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Double Sided Metal Core PCB

March 20th, 2026

A double sided metal core PCB also has same two layers of copper conductor like Double layers MCPCB, but the metal core is in the middle of two conductor, so there’re conductors (trace) on both sides of metal core, and were connected to each other by Vias. So we named it “Double sided MCPCB”, and you can populated SMD on both top and bottom.

Different with Single layer MCPCB, double sided MCPCB also requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together. But sometimes, some raw Metal Clad material vendor will supply board material which already laminated.

Compared with normal FR4, this structure need more technology and experience on laminating of two layers together with metal core.

Structure of Double Sided MCPCB

Structure of Double Sided MCPCB

Capability of Double Sided MCPCB

  • Base material: Aluminum/Copper/Iron Alloy
  • Thermal Conductivity (dielectric layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
  • Board Thickness: 0.5mm~3.0mm (0.02″~0.12″)
  • Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, 4.0 OZ, 5.0 OZ
  • Outline: Routing, punching, V-Cut
  • Solder mask: White/Black/Blue/Green/Red Oil
  • Legend/Silkscreen Color: Black/White
  • Surface finishing: Immersion Gold, HASL, OSP
  • Max Panel size: 600*500mm (23.62″*19.68″)
  • Packing: Vacuum/Plastic bag
  • Samples L/T: 10~15 Days
  • MP L/T: 12~15 Days

FAQs about Double sided Metal Core PCB

1. What is a double-sided metal core PCB?

A double-sided MCPCB consists of two circuit layers (top and bottom) with a metal core—typically aluminum or copper—sandwiched in the middle. Unlike standard FR4 boards, the metal core acts as a high-efficiency heat sink. The layers are connected using insulated through-holes or thermal vias to ensure electrical signals pass through without shorting against the metal base.

2. How does a double-sided MCPCB differ from a single-sided one?

The primary difference lies in component density and routing complexity.

  • Single-Sided: Components are on one side; the metal base is on the back. It is simpler and cheaper but limited in space.
  • Double-Sided: Allows for components and traces on both sides of the metal core. This is necessary for complex designs where high power density requires cooling for components on both surfaces of the board.

3. What materials are used for the core in double-sided PCBs?

The three most common materials are:

  • Aluminum (6061 or 5052): The most cost-effective and popular choice, offering good thermal conductivity and mechanical stability.
  • Copper: Offers superior thermal conductivity (nearly double that of aluminum) but is significantly heavier and more expensive.
  • Stainless Steel: Used primarily for its mechanical strength and corrosion resistance, though its thermal performance is lower than aluminum.

4. Why are double-sided MCPCBs used instead of standard FR4?

Standard FR4 is a poor thermal conductor. In high-power applications, heat builds up and can cause component failure. Double-sided MCPCBs are used because the metal core can dissipate heat at rates of 1.0 W/mK to 9.0 W/mK (or higher), whereas FR4 typically manages only 0.25 W/mK. This allows for smaller form factors without overheating.

5. What are the main applications for double-sided metal core PCBs?

These boards are a staple in industries where heat management is critical:

  • Automotive: LED headlights, power converters, and motor control modules.
  • Lighting: High-output street lights and industrial floodlights.
  • Power Electronics: Solid-state relays, rectifiers, and high-capacity power supplies.
  • Telecommunications: Signal amplifiers and high-frequency filtering equipment.

6. What are the manufacturing challenges of double-sided MCPCBs?

The most significant challenge is the drilling and insulation process. Because the core is conductive metal, every through-hole must be pre-drilled, filled with a specialized dielectric resin, and then re-drilled to prevent the copper pins from touching the metal core. This requires high precision and specialized lamination techniques to ensure the board does not delaminate under thermal stress.

COB MCPCB

March 20th, 2026

What is Chip On Board COB MCPCB?

COB MCPCB, known as “Chip-On-Board” Metal Core PCB, is a type of MCPCB used in thermoelectric separation application. By using COB MCPCB, the micro-chip (also known as “die”) directly touch the metal core where the heat dissipate, and electrically interconnect the trace of circuit board (wire-bonding) so that power supply can be provided.

In normal MCPCB, there’s a dielectric layer between trace copper and metal core, and the thermal conductivity is limited by that dielectric layers, so value can only be 1~3 W/m.K. But using COB MCPCB, there’s no such dielectric layer because chip (die) direct touch the metal core, so thermal conductivity value of COB MCPCB will be almost the same one of metal core material itself. The normal material of metal core is aluminum, so thermal conduviity of COB MCPCB is more than 200W/m.K.

COB MCPCB

COB MCPCB (Chip on Board)

What are the COB Wire Bonding Processes?

COB process consists of three main categories to perform when manufacturing the Chip-on-Board:

1st: die mount or die attach;

2nd: wire bonding;

3rd: the encapsulation of die wires.

By using wire bonding & epoxy packaging then directly embedded on MCPCB, this practice can extend the lifespan of LED and unified light emission.

According to process and material, COB MCPCB applications can be categorized into two types: Mirror Aluminum and silver or gold platting aluminum, or silver plating mirror aluminum PCB.

Structure of COB MCPCB

Structure of COB MCPCB

Advantage of utilizing COB MCPCB

  • Excellent heat dissipation
  • High thermal conductivity: 137W/m.K
  • Higher reliability with better heat dispatch and small number of solder joint.
  • Provide enhanced reliability and lifespan of LED
  • Easy assembly for high powers LEDs
  • High quality material and production process allows easy assembly and substantial reduce the error percentage in assembly process
  • Substantially reduced space and cost
  • With better security protection (difficult to hack using reverse engineering)
  • Shorter time to the market

Application of COB MCPCB

  • High Power LED (up to 200W)
  • LED Backlight for LED TV
  • LED Front Light for E-Book
  • Agriculture & Horticulture Lighting
  • Street & Parking Lot Lighting
  • Automotive
  • Power Supply
  • ustomer Electronics Lighting
  • Other products that require thermal solutions
Application of COB MCPCB

FAQs about COB MCPCBs

1. What is the difference between a standard MCPCB and a COB MCPCB?

A standard MCPCB (Metal Core PCB) usually has SMT (Surface Mount Technology) components soldered onto a dielectric layer. In contrast, a COB (Chip-on-Board) MCPCB allows the LED semiconductor chip to be mounted directly onto the metal core or into a recessed “well.” This removes the thermal resistance of the LED package itself, allowing for much higher power density.

2. Why is thermal conductivity so important for COB MCPCBs?

Since COB LEDs pack many light-emitting diodes into a very small area, they generate intense localized heat. If this heat isn’t dissipated, the LED’s lifespan and brightness (luminous flux) drop rapidly. COB MCPCBs use materials like Aluminum or Copper to pull heat away from the chips at rates significantly higher than standard FR4 boards.

3. What are the common base materials used in COB MCPCBs?

  • Aluminum: The most common and cost-effective choice for general lighting.
  • Copper: Offers superior thermal conductivity but is heavier and more expensive; used for extreme high-power applications.
  • Stainless Steel: Occasionally used for high-strength requirements, though it has poorer thermal properties than Aluminum.

4. What is a “Mirror Aluminum” COB MCPCB?

A Mirror Aluminum COB MCPCB features a highly reflective, polished surface. This design ensures that light emitted from the sides of the LED chips is reflected forward, increasing the overall light output efficiency (Lumen/Watt) by reducing light absorption by the board itself.

5. Can COB MCPCBs be used with high-voltage applications?

Yes, but they require a specialized dielectric layer. This layer must be thin enough to allow heat to pass through to the metal core, but thick enough to provide electrical insulation (dielectric breakdown voltage) to prevent short circuits, especially in AC-driven LED modules.

6. What are the main applications for COB MCPCB technology?

Because they offer high brightness in a compact footprint, they are the industry standard for:

  • Automotive lighting (Headlights).
  • Industrial high-bay lighting.
  • Street lights and architectural floodlights.
  • Commercial downlights and track lighting.

Single Layer MCPCB

March 20th, 2026

A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.

The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.

The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.

Single Layer MCPCB

Single Layer MCPCB Capability

  • Base material: Aluminum/Copper/Iron Alloy
  • Thermal Conductivity (dielectrial layer): 0.8, 1.0, 1.5, 2.0, 3.0 W/m.K.
  • Board Thickness: 0.5mm~3.0mm(0.02″~0.12″)
  • Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 10 OZ
  • Outline: Routing, punching, V-Cut
  • Soldermask: White/Black/Blue/Green/Red Oil
  • Legend/Silkscreen Color: Black/White
  • Surface finishing: Immersion Gold, HASL, OSP
  • Max Panel size: 600*500mm(23.62″*19.68″)
  • Packing: Vacuum/Plastic bag
  • Samples L/T: 4~6 Days
  • MP L/T: 5~7 Days

Single Layer MCPCB FAQs

1. What is a single layer MCPCB?

A single layer MCPCB consists of a metal base (typically aluminum or copper), a non-conductive dielectric layer, and a copper circuit layer. Unlike standard PCBs, the metal core acts as a primary heat sink, moving thermal energy away from high-power components to the environment or an external cooling system.

2. How does a single layer MCPCB differ from a standard FR4 PCB?

The primary difference is the substrate material. While FR4 uses fiberglass and epoxy, an MCPCB uses a metal base. This allows MCPCBs to have significantly higher thermal conductivity. While a standard FR4 board typically has a conductivity of around 0.25 W/mK, a single layer MCPCB can range from 1.0 W/mK to 9.0 W/mK depending on the dielectric material used.

3. What are the typical applications for single layer MCPCBs?

Single layer MCPCBs are most commonly used in the LED lighting industry (street lights, automotive headlamps, and backlight units) because LEDs generate significant heat that can degrade performance if not dissipated. They are also widely used in power conversion, solid-state relays, and the automotive sector for motor control modules.

4. Can you have plated through-holes (PTH) on a single layer MCPCB?

Generally, no. In a standard single layer MCPCB, the metal base is conductive, so through-holes would cause a short circuit between the signal layer and the base. Components are typically Surface Mount Devices (SMD). If through-hole components are required, specialized “COB” (Chip on Board) or complex insulated hole processes are needed, which significantly increases cost.

5. What are the layers of a single layer MCPCB?

A standard stack-up includes four main layers:

  • Solder Mask: Protects the copper circuit.
  • Circuit Layer: The copper foil used for traces.
  • Dielectric Layer: The most critical part; it provides electrical insulation while facilitating heat transfer.
  • Metal Substrate: Usually 1.0mm to 3.2mm of Aluminum (5052 or 6061) or Copper.

6. Is aluminum or copper better for the metal core?

Aluminum is the most popular choice because it is cost-effective and provides excellent thermal dissipation for most applications. Copper offers even higher thermal conductivity but is much heavier and more expensive. Copper is usually reserved for extremely high-power density applications where aluminum’s performance is insufficient.