Archive for the ‘FAQ’ Category

The first purpose of coverlay is that cover and protect the FPC circuit, enhance the rupture resistance of FPC.

Secondly, keep the circuit away from the injury by temperature, humidity, pollution and Corrosive material.

Thirdly, to cover the follow-up surface finishing of the FPC.

What’s more, it has the effect of soldermask in FPC SMT.

And the first characteristics of coverlay, it is suitable for the traditional way and rapid pressing on the same time.

Secondly, the heat resisting property and peel strength can keep a long time.

Thirdly, it can control the glue squeeze-out.

The coverlay still has the excellent bending resistance, it is suitable for the high flexible FPC.

And it meet the requirement of RoHS, the coverlay does not contain lead, mercury, cadmium,Polybrominated biphenyls,polybrominated diphenyl ether and red phosphorus.

Our high quality standard is achieved with the following.

• The process is strictly controlled under ISO 9001:2008 and IPC-A600/IPC-A610 standards.
• Extensive use of software in managing the production process
• State-of-art testing equipments and tools. E.g. Flying Probe, X-ray Inspection, AOI (Automated Optical Inspector) and ICT (in-circuit testing).
• Dedicated quality assurance team with failure case analysis process
• Continuous staff training and education

In order to delivery the cargo security to the consignee, avoid the damage, loss,
especially for the a large high value goods, insurance is the required.

For the air and sea cargo, usually we buy the insurance from
CHINA PACIFIC PROPERTY INSURANCE CO.,LTD.

It includes the insured, B/L No. quantity, name, amount Insured,transportation,
date, route,Deductible and Claim payable so on.

The amount Insured should be 110% of the actual goods value.
DEDUCTIBLE usually is USD200.00 OR  5% OF THE LOSS,WHICHEVER IS THE GREATER.

The advantage of the blister packaging.

Normally we pack the goods use PP bags, red bubble film and PE foam, they can protect well the goods.

But when we do the SMT, especially for the big bulge components, PE can’t protect well.

So need to do the blister packaging.
The advantage is can pack any kinds of grotesque goods well, save materials, light weight, easily shipment,good sealing,ROSH, no need to add other buffer material.

Production Flow Chart for ceramic PCB thick film.
1、版图确认 production files confirmation.
2、菲林制作 Film producing.
3、制版 Substrate production and conductor printing.
4、导体丝网印刷 Silkscreen Printing for Conductor
5、高温烧结 High-temperature Sintering
6、导体检验 Conductor Inspection
7、玻璃釉丝网印刷Sickscreen Priting for Glass Glaze
8、中温烧结 Mid-temperature Sintering
9、玻璃釉检验 Glass Glaze Inspection
10、最终检验 Final inspection
11、包装、入库 Packaging and warehousing

1, open the gerber files. Files-Import–AutoImport, choose the file, check Scan each Gerber & English, click Next.
2, click any layer to see and remember the format Digits, then change the NC Data format Digits same to the previous data. Click-OK-Finish.
3, setting the Unit from English to Metric.
4, choose Edit-Move, knock the”W”, knock the left mouse button to selecte the needed area, then click the left mouse button again to comfirm the area.
5, knock the right mouse button,choose anyone as the center point, move the drill layer to the right trace place.
So finish all the steps.

It is the spectial coating with three main function: moisture-proof, fungi-proof and salt fog-proof.
It will become the clear protection film when solidified.
Nomally used to protect the quanlity of the printed ciucuit boards and the relative equipment
from contaminated by the environmental.
Before do the Coating, we need to clean and dry the goods, keep the goods flat.
Attenuate the coating, place at leat for 2 hours before operating.
The last is solidification in the high temperature furnace.

Yes, we can do SMT for ceramic PCB.

• For thick film technology, we can put resistor, electric capacity, conductor, semi-conductor, and interchangeable conductor on ceramic board, the value of resistors can be the same or different.
• For DCB technology, we can assemble LED, connector, resistor and other components on ceramic board.

Due to the conductor is different between thick film technology and DCB technology, the mothed of SMT is different, for thick film technology, the components are printed and sintered on board. For DCB technology, we assemble the components on ceramic PCB by SMT machine or by hand.

• Conductor (trace) Thickness: thick film ceramic PCB is 10~20um, DCB ceramic PCB is 0.1, 0.2, 0.3mm
• The conductor(trace) for thick film ceramic PCB is Au or AgPd, DCB ceramic PCB’s conductor is copper.
• Min trace width/space:thick film ceramic PCB is 300um (250um for prototype), DCB ceramic PCB is 0.3, 0.4, 0.5mm
• PTH (Plated Through Hole) is available for thick film ceramic PCB, but it is unavailable for DCB ceramic PCB now.
• 2 layers traces on the same top side and more than 4 layers traces for thick film ceramic PCB, but can not do this for DCB ceramic PCB now.

The thermal expansion coefficient (PPM/K) of Al2O3 substrate is 7.4 within 50℃-100℃