PCB manufacturing PCB manufacturing
Home > Blog

thick film ceramic pcb

Cost-Effective Al2O3 Ceramic PCB Manufacturer: How to Balance Price, Performance, and Reliability
Friday, July 10th, 2026

What Is an Al2O3 Ceramic PCB?

An Al2O3 ceramic PCB, also called an alumina ceramic PCB, is a printed circuit board or ceramic circuit substrate made from aluminum oxide ceramic. It is used when a design needs better thermal stability, electrical insulation, dimensional stability, and high-temperature resistance than many standard organic PCB materials can provide.

Cost-effective Al2O3 ceramic PCB manufacturer hero image with alumina ceramic PCB substrates

For many electronic products, FR4 PCB is still the most economical PCB material. But when heat, voltage, frequency, size, or reliability requirements become more demanding, alumina ceramic PCB can become a practical and cost-effective option.

The key word is cost-effective, not simply cheap. A low-cost board that fails during assembly or field operation is not economical. A cost-effective Al2O3 ceramic PCB manufacturer should help buyers choose the right ceramic grade, conductor process, copper thickness, tolerance, surface finish, and inspection level for the real application.

Why Choose Al2O3 Instead of Standard FR4?

Al2O3 ceramic PCB is selected when the board material becomes part of the performance requirement. In high-power, high-temperature, high-voltage, compact, or reliability-sensitive designs, the substrate does more than hold copper traces. It affects heat transfer, insulation, mechanical stability, and long-term circuit behavior.

Common reasons to choose Al2O3 ceramic PCB include:

  • Better thermal conductivity than standard FR4
  • Strong electrical insulation
  • Good dimensional stability
  • High operating temperature capability
  • Good mechanical strength
  • Compatibility with thick film, thin film, and DCB ceramic PCB processes
  • Reliable performance in harsh or compact environments

Alumina ceramic PCB is commonly used in LED modules, power electronics, sensors, automotive electronics, industrial control, RF modules, high-voltage circuits, medical electronics, aerospace electronics, and high-reliability assemblies.

Why Al2O3 Is Often More Cost-Effective Than AlN?

Aluminum nitride (AlN) ceramic PCB has higher thermal conductivity than alumina, but it is also usually more expensive. For some power modules and compact thermal designs, AlN is the right choice. However, many products do not need that extra thermal performance.

Al2O3 often gives a better cost-performance balance when the design needs ceramic reliability but does not require the highest possible thermal conductivity.

Material Main Advantage Cost Position Best Fit
Al2O3 ceramic PCB Stable, reliable, widely used, good insulation, practical thermal performance More economical ceramic option LED, sensors, power electronics, RF modules, industrial electronics
AlN ceramic PCB Much higher thermal conductivity Higher cost High-power modules, compact heat-critical designs, advanced thermal products
FR4 PCB Lowest cost for many standard circuits Most economical General control boards, consumer electronics, low-thermal-stress products
Metal core PCB Good heat spreading with metal base Often economical for LED and power boards LED lighting, power conversion, thermal management products

If a design can meet thermal and electrical requirements with Al2O3, choosing AlN may increase cost without improving the product in a meaningful way. A good ceramic PCB manufacturer should help customers avoid over-specification.

What Makes an Al2O3 Ceramic PCB Cost-Effective?

A cost-effective ceramic PCB is not defined by substrate price alone. The total cost includes material, process complexity, yield, testing, lead time, assembly compatibility, and long-term reliability.

Alumina ceramic PCB panels being reviewed during production preparation

Important cost drivers include:

  • Ceramic substrate size and thickness
  • Alumina purity, such as 96% or 99% Al2O3
  • Circuit size and panel utilization
  • Conductor material and thickness
  • Thick film, thin film, or DCB process selection
  • Minimum line width and spacing
  • Hole, via, and edge requirements
  • Copper thickness or metallization thickness
  • Surface finish and solderability requirement
  • Tolerance level
  • Quantity and delivery schedule
  • Electrical test, visual inspection, and reliability test requirements
  • Whether PCB assembly or wire bonding is needed

The most cost-effective design is usually the one that matches the process capability without adding unnecessary tolerances. For example, asking for extremely fine lines, tight dimensional control, or special metallization may be necessary in some circuits, but it should be justified by the application.

Main Manufacturing Options for Al2O3 Ceramic PCB

Al2O3 ceramic PCB can be manufactured through different processes. The right process depends on circuit density, current load, thermal demand, conductor material, and budget.

Thick Film Al2O3 Ceramic PCB

Thick film ceramic PCB uses screen printing to apply conductive paste onto the ceramic substrate, followed by high-temperature firing. Silver palladium, gold palladium, or other conductor systems may be used depending on the design.

Thick film is often cost-effective for sensors, hybrid circuits, high-temperature electronics, and moderate-density ceramic circuits. It is useful when the design needs ceramic stability but does not require extremely fine thin-film precision.

Thin Film Al2O3 Ceramic PCB

Thin film ceramic PCB uses deposited metal layers and photolithography-like processes to create finer and more precise circuit features. It can support tighter line width, spacing, and high-frequency performance compared with many thick film structures.

Thin film Al2O3 ceramic PCB is usually selected when precision is more important than lowest cost. It is common in RF, microwave, sensor, and high-accuracy electronic modules.

DCB Al2O3 Ceramic PCB

DCB ceramic PCB means direct copper bonded ceramic PCB. In this process, copper is bonded directly to the ceramic substrate under high temperature. DCB ceramic PCB is often used in power electronics because it provides good current capacity, thermal transfer, and reliability.

DCB Al2O3 ceramic PCB can be cost-effective for power modules when the design needs stronger copper and better heat transfer than thick film can provide.

Al2O3 Ceramic PCB Applications

Al2O3 ceramic PCB is used across many industries because it combines ceramic stability with practical manufacturing cost.

Common applications include:

  • LED lighting modules
  • Power supply modules
  • IGBT and MOSFET power circuits
  • Automotive electronics
  • Industrial control boards
  • High-temperature sensors
  • Medical electronic modules
  • RF and microwave circuits
  • Aerospace electronics
  • High-voltage insulation circuits
  • Laser diode modules
  • Battery management and energy equipment

For each application, the board structure should be reviewed against real working conditions. A sensor circuit, LED module, and power module may all use Al2O3, but the conductor process and inspection requirements can be very different.

How to Reduce Cost Without Reducing Reliability?

Buyers can reduce ceramic PCB cost by making the design easier and more stable to manufacture. This does not mean lowering quality. It means removing unnecessary complexity.

Practical cost-saving steps include:

  • Choose Al2O3 instead of AlN when thermal requirements allow it
  • Use standard substrate thickness when possible
  • Avoid overly tight tolerances unless the design needs them
  • Keep board outline simple when possible
  • Improve panel utilization
  • Confirm realistic line width and spacing
  • Avoid unnecessary surface finish requirements
  • Clarify whether thick film, thin film, or DCB is actually needed
  • Separate prototype goals from mass production requirements
  • Provide complete files at the quotation stage
  • Discuss assembly requirements before finalizing the PCB design

The supplier should review manufacturability before production. A small design change may improve yield and reduce cost without changing circuit performance.

How to Evaluate an Al2O3 Ceramic PCB Manufacturer?

When choosing a cost-effective Al2O3 ceramic PCB manufacturer, buyers should evaluate both price and engineering capability.

Useful supplier checks include:

  • Experience with alumina ceramic PCB projects
  • Ability to support thick film, thin film, or DCB ceramic PCB
  • Clear material options, such as 96% or 99% alumina
  • Understanding of thermal, insulation, and tolerance requirements
  • DFM review before production
  • Stable quality control for metallization, adhesion, surface finish, and dimensional accuracy
  • Electrical testing and visual inspection capability
  • Prototype and mass production support
  • PCB assembly or ceramic PCBA support if needed
  • Clear communication about lead time, process limits, and cost trade-offs

The best supplier is not always the one with the lowest first quote. It is the one that can produce the board correctly, explain cost drivers, prevent avoidable defects, and support the project from prototype to production.

What to Send for an Al2O3 Ceramic PCB Quote?

A complete RFQ helps the manufacturer quote faster and more accurately. It also reduces the risk of wrong material, wrong process, or wrong tolerance assumptions.

Al2O3 ceramic PCB quality inspection with microscope and caliper

For a ceramic PCB quote, provide:

  • Gerber files
  • Drawing or mechanical outline
  • Ceramic material, such as Al2O3
  • Alumina purity if specified
  • Substrate thickness
  • Board dimensions
  • Copper or conductor thickness
  • Thick film, thin film, or DCB process requirement if known
  • Minimum line width and spacing
  • Hole, slot, or edge metallization requirements
  • Surface finish
  • Working voltage and current
  • Thermal requirement or power dissipation
  • Operating temperature range
  • Quantity for prototype and mass production
  • Inspection or reliability test requirement
  • Assembly requirement if PCBA is needed

If you are not sure which process is best, explain the application and performance target. A qualified ceramic PCB manufacturer can help compare thick film, thin film, DCB, Al2O3, AlN, FR4, and metal core PCB options.

When Al2O3 Ceramic PCB May Not Be the Best Choice?

Al2O3 is versatile, but it is not always the right answer.

FR4 may be better when the circuit is low-power, low-temperature, and cost-sensitive. Metal core PCB may be better for some LED and power designs that need heat spreading but do not need ceramic insulation or high-temperature stability. AlN may be better when thermal conductivity is the main limiting factor and the product can justify higher cost.

The goal is not to force every project into alumina ceramic PCB. The goal is to choose the most reliable and economical structure for the real design.

How EBest Circuit Supports Cost-Effective Ceramic PCB Projects?

EBest Circuit (Best Technology) provides custom PCB and PCBA solutions including ceramic PCB, metal core PCB, FR4 PCB, rigid-flex PCB, high frequency PCB, heavy copper PCB, HDI PCB, component sourcing, PCB assembly, and full turnkey service.

For ceramic PCB, EBest Circuit supports alumina ceramic PCB and other ceramic substrate solutions for customers that need thermal stability, insulation, and reliability. The team can review ceramic material, process choice, manufacturability, PCB assembly requirements, and quotation details before production.

This is useful for buyers who want one engineering conversation covering bare ceramic PCB, material selection, process selection, assembly risk, lead time, and cost control.

FAQ

What is an Al2O3 ceramic PCB?

An Al2O3 ceramic PCB is a printed circuit board or circuit substrate made from aluminum oxide ceramic. It is used when the design needs strong insulation, thermal stability, dimensional stability, and reliability in demanding environments.

Is Al2O3 ceramic PCB cost-effective?

Yes, Al2O3 ceramic PCB can be cost-effective when the design needs ceramic performance but does not require the higher thermal conductivity and higher cost of AlN ceramic PCB.

What is the difference between Al2O3 and AlN ceramic PCB?

Al2O3 is usually more economical and widely used. AlN has much higher thermal conductivity but is more expensive. The right choice depends on thermal demand, budget, application, and reliability requirements.

Which is cheaper, Al2O3 ceramic PCB or FR4 PCB?

FR4 is usually cheaper for standard circuits. Al2O3 ceramic PCB is used when FR4 cannot meet thermal, insulation, temperature, or reliability requirements.

What affects the price of Al2O3 ceramic PCB?

Price is affected by material grade, substrate thickness, board size, process type, conductor thickness, line width, spacing, holes, tolerance, quantity, testing, lead time, and assembly requirements.

What is the best process for alumina ceramic PCB?

There is no single best process for every design. Thick film is often practical and cost-effective, thin film is better for fine precision and RF needs, and DCB is suitable for higher-current power applications.

Can Al2O3 ceramic PCB be used for high-temperature electronics?

Yes. Alumina ceramic PCB is commonly used in high-temperature and harsh-environment electronics because of its ceramic stability, insulation properties, and thermal performance.

Can a ceramic PCB manufacturer also provide assembly?

Some manufacturers can provide ceramic PCB assembly or turnkey PCBA support. This is useful when the project needs component sourcing, SMT, wire bonding, testing, or production integration.

Conclusion

A cost-effective Al2O3 ceramic PCB manufacturer should help you balance price, process capability, thermal performance, insulation, reliability, and production yield. Alumina ceramic PCB is often the practical ceramic choice when FR4 is not enough and AlN is more than the application requires.

If you need an Al2O3 ceramic PCB, thick film ceramic PCB, thin film ceramic PCB, DCB ceramic PCB, or ceramic PCBA solution, EBest Circuit (Best Technology) can review your files and help choose a reliable manufacturing path. Contact sales@bestpcbs.com for a quotation and engineering review.

You may also like

Thick Film Ceramic PCB
Friday, March 27th, 2026

What Is a Thick Film Ceramic PCB?

A thick film ceramic PCB is made by screen-printing functional pastes onto a ceramic base and then sintering the printed layers at high temperature. After firing, the material forms durable conductive paths or functional structures on the ceramic surface. In simple terms, a thick film ceramic circuit board combines the stability of a ceramic base with printed electrical features that can support conductors, resistors, and other functional layers.

The term “thick film” refers to the thickness of the printed conductive or resistive layer. In most cases, the conductor thickness starts at around 10 ÎŒm and often falls in the 10 to 13 ÎŒm range, with some designs reaching 20 ÎŒm. This is thicker than the metallization used in thin-film ceramic technology, but still thinner than the copper structure commonly found in DCB ceramic boards or standard FR4 boards.

A thick film ceramic substrate can do more than carry conductor traces. It can also support:

  • Conductors
  • Printed resistors
  • Dielectric layers
  • Cross-over conductors
  • Semiconductor-related functional structures

Because of this flexibility, thick film ceramic PCB is widely used in hybrid modules, sensor circuits, and compact control electronics.

What Is a Thick Film Ceramic PCB?

Thick Film vs Thin Film Ceramic PCB

The comparison between thick film vs thin film ceramic PCB is one of the most common questions in ceramic electronics. Although both technologies use ceramic materials as the base, their process routes, cost structures, and application focus are quite different.

ItemThick Film Ceramic PCBThin Film Ceramic PCB
Main ProcessScreen printing + firingVacuum deposition or sputtering
Typical Conductor Thickness10–20 ÎŒmMuch thinner
Cost PositionMore economical for many industrial usesUsually higher
Printed Resistor IntegrationEasyLess common
Fine-Line CapabilityModerateHigher
Typical UseHybrid circuits, sensors, power-related modulesPrecision circuits and ultra-fine patterns

In practical use, thick film ceramic PCB is often selected when the design needs better functional integration, a stable ceramic base, and a more workable cost. Thin film ceramic PCB is more suitable when very fine line resolution or higher pattern precision is the priority.

What Materials Are Used in an Alumina Ceramic Thick Film PCB?

An alumina ceramic thick film PCB is the most common version of this technology. The substrate is usually made from 96% or 98% alumina, because alumina offers a strong balance of electrical insulation, thermal resistance, and manufacturing practicality. For applications that require higher thermal conductivity, AlN is also a common choice. In some specialized cases, beryllium oxide may be used as well.

Common Substrate Materials

MaterialTypical FeatureNotes
96% AluminaStandard industrial choiceGood balance of cost, insulation, and manufacturability
98% AluminaHigher purityBetter stability for more demanding designs
AlNHigh thermal conductivityOften used in high-power modules and applications with strict heat dissipation needs
BeOExcellent thermal conductivityUsed in specialized applications with stricter handling and safety requirements

Common Substrate Thickness Options

  • 0.25 mm
  • 0.38 mm
  • 0.50 mm
  • 0.635 mm
  • 0.76 mm
  • 1.0 mm
  • 1.6 mm or 2.0 mm as custom options

Common Conductor Materials

Conductor MaterialTypical Use
Silver-PalladiumCommon and more cost-effective
Gold-PalladiumPremium applications and bonding-friendly designs
Mo/Mn + NiCertain special environments, including ozone-related use

The choice of thick film ceramic substrate material affects both cost and performance. For example, gold-palladium is far more expensive than silver-palladium, so it is generally used only when the application truly needs its bonding or performance advantages.

What Are the Main Technical Parameters in Thick Film PCB Manufacturing?

When evaluating thick film PCB manufacturing capability, engineers usually focus on conductor thickness, minimum line width, resistor integration, and possible layer count. These factors directly affect whether the board can match the intended circuit design.

ParameterTypical Capability
Substrate Material96% / 98% Alumina, AlN, BeO
Conductor Thickness≄10 ÎŒm, up to 20 ÎŒm
Standard Trace/Space0.30 / 0.30 mm
Finer Production Capability0.20 / 0.20 mm with higher cost
Prototype Fine Line0.15 / 0.20 mm in limited cases
Final Trace Layout Tolerance±10%
Typical Layers1L and 2L
Maximum LayersUp to 10L
PTHAvailable for selected multilayer or double-sided designs
Solder MaskOptional
Solder Mask ColorSemi-transparent
Solder Mask Heat ResistanceAbove 500°C

These parameters show why thick film PCB manufacturing is well suited to many industrial, automotive, lighting, and sensor-related designs. It is not aimed at ultra-fine microelectronic geometry, but it offers very good process stability for a broad range of practical applications.

Can a Thick Film Printed Resistor Ceramic Board Integrate Different Resistor Values?

Yes. One of the strongest advantages of a thick film printed resistor ceramic board is that resistor elements can be integrated directly onto the ceramic surface. This means one substrate can carry conductors and resistors together, reducing the need for extra discrete components in some designs.

A thick film printed resistor ceramic board can include:

  • A single resistor value across the entire design
  • Different resistor values in different circuit areas
  • Combined conductor and resistor functions on one substrate

That is why thick film ceramic PCB is often used in resistor cards, hybrid circuits, analog control modules, and sensor products. At the same time, resistor complexity affects cost. In general, the more resistor values placed on one board, the more difficult the process becomes, and the higher the price is likely to be.

Can a Thick Film Printed Resistor Ceramic Board Integrate Different Resistor Values?

Can Thick Film Ceramic PCB Support Wire Bonding?

Yes, thick film ceramic PCB can support wire bonding, but the requirement should be defined early. Both gold-palladium and selected silver-palladium conductor systems can support gold wire bonding, although not every standard conductor paste is equally suitable for that purpose.

If wire bonding is required, the supplier should know this during quotation and engineering review. That early confirmation helps with:

  • Correct conductor system selection
  • Better process compatibility
  • Improved bonding reliability in production

For bonding-related projects, early material matching is always more effective than changing the design later.

What Board Structures Are Available for a Thick Film Hybrid Circuit Board?

A thick film hybrid circuit board is most commonly produced as a 1-layer or 2-layer design, but multilayer structures are also possible for more complex projects. Because a ceramic thick film circuit can integrate conductors and resistor functions on the same substrate, it is often chosen for compact modules that need both electrical function and dimensional stability.

Common Build Styles

  • Single-sided thick film hybrid circuit board
  • Double-sided thick film ceramic PCB
  • Multilayer ceramic thick film circuit structures
  • PTH-supported designs for selected projects
  • Optional solder mask upon request

Shape and Delivery Notes

  • Rectangular boards are the most common format
  • Boards can be shipped as single pieces
  • Boards can also be delivered in panel form

For standard production, rectangular shapes are usually the easiest to process, inspect, and ship. In most cases, they also provide the best balance between manufacturing efficiency and handling convenience.

What Are the Most Common Thick Film Ceramic PCB Applications?

Thick film ceramic PCB applications are broad, especially in products that need heat resistance, electrical stability, and compact function integration. Because the ceramic base can remain stable under demanding conditions, this technology is widely used across industrial and automotive sectors.

Typical Applications

  • High-power LED
  • Street light
  • High-brightness lighting
  • Automotive light systems
  • Hybrid integrated circuits for automotive
  • Fuel sender resistor card
  • Injection systems
  • Anti-lock braking systems
  • High-power semiconductor modules
  • Electric power transmitter modules
  • Semiconductor process equipment
  • Solar cell applications
  • Sensors
  • Telecommunication devices
  • Chip and wafer-related electronic applications

What Affects the Cost of Thick Film Ceramic PCB?

The cost of thick film ceramic PCB depends on material selection, conductor system, resistor design, and processing difficulty. Even when two projects look similar on the surface, their price can change noticeably if the conductor material, resistor count, or line definition is different.

Main Cost Factors

  • Gold-palladium is much more expensive than silver-palladium
  • More resistor values on the same board increase cost
  • Finer trace and spacing increase process difficulty
  • More layers add complexity
  • Special substrate thickness adds cost
  • Bonding-compatible conductor systems may require special materials
  • Small prototype runs with fine features often cost more per piece

For many engineers, thick film ceramic PCB offers a useful performance upgrade over standard boards without reaching the cost level of DCB in many practical use cases.

What Should Buyers Confirm Before Ordering?

A clear design review before production helps avoid rework, shorten communication time, and improve quotation accuracy. This is especially important for ceramic projects, where material and conductor choices directly affect the process route.

Buyer Checklist

  • Substrate material
  • Ceramic purity
  • Substrate thickness
  • Conductor material
  • Conductor thickness requirement
  • Minimum trace and spacing
  • Number of resistor values
  • Whether wire bonding is required
  • Whether PTH is needed
  • Layer count
  • Solder mask requirement
  • Single-piece or panel delivery

If you are interested in thick film ceramic PCB, please contact us today for more information about Thick Film Ceramic circuit board.

You may also like

What Are the Different Types of Ceramic PCBs?
Saturday, July 6th, 2024

Ceramic PCBs are a special breed of printed circuit boards known for their exceptional thermal resistance and durability. These PCBs are used in industries where high performance is critical, such as aerospace, automotive, medical devices, and power electronics. Nowadays, the most common types of ceramic PCB are thick film, DCB, DPC, AMB, HTCC, LTCC and thin film. In this article, we will introduce each of them in details.

What are the different types of ceramic pcbs?

Thick Film Ceramic PCB

Thick film technology is a process by using screen printing conductor paste and directly deposit slurry (conductor) on the ceramic substrate. Then sintering it under high temperature to form conductive circuit traces and electrodes, which is suitable for most ceramic substrates.

After the material is sintered at high temperature, a strong adhesion film will be formed on the ceramic circuit board, repeat this step for many times, a multi-layer circuit is generated.

You can print resistor or capacitor on the surface to get a interconnected structure. At EBest Circuit (Best Technology), we can make all the resistors with the same value, or different value for different resistor on the same board.

What are the different types of ceramic pcbs?

Thick film ceramic PCB has advantages on the simple manufacturing process, but it has some drawbacks that can’t be ignored:

  • Limited by the conductive paste and screen size
  • Line width less than 100um is difficult to achieved
  • Three-dimensional patterns are not available
  • Not suitable for fine-trace project

DBC / DCB Ceramic PCB

Direct Bonded Copper (DBC) or Direct Copper Bonded (DCB) ceramic PCBs are known for their excellent thermal conductivity. They are made by bonding a layer of copper directly onto a ceramic substrate, typically aluminum oxide or aluminum nitride. Due to the DBC technology is directly bond copper on the ceramic substrate, it can achieve thicker copper thickness to 300um. So, it is very suitable for high power applications.

The basic chemistry principle is to introduce an appropriate amount of oxygen between copper and ceramics before or during the application process. Copper and oxygen will form Cu-O eutectic liquid under 1065℃~1083℃. This is an important element in the manufacturing. DBC ceramic circuit board uses this eutectic solution to chemically react with the ceramic substrate to form CuAlO2 or CuAl2O4, achieving the combination between substrate and copper foil.

What are the different types of ceramic pcbs?

However, it is easy to generate micro-porosity between Al2O3 and Copper during the copper bonded process, and it doesn’t have a good solution by far. That is why the yield of DBC ceramic PCB is not good than DPC.

DPC (Direct Plated Copper Ceramic PCB)

DPC ceramic PCB utilizes direct copper plating technology, deposit copper foil on the alumina oxide (Al2O3) substrate. It is the most commonly used ceramic PCB in recent years. The circuit generated process is: pre-treatment – sputtering – exposure – develop – etch – strip – electroplating.

AMB (Active Metal Brazed Ceramic PCB)

AMB ceramic copper clad plate adopts the active brazing process, and the copper layer bonding force is higher than that of DPC, which is around 18n/mm – 21n/mm. AMB ceramic copper clad plate usually has a high binding force, usually makes thicker copper, between 100um and 800um. The AMB ceramic PCB generally rarely design traces or holes, even if there is a trace is very simple, the spacing is relatively wide.

HTCC (High Temperature Co-fired Ceramic PCB)

HTCC is a relatively early development technology, but due to the high sintering temperature (1300~1600℃), the choice of electrode materials is limited. Meanwhile, its cost is more expensive, these promotes the development of HTCC is relatively slow.

What are the different types of ceramic pcbs?

LTCC (Low Temperature Co-fired Ceramic PCB)

Although LTCC reduces the co-firing temperature to about 850 ° C, the disadvantage is that the dimensional accuracy and product strength are not easy to control.

Thin Film Ceramic Circuit Board

The thin film ceramic PCB is to deposit a metal layer directly on the surface of substrate by sputtering process. Through lithography, development, etching and other processes, the metal layer can also be graphed into a circuit pattern. Due to the low deposition speed of sputtering coating (generally less than 1ÎŒm/h), thin film substrate surface metal layer thickness is small and can prepare high pattern accuracy (line width/line space less than 10ÎŒm).

What are the different types of ceramic pcbs?

Common Ceramic Substrates

What are the different types of ceramic pcbs?

EBest Circuit (Best Technology) is a leading ceramic PCB manufacturer in Asia, our core members has over 20 years manufacturing experience in ceramic PCB fabricating. “High mixed, low volume, high quality, fast delivery” is our advantages and we always try our best to do that, make ourselves better and better. If you are interested in it, feel free to contact us, we are always online.

You may also like