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How to Reworking a PCB? PCB Rework and Repair Guide
Thursday, October 31st, 2024

PCB rework is a delicate yet vital process for restoring functionality to circuit boards with flaws or damages. It involves methodically removing, replacing, or modifying components to correct issues. Whether it’s due to design alterations, assembly errors, or minor repairs, PCB rework can save costs and prevent discarding entire units

What is the Process of PCB Rework?

The process of PCB rework generally follows a series of careful steps. Technicians start by inspecting the board to identify the defective areas. For rework, precise tools like soldering irons, hot air rework stations, or BGA rework machines are typically used.

Once heated, damaged or defective components are removed. A flux application ensures that the solder flows cleanly, which reduces the risk of bridging or insufficient connections. The next step is carefully placing a new component in place, using a microscope to ensure accuracy, particularly for small parts like surface-mount components. Finally, the connections are resoldered, and the board undergoes cleaning and testing.

What is the Difference Between Repair and Rework in PCB?

PCB repair and rework, though closely related, serve unique purposes within electronics manufacturing and servicing. Rework refers specifically to correcting issues in a PCB due to assembly errors or modifications required before the board is shipped to the customer. This process should be operated very carefully, including during removing, adjusting, or replacing components. For instance, rework might be needed if components were placed incorrectly, solder joints are weak, or the board has minor assembly defects.

Repair, however, addresses boards that have become faulty or non-functional after use. Repair focuses on bringing a board back to working condition, whether due to physical damage, such as broken traces or burnt components, or due to environmental factors like corrosion. While rework ensures the board meets its initial design intent, repair aims to recover a board’s functionality after it has failed. Both repair and rework require precise techniques and skilled technicians, but repair can be more complex due to the nature of post-production or operational damages.

In summary:

  • Rework: Fixing pre-delivery assembly issues to align the board with its intended design.
  • Repair: Restoring functionality to a damaged or non-functional board, often due to wear, damage, or environmental exposure.

How Many Times Can You Rework a PCB?

The number of rework attempts a PCB can safely endure depends on factors like the materials used in the board, the board’s structure (e.g., number of layers), and the rework methods applied. Typically, each rework cycle subjects the board to a heating process, which can wear down solder joints and laminate strength over time. For most PCBs, rework should be limited to two or three cycles to avoid degradation, as repeated heating can lead to pad lifting, warping, or delamination of the substrate, especially with multi-layer boards.

Multilayer PCBs with multiple embedded connections are particularly sensitive, as excessive heating can damage internal layers. High-temperature cycles weaken solder joints, increasing the risk of electrical faults. Some high-quality boards, particularly those designed for critical applications like aerospace or medical devices, may tolerate additional rework if built with durable materials, but general guidance suggests minimal rework attempts. Careful planning and accurate diagnostics are essential for minimizing rework cycles, ensuring the board’s lifespan is preserved.

Can a Damaged PCB Be Repaired?

Yes, in many cases, a damaged PCB can be repaired.

It depends on the type and extent of the damage. For example, broken traces, lifted pads, and minor component failures are often fixable. Using epoxy, technicians can repair lifted pads, while trace repair kits can restore broken connections. However, severe burns or extensive damage to multiple layers can make repairs impractical or costly. The best approach is to assess each situation individually and determine if repair is viable.

What Wire is Best for PCB Rework?

Using the right wire during PCB rework is crucial for achieving reliable connections. For rework, thin, lead-free solder wire with a flux core is often recommended. A wire diameter of 0.5mm to 0.8mm provides better control and precision, making it suitable for both small and large components. Lead-free solder is preferred in many industries due to environmental regulations, but it requires higher temperatures than traditional lead-based solders, so it’s essential to have proper temperature control.

Flux-core solder wire is essential as it allows for smoother, more reliable connections by promoting better solder flow and reducing oxidation at solder joints. Rosin-core flux is commonly used because it provides a strong bond and requires minimal cleaning. Additionally, if jumper wires are needed to bridge broken traces, insulated 30 AWG wire is ideal due to its fine gauge.

What is the IPC Standard for PCB Rework?

The IPC standards for PCB rework and repair are widely recognized and adhered to within the electronics industry to ensure quality and reliability. IPC-7711 and IPC-7721 specifically address rework, modification, and repair of printed circuit boards.

  • IPC-7711 provides guidelines for reworking and modifying electronic assemblies. This includes instructions on tools, temperature control, and safety practices necessary for removing and replacing components while preserving the board’s structure. It offers details on soldering and desoldering techniques that ensure high-quality connections after rework.
  • IPC-7721 focuses on the repair aspect, covering methods for handling damaged components and structural faults like broken traces, lifted pads, and substrate repair. This standard is critical for technicians performing repairs, as it outlines best practices for restoring physical and electrical integrity without compromising board function.

What is the Main Cause of PCB Failure?

PCB failures may cause from a variety of factors, with design flaws, manufacturing errors, and environmental stresses among the primary culprits. Here’s a closer look at some of the main causes:

  • Design Flaws: Poorly optimized PCB layouts can lead to issues like excessive heat buildup, inadequate trace width for current capacity, or improper component spacing.
  • Manufacturing Errors: Mistakes during the assembly process, such as improper soldering temperatures or placement inaccuracies, can lead to weak solder joints or misaligned components. These issues may not be apparent initially but can result in premature board failure.
  • Environmental Stress: PCBs exposed to extreme temperatures, humidity, or corrosive environments are at risk of damage. Moisture can cause short circuits or corrosion on solder joints and traces, while high temperatures may warp the board or degrade the substrate. Boards used in outdoor or industrial settings are especially vulnerable.
  • Electrostatic Discharge (ESD): Sensitive components can fail if exposed to static electricity.
  • Aging and Wear: Over time, boards and components naturally wear out. Solder joints may crack, components degrade, and thermal cycles lead to material fatigue.

If your PCB or PCBA can’t work, and don’t know where is the problem. You can contact Best Team to ask for help, we are professional in this industry.

What is Laser Direct Imaging in PCB Manufacturing?
Wednesday, October 30th, 2024

‌What is Laser Direct Imaging?

Laser Direct Imaging (LDI) is a technology that uses a laser beam emitted by an ultraviolet laser to image directly on a PCB (printed circuit board). Compared to traditional exposure techniques, LDI has higher image quality, precision traces and real-time adjustment.

The LDI technology achieves pattern transfer by projecting the line image directly onto the PCB coated with photoresist through the laser beam emitted by the laser diode. This method eliminates the use of negatives in the traditional exposure process, reduces the time and cost of loading and unloading negatives, and avoids deviations caused by negative growing. The image resolution of LDI technology is high, and the fine wire can reach about 20um, which is suitable for the production of fine wire and improves the yield of PCB production.

What is Laser Direct Imaging in PCB Manufacturing?

Working Principle of LDI Technology

The principle of laser imaging is to acquire and present images based on the characteristics of laser beam. As we know, a laser is a highly focused, high-brightness, monochromatic beam that can therefore produce high-quality images. The laser imaging system mainly consists of laser, lens, scanning device and receiver. The laser is used to generate the laser beam, the lens is used to focus the beam, the scanning device is used to change the path of the beam on the object, and the receiver is used to receive the light signal and convert it into an image.

In the imaging process, the laser beam is focused from the laser through the lens, and then the path of the beam on the object is controlled by the scanning device. When the laser beam hits the surface of an object, it interacts with the surface. This interaction causes light to scatter and reflect, with scattered light diffusing in different directions and reflected light remaining in its original direction of propagation. The receiver receives the light scattered and reflected by the object and converts it into an electrical signal. The receiver converts the signal into a digital image signal, which is then processed and displayed on the screen to form an image. In the processing process, the received signal can be filtered, amplified and other operations to improve the quality and clarity of the image.

What is Laser Direct Imaging in PCB Manufacturing?

As PCB manufacturing processes continue to advance, LDI technology is also evolving. At present, the mainstream light source in the industry is the 405nm laser diode produced by Nichiya, Panasonic, and it is expected that the optical power requirements for exposure will be further improved in the future, and the optical power of a single device may develop to 100W. Nowadays, LDI technology is not only used in PCB manufacturing process, but also in high-end applications like medical imaging, industrial detection, remote sensing.

Advantages of Laser Direct Imaging Over Photo Exposure

The advantages of laser direct imaging (LDI) compared with traditional exposure machines mainly include the following aspects:

1. Eliminating the negative process in the exposure process

    The LDI technology eliminates the step of making the negative in the traditional exposure process, thereby saving the time and cost of loading and unloading the negative, and reducing the deviation caused by the negative growth and contraction.

    2. High resolution

    The image resolution of LDI technology is very high, which is suitable for some very fine line production, especially for multi-layer PCB, which greatly improves the yield of PCB production.

    3. High quality and precision

    LDI is contactless operation, reducing the chance of miscontact, the closed operating environment reduces the influence of temperature and humidity, the image quality is high and fine, eliminating many defects in the traditional process.

    4. Reduce errors and improve alignment

    LDI technology improves alignment by eliminating alignment problems that often exist in photographic plates, especially the anisotropic movement of photographic plates caused by changes in temperature and humidity. High-precision alignment is achieved by using a charge-coupled device (CCD) camera system and a reference target to line up printed images and panels.

    5. Shorten the production process and reduce costs

    Because there is no need to have a negative production process, LDI technology shortens the production process, reduces the call of personnel, and reduces the production cost. In addition, the LDI system can lay more devices in the same environment, enabling two-way scanning and further savings.

    6. Adapt to a variety of production needs

    LDI technology has a flexible manufacturing route, which can meet various production needs without affecting the output. Once the data is delivered to the engineering department, production can begin, reducing product delivery time.

    The image quality of LDI technology is clearer than that of traditional exposure technology, and it has obvious advantages in mid-to-high-end PCB manufacturing. With the transfer of global PCB production capacity to China and the high-end development of the electronics industry, the demand for LDI equipment continues to grow, and it is expected that the future will gradually replace traditional exposure equipment in the field of low-end PCB.

    What is the Process of Direct Imaging?

    Direct imaging with LDI involves several steps that ensure precise layer creation:

    • Design Preparation: The digital circuit design is prepped for imaging, with adjustments made to accommodate laser processing specifics.
    • Photoresist Coating: The PCB is coated with a light-sensitive photoresist material, which reacts chemically when exposed to the laser.
    • Laser Imaging: The laser projects the circuit pattern directly onto the photoresist. Adjustments can be made mid-process, allowing for precise alignment.
    • Developing: After exposure, the board is treated with a developer to reveal the circuit paths. Unexposed areas are removed, leaving only the intended design.
    • Etching or Plating: Depending on the PCB type, the board undergoes etching or plating to define the copper traces, completing the imaging process.

    Difference Between Positive and Negative Images in PCB

    In PCB photo exposure, the terms “positive” and “negative” refer to how the photoresist reacts to the laser exposure:

    • Positive Image: Here, the laser exposes areas intended to be removed. During development, the exposed regions dissolve, leaving behind the unexposed areas as the design.
    • Negative Image: In a negative image process, the laser exposes the regions meant to remain on the board. These exposed parts resist the developer, protecting the underlying material, while unexposed regions dissolve away.
    What is Laser Direct Imaging in PCB Manufacturing?

    The choice between positive and negative imaging depends on the photoresist type and the specific design requirements. Both methods offer high accuracy, but each has unique benefits based on the intended application.

    Why LDI Process Less Cost-effective than Phototool?

    While LDI offers many advantages, it often requires a higher initial investment than phototools:

    1. Equipment Costs: LDI machines are sophisticated and costly, requiring a significant investment in laser technology and imaging systems.

    2. Maintenance: High-precision lasers and optics demand regular maintenance and calibration to ensure consistent performance, which adds to operational costs.

    3. Speed on Larger Runs: For high-volume production, phototools may still be more cost-effective. Phototools offer rapid replication without the need for repeated laser exposure, lowering costs for large-scale production.

    These cost factors make LDI more suitable for specialized, lower-volume, or high-precision applications rather than large-batch productions.

    How is Layer Registration in LDI?

    Layer registration is crucial in PCB manufacturing, especially for multilayer boards where each layer must align precisely. LDI excels in this aspect:

    1. Automated Alignment: LDI systems come with advanced alignment software that adjusts each laser exposure to match the existing layer positions.

    2. Reduced Human Error: Since the process is largely automated, human handling is minimal, reducing the risk of alignment issues.

    3. Dynamic Adjustment: With real-time feedback systems, LDI machines adjust alignment during the process, maintaining tight registration tolerances.

    If you’re seeking high-quality PCB manufacturing, consider choosing a provider skilled in LDI processes like Best Technology. Our company combines expertise with cutting-edge technology to ensure your boards are produced to exact specifications, delivering the durability and performance you need in today’s advanced electronics.

    PCB Surface Treatments: A Comprehensive Guide
    Tuesday, October 29th, 2024

    Printed Circuit Boards (PCBs) are the backbone of modern electronics. To ensure optimal performance and durability, PCBs undergo various surface treatments. These treatments protect the copper traces from corrosion, enhance solderability, and improve the overall reliability of the circuit board. In this article, we’ll explore the most common PCB surface treatments and their applications.

    1. HASL (Hot Air Solder Leveling)

      Principle

      HASL is a traditional surface treatment that involves immersing the PCB in a bath of molten solder. After the solder solidifies, hot air is used to level the surface and remove excess solder.

      Features

      •Material: Lead-tin alloy (for traditional HASL) or lead-free solder (for LF HASL).

      •Process: Immersion in molten solder followed by hot air leveling.

      Advantages

      •Excellent solderability.

      •Cost-effective for large volumes.

      •Good mechanical strength.

      Picture

      PCB Surface Treatments: A Comprehensive Guide

      2. OSP (Organic Solderability Preservatives)

      Principle

      OSP involves applying a thin layer of organic material (usually a rosin-based compound) to the copper surface, which protects it from oxidation.

      Features

      •Material: Organic preservatives.

      •Process: Application of organic film.

      Advantages

      •Environmentally friendly.

      •Good solderability.

      •Suitable for rework.

      Picture

      PCB Surface Treatments: A Comprehensive Guide

      3. ENIG (Electroless Nickel Immersion Gold)

      Principle

      ENIG involves depositing a layer of nickel followed by a thin layer of gold on the copper surface. This provides a robust barrier against corrosion and ensures good solderability.

      Features

      •Material: Nickel and gold.

      •Process: Electroless nickel deposition followed by immersion gold plating.

      Advantages

      •High reliability.

      •Excellent solderability.

      •Long shelf life.

      Picture

      PCB Surface Treatments: A Comprehensive Guide

      4. ENEPIG (Electroless Nickel Electroless Palladium Immersion Gold)

      Principle

      ENEPIG is similar to ENIG but adds a palladium layer between the nickel and gold. This improves the resistance to wear and tear.

      Features

      •Material: Nickel, palladium, and gold.

      •Process: Electroless nickel deposition, electroless palladium, and immersion gold plating.

      Advantages

      •Superior wear resistance.

      •Excellent solderability.

      •Long-term reliability.

      Applications

      •High-reliability military and aerospace applications.

      •High-frequency applications.

      •Wire bonding

      Picture

      PCB Surface Treatments: A Comprehensive Guide

      5. Gold Immersion (Direct Gold Plating)

      Principle

      Gold immersion directly deposits a layer of gold onto the copper surface without a nickel underlayer.

      Features

      •Material: Gold.

      •Process: Direct gold plating.

      Advantages

      •High conductivity.

      •Excellent solderability.

      • Silver Immersion

      Principle

      Silver immersion involves depositing a layer of silver onto the copper surface.

      Features

      •Material: Silver.

      •Process: Immersion silver plating.

      Advantages

      •High conductivity.

      •Low cost compared to gold.

      Picture

      PCB Surface Treatments: A Comprehensive Guide

      6. Hard Gold (Selective Gold Plating)

      Principle

      Hard gold is a thicker and harder layer of gold, typically applied selectively to contact areas.

      Features

      •Material: Gold.

      •Process: Selective gold plating.

      Advantages

      •High wear resistance.

      •Good electrical contact properties.

      Picture

      PCB Surface Treatments: A Comprehensive Guide

      7. Tin Immersion

      Principle

      Tin immersion deposits a layer of tin onto the copper surface.

      Features

      •Material: Tin.

      •Process: Immersion tin plating.

      Advantages

      •Good solderability.

      •Low cost.

      Applications

      •Cost-sensitive applications.

      •General-purpose electronics.

      Picture

      PCB Surface Treatments: A Comprehensive Guide

      Choosing the right surface treatment for your PCB depends on several factors, including the application environment, cost considerations, and performance requirements. Each treatment has its own set of advantages and limitations. Understanding these treatments will help you make informed decisions that enhance the performance and longevity of your electronic devices.

      I hope this guide helps you understand the different surface treatments used in PCB manufacturing and their applications. If you have any questions or need further clarification, feel free to reach out!

      What is ICT Full Form in PCB?
      Saturday, October 26th, 2024

      ICT Test Full Form

      The full form of ICT is In-Circuit Testing. It is a method that always used to test assembled circuit board during manufacturing.

      What is ICT in PCB?

      In-circuit testing (ICT) is a method used to test assembled circuit boards during production. It ensures that every component on the PCB functions as expected. By applying electrical signals to the board, it checks for faults like open circuits, shorts, and wrong component values.

      In PCB assembly, ICT is used for final testing after surface-mount components and through-hole components have been soldered onto the board. This test is highly effective in identifying assembly defects that might compromise the functionality of the final product.

      What is ICT Full Form in PCB?

      ICT vs. FCT

      Although ICT and FCT look similar, their purposes and focus are different.

      In-Circuit Testing (ICT) is like a thorough quality check for individual components. It tests each resistor, capacitor, inductor, and IC on the board to make sure they’re installed and working as expected. ICT does this without focusing on the PCB’s complete function as a whole; instead, it looks for manufacturing faults or placement errors on each part of the circuit. This is perfect for catching problems before the PCB reaches final assembly.

      Functional Circuit Testing (FCT), on the other hand, looks at the bigger picture. FCT checks if the assembled board works as intended in a simulated working environment. It mimics the real-world conditions the PCB will face once in use, testing the board as a whole rather than individual components. FCT aims to ensure that all parts are correctly interacting and that the board behaves as it should under operating conditions.

      What is ICT Full Form in PCB?

      Together, ICT and FCT form a powerful duo: ICT focuses on each component’s accuracy, while FCT ensures that all the elements work smoothly as a cohesive unit. Using both tests provides a comprehensive check, enhancing the PCB’s overall quality and reliability before it reaches the end-user.

      What Items Does ICT Test for on a PCBA?

      When ICT tests a PCBA, it’s really looking for any faults or failures in the components and connections that could cause problems later on. Here’s what ICT commonly checks:

      • Resistors – It verifies that each resistor has the right resistance value and is correctly placed. If a resistor value is wrong, it can disrupt the whole circuit.
      • Capacitors – ICT checks capacitance levels and polarity (in specific cases) to make sure each capacitor is installed properly. Incorrect capacitors can lead to unstable performance.
      • Inductors – The test examines if inductors have the correct inductance values. Faulty inductors can cause power issues or signal problems.
      • Integrated Circuits (ICs) – ICT verifies that ICs are in the right orientation and connected properly to avoid shorts or opens, both of which can make the board malfunction.
      • Transistors – By checking transistor functionality, ICT ensures they won’t cause signal or power issues within the PCB.
      • Diodes – ICT makes sure diodes have correct polarity and work properly. Misplaced or faulty diodes can impact the flow of current, leading to circuit failure.
      • Solder Joints – ICT evaluates each solder joint, checking for breaks or poor connections. Bad solder joints lead to unstable electrical contact, which could cause intermittent issues or complete failure.

      What is an ICT Machine?

      An ICT machine is a specialized piece of equipment designed to perform in-circuit tests on PCBs. You can see it from below picture. The ICT machine uses a test fixture, also called a “bed of nails,” containing numerous tiny probes or pins. Each probe aligns with a specific point on the PCB, making contact with various circuit points to evaluate the electrical connections.

      Once a PCB is placed in the test fixture, the machine applies signals through the probes to test individual components. It checks electrical properties such as resistance, capacitance, and voltage at each node. If a component is misplaced, missing, or faulty, the machine flags it immediately.

      What is ICT Full Form in PCB?

      With its speed and precision, an ICT machine is an invaluable tool in high-volume production lines. While setting up an ICT machine requires creating a test fixture for each PCB, they save much time and human during the manufacturing process, make sure a fast delivery.

      What Are the 7 Types of PCB Testing Methods?

      In addition to ICT testing, there are other 6 types of PCB testing methods that widely used. Let’s talk about them one by one.

      1. Flying Probe Testing

        A testing method mainly used for prototypes or small/low volume orders. In Flying Probe Testing, multiple movable probes make contact with test points on the board. Unlike ICT, it doesn’t require a fixture, making it highly flexible and cost-effective for small production runs. However, compared with ICT testing, it’s relatively slower than ICT because it tests points sequentially.

        2. Functional Circuit Testing (FCT)

        FCT is a method that check whether PCBA works correctly. It is typically come after ICT, and in almost factory, it is the last process to confirm that every component works together correctly.

        3. Burn-In Testing

        Burn-in Testing (also called aging test) pushes the board to its limits by applying high temperatures, loads, or voltages for extended periods. It can spot failures in components that might not withstand the stress of real-world conditions. Burn-in testing is often used for products that need high reliability, such as aerospace and medical devices.

        4. X-Ray Inspection

        For multilayer or densely packed PCBs, X-ray inspection is must to do. It helps visualize hidden solder joints and component placements that inspectors can’t found by naked eyes. X-ray inspection is invaluable for boards with fine-pitch components such as BGAs, QFNs, or those where hidden joints can’t be inspected visually.

        5. Automated Optical Inspection (AOI)

        AOI uses cameras to visually inspect the board for common issues like misalignment, missing components, or faulty solder joints. This is a quick and effective way to catch visible defects. AOI is widely used in automated production lines, as it quickly flags any boards that require closer examination. To get highest quality and no-defect products, Best Technology equipped with online dual track AOI to inspect PCBA.

        6. Boundary Scan Testing

        Boundary Scan Testing is particularly useful for complex boards where physical probing is challenging. It involves using ICs that support scan testing, so that engineers to check connectivity between ICs and other critical points. Boundary scan is common in high-density boards like those found in telecommunications.

        Each method brings a unique advantage to PCB testing. In-Circuit Testing (ICT) is highly effective for large-scale quality control, while Flying Probe Testing is better suited for prototypes and smaller batches. Together, these tests form a complete strategy for delivering reliable, high-quality PCBs across various production needs.

        How does ICT Testing?

        ICT works by using a bed-of-nails (BON) tester or test probes to connect to specific test points on a PCB. Electrical signals are then sent through the board, and the responses are analyzed. Here’s how it works in simple steps:

        • Connection: The PCB is placed on the ICT machine, where test pins contact the board at designated points.
        • Signal Application: The ICT machine applies electrical signals to test the components individually or in groups.
        • Data Collection: The responses from each component are recorded to determine if it matches the expected output.
        • Fault Identification: Any deviations from expected responses are flagged, identifying potential defects like soldering errors, component failures, or incorrect placements.

        FAQs about ICT

        Q: What is ICT?

        A: ICT (In-Circuit Test System), commonly known as online tester In Chinese, is mainly used for the test of assembled Circuit boards (PCBA).

        Q: Which components can ICT basic functions measure?

        A: On, short circuit, resistance, capacitance, inductance, diode, IC protection diode test, etc.

        Q: Why use ICT?

        A: According to the statistical data of the circuit board assembly industry, assembly defects are mainly reflected in the welding open circuit, short circuit, offset, missing parts and other aspects, accounting for more than 90%, so the principle of online testing technology application is to quickly detect faulty components or assembly defects, and can accurately locate defects and defect classification.

        Q: Can ICT be regarded as a universal meter?

        A: ICT can be regarded as an automated high-level multipurpose meter, and because it has the function of circuit isolation, it can accurately measure the actual value of each component in the circuit.

        Q: What is the relationship between ICT and AOI?

        A: ICT is mainly carried out by electrical measurement methods, while AOI is carried out by optical image processing technology. Both have their own strengths and complement each other. In the process arrangement, AOI is generally the first, then ICT.

        How to do EMI/EMC Testing in PCBs?
        Friday, October 25th, 2024

        In the PCB design and testing, there is a common term be mentioned frequently, that is EMI and EMC. Some people may ask that “what is EMI/EMC, why is it be mentioned every time?” Today, BEST team will take you to understand what are they and how to test them. Let’s keep reading.

        How to do EMI/EMC Testing in PCBs?

        What are EMI and EMC in PCB?

        Before diving into, we should know both EMI and EMC are important elements during the PCB design. Some new PCB projects are failed during testing, because EMI and EMC design is not reasonable.

        EMC is short for electromagnetic compatibility. EMC in a PCB is the ability of the PCB to operate in its electromagnetic environment without creating unbearable electromagnetic interference to other devices around it. In general, to achieve an EMC compliant design, engineers need to consider three basic aspects:

        • Generating unwanted electromagnetic radiation and its propagation.
        • The vulnerability of designs or components to electromagnetic interference (EMI).
        • PCB design should not cause intolerable electromagnetic interference on its own.

        EMI is short for electromagnetic interference. EMI is unwanted noise or signals generated by electronic devices, which can disrupt other nearby equipment. PCBs, being central to electronics, are often both sources and victims of EMI. Every engineer should follow EMC configuration standards to minimize the total amount of EMI and its impact.

        How to do EMI/EMC Testing in PCBs?

        In a word, EMI refers to the generation of electromagnetic interference, while EMC refers to electromagnetic compatibility, that is, how well a device blocks EMI. EMI originates from electromagnetic equipment, and EMC involves equipment that is both anti-interference and non-interference with other equipment.

        What Is the Difference Between EMI and EMC Testing?

        EMI testing focuses on measuring the interference a device generates. It aims to ensure that the PCB doesn’t emit electromagnetic waves that can interfere with other devices. EMC testing, on the other hand, checks the device’s ability to withstand electromagnetic interference from its environment without losing functionality. Both tests are essential to make sure that your PCB not only works well but also doesn’t cause problems for other systems.

        The main difference between EMC tests and EMI is their purpose and method of testing. ‌

        Test purpose

        • ‌EMC testing focus on the equipment or system will function properly in an electromagnetic environment and will not cause intolerable electromagnetic disturbance to other equipment. EMC testing includes two aspects: electromagnetic immunity (the ability to resist interference) and electromagnetic emission (not to interfere with other equipment).
        • ‌However, EMI testing focuses on unwanted electromagnetic energy emitted by a device or system that may interfere with the normal operation of other nearby equipment. The purpose of EMI testing is to identify and reduce these sources of interference to prevent interference with other equipment ‌

        Testing method

        • ‌EMC test usually includes shielding, grounding, and filtering methods. Shielding is surrounding devices or systems by using conductive materials to reduce leakage of electromagnetic radiation. Grounding is connecting the metal housing and ground to provide a safe electrical circuit loop. Filtering is to reduce unnecessary electromagnetic signal transmission through PCB circuit design.
        • ‌EMI test mainly measuring by the conducted interference and radiation interference of the devices. Conducted interference is interference that travels through a conductive medium (such as a wire), while radiative interference refers to the interference that travels through space.

        What Are the Testing Standards for EMI/EMC?

        Several global standards guide the EMI/EMC testing process. These include:

        IEC 61000 series: This is the most common EMC test standard, covering EMI and EMS (Electromagnetic sensitivity) test methods, limits and units of measure.

        EN 55014 series: This is the EU EMC test standard, including:

        EN 55014-1: Radiation from household appliances

        ‌EN 55014-2‌: Radiation immunity of household appliances

        ‌EN 55032‌ : Interference emission test for multimedia electronic products

        ‌EN 55035‌ : Immune immunity test for multimedia electronic products

        ‌GB/T17625 series ‌ : This is China’s EMC test standard, including:

        GB/T17625.1-2012‌ : EMC limits Harmonic current emission limits (Input current per phase ≤16A)

        ‌GB/T17625.2-2007‌ : Limits on voltage variation, voltage fluctuation, and flicker (rated current of equipment per phase ≤16A)

        ‌GB/T17625.7-2013‌ : Harmonic current limit for conditionally connected devices with rated current ≤75A in a common low-voltage power supply system

        ‌GB/T17625.8-2015‌ : Harmonic current limit for devices connected to a common low-voltage system with input current greater than 16A but less than 75A per phase

        ‌GB/T17625.9-2016‌ : Signal transmission emission levels, frequency bands and electromagnetic disturbance levels on low-voltage electrical installations

        ‌GBZ17625.3-2000‌ : Limits on voltage fluctuations and flickers in low-voltage supply systems for devices with rated current >16A

        ‌GBZ17625.6-2003‌ : Limits on harmonic currents produced by devices with rated current >16A in low-voltage power supply systems

        ‌GBZ17625.13-2020‌ : Evaluation of emission limits for unbalanced installations connected to medium voltage, high voltage, and ultra-high voltage power systems

        ‌GBZ17625.14-2017‌ : Evaluation of emission limits for harmonics, interharmonics, voltage fluctuations and unbalance of nuisance devices connected to low voltage power systems

        ‌GBZ17625.15-2017‌ : Evaluation of low frequency electromagnetic immunity and emission requirements for distributed generation systems in low voltage power grids

        These standards cover a wide range from household appliances to industrial equipment, you can follow one of them according to your specific applications and countries.

        How to Conduct an EMI Test?

        Before conduct a test, let’s know the testing method. EMI test methods mainly include the following ‌ :

        1. Pre-test: EMI testing performed during the design phase to detect and resolve EMI problems early in product design and development. Pre-test can be conducted using computer simulation, or by using actual test equipment.

        2. Emission test: It is a test to measure whether electromagnetic waves emitted by equipment meet EMI standards. The emission test can be carried out by field test, half-time test, full-field test and other methods. Commonly used test equipment includes spectrum analyzer, scanning receiver, antenna, etc.

        3. Sensitivity test: Common sensitivity testing methods include radiation sensitivity testing and conduction sensitivity testing. radiation sensitivity testing uses a signal generator to generate an electromagnetic field of a specific frequency and intensity. And conduction sensitivity testing involves injecting simulated electromagnetic interference signals on the power or signal lines of the equipment under test.

        4‌. Spectrum analysis: By measuring the spectrum of electromagnetic wave to analyze the characteristics of electromagnetic interference.

        ‌Above are the testing methods of EMI, and here is the steps that how to test it.

        • Select the right test method

        First of all, select a right test method according to the specific test purpose and object. For example, if the emission characteristics of the equipment need to be evaluated, an emission test can be selected; If you need to evaluate the anti-interference capability of the equipment, you can choose sensitivity test.

        • Use professional equipment

        Use professional test equipment, such as spectrum analyzer, signal generator, digital storage oscilloscope, etc., to ensure the accuracy of the test results.

        How to do EMI/EMC Testing in PCBs?
        • Environment control

        When performing sensitivity test, control the test environment to avoid the influence of other electromagnetic interference sources. Tests can be conducted in a shielded room to reduce outside interference.

        • Data analysis

        Detailed analysis of the test data, identify potential sources of electromagnetic interference, and propose improvement measures. Methods such as difference method and potential zeroing method can be used to reduce the influence of interfering magnetic field on measurement results.

        EMI/EMC PCB Design Guidelines

        1. Ground plane

        Because all circuits need to be grounded, the ground plane is the first line of defense against EMI. The following measures can be taken to reduce EMI:

        • Increase the ground area
        • Set up the ground plane
        • Each component should be connected to the ground plane
        • Each component should be connected to the ground plane or a ground point.
        • Decoupling capacitor
        • The ground plane is placed directly below the plane with the signal trace
        • Digital ground and analog ground should be separated
        • The ground wire should be as thick as possible
        • The length of the ground system should be kept to a minimum
        How to do EMI/EMC Testing in PCBs?

        2. Power supply design

        Improper power supply design will result in greater noise and ultimately reduce product performance. Two main factors that lead to power supply instability:

        1) Excessive transient AC current under high-speed switching

        2) Inductance exists in the current loop Therefore, the integrity of the power supply should be fully considered in PCB design.

        How to do EMI/EMC Testing in PCBs?

        3. PCB layout

        a) PCB size

        PCB size must be considered. When it comes to oversized boards, the traces must go a long way as the impedance increases, the noise immunity decreases, and the manufacturing cost increases. When the board size is particularly small, it will cause heat dissipation problems and crosstalk is prone to occur between adjacent traces. The recommended PCB size is a rectangle with an aspect ratio of 3:2 or 4:3. In addition, when the board size exceeds 200mm*150mm, the mechanical strength of the board retraction should be considered.

        b) Avoid right angles

        This has been said many times. Avoid 45° to 90° for vias, traces, etc. When the trace reaches more than 45°, the capacitance will increase.

        c) Keep signals separated

        Digital circuits, analog circuits, and noise sources should be placed independently on the board, and high-frequency circuits should be isolated from low-frequency circuits. In addition, attention should be paid to the component distribution of strong and weak signals and the direction of signal transmission.

        d) Increase the trace width as much as possible

        e) Wider trace sizes can effectively reduce radiated emissions.

        f) Make the return current path as short as possible and route along the path with the least resistance. The length of the return path should be roughly the same as or shorter than the length of the transmission trace.

        4. Component placement

        In general, it is best to completely separate analog and digital signals. Being too close can easily lead to problems such as crosstalk. In addition, compatible components should be placed independently to ensure that components do not interfere with each other in space.

        How to do EMI/EMC Testing in PCBs?

        5. PCB layer design

        In terms of the number of layers, choose the appropriate number of layers. Single-layer PCBs and double-layer PCBs are suitable for medium and low-density wiring or low-integrity circuits. Based on manufacturing cost considerations, most consumer electronic products rely on single-layer PCBs or double-layer PCBs. However, due to their structural defects, they both generate a lot of EMI, and they are also sensitive to external interference. Multi-layer PCBs tend to be more used in high-density wiring and high-integrity chip circuits. Therefore, when the signal frequency is high and the electronic components are densely distributed, a PCB with at least 4 layers should be selected. In multi-layer PCB design, the power layer and the ground layer should be specially arranged, and the distance between the signal line and the ground line should be reduced.

        6. EMI shielding

        Shielding and filtering can minimize the impact of EMI. Some shielding and filtering options include:

        • Component and PCB shielding
        • Low-pass filtering
        • Cable shielding

        7. Trace routing

        Put the current signals with the same output but opposite directions in parallel to eliminate magnetic interference. Discontinuities in printed leads should be minimized. For example, the lead width should not change abruptly and the lead angle should not exceed 90°.

        8. Routing design

        The power line, ground line, and traces on the circuit board should maintain low impedance to high-frequency signals. When the frequency remains so high, the power line, ground line, and circuit board traces all become small antennas responsible for receiving and transmitting interference. To overcome this interference, it is more important to reduce the high-frequency impedance of the power line, ground line, and circuit board traces than to increase the filter capacitor. Therefore, the traces on the circuit board should be short, thick, and evenly arranged.

        9. Decoupling and grounding

        The proper placement of decoupling capacitors and the application of the inductor capacitor energy storage function make it possible to provide current to the device at the moment of switching. In a DC loop, load changes can cause power supply noise. The decoupling capacitor configuration can block the noise generated by load changes. For electronic equipment, grounding is a key method to control interference. If grounding is properly combined with shielding measures, most interference problems will be solved.

        Above all are the key points when design pcb, hope you can take them in mind and use in your actual design phase.

        Aerospace PCB Assembly Guide | PCBA & Box Building
        Thursday, October 24th, 2024

        What is Aerospace PCB Assembly?

        Aerospace PCB assembly refers to the intricate process of manufacturing printed circuit boards (PCBs) specifically for aerospace systems, including aircraft, spacecraft, satellites, and other related avionics systems. These boards are vital for controlling critical systems in extreme environments, where traditional electronic components would fail. Aerospace PCBs are engineered with precise attention to durability, signal integrity, and longevity to ensure reliable operation over long periods, even in the most hostile conditions like extreme temperatures, vibrations, and radiation.

        The assembly process includes component placement, soldering, testing, and verification to ensure the PCBs meet strict aerospace industry standards. Due to the high-stakes nature of aerospace applications, each PCB must be built with the highest degree of precision and undergo rigorous testing to ensure it can withstand the operational conditions of the specific aerospace application.

        Aerospace PCB Assembly Guide | PCBA & Box Building

        Why does Aerospace PCB Assembly Need High Reliability?

        Aerospace PCB assembly requires exceptionally high reliability due to the mission-critical nature of the systems they support. Unlike consumer electronics, where failures might lead to inconvenience, failures in aerospace systems can be catastrophic, leading to loss of life, property, or the failure of multimillion-dollar space missions. Once a satellite, spacecraft, or aircraft is deployed, accessibility to repair faulty components is extremely limited. So that aerospace PCBs function flawlessly for years, or even decades, without failure.

        In addition to inaccessibility, aerospace electronics face harsh environmental conditions such as extreme temperatures, radiation, shock, and vibration. These conditions demand that PCBs operate continuously under stress without compromising their performance. High-reliability standards ensure the PCBs’ long-term stability and functionality in these demanding environments. Aerospace components must be high quality, fail-safe, and undergo extensive testing for performance, durability, and resilience.

        What Grade of IPC Standard Should Aerospace PCB Assembly Follow?

        IPC standards are a widely used term in the electronics industry that covers all aspects of electronic product design, including the acceptability of printed circuit boards, material requirements, and more. IPC standards establish standards from all aspects, as long as manufacturers strictly implement the standards, product quality and reliability are naturally guaranteed.

        Aerospace PCB assembly needs to meet the requirements of high reliability, high quality and high performance, so during the production process, it should comply with IPC-6012 Level 3 standards. IPC-6012 is a performance specification document that defines the default requirements and specifications for each class of PCB. Among them, Class 3 PCBs have tighter tolerances and are commonly used in military applications, medical devices, and the aerospace industry. The IPC-6012 Level 3 standard ensures that the PCB can also ensure the reliable start-up and operation of the equipment in harsh environments, such as high temperature, low temperature, vibration and other extreme conditions can still work.

        In addition to IPC-6012, IPC-610 Class 3 is critical for ensuring the highest quality workmanship in aerospace electronics as well. In the IPC-610 standard, class 3 defines the acceptance criteria for high-reliability electronics, including tight tolerances, high-quality soldering, and thorough inspections.

        Industry Standards for Aerospace PCB Manufacturing

        Aerospace PCB manufacturing must adhere to several industry-specific standards to ensure reliability and safety.

        • ISO9001

        It is an internationally recognized quality management system standards designed to help organizations continue to provide products or services that meet customer and applicable legal and regulatory requirements through a systematic approach. It is the code of conduct that governs our production process.

        • AS9100

        Another essential standard is AS9100, which is a widely recognized quality management system tailored specifically for the aerospace industry. It covers every aspect of the aerospace PCB production process, from material selection to assembly, testing, and delivery.

        • MIL-PRF-31032

        It is one of the most significant standards is MIL-PRF-31032, which governs the qualification of printed wiring boards used in military and aerospace applications.

        • RoHS

        PCBs for aerospace applications must also comply with RoHS (Restriction of Hazardous Substances) regulations, particularly in Europe, to ensure the environmental safety of electronic components. Additionally, aerospace PCBs undergo specific testing procedures, such as thermal cycling, vibration testing, and humidity resistance, to ensure they meet operational standards.

        Best Technology certificated by ISO9001, ISO13485, IATF16949, AS9001, RoHS and some other certifications about manufacture. We are dedicated to provide customers with “High mixed, low volume, fast delivery and high quality” PCB and PCBA products. At Best Technology, you get a sense of value for money!

        Common PCBA Modules or Systems for Aerospace Electronics

        Aerospace electronics rely on various specialized PCBA modules and systems to ensure efficient and reliable operation in mission-critical environments. These systems are essential in everything from flight control to communication, navigation, and power management in aircraft, satellites, and spacecraft. Below are some of the most common PCBA modules or systems used in aerospace electronics:

        Aerospace PCB Assembly Guide | PCBA & Box Building

        1. Avionics Control Systems

        Avionics control systems are the backbone of modern aerospace technology, responsible for managing and controlling various systems in aircraft and spacecraft. They handle critical functions such as navigation, communication, and onboard sensors, providing real-time data to pilots and flight computers.

        2. Power Management Systems

        Power management systems in aerospace electronics regulate the distribution and control of electrical power across the aircraft or spacecraft. These PCBA modules are designed to manage the onboard electrical grid.  In some subsystems, they provide a stable power supply, such as for communication equipment, control systems, and sensors.

        3. Flight Control Systems

        Flight control systems are responsible for managing an aircraft’s or spacecraft’s attitude, direction, and speed. The PCBA modules within these systems process data from various sensors (like gyroscopes and accelerometers) and use it to adjust control surfaces or thrusters.

        4. Radio Communication Systems

        It enables the communication between the aircraft and ground control. RF (Radio Frequency) modules, transceivers, and antenna control units are common PCBAs in communication systems. Aerospace communication systems are engineered to handle long-distance transmission and are resistant to environmental interference, such as radiation or electromagnetic noise.

        5. Navigation Systems

        Navigation systems in aerospace electronics guide aircraft and spacecraft to their destinations using data from GPS satellites, inertial navigation systems (INS), and other sources. The PCBAs in navigation systems are responsible for processing this data and providing accurate location, speed, and altitude information.

        6. Radar and Sensor Systems

        They are the most important parts in the aerospace applications, like collision avoidance, terrain mapping, and weather monitoring. They can process large amounts of data quickly and reliably, often using digital signal processors and field-programmable gate arrays (FPGAs) to handle real-time processing.

        7. Environmental Control Systems (ECS)

        Environmental control systems are responsible for maintaining optimal cabin and equipment conditions within an aircraft or spacecraft. These systems monitor and regulate air pressure, temperature, and humidity. The PCBAs used in ECS modules often featuring sensors that track environmental parameters and control systems that adjust them accordingly.

        8. Data Acquisition Systems

        Data acquisition systems collect and process data from various subsystems and sensors in aerospace applications. These PCBA modules are integral in spacecraft, aircraft, and satellites, enabling real-time data monitoring, analysis, and recording. Data acquisition PCBAs are designed to interface with different sensors, process data quickly, and transmit it to central control systems for further analysis. These systems must be reliable and capable of operating in high-altitude or space environments where temperatures and radiation levels can be extreme.

        9. Power Distribution Units (PDUs)

        Power Distribution Units (PDUs) manage the flow of electrical power to various subsystems within an aircraft or spacecraft. The PCBAs in PDUs ensure that power is efficiently distributed to essential systems, and they often include built-in protections against power surges, overloads, and short circuits.

        Best materials for Aerospace PCB Assembly

        Aerospace PCB mainly used high reliability and high temperature materials. Common material types are the following:

        1. High temperature substrate

        Because aerospace electronic equipment is often in a high temperature environment, it is necessary to use high temperature substrate, such as polyimide (PI) and polytetrafluoroethylene (PTFE).

        • Refractory materials

        The aerospace field has strict fire safety requirements, so it is necessary to use good flame

        retardant materials, such as polystyrene (PS) and Australian flame retardant epoxy resin.

        • Corrosion resistant materials

        There are some corrosive substances in the aerospace environment, so it is necessary to use materials with good corrosion resistance, such as special polyamides and special coatings.

        • High electrical performance materials

        In aerospace applications, circuit boards are required to have good electrical properties, including high impedance, low dielectric constant and low dissipation characteristics, so materials such as high frequency glass fiber cloth (FR4), polyimide (PI) and polytetraoxyethylene (PTFE) are often used.

        Aerospace PCB Assembly design standards

        Designing PCBs for aerospace applications requires adherence to strict design standards that ensure optimal performance under harsh conditions. These design standards focus on several critical factors:

        Signal Integrity

        Aerospace PCBs must be designed to minimize signal degradation, ensuring accurate data transmission. High-speed signal transmission lines must be optimized for impedance control and reduced electromagnetic interference (EMI).

        Thermal Management

        Effective heat dissipation is crucial to prevent overheating in aerospace PCBs. The design must incorporate features such as metal cores or heat sinks to manage thermal loads efficiently.

        Vibration and Shock Resistance

        Aerospace PCBs are subject to extreme vibration and shock during flight or launch. The design must include mechanical reinforcements and vibration-dampening measures to protect the integrity of components and solder joints.

        EMI Shielding

        Aerospace environments are susceptible to electromagnetic interference, which can disrupt signal integrity. Proper shielding techniques, such as ground planes and shielded traces, are essential to reduce EMI and ensure reliable signal performance.

        Component Placement

        Components must be strategically placed to ensure signal integrity, reduce noise, and improve overall PCB performance.

        Best Technology is a professional PCB & PCBA manufacturers in military, aerospace and medical, over 70% of our engineers have worked in PCB industry for more than 10 years. We have mature technology and advanced testing equipment to ensure the highest quality while maintain fast delivery. Trust us, we can be your most reliable PCB supplier in China and Vietnam.

        What is inverter PCB? Where is inverter p.c. board?
        Wednesday, October 23rd, 2024

        What is an inverter circuit board?

        An inverter circuit board is designed to manage the conversion process by controlling the flow of current, regulating voltage, and ensuring efficient energy transfer. It can control and regulate the conversion of direct current (DC) into alternating current (AC). In the application of renewable energy systems such as solar power generation and wind power generation, inverters play a crucial role. It efficiently converts the DC energy collected by solar panels or wind turbines into AC power supplies suitable for home and business use.

        An inverter PCB typically includes components such as power semiconductors (IGBTs or MOSFETs), microcontrollers, and various passive elements that enable the inverter to function correctly.

        What is inverter PCB? Where is inverter p.c. board?

        Types of Inverter PCB

        Inverter PCBs come from several types, mainly are single-sided PCB, double-sided PCB and multilayer PCB.

        Single-Sided PCB

        A single-sided PCB is the most basic type, with all the components and circuits mounted on one side. It is commonly used in low-cost inverters with relatively simple circuits. Due to the limited space and circuit paths, its performance and power handling capabilities are moderate. Therefore, it is suitable for small-scale inverter systems or low-power home appliances.

        Double-Sided PCB

        Double-sided PCBs feature components and copper circuitry on both sides of the board. Furthermore, plated through holes can be drilled on such board to improve the electricity. These PCBs are suitable for mid-range inverter designs that require a higher number of components and connections, as they provide better performance and power efficiency. In higher power applications like motor control systems and renewable energy inverters, double sided PCB are commonly used.

        Multilayer PCB

        Inverters designed for industrial applications or high-performance devices often require multilayer PCBs. These boards consist of three or more layers of circuitry sandwiched between layers of insulation. Multilayer PCBs can reduce electromagnetic interference (EMI) and improve signal integrity, they are excellent in complex inverter systems used in electric vehicles (EVs), large solar arrays, and industrial motor drives.

        What Benefits Does an Inverter PCB Offer?

        First of all, ‌ high reliability ‌ is an important advantage of inverter PCB. Through precise circuit design and high-quality assembly processes, inverter PCBs can significantly improve the stability and reliability of equipment. In addition, the modular design makes troubleshooting and maintenance more convenient.

        Secondly, ‌environmental protection ‌ is also an important feature of the inverter PCB. Conventional inverter PCBs may use halogen-containing chemical materials in the manufacturing process, which can pose potential threats to the environment and human health. The halogen-free inverter PCB adopts halogen-free substrate and lead-free welding technology, does not produce harmful environmental pollutants, and has less impact on the environment and human health.

        In addition, ‌ easy to upgrade and maintain ‌is another important advantage of inverter PCBs. When the inverter needs to be upgraded or repaired, it can be achieved by replacing or repairing specific PCB modules, without large-scale changes to the entire system, which greatly reduces the complexity and cost of upgrading and maintenance.

        Finally, ‌ highly integrated ‌ is also a significant advantage of inverter PCBs. Through a highly integrated design, the size and weight of the inverter are reduced for easy installation and maintenance.

        What is an Inverter Circuit Diagram?

        An inverter circuit diagram is a schematic representation that illustrates how the components on the PCB are interconnected to convert DC power into AC power. It provides a detailed view of the flow of current and the role each component plays within the inverter system.

        What is inverter PCB? Where is inverter p.c. board?

        The diagram typically includes:

        • Power Input: Showing where the DC power is supplied, often from batteries, solar panels, or other DC sources.
        • Switching Devices: Components like Insulated Gate Bipolar Transistors (IGBTs) or Metal-Oxide-Semiconductor Field-Effect Transistors (MOSFETs), which are used to alternate the direction of current, producing AC power.
        • Control Circuit: A microcontroller or other control logic that regulates the switching timing and frequency to generate a stable AC output.
        • Filters: Inductors and capacitors used to smooth out the AC waveform and minimize harmonic distortion.
        • Protection Circuits: Components that safeguard against overcurrent, overvoltage, and short circuits, ensuring safe operation of the inverter.

        Applications of Inverter PCBs

        Inverter PCBs are found in various applications, including renewable energy systems like solar inverters, uninterruptible power supplies (UPS), electric vehicle systems, motor drive systems, and home appliances like air conditioners, refrigerators, and washing machines. Below are the typical applications of inverter PCBs:

        Solar Inverters

        In solar power systems, inverter PCBs are critical for converting the DC electricity generated by solar panels into usable AC electricity for homes and businesses. Solar inverters also use MPPT (Maximum Power Point Tracking) algorithms to optimize energy harvesting.

        Uninterruptible Power Supplies (UPS)

        In UPS systems, inverter PCBs ensure the reliable conversion of DC battery power into AC electricity during power outages. These systems are vital in data centers, hospitals, and other environments where uninterrupted power is essential.

        Electric Vehicles (EVs)

        EVs rely on inverter PCBs to convert the DC power stored in the battery into AC power to drive the motor. The performance and efficiency of the inverter PCB directly affect the vehicle’s range and driving experience.

        Industrial Motor Drives

        Many industrial applications use AC motors for machinery and equipment. Inverter PCBs regulate the speed and torque of these motors by converting DC power into controlled AC output, they are important for automation, robotics, and manufacturing processes.

        Home Appliances

        Many modern home appliances, such as air conditioners, refrigerators, and washing machines, use inverter technology for energy efficiency. Inverter PCBs in these devices help control motor speed and reduce energy consumption, contributing to more eco-friendly and cost-effective home systems.

        What Causes an Inverter Board to Fail?

        There are many factors that can cause inverter board to fail, and some of them we can recognize by visual, but sometimes we cannot. Here we listing some potential factors that make inverter PCB be damaged or fail.

        • Overheating

        Excessive heat is a common cause of inverter PCB failure, particularly in high-power applications. Poor thermal management or inadequate cooling can cause components to overheat and degrade over time. For such conditions, aluminum PCBs has good thermal conductivity, this can help to heat dissipation and transfer heat out efficiently, but if the cooling system is not properly designed, even these boards can fail.

        • Poor insulation

        This may be due to poor installation, improper location selection and poor quality of equipment of PCB board. We can check whether the DC connector has short-circuit supports or burns due to water immersion, and whether the edges of the component become blackened.

        • Low bus voltage

        If this problem occurs in the morning and evening, then it is normal as the inverter tries to limit the generation conditions. If it occurs during normal daytime hours, it can be detected by above method.

        What is inverter PCB? Where is inverter p.c. board?
        • Abnormal current leakage

        These problems are often caused by poor installation quality, improper location selection and poor equipment quality. We can locate the fault area and make it insulated. If the failure is caused by the material, then replace the incorrect one.

        • No response

        Ensure that the DC input is correctly connected and the inverter has built-in reverse short circuit protection. After the connection is restored, the inverter can start. If the inverter still does not work, it may be the fault of the inverter oscillation circuit or inverter itself has a problem. Try to troubleshooting and repair with new one.

        Considerations When Choosing the Right Inverter PCB

        Several factors should be considered when choose an inverter PCB for your device. Let’s talk about them.

        1. Power Rating

          Select a PCB that can handle the power levels required by the application. Overloading a PCB beyond its rated capacity can lead to overheating, component failure, or even dangerous situations like fire.

          2. Thermal Management

          In applications where heat generation is a concern, selecting a PCB with good heat dissipation is vital. Aluminum PCB or high-quality multilayer PCBs can help dissipate heat effectively. Consider heat sinks, design thermal vias, and adequate ventilation in your design to improve thermal performance.

          3. Component Quality

          From above, we know high quality components used in the PCB is important as well. High-quality capacitors, transistors, and diodes ensure reliable operation, even in harsh conditions. Always choose components rated for the expected load and environment, or get touch with Best Technology to enjoy a one-stop service from components sourcing and PCB assembly.

          4. Environmental Resistance

          If the inverter will be used in outdoor or industrial environments, choose a PCB with protective coatings, such as conformal coatings, to shield against moisture, dust, and corrosive elements. Solar power systems or outdoor motor control applications must take it in mind.

          5. PCB Layout and Size

          The physical size and layout of the PCB should align with the space available in the inverter system. A well-organized PCB layout helps reduce electromagnetic interference (EMI) and improves overall efficiency.

          Above are all the information about inverter PCB that we can shared. If you have a question concerning the topics, please contact us.

          Wi-Fi Module PCBA Design | Box Build Assembly Manufacturer
          Tuesday, October 22nd, 2024

          Wireless technology has transformed the way devices communicate. At the heart of this transformation are Wi-Fi modules. These small components power a wide range of applications, from home automation to industrial systems. In this blog, we’ll explore the functions of Wi-Fi modules, their uses, design considerations in PCB assembly and their differences from Bluetooth.

          What is a Wi-Fi Module?

          The Wi-Fi module, also known as the wireless module, belongs to the transmission layer of the Internet of Things (loT). It integrates a processor, memory, transceiver, and sometimes an antenna. A Wi-Fi module is to convert the serial port or TTL level into an embedded module that meets the Wi-Fi wireless network communication standards, with built-in wireless network protocol IEEE802.11b.g.n protocol stack and TCP/IP protocol stack.

          Wi-Fi Module PCBA Design | Box Build Assembly Manufacturer

          The module handles the task of connecting a device to a wireless router, allowing it to send and receive data over the internet. If embedded a Wi-Fi module in traditional hardware devices, then we can directly use Wi-Fi to connect to the Internet. It can be said, it is an important part of wireless smart home, M2M and other IoT applications.

          Types of Wi-Fi Module

          According to the different functions, Wi-Fi modules can be divided into three categories:

          1. General Wi-Fi modules

            Such as USB or SDIO interface modules on our mobile phones, laptops and tablets. Wi-Fi protocol stack and driver are run in Android, Windows and IOS systems, which require a very powerful CPU to complete the application.

            2. Router Wi-Fi module

            The most typical one is our home router, its protocol and driver has powerful Flash and Ram resources chip plus Linux operating system.

            3. Embedded Wi-Fi module

            Such as 32-bit MCU, built-in Wi-Fi driver and protocol, interface for the general MCU interface such as UART. Suitable for all kinds of smart home or smart hardware items.

            What is the Difference Between Wi-Fi and Bluetooth Modules?

            While both Wi-Fi and Bluetooth modules enable wireless communication, their usage and performance differ significantly:

            ​1. Frequency

            The frequency of Wi-Fi has 2.4G and 5G bands. Wi-Fi 2.4G band has 13 channels, 2401~2423MHz. Wi-Fi 5G frequency band is divided into 5.2G band and 5.8G band, and the 5.8G frequency band is: 149, 153, 157, 161, 165; The 5.2G band must support 11ac, and the available channels are 36, 40, 44, 48, 52, 56, 60, and 64. Under normal circumstances, it is recommended to avoid 52, 56, 60, 64 channels, because they conflict with radar channels;

            Bluetooth only has 2.4G band: 2.402GHz ~ 2480GHz, a typical Bluetooth has 76 channels, each channel is 1MHz. And bluetooth BLE has 40 channels, each channel 2MHz, of which 37 channels belong to the data channel, 3 channels belong to the broadcast channel;

            Wi-Fi Module PCBA Design | Box Build Assembly Manufacturer

            2. Application

            Wi-Fi can directly access the network, and Bluetooth needs conversion processing. Therefore, WiFi is more suitable for 1-to-many local area networking, such as home and company Internet access environment. Compared with Wi-Fi module, bluetooth is more suitable for short-range and high-stability transmission, such as smart headphones. Additionally, bluetooth mesh networking is especially suitable for smart home wireless control and other applications.

            3. Transmission Distance

            The transmission distance of Wi-Fi is further than that of Bluetooth, which can reach several hundred meters, while the transmission distance of Bluetooth is generally within 100 meters;

            4. Transmission Rate

            Wi-Fi: 54Mbps; Bluetooth: 2Mbps;

            Wi-Fi is more suitable for big data transmission.

            5. Speed

            Wi-Fi is generally faster than Bluetooth. It can handle large file transfers or streaming content without any issues. Bluetooth is slower but works well for smaller data transfers like audio streaming or simple file sharing.

            What is the Range of a Wi-Fi Module?

            ‌The coverage range of the WiFi module usually depends on the specific application scenario and environmental conditions. According to the IEEE 802.11 standard, the maximum distance that wireless devices can cover is usually 300 meters, but this depends on the environment is open or not.

            In the specific environment, the coverage of the WiFi module will be affected by a variety of factors. For example, in an ideal environment of accessibility and interference, the wireless transmission distance of a wireless router is 100 meters indoors and 300 meters at outdoors. In the actual home environment, the wireless signal will be attenuated when passing through obstacles such as walls, glass, doors, and furniture, affecting the transmission distance. If an external antenna is used, the transmission distance can reach 30 ~ 50 km or even more, depending on the gain of the antenna itself.

            Advantages of Wi-Fi Module

            1. Wide coverage

            WiFi module supports ‌IEEE 802.11b/g/n and other standards to provide a wide range of wireless coverage, suitable for a variety of indoor and outdoor environments.

            2. High-speed transmission

            WiFi module supports a high data transmission rate, which can meet the requirements of high-speed data transmission, and is suitable for application scenarios with a large amount of data.

            3. Compatibility and ecosystem

            WiFi module supports a variety of communication protocols, such as ‌Wi-Fi, ‌Bluetooth, etc., has good compatibility and ecosystem, and can be integrated with a variety of devices and services.

            4. Easy to install and use

            WiFi modules are usually plug and play, easy to install and use, suitable for a variety of devices and system integration.

            Wi-Fi Module PCBA Design | Box Build Assembly Manufacturer

            Disadvantages of a Wi-Fi Module

            1. Power consumption

            One downside of Wi-Fi modules is their higher power usage compared to other wireless technologies, such as Bluetooth. This can be a concern for devices running on battery power.

            2. Interference

            Wi-Fi operates on the same frequencies as other devices, such as microwaves and cordless phones.

            3. Security

            Since Wi-Fi networks are widespread, they can be vulnerable to hacking. Proper security measures, such as encryption, must be implemented to protect data.

            What is a Wi-Fi Module Used For?

            Wi-Fi modules have a wide range of applications across industries. Actually, it exist everywhere need networks. It can be said, it can be used in every fields. Here are some typical applications:

            • Smart Homes

            Wi-Fi modules power smart devices like security cameras, thermostats, and lighting systems. They connect to a home Wi-Fi network, so users to control them remotely through apps.

            • Industrial Equipment

            In manufacturing or logistics, Wi-Fi modules enable machines to communicate wirelessly.

            • Consumer Electronics

            Devices like laptops, gaming consoles, and smart TVs rely on Wi-Fi modules for wireless internet access.

            • Healthcare Devices

            Medical equipment, such as patient monitors or wearable devices, often use Wi-Fi modules to transmit data to a healthcare provider in real time.

            • IoT Devices

            The IoT relies heavily on Wi-Fi modules. Devices ranging from smart refrigerators to connected doorbells use Wi-Fi to communicate with each other and with cloud-based systems.

            Wi-Fi Module Price

            Wi-Fi modules are available at various price points, depending on their features and intended use. For instance, the ESP8266 typically costs between $2 to $5. The ESP32, with its additional capabilities, is priced slightly higher, ranging from $5 to $10. High-end industrial Wi-Fi modules can be more expensive, ranging from $20 to $50.

            The price may also vary depending on factors like antenna design, supported protocols, and whether the module is designed for mass production or individual projects.

            What is the Most Common Wi-Fi Module?

            The ESP8266 is one of the most popular and widely used Wi-Fi modules. It is favored in many IoT applications due to its low cost, ease of use, and compact size. Another frequently used module is the ESP32, which offers additional features such as dual-core processing, built-in Bluetooth. In addition to them, there are some other common Wi-Fi module that used in the electronics.

            Wi-Fi ModuleDescriptionFrequency BrandRangePriceSpecial Features
            ESP8266Popular for IoT applications due to low cost and ease of use.2.4 GHzUp to 150 feet$2 – $5Compact size, low power, integrated TCP/IP protocol stack.
            ESP32Offers better performance with dual-core and built-in Bluetooth.2.4 GHz, BluetoothUp to 300 feet$5 – $10Dual-core processing, Bluetooth, multiple I/O options.
            CC3200A Texas Instruments Wi-Fi module designed for IoT and smart products.  2.4 GHzUp to 200 feet$8 – $15Built-in ARM Cortex-M4 processor, low power, encryption features.
            RN171A high-performance Wi-Fi module from Microchip.2.4 GHzUp to 330 feet  $20 – $30Embedded TCP/IP stack, simple serial interface.
            ATWINC1500  A low-power module designed for IoT and wearable devices.2.4 GHzUp to 200 feet$7 – $15Ultra-low power, integrated network stack, supports power-saving modes.
            WizFi210  A stable Wi-Fi module designed for industrial applications.2.4 GHzUp to 300 feet$10 – $25Low power, fast boot-up, secure connection.
            Roving Networks RN131Suitable for long-range industrial and commercial applications.  2.4 GHzUp to 400 feet$25 – $40High-performance, robust design, supports SSL encryption.

            Considerations in PCBA Design with a Wi-Fi Module

            When integrating a Wi-Fi module into PCBA design, several factors need to be considered to ensure optimal performance:

            • Antenna Design and Placement

            A key factor in wireless performance is the placement of the antenna. Ensuring there are no obstructions near the antenna can significantly improve signal strength. The module should be positioned to minimize interference from nearby components.

            • Power Supply

            Wi-Fi modules require a stable and sufficient power supply to function effectively. Voltage fluctuations or insufficient power can result in poor connectivity or even module failure.

            • Thermal Management

            Wi-Fi modules can generate heat, especially during heavy use. Proper heat dissipation methods, such as using heat sinks or thermal vias, should be incorporated into the PCBA design to maintain optimal performance.

            • EMI and EMC Compliance

            Wireless communication devices must adhere to electromagnetic interference (EMI) and electromagnetic compatibility (EMC) standards. Proper shielding and circuit design can help reduce interference and improve reliability.

            • Firmware Integration

            Many Wi-Fi modules come with firmware that handles wireless communication tasks.

            One-Stop Box-Build Assembly for Wireless Communication Devices

            For companies looking to develop wireless communication devices, Best Technology is your go-to choice. We offer one-stop PCBA and box-build service that can handle everything from component sourcing and PCBA design to final product assembly. By partnering with us, you can reduce much development time, and get a high quality, fast delivery, low cost PCBA with Wi-Fi modules.

            With over 18 years of experience in printed circuit boards and as one of the leading PCB manufacturers, we support over 2,000 customers in different industrial areas worldwide. You can count on a PCB board manufacturer like us to meet your one-stop electronics manufacturing demands. We have an experienced engineer, production and quality team to fully understand the unique requirements of your industry, such as the particular acceptance criteria in medical, automotive, communication and aerospace industries. Contact us right now to get your PCB quotation!

            Application Analysis of Ceramic Heat Sinks
            Monday, October 21st, 2024

            In the realm of modern electronics, effective thermal management has become a critical factor in ensuring the performance and longevity of devices. As power density in electronic components continues to increase, the need for efficient heat dissipation mechanisms has never been more pronounced. Among the various solutions available, ceramic heat sinks have emerged as a viable and effective option due to their unique properties. This article provides a comprehensive analysis of the applications, advantages, challenges, and future trends of ceramic heat sinks.

            Application Analysis of Ceramic Heat Sinks

            Understanding Ceramic Heat Sinks

            Ceramic heat sinks are thermal management devices designed to absorb and dissipate heat generated by electronic components. They are primarily made from materials such as aluminum oxide (Al2O3), silicon carbide (SiC), and other advanced ceramics. These materials exhibit excellent thermal conductivity and stability at high temperatures, making them suitable for various electronic applications.

            Applications of Ceramic Heat Sinks

            1. Power Electronics

            Ceramic heat sinks are widely used in power electronics, such as inverters and converters. These devices generate significant amounts of heat during operation, and ceramic heat sinks play a crucial role in dissipating this heat to maintain optimal performance and reliability. Their ability to withstand high temperatures makes them ideal for high-power applications, including electric vehicles and renewable energy systems.

            2. LED Technology

            The use of LED lighting has surged in recent years, and efficient thermal management is essential to maintain brightness and extend the lifespan of LED components. Ceramic heat sinks are increasingly employed in LED applications due to their high thermal conductivity and ability to manage heat effectively. By dissipating heat efficiently, ceramic heat sinks help maintain stable light output and prolong the operational life of LED lighting systems.

            3. Telecommunications

            In telecommunications, devices such as base stations and routers often operate under heavy loads, generating substantial heat. Ceramic heat sinks are commonly used in these applications to manage thermal loads effectively, ensuring that devices operate within specified temperature ranges. This thermal management is critical for maintaining signal integrity and overall system performance.

            4. Aerospace and Defense

            The aerospace and defense industries require components that can perform reliably under extreme conditions. Ceramic heat sinks are utilized in various applications, including avionics and satellite systems, where high temperatures and harsh environments are common. Their lightweight and high-temperature resistance make them suitable for applications in aircraft electronics and military equipment, ensuring reliability and safety.

            5. Medical Devices

            Medical equipment, particularly imaging systems and laser devices, require effective thermal management to ensure safe and reliable operation. Ceramic heat sinks are employed in these applications to dissipate heat generated during operation, preventing overheating and ensuring consistent performance. By maintaining optimal temperatures, ceramic heat sinks contribute to the safety and effectiveness of medical devices.

            Advantages of Ceramic Heat Sinks

            1. Excellent Thermal Conductivity

            Ceramic materials such as aluminum oxide and silicon carbide exhibit high thermal conductivity, allowing ceramic heat sinks to absorb and dissipate heat efficiently. This property is crucial for maintaining optimal operating temperatures in electronic components.

            2. High-Temperature Resistance

            Ceramics can withstand high temperatures without degrading, making them suitable for high-power and high-frequency applications. This capability ensures that ceramic heat sinks can operate effectively even in extreme conditions.

            3. Electrical Insulation

            Ceramic heat sinks provide excellent electrical insulation, preventing unwanted current flow between electronic components. This characteristic is essential for applications where electrical isolation is critical to avoid short circuits and enhance safety.

            4. Lightweight and Compact Design

            Ceramic materials can be engineered to be lightweight, which is beneficial in applications where weight is a concern, such as aerospace and portable electronics. Their compact design also allows for flexible integration into various systems, accommodating space constraints.

            5. Corrosion Resistance

            Ceramic materials are inherently resistant to corrosion and chemical damage, making them suitable for harsh environments. This property ensures longevity and reliability in applications exposed to corrosive substances.

            Challenges of Ceramic Heat Sinks

            Despite their advantages, the implementation of ceramic heat sinks comes with challenges.

            1. Brittleness

            One of the primary challenges of ceramic materials is their brittleness. While they offer excellent thermal performance, they can be susceptible to cracking or breaking under mechanical stress. This brittleness necessitates careful handling during manufacturing and installation.

            2. Manufacturing Complexity

            The production of ceramic heat sinks can be more complex than that of traditional metal heat sinks. The processes involved, such as sintering and shaping, may require specialized equipment and techniques, increasing manufacturing costs.

            3. Cost Considerations

            Ceramic materials can be more expensive than metals like aluminum or copper. The higher initial costs may deter some manufacturers, especially in cost-sensitive applications. This financial consideration can limit the broader adoption of ceramic heat sinks in certain markets.

            4. Thermal Interface Materials (TIM)

            The performance of ceramic heat sinks heavily relies on the quality of thermal interface materials (TIMs) used between the heat sink and electronic components. Selecting the right TIM is crucial for optimizing thermal conductivity, but it can also add to the overall cost and complexity of the assembly process.

            Future Trends in Ceramic Heat Sink Technology

            The future of ceramic heat sinks looks promising, driven by ongoing research and technological advancements. Several trends are shaping their development.

            1. Advanced Material Development

            Research into new ceramic materials with enhanced thermal and mechanical properties is ongoing. Innovations in material science could lead to the development of ceramics that combine high thermal conductivity with improved strength and ductility, addressing some of the current limitations.

            2. Integration with Active Cooling Solutions

            While ceramic heat sinks are predominantly passive cooling solutions, integrating them with active cooling systems—such as fans or liquid cooling—could enhance thermal management capabilities. This hybrid approach may provide greater efficiency in high-performance applications where heat generation is significant.

            3. Sustainability and Eco-Friendly Practices

            As environmental concerns grow, the development of eco-friendly materials and sustainable manufacturing practices for ceramic heat sinks is becoming increasingly important. This trend will likely influence future designs and production processes.

            4. Miniaturization

            The continued trend toward miniaturization in electronics demands compact and efficient thermal management solutions. Ceramic heat sinks can be designed to fit into smaller spaces while maintaining effective heat dissipation, meeting the needs of next-generation portable devices.

            Conclusion

            Ceramic heat sinks play a vital role in the thermal management of modern electronic devices. Their unique properties—such as high thermal conductivity, temperature resistance, and electrical insulation—make them ideal for a wide range of applications, from power electronics to medical devices. While challenges such as brittleness and manufacturing complexity exist, ongoing advancements in materials and techniques are likely to enhance their performance and applicability.

            As the demand for high-performance electronics continues to grow, the importance of ceramic heat sinks in effective thermal management will only increase. By leveraging innovative designs and materials, manufacturers can ensure that ceramic heat sinks meet the thermal management challenges of tomorrow, contributing to the reliability and efficiency of modern technology.

            Meet Best Technology at Electronica Munich 2024
            Saturday, October 19th, 2024

            Exciting News! Best Technology, a leading PCB assembly manufacturer from China, will be exhibiting at Electronica Munich 2024 in Germany. Join us at Booth No. 212 (Hall C6) from November 12 – 15, 2024 (Western Time). If you missed us at PCB West or AEMS, this is your chance!

            At our booth, you’ll have the opportunity to explore our advanced PCB manufacturing and assembly technologies. For reference, here is a booth location detail.

            Meet Best Technology at Electronica Munich 2024

            Actually, we have participated such exhibitions for several times, like PCB west, electronica in China, AEMS and so on. Here are some pictures:

            In the exhibition, our team of experts will be available to share in-depth knowledge about PCB assembly, from prototyping to low and high-volume production. We invite all interested professionals/engineers to visit and discover our capabilities in flexible circuit boards, rigid-flex circuits (2 to 50 layers), copper weights from 1/2 OZ to 30 OZ, and ultra-thin PCBs (0.15mm FR4) to heavy copper options. Best Technology offers a full turn-key service including component sourcing, board fabrication (FPC, PCB, MCPCB, Ceramic PCB), final assembly, programming, testing, and more.

            Additionally, we’ll showcase our metal dome products, widely used as tactile switches in conjunction with PCBs, flex circuits, or membrane keypads. Available in four varieties—four-leg domes (5mm-20mm), triangle domes (4mm-12mm), round domes (4mm-16mm), and oblong domes (3.7mm-58.1mm)—our metal domes come with or without adhesive (dome arrays).

            Meet Best Technology at Electronica Munich 2024

            We welcome you to explore how we manage component wastage and boost efficiency, helping you save time, money, and resources.

            About Electronica Munich

            Electronica is the world’s premier trade show for electronic components, systems, and applications, showcasing cutting-edge innovations and developments across industries. It’s the perfect place to learn about the latest trends in PCB manufacturing, power engineering, system peripherals, and EMS.

            Openning Hours of Electronica Munich 2024

            Openning Hours of Electronica Munich 2024

            Please keep in mind that your visitor ticket does not allow you to reenter the fair and will not open the turnstiles a second time if you leave the fair!

            For the visit/travel information about transportation, welcome to click electronica 2024 website or click here.

            Don’t miss out! We look forward to seeing you at Booth 212 from November 12 to November 15, 2024 (Western Time).