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Top 10 Companies Using Polyimide Films in Flexible Circuit Manufacturing in China
Thursday, September 17th, 2026

Polyimide flexible circuit companies use polyimide film in flexible circuit manufacturing because it combines a thin dielectric structure with heat resistance, electrical insulation, dimensional stability, and reliable bending performance. In China, PI films are used in single-sided FPCs, double-sided flex circuits, multilayer FPCs, rigid-flex boards, coverlays, stiffeners, and high-frequency flexible interconnects.

In supplier catalogs, terms such as polyimide PCB, polyimide flexible circuit, and polyimide flex circuits may describe overlapping FPC constructions.

The following 10 companies were selected based on their publicly documented flexible-circuit manufacturing capability, use of polyimide or modified polyimide materials, manufacturing presence in China, application coverage, engineering support, and quality certifications. The order is intended as a supplier comparison rather than a strict ranking by revenue or polyimide-film consumption.

Top companies using polyimide films in flexible circuit manufacturing in China

1. EBest Circuit

EBest Circuit manufactures polyimide flexible PCBs and rigid-flex boards for projects ranging from prototypes to production. Its flex capability covers PI substrates, coverlay, stiffeners, adhesiveless constructions, controlled impedance, HDI features, and rigid-flex stackups. PCB fabrication, DFM, component sourcing, PCBA, and testing can also be coordinated within one project. EBest’s published capability covers 1–10 layer FPCs and rigid-flex constructions for more complex interconnects.

Location: Shenzhen, Guangdong, China

Services:

  • Polyimide flexible PCB manufacturing
  • Multilayer FPC
  • Rigid-flex PCB manufacturing
  • PI coverlay and stiffeners
  • Controlled-impedance flex circuits
  • DFM and stackup review
  • FPC assembly and turnkey PCBA

Industries Served: Medical, automotive, aerospace, industrial control, communication, consumer electronics, and compact electronic devices

Key Differentiators:

  • PCB fabrication and PCBA coordinated in one workflow
  • DFM review covering bend zones, coverlay, stiffeners, stackup, and assembly
  • Support for both flexible and rigid-flex constructions
  • Prototype through production support

Certifications: ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, RoHS, REACH

Polyimide flexible circuit structure with copper traces coverlay and bent flex section

2. Zhen Ding Technology / Avary Holding

Zhen Ding Technology operates a broad PCB platform covering FPC, rigid-flex, HDI, SLP, IC substrates, and modules. Its FPC products serve smartphones, notebooks, wearables, tablets, AR/VR devices, and other compact electronics. The group also develops high-frequency flexible interconnect technologies for advanced communication applications.

Location: Shenzhen, Huai’an, Qinhuangdao, and other mainland China production sites

Services:

  • High-volume flexible PCB manufacturing
  • Modified-polyimide flexible circuits
  • LCP flexible circuits
  • Rigid-flex PCB
  • HDI and SLP manufacturing
  • FPC module assembly and testing

Industries Served: Smartphones, notebooks, tablets, wearables, AR/VR, communication equipment, automotive electronics, smart home products, and medical devices

Key Differentiators:

  • Large-scale FPC manufacturing footprint
  • High-frequency flexible-circuit capability
  • FPC fabrication combined with module assembly
  • Broad PCB portfolio covering FPC, HDI, SLP, rigid-flex, and substrates

Certifications: ISO 9001, IATF 16949, IECQ QC 080000, ISO 14001, ISO 45001, ISO 50001, UL, CQC

3. DSBJ / MFLEX

MFLEX, part of DSBJ, manufactures flexible printed circuits on polyimide dielectrics with copper conductors and supports PI, modified PI, LCP, adhesive, and adhesiveless material systems. Its China manufacturing footprint includes facilities in Suzhou and Yancheng, with capabilities extending from FPC fabrication to component and module assembly.

Location: Suzhou and Yancheng, Jiangsu, China

Services:

  • Single-sided to multilayer FPC
  • PI and modified-PI flexible circuits
  • Adhesive and adhesiveless structures
  • Rigid-flex constructions
  • HDI flex and microvia processing
  • FPC component assembly
  • Module assembly and functional testing

Industries Served: Smartphones, notebooks, tablets, wearables, health electronics, IoT, smart home products, consumer electronics, and new-energy vehicles

Key Differentiators:

  • Dedicated FPCB fabrication and FPCA facilities in China
  • PI, mPI, and LCP material support
  • Static and dynamic flex capability
  • Fabrication, component assembly, and module integration

Certifications: ISO 14001, ISO 50001

Flexible circuit manufacturing and inspection in a modern China electronics factory

4. Shenzhen Kinwong Electronic Co., Ltd.

Kinwong manufactures single-sided, double-sided, and multilayer flexible PCBs with published capability up to six flex layers. Its FPC platform includes roll-to-roll processing, 50 ÎŒm microvias, 35/35 ÎŒm line/space, SMT, ICT, FCT, assembly, and 5G FPC simulation and testing.

Location: Shenzhen, Guangdong, China

Services:

  • Single-sided and double-sided FPC
  • Multilayer FPC up to six flex layers
  • Rigid-flex PCB
  • Roll-to-roll FPC production
  • Microvia and fine-line processing
  • Controlled-impedance flex
  • SMT, ICT, FCT, and assembly

Industries Served: Automotive, medical, industrial control, smart terminals, wearables, consumer electronics, telecom, and 5G products

Key Differentiators:

  • Roll-to-roll flexible-circuit production
  • Fine-line and microvia capability
  • FPC fabrication combined with assembly and testing
  • 5G FPC simulation, manufacturing, and testing support

Certifications: ISO 9001, ISO 13485, IATF 16949, ISO 14001, ISO 50001, ISO 45001, IECQ QC 080000, ISO/IEC 27001, ISO/IEC 17025

5. Suntak Technology Co., Ltd.

Suntak explicitly states that its flexible PCBs use polyimide substrates for three-dimensional dynamic wiring. Its published FPC capability includes structures below 0.2 mm, repeated bending, and 50 ÎŒm-level dense routing for mobile, automotive, medical, and communication applications.

Location: Shenzhen, Guangdong, China

Services:

  • Polyimide FPC manufacturing
  • Single-sided and multilayer flexible PCB
  • Rigid-flex PCB
  • Fine-line FPC
  • Thin flexible circuits
  • High-density flexible interconnects

Industries Served: Mobile phones, wearables, automotive electronics, laptops, tablets, 5G optical communication, medical devices, and consumer electronics

Key Differentiators:

  • Documented PI-based FPC production
  • Thin FPC structures
  • Fine routing for compact flex applications
  • Dedicated Shenzhen FPC manufacturing

Certifications: ISO 9001, IATF 16949, AS9100, ISO 13485, ISO 14001, ISO 45001, ISO/IEC 27001, IECQ QC 080000, SA8000, RBA

Single-sided double-sided multilayer and rigid-flex polyimide flexible circuit examples

6. JLCPCB

JLCPCB provides standardized polyimide flex PCB manufacturing through its online ordering platform. Its published FPC capability covers one-, two-, and four-layer flex circuits, 25 ÎŒm and 50 ÎŒm PI dielectric options, adhesive and adhesiveless PI, localized stiffeners, and controlled-impedance-compatible structures.

Location: China

Services:

  • 1–4 layer flexible PCB
  • Polyimide base material
  • Adhesiveless PI FPC
  • PI, FR4, and stainless-steel stiffeners
  • Coverlay processing
  • FPC prototyping
  • PCB assembly support

Industries Served: Consumer electronics, wearables, cameras, medical electronics, automotive electronics, education, startups, and product development

Key Differentiators:

  • Online instant quotation and ordering
  • Published standard PI stackups
  • 25 ÎŒm and 50 ÎŒm PI options
  • Strong fit for prototype and small-batch FPC orders

Certifications: ISO 9001, IATF 16949, ISO 13485, ISO 14001, UL, RoHS, REACH, ISO/IEC 27001

7. PCBWay

PCBWay supports flexible PCB and rigid-flex manufacturing with polyimide available as a primary flexible base material. Its online FPC configuration supports multilayer designs, PI stiffeners, coverlay, controlled impedance, multiple thicknesses, and custom flex constructions.

Location: Hangzhou, Zhejiang, China

Services:

  • Polyimide flexible PCB
  • Multilayer FPC
  • Rigid-flex PCB
  • Custom FPC stackups
  • PI stiffeners
  • Controlled impedance
  • PCB assembly and component sourcing

Industries Served: Medical electronics, robotics, automotive, consumer products, industrial equipment, communication devices, and R&D projects

Key Differentiators:

  • Broad online FPC configuration options
  • Polyimide and other flexible material choices
  • Custom multilayer FPC support
  • Flexible PCB, rigid-flex, assembly, and prototyping services

Certifications: ISO 9001, ISO 13485, IATF 16949, UL, RoHS, REACH, CE

8. Capel / Shenzhen Kaboer Technology Co., Ltd.

Capel is the brand used by Shenzhen Kaboer Technology for flexible PCB, rigid-flex, HDI, and PCBA manufacturing. Its current process capability lists flexible circuits from single-sided through multilayer constructions, rigid-flex boards, PI material processing, fine-line routing, impedance control, and IPC-6013 acceptance support.

Location: Shenzhen, Guangdong, China

Services:

  • Polyimide FPC manufacturing
  • Multilayer flexible PCB
  • Rigid-flex PCB
  • PI coverlay and stiffeners
  • Controlled impedance
  • HDI and fine-line flex
  • SMT assembly and PCBA

Industries Served: Medical devices, automotive, aerospace, UAVs, IoT, industrial control, telecommunications, AI hardware, EVs, and consumer electronics

Key Differentiators:

  • Wide published flex and rigid-flex layer range
  • Fine-line flex capability
  • FPC fabrication plus assembly support
  • Support for IPC-6013 flexible-board acceptance

Certifications: ISO 9001, ISO 14001, ISO 45001, IATF 16949, ISO 13485, GJB9001C, UL

Engineer evaluating flexible circuit stackup bend areas and supplier capabilities

9. XiangYuan Insulation Materials Co., Ltd.

XiangYuan differs from most companies on this list because its operations span polyimide film, FCCL flexible copper-clad laminate, and finished FPC manufacturing. This gives the company direct involvement in the flexible-circuit material chain rather than only PCB fabrication.

Location: Tianjin, China, with additional production bases in Jiangxi, Shenzhen, Zhuhai, and other locations

Services:

  • Polyimide film manufacturing
  • FCCL manufacturing
  • Adhesive and adhesiveless flexible materials
  • Single-sided FPC
  • Double-sided FPC
  • Flexible-circuit material development

Industries Served: Consumer electronics, communication equipment, computers, aerospace, military electronics, optoelectronics, and new-energy applications

Key Differentiators:

  • PI film, FCCL, and FPC within the same product chain
  • Direct polyimide-film manufacturing
  • 12.5 ÎŒm, 25 ÎŒm, and 50 ÎŒm PI film options
  • Strong fit where flexible material sourcing is important

Certifications: ISO 9001, ISO 14001, UL

10. Honflex Electronics

Honflex Electronics focuses heavily on flexible circuit manufacturing and serves high-volume electronics applications including smartphones, displays, wearables, automotive electronics, new-energy systems, and other compact products. Its FPC technology portfolio includes multilayer flex, fine-line structures, and high-frequency flexible interconnects.

Location: Xiamen, Fujian, China

Services:

  • Flexible PCB manufacturing
  • Multilayer FPC
  • Rigid-flex PCB
  • MPI high-frequency flexible circuits
  • HDI FPC
  • Fine-line flexible circuits
  • Automotive FPC and battery interconnect products

Industries Served: Smartphones, notebooks, tablets, displays, wearables, automotive electronics, new-energy vehicles, robotics, industrial electronics, medical products, and smart home devices

Key Differentiators:

  • FPC-focused manufacturing platform
  • High-frequency flexible-circuit capability
  • Fine-line and HDI FPC structures
  • Dedicated automotive and new-energy flex products

Certifications: ISO 9001, IATF 16949, IECQ QC 080000, ISO 14001, ISO 45001, ISO 50001, ISO/IEC 27001, UL

Medical automotive wearable consumer electronics and communication products using flexible circuits

FAQs

1. Why is polyimide film widely used in flexible circuit manufacturing? Polyimide combines flexibility, heat resistance, electrical insulation, and dimensional stability. It can tolerate PCB fabrication and assembly temperatures while remaining thin enough for flex and rigid-flex structures.

2. What polyimide thickness is commonly used in flexible PCBs? Common PI base-film thicknesses include approximately 12.5 ÎŒm, 25 ÎŒm, and 50 ÎŒm. The final thickness depends on the FPC stackup, bend radius, copper construction, and mechanical requirement.

3. What is the difference between adhesive and adhesiveless polyimide FPC? Adhesive FPC uses a separate bonding layer between copper and polyimide. Adhesiveless material removes that separate adhesive layer, reducing the dielectric build and making it useful for thinner or repeatedly flexed constructions.

4. Can Chinese FPC manufacturers provide both fabrication and assembly? Yes. Several companies on this list combine flexible-circuit fabrication with component assembly, testing, or module integration.

5. What should I send a polyimide FPC manufacturer for quotation? Send the Gerber or ODB++ files, stackup, PI material requirement, copper weight, finished thickness, bend radius or flex-cycle requirement, coverlay, stiffener details, surface finish, impedance targets, quantity, and BOM/CPL files when assembly is required.

Looking for a Polyimide FPC Manufacturer in China?

Choosing a flexible circuit supplier is not only about whether the factory can process polyimide. PI thickness, copper type, adhesive system, coverlay, bend-zone layout, stiffener design, impedance, and assembly conditions all affect the finished FPC.

EBest Circuit supports polyimide FPC and rigid-flex PCB fabrication, DFM review, component sourcing, and PCBA for prototype and production projects. If you are developing a new flexible circuit, send your Gerber files, stackup, bend requirements, and assembly specifications to sales@bestpcbs.com for engineering review.

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Polyimide PCB Manufacturer in China, Over 18 Years
Monday, July 21st, 2025

Why choose polyimide PCB?‌ This guide details their critical properties, thickness, thermal conductivity, pros and cons, manufacturing processes and applications.

Are you still troubled by these problems?

  • Complex circuit design leads to low yield?
  • Traditional materials degrade in humid environment?
  • Does micro-aperture processing affect circuit accuracy?

EBest Circuit (Best Technology) äžšPolyimide PCB Manufacturer in China Over 18 years:

  • High-precision graphic transfer technology: using laser direct imaging (LDI) process, line width/line spacing up to 25ÎŒm, yield increased by 30%.
  • Ultra-low water absorption material: 0.2% water absorption formula, insulation resistance retention rate in humid environment> 95%.
  • Precision micro-hole processing: CO2 laser + UV laser combined drilling, aperture accuracy ±15ÎŒm, hole wall roughness <10ÎŒm.

Welcome to contact us if you have any request for polyimide PCB: sales@bestpcbs.com.

What Is Polyimide PCB?

A polyimide PCB is a flexible printed circuit board utilizing polyimide as its dielectric substrate, providing remarkable flexibility for repeated bending, folding, or twisting without mechanical damage. This polymer offers exceptional thermal stability, handling temperatures up to 400°C, a low dielectric constant near 3.5, and high tensile strength, making it suitable for electronics requiring dynamic movement or intricate three-dimensional packaging.

Commonly applied in neural implants and wearable devices, these PCBs enable reliable electrical connections in space-constrained environments while maintaining performance under stress. Fabrication involves microelectronics-compatible techniques, supporting mass production for high-density interconnects across medical and consumer applications.

What Is Polyimide PCB?

How Thick Is a Polyimide PCB?

Core Material Thickness

  • Base Polyimide Film‌: Typically ‌12.5 ÎŒm to 100 ÎŒm (0.0005–0.004 inches)‌, with ‌25 ÎŒm (0.001 inch)‌ and ‌50 ÎŒm (0.002 inches)‌ being industry standards.

Total Stackup Thickness

  • Single-Layer Flexible PCB‌: ‌50–125 ÎŒm (0.002–0.005 inches)‌ when combined with copper foil (9–18 ÎŒm).
  • ‌Multi-Layer Designs‌: Ranges ‌up to 0.3 mm (0.012 inches)‌ for 4–6 layer configurations using adhesive bonding.

Influencing Factors

  • Copper Foil‌: Ultra-thin ‌9–18 ÎŒm‌ electrodeposited copper reduces bulk.
  • ‌Adhesive Layers‌: Bonding films add ‌10–25 ÎŒm‌ per layer; adhesive-less laminates reduce total thickness to ‌30 ÎŒm‌.
  • ‌Stiffeners‌: Localized PI or steel reinforcements (‌0.1–0.3 mm‌) enhance connector zones.

Polyimide PCB Material Data Sheet & Properties

Property CategoryTest ParameterTest StandardValue with UnitCharacteristics
Physical PropertiesDensityASTM D7921.43 g/cmÂłLightweight design advantage
Water AbsorptionASTM D5700.3%Low moisture absorption for high-frequency stability
Flammability RatingUL94Non-flammableComplies with aerospace safety requirements
Mechanical PropertiesTensile StrengthASTM D63890 MPa3× stronger than FR-4 substrates
Elongation at BreakASTM D6386-8%High ductility for dynamic bending applications
Flexural StrengthASTM D79098 MPaSupports 5mm bend radius designs
Thermal PropertiesHDT @1.82MPaASTM D648360℃Withstands reflow soldering
Continuous Operating Temp.UL746B260℃Suitable for automotive electronics
CTE (Z-axis)ASTM D6961-5×10⁻⁔ /℃Matches copper foil expansion (Cu: 17×10⁻⁶/℃)
Electrical PropertiesDk @1MHzIEC 602503.4 Low signal loss for high-frequency transmission
Volume ResistivityIEC 6009310Âč⁷ Ω·cm100× higher insulation than standard materials
Dielectric StrengthIEC 60243110-120 kV/mmSuperior high-voltage breakdown resistance
Special PerformanceFlex Life @5mm radiusIPC-6013D>100,000 cyclesValidated in smart wearable devices
Peel Strength (Cu foil)IPC-TM-650≄1.0 N/mmEnsures flex circuit reliability
Min. Line Width/SpacingIPC-222330/30 ÎŒmUltra-high-density routing capability

What Is the Thermal Conductivity of Polyimide Flex PCB?

Material TypeThermal ConductivityEnhancement Mechanism
Pure Polyimide (PI)0.18 W/(m·K)N/A (base material)
PI/CNNS Nanocomposite2.04 W/(m·K) (+1033%)CNNS in-plane self-orientation
Graphene-PI CompositeUp to 739.56 W/(m·K)Layered graphene thermal networks

What Are the Pros and Cons of Polyimide Circuit Board?

Pros (Advantages)‌

  • High wiring density and miniaturization‌: Enables compact designs for space-constrained applications like mobile devices or wearables.
  • Lightweight and thin profile‌: Reduces overall weight and thickness of electronic products, ideal for portable electronics.
  • Excellent flexibility and durability‌: Can withstand millions of dynamic bends without wire breakage, supporting complex 3D assemblies.
  • Versatility in spatial layout‌: Allows arbitrary scaling and movement in three-dimensional space for integrated component connections.
  • Broad applicability‌: Suitable for high-reliability fields such as aerospace, military, and digital cameras due to robust insulating properties.

Cons (Disadvantages)‌

  • High initial cost‌: Design, routing, and photographic processes are expensive due to specialized manufacturing requirements.
  • Limited use for general applications‌: Typically justified only for specific needs, not cost-effective for standard PCBs.
  • Maintenance challenges‌: Repair and rework, such as soldering, require trained personnel to avoid damage.
What Are the Pros and Cons of Polyimide Circuit Board?

What Are Applications of Flexible Polyimide PCB?

Applications of Flexible Polyimide PCB

  • Consumer Electronics – Foldable displays (smartphones/tablets).
  • Aerospace – High-temperature wiring in satellites/spacecraft.
  • Medical Devices – Wearable sensors (ECG patches/implantable modules).
  • Automotive – Battery management systems (EVs) & autonomous vehicle sensors.
  • Industrial Automation – Flexible joints in robotic arms/motion control systems.
  • Energy – Solar panel interconnections (flexible photovoltaic modules).
  • Telecommunications – High-frequency signal routing in 5G/mmWave devices.
What Are Applications of Flexible Polyimide PCB?

How Are Polyimide PCBs Manufactured?

Manufacturing Process of Flexible Polyimide PCBs

1. Material Preparation

  • Base Film: Polyimide (PI) film (12.5–50”m) selected for thermal stability (Tg > 250°C).
  • Adhesive Coating: Epoxy/acrylic adhesive applied to PI film for copper bonding.

2. Copper Cladding

  • Lamination: Adhesive-coated PI film laminated with electrolytic copper foil (1/3–2 oz) at 180–200°C.
  • Temporary Carrier: Aluminum/steel carrier attached for ultra-thin FPCs to prevent warping.

3. Circuit Patterning

  • Dry Film Application: Photosensitive dry film laminated onto copper.
  • Exposure & Development: UV light exposes circuit pattern; unexposed areas washed away.
  • Etching: Ferric chloride/alkaline etching removes unprotected copper (line width/spacing ≄25”m).

4. Coverlay Application

  • PI Coverlay: Second PI film with adhesive laminated over circuits for protection.
  • Laser Ablation: CO₂ laser drills precision holes (via/pad openings).

5. Plating & Surface Finish

  • ENIG Plating: Electroless nickel/immersion gold applied to pads for solderability.
  • Stiffener Bonding: FR4/PI stiffeners attached to connector zones via thermal bonding.

6. Testing & Inspection

  • AOI: Automated optical inspection for defects (open/short circuits).
  • Electrical Testing: Flying probe/bed-of-nails tests verify continuity/impedance.

7. Cutting & Forming

  • Laser Cutting: Precision shaping of FPC outlines.
  • Bending Test: Flexibility validation (1,000+ bend cycles at 180°).

8. Final Cleaning & Drying

  • Ultrasonic Cleaning: Removes residual particles from etching/plating.
  • Baking: FPCs dried in 80–100°C oven to eliminate moisture.

9. Packaging

  • Anti-Static Protection: FPCs placed in anti-static bags with desiccant packs.
  • Cushioning: Foam inserts or vacuum-formed trays used to prevent movement.
  • Labeling: Barcode/QR code labels include product ID, batch number, and RoHS compliance.

10. Quality Final Check

  • Visual Inspection: Confirm no scratches, folds, or contamination.
  • Electrical Recheck: Sample testing for critical parameters (e.g., impedance).
How Are Polyimide PCBs Manufactured?

Polyimide PCB Manufacturer in China – EBest Circuit (Best Technology)

Reasons why choose us as polyimide PCB manufacturer:

  • 24-hour rapid prototyping: shorten the R&D cycle by 50% and accelerate product launch.
  • 1 Piece MOQ: zero inventory risk, trial production cost reduced by 90%.
  • Competitive & Transparent Pricing – No hidden costs, offering the best value without compromising quality.
  • Turnkey Solutions – Full-service PCB manufacturing from design to delivery, accelerating your product’s time-to-market.
  • ISO 14001/ISO 13485 certification: medical/automotive customers are exempt from secondary testing, and compliance costs are reduced by 30%
  • 0.075mm ultra-thin substrate processing: folding screen FPC thickness is reduced by 40%, and the bending life reaches 200,000 times.
  • Mature blind and buried via technology: circuit density increased by 40%, adapting to the needs of 5G modules/medical implants.
  • Free DFM (Design for Manufacturability) Analysis: Optimizes PCB layouts to reduce material waste, lower production costs, and avoid late-stage design revisions.

Please feel free to contact EBest Circuit (Best Technology) if you have any inquiry for polyimide PCB: sales@bestpcbs.com. Looking forward to hearing from you soon!

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