PCB & PCBA Technical FAQ’s

The minimum producible mechanical drill hole size is 0.1mm for standard PCB designs.

We use industry-leading PCB laminate brands including Shengyi, KB, ITEQ, and GDM, ensuring stable material quality and performance.

Tg (Glass Transition Temperature) is the temperature at which the PCB laminate transitions from a rigid glassy state to a flexible rubbery state. We commonly produce boards with Tg130, Tg150, and Tg≥170, and can support high-Tg boards up to Tg260.

Our standard FR4 PCB boards meet the UL94 V-0 flame retardant rating, the highest standard for commercial PCB materials.

Available solder mask colors: Green, Blue, Black, Red, White, Yellow, Purple.

We support standard PCB design file formats including Gerber RS-274X, ODB++, and native CAD files from Altium Designer, KiCad, and other mainstream EDA software.

Yes, we can manufacture PCBs fully compliant with IPC Class 3 standards for high-reliability aerospace, medical, and industrial applications.

The minimum required annular ring width is 0.15mm for 1oz copper PCBs, increasing by 0.05mm for every additional 1oz of copper thickness, to ensure reliable electrical connectivity and structural stability.

The minimum required solder mask bridge width is 0.1mm for 1oz copper PCBs, increasing by 0.02mm for every additional 1oz of copper thickness, to prevent solder bridging between adjacent pads during assembly.

Minimum silk screen line width: 0.15mm; Minimum silk screen character height: 0.8mm; Minimum silk screen character width: 0.5mm; Minimum spacing between silk screen and copper pad: 0.2mm.

Our manufacturing process supports a maximum via hole aspect ratio of 10:1 (board thickness : via hole diameter), ensuring reliable metallization and electrical connectivity for deep vias in high-layer-count designs.

Minimum spacing between copper trace and board edge: 0.2mm; Minimum spacing between copper pad and board edge: 0.3mm; Minimum spacing between via hole and board edge: 0.3mm.

Laser-cut stencils offer higher precision, smoother aperture walls, and better dimensional stability for fine-pitch components; chemically-etched stencils are more cost-effective for standard designs with larger apertures.

The typical dimensional tolerance for laser-cut stencil apertures is ±0.01mm, and ±0.02mm for chemically-etched stencils.

Yes, high-quality stainless steel stencils can be reused for thousands of production runs, provided they are properly cleaned and maintained to prevent solder paste buildup and aperture damage.

We can manufacture PCB stencils with a maximum size of 1200mm x 600mm, suitable for large-format PCB panel assembly.

Yes, we can manufacture step stencils with varying thicknesses in different areas of the stencil, ideal for mixed-package designs with both fine-pitch ICs and large through-hole components.

We offer flexible MOQ options: for standard passive components, the MOQ can be as low as 10 pieces; for active ICs, the MOQ is typically 1 piece for sample orders and 100 pieces for mass production orders.

Yes, we provide full component quality verification, including incoming inspection, electrical parameter testing, authenticity verification, and functional testing for critical components, ensuring all parts meet your design specifications and quality standards.

Yes, our engineering and sourcing teams can work together to provide cost optimization solutions, including component selection optimization, alternative part recommendations, bulk order pricing negotiation, and design for manufacturability (DFM) adjustments to reduce overall BOM cost.

Yes, we provide comprehensive BOM validation services, including component availability check, lead time verification, price quotation, package compatibility check, and design for assembly (DFA) recommendations to ensure your BOM is complete and manufacturable.

Yes, we have an extensive global supply chain network and can source hard-to-find, obsolete, or allocated electronic components, with full authenticity and quality verification to ensure the parts meet your requirements.

The standard lead time for prototype PCB assembly is 3-5 business days; for low-volume production, the lead time is 5-10 business days; for high-volume mass production, the lead time ranges from 10-20 business days, depending on the order quantity and complexity.

We offer flexible MOQ options: for prototype assembly, the MOQ is 1 piece; for low-volume production, the MOQ starts from 10 pieces; for high-volume mass production, we can accommodate orders from 1000 pieces upwards.

Yes, our engineering team can provide comprehensive DFA recommendations for your PCB design, including component placement optimization, footprint verification, solder paste stencil design recommendations, thermal management optimization, and manufacturability improvements to reduce assembly costs and improve production yield.

Yes, we provide a full range of post-assembly services, including acrylic, silicone, and polyurethane conformal coating, epoxy potting, encapsulation, and waterproofing services, to protect your assembled PCBs from harsh environmental conditions.

Yes, all of our PCB assembly processes are fully RoHS-compliant, and we specialize in lead-free SMT and DIP assembly, using lead-free solder paste and materials that meet EU RoHS, REACH, and other international environmental standards.

For standard SMT/PCB assembly, you need to provide: Bill of Materials (BOM) with complete part numbers, Pick and Place coordinate file for SMT components, Silk screen drawing with component reference designators, and PCB Gerber files for stencil manufacturing.