High Density Interconnects (HDI) board are defined as a board (PCB) with a higher wiring density per unit area than conventional printed circuit boards (PCB). They have finer lines and spaces (<100 µm), smaller vias (<150 µm) and capture pads (<400 µm), I/O>300, and higher connection pad density (>20 pads/cm2) than employed in conventional PCB technology. HDI board is used to reduce size and weight, as well as to enhance electrical performance. According to layer up different, currently DHI board is divided into three basic types: |
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1) HDI PCB (1+N+1) Features:
Application: Cell phone, UMPC, MP3 Player, PMP, GPS, Memory Card 1+N+1 HDI PCB Structure: |
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2) HDI PCB (2+N+2) Features:
Application: Cell phone, PDA, UMPC, Portable game console, DSC, Camcorder |
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3) ELIC (Every Layer Interconnection) Features:
Application: Cell phone, UMPC, MP3, PMP, GPS, Memory card.
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Click here for information about the Flowchart of HDI Board. | |
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