Archive for the ‘PCB Technology’ Category

Friday, June 20th, 2025

Etching is one of the most critical steps in making a printed circuit board (PCB). It’s the process that removes unwanted copper, leaving behind clean circuit traces. Whether you’re building PCBs for new projects or manufacturing at scale, understanding how PCB etching works helps you get better quality and fewer production issues.

At Best Technology, we specialize in high-precision PCB fabrication. From prototype to volume production, our team follows strict quality standards to ensure high quality PCBs. Now let’s take a closer look at the PCB etching process.

What Is PCB Etching?

PCB etching is the process of removing excess copper from a copper-clad board to form the desired circuit pattern. It’s typically done after the copper layer has been covered with an etch-resistant mask, which protects specific areas during etching. Only the unprotected copper is dissolved away by the etchant solution.

Etching creates the circuit traces that connect electronic components. If done improperly, you could end up with broken traces, short circuits, or unreliable connections. That’s why it’s important to understand the entire process before getting started.

What Liquid Is Used for PCB Etching?

Several chemical solutions are commonly used for PCB etching, depending on the production scale and copper thickness. The most frequently used liquids include:

Ferric Chloride (FeCl₃): A traditional etchant used for simple or hobby PCBs. It’s affordable but stains and is hard to dispose of.
Ammonium Persulfate (NH₄)₂S₂O₈: Produces cleaner results with less mess. Suitable for small-scale production.
Cupric Chloride (CuCl₂): Common in industrial PCB etching lines. It offers consistent results and can be regenerated for reuse.
Alkaline Etchants: These are used in professional PCB shops. They provide high-speed etching and better line resolution.

Each etchant has different properties, such as etch rate, temperature sensitivity, and compatibility with resists. Industrial PCB manufacturers often choose the one that best matches their line width, copper thickness, and environmental compliance standards.

What Materials Are Needed for PCB Etching?

Before starting the etching process, you’ll need the following materials:

Copper-clad laminate: This is the raw board, coated with a thin layer of copper.
Etching solution: Ferric chloride, cupric chloride, or another chemical agent.
Etch-resistant layer: Typically photoresist or screen-printed resist to mask the pattern.
Developer solution (if using photoresist): Helps reveal the resist pattern before etching.
Protective gear: Gloves, goggles, and fume protection to handle chemicals safely.
Etching tank or tray: For submerging and processing the boards evenly.
Agitation system: Helps improve etching speed and consistency (manual or automatic).
Rinse station: To stop the chemical reaction after etching and remove residues.

These materials work together to protect the circuit pattern and remove unwanted copper with high precision.

What Materials Are Needed for PCB Etching?

PCB Etching Process

The PCB etching process is one of the core steps that transforms a copper-clad laminate into a functional printed circuit board. It defines the copper traces that carry electrical signals between components. The goal of etching is to remove all the unwanted copper from the board, leaving only the copper paths protected by a resist layer.

1. Surface Preparation

Before etching begins, the copper surface must be completely clean and free of oxidation or oil. Any contamination can prevent the resist from adhering properly. Most manufacturers use mechanical scrubbing or chemical cleaning (like acid dipping) to ensure a uniform surface.

2. Applying the Resist Layer

Once the board is clean, a protective layer called a resist is applied to mask the areas that should not be etched. There are several ways to apply the resist:

Dry film photoresist (DFR): Laminated using heat and pressure.
Liquid photoresist: Sprayed onto the board.
Screen printing: Used in simple or low-resolution PCBs.

For most precision PCBs, photoresist is preferred. It allows for fine line resolution and is compatible with automated processing.

3. Exposure and Developing

After resist application, the board is aligned with a phototool or artwork—a transparent film with the desired circuit pattern. The board is then exposed to UV light, which hardens the resist on the areas exposed to light. The rest remains soft.

The board is then placed in a developer solution, which removes the unhardened (unexposed) resist. This reveals the copper that will be etched away, while protecting the traces and pads under the hardened resist.

4. Etching

The board enters the etching chamber, where it’s sprayed or submerged with a chemical solution designed to dissolve exposed copper.

Depending on the production scale and PCB type, different etching systems are used:

Immersion etching: The board is dipped in an etchant bath. Simple but slower.
Spray etching: High-pressure nozzles spray etchant uniformly across the board, providing faster and more controlled etching.
Conveyorized etching machines: Used in mass production, offering precision and speed.

The most common etching chemicals at this stage include:

Alkaline cupric chloride (CuCl₂): Efficient and widely used in high-speed lines.
Ammoniacal etchant: Offers even faster etching, especially suitable for fine-line PCBs.

Etching is a time-sensitive process. Too short, and some copper remains. Too long, and the resist may lift, leading to undercutting or trace erosion.

5. Etch Quality Control

Quality checks are crucial right after etching:

Line width and spacing inspection ensures the traces match the intended design.
Cross-section testing confirms the copper thickness is within tolerance.
Underetch detection helps avoid electrical shorts and performance issues.

High-end manufacturers like Best Technology use AOI (Automated Optical Inspection) machines to inspect every board for etch defects at this point.

6. Stripping the Resist

Once etching is complete, the remaining photoresist is no longer needed. It is removed using a chemical resist stripper, revealing clean, shiny copper traces.

This step prepares the board for further processing like solder mask application, drilling, or surface finish coating (such as ENIG or HASL).

7. Rinsing and Neutralizing

After stripping, the board goes through a thorough rinsing process using deionized water to remove any chemical residues. A neutralizing agent may also be applied to balance pH levels and prevent corrosion.

How Long Does It Take to Etch a PCB?

Etching time depends on several factors, like:

Copper thickness: Thicker copper layers take longer to etch.
Etchant concentration: Higher concentration speeds up the process.
Temperature: Warmer solutions increase the etch rate.
Agitation: Moving the solution or board improves uniformity and speed.

Typically, hobbyist etching using ferric chloride may take 10–30 minutes, while industrial alkaline etching can finish in 1–3 minutes with consistent results. Time control is critical—over-etching can lead to side-etching and weak traces.

Calculation Method for PCB Etching Factors

Professional PCB manufacturers use a formula to calculate the etch factor, which helps balance speed and precision. The etch factor (EF) is:

EF = Depth of Etch / Undercut Distance

A high etch factor means more vertical etching (cleaner sidewalls), while a low etch factor shows more lateral etching (side erosion). This factor helps adjust etchant chemistry and exposure settings.

Key parameters include:

Etchant type and strength
Temperature control
Agitation method
Line width and spacing
Copper thickness

By tuning these parameters, manufacturers can keep tight tolerances and maintain trace fidelity even on high-density PCBs like HDI boards.

What Should I Do if PCB Side Etching Occurs?

Side etching happens when the etchant cuts under the resist, reducing the trace width and weakening the circuit. It’s a common issue with long etching times or incorrect resist application.

To reduce or eliminate side etching:

1. Use proper photoresist application: Ensure full coverage and adhesion to the copper.

2. Optimize exposure and development times: Underdeveloped or overexposed resist can lift during etching.

3. Shorten etching duration: Use stronger etchants or increase agitation to reduce total etch time.

4. Improve etching directionality: Spray etching is better than immersion for fine features.

5. Apply protective overcoats: For high-precision PCBs, a hard-baked resist layer or dry film helps.

In production, engineers often run test coupons alongside real boards to monitor etch quality in real time.

Choose a Professional PCB Partner – Best Technology

At Best Technology, we handle complex PCB etching challenges with advanced production lines and tight quality control. We support everything from simple single-layer PCBs to multilayer HDI PCB, flexible circuits, and even ceramic-based PCBs. Our MES system tracks every board’s etching process for full traceability.

Whether you need prototype fabrication or mass production, we guarantee:

High etching precision
Clean edge definition
Minimal side etching
Consistent quality for fine-pitch circuits

Looking for a reliable PCB etching service? Contact Best Technology today and get your project started with confidence.

FAQs

1. What is the safest etchant to use at home?

Ammonium persulfate is cleaner and less messy than ferric chloride, though both require safety precautions.

2. Can I reuse PCB etching solution?

Yes, some etchants like cupric chloride can be regenerated, but they require careful chemical control.

3. What causes uneven etching?

Poor resist application, inconsistent agitation, or expired chemicals can lead to patchy etching.

4. How do I clean a PCB after etching?

Rinse with water, then clean with isopropyl alcohol to remove remaining residues before applying solder mask.

5. Is photoresist better than screen printing for masking?

Photoresist offers higher resolution and is preferred for fine-pitch or multilayer PCB designs.

What Is the Difference Between a Circuit Board and a PCB?

Before break down the cost of PCB, let’s explain the difference between circuit board and a PCB. Although people often use the terms interchangeably, there’s a slight difference. A circuit board is a general term that can refer to any board used in an electronic device.

A PCB (Printed Circuit Board) is a specific type that uses conductive tracks etched onto a substrate, usually FR4 or ceramic. All PCBs are circuit boards, but not all circuit boards are PCBs. When we talk about pcb board price, we usually mean a professionally manufactured, layered board ready for component mounting.

PCB Board Price: How Much does a PCB Board Cost?

How Much Does PCB Cost Per Square Inch?

On average, the pcb board price per square inch ranges from $0.50 to $5, depending on the complexity and order size. For basic two-layer PCBs made in large volumes, the cost can be on the lower end. But for high-frequency, multi-layer, or specialty material boards, the price goes up.

PCB Type	Price Per Square Inch
Basic 2-layer FR4 PCB	$0.50 – $1.00
4-layer PCB	$1.50 – $2.50
6+ layer PCB	$2.50 – $4.50
Ceramic or metal-core	$3.00 – $5.00+

These prices vary by manufacturer, lead time, surface finish, and testing requirements.

What Factors Affect PCB Board Price?

Several factors play a critical role in determining the PCB board price, the most influential factors include:

1. Number of Layers

The more layers a PCB has, the higher the cost. A 2-layer board is relatively inexpensive to fabricate, but as you move to 4, 6, or even 10 layers, the complexity increases significantly. Each additional layer means more lamination cycles, drilling, and alignment steps.

2. Board Size and Shape

Larger boards use more material, which drives up the price. Unusual shapes that require non-standard routing also increase the manufacturing complexity, sometimes requiring custom tooling or manual cutting.

3. Material Selection

Standard FR4 is the most cost-effective material. However, specialty substrates such as ceramic, aluminum, polyimide, or Rogers laminates are much more expensive. These are often used for high-frequency or high-heat applications and add to the total cost.

4. Trace Width and Spacing

High-density designs with narrow traces and tight spacing require more precise manufacturing, which involves advanced processes and tighter quality control. That adds cost due to increased difficulty and possible yield loss.

5. Surface Finish

Finishes like HASL (Hot Air Solder Leveling) are economical, while others like ENIG, ENEIG and Immersion Silver add durability but come at a premium. The choice depends on the soldering process and environmental conditions.

6. Via Type and Count

Through-hole vias are cheaper, but blind and buried vias, microvias, or via-in-pad structures add extra drilling and lamination steps. These specialized vias are common in HDI (High-Density Interconnect) boards and push the cost higher.

7. Solder Mask Color

Green is standard and least expensive. Other colors such as red, black, white, or blue may cost slightly more. Clear or custom colors are rare and usually priced higher.

8. Turnaround Time

Shorter lead times often require priority in the production queue and overtime labor, which increases costs. Standard production schedules offer better pricing if you’re not in a rush.

How Much Does PCB Assembly Cost?

PCB board price doesn’t include assembly unless specified. PCB assembly (PCBA) adds labor, equipment use, and component sourcing into the cost. On average:

Simple boards (fewer than 50 components): $5 – $20 per board.
Medium complexity: $20 – $30 per board.
High complexity or low volume with many components: $30+ per board.

For large runs, the price drops significantly, often down to a few dollars per board for simple designs. Using turnkey assembly (where the manufacturer handles everything) is usually cheaper in bulk.

How to Reduce PCB Cost on Printed Circuit Boards?

Here are some proven ways to bring down your pcb board price without sacrificing quality:

1. Design with standard board sizes, FR4 material, and common thickness (1.6mm) to avoid customization fees.

2. Reduce the number of layers if possible. Reusing reference designs or optimizing layout to avoid unnecessary complexity can significantly lower manufacturing costs.

3. If you’re ordering small PCBs, ask your manufacturer to panelize multiple boards in one larger sheet. This can improve production efficiency and reduces per-unit costs.

4. Unless you need advanced protection or plan multiple soldering cycles, HASL can be a suitable and affordable finish.

5. Reducing the number of different drill sizes simplifies the manufacturing process and lowers setup costs.

6. High-volume production significantly lowers the cost per unit. If you can predict demand, batch your orders for better pricing.

Working with an experienced and flexible PCB manufacturer like Best Technology allows you to get valuable feedback on cost-saving opportunities without compromising functionality. We provide full DFM checks to avoid rework costs.

How to Choose a PCB Board?

Choosing the right PCB for your project helps ensure reliability while controlling the pcb board price. Here’s what to consider:

1. Application Requirements

If you’re working on a consumer product, a standard FR4 board will do. But for high-power LEDs, RF circuits, or automotive electronics, you may need special materials like Rogers, Dupont.

2. Electrical Performance

Check if your circuit demands controlled impedance, high-frequency transmission, or thermal management. The right material and layout will support this without unnecessary expense.

3. Size and Component Density

Tight spaces or miniaturized designs may require multi-layer boards or HDI technology. Choose your layer count based on how compact your design needs to be.

4. Budget and Volume

For low-volume projects, it’s often better to work with manufacturers who support small batch or prototype services. For production runs, choose a vendor that offers scalable pricing.

For most general electronics, a 2-layer FR4 PCB will do the job. But for high-power LEDs, RF applications, or miniaturized devices, materials like aluminum, ceramic, or Rogers laminates may be required. Consult with a professional PCB manufacturer like Best Technology to get a cost-effective and reliable solution tailored to your needs.

What Is the Most Common PCB Thickness?

The industry standard for PCB thickness is 1.6mm (0.063 inch). It offers good balance between mechanical strength and space savings. However, depending on application, PCBs can range from 0.4mm to over 3.2mm.

Can I Make My Own PCB Board?

Yes, you can make a basic PCB at home using copper-clad boards and etching chemicals. But DIY boards are only suitable for low-frequency, non-critical applications. They lack the precision, durability, and reliability of professional boards.

If you need consistent performance, especially in multi-layer or fine-pitch designs, outsourcing to a PCB fabrication specialist is the best route. At Best Technology, we offer cost-effective PCB solutions with fast turnaround and tight quality control. Whether you’re prototyping or scaling up, our engineering team is here to help.

FAQs

1. Is it cheaper to order PCBs from China?

Yes. Many Chinese manufacturers like Best Technology offer excellent prices and quality due to economies of scale and efficient production lines.

2. Can I get a single PCB prototype made?

Absolutely. Many companies offer low-volume or single-piece orders for prototyping purposes.

3. Do PCB prices include components?

Not usually. PCB board price refers to the bare board. Assembly and components are charged separately.

4. Is ENIG finish worth the extra cost?

If you need better surface flatness, corrosion resistance, or plan multiple reflows, ENIG is a good investment.

5. What’s the lead time for PCB manufacturing?

Standard is 5–7 days. Express options range from 24 to 72 hours, depending on the manufacturer.

Why Are Small PCBs Important?

Small PCBs play a major role in modern electronics where compact size and lightweight form factors are essential. Whether it’s a smartwatch, fitness tracker, or smart home sensor, space is always limited. Miniaturized PCBs make it possible to fit complex electronic functions into these tiny enclosures.

But it’s not just about saving space. Small PCBs often improve signal integrity by reducing the length of signal paths. This is especially helpful in high-speed applications. Moreover, they reduce parasitic capacitance and inductance, which enhances performance in analog and RF circuits.

Additionally, small PCBs contribute to overall system efficiency. They use fewer materials, require less power, and simplify thermal management when designed properly. With all these advantages, it’s no surprise that assembling and testing small PCBs has become a specialized field in electronics manufacturing. Here is the main motherboard used in mobile phone:

How Do You Test a Small Circuit Board?

Testing a small circuit board involves several steps, each tailored to ensure functionality and identify defects before the board is installed in a final product. The key challenge lies in the limited real estate, which makes access and probing more difficult. Despite this, the following steps are commonly used:

1. Visual Inspection

Begin with a close-up inspection, using magnification tools or a microscope. You’re looking for:

Solder bridges
Tombstoned components
Incorrect polarities
Cracked or missing parts

2. Continuity and Resistance Checks

Use a multimeter to test for continuity along copper traces. Any open line could indicate a manufacturing error, such as an incomplete etch or a broken solder joint.

3. Power-On Testing

Once you’ve confirmed no shorts, apply power using a bench supply. Use a limited current setting to avoid damaging the board if something goes wrong. Confirm that voltage rails (e.g., 3.3V, 5V) match design specifications.

4. Functional Component Checks

Activate the board’s subsystems one at a time. For example, if there’s an LED or sensor, trigger them with known inputs and check the response.

5. Oscilloscope or Logic Analyzer

In digital systems, probe clock signals, data buses, and communication lines (like I2C, SPI, or UART). On analog boards, check waveform quality and frequency.

How to Assemble Electronic Components on a Small PCB?

Assembling electronic components on a small PCB involves precise coordination between manual work and machine automation. Small PCBs typically use surface-mount technology (SMT), though some through-hole components may still be involved. You can follow below steps to assemble components on your PCB.

1. Workspace Preparation

Ensure the working environment is ESD-safe. Use grounded wrist straps, antistatic mats, and proper lighting. A clean environment reduces contamination risks and improves soldering quality.

2. Stencil and Solder Paste Application

Use a laser-cut stencil to apply solder paste accurately on each pad. This ensures that components receive just the right amount of solder, which is critical for small pads.

3. Pick-and-Place Process

Surface-mount components are placed using tweezers (manual) or a pick-and-place machine (automated). For very small boards, the manual method is common in low-volume runs.

4. Reflow Soldering

After placement, the PCB passes through a reflow oven where the solder paste melts and solidifies, bonding the components securely. The reflow temperature profile must be carefully controlled.

5. Inspection and Touch-Up

Once soldered, the board is inspected under magnification. Cold joints, solder bridges, or shifted components are corrected using a fine-tip soldering iron or hot air tool.

6. Through-Hole Soldering (if applicable)

If your design uses connectors or switches, those are added next. Insert them into the board and hand-solder from the bottom side.

7. Final Cleaning

Any flux residue left after soldering should be cleaned with isopropyl alcohol or a PCB cleaning solution. This prevents corrosion and improves reliability.

How to Test Components on a PCB?

Once the PCB is assembled, testing individual components confirms they are working and properly connected. You don’t always have to remove parts from the board—many can be tested in-circuit.

Testing Common Components:

Resistors: Measure resistance values across the component with a multimeter.
Capacitors: Use a capacitance meter or LCR meter. Electrolytics should be tested for leakage or swelling.
Diodes/LEDs: Use diode mode to check forward voltage. LEDs will glow slightly if working.
Transistors: Use a component tester or check base-emitter junctions with a multimeter.
Integrated Circuits: For complex ICs, test power and ground pins, and validate input/output behavior using a scope.

Note: Some components may give inaccurate readings in-circuit due to parallel paths. If readings are questionable, desolder one leg and test again.

What Are the 7 Types of PCB Testing Methods?

1. Visual Inspection

Used in early quality checks. Technicians or AOI systems look for visible defects like misalignment, poor soldering, and missing parts.

2. In-Circuit Testing (ICT)

A bed-of-nails fixture probes test points across the PCB. It checks resistance, capacitance, and signal paths individually. Best for high-volume manufacturing.

3. Flying Probe Test

A non-fixture alternative to ICT. Probes move automatically to check test points. Suitable for prototypes and small production runs.

4. Functional Testing

Simulates real-world operation. Inputs are applied, and outputs are measured to ensure the board works as expected.

5. Boundary Scan Testing

Used for densely packed ICs like BGAs. Tests internal connections and inter-chip communication using a special interface (JTAG).

6. Burn-In Testing

Applies power for extended periods under stress conditions. Helps detect early-life failures or unstable components.

7. Automated Optical Inspection (AOI)

High-speed cameras scan the board for defects after assembly. AOI systems compare images to a golden board and flag mismatches.

How to Find a Bad Component on a Circuit Board?

Finding a faulty component on a small PCB is part detective work, part experience. Here’s a logical way to do it:

1. Visual Clues

Burned areas, cracked packages, or leaked electrolytes are red flags. Look for parts that appear physically damaged or discolored.

2. Voltage Checks

Measure voltages across IC pins and power rails. An unexpected drop may point to a shorted capacitor or faulty regulator.

3. Thermal Inspection

Use a thermal camera or just touch carefully. A component heating abnormally might be shorted internally.

4. Signal Tracing

Use a scope or logic analyzer to trace where signals stop behaving correctly.

5. Component Testing

Compare suspect part readings to known-good values. Swap out parts if needed to confirm suspicion.

How Do You Identify Electronic Components on a Circuit Board?

Understanding how to identify components on a PCB helps in repairs, testing, and reverse engineering. Here are some methods that can help you to identify the components:

Look at the Silkscreen: Reference designators like R5 (resistor), C3 (capacitor), U2 (IC) help locate parts quickly.
Check the Values: Printed numbers often reveal resistance, capacitance, or voltage ratings.
Use Datasheets: For ICs and transistors, part numbers can be searched online for specs and pinouts.
Refer to Schematics: The design files give a complete map of how everything connects.
Use a Component Tester: These handheld tools can identify unknown parts and help verify pin functions.

About Best Technology

Best Technology is a leading PCB manufacturer and assembler in China, offering full-service solutions for small PCB fabrication, SMT assembly, and functional testing. We provide:

PCB prototyping and mass production
Turnkey assembly with DFM support
Functional and in-circuit testing
Full traceability via MES system
Fast quotes and professional engineering advice

If you need a reliable partner for assembling and testing PCBs, reach out to Best Technology today.

Common FAQs about PCB

1. Can I assemble a small PCB at home?

Yes, with the right tools like a soldering iron, tweezers, magnifier, and steady hands, you can assemble small PCBs manually.

2. What’s the safest way to test a new PCB?

Start with a multimeter check for shorts, then use a bench power supply with current limiting to test under controlled conditions.

3. Can I use AOI on low-volume runs?

Manual inspection is more cost-effective for low volumes, but desktop AOI systems are now affordable for small labs.

4. How do I avoid soldering errors on small PCBs?

Use a stencil for even paste application, magnification to inspect, and reflow ovens with the right temperature profile.

5. Do I need ICT or flying probe testing?

ICT is better for large batches. Flying probe is ideal for prototyping or small batch production without custom fixtures.

What Is the PCB Fabrication?

The PCB fabrication process refers to the entire set of procedures used to manufacture a bare printed circuit board from your PCB design files —such as Gerbers, ODB++, or IPC-2581 formats—into an actual bare board ready for assembly. It involves a sequence of tightly controlled steps including inner layer imaging, etching, lamination, drilling, plating, outer layer imaging, surface finishing, and final testing.

The fabrication process must be precise and tightly controlled to avoid defects like layer misalignment, incomplete vias, or inconsistent impedance — all of which can cause failures.

Step-by-Step of the PCB Fabrication Process

Step 1: Engineering Preparation (DFM & CAM)

Before any physical process begins, the fabrication team conducts a Design for Manufacturability (DFM) review. This ensures your files comply with the manufacturer’s capabilities. Then, Computer-Aided Manufacturing (CAM) software analyzes and prepares files for production. This step includes:

Layer stackup analysis
Drill file optimization
Netlist extraction
Gerber validation

Step 2: Inner Layer Imaging

Each inner copper layer is made from a copper-clad laminate coated with a light-sensitive photoresist. Laser Direct Imaging (LDI) is used to expose the desired circuit pattern onto the photoresist. After UV exposure, unexposed areas are washed away during the developing stage, revealing the copper trace pattern underneath.

Step 3: Etching and Resist Stripping

The exposed copper is chemically removed using an etching solution, such as ammonium persulfate. The hardened photoresist protects the copper that should remain. Once etching is complete, the photoresist is stripped, leaving the final copper trace layout on the inner layers.

Step 4: Inner Layer Inspection and Punching

Automated Optical Inspection (AOI) is performed on every inner layer to detect shorts, opens, or width variations. Once approved, layers are optically punched with precise targets to ensure perfect layer-to-layer registration during lamination.

Step 5: Oxide Coating for Bonding

Before lamination, an oxide treatment (or alternative bonding method like black oxide or oxide alternative) is applied to increase the surface roughness of the copper. This improves resin adhesion and mechanical strength between layers.

Step 6: Lamination

Layers of copper-patterned cores and prepregs are stacked in sequence based on the final stack-up design. Using a lamination press, heat and pressure bond these materials into a multilayer PCB. Any layer shift during this step can lead to catastrophic misalignment, so precise registration is essential.

Step 7: Drilling

Drilling creates the interconnections between layers, including through-holes and vias. High-speed CNC drilling machines are used for standard holes, while laser drilling is employed for microvias in HDI PCBs. After drilling, panels undergo deburring and desmearing to clean the hole walls.

Step 8: Electroless Copper Plating

The drilled holes are non-conductive at first, so a thin layer (~1 µm) of copper is deposited chemically on the entire panel surface and hole walls. This electroless copper plating is critical for enabling conductivity across the board layers.

Step 9: Outer Layer Imaging and Electroplating

Outer layers are also coated with photoresist and exposed via LDI, defining where copper should remain. After exposure and development, the board is electroplated with copper to build up the outer traces and fill via holes. A tin plating is then applied as a temporary etch resist.

Step 10: Outer Layer Etching and Tin Stripping

The exposed areas (not protected by tin) are etched to remove excess copper. Once the etching is completed, the tin is chemically stripped, leaving behind the precise copper pattern for the outer layers.

Step 11: Solder Mask, Silkscreen, and Surface Finish

The board is coated with solder mask to insulate and protect copper traces while preventing solder bridges during assembly. Then, silkscreen (legend) is printed to mark component reference designators. Finally, a surface finish is applied to all exposed pads to improve solderability and protect against oxidation. Typical finishes include:

ENIG (Electroless Nickel Immersion Gold)
HASL (Hot Air Solder Leveling)
Immersion Silver
Hard Gold Plating
Soft Gold Plating
OSP (Organic Solderability Preservative)

Step 12: Electrical Testing

All fabricated boards undergo electrical testing to validate circuit continuity and isolation. This includes:

Open/short detection
Impedance testing (for high-speed circuits)

Test methods like flying probe or bed-of-nails based on volume and complexity

These tests confirm that the final PCB functions exactly as designed.

Step 13: Profiling, Routing, and V-Scoring

The final step in the PCB fabrication process is mechanical profiling. Boards are separated from the panel using CNC routing, V-cutting, or punching, depending on panelization methods. This step defines the exact outer dimensions of each PCB, matching the customer’s mechanical drawing.

Quality Control in the PCB Fabrication Process

Quality control (QC) is a vital part of the PCB fabrication process, ensuring that every board meets design specifications and performance standards. At each stage of production, rigorous testing and inspections are carried out to prevent defects and maintain reliability.

Key quality control practices include:

Design Rule Checks (DRC): Performed during CAM to validate trace width, spacing, hole size, and stack-up consistency before fabrication begins.
Automated Optical Inspection (AOI): Used after inner layer imaging and etching to catch shorts, opens, and trace issues.
X-ray Inspection: Applied in multilayer and HDI boards to verify layer registration and detect internal via or plating problems.
Solder Mask Registration Check: Ensures that the solder mask aligns properly with the copper pads to avoid bridging.
Surface Finish Evaluation: Verifies the integrity and thickness of ENIG, HASL, or OSP finishes.
Electrical Testing (E-Test): Confirms electrical connectivity of all nets and absence of shorts through flying probe or bed-of-nails testing.
Final Visual Inspection: Technicians visually inspect the board for cosmetic defects like solder mask smearing, silkscreen blurring, or mechanical damage.

PCB Fabrication Process, PCB Manufacturer in China

At Best Technology, we implement a 100% inspection rate before shipping, including impedance control and dimensional verification, supported by ISO9001, ISO13485, IATF16949, and AS9100D certifications.

Common Challenges and How to Avoid Them in PCB Fabrication

The PCB fabrication process involves over a dozen tightly coordinated steps, and even minor deviations can lead to functional failures or yield loss. Understanding the most common challenges — and how to prevent them — is crucial for design engineers and buyers alike.

1. Layer Misalignment

During lamination, even slight misregistration between inner layers can cause via breakout or impedance drift. This is often due to poor tooling, inaccurate punching, or thermal distortion. To avoid this, manufacturers must use optical punching systems and tightly control temperature profiles during lamination.

2. Inconsistent Plating in Through-Holes

Uneven plating thickness can result in poor conductivity or cracking under thermal stress. This typically stems from incorrect bath chemistry or poor hole preparation. Electroless copper plating, followed by well-regulated electrolytic plating, is essential to create reliable interconnects.

3. Solder Mask Misalignment

If the solder mask isn’t accurately registered, it can expose traces or cover pads, leading to solder bridging or poor wetting. Using laser direct imaging (LDI) for solder mask improves accuracy significantly.

4. Etching Defects

Over-etching narrows traces; under-etching leaves shorts between conductors. These issues often arise from aged chemistry or poor agitation. Manufacturers must maintain strict control over etching parameters and regularly calibrate their lines.

5. Warpage in Multilayer Boards

High-layer count PCBs or boards with uneven copper distribution may warp during lamination or reflow. This is mitigated by symmetrical stack-up design and consistent copper balancing.

The best way to avoid these issues is to partner with a manufacturer who offers early-stage engineering review, real-time process monitoring, and full transparency during production.

How to Choose a Reliable PCB Fabrication Partner?

1. Your manufacturer must be able to support your design complexity — whether it’s HDI, controlled impedance, via-in-pad, or metal-core PCBs. Check their minimum trace/space, layer count, and material compatibility before proceeding.

2. An experienced fabrication partner doesn’t just produce what you send. They should actively review your design, feedback EQ (engineer question) file, flag manufacturability concerns, and suggest layout improvements. Free DFM review, stack-up optimization, and impedance modeling are key indicators of a capable supplier.

3. Leading manufacturers use MES system to track each step of your order — from raw material to final inspection.

4. Ask your PCB manufacturer: Can you reach an engineer when issues arise? Do you get weekly updates or have to follow up multiple times? A strong partner maintains open, proactive communication, especially for urgent or high-reliability projects.

5. Choose a PCB fabrication partner who can handle both quick-turn prototypes and volume production.

Best Technology is a leading PCB manufacturer in China, we help customers from prototyping to mass production with:

✅ 24-hour quick turn

✅ Competitive pricing

✅ Full traceability using MES systems

✅ Engineering support for stack-up, impedance, and DFM

Whether you’re designing a six-layer communication board or a single-layer aluminum LED module, we can support every stage of your PCB fabrication process.

Frequently Asked Questions (FAQ)

1. What’s the difference between PCB fabrication and PCB assembly?

Fabrication creates the bare board; assembly mounts components onto it.

2. How long does the PCB fabrication process take?

Standard lead times are 5–7 days, but quick-turn options (24–48 hours) are available.

3. Which surface finish should I choose for my PCB?

ENIG is preferred for SMT and fine-pitch components; HASL works well for through-hole.

4. Can I request a custom stack-up for impedance control?

Yes, Best Technology supports custom stack-ups for RF, high-speed, and HDI boards.

5. How much does the PCB fabrication process cost?

Costs depend on layer count, board size, materials, surface finish, and lead time.

What Is a Printed Circuit Board?

A printed circuit board (PCB) is the backbone of nearly all electronic systems. It’s a flat board that holds and connects electronic components using conductive tracks, pads, and vias etched from copper sheets laminated onto a non-conductive substrate. Common materials include FR4, ceramic, aluminum, and polyimide.

PCBs come in many forms: single-sided, double-sided, and multilayer PCB, supporting everything from simple gadgets to complex military electronics. Their role is simple yet critical: provide physical support and reliable electrical connections.

How to Design a PCB Board?

The PCB design phase sets the tone for the entire lifecycle. It begins with defining the schematic, which maps out the electronic connections between components. Once that’s ready, designers move to layout – placing components and routing traces.

Key steps include:

Creating schematics using software like Altium Designer, KiCAD, or Eagle.
Assigning footprints to components for proper placement.
Defining board dimensions, layer stack-up, and signal flow.
Routing signals with attention to trace width, impedance, and clearance.
Adding vias, copper pours, and power planes for optimal performance.
Design Rule Check (DRC) to verify spacing, trace width, and other constraints.
Generating Gerber files, which are the manufacturing blueprints.

Printed Circuit Boards: PCB Design, Fabrication, Assembly and Testing

Each design must balance space, power, heat, cost, and manufacturability. One overlooked detail could delay your entire project.

Considerations During PCB Design Phase

Designers must juggle multiple variables beyond schematic accuracy. Here are essential considerations to optimize performance and reduce failure risks:

1. Component Placement: Keep analog, digital, and power circuits separate to reduce interference. Group related components logically to minimize trace lengths.

2. Signal Integrity: For high-speed designs, impedance matching, differential pair routing, and minimizing crosstalk are vital.

3. Thermal Management: Use thermal vias, copper pours, and heat sinks to handle heat dissipation—especially in power electronics.

4. Design for Manufacturability (DFM): Ensure trace width, drill sizes, and clearances match manufacturer capabilities.

5. EMC and EMI Compliance: Ground planes, shielding, and filtering components help meet regulatory standards.

6. Mechanical Constraints: Don’t overlook mounting holes, connector alignment, or enclosure fit. These small details can turn into costly errors later.

Good design minimizes rework, improves lifespan, and lowers costs across production.

Full PCB Fabrication Process – Step by Step

Once the design is complete, the PCB fabrication process turns digital files into a tangible board. Here’s how it happens:

1. Material Selection

The manufacturer selects base materials like FR4, aluminum, or ceramic depending on thermal, mechanical, and electrical requirements.

2. Inner Layer Imaging (for Multilayer PCBs)

Each inner copper layer is patterned with the circuit using photoresist, UV exposure, and etching techniques.

3. Lamination

The etched inner layers are stacked and laminated under heat and pressure, forming a solid multilayer structure.

4. Drilling

Holes are drilled to create vias for electrical connections between layers. Laser drilling is used for microvias.

5. Plating and Copper Deposition

Holes are plated with copper using electroplating to ensure conductivity across layers.

6. Outer Layer Imaging

Outer copper layers are patterned similar to the inner layers using photoresist and etching.

7. Solder Mask Application

A solder mask is applied to insulate the board and protect traces, leaving pads and holes exposed for soldering.

8. Silkscreen Printing

Component labels, logos, and reference indicators are printed on the board.

9. Surface Finish

A surface finish like HASL, ENIG, OSP, or Immersion Silver is applied to exposed copper pads to protect them and improve solderability.

10. Electrical Testing

Flying probe or bed-of-nails tests check for open circuits and shorts.

Common PCB Assembly Issues During Manufacturing

During PCB assembly, components are mounted and soldered onto the board. This phase can be manual or automated using SMT (surface-mount technology) and THT (through-hole technology).

But several issues can disrupt this process:

1. Tombstoning: A component lifts on one side during reflow, causing connectivity failure.

2. Solder Bridges: Excess solder connects two pins unintentionally, leading to short circuits.

3. Cold Joints: Poor soldering results in weak mechanical bonds and unreliable connections.

4. Misaligned Components: Incorrect placement, often caused by poor paste application or pick-and-place calibration.

5. PCB Warping: Thin or large boards may bend during reflow, affecting soldering and mechanical integrity.

6. Component Damage: Excessive heat or mishandling can destroy delicate ICs or capacitors.

Quality control, professional assembly lines, and well-prepared Gerber + BOM files help avoid these issues.

How to Test Printed Circuit Boards?

After assembly, PCB testing ensures the product works before final integration. There are several testing levels depending on the application and budget:

1. Visual Inspection

The simplest method. Engineers check for physical defects like solder bridges, missing components, or alignment issues.

2. Automated Optical Inspection (AOI)

AOI uses cameras to scan boards for soldering quality, polarity, and presence of components.

3. In-Circuit Testing (ICT)

Tests each component’s electrical characteristics by probing specific test points. It’s fast and accurate for large-volume production.

4. Flying Probe Testing

Uses robotic probes to test low-to-medium volume PCBs without the need for custom fixtures.

5. Functional Testing (FCT)

Verifies the complete assembled PCB in real-world operating conditions. Essential for high-reliability applications.

Testing isn’t optional—it’s critical. Faulty boards cost time, money, and customer trust.

Why Consider Best Technology’s Turnkey Service?

If you’re tired of juggling multiple vendors for PCB design, fabrication, assembly, and testing, Best Technology offers a full turnkey PCB service that simplifies the process.

Here’s why clients worldwide trust us:

◎ Technical Support Before & After Sales

◎ Prototype & Small Volume Welcome

◎ Quick Turn-out, On-time Delivery

◎ High Quality, Special Request Available

◎ Strong R&D Team, Know How-To

◎ Rich Experience (>13 Years)

◎ Prompt Feedback (within 12H)

◎ One-stop Service (PCBA/Assembly)

Conclusion

Printed circuit boards are at the heart of modern electronics, and getting the design, fabrication, assembly, and testing right is non-negotiable. Each step has its role—and skipping or rushing any part can lead to costly failures.

Whether you’re building a simple sensor or a complex industrial controller, choosing a partner like Best Technology can make the journey smoother. We understand what engineers, startups, and procurement teams need: fast delivery, quality control, and transparent communication.

FAQs

1. What software is used to design PCBs?

Tools like Altium Designer, Eagle, KiCAD, and OrCAD are commonly used for schematic and PCB layout.

2. How long does PCB fabrication take?

Standard fabrication takes 3–7 days. Express services can deliver in 24–48 hours depending on complexity.

3. What is the difference between PCB and PCBA?

PCB is the bare board. PCBA is the board after components are assembled and soldered.

4. How much does PCB assembly cost?

Costs vary based on quantity, complexity, part types, and whether parts are sourced by the manufacturer or supplied by the customer.

5. Does Best Technology support low-volume PCB manufacturing?

Yes. We support both low and high-volume production and offer prototyping services for new designs.

What Is PCB Contract Manufacturing?

PCB contract manufacturing is a process where companies outsource the production of printed circuit boards to a third-party manufacturer. This includes not just making the board, but also assembling components, running functional tests, and sometimes even final product packaging. It allows companies to focus on core tasks like product development and marketing, while the technical side of electronics production is handled by experts.

At its core, PCB contract manufacturing saves time, reduces production costs, and ensures consistency in quality. For startups and global electronics brands alike, finding a dependable contract manufacturer can significantly boost speed-to-market and reduce project risks.

High-quality PCB Contract Manufacturing Service

Our Printed Circuit Board Services

At Best Technology, we offer a complete range of services under one roof. Whether you’re developing a new electronic product or scaling up production, we handle everything from the initial design to final functional testing. Here’s what we bring to the table:

PCB Layout & Design

We help you start from scratch or improve your existing Gerber files. Our layout team is experienced in high-density routing, impedance control, and EMC-compliant designs. With tools like Altium Designer and CAD, we ensure accurate and efficient PCB layouts tailored to your project needs.

OEM & ODM PCB Manufacturing

Whether you need OEM or ODM service, we have the capability to take your concept and turn it into a working product. Our engineering team collaborates closely with clients to deliver custom solutions that are production-ready.

Electronic Components Assembly

From SMT (Surface Mount Technology) to through-hole assembly, our facility is equipped for full-scale PCBA (Printed Circuit Board Assembly). We support both leaded and RoHS-compliant assembly and offer automated inspection (AOI), X-ray, and BGA rework services to guarantee every joint is solid and reliable.

Wire Harness Assembly

We also supply PVC/PE/TPU/LZSH hook-up wire, flat cable, connector wire harness for machinery equipment, and cables for the field of electronic appliances, DC power supply, audio video devices, toys, medical equipment, communication devices, electrician & electrical, computer accessories cable, and so on.

Box Building Assembly

We don’t stop at the board level. If you need enclosure integration, cable harnessing, or full unit assembly, our box building assembly service is available. This end-to-end solution simplifies your supply chain and gives you more control over the finished product.

Functional Testing

We provide full functional testing based on your test procedure or help you develop one. This includes power-on tests, signal integrity verification, and custom fixture testing. We ensure your board works perfectly before it reaches your customers.

What PCBs We Can Fabricate?

Our team at Best Technology specializes in a wide range of printed circuit board types. No matter your project’s complexity or environment, we’ve got you covered. Here are some products that we can make, but not limited to these PCBs.

Extra Thin PCB

For devices that require tight packaging like smart cards, cameras, or medical sensors, we offer ultra-thin PCBs as thin as 0.1mm. These boards maintain strength while saving space.

HDI PCB

High-Density Interconnect (HDI) PCBs support advanced electronics with fine-pitch components, blind and buried vias, and micro-via-in-pad technology. These are perfect for smartphones, tablets, and compact IoT devices.

RF PCB

We manufacture RF (Radio Frequency) PCBs using low-loss materials like Rogers, Taconic, and PTFE laminates. These boards are designed for wireless communication, antennas, and radar systems, where signal clarity matters most.

Heavy Copper PCB & Busbar PCB

When high current is involved, such as in automotive or industrial power supplies, heavy copper and busbar PCBs are necessary. We can produce boards with copper thickness from 2oz to 20oz, ensuring excellent thermal and electrical performance.

Metal Core PCB

For LED lighting and power conversion applications, our metal core PCBs (MCPCBs) provide efficient thermal dissipation. Aluminum and copper cores are both available depending on your thermal and mechanical needs.

Ceramic PCB

Using materials like aluminum nitride and alumina, ceramic PCBs deliver outstanding heat resistance and insulation. We have mature manufacturing technologies, including: Thick film ceramic PCB, thin film ceramic PCB, AMB ceramic PCB, DBC & DPC ceramic PCB, HTCC & LTCC ceramic PCB.

Flex Circuit & Rigid-Flex PCB

Flex circuits offer excellent bendability, reducing connectors and saving space. Rigid-flex PCBs combine the best of both worlds and are widely used in wearables, drones, and other portable electronics.

High-Speed PCB

We design and produce high-speed PCBs with controlled impedance, low-loss materials, and proper stack-ups. These are ideal for applications like 5G networks, servers, and high-frequency digital communication.

High TG PCB

When operating temperatures exceed 170°C, High-TG (glass transition temperature) PCBs are the right choice. These boards are more stable thermally and mechanically, perfect for automotive and industrial applications.

IC Substrate

We also support packaging solutions with IC substrates that act as a bridge between chips and PCBs. Our substrates offer fine-line traceability and are used in semiconductor packaging.

Ceramic Packages

Ceramic packages provide superior hermetic sealing and thermal cycling endurance. These are used to package sensitive ICs in defense, aerospace, and critical medical applications.

FR4 PCB Capability in Best Technology

At Best Technology, we offer a wide range of FR4 PCBs — the most common material in the PCB industry — from consumer electronics to industrial control systems and automotive electronics. Whether it’s single-sided, double-sided, or multi-layer (up to 40 layers), we provide:

✅ General Capabilities

Layer Count: 1–40 layers
Board Size: Up to 580mm × 1200mm
Board Thickness: 0.2mm to 3.2mm
Copper Thickness: 0.5oz to 6oz (outer), 0.5oz to 3oz (inner)
Finished Hole Size: ≥ 0.10mm
Minimum Line Width / Spacing: 3mil / 3mil (0.075mm)
Aspect Ratio: Up to 12:1
Impedance Control: ±10% or better

✅ Material Options

Standard FR4: Tg135°C
High-TG FR4: Tg170°C to Tg180°C
Halogen-Free FR4: Environmentally friendly for RoHS/REACH applications
Low Dk/Df FR4: For better signal performance in high-speed circuits

✅ Surface Finishes

HASL (Hot Air Solder Leveling) – Leaded & Lead-free
ENIG (Electroless Nickel/Immersion Gold)
OSP (Organic Solderability Preservatives)
Immersion Tin / Immersion Silver
ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)
Gold Finger (with beveling & plating options)

✅ Solder Mask & Silkscreen

Solder Mask Colors: Green, Blue, Red, Yellow, Black, White, Purple, Matte options
Silkscreen Colors: White, Black, Yellow
Solder Mask Thickness: 7–40μm
Min Solder Mask Dam: 0.075mm (3mil)

✅ Drilling & Via Types

Mechanical Drilling (for standard vias and plated holes)
Laser Drilling (for microvias and blind/buried vias)
Via Filling & Capping (VIPPO: via-in-pad plated over)
Tented, Plugged, and Stacked Vias for HDI applications

✅ Special Capabilities

Controlled Impedance Tolerance: ±10% (custom up to ±8%)
Edge Plating / Castellation
Countersinks & Counterbores
Peelable solder mask
Carbon ink printing (for jumpers, contact pads, etc.)
Via tenting, filling, and plugging with resin

✅ Electrical Testing & Inspection

100% E-test (Flying Probe or Bed of Nails)
AOI (Automated Optical Inspection)
X-ray for BGA and inner layers
ICT, FCT, and aging testing available

With a monthly capacity of over 30,000 square meters and a 98% on-time delivery rate, our FR4 line is built to serve both prototypes and mass production.

Certifications & Quality Assurance in PCB Manufacturing

At Best Technology, quality isn’t just a goal — it’s a standard built into every step of our manufacturing process. To ensure compliance with international regulations and industry-specific requirements, we maintain a comprehensive set of certifications, including:

ISO 9001:2015 – Quality Management System
ISO 13485:2016 – Medical Device Quality System
IATF 16949:2016 – Automotive Quality Management
AS9100D – Aerospace & Defense Quality Management
UL Certification
RoHS & REACH Compliance
IPC Standards Compliance – IPC-A-600 and IPC-A-610 Class 2 & Class 3 for PCBfabrication and assembly

One-Stop High-Quality PCB Contract Manufacturer

When you’re looking for a reliable partner to handle your PCB contract manufacturing, Best Technology is ready to deliver more than just boards. We provide full-service support — from design to delivery — with speed, precision, and attention to detail.

We offer a complete solution that includes PCB fabrication, components sourcing, assembly, testing, and even box build — all under one roof. That means you don’t have to juggle multiple suppliers or waste time coordinating between factories. You get a dedicated project manager, clear communication, and consistent quality from start to finish.

Here’s why companies from over 80 countries trust us with their PCB contract manufacturing needs:

Engineering Support: this isn’t traditional engineer support, in Best Technology, every sales are engineer, they are professional so that can save much time on design communication and can give you the best solutions.
Fast Turnaround: we offer quick-turn prototyping (as fast as 24 hours) and competitive lead times for volume production.
Global Shipping: Whether you’re in the US, Germany, Japan, or Australia, we ship your orders promptly with DHL, FedEx, UPS, air & ocean shipment.
Traceability System: Our ERP system keeps detailed records for every board we produce, offering transparency and traceability.
WIP Update Every Week: Every customer can enjoy one-to-one sales-assistant service, they will update the product status & share videos every week for you, so that you can closely to your PCBs.

Cost-Effective Solutions: With advanced production lines and a mature supply chain, we provide cost-effective options without sacrificing quality.

PCB contract manufacturing can significantly reduce your product development cycle and overhead. By partnering with a professional and certified provider like Best Technology, you ensure every step — from PCB layout to functional testing — meets your project goals with precision and speed.

Whether you need a simple FR4 board or a high-performance ceramic PCB, our comprehensive services and commitment to quality make us a trusted choice for businesses around the world.

Frequently Asked Questions

1. What industries does Best Technology serve?

We serve a broad range of industries including medical, automotive, aerospace, telecom, and consumer electronics.

2. Can Best Technology support low-volume or prototype orders?

Yes, we support both small-batch prototypes and high-volume production with flexible minimum order quantities.

3. Do you offer component sourcing services?

Absolutely. We have partnerships with authorized distributors to source genuine components and manage the BOM for you.

4. What file formats do you accept for PCB layout?

We accept Gerber, ODB++, and other formats such as Altium, Eagle, and CAD-based files.

5. How can I request a quote for PCB contract manufacturing?

Simply send your files and requirements via our online form or email, and our sales team will get back to you within 24 hours.

Why Panelization Matters in PCB Manufacturing?

Panelization refers to arranging multiple PCB designs onto a single manufacturing panel (or “array”) for batch processing. Key benefits include:

Reduced material waste: Maximizing panel space utilization.
Faster assembly: Enabling automated pick-and-place machines to process multiple boards simultaneously.
Lower handling costs: Fewer individual boards to manage during fabrication and assembly.

However, suboptimal panelization can lead to:

Warpage during soldering.
V-score or routing errors.
Increased breakage during depaneling.

6 Tips to Optimize PCB Panelization

Base on our 19+years experiences in the PCB manufacturing field, today I would like to share you 6 Strategies to Optimize PCB Panelization

1. Choose the Right Panel Size

Align your PCB dimensions with standard panel sizes (e.g., 18″x24″, 21″x24″) to minimize material trimming.
Example: If your board is 80mm x 60mm, arrange 4×6 units on a 324mm x 480mm panel to reduce unused space.

2. Optimize Board Arrangement

Rotation: Rotate boards to fit more units per panel.
Mirroring: Use symmetrical designs to avoid “wasted” gaps.
Nesting software: Leverage tools like CAM350 to automate optimal layout generation.

3. Select the Best Depaneling Method

The choice of depaneling (separating individual boards) affects yield and edge quality:

V-Score: Low cost and fast, but requires straight edges and may weaken boards.
Tab Routing: Ideal for irregular shapes but adds milling time.
Laser Cutting: Precision for high-density designs, but higher cost.

Rule of thumb: Use V-score for rectangular boards and routing for complex shapes.

4. Add Breakaway Tabs and Mouse Bites

Breakaway tabs: Small connectors between boards to prevent movement during assembly.
Mouse bites: Perforated holes for easy manual separation.
Spacing: Maintain 1.5–2mm between boards to avoid solder mask bridging.

How to Optimize PCB Panelization for Higher Yield and Lower Cost?

5. Incorporate Fiducials and Tooling Holes

Add global fiducials to the panel for accurate alignment during SMT assembly.
Include tooling holes (3.2mm diameter) to secure the panel during drilling and routing.

6. Balance Quantity vs. Risk

Overcrowding panels increases the risk of cross-board defects.
Underutilizing panels raises material costs.
Recommended: Aim for 4–20 boards per panel, depending on size and complexity.

Case Study: Cost Savings Through Smart Panelization

A consumer electronics manufacturer redesigned their 50mm x 50mm IoT module panel:

Initial design: 8 boards/panel with 15% wasted space.
Optimized design: 12 boards/panel using rotated layouts and shared tooling holes.
Results:
- 15% reduction in material costs.
- 10% faster SMT assembly.
- Fewer depaneling errors due to improved tab routing.

Common Panelization Mistakes to Avoid

Ignoring manufacturer capabilities: Always consult your PCB fab’s panel size and tolerances.
Overcomplicating shapes: Complex panels increase milling time and scrap rates.
Skipping test coupons: Include test patterns for impedance control and quality checks.

Conclusion

Optimizing PCB panelization requires a balance of geometric efficiency, process knowledge, and collaboration with manufacturers. By implementing these strategies, you can reduce waste, improve yields, and lower production costs without compromising quality.

Pro Tip: Use panelization-specific design rules in tools like Altium or KiCad to automate compliance checks.

Also, if you want to know more about how to optimize PCB Panelization for Higher Yield and Lower Cost, please feel free to inquiry from us.

What Is a Mobile Phone PCB?

A mobile phone PCB is the core of your smartphone, which drives your phone be intelligent. It looks like a green or black plate populated with many small electronic parts. These components are connected through thin copper lines etched onto the board. Together, they power your phone and make sure each part works smoothly.

In smartphones, the PCB board mobile phone is usually a multi-layer board, meaning it has several layers stacked together. This design helps save space and supports high-speed data processing. The PCB also holds all essential parts like the processor, memory, charging port, and wireless chips.

What Does a Mobile Phone PCB Actually Do?

A mobile phone PCB acts like the brain and nervous system, it mainly used to connect and manage every part of the phone, its working principle is:

Power distribution: It sends power from the battery to other parts.
Signal transmission: It lets the processor talk to the screen, camera, and sensors.
Component support: It holds everything in place and keeps them working together.

Without the mobile phone PCB, the battery wouldn’t know how to charge, the screen wouldn’t respond, and the speaker wouldn’t play music. It handles all the behind-the-scenes activity while you use your apps and make calls.

Mobile Phone PCB Prototype, Mobile Circuit Boards Manufacturer

Core Components on a Mobile Phone PCB

A mobile phone PCB always is a populated PCB. At the top of the PCB, you’ll find the antenna point, where the antenna connects. Your phone connects to Wi-Fi, Bluetooth, and cellular networks through these antennas. Each component on the PCB plays its unique role:

Antenna Switch: A 16-leg switch that controls signal direction. Sometimes built together with the PFO.
PFO (Power Frequency Oscillator): Manages signal frequency. Found next to the antenna switch.
Network IC: Controls mobile network functions. In some phones, it’s built into the CPU.
Power IC: Found near brown capacitors. Regulates power across the PCB.
CPU (Processor): The largest IC. Handles all system commands and performance tasks. Some phones have two CPUs.
Flash IC: Stores system data and software. Located beside the CPU.
Logic IC: A 20-pin chip. Manages basic logic operations.
Charging IC: Found beside R22. Controls battery charging.
Audio IC: Controls sound functions. Placed close to the Power IC.
Capacitors: Store and release electrical energy. Help stabilize power supply.
Resistors: Control the flow of current. Protect other parts from too much power.
Diodes: Allow current to flow in one direction only. Prevent power damage and signal errors.

Below is a multi-layer PCB used in iphone. These parts make it possible for you to browse, take photos, and connect with the world.

Why Multi-layer PCBs Are Standard in Smartphones?

Today’s smartphones are like mini computers. They handle everything from streaming video to running powerful apps. To keep up, mobile phone PCB design has evolved. One of the biggest upgrades? The switch to multi-layer PCBs. Here we listing main advantages of using multi-layer PCBs in mobile phone.

Firstly, multi-layer PCBs offer higher circuit density, allowing more components like processors and memory to fit in the limited space. For example, the iPhone 14 Pro uses a 10-layer PCB to deliver powerful functionality in a compact design.

Secondly, they improve high-speed signal transmission by reducing interference through ground and shielding layers, ensuring stable and fast data transfer—a must for modern smartphones.

Additionally, multi-layer PCBs reduce the size and weight of smartphones. By accommodating more circuits in the same area, they help achieve smaller, lighter designs, like in the Apple Watch Series 8.

Finally, multi-layer PCBs enhance reliability and mechanical strength. Their complex construction improves durability and vibration resistance, ensuring a longer-lasting product.

How Inner and Outer Layers Interact in a Mobile PCB Stack?

In a mobile PCB board, the inner and outer layers work together like a team. The outer layers handle the connection of chips, antennas, and components you can see. Meanwhile, the inner layers manage signal traces, power distribution, and ground planes.

Signals often travel between these layers through vias—small holes filled with metal that link one layer to another. This allows for faster, cleaner communication between the mobile PCB components, such as the CPU, RAM, and radio circuits.

Materials Used in Mobile PCB Board

Choosing the right materials is crucial in mobile phone PCB manufacturing. Each layer and part of the board serves a different purpose, so engineers carefully select materials to match performance needs, durability, and size constraints. Here’s a comparison of commonly used mobile PCB materials:

Material	Description	Pros	Common Use in Mobile PCB
FR4	Fiberglass-reinforced epoxy laminate	Cost-effective, stable electrical properties	Base material in most mobile PCB cores
Polyimide	Flexible and heat-resistant material	Great for flexible PCBs and foldable applications	Used in camera modules, folding phones
Rogers	High-frequency laminate	Low dielectric loss, excellent RF performance	Antenna sections, 5G, Wi-Fi, Bluetooth
Teflon (PTFE)	Non-stick, high-performance polymer	Ultra-low signal loss, ideal for high-speed signals	Used in high-speed communication layers
Ceramic	Advanced inorganic composite	Excellent heat dissipation, high frequency stability	Power modules, 5G RF front-end, shielding

PCB Layout Basics for Mobile Phones

A solid layout is the backbone of any mobile phone PCB. Designers start with the schematic, which maps every component and connection. Mobile PCB layout focuses on a few key goals:

Short signal paths to avoid delay.
Clear power and ground planes for stability.
Thermal zones to manage heat.
Shielded areas for RF sections like Wi-Fi and GSM modules.
Placing the processor, RAM, power management ICs, and antennas carefully prevents problems later.

Warm tips:

Keep power and ground layers as solid planes. Avoid breaks or thin sections, which create voltage drops. Also, decoupling capacitors should sit close to power pins of chips.

Tips for GSM, Wi-Fi, Bluetooth, and 5G Mobile PCB Antennas

Keep antennas away from metal—metal blocks signals.
Use ground clearance around antenna traces to reduce noise.
Match impedance of the RF trace to avoid reflection.
Add shielding near high-speed digital lines to prevent signal loss.

For 5G, which uses millimeter-wave bands, the routing must be super precise. Even a few millimeters can affect signal strength. Tools like electromagnetic simulation software help refine these paths.

How AI and Automation Are Changing PCB Layout?

AI and automation have brought big changes to mobile PCB design in this two year. Instead of placing parts manually, designers can now rely on smart layout tools that optimize paths automatically. Machine learning predicts optimal routing paths. Automation assists in component placement, thermal analysis, and EMI reduction. They suggest better placements in seconds—saving hours of work.

AI also speeds up mobile PCB testing. It spots defects on boards using image recognition. That means more accurate inspections, less rework, and faster production.

As AI tools improve, they’ll continue to reduce errors, cut costs, and deliver better mobile board designs. It’s a leap forward for the industry.

What Does Best Technology Serve You?

At Best Technology, we provide complete solutions for mobile PCB design and manufacturing. Whether you’re developing a new smartphone, tablet, or wearable device, we help you build it from the ground up. Our services including but not limited to:

Custom mobile phone PCB layout and design based on your needs
Single-layer to 32+ layer boards, including HDI, rigid-flex, and high-frequency options
Advanced material selection such as FR4, polyimide, Rogers, and BT epoxy
Rapid prototyping and small-volume production with quick delivery
Full testing services like AOI, flying probe, impedance, and X-ray inspection

With over 18 years in the PCB industry, we’ve supported top-tier brands in building reliable, high-performance mobile electronics. Our team works closely with customers and give the best suggestions to optimize your mobile circuit board design. If you are interested in the mobile PCB develop, you are welcome to contact our team at sales@bestpcbs.com.

FAQs

1. What does a mobile phone PCB diagram show?

It shows where each component is placed on the board and how they are connected through copper traces.

2. How can I avoid power issues in PCB layout?

Use ground planes, short power paths, and place capacitors close to chips for voltage stability.

3. How do I identify damaged parts on a mobile PCB?

Use thermal cameras, multimeters, and reference schematics to locate shorted, burned, or faulty components.

4. What makes Best Technology a strong mobile PCB manufacturer?

They provide full-stack design-to-production all in one service, expert engineering support, DFM check, SI, PI analysis and a proven track record in mobile electronics.

What is Copper Foil PCB?

A copper foil PCB is a type of printed circuit board where copper foil is laminated onto the base material to form the conductive layer. This copper layer is what carries electrical signals and power between different parts of the board. Without it, a PCB wouldn’t function at all.

The copper is typically applied through lamination, where thin sheets of copper foil are bonded to a substrate, usually made of fiberglass-reinforced epoxy resin like FR4. This copper layer is then etched to create precise paths, known as traces, that connect components across the board.

There are also different thicknesses of copper foil used, which affect the board’s ability to carry current and dissipate heat. The standard thickness is usually 1 oz/ft² (about 35μm), but heavier copper options like 2 oz or 3 oz are often used in power electronics or high-temperature applications.

Copper Foil PCB | HTE vs RTF Copper Foil | Copper Foil PCB Manufacturers

What is the Purpose of Copper Foil in PCB?

The main role of copper foil is to carry electric current across the circuit. It’s the path for data, signals, and energy. Without copper foil, there would be no communication between components.

Besides that, copper foil helps in thermal transfer. When current flows, heat is generated. Copper helps in spreading this heat evenly, reducing hot spots. That’s key in designs with dense parts or power-hungry chips. Also, copper layers add mechanical strength to the board, supporting solder joints and reducing flex.

What are the Different Types of Copper Foils?

Copper foil types vary based on how they’re made, how rough they are, and what kind of performance they offer in real PCB applications. Choosing the right type can make a big difference in signal clarity, layer adhesion, and long-term reliability. Let’s see the most common types used in the PCB industry:

1. Electrodeposited (ED) Copper Foil

Electrodeposited copper foil is the most widely used type in standard rigid PCBs. It’s made through an electrochemical process where copper ions are deposited onto a rotating stainless steel drum. The side in contact with the drum becomes smooth, while the other side is naturally rough.

ED copper foil is great for multilayer rigid boards, consumer electronics, and automotive circuits. When treated with surface chemicals, it bonds well to laminates and resists layer separation.

2. Rolled Annealed (RA) Copper Foil

RA copper foil is made by mechanically rolling solid copper into very thin sheets and then annealing it (heating and cooling) to relieve stress. You’ll find RA copper in flex circuits, flex-rigid PCBs, wearable electronics, and mobile devices. When boards must flex without breaking, RA is the go-to.

3. Reverse Treated Foil (RTF)

RTF is a type of ED foil where the shiny side is treated instead of the rough side. This treatment adds micro-etching or chemical bonding to enhance adhesion between the copper and the laminate. RTF is popular in HDI (High-Density Interconnect) boards, high-speed digital circuits, and RF designs where signal loss must be controlled.

4. Very Low Profile (VLP) and Ultra-Low Profile (ULP) Copper Foils

These are smoother versions of standard ED foils, created to reduce conductor roughness. VLP and ULP foils are still electrodeposited, but they go through extra steps to minimize surface peaks and valleys. They are used in high-speed digital systems, data centers, 5G antennas, and any application where clean signal transmission matters.

5. High-Temperature Elongation (HTE) Copper Foil

HTE copper foil is a variant of ED copper, enhanced for high thermal and mechanical stress. It resists cracking under repeated heating and cooling cycles. HTE is preferred for automotive, power electronics, and multilayer PCBs that go through reflow soldering or see high current loads.

6. Resin-Coated Copper Foil (RCC)

RCC combines copper foil with a thin layer of resin. This resin bonds directly to the core without needing prepreg sheets, which simplifies the lamination process. Mainly in mobile phones, compact devices, or where thin layers and high accuracy are needed.

Here is a summary comparison table between them:

Copper Foil Type	Strength	Flexibility	Smoothness	Signal Performance	Application
ED	High	Low	Moderate	Standard	Rigid PCBs
RA	Medium	High	High	Good	Flex PCBs
RTF	High	Medium	Treated	Excellent	RF, HDI
VLP/ULP	Medium	Medium	Very High	Superior	5G, high-speed
HTE	Very High	Low	Moderate	Standard	Power boards
RCC	Low	Medium	High	Good	Thin mobile boards

What is the Roughness of Copper Foil in PCB?

‌The roughness of copper foil on PCB ‌ refers to the unsmoothness of the copper foil surface, Copper foil roughness affects how well signals move through the board. In high-speed designs, surface texture matters a lot. Rough copper increases insertion loss. This weakens the signal and causes noise.

Roughness is usually measured in microns, which is usually quantified by Ra, Rz and Rq. Lower values are better for RF or high-speed data.

‌Ra‌: The arithmetic average of the absolute value of the contour deviation over the sampling length, applicable to copper foil surface.
‌Rz‌: Sum of the average of the 5 largest profile peak heights and the average of the 5 largest profile valley depths over the sampling length for copper foil rough surface.
‌Rq‌: Means RMS (Root means square) value, it also is a roughness index.‌

PCB Copper Thickness Chart

Copper thickness is often given in ounces per square foot. But that doesn’t mean much until you convert it. Here’s a helpful chart:

Copper Weight (oz/ft²)	Thickness (µm)	Thickness (mil)
0.5 oz	~17 µm	~0.67 mil
1 oz	~35 µm	~1.37 mil
2 oz	~70 µm	~2.74 mil
3 oz	~105 µm	~4.11 mil
4 oz	~140 µm	~5.48 mil

For single & double sided PCB, the copper foil thickness is about 35um, 50um, 70um;
For multi-layer PCB, its outer layer copper thickness is 35um, and inner layer copper thickness is 17.5um (1/2oz).

Designers choose copper weight based on current flow and thermal limits. Thicker copper is used in power PCBs. Thinner layers are more common in signal circuits or HDI boards.

HTE vs RTF copper foil

When it comes to choosing the right copper foil for high-performance PCBs, HTE (High-Temperature Elongation) and RTF (Reverse Treated Foil) are two of the most commonly used options.

HTE Copper Foil

HTE copper foil is a specially processed electrodeposited foil that’s engineered to handle high thermal and mechanical stress. The term “high-temperature elongation” refers to the foil’s improved flexibility and stretch resistance when exposed to heat.

It’s treated chemically to improve adhesion strength, making it more reliable during multiple soldering cycles. The surface has a consistent profile that bonds well with different dielectric materials.

Key Features of HTE Foil:

Strong peel strength
Durable under repeated heating
Excellent for plated-through-hole (PTH) reliability
Withstands lamination and solder reflow cycles

RTF Copper Foil

RTF, or Reverse Treated Foil, is also made through an electrodeposition process, but with one key difference: the shiny side gets treated instead of the rough side. This treatment applies a fine, uniform microstructure that enhances bonding without creating high surface roughness.

This smoother surface makes RTF a preferred option in high-speed signal and RF PCB applications where low signal loss is critical.

Key Features of RTF Foil:

Lower surface roughness
Better electrical performance at high frequencies
Improved signal integrity
Balanced peel strength and performance

PCB Copper Electrical Conductivity

Copper has one of the highest electrical conductivities of any metal. That’s why it’s the go-to choice for PCBs. The typical conductivity of copper used in PCBs is about 5.8 x 10⁷ S/m (Siemens per meter).

This high conductivity allows small traces to carry high current with low voltage drop. It also reduces signal distortion, which is key in high-speed or RF applications.

Still, conductivity depends on purity. Most PCB foils use 99.9% pure copper. If copper is oxidized or poorly handled, conductivity drops. That’s why clean processes and proper lamination are important.

How to Calculate Copper Thickness in PCB?

The thickness of copper in PCB can be calculated by the following methods:

1. Calculation of copper plating thickness by current density and plating time:

Plating thickness (um) = current density (ASF) x plating time (min) x plating efficiency × 0.0202‌. This formula takes into account the amount of electricity, equivalent, molar mass, density and other factors. The specific calculation process involves the product of current density, plating time and plating efficiency, then multiplying by a factor 0.0202‌.

‌2. Thickness calculated by weight of copper foil:

In the common option “copper-covered FR4, single-sided,1 oz”,1 oz indicates the thickness of the copper foil. 1 oz = 28.35 g/ft², copper foil density of 8.93 g/cm³, 1 square foot = 929.03 cm². Thus, 1 oz copper foil thickness = 28.35/8.93/929.03 ≈ 35um or 1.35mil ‌. Common PCB thicknesses include 1/2Oz = 17.5um, 1 oz = 35um, 2oz = 70um, and 3 oz = 105um.

How to Calculate Copper Thickness in PCB?

In addition to these two methods, you can also use our online pcb copper thickness calculator to calculate the copper thickness.

Copper Foil PCB Manufacturers

Many trusted copper foil PCB manufacturers serve global markets. Some of the top names include:

1. Isola Group: Known for high-frequency and low-loss materials.

2. Kingboard: One of the world’s biggest copper clad laminate suppliers.

3. Ventec International: Offers low-profile copper foils and thermal substrates.

4. Mitsui Mining & Smelting: A top name in RTF and ultra-smooth foils.

5. Best Technology: Based in Asia, with 18+ years in the industry. We supply high-quality copper foil PCBs, from 0.5 oz to over 6 oz.

At Best Technology, we bring over 18 years of hands-on experience. We support standard and custom copper weights, including heavy copper for high-current boards. Our RTF and HTE options fit both signal-sensitive and power-heavy needs.

With fast lead times, in-house testing, and global delivery, we’re more than just a PCB maker. We’re your reliable partner for copper foil PCB solutions. Reach out today to explore your next project with confidence.

What Is a Fast Turn PCB Board?

A fast turn PCB board is a printed circuit board manufactured and delivered in a short time, typically within 24 to 72 hours. These quick deliveries help speed up product development, especially during prototyping and pre-production stages. It’s a solution many engineers rely on when time is tight.

Engineers use fast turn PCBs for product validation. They want to see if a new circuit design performs well before moving to mass production. So, getting a board in days instead of weeks can make a huge difference.

Fast turn PCB Board, Fast Turn Circuit Board Manufacturing

What Are the Benefits of Fast Turn PCB Orders?

Ordering a fast turn PCB board brings several advantages to the table.

First, it speeds up your product timeline. You don’t need to wait weeks to test your circuit. If changes are needed, you can get a revised board quickly and keep things moving forward.

Second, it helps reduce project risks. The faster you test, the faster you detect potential design errors. Early detection saves money and prevents delays.

Third, it improves decision-making. With working samples in hand, your team can test real performance. It’s better than guessing or using simulation data only.

Lastly, fast turn options give your company a competitive edge. Getting to market faster often means better sales and stronger customer trust.

Best Technology’s Typical Turnaround Time for Fast Turn PCBs

At Best Technology, we understand the value of time. That’s why we’ve optimized our process to support urgent PCB orders.

For standard 2-layer fast turn PCBs, we usually deliver in 24 to 48 hours. For 4-layer boards, it may take 48 to 72 hours depending on complexity. Our team works around the clock to meet those deadlines.

Even for more complex boards — such as HDI or metal-core PCBs — we still maintain one of the quickest turnaround times in the industry. And we don’t compromise on quality. Each board goes through full inspection and electrical testing before it reaches you. The detailed turnaround time is:

Prototype(<1m²)	Layers	Normal Service	Expedited Service
FR4 PCB	1 Layer	3-4 days	24 hours
	2 Layers	4-6 days	24 hours
	4 Layers	8-10 days	48 hours
	6 Layers	8-10 days	72 hours
	8 Layers	10~14 days	72-96 hours
	10 Layers	14-18 days	72-96 hours
	HDI (1+N+1 2+N+2)	2.5 – 3.5weeks	TBD (depend on design)

We don’t just print boards fast. We manage the process with strict planning, from materials to delivery. That’s why so many clients come back to us for every new project.

Factors That Affect the Turnaround Time of Prototypes

Even though we push for speed, several factors can influence how long a fast turn circuit board takes to produce. Knowing these helps avoid delays.

Circuit Board Design and Test Procedures

The design stage impacts everything. A simple, well-structured layout speeds up processing. Complex routing, fine-pitch components, or tight spacing can add extra review time.

Test procedures matter too. If a special test is needed, like impedance control or functional test setup, it adds to the schedule. Providing clear instructions in advance helps us prepare and avoid delays.

Lamination Cycles

For multilayer boards, each lamination cycle takes time. A 4-layer multi-layer board needs one cycle, while an 8-layer may need several. More layers mean longer pressing times and more careful control.

Quick builds still go through these steps. We just start immediately and plan shifts to manage it faster. That’s why sharing the full stack-up early is so important.

Via-in-Pad Plated Over

Via-in-pad designs are helpful for high-density layouts. But they add a few extra steps in production. We need to drill, plate, and fill those vias carefully. After that, we cap and flatten them before plating the surface.

This extra effort adds time compared to standard vias. If your board uses VIPPO, it’s best to let us know upfront so we can fast-track these processes.

Fabrication Drawing Specifications

Precise drawings help avoid back-and-forth communication. If drawings are unclear or missing details like dimensions, tolerances, or hole types, we’ll need to clarify before production.

Clear drawings lead to fast fabrication. They also reduce the risk of mistakes. That’s why we suggest using IPC-2581 or Gerber X2 format with notes included.

Surface Finish

Surface finish choice also plays a role. ENIG, OSP, HASL, or hard gold all have different process times. For example, ENIG takes longer than HASL because it involves two plating steps.

If speed matters most, we can recommend the best finish based on your needs. Some finishes can still meet performance goals while shaving off hours from the process.

Assembly Drawings and Notes

If you also need PCB assembly, complete documentation is key. Missing part placements, unclear polarity marks, or unreferenced BOM items slow everything down.

Providing all files in one go—BOM, pick and place, centroid file, and notes—helps avoid delays. When everything’s ready, our SMT line can move fast and precise.

Fast Turn Circuit Board Manufacturing

Manufacturing a fast turn circuit board isn’t about rushing. It’s about knowing how to work smart, reduce waste, and prevent rework.

At Best Technology, we keep a reserve stock of core materials and prepreg. That way, we can start production immediately without waiting for supply.

We also use automatic routing, inline AOI, and robotic drilling machines to keep operations smooth. Our teams work in shifts, so production doesn’t stop, even at night or on holidays.

Every department is synchronized. CAM engineers review your files fast, material control prepares the stack-up, and QA teams check every step. That’s how we manage fast output without losing accuracy.

We also run a parallel system for urgent jobs. These special jobs go into our “fast-lane” line, separated from standard orders. This ensures time-sensitive boards don’t get stuck behind large-volume orders.

Why Should You Choose Best Technology as Your Preferred Partner?

Choosing a fast turn PCB partner isn’t just about delivery speed. It’s about trust, communication, and consistent results. Best Technology stands out because we offer more than just fast service.

Experienced team: We’ve been in this field for over 18 years. Our engineers know what works and how to prevent problems early.
Clear communication: Our team responds quickly. We give you updates, clarify questions, and solve problems before they become delays.
Flexible production: Whether you need 1 board or 10,000, we scale easily. We also support special needs like rigid-flex, metal core, or ceramic boards with fast turn options.
Global shipping: We work with trusted logistics partners. Boards reach you safely and on time, even across borders.
Reliable quality: Every board goes through full inspection, AOI, flying probe, and E-test. Even fast jobs go through our strict quality checks.

When you work with Best Technology, you get speed, support, and security in every step. That’s why companies in medical, industrial, and automotive industries continue to rely on us.

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