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Archive for the ‘PCB Technology’ Category

What Is The Difference Between Thin Film and Thick Film Ceramic PCBs?

Monday, September 25th, 2023

We know due to the rapid development of electronic devices, Ceramic circuit boards have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules. Among them, thick film ceramic substrate and thin film ceramic PCB are the most popular ceramics that be used in package, because they are made by metallization process.

Why use film technology?

Compared with three-dimensional ceramic materials, film has relatively thin thickness and small size, it can be regarded as a two-dimensional structure. Thick film is made by printing process, the thick film can be made independently and the thickness is usually 10~25μm. Thin film is formed by the composition of the conductor materials and it was sputtering on the ceramic substrate directly. Normally the thickness of thin film is equal or less than 1μm. If the metallization thickness between 1μm to 10μm, then we called it as Directly Plated Copper (DPC) ceramic circuit board.

Thick Film Technology

Thick film technology is a method of direct deposition of slurry on substrate through screen printing technology, and sintering at high temperature to form conductive traces and electrodes. After the material is sinter at high temperature, it will form a strong adhesion film on the ceramic circuit board, and after repeated many times, it will form a multi-layer interconnected ceramic circuit board with resistor or capacitor. The thick film manufacturing process is more easier than thin film.

Thin Film Technology

Thin film ceramic PCB is a chip manufacture technology, which is the main method of metal film deposition in microelectronics fabrication. It was made through evaporation and PVD process firstly to deposited a 200-500nm copper layer as the seed layer. Then using electroplating process to increase the copper foil to required thickness. Finally through stripping and etching to generate the circuits. Thin film ceramic circuit is widely used in LED package fields because its fine traces, high accuracy and heat dissipation.

(Manufacturing_process_of_thin_film_ceramic)

Thin film and Thick film ceramic PCB comparison

In addition to the technology manufacturing difference, their performance and limitations also is different. Here we summarized in below table:

Technology	Thick Film	Thin Film
Conductor thick	10-25um	<=1um
Manufacture process	Screen printing, sinter	PVD, DES
TCR	(50-300) *10-6/C	(0-50) *10-6/C
Cost	Relatively Low	High for prototype
Line width	Thicker line width	Fine traces, suitable for RF
Bonding ability	Not suitable for bonding	Good for wire bonding
Resistance	Available	Need mount resistors
Solder mask	Available	Available

Application difference between Thin film and Thick film ceramic PCB

The applications of thin film and thick film also are different because of their different features. Thick film ceramics are widely used in high power devices such as automotive field, power electronics, aerospace due to its ability to handle high current and voltage. Thick film enables to provide excellent thermal management and can dissipation heat effectively. Thin film ceramic PCBs trend to micro-electronics and RF devices because of its fine lines, low resistance, and high-frequency performance.

Each technology has its unique advantages and limitations, it needs to be properly used to make it suitable for different electronic devices and industries. Choose the right ceramic PCB substrate for laymen is a big challenge, so seeking for a reliable supplier is important. Best Technology engaging ceramic circuit board manufacturing for over 10 years. And our core engineering team are deep in this industry for more than 20 years, we are so confident that we can provide the best solution for you. If you are interested in this, welcome to contact us at sales@bestpcbs.com.

What is Bus Bar PCBs in the Electronics Landscape?

Friday, September 22nd, 2023

Bus Bar PCBs are a specialized type of printed circuit board (PCB) that stand out from traditional PCBs due to their integrated conductive bus bars. These bus bars are typically made of copper or aluminum and are positioned on the surface or within the PCB. They serve the purpose of connecting electronic components, devices, or connectors and transmitting electrical currents.

Key Characteristics:

Outstanding Heat Dissipation:

Bus Bar PCBs are renowned for their exceptional heat dissipation capabilities. The integrated conductive bus bars efficiently conduct and dissipate the heat generated within the circuit, making them an ideal choice for high-power applications. Whether it’s in industrial electronics, electric vehicles, or solar inverters, this characteristic ensures that electronic components stay cool, enhancing overall system reliability.

Compact Space Utilization:

Space is often a precious resource in electronic devices. Bus Bar PCBs optimize space utilization through their integrated conductive bus bars. Unlike traditional wiring systems that can be space-consuming, Bus Bar PCBs save space, reducing the overall footprint of electronic systems.

Enhanced Electrical Performance:

The integration of conductive bus bars reduces the overall resistance and inductance of the circuit, resulting in improved electrical performance. Lower resistance translates to reduced power loss, while decreased inductance facilitates faster signal propagation. This, in turn, leads to higher efficiency and improved signal integrity.

Conclusion:

Bus Bar PCBs represent a force of innovation in the field of electronics, with their exceptional heat dissipation, space-saving design, and enhanced electrical performance making them highly favored across a multitude of applications. As technology continues to advance, Bus Bar PCBs are expected to play an increasingly pivotal role in the design and manufacturing of electronic systems.

If you have any interest in Bus Bar PCBs or any related requirements, please feel free to contact us. We have been in the field of heavy copper PCB manufacturing and bus bar PCB manufacturing more than 17 years. We are committed to providing you with outstanding products and services. Let’s explore the limitless possibilities of Bus Bar PCBs together, bringing innovation and success to your projects!

Do you know the relationship between copper thickness and circuit width & spacing?

Saturday, September 2nd, 2023

We know the precision control and performance of a product are paramount, only know that PCB can be built with a nice function, so, to understand the intricate relationship between copper thickness and circuit width and spacing is pivotal. These two parameters are like the gears of a well-oiled machine, interlocking in ways that significantly influence the printed circuit board‘s functionality, signal integrity, and manufacturability. If the designer does not consider the relationship between these two, the design may need to be modified in subsequent production.

In order to avoiding this information, let’s embark on a deeper exploration of this dynamic relationship to uncover its nuances and implications now,

Frist of all, we need to know some basic information about PCB, like copper thickness, circuit width and spacing.

The Essence of Copper Thickness

Copper, known for its exceptional electrical conductivity, is the lifeblood of any PCB. The copper thickness refers to the amount of copper deposited onto the board’s surface during fabrication. It’s the foundation upon which the traces, the intricate pathways that carry electrical signals, are built. The standard copper thickness is often measured in ounces per square foot (oz/ft²) or micrometers (µm). Common options include 1oz (35µm), 2oz (70µm), and even higher, it depends on customer’s requirement.

Circuit Width and Spacing

Circuit width and spacing, though often overlooked, are integral components that determine a PCB’s performance, integrity, and overall functionality. Circuit width refers to the dimension of the conductive traces, while spacing pertains to the distance between these traces. These seemingly simple dimensions have a profound impact on the PCB’s behavior.

Secondly, Unveiling the Intricate Relationship

The relationship between copper thickness, circuit width, and spacing is a sophisticated interplay of electrical properties, heat dissipation, and signal integrity. Let’s delve deeper into this complex web of interactions:

Current-Carrying Capacity and Copper Thickness: Copper thickness directly influences a trace’s ability to carry current without succumbing to overheating. Thicker copper translates to higher current-carrying capacity and reduced resistive losses. However, the trade-off is that wider traces are necessary to accommodate the increased copper thickness.

Resistance and Circuit Width: Wider traces exhibit lower resistance, which in turn reduces voltage drop and enhances the efficiency of signal transmission. Designers must strike a balance between trace width, copper thickness, and available board space.

Spacing and Unwanted Interactions: As circuit spacing decreases, the probability of unwanted interactions, such as crosstalk and electromagnetic interference, rises. Thicker copper can exacerbate these issues due to its larger cross-sectional area. Maintaining appropriate spacing between traces is pivotal to prevent signal degradation and maintain integrity.

Heat Dissipation and Trace Width: Thicker copper also aids in better heat dissipation, a crucial consideration for power-intensive applications. However, this can necessitate wider traces to manage the thermal load effectively.

Signal Integrity and Crosstalk: Smaller spacing reduces the risk of crosstalk, but it’s a double-edged sword. Thicker copper traces may introduce higher capacitance, altering impedance and potentially impacting signal integrity. This delicate balance requires careful consideration during design.

For now, we have known the relationship between them, how to develop a best design between the circuit width & spacing and copper thickness, which depends on what’s you really want, the huge current or heat management? Following details should be considered if you want to develop the best circuit width & spacing.

Current Requirements: Start by understanding the current requirements of your traces based on the components and operational conditions. Selecting the appropriate copper thickness and trace width ensures the PCB can handle the anticipated loads.

Thermal Management: Thicker copper facilitates heat dissipation, which is advantageous for power-dissipating components. However, remember that it might necessitate wider traces to ensure effective heat transfer.

Manufacturability: While thicker copper can enhance current-carrying capacity and heat dissipation, it might pose manufacturing challenges. Consult with PCB manufacturers to align your design choices with their capabilities.

Signal Integrity Analysis: Utilize simulation tools to analyze signal integrity, especially when dealing with smaller spacing and thicker copper. These tools provide insights into impedance matching, potential crosstalk, and overall performance.

Flexibility VS Rigidity: While thicker copper enhances many aspects, it can impact the PCB’s flexibility, crucial for certain applications. Evaluate the mechanical demands of your project and strike the right balance.

Regarding metal core PCB in Best Technology, the copper thickness and its accordingly circuit width & spacing like below, furthermore, it would be better if you can let me know your copper thickness before checking your drawing, we will give you the best solution before formal production.

Copper thickness	Minimum circuit width	Minimum circuit spacing
0.5-2oz	0.25mm	0.23mm
3oz	0.35mm	0.3mm
4oz	0.4mm	0.38mm

(trace_design_guide_of_MCPCB)

Conclusion: Striking the Optimal Balance

The intricate relationship between copper thickness, circuit width, and spacing in PCB design embodies a delicate equilibrium that significantly influences a design’s performance and functionality. This nuanced interplay directly impacts parameters such as current-carrying capacity, resistance, heat dissipation, and signal integrity.

Achieving the optimal balance between these factors requires a deep understanding of electrical properties, thermal considerations, and signal behavior. Designers must carefully evaluate the specific requirements of their projects and leverage simulation tools to fine-tune their choices. Collaboration with PCB manufacturers ensures alignment with manufacturing capabilities.

The dynamic nature of this relationship underscores the constant evolution of PCB technology. As devices become smaller, faster, and more interconnected, the demand for intricate layouts intensifies. Designers must continuously adapt to new challenges, pushing the boundaries of what’s achievable while adhering to the fundamental principles that govern PCB design.

Why do ceramic substrates contribute to the breakthrough of 905nm lidar technology?

Friday, September 1st, 2023

LiDAR (Light Detection And Ranging, referred to as “LiDAR”) measurement is a system that integrates three technologies: laser, GPS (Global Positioning System), and IMU (Inertial Measurement Unit, inertial measurement unit), used to obtain data and Generate accurate DEMs (Digital Elevation Models). The combination of these three technologies can highly accurately locate the spot of the laser beam on the object, and the ranging accuracy can reach the centimeter level. The biggest advantage of lidar is accurate, fast, and efficient operation.

Lidar is currently widely used in the field of driverless cars and robots. It is known as the “eye” of a generalized robot. It is an active measurement device that measures the precise distance between an object and a sensor by emitting laser light.

As an indispensable sensor for L3 and above automatic driving, lidar has significantly improved the reliability of the automatic driving system with its excellent ranging capability, high angular resolution and sensitivity to ambient light, and has become the key to improving reliability. A key element of autonomous driving systems, but its application is constrained by cost and technical challenges.

In the past, lidar was difficult to apply to mass-produced vehicles due to its high cost. However, recently, with the continuous evolution of technology and market competition, the cost of lidar has gradually decreased, thereby accelerating its application in the field of autonomous driving.

In this evolution process, the emergence of ceramic substrates has played a vital role in the breakthrough of lidar technology – 905nm wavelength lidar has become mainstream. Traditional materials such as FR-4 and FE-3 are difficult to meet the high heat dissipation requirements of lidar, while ceramic substrates rely on their excellent thermal conductivity. For example, the thermal conductivity of aluminum nitride ceramic substrates is as high as 200W/M.K. It effectively solves the heat dissipation problem and provides a guarantee for the stability and life of the lidar.

In lidar, the transmitter is one of the links with the highest value and the highest barriers. On the transmitter side, with the rise of China’s domestic industrial chain and the adjustment of the overall technical route of the industry, among them, 905nm VCSEL laser chips and other products have achieved breakthroughs in the market and become a hot topic in the industry.

The “heart” of the transmitter is the light source. Laser transmitter is the core component of laser technology, and its composition includes laser working medium, excitation source and resonant cavity. In this system, why choose a ceramic substrate as a component? The main reason lies in its unique advantages in heat dissipation. Especially for VCSEL (Vertical Cavity Surface Emitting Laser) chips, due to their low power conversion efficiency, the problem of heat dissipation is particularly prominent. The application of ceramic substrates has become the best choice to solve the problem of thermoelectric separation.

The ceramic substrate has excellent heat dissipation performance and can effectively conduct the heat generated inside the laser transmitter. The high thermal conductivity of the ceramic substrate allows it to efficiently conduct heat generated inside the lidar, preventing performance degradation due to overheating. In addition, ceramic materials have the advantages of high strength, hardness, thermal shock resistance, insulation, and chemical stability, which can further extend the service life of products, improve sensitivity, and enhance the response speed of lidar.

Ceramic substrates also enable high-density assembly, supporting miniaturization and integration of devices. Its stability ensures that the sensor signal is not distorted, and the matching with the thermal expansion coefficient of the chip ensures the reliability of the product in harsh environments such as high temperature, high vibration, and corrosion. In addition, the metal crystallization performance of the ceramic substrate is excellent, which ensures the stability of the circuit and further improves the quality control level of the lidar.

As a leading manufacturer of ceramic substrates, Best Technology provides a variety of ceramic substrates of different materials, including 96% alumina, 99% alumina, aluminum nitride, zirconia, silicon nitride, sapphire ceramic bases, etc. The heat dissipation properties of these different materials are different, such as aluminum nitride (AlN): thermal conductivity of 170-230 W/mK, silicon nitride (Si3N4): thermal conductivity of 20-80 W/mK, sapphire (Al2O3): thermal conductivity Coefficient 25-40W/mK.

Therefore, choosing a high-quality ceramic substrate not only helps to solve the problem of thermal and electrical separation of laser emitters, but also provides stable heat dissipation and electrical performance, providing reliable support for efficient operation and performance improvement of laser emitters. In the development of lidar technology, ceramic substrates play an increasingly important role, providing key support for performance breakthroughs and innovations in laser transmitters. We are witnessing a revolution in the auto industry brought about by China’s autonomous driving assistance systems.

If you are designing a ceramic PCB and seeking a reliable manufacturer, welcome to leave you message or contact us directly.

What You Know About Counterbores in PCB Design and Manufacturing

Friday, August 18th, 2023

In the world of design and manufacturing, precision is paramount. Every detail, down to the placement of a single component, can impact the performance and appearance of a product. This is where the concept of counterbores comes into play, a technique employed in various industries to create recessed areas for components or fasteners.

But firstly, what is counterbore? Today we will show you the definition and applications of the countersink in a PCB design.

Definition and Applications:

A counterbore is a cylindrical, flat-bottomed hole that is strategically cut into a material to accommodate specific components or fasteners. It is commonly used in various industries, including woodworking, metalworking, and mechanical engineering. The purpose of a counterbore is to create a recessed area where a component, such as a bolt head, nut, or other hardware, can sit flush with or below the surface of the material. This technique ensures a smooth appearance, prevents interference with other components, and provides mechanical stability.

Counterbores in PCB Design and Manufacturing

In the realm of printed circuit boards (PCBs), counterbores play a crucial role in achieving efficient and functional designs. PCBs are essential components in electronic devices, and their design requires careful consideration of component placement, connectivity, and mechanical stability. Counterbores in PCBs serve several important functions:

Component Alignment and Clearance: Certain components on a PCB, such as connectors, switches, or specialized modules, require precise alignment and clearance for optimal functionality. A counterbore can be introduced to create a recessed area that accommodates these components, ensuring proper alignment with neighboring components and minimizing the risk of interference.

Flush Mounting: To maintain a sleek and compact design, some components need to be mounted flush with the surface of the PCB. A counterbore creates a flat-bottomed recess that allows the component to sit at the same level as the PCB surface, contributing to an aesthetically pleasing and functional layout.

Mechanical Support: Components that are susceptible to mechanical stress or impact may benefit from additional support. By incorporating a counterbore, the PCB design can provide a more secure location for these components, reducing the risk of damage.

Heat Dissipation Enhancement: In applications where certain components generate significant heat, such as power amplifiers or processors, heat sinks are often employed to dissipate the heat. A counterbore can facilitate proper alignment and contact between the heat sink and the component, optimizing heat transfer and overall thermal performance.

The production of counterbores in PCBs involves specialized manufacturing techniques. BEST Technology as a professional PCB manufacturer, we will use precision drilling and routing equipment to create accurately sized and positioned counterbores.

If you want to know more about the counterbores, welcome to follow our post or contact us.

Enhancing UV LED Performance with MCPCB: Advantages and Innovative Applications

Thursday, August 10th, 2023

In the field of ultraviolet light-emitting diodes (UV LED), the integration of Metal Core Printed Circuit Boards (MCPCB) plays a significant role in improving UV LED performance, thermal management, and overall reliability. In this blog post, we will explore the importance of MCPCB in UV LED applications, highlighting its advantages with concrete data to demonstrate its practicality.

Efficient Heat Dissipation:

MCPCBs excel in efficient heat dissipation, ensuring optimal UV LED performance and longevity. With a metal core typically made of aluminum or copper, MCPCBs possess high thermal conductivity. For instance, MCPCBs have a thermal conductivity coefficient of normally 1.0-3.0 W/mK, it needs to be customized if the thermal conductivity exceeds 3.0W/mk. this exceptional thermal conductivity allows for rapid dissipation of generated heat, preventing heat accumulation and ensuring UV LEDs operate within their optimal temperature range.

2. Enhanced Thermal Conductivity:

MCPCBs contribute to effective heat dissipation through improved thermal conductivity. Studies indicate that MCPCBs can enhance thermal conductivity up to ten times higher than standard FR4 PCBs. Because the stack up of MCPCB is different with PCB, please see below stack up. This enhanced thermal conductivity aids in achieving a uniform temperature distribution across the entire MCPCB, reducing the risks of hotspots and thermal stress on UV LEDs. Consequently, UV LEDs can maintain their performance and reliability even during extended operation.

1oz	Copper layer
1.5mm without copper	Core base

(FR4PCB_stack_up)

3. Reliability in Harsh Environments:

MCPCBs are designed to withstand harsh environments, ensuring reliability in UV LED applications. The metal core of MCPCBs provides higher mechanical strength and resistance to thermal stress. For example, the coefficient of thermal expansion (CTE) of an MCPCB can be matched with UV LEDs, minimizing the risk of mechanical failures caused by thermal mismatch. These features enable MCPCBs to operate reliably even in high-temperature environments or under exposure to ultraviolet radiation, thereby extending the lifespan of UV LED devices.

4. Electrical Isolation:

MCPCBs offer electrical isolation between the metal core and circuit layers, ensuring safe and reliable operation of UV LEDs. The dielectric layer, typically made of materials such as epoxy resin or thermally conductive dielectric (TCF), exhibits high breakdown voltage and insulation resistance. This electrical isolation minimizes the risk of short circuits or electrical interference, protecting UV LEDs and the entire system from potential damage.

5. Performance Optimization:

By incorporating MCPCBs into UV LED technology, manufacturers can optimize the performance of their UV LED devices. The improved heat dissipation and thermal conductivity of MCPCBs enable UV LEDs to operate at maximum efficiency. Research shows that using MCPCBs can reduce LED junction temperatures by up to 20-30°C, improving light output and enhancing overall performance. This optimal performance ensures consistent UV light generation, making MCPCBs an ideal choice for various UV LED applications, including curing, sterilization, and phototherapy.

Conclusion:

The use of MCPCBs in UV LED technology offers practical benefits in heat dissipation, thermal conductivity, reliability, and electrical isolation. Concrete data and research support the effectiveness of MCPCBs in efficient heat management, even in harsh environments, enabling reliable operation of UV LEDs. With enhanced performance provided by MCPCBs, UV LED systems can deliver consistent, efficient, and durable UV light output, expanding the possibilities of UV applications in various industries. The utilization of MCPCBs further solidifies their critical role as a key supporting technology in the UV LED field.

If you are designing a metal core PCB and seeking for a reliable manufacturer, welcome to leave you message or contact us directly.

Do You Know What Is HDI Board?

Thursday, August 10th, 2023

HDI boards are a type of printed circuit board (PCB) technology that enables higher circuit density and smaller form factors compared to traditional PCBs. HDI boards are commonly used in applications where space is limited, such as mobile devices, wearables, and aerospace systems.

Best Technology has rich experience in HDI rigid flex pcb manufacturing, below is one of our 7 layers HDI rigid flex pcb.

In Best Technology, our HDI board usually has the blind holes or buried holes, and the minimum hole size usually is 0.1mm. This board has the blind and buried holes, and the minimum hole size is 0.1mm. 100 ohm differential impedance control with 50 single ended impedance control. It’s surface finish is ENIG, 1oz copper for outer layers, 1/2oz copper for inner layers, green solder mask with white silkscreen. total thickness is 1.4mm.

Here are some key features and aspects of HDI boards:

High Density: HDI boards are designed to accommodate a large number of densely packed components and interconnections. They typically have multiple layers with high routing density, allowing for more complex circuitry in a smaller footprint.

Microvias: HDI boards extensively use microvias, which are very small holes drilled into the board to create electrical connections between different layers. Microvias are smaller in size compared to traditional vias, allowing for increased routing density.

Staggered and Stacked Microvias: HDI boards employ different types of microvias, including staggered and stacked microvias. Staggered microvias connect adjacent layers, while stacked microvias connect non-adjacent layers, providing even higher routing density.

Blind and Buried Vias: HDI boards often utilize blind and buried vias, which are vias that do not extend through the entire board. Blind vias connect an outer layer with one or more inner layers, while buried vias connect inner layers only. These vias help optimize space and increase routing capabilities.

Fine Pitch Components: HDI boards support the use of fine pitch components, such as microcontrollers, ball grid array (BGA) packages, and small surface-mount devices (SMDs). The high routing density and smaller features of HDI boards make them suitable for accommodating these tiny components.
Increased Signal Integrity: HDI boards can provide improved signal integrity due to shorter trace lengths and reduced noise interference. The compact design minimizes signal loss and impedance mismatches, allowing for better performance in high-frequency applications.
Design Considerations: Designing HDI boards requires expertise in factors such as layer stacking, via types, trace widths, and clearances. Advanced design software and manufacturing techniques are often employed to ensure precise alignment and reliability of the intricate interconnections.
Manufacturing Challenges: HDI boards can be more challenging to manufacture compared to standard PCBs. The use of smaller features and complex layer structures requires specialized fabrication techniques, such as laser drilling, sequential lamination, and precise registration control.

HDI technology has become increasingly prevalent in the electronics industry, enabling the development of smaller, lighter, and more sophisticated devices. It offers enhanced electrical performance, improved reliability, and greater design flexibility. If you have any comments about the HDI board, please feel free to contact Best Technology Team e-mail: sales@bestfpc.com.

Heavy Copper PCB for Industrial Power Supply

Saturday, July 29th, 2023

All of us know the printed circuit board, but do you know what is the heavy copper PCB? Best Tech is a very experienced heavy copper PCB fabricator since year 2006. Heavy Copper PCB is a type of printed circuit board that features with thicker copper layers than standard FR4 PCBs. While conventional PCBs typically have copper thicknesses ranging from 1 to 3 ounces (per square foot), heavy copper PCBs have copper thicknesses exceeding 3 ounces and can go up to 20 or more ounces. These copper layers are typically found in the inner and outer layers of the PCB, heavy copper providing enhanced current-carrying capacity and improved heat dissipation capabilities.

The increased copper thickness in heavy copper PCBs allows them to handle higher currents without experiencing excessive heat buildup or voltage drops. This makes them well-suited for applications that require high power handling, such as industrial power supplies, power converters, motor drives, and automotive electronics. Heavy copper PCBs are designed to withstand harsh operating conditions and provide robust performance and reliability.

Today, we would like to talk about the heavy copper PCB used in Industrial Power Supply. In this blog post, we will explore the realm of Industrial Power Supply, delving into the design considerations, material selection, production challenges, exceptional heat dissipation, and unrivaled conductivity of Heavy Copper PCBs. Join us on this enthralling journey as we uncover the secrets behind their application in Industrial Power Supply scenarios, including the testing of inductance, capacitance, and resistance. Get ready to witness the power of Heavy Copper PCBs in the realm of Industrial Power Supply!

Firstly, before you are moving start for the design, it need to get to understand the Design guideline rules of heavy copper PCB.

From the guidelines of heavy copper PCB, it could get to know it encompass considerations such as trace width, trace spacing, and thermal relief patterns. The increased copper thickness necessitates wider traces to accommodate higher currents, while proper spacing is crucial to avoid thermal hotspots and ensure reliable operation. Additionally, selecting suitable materials with excellent mechanical strength and thermal properties is vital to ensure the robustness and longevity of Heavy Copper PCBs. Hope this will bring some ideas to you during your design.

Secondly, as a heavy cooper PCB manufacturing vendor, Best Tech would like to advise the Production Challenges for the heavy copper PCB.

During producing Heavy Copper PCBs presents manufacturers with a set of intricate challenges. Achieving uniform copper thickness across the board’s surface demands advanced plating techniques and precise control over process parameters. Careful attention must be given to the etching process to prevent over-etching, which can compromise the integrity of the copper layers. Moreover, the additional weight of copper requires a sturdy substrate to support the board’s structure. Manufacturers must navigate these challenges with expertise and precision to deliver high-quality Heavy Copper PCBs.

You may have a question in mind, why we need to use the heavy copper PCB for the Industrial Power Supply, because the heavy copper PCB have Exceptional Heat Dissipation and Conductivity: One of the standout features of Heavy Copper PCBs is their unrivaled heat dissipation capabilities. The increased copper thickness acts as a robust conductor, efficiently channeling heat away from power components. This exceptional heat dissipation prevents thermal stress and ensures the longevity and reliability of Industrial Power Supply systems. Additionally, the high conductivity of Heavy Copper PCBs enables efficient power transmission, reducing losses and improving overall system efficiency.

Furthermore, Heavy Copper PCBs undergo rigorous testing to ensure optimal performance in Industrial Power Supply applications. Inductance testing verifies the effectiveness of copper layers in reducing magnetic interference. Capacitance testing evaluates the ability of the PCB to store electrical energy, while resistance testing determines the conductivity and resistance of copper traces. These tests play a crucial role in validating the quality and performance of Heavy Copper PCBs in demanding power supply scenarios.

Heavy Copper PCBs find widespread applications in the field of Industrial Power Supply, particularly in the production of robust and efficient power control products. They are integral components in industrial power converters, motor drives, uninterruptible power supplies (UPS), and various automation systems. The exceptional heat dissipation and high current-carrying capacity of Heavy Copper PCBs make them ideal for handling the power demands of these applications, ensuring reliable and efficient power delivery.

Finally, in the world of Industrial Power Supply, Heavy Copper PCBs emerge as true powerhouses, combining meticulous design, advanced manufacturing processes, and exceptional heat dissipation capabilities. By adhering to design guidelines, overcoming production challenges, and conducting thorough testing, Heavy Copper PCBs prove their mettle in demanding power supply scenarios. As they continue to evolve, these powerhouses will shape the future of Industrial Power Supply, empowering systems with reliability, efficiency, and unrivaled performance. Prepare to witness the electrifying impact of Heavy Copper PCBs in the realm of Industrial Power Supply!

If you have more question heavy copper PCB for Industrial Power Supply, warmly welcomed to contact Best Tech for more get more information of heavy copper PCB which used in Industrial Power Supply. You can visit www.bestpcbs.com to know more about us.

5 Tips Tell You How to Solder BGA Better in PCBA

Monday, May 29th, 2023

BGA (Ball Grid Array) soldering is a widely used method in the electronics manufacturing industry for mounting integrated circuits onto printed circuit boards (PCBs). This method provides a more compact and reliable connection compared to traditional through-hole or surface mount technology (SMT). However, the complexity of BGA soldering poses various obstacles during the manufacturing process. Herein, we will explore the challenges faced in BGA soldering and discuss effective strategies to address them.

What is BGA Soldering?

BGA soldering is a technique that involves the attachment of integrated circuit packages to a PCB using an array of solder balls. These solder balls are typically made of lead-based or lead-free alloys, depending on environmental regulations and specific requirements. The BGA package consists of a substrate, which acts as a carrier for the integrated circuit, and the solder balls that form the electrical and mechanical connections between the package and the PCB.

The Importance of BGA Soldering in Electronics Manufacturing

BGA soldering plays a critical role in the manufacturing of various electronic devices such as computers, smartphones, and gaming consoles. The increased demand for smaller and more powerful electronics has driven the adoption of BGA packages. Their compact size and high pin density make them suitable for advanced applications where space is limited.

Challenges Faced in BGA Soldering

Component Alignment and Placement

One of the primary challenges in BGA soldering is ensuring accurate component alignment and placement on the PCB. The small size of the solder balls and the dense layout of the BGA package make it difficult to achieve precise positioning. Misalignment during the assembly process can result in solder bridges, open connections, or mechanical stress on the package.

To address this challenge, manufacturers employ advanced technologies such as Automated Optical Inspection (AOI) and X-ray Inspection. AOI systems use cameras and image processing algorithms to verify the correct alignment and placement of BGA components. X-ray inspection, on the other hand, allows manufacturers to see beneath the surface of the PCB and detect any misalignment or defects that may not be visible to the naked eye.

Solder Paste Application

Another significant challenge in BGA soldering is achieving precise and consistent solder paste application. Solder paste, a mixture of solder alloy and flux, is applied to the PCB pads before placing the BGA package. Inadequate or excessive solder paste can lead to solder defects such as insufficient solder joints, solder voids, or solder bridging.

To overcome this challenge, careful attention must be given to stencil design and aperture selection. Stencils with appropriate thickness and properly sized apertures ensure accurate solder paste deposition. Additionally, manufacturers can employ Solder Paste Inspection (SPI) systems to verify the quality and consistency of the solder paste applied. The solder paste that Best Technology uses is SAC305 solder paste, which has good printability and excellent stability.

Temperature Profiling

Temperature profiling, or we can say the thermal management, it is crucial in BGA soldering to ensure proper reflow of the solder paste. The reflow process involves subjecting the PCB to a carefully controlled temperature profile, allowing the solder paste to melt, form a reliable joint, and solidify. Inadequate temperature profiling can lead to insufficient solder wetting, incomplete reflow, or thermal damage to components.

Manufacturers must optimize the reflow oven setup and calibration to achieve the correct temperature profile. Thermal profiling techniques, such as the use of thermocouples and data loggers, help monitor and control the temperature during the reflow process.

Reflow Process

The reflow process itself presents challenges in BGA soldering. The soak zone, ramp rates, and peak temperature must be carefully controlled to prevent thermal stress on the components and ensure proper solder reflow. Inadequate temperature control or improper ramp rates can result in solder defects such as tombstoning, component warpage, or voids in the solder joints.

Manufacturers need to consider the specific requirements of the BGA package and follow recommended reflow profiles provided by component suppliers. Proper cooling after reflow is also essential to prevent thermal shock and ensure the stability of the solder joints.

Inspection and Quality Control

Inspection and quality control are critical aspects of BGA soldering to ensure the reliability and performance of the solder joints. Automated Optical Inspection (AOI) systems and X-ray inspection are commonly used to detect defects such as misalignment, insufficient solder wetting, solder bridging, or voids in the solder joints.

In addition to visual inspection techniques, some manufacturers may perform cross-section analysis, where a sample solder joint is cut and examined under a microscope. This analysis provides valuable information about the quality of the solder joint, such as solder wetting, void formation, or the presence of intermetallic compounds.

In a word, BGA soldering presents unique challenges in electronics manufacturing, primarily related to various factors. By addressing these challenges effectively, manufacturers can ensure the reliability and performance of BGA solder joints, contributing to the production of high-quality electronic devices. Best Technology has rich experience in PCBA assembly and we mounted thousands PCBs for our customers, whatever it is simple design or complex design, all the products are assemble perfect and work well in customer side. Please feel free to contact us for any questions about PCBA.

Key Challenges in Solder Mask Printing for Heavy Copper PCBs

Tuesday, May 23rd, 2023

As the demand for higher power and miniaturization of electronics increases, so does the need for Heavy Copper Printed Circuit Boards (PCBs). From our last blog – Why choose Heavy Copper PCB for your High Current Project, we know the heavy copper PCBs are defined as those with copper thicknesses greater than 3 oz. These PCBs are designed to withstand high current and thermal loads, making them suitable for power electronics applications. However, the increased copper thickness also poses challenges during the solder mask printing process.

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Understanding solder mask

Solder mask (short for S/M in the industry) is a protective coating applied to PCBs to prevent solder bridges and improve solder joint quality. The solder mask is coated to the PCB surface using a screen-printing process, where the desired pattern is created using a stencil and the solder mask ink is then deposited onto the PCB. The ink is then cured, either through heat baking or UV light, to form a solid coating.

There are several types of solder mask materials available, including epoxy, acrylic, and liquid photo imageable (LPI) solder mask. Each type has its advantages and disadvantages, depending on the application requirements.

The benefits of using solder mask in PCB manufacturing include increased reliability, improved solderability, and reduced risk of short circuits and corrosion. The solder mask we usually use is Taiyo, which has high reliability and excellent heat resistance.

Challenges in solder mask printing of heavy copper PCBs

While solder mask printing is a critical step in PCB manufacturing, the increased copper thickness in heavy copper PCBs presents several challenges for printing process as I mentioned before. It’s difficult to apply enough solder mask to cover thick copper pattern and base material with severe height difference.

1. The high copper thickness and thermal conductivity of heavy copper PCBs make it difficult for the solder mask ink to adhere properly to the surface. This can result in insufficient coverage and registration accuracy, which can affect the overall quality and reliability of the PCB.

2. The high copper thickness can cause stress on the solder mask, leading to mask cracking and peeling. The navigation mark on the substrate has specific ink thickness requirements due to limitations in the ink thickness that can be applied to the substrate. If the ink thickness on the substrate is too thick, it may result in solder resist cracks in the substrate position after the printed circuit board is soldered. This can occur during reflow soldering or thermal cycling, resulting in poor solder joint quality and reduced reliability.

3. The thick solder mask is also more difficult to exposure and develop. If the exposure energy is too weak or not enough, then some undercut problem may happen.

How to overcome this challenge?

To address these challenges, it is essential to choose the right solder mask materials and optimize the application process.

Choosing the right solder mask materials is crucial for ensuring proper adhesion and coverage on heavy copper PCBs. LPI solder mask is often preferred for heavy copper PCBs due to its excellent adhesion and thermal stability. However, epoxy and acrylic solder mask materials can also be used with proper surface preparation.

Optimizing the solder mask application process can also help address the challenges of heavy copper PCBs. This can include using a thinner stencil for improved registration accuracy and applying multiple coats of solder mask for better coverage. Advanced solder mask technology, such as laser direct imaging (LDI), can also help improve registration accuracy and reduce the risk of mask cracking and peeling.

Optimizing the printing process, now in Best Technology, we always make the substrate first, fill the substrate with the solder mask and then treat it as a normal PCB for normal printing solder mask.

If you are in the process of designing a complex multi-layer heavy copper PCB and are looking for a high-quality and experienced manufacturer, feel free to reach out to us at sales@bestpcbs.com, Best Technology can support you by OEM and ODM service to ensure your design is cost-effective and can be easily manufactured.

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