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How To Identify & Avoid Fake Electronic Components?

Monday, April 29th, 2024

Identifying and avoiding fake electronic components on PCB is crucial for ensuring the reliability and performance of your electronics. But with the development of electronics, the replacement cycle of various electronic components, including plastic integrated circuits, is getting shortage in resourcing, which brings the big difficulties to the component management supply chain.

For some components has been updated and may no longer to produced, especially for equipment manufacturers with small components consumption, many varieties and high reliability requirements. Due to small procurement volume, they often cannot be purchased directly from originally manufacturers and much be purchased through agents, thus proving the opportunities for fake components to enter the market. Herein, Best team would like to share some information about definition of fake components and methods to verify & identify fake parts, hope this is helpful for everyone that has demands on components.

What Are Fake Components and How Does It Affect Industry?

Fake components, also known as counterfeit electronic components, are parts that are misrepresented by sellers as genuine, but are actually inferior in quality and may not meet the specifications of the original manufacturer.  The U.S. Department of Energy /SAE AS5553 defines counterfeit components as copies or substitutes produced without legal authorization, or components whose materials, properties, or specifications are falsely advertised. These components can be refurbished parts, parts with altered date codes or markings, or completely fabricated units that mimic real products. They are introduced into the supply chain through various illegal means, including unauthorized factories and distributors.

Counterfeiting is a violation of the legal rights of intellectual property owners. The economic cost of counterfeit components far exceeds the cost of replacement, including safety costs, lost performance, repair or replacement, and important is reputational impact. For example, a $2 component used on a printed circuit board (PCB) can cost up to $20 to replace once it is detected to be a counterfeit component. More importantly, counterfeit components have the potential to cause serious consequences. A case in point is the crash of a chartered Convair580 near the Danish coast on September 8th, 1989. In addition, counterfeit goods may be used in some sabotages, which is likely to pose a serious challenge to national security. Therefore, identifying counterfeit components at the initial stage appear to be particularly important during the initial stage, especially before the PCBA assembly process.

best pcba

How to Identifying Fake Electronics Components at Initial Stage?

At present, the fake integrated circuits on the market can be divided into refurbished integrated circuits and counterfeit integrated circuits. The mass entry of fake and inferior devices into the market or the supply chain of military products has seriously affected the quality and reliability of our country’s equipment products. Here are some methods to confirm whether you are using a counterfeit component.

  • Visual inspection

    There will be polished marks or traces on the surface of fake electronic components, and some sellers will apply a thin film on the surface of fake electronic components, so that people cannot see the polishing marks. This kind of smearing fake electronic components look brighter than the genuine one. In addition, observing the edge of electronic components also is a good way, due to the polishing process, refurbished electronic components are easily changed to right angles from rounded corners. So, if you see that the edge of electronic components is a “Right Angle”, then you can think that it is refurbished goods!

    Visual inspection
    • Silkscreen or texts on surface

      To ensure the high-quality of products, most of chips use laser printing or marking technology with a dedicated printer to print silkscreen or text. By this method, its silkscreen is clear, neither conspicuous, nor fuzzy and difficult to erase. But the refurbished chip either has a “jagged” feeling because the writing edge is corroded by the cleaning agent, or the printing is fuzzy, different in depth, wrong in position, easy to erase or too conspicuous. During the verifying process, acetone can be used to wipe the silkscreen as well to confirm whether it is remark part.

      check silkscreen or texts on surface
      • Pin-legs on the chips

        The pins of genuine parts always in silver powder with darker and uniform color, and they are not easy to have oxidation traces. If it is a refurbished electronic component, then its pin is generally tinned and brighter like a new one. In addition, DIP parts and other plug-ins should not have scratched pins, even if there is scratch should be neat and the metal exposure is clean and no oxidation.

        Pin-legs on the chips
        • Documentation and traceability

          Genuine parts will have proper documentation including batch numbers, date codes, and traceability. And the labels of the genuine parts including the labels on the bottom side of the chip, should be consistent and the date code should be consistent with the device product, while the labels of the refurbished pieces without Remark are confused and the production date is different. Verify these details with the manufacturer’s records if possible.

          Documentation and traceability
          • Thickness measurement

            Because of the silkscreen on the electronic components, if you want to refurbish it is must to be polished, which will affect the thickness of electronic components. If you are a layman in electronic components industry, it is easy to ignore this.

            Thickness measurement
            • Function test

              Conduct electrical testing to verify that components meet the specifications claimed. This can include check if the electronic parameters align with what’s expected from the datasheet.

              Function test

              Above are the measurements about how to identify the fake components, however, last but not important is looking for a reliable reputable distributor or buy from original manufacturers directly. These sources are less likely to stock counterfeit parts. Best Technology not only provides PCB & PCBA assembly services, but also offers components sourcing and purchasing from original manufacturers. If you are looking for a reliable supplier, welcome to contact with us or send e-mail to us.

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              How Does Thermal Resistance of Solder Mask Effect Ceramic PCBs?

              Tuesday, April 23rd, 2024

              In the printed circuit board (pcb) fields, thermal management is a key consideration especially in industries such as automotive, aerospace, tele-communications and power electronics. Ceramic PCBs are known for their excellent thermal conductivity and mechanical properties and are becoming increasingly popular in applications where efficient heat dissipation is essential. Under this situation, solder resistance materials play a vital role not only in protecting the circuit, but also in influencing thermal behavior.

              ceramic pcb

              What is Thermal Resistance in Ceramic Circuit Board?

              Ceramic PCBs are usually composed of materials such as alumina (Al2O3) or aluminum nitride (AlN), which have superior thermal conductivity compared to traditional glass fiber PCB substrates. This inherent thermal conductivity promotes the efficient transfer of heat from heating components, improving the reliability and performance of electronic devices. However, while substrate materials make an important contribution to thermal management, the thermal resistance of solder resistance materials must also be considered.

              Solder mask materials are mainly used to isolate conductive wires on the pcb, prevent unexpected electrical connections, and protect the circuit from environmental factors such as moisture, dust, and chemical contaminants. Although solder mask is not generally praised for their thermal conductivity, their thermal resistance can affect the heat dissipation within the PCB components.

              ceramic pcb

              What Factors Influencing Solder Mask Thermal Resistance?

              Solder resistance thermal resistance is an important feature in the design and performance of printed circuit boards, especially when considering thermal management of electronic devices. There are several factors that affect the thermal resistance of solder pads, and understanding these factors can help optimize the thermal design of the PCB. Here are the key factors:

              Solder Mask Composition

              The type of resin and fillers used in the solder mask can significantly affect its thermal properties. Epoxy resins are common, but other materials may offer better thermal conductivity.


              Thicker layers of solder mask can increase thermal resistance because they add more insulating material between the heat source (such as electronic components) and the ambient environment. Thinner layers might improve heat dissipation but could be less effective in protecting against physical damage or corrosion. Generally, solder mask has around 20-25um thickness and has 0.2W/m.k thermal conductivity.

              Curing Process

              The process conditions under which the solder mask is cured (temperature, time, and environment) can impact its mechanical and thermal properties. Improper curing can lead to reduced heat transfer efficiency.

              Dielectric Constant

              The dielectric constant of the solder mask material influences its ability to conduct heat. Materials with higher dielectric constants may provide higher thermal resistance.

              Interface with Substrate

              The interface between the solder mask and the ceramic substrate can affect thermal resistance. Poor adhesion or air gaps may decrease heat transfer between the layers.

              ceramic pcb

              What are the Importances of Thermal Resistance in Ceramic PCBs?

              Efficient thermal management is crucial for maintaining the reliability and longevity of electronic devices, especially in applications where high temperatures can degrade components or compromise performance. In ceramic PCBs, where heat dissipation is a key advantage, minimizing thermal resistance throughout the assembly is essential.

              While ceramic substrates inherently offer excellent thermal conductivity, the solder mask layer presents a potential bottleneck for heat transfer. Therefore, selecting solder mask materials with optimal thermal properties and ensuring proper application are critical steps in PCB design and manufacturing.

              Applications and Considerations:

              Ceramic PCBs find applications in various industries, including power electronics, LED lighting, automotive systems, and telecommunications infrastructure. In these applications, where thermal management is critical, careful consideration of solder mask thermal resistance is essential for meeting performance requirements and ensuring reliability under challenging operating conditions.

              Designers and engineers must balance the need for thermal management with other considerations such as cost, manufacturability, and compatibility with assembly processes. Collaboration with experienced PCB manufacturers and material suppliers can help optimize the selection of solder mask materials and design solutions tailored to specific application requirements.

              The thermal resistance of solder mask materials is an important consideration, especially in applications where heat dissipation is a concern, such as high-power electronics or devices operating in harsh environments.

              Solder mask materials are designed to withstand the temperatures encountered during the PCB fabrication process, including solder reflow, typically ranging from around 220°C to 280°C (428°F to 536°F), depending on the specific materials and processes used.

              ceramic pcb

              However, when it comes to the thermal resistance of solder mask materials in terms of their ability to dissipate heat away from components or traces on a PCB, they generally have lower thermal conductivity compared to materials like copper or aluminum. This means that they are not as effective at transferring heat away from heat-generating components.

              In high-power applications or those where thermal management is critical, additional measures may need to be taken, such as incorporating heat sinks, thermal vias, or selecting solder mask materials with improved thermal properties. Some manufacturers offer solder mask materials with enhanced thermal conductivity for specific applications where heat dissipation is a concern.

              As electronic devices continue to evolve with increasing power densities and miniaturization, the demand for advanced thermal management solutions will grow. In the realm of ceramic PCBs, ongoing research and development efforts aim to enhance the thermal properties of solder mask materials, enabling more efficient heat dissipation and further improving the reliability and performance of electronic systems.

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              What Uses Would Ultra-Thin Printed Circuit Boards Find?

              Tuesday, April 23rd, 2024

              This category of ultrathin printed circuit boards is characterized by a thickness lesser than standard FR4 PCBs and generally finer than 0.60mm. But sometimes, due to space or margin limitation, or even design purposes, people need much thinner thickness such as 0.25 mm, 0.20 mm, or even 0.15 mm, so that it can be used by the PCB, such as SIM Card, Sensor Card, and so on. Due to thin thickness, extra thin PCB or very thin PCB name has been coined.

              ultrathin pcb

              What are the Applications of Ultra-thin PCB?

              Ultra-thin printed circuit boards (PCBs) are quite specialized items, helpful to find applications in several industries due to their flexibility, reduced weight, and space requirements. Given below are a few areas wherein ultra-thin PCBs would add more value:

              1.   Wearable Technology

              With wearables dictating minimalist designs, thin PCBs offer just the right solution. Their thinness ensures a perfect fit in wristbands, smart clothing, and medical patches for an improved user experience in comfort and battery life.

              2.   Mobile Devices

              The same can be said about PCBs as the relentless race continues for ever-thinner smartphones and tablets. Being thinner will continue enabling engineers to shove more processing power into a tight space.

              3. Aerospace and Defense

              In the world of satellites and drones, weight is critical. Besides being rugged, thin PCBs are lightweight; they allow intensive avionics systems to function faultlessly without adding their own unwarranted heft.

              ultrathin pcb

              4.   Flexible and Foldable

              Innovators can easily create new product designs using flexible PCBs that bend and flex. From foldable phones to curved displays, the product will survive repeated cycles of bending and yet have low impedance.

              5.   Medical Devices

              Miniature implantable medical devices require PCBs that are both small and biocompatible. Thin PCBs fulfill this need because they assist medical devices in being used in minimally invasive procedures and, besides, by way of example, give patient comfort since such patients can wear these devices for long periods.

              Which Kind of Surface Finishing Can be Used on Ultra-thin PCB?

              Common surface treatments used in extra thin PCB often include OSP (Organic Solderability Preservative), ENIG (Electroless Nickel Immersion Gold), or hard gold plating for the very best durability, conductivity, and environmental resistance. Now, thin PCB technology becomes a great enabler for industries that have an unparalleled level of miniaturization and functional density.

              As we continue to shrink the world of electronics, the role of thin PCBs is set to expand exponentially.

              Stay tuned for the latest thin PCB manufacturing developments that will have real potential to completely change how thin PCBs are conceptualized and used in modern electronics design. If you would like to harness the power of thin PCBs for your next project, feel free to engage a trusted PCB expert to unlock unparalleled benefits in size, weight, and performance. Learn more about the capabilities of thin PCB fabrication and the applications they are used in industry. Ensure that the Anchor Text is keyword-rich: Discover More About Thin PCB Fabrication Capabilities and Industry Applications.

              ultrathin pcb

              We hope this comprehensive article has been able to clarify doubts about Ultrathin PCBs. If you require any other service or have any question, do not hesitate to contact us. Our dedicated staff with 18 years of experience in the electronics manufacturing field is ready to present unbeatable service to you and make your dream for Ultrathin PCB come true. Talk to us for all your custom solutions and the best customer service. We are committed to making sure you get satisfaction and are bound to offer you nothing short of the best for your Ultrathin PCBs. Get in touch with us today and let us take your project to the next level.

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              We Will Be Exhibiting at New-Tech Israel 2024

              Friday, April 12th, 2024

              Best Technology, a China-based PCB & PCBA manufacturer will be exhibiting at New-Tech 2024 in EXPO Tel-Aviv, Israel at booth No. 66 from May 28, 2024 to May 29, 2024(Western Time). Actually, we have participated in such exhibition for several years. At our exhibition booth, attendees will be able to learn more about our company for PCB manufacturing and PCB assembly technology. Here are some pictures for your reference.

              pcb exhibition
              AEMS show
              pcb exhibition
              pcb exhibition
              ceramic exhibition
              Ceramic exhibition
              pcb exhibition
              pcb exhibition
              pcb exhibition
              pcb exhibition

              For interested professionals, Best Technology had on hand experts to offer detailed insights and experience on PCB assembly, covering PCB prototype and low/high-volume production. For more information on PCB assembly and fabrication, welcome to visit our booth.

              You will see 10mm to 1,500 mm flexible circuit board, from 2layer rigid-flex circuit to 50 layers, 1/2 OZ copper to 3 OZ, 0.15mm extra thin FR4 PCB to 30 OZ heavy copper, various ceramic PCBs (thick film, thin film, DPC, DBC, HTCC, AMB, LTCC). Our new products also will be shown in this exhibition, like copper/aluminum busbar PCB, transparent/PI/rubber silicone flexible heating film, semi-flexible PCB, semi-flexible aluminum PCB.

              best products

              In Best Technology, you will enjoy one-stop service from components sourcing, board fabrication (FPC, PCB, MCPCB, Ceramic PCB) and final assembly with programming and testing and metal dome that is used in conjunction with a printed circuit board, flex circuit, or membrane switch, become normally-open tactile switches. we have four types of metal domes: four legs with size from 5mm-20mm; triangle with size 4mm-12mm; round dome with size 4-16mm, oblong dome with size 3.7mm-58.1mm, and we also make dome with adhesive, named dome array, custom membrane switches also available in Best Tech.

              You are warmly welcome to see how we can manage the components wastage and efficiency to help save your time, money and energy.

              About New-Tech:

              The New-Tech Exhibition is the largest and major exhibition of the Hi–Tech & Electronics in Israel. More than 150 companies, who lead these fields in Israel and around the world, will take part and exhibit in this trade show.

              This exhibition shows a comprehensive array of electronic components, production processes, subcontracting services, clean room equipment, electro-optic devices, test equipment, printed circuit boards, industrial materials, computerization solutions, robotics, power systems, RF/microwave technologies, and more. Attendees can explore cutting-edge innovations in development, design, engineering, and procurement across various industries.

              It is important to note:

              1. Participation in the exhibition is conditional on prior registration, even for invited customers.

              2. After registration and before the conference, a code will be sent to the mobile to confirm participation in the conference.

              For more details and registration: https://www.new-techevents.com/exhibition-registration-form/

              Welcome to visit us at Booth #66 from May 28, 2024 to May 29, 2024 (Western Time).

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              What Is the Importance of Ground Plane in PCB EMC Design?

              Saturday, March 30th, 2024

              In the design of electronic products, electromagnetic compatibility (EMC) is a crucial consideration. Particularly in the design of printed circuit boards (PCBs), the rationality of EMC design directly impacts the performance and stability of the product. Among the many factors affecting EMC, one factor is especially critical, and that is the design of the ground plane. Today, let’s talk about the impact of grounding on EMC.

              In an electronic product, grounding is a very important element, it is directly related to EMC compliance. Especially in large equipment, the grounding of multiple systems and subsystems is involved. It can be said, a good grounding system means the half successfully of a product.

              What are Ground Plane and EMC in a PCB?

              The ground plane, as the reference potential in a circuit, not only carries the return path of current but also plays a role in electromagnetic shielding and noise suppression. In high-frequency circuits, the impedance and layout of the ground plane have a significant impact on signal integrity. Unreasonable ground plane design may result in signal interference, increased radiation, and decreased system stability.

              EMC stands for Electromagnetic Compatibility. It refers to the ability of electronic devices and systems to operate properly in their intended electromagnetic environment without causing or experiencing interference. EMC ensures that devices can function without adversely affecting other devices nearby or being affected by electromagnetic interference from external sources. Generally, the ground planes will showing three shapes, please see as following:

              Why A Grounding Must be Designed in PCB?

              Grounding can be understood as an equipotential point or plane serving as the reference potential for a circuit or system, which can be a specific ground layer in a PCB or the metal chassis of a product. While many perceive the purpose of designing a ground plane primarily to prevent external electromagnetic interference (EMI), but in printed circuit board design, it serves multiple purposes beyond this.

              Generally, a well-designed ground provides a common reference zero potential for all circuit units within a system, ensuring no potential difference between circuits and thus stable operation. It also protects circuits from damage, ensuring the safe functioning of electronic products. For instance, ground can provide discharge paths for transient disturbances and dissipate accumulated charges on product metal enclosures induced by static electricity, to prevent potential sparks that may cause interference internally. Additionally, choosing appropriate grounding for shielding structures can yield effective electromagnetic shielding.

              Grounding design is very necessary especially for medical industry. As we know, there are many medical devices are directly connected to patients’ bodies, such as monitors. In cases where the chassis carries voltage due to poor grounding, fatal risks may arise. Furthermore, grounding reduces common-mode interference currents flowing through PCBs and prevents high-frequency EMI signals within products from reaching equivalent radiating antennas. Thus, grounding is typically a primary method for noise suppression and interference prevention.

              Design Principles of Ground Plane in PCB

              A well-designed grounding system should not only consider the radiation and conduction of individual PCBs but also prevent from a systemic perspective. In the design phase, failure to carefully consider the grounding system may indicate a high likelihood of EMC failure for the system. So, knowing the design principles is extremely important to make sure the successful of EMC.

              • Keep it short and wide

              To reduce the impedance of circuits, especially in high-frequency circuits, the ground plane should be made as short and wide as possible. This helps to minimize the return path of the current, thereby reducing EMI.

              • Partition layout

              For complex PCB designs like multilayer PCBs, it is recommended to use a partition layout to separate the ground planes of different functional modules. This helps to isolate noise interference between different modules.

              • Single-point ground and multipoint ground

              Depending on the circuit’s operating frequency and signal characteristics, choose between single-point grounding or multipoint grounding. Single-point grounding is suitable for low-frequency circuits, while multipoint grounding is more suitable for high-frequency circuits.

              • Ground plane

              Where possible, use a ground plane as the ground. The ground plane can provide a low-impedance return path and aid in electromagnetic shielding.

              How to Optimize Your Grounding Design?

              As for PCB that has already design the circuit layout, how to optimize the ground to get the maximum EMI? Here are some tips that may helpful for you.

              • Fill the blank areas of the PCB with ground planes to increase the ground plane’s area and reduce impedance.
              • Reducing the area of ground loops helps to decrease electromagnetic radiation and induced noise.
              • Power lines and ground planes should be placed as close as possible and run parallel to reduce the area of the current loop.
              • Placing decoupling capacitors between power and ground planes helps to filter out high-frequency noise.

              In PCB EMC design, ground plane design is an essential step that cannot be ignored. By following the principles and optimization methods of ground plane design, the EMC and signal integrity of electronic products can be significantly improved. Therefore, in PCB design, sufficient attention and consideration must be given to ground plane design. Welcome to contact Best Technology if you want to know more about ground and EMC design.

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              Top 6 Considerations You Must Know About PCB Designs

              Wednesday, March 27th, 2024

              Electronics devices and parts are existing everywhere in this big data era, and more and more engineers trying to step in the electronics design and development. As a one-stop PCB and PCBA manufacturer in China, Best Technology would like to share some basic considerations and tips during the PCB designs. Hope this can help you.

              Substrate Material

              Substrate is the main composition of a circuit board and it mainly used for suppler and copper foil insulation. The commonly materials are FR4 and PI. FR4 is a widely acceptable international grade for fiberglass reinforced epoxy laminated, and it always used for making rigid PCB or rigid-flex PCB. FR4 substrate has good insulation and mechanical strength, so it can be widely used in various applications. However, PI has higher heat and chemistry resistance, more suitable for high temperature and chemical corrosion environment.  

              Circuit Layout

              The layout design depends on the dimensions, performance and reliability of a circuit board, it is needed to follow your supplier’s standard to make sure the fast production time and high quality.

              • Min line width

              Please make sure your line width within your supplier’s manufacturing capability, that is to say, if it is less than the minimum line width will not able to be produced. The best way is if the design conditions available, the larger the line width, the better the factory production. Generally, the line width keeps around 10mil is the best. In another word, if your line width is less than normal standard, it would be difficult for you to find a suitable supplier.

              • Min line spacing

              Min line spacing means the distance between trace and trace. Normally, from the production aspect, the distance from line to pads should not less than min line spacing, and it would be better if it is larger, generally equal to or more than 10mil.

              • The spacing between circuit to outline should be control in 20mil.

              Plug-in Hole

              The diameter of plug-in hole should be considered by the side of components, but it is necessary that it must greater than the component’s pins, it is recommended that greater at least 0.2mm. That is to say, if the pin of components is 0.6mm, then the plug-in holes should be greater than 0.8mm. Otherwise, the plug-in components would be probably difficult to insert into PCB because of the tolerance control during the manufacturing and assembly

              Min Hole Diameter

              As we all know, the holes in PCB almost be used for mounting components, connect circuit and provide the electrical connection between layers. So how to design the hole also is crucial during the designing. Generally, the min hole diameter depends on the drill bitter that vendor used, always around 0.2-0.4mm. You can ask your supplier during the design evaluation.

              Copper Thickness

              Copper foil is a layer of metal foil on the PCB board that is used to conduct current. The thickness of copper foil is usually in oz (ounces), such as 1oz, 2oz, 3oz, etc. The thickness of the copper foil will affect the conductivity and heat dissipation performance of the PCB board.

              Impendence Control

              Impedance control is a key parameter in high-speed signal transmission and high-frequency circuit design. It involves board thickness, copper foil thickness, substrate dielectric constant, pad and line layout and other factors to improve the signal integrity and anti-interference ability of the PCB board.

              The production process of PCBs is rather complex, involving a wide range of techniques from simple mechanical processing to sophisticated machining, so you should understand the design rules very clearly when you are trying to design a PCB board. Its applications are also diverse, from consumer electronics to industrial machinery, where PCBs are utilized.

              Best Technology offers one-stop PCB solutions, we offer service from prototyping to large-scale production and assembly. With experienced engineers and service teams, we ensure successful fulfillment of your requirements. Just send us with your design files, and we will make the circuit board for you in a very short time.

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              Do You Know What Is PCB Stiffener Busbar?

              Wednesday, March 27th, 2024

              Busbar PCB is an electronic component, also known as a socket board or mother board, which is an important part of an electronic device and is used to connect and transmit current and signals, so it plays a crucial role in the design of electronic devices. Busbar PCB is like a PCB coated with an “ear”, which we also call it as stiffener busbar. Want to know more about it? Welcome to reading on!


              What is PCB Stiffener Busbar?

              A busbar circuit board is a key component used in electrical systems. It usually consists of a main conductive busbar (usually copper or aluminum) that is covered with an insulating material such as prepreg or resin. Busbar boards are used to transmit high currents in power systems, such as in industrial equipment, power distribution systems, and control panels.

              These boards typically have multiple slots for inserting electrical connectors or electrical devices. The design of the bus board can be customized according to the specific application requirements to adapt to different current and voltage requirements. They are widely used in the industrial and commercial sectors because they provide reliable power transmission and connectivity solutions.


              What Are Benefits of Using a Busbar PCB?

              Busbar stiffener pcb serves as a crucial element of conducting electricity, especially when simplifying the power distribution process, saving costs and requiring greater flexibility. They come in a variety of sizes and different coatings, such as aluminum and copper. The material type, dimension, size and shape of the busbar determine the current capacity it can carry. Compared with a coil harness, though it is expensive in manufacturing, but has longer life and does not need to replace in a short time. Here we listing some benefits of busbar PCB:

              • Efficient Power Distribution

              With the fast development of new energy cars and vehicles, the electronic parts in the cars also should updated to meet the demands of renewable energy powers. So the busbar PCB stands out because it can distribute the powers in devices efficiently. Meanwhile, it also can help to reducing the consumption of energy. Because of its integrated nature, it can easily adapt to the integration of renewable energy, which is quite intriguing to consider in this advanced era of energy.

              • High Conductivity

              The busbar stiffener on a PCB is typically crafted from either copper or aluminum. Copper, renowned for its excellent conductivity, stands out as the preferred material for busbars due to its capacity to facilitate the flow of electrons. Moreover, copper’s robust nature enables it to withstand harsh environmental conditions and high temperatures, thus bolstering its longevity and durability. But if you want PCB that can carry higher conductivity, ceramic PCB is the best choice but a little bit higher cost.

              • Can be Customized

              Busbar is a highly customization product in PCB design, it offers various options for its mechanical capability. So maybe you can find it in every industry, such as educations, medical instruments, factories, communications and various electronic devices. Tight space and compact devices require substitute electrical distribution, and busbars serve the purpose right. Due to its high compact and strong mechanical and chemistry, busbar PCB can be used in extremely harsh weather. This makes them a good choice in substations or devices that need to used outdoors.

              • Space Saving

              Due to the copper materials mounted on the PCB, Busbar PCBs can replace multiple traces with a single, wider conductive strip, saving valuable space on the board. This compact design is particularly useful in applications where space is limited. In addition, busbar PCB provides multi-layer structure when your design is complex and has density traces network.

              By means our extensive PCB & PCBA manufacturing and professional engineering team, we are highly able to build and design busbar PCBs according to your specific requirements. Meanwhile, we follow the strict quality system to make sure the high-quality of products. You are welcome to contact us or send e-mail if you want to make such busbar stiffener PCB.

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              What Are the Benefits of DFM in PCB Manufacturing?

              Monday, March 18th, 2024

              In the PCB manufacturing, we always heard a word – DFM, do you know what is DFM? And how does it affect the manufacturing? Herein, Best Team would like to explain the DFM and its benefits for you.

              What is DFM?

              DFM stands for Design for Manufacturing. It is an engineering approach focused on designing products in a way that optimizes their manufacturability, testability, and reliability right from the beginning stages of product development.

              The goal of DFM is to simplify the manufacturing process, reduce production costs, and improve the overall quality of the final product. This involves considering manufacturing constraints and capabilities early in the design phase to minimize complexities, facilitate assembly, and enhance efficiency in production. By integrating DFM principles, manufacturers and engineers/designers can achieve cost savings, faster time to market, and higher-quality products.

              What We Should Considered About Design for Manufacturing?

              Design for Manufacturing (DFM) is guided by several key principles aimed at optimizing the design of products for efficient and cost-effective manufacturing processes. Here are five fundamental principles and considerations must know of DFM:

              1. Design

              We all know the more complex the design, the greater the risk during the manufacturing. Therefore, keep the design as simple as possible while meeting the functional requirements of the product. Simplifying the design including reduce the number of parts, assembly steps, and manufacturing processes involved, which in turn lowers production costs and minimizes the risk of errors or defects.

              • Standardization

              In the PCB industry, there is an IPC standard to standardized all the elements design in PCB, this involved the line width, line spacing, solder mask thickness, text height and so forth. By using standardized parts and processes, manufacturers can take advantage of economies of scale, reduce lead times, smooth the manufacturing process and simplify supply chain management. Standardization also ensures the interchangeability, repair, and maintenance of products.

              • Design for Assembly (DFA)

              If you are trying to mount some components to keep and enhance the performance of product, then DFA is must to take into account. Arrange components on the PCB layout in a way can minimize signal interference, reduces trace lengths, and simplifies assembly. Placing components strategically can improve signal integrity, reduce electromagnetic interference (EMI), and facilitate automated assembly processes.

              • Material

              Select materials and manufacturing processes that are readily available, cost-effective, and well-suited to the intended application. Consider factors such as material properties, availability, recyclability, and environmental impact when making material choices. Designing for materials involves optimizing designs to minimize material waste and maximize efficiency in material usage.

              • Testability and Debugging

              Design PCBs with features that facilitate testing, troubleshooting, and debugging during manufacturing and assembly. Include test points, debug headers, and built-in self-test (BIST) circuitry to simplify testing and diagnostics. Design PCBs with clear labeling, documentation, and accessibility to aid in maintenance and repair.

              What Are the Benefits of DFM Analyzing?

              The mainly benefits of using DFM is save cost. You know, when creating a new project, we need put much money and time in designing and prototyping. DFM helps identify potential manufacturing issues early in the design phase, allowing for cost-effective modifications before production starts. By optimizing designs for manufacturability, companies can avoid expensive rework and reduce overall production costs. Statistically, we can save around 170 thousand dollars one year by adopting DFM analyzing (human cost, trail-production cost and repair cost). In addition, DFM offers numerous benefits including:

              • Reduce potential quality defects
              • Facilitate production process improvement
              • Decrease trial production cycles
              • Quick time to market
              • Enhanced product quality and stability
              • Mitigate risks associated with personnel changes

              How to Find a Manufacturer with DFM Service?

              Finding a reliable DFM manufacturer is essential for ensuring the success of your product development. Best Technology engaging in PCB manufacturing for more than 17 years, and we have many experts that can help to solve and provide PCB solution for you. Meanwhile, we have professional DFM system that can help to quickly diagnose the design exception such as components missing, trace layout, open/short circuit. With our expertise and advanced tools, we ensure that your PCB designs are optimized for efficient manufacturing, resulting in high-quality products that meet your specifications and exceed expectations. Trust Best Technology to be your partner in achieving excellence in PCB manufacturing.

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              2024 Newest Guide to High Thermal Conductivity PCBs

              Monday, March 18th, 2024

              Currently, with the rapid development of the digital era, the demands and requirements for electronics have increased significantly. Many double-sided and multi-layer boards have high density and power, making it difficult to dissipate heat efficiently. Conventional printed circuit board substrates such as FR4 and CEM3 are poor thermal conductors with interlayer insulation, the heat can’t transfer out, which leading to high-temperature failure of electronic components and devices. So, engineers and researchers are aiming to find high thermal conductivity PCBs to solve such problems, and metal core PCB and ceramic PCB stand out at this time.

              Metal core PCB is a type of PCB that made by metal alloy material as the base core, commonly are aluminum core or copper core, rarely is iron PCB. They are popular because of its good heat dissipation properties and good mechanical strength.

              What is Aluminum PCB and Why Use It?

              Aluminum substrate is a low-alloyed Al-Mg-Si series high-ductility alloy sheet. It exhibits excellent thermal conductivity, electrical insulation properties, and mechanical machinability. Compared to traditional FR-4, with the same thickness and line width, aluminum substrate can carry higher currents, withstanding voltages up to 4500V. Its thermal conductivity coefficient exceeds 2.0.

              A normal single side (1L) aluminum core PCB consists of three layers, aluminum base, dielectric layer and copper trace layer. Generally speaking, 1L aluminum PCB is always used for LED lighting, high current LED, spotlight, etc. So it also called LED PCB. For high-end applications, there are also designs for double-sided boards, structured as circuit layer, insulation layer, aluminum base, insulation layer, and circuit layer. In rare cases, multi-layer boards are used, which can be composed of multi-layer FR4 boards laminated to insulation layers and aluminum base.


              The thermal conductivity of aluminum core is range from 1-3W/m.k, the higher conductivity, the better heat dissipation. However, not all the projects is suitable for higher conductivity, it should depend on the specific requirements, such as mechanical strengthen, corrosivity. Nowadays, Best Technology used 6061, 5052, 1060 aluminum alloy as the metal core, others also available if customers have requirements.

              How Does Copper Core PCB Works?

              Copper substrate is the most expensive type among metal substrates, offering significantly better thermal conductivity compared to aluminum and iron substrates. It is suitable for high-frequency circuits, regions with large temperature variations, and precision communication equipment for heat dissipation purposes, as well as in the construction and decoration industries.

              The copper PCB’s circuit layer requires a significant current-carrying capacity, thus necessitating the use of thicker copper foils, typically ranging from 35μm to 280μm in thickness. The thermal insulation layer is the core technology of the copper substrate, composed of aluminum oxide and silicon powder as the main thermal conductive components, filled with a polymer of epoxy resin. It exhibits low thermal resistance (0.15), excellent viscoelastic properties, and possesses the ability to resist thermal aging, withstanding mechanical and thermal stresses.

              The metal base layer of the copper substrate serves as its supporting component, requiring high thermal conductivity. It is typically made of copper foil, though copper plate can also be used (with copper PCB offering better thermal conductivity, around 1-400W/m.k). These substrates are suitable for conventional mechanical processing methods such as drilling, punching, and cutting.


              What Are Differences Between Copper and Aluminum PCB?

              Though both copper and aluminum are metal core PCB, they still have some differences in characteristic and manufacturing. Knowing their differentiation can help you to understanding and making correct decision in material selection.

              • Material

              Copper has excellent electrical conductivity and mechanical strength, so copper PCB is well-suit for high frequency circuits and high-power electronic equipment. While aluminum is slightly inferior to the copper base, so it is a good choice of low-power devices.

              • Cost

              Compared with copper, aluminum PCB has much advantages in cost, so if you have limited budget and require to use for low-power equipment such as LED lights, aluminum is the better one.

              • Manufacturing

              Due to copper has great hardness and good strengthen, it requires for special technical and complex processes, for example: chemical etching, electro-plating. However, the lightweight of aluminum makes it easy in manufacturing. In addition, PTH (plated through holes) can be created on copper PCBs, but not on aluminum ones.

              • Physical Property

              The difference in elastic modulus between copper and aluminum is significant, resulting in less warping and expansion/contraction in copper substrates compared to aluminum substrates.

              • Application

              Aluminum PCB is lighter than copper substrate, the material cost is lower, often used in daily LED lights or electronic equipment. Because of its strong thermal conductivity and better electrical conductivity, copper substrate is usually used in high-speed circuits and high energy circuits. In addition, copper substrates are also widely used in areas requiring high heat transfer and heat dissipation performance, such as power amplifiers, power supplies, power tools, automotive engine controllers and solar inverters.


              What is Ceramic PCB? And Its Thermal Conductivity?

              Ceramic PCB is one of the high thermal conductivity PCBs in this industry. They have good high-frequency properties and electrical properties, and have high thermal conductivity, chemical stability and excellent thermal stability of organic substrates without. It is a new generation of large-scale integrated circuits and power electronics module ideal packaging materials. The thermal conductivity of the ceramic substrate can reach about 220W/ M.K according to the preparation method and the material formula. Theoretically speaking, the thermal conductivity of ceramic circuit made by alumina is 24-28W/m.k, AlN is 150-240W/m.k and for BeO is 22-250W/m.k.

              Ceramic PCB can be divided into various types of PCB according to its different PCB manufacturing process, they are thick film, thin film PCB, DPC, DBC, HTCC and LTCC ceramic circuit board. Different types of PCB made in different temperature and uses different materials, this means they have different chemistry and physical properties. So you should take them into consideration when designing a ceramic PCB for your device.


              A Reliable PCB Supplier in China – Best Technology

              Whatever you choose metal core PCB or ceramic PCB, a reliable supplier is necessary and needed. Best Technology has extensive manufacturing experience in PCB and we are very confident that we can serve you the best service and high-quality product. With rich experience and strong R&D team, we know how to provide you the best solution and evaluate the design files for you. We have professional DFM (Design For Manufacturing) process to identify the mistakes or inappropriate layout in design. Welcome to contact with us to discuss your PCB projects.

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              Top 1 Design and Manufacturing Considerations for Bendable Aluminum PCBs

              Thursday, March 7th, 2024

              You know, bendable aluminum PCBs have gained prominence in various electronic applications due to their unique ability to flex and conform to curved surfaces. Unlike traditional rigid PCBs that are commonly composed of materials like fiberglass , these PCBs utilize aluminum as the base material, allowing it bendable and flexibility when needed. Compared to the rigid characteristics of traditional metal core PCB, bending aluminum PCB can be adapted to specific space requirements and shape requirements. In this article, we will introduce the characteristics of bendable aluminum PCBs and explore the key considerations that engineers and manufacturers need to pay attention during the design and production process.

              What Are the Benefits of Bendable Aluminum PCBs?

              May some designers are reraly to know the bendable aluminum PCB, in their congnition, the bendable PCBs are including flex circuits, rigid flexible circuit and FFC, and aluminum PCB is classfied into one of rigid PCB. But here, Best Technology is so proud to say, we have developed bendable aluminum PCB and we can manufacture it with fast delivery and high-quality, this is what we prouded.

              The primary advantage of bendable aluminum PCBs is their flexibility. They can be bent and shaped to fit into various form factors and designs, making them suitable for applications where space is limited or where flexibility is required and traditional rigid boards are not ideal. Common applications include wearable devices, curved displays, and other electronic systems with unconventional form factors.

              Additionally, bendable aluminum PCB has the advantages of aluminum, so it has good heat dissipation and higher thermal management than traditional PCBs. This feature is crucial for maintaining the reliability and performance of electronic devices, especially those operating in high-temperature environments.

              Considerations During the Design Process

              Al Material Selection:

              Considering that it is a bendable aluminum substrate, it must be satisfied that the material selection should be bendable but at the same time have good heat dissipation of the metal base. This aluminum base material is a specially designed aluminum alloy or aluminum base composite material. Meanwhile, the thickness of the material is critical, such as the material is generally from 0.2mm to 1.6mm, of which 0.2mm to 1.0mm is the more common bending metal substrate thickness.

              Flexibility Requirements:

              Defining the flexibility requirements is a crucial step in the design process. The degree of bending, bending radius, and any other factors related to flexibility must be clearly defined based on the intended application. For instance, a wearable fitness tracker might require a specific bending profile to comfortably conform to the curvature of the wrist.

              Also note that the bending radius is different for materials of different thicknesses. In general, a smaller bending radius usually corresponds to a thinner board material, while a larger bending radius can accommodate a thicker board material.

              Circuit Layout:

              The layout of the circuit components plays a pivotal role in ensuring the longevity of bendable aluminum PCBs. Designers should strategically plan the arrangement of components to accommodate bending without subjecting critical elements, such as sensors or microcontrollers, to excessive stress. Even distribution of components contributes to a balanced bending profile.

              And the pad should not be designed at the bend of the bending, which will cause damage to the assembly components after bending, or even no way to bend. In addition, the welding pad near the bending cross should also be kept away from the bending line to avoid collision and extrusion of the components after bending.

              Bending Radius:

              Determining the minimum bending radius that the PCB can tolerate is essential for preventing structural damage or compromise in electrical performance. Specific bending radii should be defined based on the application’s needs. For example, a bendable aluminum PCB designed for a wearable device might need to withstand repeated bending with a predefined radius.

              Dielectric Layer:

              Choosing an appropriate dielectric material is crucial for maintaining insulation between different layers of the PCB. The dielectric layer should possess flexibility to withstand bending without compromising its insulating properties.

              As we know, when design the aluminum PCB, the thermal conductivity is also important. Bendable aluminum also has the thermal conductivity requirement, but when the thermal conductivity material is higher, the higher the content of ceramic powder in material. And when the content of ceramic powder is higher, the brittleness of the material is higher, and it is easier to break or break after bending. The material of 1W/m.k is more bendable than 3W/m.k。


              Considerations During the Manufacturing Process

              Bendable aera line:

              For the production requirements of the light plate, the V-cut mark is generally used to determine the complete line at the bend, and attention should be paid to the depth control of the v-cut, so as not to damage the line.

              Testing and Validation:

              Prototyping is a vital phase in the manufacturing process of bendable aluminum PCBs. Thorough testing and validation are necessary to ensure that the PCB meets the required electrical and mechanical specifications. Bending tests simulating the intended application conditions should be performed to assess the PCB’s durability. such as bending test, bending angle test.

              Generally speaking, after the bare board finished, it’s not bendable to the required angle. In order to avoid bad transportation or collision, some customers require not to bend and they will bend it by themselves. But if the customers don’t want to bend the board by himself, we also can help to bend it, it will require mold and it need to custom the package for shipping. The custom package can help to protect the damage in shipping.

              Collaboration with Manufacturers:

              Close collaboration with experienced PCB manufacturers is key to successful production. Manufacturers with expertise in flexible PCB fabrication can provide valuable insights into the manufacturing process. Working together ensures that the design aligns with manufacturing capabilities, optimizing the production of bendable aluminum PCBs.


              In a word, the design and manufacturing of bendable aluminum PCBs involve a series of critical considerations to ensure the success and reliability of the final product. From material selection and flexibility requirements to testing, validation, and compliance with industry standards, each step plays a pivotal role in creating PCBs that meet the unique demands of modern electronic applications. By carefully addressing these considerations, designers and manufacturers can unlock the full potential of bendable aluminum PCBs in diverse and innovative electronic devices. Welcome to contact Best Technology if you want to know more.

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