S1000-2M

April 17th, 2026

S1000‑2M is a high‑Tg FR‑4 PCB material from Shengyi Technology, with Tg ≥170°C (DSC: 180°C; DMA: 185°C). Engineered for lead‑free assembly and high‑layer‑count PCBs, it delivers stable thermal performance, excellent through‑hole reliability, and superior processability. Widely used in automotive, computing, communications, industrial, and HDI applications.

High Tg PCB Material S1000-2M

What Is S1000-2M PCB Material?

S1000-2M is a high glass transition temperature (Tg) epoxy laminate developed by Shengyi Technology. It is widely used in multilayer PCB fabrication where thermal reliability, dimensional stability, and CAF resistance are critical.

Compared with standard FR4 materials, S1000-2M PCB material offers improved thermal endurance and mechanical robustness, making it suitable for demanding applications such as automotive electronics, industrial control systems, and high-density PCB assemblies.

Core positioning:

Tg: ~170°C (DSC)
FR4 class with enhanced performance
Designed for multilayer and HDI boards
Optimized for lead-free assembly processes

Shengyi S1000-2M Features

Lead‑free compatible FR‑4 laminate & prepreg
High Tg 170°C+ (DSC), UV blocking / AOI compatible
Outstanding heat resistance and high thermal stability
Low Z‑axis CTE for improved via reliability
Excellent anti‑CAF performance
Low water absorption & high temperature/humidity resistance
Excellent mechanical machining performance

S1000‑2M Datasheet Values

Parameter	Test Method	Condition	Unit	Typical Value
Tg (DSC)	IPC‑TM‑650 2.4.25	DSC	°C	180
Tg (DMA)	IPC‑TM‑650 2.4.24.4	DMA	°C	185
Td (5% wt loss)	IPC‑TM‑650 2.4.24.6	TGA	°C	355
CTE Z‑axis (before Tg)	IPC‑TM‑650 2.4.41	–	ppm/°C	41
CTE Z‑axis (after Tg)	IPC‑TM‑650 2.4.41	–	ppm/°C	208
T260	IPC‑TM‑650 2.4.24.1	TMA	min	60
T288	IPC‑TM‑650 2.4.24.1	TMA	min	30
T300	IPC‑TM‑650 2.4.24.1	TMA	min	15
Thermal Stress	IPC‑TM‑650 2.4.13.1	288°C, solder dip	s	>100s, no delamination
Dk (1GHz)	IPC‑TM‑650 2.5.5.9	1GHz	–	4.6
Df (1GHz)	IPC‑TM‑650 2.5.5.9	1GHz	–	0.018
Peel Strength (1oz HTE)	IPC‑TM‑650 2.4.8	After 288°C thermal stress	N/mm	1.3
Water Absorption	IPC‑TM‑650 2.6.2.1	–	%	0.08
Flammability	UL94	–	Rating	V‑0
CTI	IEC 60112	–	Level	3
Dielectric Breakdown	IPC‑TM‑650 2.5.6	–	kV	45+
Volume Resistivity	IPC‑TM‑650 2.5.17.1	After moisture resistance	MΩ·cm	8.66E+08
Surface Resistivity	IPC‑TM‑650 2.5.17.1	After moisture resistance	MΩ	2.17E+07
Flexural Strength (LW)	IPC‑TM‑650 2.4.4	125°C	MPa	567
Flexural Strength (CW)	IPC‑TM‑650 2.4.4	125°C	MPa	442
Arc Resistance	IPC‑TM‑650 2.5.1	–	s	133

Remarks:

1. Specification sheet: IPC-4101/126, is for your reference only.

2. All the typical value is based on the 1.6mm specimen, while the Tg is for specimen≥0.50mm.

3. All the typical values listed above are for your reference only and not intended for specification.

4. E=Temperature conditioning in the table

S1000‑2M PCB Material Applications

High‑layer‑count PCBs
Automotive electronics
Computing & servers
Communications equipment
Industrial control
HDI boards
High‑reliability industrial electronics

S1000-2M vs S1000-2: What are Differences?

Property	S1000-2	S1000-2M
Material Type	High Tg FR4 epoxy laminate	Enhanced high Tg FR4 epoxy laminate
Resin System	Standard epoxy	Modified epoxy system
Tg (DSC)	~150°C	~170°C
Tg (TMA)	~160°C	~175–180°C
Td (5% weight loss)	~320–330°C	≥340°C
T260	≥30 min	≥60 min
T288	≥10 min	≥15 min
CTE Z-axis (<Tg)	~55–60 ppm/°C	~45–50 ppm/°C
CTE Z-axis (>Tg)	~280–300 ppm/°C	~240–260 ppm/°C
Thermal Conductivity	~0.30 W/m·K	~0.30–0.35 W/m·K
Dielectric Constant (Dk @1GHz)	~4.5	~4.3–4.5
Dissipation Factor (Df @1GHz)	~0.020	~0.018–0.020
Volume Resistivity	≥1×10⁷ MΩ·cm	≥1×10⁷ MΩ·cm
Surface Resistivity	≥1×10⁶ MΩ	≥1×10⁶ MΩ
Flexural Strength	≥400 MPa	≥450 MPa
Peel Strength (1 oz Cu)	≥0.9 N/mm	≥1.0 N/mm
Water Absorption	≤0.20%	≤0.15%
CAF Resistance	Standard	Enhanced
Flammability Rating	UL94 V-0	UL94 V-0
Lead-Free Compatibility	Good	Excellent
Reflow Cycles (Typical)	2–3 cycles	3–5 cycles
Max Layer Count (Typical)	Up to ~8–10 layers	Up to ~12–16+ layers
HDI Suitability	Moderate	Good
Warpage Control	Standard	Improved
Drillability	Good	Better (lower smear)
Application Level	Consumer / general industrial	Automotive / industrial / high reliability
Relative Cost	Lower	+5% to +10%

Choose S1000-2 if:

Cost is the primary concern
Product lifecycle is short
Operating temperature is moderate
PCB complexity is low (≤6 layers)

Choose S1000-2M if:

High reliability is required
Multilayer PCB (>6–8 layers)
Lead-free soldering is used
Product operates in harsh environments
Long lifecycle (>5 years) is expected

FAQs About S1000-2M PCB Material

1. What is S1000-2M Tg value?

S1000-2M has a Tg of approximately 170°C, which supports high-temperature PCB applications and lead-free soldering processes.

2. Is S1000-2M suitable for automotive PCBs?

Yes, it is widely used in automotive electronics due to its thermal stability, CAF resistance, and long-term reliability.

3. Is S1000-2M better than standard FR4?

Yes, it offers higher Tg, better thermal resistance, and improved reliability compared to standard FR4 materials.

4. Can S1000-2M be used for high-frequency designs?

It can be used for general digital circuits, but for RF applications, specialized low-loss materials are recommended.

Get S1000-2M Datasheet & PCB Manufacturing Support

If your project requires high-reliability multilayer PCB material, S1000-2M is a proven and cost-effective choice.

At EBest Circuit, we provide:

Material selection support
Stack-up design optimization
Fast PCB & PCBA manufacturing

📩 Email: sales@bestpcbs.com

📞 Tel: +86-755-2909-1601

Shengyi S1141 FR4 PCB Laminate | PCB Manufacturer

April 16th, 2026

Shengyi S1141 PCB material is widely used in cost-sensitive electronics manufacturing due to its stable performance and reliable processing characteristics. As a standard FR-4 laminate, it offers balanced thermal, electrical, and mechanical properties, making it suitable for a wide range of PCB applications.

What Is Shengyi S1141 PCB Material?

Shengyi S1141 is a mid-Tg FR-4 epoxy glass laminate, designed for general-purpose PCB fabrication. It belongs to the Shengyi standard FR4 material series and is commonly used in multilayer PCB production.

Key characteristics include:

Tg around 140°C
Good mechanical stability
Compatible with standard SMT processes
Cost-effective compared to high-Tg materials

Unlike high-end laminates, S1141 focuses on manufacturing efficiency and affordability, which is why it remains popular in high-volume production.

Shengyi S1141 FR4 Datasheet

Below is a detailed datasheet-style specification table for Shengyi S1141 material. These values are typical and may vary slightly depending on resin content and laminate thickness.

Electrical Properties

Parameter	Typical Value	Test Condition
Dielectric Constant (Dk)	4.3 ± 0.1	@1MHz
Dielectric Constant (Dk)	4.1 – 4.2	@1GHz
Dissipation Factor (Df)	0.018	@1MHz
Dissipation Factor (Df)	0.015 – 0.017	@1GHz
Volume Resistivity	≥ 1×10⁶ MΩ·cm	C-96/35/90
Surface Resistivity	≥ 1×10⁵ MΩ	C-96/35/90
Dielectric Breakdown Voltage	≥ 40 kV	ASTM D149

Thermal Properties

Parameter	Typical Value	Test Method
Glass Transition Temperature (Tg)	~170°C	DSC
Thermal Decomposition (Td)	>300°C	TGA (5%)
T260	≥ 60 min	IPC-TM-650
T288	≥ 20 min	IPC-TM-650
Z-axis CTE (Below Tg)	~50 ppm/°C	TMA
Z-axis CTE (Above Tg)	~260 ppm/°C	TMA

Mechanical Properties

Parameter	Typical Value	Test Method
Flexural Strength	≥ 450 MPa	IPC-TM-650
Peel Strength (1 oz Cu)	≥ 1.0 N/mm	IPC-TM-650
Density	~1.85 g/cm³	ASTM D792

Physical & Reliability Properties

Parameter	Typical Value	Condition
Moisture Absorption	≤ 0.15%	D-24/23
Flammability Rating	UL94 V-0	UL Standard
CAF Resistance	High	IPC standard
Thermal Conductivity	~0.3 W/m·K	Typical

When designing impedance-controlled PCBs using S1141, it is recommended to:

Use field solver tools for stack-up calculation
Consider frequency-dependent Dk/Df variation
Validate with impedance coupons during fabrication

Why Choose Shengyi S1141 Over Standard FR-4?

Compared with conventional FR-4 materials, S1141 provides noticeable improvements in electrical stability and signal transmission quality.

Feature	Standard FR-4	Shengyi S1141
Signal Loss	Higher	Lower
Impedance Stability	Moderate	More stable
High-Speed Support	Limited	Suitable for GHz-level
Thermal Reliability	Standard	Enhanced
Cost	Low	Moderate

When signal frequency exceeds ~1GHz or edge rates become fast, standard FR-4 begins to show higher insertion loss. S1141 mitigates this issue without moving to expensive RF materials.

What Applications Use Shengyi S1141 PCB Material?

Shengyi S1141 is widely adopted in applications where signal integrity, reliability, and cost balance are required.

Typical Applications

Networking equipment (routers, switches)
Industrial control systems
Automotive electronics (ADAS, control modules)
Power supply and inverter boards
Communication infrastructure
Consumer electronics with high-speed interfaces

How Does Shengyi S1141 Compare to Rogers Materials?

S1141 is often considered a cost-effective alternative to high-frequency laminates like Rogers.

Parameter	S1141	Rogers (e.g., RO4350B)
Cost	Medium	High
Df	Moderate	Very Low
RF Performance	Good	Excellent
Processing	FR-4 compatible	Special handling
Application	Digital + mid RF	High-frequency RF

Conclusion:

Choose S1141 for high-speed digital and cost-sensitive designs
Choose Rogers for pure RF and microwave applications

Get a Quote for Shengyi S1141 PCB Today

If your project requires stable signal performance, controlled impedance, and cost efficiency, Shengyi S1141 is a strong candidate.

At EBest Circuit (Best Technology), we provide:

Free DFM analysis
Material selection guidance
Fast prototyping and mass production

📩 Contact us:

sales@bestpcbs.com
sales@bestpcb.vn

FAQs

1. What is the dielectric constant of Shengyi S1141?

The dielectric constant typically ranges from 4.1 to 4.3 at 1GHz, offering stable impedance control for high-speed designs.

2. Is S1141 better than standard FR-4?

Yes, it provides lower loss and better signal integrity, making it more suitable for high-speed applications.

3. Can S1141 replace Rogers materials?

Partially. It can replace Rogers in mid-frequency applications, but not in high-frequency RF designs above several GHz.

4. Is Shengyi S1141 suitable for automotive electronics?

Yes, due to its thermal stability and reliability, it is widely used in automotive control systems.

5. What layer count is suitable for S1141?

It is commonly used in 4-layer to 16-layer PCBs, and can support higher layer counts depending on design.

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