High Speed PCB: How to Design It?

July 3rd, 2024

In today’s tech-driven world, creating efficient high speed PCB (Printed Circuit Board) is critical for ensuring devices can handle rapid data transfer without issues. These high speed PCBs are popular in the wireless devices which needs high signal transfer. Crafting high-speed circuits requires careful planning and precise execution to maintain signal quality and overall performance. In this blog, we introduced the basics of high-speed PCB design, offering practical tips and insights into the best materials and techniques for high-frequency applications.

What is a High Speed Circuit PCB?

High-speed PCB is a circuit board that can support signal transmission. High-speed signals usually refer to signals with frequencies higher than 50MHz, such as high-speed digital signals, high-speed analog signals, etc. These fast transitions can introduce challenges like signal reflections, electromagnetic interference (EMI), and crosstalk, which can disrupt performance if not properly managed.

Additionally, these signals will be affected by board materials, layout, wiring and other factors during transmission. Therefore, a specially designed circuit board is required to ensure the integrity and reliability of the signal. Here is a 4 layers high speed PCB for Iradar device with 50ohm single-ended impedance control.

Features of High-Speed PCB

High frequency

Low permittivity and low loss factor

Multilayer design

Strict impedance control

High-precision manufacturing

Low noise characteristic

High density circuit layout (micro-vias)

High performance

What is Considered High-Speed PCB Design?

High-speed PCB design focuses on managing the complexities that come with high-frequency signals and fast switching. Key considerations include:

– Signal Integrity: Ensuring signals travel without distortion or loss.

– Power Management: Distributing power effectively to minimize noise and voltage drops.

– Heat Handling: Managing heat from high-speed components to prevent overheating.

– Impedance Matching: Keeping impedance consistent to reduce signal reflections and loss.

– Differential Pair Routing: Reducing EMI and crosstalk by routing complementary signal pairs together.

This type of high speed pcb design requires a solid understanding of electromagnetic principles, advanced simulation tools, and precise manufacturing techniques. For those new to high-speed PCB design, EBest Circuit (Best Technology) offers expert guidance and solutions.

What’s the Best Material for High-Speed PCB Design?

Choosing the right material for high speed pcb is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

– FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.

– Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.

– Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

Where is the High-Speed PCB Commonly Used in?

High-speed circuit boards are widely used in signal transmission applications, the typical fields are including:

1. Communication equipment – such as 5G base stations, optical fiber communication equipment, etc.

2. Data center – like high-performance computing, storage servers, etc.

3. Consumer electronics in our daily life – high-end smartphones, tablets, gaming devices, etc.

4. Aerospace and military – high speed are always used in high-end devices. For example, radar, navigation systems and other equipment with high reliability requirements.

What is the 3H Rule in High Speed PCB Design?

The 3H rule is a guideline suggesting that signal traces should be spaced at least three times the height of the dielectric (3H) between the signal layer and the adjacent ground or reference layer. This helps minimize crosstalk and maintain signal integrity, particularly for high-speed digital signals with rise times of 1 ns or less. Key aspects include:

– Trace Spacing: Keeping traces apart by at least 3H reduces electromagnetic coupling and interference.

– Signal Integrity: Adequate spacing helps maintain clear signals in high-speed circuits.

– Effectiveness: This rule is especially beneficial for fast digital signals, reducing the risk of crosstalk and interference.

For instance, if the dielectric height between the signal layer and the reference layer is 0.2 mm, traces should be at least 0.6 mm apart to follow the 3H rule.

How to Design a High-Speed Board?

Designing a high-speed PCB involves several strategies to ensure effective signal transmission, power distribution, and minimal EMI. Here’s a step-by-step approach:

Component Placement and Layer Stack-Up

Place high-speed components to minimize signal paths and interference. Group related components to simplify routing. In addition, create a layer stack-up that supports controlled impedance and reduces signal loss. Use ground planes between layers for a return path for high-frequency currents.

Trace Routing and Impedance Control

Keep high-speed traces short and direct, avoiding right-angle bends. Use microstrip or stripline configurations for controlled impedance and minimal noise. For impedance control, calculate and ensure consistent impedance for traces. Use differential pair routing for high-speed signals to reduce EMI and crosstalk.

Power Distribution and EMI Mitigation

Use decoupling capacitors near high-speed components to filter noise and stabilize the power supply. Design a robust power distribution network to minimize impedance and ensure stable voltage. And employ proper grounding and shielding techniques. Route high-speed signals on inner layers between ground planes to reduce EMI and provide a consistent return path.

Simulation and Testing

Use signal integrity analysis tools like SI or PI to simulate the PCB layout, predicting signal behavior and identifying potential issues. Analyze aspects like eye diagrams to assess signal quality.

High-speed PCB design is a complex but rewarding endeavor that ensures your electronics perform efficiently in high-frequency environments. By understanding the fundamentals and applying the right techniques and materials, you can create robust, high-speed boards. EBest Circuit (Best Technology) is here to assist you with expert advice and solutions for your high-speed PCB needs.

What Are the Differences Between Active and Passive Components?

July 3rd, 2024

In PCB electronics, components are classified into two main categories: active and passive components. Understanding these differences is crucial for anyone working with electronic circuits. Active components control electricity flow and require an external power source. Passive components do not control electricity and do not need an external power source.

What are active and passive components meaning?

Active and passive components, simply say, the device that needs an energy (electrical) source is called an active device, and the device that does not need an energy source is a passive device. Active components, such as transistors and diodes, require external power to function. They can control the flow of electricity. Passive components, like resistors and capacitors, do not need external power. They cannot control electrical flow but can store, resist, or filter energy. Both passive and active components are common useful in PCB assembly and SMT technology.

Active components play a dynamic role in circuits. They can amplify signals, switch currents, and perform various complex functions. These components rely on an external power source to operate and influence the behavior of the circuit. For instance, a transistor can amplify a weak signal, making it stronger and more useful for further processing.

What Are the Differences Between Active and Passive Components?

Passive components, on the other hand, are more static in nature. They cannot amplify signals or control current flow but are essential for other functions like energy storage and signal filtering. Resistors, capacitors, inductors, and transformers are common examples. Each of these components has a specific role in maintaining the stability and functionality of an electronic circuit.

What are the key differences between active and passive components?

The main difference between active and passive components is their ability to control electricity. Active components can amplify signals and perform complex tasks. Passive components can only store, resist, or filter energy. They cannot amplify signals or control current.

Active components are energy-dependent. They require an external source of power to function and can influence the flow of electricity within the circuit. For example, an integrated circuit (IC) can perform multiple functions like amplification, switching, and signal modulation, all of which require external power.

Passive components, in contrast, do not require an external power source. They can only perform their functions passively. For instance, a resistor can limit the current flowing through a circuit without needing additional power. Similarly, a capacitor can store electrical energy and release it when needed, all without external energy input.

Common active components in electronics

Active devices are the main components of electronic circuits. From the physical structure, circuit function and engineering parameters, active devices can be divided into discrete devices and integrated circuits.

1. Discrete devices

Bipolar transistor, generally referred to as transistor or BJT
Field effective transistor
Thyristor
Semiconductor resistors and capacitors – resistors and capacitors manufactured by integrated technology are used in integrated circuits.

2. Integrated circuit

Integrated circuit can be divided into analog IC and digital IC. Analog integrated circuits mainly deal with continuous analog signals, such as sound, light, temperature, etc., and retain the continuity and accuracy of the signal through amplification, filtering, mixing and other operations. In contrast, digital integrated circuits are used to process discrete time digital signals, convert the signal into binary digital form, and then perform logical operations and processing.

Basic analog integrated circuit devices generally include:

Integrated operational amplifier (operation amplifier)
Comparator
Logarithmic and exponential amplifiers
Multiplier/divider
Analog switching circuit (analog switch)
Phase lock loop
Integrated voltage regulator
Reference source
Wave-form generator
Power amplifier

Digital integrated circuit including:

Logic gate circuit
Flip-flop
Register
Decoder
Data comparator
Driver
Counter
Shaping circuit
Programmable Logic Device (PLD)
Microprocessor (MPU)
Microcontroller (MCU)
Digital signal processor (DSP)

Common passive components in electronics

Passive devices in electronic systems can be divided into circuit components and connection components according to the circuit functions they play. These components are essential for functions like energy storage, filtering, and impedance matching in electronic circuits. The common passive components are including:

Circuit components

Diode
Resistor
Resistor network
Capacitor
Inductor
Transformer
Relay
Key
Speaker
Switch

Connection components

Connector
Socket
Cable
PCB (printed circuit board)

Why are active components crucial in modern electronics?

The ability of active components to control and manipulate electrical signals makes them indispensable in a wide range of applications.

In computers, for example, active components such as processors and memory chips perform complex calculations and store large amounts of data. In communication systems, active components amplify weak signals, making long-distance transmission possible. Without these amplifiers, the signal would decay with distance, leading to a decline in communication quality. Power electronics, another key area of modern development, relies heavily on active components. Devices like power converters, inverters, and motor controllers use transistors and integrated circuits to efficiently convert and control electrical energy. This efficiency is crucial for applications ranging from renewable energy systems to electric vehicles.

It’s fair to say that without active components, devices like computers, smartphones, and TVS wouldn’t function the way they do today, and our era of big data wouldn’t be moving as fast as it is today.

How do passive components complement active components?

Both active and passive components are indispensable in a circuit. They depend on each other and complement each other. Without active components, the circuit cannot be activated or perform a specific work. Without passive components, the circuit cannot be controlled and adjusted, nor can it achieve a stable operating state. Such a relationship between the two is like the relationship between the “dynamic” and the “static” of a circuit.

For example, in an audio amplifier circuit, the power supply and amplifier are the active components, and the load and resistance are the passive components. The power supply provides energy, the amplifier amplifies the signal, and controls and limits it through load and resistance, and finally realizes the amplification and regulation of the audio signal. In signal processing, inductors filter out high-frequency noise and protect sensitive active components from interference. Transformers, on the other hand, enable efficient power transfer between different parts of the circuit, allowing active components to operate within their optimal voltage range.

Comparing the Energy Requirements of Active and Passive Elements

Active components need an external power source to function. They consume energy during operation. Passive components do not need external power and generally do not consume energy, except for minor resistive losses. This difference impacts the design and efficiency of electronic circuits.

Active components, such as transistors and integrated circuits, rely on external power to operate. This power requirement means that active components consume energy during their operation. The amount of energy consumed depends on the specific component and its application. For instance, a power amplifier consumes more energy than a simple transistor switch.

Passive components, in contrast, do not need external power to function. They operate solely based on the electrical energy present in the circuit. Resistors, capacitors, and inductors do not consume significant energy, except for minor resistive losses in resistors. This low energy requirement makes passive components more efficient in certain applications.

The difference in energy requirements between active and passive components impacts the overall efficiency of electronic circuits. Designers must carefully balance the use of active and passive components to achieve optimal performance and energy efficiency. For example, using passive filters instead of active ones can save energy in low-power applications.

Active and Passive Component Images and Symbols

Recognizing symbols are essential for reading and designing circuit diagrams. They provide a visual representation of the components and their functions, helping designers understand the overall structure and operation of the circuit. Recognizing these symbols is a fundamental skill for anyone involved in electronics. Here is a detailed images and symbols listing of common active and passive components.

Above all is the introduction to passive and active components, hope it is useful for every engineers. EBest Circuit (Best Technology) is a professional PCB and PCBA manufacturer in Asia. We have our own factory in China and Vetnam. Welcome to contact us if you have any questions about components and PCB assembly.

PCB Design for PICE Card, Industrial PCB Design Cases

June 25th, 2024

EBest Circuit (Best Technology) has been a leader in PCB manufacturing and design for over 17 years. Our R&D team allows us to offer customers quick and valuable PCB design solutions. Here, we share one of our industrial motherboard design for PICE card for your reference.

PICE card

[1]: Main chip: XCKU11P

[2]: 30A maximum current

[3]: Single pair differential line, 10G optical network

[4]: 14 layers PCB

If you need a custom industrial PCB design, please feel free to contact us.

Video Decoder Hardware PCB Design Case Example

June 25th, 2024

A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:

Video decoder

[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI

[2]: Single pair differential line, 10G optical network, memory of DDR4

[3]: 12 layers PCB

Why choose us?

We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose EBest Circuit (Best Technology) you can enjoy:

Professional engineer evaluation

DFM analysis

One-time successully on prototyping

SI analysis of signal integrity

Electromagnetic compatibility (EMC) analysis

High Speed PCB Design Guidelines, PCB Camera Design Case

June 25th, 2024

When designing high-speed PCBs, several critical factors must be considered to ensure optimal performance. These include signal integrity, impedance control, and minimizing electromagnetic interference (EMI). Below is an ultra high speed camera PCB solution made by EBest Circuit (Best Technology):

An ultra-high-speed camera rigid-flex circuit board

[1]: XCKU060 chip

[2]: 20A maximum current

[3]: Four DDR4 channels

[4]: 20 layers PCB

High Speed PCB Design Guidelines, PCB Camera Design Case

Camera PCB design considerations:

1. When the Camera adopts a connector: when the MIPI differential signal passes through the connector, the adjacent differential signal pairs must be isolated using GND pins; If it is not convenient to punch holes, the spacing between the difference pairs is at least 15mil.

2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.

3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.

4. The Camera layout needs to be far away from high-power radiation devices, such as GSM antennas.

5. CIF/MIPI and other signals, if there is a board to board connection through the connector, it is recommended that all signals be connected with a certain resistance value (between 2.2ohm and 10ohm, depending on the SI test), and reserve TVS devices.

EBest Circuit (Best Technology) offers one-stop solutions for our values customers. And we provide free technical support for our customers. If you have similiar requirements, welcome to contact us at any time!

Differential Signal PCB Design, Fiber Optical SFP Module

June 25th, 2024

PCB design is one of an important process before the PCB manufacturing, it determines the overall performance of the whole product. We are an experienced PCB design and manufacturing vendor, with our professional technical team and advanced evaluated tools, we can make sure the PCB design one-time success. Today, we shared a example of fiber optical SFP modules design:

32X100G(QSFP28) large capacity convergence shunt

[1]: Marvell: 98CX8522

[2]: Single pair differential line, 25G optical network

[3]: 16 layers PCB

Differential Signal PCB Design, Fiber Optical SFP Module

How to design a SFP optical module PCB?

SFP optical module interface PCB design depends on many aspects, including interface signal processing, timing control, power management and so on.

1. Determine the interface standard: SFP optical module interface standards, such as SFP, SFP+, QSFP and so on, you need to choose the appropriate interface standard according to the specific needs.

2. Choose the chip solution: According to the interface standard, choose the appropriate chip solution, usually including constant voltage source, amplifier, comparator, clock generator, EEPROM, etc.

3. Signal processing: For receiving and sending signals, filtering, amplification and comparison are required to ensure signal quality and stability.

4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.

5. Power management: SFP optical module interface requires multiple power supplies, including Vcc, VCC-TX, VCC-RX, etc. Reasonable power management is required to ensure the stability and reliability of the power supply.

6. PCB design: According to the above requirements, PCB design is carried out, considering signal isolation, layering layout, status separation, signal integrity and other factors.

Feel freely to send message us if you are interested in PCB design.

High Speed PCB Design, Industrial PCB Case Sharing

June 25th, 2024

A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. EBest Circuit (Best Technology) is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.

32 x 400GE industrial switch

[1]: Marvell-400G chip

[2]: 200A maximum current

[3]: Single pair differential line 56G optical network

[4]: 24 layers high power PCB

High Speed PCB Design, Industrial PCB Case Sharing

What’s the Best Material for High-Speed PCB Design?

Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.

Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.

Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.

Network Motherboard Design for Network Switching Cases

June 25th, 2024

Best technology offers numerous PCB design solutions for our customer, from HDI design, high speed device PCB design, AI optical module design and network motherboard design for network switching. Below is one of our network motherboard design solutions:

An ATCA network switching motherboard

[1]：BCM88XXX, BCM55XXX chips

[2]：60A maximum current

[3]：8口10Ｇ optical network

[4]: 8 x DDR3 chips

Network Motherboard Design for Network Switching Cases

Network Switching Differential Pair Design Guide

Each TrxP/TrxN signal group (where xcx0-3) shall be routed as a differential pair. This includes the entire length of wiring processing.
The individual differential correspondences are packed together as tightly as possible. Impedance calculations are usually started by selecting the smallest line blank (4-5mil). The tracking width is then adjusted to achieve the necessary impedance.
Differential line group resistance of Ethernet is calculated at 100 ohms.
In general, when routing the four differential pairs of the Gigabit Ethernet to the r45 connector, at least one pair will pass through to the opposite outer layer.
Priority should be given to differential pair wiring. Terminals should be added after the routing is determined
The values of all resistance terminals in the Ethernet front end should be 1.0% tolerance
All capacitor termination Ethernet front ends in the module should have strict tolerances and high quality product media (npo)

You are welcome to contact us if you want to get your DIY network switching PCB designs.

PCB design: how to optimize component placement ?

June 21st, 2024

PCB design not only including the routing layout, component placement also is a key parameter. It involves understanding electrical parameters, signal integrity, and thermal management. This article will introduce several golden rules of how to optimize your component placement, whether you are a novice or a seasoned professional, it is helpful for you to manage your circuit board design greatly.

Determine the power supply and grounding plane

In the early stage of PCB design, reasonable power supply and grounding layout is the key. The power supply and ground plane not only provide a stable power supply for the components, but also play a role in reducing electromagnetic interference (EMI). To begin the layout, the first thing is confirming the location of the power supply and ground area. Usually, the power is placed in a complete layer of the PCB, and the ground is in another layer, which can effectively reduce the power supply noise.

Make sure the power plane is close to the area where high power is needed, which can reduce the voltage drops along the supply path. The ground area should be as large and continuous as possible, this helps to provide a good return path and reduce interference from high-frequency signals.

Differentiate layouts by function

When laying out components, dividing the circuit board into different functional areas can improve the efficiency and performance of the design. For example, you can separate power supply into signal processing area, power management area, and interface. This method helps to reduce the mutual interference between different circuits and improve the overall stability of the circuit.

Please noted that, high-frequency components should be close to connectors or key interfaces to shorten the signal path and reduce interference. Low-frequency components can be placed away from critical signal paths to optimize overall signal integrity.

Keep short and direct trace

Shortening the length of signal lines is another important thing to optimize component layout. Make sure keep them short and direct as possible. Long distance signal routing may lead to signal attenuation and delay, which will affect the overall performance of the circuit. Placing the relevant components as close as possible. This not only reduces the length of the circuits, but also reduces the coupling and interference between the signals.

How to optimize component placement during the PCB design?

In addition, in the routing process, try to avoid right-angle (90 degrees) turns. Because the right angle will cause signal reflection, affecting the integrity of the signal. Try to use 45 degree turns or arc turns to reduce signal loss.

Consider heat dissipation requirements

Heat management is an important consideration when placing high-power components. Place power components in the edge area of the PCB, such as power transistors and high-frequency converters. This facilitates the use of natural air flow for heat dissipation and convenient for the installation of external cooling devices.

In high-density designs, through-holes, vias and cooling copper blocks can be designed on the PCB, which can transfer heat to the inner layer or bottom of the PCB to help dissipate heat. In addition, maintain a reasonable distance between each component to promote air flow and heat dissipation.

Optimize test points position

Consider placing test points in a convenient location for testing and debugging. Placing test points close to relevant components simplifies the debugging process and reduces test complexity. In particular, the placement of test points on the key signal path can facilitate the detection and verification of signal integrity and stability in the design stage.

For example, the discrete components required for OpAmp operational amplifiers can be placed close to the device, so that the bypass capacitors and resistors can work with them. This helps to optimize the wiring length mentioned as above, while also making testing and fault detection easier.

Consider DFM & DFA factors

Optimizing component layout takes into account not only electrical performance, but also the actual requirements of manufacturing and assembly. For example, try to avoid placing components on both sides of the PCB to simplify the PCBA assembly process. The components are arranged neatly and spaced consistently, which helps the automated assembly equipment to operate efficiently and reduce assembly errors.

Properly using DFM (Design for Manufacturability) principles make production easier and more cost-effective. Ensure that your design can be fabricated with standard processes.

Perform DRC as often as possible

Although it only takes a short time to run DRC (Design Rule Check) functionality on PCB software. But in some complex design environments, perform checks during the design process can save a lot of time, which is a good habit to keep. Every layout routing decision is critical, and running DRC can remind you of the most important layout at any time.

Check production files before sending to manufacturer

While most of PCB manufacturers are happy to download it directly and verify it for you, it is best to export the Gerber file yourself and use the free software such as Gerberv to check that it is as expected to avoid misunderstandings. By verifying it yourself, you may even find some inadvertent errors and thus avoid the cost of completing the production according to the wrong parameters.

Successful PCB design cases – EBest Circuit (Best Technology)

A: A mITX architecture industrial control main board

[1] Intel Xeon E3, Core™ i7/i5, Celeron G3900E processors

　[2]：2x DDR4 SODIMM 2133 MHz (up to 32 GByte)

　[3]：4x SATA Gen 3.0

　[4]：1x PCIe x16 (Gen 3)

　[5]：2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +

2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)

Anyway, communicating with your manufacturer to understand their equipment and processes can optimize the design, reduce manufacturing problems, improve production efficiency and product quality.

What is a Copper Clad Laminate (CCL) in PCB?

June 18th, 2024

Copper Clad Laminate as a base material of FR4 PCB, serving as a key part in the building of printed circuit board. Understanding what Copper Clad Laminate is, its benefits, types, and manufacturing process is essential for anyone who involved in the electronics industry. This article aims to provide a comprehensive overview of copper clad laminate material, and hope everyone in the PCB industry be interested in it.

What is copper clad laminate?

Copper Clad Laminate, short for CCL, is an electronic glass fiber cloth or other reinforcing material dipped in resin, one or both sides covered with copper foil and made of a plate-like material, referred to as copper clad plate. It also called “Core” when used in the multi-layer PCB designs. Through the different process like etch, drill or copper plating, we can generate different patterns, layouts onto the surface of the CCL, and then form a circuit board that we saw in the electronics.

CCLs provide the necessary support and electrical insulation in an electronic device, while also facilitating the pathways for electrical currents through the copper foil. So, in another word, the performance, long-term reliability and stability of the PCB depend on the CCL to a large extent.

What are the types of copper clad laminates?

Generally speaking, copper clad laminate can be divided into two main types according to its mechanical properties, they are – rigid copper clad laminate and flexible copper clad laminate. Here we listing the detailed types of CCL.

Rigid copper-clad laminate

a. According to different insulation materials and structures: organic resin clad copper laminate, metal clad copper laminate, ceramic clad copper laminate.

b. According to the thickness of the plate: conventional copper-covered laminate and thin copper-covered laminate. The thickness less than 0.5mm (doesn’t include the copper foil) is called thin CCL.

c. According to the reinforcement material used: electronic glass fiber cloth base copper foil board, paper base copper foil board and composite base copper foil board.

d. According to the insulating resin used, such as epoxy resin copper-coated foil board, polyester resin copper-coated foil board and cyanate resin copper-coated foil board.

e. Special rigid copper clad plate, according to the flame-retardant grade and some special properties.

Flexible copper clad laminate

a. polyester types (flame retardant and non-flame retardant)

b. polyimide type (flame retardant, non-flame retardant)

c. Extra thin electronic glass fiber cloth copper foil laminate

What’s the main composition of copper clad laminate?

A normal copper clad laminate mainly consists of copper foil and some auxiliary materials. These materials make the CCL conductive and be used as the core material of the circuit board. Here we would like to explain these compositions in details:

Copper foil

Copper foil is one of the main raw materials for manufacturing copper clad laminate, and it is a very pure metal material with excellent electrical conductivity. The thickness and purity requirements of the copper clad foil are very high, usually between 18-70μm, and the purity is more than 99.8%. In the manufacturing process of CCL, copper foil is used as a conductive layer to transfer current from one electronic component to another. It also has good plasticity and ductility, and can be bent, stretched and formed as needed without adversely affecting electrical conductivity. In addition, the corrosion resistance of the copper foil is also very good, which can resist the erosion of chemical substances, ensuring that the CCL can work properly in a variety of environments.

Auxiliary materials like resin and adhesive

In addition to copper foil and copper clad foil, the production of CCL also involves some other auxiliary materials, such as adhesives and reinforcing materials. Among them, the adhesive is mainly used to fix the copper foil and copper clad foil on the substrate. The selection of adhesives should take into account their adhesion and high temperature resistance to ensure that the copper foil and copper clad foil can be firmly bonded to the substrate. Reinforcement materials are mainly used to improve the mechanical strength and bending resistance of CCL. Common reinforcement materials include glass fiber cloth and polyimide film.

CCL Manufacturing Process

The manufacture of CCL is a meticulous process; therefore, it includes many accurate steps:

Prepare substrate – the commonly used substrate is fiberglass cloth impregnated with epoxy resin, which is non-conductive material and has good insolation and mechanical properties, then cured to get the correct mechanical and thermal characteristics.
Surface treatment – this is a surface cleaning and grinding process to achieve a clean and roughness surface of the substrate, resulting a good adhesion between the copper foil and substrate.
Copper Foil Lamination – lamination of copper foil onto the prepared substrate is done by temperature and pressure quickly and smoothly to obtain a stable bond. This is a lamination process of single layer CCL, if you want a multi-layer CCL, coating adhesive on each layer and then laminate in the press machine, then making them in a whole product.
Cutting and Trimming – the need for the dimensions drives the sheets to be cut and trimmed into a desired size.
Quality Checking: A thorough quality check follows to confirm that the CCL matches industry requirements on thickness, adhesion, and electrical properties.

Where is the Copper Clad Laminate uses?

CCL has a widely applications thus constituting a critical element for numerous electronic devices and systems, the typically are including:

Consumer electronics like cell phones, laptops, and tablets
Automotives including infotainment and engine control units
Industrial equipment like common test equipment
Telecommunications such as networking equipment and communication devices
Medical device, for example: imaging system, diagnostics

If you are looking for a company that can advance and improve your electronic circuit, then EBest Circuit (Best Technology) is the right choice for you. EBest Circuit (Best Technology) is a one-stop solution providers in China with extensive years of experience in high quality PCB and PCBA manufacturing. We have certificated by ISO9001, ISO13485, IATF16949 to make you no worry about the quality. Contact us right now to get your quotations!

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What is a High Speed Circuit PCB?

Features of High-Speed PCB

What is Considered High-Speed PCB Design?

What’s the Best Material for High-Speed PCB Design?

Where is the High-Speed PCB Commonly Used in?

What is the 3H Rule in High Speed PCB Design?

How to Design a High-Speed Board?

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What are active and passive components meaning?

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