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What is Metal Core Printed Circuit Board and Its Advantages?
星期二, 23 7 月, 2024

Metal core printed circiut boards are used where a large of heat are generated in the circuit, and the heat needs to be dissipated quickly to avoid overheat. These boards offer good thermal conductivity and dimensional stability. The aluminum core can reduce the overall weight of your board.

What is Metal Core Printed Circuit Board?

A metal core printed circuit board (MCPCB) is a type of PCB that incorporates a metal core, usually aluminum or copper, as its base material. This core helps to enhance the board’s thermal management capabilities. Unlike traditional PCBs made of fiberglass (FR4), MCPCBs are designed to dissipate heat more effectively, making them ideal for applications where heat dissipation is crucial.

MCPCBs are also referred to as insulated metallic substrate (IMS), or insulated metal PCBs (IMPCB), thermal-clad PCBs. A typical metal core PCB is made of thermal insulating layer (dielectric layer), metal base and copper foil.

The basic constructure of a metal core circuit board includes:

  • Silkscreen
  • Solder mask (S/M)
  • Circuit layer (copper foil layer)
  • Dielectric layer
  • Metal core base

What are Metal Core PCBs Used For?

Metal core PCBs are popular because of its good thermal management. It utilizes in various applications that demand efficient heat dissipation and high thermal performance. Here are some common applications that metal core printed circuit board will be used in.

  • LED lighting

MCPCBs are widely used in LED lighting systems due to their excellent thermal management properties. LEDs generate a significant amount of heat, and metal core PCBs help to dissipate this heat effectively, ensuring longer lifespan and consistent performance of the LEDs.

  • Power supplies

High-power supply units benefit from MCPCBs as they can handle the heat generated by power components. This helps in maintaining the stability and efficiency of the power supply over time.

  • Automotive electronics

In the automotive industry, MCPCBs are used in various electronic control units (ECUs), lighting systems, and other high-power applications. The robust nature of MCPCBs makes them suitable for the harsh conditions experienced in automotive environments.

  • Industrial equipment

Industrial machinery and equipment that operate under high temperatures or require high power output use MCPCBs for their thermal management capabilities. This ensures the reliability and longevity of the equipment.

  • Telecommunications

Telecommunications equipment, such as base stations and routers, use MCPCBs to manage the heat generated by high-speed and high-frequency operations, ensuring uninterrupted performance and reliability.

  • Consumer electronics

High-performance consumer electronics, including laptops, smartphones, and gaming consoles. They install with MCPCBs to manage heat and improve device performance and lifespan.

What are the Advantages of Metal Core PCB?

Metal core PCBs are preferred for several reasons, primarily revolving around their superior heat dissipation capabilities and mechanical strength. Here are some main advantages of metal core PCBs.

  • Superior thermal management
  • Mechanical strength
  • Compact design
  • Enhanced performance
  • Improved reliability
  • Higher recyclability
  • Cost Efficiency
  • Dimension stability
  • Size reduction
  • Longer lifetime

What Metal is Used in PCBs?

The choice of metal in PCBs significantly affects their thermal and mechanical properties. The most commonly used metals in MCPCBs are aluminum and copper. Here’s a closer look at these materials:

Aluminum

          • Thermal Conductivity: Aluminum has a thermal conductivity of approximately 1.0 to 2.0 W/mK, making it an excellent material for heat dissipation.
          • Cost-Effective: Aluminum is relatively inexpensive compared to other metals, making it a cost-effective choice for many applications.
          • Lightweight: Aluminum is lighter than copper, which can be beneficial in applications where weight is a concern.
          • Corrosion Resistance: Aluminum naturally forms a protective oxide layer, enhancing its resistance to corrosion.

          Copper

          • Thermal Conductivity: Copper has a higher thermal conductivity than aluminum, ranging from 3.0 to 5.0 W/mK, providing superior heat dissipation.
          • Electrical Conductivity: Copper is also an excellent conductor of electricity, which can improve the electrical performance of the PCB.
          • Durability: Copper is more durable and resistant to wear and tear compared to aluminum, making it suitable for more demanding applications.
          • Higher Cost: Copper is more expensive than aluminum, which can increase the cost of the PCB but is justified in applications requiring superior performance.

          Other Metals

          In some specialized applications, other metals like stainless steel or alloys might be used, but these are less common due to their specific properties and higher costs.

          What is the difference between FR4 PCB and Aluminum PCB?

          Aluminum PCB is a material based on aluminum base material, coated with an insulating layer and other conductive layers on the aluminum base material. FR4 is a glass fiber reinforced laminate, made of multi-layer fiber cloth and resin composite. In the following, we will introduce the difference between aluminum substrate and FR4 in terms of thermal conductivity, mechanical strength, manufacturing difficulty, application range and thermal expansion coefficient.

          1. Aluminum substrate has good heat dissipation, and its thermal conductivity is about 10 times that of FR4.

          2. The mechanical strength and toughness of the aluminum substrate are better than FR4, which is suitable for installing large components and making large-area pcb boards.

          3. The production of aluminum substrate requires more process steps, and its production process is more complex than FR4, and the production cost is higher than FR4.

          4. The aluminum substrate is suitable for high-power electronic products such as LED lighting, power supplies, inverters and solar inverters, and FR4 is suitable for low-power electronic products such as televisions, telephones and electronic game consoles.

          5. The thermal expansion coefficient of aluminum substrate is close to that of copper foil, which is smaller than that of FR4, which is good for ensuring the quality and reliability of the circuit board.

          How to Design Metal Core PCB?

          Designing a metal core PCB is a complex process that includes several crucial steps. During the design, we should ensure the board meets the thermal, electrical, and mechanical requirements of the application. Below is a detailed guide to the MCPCB design process.

          1. Define the Application Requirements

          Before starting the design process, it’s essential to clearly define the requirements of your application. This includes understanding the thermal, electrical, and mechanical needs of the project. Determine the maximum operating temperature and the amount of heat that needs to be dissipated, ensuring the MCPCB can handle the thermal load effectively. Specify the electrical characteristics such as current load, voltage levels, and signal integrity requirements to ensure the board can deliver the necessary performance.

          2. Select the Core Material

          As mentioned above, there are two common metal materials used in this industry: aluminum alloy and copper core. They have unique characteristics and properties when used in device. So. choosing the appropriate metal core material is crucial for the performance of your electronic device. This table provides a side-by-side comparison of aluminum alloy and copper core materials, helping to choose the appropriate material when designing MCPCBs.

          PropertyAluminumCopper
          Thermal Conductivity1.0 – 2.0 W/mK3.0 – 5.0 W/mK
          Electrical ConductivityLower than CopperHigh
          WeightLightHeavy
          CostLowerHigh
          Mechanical StrengthGoodExcellent
          Corrosion ResistanceNatural Protective Oxide LayerRequires Additional Protection
          Thermal Expansion CoefficientHigherLower
          MachinabilityGoodMore Difficult
          Environmental ImpactRecyclableRecyclable
          Application AreasLED Lighting, Consumer Electronics, High-PerformanceElectronics, Industrial Equipment

          3. Determine the Layer Stack-Up

          The layer stack-up defines the arrangement of the different layers in the PCB. A typical MCPCB stack-up includes:

          • Top Copper Layer: The conductive layer where components are mounted.
          • Dielectric Layer: An insulating layer that separates the copper layer from the metal core. It has good thermal conductivity to transfer heat from the components to the metal core.
          • Metal Core: The central layer made of aluminum or copper, which acts as a heat spreader.
          • Bottom Copper Layer (optional): Used in double-sided MCPCBs for additional routing of traces.

          4. Design the Circuit Layout

          The circuit layout includes placing components and routing traces on the PCB. Key considerations include strategically placing heat-generating components to ensure efficient heat dissipation and keeping sensitive components away from high-heat areas. Trace routing should minimize electrical interference and maintain signal integrity, using wider traces for high-current paths to reduce resistance and heat generation. Implementing thermal vias enhances heat transfer from the top copper layer to the metal core by using plated through holes that connect the copper layer to the metal core, facilitating better heat dissipation.

          5. Design for Manufacturability (DFM)

          Ensuring that your design can be efficiently manufactured is critical. Maintain adequate clearances between traces, pads, and other features to meet MCPCB manufacturing capabilities and avoid short circuits. Use standard drill sizes to reduce manufacturing complexity and cost. Apply a solder mask to prevent solder bridges and protect the copper traces from oxidation. Use clear and legible silkscreen markings for component identification and assembly instructions. You can communicate with your supplier and ask for a capability chart, so that can save much time on design phase.

          6. Prototype and Test

          Once the design is validated, create a prototype of the MCPCB and conduct thorough testing. Measure the actual thermal performance under operational conditions to verify the simulation results. Test the functionality of the PCB in the intended application environment to ensure it meets all performance requirements. Conduct reliability tests such as thermal cycling, vibration testing, and humidity testing to assess the durability of the MCPCB.

          Best Technology – A Leading MCPCB Manufacturer in Asia

          With 18+ years of experience in the PCB industry, Best Technology has a deep understanding of the complexities involved in MCPCB production. Our team of experts is adept at designing and manufacturing MCPCBs that deliver optimal performance. Best Technology offers customized turn-key solutions tailored to the specific needs of our clients. Whether it’s a unique design requirement or a specific material preference, we provide flexible options to meet diverse demands.

          Contact Best Technology, get your quote right now to make your own metal core circuit boards!

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          How does a DPC Ceramic PCB Manufactured?
          星期六, 6 7 月, 2024

          Direct Plating Copper (DPC) is a ceramic circuit board developed on the basis of ceramic film processing. Aluminum nitride/alumina ceramic is used as the substrate of the circuit, and the composite metal layer on the surface of the substrate is sputtered, and the circuit is formed by electroplating and lithography. Its basic processes are:

          • Incoming Quality Control (IQC)

          The process begins with the inspection of raw materials to ensure they meet strict quality standards. This step involves checking ceramic substrates for physical defects such as cracks, chips, or surface irregularities, and verifying material properties like thermal conductivity and dielectric strength. Advanced equipment such as microscopes and X-ray fluorescence (XRF) analyzers are used for thorough inspection, ensuring only the best materials proceed to the next stage.

          • Laser Drilling

          Before laser drilling, a water-soluble, food-grade substrate pigment is brushed onto the ceramic substrate to reduce reflectivity and enhance laser drilling effectiveness. After drying in an oven, a laser drilling machine is used to drill through the substrate, creating pathways for connections between the upper and lower surfaces. Depending on the ceramic material, different laser wavelengths such as infrared, green light, ultraviolet, or CO2 are used to burn away the material with each laser pulse.

          How does a DPC Ceramic PCB Manufactured?
          • Laser Marking

          Laser marking involves using a laser marking machine to engrave product QR codes onto the ceramic substrate. This step ensures precise and permanent identification marks on the PCB.

          • Ultrasonic Cleaning

          After laser drilling and marking, the substrates are cleaned to remove any attached particles or residues. This involves coarse and fine debris removal using ultrasonic cleaning, followed by water washing to eliminate any remaining particles. The cleaned substrates undergo micro-etching to roughen the surface, enhancing the effectiveness of subsequent magnetron sputtering, and are then dried to remove surface moisture.

          • Magnetron Sputtering

          In the magnetron sputtering process, a high-vacuum chamber is used to ionize argon gas, producing an ion stream that bombards a target cathode. This causes atoms of the target material to be ejected and deposited as a thin film on the ceramic substrate. Pre-sputtering treatments such as dust removal, degreasing, and slow pulling are conducted to ensure optimal results.

          • Chemical Copper Plating

          Chemical copper plating thickens the copper layer, improving the conductivity of the vias and ensuring better adhesion with the sputtered copper layer. This catalytic redox reaction involves pre-treatment steps like degreasing, micro-etching, pre-immersion, activation, and acceleration to ensure proper copper deposition.

          • Full-Panel Electroplating

          Full-panel electroplating increases the thickness of the copper layer. This involves processes such as degreasing, micro-etching, acid washing, copper plating, and stripping excess copper from the fixtures. The copper plating uses copper balls as anodes and an electrolyte solution of CuSO4 and H2SO4, with the primary reaction being Cu2+ + 2e- → Cu.

          • Grinding, Laminating, Exposure, and Developing

          Post electroplating, the copper layer is prepared for patterning. This includes acid washing to remove oxides, grinding to roughen and clean the surface, laminating with a photoresist dry film, UV exposure through a photomask to create the desired pattern, and developing to dissolve unexposed areas, leaving behind the patterned photoresist.

          How does a DPC Ceramic PCB Manufactured?

          • Pattern Plating (Electroplating Copper)

          The exposed and developed areas of the substrate where the circuit pattern is defined undergo further copper electroplating to thicken the circuit traces.

          How does a DPC Ceramic PCB Manufactured?
          • Etching and Stripping

          Unwanted copper and dry film are removed through etching, stripping away excess copper deposited in previous steps. This includes rough grinding, film stripping, copper etching, and titanium etching, ensuring only the desired circuit pattern remains.

          • Annealing

          The ceramic boards are annealed in a furnace to relieve stresses introduced during electroplating, enhancing the ductility and toughness of the copper layer and ensuring dense copper grain packing.

          • Belt Grinding

          Post-annealing, the substrate surface may have an oxide layer and rough texture. Belt grinding is used to remove these oxides and smoothen the surface, ensuring the quality of subsequent gold or silver surface treatments.

          • Flying Probe Testing

          High-speed flying probe testers check for continuity and shorts in the vias and circuit traces, ensuring electrical integrity.

          • Sandblasting Before Solder Mask

          Prior to solder mask application, the substrate undergoes sandblasting to roughen and clean the surface, removing oxides and contaminants. This includes acid washing, sandblasting, and micro-etching.

          • Solder Mask Printing

          Solder mask is printed on areas of the PCB that do not require soldering, protecting the circuits during soldering and assembly. Screen printing applies solder mask ink, which is then UV-cured and developed to remove unexposed areas.

          • Sandblasting After Solder Mask

          After solder mask application, exposed areas that need surface treatments undergo sandblasting to roughen the surface and remove oxides, preparing for gold or silver plating.

          • Surface Treatment

          Surface treatments like electroless or electrolytic plating of gold, silver, or other metals are applied to the solder pads, enhancing solderability and preventing oxidation.

          • Laser Cutting

          Laser cutting equipment precisely cuts the finished PCBs from the manufacturing panel, ensuring accurate dimensions and clean edges.

          • Testing

          Various testing equipment, including thickness gauges, Automated Optical Inspection (AOI) machines, and ultrasonic scanning microscopes, are used to inspect the PCBs’ performance and appearance, ensuring they meet quality standards.

          • Packaging and Shipping

          Finally, the PCBs are vacuum-packed using packaging machines to protect them during transport. They are then stored and shipped to customers, ensuring they arrive in perfect condition.

          Above is the all the processes of DPC muanufacturing. If you are interested in process of other PCBs, welcome to contact us.

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          What are the advantages of ceramic PCB?
          星期六, 6 7 月, 2024

          Ceramic PCB is a type of emerging PCB in the recent years, they are known for their high thermal conductivity and low expansion coefficient. Except this, it has numerous advantages that normal FR4 PCB can not achieved. And even for metal core PCB (MCPCB). Today, we are going to introduce their characteristics in detail.

          What are the advantages of ceramic PCB?

          1.  High thermal conductivity

          The core metal content of ceramic circuit boards is as high as 96-98%, which makes them have extremely high thermal conductivity. Compared with ordinary FR4 circuit boards, the thermal conductivity of ceramic circuit boards can reach 170-230 W/mK, while the thermal conductivity of FR4 boards is usually only 0.3-0.4 W/mK. Higher thermal conductivity allows for more efficient heat dissipation, avoiding the problem of damage to electronic components due to overheating. This is particularly important in high-power applications, such as LEDs and power semiconductors.

          2.  Low thermal expansion coefficient

          Ceramic materials have a very low coefficient of thermal expansion (CTE), usually between 6-8 ppm/°C. In contrast, FR4 material has around 14-16 ppm/°C CTE. This means that ceramic materials hardly expand or contract when temperature changes. The low thermal expansion coefficient improves the reliability of the circuit board, reduces the influence of the thermal cycle on the circuit board structure and the connection of electronic components. Especially suitable for use in the environment with frequent temperature changes.

          What are the advantages of ceramic PCB?

          3.  High surface hardness

          The surface hardness of ceramic materials is up to 9 Mohs, which is harder than aluminum oxide and silicon. It means ceramic PCB has more wear-resistant, scratch resistant, and not easy to damage. It enables to run stably for a long time even in harsh physical environments, extending the service life of the board. That is why ceramic PCB is always recommended to use in military.

          4.  High compressive strength

          The compressive strength of the ceramic circuit board can reach 450-500 MPa, which can withstand large mechanical pressure without deformation or rupture. This characteristic makes them excellent in applications that require them to withstand mechanical stress, such as industrial automation and aerospace.

          5.  High dielectric strength

          Ceramic PCB has very high dielectric strength, usually between 15-25 kV/mm. And it can withstand higher electric fields without electrical breakdown.

          6.  Ability to withstand higher temperatures

          Ceramic circuit boards can operate at temperatures up to 1000°C without degradation or damage. While FR4 circuit boards typically operate at an upper limit of 140-170°C. Ceramic circuit boards are suitable for electronic devices in high temperature environments, such as electric vehicles and high-power lasers.

          What are the advantages of ceramic PCB?

          7. High breakdown voltage

          The high breakdown voltage of the ceramic circuit board can reach 20-35 kV, ensuring reliable operation under high voltage conditions. It is well suitable for use in high-voltage power supplies and power electronic equipment, providing higher safety.

          8.  Does not absorb water

          The water absorption of ceramic materials is usually less than 0.1%, while the water absorption of FR4 materials is 0.1-0.2%. The non-water absorbing feature prevents performance degradation and damage caused by water absorption in a humid environment. It is ideal for Marine, medical, and other applications that require moisture resistance.

          9. Low loss at high frequency

          In high-frequency applications, the dielectric loss Angle tangent (Df) of ceramic circuit boards is usually between 0.0001-0.001, while the loss Angle tangent of FR4 materials is 0.02-0.03. Low loss ensures signal integrity and transmission efficiency, which is suitable for communication equipment and high-frequency electronic equipment.

          10.  Resistance to cosmic rays

          Ceramic materials can resist the impact of cosmic rays, will not be degraded or damaged by rays. They are suitable for satellite electronic equipment, ensuring the stability and reliability of the circuit board in a high radiation environment.

          11.  No organic ingredients

          Ceramic circuit boards do not contain organic components, so they have high chemical stability, are not susceptible to chemical corrosion and decomposition. They are good choice to use in harsh chemical environments.

          12.  High-density assembly

          Ceramic circuit boards support high-density assembly with line/pitch resolution of 20 microns. This allows them to be adapted to more complex and refined circuit designs, suitable for microelectronics and high-precision applications.

          Best Technology provides professional one-stop ceramic PCB design and manufacturing service all around the world. We welcome all the friends and partners from domestic and abroad to visit our ceramic circuit board workshop.

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          What Are the Different Types of Ceramic PCBs?
          星期六, 6 7 月, 2024

          Ceramic PCBs are a special breed of printed circuit boards known for their exceptional thermal resistance and durability. These PCBs are used in industries where high performance is critical, such as aerospace, automotive, medical devices, and power electronics. Nowadays, the most common types of ceramic PCB are thick film, DCB, DPC, AMB, HTCC, LTCC and thin film. In this article, we will introduce each of them in details.

          What are the different types of ceramic pcbs?

          Thick Film Ceramic PCB

          Thick film technology is a process by using screen printing conductor paste and directly deposit slurry (conductor) on the ceramic substrate. Then sintering it under high temperature to form conductive circuit traces and electrodes, which is suitable for most ceramic substrates.

          After the material is sintered at high temperature, a strong adhesion film will be formed on the ceramic circuit board, repeat this step for many times, a multi-layer circuit is generated.

          You can print resistor or capacitor on the surface to get a interconnected structure. At Best Technology, we can make all the resistors with the same value, or different value for different resistor on the same board.

          What are the different types of ceramic pcbs?

          Thick film ceramic PCB has advantages on the simple manufacturing process, but it has some drawbacks that can’t be ignored:

          • Limited by the conductive paste and screen size
          • Line width less than 100um is difficult to achieved
          • Three-dimensional patterns are not available
          • Not suitable for fine-trace project

          DBC / DCB Ceramic PCB

          Direct Bonded Copper (DBC) or Direct Copper Bonded (DCB) ceramic PCBs are known for their excellent thermal conductivity. They are made by bonding a layer of copper directly onto a ceramic substrate, typically aluminum oxide or aluminum nitride. Due to the DBC technology is directly bond copper on the ceramic substrate, it can achieve thicker copper thickness to 300um. So, it is very suitable for high power applications.

          The basic chemistry principle is to introduce an appropriate amount of oxygen between copper and ceramics before or during the application process. Copper and oxygen will form Cu-O eutectic liquid under 1065℃~1083℃. This is an important element in the manufacturing. DBC ceramic circuit board uses this eutectic solution to chemically react with the ceramic substrate to form CuAlO2 or CuAl2O4, achieving the combination between substrate and copper foil.

          What are the different types of ceramic pcbs?

          However, it is easy to generate micro-porosity between Al2O3 and Copper during the copper bonded process, and it doesn’t have a good solution by far. That is why the yield of DBC ceramic PCB is not good than DPC.

          DPC (Direct Plated Copper Ceramic PCB)

          DPC ceramic PCB utilizes direct copper plating technology, deposit copper foil on the alumina oxide (Al2O3) substrate. It is the most commonly used ceramic PCB in recent years. The circuit generated process is: pre-treatment – sputtering – exposure – develop – etch – strip – electroplating.

          AMB (Active Metal Brazed Ceramic PCB)

          AMB ceramic copper clad plate adopts the active brazing process, and the copper layer bonding force is higher than that of DPC, which is around 18n/mm – 21n/mm. AMB ceramic copper clad plate usually has a high binding force, usually makes thicker copper, between 100um and 800um. The AMB ceramic PCB generally rarely design traces or holes, even if there is a trace is very simple, the spacing is relatively wide.

          HTCC (High Temperature Co-fired Ceramic PCB)

          HTCC is a relatively early development technology, but due to the high sintering temperature (1300~1600℃), the choice of electrode materials is limited. Meanwhile, its cost is more expensive, these promotes the development of HTCC is relatively slow.

          What are the different types of ceramic pcbs?

          LTCC (Low Temperature Co-fired Ceramic PCB)

          Although LTCC reduces the co-firing temperature to about 850 ° C, the disadvantage is that the dimensional accuracy and product strength are not easy to control.

          Thin Film Ceramic Circuit Board

          The thin film ceramic PCB is to deposit a metal layer directly on the surface of substrate by sputtering process. Through lithography, development, etching and other processes, the metal layer can also be graphed into a circuit pattern. Due to the low deposition speed of sputtering coating (generally less than 1μm/h), thin film substrate surface metal layer thickness is small and can prepare high pattern accuracy (line width/line space less than 10μm).

          What are the different types of ceramic pcbs?

          Common Ceramic Substrates

          What are the different types of ceramic pcbs?

          Best Technology is a leading ceramic PCB manufacturer in Asia, our core members has over 20 years manufacturing experience in ceramic PCB fabricating. “High mixed, low volume, high quality, fast delivery” is our advantages and we always try our best to do that, make ourselves better and better. If you are interested in it, feel free to contact us, we are always online.

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          Leading Ceramic PCB Board Manufacturer – Best Technology
          星期五, 5 7 月, 2024

          With the gradual deepening of electronic technology in various application fields, the highly integrated circuit board has become an inevitable trend. Under this situation, the disadvantage of traditional circuit board FR-4 and CIM-3 in TC (thermal conductivity) has become a drawback to delay the development of electronic technology. Though the metal core PCBs are known for their good thermal management, they hard to meet the fast heat dissipation and miniaturization of the devices at the same time. This is why ceramic PCB stands out.

          What is Ceramic PCB?

          A ceramic PCB is a type of PCB made from ceramic materials, such as alumina (Al2O3), ALN (aluminum nitride), or Beryllium Oxide (BeO). These materials are prepared by using thermal conductive ceramic powder and organic adhesive under the condition of below 250℃. Ceramic powders are not easy to made, especially for aluminum nitride powder, this is one of reasons that why ALN ceramic PCB is more expensive.

          There are some different methods to make ceramic PCBs, commonly in the market are thick film, DBC, DPC and thin film technology. Different types of ceramic circuit boards have its unique characteristics. May you heard about HTCC, LTCC and AMB, they are also the ways to make ceramic PCBs, but there just a few manufacturers can make. Here is a HTCC ceramic PCB that we made.

          HTCC ceramic PCB

          Why Ceramic PCBs are popular used?

          Different from the traditional FR-4 PCB (wave fiber), ceramic PCBs have good high-frequency properties, electrical properties that organic materials can’t achieved. It is a new generation of large-scale integrated circuits and power electronics module ideal packaging materials. The main advantages of ceramic circuit board including:

          • Higher thermal conductivity
          • More matched thermal expansion coefficient (CTE)
          • Lower resistance
          • Good weldability and can be used in high temperature
          • Good insulation
          • Lower high-frequency loss
          • High density assembly available
          • No organic ingredients, resistance to cosmic rays, high reliability in aerospace
          • No oxide layer in copper layer, so it can be used for a long time in a reducing atmosphere

          Who is the Best Ceramic PCB Manufacturer?

          There are so many PCB manufacturers in the domestic and aboard, but reliable ceramic PCB vendors with good quality and reasonable price are very few. If you are looking for an experienced one, then keep the change. We’re the best option! Best Technology offers ceramic PCBs for our customers more than 100k every year, and we are high mixed from thick film ceramic PCB, DPC ceramic PCB, DBC/DCB ceramic PCB to AMB. Your PCBs need to use in automotives? Don’t worry, we gained IATF16949 and ISO13485 certifications, and all the manufacturing processes are strictly followed by ISO9001 quality control system. We welcome all the questions and inquiries from everyone.

          Here is our ceramic PCB manufacturing capability for your reference.

          Ceramic PCB Manufacturing Capability
          No. ItemGeneral ParameterSpecial Process
          1SubstrateHigh insulation, chemical corrosion resistance, high-temperature resistanceAl2O3Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
          2Excellent thermal conductivity, low thermal expansion coefficient, and high-temperature resistanceAIN
          3Insulation performance and high-temperature stabilityZTA
          4High strength, high hardness, high thermal conductivity, and low dielectric lossSi3N4
          5ConductorTungsten(LTCC/HTCC)、Au、Au&Pd、Au&Pb、Ag、Ag&Pd、Ag&Pb
          6Layer CountDPCSingle – Double sided 
          7DBCSingle – Double sided 
          8AMBSingle – Double sided 
          9Thick filmSingle – Double sided, 4L 
          10LTCCSingle – Double sided, 4L, 6L6L – 14L
          11HTCCSingle – Double sided, 4L, 6L 
          12Copper ThicknessInner layer/ 
          13Outer layerHoz-3oz (DPC), 3oz-12oz(DBC/AMB) 
          14DimensionMax. dimension130*180Larger dimension available (pass evaluation)
          15Min. dimension2*2Shipped in panel
          16Substrate thicknessAl2O3/AIN 0.38. 0.635, 1.0mm, Si3N4 0.25、0.32mm>1.5
          17Surface Treatment
          (thickness)
          OSP0.2-0.5um/
          18ENIG1-3u”(Au)120-320u”(Ni)/
          19Immersion silver6-12u”/
          20Immersion tin≥1um/
          21ENEPIGAu 2u”, Pd 1U”, Ni 100u”/
          22Hard gold5-30u”(Au)、120-200u”(Ni)/
          23DrillMin. PTH0.05MM/
          24Min. NPTH0.05MM/
          25Max. aspect ratio (PTH PCB)5:1/
          26NTPH tolerance±0.05/
          27PTH tolerance±0.05/
          28Line width/ Line spacingInner layerLine width≥0.1mm; Line space≥0.1mm0.076/0.076mm
          29Outer layer1OZ; Line width≥0.12mm; Line space≥0.12mm0.1/0.1mm
          302OZ;Line width≥0.2mm; Line space≥0.2mm0.15/0.15mm
          313OZ;Line width≥0.25mm; Line space≥0.25mm0.2/0.2mm
          324OZ;Line width≥0.35mm; Line space≥0.35mm0.3/0.3mm
          335OZ;Line width≥0.45mm; Line space≥0.45mm0.4/0.4mm
          346OZ;Line width≥0.55mm; Line space≥0.55mm0.5/0.5mm
          35Thick film; Line width≥0.1mm; Line space≥0.1mm0.076/0.076mm
          36Line width tolerance±20%/
          37Solder Mask (SM) /SilkscreenConductorGlass glaze, medium, solder mask ink/
          38SM colorWhite, black, greenMixed color
          39Silkscreen colorWhite, blackMixed color
          40Silkscreen height, widthLine width≥0.13mm; Height≥0.8mm/
          41SM thickness≥20um/

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          High Speed PCB: How to Design It?
          星期三, 3 7 月, 2024

          In today’s tech-driven world, creating efficient high speed PCB (Printed Circuit Board) is critical for ensuring devices can handle rapid data transfer without issues. These high speed PCBs are popular in the wireless devices which needs high signal transfer. Crafting high-speed circuits requires careful planning and precise execution to maintain signal quality and overall performance. In this blog, we introduced the basics of high-speed PCB design, offering practical tips and insights into the best materials and techniques for high-frequency applications.

          What is a High Speed Circuit PCB?

          High-speed PCB is a circuit board that can support signal transmission. High-speed signals usually refer to signals with frequencies higher than 50MHz, such as high-speed digital signals, high-speed analog signals, etc. These fast transitions can introduce challenges like signal reflections, electromagnetic interference (EMI), and crosstalk, which can disrupt performance if not properly managed.

          Additionally, these signals will be affected by board materials, layout, wiring and other factors during transmission. Therefore, a specially designed circuit board is required to ensure the integrity and reliability of the signal. Here is a 4 layers high speed PCB for Iradar device with 50ohm single-ended impedance control.

          high speed pcb for Iradar

          Features of High-Speed PCB

          • High frequency
          • Low permittivity and low loss factor
          • Multilayer design
          • Strict impedance control
          • High-precision manufacturing
          • Low noise characteristic
          • High density circuit layout (micro-vias)
          • High performance

          What is Considered High-Speed PCB Design?

          High-speed PCB design focuses on managing the complexities that come with high-frequency signals and fast switching. Key considerations include:

          – Signal Integrity: Ensuring signals travel without distortion or loss.

          – Power Management: Distributing power effectively to minimize noise and voltage drops.

          – Heat Handling: Managing heat from high-speed components to prevent overheating.

          – Impedance Matching: Keeping impedance consistent to reduce signal reflections and loss.

          – Differential Pair Routing: Reducing EMI and crosstalk by routing complementary signal pairs together.

          This type of high speed pcb design requires a solid understanding of electromagnetic principles, advanced simulation tools, and precise manufacturing techniques. For those new to high-speed PCB design, Best Technology offers expert guidance and solutions.

          What’s the Best Material for High-Speed PCB Design?

          Choosing the right material for high speed pcb is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

          – FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.

          – Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.

          – Teflon: Excellent for high-frequency applications but more expensive and harder to process.

          Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

          Where is the High-Speed PCB Commonly Used in?

          High-speed circuit boards are widely used in signal transmission applications, the typical fields are including:

          1. Communication equipment – such as 5G base stations, optical fiber communication equipment, etc.

            2. Data center – like high-performance computing, storage servers, etc.

            3. Consumer electronics in our daily life – high-end smartphones, tablets, gaming devices, etc.

            4. Aerospace and military – high speed are always used in high-end devices. For example, radar, navigation systems and other equipment with high reliability requirements.

            What is the 3H Rule in High Speed PCB Design?

            The 3H rule is a guideline suggesting that signal traces should be spaced at least three times the height of the dielectric (3H) between the signal layer and the adjacent ground or reference layer. This helps minimize crosstalk and maintain signal integrity, particularly for high-speed digital signals with rise times of 1 ns or less. Key aspects include:

            – Trace Spacing: Keeping traces apart by at least 3H reduces electromagnetic coupling and interference.

            – Signal Integrity: Adequate spacing helps maintain clear signals in high-speed circuits.

            – Effectiveness: This rule is especially beneficial for fast digital signals, reducing the risk of crosstalk and interference.

            For instance, if the dielectric height between the signal layer and the reference layer is 0.2 mm, traces should be at least 0.6 mm apart to follow the 3H rule.

            How to Design a High-Speed Board?

            Designing a high-speed PCB involves several strategies to ensure effective signal transmission, power distribution, and minimal EMI. Here’s a step-by-step approach:

            Component Placement and Layer Stack-Up

            Place high-speed components to minimize signal paths and interference. Group related components to simplify routing. In addition, create a layer stack-up that supports controlled impedance and reduces signal loss. Use ground planes between layers for a return path for high-frequency currents.

            Trace Routing and Impedance Control

            Keep high-speed traces short and direct, avoiding right-angle bends. Use microstrip or stripline configurations for controlled impedance and minimal noise. For impedance control, calculate and ensure consistent impedance for traces. Use differential pair routing for high-speed signals to reduce EMI and crosstalk.

            High Speed PCB: How to Design It?

            Power Distribution and EMI Mitigation

            Use decoupling capacitors near high-speed components to filter noise and stabilize the power supply. Design a robust power distribution network to minimize impedance and ensure stable voltage. And employ proper grounding and shielding techniques. Route high-speed signals on inner layers between ground planes to reduce EMI and provide a consistent return path.

            Simulation and Testing

            Use signal integrity analysis tools like SI or PI to simulate the PCB layout, predicting signal behavior and identifying potential issues. Analyze aspects like eye diagrams to assess signal quality.

            High-speed PCB design is a complex but rewarding endeavor that ensures your electronics perform efficiently in high-frequency environments. By understanding the fundamentals and applying the right techniques and materials, you can create robust, high-speed boards. Best Technology is here to assist you with expert advice and solutions for your high-speed PCB needs.

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            We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:

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            2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.

            3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.

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            4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.

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            What are the considerations before PCB design?

            PCB design involves several steps and some considerations need to be noticed. If you are a designer, think about these points before starting the design.

            • Manufacturing: prototyping study or mass production.
            • What it will be used in?
            • What kind of production technology it will used?
            • Material?
            • How many layers you want?
            • Whether need to do impedance control?

            Best Technology has more than 17 years in this industry, we have served for over 1200 customer all around the world. Our goal is to provide customer with best solutions and top notch quality products, and it is luckily that we did a good job. If you want to work with us or need a PCB manufacturer in Asia, contact us right now!

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