PCB Manufacturing Capability

We are continued to improve our MCPCB, FR4 PCB & Ceramic PCB manufacturing level to get satisfactory result from customers and ourselves. Currently our monthly productivity is 260,000 square feet (28,900 square meter), more than 100 different boards will be completed. We also provide fast service, and urgent boards can be shipped out within 24 hours! For more information, please click here for lead time…

Best Technology provides a wide range of PCB manufacturing capabilities covering FR4 PCB, MCPCB, and Ceramic PCB solutions. From standard multilayer boards to high thermal conductivity and high-reliability applications, our engineering and production team supports both prototype and volume requirements with stable quality and flexible lead time.

General Capability Overview

Capability Item	FR4 PCB	MCPCB	Ceramic PCB
Max Layer Count	32 Layers	10 Layers	Thick Film: 10 Layers; DCB: 2 Layers
Max Board Thickness	2L: 6.0 mm; 4L and above: 8.0 mm	4.0 mm	Thick Film: 1.5 mm; DCB: 1L: 1.3 mm, 2L: 1.6 mm
Max Board Size	610 × 610 mm; 100 × 1,300 mm	610 × 1,625 mm	Thick Film: 200 × 200 mm; DCB: 138 × 178 mm
Max Aspect Ratio	8:1	12:1	8:1
Warp & Twist	≤ 0.75%	≤ 3%	N/A
Flammability	UL 94V-0	N/A	N/A
Thermal Stress	3 × 10 sec @ 280°C	N/A	N/A

Minimum Board Thickness by Layer Count

Layer Structure	FR4 PCB	MCPCB	Ceramic PCB
2 Layers	0.13 mm / 0.17 mm	0.3 mm / 0.6 mm	Thick Film: 0.25 mm / 0.28 mm; DCB: 0.30 mm / 0.40 mm
4 Layers	0.4 mm	1.0 mm	0.34 mm
6 Layers	0.6 mm	1.2 mm	0.46 mm
8 Layers	0.8 mm	1.6 mm	0.81 mm
10 Layers	1.2 mm	2.0 mm	1.50 mm

Copper / Conductor Capability

Capability Item	FR4 PCB	MCPCB	Ceramic PCB
Max Conductor Thickness	20 oz	10 oz	Thick Film: 13 μm; DCB: 8.6 oz
Min Conductor Thickness	1/2 oz	N/A	Thick Film: 10 μm; DCB: 3.9 oz
Thermal Conductivity	0.30–0.45 W/m·K	Standard: 0.8–1.5 W/m·K; High: 2.0–3.0 W/m·K	Al2O3: ≥24 W/m·K; AlN: ≥170 W/m·K
Dielectric Strength	>1.3 kV/mm	>1.5 kV; >3.0 kV for wider spacing	>15 kV/mm

Trace / Hole / Pad Capability

Capability Item	FR4 PCB	MCPCB	Ceramic PCB
Min Trace / Space	Standard: 4/4 mil; HDI: 2/2 mil	6/6 mil	Thick Film: 6/8 mil; DCB: 12/12 mil
Min Hole Diameter	Standard: 0.20 mm; HDI: 0.10 mm	0.30 mm	0.10 mm
Min Punch Hole Diameter	2.5 mm	3.0 mm	N/A
Min Hole Spacing	0.30 mm	0.40 mm	NPTH: 0.30 mm; PTH: 0.50 mm
Min Solder Pad Diameter	HDI: 0.25 mm; Standard: 0.35 mm	0.35 mm	0.25 mm
Min Annular Ring	0.075 mm	0.15 mm	0.20 mm
Min Solder Mask Bridge	HDI: 0.15 mm; Standard: 0.20 mm	0.20 mm	0.30 mm
Min BGA Pad Margin	0.125 mm	0.30 mm	N/A

Tolerance Capability

Capability Item	FR4 PCB	MCPCB	Ceramic PCB
PTH Wall Thickness	HDI: 12 μm; Standard: 15 μm	N/A	Thick Film: 10 μm; DCB: Not Available
PTH Hole Tolerance	±0.075 mm	±0.10 mm	N/A
NPTH Hole Tolerance	±0.05 mm	±0.05 mm	±0.05 mm
Hole Position Tolerance	±0.05 mm	±0.075 mm	±0.10 mm
Outline Tolerance (CNC)	±0.15 mm	±0.15 mm	Laser: +0.20 / -0.05 mm
Outline Tolerance (Punching)	±0.10 mm	±0.15 mm	+0.25 / -0.20 mm

Electrical and Surface Finish Capability

Capability Item	FR4 PCB	MCPCB	Ceramic PCB
Impedance Control	>50 ohm: ±10%; ≤50 ohm: ±5 ohm	N/A	N/A
Surface Finish	ENIG, Flash Gold, Hard Gold Finger, Gold Plating, Selected Gold Plating, ENEPIG, ENIPIG, HAL, Lead-Free HASL, OSP, Immersion Silver, Immersion Tin	N/A	Thick Film: AgPd, AuPd, Mn/Ni; DCB: Ni Plating, ENIG

Notes:

• Units: mm unless otherwise specified
• Special requirements: available upon engineering review
• Capability values: subject to product design, material type, and manufacturing process
• Custom stack-up and tighter tolerance: available on request

If you would like some special material, tighter tolerance or other requirements, you can Contact our stuff directly, we are going to answer any questions of MCPCB, FR4 PCB & Ceramic PCB at any time.