Archive for the ‘FAQ’ Category

What Is The Difference Between Thin Film and Thick Film Ceramic PCBs?

Monday, September 25th, 2023

We know due to the rapid development of electronic devices, Ceramic circuit boards have gradually developed into an ideal packaging substrate for a new generation of integrated circuits and power electronic modules. Among them, thick film ceramic substrate and thin film ceramic PCB are the most popular ceramics that be used in package, because they are made by metallization process.

Why use film technology?

Compared with three-dimensional ceramic materials, film has relatively thin thickness and small size, it can be regarded as a two-dimensional structure. Thick film is made by printing process, the thick film can be made independently and the thickness is usually 10~25Îźm. Thin film is formed by the composition of the conductor materials and it was sputtering on the ceramic substrate directly. Normally the thickness of thin film is equal or less than 1Îźm. If the metallization thickness between 1Îźm to 10Îźm, then we called it as Directly Plated Copper (DPC) ceramic circuit board.

(ceramic_pcb_with_green_glass_glaze)

Thick Film Technology

Thick film technology is a method of direct deposition of slurry on substrate through screen printing technology, and sintering at high temperature to form conductive traces and electrodes. After the material is sinter at high temperature, it will form a strong adhesion film on the ceramic circuit board, and after repeated many times, it will form a multi-layer interconnected ceramic circuit board with resistor or capacitor. The thick film manufacturing process is more easier than thin film.

(Simply_process_for_thick_film_ceramic)

Thin Film Technology

Thin film ceramic PCB is a chip manufacture technology, which is the main method of metal film deposition in microelectronics fabrication. It was made through evaporation and PVD process firstly to deposited a 200-500nm copper layer as the seed layer. Then using electroplating process to increase the copper foil to required thickness. Finally through stripping and etching to generate the circuits. Thin film ceramic circuit is widely used in LED package fields because its fine traces, high accuracy and heat dissipation.

(Manufacturing_process_of_thin_film_ceramic)

Thin film and Thick film ceramic PCB comparison

In addition to the technology manufacturing difference, their performance and limitations also is different. Here we summarized in below table:

TechnologyThick FilmThin Film
Conductor thick10-25um<=1um
Manufacture processScreen printing, sinterPVD, DES
TCR(50-300) *10-6/C(0-50) *10-6/C
CostRelatively LowHigh for prototype
Line widthThicker line widthFine traces, suitable for RF
Bonding abilityNot suitable for bondingGood for wire bonding
ResistanceAvailableNeed mount resistors
Solder maskAvailableAvailable

Application difference between Thin film and Thick film ceramic PCB

The applications of thin film and thick film also are different because of their different features. Thick film ceramics are widely used in high power devices such as automotive field, power electronics, aerospace due to its ability to handle high current and voltage. Thick film enables to provide excellent thermal management and can dissipation heat effectively. Thin film ceramic PCBs trend to micro-electronics and RF devices because of its fine lines, low resistance, and high-frequency performance.

Each technology has its unique advantages and limitations, it needs to be properly used to make it suitable for different electronic devices and industries. Choose the right ceramic PCB substrate for laymen is a big challenge, so seeking for a reliable supplier is important. Best Technology engaging ceramic circuit board manufacturing for over 10 years. And our core engineering team are deep in this industry for more than 20 years, we are so confident that we can provide the best solution for you. If you are interested in this, welcome to contact us at sales@bestpcbs.com.

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Why do ceramic substrates contribute to the breakthrough of 905nm lidar technology?

Friday, September 1st, 2023

LiDAR (Light Detection And Ranging, referred to as “LiDAR”) measurement is a system that integrates three technologies: laser, GPS (Global Positioning System), and IMU (Inertial Measurement Unit, inertial measurement unit), used to obtain data and Generate accurate DEMs (Digital Elevation Models). The combination of these three technologies can highly accurately locate the spot of the laser beam on the object, and the ranging accuracy can reach the centimeter level. The biggest advantage of lidar is accurate, fast, and efficient operation.

Lidar is currently widely used in the field of driverless cars and robots. It is known as the “eye” of a generalized robot. It is an active measurement device that measures the precise distance between an object and a sensor by emitting laser light.

  As an indispensable sensor for L3 and above automatic driving, lidar has significantly improved the reliability of the automatic driving system with its excellent ranging capability, high angular resolution and sensitivity to ambient light, and has become the key to improving reliability. A key element of autonomous driving systems, but its application is constrained by cost and technical challenges.

  In the past, lidar was difficult to apply to mass-produced vehicles due to its high cost. However, recently, with the continuous evolution of technology and market competition, the cost of lidar has gradually decreased, thereby accelerating its application in the field of autonomous driving.

In this evolution process, the emergence of ceramic substrates has played a vital role in the breakthrough of lidar technology – 905nm wavelength lidar has become mainstream. Traditional materials such as FR-4 and FE-3 are difficult to meet the high heat dissipation requirements of lidar, while ceramic substrates rely on their excellent thermal conductivity. For example, the thermal conductivity of aluminum nitride ceramic substrates is as high as 200W/M.K. It effectively solves the heat dissipation problem and provides a guarantee for the stability and life of the lidar.

In lidar, the transmitter is one of the links with the highest value and the highest barriers. On the transmitter side, with the rise of China’s domestic industrial chain and the adjustment of the overall technical route of the industry, among them, 905nm VCSEL laser chips and other products have achieved breakthroughs in the market and become a hot topic in the industry.

The “heart” of the transmitter is the light source. Laser transmitter is the core component of laser technology, and its composition includes laser working medium, excitation source and resonant cavity. In this system, why choose a ceramic substrate as a component? The main reason lies in its unique advantages in heat dissipation. Especially for VCSEL (Vertical Cavity Surface Emitting Laser) chips, due to their low power conversion efficiency, the problem of heat dissipation is particularly prominent. The application of ceramic substrates has become the best choice to solve the problem of thermoelectric separation.

The ceramic substrate has excellent heat dissipation performance and can effectively conduct the heat generated inside the laser transmitter. The high thermal conductivity of the ceramic substrate allows it to efficiently conduct heat generated inside the lidar, preventing performance degradation due to overheating. In addition, ceramic materials have the advantages of high strength, hardness, thermal shock resistance, insulation, and chemical stability, which can further extend the service life of products, improve sensitivity, and enhance the response speed of lidar.

Ceramic substrates also enable high-density assembly, supporting miniaturization and integration of devices. Its stability ensures that the sensor signal is not distorted, and the matching with the thermal expansion coefficient of the chip ensures the reliability of the product in harsh environments such as high temperature, high vibration, and corrosion. In addition, the metal crystallization performance of the ceramic substrate is excellent, which ensures the stability of the circuit and further improves the quality control level of the lidar.

As a leading manufacturer of ceramic substrates, Best Technology provides a variety of ceramic substrates of different materials, including 96% alumina, 99% alumina, aluminum nitride, zirconia, silicon nitride, sapphire ceramic bases, etc. The heat dissipation properties of these different materials are different, such as aluminum nitride (AlN): thermal conductivity of 170-230 W/mK, silicon nitride (Si3N4): thermal conductivity of 20-80 W/mK, sapphire (Al2O3): thermal conductivity Coefficient 25-40W/mK.

Therefore, choosing a high-quality ceramic substrate not only helps to solve the problem of thermal and electrical separation of laser emitters, but also provides stable heat dissipation and electrical performance, providing reliable support for efficient operation and performance improvement of laser emitters. In the development of lidar technology, ceramic substrates play an increasingly important role, providing key support for performance breakthroughs and innovations in laser transmitters. We are witnessing a revolution in the auto industry brought about by China’s autonomous driving assistance systems.

If you are designing a ceramic PCB and seeking a reliable manufacturer, welcome to leave you message or contact us directly.

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What You Know About Counterbores in PCB Design and Manufacturing

Friday, August 18th, 2023

In the world of design and manufacturing, precision is paramount. Every detail, down to the placement of a single component, can impact the performance and appearance of a product. This is where the concept of counterbores comes into play, a technique employed in various industries to create recessed areas for components or fasteners.

But firstly, what is counterbore?  Today we will show you the definition and applications of the countersink in a PCB design. 

Definition and Applications:

A counterbore is a cylindrical, flat-bottomed hole that is strategically cut into a material to accommodate specific components or fasteners. It is commonly used in various industries, including woodworking, metalworking, and mechanical engineering. The purpose of a counterbore is to create a recessed area where a component, such as a bolt head, nut, or other hardware, can sit flush with or below the surface of the material. This technique ensures a smooth appearance, prevents interference with other components, and provides mechanical stability.

Counterbores in PCB Design and Manufacturing

In the realm of printed circuit boards (PCBs), counterbores play a crucial role in achieving efficient and functional designs. PCBs are essential components in electronic devices, and their design requires careful consideration of component placement, connectivity, and mechanical stability. Counterbores in PCBs serve several important functions:

  1. Component Alignment and Clearance:  Certain components on a PCB, such as connectors, switches, or specialized modules, require precise alignment and clearance for optimal functionality. A counterbore can be introduced to create a recessed area that accommodates these components, ensuring proper alignment with neighboring components and minimizing the risk of interference.
  • Flush Mounting: To maintain a sleek and compact design, some components need to be mounted flush with the surface of the PCB. A counterbore creates a flat-bottomed recess that allows the component to sit at the same level as the PCB surface, contributing to an aesthetically pleasing and functional layout.
(Counterbore_hole_in_heavy_copper_PCB)
  • Mechanical Support: Components that are susceptible to mechanical stress or impact may benefit from additional support. By incorporating a counterbore, the PCB design can provide a more secure location for these components, reducing the risk of damage.
  • Heat Dissipation Enhancement: In applications where certain components generate significant heat, such as power amplifiers or processors, heat sinks are often employed to dissipate the heat. A counterbore can facilitate proper alignment and contact between the heat sink and the component, optimizing heat transfer and overall thermal performance.
(Detail_counterbore_hole)

The production of counterbores in PCBs involves specialized manufacturing techniques. BEST Technology as a professional PCB manufacturer, we will use precision drilling and routing equipment to create accurately sized and positioned counterbores.

If you want to know more about the counterbores, welcome to follow our post or contact us.

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Heavy Copper PCB for Industrial Power Supply

Saturday, July 29th, 2023

All of us know the printed circuit board, but do you know what is the heavy copper PCB? Best Tech is a very experienced heavy copper PCB fabricator since year 2006. Heavy Copper PCB is a type of printed circuit board that features with thicker copper layers than standard FR4 PCBs. While conventional PCBs typically have copper thicknesses ranging from 1 to 3 ounces (per square foot), heavy copper PCBs have copper thicknesses exceeding 3 ounces and can go up to 20 or more ounces. These copper layers are typically found in the inner and outer layers of the PCB, heavy copper providing enhanced current-carrying capacity and improved heat dissipation capabilities.

The increased copper thickness in heavy copper PCBs allows them to handle higher currents without experiencing excessive heat buildup or voltage drops. This makes them well-suited for applications that require high power handling, such as industrial power supplies, power converters, motor drives, and automotive electronics. Heavy copper PCBs are designed to withstand harsh operating conditions and provide robust performance and reliability.

Today, we would like to talk about the heavy copper PCB used in Industrial Power Supply. In this blog post, we will explore the realm of Industrial Power Supply, delving into the design considerations, material selection, production challenges, exceptional heat dissipation, and unrivaled conductivity of Heavy Copper PCBs. Join us on this enthralling journey as we uncover the secrets behind their application in Industrial Power Supply scenarios, including the testing of inductance, capacitance, and resistance. Get ready to witness the power of Heavy Copper PCBs in the realm of Industrial Power Supply!

Firstly, before you are moving start for the design, it need to get to understand the Design guideline rules of heavy copper PCB.

From the guidelines of heavy copper PCB, it could get to know it encompass considerations such as trace width, trace spacing, and thermal relief patterns. The increased copper thickness necessitates wider traces to accommodate higher currents, while proper spacing is crucial to avoid thermal hotspots and ensure reliable operation. Additionally, selecting suitable materials with excellent mechanical strength and thermal properties is vital to ensure the robustness and longevity of Heavy Copper PCBs. Hope this will bring some ideas to you during your design.

Secondly, as a heavy cooper PCB manufacturing vendor, Best Tech would like to advise the Production Challenges for the heavy copper PCB.

During producing Heavy Copper PCBs presents manufacturers with a set of intricate challenges. Achieving uniform copper thickness across the board’s surface demands advanced plating techniques and precise control over process parameters. Careful attention must be given to the etching process to prevent over-etching, which can compromise the integrity of the copper layers. Moreover, the additional weight of copper requires a sturdy substrate to support the board’s structure. Manufacturers must navigate these challenges with expertise and precision to deliver high-quality Heavy Copper PCBs.

You may have a question in mind, why we need to use the heavy copper PCB for the Industrial Power Supply, because the heavy copper PCB have Exceptional Heat Dissipation and Conductivity: One of the standout features of Heavy Copper PCBs is their unrivaled heat dissipation capabilities. The increased copper thickness acts as a robust conductor, efficiently channeling heat away from power components. This exceptional heat dissipation prevents thermal stress and ensures the longevity and reliability of Industrial Power Supply systems. Additionally, the high conductivity of Heavy Copper PCBs enables efficient power transmission, reducing losses and improving overall system efficiency.

Furthermore, Heavy Copper PCBs undergo rigorous testing to ensure optimal performance in Industrial Power Supply applications. Inductance testing verifies the effectiveness of copper layers in reducing magnetic interference. Capacitance testing evaluates the ability of the PCB to store electrical energy, while resistance testing determines the conductivity and resistance of copper traces. These tests play a crucial role in validating the quality and performance of Heavy Copper PCBs in demanding power supply scenarios.

Heavy Copper PCBs find widespread applications in the field of Industrial Power Supply, particularly in the production of robust and efficient power control products. They are integral components in industrial power converters, motor drives, uninterruptible power supplies (UPS), and various automation systems. The exceptional heat dissipation and high current-carrying capacity of Heavy Copper PCBs make them ideal for handling the power demands of these applications, ensuring reliable and efficient power delivery.

Finally, in the world of Industrial Power Supply, Heavy Copper PCBs emerge as true powerhouses, combining meticulous design, advanced manufacturing processes, and exceptional heat dissipation capabilities. By adhering to design guidelines, overcoming production challenges, and conducting thorough testing, Heavy Copper PCBs prove their mettle in demanding power supply scenarios. As they continue to evolve, these powerhouses will shape the future of Industrial Power Supply, empowering systems with reliability, efficiency, and unrivaled performance. Prepare to witness the electrifying impact of Heavy Copper PCBs in the realm of Industrial Power Supply!

If you have more question heavy copper PCB for Industrial Power Supply, warmly welcomed to contact Best Tech for more get more information of heavy copper PCB which used in Industrial Power Supply. You can visit www.bestpcbs.com to know more about us.

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Can I Design Via Holes in Thick Film Ceramic Boards?

Tuesday, April 18th, 2023

May some engineers or designers who be interested in thick film ceramic circuit are curious about can thick film ceramic boards design with via holes like FR4 PCB? Herein, we will explore the feasibility of using thick film ceramic boards for via holes, including the materials and processes involved, as well as the advantages of this approach.

What is thick film ceramic board?

The “Thick Film” refers to the thickness of conductor layer on a Ceramic PCB. Normally the thickness will be at least 10um, around 10~13um, which is thicker than spurting technology in Thin Film Ceramic PCB. And of course thickness is less than DCB Ceramic board or FR4 board.

Thick film ceramic circuit enables to put resistor, electric capacitor, conductor, semi-conductor, and interchangeable conductor on ceramic board, after manufacturing steps of printing and high temperature sintering. The more important thing is by using thick film technology, we can make all the resistors with the same value, or different value for different resistor on the same board.

Materials and processes for via holes

In general, thick film ceramic circuit is not suitable for designing via holes. Because the characteristics of thick film ceramic board mainly depends on the insulation properties of its ceramic substrate, rather than conductive properties. The conductivity of thick film ceramic plate is not good than Metal Core PCB, or even we can say it has a very poor conductivity, usually can’t meet the requirements of the via hole.

But, designing via holes in thick film ceramics is available in Best Technology. Generally speaking, the fabrication of via holes in thick film ceramic boards typically involves several key materials and processes.

From the designer’s perspective, a conductive material is used to create a continuous conductive path from one side of the ceramic board to the other. Common conductive materials include gold paste, silver paste, and copper paste. These materials are usually screen printed onto the ceramic board in the desired pattern, and then fired at high temperatures to achieve sintering and form a conductive layer.

Once the conductive layer is formed, the via holes are created by drilling or punching small holes through the ceramic board at the desired locations. These holes are then filled with a conductive material, such as silver paste or copper paste, to establish electrical connections between the different layers of the circuit.

Finally, the via holes are fired again at high temperatures to achieve sintering and ensure good adhesion and electrical performance.

Advantages of Via Holes in Thick Film Ceramic Boards

These via holes offer several advantages in the design and fabrication of thick film ceramic boards, including as following:

  • Electrical connectivity

Via holes provide electrical connectivity between different layers of a thick film ceramic board. They allow for the interconnection of different circuitry or conductive layers, enabling the flow of electrical signals or power between different parts of the board. This allows for complex and multi-layered circuit designs, which can be highly beneficial in applications that require intricate circuitry or high-density interconnects.

  • Space-saving

Via holes can provide a means of vertical interconnection, allowing for more efficient use of board real estate. Instead of routing traces or conductors on the surface of the board, which can take up valuable space, via holes can be used to route connections through the board, freeing up surface area for other components or functions. This is especially advantageous in compact or miniaturized electronic devices where space is limited.

  • Thermal management

Via holes can aid in thermal management in thick film ceramics. They can be used to transfer heat from one layer of the board to another, helping to dissipate heat generated by components or circuits. This can be particularly important in high-power or high-heat applications, where efficient thermal management is crucial for preventing overheating and ensuring reliable performance.

  • Mechanical stability

Via holes provide additional support and reinforcement to the board, reducing the risk of warping, bending, or cracking. Via holes can also help improve the overall mechanical integrity of the board by reducing stress concentration points and enhancing its structural rigidity.

  • Design flexibility

Via holes offer design flexibility in thick film ceramic boards. They can be designed and placed according to the specific requirements of the circuit or system, allowing for customized and optimized designs. Via holes can be used to route traces, create vias for component mounting, or provide grounding or shielding, among other functionalities. This flexibility in design allows for more efficient and effective circuit layouts, which can lead to improved performance and reliability.

As previously mentioned, designing via holes in thick film ceramic boards offers various benefits. However, when it comes to choosing the appropriate paste for via holes, silver paste is often recommended to our customers. But why is that? Can I use gold or copper? In our upcoming article, we will delve into the reasons behind this recommendation and provide you with valuable insights. Stay tuned to uncover the answers!

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10 Tips to Reduce the manufacturing cost of Printed Circuit Board

Thursday, March 23rd, 2023

Many times, when PCB engineer or purchaser seek for a PCB manufacturer to make circuit boards, that always think the price is too high, but don’t know where makes the price is so high and how to optimize the cost on the premise of ensuring the quality of the circuit board. Herein, we share a very useful guideline about “Ten tips to reduce the PCB manufacturing cost”, welcome to read on!

  • Substrate

Different brands of substrate have different price. For a simple example, if you require a multi-layer PCB, Tg should greater than 150o, and PP need to over 0.20mm, then use GDM will cheaper than KB or SL. But GDM is usually used for making single or double-sided PCB, it is not recommended to make multi-layer circuit board. If you need to fabricate an 8 layers of multi-layer PCB, KB Tg170 is ideal for your choice since it has good performance and relatively cost-efficient.

  • Solder mask oil

In generally, what we should consider about the solder mask (S/M) are color and brand.

For the solder mask color, the most commonly used are green, white and black, if you would like to choose other special colors such as blue, yellow, gray, the price will be a little more costly.

From the brand aspect, currently the best brand is Taiyo solder mask, because it has high viscosity, stable dielectric constant, good insulation and oxidation resistance properties, but it is more expensive than others. Other brands of solder mask oil will be relatively cheap, but the quality is not particularly stable and can’t be guaranteed. So if the circuit boards need to used on bulk products, we recommend to use Taiyo to get a stable quality.

  • Printing film

If it is a bulk order with simple design and trace width/space >= 5/5mil, almost manufacturers will use printing film to generate traces. But please remember: the larger the board size, the higher cost of film. (Generally speaking, Prototypes or small orders are use LDI exposure machine to generate the trace, but for mass production, manufacturer will priority choose film and then use LDI.)

  • Line width/space

The thinner traces, the higher manufacturing price. Because the line is thinner, the accuracy of the equipment and the quality of the chemical solution are required to be relatively high, and the yield will be relatively low, resulting in higher costs. Each manufacturer has its capability, so choose a suitable supplier is most important, view Best’s website to check our capability.

  • Drill holes

The smaller the hole, the higher the price, the diameter of less than 0.3mm will increase the price. The more holes there are, the higher the price will be. Other special holes will also increase the cost, such as half holes, blind holes, PTH holes larger than 6.0mm, etc. Because the hole is small, only one board can be drilled at a time when drilling the hole on PCB material, which is low efficiency and the possibility of drilling a broken drill bitter is also large, resulting in higher cost.

  • Finished copper thickness

Finished copper thickness ≥2oz, and hole copper >25μm board will increase the cost. Because the price of copper itself is relatively expensive, the thicker the copper, the higher the price, coupled with the cost of additional electric copper, leads to the overall price rise.

  • Finished board thickness

There is little difference in the price of PCB with board thickness of 1.2mm and 1.6mm, but if the board thickness is 2.0mm or even thicker, its cost will increase correspondingly. The thicker the board, the more sheets of fiberglass, so the cost will increase accordingly.

  • Outline

If there are more slots, and the slots are less than 1.0mm, the cost will increase. This is because the gong groove of the board is more shaped, resulting in the processing time is elongated. In addition, if the width of the groove is small, processing can not be too fast, easy to break the milling cutter, so the processing efficiency is low, the natural production cost increases.

  • Surface treatment

Our common surface treatment processes are: OSP(antioxidant), lead HASL, lead-free HASL (environmental protection), gold plating, immersion gold, ENEPIG and some combination processes. The price of the above process is more expensive in turns, that is, OSP (antioxidant) < lead HASL < lead free HASL < gold plating < immersion gold < ENEPIG.

  • Tooling fee and testing fee

Tooling fee: in generally most of manufacturers use milling cutter to punch outline if this is a prototype order or small order. But if bulk order, it is needed to use a tooling jig, so there is a tooling fee need to pay.

Testing fee: flying probe tester is usually for small order, mass production need to use testing jig, and there is a different testing fee for both.

Above elements can affect the cost of making a board, you can try to follow those guidelines if you have a limited budget. Or if you want to know a exactly cost, please send RFQ to Best Technology, our sales will give you a best price.

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3M Epoxy Adhesive DP190-Gray & 3M Epoxy Adhesive DP190-Translucent

Friday, April 22nd, 2022

Both 3M Epoxy Adhesive DP190-Gray and 3M Epoxy Adhesive DP190-Translucent are a two-part epoxy adhesive that delivers exceptional performance with high shear and peel strength.

They can bond to a wide range of materials, such as metals, ceramics, wood, fiberboard, glass, rubber and many plastics. So, PCB is no exception. But what are the similarities and differences between them?

Similarities

  • Provide tough, strong bonds through high shear and peel strength.
  • Capable of bonding to a wide variety of different materials.
  • Deliver extended work-life, providing additional time for adjustment.
  • Exhibit good environmental aging properties, delivering long-term durability.

Differences

3M Epoxy Adhesive DP190-Gray has a moderately high modulus. With a 90-minute work-life, it reaches handling strength in approximately 10 hours and full cure in 7 days at room temperature.

Additionally, this epoxy adhesive has medium viscosity and self-leveling with a 1:1 mix ratio by volume. But its flexibility and elongation are moderate.

(3M Epoxy Adhesive DP190-Gray)

3M Epoxy Adhesive DP190-Translucent has a moderately low modulus. With an 80-minute work-life, it reaches handling strength in approximately 10 hours and full cure in 14 days at room temperature.

It has low viscosity and self-leveling with a 1:1 mix ratio by volume. Additionally, it features high flexibility and elongation.

3M Epoxy Adhesive DP190–Translucent

This is all about the similarities and differences between the 3M Epoxy Adhesive DP190-Gray and 3M Epoxy Adhesive DP190-Translucent. It is supposed that you have known about them.

But if you still have any questions about them or PCB, please feel free to contact us. Because at Best Technology, we are fully equipped to handle your PCB manufacturing requirements.

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Notes for cleaning PCBA

Monday, October 18th, 2021

PCBA includes components assembly and DIP plug-in, in the whole process, there will be reflow soldering, wave soldering, manual soldering, due to the current Electronic products are getting smaller and smaller, and the size requirements of PCBA are getting smaller and smaller, but the requirements for quality (including product reliability and stability, etc.) are getting higher and higher. Many customers require PCBA boards with conformal coating to increase stability and reliability and ensure product quality and performance. But the PCBA board must be cleaned before with conformal coating.

Because there will be a variety of flux residues on the soldered MCPCB board, some of which are acidic, soluble and corrosive, etc., if these residues are not cleaned, the coating will also cause very great damage to the product. In this blog I’d like to share some notes for cleaning PCBA.

  1. PCBA board after soldering, should be cleaned as soon as possible (flux residue will produce corrosion over time), cleaning residual flux and other pollutants on PCBA board.
Copper Core PCB
  • When cleaning the PCBA board, prevent the cleaning agent from intruding into the unsealed components to avoid damage to the components. After cleaning, it should be placed in the oven at about 30-50 degrees, baked for about half an hour, and then removed after drying PCBA board.
FR4 PCB
  • When cleaning the PCBA board, protect the components and labels on the board. Otherwise, the mounted and welded PCBA board will be wasted.
Aluminum Core PCB

Cleaning PCBA board affects the life and reliability of electronic products. Some of PCBA boards are not cleaned, which may lead to short circuit and leakage, leading to unqualified products and many failures, increasing the cost of recovery and maintenance, so it is not worth the loss to clean PCBA boards.

Best Technology has our own SMT factory and can help our customers to buy the components at the same time. If you have any new inquiry of PCBA, welcome to send it to me then I can send you the quotation for comparison with your other suppliers.

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Aluminum vs Copper Core PCB

Wednesday, May 19th, 2021

In Best Technology, currently the most common metal used for Metal Core PCB manufacturer are Aluminum, Copper. Today let’s talk about the main differences between aluminum substrate and copper substrate, hoping to help you choose the right substrate in future design projects.

Although they both share similar properties and functions, there are still a few variations between the two kinds of metals. Some of the key differences between aluminium and copper core PCBs are explained in the points below.

1. Thermal Conductivity

The thermal conductivity of copper substrate is up to about 400(W/mK) and the thermal conductivity of aluminum substrate is generally about 200W(W/mK). The thermal conductivity is higher, the transfer efficiency will be better, and the heat dissipation will be better, then the working life will be longer.

 Thermal Conductivity

2. Electrical Conductivity

Both aluminum and copper, being metals, are electrical conductors of electricity, although the exact degree of this varies between the two metals. When it comes to electrical conductivity, copper has a clear advantage over aluminum. In other words, in applications where there is a need for efficient electrical conductivity, copper makes for an ideal pick.

 Electrical Conductivity

3. Electrical Resistance

Resistance is very important when it comes to PCB design, as it can have an effect on the overall function and stability of the component. Given that copper has a higher density than aluminum, it tends to have a lower resistance than aluminum, so copper is an better choice where there’s a requirement for thinner circuits and faster electricity transfer.

Electrical Resistance

4. Weight

Since copper has the higher density for per unit area, the weight of copper PCB is much heavier than aluminum PCB for the same design.

In applications where light-weight construction is required more than anything else, aluminum is the preferred material of choice. On the other hand, applications where weight is not much of an issue, tends to be the ones where copper is widely used.

Weight

5. Application

Copper core PCB is the best heat dissipation among all MCPCB, so it’s mostly used in automobile headlights, taillights and some high-tech electronic products (unmanned aircraft, mining machine) high-power lighting equipment. The aluminum core PCB is mostly used in indoor lighting, energy saving lighting, street lighting and other energy-saving lighting electronic products.

Application
Application

In conclusion, due to the above different parameters and performance, the cost of copper is generally more expensive than aluminum. If you have other questions about MCPCB, welcome to contact us .

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What’s fiducial marks on the PCB?

Saturday, April 24th, 2021

You may ever be recommended by some PCB manufacturers to add the fiducial holes on the board edge. Do you know what is fiducial marks and what’s the purpose for this kind of holes in a PCB?

Now, let me to show you something for what is the fiducial holes.

Fiducial holes, we also call it fiducials mark, while we assemble a PCB, it will need to locate the positions for each component, and it is positioned based on the fiducial mark as the reference point.

There are 3 types fiducial marks, first type is fiducial marks on a single board, second type is the fiducial marks on a PCB panel, third one is the fiducial marks for some single component on the board.

Here are the pictures for you to understand the types of the fiducials.

Fiducial holes types
Fiducial holes

Fiducial mark on a single board is designed for positioned all circuits features on a single board. It is necessary to have a fiducial mark on a single board.

And fiducial marks on a PCB panel is used to assist positioning the circuits. 

For the fiducial mark of a single component, it is designed to position the fiducial mark of a single component, which can improve the placement progress (For QFP, CSP, BGA and other important components must have the fiducial marks).

So, it is important to add the fiducial holes on a PCB board.

Also, while we make the panel for the PCB board, on the diagonal of the four corners, it is required to have 2 fiducial points at least on 2 diagonal corners.  you can also place 4 marks on the four corners, but generally, assembly plant will only need 2 marks for recognize.

See below a PCB panel for reference:

PCB panel drawing Best Technology
Fiducial holes on a panel

In the other hand, while you design the PCB, please try not to put the silk screens, pads, traces etc. within 2mm of the optical fiducial marks. Otherwise, the SMT machine will not be able to recognize the optical fiducial on the PCB boards.

And if you add the fiducial holes on the area which without any circuits, to avoid the holes being etching while the process, so generally we suggest to add a metal circles around the fiducial holes, to make it more obviously on the boards.

If you have any new PCB design which you also want to add the fiducial marks.

You are welcome to contact Best Technology for a help and we will show our best help for you.  

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