A halogen free PCB is normally specified by limiting chlorine and bromine in the base material, then controlling every additional material covered by the customer requirement. IEC 61249-2-21 is a common starting point for non-halogenated epoxy glass laminate, while test reports, material declarations, approved material grades, and drawing notes determine whether a production lot can actually be accepted.
This guide focuses on verification rather than repeating a general material overview. It explains the numerical limits, the difference between chemical and flammability requirements, the evidence a buyer should request, and the checks that should be completed before releasing a board for production.
What Are the Core Halogen Free PCB Requirements?
The core chemical limits commonly used for halogen-free PCB laminate are chlorine at no more than 900 ppm, bromine at no more than 900 ppm, and the combined total at no more than 1,500 ppm. These limits are associated with IEC 61249-2-21 and should be applied to the exact material scope stated in the purchase specification.
Requirement
Common Limit or Evidence
What It Covers
Chlorine content
≤ 900 ppm
Chlorine in the tested base material
Bromine content
≤ 900 ppm
Bromine in the tested base material
Combined chlorine and bromine
≤ 1,500 ppm
Total of the two measured elements
Flammability
Specified material rating, often UL 94 V-0
Burning behavior at the qualified thickness
Material identity
Approved grade and manufacturer
The laminate and prepreg actually used
The limits do not mean the material contains absolutely zero halogen. They establish maximum measured concentrations. The drawing should therefore name the applicable standard, approved laminate grade, required flame rating, and evidence needed for lot acceptance.
Why Is Halogen Free Important?
Halogen-free requirements matter when an OEM must control restricted material chemistry, product environmental policy, combustion by-products, or supply-chain declarations. The requirement is most useful when it is tied to a defined product or customer specification rather than treated as a general synonym for “environmentally friendly.”
For engineers and buyers, the practical benefits are traceability and design control. A clear requirement reduces the chance of an unapproved laminate substitution, establishes which materials need declarations, and makes prototype-to-production transfer easier. For a broader explanation of the terminology and applications, see our halogen-free PCB overview.
How Do IEC, RoHS, REACH, and UL 94 Differ?
IEC 61249-2-21, RoHS, REACH, and UL 94 answer different compliance questions, so passing one does not prove the others. A procurement specification should list each required condition separately.
Reference
Primary Scope
Decision It Supports
IEC 61249-2-21
Non-halogenated epoxy glass base materials
Material composition and base-material properties
IPC-TM-650 2.3.41
Total halogen test method for base materials
How chlorine and bromine are measured
RoHS
Ten restricted substances in electrical and electronic equipment
Chemical obligations, including Candidate List substances in articles
Supply-chain communication and substance obligations
UL 94
Small-scale flammability behavior of plastic materials
Whether the material has the specified flame classification
A board can be RoHS compliant without meeting a customer’s halogen-free definition because RoHS restricts specific substances, including PBB and PBDE, rather than all chlorine and bromine content. Likewise, UL 94 is a flammability classification, not a complete chemical-composition declaration. Our RoHS information page provides additional context for projects that require both controls.
Which Materials Must Be Covered by the Requirement?
The required scope should include every material named by the customer specification, not only the laminate core. A narrow base-material requirement and a finished-PCB requirement are not automatically equivalent.
Laminate cores and prepregs: confirm the exact manufacturer, grade, thickness, resin system, and supporting declaration.
Solder mask and legend ink: request declarations when the customer requirement covers the finished bare board.
Bonding films and adhesives: include them for flex, rigid-flex, heat-spreader, or other bonded constructions when applicable.
Plugging, filling, and coating materials: review via-fill resin, peelable mask, carbon ink, and conformal coatings when they remain in the delivered product.
Assembly materials: solder paste, flux, wire insulation, connectors, and component packages require separate PCBA-level control if the finished assembly is in scope.
The phrase halogen free pcb material is therefore too broad for a purchasing drawing unless the controlled materials are listed. The same applies to halogen free pcb laminate: a compliant laminate does not, by itself, document every material added later. Our detailed halogen-free PCB material guide explains the main laminate families and engineering properties.
How Should Halogen Free PCB Requirements Be Written on Drawings?
A useful fabrication note names the standard, material scope, approved grade or equivalency rule, flame rating, assembly compatibility, and required documentation. A note that only says “halogen-free FR4” leaves too many decisions open.
An example starting point is:
“Use halogen-free laminate and prepreg compliant with IEC 61249-2-21: Cl ≤ 900 ppm, Br ≤ 900 ppm, and Cl + Br ≤ 1,500 ppm. Material shall meet the specified UL 94 rating at the finished construction thickness. Supplier substitution requires written approval. Provide material declaration and certificate of conformity with the shipment.”
This example must be adapted to the product specification. The drawing may also need the laminate manufacturer and grade, IPC-4101 slash sheet, Tg, Td, Z-axis CTE, Dk/Df targets, copper foil type, lead-free assembly requirement, and lot traceability. Designers can also compare available rigid-board material options on our FR4 PCB page.
Which Documents Should a Supplier Provide?
The documentation package should prove material identity, declared composition, and production traceability at the level required by the contract. A generic marketing statement is not enough for controlled projects.
Material declaration: identifies the applicable laminate or material family and its declared halogen status.
Technical data sheet: provides Tg, Td, CTE, Dk/Df, moisture absorption, flammability, and other grade-specific properties.
Certificate of conformity: links the delivered product to the purchase order and specified requirements.
Lot or batch traceability: links incoming material, production traveler, and shipment records.
Test report: provides measured chlorine and bromine results when contractually required.
Change notification: prevents silent substitution of the laminate, prepreg, solder mask, or other controlled material.
The buyer should also define whether documents are needed with every lot, only for first-article approval, or upon request. That decision affects administration time, test cost, and release lead time.
How Is Total Halogen Content Tested?
Total halogen testing for base materials commonly uses combustion sample preparation followed by ion chromatography to quantify chlorine and bromine. IPC-TM-650 2.3.41 describes a total-halogen method for base materials; surface ionic contamination methods answer a different question.
A representative material specimen is selected and weighed.
The specimen is combusted so chlorine- and bromine-containing compounds are converted into measurable ions.
The combustion products are absorbed into a prepared solution.
Ion chromatography separates and measures chloride and bromide.
The laboratory reports results in ppm and compares them with the specified limits.
XRF screening can help identify elevated bromine or chlorine in some materials, but it may not provide the same compound-specific or low-level quantitative evidence as the contract test method. The test plan should state the sample type, preparation method, laboratory method, reporting limit, and acceptance criteria.
What Engineering Trade-Offs Need Review?
A halogen-free designation does not establish electrical, thermal, or mechanical suitability. Engineers still need to qualify the selected grade against the stackup, assembly profile, operating environment, and reliability target.
Thermal behavior: compare Tg, Td, T260/T288, and Z-axis CTE with the expected reflow and repair cycles.
Drilling and desmear: filler content and resin chemistry can change tool wear, smear behavior, and hole-wall preparation.
Signal performance: confirm Dk, Df, resin content, and glass style for controlled-impedance or high-speed designs.
CAF and moisture performance: review laminate data and construction spacing for humid or high-bias applications.
Availability: approved grades, prepreg styles, and copper-clad thicknesses may affect material lead time and substitution risk.
Cost: special testing, lot-specific documentation, and restricted material choices may add cost beyond the laminate price.
The safest selection is not simply the grade with the highest Tg. It is the grade whose complete property set and processing history fit the actual board design.
What Should Be Checked Before Production Release?
Production should be released only after the drawing, stackup, approved materials, compliance evidence, and change-control path agree. The following checks prevent most avoidable specification gaps:
The standard and numerical halogen limits are written on the controlled drawing or specification.
The material scope is defined: laminate only, finished bare PCB, or complete PCBA.
The laminate manufacturer, grade, prepreg styles, and acceptable equivalents are approved.
UL 94, RoHS, REACH, and customer-specific requirements are listed separately.
Tg, Td, CTE, Dk/Df, CAF, moisture, and lead-free assembly needs have been reviewed.
Required documents and their delivery frequency are stated on the purchase order.
Substitutions and supplier changes require written approval.
First-article or third-party testing is defined when declarations alone are insufficient.
These checks turn halogen free PCB requirements into an auditable production instruction instead of an informal preference.
FAQ About Halogen Free PCB Requirements
Does halogen-free mean zero chlorine and bromine?
No. In common PCB specifications, halogen-free means the measured chlorine, bromine, and combined total remain below defined limits. It is a threshold-based requirement, not a claim that every halogen atom has been eliminated.
Is a RoHS-compliant PCB automatically halogen-free?
No. RoHS restricts ten named substances, including PBB and PBDE, but it does not set a universal limit for all chlorine and bromine in PCB materials. Halogen-free and RoHS requirements should be specified and documented separately.
Does UL 94 V-0 prove a laminate is halogen-free?
No. UL 94 V-0 describes flammability behavior under a defined small-scale test. It does not provide a full chemical-composition result. Use material declarations or the specified chemical test evidence to verify halogen content.
Can a standard FR4 PCB be halogen-free?
Yes. FR4 describes a flame-retardant glass-reinforced epoxy material class, while individual grades can use different flame-retardant systems. The exact laminate grade and its documentation determine whether it meets the project’s halogen-free requirement.
Should solder mask be included in the requirement?
Include solder mask when the customer specification applies to the finished bare PCB rather than only the base laminate. The same logic applies to legend ink, via-fill resin, bonding films, adhesives, and other materials that remain in the delivered board.
Is halide-free flux the same as halogen-free assembly material?
No. Halide-free classifications focus on ionic halides in flux chemistry, while a halogen-free product requirement may cover a broader set of halogen-containing compounds. Confirm the applicable assembly-material standard and customer definition before approving solder paste or flux.
When is third-party testing needed?
Third-party testing may be appropriate for first-article qualification, regulated or safety-sensitive products, disputed material identity, supplier changes, or contracts that explicitly require measured data. Routine lots may rely on approved material control and declarations when the customer specification allows it.
What sample should be tested?
The test specimen must match the scope of the requirement. A laminate coupon can support a base-material claim, but it may not represent solder mask, ink, adhesives, or assembly materials. Define whether the laboratory receives raw laminate, a finished bare board, or a complete assembly.
What changes require requalification?
Requalification may be required after a laminate or prepreg substitution, resin-system change, solder-mask change, manufacturing-site change, or customer drawing revision. The purchase agreement should identify which changes require notification, documentation review, or repeat testing.
Do halogen-free materials always cost more?
Not always, but approved-grade availability, special prepreg styles, minimum purchase quantities, lot testing, documentation, and restricted substitution can increase cost. Compare the complete stackup and compliance package rather than judging only the laminate unit price.
How Can EBest Circuit Support a Halogen-Free PCB Project?
At EBest Circuit, we review the fabrication drawing, stackup, approved material grade, assembly profile, and required compliance documents before quotation and production. Halogen-free FR4 is available as an optional material route, subject to the selected grade and project requirements.
Send us your Gerber files, stackup, quantity, approved material list, and compliance notes for review. Our team can clarify material availability, documentation scope, and manufacturability before the order is released. Contact us through our PCB enquiry page or email sales@bestpcbs.com.
Halogen-free PCB materialis used in electronics that require safer materials, environmental compliance and stable PCB manufacturing quality. It helps reduce harmful gas release during burning while keeping reliable flame resistance, soldering performance and long-term product stability.
This guide explains what halogen-free PCB material is, how it works, which standards matter, how to compare halogen-free FR4 and halogen-free CEM-3, and how to choose the right material for custom PCB manufacturing.
What Is Halogen-Free PCB Material?
Halogen-free PCB material refers to laminate, prepreg, solder mask and related board materials with controlled chlorine and bromine content. In common PCB manufacturing, a material is usually considered halogen-free when chlorine is no more than 900 ppm, bromine is no more than 900 ppm and total halogens are no more than 1500 ppm.
Traditional FR4 and CEM-3 materials may use brominated flame retardants to improve fire resistance. Halogen-free PCB material replaces these systems with phosphorus-based, nitrogen-based or inorganic flame-retardant systems. This helps maintain flame resistance while reducing toxic and corrosive gas release during combustion.
For custom PCB manufacturing, halogen-free does not mean lower performance. A suitable halogen-free PCB material can support UL 94 V-0 flame rating, lead-free soldering, multilayer construction, stable insulation resistance and long-term reliability. Final performance depends on laminate grade, resin system, stack-up design and production control.
Why Is Halogen-Free PCB Material Important in PCB Manufacturing?
Halogen-free PCB material is important because it supports safer, cleaner and more compliant electronics manufacturing. When halogenated materials burn, they may release corrosive and toxic gases. This can create risk in enclosed equipment, transportation electronics, consumer devices, industrial control systems and safety-related products.
Global market access is another key reason. Many OEM brands in Europe and North America prefer halogen free PCB materials for environmental policies, product safety rules and customer compliance requirements. In many export projects, halogen-free requirements are written directly into the PCB fabrication drawing, product specification or approved vendor list.
From a production view, halogen-free PCB material also affects processing. Resin chemistry, Tg, Td, CTE, drilling quality, lamination behavior and reflow resistance all influence yield. For OEM and ODM projects, early material confirmation helps reduce quotation errors, production delays and compliance risks during prototype, pilot run and mass production.
How Does Halogen-Free PCB Material Achieve Flame Resistance?
Halogen-free PCB material achieves flame resistance by using non-halogen flame-retardant systems instead of brominated or chlorinated additives. Common systems include phosphorus compounds, nitrogen-based chemistry, inorganic fillers and modified epoxy resin systems. These materials help slow ignition, promote char formation and reduce flame spread.
During combustion, phosphorus-based systems can form a protective char layer on the material surface. This layer limits oxygen contact and slows heat transfer into the laminate. Inorganic fillers can also help absorb heat and reduce the release of flammable gases from the resin system.
The main challenge is balance. A halogen-free PCB material must keep flame resistance without weakening dielectric performance, peel strength, drilling quality or reflow reliability. For this reason, low-cost halogen-free laminate is not always suitable for dense multilayer PCB, high-speed circuits or high-temperature applications.
What Standards and Compliance Limits Define Halogen-Free PCB Materials?
Halogen-free PCB material is usually defined by chemical content limits and supported by PCB material, flame resistance and environmental compliance standards. The most common limit is Cl ≤900 ppm, Br ≤900 ppm and total halogens ≤1500 ppm. These values are often used in laminate certificates, customer specifications and material declarations.
Standard
Scope
Key Requirement
IEC 61249-2-21
PCB base materials
Cl ≤900 ppm, Br ≤900 ppm, total halogens ≤1500 ppm
IPC-4101
Rigid laminate and prepreg
Material type, resin system, Tg, Td, Dk, Df, flammability
IPC-4103
High-speed laminate
Electrical and material performance classification
UL 94 V-0
Flammability
Self-extinguishing behavior
RoHS
Restricted substances
Hazardous substance control
REACH
Chemical safety
Chemical registration and substance control
IPC-1752
Material declaration
Supply chain material reporting
For production drawings, it is better to state the requirement clearly instead of writing only “FR4.” A stronger callout is “compliant with IEC 61249-2-21, UL 94 V-0, lead-free compatible.” For critical projects, the drawing may also list a specific laminate brand, IPC slash sheet or approved equivalent.
What Are the Main Types of Halogen-Free PCB Materials?
Halogen-free PCB material is not one single material. It includes several laminate families for different cost, reliability and performance targets. The correct option depends on board layers, operating temperature, assembly process, electrical speed and end-product compliance.
Standard FR4 option Used for most custom PCB manufacturing projects. It supports rigid PCB, multilayer PCB, lead-free soldering and many commercial or industrial electronics.
High-Tg FR4 option Suitable for higher thermal stress, multilayer boards, power electronics and products exposed to repeated reflow or elevated operating temperature.
CEM-3 option Often used for cost-sensitive single-sided or double-sided boards. It can be considered for appliances, LED products and simple control boards.
High-speed material option Used when signal integrity matters. These materials offer controlled Dk and Df for data communication, computing, wireless and RF-related boards.
Metal core material option Used for LED lighting, power modules and heat-dissipation applications where thermal management is more important than layer count.
Flexible or rigid-flex option Used in compact electronics, wearable products and modules that require bending, folding or space-saving assembly.
Halogen-Free FR4 vs Halogen-Free CEM-3: Which Material Is Better for Your PCB Project?
Halogen-free FR4 and halogen-free CEM-3 are both used in custom PCB manufacturing, but they are suitable for different project levels. FR4 is usually better for multilayer boards, higher reliability and stronger thermal performance. CEM-3 is more suitable for simpler boards where cost control is more important than high-density routing or harsh operating conditions.
Item
Halogen-Free FR4
Halogen-Free CEM-3
Base Structure
Woven glass fabric with epoxy resin
Composite epoxy material with glass mat structure
Common Board Type
Multilayer PCB, double-sided PCB, industrial PCB
Single-sided PCB, double-sided PCB, simple control board
Mechanical Strength
Higher strength and better rigidity
Medium strength, suitable for less demanding boards
Thermal Stability
Better for lead-free soldering and repeated reflow
Suitable for lower thermal stress applications
Dimensional Stability
Better layer alignment and hole registration
Moderate stability, less suitable for tight tolerance designs
Electrical Performance
More stable for impedance and signal requirements
Suitable for general low-speed circuits
Drilling Quality
Better for dense holes and multilayer structures
Acceptable for simple hole structures
Moisture Resistance
Better when high-grade FR4 is selected
Usually lower than FR4 in humid or harsh environments
Routing Density
Medium to high routing density
Low to medium routing density
Reliability Level
Better for industrial, telecom, medical and automotive-related products
Better for cost-sensitive consumer or appliance products
Material Cost
Higher
Lower
Production Risk
More stable for complex structures
Lower cost, but higher risk in demanding projects
Best Fit
Reliability-focused custom PCB manufacturing
Cost-sensitive simple electronics
For most medium and high-reliability PCB projects, FR4 is the safer and more flexible choice. It works better for multilayer boards, lead-free assembly, tighter tolerances, impedance control and long-term operation. If the project involves industrial control, telecom equipment, servers, automotive electronics or medical devices, FR4 is usually more suitable.
CEM-3 can be considered when the PCB structure is simple, the operating temperature is moderate and the product is highly cost-sensitive. It may be suitable for LED products, appliance control boards, simple consumer electronics and low-density double-sided boards. However, it should not be selected only because of lower cost if the project requires strong thermal reliability, stable dimensions or repeated soldering.
What Electrical, Thermal and Mechanical Properties Matter in Halogen-Free PCB Material?
The main properties of halogen-free PCB material include heat resistance, electrical stability, dimensional control and copper bonding strength. These properties affect soldering reliability, signal performance, via quality and long-term PCB durability. For custom PCB manufacturing, the material should match the board structure, assembly temperature and operating environment.
Tg, Glass Transition Temperature Tg shows when the resin system starts to soften under heat. A higher Tg helps the PCB keep better stability during lead-free soldering, lamination and long-term operation. For multilayer boards or high-temperature applications, high-Tg laminate is usually a safer choice.
Td, Decomposition Temperature Td shows when the material starts to break down under high temperature. A higher Td gives the PCB better resistance to reflow soldering and repair work. Low Td may increase the risk of delamination, blistering and weak hole wall reliability.
CTE, Coefficient of Thermal Expansion CTE shows how much the material expands when temperature changes. Lower Z-axis CTE helps protect plated through holes during soldering and field use. High CTE may cause via cracking, barrel separation and inner-layer connection failure.
Dk and Df Dk affects impedance stability, while Df affects signal loss. Standard FR4 can work for general control boards. For high-speed, RF, telecom or data communication boards, stable Dk and low Df are more important.
Peel Strength Peel strength shows how well copper foil bonds to the laminate. Higher peel strength helps prevent pad lifting, trace peeling and copper separation during soldering or rework. It is important for fine traces, connectors and heavy copper areas.
Moisture Absorption Low moisture absorption helps reduce blistering, CAF risk, leakage current and delamination during high-temperature assembly. For humid environments, long storage or export projects, low-moisture material and proper baking control are important.
CTI, Comparative Tracking Index CTI shows the material’s resistance to electrical tracking. Higher CTI improves insulation safety in power supplies, appliance electronics, industrial control boards and high-voltage areas.
For most commercial electronics, standard FR4 can meet basic requirements. For automotive electronics, power boards, telecom equipment, servers, medical devices or industrial control products, high-Tg, high-Td, low-CTE and low-moisture material is usually a better choice.
What Are the Advantages of Halogen-Free PCB Materials?
Halogen-free PCB materials offer environmental, safety and reliability benefits when selected correctly. The main value is not only “green material,” but also stronger compatibility with modern electronics compliance, lead-free assembly and brand safety requirements.
Lower toxic and corrosive gas risk during fire or high-temperature decomposition.
Better compliance support for products sold into regulated global markets.
Suitable for lead-free soldering when high-Tg and high-Td grades are selected.
Improved sustainability positioning for consumer and industrial products.
Good material availability across FR4, high-Tg FR4, CEM-3 and high-speed laminates.
Useful for enclosed equipment such as servers, automotive modules, railway systems and control cabinets.
Supports custom PCB manufacturing from prototype to mass production when material data is confirmed early.
What Are the Limitations of Halogen-Free PCB Materials?
Halogen-free PCB materials also have limitations. Some grades may be more expensive, more sensitive to processing conditions or different in electrical behavior compared with traditional FR4. These issues can be controlled when the supplier reviews the stack-up and production process before fabrication.
Higher material cost compared with standard brominated FR4 in many cases.
Different drilling behavior depending on filler and resin chemistry.
Possible dielectric variation that affects high-speed impedance design.
More careful lamination control for multilayer boards.
Material substitution risk if the drawing only says “halogen-free” without a grade.
Longer procurement time for special high-speed or high-Tg laminate.
Potential solder mask mismatch if only the base laminate is halogen-free but other materials are not specified.
Where Are Halogen-Free PCB Materials Commonly Used?
Halogen-free PCB materials are used in products where safety, compliance, sustainability and long service life are important. Their application range continues to expand as more electronics brands move away from brominated flame-retardant systems.
Consumer electronics Smartphones, tablets, chargers, audio devices, smart home products and wearable electronics.
Automotive electronics Body control modules, lighting boards, battery management systems, infotainment boards and sensor modules.
Industrial control PLC boards, motor control boards, power control modules, automation equipment and monitoring devices.
Telecom and data equipment Routers, switches, optical modules, servers, base station boards and high-speed communication modules.
LED and power electronics LED lighting boards, power supplies, inverter control boards and thermal management PCB projects.
Medical and safety-related electronics Monitoring equipment, control panels, portable devices and products with strict material declarations.
For example, an industrial control PCB project may switch from standard FR4 to high-Tg material when the board must pass lead-free reflow, long-term thermal cycling and export compliance review. In this situation, Tg, Td, CTE, laminate traceability and stable repeat production are more important than material cost alone.
What Manufacturing Challenges Occur with Halogen-Free PCB Materials?
Halogen-free PCB material can bring process challenges during drilling, lamination, desmear, plating, solder mask application and final assembly. These challenges do not mean the material is difficult to use, but they require controlled manufacturing parameters.
Step 1: Material confirmation The factory checks laminate grade, Tg, Td, copper thickness, resin content, IPC slash sheet, UL rating and material declaration before production. This step prevents incorrect material substitution and compliance disputes after delivery.
Step 2: Stack-up review The stack-up is checked for board thickness, copper distribution, prepreg selection, impedance layers and press cycle suitability. For multilayer boards, lamination pressure and temperature control are especially important.
Step 3: Drilling control Some laminates contain fillers that affect drill wear and hole wall quality. The factory may adjust drill parameters, hit count, feed rate and drill tool selection to reduce smear, burrs and rough hole walls.
Step 4: Desmear and plating control Hole wall preparation should match the resin system. Incomplete desmear can reduce plating adhesion, while over-processing may attack the laminate surface. Stable copper plating reduces via cracking and hole reliability issues.
Step 5: Solder mask and surface finish matching The solder mask, legend ink and surface finish should match the compliance requirement if the final product requires full material control. ENIG, HASL lead-free, immersion silver and OSP can be selected according to assembly and storage requirements.
Step 6: Assembly reliability review Lead-free assembly often reaches higher peak temperatures. The material should withstand reflow without delamination, blistering, pad lifting or copper separation. This is especially important for double-sided SMT assembly and dense components.
In mass production, material review should be completed before releasing the job to the production line. A practical factory check usually includes laminate certificate review, press cycle suitability, drill quality, solder mask compatibility and assembly temperature profile. This helps reduce delamination, via cracking, material mismatch and repeat-order variation.
What Common Failure Risks Should Be Avoided in Halogen-Free PCB Projects?
Common failure risks in halogen-free PCB projects include delamination, blistering, CAF, via cracking, poor copper adhesion, solder mask mismatch and wrong material declaration. Most issues come from unclear specifications, poor material matching or weak process control.
Risk
Common Cause
Prevention
Delamination
Low Td, moisture, poor lamination
Use suitable Tg/Td and bake when required
Blistering
Moisture absorption or surface contamination
Control storage, baking and cleaning
Via Cracking
High Z-axis expansion
Use low-CTE laminate and stable plating
CAF
Moisture, glass/resin interface weakness
Select CAF-resistant material and spacing rules
Pad Lifting
Weak copper adhesion or high thermal stress
Check peel strength and assembly profile
Impedance Drift
Wrong Dk/Df assumption
Confirm laminate data before stack-up approval
Compliance Failure
Unclear material callout
Specify IEC limits and material declaration
Solder Mask Conflict
Base laminate only
Confirm solder mask and ink compliance
A practical factory approach is to review the risk before production rather than after inspection. For example, a six-layer industrial PCB with lead-free reflow should not use the same material logic as a simple two-layer consumer board. The board structure, soldering temperature and operating environment must be reviewed together.
How Is Halogen-Free PCB Material Tested During PCB Production?
Halogen-free PCB material is tested through material verification, process inspection and finished board checks. The goal is to confirm that the selected material meets compliance requirements and can remain stable during PCB manufacturing, soldering and long-term use.
Material certificate review The factory checks laminate datasheets, material declarations, RoHS/REACH statements and UL information before production. This helps confirm whether the material meets Cl ≤900 ppm, Br ≤900 ppm and total halogens ≤1500 ppm.
Incoming material inspection The laminate, prepreg and copper-clad material should be checked before production. The factory confirms material grade, thickness, copper weight, surface condition and batch information to avoid wrong material use.
Stack-up and laminate verification For multilayer boards, the stack-up should be reviewed before lamination. This includes layer structure, dielectric thickness, copper balance and pressing suitability. Good stack-up control helps reduce warpage, delamination and registration problems.
Drilling and hole quality check Some laminates may have different drilling behavior from standard FR4. The factory checks hole wall quality, smear, burrs and drill accuracy. Poor drilling control can affect plating adhesion and via reliability.
Plating and microsection inspection Microsection inspection helps check hole wall plating, copper thickness, inner-layer connection and laminate condition. This is important for multilayer PCB, high-reliability boards and products that require long service life.
Thermal stress testing Thermal stress testing checks whether the PCB can withstand soldering heat without blistering, delamination or copper separation. This is especially important for lead-free assembly, double-sided SMT and high-Tg FR4 projects.
Electrical testing Finished boards should pass open and short testing. For impedance-controlled boards, impedance testing should also be performed according to the approved stack-up and actual material data.
Solderability testing Solderability testing confirms whether pads can be soldered properly after surface finish processing. It helps reduce assembly problems such as poor wetting, weak solder joints and rework risk.
Final quality inspection Final inspection checks board appearance, dimensions, solder mask, marking, surface finish, hole quality and customer requirements. For export or repeat orders, inspection records and material batch information should be kept for traceability.
For reliable production, testing should not be treated as a final step only. A good factory controls material from incoming review to finished board inspection, so prototype, pilot run and mass production can remain consistent.
What Quality Standards Should Halogen-Free PCB Production Follow?
Halogen-free PCB production should follow material, process and finished board quality standards. These standards help ensure that the PCB is not only compliant in material declaration, but also stable in manufacturing and reliable in final application.
Standard
Production Focus
IEC 61249-2-21
Halogen-free content limits
IPC-4101
Rigid laminate and prepreg requirements
IPC-6012
Rigid PCB qualification and performance
IPC-A-600
Printed board acceptability
IPC-A-610
Assembly acceptability when PCBA is supplied
UL 94 V-0
Flame resistance classification
RoHS
Restricted hazardous substances
REACH
Chemical substance compliance
ISO 9001
Quality management system
IATF 16949
Automotive quality control when applicable
ISO 13485
Medical production control when applicable
For export manufacturing, the supplier should provide clear documentation instead of vague claims. Useful documents include material datasheet, laminate certificate, UL file information, RoHS/REACH statement, microsection report, impedance report and final inspection report. These records help purchasing teams, quality teams and end customers confirm that the approved material and finished PCB meet the required specification.
What Factors Affect the Cost of Halogen-Free PCB Manufacturing?
The cost of halogen-free PCB manufacturing depends on material grade, board structure, production difficulty, testing requirements and order quantity. Halogen-free laminate is usually more expensive than standard FR4, but the final PCB cost is mainly decided by the full manufacturing specification.
Material grade Standard FR4 is more cost-effective than high-Tg, low-Df or high-speed laminate. If the project requires high thermal stability, controlled impedance or low signal loss, the material cost will increase.
Layer count A two-layer board is easier to produce than a four-layer, six-layer or high-layer-count PCB. More layers require more lamination steps, tighter stack-up control and more inspection, so the manufacturing cost becomes higher.
Board thickness and copper weight Special board thickness, heavy copper or uneven copper distribution can increase production difficulty. Heavy copper also requires more careful etching, plating and thermal control, especially for power-related projects.
Surface finish OSP is usually more economical, while ENIG, immersion silver and other finishes may increase cost. The surface finish should match soldering requirements, storage time, component type and end-use environment.
Impedance control If the PCB requires controlled impedance, the supplier must calculate stack-up, confirm material Dk/Df and perform impedance testing. This adds engineering work, material control and inspection cost.
Tolerance requirements Tight line width, small spacing, small holes, controlled thickness and high registration accuracy increase manufacturing difficulty. These requirements are common in dense multilayer boards and high-performance electronics.
Testing and inspection level Basic boards may only require standard electrical testing and visual inspection. High-reliability projects may require microsection reports, thermal stress testing, solderability testing, ionic contamination testing, impedance reports or material traceability records.
Order quantity and lead time Prototype orders usually have higher unit cost because setup, tooling and engineering review are spread across fewer boards. Mass production can reduce unit cost, while urgent delivery may increase production and material procurement cost.
For cost control, the best approach is to match the material to the real application risk. A simple consumer board may not require high-end laminate, while a dense industrial or telecom PCB should not use low-grade material only to reduce cost.
How to Choose a Reliable Halogen-Free PCB Manufacturer?
A reliable halogen-free PCB manufacturer should provide stable material sourcing, strict process control, clear compliance documents and repeatable production quality. For OEM, ODM, prototype and mass production projects, the manufacturer should not only supply the material, but also control fabrication, testing, documentation and delivery.
Check material compliance capability The manufacturer should confirm whether the selected material meets IEC 61249-2-21, RoHS, REACH and UL 94 V-0 requirements when applicable. Material datasheets, laminate certificates and material declarations should be available before production.
Review PCB manufacturing experience Halogen-free PCB material may require different drilling, lamination, plating and soldering control compared with standard FR4. A capable manufacturer should understand high-Tg FR4, CEM-3, multilayer PCB, impedance control and lead-free assembly requirements.
Confirm material traceability For export products and repeat orders, traceability is important. The manufacturer should be able to track laminate batch, copper thickness, production lot, inspection records and final delivery documents.
Evaluate engineering review ability A good manufacturer should review stack-up, material grade, surface finish, impedance requirements and production risks before fabrication. This helps reduce wrong material selection, delamination, via cracking, quotation errors and delivery delays.
Check quality control process The manufacturer should support electrical testing, visual inspection, microsection checks, solderability testing, thermal stress testing and final inspection reports. For high-reliability boards, testing requirements should be confirmed before production starts.
Compare prototype and mass production capability A reliable manufacturer should keep quality stable from samples to pilot run and mass production. Material consistency, process repeatability and batch control are important for long-term supply.
Review export and delivery support For international buyers, the manufacturer should provide clear communication, export packaging, shipping support and complete production documents. A China source factory can offer flexible customization, cost control and global delivery without making false local claims.
Avoid choosing by price only The lowest price may hide risks in material grade, testing level, documentation or process control. A reliable halogen-free PCB manufacturer should balance cost, quality, compliance, delivery and engineering support.
What Files and Specifications Are Needed Before Halogen-Free PCB Production?
Before halogen-free PCB production, clear files and specifications help the supplier quote accurately, select the right material and reduce production risk. Missing information may cause wrong material use, quotation delays or compliance issues after delivery.
Gerber files Include copper layers, solder mask, silkscreen, outline and all required board layers.
Drill files Show plated holes, non-plated holes, slots and special hole requirements.
Stack-up Provide layer order, dielectric thickness, copper weight and total board thickness.
Material requirement Clearly state the required material type. For stricter projects, add Tg, UL rating or halogen-free limits.
Surface finish Confirm ENIG, OSP, HASL lead-free, immersion silver or other required finish.
Copper thickness State base copper and finished copper thickness, especially for power boards or heavy copper projects.
Impedance data If controlled impedance is required, provide target impedance, tolerance and reference layers.
Solder mask requirement Confirm whether solder mask and legend ink also require compliance control.
Quantity and lead time State whether the order is for prototype, pilot run or mass production.
Quality requirements Confirm IPC class, electrical test, microsection report, impedance report or other inspection needs.
Assembly files If PCBA is required, provide BOM, CPL, assembly drawing and soldering requirements.
A clear note can be written as: “Use material compliant with IEC 61249-2-21, Cl ≤900 ppm, Br ≤900 ppm, total halogens ≤1500 ppm, UL 94 V-0, lead-free assembly compatible.”
FAQs About Halogen-Free PCB Material
Q1: Is halogen-free PCB material the same as RoHS-compliant PCB material? A1:No.RoHS controls restricted hazardous substances, while halogen-free focuses on chlorine and bromine content. A PCB can be RoHS-compliant but not halogen-free, so both requirements should be listed clearly when the project requires full compliance.
Q2: What is the standard halogen-free limit for PCB materials? A2: The common limit is chlorine ≤900 ppm, bromine ≤900 ppm and total halogens ≤1500 ppm. This limit should be written in the fabrication drawing or material specification to avoid vague material selection.
Q3: Does halogen-free PCB material have weaker flame resistance than standard FR4? A3:Not necessarily.A suitable laminate can still meet UL 94 V-0 flame resistance. The key is to confirm the laminate datasheet, UL rating and flame-retardant system before PCB production.
Q4: Is halogen free FR4 PCB material suitable for multilayer boards? A4:Yes. Halogen free FR4 PCB material is widely used for multilayer PCB manufacturing. For dense boards, high layer counts or lead-free assembly, high-Tg and high-Td grades are usually better.
Q5: When should I choose halogen-free CEM-3 PCB material? A5: Choose halogen-free CEM-3 PCB material for simple, cost-sensitive single-sided or double-sided boards. For multilayer boards, high thermal stress or tight dimensional control, FR4 is usually the safer choice.
Q6: Are halogen free PCB materials more expensive? A6:Usually yes.Halogen free PCB materials often cost more than standard FR4, especially high-Tg, low-Df or special-grade laminates. However, they can reduce compliance risk and improve export project acceptance.
Q7: Can a PCB be partially halogen-free? A7:Yes.A PCB may use halogen-free laminate but non-halogen-free solder mask, ink or adhesive. If full board compliance is required, the complete material system should be confirmed before production.
Q8: What failure problems are common with poor halogen-free PCB material selection? A8: Common risks include delamination, blistering, via cracking, CAF, pad lifting, impedance drift and poor soldering reliability. These issues can often be reduced by reviewing Tg, Td, CTE, Dk, Df and process suitability before fabrication.
Q9: Is halogen-free PCB material suitable for high-speed circuits? A9:Yes, but the grade matters. High-speed circuits require stable Dk, low Df and controlled impedance. Standard FR4 may work for moderate-speed boards, while high-speed applications should use suitable low-loss laminate.
Q10: How should I write halogen-free PCB material in a fabrication drawing? A10: Use a clear note such as “Compliant with IEC 61249-2-21, Cl ≤900 ppm, Br ≤900 ppm, total halogens ≤1500 ppm, UL 94 V-0, lead-free compatible.” Add the laminate grade if the project has strict reliability requirements.
Q11: Does halogen-free PCB material affect soldering performance? A11:Yes, it can.Tg, Td, moisture absorption and Z-axis CTE affect soldering reliability. For lead-free assembly, the supplier should confirm material heat resistance, baking control, surface finish and reflow compatibility.
Q12: What documents should a supplier provide for halogen-free PCB production? A12: A supplier should provide material datasheets, material declaration, RoHS/REACH statement, UL information, final inspection report and testing records. For high-reliability boards, microsection and impedance reports may also be required.
How Can You Start a Halogen-Free PCB Manufacturing Project?
A successful halogen-free PCB manufacturing project starts with clear material requirements and early production review. Before quotation, prepare Gerber files, stack-up, material notes, surface finish, quantity, testing requirements and assembly files if PCBA service is required.
For most projects, FR4 is a safe choice for reliability, while CEM-3 can be used for simpler cost-sensitive boards. If your project requires OEM manufacturing, ODM production, samples or mass production, contact our team for fast technical review and quotation support: sales@bestpcbs.com.
What is halogen free PCB, and why are more electronics manufacturers switching to it? As environmental regulations become stricter worldwide, halogen free PCB materialsare increasingly used in automotive electronics, communication devices, LED lighting, industrial equipment, and medical products.
Traditional PCB materials often contain bromine and chlorine flame retardants. Under high temperatures or fire conditions, these substances may release toxic gases and dense smoke. Because of this, many manufacturers now prefer halogen free PCB solutions that provide safer environmental performance and better compliance with global standards.
A halogen free PCB not only supports cleaner manufacturing, but also improves product safety, thermal reliability, and long-term sustainability. Today, these materials are widely applied in high-reliability electronic products where stable performance is important.
What is Halogen Free PCB?
What is halogen free PCB, and why are more electronic products using it today? Halogen free PCB refers to a PCB made without bromine or chlorine-based flame retardants. These materials help reduce toxic gas emissions during high-temperature conditions or fire exposure.
Traditional PCB materials often contain halogen compounds to improve flame resistance. However, when exposed to heat, these substances may release harmful smoke and corrosive gases. Because of this, many industries are shifting toward safer and more environmentally friendly PCB materials.
A halogen free PCB usually follows IEC 61249-2-21 standards. According to this specification:
Chlorine content must remain below 900 ppm
Bromine content must remain below 900 ppm
Total halogen content must stay below 1500 ppm
Today, halogen free PCB products are widely used in automotive systems, industrial equipment, LED lighting, communication devices, and medical electronics because they support cleaner manufacturing practices and improved product safety.
Why Use Halogen Free PCB?
Why use halogen free PCB instead of traditional PCB materials? More manufacturers are choosing these materials because they support environmental compliance, product safety, and long-term reliability. Main advantages include:
Reduce toxic smoke during overheating or fire exposure
Lower environmental impact during disposal and recycling
Meet RoHS and REACH environmental regulations
Improve safety for enclosed electronic products
Support sustainable manufacturing requirements
Help exported products comply with international standards
Provide stable thermal performance in demanding applications
Many industries now prefer halogen-free PCB materials because global environmental regulations continue becoming stricter every year.
What Materials Are Used in Halogen Free PCB?
What materials are commonly used in halogen free PCB manufacturing? Most halogen free PCB products use specially developed resin systems and laminates designed to replace traditional brominated flame retardants. Common halogen free PCB laminate materials include:
Halogen free FR4 epoxy resin
Phosphorus-based flame-retardant systems
Nitrogen compound resin systems
Halogen-free CEM3 materials
High Tg halogen-free laminates
Aluminum-based halogen-free materials
These materials maintain flame resistance while reducing hazardous substances. Many modern laminates also provide excellent thermal stability and reliable electrical insulation. Popular laminate manufacturers include:
Shengyi
ITEQ
Panasonic
Isola
Rogers
High-quality halogen free PCB laminate materials are important for products exposed to high temperatures or continuous operation.
What Applications Use Halogen Free PCB?
Where is halogen free PCB commonly used today? These PCB products are now found across many industries because they combine environmental safety with stable electrical performance. Common applications include:
Automotive control systems
LED lighting modules
Medical electronics
Industrial automation devices
Communication equipment
Consumer electronics
Power supply systems
Renewable energy equipment
Aerospace electronics
Smart home products
Automotive and medical industries especially prefer halogen free PCB materials because these applications require high reliability, stable thermal performance, and environmental compliance.
What Are the Requirements for Halogen Free PCB?
What requirements must a halogen free PCB meet before being used in electronic products? Besides reducing harmful substances, the material must also provide stable thermal performance, reliable insulation, and environmental compliance. Main requirements for halogen free PCB include:
Bromine content must be below 900 ppm
Chlorine content must be below 900 ppm
Total halogen content must be below 1500 ppm
Must comply with IEC 61249-2-21 standards
Must support RoHS and REACH environmental regulations
Should meet UL94 V-0 flame-retardant standards
Must provide stable thermal resistance during soldering
Should maintain good electrical insulation performance
Must have low moisture absorption
Should support reliable multilayer lamination
Surface finish compatibility should remain stable
PCB materials should pass electrical and reliability testing
Manufacturers should provide material traceability and certification reports
Many modern halogen free PCB materials also use high Tg resin systems to improve heat resistance and long-term reliability in automotive, industrial, LED, and communication applications.
Halogen-Free PCB vs FR4 PCB: What is Difference?
What is the difference between halogen-free PCB and standard FR4 PCB? Both materials are widely used in electronics manufacturing, but they differ in flame-retardant systems, environmental performance, thermal stability, and application suitability.
Feature
Halogen-Free PCB
Standard FR4 PCB
Flame Retardant Type
Phosphorus or nitrogen-based system
Brominated flame retardant system
Halogen Content
Very low or none
Contains bromine/chlorine compounds
Environmental Performance
More environmentally friendly
Standard environmental performance
Toxic Smoke During Burning
Lower smoke and gas emission
Higher toxic smoke emission
RoHS & REACH Compliance
Excellent compatibility
Usually compliant but depends on material
Thermal Stability
Higher in many grades
Standard thermal stability
Tg Performance
Often high Tg materials
Normal Tg or high Tg available
Electrical Insulation
Stable insulation performance
Good standard insulation
Moisture Resistance
Better in many laminate systems
Standard moisture resistance
Reliability in High Heat
Better for high-temperature environments
Suitable for general applications
Processing Difficulty
Slightly stricter process control
Easier standard processing
Material Cost
Slightly higher
Lower
Recycling & Disposal Safety
Safer and cleaner
Moderate
Typical Applications
Automotive, medical, LED, industrial control
Consumer electronics, standard electronics
Market Trend
Growing rapidly
Traditional mainstream material
What is the Manufacturing Process for Halogen-Free PCB?
How are halogen-free PCBs manufactured? The basic process is similar to standard PCB production, but material selection, lamination control, drilling quality, and testing require closer attention because halogen-free laminates use different resin systems.
1. Material Selection The manufacturer first selects suitable halogen-free PCB laminate according to the product application, layer count, Tg value, copper thickness, thermal demand, and compliance requirements. Common options include halogen-free FR4, high Tg laminate, CEM3 material, and aluminum-based material.
2. Material Inspection Before production, the laminate, prepreg, and copper foil are checked for thickness, surface quality, certification, and halogen content report. This step helps ensure the material meets IEC 61249-2-21, RoHS, REACH, and project requirements.
3. Inner Layer Imaging For multilayer PCBs, the inner copper layers are coated with dry film and exposed according to the circuit pattern. This step defines the inner layer traces and prepares the board for etching.
4. Etching and Inner Layer Inspection Unwanted copper is removed to form the required circuit pattern. After etching, the inner layers are inspected for open circuits, short circuits, line width, spacing, and copper residue.
5. Lamination The inner layers, prepreg, and copper foil are stacked together and laminated under controlled temperature and pressure. Halogen-free materials may need adjusted lamination parameters because their resin flow and curing behavior can differ from standard FR4.
6. Drilling Mechanical or laser drilling is used to create through holes, blind vias, buried vias, or microvias. Drilling quality is important because poor hole walls can affect copper plating and long-term reliability.
7. Desmear and Hole Metallization After drilling, resin smear inside the holes is removed. Then the hole walls are chemically treated and plated with copper to build electrical connections between layers.
8. Outer Layer Imaging and Etching The outer layer circuit pattern is created through imaging, plating, and etching. This step forms the final copper traces, pads, and connection areas on the PCB surface.
9. Solder Mask Application A solder mask is applied to protect the copper surface, prevent solder bridging, and improve insulation. The solder mask must be compatible with halogen-free PCB material and assembly temperatures.
10. Surface Finish A surface finish is added to protect exposed copper pads and improve solderability. Common options include ENIG, HASL, immersion silver, immersion tin, and OSP.
11. Legend Printing Component marks, logos, polarity symbols, and part numbers are printed on the PCB surface. This helps assembly teams identify placement direction and board information clearly.
12. Electrical Testing Each PCB is tested for open circuits, short circuits, and connection accuracy. This step helps confirm that the board matches the design files before shipment.
13. Reliability and Quality Inspection The PCB may go through visual inspection, AOI, impedance testing, solderability testing, thermal stress testing, and dimensional inspection. For high-reliability applications, extra checks can be added based on project requirements.
14. Final Cleaning and Packaging After inspection, the boards are cleaned, dried, vacuum packed, and labeled. Proper packaging helps prevent oxidation, moisture absorption, and surface contamination during storage and shipping.
Why Choose EBest for Halogen Free PCB Manufacturer?
Why choose EBest for halogen free PCB manufacturing? EBest Circuit has more than 20 years of PCB manufacturing experience and provides one-stop PCB solutions for global electronics industries.
Stable halogen-free PCB material sourcing helps improve long-term product consistency
High Tg laminate support improves thermal reliability in demanding applications
One-stop PCB fabrication and assembly services help reduce supplier management costs
PCB prototype and mass production support help shorten project development cycles
Fast-turn production service helps reduce urgent project lead time pressure
Some prototype orders can be shipped within 24 hours
Monthly production capability reaching 260,000 square feet
Strict quality inspection helps reduce manufacturing defects and reliability risks
Electrical testing and reliability verification help improve product stability
Support for multilayer and complex PCB structures helps simplify difficult projects
Automotive, industrial, and medical manufacturing experience helps support high-reliability applications
Support for RoHS, REACH, UL, ISO 9001:2015, ISO 13485:2016, IATF 16949, and AS9100D requirements
Component sourcing and PCB assembly services help simplify supply chain management
Stable international delivery capability helps improve project scheduling efficiency
From PCB prototype to mass production, EBest focuses on stable quality, fast response, and reliable manufacturing support for global electronics projects.
FAQs About Halogen Free PCB
Q1: Is halogen free PCB better than standard FR4 PCB?
A1: Halogen free PCB is often preferred for products that require better environmental performance, lower toxic emissions, and higher safety standards. Compared with traditional FR4 PCB, halogen-free materials can provide cleaner burning characteristics and stronger support for RoHS and REACH compliance.
Q2: Why are more electronic products using halogen free PCB?
A2: More electronic manufacturers are switching to halogen free PCB because environmental regulations are becoming stricter worldwide. Halogen-free materials help reduce harmful smoke, toxic gas emissions, and environmental impact during overheating or fire exposure.
Q3: Can halogen free aluminum PCB be used in high-power products?
A3: Yes. Halogen free aluminum PCB is widely used in LED lighting, automotive lighting, power modules, and industrial power supplies because it combines environmental compliance with excellent heat dissipation performance.
Q4: Does halogen free PCB cost more than standard PCB?
A4: In many cases, halogen free PCB materials are slightly more expensive because of specialized resin systems and stricter manufacturing requirements. However, the improved thermal reliability, environmental performance, and global compliance advantages often make the additional cost worthwhile.
Q5: What industries commonly use halogen-free PCB materials?
A5: Halogen-free PCB materials are commonly used in automotive electronics, communication systems, medical devices, industrial automation equipment, LED lighting products, aerospace electronics, and renewable energy systems.
Q6: How can I identify a reliable halogen-free CEM3 PCB material supplier?
A6: A reliable supplier should provide certified material reports, stable laminate sourcing capability, strict quality inspection, and support for RoHS, REACH, and UL compliance standards.
Conclusion
EBest provides high-quality halogen free PCB manufacturing services for industrial, automotive, medical, communication, and LED applications. From PCB prototype to mass production, EBest supports reliable fabrication, stable material sourcing, and fast delivery services. Contact us today for your PCB project inquiry: sales@bestpcbs.com.
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