Archive for the ‘Our News’ Category

What is Bus Bar PCBs in the Electronics Landscape?

Friday, September 22nd, 2023

Bus Bar PCBs are a specialized type of printed circuit board (PCB) that stand out from traditional PCBs due to their integrated conductive bus bars. These bus bars are typically made of copper or aluminum and are positioned on the surface or within the PCB. They serve the purpose of connecting electronic components, devices, or connectors and transmitting electrical currents.

Key Characteristics:

Outstanding Heat Dissipation:

Bus Bar PCBs are renowned for their exceptional heat dissipation capabilities. The integrated conductive bus bars efficiently conduct and dissipate the heat generated within the circuit, making them an ideal choice for high-power applications. Whether it’s in industrial electronics, electric vehicles, or solar inverters, this characteristic ensures that electronic components stay cool, enhancing overall system reliability.

Compact Space Utilization:

Space is often a precious resource in electronic devices. Bus Bar PCBs optimize space utilization through their integrated conductive bus bars. Unlike traditional wiring systems that can be space-consuming, Bus Bar PCBs save space, reducing the overall footprint of electronic systems.

Enhanced Electrical Performance:

The integration of conductive bus bars reduces the overall resistance and inductance of the circuit, resulting in improved electrical performance. Lower resistance translates to reduced power loss, while decreased inductance facilitates faster signal propagation. This, in turn, leads to higher efficiency and improved signal integrity.

Conclusion:

Bus Bar PCBs represent a force of innovation in the field of electronics, with their exceptional heat dissipation, space-saving design, and enhanced electrical performance making them highly favored across a multitude of applications. As technology continues to advance, Bus Bar PCBs are expected to play an increasingly pivotal role in the design and manufacturing of electronic systems.

If you have any interest in Bus Bar PCBs or any related requirements, please feel free to contact us. We have been in the field of heavy copper PCB manufacturing and bus bar PCB manufacturing more than 17 years. We are committed to providing you with outstanding products and services. Let’s explore the limitless possibilities of Bus Bar PCBs together, bringing innovation and success to your projects!

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“TEN Q & A” about Ceramic Printed Circuit Board

Monday, February 27th, 2023

Q1: What do the abbreviations DBC and AMB stand for?

A: DBC means “Direct Bond Copper” while full name of AMB is “Active Metal Brazed”. Both abbreviations refer to bonding technology of attaching a relatively thick copper (generally more than 0.2mm) on the ceramic substrates. These two technologies can be used to fabricate metalized ceramic substrates.

Q2: What is the mainly difference between DBC and AMB?

A: The mainly difference is AMB need to braze the copper to a ceramic board by active metal while DBC can directly connect the copper and substrate without any additional materials.

Q3: Which kind of ceramics are suitable for DBC and AMB?

A: DBC technology is suitable for oxide ceramics such as Al2O3 and ZTA. Non-oxide ceramics must be oxidized before they can be bonded to copper by DBC technology. ALN can be made into DBC or AMB ceramics, but Si3N4 only can be used as AMB substrates.

Q4: What is the function of metalized ceramic PCB?

The metallized ceramic substrate needs to carrier and interconnect multiple power semiconductor devices. The resulting electronic components are called power modules or multi-chip packages, most commonly LED packages or semiconductor packages. 

Q5: Does AMB can be used with oxide ceramics?

A: Yes, but the effective of DBC technology is better and the cost is relatively lower.

Q6: What is the most important performance need to be considered when design a new ceramic PCB?

A: It depends on the end application of product will be used in. Ceramics are chemically inert substances that are resistant to corrosion, moisture, and high temperatures, making them preferable to organic dielectrics that degrade in corrosive environments. Electrical, thermal and mechanical properties are equally important in the design of a new substrate. Dielectric strength is an important factor to meet the isolation requirements, which should be set according to the standards, specifications and regulations of the target application. Low thermal conductivity is not conducive to the heat transfer between the chip and the surrounding environment. The bending strength and fracture toughness play an important role in prolonging the service life of the substrate under thermal-mechanical stress.

Q7: How to choose a suitable substrate?

A: First, the heat dissipation of power semiconductor devices should be understood. Then, based on the chip and the ambient temperature, the required substrate thermal resistance is calculated. However, the combination of copper and ceramic may not always achieve the desired thermal resistance.  For one thing, the isolation voltage determines the minimum thickness of the ceramic. On the other hand, the thickness ratio of copper to ceramic has a great effect on the reliability. Finally, the set of applicable standards will be very limited.

Q8: Are DBC and AMB substrates suitable for high voltage applications?

A: The DBC substrate is ideal for applications with operating voltages up to 1.7 kV.  For higher operating voltages, a thicker ceramic layer is required to meet the relevant isolation requirements.  Silicon nitride (ALN) is often used because its high thermal conductivity offsets the increased thickness. In addition, resistance to partial discharge is particularly important in this application. Thus, AMB is superior to DBC techniques for this purpose unless the interfacial gap between copper and ceramics can be eliminated.

Q9: Are DBC and AMB substrates copper plated only on both sides?

A: No, both of two technologies can plate copper only on one side. But this is not a standard combination of materials, however, because the resulting flatness of the substrate is critical in multiple applications.

Q10: What are the shapes of substrates?

A: The rectangle is the cheapest and most common shape to produce. Other shapes are also available, but may incur additional production costs.

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How To Make PCB Silkscreen on Automatic Silkscreen Printer

Thursday, December 8th, 2022

If you’ve ever learned a printed circuit board, you may see some silkscreen legends printed on the PCB. Silkscreen legend plays an important role in PCB production process.  Therefore, the quality of silkscreen also is significant.

(Silkscreen)

Last time we share some acknowledges about silkscreen guideline, today we will introduce how to make PCB silkscreen on the Automatic Silkscreen Printer step by step for you.

Manufacturing processes of printing silkscreen

  • Screen fix

Step 1, we need to fix the screen on the base or workbench with a fixture, and leave 3-5mm distance away from the positioning plate when put the screen.

  • Align and position

Step 2, we need to place the circuit board on the positioning plate with right-angle positioning method or stud registration method (generally use 2 positioning pieces), make it fixed and aligned, then put down the stencil frame and adjust the positioning button, so that the PCB outline is roughly overlapping with screen. Next step, perform initial align boards according to the positioning holes or outline line, then gradually adjust to the optimal position based on pads.

  • Silkscreen ink selection and fine-tune

Step 3, we need to select the silkscreen ink according to the customer requirements, put down the screen frame and poured ink into the screen frame, and then select the length of the appropriate scraper for trial printing sample, and fine-tune the positioning until accurate. 

  • Trial printing

Step 4, we will need to do trial printing the prototypes with transparent character alignment film and check to see if there is a legend deviation, if no, then we can proceed with mass production, but if not, then the positioning should be fine-tuned again, rip off the defective film and affixed with the new one then printing again, repeat trail until qualified.

(Trail_printing_inspection)
  • Screen printing (manually)

Step 5, let’s place the circuit board (which have finished surface treatment process) on a fixed position, put down the screen frame, and then hold the scraper with both hands, at an Angle of 50°- 60 ° with even force on the scraping screen surface from front to back or from back to front. The printing material is subjected to the pressure of the scraper through the printing mesh hole and printed on the circuit board. After the scraper passes through, the screen recovers by its own tension. After the scraper is finished, the screen frame is lifted, and the sealing screen printing material is scraped back.

  • Screen printing (auto printer)

Step 6, the Angle of the scraper is an external “eight” font, usually between 20-30 degrees, you can choose the printing times according to the actual needs.

(Auto_printing)

In the past, most of the factories make the screen printing manually, it is time consuming and limited to relatively short lengths of 60 yards. So, in our manufacturing line, we have imported the automatic flat-bed screen printing.

Automatic_Silkscreen_Printer

Here I would like to share some features of the PCB silkscreen printer with you:

Features of Auto-Printer

  • High speed: the automatic screen printer has its own unique frequency conversion speed regulation device, the printing speed can be adjusted from 20 to 70 times per minute auto screen printing machine.
  • Cost-effective: the auto printer has its own electronic counter, which can automatically shut down according to the pre-designed total number, saving a lot of manpower and ink material.
  • Good quality: the automatic screen printer is very accurate in point and color, because it is equipped with a multi-color printing electric eye device, which can improve the quality of printing.
  • Good adhesive: the adhesion of the screen machine is very good, and the ink layer is relatively thick, so the text legend is not easy to fade.
  • Multi-aspect: the fully automatic screen printer can not only be used alone, but also can be connected to a UV dryer, or a slitting machine, a reminder, and other auxiliary machines.

With the help of Automatic silkscreen printer, we are able to provide “faster” and more “efficient” service to our customers, warmly welcome to contact us, we are ONLINE always!

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Happy Mid-Autumn Festival

Saturday, September 10th, 2022

The 15th day of August lunar (Sept 10th, 2022) is the Traditional Mid-Autumn Festival (also named as Moon cake Day) in China, families usually sit down together to have a reunion dinner and enjoy the delicious moon cake under beautiful full moon to celebrate this important day.

In order to thank all employees for their hard work and efforts, Best Technology prepared handle-made Mid-Autumn moon cakes to express our best wishes and heartfelt thanks to our staffs.

Handle made Moon cakes prepared by Best Technology
Moon-cake in the front desk of Best Technology SMT workshop

All staffs from Best Technology received the tastefully Moon cakes and everyone is permeated with warm and harmonious festive atmosphere. As a member of Best Tech, I felt full of happiness when received the cakes.

The moon cake not only represents the Mid-Autumn greetings and blessing to employees, but also shows the loving care from management for us.

It not only brought laughter, also brought full of touching and motivation to everyone. I believe that in the future, we will cheer up, make persistent efforts, and create a more brilliant tomorrow for the company!

Best Tech is a big family and everyone is a member of this family that we love and help each other.

(Employees in Workshop)

Since the establishment of company in 2006, Peter and Emily have always pay highly attention to the health care and life of our staffs, not only for Mid-Autumn Festival, but also for every traditional festival in China. Different beautiful gifts and best wishes will be always received from Best.

A bright moon and stars twinkle and shine. Here, Best Tech wish all of our customers a merry Mid-Autumn Festival, bliss and happiness, wish you a perfect life just like the round moon in Mid-Autumn Day!!

Also, Best will close for Mid-Autumn Festival from Sept 10-12th, and resume to office on Sept 13th, if you have any inquiry, please contact us.

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Via Tented, Via Filled & Via Plugged

Monday, December 20th, 2021

Via Tented, Via Filled (filled with solder mask) & Via Plugged (Via In Pad – Conductive material or Non-Conductive material)

One of the most confused idea during our PCB design is the difference between Via Tenting, Via Filling and Via Plugging. Designers often get mixed up between them and fail to take full advantage of the process.

Today, let us discuss them, so that you can be confident in specifying your design requirements clearly when submitting PCB files to Best Technology before final manufacturing.

Via Tented

What is via?

A plated through hole (PTH) in a Printed Circuit Board that is used to provide electrical connection between a trace on one layer of the Printed Circuit Board to a trace on another layer. Since it is not used to mount component leads, it is generally a small hole and pad diameter.

A. Three methods and definitions of via processing

There are three methods for via processing: via hole opening & via hole cover oil & via hole plug oil

1. Through hole opening window: it is the tin on the solder ring of the via (the tin is exposed like a plug-in pad). The window is usually used to debug the measurement signal. The disadvantage is that it is easy to cause a short circuit.

2. Through hole cover oil: it is the welding ring of the through hole (via) covered with solder mask ink

3. Through hole plugging oil: refers to plugging the hole with ink.

Secondly, the inspection standards for a processing method

1. Through-hole opening window is like a plug-in pad, and the window is sprayed with tin. Inspection standard: tin can be tinned, and tin can be easily tinned.

2. The inspection standard of the via hole cover oil: it is not easy to tin in the patch.

3. Inspection criteria for via plug oil: First, it must be opaque, and it must be covered and blocked by ink.

Finally, we are talk for comparison and distinction between via hole cover oil and via hole plug oil:

1. Via plug oil This process is an important supplement to via plug oil, so generally high-quality boards will require via plug oil. And often many engineers who are just entering the industry are stupid and unclear. So how do you distinguish between the two?

2. The requirement of via hole cover oil is that the ring of the via hole must be covered with ink. The emphasis is to ensure the thickness and coverage of the ink on the edge of the hole. The key control is that the ring does not accept false copper exposure and orifice oil. Thin

3. Through hole plugging oil is the production of plug holes with ink inside the holes of the through holes. The emphasis is on the quality and density of the plug holes. After the holes are plugged, no light can be transmitted.

4. The method of plugging the via hole is to first fill the via hole with ink to block the via hole, so that the ink on the solder mask will not flow into the via hole, so as to achieve the situation that the via hole does not appear yellow. (If you have strict requirements and place an order for via hole cover oil, the cover oil is usually not full or yellowish, you can change it to via hole plug oil later). In addition, the smaller the vias are, the easier it is to plug them. The vias of the fortress oil are not easy to be too large (the circuit board proofing plugging oil is directly plugged with ink, and the printing tape is plugged. It is recommended that the vias that need to be plugged are designed to be <0.5mm. This is also free; no additional money is required).

If you have more question Via Tented, Via Filled& Via Plugged, warmly welcomed to contact Best Tech for more FR4 design service.

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The function of solder mask layer on the PCB Board.

Monday, September 20th, 2021

At last time, we shared a blog talking about Why most of the PCB boards are green?. Believe you’ve known the reasons for why most of solder mask colors are green.

Today, let’s share something about the function of solder mask on the Printed Circuits Boards.

The solder mask layer is designed mainly to prevent the PCB copper foil from being directly exposed to the air and play a role in protecting the PCB surface, which is also to prevent the area that should not be soldered from being soldered.

PCB Solder mask

As we know that almost all the PCB need to do the assembly, which need to go through the reflow soldering while the assembly, and solder mask plays an important role during control of the reflow soldering process.

Here is a summary for what solder mask roles played on the board:

(1) Prevent physical disconnection of conductor circuits on the circuits board;

(2) In the welding process, solder mask can prevent short circuit caused by bridging;

(3) solder mask can reduce copper pollution to the soldering trough;

(4) Print solder mask on the PCB can prevent insulation deterioration and corrosion caused by external environmental factors such as dust and moisture;

(5) Solder mask are with high insulation; it is possible to increase the density of the circuit.

Red solder mask

In terms of solder mask material, it must be used through liquid wet process or dry film lamination.

Dry film solder mask materials are supplied in a thickness of 0.07-0.1mm (0.03-0.04″), which can be suitable for some surface mount products, but this material is not suitable for PCBs with tighter pitches.

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Baking Time & Temperature Standard of MCPCB

Tuesday, August 17th, 2021

After manufacturing the Metal Core PCB, there is a shelf life, once the shelf life has passed, we need to bake the bare board before assembling the components, otherwise the MCPCB is prone to burst when the SMT line is produced. There are industry specifications for both how long MCPCB can be stored and how long they can be baked.

MCPCB Control Standard

  1. Unpacking & Storage
  2. If the packing bag is sealed, and the manufacturing date is within 2 months, it can be directly used before assembly.
  3. The manufacturing date is within 2 months, and the unpacking date must be marked after unpacking.
  4. The manufacturing date is within 2 months, and it must be assembled and used within 5 days after unpacking.
  • Baking Time
  • If unpacked for more than 5 days within 2 months of the manufacturing date, bake at 120±5°C for 1 hour
  • Two months after the manufacturing date, baking at 120±5°C for 1 hour before assembly.
  • Two to Six months after the manufacturing date, baking at 120±5°C for 2 hours before assembly.
  • Six to Twelve months after the manufacturing date, baking at 120±5°C for 4 hours before assembly.
  • The MCPCB after baking must be used up within 5 days (put into IR REFLOW), and unused board must be baked for another hour before assembly.
  • Over half one year after the manufacturing date, bake at 120±5°C for 4 hours before assembly, and then send it to the production line to do HASL_LF before using.
Baking Machine

Preservation & Baking Standard for in different regions

The specific storage time and baking temperature of MCPCB are not only related to the production capacity and production process of manufacturer, but also have a great relationship with the region.

  1. For areas with heavier humidity, the MCPCB must be used up within 24 hours when exposed to the air, otherwise it is easy to oxidize. After normal opening, it is best to use it up in 8 hours.
  • For areas with a relatively dry climate, the preservation time of PCB will be longer, and the baking time can also be shorter. The baking temperature is generally 120±5°C, and the baking time is determined according to the specific situation.

The MCPCB with OSP or Gold Immersion has a shelf life of 6 months after packaging, and it is generally not recommended to bake for MCPCB with OSP.

PCB board with SMT

If you have other questions about MCPCB, welcome to contact us.

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What kind of test for Coil Printed Circuit Board?

Wednesday, August 11th, 2021

In year 2019, one of our US customers asked us, Marina can Best Technology make a Coil PCB (Printed Circuit Board) with FR4 material? Yes, of course, we can make different kinds of PCB for our customer, included for the Coils PCB, which currently is widely used for wireless charging and antenna products. Please see the following Coils board from Best Technology.

The manufacturing process is same as other PCB manufacturing process, and just make sure the etching process and pay attention for the etching tolerance of the coils trace. And when coils PCB board finished, do you know what kind of test need to do to check the functional of Coils boards?

Today I would like to share how Best Technology test Coil PCB board. Everyone knows that we check the quality of PCB board with Flying probe tester, as the production efficiency is extremely low and the inductance and capacitance cannot be accurately measured. In this way, we need to use LCR meter to make verify the inductance and capacitance. See the LCT meter as following.

Best Technology chooses the digital meter LCR Meter to test the impedance characteristics of the coil. From the LCR tester you know see two numbers, one for inductance and another for resistance.

After test each coils printed circuit board, we will make record at our paper to make sure every measurement data will meet for customer requirement.

Currently, LCR Meter only provides a single-channel test function, and can only test the impedance characteristics of a set of coils at a time. But this is the effective test method for Coil printed Circuit Board. But we believe we will buy more LCR meters to let the test coil board become quicker.

If you have any comments on the testing for Coil printed circuit board, you are welcome to send us query and we are happy to discuss with you. You can visit www.bestpcbs.com to know more about us. Thank you

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The way to add the mouse bite on the PCB Panel #Bestpcb

Saturday, July 31st, 2021

#Bestpcb #Best PCB

Maybe you’ve ever been recommended by your PCB manufacturer to add a mouse bite on the PCB edge?

But, what’s mouse bites?  Is it something about the Rat?

Of course not, it is kind of connection way for PCB Panel.

As you know, usually the Printed Circuits Boards are manufactured on a standard sized panel, and sometime, the panel will with sharp edges, and those sharp edges are often referred to as “mouse bites” and they are left over after depanelization.

mouse bite PCB depanelization Best Technology

Mouse Bites usually presented as row of tiny holes on the board edge, just like the half holes around a stamp, which to connect and allow those small boards in an array.

mouse bite stamp holes on the PCB edge

Here is the picture for you to see how the mouse bites presented on the Gerber drawing and what it is when it is finished.

Partial Effect drawing after Penalization: (the way of connecting bridge is used in the middle, this way can reduce the residue of burr in minimize)

Partial Effect drawing pcb panel
PCB panel mouse bite

Some People also called mouse bites as perforated breakaway tabs, it is designed for a better the purpose of the mouse bites is for a better grasp when mounted.

Here is the design rules if you need to add the mouse bites on your PCB panel.

  1. The distance between each single board need to arranged as 1.2mm and 1.6mm.
  • The distance between each holes need to be 0.2mm, the distance between holes center should be 0.75mm.
  • Need to add two rows, the mouse bites extend to 1/3 of the board, if there is a some circuits on the board edge, you will need to avoid it.
  • After adding mouse bites, the shapes of the two sides of the hole are connected, which is convenient for the production of gongs after work.

Here are some of our PCB with mouse bites for your reference.

mouse bite PCB Best Technology
PCB with mouse bit

If you want to add mouse bites on your PCB board, you are welcome to send us your request and we will help you make it on your PCB Panel.

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How to make Panel for MCPCB?

Friday, July 16th, 2021

Regarding all Metal core PCB required panelization, which needs to take into account how the boards are connected. There are two main connection methods for panel: Double face carved V-shaped groove (V-CUT), and the long slot plus a small circular hole (commonly known as stamp hole), depending on the shape of the PCB.

  1. V-CUT

V-CUT is to draw a slot at the junction of two boards, where the connection of the boards is relatively thin and easy to break. Currently SMT Board is widely used, characterized with neat and level edges after separation, which is recommended as priority.

V-cuts are generally straight lines, and there will be no complicated traces such as curved arcs, so pay attention to be in a straight line when making the panelization. Please also note the following two points.

â‘  The two sides of V-CUT line (top side and bottom side) require a no circuits area that is not smaller than 1mm, to avoid the damage circuits when separating.

② After cutting the V-shaped groove, the remaining thickness should be 1/4 to 1/3 of the total board thickness , which is not smaller than 0.4mm.

V-Cut
  • Stamp Holes/Mouse Bite

For irregular PCB boards, the shape of the board has curved corners, there will be many burrs if use V-cut. In this case the stamp hole connection would be the better choice.

  1. Panelization Rules:
  1. The spacing between the panel and the board is 1.2mm or 1.6mm.
  • The diameter of hole is 0.55mm, generally a row of 8 holes (Hole count depends on the design requirements, more holes can enhance the stability), the spacing of the two holes is 0.2mm.
  • The distance between the upper and lower rows of holes is 2mm, and 1/3 of the stamp holes enter the board. Pay attention to avoid the circuit on the edge of the board.
  • After adding the stamp holes, the shape of both sides of the hole need to be connected to facilitate the subsequent routing manufacturing.
  • The part picture after panelization.(Using the connection bridge in the middle, which can minimize the residual.)
Part Picture
  • The effect picture after panelization.
Stamp Holes

If you want to learn more about MCPCB design, welcome contact us.

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