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What is pcb finish nickel or électrolytique with champagne effect?
Friday, December 27th, 2024

What is pcb finish nickel or électrolytique with champagne effect? ​​PCB nickel plating is a process of depositing a nickel metal layer on the surface of a printed circuit board. Its core purpose is to enhance the performance and durability of the circuit board. Champagne effect electroplating is achieved by mixing the composition of the electroplating solution and precisely controlling the electroplating process parameters. It gives the circuit board a unique and elegant appearance.

What is pcb finish nickel or électrolytique with champagne effect?

What is pcb nickel champagne effect?

PCB nickel champagne effect refers to a champagne-like appearance and corresponding performance characteristics obtained by a specific nickel plating process on a printed circuit board (PCB).

  • Color: It presents a light golden or light amber color similar to champagne. This unique color makes it stand out among many PCB surface treatment effects and has high recognition and decorativeness.
  • Glossiness: It has a soft gloss, which is neither too bright mirror effect nor completely matte without gloss, but a moderate gloss between the two, giving people an elegant and textured visual experience.

Why choose champagne effect for pcb finishes?

There are several reasons for choosing champagne effect as PCB finish:

  • Aesthetic advantage: Champagne color is elegant and noble, with unique color and soft gloss, which makes it stand out visually, and can meet the differentiated and exquisite needs of high-end electronic products for appearance design. It is suitable for equipment that is sensitive to light reflection, avoids reflection interference, and enhances the overall visual effect.
  • Corrosion resistance: The champagne effect layer formed by nickel plating can effectively protect the copper foil from oxidation and corrosion. Whether it is in a harsh environment such as humidity, chemical exposure or outdoor, it can ensure the stability of PCB electrical performance and extend the service life.
What is pcb finish nickel or électrolytique with champagne effect?
  • Electrical performance: The surface of the nickel layer is flat and smooth, which can reduce contact resistance and ensure the integrity and accuracy of high-frequency and high-speed signal transmission; good solderability helps to improve welding efficiency and quality and ensure stable electrical connection.
  • Mechanical properties: With a certain hardness and wear resistance, it can withstand mechanical wear during production, assembly, transportation and use, such as PCBs with frequent plug-in and unplug interfaces, which can protect the circuits and plating and maintain the integrity and functionality of the PCB.
  • Market demand: Meet consumers’ pursuit of personalized electronic products and help products stand out from the competition; fit the high-quality and high-end image of high-end products and enhance the market competitiveness of products.

Why nickel champagne finish is gaining popularity?

The increasing popularity of nickel champagne finish is mainly due to its advantages in both beauty and performance, and the production process is also improving.

From the aesthetic point of view, it meets the needs of personalized and high-end appearance of consumer electronic products. Its unique champagne color is exquisite and elegant, which can enhance product recognition and high-end image.

In terms of performance, good corrosion resistance can ensure the reliability of PCB in complex environments; excellent electrical performance adapts to high-end technical requirements such as high-frequency and high-speed signal transmission, and mechanical performance can also cope with various mechanical forces in practical applications.

At the same time, the mature production process reduces costs, and has strong compatibility with existing PCB manufacturing processes, which is convenient for promotion and application.

How does nickel champagne effect improve pcb quality?

Nickel champagne effect improves PCB quality in three aspects:

  • Protective performance: First, it enhances corrosion resistance. The nickel layer can prevent the copper foil from being corroded by humid environment and chemicals, and prolong the service life of PCB. Second, it improves wear resistance. Its certain hardness can withstand mechanical friction and protect the circuit and plating.
What is pcb finish nickel or électrolytique with champagne effect?
  • Electrical performance: Reduce contact resistance, and the flat and smooth surface reduces signal transmission loss and reflection. At the same time, it improves solderability, combines well with solder, improves welding quality and efficiency, and ensures reliable electrical connection.
  • Appearance quality: The unique light golden or light amber color and soft luster enhance the recognition and beauty of PCB and increase the added value of high-end electronic products.

What impact does champagne effect have on pcb durability?

The champagne effect (usually achieved through nickel plating) has many positive effects on the durability of PCB:

1. Corrosion resistance

  • Isolation protection: The copper foil of PCB is susceptible to oxidation and corrosion. The champagne effect nickel layer is like a solid shield, isolating the copper foil from corrosive substances in the outside world, thereby greatly reducing the possibility of corrosion of the copper foil.
  • Long-term stability: This anti-corrosion property can ensure the stability of the electrical performance of the PCB during the long-term use of electronic products. The corrosion resistance brought by the champagne effect can significantly extend the service life of the PCB and reduce the failure and maintenance costs caused by corrosion.

2. Wear resistance

  • Mechanical protection: During the production, assembly, transportation and daily use of PCBs, there will be various possible mechanical frictions. The champagne effect nickel layer has a certain hardness and can withstand these frictions and scratches, protecting the lines and plating on the surface of the PCB from damage.
  • Maintain integrity: For frequently used electronic products, this wear resistance can ensure the integrity of the PCB, help avoid repeated friction and breakage, resulting in interruption of electrical connections, thereby improving the durability of the PCB.

Is champagne effect the best choice for premium pcbs?

Champagne effect is a good choice for premium PCBs, but not the absolute best choice.

From the advantages, it has appearance advantages, and the color and gloss make the PCB more refined and high-end. In terms of performance, it has good corrosion resistance and can stabilize electrical performance; the flat and smooth surface can reduce contact resistance, ensure signal quality, and has good solderability; in terms of mechanical properties, hardness and wear resistance can protect the circuit and plating.

What is pcb finish nickel or électrolytique with champagne effect?

However, it also has limitations. In terms of application scenarios, it may not be the most suitable when there are special requirements for extreme environments or electromagnetic shielding, and other targeted surface treatments are required.

PCB nickel plating can enhance the circuit board’s corrosion resistance, welding and multi-layer board connection performance, making it more durable and stable. Champagne effect electroplating adds aesthetic elements on the basis of the practicality of nickel plating, making it continuously advanced in performance and appearance, making the appearance of high-end electronic product circuit boards more refined.

All about layers to circuit board
Thursday, December 26th, 2024

The layers to circuit board are essential for defining its structure and functionality. The substrate provides mechanical support; the conductive layer is responsible for signal transmission and power distribution; the insulating layer is placed between the conductive layers to prevent short circuits; the solder mask protects the circuit board and ensures reliable welding; the outermost screen printing layer is used for marking and guiding component placement.

How many layers does a circuit board have?

The number of layers of a circuit board can range from single to multiple layers. Common layers include single, double, four, six, eight, ten and twelve layers.

All about layers to circuit board

Single-layer boards are the most basic type of circuit boards. All components and circuits are on the same layer. The manufacturing cost is low but suitable for simple circuit designs.

Double-layer boards connect the upper and lower layers through vias and are suitable for medium-complex circuit designs.

Four-layer boards have two layers of internal copper foil, which have higher noise suppression and anti-interference capabilities and are often used in industrial control and communication fields.

Six-layer boards can optimize electromagnetic interference and are suitable for circuit designs that need to transmit signals at different speeds.

Eight-layer boards usually contain four wiring layers and four reference planes, which are suitable for high-end electronic devices and aerospace fields.

Common circuit board layers on the market include 1 layer, 2 layers, 4 layers, 6 layers, 8 layers, 10 layers and 12 layers. High-end PCB boards can even reach 32 layers or 50 layers, but these are usually used for special needs and high-performance equipment.

The number of layers of a circuit board has a significant impact on performance and cost. Multi-layer circuit boards have higher performance and reliability and can adapt to complex circuit design requirements, but the cost also increases with the number of layers.

What are the layers of a PCB layout?

PCB design includes multiple layers, each with its specific function:

  • Signal layer: including Top Layer, Bottom Layer and Mid Layer, used to install components and routing.
  • Mechanical layer: defines the appearance and mechanical size of the PCB board, without electrical properties, used to outline the shape, place text, etc.
  • Silkscreen layer: including Top Overlay and Bottom Overlay, used to define silkscreen characters, such as component names, symbols, etc.
  • Solder paste layer: including Top Paste and Bottom Paste, used for surface mount pads.
  • Solder mask layer: including Top Solder and Bottom Solder, to prevent short circuit during soldering.
All about layers to circuit board
  • Drilling layer: provides drilling information during manufacturing.
  • Prohibited wiring layer: defines wiring boundaries to prevent wiring from exceeding the range.
  • Multilayer: used for electrical connection of pads and vias.

Can a PCB have 3 layers?

PCB can have 3 layers. Three-layer PCB board does exist, which has a design with three copper layers, including two outer copper layers and one inner copper layer, and the inner copper layer is located between the two outer copper layers.

However, although three-layer PCB board is technically feasible, it is not common in practical applications. The main reasons include:

  • The process cost difference is not big: the process cost of three-layer board and four-layer board is not much different, because the four-layer board has an extra layer of copper foil and adhesive layer, but this difference is not enough to significantly increase the cost.
  • Process stability issues: In the PCB manufacturing process, four-layer boards are easier to control than three-layer boards, especially in terms of symmetry and warpage. Three-layer boards are prone to exceed this standard when they are large in size, affecting the reliability of SMT patches and the entire product.
  • Design habits: Designers usually tend to design boards with even layers. Even if odd-numbered boards can achieve functions, they will be designed as even layers to avoid potential problems.

How do you tell how many layers a PCB is?

The methods for judging the number of PCB layers mainly include the following:

1. Appearance judgment method:

  • Observation of copper foil layer: A single-layer PCB board has only one copper foil layer, one side of the double-sided component has copper foil, and the other side is printed circuit. A double-layer PCB board has two copper foil layers, located on both sides of the board. Four-layer and six-layer PCB boards have more copper foil layers, and the thickness of the board increases accordingly.
  • Drilling position and number: The drill holes in a multi-layer PCB board are channels connecting different layers. The drilling holes of double-layer PCBs are mostly located in the four corners, while four-layer or six-layer PCBs will have more drilling holes in the middle, and the drilling positions and quantities are more complicated.
All about layers to circuit board
  • Board thickness: Generally, the thickness of single-sided copper PCBs is 1.6mm, the thickness of double-sided copper PCBs is 1.2-1.6mm, and the thickness of four-layer PCBs is 1.6~2.0mm. If the thickness of the PCB board exceeds 2mm, then the PCB board has at least 4 layers.

2. File viewing method:

Use PCB design software such as AD, PADS, Eagle, etc. to open the target PCB file. Select the “Board Layer Structure” or “Layer Settings” option in the software to view the number of layers of the PCB. Design engineers usually name different layers, such as TOP, BOTTOM, L1, L2, etc., to indicate different copper foil layers and internal interlayers.

3. Visual method:

  • Edge observation: Observe the edge of the PCB. If you can see multiple layers of copper foil lines or stacked boards, then this may be a multi-layer PCB. Each copper foil line represents an independent PCB layer.
  • Solder mask color: Different layers of multi-layer PCBs are usually distinguished by solder mask layers of different colors. Check the surface of the PCB to see if there are areas of different colors, which may indicate differences between the layers.
  • Printed markings: PCB manufacturers usually mark the number of layers on the PCB. Check if there are printed marks or labels on the PCB, which may show the number of layers of the PCB.

4. Other methods:

  • Guide hole and blind hole light method: Determine the number of layers of the PCB by observing the guide holes and blind holes. The circuit connections of multi-layer PCBs all use guide hole technology. By observing the position and number of guide holes, the number of layers of the PCB can be preliminarily determined.
  • Accumulation method: Determine the number of layers of the PCB by comparing the routing and component positions of some public board PCB boards. This method requires a certain amount of experience and accumulation.

What is the spacing for PCB layers?

The spacing of PCB layers is usually between 0.1mm and 0.3mm. Specifically, the recommended range of interlayer distance is 0.1-0.3mm to ensure sufficient spacing between layers to avoid signal interference and short circuits.

In addition, other spacing requirements need to be considered in PCB design:

  • Spacing between conductors: The minimum line spacing must not be less than 4MIL, and the conventional spacing is 10MIL.
  • Pad aperture and pad width: If mechanical drilling is used, the pad aperture must not be less than 0.2mm; if laser drilling is used, it must not be less than 4mil.
  • Spacing between pads: Not less than 0.2mm.
  • Spacing between copper and board edge: The spacing between live copper and PCB board edge is not less than 0.3mm. Large-area copper plating usually has an indentation distance from the board edge, which is generally set at 20mil.

These specifications and standards are designed to ensure the electrical performance, mechanical strength and manufacturing feasibility of PCBs.

How is a PCB board structured?

The basic structure of a PCB board includes four main layers: top layer, bottom layer, inner layer and pad layer.

The top layer is the topmost layer of the PCB board, which is full of electronic components such as resistors, capacitors and chips, and is responsible for connection and wiring to ensure the accurate transmission of current and signals. The bottom layer is located at the bottom of the PCB board, and is mainly responsible for the laying of ground wires and the connection of auxiliary signal lines, providing stable support.

The inner layer is located between the top layer and the bottom layer, and is composed of multiple layers of copper foil stacked to form a complex circuit network for signal transmission and power supply, reducing signal interference.

The pad layer covers the surface of the pad to prevent the solder from splashing into other areas during the welding process, protecting the welding quality and stability of the circuit board.

What are the small holes in printed circuit boards called?

There are many types of small holes on printed circuit boards, mainly including Via, Blind Via, Buried Via and Through Via.

1. Via: Vias are one of the most common types of holes in printed circuit boards, which are used for electrical connections between layers or for fixing and positioning devices. Vias can be divided into three types: blind holes, buried holes and through holes.

  • Blind hole: a hole that connects the surface layer and the inner layer but does not penetrate the entire circuit board. It is suitable for high-density interconnection design and saves space.
  • Buried hole: a hole located between the inner layers but does not extend to the outer layer. It is used for inner layer signal interconnection to reduce signal interference.
  • Through hole: a hole that runs through the entire circuit board, used for internal interconnection or as a component positioning hole, easy to use and low cost.
All about layers to circuit board

2. Non-plated hole (NPTH): There is no copper on the inner wall of this hole. It is mainly used for positioning when assembling electronic components or connecting the joints of the panel.

3. Plated hole (PTH): including vias and pads. Vias are used for electrical connections between two layers, and pads are used to install plug-in electronic components.

4. Micro-Via: used for high-density PCB design to achieve more sophisticated wiring.

These different types of holes play different roles in printed circuit boards. Choosing the right hole type according to design requirements can improve the performance and reliability of the circuit board.

Each layer of the circuit board is indispensable. They work closely together to create a high-performance PCB circuit board. The substrate layer provides stable support, the signal layer transmits signals, the power layer provides power, the ground layer resists interference, the middle layer expands or isolates the circuit, and the silk screen layer assists in assembly.

How to read a pcb board?
Tuesday, December 24th, 2024

How to read a pcb board? When reading a PCB board, you need to pay attention to several aspects: First, the substrate, such as FR4, is green or brown, the ceramic substrate is white and brittle, and the aluminum substrate has a metallic texture, and their characteristics are different.

Second, identify the components. Resistors are mostly small cylinders with two pins, marked with resistance values, and play the role of current limiting and voltage dividing; capacitors have various shapes, electrolytic capacitors have polarity for filtering, and ceramic capacitors have no polarity for coupling; integrated circuits are multi-pin black chips, and their functions are known by model; transistors have three pins and can amplify or switch signals.

How to read a pcb board?

Finally, pay attention to solder joints, vias, test points and markings. The solder joints should be good, vias connect multi-layer lines, test points help detection, and markings help track circuits and understand component parameters and areas, so that you can understand the PCB board.

How to read PCB for beginners?

The steps and methods for beginners to read PCB are as follows:

  • Observe the overall structure: First, carefully observe the overall structure of the circuit board, pay attention to the shape, size and color of the circuit board, as well as the markings and labels on it.
  • Identify electronic components: Try to identify various electronic components on the circuit board, such as resistors, capacitors, inductors, diodes, transistors, integrated circuits, etc.
  • Trace the circuit path: Trace the wire path on the circuit board and understand how the circuit is connected. Pay attention to the direction and connection of the wires, and try to trace the circuit path from one component to another and the connections between them.
  • Analyze the circuit board hierarchy: A complex circuit board usually consists of multiple layers. By observing the structure and hierarchy of the circuit board, you can infer the function and design of the circuit board.
  • Read the circuit board markings: There are usually markings, labels, printed text or icons on the circuit board to indicate components, connections or other important information.
  • Reference circuit diagrams and documents: Get the circuit diagram or related documents of the circuit board. The circuit diagram is a graphical representation of the circuit on the circuit board, which can provide more detailed information.
  • Learn basic circuit knowledge: In order to better understand the circuit board, it is recommended to learn some basic circuit knowledge. Understand the basic concepts such as current, voltage, resistance, capacitance in the circuit, as well as common circuit topologies and circuit analysis methods.

How do you analyse a PCB board?

Analysis of PCB boards can be carried out from the following aspects:

  • Check the ink quality: high-quality PCB boards usually use well-known brands of ink, and the printing and baking process is exquisite. Excellent ink has better gloss and thickness.
  • Observe the silk-screen text: the silk-screen text of high-quality PCB boards is clear and three-dimensional, and it is difficult to find the roughness of the edges of the handwriting even under a magnifying glass.
  • Check the smoothness of the V-cut: high-quality PCB boards are more delicate in V-cut processing, and the edges are smooth and free of burrs.
  • Evaluate the color of the board: the color of the board is uniform and there is no obvious color difference, indicating that the production process is stable and the quality is more guaranteed.
  • Check the packaging material: high-quality packaging materials can usually better protect the PCB board and prevent damage during transportation.

How do I identify parts of a PCB?

Identifying the various parts of a PCB (printed circuit board) requires understanding its basic structure and common components.

1. Basic structure

  • Substrate: FR4 (mostly green or brown) is common, as well as ceramic and aluminum substrates. It mainly plays a supporting and insulating role.
  • Copper foil circuit: observe the direction of the circuit, the thicker one carries large current, and the thinner one carries signals; multilayer boards should distinguish between the power layer and the signal layer.
How to read a pcb board?

2. Common components

  • Resistors: small cylinders with two pins, you can see the markings to identify the resistance value. Used for current limiting and voltage division.
  • Capacitors: various shapes, electrolytic capacitors have polarity, and ceramic capacitors have no polarity. Used for storing charge, filtering, etc.
  • Integrated circuits (ICs): black rectangular chips, multiple pins, and model identification, which are the core of realizing complex functions.
  • Transistors: bipolar and field effect types, three pins, used to amplify signals or as switches.

3. Others

  • Solder points and vias: Solder points connect components and circuits, and should be full and smooth; vias are used to connect different layers of circuits.
  • Test points and logos: Test points are used for electrical testing, and logos contain information such as component numbers and values ​​to help understand circuits.

How do you identify PCB material?

To identify PCB (printed circuit board) materials, you can start from the following aspects:

1. Observe the appearance

  • Color: green or brown may be FR4; white and hard and brittle may be a ceramic substrate; silver with a metallic texture may be an aluminum substrate. Color sometimes also implies performance, such as black PCB may have a special design to resist electromagnetic interference.
  • Texture and thickness: touch it with your hand, FR4 is harder and tougher, ceramic is hard and brittle, and aluminum substrate has a metallic texture. The thickness of PCBs for different devices is different, simple devices are thinner, and complex devices are thicker.

2. Reference environment and scenario

  • High temperature environment: Ceramic or metal substrates may be used in high temperature environments, such as automobile engines and industrial furnace control circuits, and aluminum substrates are often used in electric vehicle motor controllers.
  • High humidity environment: High humidity environment requires materials to be moisture-proof. FR4 has a certain moisture-proof ability. Some PCBs that have been specially treated or coated with moisture-proof paint can better resist moisture.
  • High-frequency circuit application: The key to high-frequency circuits is dielectric constant and loss factor. For example, 5G communication equipment and radar systems may use special materials such as polytetrafluoroethylene boards, such as 5G base station antenna boards.

3. Check markings and documents

  • PCB surface markings: Check whether there are manufacturer markings, material types, certification marks, etc. on the surface, such as UL and RoHS certification, to obtain material clues.
  • Product documents and specifications: Find keywords such as “Board Material” in product manuals, technical documents or PCB specifications to determine the material.

How do you find the number of layers in a PCB?

To determine the number of layers of a circuit board (PCB), you can use the following methods to identify it:

  • 1. Check the edge: Observe the edge of the PCB. If you can see multiple layers of copper foil or laminated boards, then this may be a multi-layer PCB. Each copper foil represents a separate PCB layer.
  • 2. Number of holes: Multi-layer PCBs usually have more connection holes. Observe the solder holes on the surface and bottom of the PCB. If there are many holes arranged at intervals, it is likely a multi-layer PCB.
  • 3. Solder mask color: Different layers of a multi-layer PCB are usually distinguished by solder mask of different colors. Check the surface of the PCB to see if there are areas of different colors, which may indicate differences between the layers.
  • 4. Printed markings: PCB manufacturers usually mark the number of layers on the PCB. Check if there are printed markings or labels on the PCB, which may show the number of layers of the PCB.
  • 5. Through the light source: If you have a light source, you can try to illuminate the PCB in a transparent way. Through the PCB, you may be able to see the layout of the internal layers, which can be used to infer the number of layers of the PCB.

What do the numbers on a PCB mean?

The numbers on the PCB board are usually used to identify the category, function number and serial number of electronic components on the circuit board. Specifically, the letter before the number indicates the category of the component, such as R for resistors, C for capacitors, D for diodes, etc.

The number after the number indicates the serial number or function number of the component on the circuit board. For example, R107 means that the serial number of the first resistor is 107, and C118 means that the serial number of the first capacitor is 11812.

How to read a pcb board?

In addition, the number can also represent the functional area or module of the circuit. For example, “1” may represent the motherboard circuit, “2” may represent the power supply circuit, etc., which are determined by the circuit designer.

In some cases, the combination of letters and numbers before the number can also represent specific functions or interfaces, such as SW for switch, LED for light-emitting diode, etc.

What does f stand for on a circuit board?

The “F” on the circuit board usually stands for fuse. In the circuit diagram, the single letter “F” usually represents lightning arrester, while the combination of letters has different meanings, such as “FU” for fuse and “FR” for thermal relay. This is a common representation method in electronic components.

To read the PCB board, you must first identify the substrate material, and then identify various electronic components, such as resistors, capacitors, integrated circuits, transistors, etc., understand their appearance characteristics and functional roles, so as to clarify the circuit connection and signal direction, and thus understand the circuit logic of the PCB board.

What is copper oxydation pcb?
Monday, December 23rd, 2024

What is copper oxydation pcb?Copper oxidation is the process of copper reacting chemically with oxygen in the air to form copper oxide. When PCB is exposed to humid air, moisture will be adsorbed on the copper surface. In the early stage of this oxidation process, only a very fine and imperceptible discoloration layer may be formed on the copper surface, but with the passage of time and the continuous action of oxidation conditions, the oxide layer will gradually thicken.

What is PCB Oxidation?

PCB oxidation refers to the phenomenon that the metal wire or pad surface on the PCB board reacts chemically with oxygen to form an oxide layer. This oxide layer is usually formed by oxides on copper materials, mainly including copper oxide (CuO) or cuprous oxide (Cu2O).

What is copper oxydation pcb?

The reasons for PCB oxidation are varied, mainly including the following points:

  • Environmental factors: high temperature and humidity, high pH or pollutant-containing environments will accelerate the oxidation process of PCB boards.
  • Manufacturing and storage conditions: During the manufacturing and storage process, if the appropriate temperature and humidity are not maintained, or if the packaging is improper, causing the PCB to be exposed to moisture and corrosive gases, oxidation is likely to occur.
  • Chemical reaction: The metal part on the PCB reacts with moisture and chemicals in the surrounding environment, which is also an important cause of oxidation.

What are the effects of PCB oxidation?

PCB oxidation will have many effects on the performance and reliability of electronic products. First, oxidation will lead to a decrease in conductivity, making the circuit board prone to poor contact, cross-connection and short circuit problems, thereby affecting the use effect and performance of electronic products.

Second, oxidation may cause short circuits and fires, because the oxide layer will form a conductive rust layer, which may cause safety accidents once a short circuit occurs. In addition, oxidation will also reduce the stability and reliability of the circuit board, because the oxide layer reduces the protective layer on the surface of the circuit board, making it more susceptible to interference and fluctuations during long-term operation.

To prevent PCB oxidation, the following measures can be taken:

  • Control humidity and temperature: Store the PCB in a dry and ventilated environment, avoiding humidity and high temperature environments.
  • Use high-quality materials: Choose a circuit board with a copper-plated protective layer, which can effectively reduce the degree of oxidation.
  • Moisture-proof treatment: Use a moisture-proof treatment agent to treat the PCB with moisture to enhance its stability.
  • Daily maintenance: Regularly inspect and maintain the PCB to detect and deal with surface corrosion in a timely manner.

What are the types of PCB corrosion?

The types of PCB corrosion mainly include the following:

  • Atmospheric corrosion: This is the most common type of corrosion, usually caused by a chemical reaction between oxygen and moisture in the air and copper, resulting in the formation of copper oxide on the copper surface, reducing the conductivity of the circuit board, but the mechanical properties remain unchanged.
What is copper oxydation pcb?
  • Local corrosion: This type of corrosion mainly affects a limited or small area, usually due to exposure to an environment with excessive humidity. Local corrosion includes filiform corrosion, crevice corrosion, and pitting corrosion.
  • Galvanic corrosion: occurs when two different metals (such as copper and another metal) are coupled in a corrosive electrolyte. Galvanic corrosion causes one metal to corrode faster than the other, usually when one end of the wire/cable is connected to the positive electrode and the other end is connected to the negative electrode.
  • Electrolytic corrosion: occurs when an ionized substance (electrolyte) comes into contact with two electrodes and current passes through the PCB. The electrolyte speeds up the rate of electrochemical reactions, causing the corrosion process to accelerate.
  • Fretting corrosion: Electrochemical corrosion occurs when two metal surfaces come into contact with each other and one of the metals is in a corrosive environment. Fretting corrosion usually occurs between two different metals, such as copper and steel or copper and aluminum, causing current to flow from copper to steel or aluminum, forming copper oxide.
  • Electrolytic dendrite formation: When there is ion contamination in the moisture, dendrites are formed on the copper traces, causing short circuits between traces. This deformation causes metal strips to grow from adjacent copper traces with different voltages, ultimately leading to a short circuit.

How to remove oxidation from PCB?

The methods for removing oxides from PCBs mainly include physical removal, chemical reduction, surface treatment, and environmental control.

1. Physical removal method:

  • Fine sandpaper wiping: For mild oxidation, fine sandpaper (non-iron sandpaper) can be used to gently wipe the oxide layer until the metallic luster is restored.
  • Diluted acid soaking: For more serious oxidation, you can soak the circuit board in diluted sulfuric acid, hydrochloric acid or white vinegar (acetic acid). After the oxide layer is corroded, clean it with alcohol.

2. Chemical reduction method:

  • Dimethyl borane alkaline solution: Use alkaline solution mainly composed of dimethyl borane to reduce the oxidized surface of the inner layer copper foil to enhance acid resistance and adhesion.
  • Sodium thiosulfate reduction solution: Use sodium thiosulfate reduction solution with a pH value of 3-3.5 to treat copper surface whiskers to form a coating layer of copper and cuprous oxide mixture to improve antioxidant capacity.

3. Surface treatment method:

  • Tin plating: Tin plating on the surface of the PCB to form a protective layer, which effectively prevents oxidation and has a low cost.
  • Gold plating: Gold plating can provide higher corrosion resistance, but the cost is higher.
  • Coating anti-oxidation coating: Use anti-oxidation coating to form a strong, corrosion-resistant protective layer to isolate the PCB surface from contact with air.

4. Environmental control method:

  • Control the ambient temperature and humidity: During the manufacturing, storage and transportation of PCBs, strictly control the temperature and humidity of the environment to avoid exposing the PCB to high temperature, high humidity or pollutant-containing environments.
  • Choose appropriate packaging materials: such as moisture-proof bags, foam boxes, etc. to ensure the integrity and quality of the PCB.

How to protect PCB from oxidation?

The methods to protect PCBs from oxidation include the following aspects:

  • Choose high-quality substrates: Select substrates with strong antioxidant properties, such as FR-4, high TG boards or aluminum substrates.
  • Control the ambient humidity: During the manufacturing and storage process, maintain a low humidity environment to reduce the risk of oxidation, because high humidity will accelerate the occurrence of oxidation reactions.
What is copper oxydation pcb?
  • Use antioxidants: During the manufacturing or assembly of PCBs, antioxidants are applied to protect the circuit layer from oxidation, which can be implemented during the packaging and coating process.
  • Surface treatment process: The use of metal plating with strong antioxidant properties, such as gold plating, silver plating, tin plating, etc., can form a protective film on the surface of the metal circuit to prevent the occurrence of oxidation reactions.
  • Regular cleaning and maintenance: Use appropriate cleaning agents and regular cleaning methods to remove possible dirt and oxides and keep the PCB surface clean.
  • Reasonable storage and use environment: Avoid exposure to humid, high temperature, and highly polluted environments. It is best to use sealed packaging and place it in a dry and cool place. During use, pay attention to keeping the electronic equipment clean and prevent dust, moisture and other pollutants from entering the PCB.

What chemical is used to clean PCB?

Common chemicals for cleaning PCBs include water-based cleaning agents, hydrocarbon cleaning agents, and organic solvents.

Water-based cleaning agents use water as the cleaning medium and improve the cleaning effect by adding a small amount of surfactants, detergent aids, and corrosion inhibitors. This cleaning agent has a good dissolving effect on water-soluble dirt and is suitable for batch cleaning.

Hydrocarbon cleaning agents are suitable for manual scrubbing and local surface treatment wiping, but the air in the working environment must be unobstructed. Hydrocarbon cleaning agents have weak cleaning power and are flammable and explosive safety risks.

The organic solvent cleaning process is relatively simple, and only the same solvent needs to be used for cleaning and rinsing. Common organic solvents include trichloroethylene, carbon tetrachloride, etc. These solvents have a good dissolving effect on dirt, but attention should be paid to their volatility and safety.

Copper oxidation PCB involves many links in electronic manufacturing, from design to manufacturing, from use to maintenance, and negligence at each stage may lead to this problem, thereby damaging the performance of the PCB. As a professional PCB manufacturer, BEST Technology blocks oxidation factors from cleaning to packaging. Once an oxidation problem occurs, special cleaning agents are used for minor treatments, and professional processes such as micro-etching and electroplating are used for repair.

What is a flip chip cob led?
Friday, December 20th, 2024

What is a full flip chip cob led? COB (Chip On Board), or chip on board packaging technology, is a technology that directly packages multiple LED chips on a circuit board. Unlike traditional LED packaging methods, COB LEDs do not need to package each chip separately, but instead arrange them closely and integrate them on a common substrate to form a light-emitting module.

What is a COB flip chip?

COB flip chip refers to a packaging technology, the full name of which is Chip on Board (chip directly on the board), where “flip” refers to the packaging method of the chip. Flip chip COB technology packages LED chips directly on the PCB substrate, covers the silicon wafer with thermally conductive epoxy resin, and performs heat treatment, and finally establishes an electrical connection between the chip and the substrate through wire bonding.

What is a flip chip cob led?

Its characteristics and applications:

  • Simple structure: Full Flipped chip COB technology has a simpler structure, reduces gold or copper wire connections, and simplifies the manufacturing process.
  • High temperature resistance: This packaging method has better high temperature resistance and improves the stability and reliability of the product.
  • Good heat dissipation performance: Due to the reduction of connecting parts, the heat dissipation performance is improved, reducing the risk of dead lights and falling lights.
  • Widely used: Flip-chip COB technology is widely used in indoor small-pitch LED displays.

Comparison with other packaging technologies

  • Formal COB: The formal chip packaging method is earlier, the process is mature but the stability is poor, it is easily affected by moisture, and it affects the light output efficiency and heat dissipation efficiency.
  • Mixed COB: Mixing formal and flip chips, taking into account cost and performance, is suitable for the transition stage.

What is a flip chip used for?

The main functions of flip chips include:

  • Reduce signal delay and parasitic inductance: Flip chips are directly electrically connected to the pads of the package substrate through bumps, without the need for long bonding wires, so the signal path is shorter, which can effectively reduce signal delay and parasitic inductance.
  • Improve heat dissipation performance: Since the chip is directly connected to the substrate through bumps, heat is more easily transferred to the substrate, thereby improving heat dissipation performance.
  • High I/O pin density: Flip chips have higher I/O pin density, save area, and are suitable for high-performance and high-integration applications.
  • Improve package reliability: Flip chips use metal ball connections, which are compact and reliable, so they are increasingly used in the packaging industry.
  • Reduce package size: Using metal ball connections can reduce package size, improve electrical performance, and solve the problem that traditional packaging methods need to expand volume due to increased pin counts.

How does a flip-chip work?

The working principle of flip chip technology is to form bumps on the active side of the chip, and then align and weld the active side of the chip with the pads on the substrate facing down, thereby achieving direct electrical connection between the chip and the substrate.

What is a flip chip cob led?

This connection method not only reduces the package volume, but also improves signal transmission speed and reliability because the signal path is shorter and the parasitic inductance and capacitance effects caused by wire bonding are avoided.

What are the disadvantages of flip chip?

The main disadvantages of flip chips include thermal stress problems and reliability problems. Due to the mismatch in the coefficient of thermal expansion (CTE) between the chip and the substrate, when the temperature changes, the solder joints will be subjected to large thermal stress, resulting in fatigue damage and failure. In order to solve these problems, the bottom filling process is usually adopted, that is, polymer materials are injected into the gap between the chip and the substrate to improve the stress distribution of the solder joint, reduce the strain amplitude, and extend the thermal fatigue life of the solder joint.

In addition, flip chip technology faces some challenges in practical applications, including:

  • Material selection and process optimization: As chips become increasingly miniaturized and thinner, the requirements for the performance of filling materials and packaging reliability continue to increase. Material design, process optimization and other measures are effective ways to deal with potential challenges.
  • Wide-scale use of lead-free solder: The use of lead-free solder has put forward new requirements for the bottom filling process, which requires further research and improvement.

What are the different types of flip chips?

There are mainly the following types of flip chips:

FCBGA (flip chip ball grid array package):

  • Process characteristics: FCBGA uses small balls instead of pins for welding, has high I/O density, can effectively solve electromagnetic compatibility and electromagnetic interference problems, and reduce the packaging area. In addition, its good heat dissipation performance enables the chip to work stably at higher power.
What is a flip chip cob led?
  • Application areas: Widely used in high-end microprocessor and graphics processing chip packaging, such as high-end CPU and GPU, to ensure the stability and performance of the chip when running at high frequency.

FCCSP (Flip Chip Size Package):

  • Process characteristics: FCCSP can achieve chip size and package size close to each other, suitable for portable electronic devices with strict space requirements. Its compact packaging form minimizes the space occupied by the package while ensuring chip performance.
  • Application areas: Suitable for devices with limited internal space such as smartphones and tablets, which can reduce the package space while ensuring performance, leaving more space for other components.

Cob flip chip vs smd

SMD and COB each have their own advantages and disadvantages. Which technology to choose depends on the specific application scenario and requirements.

Application scenarios and comparison of advantages and disadvantages

1. Packaging method:

  • SMD: SMD (Surface Mount Device) technology is to package LED chips into lamp beads and then solder them on the PCB board. This technology is mature and low-cost, and is suitable for LED displays with regular spacing.
  • COB: COB (Chip-on-Board) technology is to directly package the LED chip on the PCB board, with a smaller dot pitch, which is suitable for micro-pitch LED display screens. Although the cost is higher, the process is simpler and the dot pitch can be smaller.

2. Dot pitch:

  • SMD: The dot pitch is larger, usually reaching P20 to P1.25, but it is difficult to reduce further.
  • COB: The dot pitch is smaller, suitable for products of P1.25 and below, such as P0.93, P0.78, etc.

3. Cost:

  • SMD: Due to mature technology and low cost, it is suitable for large-scale production and conventional applications.
  • COB: Due to the high cost of technology and materials, it is suitable for the high-end, high-demand micro-pitch LED display market.

4. Stability and life:

  • SMD: Due to the protrusion of the lamp beads, it is easy to cause the problem of falling or dead lights during installation and removal.
  • COB: Directly encapsulated on the PCB board, the probability of falling and dead lights is reduced, and the stability is better.

5. Optical performance and heat dissipation performance:

  • SMD: The light spot may be uneven due to the independent light emission of multiple LED chips, and the color rendering performance is affected by the design and materials. Heat dissipation performance is affected by the packaging design of a single LED chip.
  • COB: Multiple LED chips are closely arranged, the light spot is uniform, the color rendering performance is good, and the heat dissipation area is large and uniform.

What is the difference between flip chip and BGA?

The main difference between flip chip (Flip Chip) and BGA (Ball Grid Array) lies in the packaging method and application scenario.

1. Packaging method

  • Flip chip (Flip Chip): Flip chip is a packaging technology that directly solders the contact points of the chip to the substrate. The contact points of the chip (usually metal balls) are directly connected to the contacts on the substrate to form an electrical connection.
  • BGA (Ball Grid Array): BGA is a surface mounting technology in which the chip is connected to the pads on the substrate through its contact points (usually ball pins). BGA packaging usually uses a solder ball array, and the solder balls are fixed to the substrate by reflow soldering.

2. Application scenarios and advantages and disadvantages

Flip chip:

  • Advantages: Reduced resistance and parasitic capacitance, increased signal transmission speed; small package size, suitable for high-density integration; high reliability because of reduced connection points.
  • Disadvantages: Complex manufacturing process and high cost; requires precise alignment and welding technology.
  • Application scenarios: Suitable for high-performance computing and high-speed signal transmission occasions, such as CPU, GPU, etc.

BGA:

  • Advantages: Increased I/O pin count and increased packaging density; increased assembly yield; improved electrothermal performance.
  • Disadvantages: Occupies a large substrate area; relatively complex manufacturing process and high cost.
  • Application scenarios: Suitable for high pin count and high performance requirements, such as high-end processors, graphics processing units, etc.

What is the difference between flip chip and COB?

Flip chip and COB (Chip on Board) have significant differences in definition and application.

1. Definition and basic concepts

  • Flip chip is a chip packaging technology in which the I/O end (pin) of the chip faces downward and is connected to the substrate through solder bumps. This technology can improve packaging density and electrical performance, and is often used in high-performance computing and communication equipment.
  • COB (Chip on Board) is a technology that directly packages chips on circuit boards, aiming to solve the shortcomings of traditional LED displays, such as dead lights and falling lights, and improve stability and resolution. COB technology is divided into two types: positive and flip.
What is a flip chip cob led?

2. Packaging method:

  • Flip chip: The I/O end of the chip faces down and is connected to the substrate through solder bumps.
  • COB: The chip is directly packaged on the PCB board, which is divided into positive and flip. The positive chip faces up and is connected through welding wires; the flip chip faces down and is directly connected to the PCB without welding wires.

3. Application field:

  • Flip chip: Widely used in high-performance computing, communication equipment and other fields, it is favored for its high-density installation and good electrical performance.
  • COB: Mainly used in LED displays, especially in the field of high-end displays. COB technology can solve the problems of high thermal resistance, high cost and smaller spacing in traditional SMD packaging.

4. Advantages and Disadvantages:

  • Flip chip: Advantages include high packaging density and good electrical performance; Disadvantages are complex production process and high cost.
  • COB: Formal COB has lower cost, but there are wire bonding problems that affect stability and heat dissipation efficiency; Flip chip COB has high process requirements, better stability, strong thermal conductivity, but higher cost.

Flip chip COB LED integrates the advantages of COB packaging and flip chip technology, achieving precise light color control and uniform light distribution in optical performance, excellent electrical performance, efficient heat dissipation, and strong stability. As a professional PCB manufacturer, BEST Technology is committed to creating high-quality PCBs for flip chip COB LEDs and providing stable and reliable solutions.

Is rf assembly high frequency or low frequency?
Thursday, December 19th, 2024

Is rf assembly high frequency or low frequency?RF components have a wide operating frequency range, covering multiple frequency bands from low frequency to high frequency. Generally speaking, the RF band generally refers to 3kHz to 300GHz, but in actual applications, 3kHz to 30MHz is often regarded as a low-frequency RF range, such as some simple wireless remote controls, while 30MHz to 300GHz belongs to high-frequency RF.

What is high-frequency vs low frequency?

Definition of high frequency and low frequency

  • Low-frequency circuit: mainly used to process signals with lower frequencies, usually in the range of tens of hertz to several thousand hertz. Common applications include audio circuits, etc.
Is rf assembly high frequency or low frequency?
  • High-frequency circuit: used to process signals with higher frequencies, usually in the range of several thousand hertz to several hundred megahertz. High-frequency circuits are very important in applications such as communications, radars, and satellites.

Differences between high frequency and low frequency in PCB design

  • Power supply design: In high-frequency PCB design, the power supply design is usually one layer, which can minimize signal loops and thus reduce noise.
  • Signal integrity: High-frequency PCB design requires special attention to signal integrity, including signal transmission delay, reflection and crosstalk.

Is RF high or low-frequency?

RF (radio frequency) is high frequency. It refers to the electromagnetic frequency that can be radiated into space. Its frequency range is from 300kHz to 30GHz, so it belongs to the high-frequency category. Alternating current that changes less than 1000 times per second is called low-frequency current, while alternating current that changes more than 10,000 times per second is called high-frequency current. RF is such a high-frequency current.

Basic characteristics of RF

  • Frequency and wavelength: The frequency of RF is between 300kHz and 30GHz. The wavelength is inversely proportional to the frequency, that is, the shorter the wavelength, the higher the frequency. The frequency of RF is higher, so the wavelength is shorter.
  • Amplitude and phase: The amplitude signal of RF represents the measure of the change of electric field oscillation, and the phase represents the position of a single time point in the wave cycle.
  • Modulation: In order to achieve communication, the RF signal needs to be modulated. Modulation includes analog modulation and digital modulation, which uses frequency, phase and amplitude to transmit data.

What is the highest RF frequency?

The highest frequency of RF (radio frequency) is 300GHz. Within this frequency range, RF is widely used in fields such as radar and wireless communication.

The basic characteristics of RF include frequency, wavelength, amplitude and phase. Frequency refers to the frequency of electromagnetic field oscillation, measured in Hertz (Hz). Wavelength is inversely proportional to frequency, that is, wavelength is equal to the speed of light divided by frequency. The amplitude of RF refers to the measure of the change in electric field oscillation, while the phase indicates the position of a single time point in the wave cycle.

How do you know if the frequency is high or low?

In PCB design, judging whether the frequency is high or low is mainly based on the frequency range of the signal.

Definition of frequency range

  • High frequency: usually refers to signals with frequencies between 3MHz and 300GHz. In PCB design, signals greater than 50MHz are generally considered high-speed signals, and signals with rising/falling edges less than 50ps are also considered high-speed signals.
Is rf assembly high frequency or low frequency?
  • Low frequency: usually refers to signals with frequencies between hundreds of Hz and hundreds of kHz.

Specific applications in PCB design

  • High-frequency PCB design: In high-frequency PCB design, the power supply design is usually one layer, which can minimize the signal loop and thus reduce noise. In addition, high-frequency signals are susceptible to interference, so special attention should be paid to noise issues in the design.
  • Low-frequency PCB design: Low-frequency circuit design usually does not need to consider signal loops and noise issues too much, but it is still necessary to pay attention to signal integrity and electromagnetic compatibility.

Measurement methods and tools

  • Oscilloscope: Oscilloscope is a common tool for measuring signal frequency. The frequency range of the signal can be judged by observing the waveform.
  • Spectrum analyzer: Spectrum analyzer can measure the frequency component of the signal more accurately and is suitable for occasions requiring high-precision measurement.

What is high-frequency PCB?

High-frequency PCB is a special type of circuit board designed specifically for processing high-frequency signals, and its operating frequency can reach hundreds of megahertz (MHz) to tens of gigahertz (GHz). High-frequency PCB occupies a key position in high-frequency application scenarios such as wireless communication, 5G, Wi-Fi, radar, and high-speed data transmission.

Is rf assembly high frequency or low frequency?

High-frequency PCB has a low dielectric constant, which leads to less signal loss during transmission. It is suitable for efficient transmission. It uses special materials to ensure a small dielectric constant, thereby ensuring transmission speed and meeting the needs of high-speed data transmission. In the field of precision metal material heating treatment, high-frequency PCB can achieve heating of components of different depths to meet various heating needs.

What is RF PCB?

RF PCB is a printed circuit board specially used for RF circuit design and manufacturing. It has unique characteristics and requirements in high-frequency signal transmission, impedance control, shielding and isolation, miniaturization and high-density wiring.

It is mainly used to process high-frequency signals, usually above 100MHz, and is widely used in wireless communications, radar systems and other application scenarios that need to receive and send wireless signals.

What is microwave PCB?

Microwave PCB (microwave printed circuit board) is a circuit board specially designed to process microwave frequency band signals. Microwave PCB usually works in microwave bands with a frequency greater than 2GHz. It uses a specific microwave substrate copper clad board and is produced through a special manufacturing process to meet the low-loss and low-delay transmission requirements of high-frequency signals. Its characteristics include:

Is rf assembly high frequency or low frequency?
  • Low loss: Microwave PCB uses materials with low dielectric constants to reduce energy loss during signal transmission.
  • High stability: stable performance in high temperature and high humidity environments, ensuring reliable signal transmission.
  • Low latency: suitable for high-speed data transmission needs, ensuring signal accuracy and stability.

The frequency range of RF components covers low frequency and high frequency, with unique characteristics and a wide range of application scenarios. As the key foundation for supporting the operation of high-frequency RF components, the characteristics and design of high-frequency PCB directly affect the performance of RF components. From signal integrity to system stability to miniaturization integration capabilities, they are inseparable from the careful design and optimization of high-frequency PCB.

What is NPTH in PCB?
Wednesday, December 18th, 2024

What is NPTH in PCB? NPTH is a through hole on PCB, but unlike plated through hole, its hole wall is not treated with electroplated metal. These holes are usually used for mechanical installation, positioning or as non-electrical connection purposes such as ventilation and heat dissipation channels.

What is an NPTH?

NPTH refers to non-plated through hole, that is, a hole without electroplated metal on the hole wall. The hole wall of NPTH hole is not electroplated with metal and is usually used for positioning, fixing or as a screw hole. These holes do not participate in electrical connection and are mainly used for mechanical fixing or structural support.

What is NPTH in PCB?

NPTH holes are often used in the following scenarios:

  • Positioning hole: used to position and fix other components or parts on PCB.
  • Screw hole: used to install screws and fix PCB or other components.
  • Mounting hole: used to install connectors or other external devices.

What is the full form of NPTH?

The full name of NPTH is “Non Plating Through Hole”. In printed circuit boards (PCBs), NPTH refers to holes whose walls are not plated with metal and therefore do not participate in electrical connections. Such holes are usually used for positioning, fixing screws or other non-conductive purposes.

What is the difference between PTH and non PTH?

The main difference between PTH (Plating Through Hole) and NPTH (Non Plating Through Hole) is whether the hole wall is plated.

1. Plating:

  • PTH: The hole wall is plated and is usually used for electrical connections, such as vias (VIA) and component holes. There is copper on these hole walls, which can achieve electrical conduction between the layers of the circuit board.
  • NPTH: The hole wall is not plated and is usually used for positioning, fixing and other functions, such as screw holes or connector fixing holes. There is no copper in these hole walls and does not participate in electrical connections.

2. Appearance characteristics:

  • PTH: There are traces of plating, the hole wall is smooth and covered with copper.
  • NPTH: There are no traces of plating, the hole wall is not smooth and not covered with copper.

3. Application scenarios:

  • PTH: Mainly used in scenarios where electrical connection is required, such as connecting different layers of a circuit board or connecting components.
  • NPTH: Mainly used in scenarios where electrical connection is not required, NPTH holes usually do not have hole rings, but in some special cases, hole rings are also designed to achieve grounding functions.

What is a PTH pad?

PTH pads (Plated Through Hole) refer to pads with through holes, and the hole walls are copper-plated. PTH pads play an important role in PCB design, and are mainly used to connect different layers of a circuit board or connect component pins to a circuit board.

The following points should be noted during the design and manufacturing process of PTH pads:

  • Size and shape: The outer ring of the PTH pad cannot be less than 0.2mm (8mil) on one side to ensure stability during welding.
  • Welding process: During welding, the PTH pad will take away a considerable amount of solder, which may cause insufficient solder problems.
  • Manufacturing capability: The design of the PTH pad is directly related to the manufacturing capability of the circuit board, which may cause welding quality problems.

PTH pads play a key role in PCB assembly, ensuring stable connection of components and reliable electrical performance. Correct PTH pad design can significantly improve the reliability and manufacturing quality of the circuit board.

How thick is plated through-hole plating?

The plating thickness standards for plated through-holes vary depending on the application scenario. Specifically:

  • IPC Level 1: The smallest thickness, short service life, usually used in consumer electronics that may become obsolete in a few years, requires an average thickness of 20 microns, and spots are not thinner than 18 microns.
  • IPC Level 2: More durable, continuously used holes, suitable for equipment that often runs for 5 years or more, requires an average thickness of 20 microns, and spots are not thinner than 18 microns.
  • IPC Level 3: The thickest and most durable plated through-holes, used for products expected to be used for ten years or more, requires an average thickness of 25 microns, and spots are not thinner than 20 microns.

What is the anatomy of a plated through-hole?

A plated through-hole (PTH) is a hole drilled in a circuit board, and a layer of metal is deposited on the hole wall through an electroplating process to achieve electrical connections between different layers of the circuit board. Its construction usually includes the following parts:

  • Hole wall: The hole wall of the plated through-hole is formed by drilling, usually in a circular or other shape.
  • Metal plating: A layer of metal deposited on the hole wall by electroplating process to achieve electrical connection. The thickness and quality of the metal plating have an important impact on the electrical performance and reliability of the plated through-hole.
  • Pad: Located at both ends of the plated through-hole, it is used to solder electronic components or connect other circuit boards. The shape and size of the pad are usually designed according to the type and size of the electronic component.
  • Solder mask: A layer of insulating material covering the surface of the circuit board to prevent solder flow and short circuit during soldering. The solder mask usually leaves a certain opening around the plated through-hole to solder electronic components.

What is the required hole fill of a plated through-hole?

The required hole fill of a plated through-hole is usually required to reach 100%. Specifically, the plated through-hole (PTH) should be filled with 100% vertical solder, the solder side should have a perfect fillet, and the component and pad should be in 100% contact with the solder.

The surface of the weld should be smooth, non-porous, non-disturbed, bright, and the solder joints completely wrap the solder feet and are concave. In addition, electroplating hole filling technology also plays an important role in improving the electrical performance and connection reliability of circuit boards.

What is NPTH in PCB?

Electroplating hole filling can improve electrical performance, improve connection reliability, avoid electromagnetic interference, and has excellent solderability and a more simplified process. In practical applications, electroplating hole filling is suitable for blind holes with a diameter of 80-220um and a thickness-diameter ratio of less than or equal to 1:1. The hole filling rate can reach more than 85%.

What is the difference between plated and coated?

The main difference between plating and coating lies in their formation method and application scenarios.

1. Formation method

  • Plating: Plating is a metal protective layer formed on the surface of the material by electroplating or chemical plating. Electroplating is to use the principle of electrolysis to plate a thin layer of other metals or alloys on certain metal surfaces to form a metal film. Chemical plating is to form a metal coating on the surface of the material through chemical reaction.
  • Coating: Coating is a protective layer formed by spraying paint on the surface of the material. Common coating methods include hot-dip galvanizing, thermal spraying and surfacing, which mainly apply metal to the surface of the substrate by physical means.

2. Application scenarios

  • Plating: Plating is widely used in aviation, automobile, electronics and other fields. In the aviation field, coating can improve the mechanical strength and processing accuracy of parts and reduce the weight of parts; in the automotive field, coating can improve the corrosion resistance and wear resistance of the car body.
  • Coating: Coating is widely used in construction, machinery, automobile and other fields. In the construction field, coating mainly plays the role of anti-corrosion, waterproof, heat preservation, etc.; in the mechanical field, coating can enhance the hardness, wear resistance and corrosion resistance of the material surface.

3. Advantages and disadvantages

  • Plating: Advantages include good anti-corrosion, anti-wear, electrical conductivity, thermal conductivity and aesthetics. Disadvantages are complex process and high cost.
  • Coating: Advantages are simple process, low cost, anti-corrosion, waterproof, wear resistance, heat insulation and other characteristics. Disadvantages are that the aesthetics and some physical properties are not as good as plating.

Although NPTH in PCB does not directly participate in electrical connection like plated through holes, it plays an irreplaceable role in mechanical installation, heat dissipation, etc., and together with plated through holes, it constitutes a complete functional system of PCB.

What are PCB stencil printers?
Wednesday, December 18th, 2024

What are PCB stencil printers? stencil pcb printers is a process for applying solder paste to specific pad locations on a PCB board with high precision. The core tool is the PCB stencil, a thin sheet of precision-machined metal with holes that exactly match the shape, size, and location of the PCB board pads.

What is a PCB stencil?

A stencil in PCB refers to a tool used in the surface mount assembly process to precisely deposit solder paste at specific locations on a printed circuit board. The stencil is usually made of brass or stainless steel and is engraved with circuit patterns that match the locations of surface mount devices (SMDs) on the PCB.

What are PCB stencil printers?

The stencil plays a vital role in the PCB assembly process. It ensures that solder paste is accurately deposited at the locations of the SMDs, thereby ensuring that the components are accurately mounted in the correct locations.

The design of the stencil, including its composition, thickness, and the shape and size of the holes, will affect the quality of the solder paste deposition. Too much or too little solder paste can lead to welding quality problems, such as ball formation, bridging or tombstoning.

What is a PCB stencil made of?

PCB stencils are mainly made of stainless steel, which has good corrosion resistance and high hardness. This stencil is usually called a SMT Stencil or a solder paste printing stencil, which is mainly used to print solder paste onto PCB circuit boards during SMT assembly.

The stencil is cut by high-precision laser, and has holes or grooves corresponding to the PCB pads, which are used to accurately control the printing of solder paste.

What types of PCB stencils are there?

The types of stencil in PCB stencils mainly include the following:

  • AI stencil: mainly used in SMT process, can replace dispensing machines, improve production efficiency and reduce costs.
What are PCB stencil printers?
  • Laser stencil: through high-energy laser cutting to create an opening that perfectly matches the PCB pad, it has the advantages of high precision and smooth edges, and is particularly suitable for high-density and high-demand PCB assembly.
  • Etched stencil: The opening is formed by chemical etching liquid corroding the steel sheet. The cost is lower, but the accuracy and edge smoothness are not as good as laser cutting.

These stencil types have their own characteristics and are suitable for different PCB manufacturing needs. Laser stencils are particularly suitable for high-density and high-demand PCB assembly due to their high precision and smooth edges; while etched stencils are suitable for applications with low precision requirements due to their low cost and simple manufacturing process.

What is the function of a PCB stencil?

The stencil in the PCB template plays a vital role in the manufacturing process. The stencil is a high-strength metal grid that is mainly used to apply solder paste on the PCB. Its specific functions include:

  • Accurate quantitative distribution of solder paste: The stencil accurately controls the distribution of solder paste through the holes on it, ensuring that the solder paste is evenly and accurately applied to the predetermined pad position on the PCB, avoiding too much or too little solder paste, thereby ensuring welding quality.
  • Improve welding quality: By precisely controlling the distribution of solder paste, stencil helps reduce welding defects such as bridging and empty soldering, improves the consistency and reliability of welding, and thus improves the electrical performance of the entire PCB and the overall quality of the product.
  • Adapt to complex designs: With the trend of miniaturization and high density of electronic products, the components on PCBs are getting smaller and smaller, and the spacing is getting closer and closer. Stencil can be customized according to design requirements to meet the needs of high-end electronic products.
  • Improve production efficiency: On an automated production line, with the use of precision stencil and automatic solder paste printers, fast and efficient mass production can be achieved, greatly improving production efficiency and reducing the error rate of manual operation.

How to design a PCB stencil?

In the surface mount (SMT) assembly process, solder paste stencil plays a key role. Its ability to accurately apply solder paste is directly related to the quality and reliability of the connection between SMD components and PCB pads. The following are the key points to focus on when designing solder paste stencils:

  • Matching design files: The design of solder paste stencils must be closely constructed based on the solder paste layer information of the PCB to ensure that every hole and shape on the stencil is precisely matched with the solder paste layer, so as to provide an accurate basis for subsequent solder paste coating and avoid poor welding problems caused by design deviations.
  • Selection and thickness: There are many types of solder paste stencils, the most common of which are stainless steel stencils and polymer stencils. At the same time, the determination of stencil thickness cannot be ignored. It is usually in the range of tens to hundreds of microns. It needs to be finely adjusted in combination with factors such as pad size, pin spacing, and required solder paste amount to ensure uniformity and stability of solder paste coating.
What are PCB stencil printers?
  • Hole size and shape: The hole size and shape of the stencil should be perfectly matched with the solder paste area on the solder paste layer, and the solder paste coating range should be strictly controlled to prevent the solder paste from overflowing to the adjacent pads and causing short circuit failures, or insufficient solder paste coating affecting the welding quality, to ensure that the solder paste coating is accurate at every location.
  • Customized special design: For special components or parts with special pin structures, a special design scheme is required on the solder paste stencil.

How to use a PCB stencil?

The following are the steps to use a PCB stencil:

1. Preparation:

  • Check whether the PCB stencil opening is blocked or deformed, and whether the PCB board surface is clean.
  • According to the size of the printer and the stencil, install the stencil through the positioning hole and the printer positioning pin to ensure the correct direction and secure fixation.
What are PCB stencil printers?

2. Solder paste preparation:

  • Select solder paste according to PCB welding requirements and component type, check the shelf life and quality, take it out and stir it for 3-5 minutes to make it uniform.

3. Solder paste printing:

  • According to the thickness of the stencil, opening and solder paste characteristics, adjust the parameters such as the printer scraper pressure, printing speed), demolding speed and stroke.
  • Start the printer, and the scraper moves to fill the stencil opening with solder paste and transfer it to the PCB pad. Observe the printing situation during the process and adjust it in time if there is any problem.

4. Post-printing inspection and cleaning:

  • Use a magnifying glass or SPI to check the quality of solder paste printing on the PCB board, and reprint the unqualified ones after cleaning.
  • Use special solvents and tools to clean the template, remove the residual solder paste, and store it properly after drying.

PCB stencil printing is an indispensable key process in the field of electronic manufacturing. As a core tool, the quality and precision of the stencil directly determine the coating effect of the solder paste on the PCB board, which in turn affects the welding quality of electronic components, and ultimately plays a decisive role in the performance, reliability and stability of electronic products.

How are the circuit boards connected?
Tuesday, December 17th, 2024

How are the circuit boards connected? Soldering is the most common and long-standing way to connect circuit boards. For traditional circuit boards, we usually use electric soldering irons to perform soldering operations. First, the metal part of the electronic component pins or wires to be connected is tightly fitted with the corresponding pads on the circuit board. Then, the pads and pins are heated with an electric soldering iron, and the solder wire is brought close together to melt the solder and evenly wrap the connection parts to form a stable metal connection.

How are the circuit boards connected?

A circuit board 6 connections typically refers to a design that incorporates six distinct points or pads for electrical connections, which could be input/output ports, signal pathways, or power connections. These boards are often used in simple applications where a limited number of connections are needed to interface with other components or systems.

What are the connections between circuit boards?

The main ways to connect circuit boards include the following:

  • Welding connection: This is one of the most commonly used connection methods, which connects components on the circuit board together by welding. The advantages of welding connection are stable and reliable connection, low cost, and suitable for circuit boards that do not require regular changes.
  • Plug-in connection: Plug-in connection can achieve fast plug-in and pull-out, easy replacement and maintenance, but requires high precision of plug-ins and sockets, and occupies a large space, which is not suitable for circuit boards with limited space.
  • Connector connection: This is a widely used circuit board connection method that can connect circuit boards of different forms and sizes. The advantages of connectors are convenient and fast connection, high reliability, and a large number of plug-in and unplug times, which are suitable for various circuit board application scenarios.
  • Plug-in connection: widely used in complex instruments and equipment, and connected through standard pins or sockets. This method is easy to replace and repair, ensuring the reliability and production efficiency of the connection.
  • Special connection methods: including V-cut and copper foil bridge connection, spring connection and spring connection, panel connection, etc. These methods are suitable for specific scenarios and needs, such as V-cut for the separation stage of PCB boards, spring connection and spring connection for the connection of flexible circuit boards, and panel connection for multiple PCB designs placed on a large substrate.

How to connect components on PCB?

There are usually the following ways to connect components on PCB:

  • Soldering: This is the most common connection method. By connecting the pins of the components to the pads on the PCB with solder, you can use a soldering iron or SMT equipment for soldering.
  • Spring contact: For some components that need to be replaced frequently, such as batteries, you can use spring contact to make the components easy to disassemble.
How are the circuit boards connected?
  • Screw fixing: For components that need to withstand large forces, such as heat sinks, motors, etc., screw fixing can be used. Pay attention to choosing the right screws and tightening strength.
  • Clamping with pliers: For some components that need to be fine-tuned, such as rheostats, potentiometers, etc., pliers can be used to clamp.
  • Plastic bayonet: For some components that need to be frequently plugged and unplugged, such as wire connectors, plastic bayonet can be used for connection.

How to connect PCB boards together?

To connect PCB boards together, you can consider the following common methods:

Welding:

  • PCB wire welding: This is a simple and commonly used method to achieve connection by directly welding the wire to the pad of the PCB board. When welding, you need to pay attention to the quality and stability of the welding to ensure the reliability of the connection.
  • PCB cable welding: It is suitable for situations where multiple wires need to be connected. You can use cable to connect multiple PCB boards together, and then fix the connection between the cable and the PCB board by welding.
  • Direct welding between PCBs: This method is often used for connections between two PCB boards at a 90-degree angle. When welding, attention should be paid to the alignment and fixation between the two PCB boards to ensure the quality of welding.

Plug-in connection:

  • Printed circuit board socket: This connection method is often used in more complex instruments and equipment. A printed plug is made from the edge of the PCB board. The plug part is designed according to the size of the socket, the number of contacts, the distance between contacts, the position of the positioning holes, etc., so that it matches the dedicated PCB printed circuit board socket.
How are the circuit boards connected?
  • Standard pin connection: This method is suitable for use in small instruments. Two PCB boards are connected by standard pins. The two PCB boards are generally parallel or vertical.
  • Crimping: The PCB board is crimped with other components through a special crimping tool to achieve connection. This method is suitable for situations where frequent disassembly and replacement are required.
  • Bonding: Use glue or adhesive to bond the PCB board with other components. This method is suitable for situations where the connection strength requirement is not high.
  • Use connectors: Connectors are a component specially used to connect PCB boards, which can provide reliable connection and convenient disassembly. There are many types of connectors, and you can choose the right connector according to specific needs.
  • Screw fixing: For some larger or heavier PCB boards, screws can be used to fix them to other components to ensure the stability of the connection.

What are the different types of PCB connectors?

The main types of PCB connectors include the following categories:

  • Ordinary board-to-board connector: used to connect two parallel or vertical PCBs, suitable for signal transmission between different circuit boards. According to different spacing, it can be divided into 0.50mm, 0.60mm, 0.80mm and other specifications. The smaller the spacing, the more pins can be accommodated, and the signal transmission is more intensive, but the processing accuracy and installation requirements are higher.
  • Mezzanine connector: mainly used to connect two PCBs with close spacing when space is limited. It is usually connected in a stacked manner to save space and is often used in the connection structure of the motherboard-daughterboard.
  • Backplane connector: a group of electrical connectors parallel to each other, each pin of each connector is connected to the same relative pin of all other connectors to form a connector bus.
  • Spring-type board-to-board connector: contains a spring structure inside, which can ensure a stable connection even when the spacing between the boards fluctuates. It is suitable for devices with high requirements for connection stability.
  • Wire-to-board connector: used to connect wires or cables to PCBs. The wire connection part is similar to the wire-to-wire connector, while the circuit board connection part is mostly a two-piece connector that is press-fit or welded.
  • Wire-to-wire connector: used to connect two wires. One end of the connector is permanently connected to the wire, and the other end forms a detachable interface. Permanent connection methods can use crimping or insulation displacement contacts (IDC), etc.

How to choose PCB connectors?

There are several key factors to consider when choosing PCB connectors:

  • Connector type: choose the appropriate connector type according to application requirements.
  • Size: The size of the connector needs to adapt to the size and layout of the circuit board to ensure that the connector can be properly installed and connected.
How are the circuit boards connected?
  • Electrical performance: consider the rated voltage, rated current, and withstand voltage of the connector to ensure that it can withstand the electrical load required by the device.
  • Mechanical performance: includes the number of plug-in and unplugging times, durability, and shock resistance. If the device needs to frequently plug and unplug the connector, a durable and long-life connector should be selected; if the device will be subject to vibration or shock, a connector with good shock resistance should be selected.
  • Environmental conditions: Environmental conditions have a great impact on the choice of connectors.
  • Technical parameters: Understand the technical requirements of the application, including pin spacing, soldering method, rated voltage, rated current, number of plug-in and unplug times, temperature range, board spacing, connector geometry, and solder hole diameter of the solder tab.

How do you connect wire to a circuit board?

Soldering is usually used to connect wires to circuit boards. Solder the ends of the wires to the pads on the circuit board using a soldering iron and solder.

  • Prepare tools and materials: soldering iron, solder wire, flux, wires, and circuit boards.
  • Clean wires and circuit boards: Use alcohol or other cleaning agents to clean the wires and pads on the circuit board to ensure a good solder connection.
  • Strip the wire: Use wire strippers or scissors to strip a section of the wire end to expose the metal wire inside.
  • Tin the wire: Place the end of the wire on the soldering iron tip and wrap it with solder wire at the same time to evenly coat the end of the wire with a layer of solder.
  • Solder wires to circuit boards: Place the tinned wire ends on the pads on the circuit board, and use a soldering iron to melt the solder to connect the wires to the pads.
  • Check welding quality: Check whether the solder joints are firm and whether there are problems such as cold solder joints or short circuits.
  • Clean the soldering area: Use alcohol or other detergents to clean the soldering area to remove excess solder and flux.

Circuit board connection is a technology that requires both theoretical knowledge and practical experience. From basic soldering and plug-in connections to various unique ways of PCB connection, each connection method has its applicable scenarios and key points. Regardless of the connection method, preparation before connection, detailed control during the connection process, and detection and debugging after connection are all crucial.

What is heavy copper pcbs?
Friday, December 13th, 2024

What is heavy copper pcbs? That is, the copper foil thickness is greater than the conventional standard PCB. Generally speaking, when the copper foil thickness reaches 3 ounces per square foot (oz/ft²) and above, it can be called a heavy copper PCB.

The manufacturing process of heavy copper PCBs is more complicated than that of ordinary PCBs, requiring higher technical levels and professional equipment. Compared with ordinary PCBs, its characteristics are high current carrying, good heat dissipation, high mechanical strength and strong reliability. It is suitable for high-power electronic equipment, harsh working environments and fields with high reliability requirements.

What is heavy copper pcbs?

What is high copper thickness PCB?

High copper thickness PCB refers to a printed circuit board that uses thicker copper foil as the conductive material. In the standard PCB manufacturing process, the thickness of the copper foil is usually determined according to the application requirements, but when the thickness of the copper foil is greater than or equal to 3 ounces, this PCB is called a high copper thickness PCB.

Usually compatible with FR-4 dielectric, mainly used for inner layers rather than outer layers, plated through holes (PTH) usually need to be plugged/filled, and careful registration and lamination are required

Common heavy copper PCB thickness:

  • 2 oz (70 microns)
  • 3 oz (105 microns)
  • 4 oz (140 microns)
  • 6 oz (210 microns)
  • 8 oz (280 microns)
  • 10 oz (350 microns)

Application areas of heavy copper PCB:

  • Automotive electronics: widely used in key electronic devices such as automotive control modules, engine control systems, airbags, etc., because they can withstand high temperature, low temperature, corrosion and other environmental factors.
  • Power circuit: widely used in power modules, DC-DC converters and high power distribution boards, etc., capable of handling high current and high power requirements.
  • Industrial control system: used in high power motor drives, automation equipment and large mechanical control to meet the needs of high conductivity and mechanical strength.
  • Renewable energy systems: used in solar and wind energy systems to ensure stable system operation and reduce failure rates.

What are the advantages of heavy copper PCBs?

  • High conductivity: High copper PCB uses heavy copper foil as the conductive layer. Compared with ordinary PCB, its conductivity is significantly improved, which can carry larger current, reduce resistance loss and improve circuit efficiency.
  • High mechanical strength: Due to the increase in the thickness of copper foil, the mechanical strength of high copper PCB is also improved accordingly, which can withstand greater mechanical stress and impact, and is not easy to deform or damage.
What is heavy copper pcbs?
  • Good heat dissipation performance: High copper PCB can quickly transfer heat from the circuit to the surrounding environment, effectively prevent components from overheating and damage, and improve the reliability and service life of the equipment.

What type of copper is PCB?

There are mainly the following types of copper on PCB: red copper, copper clad plate and inner layer copper.

  • Red copper: Red copper is the earliest material used in circuit boards, and is widely used due to its good processing performance and conductivity. The main component of red copper is copper, and the other components are less, but the disadvantage is that it is easily oxidized and corroded.
  • Copper clad laminate: Copper clad laminate is a layer of copper foil on an inorganic substrate, usually used for double-sided and multi-layer circuit boards. The copper foil ensures the conductivity and connectivity of the circuit board, while the inorganic substrate provides mechanical strength and heat resistance.
  • Inner copper: Inner copper is used in multi-layer circuit boards, which are made of multiple layers of inorganic substrate and copper foil. It is usually used in high-density or high-speed design circuit boards, with better signal transmission performance and higher mechanical strength, but the manufacturing cost is higher.

In addition, there are different types of copper foil in PCB, including electrodeposited copper and rolled copper. Electrodeposited copper has a vertical grain structure and a rougher surface, which is suitable for rigid PCB boards; while rolled copper has a horizontal grain structure and a smoother surface, which is suitable for flexible and high-speed circuit boards.

How thick is 2 oz copper on PCB?

The thickness of 2 oz copper is about 70 microns. In PCB design, copper thickness is usually expressed in ounces (oz), and the thickness of 1 ounce of copper is about 35 microns, so the thickness of 2 ounces of copper is about 70 microns.

The copper thickness standard of PCB board is usually expressed in oz/ft² (ounces/square foot) or um (micrometer). The copper thickness of PCB board has an important impact on the performance and stability of the circuit board. The outer copper thickness mainly affects the stability of signal transmission and the ability to resist electromagnetic interference, while the inner copper thickness affects the signal transmission rate and signal-to-noise ratio.

Generally speaking, the thicker the outer copper thickness, the stronger the stability and signal strength of the circuit board, which is suitable for high-frequency and high-speed occasions; while the thinner the inner copper thickness, the more suitable for high-speed transmission signals, and the thicker the inner copper thickness, the more suitable for low-speed transmission signals and high signal-to-noise ratio signals.

Why use heavy copper PCB?

The main reasons for using heavy copper PCB include the following aspects:

  • Enhanced current carrying capacity: Heavy copper PCB uses a thicker copper layer, which can carry a larger current and reduce resistance and voltage drop. This is especially important for high-power applications or circuits that require high current transmission.
  • Optimize heat dissipation performance: Copper has good thermal conductivity, and a thicker copper layer can more effectively conduct heat away from hot spots and improve heat dissipation efficiency.
  • Improve signal transmission efficiency: Thicker copper layers can reduce losses and reflections during signal transmission and improve signal integrity.
  • Enhance mechanical strength: Thicker copper layers can increase the overall structural strength of PCBs, making them more resistant to physical shock and deformation.
  • Adapt to complex process requirements: Heavy copper PCBs can meet complex circuit design requirements through special process treatments, such as etching, drilling, gold plating, etc., to ensure the accuracy and reliability of circuit boards during manufacturing.

What is the most common copper thickness for PCB?

The most common PCB copper foil thickness is 35 microns. This thickness of copper foil is suitable for most consumer electronics products, can meet daily current and heat requirements, and has a relatively low cost and is suitable for large-scale production.

How are heavy copper PCBs made?

In the initial stage of making heavy copper PCBs, relatively heavy copper foil materials are selected. These copper foils are usually produced by electrolytic copper. During the electrolysis process, copper foils of different thicknesses can be produced by controlling the conditions of electrolysis, such as current density, electrolyte composition, and electrolysis time.

For situations where thicker copper foil is required, multiple lamination methods are used. Multiple layers of copper foil and insulating substrate materials are laminated according to design requirements, and then the copper foil and substrate are tightly combined through a high-temperature, high-pressure lamination process.

Next, the circuit pattern is manufactured on the outer layer of the heavy copper PCB, usually using a photolithography process. After that, according to the design requirements, holes are drilled on the heavy copper PCB to provide conditions for installing components and connecting circuits.

What is heavy copper pcbs?

After the drilling is completed, a metal layer is covered on the hole wall using electroplating technology to achieve a connection between the layers, and a layer of copper foil is electroplated on the hole wall to increase the thickness of the conductor and the surface pad. Next, the dry film and excess copper foil are removed, and chemical etchants are generally used to make the circuit pattern clearer.

Subsequently, the heavy copper PCB is subjected to surface treatment, such as gold plating, tin spraying, etc., to improve welding performance and corrosion resistance. Finally, the finished heavy copper PCB is strictly inspected and tested to ensure that its electrical and mechanical properties are consistent with the design requirements.

Professional Heavy copper PCB manufacturers – BEST Technology

The minimum width and thickness of the heavy copper PCB conductor are mainly determined based on the required current carrying capacity and the maximum temperature rise allowed for the conductor. From the perspective of its size specifications and actual manufacturing process, the routing of the circuit board may not be a regular rectangular shape.

What is heavy copper pcbs?

It is worth noting that the thicker copper conductor will significantly increase the overall thickness of the circuit board to a large extent. In terms of manufacturing process, the additive method (electroplating) process has certain advantages over the subtractive method (etching) process, but at the same time, its cost is relatively higher.

BEST Technology process capabilities:

  • Substrate: FR4/Aluminum
  • Copper thickness: 4OZ~10OZ
  • Extremely heavy copper thickness: 20~200 OZ
  • Contour: Milling, Punching, V-Cut
  • Solder mask: White oil/Black oil/Blue oil/Green oil/Red oil
  • Surface treatment: Immersion gold, tin spraying, OSP
  • Maximum panel size: 580*480mm(22.8″*18.9″)

Heavy copper PCB occupies an important position in the electronics field with its unique characteristics. With high current carrying capacity, good heat dissipation performance, higher mechanical strength and excellent reliability, it has become an ideal choice for many high-demand application scenarios. From power electronics to automotive electronics, from aerospace to medical equipment and communications, heavy copper PCB plays a key role.