Posts Tagged ‘Ceramic PCB manufacturer’

Multilayer Ceramic Substrate PCB, Ceramic PCB Manufacturer

Tuesday, April 15th, 2025

With nearly two decades of experience, Best Technology has become one of the most reliable ceramic PCB manufacturers in Asia. We specialize in high-quality ceramic substrate PCBs for a wide range of industries. From automotive to aerospace, from LED lighting to power electronics—we support innovation with strong technical backing and fast delivery.

We don’t just offer boards; we offer tailored solutions. Our team listens carefully, moves quickly, and delivers results. Whether you need AlN, Al₂O₃, or multilayer ceramic PCB, we’ve got your back.

Multilayer Ceramic Substrate PCB, Ceramic PCB Manufacturer

What Is a Ceramic Substrate PCB?

A ceramic substrate PCB is a circuit board made using ceramic materials as the base instead of traditional resins. Unlike FR-4 or other standard materials, ceramics offer excellent heat resistance, thermal conductivity, and mechanical strength.

They’re not just tough—they’re smart. Ceramics can carry high-frequency signals without distortion. They also handle high power loads with ease, which is why they’re often used in power modules and high-speed communication systems.

Ceramic Substrate PCB Types

Ceramic PCBs vary based on two main categories: materials and production techniques.

1. Divided by Materials

Aluminum Nitride (AlN) PCB

Aluminum nitride PCB is favored for its exceptional thermal performance. Its thermal conductivity ranges from 170 to 230 W/m·K, which is much higher than FR4 or even alumina. It’s often used in power devices, RF modules, and LED lighting. This type also provides strong insulation and good mechanical stability.

Alumina (Al2O3) PCB

Alumina PCBs are the most common type. They offer a balanced mix of electrical insulation, mechanical strength, and cost-effectiveness. They’re available in 96%, 99%, or 99.6% purity levels. The higher the purity, the better the thermal and electrical properties. These boards are widely used in automotive sensors, LED lighting, and industrial controls.

Beryllium Oxide (BeO) PCB

BeO PCBs offer the highest thermal conductivity among ceramic materials—up to 300 W/m·K. However, due to safety concerns during manufacturing, it’s less popular today. Still, for very specific military or aerospace projects, it’s an option. At Best Technology, we generally recommend safer materials like AlN or Alumina for most projects.

Silicon Nitride (Si₃N₄) PCB

Silicon nitride offers high strength and fracture toughness. It handles heavy vibration and thermal shock better than others. It performs well in both high-temperature and high-load environments.

Silicon Carbide (SiC) PCB

SiC gaining attention in high-demand environments like electric vehicles and aerospace systems. It offers thermal conductivity in the range of 80 to 180 W/m·K, along with excellent chemical and radiation resistance.

Zirconia (ZrO₂) PCB

Zirconia is known for its toughness and wear resistance. ZrO₂ is used in environments requiring abrasion resistance, such as medical implants, aerospace sealing systems, or sensor housings. It’s not as popular for power electronics but fills special roles where durability matters more than heat dissipation.

2. Divided by Manufacturing Techniques

Thick Film Ceramic Substrate PCB

These use screen-printing to apply conductive and dielectric pastes onto the ceramic surface. It’s reliable, cost-effective, and great for low to medium-volume production. The conductor is usually silver or gold. This type works well for sensors and power hybrid circuits. They also support multilayer designs.

Thin Film Ceramic PCB

This method uses vacuum deposition and photolithography. It’s precise and supports very fine lines and spaces. Thin-film PCBs are more expensive but deliver unmatched performance in miniaturized devices, such as medical implants or RF modules.

DBC Ceramic PCB (Direct Bonded Copper)

DBC PCBs bond copper directly onto a ceramic surface through a high-temperature process. The copper layer is thick and can carry high currents. They are suitable for power semiconductors and automotive applications. They also offer strong adhesion and excellent heat spreading.

DPC Ceramic PCB (Direct Plated Copper)

DPC PCBs are made by plating copper directly onto the ceramic using a chemical process. They can achieve finer features than DBC and are suitable for high-frequency or miniaturized devices.

HTCC Ceramic PCB (High-Temperature Co-fired Ceramic)

HTCC involves firing a mix of ceramic and metal powders at over 1600°C. It’s durable and works in harsh environments. HTCC PCBs are commonly used in military and aerospace industries due to their stability under extreme conditions.

LTCC Ceramic PCB (Low-Temperature Co-fired Ceramic)

LTCC is similar to HTCC but fired at a lower temperature (around 850°C). This process allows for the embedding of passive components, which saves space. It’s perfect for compact, multi-functional devices, especially in telecom and satellite systems. Both HTCC and LTCC ceramic substrate can made into multilayers.

AMB Ceramic PCB (Active Metal Brazing)

AMB PCBs use an active brazing technique to bond copper and ceramic. This method provides better bonding strength than DBC and is ideal for high-load applications like electric vehicles.

Technical Specification of Beryllium Oxide (BeO) Ceramic Substrate

Material Property		Unit	Value
Color		\	White
Medium grain size		um	3-5
Surface roughness (Ra)		um	0.3-0.5
Density		Kg/m3	3010
Rate of water absorption		%	0
Bending strength	4 point method (40x4x3mm3)	Mpa	400
Bending strength	Dual ring method (0.63mm substrate thickness)	Mpa	500
Thermal conductivity (20-100℃)		W/m-k	220-250
Specific heat		J/kg.K	800
Coefficient of Linear expansion		1*E-6 / K	5.1-8.9
Dielectric constant			6-7
Dielectric loss factor (1 MHz)		1*E-3	0.3
Breakdown Voltage	2.0mm substrate	KV/mm	34
	1.0mm substrate		17
	0.635mm substrate		11
Volume resistivity	20℃	Ohm * cm	–

Technical Specification of Silicon Nitride (Si₃N₄) Ceramic Substrate

Material Property		Unit	Value
Color		\	Gray, White, Off-White
Medium grain size		um	3-5
Surface roughness (Ra)		um	0.3-0.5
Density		Kg/m3	3120-3220
Rate of water absorption		%	0
Bending strength	4 point method (40x4x3mm3)	Mpa	147
Bending strength	Dual ring method (0.63mm substrate thickness)	Mpa	490
Thermal conductivity		W/m-k	18.42
Specific heat		J/kg.K	710
Coefficient of Linear expansion (20-1000℃)		10-6/℃	2.8-3.2
Dielectric constant			9.4-9.5
Dielectric loss factor (1 MHz)		1*E-3	0.3
Breakdown Voltage	2.0mm substrate	KV/mm	34
	1.0mm substrate		17
	0.635mm substrate		11
Volume resistivity	20℃	Ohm * m	1.4*105
Volume resistivity	500℃	Ohm * m	4*108

Technical Specification of Silicon Carbide (SiC) Ceramic Substrate

Material Property		Unit	Value
Color		\	Black
Medium grain size		um	3-5
Surface roughness (Ra)		um	0.3-0.5
Density		Kg/m3	3220
Rate of water absorption		%	0
Bending strength	4 point method (40x4x3mm3)	Mpa	400
Bending strength	Dual ring method (0.63mm substrate thickness)	Mpa	500
Thermal conductivity		W/m-k	83.6
Specific heat	-106℃	J/kg.K	399.84
	107℃		472.27
	247℃		1266.93
Coefficient of Linear expansion (20-1000℃)		10-6/℃	6.28-9.63
Dielectric constant			7
Dielectric loss factor (1 MHz)		1*E-3	0.3
Breakdown Voltage	2.0mm substrate	KV/mm	34
	1.0mm substrate		17
	0.635mm substrate		11
Volume resistivity	20℃	M * cm	102

Technical Specification of Zirconia (ZrO₂) Ceramic Substrate

Material Property		Unit	Value
Color		\	White
Medium grain size		um	3-5
Surface roughness (Ra)		um	0.3-0.5
Density		Kg/m3	5850
Rate of water absorption		%	0
Bending strength	4 point method (40x4x3mm3)	Mpa	380
Bending strength	Dual ring method (0.63mm substrate thickness)	Mpa	500
Thermal conductivity		W/m-k	2.09
Specific heat		J/kg.K	563.89
Coefficient of Linear expansion (20-1000℃)		10-6/℃	6.5-11.2
Dielectric constant			27
Dielectric loss factor (1 MHz)		1*E-3	0.3
Breakdown Voltage	2.0mm substrate	KV/mm	34
	1.0mm substrate		17
	0.635mm substrate		11
Volume resistivity	1000℃	Ohm * cm	104
Volume resistivity	1700℃	Ohm * cm	6-7

For technical specifications of Al2O3 and AlN, please click here to view the details.

What Is the Difference Between Ceramic Substrate and FR-4?

Property	Ceramic Substrate PCB	FR-4 PCB
Material Composition	Inorganic (e.g., Al₂O₃, AlN, Si₃N₄)	Organic (Epoxy resin + fiberglass)
Thermal Conductivity	High (AlN: 170–230 W/m·K, BeO: up to 300 W/m·K)	Low (~0.3–0.5 W/m·K)
Operating Temperature	Up to 800°C or more	Limited to ~130–150°C
Electrical Insulation	Excellent and stable	Moderate
Dielectric Constant	Low and stable (AlN ~8.5, Al₂O₃ ~9.8)	Higher and less stable (~4.2–4.8)
Moisture Absorption	None (non-porous)	Yes (hygroscopic)
Mechanical Strength	High (brittle but rigid)	Good flexibility and toughness
Thermal Expansion (CTE)	Very low (~5–7 ppm/°C)	Higher (~14–17 ppm/°C)
RF / Microwave Performance	Excellent (low loss, stable dielectric)	Poor to average (higher signal loss)
Price	Higher	Lower
Application	Focus High-power, high-reliability systems (LEDs, lasers, RF)	General-purpose, consumer electronics
Design Flexibility	Less flexible, requires precise processing	Very flexible, supports complex multilayer structures

How Thick Is a Ceramic Substrate?

Ceramic substrate PCBs come in various thicknesses, depending on the material and application. The most commonly used thicknesses range from 0.25 mm to 3.0 mm. However, special requests can push this range even further.

For alumina, the standard thicknesses are 0.25 mm, 0.38 mm, 0.5 mm, 0.635 mm, 1.0 mm, and 1.5 mm. These sizes work well for LED packages and power control boards.

Aluminum nitride substrates are typically used in 0.38 mm to 1.0 mm thicknesses. The thinner sheets are used in RF circuits, while thicker ones help in thermal management and mechanical support.

Silicon nitride and silicon carbide can also be customized in terms of thickness. Some high-strength applications require boards thicker than 2 mm to add mechanical stability.

For LTCC and HTCC processes, the thickness can vary as layers are stacked. After sintering, the final board may be thinner than expected due to shrinkage. Designers often specify individual layer thicknesses from 100 µm to 300 µm before lamination.

Factors Affect Ceramic Substrate PCB Price

A ceramic substrate price can be varied depends on the material and process used. Here is a detailed explanation.

1. Material Type

Alumina is the most cost-effective, followed by aluminum nitride. Silicon nitride, silicon carbide, and beryllium oxide are more expensive due to material costs and production challenges.

2. Board Size and Thickness

Larger boards cost more to produce. Thicker substrates also require more raw material and longer sintering times, increasing the cost.

3. Layer Count

Single-layer ceramic PCBs are cheaper. Multilayer designs need more lamination and alignment, raising both time and processing costs.

4. Metallization Method

The choice between thick film, DPC, DBC, or HTCC has a big impact. DPC and DBC processes require specialized equipment, so they are more expensive than thick film types.

5. Tolerances and Precision

If your application requires tight tolerances or fine trace widths, this will increase the cost. More precise laser cutting, printing, or etching takes longer and demands higher quality control.

6. Volume

Like most products, higher quantities reduce the per-unit cost. Low-volume or prototype runs are usually priced higher due to tooling and setup.

7. Surface Finish and Testing

Optional services such as ENIG, silver plating, or 100% electrical testing will raise the overall price.

In summary, the price of a ceramic substrate PCB depends on the complexity, material, and quality requirements. While they cost more than FR-4 boards, their performance and longevity often justify the higher investment.

What Is a Ceramic PCB Used For?

High-brightness and long-lifetime lighting
Inverters
IGBTs
Motor drives
Imaging systems
Implants
Diagnostics
Telecom
Antennas
Filters
Base stations
EV batteries
Sensors
Control units
Aerospace
Radar systems
Satellite modules

Multilayer Ceramic PCB Manufacturing Process

Multilayer ceramic PCBs are built using different methods than traditional FR-4 boards. The most popular technique is the thick film, HTCC or LTCC process, which allows stacking multiple ceramic layers with embedded circuits. Here’s a step-by-step look at how they’re made:

1. Ceramic Tape Casting

First, thin ceramic tapes (called green sheets) are cast using alumina, aluminum nitride, or other ceramic powders mixed with binders and solvents. These tapes are then dried and punched to create holes for vias.

2. Via Filling and Screen Printing

Vias are filled with conductive pastes such as gold, silver, or tungsten. Then, a conductive pattern is printed on each layer using screen printing or sputtering techniques.

3. Layer Alignment and Lamination

Multiple layers are stacked together carefully, with precise alignment. They are then laminated under pressure and heat, forming a compact structure ready for sintering.

4. Sintering or Firing

In this step, the laminated structure is fired in a high-temperature furnace—up to 1,600°C for HTCC or 850°C for LTCC. This burns off the organic materials and solidifies the ceramic and metal layers.

5. Metallization and Plating

After sintering, the external layers are coated with surface finishes like silver, gold, ENIG, or nickel. These finishes improve solderability and prevent oxidation.

6. Laser Cutting and Drilling

Final shaping is done using CO₂ or UV lasers. This step defines the board outline and makes precise holes for connectors or mounting.

7. Inspection and Testing

Each board undergoes dimensional inspection, electrical testing, and sometimes X-ray analysis to check for internal defects or misalignments.

Why Choose Best Technology as Your Ceramic PCB Manufacturer?

You’re not just buying a board. You’re choosing a partner. At Best Technology, we offer:

Free ceramic substrate technical consultation
In-house production for better lead times
100% electrical testing before shipping
Rapid prototyping and mass production
Custom designs for all industries
Friendly support team that speaks your language
Military-grade quality
ISO13485, IATF16949, AS9100D certificated
No minimum order quantity requirement
5 years quality assurance

Let us help bring your next high-performance product to life. Whether it’s Aluminum Nitride PCB, Alumina, or multilayer ceramic PCB, we’re ready to deliver results you can count on.

What is Alumina Ceramic PCB?

Alumina ceramic PCBs are circuit boards made using aluminum oxide (Al₂O₃) as the substrate material. This type of PCB is known for its excellent thermal management, high insulation resistance, and mechanical strength.

Compared to conventional FR-4 boards, alumina ceramic PCBs offer better heat dissipation, making them ideal for high-power applications like LED lighting, automotive electronics, and aerospace systems.

Unlike standard PCB materials, alumina ceramic is highly resistant to chemical corrosion and environmental stress. It can endure extreme temperatures without degrading, ensuring long-term reliability in demanding conditions.

How Do You Make Al₂O₃ Ceramic PCB?

Fabricating an alumina ceramic PCB requires a specialized manufacturing process. Unlike FR-4 boards, which are processed using laminates, ceramic PCBs are created through advanced sintering techniques.

The process typically involves:

Material Preparation – High-purity alumina ceramic is selected based on thermal and electrical requirements.

Al2O3 Ceramic PCB Fabrication & Ceramic PCB Manufacturer

Substrate Formation – The ceramic is shaped and sintered at high temperatures to achieve a dense, strong structure.

Metallization – Copper, silver, or gold is deposited onto the ceramic surface using thick-film or thin-film technology.

Circuit Patterning – The conductive layer is etched or laser-processed to define the circuit layout.

Component Assembly – SMD or through-hole components are mounted using high-temperature soldering or wire bonding.

Final Testing – The finished PCB undergoes electrical and thermal testing to ensure optimal performance.

This fabrication method results in a robust, high-performance PCB with excellent electrical insulation and thermal efficiency.

What Are the Advantages of Alumina Ceramic PCB?

Al₂O₃ ceramic PCBs come with a range of benefits that make them superior to traditional materials.

Exceptional Heat Dissipation – The ceramic substrate effectively transfers heat away from components, preventing overheating.

High Mechanical Strength – Alumina ceramic is incredibly strong, resisting mechanical stress and impact.

Superior Electrical Insulation – This material prevents electrical leakage, ensuring stable circuit performance.

Corrosion Resistance – Unlike metal-based PCBs, alumina ceramic does not rust or degrade over time.

Dimensional Stability – It maintains its structure under extreme conditions, including high temperatures and humidity.

These advantages make alumina ceramic PCBs a top choice for advanced electronic applications requiring reliability and efficiency.

What Are the Materials Used in Ceramic Substrate?

Ceramic PCBs can be made using different types of ceramics, each offering unique properties:

Alumina (Al₂O₃) – The most widely used ceramic material, known for its affordability and strong thermal performance.

Aluminum Nitride (AlN) – Offers higher thermal conductivity than alumina but comes at a higher cost.

Beryllium Oxide (BeO) – Provides outstanding thermal properties but has limited use due to toxicity concerns.

Silicon Carbide (SiC) – Used in specialized high-temperature applications.

Each material is selected based on specific electrical, thermal, and mechanical requirements.

Is Alumina Ceramic Better Than Zirconia Ceramic?

Alumina and zirconia ceramics are both high-performance materials, but they serve different purposes.

Alumina Ceramic (Al₂O₃) – Offers better thermal conductivity, making it ideal for PCBs that require efficient heat dissipation.

Zirconia Ceramic (ZrO₂) – Has superior mechanical toughness and is often used in wear-resistant applications.

For electronic circuit boards, alumina is the preferred choice due to its balance of strength, electrical insulation, and heat management.

How Thick is Alumina Ceramic PCB?

The thickness of an alumina ceramic PCB varies based on application needs. Typically, the substrate thickness ranges from 0.25mm to 5mm, depending on thermal and mechanical requirements.

Thinner PCBs are used in compact electronics, while thicker substrates are chosen for heavy-duty applications requiring robust performance.

What is the Difference Between Al₂O₃ Ceramic PCB and FR-4?

FR-4 and alumina ceramic PCBs are widely used, but they differ in key ways:

Material Composition – FR-4 is a fiberglass-reinforced epoxy, while alumina ceramic is a solid ceramic substrate.

Thermal Conductivity – Alumina ceramic dissipates heat much more efficiently than FR-4.

Durability – Ceramic PCBs can withstand harsh environments, whereas FR-4 boards are more prone to degradation.

Electrical Performance – Alumina has superior insulation and minimal signal loss, making it ideal for high-frequency circuits.

For applications where heat management and longevity are critical, alumina ceramic PCBs offer a clear advantage.

What Are the Applications of Alumina Ceramic PCB?

Due to their exceptional properties, alumina ceramic PCBs are used in various industries:

LED Lighting – Ensures efficient heat dissipation for high-brightness LEDs.

Power Electronics – Used in high-voltage circuits requiring stability and durability.

Automotive Electronics – Found in electric vehicles, sensors, and power management systems.

Aerospace & Defense – Used in radar, communication, and avionics due to reliability under extreme conditions.

Medical Devices – Integrated into imaging systems and surgical instruments for their biocompatibility and precision.

As electronic devices continue to demand higher efficiency and performance, alumina ceramic PCBs are becoming an essential part of modern technology.

Conclusion：

Al₂O₃ ceramic PCBs provide a superior solution for applications requiring durability, thermal efficiency, and electrical reliability. Compared to traditional FR-4 boards, they offer better heat dissipation, mechanical strength, and longevity.

For high-quality alumina ceramic PCB fabrication, choosing the right manufacturer is crucial. At Best Technology, we specialize in custom ceramic PCBs designed to meet the most demanding requirements. Contact us at sales@bestpcbs.com to discuss your project needs!