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PCB Design for PICE Card, Industrial PCB Design Cases
Tuesday, June 25th, 2024

Best Technology has been a leader in PCB manufacturing and design for over 17 years. Our R&D team allows us to offer customers quick and valuable PCB design solutions. Here, we share one of our industrial motherboard design for PICE card for your reference.

PICE card

[1]: Main chip: XCKU11P

[2]: 30A maximum current

[3]: Single pair differential line, 10G optical network

[4]: 14 layers PCB

If you need a custom industrial PCB design, please feel free to contact us.

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Video Decoder Hardware PCB Design Case Example
Tuesday, June 25th, 2024

A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:

Video decoder

[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI

[2]: Single pair differential line, 10G optical network, memory of DDR4

[3]: 12 layers PCB

Why choose us?

We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:

  • Professional engineer evaluation
  • DFM analysis
  • One-time successully on prototyping
  • SI analysis of signal integrity
  • Electromagnetic compatibility (EMC) analysis

Contact us if you have any questions.

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High Speed PCB Design Guidelines, PCB Camera Design Case
Tuesday, June 25th, 2024

When designing high-speed PCBs, several critical factors must be considered to ensure optimal performance. These include signal integrity, impedance control, and minimizing electromagnetic interference (EMI). Below is an ultra high speed camera PCB solution made by Best Technology:

An ultra-high-speed camera rigid-flex circuit board

[1]: XCKU060 chip

[2]: 20A maximum current

[3]: Four DDR4 channels

[4]: 20 layers PCB

High Speed PCB Design Guidelines, PCB Camera Design Case

Camera PCB design considerations:

1. When the Camera adopts a connector: when the MIPI differential signal passes through the connector, the adjacent differential signal pairs must be isolated using GND pins; If it is not convenient to punch holes, the spacing between the difference pairs is at least 15mil.

2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.

3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.

4. The Camera layout needs to be far away from high-power radiation devices, such as GSM antennas.

5. CIF/MIPI and other signals, if there is a board to board connection through the connector, it is recommended that all signals be connected with a certain resistance value (between 2.2ohm and 10ohm, depending on the SI test), and reserve TVS devices.

Best Technology offers one-stop solutions for our values customers. And we provide free technical support for our customers. If you have similiar requirements, welcome to contact us at any time!

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Differential Signal PCB Design, Fiber Optical SFP Module
Tuesday, June 25th, 2024

PCB design is one of an important process before the PCB manufacturing, it determines the overall performance of the whole product. We are an experienced PCB design and manufacturing vendor, with our professional technical team and advanced evaluated tools, we can make sure the PCB design one-time success. Today, we shared a example of fiber optical SFP modules design:

32X100G(QSFP28) large capacity convergence shunt

[1]: Marvell: 98CX8522

[2]: Single pair differential line, 25G optical network

[3]: 16 layers PCB

How to design a SFP optical module PCB?

SFP optical module interface PCB design depends on many aspects, including interface signal processing, timing control, power management and so on.

1. Determine the interface standard: SFP optical module interface standards, such as SFP, SFP+, QSFP and so on, you need to choose the appropriate interface standard according to the specific needs.

2. Choose the chip solution: According to the interface standard, choose the appropriate chip solution, usually including constant voltage source, amplifier, comparator, clock generator, EEPROM, etc.

3. Signal processing: For receiving and sending signals, filtering, amplification and comparison are required to ensure signal quality and stability.

4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.

5. Power management: SFP optical module interface requires multiple power supplies, including Vcc, VCC-TX, VCC-RX, etc. Reasonable power management is required to ensure the stability and reliability of the power supply.

6. PCB design: According to the above requirements, PCB design is carried out, considering signal isolation, layering layout, status separation, signal integrity and other factors.

Feel freely to send message us if you are interested in PCB design.

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High Speed PCB Design, Industrial PCB Case Sharing
Tuesday, June 25th, 2024

A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. Best Technology is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.

32 x 400GE industrial switch

[1]: Marvell-400G chip

[2]: 200A maximum current

[3]: Single pair differential line 56G optical network

[4]: 24 layers high power PCB

What’s the Best Material for High-Speed PCB Design?

Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

  • FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.
  • Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.
  • Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.

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Network Motherboard Design for Network Switching Cases
Tuesday, June 25th, 2024

Best technology offers numerous PCB design solutions for our customer, from HDI design, high speed device PCB design, AI optical module design and network motherboard design for network switching. Below is one of our network motherboard design solutions:

An ATCA network switching motherboard

[1]:BCM88XXX, BCM55XXX chips

[2]:60A maximum current

[3]:8口10G optical network

 [4]:  8 x DDR3 chips

Network Switching Differential Pair Design Guide

  • Each TrxP/TrxN signal group (where xcx0-3) shall be routed as a differential pair. This includes the entire length of wiring processing.
  • The individual differential correspondences are packed together as tightly as possible. Impedance calculations are usually started by selecting the smallest line blank (4-5mil). The tracking width is then adjusted to achieve the necessary impedance.
  • Differential line group resistance of Ethernet is calculated at 100 ohms.
  • In general, when routing the four differential pairs of the Gigabit Ethernet to the r45 connector, at least one pair will pass through to the opposite outer layer.
  • Priority should be given to differential pair wiring. Terminals should be added after the routing is determined
  • The values of all resistance terminals in the Ethernet front end should be 1.0% tolerance
  • All capacitor termination Ethernet front ends in the module should have strict tolerances and high quality product media (npo)

You are welcome to contact us if you want to get your DIY network switching PCB designs.

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PCB design: how to optimize component placement ?
Friday, June 21st, 2024

PCB design not only including the routing layout, component placement also is a key parameter. It involves understanding electrical parameters, signal integrity, and thermal management. This article will introduce several golden rules of how to optimize your component placement, whether you are a novice or a seasoned professional, it is helpful for you to manage your circuit board design greatly.

  • Determine the power supply and grounding plane

In the early stage of PCB design, reasonable power supply and grounding layout is the key. The power supply and ground plane not only provide a stable power supply for the components, but also play a role in reducing electromagnetic interference (EMI). To begin the layout, the first thing is confirming the location of the power supply and ground area. Usually, the power is placed in a complete layer of the PCB, and the ground is in another layer, which can effectively reduce the power supply noise.

Make sure the power plane is close to the area where high power is needed, which can reduce the voltage drops along the supply path. The ground area should be as large and continuous as possible, this helps to provide a good return path and reduce interference from high-frequency signals.

  • Differentiate layouts by function

When laying out components, dividing the circuit board into different functional areas can improve the efficiency and performance of the design. For example, you can separate power supply into signal processing area, power management area, and interface. This method helps to reduce the mutual interference between different circuits and improve the overall stability of the circuit.

Please noted that, high-frequency components should be close to connectors or key interfaces to shorten the signal path and reduce interference. Low-frequency components can be placed away from critical signal paths to optimize overall signal integrity.

  • Keep short and direct trace

Shortening the length of signal lines is another important thing to optimize component layout. Make sure keep them short and direct as possible. Long distance signal routing may lead to signal attenuation and delay, which will affect the overall performance of the circuit. Placing the relevant components as close as possible. This not only reduces the length of the circuits, but also reduces the coupling and interference between the signals.

How to optimize component placement during the PCB design?

In addition, in the routing process, try to avoid right-angle (90 degrees) turns. Because the right angle will cause signal reflection, affecting the integrity of the signal. Try to use 45 degree turns or arc turns to reduce signal loss.

  • Consider heat dissipation requirements

Heat management is an important consideration when placing high-power components. Place power components in the edge area of the PCB, such as power transistors and high-frequency converters. This facilitates the use of natural air flow for heat dissipation and convenient for the installation of external cooling devices.

In high-density designs, through-holes, vias and cooling copper blocks can be designed on the PCB, which can transfer heat to the inner layer or bottom of the PCB to help dissipate heat. In addition, maintain a reasonable distance between each component to promote air flow and heat dissipation.

  • Optimize test points position

Consider placing test points in a convenient location for testing and debugging. Placing test points close to relevant components simplifies the debugging process and reduces test complexity. In particular, the placement of test points on the key signal path can facilitate the detection and verification of signal integrity and stability in the design stage.

For example, the discrete components required for OpAmp operational amplifiers can be placed close to the device, so that the bypass capacitors and resistors can work with them. This helps to optimize the wiring length mentioned as above, while also making testing and fault detection easier.

  • Consider DFM & DFA factors

Optimizing component layout takes into account not only electrical performance, but also the actual requirements of manufacturing and assembly. For example, try to avoid placing components on both sides of the PCB to simplify the PCBA assembly process. The components are arranged neatly and spaced consistently, which helps the automated assembly equipment to operate efficiently and reduce assembly errors.

How to optimize component placement during the PCB design?

Properly using DFM (Design for Manufacturability) principles make production easier and more cost-effective. Ensure that your design can be fabricated with standard processes.

  • Perform DRC as often as possible

Although it only takes a short time to run DRC (Design Rule Check) functionality on PCB software. But in some complex design environments, perform checks during the design process can save a lot of time, which is a good habit to keep. Every layout routing decision is critical, and running DRC can remind you of the most important layout at any time.

  • Check production files before sending to manufacturer

While most of PCB manufacturers are happy to download it directly and verify it for you, it is best to export the Gerber file yourself and use the free software such as Gerberv to check that it is as expected to avoid misunderstandings. By verifying it yourself, you may even find some inadvertent errors and thus avoid the cost of completing the production according to the wrong parameters.

Successful PCB design cases – Best Technology

A: A mITX architecture industrial control main board

[1] Intel Xeon E3, Core™ i7/i5, Celeron G3900E processors

 [2]:2x DDR4 SODIMM 2133 MHz (up to 32 GByte)

 [3]:4x SATA Gen 3.0

 [4]:1x PCIe x16 (Gen 3)

 [5]:2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +

2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)

Anyway, communicating with your manufacturer to understand their equipment and processes can optimize the design, reduce manufacturing problems, improve production efficiency and product quality.

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What is a Copper Clad Laminate (CCL) in PCB?
Tuesday, June 18th, 2024

Copper Clad Laminate as a base material of FR4 PCB, serving as a key part in the building of printed circuit board. Understanding what Copper Clad Laminate is, its benefits, types, and manufacturing process is essential for anyone who involved in the electronics industry. This article aims to provide a comprehensive overview of copper clad laminate material, and hope everyone in the PCB industry be interested in it.

copper clad laminate

What is copper clad laminate?

Copper Clad Laminate, short for CCL, is an electronic glass fiber cloth or other reinforcing material dipped in resin, one or both sides covered with copper foil and made of a plate-like material, referred to as copper clad plate. It also called “Core” when used in the multi-layer PCB designs. Through the different process like etch, drill or copper plating, we can generate different patterns, layouts onto the surface of the CCL, and then form a circuit board that we saw in the electronics.

CCLs provide the necessary support and electrical insulation in an electronic device, while also facilitating the pathways for electrical currents through the copper foil. So, in another word, the performance, long-term reliability and stability of the PCB depend on the CCL to a large extent.

copper clad laminate

What are the types of copper clad laminates?

Generally speaking, copper clad laminate can be divided into two main types according to its mechanical properties, they are – rigid copper clad laminate and flexible copper clad laminate. Here we listing the detailed types of CCL.

  • Rigid copper-clad laminate

a. According to different insulation materials and structures: organic resin clad copper laminate, metal clad copper laminate, ceramic clad copper laminate.

b. According to the thickness of the plate: conventional copper-covered laminate and thin copper-covered laminate. The thickness less than 0.5mm (doesn’t include the copper foil) is called thin CCL.

c. According to the reinforcement material used: electronic glass fiber cloth base copper foil board, paper base copper foil board and composite base copper foil board.

d. According to the insulating resin used, such as epoxy resin copper-coated foil board, polyester resin copper-coated foil board and cyanate resin copper-coated foil board.

e. Special rigid copper clad plate, according to the flame-retardant grade and some special properties.

  • Flexible copper clad laminate

a. polyester types (flame retardant and non-flame retardant)

b. polyimide type (flame retardant, non-flame retardant)

c. Extra thin electronic glass fiber cloth copper foil laminate

What’s the main composition of copper clad laminate?

A normal copper clad laminate mainly consists of copper foil and some auxiliary materials. These materials make the CCL conductive and be used as the core material of the circuit board. Here we would like to explain these compositions in details:

  • Copper foil

Copper foil is one of the main raw materials for manufacturing copper clad laminate, and it is a very pure metal material with excellent electrical conductivity. The thickness and purity requirements of the copper clad foil are very high, usually between 18-70μm, and the purity is more than 99.8%. In the manufacturing process of CCL, copper foil is used as a conductive layer to transfer current from one electronic component to another. It also has good plasticity and ductility, and can be bent, stretched and formed as needed without adversely affecting electrical conductivity. In addition, the corrosion resistance of the copper foil is also very good, which can resist the erosion of chemical substances, ensuring that the CCL can work properly in a variety of environments.

copper clad laminate
  • Auxiliary materials like resin and adhesive

In addition to copper foil and copper clad foil, the production of CCL also involves some other auxiliary materials, such as adhesives and reinforcing materials. Among them, the adhesive is mainly used to fix the copper foil and copper clad foil on the substrate. The selection of adhesives should take into account their adhesion and high temperature resistance to ensure that the copper foil and copper clad foil can be firmly bonded to the substrate. Reinforcement materials are mainly used to improve the mechanical strength and bending resistance of CCL. Common reinforcement materials include glass fiber cloth and polyimide film.

CCL Manufacturing Process

The manufacture of CCL is a meticulous process; therefore, it includes many accurate steps:

  • Prepare substrate – the commonly used substrate is fiberglass cloth impregnated with epoxy resin, which is non-conductive material and has good insolation and mechanical properties, then cured to get the correct mechanical and thermal characteristics.
  • Surface treatment – this is a surface cleaning and grinding process to achieve a clean and roughness surface of the substrate, resulting a good adhesion between the copper foil and substrate.
  • Copper Foil Lamination – lamination of copper foil onto the prepared substrate is done by temperature and pressure quickly and smoothly to obtain a stable bond. This is a lamination process of single layer CCL, if you want a multi-layer CCL, coating adhesive on each layer and then laminate in the press machine, then making them in a whole product.
  • Cutting and Trimming – the need for the dimensions drives the sheets to be cut and trimmed into a desired size.
  • Quality Checking: A thorough quality check follows to confirm that the CCL matches industry requirements on thickness, adhesion, and electrical properties.
copper clad laminate

Where is the Copper Clad Laminate uses?

CCL has a widely applications thus constituting a critical element for numerous electronic devices and systems, the typically are including:

  • Consumer electronics like cell phones, laptops, and tablets
  • Automotives including infotainment and engine control units
  • Industrial equipment like common test equipment
  • Telecommunications such as networking equipment and communication devices
  • Medical device, for example: imaging system, diagnostics

If you are looking for a company that can advance and improve your electronic circuit, then Best Technology is the right choice for you. Best Technology is a one-stop solution providers in China with extensive years of experience in high quality PCB and PCBA manufacturing. We have certificated by ISO9001, ISO13485, IATF16949 to make you no worry about the quality. Contact us right now to get your quotations!

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What Are the Advantages of Using Bus Bar PCB?
Friday, June 14th, 2024

In the design of electronic devices and systems, power distribution and heat dissipation management are key factors. Bus bar PCB, as an efficient solution, is particularly outstanding in these aspects. In this article, we would like to introduce the advantages of Bus bar PCB and its applications in different industries.

What Is A Bus Bar PCB?

At the beginning, we should know what a bus bar PCB is. The Bus bar PCB is a special and newest design that integrates the FR4 material and metal alloy into a whole product, which allows the current transfer path into the circuit board. Due to the current carry capacity and special shape, it also called busbar PCB, embedded bus bar PCB, extruded copper PCB, copper inlay PCB, copper extrusion PCB.

bus bar pcb

Bus bar circuit board provide a more compact and efficient means of current distribution than traditional wires and cables. This design improves the overall performance of the electronic system by reducing inductance, increasing current carrying capacity, and optimizing heat dissipation.

What Are the Advantages of Bus Bar PCB?

Bus bar PCB offers numerous benefits when be using the power supply applications, its main functions are:

1. Reduce the inductance

Bus bar PCBs reduce inductance by allowing current to flow between tightly spaced conductors. This layout reduces the loop area and thus the inductance value. This is particularly important for high-frequency and highspeed applications, as it reduces voltage spikes and noise, improving system stability and performance.

2. Enhanced current carrying capacity

Due to its large cross-sectional area and high-quality conductive materials, Bus bar PCB can efficiently carry large currents. This is particularly useful in applications that require a large amount of power distribution, such as power supplies, electric vehicles, and renewable energy systems. Bus bar PCBs support higher current density compared to conventional PCB wiring, which improves thermal management and reliability.

3. Improve thermal management

The Bus bar PCB effectively dissipates heat generated by key components. In high power applications, the buildup of heat can affect performance and life. The Bus bar PCB helps maintain optimal operating temperatures through efficient heat distribution, reducing the need for additional cooling mechanisms.

4. Save space and weight

The compact design of the Bus bar PCB reduces the overall size and weight of the electronic components. Its simple construction and elimination of multiple wire connectors contribute to space savings. This is particularly beneficial for applications where size and weight are critical, such as the aerospace and automotive industries.

5. Improved reliability and durability

Bus bar PCBS have superior mechanical strength and durability compared to traditional wiring systems. Its robust construction and secure connections reduce the risk of loose connections, failure due to vibration, and mechanical wear. This improves system reliability and service life for harsh environments and demanding applications.

6. Simplify assembly and maintenance

Using a Bus bar PCB simplifies the assembly process because it reduces the number of individual wires and connectors. This not only speeds up installation, but also reduces assembly errors. In addition, the Bus bar PCB provides a more orderly and accessible layout for easy troubleshooting and repair.

embeded bus bar pcb

7. Cost effective

Although there may be a high initial cost, Bus bar PCBs can provide cost savings in the long term. Its advantages in reduced inductance, improved thermal management and enhanced reliability reduce operating and maintenance costs. In addition, Bus bar PCB reduces the need for addons, such as heat sinks or complex wiring bundles, thereby increasing overall cost effectiveness.

What Applications of Bus Bar PCB?

Due the high current carry capacity of the bus bar PCB, makes it very suitable for power supply or power management devices. Bus bar PCB can perform well in such fields. Here are some common application examples that bus bar PCB can be used for. If you are seeking for a PCB to integrate into your power supply project, then bus bar PCB is the go-to-choice.

1. Power Electronics

In power converters, inverters and high-current power supplies, Bus bar PCBS are widely used because of their ability to efficiently handle high currents and excellent thermal performance.

2. The Automobile industry

Another popular field that bus bar PCB used in is automotives, especially in electric vehicles (EVs) and hybrid electric vehicles (HEVs). In the electric cars, it can be used for battery connectivity and power distribution, contributing to weight reduction and performance improvements.

3. Renewable energy

Bus bar PCB is an environment friendly material, it is often used in solar systems, wind turbines and energy storage solutions to manage high currents and enhance reliability.

4. Industrial equipment

In industrial machinery and equipment, Busbar PCB provides powerful and efficient power distribution for motors, drives and control systems.

aluminum bus bar pcb

5. Aerospace

Bus bar PCBS are used in aerospace applications, such as avionics and power distribution systems, where size, weight and reliability are key factors.

Final Words

All in all, bus bar PCB offers significant advantages in handling high currents, improving thermal management, and providing reliable power distribution across various applications. By integrating bus bar PCBs, industries can achieve better power management, reduced system size and weight, and improved overall reliability.

Best Technology is a one-stop PCB solution provider in Asia, we offer various kinds of PCBs not only include bus bar PCB, but also Extra thin PCB, RF PCB, HDI PCB, Heavy copper PCB, Ceramic PCB, Metal Core PCB, Flex PCB and rigid flex PCB, PCBA and so more. We have more than 17 years-experience in PCB design and manufacturing, and served more than 1200 customers. Choosing Best Technology as your supplier ensures you get high quality PCBs, helping to improve the performance and competitiveness of your products. Contact us right now to customize your own PCB!

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How to Distinguish Hard Gold and Soft Gold Plating on PCB?
Friday, June 14th, 2024

Gold plating is a common surface finish in PCB manufacturing, also known as nickel gold electroplating. It provides excellent conductivity, corrosion resistance and good durability to electronic devices. However, not all gold plating is created equal. There are two primary types of gold plating are used in PCB fabricating: hard gold plating and soft gold plating. They differ in properties, manufacturing process and applications, let’s explore it today!

How to Distinguish Hard Gold and Soft Gold Plating on PCB?

What are Hard Gold Plating and Soft Gold Plating?

In the manufacturing process of printed circuit boards (PCBs), we often hear the words “soft gold” and “hard gold”. They are actually describing the different metal materials used in the gold-plating process.

Hard gold usually refers to an alloy formed by electroplating process. This alloy is doped with other metal elements, such as nickel, cobalt, etc., to make it harder and more resistant to friction. Hard gold is especially suitable for places that require force and friction, such as the edge contact points of circuit boards (commonly known as “gold fingers”), because it can withstand frequent insertion and removal operations. Although the processing process of hard gold is complex, it can be doped with other metals to improve the hardness of gold, making it more suitable for making hollow jewelry or for industrial applications.

How to Distinguish Hard Gold and Soft Gold Plating on PCB?

Soft gold refers to the state of pure gold or close to pure gold, because of the high purity of gold, it is relatively soft. Soft gold is mainly used for aluminum wire on COB (Chip On Board), or the contact surface of mobile phone keys, because it can maintain good electrical conductivity and weldability. The processing process of soft gold is relatively simple, does not require complex alloying process, and maintains the soft characteristics of gold, which is suitable for the production of solid jewelry or for applications requiring good electrical conductivity.

How to Distinguish Hard Gold and Soft Gold Plating on PCB?

Properties and applications: hard gold plating vs soft gold plating

Hard gold plating is known for its high hardness, typically achieved by alloying gold with small amounts of nickel or cobalt. So, it has highly resistant to wear and mechanical stress. The thickness of hard gold plating is usually greater than that of soft gold plating, ranging from 30 to 50u’’ or more. Best Technology can make up to 50u’’ if you required. Due to the hardness of the hard gold plating, they are commonly used in edge connectors, keypads, and contact points where repeated mechanical action occurs.

The manufacturing process of soft gold plating involves a chemical process to deposit a thinner layer of pure gold onto the PCB surface. The coated pure gold without any alloying elements, resulting in a softer finished compared to the hard gold plating. Additionally, the thickness of soft gold plating is typically thinner than that of hard gold plating, usually around 1 to 3u’’. Due to the softness and conductivity properties, the soft gold plating technology is often used in applications requiring high conductivity and precision, such as wire bonding and fine-pitch components in high-frequency and high-speed circuits.

What’s the difference between gold plating and immersion gold?

Actually, Immersion Gold is mostly called ENIG (electroless nickel immersion gold) surface treatment method. The advantage of this method is that nickel and gold can be attached to copper without electroplating process, and its surface is smoother than gold plating, which is especially important for the shrinking electronic parts and components requiring flatness.

The method of leaching gold is chemical deposition. A coating is formed by chemical redox reaction, which is generally thick. Electroplating gold is based on the principle of electrolysis, also known as electroplating. Most other metal surface treatments are electroplating. In actual product applications, 90% of the gold PCB board is dipped in gold, because the poor weldability of the electric gold-plated board is its fatal defect.

How to Distinguish Hard Gold and Soft Gold Plating on PCB?

Nickel gold coating with stable color, good brightness, smooth coating and good weldability can be deposited on the surface of printed circuit by gold leaching process. It can be divided into four stages: pretreatment (degreasing, micro-etching, activation, post-leaching), nickel plating, gold leaching, post-treatment (waste gold washing, DI washing, drying). The thickness of gold leaching is 0.025-0.1um. Gold is used in the surface treatment of the circuit board because gold has strong electrical conductivity, good oxidation resistance and long service life. General applications such as keyboard board, gold finger board, etc.

Choosing between hard gold plating and soft gold plating for your PCB depends on your specific application requirements. At Best Technology, we offer expert guidance and high-quality PCB manufacturing services to help you select the best surface finish for your needs. Choose us as your trusted PCB supplier to ensure reliable and efficient solutions for all your electronic projects.

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