Archive for the ‘Our News’ Category

The Advantages of Surface Mount Technology of a printed circuit board

Friday, March 19th, 2021

Surface-Mount Technology has been the industry standard for assembling printed circuit board. It has maintained its popular due its wide array of advantages and relatively few drawbacks. For more than 15 years’ experience, Best Technology has been offering surface-mount service for worldwide customers, and SMT service become a great part of our business.

See some photo which we are do assembly for our customer this month.

SMT 1

Top Advantages of Surface-Mount Technology

Smaller size and reduced weight are the two main advantages to SMT. Components can be aligned closer together and end products will be more compact and light weight.

SMT 2

Here are additional benefits of SMT:

1.Component placement auto correctly – there is no alignment between the PCB solder pads and components pads to avoid placement errors.

2.Low cost:

The advantage of small size up to 0201. One set, SMT typically requires lower production costs than through-hole placement. The size of the board is reduced, the number of drilled holes is reduced, and routing of traces is reduced. So bring down the cost of the whole project.

3.Design flexibility – You can combine through-hole technology and SMT manufacturing on the same board for greater functionality.

4. Printed circuit boards created with the SMT process are more compact, providing higher circuit speeds. (This is the main reasons most manufacturers choose for this method.)

5.Higher circuit speeds – Most manufacturers rate this the number-one benefit.

Lower resistance/induction – High-frequency performance reduces unwanted consequences of RF signals.

6. Quick Turn Around

Using Surface-Mount Technology, it can save lots of time, SMT is a much more streamlined manufacturing process compared to through-hole. Time is saved because components are applied using a solder paste instead of drilling holes in the PCB

7. Quantity – More components can be positioned using both sides of the circuit board, creating more connections for each component. Fewer circuit boards are needed for devices.

8. Stability – Better performance delivery is realized with vibration mechanical conditions. SMT connections are more reliable, it can reduce the dis connection risks during the final test.

SMT 3

Best Technology offers expert surface-mount technology services in China, along with manufacturing bare printed circuit board, flexible circuits, and MCPCB fabrication. With more than 15 years rigid PCB board experience, Best Technology has the resources, equipment, and know-how to produce your PCBs quickly and reliably.

different assembled board photo

Call Best Technology now and let us become your partner of PCB assembly service.

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High-TG FR4 Printed Circuit Board

Thursday, December 31st, 2020

If you work in Printed Circuit Board industry, you may know a normal PCB FR4-Tg is 130-140 degrees, the medium Tg is greater than 150-160 degrees, and High-TG FR4 Printed Circuit Board is greater than 170 degrees.
And what is a High-TG FR4 Printed Circuit Board? High-TG PCB is another name for a high-temperature FR4 PCB, it means the printed wiring boards designed to endure for extremely high-temperature. A Printed Circuit Board is defined as high-TG FR4 PCB if its glass transition temperature (TG) is higher than 170 degrees Celsius. High-TG FR4 will have better mechanical and chemical resistance to heat and moisture than standard FR4. The higher the TG value, the better the temperature resistance of the material, so High-TG FR4 is more and more popular particularly working in high power industry.
Best Technology can provide many different High-TG FR4 material for Rigid Circuit board, Typical High-TG FR4 PCB material including: ITEQ-IT-180A, ISOLA 370HR, ShengYi S1000-2 and etc.

Part of the inventory of raw material-1
Part of the inventory of raw material-2
Part of the inventory of raw material-3

From the following PCB picture, you can see the normal TG130 FR4 PCB substrate is not only softening, deformation, melting, as well as other phenomenon working under high temperatures, but also there is a sharp decline in electrical properties, which will effect on product life.

Solder mask blistering-1
、Solder mask blistering-2

If your FR4 Printed Circuit Board or PCBA board appear to above problems, then you should consider to use a High-TG FR4 Rigid Circuit Board. it may be catching your interest willing to understand a little bit more about High-TG FR4 printed circuit boards. Because High Tg Rigid Circuit board have a better stability at high temperatures, the substrate provides better heat resistance, mechanical and chemical stability for the circuit board.

BPM20396)

Properties/ Applications of high Tg PCB
With the rapid development of electronics industry, High-TG FR4 PCB is widely used in Uninterrupted Power Supply, precise instrument as well as industry. High-TG FR4 PCB material probably designed for the high functionality, high multi-layer development high-density circuit; higher heat resistance and high-density surface mounting technology (SMT). So, the demand on High-TG FR4 PCB material become more widely used PCB manufacturing.
What’s more, High TG material is also popular in LED lighting industry, because heat dissipation of LED is higher than normal electronic components, but same structure of FR-4 board is much cheaper than metal core PCB, such as aluminum PCB.
High-TG FR4 PCB materials have the following properties:
 Resistance to high temperatures
 Long delamination durability (aging of materials to consider for safety reasons)
 Low thermal expansion
Excellent PTH reliability
Good mechanical properties
High temperature durability
High value of thermal stress resistance
high temperature durability
long delamination durability
Low Z axis expansion (CTE)

BPM19308

Advantages of High-TG FR4 PCB
Higher stability: it will automatically improve the heat resistance, chemical resistance, moisture resistance, as well as stability of the device if increasing the TG of a printed circuit board substrate.
Bear high power density designs: high TG PCB will be a good solution for heat management if the device has high power density with quite high heat generation rate.
It can achieve with using a larger printed circuit board to change the design and power requirements of a device when reducing the heat generation of ordinary board, what’s more, it also can use the high TG PCB.
Ideal for multilayer & HDI PCBs: there will lead to high levels of heat dissipation because multilayer & HDI PCBs are more compact and have dense circuits. So high TG PCBs are often used for the multilayer & HDI PCBs so that it can make sure reliability in Printed circuit board fabrication.

BPM20005 TOP
BPM20005 BOT

 If your applications are in any danger of subjecting your PCBs to extreme temperatures or the PCB is required to be RoHS Compliant, it will be in your best interest to look into high-TG FR4 PCBs.
Come to contact Best Technology Co., Limited. for High-TG PCB assistance. we can help you determine if you need high-temperature printed circuit boards and direct you to which specific boards are likely to be useful for your design and application. If you are transitioning to RoHS or just need more information about the High TG laminates, just give us a call and we’ll be happy to accommodate you. contact us online right now.

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What’s the Countersink and counter bore on a PCB drawing?

Wednesday, September 30th, 2020

Firstly, do you know what’s a countersink and counter bore?

By definition, a countersink is a stepped hole, which can allow the fasten parts head to sink fully to the parts.

With counter sink on your design, the tapered head of a screw can sit flush with the top of the laminate, commonly countersink is used to install bolts or other connecting parts.

Below is the example for the hole drawing and picture for a countersink:

Picture: counterbore holes attributes

To drill your countersunk holes accurately in our PCB fabrication plant, the following information is need to be defined when you supply the PCB drawing for us to make the PCB:

  • Which side of the board is the countersink hole should be drilled, on top or bottom?
  • Is the sink and shaft to be through plated or non-plated?
  • Taper angle or countersink angle. 82°, 90°,120° etc.
  • Countersink diameter of top
  • Countersink diameter of bottom (body)
  • Depth of the countersink is to be drilled(the height of the screw to determine the countersink depth.

By comparison, a counterbore makes a flat-bottomed hole and its sides are drilled straight down. This is usually used when a fastener such as a bolt or cap head screw is required to sit flush with or below the level of a surface.

Below is the drawing and picture for a countersink.

Same as the countersink, the counterbore holes attributes drawing is needed to supply with your PCB drawing when fabricate the counterbored holes. But for counterbore on PCB, because the sides of the hole are always parallel, there is no need to specify the angle.

With below drawing, believe it will be more helpful for you to understand the difference for a counter sink hole and counterbore on the printed circuits board.

If need to have any question regarding the counter sunk or counter board on a PCB drawing, please contact us feel free.

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What are the factors affecting cost of the MCPCB?

Tuesday, September 29th, 2020

Best Technology considers all the factors affecting the cost of MCPCB production while formulating final cost structure. Many customers contact us to know the factors which affecting the price. The factors are Size & Thickness, Number of layers, Cu Thickness, Thermal Conductivity, Surface Finishing etc.

Size & Thickness: Since larger boards require more material.

As you know, 1.6mm is the standard thickness, if you choose non-standar thickness (Thicker or thinner than 1.6mm), sometimes the price will need to increase, it depend on the layers of your MCPCB.

The different number of layers and manufacturer technology:It’s the main factor for affecting the manufacturing price, therefore the circuit board designing is done in such a manner that it comprises a minimum number of circuit layers. 

Thermal Conductivityis one of the most important performances of MCPCB, the higher the thermal conductivity is, the more expensive the price is. At present, the highest thermal conductivity we can provide is 8W/m.K, the commonly used thermal conductivity is 1-3W/m.K

Cu Thickness: The cost will be more expensive if the copper is thicker. We can provide 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 10 OZ.

Surface Finishing: The common Surface Finishing for MCPCB is HASL_LF, OSP  ENIG (The normal thickness of gold is 1u’’). ENIG is more expensive since the gold is expensive and it with good performance for protecting the surface from oxidized.

ENIEPIG is good for wire bonding (the normal thickness of gold is 3u”).

We always strive to formulate a competitive price structure for our customers, this enables to have a considerable reduction in the total prices and deliver superior quality services to them. If you would like to know more about MCPCB, please directly contact our sales Tammy

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What is an HDI FR4 PCB?

Wednesday, September 16th, 2020

HDI abbreviation means High Density Interconnect. HDI PCBs have extremely density trace spaces and lines, micro vias under 0.25mm(10mil), smaller pads and higher connection pad density. See the photo of HDI board laser drill& prepreg thickness ratio.

It is very helpful in enhancing electrical performance and HDI PCB use for high-end products and HDI PCB is regularly used in 4G network communications, medical, Military and Aerospace. See the HDI board which Best Tech made for customers.

HDI PCB is the better option for high-layer count and costly laminated boards. Due to the increasing complexity of design structures laminate, the Blind vias and Buried vias are increasingly used in high-density circuit boards (HDI PCB board). Best Tech always improved manufacture capability for HDI, following production capability of the comparison for 2020 and the capability which Best Tech want to achieve at year 2021.

Following is the advantages to use an HDI PCB

The common reason for using HDI technology is a significant increase in packaging density. In addition, overall space requirements are reduced will result in smaller board sizes and fewer layers. 

1.Denser trace

2.More stable performance

3.Reduce interference inductance and capacitance effects

4.Improve signal integrity in high-speed design

5. Reduce frequent relocation of components

What’s mean for a blind via hole?

It is a hole runs from an outer layer, but not through the entire PCB. These holes can be drilled mechanically or using laser technology.

And what’s mean for a buried via hole?

This is a hole that runs between one or more inner layers. They are normally mechanically drilled.

By the way, we would like to make some explain for the through via hole, see attached photo to know the detail.

Do you want to know the different types for HDI PCB boards?

The following photos mainly shows the different laminate structures available from Best Tech for HDI PCB for prototype and mass production.

What is the minimum pad size of hole on the outer and inner layer?

This is different from manufacturer to manufacturer, but in general you can say that the majority of manufacturers can produce them as follows:
A = 0.10 mm
B = 0.15 mm
C = 0.20 mm

Finally, here is an 8L HDI FR4 PCB which we made for our customer at June. See the stack up information.

Surface finish: ENIG(2u”)

Features

1. 3+(2)+3  HDI FR4 PCB board

2. L1 L2、L2 L3、 L3 L4、 L5 L6、 L6 L7、 L7 L8 laser blind hole, micro via size:0.15mm

3. L3、L6 mechanical blind hole, hole size:0.25mm, through hole:0.3mm

4. minimum trace width and space is 3/3mil

5. Finished board thickness: 1.3±10%

6. following is the stack up information

For more information for HDI PCB, welcome to send any query to Best Tech for advice.

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Why don’t use BeO as substrate to make DBC ceramic PCB?

Wednesday, September 9th, 2020

It is widely known that BeO with high thermal conductivity (200-250W/m.k).

High dielectric constant 6-7 (0.1MHz) and dielectric loss tangent is 10-4 (0.1GHz).

It is ideal material for ceramic PCB, lots of engineers want to use it as DBC ceramic PCB substrate.

But it is unfeasible, the powder of BeO is extremely poisonous.

The poison gas is produced by the reaction between oxygen, Cu and BeO under

1065-1085 degrees Celsius, so it is limited to make cooper on BeO substrate,

it has caused AlN (Aluminium Nitride) is becoming more and more popular.

Though BeO is unfeasible for DBC technology, but it is feasible for thick film technology.

Because when doing the conductor (Au or AgPd) on BeO substrate, we use silk-screen printing, no need to under high temperature environment, there is no chemical reactions.

Below the manufacturing process for your reference.

Here is the photo of BeO with AgPd conductor.

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How to prevent the FR4 PCB bended and warped after reflowing?

Wednesday, August 19th, 2020

Everyone may know that PCBs are easy to be bended or warped when get through the reflow process. Do you how to avoid this issue? here are some advices your reference.

  1. Reduce the effect of temperature on PCB board stress

Due to the “temperature” is the main source of stress for board, so as long as the temperature of the reflow oven reduce the temperature or slow the speed of warming up and cooling down in the reflow oven, the board bending and warping issue can be reduced. But it may be occurring other issues, such as short circuit when soldering. See Best Tech make control for the temperature of the reflowing process.

reflow machine

 2. Use high Tg plate

 Tg is the glass transition temperature. The lower of the Tg value, the faster of board starts to soften after finishing reflowing, and deformed of the board become more serious. if use of higher Tg 170 material can increase the ability to withstand stress deformation, but the price of TG170 material is higher. See the stock of high Tg material from Best Tech.

Use high Tg plate

3. Increase the board thickness

If final application allowed, we recommend 1.6mm thickness to prevent the risk of board bending. Best Tech can provide PCB board thickness to 4.5~8.0mm.

PCB board thickness
  • Try to reduce the size of the board and the number of panels during design

 Since most reflow oven use chains to driving the board forward, if larger size of the FR4 PCB, the own weight will be deformed in the reflow oven, so during design try to design the long side of the PCB as a board edge, it can reduce the deformed. And

Same reason, if there are many PCBs in a big panel, PCB will be bigger and heavier, when get through the oven, the speed in the oven will be slowly and it will influence the deformed of the PCB. See following PCB board, we only panel 1 single piece into a panel to keep the size of FR4 PCB panel not bigger.

pcb
pcb

5. Use the reflow carrier/tray

If above methods cannot get a good result for deforming, you maybe can use a reflow carrier/tray to reduce the deformation. The reason reflow tray can fix the circuit board, after the temperature of the printed circuit board is lower than the Tg value, it can maintain the original size.

pcb in tray

6. Use Router instead of V-Cut

Since V-Cut will destroy the structural strength of the panels, try to use Router PCB board or just reduce the depth of the V-Cut will helps the deform issue.

pcb
pcb

If you want to know more about how we control the bended and warped for PCB, you are welcome to contact us.

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What’s the advantages for AMB ceramic PCB comparing with DPC, DCB, LTCC, HTCC, thick film ceramic PCB?

Tuesday, August 18th, 2020

As we know, there are all kinds of ceramic PCB, DPC ceramic PCB, DBC ceramic PCB, LTCC ceramic PCB, HTCC ceramic PCB, thick film/thin film ceramic PCB.

Very few people know that there is AMB (Active Metal Bonding) ceramic PCB.

Do you know what’s the advantage for AMB ceramic PCB compare with other ceramic PCB (Al2O3/AlN/BeO/Si3N4 PCB)?

For AMB PCB, the substrate can be AlN ( Aluminium Nitride) and Si3N4 (Silicon Nitride) normally, AlN is the most popular. It is widely known that AlN with very high thermal conductivity ( Theoretical Value is 320W/m.k).

Using AMB technology to combine the oxygen-free copper and AlN material under high temperature, AlN with smaller thermal resistance, lower coefficient of thermal expansion and more stable partial discharge capability.

Compared with the traditional DBC or other substrate, the Aluminum Nitride copper-clad ceramic substrate made by the AMB technology with higher bonding strength of the copper layer and better cold and hot cycling characteristics.

So it  is widely used in the field of IGBT, especially for the high-power device control module.

AMB with competitive price and the copper thickness can be much thicker.

AlN max 300um
Si3N4 max 1200um

For more details, please contact me sales@bestpcbs.com 
I will update the manufacture process at the end of this month.

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What are the Differences between Double Sided MCPCB and Double/Two Layers MCPCB?

Friday, August 14th, 2020

Metal Core PCB are differentiated on the basis of their construction, which can be divided into following types: single layer, double/two layers, double sided, and multi layer. The double sided and double/two layers MCPCB are commonly used in advanced electronic circuits, some people may be confused about them due to their similar names. So in this blog I’d like to share with you the differences between the two types. 

Actually the main difference is the double sided and double/two layers MCPCB have different layout due to the positioning of the metal core.

Double/two layers MCPCB

As you can see the following stack up, the metal core is at the bottom, with two copper layers on top side, the dielectric layer is between the copper layer and the bottom metal base. In short, the conductor layers is in same side of the metal core. The components can only be assembled on the top layer.

double/two mcpcb stack up
double/two mcpcb

Double sidedMCPCB

As you can see the following MCPCB stack up, the metal core is in the middle of two conductor layers. There is also a dielectric layer between the metal core and a copper layer. The metal core and conductors are connected to each other through PTH (Plated Through Hole). The components can be assembled on both the bottom and top.

double sided mcpcb stack up
double sided mcpcb
Double sided MCPCB

Both double sided and double/two layers aluminum/copper core have the good heat dissipation, reliable performance at high temperatures and excellent thermal expansibility, according to our experience, for the same design, the heat dissipation on Double Sided MCPCB is a little better than Double Layers MCPCB.

The choice of the either type will depend on customer’s application requirements. If you are still confused about the two types and their benefits for your application, please feel free to contact Tammy (Email:sales9@bestpcbs.com), the Metal Core PCB International Sales in Best Technology.

Welcome to visit our website to learn more about us, we can provide different types of MCPCB in diverse specifications.

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How to avoid circuits issue while the production process ?

Monday, July 13th, 2020

As we all know, the short & open circuits is a very common issues for the Printed Circuits Board, especially for the extra thin PCB, because its substrates thickness are very thin, generally from 0.4mm-0.15mm, so the circuits will be easy to be broken if we didn’t control the production process well.

So, you may want to know, as an experienced PCB manufacturer, what we will do to avoid the circuits issues?

Here let me show you what we do:

Firstly, after the process of copper plating, we will put the boards into our washing line to remove those drilling burr, surface oxide layer, etc.  To make sure the boards are fully clean before start the traces making process.

pcb washing
pcb washing

Actually, most of the open and short circuits problem are caused by the film scratching, so each operation while the pattern transfer process is very important.

That’s also why the exposure and developing need to be processed in the dust-free workshop. We will use the rack to place each PCB board separately, to avoid the touching between PCB.

pcb explosure and developing
pcb explosure and developing

After the circuits etching out, we will take the boards to do the AOI testing, to check if there are any broken circuits, short gaps, protrusions, copper surface garbage and other problems. If there is, our machine will alert the problem, and we will fix the problem or scrap the defectives boards, with this process to prevent the defective boards move to the next step.

Most importantly is that we will do the first article inspection for all the boards, as long as we found the circuits issues while the AOI process, we will not take the whole batch boards go ahead.

aoi testing
aoi testing

Besides, the operation standard while the etching process is also very important for how the traces being. So, our production team will control the running speed of the etching machine very strictly. If it is a PCB with o.5oz bottom copper , only allow walk 1.4 meters at per minute, if 2oz, walk 0.8m one minute.

etching pcb
etching pcb

Except above process, all the boards will be required to do a final electrical testing before move to the packing. For prototypes, we will use flying probe testing. For volume, we will open the E-testing fixture to do the testing.

In our company, for the extra thin PCB, if the boards thickness lower than 0.2mm to do the flying probe testing, it needs to be tested before the outline process, because the boards are too thin to support the boards well while the flying probe, it will fall down easily.

flying probe testing and electric testing
flying probe testing and electric testing

Of course, our QC people will do the double visual inspection to make sure all the boards are being well made.

fr4 pcb inspection
fr4 pcb inspection

We always try our best effort to prevent any defective boards send to customers.  

Quality and Customers Scarification, it is always our company’s pursuit.

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