After we have talked aboutĂÂ PCB inspection in last article, so today we move to the solder paste printing inspection. If you would like to learn something about PCB inspection, please click The Application of AOI inĂÂ PCB Inspection.
Solder paste printing, the very beginning of SMT, is the root of most defects on the PCB. The defects occur in printing process is up to 60%-70%. Thus, if the defects can be avoided in this link, then the damage is able to save cost minimized. Therefore, most of printed circuit board manufacturers have already equipped with AOI testing in SMT production lines.
There are various of printing defects, but they can be generally divided into insufficient or excessive solder paste, the solder paste inĂÂ the middle part of large pads scraped etc.. The reason why these defects are formed including unreasonable setting of printing machine parameter, low accuracy, improper selection for scraper and so on. However, it is effective to monitor the solder paste printing by AOI technology and analyze the number as well as types of defects, so that enhance the capability of printing.
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