Archive for the ‘best pcb’ Category

What Are the Benefits of DFM in PCB Manufacturing?

Monday, March 18th, 2024

In the PCB manufacturing, we always heard a word ā€“ DFM, do you know what is DFM? And how does it affect the manufacturing? Herein, Best Team would like to explain the DFM and its benefits for you.

What is DFM?

DFM stands for Design for Manufacturing. It is an engineering approach focused on designing products in a way that optimizes their manufacturability, testability, and reliability right from the beginning stages of product development.

The goal of DFM is to simplify the manufacturing process, reduce production costs, and improve the overall quality of the final product. This involves considering manufacturing constraints and capabilities early in the design phase to minimize complexities, facilitate assembly, and enhance efficiency in production. By integrating DFM principles, manufacturers and engineers/designers can achieve cost savings, faster time to market, and higher-quality products.

What We Should Considered About Design for Manufacturing?

Design for Manufacturing (DFM) is guided by several key principles aimed at optimizing the design of products for efficient and cost-effective manufacturing processes. Here are five fundamental principles and considerations must know of DFM:

  1. Design

We all know the more complex the design, the greater the risk during the manufacturing. Therefore, keep the design as simple as possible while meeting the functional requirements of the product. Simplifying the design including reduce the number of parts, assembly steps, and manufacturing processes involved, which in turn lowers production costs and minimizes the risk of errors or defects.

  • Standardization

In the PCB industry, there is an IPC standard to standardized all the elements design in PCB, this involved the line width, line spacing, solder mask thickness, text height and so forth. By using standardized parts and processes, manufacturers can take advantage of economies of scale, reduce lead times, smooth the manufacturing process and simplify supply chain management. Standardization also ensures the interchangeability, repair, and maintenance of products.

  • Design for Assembly (DFA)

If you are trying to mount some components to keep and enhance the performance of product, then DFA is must to take into account. Arrange components on the PCB layout in a way can minimize signal interference, reduces trace lengths, and simplifies assembly. Placing components strategically can improve signal integrity, reduce electromagnetic interference (EMI), and facilitate automated assembly processes.

  • Material

Select materials and manufacturing processes that are readily available, cost-effective, and well-suited to the intended application. Consider factors such as material properties, availability, recyclability, and environmental impact when making material choices. Designing for materials involves optimizing designs to minimize material waste and maximize efficiency in material usage.

  • Testability and Debugging

Design PCBs with features that facilitate testing, troubleshooting, and debugging during manufacturing and assembly. Include test points, debug headers, and built-in self-test (BIST) circuitry to simplify testing and diagnostics. Design PCBs with clear labeling, documentation, and accessibility to aid in maintenance and repair.

What Are the Benefits of DFM Analyzing?

The mainly benefits of using DFM is save cost. You know, when creating a new project, we need put much money and time in designing and prototyping. DFM helps identify potential manufacturing issues early in the design phase, allowing for cost-effective modifications before production starts. By optimizing designs for manufacturability, companies can avoid expensive rework and reduce overall production costs. Statistically, we can save around 170 thousand dollars one year by adopting DFM analyzing (human cost, trail-production cost and repair cost). In addition, DFM offers numerous benefits including:

  • Reduce potential quality defects
  • Facilitate production process improvement
  • Decrease trial production cycles
  • Quick time to market
  • Enhanced product quality and stability
  • Mitigate risks associated with personnel changes

How to Find a Manufacturer with DFM Service?

Finding a reliable DFM manufacturer is essential for ensuring the success of your product development. Best Technology engaging in PCB manufacturing for more than 17 years, and we have many experts that can help to solve and provide PCB solution for you. Meanwhile, we have professional DFM system that can help to quickly diagnose the design exception such as components missing, trace layout, open/short circuit. With our expertise and advanced tools, we ensure that your PCB designs are optimized for efficient manufacturing, resulting in high-quality products that meet your specifications and exceed expectations. Trust Best Technology to be your partner in achieving excellence in PCB manufacturing.

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2024 Newest Guide to High Thermal Conductivity PCBs

Monday, March 18th, 2024

Currently, with the rapid development of the digital era, the demands and requirements for electronics have increased significantly. Many double-sided and multi-layer boards have high density and power, making it difficult to dissipate heat efficiently. Conventional printed circuit board substrates such as FR4 and CEM3 are poor thermal conductors with interlayer insulation, the heat canā€™t transfer out, which leading to high-temperature failure of electronic components and devices. So, engineers and researchers are aiming to find high thermal conductivity PCBs to solve such problems, and metal core PCB and ceramic PCB stand out at this time.

Metal core PCB is a type of PCB that made by metal alloy material as the base core, commonly are aluminum core or copper core, rarely is iron PCB. They are popular because of its good heat dissipation properties and good mechanical strength.

What is Aluminum PCB and Why Use It?

Aluminum substrate is a low-alloyed Al-Mg-Si series high-ductility alloy sheet. It exhibits excellent thermal conductivity, electrical insulation properties, and mechanical machinability. Compared to traditional FR-4, with the same thickness and line width, aluminum substrate can carry higher currents, withstanding voltages up to 4500V. Its thermal conductivity coefficient exceeds 2.0.

A normal single side (1L) aluminum core PCB consists of three layers, aluminum base, dielectric layer and copper trace layer. Generally speaking, 1L aluminum PCB is always used for LED lighting, high current LED, spotlight, etc. So it also called LED PCB. For high-end applications, there are also designs for double-sided boards, structured as circuit layer, insulation layer, aluminum base, insulation layer, and circuit layer. In rare cases, multi-layer boards are used, which can be composed of multi-layer FR4 boards laminated to insulation layers and aluminum base.

Aluminum_PCB

The thermal conductivity of aluminum core is range from 1-3W/m.k, the higher conductivity, the better heat dissipation. However, not all the projects is suitable for higher conductivity, it should depend on the specific requirements, such as mechanical strengthen, corrosivity. Nowadays, Best Technology used 6061, 5052, 1060 aluminum alloy as the metal core, others also available if customers have requirements.

How Does Copper Core PCB Works?

Copper substrate is the most expensive type among metal substrates, offering significantly better thermal conductivity compared to aluminum and iron substrates. It is suitable for high-frequency circuits, regions with large temperature variations, and precision communication equipment for heat dissipation purposes, as well as in the construction and decoration industries.

The copper PCB’s circuit layer requires a significant current-carrying capacity, thus necessitating the use of thicker copper foils, typically ranging from 35Ī¼m to 280Ī¼m in thickness. The thermal insulation layer is the core technology of the copper substrate, composed of aluminum oxide and silicon powder as the main thermal conductive components, filled with a polymer of epoxy resin. It exhibits low thermal resistance (0.15), excellent viscoelastic properties, and possesses the ability to resist thermal aging, withstanding mechanical and thermal stresses.

The metal base layer of the copper substrate serves as its supporting component, requiring high thermal conductivity. It is typically made of copper foil, though copper plate can also be used (with copper PCB offering better thermal conductivity, around 1-400W/m.k). These substrates are suitable for conventional mechanical processing methods such as drilling, punching, and cutting.

Copper_core_PCB

What Are Differences Between Copper and Aluminum PCB?

Though both copper and aluminum are metal core PCB, they still have some differences in characteristic and manufacturing. Knowing their differentiation can help you to understanding and making correct decision in material selection.

  • Material

Copper has excellent electrical conductivity and mechanical strength, so copper PCB is well-suit for high frequency circuits and high-power electronic equipment. While aluminum is slightly inferior to the copper base, so it is a good choice of low-power devices.

  • Cost

Compared with copper, aluminum PCB has much advantages in cost, so if you have limited budget and require to use for low-power equipment such as LED lights, aluminum is the better one.

  • Manufacturing

Due to copper has great hardness and good strengthen, it requires for special technical and complex processes, for example: chemical etching, electro-plating. However, the lightweight of aluminum makes it easy in manufacturing. In addition, PTH (plated through holes) can be created on copper PCBs, but not on aluminum ones.

  • Physical Property

The difference in elastic modulus between copper and aluminum is significant, resulting in less warping and expansion/contraction in copper substrates compared to aluminum substrates.

  • Application

Aluminum PCB is lighter than copper substrate, the material cost is lower, often used in daily LED lights or electronic equipment. Because of its strong thermal conductivity and better electrical conductivity, copper substrate is usually used in high-speed circuits and high energy circuits. In addition, copper substrates are also widely used in areas requiring high heat transfer and heat dissipation performance, such as power amplifiers, power supplies, power tools, automotive engine controllers and solar inverters.

Wired_PCB

What is Ceramic PCB? And Its Thermal Conductivity?

Ceramic PCB is one of the high thermal conductivity PCBs in this industry. They have good high-frequency properties and electrical properties, and have high thermal conductivity, chemical stability and excellent thermal stability of organic substrates without. It is a new generation of large-scale integrated circuits and power electronics module ideal packaging materials. The thermal conductivity of the ceramic substrate can reach about 220W/ M.K according to the preparation method and the material formula. Theoretically speaking, the thermal conductivity of ceramic circuit made by alumina is 24-28W/m.k, AlN is 150-240W/m.k and for BeO is 22-250W/m.k.

Ceramic PCB can be divided into various types of PCB according to its different PCB manufacturing process, they are thick film, thin film PCB, DPC, DBC, HTCC and LTCC ceramic circuit board. Different types of PCB made in different temperature and uses different materials, this means they have different chemistry and physical properties. So you should take them into consideration when designing a ceramic PCB for your device.

Ceramic_PCB

A Reliable PCB Supplier in China ā€“ Best Technology

Whatever you choose metal core PCB or ceramic PCB, a reliable supplier is necessary and needed. Best Technology has extensive manufacturing experience in PCB and we are very confident that we can serve you the best service and high-quality product. With rich experience and strong R&D team, we know how to provide you the best solution and evaluate the design files for you. We have professional DFM (Design For Manufacturing) process to identify the mistakes or inappropriate layout in design. Welcome to contact with us to discuss your PCB projects.

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Top 1 Design and Manufacturing Considerations for Bendable Aluminum PCBs

Thursday, March 7th, 2024

You know, bendable aluminum PCBs have gained prominence in various electronic applications due to their unique ability to flex and conform to curved surfaces. Unlike traditional rigid PCBs that are commonly composed of materials like fiberglass , these PCBs utilize aluminum as the base material, allowing it bendable and flexibility when needed. Compared to the rigid characteristics of traditional metal core PCB, bending aluminum PCB can be adapted to specific space requirements and shape requirements. In this article, we will introduce the characteristics of bendable aluminum PCBs and explore the key considerations that engineers and manufacturers need to pay attention during the design and production process.

What Are the Benefits of Bendable Aluminum PCBs?

May some designers are reraly to know the bendable aluminum PCB, in their congnition, the bendable PCBs are including flex circuits, rigid flexible circuit and FFC, and aluminum PCB is classfied into one of rigid PCB. But here, Best Technology is so proud to say, we have developed bendable aluminum PCB and we can manufacture it with fast delivery and high-quality, this is what we prouded.

The primary advantage of bendable aluminum PCBs is their flexibility. They can be bent and shaped to fit into various form factors and designs, making them suitable for applications where space is limited or where flexibility is required and traditional rigid boards are not ideal. Common applications include wearable devices, curved displays, and other electronic systems with unconventional form factors.

Additionally, bendable aluminum PCB has the advantages of aluminum, so it has good heat dissipation and higher thermal management than traditional PCBs. This feature is crucial for maintaining the reliability and performance of electronic devices, especially those operating in high-temperature environments.

Considerations During the Design Process

Al Material Selection:

Considering that it is a bendable aluminum substrate, it must be satisfied that the material selection should be bendable but at the same time have good heat dissipation of the metal base. This aluminum base material is a specially designed aluminum alloy or aluminum base composite material. Meanwhile, the thickness of the material is critical, such as the material is generally from 0.2mm to 1.6mm, of which 0.2mm to 1.0mm is the more common bending metal substrate thickness.

Flexibility Requirements:

Defining the flexibility requirements is a crucial step in the design process. The degree of bending, bending radius, and any other factors related to flexibility must be clearly defined based on the intended application. For instance, a wearable fitness tracker might require a specific bending profile to comfortably conform to the curvature of the wrist.

Also note that the bending radius is different for materials of different thicknesses. In general, a smaller bending radius usually corresponds to a thinner board material, while a larger bending radius can accommodate a thicker board material.

Circuit Layout:

The layout of the circuit components plays a pivotal role in ensuring the longevity of bendable aluminum PCBs. Designers should strategically plan the arrangement of components to accommodate bending without subjecting critical elements, such as sensors or microcontrollers, to excessive stress. Even distribution of components contributes to a balanced bending profile.

And the pad should not be designed at the bend of the bending, which will cause damage to the assembly components after bending, or even no way to bend. In addition, the welding pad near the bending cross should also be kept away from the bending line to avoid collision and extrusion of the components after bending.

Bending Radius:

Determining the minimum bending radius that the PCB can tolerate is essential for preventing structural damage or compromise in electrical performance. Specific bending radii should be defined based on the application’s needs. For example, a bendable aluminum PCB designed for a wearable device might need to withstand repeated bending with a predefined radius.

Dielectric Layer:

Choosing an appropriate dielectric material is crucial for maintaining insulation between different layers of the PCB. The dielectric layer should possess flexibility to withstand bending without compromising its insulating properties.

As we know, when design the aluminum PCB, the thermal conductivity is also important. Bendable aluminum also has the thermal conductivity requirement, but when the thermal conductivity material is higher, the higher the content of ceramic powder in material. And when the content of ceramic powder is higher, the brittleness of the material is higher, and it is easier to break or break after bending. The material of 1W/m.k is more bendable than 3W/m.k怂

(Bendable_MCPCB)

Considerations During the Manufacturing Process

Bendable aera lineļ¼š

For the production requirements of the light plate, the V-cut mark is generally used to determine the complete line at the bend, and attention should be paid to the depth control of the v-cut, so as not to damage the line.

Testing and Validation:

Prototyping is a vital phase in the manufacturing process of bendable aluminum PCBs. Thorough testing and validation are necessary to ensure that the PCB meets the required electrical and mechanical specifications. Bending tests simulating the intended application conditions should be performed to assess the PCB’s durability. such as bending test, bending angle test.

Generally speaking, after the bare board finished, itā€™s not bendable to the required angle. In order to avoid bad transportation or collision, some customers require not to bend and they will bend it by themselves. But if the customers donā€™t want to bend the board by himself, we also can help to bend it, it will require mold and it need to custom the package for shipping. The custom package can help to protect the damage in shipping.

Collaboration with Manufacturers:

Close collaboration with experienced PCB manufacturers is key to successful production. Manufacturers with expertise in flexible PCB fabrication can provide valuable insights into the manufacturing process. Working together ensures that the design aligns with manufacturing capabilities, optimizing the production of bendable aluminum PCBs.

Conclusion

In a word, the design and manufacturing of bendable aluminum PCBs involve a series of critical considerations to ensure the success and reliability of the final product. From material selection and flexibility requirements to testing, validation, and compliance with industry standards, each step plays a pivotal role in creating PCBs that meet the unique demands of modern electronic applications. By carefully addressing these considerations, designers and manufacturers can unlock the full potential of bendable aluminum PCBs in diverse and innovative electronic devices. Welcome to contact Best Technology if you want to know more.

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What Is Immersion Silver? Why Choose It for PCB Coating?

Monday, February 26th, 2024

Due to the growing concerns and advocacy for environmental friendliness, as well as the prohibition of harmful substances like lead (tin), an increasing number of industries are moving away from the use of HASL (Hot Air Solder Leveling) technologies for PCB (Printed Circuit Board) surface treatment. The current trend is to use other surface treatments such as OSP, gold plating, immersion tin, immersion silver, ENIG and ENEPIG. Among them, immersion silver becoming a popular choice since it has excellent performance and cost effectiveness.

What is Immersion Silver Finish?

Immersion silver finishing is an environment friendly surface treatment that coating a layer of silver (about 0.1~0.4um) on the copper surface to ensure the good solderability when assembly. When comparing its functional performance with other surface finishes like OSP and ENIG, immersion silver falls between them. It exhibits outstanding solderability and exceptional solder joint strength, surpassing OSP, which lacks a conductive barrier. However, when employed as a contact surface, immersion silver demonstrates lower strength compared to gold.

What is the Working Principle of Immersion Silver?

Immersion silver finishing uses chemical deposition to finish the whole processes. Electrochemical deposition is a method of reducing and depositing metals onto the surface of an object by controlling the current in a solution. In the immersion silver process, the pad serves as the anode (positive electrode), while silver acts as the cathode (negative electrode), with a current applied between them. This causes silver ions (Ag+) to be reduced to silver metal under the influence of the electric field, subsequently adhering to the pad surface and gradually forming a silver layer.

The displacement reaction of immersion silver is:

2Ag+ + Cu = 2Ag + Cu++

This method utilizes both electrical current and chemical reactions to deposit silver from the solution onto the surface of the PCB pad, creating a uniform and porous silver layer.

Silver Plated Analyzing: Pros vs Cons

Before selecting the immersion silver coating, we should understand its advantages and disadvantages to consider whether it is suitable for your PCB project and end-applications.

Pros of immersion silver:

  1. Cost-effective than immersion gold
  2. Good surface flatness and low contact resistance
  3. Corrosion resistance
  4. Good solderability, especially for BGA chips or smaller components
  5. Environment friendly
  6. High reliability

Cons of immersion silver:

  1. Difficult to handle, must wear gloves
  2. Special storage conditions ā€“ if the package is opened and not all PCBs need to be used, it must be resealed quickly or use them within 24h.
  3. Peelable masks canā€™t to use

Important Points You Must Know About Storage

  1. For storage and handling, it needs more careful than immersion tin and OSP.
  2. It is compliant with ROHS and safer than HASL.
  3. In the dry conditions, it can be stored 6-12months.
  4. PCB with immersion silver must be soldered within 24hours if package is unsealed.
  5. If the immersion silver PCB has been stored for more than 12 months, a solderability testing is must before assembling.

Immersion Silver vs ENIG

ENIG also is a common surface treatment in the PCB manufacturing, its full name is Electroless Nickel/Immersion Gold finishing. The ENIG technology is a relative expensive than immersion silver, and it suitable for more complex layout design.

ENIG plating involves safeguarding the copper pads on PCBs by first applying a layer of nickel and then overlaying the copper surface with a thin layer of gold. In essence, the procedure is akin to immersion silver, but it significantly improves PCBs by providing enhanced resistance to oxidation, superior solderability, and excellent surface planarity.

Letā€™s review the performance comparison between these two surface treatments:

Welcome to contact us if you have any questions about immersion silver or other surface treatment.

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How Does the Ceramic PCB Works in IGBT Modules?

Friday, January 19th, 2024

IGBT (Insulated Gate Bipolar Transistor) is a bipolar junction transistor (BJT) with a MOS gate, or we can say that an IGBT module is a combination of BJT and MOS module. Despite its small size, the IGBT chip can control the transmission of electrical energy. It can switch the current 100,000 times within 1 second under an ultra-high voltage of 650 million volts.

What is the Working Principle of IGBT?

IGBT combines the features of a transistor and a switching circuit, making it a new type of electronic component that can control current efficiency. Its structure allows it to achieve current control from turn on to off without generating excessive leakage current, as well as not affecting the operation of other circuits.

The working principle of IGBT modules including two parts – the current control of MOS gate and BJT transistor. When the voltage of MOS gate changes, it affects the conduction of the transistor, thus controlling the flow of current. When the BJT comes into play, it controls the flow of current, so that improve the working efficiency of the IGBT.

(Working_principle_of_IGBT)

How Does A Ceramic PCB Protect IGBT Modules from Overheat?

As you know, IGBT modules have been applied for many years in various industries such as automotive, industrial, aerospace, consumer electronics, and more. However, optimizing the thermal dissipation of IGBT packaging is crucial to enable the modules to operate at higher power conditions. If heat dissipation is improved, IGBT modules can be used in more advanced applications.

You might be wondering how much heat does an IGBT module generate during running? It’s equivalent to the heat produced by 100 electric furnaces. This substantial amount of heat must be dissipated immediately from the IGBT chip, thatā€™s why the ceramic circuit board stands out.

(Ceramic_pcb_with_DPC_technology)

In IGBT modules, ceramic PCBs are placed beneath the IGBT chip, or we can say the chip is assembled on the ceramic circuit board. The ceramic PCB connects and supports the chip, rapidly dissipating heat to the outer package. This method protects the chip from the adverse effects of heat.

Why ceramic PCBs Are Suitable for IGBT thermal dissipation?

Ceramic materials exhibit excellent thermal dissipation and electrical insulation properties. Unlike aluminum metal core PCBs, ceramic PCBs do not use insulation layers that hinder heat dissipation. In the manufacturing process of ceramic PCBs, copper foil is directly bonded to the ceramic substrate under high pressure and temperature (it depends on the different technology and different copper thickness). During PCB manufacturing, IGBT and other components are mounted on the circuit board through assembly technology.

Ceramic materials have extremely high insulation capabilities, enduring breakdown voltages up to 20KV/mm. At present, there are three ceramic materials that can be used for IGBT modules, they are 99% or 96%怀Alumina (Alā‚‚Oā‚ƒ), Aluminum Nitride (AlN), and Silicon Nitride (Siā‚ƒNā‚„).

The thermal conductivity of alumina PCB is 15-35W/mK, aluminum nitride PCB is 170-230W/mK, and silicon nitride PCB is 80+W/mK. In contrast, aluminum core circuit boards only have a thermal conductivity of 1-12W/mK.

Applications of Ceramic PCBs in IGBT Packaging

Alumina PCBs are the most commonly used circuit boards in IGBT modules due to their lower cost. But if IGBT modules have higher power or precision requirements, AlN ceramic PCBs and Si3N4 PCBs are the most suitable choices. Because they have higher thermal dissipation and thermal expansion coefficients (CTE) close to semiconductors. Since different ceramic substrate has different features, the uses of ceramic PCB should depend on the specific requirements of IGBT modules.

In addition, with the development of Silicon Carbide (SiC) and Gallium Nitride (GaN) materials, they are starting to be used for IGBT chips due to their high-frequency, high-power, and high-temperature characteristics. Maybe in the future, aluminum nitride PCBs and silicon carbide PCBs will be increasingly applied to high-power IGBT modules in high-density three-dimensional packaging.

Common Properties of Using Ceramic Circuit Board

  • Excellent thermal conductivity and voltage resistance of ceramic substrates.
  • Copper trace layers has extremely high current-carrying capacity.
  • Strong adhesion and reliability between circuit layers and ceramic substrates.
  • Good soldering performance, suitable for wire bonding.
(Ceramic_PCB)

How to Solve the Overheat Issues in IGBT?

Though the ceramic PCB is good at heat dissipation, there still some overheat occasions happened if small power or long-time operation. Here we summarized some solutions for such issues.

1. Clean the heat sink to ensure tight contact between the IGBT and the heat sink.

2. Clean the fan, including the fan blades and lubricate the bearings if needed.

3. Clear the airflow path of the fan.

4. Replace with higher power IGBTs, ensuring the withstand voltage is not lower than the original IGBT’s value.

Above all are the information that weā€™d shared, welcome to contact us if you want to know more. Best Technology is a historic company which has over 17 years PCB manufacturing experience, here you can enjoy the one-stop ODM & OEM service, one-to-one after sales, quick delivery and high-quality products.

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What Are Differences of ENIG VS ENEPIG in PCB Manufacturing ā€“ Series 2

Tuesday, January 2nd, 2024

In our last blog, we simply introduced ENIG surface treatment in PCB manufacturing, and this time, we will share more information about the comparison of ENIG and ENEPIG.

What is ENEPIG Surface Treatment?

ENEPIG stands for Electroless Nickel Electroless Palladium Immersion Gold. This type of metal coating on the PCB pad surface consists of three layersā€”nickel, palladium, and gold. Apart from protecting the copper surface from corrosion and oxidation, the ENEPIG surface treatment is also suitable for high-density SMT (Surface Mount Technology) designs.

For its manufacturing process, manufacturers begin by activating the copper surface, followed by depositing a layer of electroless nickel, then a layer of electroless palladium, and finally, a layer of immersion gold. The process is somewhat similar to the one they follow in the ENIG process, but adding a palladium layer to the ENIG technology. The palladium layer not only improves the surface protection of the PCB, but also prevents nickel from deteriorating and inhibits interactions with the gold layer.

Pros of ENEPIG Surface Treatment

  • Reduce the black pad issues
  • Excellent solderability and high reflow soldering performance
  • Provide high-reliable wire bonding capability
  • High-density design available
  • Meet the miniaturization standards
  • Suitable for extra thin PCBs

Cons of ENEPIG Surface Treatment

  • Expensive than ENIG process
  • Thicker palladium layer will decrease the effective of SMT soldering
  • Longer wettability time

What are the Differences Between ENIG and ENEPIG?

The main difference between ENIG and ENEPIG is the palladium layer. This is the extra layer that added in ENEPIG process, which provides high oxidation resistance, enhance the electrical performance of the surface cleanliness and improve the abrasion resistance of the PCB surface. However, the palladium layer also increases the cost of manufacturing.

Additionally, the inconsistent surface cleanliness of ENIG, resulting from low solder joint reliability, particularly in gold wire bonding, is a concern. Extra procedures are also required to prevent nickel corrosion in ENIG. When considering it into manufacturing, the ENIG is well-suited for lower-end electronic products.

(ENIG_VS_ENEPIG)

The Considerations of Selecting ENIG or ENEPIG Surface Finishing

Though both two surface treatments offer excellent electrical performance and heat dissipation properties, there are still some conditions that need to consider when choose them.

  • Budget

Cost is an important factor when choose a suitable surface treatment. As we explain above, ENEPIG is expensive than ENIG, if you are trying to find a relative cost-effective coating, then ENIG is the best choice.

  • End-applications

The end-applications or finished products also determined the selection of surface finishing. For example, if your PCB will be used in high temperature applications, ENIG would be the better one since it can withstand high temperature.

  • Flatness

Many traditional surface finishes have poor flatness and smoothness, this brings the big challenge of small-size components mounted. Especially for those fine-pitch components like BGA, an uneven surface can result many problems. However, both ENIG and ENEPIG offer highly smooth surface finishes, forming thin and uniform layers on the solder pads.

  • Bonding demand

ENEPIG provides the optimal choice for wire bonding due to its highly smooth surface finish, which enhances wire bonding capabilities.

  • Environment-friendly

Some traditional surface treatments contain hazardous substances, making them non-compliant with RoHS requirements. Both ENIG and ENEPIG made by Best Technology are fully RoHS compliant and lead-free, so you are donā€™t worry about the environment unfriendly.

At the end, the choice between ENIG and ENEPIG surface treatments in PCB manufacturing involves a careful consideration of various factors. While both options offer excellent electrical performance, heat dissipation properties, and compliance with environmental standards like RoHS, specific project requirements and priorities will guide the decision-making process. If you are still confuse about the selection of surface treatment, welcome to contact with us, Best Team will give you a best solution that can meet your specific demands and save money for you.

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Why Thermal Conductivity Layer is Important in Aluminum PCB?

Tuesday, January 2nd, 2024

In the aluminum PCB design, people always mention the thermal conductivity value. Do you know what about thermal conductivity and you know what is the role of this layer in the aluminum core circuit board? Welcome to keep reading if you are interested in it.

(1_layer_aluminum_pcb)

What is thermal conductivity?

Thermal conductivity is a physical value signifies the capacity of a material to allow heat flow per unit area through it in a unit of time. A higher thermal conductivity indicates better heat conduction for the material. In the field of heat generation and thermal management products, thermal conductivity is a crucial parameter as it relates to the product’s heat dissipation capability and stability. In the structure of aluminum, the thermal conductivity layer is always stand between the copper circuit layer and base material, so that the heat generated by product can be transfer quickly to outside.

(Stack_up_for_1_layer_aluminum_PCB)

Significance of Thermal Conductivity in Aluminum PCBs

Aluminum substrates are commonly used materials in heat dissipation and thermal management products. Their thermal conductivity is a vital element evaluated heat dissipation properties typically in W/mĀ·K. It can be understood as the material’s heat transfer rate, i.e., the amount of heat conducted per unit time. Specifically, assuming the same amount of heat is conducted in aluminum substrates and other materials, the conduction rate of aluminum substrate will be faster over a certain period. This implies that aluminum substrates can transfer heat more quickly from the heat source to the external environment, achieving efficient heat dissipation.

Impact of Thermal Conductivity on Heat Dissipation Products

The primary function of thermal management products is to dissipate heat. How does thermal conductivity specifically affect them? Let us dive into from below aspects:

1. Thermal Conductivity Value

A higher thermal conductivity leads to better heat dissipation capability, as it can achieve faster transfer of heat from the heat source to the environment. Therefore, thermal conductivity of aluminum substrates plays a crucial role in the heat dissipation products, such as the LED lights, industrial power devices, automotives. At Best Technology, the thermal conductivity we used for aluminum PCB always is range from 1.0 to 3.0W (thickness=75-200um). Different thermal conductivity value has its own thickness.

2. Product Stability

The stability of a product also depends on its thermal conductivity. According to our 17+ manufacturing experience, insufficient thermal conductivity in heat dissipation products may result in overheating during prolonged operation, potentially shortening the product’s lifespan. Let me take a simple example, assume your mobile phone is under long time playing games, then it will generate many heats, finally causing the overheating phenomenon. And this will shorten its lifecycle if you always do like that.

(Single_sided_4_layer_aluminum_PCB)

When it comes to thermal conductivity selection, there is a big misunderstanding is that some may believe that higher thermal conductivity in aluminum substrates is always better. However, this is not entirely accurate. While higher thermal conductivity is generally favorable, it does not mean that aluminum substrates with the highest thermal conductivity are suitable for all heat dissipation applications. In specific use cases, it is essential to choose the appropriate thermal conductivity for aluminum substrates based on actual requirements to achieve the optimal heat dissipation effect.

By the way, if you want to choose higher thermal conductivity value, ceramic PCB is a better choice, which can achieve 24W or more. It mainly depends on its ceramic substrate material, like the Al2O3 thermal conductivity value is around 24W~28W/m-K, while AlN enable to reach 150W~240W/m-K.

Conclusion

All in all, to ensure optimal heat dissipation effects and stability, it is crucial to choose the right thermal conductivity for aluminum substrates based on actual needs. The careful consideration of thermal conductivity values in aluminum PCBs is integral to the longevity and performance of heat dissipation products, emphasizing the importance of informed selection in the pursuit of effective thermal management.

Best Technology is an expert in metal core PCB manufacturing, we have strong R&D team and full-experienced employs that can provide with you the best metal core PCB solution. Welcome to contact us at sales@bestpcbs.com if you want to know more.

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What Are Differences of ENIG VS ENEPIG in PCB Manufacturing ā€“ Series 1

Tuesday, January 2nd, 2024

Surface treatment also called surface finishing, it is a protective layer that through coating a layer of metal organic material on the surface of printing circuit boards (PCBs). Apply a layer of surface treatment enable to protect pads from scratches and oxidation, as well as improve the solderability of components mounting. ENIG and ENEPIG are the two common high-reliable surface finishing types in the circuit board manufacturing, they are not only for FR4-PCB, but also available in ceramic PCB, flex circuits and rigid-flex PCB. Today, Best Team would like to sharing information about ENIG and ENEPIG, and explore the differences between them.

(Assembled_PCB)

How to Select the Right Surface Treatment for Your PCB?

With the rapid development of electronics, there are various of PCB types that can be used in electronic devices, and at the same time, there are also increasingly more surface treatment technics available for selection. Until now, the common surface treatments are OSP, HASL, Immersion Silver, Gold Plating, ENIG and ENEPIG. Each of these surface treatments has its own advantages and disadvantages, so it is necessary to choose the most suitable one for a particular application. The selection of surface finish needs to take into account factors such as cost, application environment, fine-pitch components, the use of leaded or lead-free solder, operating frequency, shelf life, drop and impact resistance, volume and throughput, as well as thermal resistance.

With PCBs trending towards micro-vias and finer traces, and the drawbacks of HASL and OSP, such as flatness and flux elimination issues, becoming more pronounced, the demand for surface treatments like ENIG continues to grow. In addition, black pad is a major weakness of ENIG while ENEPIG enable to solve it very well, making it a preferred choice for those PCBs need to wire bonding.

What is the ENIG Surface Treatment?

ENIG, its full name is Electroless Nickel Immersion Gold, is also known as chemical gold or immersion gold in the electronics industry. This type of surface treatment provides two metal layersā€”gold and nickelā€”that manufacturers deposit them on the surface of PCB pads sequentially. This surface finish is a selective surface finish, meaning that certain specific pads may have ENIG surface finish, while others may have different types, such as OSP, HASL, or immersion tin. Here are the main processes of the ENIG coating:

  • Copper activation

In this step, manufacturers will active the copper layer through cleaning process, this way can help to remove the dust and oxides residual on the surface, but also remove any gases or air trapped in the perforations (holes) of the PCB by wetting the surface. Next, micro-etching the PCB surface using substances like hydrogen peroxide or sulfuric acid.

  • Electroless nickel

This process is to coat a layer of nickel on the active copper layer by electroplating. The nickel layer serves as a protective layer or inhibitor, which prevent the copper reactive with other elements.

  • Immersion gold

Immersion gold is the last step of whole ENIG process, immersing the PCB into a mixture, oxidizing the nickel surface, generating nickel ions, and then reducing gold from the mixture. The reduced gold forms a metallic coating to protect the nickel surface. This is the whole process of coating ENIG surface treatment.

(PCB_with_ENIG_surface_treatment)

Advantages of ENIG

  • Surface flatness ā€“ good for fine-pitch and small size components like BGA.
  • Suitable for press-fit components since it provides a reliable connection for electrical testing.
  • Suitable for wire bonding and gold-fingers connectors.
  • Cost-effective compared with ENEPIG

Disadvantages of ENIG

  • Black pad issues.
  • Varied coating thickness because of the uncontrolled nickel plated and immersion gold.
  • Poor wettability during PCB assembly.

All in all, ENIG is a good option if you want to mount fine-pitch components on the PCB surface or if you are considering its use in plug-and-pull devices such as WIFI interfaces. In our next blog, we will introduce ENEPIG surface treatment, including its pros & cons and the differences between ENIG and ENEPIG. Pay attention to our news or contact us directly if you want to know more.

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What Is the Role of Electronic Parts on the Circuit Boards?

Tuesday, December 19th, 2023

A circuit board is an independent part of modern electronic devices, equipped with various components that play different roles and functions on the board such as connecting, signal transmission, power distribution, and signal conversion. Theoretically speaking, electronic components are the fundamental units in the devices, and printed circuit board (PCB) serves as a carrier for mounting components, connecting them to completing the functions of electronic systems. Here, we will introduce some common circuit board components and their functions.

(A_PCB_with_components)

What Are Electronic Components?

Electronic components are fundamental building blocks used in the construction of electronic circuits and systems. These components manipulate electrical signals to perform specific functions in electronic devices. Based on their purpose and functionality, electronic components can be categorized into two major types: passive components and active components.

Passive electronic components mainly include resistors, capacitors, inductors, power filters, and so on. They do not have active operational functions such as amplification or signal control. Instead, passive components can only consume or store electrical energy. In electronic systems, their main roles include signal transmission, distribution, filtering, isolation, and other similar functions.

Active electronic components, on the other hand, include transistors, field-effect transistors (FETs), integrated circuits (ICs). Unlike passive components, active components have the ability to actively amplify, control, and manipulate signals related to current, voltage, frequency, and more. They play a crucial role in electronic systems, enabling active operations and functionalities.

(Components_on_a_pcb)

What Is the Functionality of Common Components on PCB?

On an assembled circuit board (PCBA), we can see various of components on its surface. Different components play its unique role and have different function. Here we will introduce the function of common components.

  • Resistor

A resistor is a component used to restrict the flow of electric current. Its purpose is to control the magnitude of current by adjusting its resistance value, ensuring appropriate current adjustment within the circuit.

  • Capacitor

The capacitor has the ability to store charge and release it when needed. Its function is to smooth power supply voltage, stabilize current, and in some cases, perform signal filtering to accomplish signal conditioning. Resistors and capacitors are two common types of electronic components.

  • Diode

Diode is a type of component with unidirectional conductivity. The uses of diode enable to allow current to flow in one direction while blocking reverse current. It is commonly used in power supplies, rectifiers, and other circuits.

  • Transistor

A transistor functions in amplification and switching in a printed circuit board. Its role is to amplify electronic signals, control the flow of current, and it is widely used in circuits such as amplifiers and logic gates.

  • Integrated Circuit (IC)

Integrated circuit is a very important components in those small size circuits, because it can integrate multiple functional circuits onto a single chip. That means it can save space if your design has limited space, enhance system performance and reliability of devices. Integrated circuits find widespread applications in areas such as computers, communication systems, and embedded systems.

  • Inductor

The working principle of inductor is similar to a capacitor, but the different is an inductor has the ability to store and release energy while capacitor is to store and release charge. Its main function is to accomplish energy conversion and distribution in a circuit. Inductors are commonly used in circuits for filtering, power supplies, and more.

  • Variable Resistor

A variable resistor allows for the adjustment of resistance and it always used for modifying circuit characteristics by changing the resistance value. Variable resistors are commonly used in circuits for functions like volume control, light intensity adjustment and some other devices that need to adjust the resistance.

  • Light Emitting Diode (LED)

LED chips is a component that we can see everywhere need to light up. It converts electrical energy into light energy. Its function includes emitting light for indicators, illumination, and it is widely used in circuits such as display screens and indicator lights.

  • Power Module

Power module is always designed to provide the electrical energy required by a circuit. Using power to stabilize output voltage and current, protecting the circuit from external power fluctuations.

  •  Sensor

A sensor can perceive physical quantities or signals in the surrounding environment and convert them into electrical signals. Its function is to enable interaction between the circuit and the external environment. Sensors find wide applications in areas such as automatic control, the Internet of Things (IoT), and more.

(PCBA)

In summary, the various components on a circuit board have their specific roles, work in conjunction with each other, and collectively achieve the functionality and objectives of the circuit. Understanding the functions of these components allows for a better grasp of the working principles of circuit boards, providing reference and guidance for the design and maintenance of electronic products.

However, for some reasons, inspect the components before PCB assembly is the main method that ensures the reliability of a PCBA. In our next post, we will share how to make the incoming inspection for electronic components, leave your messages if you are interested in it.

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What is a E-Tester & how E-tester test PCB?

Saturday, December 2nd, 2023

We often receive this question from customerā€ what is a E-Tester?ā€ andā€ how to do E-Test for FR4 PCB?ā€ Hereby I would like to share with you how to use E-Tester to test PCB.

Best Technology in FR4 PCB circuit manufacturing filed since year 2006, we have more than 17 years experiences in PCB fabrication process. We can provide from the design to turn key service for our customer.

Let us come to todayā€™s topic, now what is a E-Tester?

What is a E-tester?

E-Tester is tooling for test PCB during volume production. E-Tester was used to detect the electrical performance of PCB. It is the essential process to test the PCB by this tester before shipment.

As you may know that during PCB process flow, it might be caused some defects by external factors and this is unavoidable.

So, in order to reduce the loss before PCB goes to the next stage when it is assembled with components, Therefore, the E-Test plays important role in PCB quality control to segregate PCBs with defects from shipment to customers and thatā€™s why most of customers require their PCB manufactures to do 100% E test before shipment.

(E_testers)

The E tester mainly checks the open/short circuit for FR4 PCB.

How to do E-test?

Firstly, set up the E-tester on the testing machine and up test datasheet on the computer. Put the board to the E-tester to test the open/short circuit for board and dielectric strength.

Shorts Test: Check to make sure that NO current flows between separate nets by measuring the amount resistance between them.

Opens Test: Check to make sure there is current flow from one ā€œnodeā€ to the next for every net on the board.

(Tester_testing)

During the testing, test whether there is short circuit between different network routes of PCB; test whether the PCB network is open to each PAD, and whether the hole is open; Finally, Insulation strength test and the Impedance test.

If the trace open is found on the bare board, the failure location could be repaired or the bare board has to be scrapped. On the other hand, the cost will be increased when PCB goes to the next stage when it is assembled with components, mainly are the sorting cost, component cost and the assembly cost. The compensation ratio is 10 times or even more than the PCB cost and this damages PCB manufacturerā€™s profit. The worse case is when PCBA is installed onto the end product, the loss caused by defected PCB could be very painful, say up to thousand times of PCB cost. Therefore, the E-Test plays important role in PCB industry to segregate PCBs with defects from shipment to customers and thatā€™s why most of customers require their PCB suppliers to do 100% E test before shipment.

If you want to know more about testing for FR4 PCB board, welcome to visited www.bestpcbs.com or email us, we are very happy to answer your question.

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