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Video Decoder Hardware PCB Design Case Example
Tuesday, June 25th, 2024

A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:

Video decoder

[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI

[2]: Single pair differential line, 10G optical network, memory of DDR4

[3]: 12 layers PCB

Why choose us?

We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:

  • Professional engineer evaluation
  • DFM analysis
  • One-time successully on prototyping
  • SI analysis of signal integrity
  • Electromagnetic compatibility (EMC) analysis

Contact us if you have any questions.

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High Speed PCB Design Guidelines, PCB Camera Design Case
Tuesday, June 25th, 2024

When designing high-speed PCBs, several critical factors must be considered to ensure optimal performance. These include signal integrity, impedance control, and minimizing electromagnetic interference (EMI). Below is an ultra high speed camera PCB solution made by Best Technology:

An ultra-high-speed camera rigid-flex circuit board

[1]: XCKU060 chip

[2]: 20A maximum current

[3]: Four DDR4 channels

[4]: 20 layers PCB

High Speed PCB Design Guidelines, PCB Camera Design Case

Camera PCB design considerations:

1. When the Camera adopts a connector: when the MIPI differential signal passes through the connector, the adjacent differential signal pairs must be isolated using GND pins; If it is not convenient to punch holes, the spacing between the difference pairs is at least 15mil.

2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.

3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.

4. The Camera layout needs to be far away from high-power radiation devices, such as GSM antennas.

5. CIF/MIPI and other signals, if there is a board to board connection through the connector, it is recommended that all signals be connected with a certain resistance value (between 2.2ohm and 10ohm, depending on the SI test), and reserve TVS devices.

Best Technology offers one-stop solutions for our values customers. And we provide free technical support for our customers. If you have similiar requirements, welcome to contact us at any time!

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Differential Signal PCB Design, Fiber Optical SFP Module
Tuesday, June 25th, 2024

PCB design is one of an important process before the PCB manufacturing, it determines the overall performance of the whole product. We are an experienced PCB design and manufacturing vendor, with our professional technical team and advanced evaluated tools, we can make sure the PCB design one-time success. Today, we shared a example of fiber optical SFP modules design:

32X100G(QSFP28) large capacity convergence shunt

[1]: Marvell: 98CX8522

[2]: Single pair differential line, 25G optical network

[3]: 16 layers PCB

How to design a SFP optical module PCB?

SFP optical module interface PCB design depends on many aspects, including interface signal processing, timing control, power management and so on.

1. Determine the interface standard: SFP optical module interface standards, such as SFP, SFP+, QSFP and so on, you need to choose the appropriate interface standard according to the specific needs.

2. Choose the chip solution: According to the interface standard, choose the appropriate chip solution, usually including constant voltage source, amplifier, comparator, clock generator, EEPROM, etc.

3. Signal processing: For receiving and sending signals, filtering, amplification and comparison are required to ensure signal quality and stability.

4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.

5. Power management: SFP optical module interface requires multiple power supplies, including Vcc, VCC-TX, VCC-RX, etc. Reasonable power management is required to ensure the stability and reliability of the power supply.

6. PCB design: According to the above requirements, PCB design is carried out, considering signal isolation, layering layout, status separation, signal integrity and other factors.

Feel freely to send message us if you are interested in PCB design.

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Motherboard Network Adapter PCB Design Solution Example
Tuesday, June 25th, 2024

A motherboard network adapter PCB comprises several key components, each playing a vital role in ensuring effective network connectivity. And between them, the PCB is the most important. Now, best technology is sharing an example about motherboard network PCB design.

10G/100G large capacity convergence shunt

[1]: Marvell: 98DX8548

[2]: 21A maximum current

[3]: Single pair differential line, 10G and 25G optical networks

[4]: 10 layers PCB

What are the considerations before PCB design?

PCB design involves several steps and some considerations need to be noticed. If you are a designer, think about these points before starting the design.

  • Manufacturing: prototyping study or mass production.
  • What it will be used in?
  • What kind of production technology it will used?
  • Material?
  • How many layers you want?
  • Whether need to do impedance control?

Best Technology has more than 17 years in this industry, we have served for over 1200 customer all around the world. Our goal is to provide customer with best solutions and top notch quality products, and it is luckily that we did a good job. If you want to work with us or need a PCB manufacturer in Asia, contact us right now!

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High Speed PCB Design, Industrial PCB Case Sharing
Tuesday, June 25th, 2024

A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. Best Technology is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.

32 x 400GE industrial switch

[1]: Marvell-400G chip

[2]: 200A maximum current

[3]: Single pair differential line 56G optical network

[4]: 24 layers high power PCB

What’s the Best Material for High-Speed PCB Design?

Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

  • FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.
  • Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.
  • Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.

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Network Motherboard Design for Network Switching Cases
Tuesday, June 25th, 2024

Best technology offers numerous PCB design solutions for our customer, from HDI design, high speed device PCB design, AI optical module design and network motherboard design for network switching. Below is one of our network motherboard design solutions:

An ATCA network switching motherboard

[1]:BCM88XXX, BCM55XXX chips

[2]:60A maximum current

[3]:8口10G optical network

 [4]:  8 x DDR3 chips

Network Switching Differential Pair Design Guide

  • Each TrxP/TrxN signal group (where xcx0-3) shall be routed as a differential pair. This includes the entire length of wiring processing.
  • The individual differential correspondences are packed together as tightly as possible. Impedance calculations are usually started by selecting the smallest line blank (4-5mil). The tracking width is then adjusted to achieve the necessary impedance.
  • Differential line group resistance of Ethernet is calculated at 100 ohms.
  • In general, when routing the four differential pairs of the Gigabit Ethernet to the r45 connector, at least one pair will pass through to the opposite outer layer.
  • Priority should be given to differential pair wiring. Terminals should be added after the routing is determined
  • The values of all resistance terminals in the Ethernet front end should be 1.0% tolerance
  • All capacitor termination Ethernet front ends in the module should have strict tolerances and high quality product media (npo)

You are welcome to contact us if you want to get your DIY network switching PCB designs.

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Industrial Motherboard Design, Industrial PCB Case Sharing
Monday, June 24th, 2024

Best technology engaging in the PCB manufacturing and PCB design for more than 17 years. With a strong R&D team, we can provide customers with fast and valued PCB design solutions. Here is one of our industrial motherboard design & industrial PCB case sharing for your reference. If you want to get your own industrial PCB design, welcome to contact us.

A mITX architecture industrial control motherboard

[1] Intel Xeon E3, Core™ i7/i5, Celeron G3900E processors

[2]:2x DDR4 SODIMM 2133 MHz (up to 32 GByte)

[3]:4x SATA Gen 3.0

[4]:1x PCIe x16 (Gen 3)

[5]:2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +

2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)

Industrial PCB Design Considerations

  • Control the length of the circuit: Minimize the length of the circuit, especially the key signal lines, to reduce signal attenuation and delay.
  • Avoid sharp angles and right angles: Right angles and sharp angles should be avoided when wiring, and rounded or 45 degree angles should be used as far as possible to reduce signal reflection and impedance discontinuity.
  • Line width: Determine the line width according to the current size and thermal requirements to ensure the reliability and stability of the circuit.
  • Inter-layer wiring: Rational use of multi-layer PCB inter-layer wiring, such as the signal line on the inner layer, power and ground wire on the outer layer.
  • Impedance control: For high-speed signals, it is necessary to control the line impedance to ensure signal integrity, and carry out impedance matching design if necessary.
  • Avoid cross and parallel wiring: Try to avoid cross and parallel wiring of signal lines to reduce crosstalk and electromagnetic interference.

Contact us if you have any questions and inquiry about industrial PCB design projects.

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PCB design: how to optimize component placement ?
Friday, June 21st, 2024

PCB design not only including the routing layout, component placement also is a key parameter. It involves understanding electrical parameters, signal integrity, and thermal management. This article will introduce several golden rules of how to optimize your component placement, whether you are a novice or a seasoned professional, it is helpful for you to manage your circuit board design greatly.

  • Determine the power supply and grounding plane

In the early stage of PCB design, reasonable power supply and grounding layout is the key. The power supply and ground plane not only provide a stable power supply for the components, but also play a role in reducing electromagnetic interference (EMI). To begin the layout, the first thing is confirming the location of the power supply and ground area. Usually, the power is placed in a complete layer of the PCB, and the ground is in another layer, which can effectively reduce the power supply noise.

Make sure the power plane is close to the area where high power is needed, which can reduce the voltage drops along the supply path. The ground area should be as large and continuous as possible, this helps to provide a good return path and reduce interference from high-frequency signals.

  • Differentiate layouts by function

When laying out components, dividing the circuit board into different functional areas can improve the efficiency and performance of the design. For example, you can separate power supply into signal processing area, power management area, and interface. This method helps to reduce the mutual interference between different circuits and improve the overall stability of the circuit.

Please noted that, high-frequency components should be close to connectors or key interfaces to shorten the signal path and reduce interference. Low-frequency components can be placed away from critical signal paths to optimize overall signal integrity.

  • Keep short and direct trace

Shortening the length of signal lines is another important thing to optimize component layout. Make sure keep them short and direct as possible. Long distance signal routing may lead to signal attenuation and delay, which will affect the overall performance of the circuit. Placing the relevant components as close as possible. This not only reduces the length of the circuits, but also reduces the coupling and interference between the signals.

How to optimize component placement during the PCB design?

In addition, in the routing process, try to avoid right-angle (90 degrees) turns. Because the right angle will cause signal reflection, affecting the integrity of the signal. Try to use 45 degree turns or arc turns to reduce signal loss.

  • Consider heat dissipation requirements

Heat management is an important consideration when placing high-power components. Place power components in the edge area of the PCB, such as power transistors and high-frequency converters. This facilitates the use of natural air flow for heat dissipation and convenient for the installation of external cooling devices.

In high-density designs, through-holes, vias and cooling copper blocks can be designed on the PCB, which can transfer heat to the inner layer or bottom of the PCB to help dissipate heat. In addition, maintain a reasonable distance between each component to promote air flow and heat dissipation.

  • Optimize test points position

Consider placing test points in a convenient location for testing and debugging. Placing test points close to relevant components simplifies the debugging process and reduces test complexity. In particular, the placement of test points on the key signal path can facilitate the detection and verification of signal integrity and stability in the design stage.

For example, the discrete components required for OpAmp operational amplifiers can be placed close to the device, so that the bypass capacitors and resistors can work with them. This helps to optimize the wiring length mentioned as above, while also making testing and fault detection easier.

  • Consider DFM & DFA factors

Optimizing component layout takes into account not only electrical performance, but also the actual requirements of manufacturing and assembly. For example, try to avoid placing components on both sides of the PCB to simplify the PCBA assembly process. The components are arranged neatly and spaced consistently, which helps the automated assembly equipment to operate efficiently and reduce assembly errors.

How to optimize component placement during the PCB design?

Properly using DFM (Design for Manufacturability) principles make production easier and more cost-effective. Ensure that your design can be fabricated with standard processes.

  • Perform DRC as often as possible

Although it only takes a short time to run DRC (Design Rule Check) functionality on PCB software. But in some complex design environments, perform checks during the design process can save a lot of time, which is a good habit to keep. Every layout routing decision is critical, and running DRC can remind you of the most important layout at any time.

  • Check production files before sending to manufacturer

While most of PCB manufacturers are happy to download it directly and verify it for you, it is best to export the Gerber file yourself and use the free software such as Gerberv to check that it is as expected to avoid misunderstandings. By verifying it yourself, you may even find some inadvertent errors and thus avoid the cost of completing the production according to the wrong parameters.

Successful PCB design cases – Best Technology

A: A mITX architecture industrial control main board

[1] Intel Xeon E3, Core™ i7/i5, Celeron G3900E processors

 [2]:2x DDR4 SODIMM 2133 MHz (up to 32 GByte)

 [3]:4x SATA Gen 3.0

 [4]:1x PCIe x16 (Gen 3)

 [5]:2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +

2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)

Anyway, communicating with your manufacturer to understand their equipment and processes can optimize the design, reduce manufacturing problems, improve production efficiency and product quality.

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PCB Design: What Every Designer Needs to Know
Wednesday, June 19th, 2024

Although semiconductor integration is increasing, many applications have ready-to-use systems on chip. And there are various powerful and out-of-the-box development boards are becoming more readily available, many use cases in electronics still require the use of custom PCBs. In one-time development, even an ordinary PCB can play a very important role. This article will introduce several golden rules of PCB design, and are widely applicable to various PCB design projects.

What are the golden rules of PCB design?

The golden rules of PCB design serve as the foundation for a robust layout. Remember below top 5 rules can help you in PCB designing.

  • Optimize component placement
  • Select correct crosstalk
  • Make sure short and straight circuits
  • Manage the distribution of power and ground circuit whenever possible.
  • Avoid sharp angles in traces, opting for 45-degree turns instead.

Additionally, always perform Design Rule Checks (DRC) to catch potential issues before finalizing the layout. These checks help ensure compliance with manufacturing and performance standards.

PCB Design: What Every Designer Needs to Know

What are the top 3 important steps in PCB design and layout process?

The PCB design and layout process has many important steps, but these three processes should be given priority.

1. Schematic design and component selection

Start by creating a detailed schematic diagram of your circuit board. As a designer, you can choose discrete components with high or low component values, but with the same performance. By consolidating within a smaller range of standard values, the bill of materials (BOM) can be simplified and potentially cost reduced.

Select suitable components based on the requirements of your design, considering factors like voltage, current, and signal frequency. A clear and precise schematic is essential. It helps avoid errors and streamlines the layout process, making it easier to place and route components effectively.

2. Component placement

Arrange components strategically on the board. Place critical components like microcontrollers and high-frequency ICs first, followed by supporting components. Consider heat dissipation and accessibility for debugging. If you have a range of PCB products based on preferred component values, it will also help you make the right inventory management decisions in the longer term.

3. Routing

Routing including connecting the components with traces. Prioritize routing for critical signals first, such as clock lines and high-speed data paths. Use the shortest possible paths and avoid crossing different signal types to reduce interference. After critical traces, route the power and ground nets, followed by less critical signals. Utilize multiple layers if needed to keep the layout clean and manageable.

PCB Design: What Every Designer Needs to Know

What are the guidelines for PCB layout?

PCB layout guidelines can help designers achieve optimal component placement and ensure the board is easy to assemble. Here are some things to consider:

1. Trace width and spacing

Maintain appropriate trace width and spacing based on current carrying capacity and voltage levels. The IPC-2221A standard provides recommendations on PCB trace width and spacing. According to this standard, the trace width must be selected based on current-carrying capacity and permissible temperature rise. For instance, a 1mm wide trace with 1oz. copper (35μm) can carry approximately 2.5A with a 10°C temperature rise.

2. Layer stack-up

Design your PCB stack-up carefully. Multilayer designs are typically used in high-frequency applications to effectively separate power, ground, and signal layers, thereby reducing electromagnetic interference (EMI). Studies show that in a 4-layer or more stack-up, closely coupling the power and ground planes can significantly reduce EMI and improve signal integrity.

PCB Design: What Every Designer Needs to Know

3. Thermal management

Consider thermal aspects in your layout. Place components that generate significant heat, such as power transistors, away from heat-sensitive components. Use thermal vias and heat sinks to manage heat dissipation effectively.

4. Via placement

Use vias strategically to connect different layers. Avoid placing too many vias close to high-frequency signal paths to prevent signal degradation. Use via stitching to enhance ground planes and reduce loop areas.

5. Power distribution

Using wide traces for power and ground planes is critical to minimizing resistance and inductance. For instance, IPC-2152 provides guidelines on power distribution and suggests using wide traces to handle higher currents and minimize voltage drops.

What are the considerations of PCB layout?

When designing a printed circuit board, you can consider these points:

1. Signal integrity

Maintain signal integrity by minimizing trace lengths and avoiding impedance mismatches. Use differential pairs for high-speed signals and keep them close together to reduce noise.

2. EMI/EMC

EMI and EMC are critical considerations. Use proper shielding and grounding techniques to mitigate interference and ensure compliance with regulatory standards.

3. Design for Manufacturability (DFM)

Ensure your layout is manufacturable by adhering to fabrication capabilities and tolerances. Simplify routing and avoid excessive component density to facilitate easier assembly and inspection.

PCB Design: What Every Designer Needs to Know

4. Mechanical constraints

Consider the physical dimensions and mounting requirements of your PCB. Ensure that components and traces do not interfere with mechanical parts or enclosures.

5. Cost

Optimize your design for cost by reducing layer count where possible and minimizing the use of expensive materials or processes. Balance performance requirements with budget constraints.

At Best Technology, we offer expert design services to help you achieve your project goals with precision and excellence. Choose us for your next PCB project and experience the benefits of quality and innovation.

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Bus Bar PCB: What are the Considerations During Designing?
Saturday, June 8th, 2024

In the electronics industry especially for new-energy vehicles, a Bus Bar PCB plays an important role to achieve specific function. It transmits large amounts of current through metal strips or conductive paths, making it ideal for high-power applications. The design of busbar PCBs is a key technical area for designers or engineers who engaged in power distribution or who require efficient current management. In this article, we would like to share some information about the considerations during a bus bar circuit board designing, hope this may help you to design a desired PCB successfully.

What is a Bus Bar PCB?

Bus bar PCB is one of a new type of heavy copper PCB and it was made by FR4 fiber glass material and laminated with metal alloys.  It transmits electrical energy from one point to multiple output points through integrated conductive paths, which are typically made of copper or aluminum. Busbar PCBs are designed to reduce resistance and inductance, thereby maximizing current transfer efficiency and minimizing energy loss.

bus bar pcb design

Generally, if it is used in a charging pile product, there are generally at least 2 busbar circuit boards, one is the main control board (a larger one), and the other is a smaller board, both of two need to use the bus bar process.

Bus bar PCB is widely used in power distribution systems, electric vehicles, industrial equipment and other occasions requiring high current. They are designed to simplify system wiring, reduce electromagnetic interference (EMI), and improve overall reliability and performance of the product.

Why is High Current Bus Bar PCB Important?

Bus bar PCB has irreplaceable advantages in current transmission and power distribution. They mainly feature three functions when used in electronics. First of all, they are able to efficiently handle large currents without generating excessive heat. This is what standard FR4 PCB cannot achieved. Secondly, bus bar PCB has ability to significantly reduce the complexity of the circuit layout design. By integrating the current transfer path, they can reduce the number and length of circuits required by the system, thereby simplifying system design and reducing potential failures.

In addition, bus bar PCB helps reduce electromagnetic interference. Due to the design optimization of the conductive path, the noise generated during current transmission can be effectively suppressed. This characteristic makes it perform well in high-noise environments, ensuring the stability and reliability of electronic devices.

What Should We Consider When Designing A Bus Bar PCB?

Due to it is a new innovation in the industry, it is a not a simple thing to design a bus bar circuit board successfully. It’s a complex task that requires consideration of several technical factors to ensure its effectiveness and reliability. The following are the main aspects to focus on when designing a bus bar PCB.

  • Copper Thickness

The first important thing is what’s the copper thickness of busbar you want to. You must know, thicker copper allows for higher current carrying capacity, but not thicker thickness is better, it should be calculated according to the voltage and current it will used in.

  • Current capacity and temperature management

The bus bar PCB should be designed to carry the maximum expected current while keeping the temperature within a safe range. This is usually achieved by selecting the appropriate conductor material and optimizing the cross-sectional area of the conductor. For example, for 100A current requirements, a typical design would use copper strips with a thickness of 5mm to ensure that the temperature rise does not exceed 20C.

bus bar pcb design
  • Resistance and inductance

Low resistance and low inductance are key to bus bar PCB design. The shape, thickness and layout of conductors should reduce resistance and inductance as much as possible to improve the efficiency of current transmission. For example, the use of trapezoidal or flat conductors can effectively reduce inductance, thereby improving current transmission performance.

  • Electromagnetic compatibility (EMC)

Bus bar PCB design also needs to consider electromagnetic compatibility issues to ensure that it does not produce too much electromagnetic interference (EMI), while being able to resist external electromagnetic interference. By optimizing the conductor layout and using shielding materials, the electromagnetic compatibility of the bus PCB can be significantly improved.

  • Thermal management

Because bus bar PCB aims to transmit high current, thermal management is an important part of the design. The thermal design should ensure that the PCB can effectively dissipate heat and prevent overheating damage. For high power applications, radiators or active cooling are often used to ensure temperature control within design specifications.

bus bar pcb design

Best Technology Manufacturing Capability of Bus Bar PCBs

As the one of leading PCB manufacturers in China, Best Technology has exceptional capabilities in the production of busbar PCBs. Our manufacturing capabilities include high-precision metal processing technology to produce busbar PCBs with complex geometry and tight tolerances. In addition, we also have the production capacity of multi-layer bus bar PCB to meet the needs of different applications.

Best Technology is committed to providing customers with high-quality, high-performance busbar PCBs to support their power management and distribution systems. Below is a basic parameter of our bus bar PCB manufacturing capability. For more details, welcome to e-mail us at sales@bestpcbs.com.

Best technology capability of bus bar pcb
(Best technology capability of bus bar pcb)

Nowadays, bus bar PCBs are widely used in power distribution systems, electric vehicles, industrial equipment and other occasions requiring high current. According to statistics, the global busbar market is expected to grow at a compound annual growth rate (CAGR) of 6.5% between 2023 and 2028, demonstrating the growing importance of this technology in multiple industries.

With the rapid development of the eras, the most important thing for designers or buyers is to find a reliable bus bar PCB manufacturer to meet the high demands of the market. As the expert of the bus bar PCB fabricating, Best Technology has the mature technology and advanced equipment to produce high quality bus bar PCBs. Contact us right now to get your own bus bar PCB solutions!

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