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Currently there're three basic substrate to make ceramic PCB, and different cermaic circuit board making technology will use different substrate.

  • Aluminum Oxide (Al2O3)
  • Aluminum Nitride (AIN)
  • BeO

Becuase the toxicity of BeO and not environmental during manufacturing, now most popular material is Al2O3 (cheaper) and AIN (expensive). Here are more details for them.

A) Technical Specification of 96% Alumina (Al2O3) Ceramic Substrate
Material Property
Unit
Value
Remarks
Color
\
White
Medium grain size
um
3-5
Surface roughness (Ra)
um
0.6 (Max)
Density
kg/m3
3780
Rate of water absorption
%
0
Bending strength

4 point method (40x4x3mm3)

Mpa
400
Dual ring method (0.63mm substrate thickness)
Mpa
500
Modulus of Yang
Gpa
340
吉帕斯卡
Thermal conductivity (20-100℃)
W/m-K
24
Specific heat
J/kg.K
800
Coefficient of Linear expansion

200-300C

1*E-6 / K

6.8
20-600C
7.3
20-1000℃
8.0
 
Dielectric constant

1 MHZ

9.8+/-10%
1 GHZ
10.0+/-10%
Dielectric loss factor (1 MHz)
1*E-3
0.3
Breakdown Voltage

2.0mm substrate

KV/mm

34
1.0mm substrate
17
0.635mm substrate
11
 
Volume resistivity

20℃

Ohm * cm

1*E13
200℃
1*E12
400℃
1*E11
 
600℃
1*E8
 
B) Technical Specification of Aluminum Nitride (AIN) Ceramic Substrate
Material Property
Unit
Value
Remarks
Color
\
White
Medium grain size
um
3-5
Surface roughness (Ra)
um
0.3~0.5
Density
kg/m3
>3,300
Rate of water absorption
%
0
Bending strength

4 point method (40x4x3mm3)

Mpa
400
Dual ring method (0.63mm substrate thickness)
Mpa
500
Thermal conductivity (20℃)
W/m-K
>=170
Specific heat
J/kg.K
800
Coefficient of Linear expansion

1*E-6 / K

4.4
Dielectric constant
9.0+/-10%
Dielectric loss factor (1 MHz)
1*E-3
0.3
Breakdown Voltage

2.0mm substrate

KV/mm

34
1.0mm substrate
17
0.635mm substrate
11
 
Volume resistivity

20℃

Ohm * cm

1*E14
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