As a printed circuit board (PCB) vendor in Asia, we are dedicated to be your best partner of specific, advanced, high-precision printed circuit boards, includes but not limited to Metal Core PCB ( MCPCB) such as Aluminum PCB, COB MCPCB, Copper PCB, Ceramic PCB, heavy copper board (up to 20 OZ), HDI(1+N+1, 2+N+2, 3+N+3), Rigid-flex circuits, high TG, HDI, high frequency (Rogers, Taconic), impedance controlled board, and so on.

What we provide is not only MCPCB, Ceramic PCB , Rigid-flex circuits & FR4 PCB manufacturing, but also including PCB duplicating, Engineering & process design, components management & sourcing solution, PCB in house assembly & full system integration, surface mounted technology (SMT), PCBA, Wire bonding, COF, and more...

Full Product Lines of Printed Circuit Boards

Based on different base material, there're four basic types: MCPCB, FR4, Rigid-flex circuits and Ceramic PCB.

For MCPCB, which full name is Metal Core Printed Circuit Board, also named Metal Clad PCB, there're single layer MCPCB , COB MCPCB , two layers MCPCB, double sided MCPCB and Multi-layers MCPCB.

For FR4 PCB series, right now, we justclass it into Single sided (S/S) PCB, 2 layers PCB, Multi-Layers PCB (20 layers), Rigid-flex circuit,

For Ceramic PCB, which widely used in aerospace, high temperature, pressure, insulation, frequency and high reliableindustry, and in three caterogy: Thick Film, Thin Film, and DCB Technology.

For Rigid-flex circuits, combined advantage of both FR4 (Rigid) and flexible circuits (flxible), is wided used in small area need strong support on board.

Why Ceramic PCB has such excellent performance? You can have a brief view on its basic structure and then you will understand.

96% or 98% Alumina (Al2O3), Aluminum Nitride (ALN), or Beryllium Oxide (BeO)
Conductors material: For thin, thick film technology, it'll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it'll be copper only
Application temp: -55~850C
Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for ALN , 220~250W/m-K for BeO;
Max compression strength: >7,000 N/cm2
Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively
Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)
Click here to see more details about ceramic substrate.

According to different manufacturing method, current there're three basic types for ceramic board:

A) Thick Film Ceramic Board
Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB

B) Thin Film Ceramic Board
Thin Film Technology Ceramic PCB: Because the thickness of electric resistance and conductor film less than 10 micron, and that film was spurting on ceramic substrate, so named thin film ceramic board. More for Thin Film Ceramic PCB

C) DCB Ceramic Board
DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. More for DCB Ceramic PCB

Metal Core PCB means the core (base) material for PCB is the metal, not the normal FR4/CEM1-3, etc. and currently the most common metal used for MCPCB manufacturer are Aluminum, Copper and steel alloy. Aluminum has good heat transferring and dissipation ability, but yet relatively cheaper; copper has even better performance but relatively more expensive, and steel can be divided into normal steel and stainless steel. It more rigid than both aluminum and copper, but thermal conductivity is lower than them too. People will choose their own base/core material according to their different application.

Generally speaking, aluminum is the most economic option considering thermal conductivity, rigidness, and cost. Therefore, the base/core material of normal Metal Core PCB are made of aluminum. In our company, if not special request, or notes, the metal core refer will be aluminum, then MCPCB will means Aluminum Core PCB. If you need Copper Core PCB, Steel Core PCB, or Stainless steel core PCB, you should add special notes in drawing.

Sometimes people will use abbreviation “MCPCB”, instead of the full name as Metal Core PCB, or Metal Core Printed Circuit Board. And also used different word refers the core/base, so you will also see different name of Metal Core PCB, such as  Metal PCB, Metal Base PCB, Metal Backed PCB, Metal Clad PCB and Metal Core Board and so on.

MCPCBs are used instead of traditional FR4 or CEM3 PCBs because of the ability to efficiently dissipate heat away from the components. This is achieved by using a Thermally Conductive Dielectric Layer.

The main difference between a FR4 board and MCPCB is the thermal conductivity dielectric material in the MCPCB. This acts as a thermal bridge between the IC components and metal backing plate. Heat is conducted from the package through the metal core to an additional heat sink. On the FR4 board the heat remains stagnant if not transferred by a topical heatsink. According to lab testing a MCPCB with a 1W LED remained near an ambient of 25C, while the same 1W LED on a FR4 board reached 12C over ambient. LED PCB always be produced with Aluminum core, but sometimes steel core PCB also be used.

According to number of copper trace layers, FR4 printed circuit board is normally divided into following types:
Single Sided (S/S), or Single layer;
Double Sided (D/S), or double layer, 2Layers, 2L;
Four Layers (4L), Six Layers (6L), Eight Layers (8L), Ten Layers (10L)
Board with more than 10L
In fact, for board more than four layers, people will named it "Multi-layer PCB". According to that standard, there're only three types of PCB: Single, Double and Multi-layers.

If divide the board according to manufacturing technology, major based on hole diamter size, it'll divid into two types:

Normal through hole (diameter >=0.20mm (8mil)
HDI (diameter <=0.15mm (6mil)
According to copper thickness, it can be divided into

Normall copper: copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ,
Heavy copper: copper thickness: >= 3 OZ
According to core material, it can be divided into

Rigid FR4 PCB: Only FR4, it is rigid for whole board;
Rigid-flex circuits: Rigid FR4 plus flexible circuits;
According to Tg value of FR4, it can be divided into

Normal Tg: Value 130, 135, 140;
High Tg: Value 170, 180;
According to radio frequency (RF) level of PCB, it can be divided into

Normal: < 300 Mhz
High Radio Frequency: 300MHz ~ 3GHz,or even bigger
According to board thickness, it can be divided into

Normal: >=0.30mm
Extra Thin: 0.10~0.30mm;