Maybe you’ve ever been recommended by your PCB manufacturer to add a mouse bite on the PCB edge？
But, what’s mouse bites? Is it something about the Rat?
Of course not, it is kind of connection way for PCB Panel.
As you know, usually the Printed Circuits Boards are manufactured on a standard sized panel, and sometime, the panel will with sharp edges, and those sharp edges are often referred to as “mouse bites” and they are left over after depanelization.
mouse bite PCB depanelization Best Technology
Mouse Bites usually presented as row of tiny holes on the board edge, just like the half holes around a stamp, which to connect and allow those small boards in an array.
mouse bite stamp holes on the PCB edge
Here is the picture for you to see how the mouse bites presented on the Gerber drawing and what it is when it is finished.
Partial Effect drawing after Penalization: (the way of connecting bridge is used in the middle, this way can reduce the residue of burr in minimize)
Partial Effect drawing pcb panel
PCB panel mouse bite
Some People also called mouse bites as perforated breakaway tabs, it is designed for a better the purpose of the mouse bites is for a better grasp when mounted.
Here is the design rules if you need to add the mouse bites on your PCB panel.
The distance between each single board need to arranged as 1.2mm and 1.6mm.
The distance between each holes need to be 0.2mm, the distance between holes center should be 0.75mm.
Need to add two rows, the mouse bites extend to 1/3 of the board, if there is a some circuits on the board edge, you will need to avoid it.
After adding mouse bites, the shapes of the two sides of the hole are connected, which is convenient for the production of gongs after work.
Here are some of our PCB with mouse bites for your reference.
mouse bite PCB Best Technology
PCB with mouse bit
If you want to add mouse bites on your PCB board, you are welcome to send us your request and we will help you make it on your PCB Panel.
Regarding all Metal core PCB required panelization, which needs to take into account how the boards are connected. There are two main connection methods for panel: Double face carved V-shaped groove (V-CUT), and the long slot plus a small circular hole (commonly known as stamp hole), depending on the shape of the PCB.
V-CUT
V-CUT is to draw a slot at the junction of two boards, where the connection of the boards is relatively thin and easy to break. Currently SMT Board is widely used, characterized with neat and level edges after separation, which is recommended as priority.
V-cuts are generally straight lines, and there will be no complicated traces such as curved arcs, so pay attention to be in a straight line when making the panelization. Please also note the following two points.
â‘ The two sides of V-CUT line (top side and bottom side) require a no circuits area that is not smaller than 1mm, to avoid the damage circuits when separating.
② After cutting the V-shaped groove, the remaining thickness should be 1/4 to 1/3 of the total board thickness , which is not smaller than 0.4mm.
V-Cut
Stamp Holes/Mouse Bite
For irregular PCB boards, the shape of the board has curved corners, there will be many burrs if use V-cut. In this case the stamp hole connection would be the better choice.
Panelization Rules:
The spacing between the panel and the board is 1.2mm or 1.6mm.
The diameter of hole is 0.55mm, generally a row of 8 holes (Hole count depends on the design requirements, more holes can enhance the stability), the spacing of the two holes is 0.2mm.
The distance between the upper and lower rows of holes is 2mm, and 1/3 of the stamp holes enter the board. Pay attention to avoid the circuit on the edge of the board.
After adding the stamp holes, the shape of both sides of the hole need to be connected to facilitate the subsequent routing manufacturing.
The part picture after panelization.(Using the connection bridge in the middle, which can minimize the residual.)
Part Picture
The effect picture after panelization.
Stamp Holes
If you want to learn more about MCPCB design, welcome contact us.
In the ceramic circuit board processing and production process, laser processing mainly includes laser drilling and laser cutting.
Ceramic materials such as alumina and aluminum nitride have the advantages of high thermal conductivity, high insulation and high temperature resistance, and have a wide range of applications in the fields of electronics and semiconductors. However, ceramic materials have high hardness and brittleness, and its molding and processing are very difficult, especially the processing of micropores. Due to the high power density and good directivity of the laser, lasers are generally used to perforate ceramic plates. Laser ceramic perforation generally uses pulsed lasers or quasi-continuous lasers (fiber lasers). The laser beam is focused on On the workpiece placed perpendicular to the laser axis, a laser beam with high energy density (105-109w/cm2) is emitted to melt and vaporize the material. An air stream coaxial with the beam is ejected by the laser cutting head to remove the melted material from The bottom of the incision is blown out to gradually form a through hole.
Due to the small size and high density of electronic devices and semiconductor components, the precision and speed of laser drilling are required to be high. According to the different requirements of component applications, electronic devices and semiconductor components have small size and high density. Due to its characteristics, the precision and speed of laser drilling are required to be high. According to the different requirements of component applications, the diameter of the micro-hole is in the range of 0.05 to 0.2 mm. For lasers used for ceramic precision processing, generally the focal spot diameter of the laser is less than or equal to 0.05mm. Depending on the thickness and size of the ceramic plate, it is generally possible to control the defocus to achieve through-hole punching of different apertures. For through-holes with a diameter less than 0.15mm, drilling can be achieved by controlling the defocus amount.
There are mainly two types method for cutting ceramic PCB: waterjet cutting and laser cutting. Currently, fiber lasers are mostly used for laser cutting. Fiber laser cutting ceramic circuit boards has the following advantages:
(1) High precision, fast speed, narrow cutting seam, small heat-affected zone, smooth cutting surface without burrs.
(2) The laser cutting head will not touch the surface of the material and will not scratch the workpiece.
(3) The slit is narrow, the heat-affected zone is small, the local deformation of the workpiece is extremely small, and there is no mechanical deformation.
(4) The processing flexibility is good, it can process any graphics, and it can also cut pipes and other special-shaped materials.
Al2O3 PCB with drilling
AlN PCB with drilling
 Under the development trend of light and thin, miniaturization, etc., the traditional cutting processing method has not been able to meet the demand due to the insufficient precision. Laser is a non-contact processing tool, which has obvious advantages over traditional processing methods in cutting process, and plays a very important role in the processing of ceramic substrate PCB.
Please contact sales@bestpcbs.com if you want to know more ceramic PCB.
When the bare Printed Circuit Board qty become volume fabrication, the PCB manufacture will not use the Probe flying tester to test the PCB circuit board. Best Tech will make new PCB test fixture to test the bare PCB, The electrical Test (E-test), which is the final electrical test to verify net continuity and the absence of shorts on the bare printed circuit boards (PCBs). In Best Tech PCB factory, we perform 100% electrical testing on all bare PCBs its facilities as per IPC-6012 class 2 standard. And from the following photo in computer, you can see it will show PASS for PCB.
in test
in test
To test the PCB boards, we require the NETLIST file. Normally we create a reference netlist file from the customer’s original Gerber files during PCB fabrication.
We always prefer to receive the CAD file based on the netlist for comparison. Since a CAD based netlist is generated before PCB routing, it provides another layer of checking (against the Gerber files). This allows us to catch any PCB faults introducing in the event of an error in the Gerber files. For full turnkey PCB assembly (PCBA service) projects, this helps to ensure that the PCB boards are 100% correct before any components are populated.
tester 2
tester2
Here are Best Tech E-tester Capabilities
Minimum Continuity Resistance
0.1 Ohms
Maximum Test Voltage
1000 Volts
Max Isolated Resistance
25 M Ohm – 2 G Ohm
Electrical Test Pitch (Fixture)
20mil(0.5mm)
Electrical Test Pitch (Flying Probe)
4mil
Debug /check for missing pins: (Test fixture)
10 minutes
Test time per board:
40 seconds
Setup time:
30 minutes
All points are tested simultaneously. However, this process involves set-up to create the fixture itself and additional costs associated with the cost of materials.
The electrical test fixture has a limited shelf life and repeat using times. For every PCB it will need a fixture and its custom-made for a customer only. Many other factories only store 2 years shelf life for electrical test fixtures, but Best Tech will store at least 3 years for customer.
In order to ensure the quality of fixtures and spare enough space to store fixtures, Best Tech leaves one floor to keep the fixture. See attached fixture photo.
tester 1
tester1
During the 3 years’ time, customer no need to pay the fixture charge again if the update is no update. The flexible test fixture shelf-life policy, it will help customer save the cost.
At the end of the PCB production process, we use electrical test to check the interconnectivity of the PCB is correct against the original board data.
Best Tech did the E-Tester to test the PCB 100% before delivery to customer, this makes Best Tech get highly comments from our customer on the world with good printed circuit board quality and best service. See the customer highly comments of Best Tech.
Do you know what is IPC standard for PCB?IPC, it is a trade association whose goal is to standardize the assembly and production requirements of electronic devices and components.  It was established in 1957 as the Institute of Printed Circuits.  IPC has developed thousands of standards and specifications to regulate the electronics manufacturing industry.
IPC standards are related to PCB design, production technology, electronic assembly, etc., in order to achieve high reliability, high quality, high performance, and meet user specifications.
What are the IPC Standards for?
Before we can understand IPC standards, we first need to know who made them. It comes from the IPC Association, a trade association whose goal is to standardize assembly and production requirements for electronic devices and components. It was founded in 1957 as the Printed Circuit Research Institute. Its name was later changed to the Institute for Electronic Circuit Interconnection and Packaging to highlight the expansion from bare boards to packages and electronic components. In 1999, the organization officially changed its name to IPC with the slogan “Association Connecting Electronics Industries”.
IPC standards are the most widely recognized code of acceptability in the electronics industry. The organization publishes standards for nearly every stage of the electronic product development cycle, including design, procurement, assembly, packaging, and more. In other words, IPC standards refer to everything in the electronics industry and are the basic knowledge of designers and manufacturers.
Just like the IPC standards tree, there are many different aspects of standards that all serve the end product. IPC-A-610, for example, focuses on the acceptability of electronic components and is used worldwide by original equipment manufacturers and EMS companies.
What is the PCB IPC Standard?
IPC plays a vital role in the PCB industry by establishing standards that cover every stage of PCB production from design to manufacturing. These standards ensure consistency and compatibility throughout the PCB process. During the design phase, IPC standards guide file formats, PCB design software, design guidelines, and electronic product documentation. They also affect the material selection of PCB components, surface mount equipment and surface treatments. In addition, these standards are essential for testing and evaluating the acceptability of printed boards.
When it comes to welding, IPC standards cover a variety of techniques, including reflow soldering, wave soldering and welding. These guidelines help companies determine whether their electrical and electronic components meet quality expectations during manufacturing. IPC standards also address cable and harness assemblies to ensure they meet standards.
The most widely recognized IPC standard for PCBs is IPC-6011, which Outlines the performance requirements for PCBS. However, IPC-6012 is more specific and governs the qualification and performance of rigid PCBs. IPC-6012 covers everything from how the PCB should be made to its thickness and the integrity of the copper layer. Compliance with this standard ensures that PCBs meet electrical and mechanical performance expectations. Whether you’re creating boards for high-end computers or small consumer devices, compliance with PCB IPC standards is critical to meeting industry and customer expectations. Here is the IPC tree for your reference:
What is the IPC Level of PCB?
One of the most widely used industry standards in the manufacturing of printed circuit boards is IPC-A-610C Acceptability of Electronic Assemblies and IPC-A-600 Acceptability of Printed Boards. This standard is used primarily for the incoming inspection of bare boards from a PCB fabricator.
In the IPC-A-610C document, electronic products are divided into level 1, level 2, and level 3. The higher the level, the stricter the quality inspection conditions. Here are how 3 levels divided:
Level 1 products: called general-purpose electronic products. Including consumer electronic products, certain computers and their peripherals, and products whose main purpose is to use functions.
Level 2 products: called dedicated service electronic products. Including communication equipment, complex industrial and commercial equipment and high-performance, long-life measuring instruments. Under normal use environment, this kind of product should not malfunction.
Level 3 products: called high-performance electronic products. Including high-reliability, long-life military and civilian equipment that can continue to operate. This kind of product must not allow any interruption failure during use, and at the same time, it is necessary to ensure the reliable startup and operation of the equipment in a harsh environment. Such as medical life-saving equipment and all military equipment systems.
For PCB manufacturing, do you know which IPC standards are commonly used?
multilayer pcb
IPC Standard for PCBs
The IPC has created several standards for printed circuit board (PCB) design, manufacturing, and assembly. Here I would like to share you some standards which we mainly use:
IPC-2221
A general standard that covers almost every aspect of PCB design, including electrical considerations, thermal design, and manufacturing-ready design.
IPC-2222
A guide for rigid PCB cross-sectional design, including recommendations for board thickness, hole aspect ratio, and dielectric clearance.
IPC-2223
A standard for reliable Flex-PCB design, including guidelines for material selection, impedance control, and pad placement.
IPC-2224
A standard for PC card form PCBs, including design requirements for organic and inorganic materials, and single, double, or multilayered interconnections.
IPC-A-610
A standard for PCB assembly that classifies PCBs into three quality levels, with Class 1 being the lowest and Class 3 being the highest.
IPC-6011
General Performance Specification for Printed Boards
IPC-6012
Appraisal performance and specifications for Rigid printed boards
IPC-6013
Appraisal performance and specifications for Flexible printed boards
Appraisal and performance of permanent performance
IPC-HM-860
Multilayer Hybrid Circuit Specification
J-STD-003
Solderable test for printed boards
IPC-A-600F
Acceptance conditions for printed boards
IPC-4761
Design Guide for Protection of Printed Board Via Structure
resin filled production bpm20599
What is IPC-A-610 Standard?
IPC-A-610 Standard is one of the most widely recognized standards in the electronics industry, specifically focusing on the acceptability of electronic assemblies. It provides detailed guidelines and criteria for the inspection of PCB assemblies, so that these assemblies meet the necessary quality levels for their intended use. Its main content includes:
1. Soldering Criteria
IPC-A-610 provides in-depth guidelines on acceptable soldering techniques, covering solder joints, surface mount devices (SMDs), through-hole components, and wire terminations. It explains what constitutes an acceptable versus defective solder joint, ensuring that the electrical connections are reliable.
2. Component Placement
The standard includes criteria for the correct placement and alignment of electronic components on PCBs. It specifies the acceptable tolerances for misalignment and ensures components are correctly placed for proper electrical performance and physical integrity.
3. PCB Assembly Defects
IPC-A-610 details different types of assembly defects, such as insufficient solder, tombstoning, lifted pads, and more. Each defect is categorized based on its severity and impact on the function and reliability of the product, providing guidance on whether a defect can be accepted or if it requires rework.
4. Classes of Electronic Assemblies
The standard divides electronic assemblies into three classes based on the end-use of the product:
Class 1 – General electronic products
Class 2 – Dedicated service electronic products
Class 3 – High-performance products
5. Mechanical Assembly
IPC-A-610 provides criteria for the mechanical aspects of PCB assemblies, such as mounting hardware, screws, connectors, and wire routing.
6. Coating and Potting
The standard covers the application of protective coatings (conformal coatings) and potting materials that protect the PCB from environmental damage such as moisture, dust, or chemicals. It specifies acceptable thicknesses, coverage areas, and inspection methods.
7. Cleaning Requirements
The cleanliness of PCB assemblies is critical for preventing performance degradation over time. IPC-A-610 outlines acceptable levels of residues from fluxes and other contaminants and specifies methods for inspecting and verifying cleanliness.
8. Cable and Wire Harness Assemblies
The standard includes requirements for assembling and inspecting cable and wire harnesses.
9. Solderless Wire Wraps
The standard also touches on solderless wire-wrapped connections, which are used in some applications where soldering is not practical or preferred. IPC-A-610 defines the acceptable criteria for such connections.
10. Inspection and Testing
The IPC-A-610 standard provides guidelines for visual inspection and testing methods used to evaluate whether an assembly meets the required acceptability criteria. This can include both automated and manual inspection processes, depending on the class of product.
Why IPC Standard is Important?
IPC standards are of great importance to the circuit board industry.
1. IPC standard specifies the requirements for all aspects of the design, manufacturing and assembly of the circuit board, including material selection, size specifications, welding quality, reliability testing, etc., providing a unified reference and guide for circuit board manufacturers to improve product quality and reliability.
2. IPC standards can help communicate and cooperate between PCB manufacturers and customers. By referring to IPC standards, the two parties can reach a consensus on PCB specifications, quality requirements and other aspects, reduce misunderstandings and disputes, and improve production efficiency.
3. For customers, IPC standards provide confidence. When a company adheres to these standards, they can trust that the final product will be reliable and durable, even in demanding environments.
4. In addition, IPC standards also contribute to the technological innovation and development of the circuit board manufacturing industry. By being in line with international standards and understanding the latest technological trends and standard requirements, manufacturers can continuously improve production processes and equipment, improve production efficiency and product quality, and enhance competitiveness.
At the same time, IPC regularly updates and revises standards to meet changing technology and market needs.
What is the IPC Standard for PCB Clearance?
PCB clearance, or the distance between conductive components, is essential to avoid electrical shorts or interference. Without proper clearance, electrical shorts could occur, potentially leading to device failure or safety hazards. The IPC-2221 standard covers PCB design and provides guidelines for this clearance, ensuring safety and functionality. This standard specifies how much space is needed between traces, pads, and other conductive materials depending on the operating voltage. However, the minimum clearance between any two conductors on a PCB depends on the device’s intended use and voltage:
General-purpose devices:Â 0.1 mm (4 mils)Â
Power conversion devices:Â 0.13 mm (5.1 mils)Â
Class 2 and 3 PCBs:Â 0.25 mm (10 mils) for low voltage and 0.5 mm (20 mils) for high voltageÂ
What are the IPC Standards for PCB Repair?
PCB repair can be tricky, but IPC-7711/7721 offers guidance on how to properly rework and repair PCBs. These standards provide detailed procedures for everything from removing defective components to repairing damaged traces and soldering issues.
By following IPC-7711/7721, technicians can restore a PCB to its original condition without compromising its performance. This is critical in industries where PCBs are expensive or difficult to replace, such as aerospace and medical devices. Repair standards also reduce the environmental impact by extending the life of the PCB, making repairs more sustainable.
It is no problem for us to manufacture the PCB following the standard in IPC 6012 /6013 Class 2 and Class 3, as well as following to the standard listed above. These acceptance conditions are the basis for the inspection of our company’s products, as well as the working standards of the employees at the production site, and also become an important part of the training of the employees for PCB production and assembly in our company.
Send us your PCB drawing, let’s help to make your PCB design into a real board.
DBC means direct bonding copper, it is a ceramic surface metallization technology.
The copper is bonded on Alumina, Beryllium Oxide and Aluminum Nitride, Packaging applications for power electronic modules, semiconductor refrigeration and LED devices are widely used.
DBC-Ceramic-PCB
96% Al2O3 has good insulation, good chemical stability, high strength, and low price. It is the preferred material for DBC technology, but the thermal conductivity of aluminum oxide is low, and there is a certain thermal mismatch with the thermal expansion coefficient of Si.
BeO is a good ceramic material used in DBC technology. It has high low-temperature thermal conductivity. It can be used for medium and high power devices. In the application field and process, the toxicity caused by it should be properly protected.
AlN material is non-toxic, moderate dielectric constant, thermal conductivity is much higher than aluminum oxide, close to beryllium oxide, and thermal expansion coefficient close to SI. All kinds of chips and high-power devices can be directly attached to the AlN substrate. No transition layer of other materials is used. The prospects currently used in DBC technology are very promising.
There is no any layer between the metal and ceramic substrate, so the thermal diffusion ability is strong; the contact resistance is also low, which is conducive to the connection of high-power and high-frequency devices.
The linking temperature is lower than the melting point of copper, and the DBC substrate maintains a stable geometric shape during the connection process. In some cases, the copper foil can be made into the required shape before the linking, and then the DBC preparation process is performed, eliminating the need After connecting the etching process.
The copper conductor part has a very high current-carrying capacity, so it has the ability to reduce the size of the intercepting medium and increase the power capacity.
Sink Pad Board, also called Heat Sink or DTP (direct thermal path), it’s an alternative PCB technology to the conventional metal core PCB providing direct thermal path solutions for high power LED.Â
The thermal conductive PADÂ is convexity area of copper core/pedestal, so that the thermal PAD of LED can touch the convexity area of metal core directly, and then the heat of LED will be dissipated into the air much faster and more efficient than conventional MCPCB.
Heat Sink
2. If only the LED pad can be made as SinkPAD?
Of course no, the pads of other chips or components also can be designed as Sink PAD, one of the most common is the IC pad. In some designs, IC needs to pass through the large current and it will emit a lot of heat, it would be best to design its pad as a thermal conductive pad at this time.
SinkPad Board after SMT
3. What is the thermal conductivity of a SinkPAD ?
The thermal conductivity could be 235 W/m.k to 400 W/m.k.
4. Can we use SinkPAD technology for any LED packages?
No, it’s designed to be used with the LEDs which has electrically neutral thermal pad. Such as Cree XPL/XML/XHP/XPG/XPE/XPC/XTE/XBD, Luxeon Rebel & Luxeon M from Philips Lumiled, Oslon SSL & Oslon square from Osram, Nichia N219, Seoul Semiconductor Z5P / Z5M, Samsung 3535, Bridgelux SM4, etc.
5. What is the Manufacturing Process for the SinkPAD Board?
Manufacturing process is the same as conventional MCPCB, please click here to see the manufacturing process status.
Shinkpad
6. How does SinkPAD Board compare to Conventional MCPCB?
Conventional MCPCB uses a thermally conductive dielectric layer to bond circuit layer with base metal (Aluminum or Copper) layer. The key to thermal performance of MCPCB lies in its dielectric layer. Even though thermally conductive dielectric has higher thermal performance compared to normal FR4, it’s still a weakest link in the conduction thermal path.
SinkPAD Board approach overcomes this limitation, which provides “Direct thermal path”, the LED Chip can directly contact the copper substrate, there’s no dielectric between LED thermal pads and the metal base, then the thermal resistance is very small.
7. Can the aluminumbe made as the base of Heat Sink?
Actually yes, however, regarding of current technical conditions, since aluminum or aluminum alloy cannot directly react with acid, the reaction process is too complex and difficult to control, which will increase the difficulty of etching the LED pad platform.
Considering the scrap rate, the process of etching LED pad platform with aluminum is more complex and the overall cost is higher, and the copper also dissipates heat much better than aluminum, so copper is generally used as the substrate for Heat Sink in our company.
Copper Substrate
8. Does SinkPAD Board require special PCB design?
No, we can use your existing MCPCB Gerber data.
Welcome to contact us if you have other questions about Sink Pad Board.
Before leaving PCB manufacturing line, bare PCBs (Printed Circuit Boards) have to pass electrical tests so that it guarantee that boards go for high performance and high reliability after finish the SMT（Surface Mount Technology）. Electrical tests are implemented to find out electrical and circuitry issues such as shorts, opens, resistance, capacitance etc. all of which indicate whether bare boards or assembled board are correctly fabricated.
shorts circuit
When test probes work, it moves quickly from test points to other test points as per instructions instructed by the computer set up program. ÂÂ
probe flying test
Probe test is no need fixture, so it is very popular in the printed circuit boards manufacturing. The most significant reason is their cost. it is highly cost-effective for prototypes and low to mid-volume production. And the most important factor, the test reports can be provided for each board after finish tested and it is very easy to export from the computer, you can send to your customer very quickly for the test results of PCB.
Advantages of Flying Probe Test:
Low test cost (Eliminates fixturing costs and time)
Short test development time
Fast computer program development, easy integration of design changes
Rapid feedback provided to PCB design engineers at prototyping period
Process flexibility
Circuit access, even in the absence of test points
Controlled probe contact, programmable for any type of board
Different test solutions and approaches integrated in a single test system
Intrinsic positioning and measurement precision
Disadvantages of Flying Probe Test
Everything has two sides. Apart from obvious advantages, flying probe test have some disadvantages.
Since flying probes have direct physical contact with vias and test pads and small pits are easily caused on board surface, when flying probe tester is working on components without test pad, it’s possible that probes have contact with component leads so that loose leads or leads with badly-performed soldering may be missed.
In spite of the disadvantages mentioned, flying probe test is still regarded as a significant test method for PCB fabrication. Flying Probes have enhanced the competitive variable as lost time due to retooling has been removed. Prototype and Quick Turn product is the perfect match for Flying Probes as they carry out in low quantity orders and are quick to change jobs, unlike the long setup times with fixture testers.
By the way, to test circuit shorts, opens, Best Technology also do AOI checking to make sure there is no issue for PCB manufacturing.
AOI test
Contact Best Technology right now, to discuss more for printed circuit boards.
As we all know if ceramic PCB is very fragile, so it is not easy to do SMT for them.
But we can do the SMT for ceramic PCB easily because we do it every day and we have more than 15 years experiences for doing that.
For the almost SMD components (such as SMD rsistors, capacitors, diode etc), normally we will add the solder paste by using SMT stencil, then put the components by machine, finally do the oven reflow.
For some special components, we will need to solder it by hand, such as through connectors, but it can’t be soldered by hand directly, it need to be put on the heating table to keep the temperature is high enough to make the solder past at melt state. Because the ceramic material with very good heat dissipation, the solder paste will be solidification very easily if don’t put the ceramic PCB on heating table
For some small LED, it can’t be put by SMT machine, because no such small feeder to pick it up, then need to put it on board by hand.
We can do very well for the small BGA components too.
In Best Technology, currently the most common metal used for Metal Core PCB manufacturer are Aluminum, Copper. Today let’s talk about the main differences between aluminum substrate and copper substrate, hoping to help you choose the right substrate in future design projects.
Although they both share similar properties and functions, there are still a few variations between the two kinds of metals. Some of the key differences between aluminium and copper core PCBs are explained in the points below.
1. Thermal Conductivity
The thermal conductivity of copper substrate is up to about 400(W/mK) and the thermal conductivity of aluminum substrate is generally about 200W(W/mK). The thermal conductivity is higher, the transfer efficiency will be better, and the heat dissipation will be better, then the working life will be longer.
 Thermal Conductivity
2.Electrical Conductivity
Both aluminum and copper, being metals, are electrical conductors of electricity, although the exact degree of this varies between the two metals. When it comes to electrical conductivity, copper has a clear advantage over aluminum. In other words, in applications where there is a need for efficient electrical conductivity, copper makes for an ideal pick.
 Electrical Conductivity
3. Electrical Resistance
Resistance is very important when it comes to PCB design, as it can have an effect on the overall function and stability of the component. Given that copper has a higher density than aluminum, it tends to have a lower resistance than aluminum, so copper is an better choice where there’s a requirement for thinner circuits and faster electricity transfer.
Electrical Resistance
4. Weight
Since copper has the higher density for per unit area, the weight of copper PCB is much heavier than aluminum PCB for the same design.
In applications where light-weight construction is required more than anything else, aluminum is the preferred material of choice. On the other hand, applications where weight is not much of an issue, tends to be the ones where copper is widely used.
Weight
5. Application
Copper core PCB is the best heat dissipation among all MCPCB, so it’s mostly used in automobile headlights, taillights and some high-tech electronic products (unmanned aircraft, mining machine) high-power lighting equipment. The aluminum core PCB is mostly used in indoor lighting, energy saving lighting, street lighting and other energy-saving lighting electronic products.
Application
Application
In conclusion, due to the above different parameters and performance, the cost of copper is generally more expensive than aluminum. If you have other questions about MCPCB, welcome to contact us .
