On July 3rd, 2024, we had India customers visit our office and factory. All our staff of our customer warmly welcome the guest from afar.
Our sales manager Peter, along with Connie and Marina, gave a detailed introduction to our main business and product expertise. They talked about our strict quality control, careful selection of PCB board materials, advanced production equipment, and mature manufacturing processes. Our guests seemed quite impressed with how thorough we are in ensuring top-notch quality.
Actually, we’ve been working with this customer for several years now, and it’s been a fantastic journey of building trust and collaboration. This visit was a great chance to dive into a new PCB project and show off our latest innovations, including electric heating films, ceramic PCBs, and bendable aluminum PCBs.
When checking the sample books, the customers specially mentioned the blind vias and checked the related products for many times. It looks like they are extremely interested in this technology. You know, blind vias, buried vias, through hole vias, micro vias and thermal vias are always our strengthens.
Next day, Connie will be taking our guests on a tour of our metal dome and dome array factory. It’s always exciting to show our partners the heart of our operations and let them see firsthand the dedication and precision that goes into our work.
Best Technology is a one-stop PCB and PCBA service provider in China and Vietnam. “High mix, Low-Middle Volume, High Quality and Fast Delivery” is our advantages. Custom PCBs available in our company as well. You can get high-quality PCB board and PCBA at a very transparent price. For more information, feel free to contact us at any time.
In today’s tech-driven world, creating efficient high speed PCB (Printed Circuit Board) is critical for ensuring devices can handle rapid data transfer without issues. These high speed PCBs are popular in the wireless devices which needs high signal transfer. Crafting high-speed circuits requires careful planning and precise execution to maintain signal quality and overall performance. In this blog, we introduced the basics of high-speed PCB design, offering practical tips and insights into the best materials and techniques for high-frequency applications.
What is a High Speed Circuit PCB?
High-speed PCB is a circuit board that can support signal transmission. High-speed signals usually refer to signals with frequencies higher than 50MHz, such as high-speed digital signals, high-speed analog signals, etc. These fast transitions can introduce challenges like signal reflections, electromagnetic interference (EMI), and crosstalk, which can disrupt performance if not properly managed.
Additionally, these signals will be affected by board materials, layout, wiring and other factors during transmission. Therefore, a specially designed circuit board is required to ensure the integrity and reliability of the signal. Here is a 4 layers high speed PCB for Iradar device with 50ohm single-ended impedance control.
Features of High-Speed PCB
High frequency
Low permittivity and low loss factor
Multilayer design
Strict impedance control
High-precision manufacturing
Low noise characteristic
High density circuit layout (micro-vias)
High performance
What is Considered High-Speed PCB Design?
High-speed PCB design focuses on managing the complexities that come with high-frequency signals and fast switching. Key considerations include:
– Signal Integrity: Ensuring signals travel without distortion or loss.
– Power Management: Distributing power effectively to minimize noise and voltage drops.
– Heat Handling: Managing heat from high-speed components to prevent overheating.
– Impedance Matching: Keeping impedance consistent to reduce signal reflections and loss.
– Differential Pair Routing: Reducing EMI and crosstalk by routing complementary signal pairs together.
This type of high speed pcb design requires a solid understanding of electromagnetic principles, advanced simulation tools, and precise manufacturing techniques. For those new to high-speed PCB design, Best Technology offers expert guidance and solutions.
What’s the Best Material for High-Speed PCB Design?
Choosing the right material for high speed pcb is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:
– FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.
– Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.
– Teflon: Excellent for high-frequency applications but more expensive and harder to process.
Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.
Where is the High-Speed PCB Commonly Used in?
High-speed circuit boards are widely used in signal transmission applications, the typical fields are including:
1. Communication equipment – such as 5G base stations, optical fiber communication equipment, etc.
2. Data center – like high-performance computing, storage servers, etc.
3. Consumer electronics in our daily life – high-end smartphones, tablets, gaming devices, etc.
4. Aerospace and military – high speed are always used in high-end devices. For example, radar, navigation systems and other equipment with high reliability requirements.
What is the 3H Rule in High Speed PCB Design?
The 3H rule is a guideline suggesting that signal traces should be spaced at least three times the height of the dielectric (3H) between the signal layer and the adjacent ground or reference layer. This helps minimize crosstalk and maintain signal integrity, particularly for high-speed digital signals with rise times of 1 ns or less. Key aspects include:
– Trace Spacing: Keeping traces apart by at least 3H reduces electromagnetic coupling and interference.
– Signal Integrity: Adequate spacing helps maintain clear signals in high-speed circuits.
– Effectiveness: This rule is especially beneficial for fast digital signals, reducing the risk of crosstalk and interference.
For instance, if the dielectric height between the signal layer and the reference layer is 0.2 mm, traces should be at least 0.6 mm apart to follow the 3H rule.
How to Design a High-Speed Board?
Designing a high-speed PCB involves several strategies to ensure effective signal transmission, power distribution, and minimal EMI. Here’s a step-by-step approach:
Component Placement and Layer Stack-Up
Place high-speed components to minimize signal paths and interference. Group related components to simplify routing. In addition, create a layer stack-up that supports controlled impedance and reduces signal loss. Use ground planes between layers for a return path for high-frequency currents.
Trace Routing and Impedance Control
Keep high-speed traces short and direct, avoiding right-angle bends. Use microstrip or stripline configurations for controlled impedance and minimal noise. For impedance control, calculate and ensure consistent impedance for traces. Use differential pair routing for high-speed signals to reduce EMI and crosstalk.
Power Distribution and EMI Mitigation
Use decoupling capacitors near high-speed components to filter noise and stabilize the power supply. Design a robust power distribution network to minimize impedance and ensure stable voltage. And employ proper grounding and shielding techniques. Route high-speed signals on inner layers between ground planes to reduce EMI and provide a consistent return path.
Simulation and Testing
Use signal integrity analysis tools like SI or PI to simulate the PCB layout, predicting signal behavior and identifying potential issues. Analyze aspects like eye diagrams to assess signal quality.
High-speed PCB design is a complex but rewarding endeavor that ensures your electronics perform efficiently in high-frequency environments. By understanding the fundamentals and applying the right techniques and materials, you can create robust, high-speed boards. Best Technology is here to assist you with expert advice and solutions for your high-speed PCB needs.
Best Technology has been a leader in PCB manufacturing and design for over 17 years. Our R&D team allows us to offer customers quick and valuable PCB design solutions. Here, we share one of our industrial motherboard design for PICE card for your reference.
PICE card
[1]: Main chip: XCKU11P
[2]: 30A maximum current
[3]: Single pair differential line, 10G optical network
[4]: 14 layers PCB
If you need a custom industrial PCB design, please feel free to contact us.
A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:
Video decoder
[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI
[2]: Single pair differential line, 10G optical network, memory of DDR4
[3]: 12 layers PCB
Why choose us?
We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:
When designing high-speed PCBs, several critical factors must be considered to ensure optimal performance. These include signal integrity, impedance control, and minimizing electromagnetic interference (EMI). Below is an ultra high speed camera PCB solution made by Best Technology:
An ultra-high-speed camera rigid-flex circuit board
[1]: XCKU060 chip
[2]: 20A maximum current
[3]: Four DDR4 channels
[4]: 20 layers PCB
Camera PCB design considerations:
1. When the Camera adopts a connector: when the MIPI differential signal passes through the connector, the adjacent differential signal pairs must be isolated using GND pins; If it is not convenient to punch holes, the spacing between the difference pairs is at least 15mil.
2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.
3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.
4. The Camera layout needs to be far away from high-power radiation devices, such as GSM antennas.
5. CIF/MIPI and other signals, if there is a board to board connection through the connector, it is recommended that all signals be connected with a certain resistance value (between 2.2ohm and 10ohm, depending on the SI test), and reserve TVS devices.
Best Technology offers one-stop solutions for our values customers. And we provide free technical support for our customers. If you have similiar requirements, welcome to contact us at any time!
PCB design is one of an important process before the PCB manufacturing, it determines the overall performance of the whole product. We are an experienced PCB design and manufacturing vendor, with our professional technical team and advanced evaluated tools, we can make sure the PCB design one-time success. Today, we shared a example of fiber optical SFP modules design:
32X100G(QSFP28) large capacity convergence shunt
[1]: Marvell: 98CX8522
[2]: Single pair differential line, 25G optical network
[3]: 16 layers PCB
How to design a SFP optical module PCB?
SFP optical module interface PCB design depends on many aspects, including interface signal processing, timing control, power management and so on.
1. Determine the interface standard: SFP optical module interface standards, such as SFP, SFP+, QSFP and so on, you need to choose the appropriate interface standard according to the specific needs.
2. Choose the chip solution: According to the interface standard, choose the appropriate chip solution, usually including constant voltage source, amplifier, comparator, clock generator, EEPROM, etc.
3. Signal processing: For receiving and sending signals, filtering, amplification and comparison are required to ensure signal quality and stability.
4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.
5. Power management: SFP optical module interface requires multiple power supplies, including Vcc, VCC-TX, VCC-RX, etc. Reasonable power management is required to ensure the stability and reliability of the power supply.
6. PCB design: According to the above requirements, PCB design is carried out, considering signal isolation, layering layout, status separation, signal integrity and other factors.
Feel freely to send message us if you are interested in PCB design.
A motherboard network adapter PCB comprises several key components, each playing a vital role in ensuring effective network connectivity. And between them, the PCB is the most important. Now, best technology is sharing an example about motherboard network PCB design.
10G/100G large capacity convergence shunt
[1]: Marvell: 98DX8548
[2]: 21A maximum current
[3]: Single pair differential line, 10G and 25G optical networks
[4]: 10 layers PCB
What are the considerations before PCB design?
PCB design involves several steps and some considerations need to be noticed. If you are a designer, think about these points before starting the design.
Manufacturing: prototyping study or mass production.
What it will be used in?
What kind of production technology it will used?
Material?
How many layers you want?
Whether need to do impedance control?
Best Technology has more than 17 years in this industry, we have served for over 1200 customer all around the world. Our goal is to provide customer with best solutions and top notch quality products, and it is luckily that we did a good job. If you want to work with us or need a PCB manufacturer in Asia, contact us right now!
A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. Best Technology is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.
32 x 400GE industrial switch
[1]: Marvell-400G chip
[2]: 200A maximum current
[3]: Single pair differential line 56G optical network
[4]: 24 layers high power PCB
What’s the Best Material for High-Speed PCB Design?
Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:
FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.
Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.
Teflon: Excellent for high-frequency applications but more expensive and harder to process.
Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.
For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.
Best technology offers numerous PCB design solutions for our customer, from HDI design, high speed device PCB design, AI optical module design and network motherboard design for network switching. Below is one of our network motherboard design solutions:
An ATCA network switching motherboard
[1]：BCM88XXX, BCM55XXX chips
[2]：60A maximum current
[3]：8口10Ｇ optical network
[4]: 8 x DDR3 chips
Network Switching Differential Pair Design Guide
Each TrxP/TrxN signal group (where xcx0-3) shall be routed as a differential pair. This includes the entire length of wiring processing.
The individual differential correspondences are packed together as tightly as possible. Impedance calculations are usually started by selecting the smallest line blank (4-5mil). The tracking width is then adjusted to achieve the necessary impedance.
Differential line group resistance of Ethernet is calculated at 100 ohms.
In general, when routing the four differential pairs of the Gigabit Ethernet to the r45 connector, at least one pair will pass through to the opposite outer layer.
Priority should be given to differential pair wiring. Terminals should be added after the routing is determined
The values of all resistance terminals in the Ethernet front end should be 1.0% tolerance
All capacitor termination Ethernet front ends in the module should have strict tolerances and high quality product media (npo)
You are welcome to contact us if you want to get your DIY network switching PCB designs.
Best technology engaging in the PCB manufacturing and PCB design for more than 17 years. With a strong R&D team, we can provide customers with fast and valued PCB design solutions. Here is one of our industrial motherboard design & industrial PCB case sharing for your reference. If you want to get your own industrial PCB design, welcome to contact us.
A mITX architecture industrial control motherboard
[5]：2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +
2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)
Industrial PCB Design Considerations
Control the length of the circuit: Minimize the length of the circuit, especially the key signal lines, to reduce signal attenuation and delay.
Avoid sharp angles and right angles: Right angles and sharp angles should be avoided when wiring, and rounded or 45 degree angles should be used as far as possible to reduce signal reflection and impedance discontinuity.
Line width: Determine the line width according to the current size and thermal requirements to ensure the reliability and stability of the circuit.
Inter-layer wiring: Rational use of multi-layer PCB inter-layer wiring, such as the signal line on the inner layer, power and ground wire on the outer layer.
Impedance control: For high-speed signals, it is necessary to control the line impedance to ensure signal integrity, and carry out impedance matching design if necessary.
Avoid cross and parallel wiring: Try to avoid cross and parallel wiring of signal lines to reduce crosstalk and electromagnetic interference.
Contact us if you have any questions and inquiry about industrial PCB design projects.
