What We Serve

Full turnkey service for various types of ceramic pcb manufacturing, custom ceramic pcb, pcb assembly, ceramic pcb duplicating in a very short time.

Ability in Process Technology

General Parameter
Special Process
High insulation, chemical corrosion resistance, high-temperature resistance
Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
Excellent thermal conductivity, low thermal expansion coefficient, and high-temperature resistance
Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
Insulation performance and high-temperature stability
Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
High strength, high hardness, high thermal conductivity, and low dielectric loss
Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
Glass, quartz, sapphire, 99% , 92% Al2O3 (black)
Single - Double sided
Single - Double sided
Single - Double sided
Thick film
Single - Double sided, 4L
Single - Double sided, 4L, 6L
6L - 14L
Single - Double sided, 4L, 6L
Inner layer
Outer layer
Hoz-3oz (DPC)   3oz-12oz(DBC/AMB) 
Max. dimension
Larger dimension avalible (pass evaluation)
Min. dimension
Shipped in panel
Substrate thickness
Al2O3/AIN 0.38. 0.635.1.0mm . Si3N4 0.25、0.32MM
Immersion silver
Immersion tin
Au 2u", Pd 1U", Ni 100u" 
Hard gold
Min. PTH
Max. aspect ratio (PTH PCB)
NTPH tolerance
PTH tolerance
Glass glaze, medium, solder mask ink
SM color
White, black, green
Mixed color
Silkscreen color
White, black
Mixed color
Silkscreen height, width
Line width≥0.13mm;Height≥0.8mm
SM thickness
Solder mask bridge
Outline tolerance
Min. tolerance(PTH)
Min. tolerance(NPTH)
Min. circuit to board edge
Min. finished board thickness


Best Technology is a well-known ceramic PCB manufacturer and ceramic PCB assembly for over 18 years. We have a large facility for handling low-medium-large quantity ceramic PCBs. We can make custom ceramic PCBs of any design.

About us

Company Profile

Our products ranging from standard FR4 PCB, multi-layer PCBs, metal-based PCBs (MCPCBs), ceramic PCBs, flexible and rigid-flexible PCBs to high frequency PCBs. Currently our mouthy capability is 260,000 square feet (28,900 square meter), more than 1,000 different boards will be completed. We also provide expediate service, so that urgent boards can be shipped out within 24 hours.

At a custom printed circuit board manufacturer, we believe that continuous growth is the key to success. So, we always invest much in research and development to stay ahead of industry trends. Our focus on product quality and customers satisfaction, and we aim to build strong relationships and offer personalized support and solutions to our customers.

qualification certificate

Quality Certifications

We have relevant quality certifications and RoHS compliant quality management system to offer the best ceramic PCB quality to our customers.

  • ISO 9001:2015
  • ISO 13485:2016
  • IATF 16949:2016
  • RoHS


We offer one-stop service from ceramic PCB design, prototyping, ODM, DFM, PCB assembly, box building services. You can get high-quality ceramic PCB board and PCBA at a very reasonable price. With our advanced technology and equipment, we ensure the highest quality.


Competitive Price

We are committed to offering high-quality PCB solutions at competitive prices. By optimizing our production processes and managing costs efficiently, we ensure that you get the best value for your investment.

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Quality Guarantee

At Best Technology, quality is our top priority. We perform strict quality control procedures cover every stage of production, from raw material selection, prototyping to final product testing.

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Turnkey Service

Our all-in-one approach simplifies supply chain, shorten lead times, and improves communication efficiency. And we have one-on-one sales-assistant service to give you a wonderful experience work with us.

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On-Time Delivery

We understand the importance of meeting your project deadlines, and we offer online WIP updates to make sure you can keep track of the progress of your PCB product.

Latest News


Why Ceramic PCB has such excellent performance?

Apart from MCPCB, if you want to use PCB in high pressure, high insulation, high frequency, high temperature, and high reliable and minor volume electronic products, then Ceramic PCB will be your best choice.

Why Ceramic PCB has such excellent performance? You can have a brief view on its basic structure and then you will understand.

96% or 98% Alumina (Al2O3), Aluminum Nitride (ALN), or Beryllium Oxide (BeO)
Conductors material: For thin, thick film technology, it'll be silver palladium (AgPd), gold pllladium (AuPd); For DCB (Direct Copper Bonded) it'll be copper only
Application temp: -55~850C
Thermal conductivity value: 24W~28W/m-K (Al2O3); 150W~240W/m-K for ALN , 220~250W/m-K for BeO;
Max compression strength: >7,000 N/cm2
Breakdown Voltage (KV/mm): 15/20/28 for 0.25mm/0.63mm/1.0mm respectively
Thermal expansion conefficient(ppm/K): 7.4 (under 50~200C)
Click here to see more details about ceramic substrate.

According to different manufacturing method, current there're three basic types for ceramic board:

A) Thick Film Ceramic Board
Thick Film Ceramic PCB: Using this technology, the thickness of conductor layer exceeds 10 micron, more thick than spurting technology. The conductor is silver or gold palladium, and was printed on ceramic substrate. More for Thick Film Ceramic PCB

B) Thin Film Ceramic Board
Thin Film Technology Ceramic PCB: Because the thickness of electric resistance and conductor film less than 10 micron, and that film was spurting on ceramic substrate, so named thin film ceramic board. More for Thin Film Ceramic PCB

C) DCB Ceramic Board
DCB (Direct Copper Bonded) technology denotes a special process in which the copper foil and the core (Al2O3 or ALN), on one or both sides, are directly bonded under appropriate high temperature and pressure. More for DCB Ceramic PCB

Application of Ceramic PCB
high-accuracy clock oscillator, voltage controlled oscillator (VCXO), temperature compensated crystal oscillators (TCXOs), oven controlled crystal oscillators (OCXOs);
Semiconductor cooler;
electric power electronic control module;
high insulation & high pressure device;
high temperature (up to 800C)
high power LED
High Power semiconductor modules
solid state relay (SSR)
DC-DC module power sources
electric power transmitter modules
Solar-panel arrays

What are the different types of ceramic PCBs?

Ceramic PCBs are a special breed of printed circuit boards known for their exceptional thermal resistance and durability. These PCBs are used in industries where high performance is critical, such as aerospace, automotive, medical devices, and power electronics. Nowadays, the most common types of ceramic substrate PCB are thick film, DCB, DPC, AMB, HTCC, LTCC and thin film. In this article, we will introduce each of them in details.

Thick film ceramic PCB
Thick film technology is a process by using screen printing conductor paste and directly deposit slurry (conductor) on the ceramic substrate. Then sintering it under high temperature to form conductive circuit traces and electrodes, which is suitable for most ceramic substrates.
After the material is sintered at high temperature, a strong adhesion film will be formed on the ceramic circuit board, repeat this step for many times, a multi-layer circuit is generated.
You can print resistor or capacitor on the surface to get a interconnected structure. At Best Technology, we can make all the resistors with the same value, or different value for different resistor on the same board.
Thick film ceramic PCB has advantages on the simple manufacturing process, but it has some drawbacks that can’t be ignored:

● Limited by the conductive paste and screen size
● Line width less than 100um is difficult to achieved
● Three-dimensional patterns are not available
● Not suitable for fine-trace project

DBC / DCB Ceramic PCB
Direct Bonded Copper (DBC) or Direct Copper Bonded (DCB) ceramic PCBs are known for their excellent thermal conductivity. They are made by bonding a layer of copper directly onto a ceramic substrate, typically aluminum oxide or aluminum nitride. Due to the DBC technology is directly bond copper on the ceramic substrate, it can achieve thicker copper thickness to 300um. So, it is very suitable for high power applications.

The basic chemistry principle is to introduce an appropriate amount of oxygen between copper and ceramics before or during the application process. Copper and oxygen will form Cu-O eutectic liquid under 1065℃~1083℃. This is an important element in the manufacturing. DBC ceramic circuit board uses this eutectic solution to chemically react with the ceramic substrate to form CuAlO2 or CuAl2O4, achieving the combination between substrate and copper foil.
However, it is easy to generate micro-porosity between Al2O3 and Copper during the copper bonded process, and it doesn’t have a good solution by far. That is why the yield of DBC ceramic PCB is not good than DPC.

DPC (Direct Plated Copper Ceramic PCB)
DPC ceramic PCB utilizes direct copper plating technology, deposit copper foil on the alumina oxide (Al2O3) substrate. It is the most commonly used ceramic PCB in recent years. The circuit generated process is: pre-treatment – sputtering – exposure – develop – etch – strip – electroplating.

AMB (Active Metal Brazed Ceramic PCB)
AMB ceramic copper clad plate adopts the active brazing process, and the copper layer bonding force is higher than that of DPC, which is around 18n/mm - 21n/mm. AMB ceramic copper clad plate usually has a high binding force, usually makes thicker copper, between 100um and 800um. The AMB ceramic PCB generally rarely design traces or holes, even if there is a trace is very simple, the spacing is relatively wide.

HTCC (High Temperature Co-fired Ceramic PCB)
HTCC is a relatively early development technology, but due to the high sintering temperature (1300~1600℃), the choice of electrode materials is limited. Meanwhile, its cost is more expensive, these promotes the development of HTCC is relatively slow.

LTCC (Low Temperature Co-fired Ceramic PCB)
Although LTCC reduces the co-firing temperature to about 850 ° C, the disadvantage is that the dimensional accuracy and product strength are not easy to control.

Thin Film Ceramic PCB
The thin film ceramic PCB is to deposit a metal layer directly on the surface of substrate by sputtering process. Through lithography, development, etching and other processes, the metal layer can also be graphed into a circuit pattern. Due to the low deposition speed of sputtering coating (generally less than 1μm/h), thin film substrate surface metal layer thickness is small and can prepare high pattern accuracy (line width/line space less than 10μm).

Common Ceramic Substrates

Best Technology is a leading ceramic PCB manufacturer in Asia, our core members has over 20 years manufacturing experience in ceramic PCB fabricating. “High mixed, low volume, high quality, fast delivery” is our advantages and we always try our best to do that, make ourselves better and better. If you are interested in it, feel free to contact us, we are always online.

What are the advantages of ceramic PCB?

Ceramic PCB is a type of emerging PCB in the recent years, they are known for their high thermal conductivity and low expansion coefficient. Except this, it has numerous advantages that normal FR4 PCB can not achieved. And even for metal core PCB (MCPCB). Today, we are going to introduce their characteristics in detail.

What are the advantages of ceramic PCB?
1. High thermal conductivity
The core metal content of ceramic circuit boards is as high as 96-98%, which makes them have extremely high thermal conductivity. Compared with ordinary FR4 circuit boards, the thermal conductivity of ceramic circuit boards can reach 170-230 W/mK, while the thermal conductivity of FR4 boards is usually only 0.3-0.4 W/mK. Higher thermal conductivity allows for more efficient heat dissipation, avoiding the problem of damage to electronic components due to overheating. This is particularly important in high-power applications, such as LEDs and power semiconductors.

2. Low thermal expansion coefficient
Ceramic materials have a very low coefficient of thermal expansion (CTE), usually between 6-8 ppm/°C. In contrast, FR4 material has around 14-16 ppm/°C CTE. This means that ceramic materials hardly expand or contract when temperature changes. The low thermal expansion coefficient improves the reliability of the circuit board, reduces the influence of the thermal cycle on the circuit board structure and the connection of electronic components. Especially suitable for use in the environment with frequent temperature changes.

What are the advantages of ceramic PCB?
3. High surface hardness
The surface hardness of ceramic materials is up to 9 Mohs, which is harder than aluminum oxide and silicon. It means ceramic PCB has more wear-resistant, scratch resistant, and not easy to damage. It enables to run stably for a long time even in harsh physical environments, extending the service life of the board. That is why ceramic PCB is always recommended to use in military.

4. High compressive strength
The compressive strength of the ceramic circuit board can reach 450-500 MPa, which can withstand large mechanical pressure without deformation or rupture. This characteristic makes them excellent in applications that require them to withstand mechanical stress, such as industrial automation and aerospace.

5. High dielectric strength
Ceramic PCB has very high dielectric strength, usually between 15-25 kV/mm. And it can withstand higher electric fields without electrical breakdown.

6. Ability to withstand higher temperatures
Ceramic circuit boards can operate at temperatures up to 1000°C without degradation or damage. While FR4 circuit boards typically operate at an upper limit of 140-170°C. Ceramic circuit boards are suitable for electronic devices in high temperature environments, such as electric vehicles and high-power lasers.

What are the advantages of ceramic PCB?
7. High breakdown voltage
The high breakdown voltage of the ceramic circuit board can reach 20-35 kV, ensuring reliable operation under high voltage conditions. It is well suitable for use in high-voltage power supplies and power electronic equipment, providing higher safety.

8. Does not absorb water
The water absorption of ceramic materials is usually less than 0.1%, while the water absorption of FR4 materials is 0.1-0.2%. The non-water absorbing feature prevents performance degradation and damage caused by water absorption in a humid environment. It is ideal for Marine, medical, and other applications that require moisture resistance.

9. Low loss at high frequency
In high-frequency applications, the dielectric loss Angle tangent (Df) of ceramic circuit boards is usually between 0.0001-0.001, while the loss Angle tangent of FR4 materials is 0.02-0.03. Low loss ensures signal integrity and transmission efficiency, which is suitable for communication equipment and high-frequency electronic equipment.

10. Resistance to cosmic rays
Ceramic materials can resist the impact of cosmic rays, will not be degraded or damaged by rays. They are suitable for satellite electronic equipment, ensuring the stability and reliability of the circuit board in a high radiation environment.

11. No organic ingredients
Ceramic circuit boards do not contain organic components, so they have high chemical stability, are not susceptible to chemical corrosion and decomposition. They are good choice to use in harsh chemical environments.

12. High-density assembly
Ceramic circuit boards support high-density assembly with line/pitch resolution of 20 microns. This allows them to be adapted to more complex and refined circuit designs, suitable for microelectronics and high-precision applications.

Best Technology provides professional one-stop ceramic PCB design and manufacturing service all around the world. We welcome all the friends and partners from domestic and abroad to visit our ceramic circuit board workshop.

How does a DPC Ceramic PCB Manufactured?

Direct Plating Copper (DPC) is a ceramic circuit board developed on the basis of ceramic film processing. Aluminum nitride/alumina ceramic is used as the substrate of the circuit, and the composite metal layer on the surface of the substrate is sputtered, and the circuit is formed by electroplating and lithography. Its basic processes are:

Incoming Quality Control (IQC)
The process begins with the inspection of raw materials to ensure they meet strict quality standards. This step involves checking ceramic substrates for physical defects such as cracks, chips, or surface irregularities, and verifying material properties like thermal conductivity and dielectric strength. Advanced equipment such as microscopes and X-ray fluorescence (XRF) analyzers are used for thorough inspection, ensuring only the best materials proceed to the next stage.

Laser Drilling
Before laser drilling, a water-soluble, food-grade substrate pigment is brushed onto the ceramic substrate to reduce reflectivity and enhance laser drilling effectiveness. After drying in an oven, a laser drilling machine is used to drill through the substrate, creating pathways for connections between the upper and lower surfaces. Depending on the ceramic material, different laser wavelengths such as infrared, green light, ultraviolet, or CO2 are used to burn away the material with each laser pulse.

How does a DPC Ceramic PCB Manufactured?
Laser Marking
Laser marking involves using a laser marking machine to engrave product QR codes onto the ceramic substrate. This step ensures precise and permanent identification marks on the PCB.

Ultrasonic Cleaning
After laser drilling and marking, the substrates are cleaned to remove any attached particles or residues. This involves coarse and fine debris removal using ultrasonic cleaning, followed by water washing to eliminate any remaining particles. The cleaned substrates undergo micro-etching to roughen the surface, enhancing the effectiveness of subsequent magnetron sputtering, and are then dried to remove surface moisture.

Magnetron Sputtering
In the magnetron sputtering process, a high-vacuum chamber is used to ionize argon gas, producing an ion stream that bombards a target cathode. This causes atoms of the target material to be ejected and deposited as a thin film on the ceramic substrate. Pre-sputtering treatments such as dust removal, degreasing, and slow pulling are conducted to ensure optimal results.

Chemical Copper Plating
Chemical copper plating thickens the copper layer, improving the conductivity of the vias and ensuring better adhesion with the sputtered copper layer. This catalytic redox reaction involves pre-treatment steps like degreasing, micro-etching, pre-immersion, activation, and acceleration to ensure proper copper deposition.

Full-Panel Electroplating
Full-panel electroplating increases the thickness of the copper layer. This involves processes such as degreasing, micro-etching, acid washing, copper plating, and stripping excess copper from the fixtures. The copper plating uses copper balls as anodes and an electrolyte solution of CuSO4 and H2SO4, with the primary reaction being Cu2+ + 2e- → Cu.

Grinding, Laminating, Exposure, and Developing
Post electroplating, the copper layer is prepared for patterning. This includes acid washing to remove oxides, grinding to roughen and clean the surface, laminating with a photoresist dry film, UV exposure through a photomask to create the desired pattern, and developing to dissolve unexposed areas, leaving behind the patterned photoresist.

How does a DPC Ceramic PCB Manufactured?
Pattern Plating (Electroplating Copper)
The exposed and developed areas of the substrate where the circuit pattern is defined undergo further copper electroplating to thicken the circuit traces.

How does a DPC Ceramic PCB Manufactured?
Etching and Stripping
Unwanted copper and dry film are removed through etching, stripping away excess copper deposited in previous steps. This includes rough grinding, film stripping, copper etching, and titanium etching, ensuring only the desired circuit pattern remains.

The ceramic boards are annealed in a furnace to relieve stresses introduced during electroplating, enhancing the ductility and toughness of the copper layer and ensuring dense copper grain packing.

Belt Grinding
Post-annealing, the substrate surface may have an oxide layer and rough texture. Belt grinding is used to remove these oxides and smoothen the surface, ensuring the quality of subsequent gold or silver surface treatments.

Flying Probe Testing
High-speed flying probe testers check for continuity and shorts in the vias and circuit traces, ensuring electrical integrity.

Sandblasting Before Solder Mask
Prior to solder mask application, the substrate undergoes sandblasting to roughen and clean the surface, removing oxides and contaminants. This includes acid washing, sandblasting, and micro-etching.

Solder Mask Printing
Solder mask is printed on areas of the PCB that do not require soldering, protecting the circuits during soldering and assembly. Screen printing applies solder mask ink, which is then UV-cured and developed to remove unexposed areas.

Sandblasting After Solder Mask
After solder mask application, exposed areas that need surface treatments undergo sandblasting to roughen the surface and remove oxides, preparing for gold or silver plating.

Surface Treatment
Surface treatments like electroless or electrolytic plating of gold, silver, or other metals are applied to the solder pads, enhancing solderability and preventing oxidation.

Laser Cutting
Laser cutting equipment precisely cuts the finished PCBs from the manufacturing panel, ensuring accurate dimensions and clean edges.

Various testing equipment, including thickness gauges, Automated Optical Inspection (AOI) machines, and ultrasonic scanning microscopes, are used to inspect the PCBs’ performance and appearance, ensuring they meet quality standards.

Packaging and Shipping
Finally, the PCBs are vacuum-packed using packaging machines to protect them during transport. They are then stored and shipped to customers, ensuring they arrive in perfect condition.

18 years of dedicating to PCB manufacturing

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