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High Speed PCB Design Guidelines, PCB Camera Design Case
Tuesday, June 25th, 2024

When designing high-speed PCBs, several critical factors must be considered to ensure optimal performance. These include signal integrity, impedance control, and minimizing electromagnetic interference (EMI). Below is an ultra high speed camera PCB solution made by Best Technology:

An ultra-high-speed camera rigid-flex circuit board

[1]: XCKU060 chip

[2]: 20A maximum current

[3]: Four DDR4 channels

[4]: 20 layers PCB

High Speed PCB Design Guidelines, PCB Camera Design Case

Camera PCB design considerations:

1. When the Camera adopts a connector: when the MIPI differential signal passes through the connector, the adjacent differential signal pairs must be isolated using GND pins; If it is not convenient to punch holes, the spacing between the difference pairs is at least 15mil.

2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.

3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.

4. The Camera layout needs to be far away from high-power radiation devices, such as GSM antennas.

5. CIF/MIPI and other signals, if there is a board to board connection through the connector, it is recommended that all signals be connected with a certain resistance value (between 2.2ohm and 10ohm, depending on the SI test), and reserve TVS devices.

Best Technology offers one-stop solutions for our values customers. And we provide free technical support for our customers. If you have similiar requirements, welcome to contact us at any time!

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High Speed PCB Design, Industrial PCB Case Sharing
Tuesday, June 25th, 2024

A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. Best Technology is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.

32 x 400GE industrial switch

[1]: Marvell-400G chip

[2]: 200A maximum current

[3]: Single pair differential line 56G optical network

[4]: 24 layers high power PCB

What’s the Best Material for High-Speed PCB Design?

Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

  • FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.
  • Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.
  • Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.

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We Will Be Exhibiting at New-Tech Israel 2024
Friday, April 12th, 2024

Best Technology, a China-based PCB & PCBA manufacturer will be exhibiting at New-Tech 2024 in EXPO Tel-Aviv, Israel at booth No. 66 from May 28, 2024 to May 29, 2024(Western Time). Actually, we have participated in such exhibition for several years. At our exhibition booth, attendees will be able to learn more about our company for PCB manufacturing and PCB assembly technology. Here are some pictures for your reference.

pcb exhibition
AEMS show
pcb exhibition
pcb exhibition
ceramic exhibition
Ceramic exhibition
pcb exhibition
pcb exhibition
pcb exhibition
pcb exhibition

For interested professionals, Best Technology had on hand experts to offer detailed insights and experience on PCB assembly, covering PCB prototype and low/high-volume production. For more information on PCB assembly and fabrication, welcome to visit our booth.

You will see 10mm to 1,500 mm flexible circuit board, from 2layer rigid-flex circuit to 50 layers, 1/2 OZ copper to 3 OZ, 0.15mm extra thin FR4 PCB to 30 OZ heavy copper, various ceramic PCBs (thick film, thin film, DPC, DBC, HTCC, AMB, LTCC). Our new products also will be shown in this exhibition, like copper/aluminum busbar PCB, transparent/PI/rubber silicone flexible heating film, semi-flexible PCB, semi-flexible aluminum PCB.

best products

In Best Technology, you will enjoy one-stop service from components sourcing, board fabrication (FPC, PCB, MCPCB, Ceramic PCB) and final assembly with programming and testing and metal dome that is used in conjunction with a printed circuit board, flex circuit, or membrane switch, become normally-open tactile switches. we have four types of metal domes: four legs with size from 5mm-20mm; triangle with size 4mm-12mm; round dome with size 4-16mm, oblong dome with size 3.7mm-58.1mm, and we also make dome with adhesive, named dome array, custom membrane switches also available in Best Tech.

You are warmly welcome to see how we can manage the components wastage and efficiency to help save your time, money and energy.

About New-Tech:

The New-Tech Exhibition is the largest and major exhibition of the Hi–Tech & Electronics in Israel. More than 150 companies, who lead these fields in Israel and around the world, will take part and exhibit in this trade show.

This exhibition shows a comprehensive array of electronic components, production processes, subcontracting services, clean room equipment, electro-optic devices, test equipment, printed circuit boards, industrial materials, computerization solutions, robotics, power systems, RF/microwave technologies, and more. Attendees can explore cutting-edge innovations in development, design, engineering, and procurement across various industries.

It is important to note:

1. Participation in the exhibition is conditional on prior registration, even for invited customers.

2. After registration and before the conference, a code will be sent to the mobile to confirm participation in the conference.

For more details and registration: https://www.new-techevents.com/exhibition-registration-form/

Welcome to visit us at Booth #66 from May 28, 2024 to May 29, 2024 (Western Time).

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What Are the Benefits of DFM in PCB Manufacturing?
Monday, March 18th, 2024

In the PCB manufacturing, we always heard a word – DFM, do you know what is DFM? And how does it affect the manufacturing? Herein, Best Team would like to explain the DFM and its benefits for you.

What is DFM?

DFM stands for Design for Manufacturing. It is an engineering approach focused on designing products in a way that optimizes their manufacturability, testability, and reliability right from the beginning stages of product development.

The goal of DFM is to simplify the manufacturing process, reduce production costs, and improve the overall quality of the final product. This involves considering manufacturing constraints and capabilities early in the design phase to minimize complexities, facilitate assembly, and enhance efficiency in production. By integrating DFM principles, manufacturers and engineers/designers can achieve cost savings, faster time to market, and higher-quality products.

What We Should Considered About Design for Manufacturing?

Design for Manufacturing (DFM) is guided by several key principles aimed at optimizing the design of products for efficient and cost-effective manufacturing processes. Here are five fundamental principles and considerations must know of DFM:

  1. Design

We all know the more complex the design, the greater the risk during the manufacturing. Therefore, keep the design as simple as possible while meeting the functional requirements of the product. Simplifying the design including reduce the number of parts, assembly steps, and manufacturing processes involved, which in turn lowers production costs and minimizes the risk of errors or defects.

  • Standardization

In the PCB industry, there is an IPC standard to standardized all the elements design in PCB, this involved the line width, line spacing, solder mask thickness, text height and so forth. By using standardized parts and processes, manufacturers can take advantage of economies of scale, reduce lead times, smooth the manufacturing process and simplify supply chain management. Standardization also ensures the interchangeability, repair, and maintenance of products.

  • Design for Assembly (DFA)

If you are trying to mount some components to keep and enhance the performance of product, then DFA is must to take into account. Arrange components on the PCB layout in a way can minimize signal interference, reduces trace lengths, and simplifies assembly. Placing components strategically can improve signal integrity, reduce electromagnetic interference (EMI), and facilitate automated assembly processes.

  • Material

Select materials and manufacturing processes that are readily available, cost-effective, and well-suited to the intended application. Consider factors such as material properties, availability, recyclability, and environmental impact when making material choices. Designing for materials involves optimizing designs to minimize material waste and maximize efficiency in material usage.

  • Testability and Debugging

Design PCBs with features that facilitate testing, troubleshooting, and debugging during manufacturing and assembly. Include test points, debug headers, and built-in self-test (BIST) circuitry to simplify testing and diagnostics. Design PCBs with clear labeling, documentation, and accessibility to aid in maintenance and repair.

What Are the Benefits of DFM Analyzing?

The mainly benefits of using DFM is save cost. You know, when creating a new project, we need put much money and time in designing and prototyping. DFM helps identify potential manufacturing issues early in the design phase, allowing for cost-effective modifications before production starts. By optimizing designs for manufacturability, companies can avoid expensive rework and reduce overall production costs. Statistically, we can save around 170 thousand dollars one year by adopting DFM analyzing (human cost, trail-production cost and repair cost). In addition, DFM offers numerous benefits including:

  • Reduce potential quality defects
  • Facilitate production process improvement
  • Decrease trial production cycles
  • Quick time to market
  • Enhanced product quality and stability
  • Mitigate risks associated with personnel changes

How to Find a Manufacturer with DFM Service?

Finding a reliable DFM manufacturer is essential for ensuring the success of your product development. Best Technology engaging in PCB manufacturing for more than 17 years, and we have many experts that can help to solve and provide PCB solution for you. Meanwhile, we have professional DFM system that can help to quickly diagnose the design exception such as components missing, trace layout, open/short circuit. With our expertise and advanced tools, we ensure that your PCB designs are optimized for efficient manufacturing, resulting in high-quality products that meet your specifications and exceed expectations. Trust Best Technology to be your partner in achieving excellence in PCB manufacturing.

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How Does the Ceramic PCB Works in IGBT Modules?
Friday, January 19th, 2024

IGBT (Insulated Gate Bipolar Transistor) is a bipolar junction transistor (BJT) with a MOS gate, or we can say that an IGBT module is a combination of BJT and MOS module. Despite its small size, the IGBT chip can control the transmission of electrical energy. It can switch the current 100,000 times within 1 second under an ultra-high voltage of 650 million volts.

What is the Working Principle of IGBT?

IGBT combines the features of a transistor and a switching circuit, making it a new type of electronic component that can control current efficiency. Its structure allows it to achieve current control from turn on to off without generating excessive leakage current, as well as not affecting the operation of other circuits.

The working principle of IGBT modules including two parts – the current control of MOS gate and BJT transistor. When the voltage of MOS gate changes, it affects the conduction of the transistor, thus controlling the flow of current. When the BJT comes into play, it controls the flow of current, so that improve the working efficiency of the IGBT.

(Working_principle_of_IGBT)

How Does A Ceramic PCB Protect IGBT Modules from Overheat?

As you know, IGBT modules have been applied for many years in various industries such as automotive, industrial, aerospace, consumer electronics, and more. However, optimizing the thermal dissipation of IGBT packaging is crucial to enable the modules to operate at higher power conditions. If heat dissipation is improved, IGBT modules can be used in more advanced applications.

You might be wondering how much heat does an IGBT module generate during running? It’s equivalent to the heat produced by 100 electric furnaces. This substantial amount of heat must be dissipated immediately from the IGBT chip, that’s why the ceramic circuit board stands out.

(Ceramic_pcb_with_DPC_technology)

In IGBT modules, ceramic PCBs are placed beneath the IGBT chip, or we can say the chip is assembled on the ceramic circuit board. The ceramic PCB connects and supports the chip, rapidly dissipating heat to the outer package. This method protects the chip from the adverse effects of heat.

Why ceramic PCBs Are Suitable for IGBT thermal dissipation?

Ceramic materials exhibit excellent thermal dissipation and electrical insulation properties. Unlike aluminum metal core PCBs, ceramic PCBs do not use insulation layers that hinder heat dissipation. In the manufacturing process of ceramic PCBs, copper foil is directly bonded to the ceramic substrate under high pressure and temperature (it depends on the different technology and different copper thickness). During PCB manufacturing, IGBT and other components are mounted on the circuit board through assembly technology.

Ceramic materials have extremely high insulation capabilities, enduring breakdown voltages up to 20KV/mm. At present, there are three ceramic materials that can be used for IGBT modules, they are 99% or 96% Alumina (Al₂O₃), Aluminum Nitride (AlN), and Silicon Nitride (Si₃N₄).

The thermal conductivity of alumina PCB is 15-35W/mK, aluminum nitride PCB is 170-230W/mK, and silicon nitride PCB is 80+W/mK. In contrast, aluminum core circuit boards only have a thermal conductivity of 1-12W/mK.

Applications of Ceramic PCBs in IGBT Packaging

Alumina PCBs are the most commonly used circuit boards in IGBT modules due to their lower cost. But if IGBT modules have higher power or precision requirements, AlN ceramic PCBs and Si3N4 PCBs are the most suitable choices. Because they have higher thermal dissipation and thermal expansion coefficients (CTE) close to semiconductors. Since different ceramic substrate has different features, the uses of ceramic PCB should depend on the specific requirements of IGBT modules.

In addition, with the development of Silicon Carbide (SiC) and Gallium Nitride (GaN) materials, they are starting to be used for IGBT chips due to their high-frequency, high-power, and high-temperature characteristics. Maybe in the future, aluminum nitride PCBs and silicon carbide PCBs will be increasingly applied to high-power IGBT modules in high-density three-dimensional packaging.

Common Properties of Using Ceramic Circuit Board

  • Excellent thermal conductivity and voltage resistance of ceramic substrates.
  • Copper trace layers has extremely high current-carrying capacity.
  • Strong adhesion and reliability between circuit layers and ceramic substrates.
  • Good soldering performance, suitable for wire bonding.
(Ceramic_PCB)

How to Solve the Overheat Issues in IGBT?

Though the ceramic PCB is good at heat dissipation, there still some overheat occasions happened if small power or long-time operation. Here we summarized some solutions for such issues.

1. Clean the heat sink to ensure tight contact between the IGBT and the heat sink.

2. Clean the fan, including the fan blades and lubricate the bearings if needed.

3. Clear the airflow path of the fan.

4. Replace with higher power IGBTs, ensuring the withstand voltage is not lower than the original IGBT’s value.

Above all are the information that we’d shared, welcome to contact us if you want to know more. Best Technology is a historic company which has over 17 years PCB manufacturing experience, here you can enjoy the one-stop ODM & OEM service, one-to-one after sales, quick delivery and high-quality products.

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What is Bus Bar PCBs in the Electronics Landscape?
Friday, September 22nd, 2023

Bus Bar PCBs are a specialized type of printed circuit board (PCB) that stand out from traditional PCBs due to their integrated conductive bus bars. These bus bars are typically made of copper or aluminum and are positioned on the surface or within the PCB. They serve the purpose of connecting electronic components, devices, or connectors and transmitting electrical currents.

Key Characteristics:

Outstanding Heat Dissipation:

Bus Bar PCBs are renowned for their exceptional heat dissipation capabilities. The integrated conductive bus bars efficiently conduct and dissipate the heat generated within the circuit, making them an ideal choice for high-power applications. Whether it’s in industrial electronics, electric vehicles, or solar inverters, this characteristic ensures that electronic components stay cool, enhancing overall system reliability.

Compact Space Utilization:

Space is often a precious resource in electronic devices. Bus Bar PCBs optimize space utilization through their integrated conductive bus bars. Unlike traditional wiring systems that can be space-consuming, Bus Bar PCBs save space, reducing the overall footprint of electronic systems.

Enhanced Electrical Performance:

The integration of conductive bus bars reduces the overall resistance and inductance of the circuit, resulting in improved electrical performance. Lower resistance translates to reduced power loss, while decreased inductance facilitates faster signal propagation. This, in turn, leads to higher efficiency and improved signal integrity.

Conclusion:

Bus Bar PCBs represent a force of innovation in the field of electronics, with their exceptional heat dissipation, space-saving design, and enhanced electrical performance making them highly favored across a multitude of applications. As technology continues to advance, Bus Bar PCBs are expected to play an increasingly pivotal role in the design and manufacturing of electronic systems.

If you have any interest in Bus Bar PCBs or any related requirements, please feel free to contact us. We have been in the field of heavy copper PCB manufacturing and bus bar PCB manufacturing more than 17 years. We are committed to providing you with outstanding products and services. Let’s explore the limitless possibilities of Bus Bar PCBs together, bringing innovation and success to your projects!

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“TEN Q & A” about Ceramic Printed Circuit Board
Monday, February 27th, 2023

Q1: What do the abbreviations DBC and AMB stand for?

A: DBC means “Direct Bond Copper” while full name of AMB is “Active Metal Brazed”. Both abbreviations refer to bonding technology of attaching a relatively thick copper (generally more than 0.2mm) on the ceramic substrates. These two technologies can be used to fabricate metalized ceramic substrates.

Q2: What is the mainly difference between DBC and AMB?

A: The mainly difference is AMB need to braze the copper to a ceramic board by active metal while DBC can directly connect the copper and substrate without any additional materials.

Q3: Which kind of ceramics are suitable for DBC and AMB?

A: DBC technology is suitable for oxide ceramics such as Al2O3 and ZTA. Non-oxide ceramics must be oxidized before they can be bonded to copper by DBC technology. ALN can be made into DBC or AMB ceramics, but Si3N4 only can be used as AMB substrates.

Q4: What is the function of metalized ceramic PCB?

The metallized ceramic substrate needs to carrier and interconnect multiple power semiconductor devices. The resulting electronic components are called power modules or multi-chip packages, most commonly LED packages or semiconductor packages. 

Q5: Does AMB can be used with oxide ceramics?

A: Yes, but the effective of DBC technology is better and the cost is relatively lower.

Q6: What is the most important performance need to be considered when design a new ceramic PCB?

A: It depends on the end application of product will be used in. Ceramics are chemically inert substances that are resistant to corrosion, moisture, and high temperatures, making them preferable to organic dielectrics that degrade in corrosive environments. Electrical, thermal and mechanical properties are equally important in the design of a new substrate. Dielectric strength is an important factor to meet the isolation requirements, which should be set according to the standards, specifications and regulations of the target application. Low thermal conductivity is not conducive to the heat transfer between the chip and the surrounding environment. The bending strength and fracture toughness play an important role in prolonging the service life of the substrate under thermal-mechanical stress.

Q7: How to choose a suitable substrate?

A: First, the heat dissipation of power semiconductor devices should be understood. Then, based on the chip and the ambient temperature, the required substrate thermal resistance is calculated. However, the combination of copper and ceramic may not always achieve the desired thermal resistance.  For one thing, the isolation voltage determines the minimum thickness of the ceramic. On the other hand, the thickness ratio of copper to ceramic has a great effect on the reliability. Finally, the set of applicable standards will be very limited.

Q8: Are DBC and AMB substrates suitable for high voltage applications?

A: The DBC substrate is ideal for applications with operating voltages up to 1.7 kV.  For higher operating voltages, a thicker ceramic layer is required to meet the relevant isolation requirements.  Silicon nitride (ALN) is often used because its high thermal conductivity offsets the increased thickness. In addition, resistance to partial discharge is particularly important in this application. Thus, AMB is superior to DBC techniques for this purpose unless the interfacial gap between copper and ceramics can be eliminated.

Q9: Are DBC and AMB substrates copper plated only on both sides?

A: No, both of two technologies can plate copper only on one side. But this is not a standard combination of materials, however, because the resulting flatness of the substrate is critical in multiple applications.

Q10: What are the shapes of substrates?

A: The rectangle is the cheapest and most common shape to produce. Other shapes are also available, but may incur additional production costs.

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How To Make PCB Silkscreen on Automatic Silkscreen Printer
Thursday, December 8th, 2022

If you’ve ever learned a printed circuit board, you may see some silkscreen legends printed on the PCB. Silkscreen legend plays an important role in PCB production process.  Therefore, the quality of silkscreen also is significant.

(Silkscreen)

Last time we share some acknowledges about silkscreen guideline, today we will introduce how to make PCB silkscreen on the Automatic Silkscreen Printer step by step for you.

Manufacturing processes of printing silkscreen

  • Screen fix

Step 1, we need to fix the screen on the base or workbench with a fixture, and leave 3-5mm distance away from the positioning plate when put the screen.

  • Align and position

Step 2, we need to place the circuit board on the positioning plate with right-angle positioning method or stud registration method (generally use 2 positioning pieces), make it fixed and aligned, then put down the stencil frame and adjust the positioning button, so that the PCB outline is roughly overlapping with screen. Next step, perform initial align boards according to the positioning holes or outline line, then gradually adjust to the optimal position based on pads.

  • Silkscreen ink selection and fine-tune

Step 3, we need to select the silkscreen ink according to the customer requirements, put down the screen frame and poured ink into the screen frame, and then select the length of the appropriate scraper for trial printing sample, and fine-tune the positioning until accurate. 

  • Trial printing

Step 4, we will need to do trial printing the prototypes with transparent character alignment film and check to see if there is a legend deviation, if no, then we can proceed with mass production, but if not, then the positioning should be fine-tuned again, rip off the defective film and affixed with the new one then printing again, repeat trail until qualified.

(Trail_printing_inspection)
  • Screen printing (manually)

Step 5, let’s place the circuit board (which have finished surface treatment process) on a fixed position, put down the screen frame, and then hold the scraper with both hands, at an Angle of 50°- 60 ° with even force on the scraping screen surface from front to back or from back to front. The printing material is subjected to the pressure of the scraper through the printing mesh hole and printed on the circuit board. After the scraper passes through, the screen recovers by its own tension. After the scraper is finished, the screen frame is lifted, and the sealing screen printing material is scraped back.

  • Screen printing (auto printer)

Step 6, the Angle of the scraper is an external “eight” font, usually between 20-30 degrees, you can choose the printing times according to the actual needs.

(Auto_printing)

In the past, most of the factories make the screen printing manually, it is time consuming and limited to relatively short lengths of 60 yards. So, in our manufacturing line, we have imported the automatic flat-bed screen printing.

Automatic_Silkscreen_Printer

Here I would like to share some features of the PCB silkscreen printer with you:

Features of Auto-Printer

  • High speed: the automatic screen printer has its own unique frequency conversion speed regulation device, the printing speed can be adjusted from 20 to 70 times per minute auto screen printing machine.
  • Cost-effective: the auto printer has its own electronic counter, which can automatically shut down according to the pre-designed total number, saving a lot of manpower and ink material.
  • Good quality: the automatic screen printer is very accurate in point and color, because it is equipped with a multi-color printing electric eye device, which can improve the quality of printing.
  • Good adhesive: the adhesion of the screen machine is very good, and the ink layer is relatively thick, so the text legend is not easy to fade.
  • Multi-aspect: the fully automatic screen printer can not only be used alone, but also can be connected to a UV dryer, or a slitting machine, a reminder, and other auxiliary machines.

With the help of Automatic silkscreen printer, we are able to provide “faster” and more “efficient” service to our customers, warmly welcome to contact us, we are ONLINE always!

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Happy Mid-Autumn Festival
Saturday, September 10th, 2022

The 15th day of August lunar (Sept 10th, 2022) is the Traditional Mid-Autumn Festival (also named as Moon cake Day) in China, families usually sit down together to have a reunion dinner and enjoy the delicious moon cake under beautiful full moon to celebrate this important day.

In order to thank all employees for their hard work and efforts, Best Technology prepared handle-made Mid-Autumn moon cakes to express our best wishes and heartfelt thanks to our staffs.

Handle made Moon cakes prepared by Best Technology
Moon-cake in the front desk of Best Technology SMT workshop

All staffs from Best Technology received the tastefully Moon cakes and everyone is permeated with warm and harmonious festive atmosphere. As a member of Best Tech, I felt full of happiness when received the cakes.

The moon cake not only represents the Mid-Autumn greetings and blessing to employees, but also shows the loving care from management for us.

It not only brought laughter, also brought full of touching and motivation to everyone. I believe that in the future, we will cheer up, make persistent efforts, and create a more brilliant tomorrow for the company!

Best Tech is a big family and everyone is a member of this family that we love and help each other.

(Employees in Workshop)

Since the establishment of company in 2006, Peter and Emily have always pay highly attention to the health care and life of our staffs, not only for Mid-Autumn Festival, but also for every traditional festival in China. Different beautiful gifts and best wishes will be always received from Best.

A bright moon and stars twinkle and shine. Here, Best Tech wish all of our customers a merry Mid-Autumn Festival, bliss and happiness, wish you a perfect life just like the round moon in Mid-Autumn Day!!

Also, Best will close for Mid-Autumn Festival from Sept 10-12th, and resume to office on Sept 13th, if you have any inquiry, please contact us.

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Via Tented, Via Filled & Via Plugged
Monday, December 20th, 2021

Via Tented, Via Filled (filled with solder mask) & Via Plugged (Via In Pad – Conductive material or Non-Conductive material)

One of the most confused idea during our PCB design is the difference between Via Tenting, Via Filling and Via Plugging. Designers often get mixed up between them and fail to take full advantage of the process.

Today, let us discuss them, so that you can be confident in specifying your design requirements clearly when submitting PCB files to Best Technology before final manufacturing.

Via Tented

What is via?

A plated through hole (PTH) in a Printed Circuit Board that is used to provide electrical connection between a trace on one layer of the Printed Circuit Board to a trace on another layer. Since it is not used to mount component leads, it is generally a small hole and pad diameter.

A. Three methods and definitions of via processing

There are three methods for via processing: via hole opening & via hole cover oil & via hole plug oil

1. Through hole opening window: it is the tin on the solder ring of the via (the tin is exposed like a plug-in pad). The window is usually used to debug the measurement signal. The disadvantage is that it is easy to cause a short circuit.

2. Through hole cover oil: it is the welding ring of the through hole (via) covered with solder mask ink

3. Through hole plugging oil: refers to plugging the hole with ink.

Secondly, the inspection standards for a processing method

1. Through-hole opening window is like a plug-in pad, and the window is sprayed with tin. Inspection standard: tin can be tinned, and tin can be easily tinned.

2. The inspection standard of the via hole cover oil: it is not easy to tin in the patch.

3. Inspection criteria for via plug oil: First, it must be opaque, and it must be covered and blocked by ink.

Finally, we are talk for comparison and distinction between via hole cover oil and via hole plug oil:

1. Via plug oil This process is an important supplement to via plug oil, so generally high-quality boards will require via plug oil. And often many engineers who are just entering the industry are stupid and unclear. So how do you distinguish between the two?

2. The requirement of via hole cover oil is that the ring of the via hole must be covered with ink. The emphasis is to ensure the thickness and coverage of the ink on the edge of the hole. The key control is that the ring does not accept false copper exposure and orifice oil. Thin

3. Through hole plugging oil is the production of plug holes with ink inside the holes of the through holes. The emphasis is on the quality and density of the plug holes. After the holes are plugged, no light can be transmitted.

4. The method of plugging the via hole is to first fill the via hole with ink to block the via hole, so that the ink on the solder mask will not flow into the via hole, so as to achieve the situation that the via hole does not appear yellow. (If you have strict requirements and place an order for via hole cover oil, the cover oil is usually not full or yellowish, you can change it to via hole plug oil later). In addition, the smaller the vias are, the easier it is to plug them. The vias of the fortress oil are not easy to be too large (the circuit board proofing plugging oil is directly plugged with ink, and the printing tape is plugged. It is recommended that the vias that need to be plugged are designed to be <0.5mm. This is also free; no additional money is required).

If you have more question Via Tented, Via Filled& Via Plugged, warmly welcomed to contact Best Tech for more FR4 design service.

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