ro3003 material

RO3003 is widely used across RF and microwave PCB because it offers stable electrical behavior, low loss, and smooth processing on modern PCB lines. Engineers often choose this laminate when they need predictable impedance, steady phase response, and strong thermal performance at high frequencies. Below is a comprehensive, fabrication-level RO3003 datasheet, covering electrical, mechanical, thermal, chemical, processing, and reliability properties.

Rogers RO3003™ Electrical Properties

Parameter	Condition	Typical Value	Notes
Dielectric Constant (Dk)	10 GHz (IPC-TM-650 2.5.5.5)	3.00 ± 0.04	Very stable across temperature and frequency
Dielectric Constant (Dk)	2.5 GHz	3.01	Suitable for wideband RF
Dissipation Factor (Df)	10 GHz	0.0010	Extremely low loss
Dissipation Factor (Df)	2.5 GHz	0.0009	Excellent for mmWave
Volume Resistivity	23°C / 50% RH	1.7 × 10¹⁰ MΩ·cm	High electrical insulation
Surface Resistivity	23°C / 50% RH	5.7 × 10⁹ MΩ	Stable in damp conditions
Electric Strength	0.5 mm thickness	35 kV/mm	Strong dielectric barrier
Impedance Stability	-40°C to +85°C	±1.3%	Very stable for antenna structures
Dk Temperature Coefficient (TCDk)	-40 to +85°C	-3 ppm/°C	Very low drift

RO3003 is chosen often for 77 GHz radar, 24 GHz radar, and mmWave antennas because of these stable dielectric properties.

RO3003™ Material Thermal Properties

Parameter	Typical Value	Notes
Thermal Conductivity	0.5 W/m·K	Higher than FR4
Usable Temperature Range	-55°C to +150°C	Suitable for automotive radar
Dimensional Stability (X/Y)	0.2–0.3%	Strong laminate stability
Coefficient of Thermal Expansion (CTE) – X	17 ppm/°C	Matches copper closely
CTE – Y	17 ppm/°C	Helps reduce expansion stress
CTE – Z	24 ppm/°C	Critical for microvias
Thermal Decomposition Temp (Td)	> 400°C	Much higher than FR4
Thermal Stress	288°C / 10 sec	No delamination
Specific Heat	1.0 J/g-K	Supports stable power handling

The matched X/Y CTE and moderate Z-axis CTE improve reliability in multi-layer RF boards, QFN modules, and BGA transitions.

RO3003™ Mechanical Properties

Parameter	Condition	Typical Value
Tensile Modulus (MD)	23°C	18,000 MPa
Tensile Modulus (CD)	23°C	17,500 MPa
Flexural Strength	23°C	340 MPa
Peel Strength	1 oz Cu, after thermal aging	8.0 lb/in
Density	—	2.1 g/cm³
Hardness (Shore D)	—	74
Moisture Absorption	48h @ 50°C water	0.02%

Low moisture absorption is one of the main reasons designers choose Ro3003 laminate for outdoor and long-range radio systems.

RO3003™ Chemical & Environmental Properties

Property	Typical Value
Flammability	UL 94 V-0
Fungus Resistance	Pass
Copper Corrosion Test	Pass
Water Absorption	0.02%
RoHS	Compliant
Lead-Free Assembly	Fully supported

The laminate performs well in harsh environments such as marine radar, industrial sensors, and automotive radar systems.

RO3003™ Thickness Availability

Standard Thickness	Inches	Mil	Notes
0.127 mm	0.0050″	5 mil	Very common for antennas
0.203 mm	0.0080″	8 mil	Good for compact RF paths
0.254 mm	0.0100″	10 mil	LNA/PA front-end boards
0.508 mm	0.0200″	20 mil	Many GPS modules
0.762 mm	0.0300″	30 mil	Lower insertion loss
1.524 mm	0.0600″	60 mil	Large antennas or radar

Copper foil options include:

Copper Type	Standard Weight	Notes
ED Copper	½ oz, 1 oz	Best for general RF
Reverse-Treat Copper (RTF)	½ oz, 1 oz	Better for low-loss designs
Rolled Copper	Limited	Used for bending applications

RO3003™ Available Panel Sizes

Panel Size	Notes
12″ × 18″	Most common
18″ × 24″	Higher utilization
24″ × 36″	For mass production
Custom Cuts	By manufacturer

Panel selection strongly affects Rogers 3003 price because utilization changes final cost.

RO3003™ Impedance Control Data

Line Type	Result on 10 mil RO3003	Notes
50 Ω Microstrip	~23 mil width	Typical, depends on copper
75 Ω Microstrip	~12 mil width	Used in satellite links
100 Ω Differential Pair	8–10 mil / 8–10 mil spacing	Depends on copper thickness
90 Ω Diff Pair	10–12 mil	Common in RF front ends

For mmWave (60–86 GHz), designers often use:

Feature	Typical Value
Via Stub Target	< 6 mil
CPWG Gap	6–8 mil
Bends	Avoid sharp angles

RO3003™ Reliability Properties

Test	Result
Thermal Cycling	Excellent stability
IST Test	Low via fatigue
PTH Reliability	Stable with standard processes
Solder Float	No blistering
High-Temp Exposure	No resin cracking
Multi-Reflow Test	Stable after 3× lead-free reflow

RO3003 is widely used in 77 GHz automotive radar because it withstands large temperature swings without drift.

RO3003™ Comparison Against Other Rogers Materials

Parameter	RO3003	RO4003C	RO4350B
Dk	3.00	3.38	3.48
Df	0.0010	0.0027	0.0037
Moisture Absorption	0.02%	0.04%	0.06%
Thermal Conductivity	0.5 W/m·K	0.3 W/m·K	0.6 W/m·K
Dimensional Stability	High	Medium	High
Fabrication Difficulty	Low	Very low	Low
Cost	Highest	Lowest	Medium
Best For	Radar, mmWave	General RF	Telecom, WiFi, RF modules

RO3003™ Material Stack-Up Examples

• 1- Layer RF Antenna Stack-Up

Layer	Material
Top Copper	18 μm RTF
Dielectric	RO3003 10 mil
Ground Copper	18 μm RTF

• 2-Layer Balanced RF Module

Layer	Material
Signal Layer	½ oz copper
RO3003 Core	20 mil
Ground Layer	1 oz copper

• Hybrid RF + Digital Stack-Up

Layer	Material
Top Copper	RF traces
RO3003	10 mil
Adhesive Layer	—
FR4 Prepreg	Standard
FR4 Core	Digital circuits
Bottom Copper	Ground / digital signals

If your next RF project involves RO3003 or other high-frequency laminates, our engineering team is ready to assist with simulations, stack-up proposals, prototype runs, and volume builds. You are welcome to contact EBest Circuit (Best Technology) for professional guidance and fast support as you move from concept to production.

Our teams support RF designers from the early stack-up stage through final production with careful engineering review, material guidance, and precise process control. Every PCB moves through certified systems, including ISO9001, ISO13485, IATF16949, and AS9100D, which gives customers confidence in long-term reliability.

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