Archive for the ‘FR4 PCB’ Category

星期五, 13 9 月, 2024

What is Copper Clad Laminate?

Copper clad laminate short for CCL, it is a foundational material in the electronics industry. It consists of a thin copper foil bonded to one or both sides of a non-conductive substrate like fiberglass or resin. This combination creates a durable and conductive material that serves as the base for creating printed circuit boards (PCBs). The copper layer facilitates the transmission of electrical signals, while the insulating substrate supports the board’s structural integrity.

CCL comes in various thicknesses and types, depending on the application. It’s a critical part of most electronic devices, from smartphones to industrial machines. Its main role is to support the etching of circuit patterns, where unnecessary copper is removed, leaving conductive paths that enable electrical connections. Below is a structure of a double sided copper clad laminate:

What is Copper Clad Board Used For?

Copper clad boards are widely used in PCB manufacturing. Their role is to provide a surface for electrical components to connect through conductive copper traces. CCLs are widely used in applications including, but not limited to:

Electronic products: Copper clad board is the basic material of electronic products, used to manufacture various electronic equipment circuit board, such as TV, radio, computer, computer and so on.

Communication equipment: Mobile phones, tablet computers, routers and other communication equipment a large number of copper clad laminate.

Computers and peripherals: Computer motherboards, graphics cards, hard disks, etc., need a large number of copper-clad boards.

Automotive electronics: Electronic equipment in modern automobiles, such as ABS, air conditioning, navigation, etc., need to use copper clad board.

Military: Electronic components in military equipment also need to use a large number of copper-clad boards.

In addition, copper clad boards are also used in industrial control, medical instruments, national defense, aerospace and other fields. With the development of technology and the increase of application demand, the use of copper clad plate in electronic products is more and more extensive, which plays an important role in promoting the renewal of social production and living tools. For example, the development of the Internet of Things and artificial intelligence, as well as the application of 5G communication technology, have greatly increased the demand for copper clad sheets. ‌

What is the Market Report for Copper Clad Laminate?

The market for copper clad laminate has grown steadily due to the increasing demand for consumer electronics, automotive advancements, and telecommunication developments. The global CCL market is expected to expand significantly over the next few years, driven by technological advancements in 5G, renewable energy systems, and electric vehicles.

Key players in this market are working to develop lighter, thinner, and more efficient CCLs to keep pace with the growing need for high-performance electronics. Manufacturers exploring new materials and production methods to reduce costs while enhancing performance. The future looks promising, with a forecast of rapid growth driven by the electronics industry’s evolution.

Is Copper Clad Better Than Copper?

Copper clad laminate is a more practical option for PCBs than solid copper because it provides the required conductive properties at a lower cost. While copper is an excellent conductor, using copper as metal core PCBs would be expensive and impractical. CCL offers the same conductivity benefits but adds a lightweight, non-conductive layer that provides structural support.

Electrical Conductivity and Cost Efficiency

While pure copper has excellent electrical conductivity, copper clad laminates (CCLs) provide a balance between cost and performance. In a copper clad board, only a thin copper layer is used, which significantly reduces the amount of copper needed compared to using solid copper. For applications like PCBs, where large surfaces need copper conductivity but do not require the full thickness of copper, copper clad is more efficient and economical.

Thermal Management

Copper clad materials often have better thermal management properties due to the substrate’s ability to dissipate heat while maintaining the copper layer’s high conductivity. Pure copper, while an excellent heat conductor, may not offer the same level of thermal dissipation when used alone in complex electronic assemblies. For instance, in multi-layer PCBs, copper clad boards help balance the need for heat management and conductivity by using the copper layer efficiently while the base material manages thermal stress.

Structural Support and Durability

Copper clad laminates provide added structural support compared to pure copper sheets. The non-conductive substrate, often made of fiberglass, resin, or other materials, adds durability and rigidity to the thin copper layer. By contrast, is soft and flexible, making it unsuitable for structural applications without some form of backing material.

Corrosion Resistance

Copper, though highly conductive, is prone to oxidation and corrosion over time, which can affect its performance in certain environments. Copper clad laminates, however, are often treated with protective coatings or layered with other materials to enhance their resistance to corrosion.

Weight Considerations

Another important factor is weight. Copper is a dense metal, and using thick copper layers can significantly increase the weight of a product. In contrast, copper clad laminates achieve high conductivity with only a fraction of the copper’s weight.

How Thick is Copper Clad Board?

The thickness of a copper clad board depends on its intended application. Standard copper thicknesses for CCL are measured in ounces per square foot, typically ranging from 0.5 oz to 2 oz per square foot. This translates to about 17 to 70 microns. For high-power applications, thicker copper, such as 3 oz or more, may be used.

On the other hand, the thickness of the laminate itself can also vary, depending on whether it’s a single-layer, double-layer, or multilayer board. The insulating substrate can range from 0.2 mm to several millimeters, depending on the application. The total thickness of the copper clad board is a combination of the copper foil and the insulating material.

How Much Does Copper Cladding Weigh?

The weight of copper cladding is typically expressed in ounces per square foot. A common weight is 1 oz of copper, which means that a square foot of copper clad board has a 1-ounce copper layer. This is approximately 35 microns thick. Heavier copper cladding, such as 2 oz or 3 oz, is also used for applications that require higher current-carrying capacity or greater durability.

It’s important to balance the weight with the application needs. Higher copper weight provides better conductivity and durability but adds cost and weight to the final product. Therefore, the choice of copper weight in CCL depends largely on the required performance and cost considerations.

Copper Clad Laminate Price

The price of copper clad laminate varies based on several factors such as copper thickness, substrate material, board size, and production volume. Standard-grade CCL is more affordable, while high-end options with specialty substrates like Teflon or ceramic tend to be more expensive.

On average, copper clad laminate costs range from $5 to $15 per square meter for common types. However, high-performance laminates designed for demanding environments, such as those used in aerospace or military applications, can be significantly more expensive.

Global market trends, material shortages, and the demand for electronics heavily influence pricing. Recently, fluctuations in copper prices and supply chain disruptions have impacted the cost of CCL. Still, bulk orders or long-term contracts with suppliers can help reduce costs for large manufacturers.

How to Cut Copper Clad Laminate?

CCL requires careful handling to ensure precise cuts without damaging the copper layer or the substrate. The cutting method will vary depending on the thickness and material, but overall, clean and accurate techniques are key.

1. Choose the Right Tools

The tools you use depend on the thickness of the copper clad laminate. Thin CCL can be cut with a utility knife, while thicker boards require specialized tools like a PCB shear or laser cutter.

2. Prepare the Work Area

Before cutting, ensure that your workspace is clean and stable. Use a flat surface to keep the laminate steady during cutting. For larger boards, use clamps to secure them in place. Always wear protective gear like goggles and a mask, especially when working with power tools to avoid dust and debris.

3. Measure and Mark the Cutting Line

Accurate measurements are crucial for a clean cut. Use a ruler or measuring tape to mark the cutting line and draw it clearly with a permanent marker. Double-check your measurements to avoid mistakes before cutting.

4. Score the Copper Clad Laminate

For thin laminates, use a utility knife to score along the marked line. Score the copper side first, then flip it over and score the substrate. Once both sides are scored, gently bend the laminate along the line until it snaps cleanly.

5. Cut Thick Copper Clad Laminate

For thicker CCL, use a guillotine PCB shear or a Dremel tool. A PCB shear provides a clean, straight cut, while a Dremel is useful for cutting complex shapes. For high precision, a laser cutter is the best choice, especially for intricate designs.

6. Deburr and Smooth the Edges

After cutting, the edges may be rough. Use a file to smooth out any jagged areas, then finish with fine-grit sandpaper.

Safety is important when cutting CCL. Fiberglass and other substrate materials can produce harmful dust. Always wear a dust mask and safety goggles, and work in a well-ventilated area to minimize exposure to particles. In addition to this, avoid over-scoring the laminate, which can damage the substrate or cause copper peeling. Make sure to apply consistent pressure while cutting to prevent uneven edges. Always prioritize safety by using proper protective gear to avoid injuries.

Copper Clad Laminate Suppliers

Numerous suppliers provide copper clad laminate globally. The selection of a supplier depends on factors like the type of laminate, application requirements, and volume needed. Some well-known suppliers include:

Kingboard Laminates
Panasonic
Isola Group
Nan Ya Plastics
Shengyi Technology
Rogers Corporation
Ventec International Group
Doosan Corporation
Iteq Corporation
Mitsubishi Gas Chemical

With over a decade of effort and experience, Best Technology has been actively contributing to the growth of this business. Certified with ISO9001, ISO13485, IATF16949, UL, and RoHS, the company is fully capable of delivering high-quality, eco-friendly PCBs and various types of copper clad laminates at competitive prices.

What is Resistance in a Circuit Board?

Resistance in a circuit board determines how easily electric current flows through the board. Every component and trace on the board offers some resistance, but the goal is to minimize it. Resistance happens when the flow of electrons is blocked or slowed down by the material they travel through. This blockage causes energy loss, often as heat.

In printed circuit boards (PCBs), low resistance is preferred in traces and paths to ensure smooth current flow. However, resistors are intentionally added in circuits to control and manage current flow, protecting sensitive components.

Does A Circuit Board Base Have Low Resistance?

What is the Base of a Circuit Board?

The base of a circuit board is the foundation on which components are mounted and connected. The copper layers, laminated onto the base, provide the conductive pathways that allow current to flow between components. It usually consists of layers of different materials, including a non-conductive substrate like fiberglass, often referred to as FR4. Some other materials also can be used as the base of circuit board, like:

Glass fiber cloth substrate: commonly used in the production of double panels and multi-layer boards, with good mechanical properties and cost effectiveness.

Paper substrate: lower cost suitable for cost-sensitive applications.

Epoxy resin substrate: it has good mechanical properties and thermal stability, widely used in electronic products

Polyimide substrate: it has excellent high temperature resistance, suitable for high performance electronic products.

Polytetrafluoroethylene (PTFE) substrate: very high temperature resistance and low dielectric constant, suitable for high frequency and high temperature environments.

Ceramic substrates: such as alumina, aluminum nitride, etc., with high thermal stability and low dielectric constant, suitable for extreme environments.

Teflon (ETFE) substrate, it has good corrosion resistance, high frequency properties and low dielectric constant.

Metal substrates: metal materials like aluminum or copper are always serve as the base of metal core PCBs, they have very good thermal conductivity, and suitable for high power applications where need good heat dissipation.

How Does a Basic Circuit Board Work?

The basic circuit board connects various electronic components through conductive paths called traces, and performs specific functions through the interaction of electronic components. These tracks are made of copper and are designed to create specific circuits that control the flow of electricity. The circuit board uses insulating materials to isolate the conductive layer of copper foil on the surface, so that the current flows in each component along the pre-designed path to complete the functions of work, amplification, attenuation, modulation, demodulation, coding and so on.

Components such as capacitors, resistors, transistors, and diodes are soldered onto the board. The current flows through the components, following the paths designed in the layout, executing the required tasks, such as powering an LED or processing signals.

For the circuit to work, all components must be properly connected and powered. Any break in these connections can disrupt the flow of current, leading to malfunctions.

The main components and functions of the circuit board:

Pad – metal holes for welding the pins of components.

Through hole – there are metal through holes and non-metal through holes, used to connect the component pins between each layer.

Conductor – the conductive path connecting electronic components.

Components – such as resistors, capacitors, inductors, etc., are connected to each other by conducting lines.

Connector – used to connect external devices.

Electrical boundary – defines the electrical characteristics of the board.

Does an Open Circuit Have Low Resistance?

No, an open circuit has high resistance, often considered infinite.

Open circuit refers to the circuit state when no current passes between two points in the circuit or is connected by a conductor with a very large impedance value (or resistance value). When the branch between two points in the circuit is open, the potential difference between the two points is called “open voltage” and can be measured by a voltmeter. In the open state, because there is no current flow, the resistance is very high, this is because the current path in the open circuit is interrupted, resulting in the current cannot flow, so that the resistance in the open state is extremely high ‌

In contrast, a short circuit refers to the situation where the current does not pass through the electrical appliance and directly constitutes a path. In a short circuit, the resistance in the circuit is small, because the current flows directly through the wire, rather than through the load, resulting in a large current. In this state, the fuse may automatically blow due to excessive current, to prevent the wire from causing a fire due to heat ‌

How to Tell If a Circuit Board is Shorted?

Identifying a shorted circuit board involves looking for signs like:

Burn marks or discoloration on the board.

Swollen or damaged components.

Overheating, causing the board to feel hot to the touch.

The device or board not powering on or malfunctioning.

To confirm a short, a multimeter can be used. By measuring the resistance between points where there should be separation, a very low resistance could indicate a short. This can help pinpoint faulty components or traces.

How to Check Resistors on a Circuit Board?

To check resistors on a circuit board, you can use a multimeter in resistance mode.

Turn off the power to the board and discharge capacitors to avoid any residual current.

Set the multimeter to the appropriate resistance range.

Place the probes across the resistor’s terminals and read the value displayed on the meter.

Compare this value with the expected resistance value, usually printed on the resistor or found in the circuit’s schematic. A large discrepancy could indicate a faulty resistor.

How Are Circuit Boards Grounded?

Circuit boards are grounded by connecting the ground plane, often a large layer of copper, to a grounding point. The grounding modes of the circuit board mainly include single point grounding, multi-point grounding, floating ground and virtual ground. ‌

Single-point grounding

Single-point grounding ‌ is suitable for low-frequency circuits where only one physical point in the entire circuit system is defined as the grounding reference point and all other points that need to be grounded are directly connected to this point. This approach can reduce common ground impedance coupling and low-frequency ground loop interference, and is usually used for circuits with frequencies less than 1MHz.

Multi-point grounding

Multipoint grounding ‌ is suitable for high-frequency circuits, where each ground point of the electronic device is directly connected to the nearest ground plane (that is, the metal base plate of the device). This method can reduce the interference generated by the common ground impedance, and also reduce the parasitic capacitance and inductance, which is usually used for circuits with frequencies greater than 10MHz.

Floating ground

‌Floating ‌ that is, the ground of the circuit is connected to the ground without a conductor, but at a higher potential. The advantage of floating ground is that the circuit is not affected by geoelectrical properties, and can prevent electromagnetic interference caused by the coupling of common ground impedance circuits. However, the disadvantage of this method is that it is affected by the parasitic capacitance, which leads to the change of ground potential and increases the inductive interference to the analog circuit.

Virtual ground

Virtual ground ‌ is similar to floating ground and can be understood as the “floating ground” when the operational amplifier is short and broken.

What is the Rule for Resistance in a Circuit?

The fundamental rule of resistance is governed by Ohm’s Law: V=IR, where voltage (V) is equal to the current (I) multiplied by resistance (R). This shows that the resistance directly affects how much current flows for a given voltage.

In circuits, resistors are used to control current, and their value determines how much current is allowed through. For example, higher resistance lowers the current flow, while lower resistance allows more current to pass.

With over 18 years as an industry leader, Best Technology is one of the most experienced PCB and PCB assembly manufacturer in Asia. We are highly specialized not only in quick-turn PCB prototype and PCB assembly, but also medium and small volume PCB fabrication. In Best Technology, you can enjoy a full-comprehensive one-stop service from PCB design, layout, PCB fabricate, PCB assembly, function testing and delivery. We always try our best to fabricate your PCB with copper clad laminate with the highest quality to meet your demands.

If you have any questions, please feel free to contact us with sales@bestpcbs.com, we will be happy to help you.

PCB Full Form

PCB stands for Printed Circuit Board, a key component in almost all electronic devices. It connects and supports electronic components using conductive tracks, pads, and other features. The design and production of PCBs require precise engineering, as they are crucial for the functionality of the final product.

What is PCB Quote Packaging?

PCB quote packaging refers to the process of gathering and organizing all the details needed to estimate the cost of producing a PCB. This includes not only the design specifications but also the materials, manufacturing processes, and other engineering considerations. It’s not just a financial calculation but a complete engineering analysis that ensures the quote is accurate, feasible, and optimized for production.

The quote must consider every detail that affects production—like material types, size, complexity, and production volume. The aim is to package all these details into a clear, comprehensive quote, ensuring the client understands what they are paying for and why.

Why is Engineering Important in PCB Quote Packaging?

Engineering plays a vital role in the PCB quoting process because it’s not just about estimating costs. It’s about understanding the technical requirements and ensuring that every aspect of the design and production is accounted for. Engineers analyze the design, materials, and manufacturing methods to ensure the quote reflects the real cost of production.

Without engineering insight, a quote could be inaccurate, leading to cost overruns or production delays. Engineers make sure that all technical details, such as layer count, trace width, and component placement, are properly considered.

What Are the Key Factors in a PCB Quote?

Several factors come into play when preparing a PCB quote:

PCB Quote Packaging is What Type of Engineering?

1. Type of manufacturing process

The technical type of PCB determines its complexity and cost. For example, simple single panels cost much less than multi-layer panels, while flexible circuits (FPC) or rigid and flexible panels require more complex manufacturing processes and naturally cost more. In addition, whether advanced technologies such as microvias, laser drilling, blind holes or buried holes are required can also have a significant impact on the quotation.

2. Material type

Materials are an important part of PCB costs. Common materials include FR4, ceramics, metal substrates, etc. FR4 is the most common base material and is suitable for most conventional applications, but for high-frequency, high-temperature environments, ceramic or metal-based materials may be more suitable, but their price is relatively high. Choosing the right material not only affects the performance, but also directly affects the cost.

3. IPC level

IPC grades reflect the quality standards of PCB manufacturing, commonly used are IPC-A-600 grades 1, 2 and 3. The higher the grade, the more stringent the manufacturing requirements, and the corresponding increase in cost. For example, grade 3 PCBS are usually used in high-demand fields such as aerospace and medical equipment, which require higher accuracy and quality control, so the price is higher.

4. Circuit design

PCB circuit design complexity directly affects manufacturing costs. Including wire width, spacing, hole size and so on, the production process has put forward different requirements. High density interconnect (HDI) boards typically require more elaborate wiring techniques and may involve the use of microvias, which will increase the difficulty and cost of manufacturing.

5. PCB size and yield

The size of the PCB directly affects the amount of material used, and the larger the board, the more material is needed. In addition, the yield is also an important factor affecting the quotation. PCB manufacturing with complex design or high density lines is prone to defects, resulting in decreased yield. That means manufacturers may need to produce more boards to meet orders, increasing costs.

6. Material thickness

Different applications require different thicknesses of PCB materials. The standard FR4 thickness is usually 1.6mm, but thinner or thicker boards are sometimes used. Changes in material thickness can affect the overall cost, especially if thicker sheets require special processing or higher strength, and manufacturing expenses will increase accordingly.

7. Copper thickness

The copper thickness in the PCB usually has a standard choice, such as 1oz, 2oz or even thicker copper layers. The higher the copper thickness, the better the conductivity of the PCB, suitable for high-current applications, but the increase in copper thickness will significantly increase the manufacturing cost, especially in the plating and etching process requires additional materials and processes.

8. Stack-up method

The stacking mode determines the number of layers and the interlayer structure of the PCB. Complex multilayer boards or HDI boards require more complex lamination processes. For example, the lamination method may involve multiple pressing, the use of prepregs or special insulation materials. Each additional layer requires more manufacturing steps, resulting in increased costs.

9. Quantity

The quantity of the order has a direct impact on the PCB quotation. High-volume production can reduce unit prices by spreading tooling and setup costs, while small-batch orders are typically more expensive due to relatively high production preparation and start-up costs.

10. Delivery date

The shorter the delivery time, the higher the quotation. Rush orders require prioritizing production, which can disrupt the plant’s production schedule and require additional resource deployment. To meet urgent delivery deadlines, manufacturers may need to work overtime or speed up production, increasing overall production costs.

These are just a few examples, but they show how engineering considerations are woven into every part of the quoting process.

PCB Manufacturing Process

How Do Engineers Calculate PCB Manufacturing Costs?

Engineers calculate PCB manufacturing costs by considering the design specifications and the production methods needed to meet those requirements. They start by analyzing the PCB’s layout and design, which determines factors like layer count, trace width, and hole size. Each of these elements has a direct impact on the materials used and the manufacturing process.

They also consider the assembly process—whether it’s surface-mount or through-hole—and what testing will be required. After evaluating these details, they calculate the costs associated with each step of the manufacturing process. This ensures the final quote is both accurate and comprehensive.

What Type of Engineer Designs PCBs?

Engineers who design PCBs typically have a bachelor’s degree or above in electrical engineering, automation, computer science, or a related field ‌ and understand the basics of electronic design, printed circuit board (PCB), and electronics manufacturing in the PCB industry. These engineers need to master PCB design software such as Altium Designer, Eagle PCB, PADS, or CAD, etc., as well as the use of related manufacturing and testing tools. At the same time, they need to have a knowledge of the PCB industry, a certain circuit design and electronic components knowledge, including digital and analog circuits, signal processing, power electronics, embedded systems, communication technology, etc. In addition, holding certificates such as IPC-2221/2222, IPC-A-600/610, and CID (Certified Interconnect Designer) can prove that they have relevant professional knowledge and skills, which can help improve their career competitiveness.

These engineers also need to have a strong sense of responsibility and team spirit, have good communication and coordination skills, and be able to work effectively with customers, manufacturers, and other team members. For junior engineers, it is recommended to study in a single point of depth, such as PCB design, SI simulation, thermal design, EMC design, product testing, etc., and then start from this advantage point to expand the scope of knowledge

What Materials Are Considered During PCB Quote Packaging?

The type of material used for a PCB is a major cost driver. Common materials include:

This is the most common material used in PCBs due to its balance of cost and performance. It’s versatile and reliable for most standard applications.

Metal Core

Metal core PCBs are used in applications where heat dissipation is a concern, such as LED lighting. These boards are more expensive due to the metal layer.

Ceramic

Ceramic materials are used for high-frequency or high-temperature applications. They are more costly but offer better performance in extreme conditions.

Each material has its own manufacturing process, which also affects the cost. For instance, metal core boards may require different drilling techniques compared to standard FR4 boards. Engineers must consider these details when preparing a quote.

How Does the Choice of PCB Manufacturing Methods Impact the Quote?

The method used to manufacture the PCB can greatly impact the final cost. Common methods include:

Surface-Mount Technology (SMT): This is the most common method for modern PCB assembly. It’s efficient and cost-effective for most applications.

Through-Hole Technology (THT): This method is used for components that require a stronger mechanical bond. It’s more labor-intensive and, therefore, more expensive.

Flexible and Rigid-Flex Manufacturing: These types of PCBs require specialized processes and materials, which can increase the cost.

Additionally, advanced techniques like laser drilling for microvias or selective soldering for complex assemblies may be necessary for high-precision designs. Each of these methods requires careful consideration, and engineers must choose the best process for both the design and the budget.

Who Designs PCB?

Since 2006, Best Technology has been the leading PCB quick turn manufacturer specializing in both PCB prototype and production quantities, initially produced single-sided and double-sided printed circuit boards for the consumer electronics market. Now, we provide not only FR4 PCB, but also some special PCB like flex circuit, metal core PCB, ceramic PCB, extra thin PCB, HDI PCB, IC substrate, busbar PCB, heavy copper PCB and so on. We can make 50 layers PCB, and it is not our limit.

Nowadays, Best Technology has grown to become a major PCB manufacturer in Asia to serve in diverse customers base such as electronics appliance, communication, educational electronics, power supplies, automations.

For more information about PCB, or to learn more about the online quote and ordering process, please visit www.bestpcbs.com

What is Copper Pour in PCB Design?

Copper pour, also known as copper coating, refers to filled solid copper on PCB where without trace layout area or idle space. Instead of leaving unused areas bare, copper is poured over them, connecting it to the ground or other designated signals. The main purpose of this process is to reduce the ground impedance, improve the anti-interference ability, reduce the voltage drop. Thereby improving the power supply efficiency, and connect with the ground wire to reduce the loop area. By covering large sections of the board with copper, it also minimizes signal interference and adds a layer of protection to the PCB. Copper pour are essential for designers to maintain signal integrity and reduce unwanted noise.

What is Pour Board? What is Copper Pour in PCB?

The process of copper coating is not only very important for digital circuits, because it can effectively reduce the ground impedance, which is particularly important for digital circuits with a large number of spiking pulse currents. However, for analog circuits, the ground wire loop formed by laying copper may cause electromagnetic coupling interference.

Why Use Copper Pours on Circuit Boards?

Copper pours offer several advantages that make them an essential part of circuit board design. When creating PCBs, some engineers tend to leave many copper-free areas on the board. But a high percentage of copper-free areas on the PCB can negatively affect the product, making it vulnerable to early damage, when copper pouring comes in handy.

There are some novices who think that less copper pouring means that the cost will be lower and lower, which is wrong. It is true that the plating area is small, which can save copper, but there is no way to guarantee the quality, and the appropriate amount of copper pouring can improve the quality of the product.

When the PCB board is placed in the plating tank and the appropriate current is applied, the PCB will show the physical state after dry film coverage. After passing a current, the circuit lines exposed to the outside of the dry film will be plated with copper from the plating tank. The total area of the part of the circuit exposed outside the dry film will affect the value of the current distribution during the plating process, if the bare copper area is large, the current input is uniform, and the current received is more uniform. Therefore, a large area of copper plane must be laid in the design to prevent this from happening. If the total plating area of copper is too small or the pattern distribution is very uneven, the received current will not be uniform. In this way, when powered on, the greater the current, the thicker the copper plating layer (so designed, if only 1OZ is required, then the finished copper thickness can reach 2OZ).

If the gap between current traces is too small, for example about 3mil to 3.5mil, a “clip film” will form between the traces. In other words, the dry film is caught in the middle of the gap, which causes the subsequent base to start the copper in the middle, which can lead to a short circuit if the etching process is not cleaned. In order to maintain the high quality of PCB manufacturing, independent lines must be avoided as much as possible in PCB design and layout. In addition, it is recommended to use a large amount of copper on the entire PCB, if there is a separate line that cannot be covered with copper, then the continuation between the lines must be as wide as possible.

Advantages of Copper Pour Board

1. For EMC (electromagnetic compatibility) requirements, a large area of ground or power supply needs to be covered with copper, which will play a shielding role. For some special area, such as protective ground, it plays a protective role.

2. From PCB manufacturing perspective, generally in order to ensure an uniform copper plating, or avoid lamination deformation and bending, manufacturers always pour copper for those less trace layout PCB board.

3. For signal integrity PCB, pour copper gives the high-frequency digital signal a complete return path, and reduce the wiring of the DC network. In another way, pour copper can help to heat dissipation.

Disadvantages of Copper Pour

1. If the pins of the components are fully covered with copper, the heat dissipation may be too fast, resulting in difficulties in dismantling and repairing the components. Therefore, sometimes in order to avoid this situation, cross connections are used for components (pin contact and pad contact are shown in “+”).

2. Pouring copper in the area around the antenna is easy to cause weak signal, interfered acquisition signal, and the impedance of copper will affect the performance of the amplifier circuit. So the area around the antenna section is usually not covered with copper.

Copper Pour vs Ground Plane

There’s often confusion between copper pours and ground planes. While both serve similar purposes, they are not the same. A ground plane is a layer dedicated entirely to the ground signal, covering the entire surface of a board layer. It ensures a low-impedance path for electrical signals, minimizing interference.

Copper pours, on the other hand, are not necessarily tied to the ground. Designers can connect copper pours to any net, including power lines or signal traces. The primary goal of a copper pour is to fill in empty spaces, whereas a ground plane is dedicated exclusively to providing a ground connection.

Implementation of PCB Copper Pours

When designing a PCB with copper pours, a few best practices help in optimizing its performance. Here are some useful tips:

Assign Copper Pours to Ground First

When designing, prioritize assigning continuous copper to ground layers over power planes. A solid ground plane improves overall performance, providing a reliable reference for signals and reducing noise. Every PCB should have strong, consistent ground connections.

Monitor Trace Currents

Although reducing inductance is advantageous, flooding the board with copper can sometimes interfere with circuit tuning. Be mindful of traced paths, especially in high-current areas, to maintain proper load control.

Maintain Symmetry in Copper Pours

Ensure copper pours are symmetrical on both sides of the PCB. This balance helps prevent issues like board warping due to uneven expansion or moisture absorption. Symmetrical copper distribution is essential for the board’s structural integrity.

Avoid Acute Angles

Keep copper pours free from long, narrow protrusions or angles sharper than 45 degrees. Such shapes can become weak points, breaking off or acting as antennas during vibration or shock, potentially causing functional failures.

Incorporate Relief Features

Adding slots, anti-pads, and thermal spokes can relieve stress caused by material expansion, especially for large copper pours used on power planes. These features ensure mechanical stability and ease soldering.

Carefully Review Design Masks

Automated copper pour shapes may need manual adjustments to remove artifacts or undesirable patterns around complex components. Always review and fine-tune these masks to achieve optimal results.

When copper pours are correctly connected to appropriate nets, designers can enhance both the electrical and physical properties of the circuit by distributing copper strategically across the board.

Copper Pour Clearances and Settings

When designing a PCB with copper pours, clearances and settings play a crucial role in ensuring proper functionality and avoiding issues like short circuits. Here are PCB copper pour suggestions based on standard PCB board:

1. Trace to Copper Pour Clearance

Standard clearance: 0.2 mm (200 µm) or 8 mils
High-voltage applications: 1 mm (1000 µm) or 40 mils (or more, depending on voltage levels)

2. Pad to Copper Pour Clearance

SMD pads: 0.2 mm to 0.3 mm (8-12 mils)
Through-hole pads: 0.3 mm to 0.5 mm (12-20 mils)

You can adjust these values based on the pad size and the net to which the copper pour is connected.

3. Copper Pour Width and Thickness

The width and thickness of the copper pour should be chosen based on the current-carrying capacity of the board:

Minimum width: 1.5 mm (60 mils) for low-current signals
Power lines: At least 2-3 mm (80-120 mils), depending on current
Copper thickness: 35 µm (1 oz/ft²) is standard, but for higher currents, you can use thicker copper like 70 µm (2 oz/ft²) or more.

4. Via Clearance in Copper Pours

Standard via clearance: 0.2 mm (8 mils)
High-current via clearance: 0.5 mm (20 mils)

Clearance should be adapted to the board’s layer stack-up and current needs.

5. Thermal Relief Spokes

Spoke width: 0.3 mm to 0.5 mm (12-20 mils)
Spoke count: Typically 4 thermal relief spokes per pad
Clearance to pad center: 0.5 mm (20 mils)

6. Copper Pour to Board Edge Clearance

Standard clearance: 0.5 mm (20 mils) from the board edge
High-voltage boards: 1 mm (40 mils) or more

Layer Placement of Copper Pours

Copper pours can be placed on any layer of a PCB. In multi-layer PCBs, copper pours are often added on internal layers to maximize performance. For example, ground and power pours are frequently found on internal layers to reduce noise and improve thermal dissipation.

On outer layers, copper pours serve to enhance thermal management. They distribute heat from high-power components and help maintain an even temperature across the board. It’s important to balance the placement of copper pours with other components to ensure overall board stability and functionality.

Copper Pour PCB Design Considerations

1. The open areas in the design must be minimized and the open Spaces filled with copper.

2. It’s important to assess the current-carrying capacity. Make sure the copper pour is thick enough to handle the expected current loads, especially in power applications.

3. If there is no room for the copper, the two wires, the two pads, and the distance between the wires and the pads are designed to be 2 ounces thick with a minimum spacing of 8 mil.

4. When pouring copper, keep a certain distance from the ordinary touch pad. The distance between the track, the common plane and the drilled area should be greater than 0.5 mm. The copper must be poured as firmly as possible. Avoid pouring copper on small grids.

5. The inner layer of the gold finger must be all poured copper to avoid thinning of the board at the gold finger. Avoid choosing laminated structures with thin plates.

6. Those thin long, poorly grounded ground copper will have an antenna effect, which will cause poor EMC problems. Therefore, we should try to avoid causing broken copper when coating copper, such as causing broken copper can be removed.

7. Isolated (dead zone) copper problem, isolated copper if relatively small equivalent to broken copper can be deleted. If it is large, it can be defined as a place to add through the hole treatment, at this time there is no isolated copper.

8. Refer to the product design manual and apply copper coating near the antenna. Any interference or interference with the antenna must be avoided when pouring fake copper.

What are vias in PCB design?

Via hole is one of the important components of multi-layer PCB, and the cost of drilling usually accounts for 30% to 40% of the PCB board cost. Simply put, every hole on the PCB can be called a pass hole. From the function point of view, the hole can be divided into two categories: one is used as an electrical connection between the layers. The second is used as the fixing or positioning of the device.

How to Calculate Current Carrying Capacity in PCB Vias?

From a manufacturing process perspective, vias can be divided into three types: blind vias, buried vias, and through vias:

Blind vias: These connect the surface layer to an internal layer, without going through the entire board. Their depth is typically related to the hole diameter.

Buried vias: Located inside the PCB, they don’t reach the surface.

Through vias: These pass through the entire board and are the most common due to their lower manufacturing cost and simpler process.

How to make PCB vias?

Typically, PCB vias are produced following the IPC-2 standard, where the copper thickness in the hole is around 0.8 mil to 1 mil. However, in practice, the copper plating might not be uniform, and the thinnest part could be as narrow as 0.7 mil, affecting the current-carrying capacity.

Generally, the conventional PCB board is produced according to IPC-2 standard, where the copper thickness in the hole is around 0.8 mil to 1 mil (you can check the specific content of the IPC-2 standard). The hole that we think is produced during production is this ideal situation (as shown below), the size of the hole is regular, and the thickness of the hole copper is very symmetrical:

However, in practice, the copper plating might not be uniform. As you can see, the copper plating thickness of the perforated wall of the PCB produced in general may be wide up and down, and narrow in the middle, so the narrowest limit may be 0.7mil. It can be imagined that if the current carrying situation is evaluated, it should be calculated according to the smallest and smallest cross-sectional area, but the smallest cross-sectional area is deviated from the actual design value. But actually, a good PCB manufacturer can help to save much time and money for you, you can see the via holes cross-sectional made by Best Technology and others.

What Is the Current Carrying Capacity of a Via?

The current-carrying capacity of a via refers to the maximum current it can safely handle. In PCB design, vias are essential components that connect traces between layers, and their size and shape directly impact how much current they can carry. Factors affecting current capacity include via diameter, number of vias, and placement.

The current carrying capacity of a via hole refers to the current that can be safely carried by the hole. In PCB design, the hole is a key component connecting the layers of printed wires. Their size and shape directly affect the ability of current to pass through. The current carrying capacity of the hole is not only related to the diameter of the hole, but also affected by the uneven current distribution. That is, when multiple holes are actually placed, the current distribution is not equal, which is related to the distribution, quantity and location of the hole. Therefore, evaluating the current carrying capacity of the holes requires consideration of a variety of factors, including the size and number of holes, and their layout on the board.

For instance, a 12 mil via can safely carry around 1.2A of current. However, increasing the via size (e.g., to 16 mil, 20 mil, or 24 mil) doesn’t necessarily yield a proportional increase in current capacity. A recommended via size for optimal current handling is 10-12 mil.

In some cases, the current carrying capacity of the through hole can be evaluated by DC simulation software, such as using tools such as Allegro’s IR Drop. These tools can help designers more accurately predict and optimize the performance of the board.

How to Calculate Current Carrying Capacity in PCB Via?

The current-carrying capacity of a via can be simplified by using a trace model calculation. The formula is:

I = 0.048 * T^0.44 * A^0.75

Where:

I is the maximum allowable current in amperes (A).

T is the maximum temperature rise in degrees Celsius.

A is the cross-sectional area of the via, measured in square mils.

For the cross-sectional area of the via: A = π * (D + Tk) * Tk

Where:

D is the via’s diameter.

Tk is the copper thickness, typically around 20 μm (0.8 mil) according to IPC-2 or IPC-3 standards.

In high-density interconnect (HDI) boards, due to manufacturing constraints, the copper thickness may be reduced to as low as 10 μm.

PCB Via Current Calculator Per IPC 2152

IPC-2152 replaces the 50-year-old IPC-2221B standard. IPC-2221B identifies in a series of diagrams the connection between the PCB’s temperature rise, the current in the track, and the cross-sectional area of the track without multilayer boards.

IPC-2152 outlines the relationship of thermal conductivity, through hole, board material, and thickness to current, trace cross section, copper weight, and temperature. It can also determine the exact values of external and internal traces. IPC-2152 is not only a real-time protection program, but it also helps PCB designers model safe and appropriate designs. The Best Technology Wire Width and current Capacity calculator is based on this standard. You can calculate the trace area and current capacity for a given temperature rise.

The figure below is the calculation chart of the cross-sectional area of the through-hole given by IPC 2152. The formula of the cross-sectional area of the through-hole wall in the above figure is transformed, where D is the empty outer diameter, D is the inner diameter of the hole, and (d-d)/2 is the thickness of the hole wall, also known as the through-hole copper thickness. Where D is the empty outer diameter, D is the inner diameter of the hole, and (d-d)/2 is the thickness of the hole wall, also known as the thickness of copper through the hole. The copper thickness through the hole is not determined, and the copper thickness of each PCB manufacturer may be different. If you want to pass a larger current through the hole, it may be better to punch several more through the hole.

Then you can get a new formula of calculating cross sectional area of hole wall:

A typical example is calculating the via size based on a 20°C temperature rise and a 1A current.

Given:

Copper thickness of 1 oz (1.38 mil)

Current carrying capacity of 1A

Maximum temperature rise of 20°C

From the IPC-2152 Conservative Chart, the cross-sectional area corresponding to these conditions is 28 mil². Using the equation for the via’s cross-sectional area, you can calculate the via’s diameter.

From the chart, the required cross-sectional area is 28 mil².

The copper thickness is 1.38 mil.

Solving for the via diameter, we get:

d = 7.28 mil (0.185 mm)

Thus, a via with an internal diameter of 0.185 mm will safely carry a 1A current with a 20°C temperature rise.

Best Technology’s Via Current Capacity Calculator

Best Technology offers a current capacity calculator for PCB vias to ensure that designs meet specific current-carrying needs. The tool allows designers to input their parameters, such as via diameter and copper thickness, and outputs the current-carrying capacity value. Clik below image to use or click here: via current capacity calculator

1. Single-sided board:

On the most basic printed circuit board, parts are concentrated on one side and wires are concentrated on the other side. Because wires only appear on one side, this type of printed circuit board is called a single-sided board. Because single-sided boards have many strict restrictions on designing circuits (because there is only one side, wiring cannot cross and must go around a separate path), early circuits used this type of circuit board.

2. Double-sided board

This type of circuit board has wiring on both sides. In order to connect the wires on both sides, there must be a proper circuit connection between the two sides. This connection between the circuits is called a guide hole. A guide hole is a small hole filled or coated with metal on a printed circuit board, which can be connected to the wires on both sides. Because the area of a double-sided board is doubled that of a single-sided board, and the wiring can be interlaced (can go around to the other side), double-sided boards can be used on more complex circuits than single-sided boards.

3. Multilayer board:

In order to increase the area that can be wired, multilayer boards use more single- or double-sided wiring boards. Multilayer boards use several double-sided boards, and put an insulating layer between each layer of boards and glue them firmly. The number of layers of the circuit board represents how many independent wiring layers there are, usually an even number of layers, and includes the two outermost layers.

4. Flexible PCB board

Flexible PCB board is a printed circuit board made of a flexible substrate. Its advantage is that it can be bent, which is convenient for the assembly of electrical components. Flexible circuit board, flexible PCB, flexible circuit and multi-function printed circuit are other names for these circuit boards. These printed circuit boards are made using the same components as rigid printed circuit boards. The main difference is that the circuit board is designed to bend to the desired shape throughout the application process. These PCBs are available in single-sided, double-sided, and multi-layer configurations. This helps reduce the complexity of unit assembly.

5. Rigid PCB Board

Rigid PCB is a circuit board that cannot be twisted or folded. The base material of the board is a rigid substrate, which gives the board rigidity and strength. They are composed of multiple layers, including substrate layers, copper layers, solder mask layers, and silk screen layers, which are bonded together by adhesives and heat. While some circuit boards are single-sided, double-sided, or multi-layered, rigid PCBs can be any of these as needed. However, once made, they cannot be modified or changed.

6. Rigid-Flex Board

Rigid-Flex Board is a hybrid circuit board that combines elements of flexible and rigid circuit boards to form a foldable or continuously bendable circuit board, which is usually molded into a curved shape or curve during the manufacturing process.

The flexible portion of the circuit board is often used for interconnections between rigid circuit boards, allowing narrower wires to take up less space, thereby reducing the size of the circuit board. Using flexible PCBs for interconnections often eliminates the need for bulky and heavy connectors, making rigid-flex boards lighter. The design of rigid-flex boards is slightly more complicated because these boards are 3D constructed, allowing the board to be folded or twisted to produce the shape required for the product.

7. High-frequency PCB board

High-frequency circuits refer to the overall circuit board design, not the other types of circuit board structures we described earlier. These PCBs are designed to conduct signals over 1 GHz.

High-frequency boards mostly use FR4-grade glass-reinforced epoxy boards, polyphenylene ether (PPO) resins, and Teflon, but Teflon has a low and stable Dk value, low dielectric loss, low hygroscopicity, and is slightly more expensive.

When designing high-frequency circuits, various factors must be considered, such as Dk value, dissipative loss, and dielectric thickness. The DK value of the substrate is an important factor to remember. Substrates with a higher probability of Dk value changes usually experience impedance changes, which affects the harmonics that make up the electrical signal, resulting in poor signal integrity.

8. Copper substrate

Copper substrate is a metal substrate with high thermal conductivity, suitable for high-frequency circuits and areas with large high and low temperature changes and heat dissipation and architectural decoration industries for precision communication equipment.

The copper substrate circuit layer requires a large current carrying capacity, and a thicker copper foil should be used, with a thickness of generally 35μm~280μm. The thermal conductive insulation layer is the core technology of the copper substrate. It is composed of core thermal conductive components and high molecular polymers, with low thermal resistance (0.15), excellent viscoelastic properties, resistance to thermal aging, and the ability to withstand mechanical and thermal stress.

The copper substrate metal base is the supporting member of the copper substrate, which is required to have high thermal conductivity. It is generally a copper plate, and a copper plate can also be used (where the copper plate can provide better thermal conductivity). It is suitable for conventional mechanical processing such as drilling, punching and cutting.

9. Aluminum-based PCB board

The design of aluminum-based PCB circuits is similar to that of copper-based PCBs, but the substrate material of aluminum-based PCBs is aluminum metal, rather than the standard glass fiber used in most circuits.

The aluminum layer is reinforced with the least heat-resistant insulation material, which means less heat is transferred from the insulation material to the backing. After applying the insulation layer, another layer of copper is required.

10. High Density Interconnect (HDI) PCB

Among the many types of PCBs, HDI PCB is a circuit with multiple interconnections that takes up very little space. HDI components are mounted close to each other, minimizing PCB space while maintaining high functionality. Boards containing 120-160 pins per square inch are classified as HDI PCBs.

HDI designs integrate dense device mounting and multi-purpose wiring. With the help of microvias, buried vias, and blind vias, compact circuits can be made, minimizing drilling to copper. For the electrical requirements of high-speed signals, HDI PCBs must have high-frequency conduction capabilities, impedance control, and minimal redundant radiation.

11. Thick Copper PCB

Thick copper PCB is also called heavy copper PCB. Basically, it contains more than 2 ounces of copper in the inner and outer layers of the board. Heavy copper transmitters significantly increase the overall thickness of the board; thick copper boards are known for supporting high currents, high temperatures, and cyclical thermal cycles.

12. High TG PCB

Among various types of PCBs, high Tg PCBs are circuit boards designed to work at high temperatures. Glass transition temperature (Tg) is an essential element of any epoxy resin. It is basically the temperature point at which the polymer changes from a hard glass substrate to a soft rubber substrate. The substrates used to make high Tg circuit boards must be flame retardant, which means that they soften instead of burning at the glass transition point (Tg).

The higher the Tg value, the higher the temperature requirement during lamination. Under such conditions, the PCB will become hard and brittle, affecting the aperture size and related electrical properties. Standard boards will soften, deform and melt under such conditions, and their mechanical and electrical properties will be significantly reduced.

Standard FR-4 Tg is between 130-1400C, medium Tg is between 150-1600C, and high Tg is above 1700C. The higher the Tg value, the better the board’s heat, moisture and chemical resistance.

Conclusion:

PCB board types are updated and iterated with the rapid development of the industry, and various types of PCB boards have gradually evolved to cope with various application scenarios, adding corresponding materials according to the required performance. BEST Technology has various PCB types of manufacturing technology, which can meet your any type of PCB needs.

How much do pcb board price?

The price of PCB is determined by many factors, including board cost, processing cost, quality inspection cost, etc. ‌

‌Board cost‌ is the main component of PCB cost, accounting for about half of the total cost. The cost of boards depends on factors such as material, thickness, size and quality. For example, the prices of different types of plates such as FR4, CEM-1, and aluminum substrates vary significantly. The cost of panels will be affected by multiple factors such as market supply and demand, raw material price fluctuations, and the complexity of the production process.

What are the factors that affect pcb board price?

‌Processing costs‌ include cutting, drilling, electroplating, lamination and other links. The equipment and process requirements of each link will affect the final cost. The depreciation costs of high-end equipment, workers’ operational proficiency and the degree of optimization of the production process are all key factors that affect processing costs.

‌Quality inspection cost‌ is also an important part of PCB cost. Strict quality testing is required during the production process, including environmental adaptability testing, electrical performance testing, etc. The number and stringency of these testing items will also affect production costs.

In addition, the cost of PCB also includes indirect costs, such as equipment depreciation expenses, labor costs, management expenses, R&D expenses, etc. Batch size and yield control are also important factors that affect cost. Large-volume production usually reduces unit costs, and high yield means lower costs. Therefore, the specific cost of PCB needs to be comprehensively evaluated based on factors such as specific board type, processing requirements, testing standards, and production batches.

Why is PCB so expensive?

‌The price of PCB is high mainly because its production involves multiple cost factors and complex processes. ‌

The production cost of PCB is affected by the cost of materials.

PCB boards are mainly made of materials such as copper, fiberglass, and epoxy resin. The cost of these materials directly affects the final price of the PCB board. In addition, the complexity of PCB design and manufacturing is also an important factor affecting the price. The design and manufacturing process requires precise tools and specialized skills. The more complex the design, the higher the fees paid to the designer. The complexity of the manufacturing process will also lead to increased costs.

Accuracy and quality are also key factors in determining pcb board price.

High-precision PCBs require higher manufacturing costs because they require more precise tools and more rigorous manufacturing processes. High-quality PCBs usually need to go through more quality control steps, which also increases costs.

Supply chain and regional differences are also factors that affect pcb board price.

Changes in the global supply chain and differences in production costs in different regions will be reflected in pcb board price.

In terms of production process.

PCB production includes multiple stages, such as pre-processing, image transfer, electroplating, etching, inspection and trimming, and post-processing. Each stage requires specific technology and equipment, which also increases production costs.

In addition, the price of PCB is also affected by a variety of other factors, including surface treatment technology, copper foil thickness, customer’s quality acceptance standards, mold fees and test rack fees, payment methods and order volume/delivery time, etc. For example, different surface treatment processes (such as OSP, leaded tin spraying, lead-free tin spraying, etc.) and copper foil thickness will lead to price differences; the higher the customer’s quality acceptance standards, the higher the price; mass production may require Molds and test racks, which also add cost.

To sum up, the high price of PCB is mainly due to the fact that its production involves a variety of materials, complex processes, high precision and quality requirements, and a variety of factors that affect cost.

How much gold is in a PCB board?

‌PCB boards contain a certain amount of gold, but the exact amount varies depending on the type and application of the PCB board.

PCB board (printed circuit board) is an indispensable component of most electronic products and is used to interconnect circuits. With the development of technology, some special electronic copper-clad laminates can even be used directly to manufacture electronic components.

In the manufacturing process of PCB boards, gold is often used as a material for surface treatment, especially in some high-end or special application PCB boards. For example, components such as motherboards, CPUs, random access memory chips (RAM), internal modems, PCI boards, Ethernet ports, etc. often contain gold on their connection pins and surface layers. The use of this gold not only increases the value of the product, but also improves its performance and reliability‌.

As for the specific gold content, although there is no fixed ratio, data shows that 1 ton of circuit boards contains at least 80 grams of gold, and chip packaging also contains gold and other precious metals such as silver. This shows that recycling precious metals such as gold from electronic waste has considerable economic value‌. In addition, the application of gold in PCB boards is usually achieved by electroplating. Sometimes a layer of nickel is added between gold and copper as a barrier layer to prevent electron migration and diffusion reactions between them.

To sum up, although the gold content in PCB boards is not high, its existence is crucial to improving the performance and reliability of electronic products, and it also has certain economic value in electronic waste recycling.

How much does it cost to replace a PCB board?

Cost estimation method in PCB processing factory The cost of PCB is composed of many factors. Most of the cost comes from the number of layers, material, drilling volume, surface treatment process, etc. of the board. Generally speaking, the cost of the board is about 1% of the total cost. About half.

According to speculation, the processing cost of PCB with more than 6 layers of material per square centimeter can be estimated as follows:

(1) For every two additional layers of the line, the cost increases by 0. 05 yuan, that is, 0. 05 yuan/cm2;

(2) Screen printing layer and solder mask layer, film cost, 300 yuan;

(3) The circuit layer film fee is 100 yuan per layer.

Actual costs should be inquired from the manufacturer.

Design requirements (1) Among the PCB processing costs, the board cost accounts for about half. Therefore, the smaller and thinner the board size, the higher the utilization rate, and the lower the cost.

(2) In terms of surface treatment, based on spray tin spraying, the surface treatment cost OSP is about 20% lower, ENIG is about 20% higher, and Im-Sn and Im-Ag are basically the same as spray tin spraying.

(3) The number of laminations has a greater impact on the cost. Each additional time will increase the total cost by about 3%.

(4) Special processes, such as buried copper, are relatively expensive and require separate communication with the manufacturer.

(5) The cost of line width/line spacing less than or equal to 3mil/3mil is about 6% higher than the cost of greater than 3mil/3mil.

(6) Adding one stage to the HDI board will increase the cost by about 18%. Therefore, the use of HDI needs to be carefully considered.

Are old PCBs worth anything?

Old PCBs not only have economic value, but also have important significance and value in environmental protection, art, etc.

There are a lot of gold elements on old PCBs, because circuit interfaces are often plated with gold to increase contact performance and prevent corrosion. In addition, waste printed circuit boards also contain a variety of valuable metals. The main direction of recycling waste circuit boards is the recycling of metals.

These circuit boards contain a large amount of precious metals and rare materials. According to data, the metal contains about 20% copper, 8% iron, 2% nickel, 4% tin, 2% zinc and other common metals, and about 0.1 % gold, 0.2% silver, 0.005% palladium and other precious metals, and also contains many toxic and harmful heavy metals, such as lead, hexavalent chromium, mercury, cadmium, etc. With the right recycling techniques and processes, these valuable materials can be extracted and used to produce new electronic products.

This can not only save resources and reduce damage to the natural environment, but also effectively reduce production costs. Therefore, discarded PCB circuit boards should not be simply regarded as garbage, but should be regarded as a valuable resource.

With a combination of technology and creativity, electronics enthusiasts and artists have discovered a variety of ways to transform discarded circuit boards into unique pieces of art, home décor, or functional items. Through careful disassembly and reassembly, these discarded circuit boards are given a new life.

How can I make PCB cheaper?

1. ‌Optimized design‌: Correct component placement and layout design can significantly reduce PCB costs and improve circuit performance‌.

2. ‌Choose the right material‌: Choose the right PCB material according to the application scenario.

3. Optimize line spacing: By optimizing line width and line spacing, you can avoid additional adding.

4. Optimize the process‌: Use more efficient manufacturing processes such as the V-cut process to reduce material waste and improve sheet utilization.

5. ‌Mass production and panelization‌: Carry out mass production according to demand, enjoy batch discounts and discounts, and reduce unit prices‌.

6. ‌Technical improvement‌: Introduce advanced equipment and processes to improve production efficiency and reduce error rates, thereby reducing production costs‌.

Through the comprehensive application of the above strategies, the cost of PCB can be effectively reduced while ensuring product quality and production efficiency.

Conclusion:

Understanding the factors that affect pcb board price during the production and processing stages can help you make cost-effective decisions to ensure the quality of your products while saving money. BEST Technology has extensive design and production experience in PCB manufacturing and can effectively help you solve pcb board price issues.

What is a heavy copper PCB?

Heavy copper PCB is a special printed circuit board (PCB) characterized by a very high concentration of copper, usually up to 200 ounces per square foot, and the copper content of the inner and outer layers of the circuit board is above 3 ounces (oz), which enables heavy copper PCBs to conduct extremely high currents, achieve good heat distribution, and realize complex circuit layouts in a limited space.

In the design and manufacturing process of heavy copper PCBs, thermal stress handling is an important consideration. Engineers need to eliminate thermal stress as much as possible to maintain the circuit while minimizing the power budget, while taking into account environmentally friendly design.

With the development of PCB manufacturing process, modern manufacturing technology such as the use of aluminum PCB can better handle thermal stress problems.

The heat dissipation capacity of Heavy copper PCB is better than the traditional solution of using external heat sink, because it prints the heat sink directly on the circuit board during the manufacturing process, and achieves rapid heat transfer through conductive through-holes, thereby improving heat dissipation performance.

In general, Heavy copper PCB is a high-performance electronic component carrier, which provides an ideal solution for applications requiring high power and high reliability through its high copper content and optimized thermal management characteristics.

What is the difference between PCB and Heavy copper PCB?

Copper board and Heavy copper board look similar in name, and people tend to think that they are the same PCB, but in fact they refer to different things.

1. PCB:

PCB refers to a copper-based PCB. The use of copper as a substrate is to better dissipate heat and extend the life of components on the PCB. The copper substrate is to allow heat to be quickly transferred from the PCB to the outside, such as a heat sink or a metal casing. Because the thermal conductivity of copper is several times that of aluminum or other metals, up to 401W/MK.

2. Heavy copper PCB:

Heavy copper PCB refers to PCB with copper thickness exceeding 3OZ. The substrate can be aluminum or FR4. Heavy copper is to enable PCB to carry large current. Please note that Heavy copper here does not refer to the thickness of PCB, but the thickness of copper foil on PCB. Both aluminum PCB and FR4 PCB can thicken the copper foil.

What is the maximum copper thickness on Heavy copper PCB?

‌The maximum thickness of copper on Heavy copper PCB can reach 20oz. ‌

In circuit board design and manufacturing, copper thickness is an important parameter, which directly affects the electrical performance, heat dissipation capacity and mechanical strength of the circuit board. For applications that need to carry large currents, it is necessary to choose a thicker copper layer.

The copper layer thickness of Heavy copper ultra-thick PCB is generally between 2oz and 20oz. This range of copper layer thickness can ensure the stability and reliability of the circuit board while providing good heat dissipation performance.

In practical applications, according to international standards, the copper thickness of PCB boards can be divided into standard copper thickness and non-standard copper thickness. Standard copper thickness includes 1oz (35um) and 2oz (70um), while non-standard copper thickness covers 0.5oz (17um), 3oz (105um) and 4oz (140um). For some special applications, such as high-power LED lights, electronic high-frequency circuits, etc., a higher copper thickness may be required. At this time, non-standard copper thickness will be selected, up to 20oz.

During the manufacturing process, a Heavy copper foil is first adhered to the substrate, and then the circuit pattern is transferred to the copper foil through a photolithography process. Then chemical etching is performed to remove excess copper, and finally the thickness of the copper layer is further increased through an electroplating process to ensure that the Heavy copper PCB can meet the requirements of high current and high power applications.

Finally, surface treatment is performed to protect the copper circuit from oxidation and corrosion. Common surface treatment methods include hot air leveling (HASL), lead-free tin spraying, nickel gold (ENIG), etc. During the entire manufacturing process, process parameters must also be strictly monitored to ensure the uniformity and thickness consistency of the copper layer.

What are the advantages of Heavy copper PCBs?

1. Heavy copper PCBs have better current conductivity and can withstand excessive current loads. Because thicker copper wires have higher current carrying capacity, their current carrying capacity can be increased by increasing the copper wire width.

2. Heavy copper inner layers are ideal power distribution layers in multi-layer PCBs, which minimize ground bounce and power supply noise

3. Improve thermal performance and increase heat dissipation. Can withstand repeated thermal cycles during manufacturing and assembly.

4. Provide high mechanical strength in connector locations and plated through holes.

5. Due to the presence of copper layers, the size of the circuit board is reduced.

What are the disadvantages of Heavy copper PCBs?

1. Heavy copper PCBs are more expensive to manufacture than standard PCBs because more specialized equipment and richer expertise are required.

2. Heavy copper PCBs are more difficult to process because the PCBs may be heavier and bulkier than other PCBs.

What are the properties of Heavy copper PCBs?

High mechanical strength: After Heavy copper is applied to the circuits and vias of the board, the printed circuit board has super high mechanical strength, and the weather resistance of the circuit board and electrical system is more stable and has a high melting point. Hot melt welding methods such as oxygen blowing can be used, and it is not easy to become brittle at low temperatures. Even in an extremely corrosive atmospheric environment, Heavy copper PCBs can form a strong, non-toxic passivation protective layer.

Excellent weather resistance: Because Heavy copper PCB boards support the selection of a variety of dielectric materials. It improves the overall weather resistance of the board and can ensure the stability of circuit transmission signals under certain high temperature or extreme special environments.

Thermal management: With the advancement of modern technology, PCBs are becoming more and more complex, and high-density currents increase the difficulty of thermal management. Excessive temperature will affect the normal operation of electronic equipment and even cause damage. Heavy copper PCB boards can provide stronger heat dissipation capabilities. With heat sinks and copper plating on through holes, the heat generation of the board can be greatly reduced.

Excellent current conductivity: In the operation of electronic equipment, Heavy copper printed circuit boards are excellent current conductors that can connect and transmit power between various boards.

Diversity: Plating of Heavy copper circuits allows Heavy copper PCB manufacturers to increase the copper weight of via sidewalls and plated holes, thereby reducing the number of layers and occupied space.

Ductility: Heavy copper PCBs have the best ductility and are not limited by processing temperature.

High performance: Heavy copper plating integrates high current and control circuits, allowing high density with a simple board structure.

Where are Heavy copper PCBs used?

1. Automotive electronics

2. Grid switching systems

3. Power line monitors

4. Security and signal systems

5. Radar monitoring systems

6. Industrial control

7. Aerospace

8. Telecommunications

9. Medical devices

Conclusion:

In PCB production, Heavy copper PCBs require special processes, are difficult to operate, and have certain technical barriers, so the production cost of Heavy copper PCBs is higher than other ordinary circuit boards. Although the price is not cheap, the quality and service are the best.

BEST Technology has more than 18 years of PCB manufacturing experience. Focusing not only on fast PCB prototyping and PCB assembly, but also on small and medium batch PCB manufacturing, customer satisfaction is our goal, we will do our best to manufacture your circuit boards in the highest quality to meet your needs, and are committed to complying with the most stringent standards in PCB manufacturing and assembly. ‌

Why fill PCB with copper?

The main purpose of using copper to fill PCB (Printed Circuit Board) is to improve the electrical conductivity of the circuit board, enhance mechanical strength and stability, protect the circuit board from oxidation or corrosion, and improve heat dissipation capabilities. ‌

The influence of copper thickness on PCB

As an excellent conductive material, copper plays a vital role in PCB design. By covering the surface of the PCB with copper foil, the conductive performance of the circuit board can be significantly improved and the connection between various components can be ensured to be more stable and reliable.

Copper foil itself has high mechanical strength and stability, which can effectively prevent PCB from being damaged or deformed due to the influence of the external environment. The corrosion resistance of copper foil can also protect the circuit board from oxidation or corrosion, thereby extending the service life of the circuit board and ensuring its stability and reliability during work.

Since metal has good electrical and thermal conductivity, copper coating can increase the heat dissipation surface area of the PCB, help distribute heat evenly, and prevent the generation of local high-temperature areas. This can not only reduce local heat concentration, but also reduce the temperature gradient of the heat source and improve heat dissipation efficiency.

To sum up, the role of copper-filled PCB is multi-faceted. It can not only improve the conductivity and mechanical stability of the circuit board, but also protect the circuit board from environmental influences, while enhancing the heat dissipation capacity and ensuring the stable operation of electronic equipment. and long-term use‌.

Is a thicker PCB copper better?

The copper thickness of PCB is not as thick as possible, but the appropriate copper thickness needs to be selected according to the design requirements and actual application of the circuit board. ‌

The importance of copper thickness in PCB manufacturing cannot be ignored because it directly affects the conductive performance, heat dissipation performance, mechanical strength and signal integrity of the circuit board. Proper copper thickness can provide good electrical and thermal conductivity while ensuring the reliability and stability of the circuit board.

Although an excessively thick copper layer can improve current carrying capacity and heat dissipation performance, it will also increase cost and weight, which may lead to serious glue flow and increased processing difficulty. Therefore, when selecting copper thickness, factors such as circuit board design requirements, application environment, and cost need to be comprehensively considered.

During the PCB design and manufacturing process, the optimal copper thickness should be selected based on specific application requirements and cost considerations to achieve optimal circuit performance, heat dissipation, and mechanical strength‌.

How thick is the copper on a 1 ounce copper PCB?

The thickness of 1 ounce of copper on a PCB is 35 microns. ‌

In the PCB industry, ounces (oz) are the unit used to express copper foil thickness, not weight. Specifically, the thickness of 1oz of copper refers to the thickness achieved by spreading 1oz of copper evenly over an area of 1 square foot.

According to different information, the thickness of 1oz copper can be obtained by different calculation methods, but the generally accepted value is that 1oz copper is equal to 1.4mil (milliinch), which is equivalent to 35 microns. Therefore, whether in international standards or practical applications, the thickness of 1oz copper on PCB is usually considered to be 35 microns.

In addition, the copper thickness of the PCB has a direct impact on the circuit board’s current carrying capacity, heat dissipation, reliability and other performance indicators. Commonly used PCB copper thickness specifications include 1oz, 2oz, 3oz, 4oz, 5oz, 6oz, etc., which correspond to different copper layer thicknesses. The copper layer thickness of 1oz is 35 microns, 2oz is 70 microns, and so on, 6oz is 210 microns. . These specifications provide the basis for selecting different copper thicknesses based on specific application needs to meet different electrical performance and physical requirements.

What is the conventional PCB copper thickness?Thick copper plate, FPC

‌Regular PCB copper thickness is 1oz (35μm). When the thickness of the copper foil reaches or exceeds 2oz, such a PCB board is defined as a thick copper board; for flexible circuit boards (FPC), the copper thickness also has different specifications, for example, 0.5oz copper thickness is used for flexible circuit boards is being manufactured. ‌

In PCB manufacturing, the choice of copper thickness is determined based on specific application requirements. Common copper thickness classifications include:

1. ‌1oz copper thickness: ‌

This is the most common and standard copper foil thickness and is widely used in everyday electronic devices and general applications. 1oz (ounce) means 1 ounce of copper foil weighs 1 square foot. In the PCB manufacturing process, 1 ounce corresponds to a copper foil thickness of approximately 35 microns, which has good electrical and thermal conductivity.

2. ‌2oz copper thickness: ‌

Copper foil of this thickness is usually used in circuits that require higher current carrying capabilities, such as power amplifiers, high-power LEDs, etc. 2oz copper thickness corresponds to a copper foil thickness of approximately 70 microns, which has better performance in electrical conductivity and heat dissipation than 1oz copper thickness.

3. ‌0.5oz copper thickness: ‌

This thinner copper foil thickness is suitable for some light and small electronic products, such as electronic watches, mobile phones, etc. 0.5oz (18μm) copper foil is suitable for equipment that has strict requirements on circuit board size and weight.

How to choose PCB copper thickness?

Choosing PCB copper thickness depends primarily on the board’s purpose, current requirements, signal integrity requirements, cost budget, and manufacturing process capabilities.

1. ‌Circuit board usage and current requirements‌: For circuit boards that need to handle large currents, such as power boards, it is recommended to use thicker copper foil, such as 2oz (about 70μm) or 3oz (about 105μm). For signal transmission, a copper thickness of 1oz (~35μm) is usually sufficient. Ordinary double-sided boards generally use 1oz copper thickness, while multi-layer boards generally use 1/2oz, 1/3oz copper thickness for the inner layer, and 1oz, 1/2oz, 1/3oz copper thickness for the outer layer.

2. Signal integrity requirements: For high-density interconnect (HDI) boards or high-frequency circuits, thinner copper foil may be required to reduce parasitic effects and ensure signal integrity.

3. ‌Cost considerations‌: The thicker the copper foil, the higher the cost is usually.

4. Environmental factors: For PCBs in extreme working environments (such as high temperature, high humidity or high vibration environments), the thickness of the copper foil may need to be adjusted to enhance the stability and durability of the circuit.

In summary, selecting PCB copper thickness is a process that comprehensively considers multiple factors and needs to be determined based on specific application scenarios and design requirements.

What is the difference between different copper thicknesses on PCB?

‌The main differences between different copper thicknesses on PCBs are their conductive properties, load-bearing capacity, anti-interference performance, cost and manufacturing difficulty. ‌

‌Outer copper thickness‌ is commonly used for circuit board routing and connections, and its selection depends on the application requirements and design needs of the circuit board. The outer copper thickness range is generally between 1-5oz, and the more common ones are 1oz, 2oz, 3oz and 4oz. The thicker the outer copper layer, the stronger the circuit board’s load-bearing capacity, and the better its anti-interference performance and electrical conductivity. But at the same time, the increase in the thickness of the outer copper layer will also lead to an increase in cost and manufacturing difficulty.

‌Inner layer copper thickness‌ is used for internal connections and signal transmission of the circuit board, and its selection also depends on the application requirements and design needs of the circuit board. The thickness of the inner copper layer generally ranges from 0.5-2oz, with the more common ones being 0.5oz, 1oz, and 2oz. If the circuit board needs to transmit high-speed signals, a larger inner copper thickness should be selected. The increase in the thickness of the inner copper layer will also lead to an increase in cost and manufacturing difficulty.

‌Copper Thickness Standard‌According to international standards, the copper thickness of PCB boards can be divided into standard copper thickness (such as 1oz and 2oz) and non-standard copper thickness (such as 0.5oz, 3oz and 4oz). In practical applications, some special PCB boards may require higher copper thickness, such as high-power LED lights, electronic high-frequency circuits, etc.

To sum up, the choice of different copper thicknesses is to meet specific circuit board design needs, including conductive performance, anti-interference performance and other requirements. At the same time, the choice of copper thickness also needs to consider aspects such as cost and manufacturing difficulty.

Conclusion:

By controlling the thickness of copper on the PCB to meet different usage requirements, applications that require large currents will naturally require PCBs with thicker copper foils. However, PCBs that require thicker copper foils are a great test of the capabilities of PCB manufacturers. BEST Technology has accumulated rich production experience in the PCB manufacturing industry and has many years of manufacturing experience for PCBs with different copper thicknesses. We can meet any PCB copper thickness requirements.

What is the standard thickness of a copper layer on a PCB?

In the manufacture of printed circuit boards (PCBs), the thickness of the copper layer is an important parameter that directly affects the electrical performance and reliability of the circuit board. Depending on the application requirements, the thickness of the copper layer can vary within a certain range. Generally speaking, the conventional copper layer thickness is between 1-35μm, with 35μm being the most commonly used thickness. For some applications with high reliability requirements, the copper layer thickness may reach more than 50μm.

The selection of the thickness of the copper layer is a decision-making process that takes into account a variety of factors, including the conductivity, heat dissipation, mechanical strength, cost and manufacturing difficulty of the circuit board. A larger copper thickness can reduce resistance and improve the conductivity and heat dissipation of the circuit board, but it will also increase material costs and production difficulties. Therefore, when designing PCB boards, engineers need to select a suitable copper thickness standard range based on specific application scenarios and design requirements to ensure the performance and reliability of the circuit board.

1oz copper thickness in mm = 0.035mm

0.5 oz copper thickness in mm = 0.0175mm

1.5 oz copper thickness in mils = 0.0525mm

2 oz copper thickness in mils = 0.07mm‌

How thick is PCB copper after plating?

PCB printed circuit boards are usually bonded to glass epoxy substrates with a layer of copper foil, usually 18, 35, 55 and 70 microns thick. The most commonly used copper foil is 35 microns thick.

The copper foil used by PCB manufacturers is generally 35~50 microns thick, and some are thinner than this, such as 10 microns, 18 microns, and thicker such as 70 microns. The thickness of the composite copper foil on a 1~3 mm thick substrate is about 35 microns. The thickness of the composite copper foil on a substrate with a thickness of less than 1MM is about 18 microns, and the thickness of the composite copper foil on a substrate with a thickness of more than 5 mm is about 55 microns.

The copper layer thickness of PCB (printed circuit board) can be adjusted according to different needs and designs. Common copper layer thicknesses include 1oz (35μm), 2oz (70μm), 3oz (105μm), and other thicker options. For most applications, a copper layer thickness of 1oz is sufficient and suitable for general signal transmission. ‌For circuit boards that need to carry large currents, such as switching power supplies, a copper layer thickness of 2oz or higher is usually used. ‌In addition, there are some special cases where manufacturers provide extremely heavy copper up to 20 oz/ft2 (26.8 mils or 0.34 mm) to meet special needs. ‌

When choosing the thickness of the copper layer, factors such as the purpose of the circuit board and the magnitude of the signal voltage and current need to be considered. ‌For example, for circuit boards that require excessive current, a copper thickness of 70μm or 105μm may be used. ‌For thin laminates that require ultra-high density patterns, a copper thickness of 12μm may be used. ‌Therefore, the specific thickness of the PCB after copper plating is determined according to design requirements and specific applications.‌

How thick is 2 oz copper for PCB?

If 1 ounce (28.35 grams) of copper were flattened to evenly cover a surface area of 1 square foot (0.093 square meters), the resulting thickness would be 1.37mils (0.0348mm). A conversion chart for different units of measurement can be found below.

What is the difference between different copper thicknesses in PCB?

‌Copper is an excellent conductive material, and the thickness of the copper layer directly affects the conductive effect of the circuit board. ‌Thicker copper layers can provide lower resistance, reduce signal transmission losses, and are particularly suitable for high-frequency and high-speed digital circuits. ‌

During the operation of electronic equipment, good heat dissipation is a key factor in ensuring the performance and life of components. ‌Thicker copper layers can conduct and dissipate heat more effectively, preventing components from overheating. ‌

In high-power electronic devices, thicker copper layers can carry larger currents, avoiding burnout or performance degradation caused by excessive current.

Below is the conductivity corresponding to different copper thicknesses.

How thick is high current PCB copper?

In PCB design, copper thickness (also called copper thickness) is an important parameter, which directly affects the performance indicators of the circuit board such as current carrying capacity, heat dissipation and reliability. For PCBs that need to withstand high currents, such as high-power LED light strips, power circuit boards, high-power motor control boards or high-power inverter control boards, thicker copper layers are usually used to increase current carrying capacity.

Different uses have different copper foil thicknesses. Common 0.5oz, 1oz, and 2oz are mostly used in consumer and communication products. Thick copper products above 3oz are mostly used for high currents, such as high-voltage products and power boards.

The thickness of copper foil (track width) will affect the current size. Although there is a formula that can directly calculate the maximum current carrying capacity of copper foil, it is not so simple when actually designing the circuit. Therefore, the safety factor should be fully considered during the design.

How thick is the copper in a flex PCB?

The thickness of copper foil in flexible PCB is generally 18μm, 35μm, 55μm and 70μm. These thickness specifications are suitable for different types of circuit board requirements, among which 35μm is the most commonly used copper foil thickness.

For flexible PCB, the choice of copper foil thickness depends on the specific purpose of the circuit board and the size of the signal voltage and current. For example, for PCBs that require excessive current, some parts will use 70μm copper thickness, while for signal transmission, 1oz (35μm) thickness is usually sufficient. In addition, for substrates of different thicknesses, the thickness of copper foil is also different. For example, the thickness of the composite copper foil on a 1mm thick substrate is about 18μm, and on a substrate thicker than 5mm, the thickness of the composite copper foil is about 55μm.

Conclusion:

PCBs for different usage scenarios correspond to different thicknesses of copper, and its thickness directly affects the conductive effect of the circuit board. If the copper layer is too thin, the conductivity may decrease, resulting in signal transmission attenuation or current instability. If the copper layer is too thick, although the conductivity will be very good, it will increase the cost and weight of the circuit board and easily lead to serious glue flow. In PCB manufacturing, it is necessary to select the appropriate copper thickness according to the design requirements and actual applications of the circuit board to achieve the best conductive effect.

BEST Technology is a professional PCB circuit board manufacturer with a large area of site and equipped with useful and experienced production personnel. Corresponding to different thicknesses of copper, we have rich production and processing experience. We can meet the requirements of any circuit board copper layer thickness.‌

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