Archive for the ‘Our News’ Category

How to improve the gap between the convexity and LED pad?

Saturday, July 11th, 2020

About the SinkPad copper core PCB, all is known that convexity is very important, the height of convexity is about 0.2mm-0.25mm.

We need to know whatâ€™s the reasons caused the gap between the convexity and LED pad is big.

We make the copper core with convexity firstly, then make the circuit/panel board (FR4PCB/BT PCB) and finally do the lamination for cooper core and circuit board.
The tolerance for convexity is +/-0.05mm-0.075mm.
The tolerance for circuit/panel board is +/-0.13mm.

If we do negative tolerance for convexity and positive tolerance for circuit/panel board, then it will cause the gap very big.

See below picture and details.

For example, the size of convexity is 0.5mm, after negative tolerance -0.075mm, it will be 0.425mm and each side will be 0.0375mm smaller.

For the circuit/panel board, the gap between convexity is 0.2mm, after positive tolerance +0.13mm, it will be 0.33mm and each side will be 0.065mm bigger.

So finally, the gap will be 0.2mm+0.0375+0.065mm=0.3025mm.Â It is about 50% bigger than original size.

How to improve that problem?

Making the copper core with convexity according to design.
Measuring the dimension of convexity before making the circuit/panel board, then making the circuit/panel board according to the convexity dimension with compensation design.
Do Positive tolerance for convexity and negative tolerance for circuit/panel board, the gap will be much more smaller.

For example, the size of convexity is 0.5mm, after negative tolerance +0.075mm, it will be 0.575mm and each side will be 0.0375mm bigger

For the circuit/panel board, the gap between convexity is 0.2mm, after positive tolerance -0.13mm, it will be 0.07mm and each side will be 0.065mm smaller.

So finally, the gap will be 0.2mm-0.0375-0.065mm=0.0975mm.Â It is about 50% smaller than original size.

For more information about SinkPad PCB, please click

https://www.bestpcbs.com/products/multi-layer-sinkpad-board.htm

Tags:dtp pcb, sinkpad pcb
Posted in FAQ, Our News, PCB News, PCB Technology | No Comments »

How to avoid the negative effects of vias in high-speed PCB design

Wednesday, July 1st, 2020

In high-speed PCB design, the seemingly simple vias often bring great negative effects to the circuit design. In order to reduce the adverse effects caused by the parasitic effects of vias, in the design, you can do as much as possible:

1. From the two aspects of cost and signal quality, choose a reasonable size of via size. If necessary, you can consider using different sizes of vias. For example, for power or ground vias, you can consider using larger sizes to reduce impedance. For signal traces, you can use smaller vias. Of course, as the via size decreases, the corresponding cost will increase.

2. The two formulas discussed above can be concluded that the use of thinner PCB boards is beneficial to reducing the two parasitic parameters of vias.

3. The signal traces on the PCB board should not change layers as much as possible, that is to say, try not to use unnecessary vias.

4. The power and ground pins should be drilled through the hole. The shorter the lead between the hole and the pin, the better. You can consider making multiple vias in parallel to reduce the equivalent inductance.

5. Place some grounded vias near the vias for signal changeover to provide the closest loop for the signal. You can even place some extra ground vias on the PCB.

6. For high-density high-speed PCB boards, consider using micro vias.

If you have any questions, or suggestions, welcome to leave your comments.

Tags:high-speed pcb design, pcb design
Posted in Our News, PCB News, PCB Technology | No Comments »

14-Year Anniversary Celebration of Best Technology-Thank you!

Sunday, June 28th, 2020

We are elated to announce that Best Technology has recently completed 14 years of its glorious journey. Every small step has been worth celebrating. On June 26, 2020, our founder, Peter, Emily, group leaders and all the employees spent this unforgettable festival together.

On Best Technology successful journey, Peter opines- â€œThese past 14 years have been a period of growth and a learning experience for us as we went through several trials and errors till we deliver successful business. Today we are proud of the fact that our employees can make great progress day by day after training with us and feel confident taking on tough project-related challenges,thanks for all the endeavour from employees and thanks for the great support from our suppliers and customers. Best Technologyâ€™s continuous development can not do without them.â€

We have come a long way from 2006 when we started off with just 1 people(Peter). Today we are proud to announce that we have nearly 100 employees and many sister companies spread all over China mainland and also have customers in over 150 countries around the world.

From above, it is evident that there has been a staggering growth in the number of employees in the span of 14 years. This enhanced employee strength has built the roadmap to Best Technologyâ€™s success.

The above graph presents our companyâ€™s growth against the years 2006 to 2020. It can be seen that the growth rate is very high from 2006($8000) to 2019($6560,000). At this year 2020, Best Technology still keeps growing with increasing sales volume in spite of COVID-19 outbreak.

Best Technologyâ€™s unique journey has been a brick-by-brick progress and has entailed years of efforts. Our companyâ€™s commitment in becoming world class distinctive solution of printed circuit board and metal domes in 2025 has paved the way to the series of milestones achieved. These are equally appreciated by the correct leadership of our chairman, Peter.

The primary aim of our company has been to equip the professionals with all possible accoutrements to tackle on-job challenges. Todayâ€™s ever changing face of businesses demands deeper knowledge, quality, and on-time delivery. Customers are always looking out for continuous and improved delivery. The best means to achieve the same is to keep improving.

We will continue our journey towards innovating the new ways of learning, delivering excellence to the customers and lending a hand to achieve professional goals.

Whatâ€™s more, Best Technologyâ€™s 14th-year anniversary celebration is a solemn procession of efforts and dedication of the trainers and staffs who have spent their quality time to provide the best services and meet more expectations of the ever evolving PCB world.

Tags:Anniversary
Posted in Our News, PCB News | No Comments »

In order to reduce the cost, can SinkPad PCB use aluminum base instead copper base for heat dissipation?

Wednesday, June 24th, 2020

SinkPad PCB is a type of Copper base PCB used in thermoelectric separation application. It generally used for high power LED, the pad of LED touch the copper base directly, so that the heat generated by LED will dissipate quickly, which can achieve the best heat dissipation and conduction.

In another words, it is a technology that require to increase the path of the LED pad to the copper base to accelerate the heat emission from the base material. The copper base is vital while it also cost higher.

Then in order to lower cost, can SinkPad PCB use aluminum base instead copper base for heat dissipation?

The answer is NO. As you can see the below manufacturing steps, the SinkPad will etch the copper base into convex platform with Copper Etching Solution, then hollow out the Double Layer FR4 PCB, and do lamination with the convex platform.

However, regarding of current technical conditions, since aluminum or aluminum alloy cannot directly react with acid, the reaction process is too complex and difficult to control, which will increase the difficulty of etching the LED pad platform. Considering the scrap rate, the process of etching LED pad platform with aluminum is more complex and the overall cost is higher.

Tags:led pcb, sinkpad pcb
Posted in FAQ, Our News, PCB News, PCB Technology | 9 Comments »

Why don’t use BeO as substrate to make DBC ceramic PCB?

Monday, June 22nd, 2020

It is widely known that BeO with high thermal conductivity (200-250W/m.k). High dielectric constant 6-7 (0.1MHz) and dielectric loss tangent is 10-4 (0.1GHz), extremely high working temprature. It is ideal material for ceramic PCB, lots of engineers want to use it as DBC ceramic PCB substrate.

But it is not popular in ceramic PCB market, comparing with Al2O3, AIN, Si3N4, or ZrO2, as the powder of BeO is extremely poisonous.

The poison gas is produced by the reaction between oxygen, Cu and BeO under 1065-1085 degrees Celsius, so it is limited to make cooper on BeO substrate, it has caused ALN (AluminiumÂ Nitride) is becoming more and more popular.

Right now, only few countries are using BeO to make ceramic PCB, such as USA, Russia and China. USA had biggest capability to make BeO , and here in China, there’re still some companies to make BeO raw material and among them, a few companies to produce direct copper bonded (DCB) on BeO because of environment limitation.

Though BeO is not popular for DBC technology, but it is feasible for thick film technology, because when the mentalization of Ceramic PCB, the conductor (Au or AgPd) on BeO substrate was made by silk-screen printing, and drying temperature is only around 850C, no need to under high temperature environment, so there is no chemicalÂ reactions, no environment issue.

Below the thick film ceramic PCB manufacturing process for your reference.

https://www.bestpcbs.com/products/thick-film-ceramic-pcb-manufacturing-process.htm

Here is the photo of BeO with AgPd conductor.

Welcome to contact us if you have better idea, or different comments on BeO ceramic PCB, communation will make us becoming better and better.

Tags:Beo, ceramic PCB, DBC ceramic PCB, DCB ceramic pcb
Posted in Ceramic PCB, FAQ, Our News, PCB News, PCB Technology | No Comments »

How to clean the PCB assembled boards after soldering?

Friday, June 19th, 2020

Best Technology is a full turn-key assembly service company, we can supply the assembled board with very nice and clean surface.

Do you want to know how we control the cleaning process of PCBA? We would like to share the full cleaning process.

As we know, flux is used when soldering electrical components to a printed circuit board.

After assembly process finished, we need to remove all the unnecessary flux paste or other solder flux/ residue in order to avoid any quality issue.

Although it is a simple work, but to prepare some tools and preparation is necessary and important. Like wash board water, dust-free cloth, brush,Tweezers, static bracelets, finger gloves

Here is the how the cleaning process we made:

Step1:

Use brush to brush the solder joint and solder flux on the soldered PCB. Applying some alcohol or acetone onto the brush, do not use too much pressure, as this may cause the solder point to break. Repeat the procedure as necessary, to remove remaining flux residue on the PCBA.

PCB assembly — Step1: Brush the solder joint and solder flux on the soldered PCB

Step2:

Wipe with a clean dust-free cloth to clean the assembled PCB.

Keep board clean and tidy to make sure no impurities and finger marks. Do the same process for bottom side.

Step3:

When above step finished, keep the board for an extra day to let the board dry enough before packing. Best QC guys will do final inspection for the finger prints under light. this will be helpful to check the cleaning result further.

Step4:

Finally, use dust-free cloth to do the final cleaning and let the board dry and clean enough before package.

PCBA Cleaning process — Step4: use dust-free cloth to do the final cleaning.

Above are the process for how we clean the assembled boards.

Best Tech is a very professional manufacturer in printed circuit board and assembly. We clean each of assembled boards as the procedure we showed above.

If you are interesting to know more process for how we control the quality for the PCB assembled boards, contact us at any time, we will show you more.

Tags:PCB Assembly, pcb assembly cleaning, pcba cleaning, turnkey pcba services
Posted in FAQ, Our News, PCB News, PCB Technology, PCBA | No Comments »

What kind of finishing recommended for the extra thin FR4 PCB

Thursday, June 18th, 2020

As we know, the extra thin PCB means the thickness of printed circuit board is more thin than normal PCB, which is refer to a thickness smaller than 0.4mm for 1L/ 2L & 4L PCB. For extra thin PCB, we know they are all very thin and are easily to be broken, so the option for the surface treatment of the extra thin PCB is very crucial.

So, what kind of finishing to be recommended for the extra thin Rigid PCB?

0.15mm extra thin FR4 PCB_Best Technology

Generally, there are 3 kinds finishing can be recommended for the extra thin PCB. It is OSP, ENIG (Electroless Nickel Immersion Gold), and ENEPIG.

But you may want to ask that lead-free Tin is also a common finishing for the PCB. Why not recommend LF HASL?

Thatâ€™s because while LF HASL Process, the PCB will be easy to be blew away, people will use heated compressed air to leveling (blowing) on the coating molten tin (lead) solder, during this process, the traces will be easy to be broken as well.

So normally, we will not recommend the LF HASL finishing for an ultra thin FR4 PCB.

HASL lead-free is only suitable for a board with minimum thickness of 0.6mm, while the standard gold immersion surface coating can support PCB with a minimum thickness of 0.2mm. For the surface treatment of ENEPIG , which plate only needs to be about 0.1 microns for palladium and about 0.1 microns for gold, (palladium is a precious metal that is much harder than gold), so for board with ENEPIG finishing, its surface will looks more smooth, thatâ€™s also why it is the most recommended surface treatment for an extra thin PCB.

If you are searching for an extra thin PCB, feel freely to ask or send your inquiry to us. We will be pleased to share you more information regarding the extra thin PCB.

Tags:extra thin pcb, extra thin rigd pcb, surface treatment
Posted in FAQ, Our News, PCB News, PCB Technology | No Comments »

What is SinkPad PCB?

Wednesday, June 17th, 2020

SinkPad PCB, also called Heat Sink or DTP (direct thermal path)Â PCB, it is a type of Copper base PCB used in thermoelectricÂ separation application. It generally used for high power LED, the pad of LED touch the copper base directly, so that the heat generated by LED will dissipate quickly, which can achieve the best heat dissipation and conduction.

Thermoelectric separation technology is based on the higher heat dissipation requirements of high power electronic products, which needs to meet two basic conditions:

1.LED pad touches the base substrate directly.

It means we need to increase the path of the LED pad to the base substrate to accelerate the heat emission from the base material.

2.Higher heat dissipation substrate materials

Copper has a thermal conductivity of 401W/mÂ·K, while aluminum has a thermal conductivity of 237W/mÂ·K. Obviously, copper has better thermal conductivity because of its high density, high mass. Therefore, a SinkPad PCB usually means a SinkPad copper base PCB.

Tags:copper core pcb, MCPCB, sinkpad pcb
Posted in FAQ, Our News, PCB News, PCB Technology | 1 Comment »

Why do High Power LED mostly use COB light sources? What are the advantages?

Tuesday, June 16th, 2020

If we observe carefully, we will find that most of the high-quality surface light lamps in the marketÂ use COB light source, such as LED spotlights, Automotive, LED Backlight for LED TV, etc.Â What are the advantages of such choice?

First of all, we need toÂ how the COB differ from theÂ common MCPCB. “Chip-On-Board” Metal Core PCBÂ is a type of MCPCB used in thermoelectric separation application. By using COB, the micro-chip (also known as “die”) directly touch the metal core where the heat dissipate, and electrically interconnect the trace of circuit board (wire-bonding) so that power supply can be provided.

Advantages of utilizing COB MCPCB overÂ common MCPCB:

High thermal conductivity(137W/m.K), High insulation, High pressure resistance
High reflectivity: mirror aluminumâ‰¥98% (The reflectivity of Taiyo Soldermask used in common MCPCB is 75-80%, the highest is only 90%)

SinceÂ theÂ COB is packaged directly on the MCPCB, itâ€™sÂ easy assembly for high powers LED, direct heat dissipation through the substrate can not only reduce the manufacturing process and cost of the bracket, but also have the advantage of reducing heat dissipation resistance. So the spotlight produced by COB technology will be lighter, more flexible and able to realize more possibilities on the stage.

If you are also interested in COB, please feel free to contact me, Iâ€™m looking forward to communicating more with you.

Youâ€™re welcome to visit our website to learn more about us. https://www.bestpcbs.com/products/COB-MCPCB.htm

Tags:cob mcpcb, MCPCB
Posted in FAQ, Our News, PCB News, PCB Technology | No Comments »

What is high Tg PCB (fr4-170TG, TG 130-140, FR4 Tg150)

Thursday, June 11th, 2020

In recent years, there are more and more customers request to manufacture PCB with high Tg, in the following we would like to describe what is high Tg PCB.

Normally high Tg refers to high heat resistance in PCB raw material, the standard Tg for copper clad laminate is between 130 â€“ 140â„ƒ, High Tg is generally greater than 170â„ƒ, and middle Tg is generally greater than 150â„ƒ. Basically the printed circuit board with Tgâ‰¥170â„ƒ, we call high Tg PCB. As the rapid development of electric industry, especially for the computer as the representative of electronic products, developing toward the high performance, high multilayer requires PCB substrate material with higher heat resistance to ensure high reliability. On the other hand, as a result of development of SMT, CMT with high density pcb assembly technology, the PCB manufacturing with small hole size, fine lines and thin thickness are more and more inseparable from the support of high heat resistance.

If the Tg of PCB substrate is increased, the heat resistance, moisture resistance, chemical resistance and stability of printed circuit boards will be improved as well. The high Tg applicates more in the lead free pcb manufacturing process.

Therefore, the difference between general FR4 and high Tg FR4 is, in the hot state, especially in the heat absorption with moisture, the high Tg PCB substrate will perform better than general FR4 in the aspects of mechanical strength, dimensional stability, adhesiveness, water absorption and thermal decomposition.

Tags:FR4 PCB, FR4 Tg150, fr4-170TG, TG 130-140
Posted in FAQ, Our News, PCB News, PCB Technology | 2 Comments »