Archive for the ‘best pcb’ Category

PCB Footprint Standards and How to Make Footprint PCB?

Tuesday, August 19th, 2025

A footprint PCB is especially significant in component placement accuracy, soldering reliability, electrical performance, thermal management, and inspection and testing. This blog explains the meaning, standards, design guidelines, creation process, and precision methods of footprint PCBs to help engineers achieve accurate, reliable, and manufacturable circuit board layouts.

Do you have these problems on PCB prototype or mass production projects?

Manufacturing and assembly problems due to the non-standardized design?
Lacking the knowledge about the standardized design rules?
Absence of understanding of the component footprints?
Deficiency applies to the PCB footprint library?

Below are the workable solutions provided by Best Technology.

Fully follow and apply the standardized design norms to improve the PCB yield.
Employ a PCB footprint library to improve the design efficiency and reduce the rate of design mistakes.
Boost the design verification and inspection to improve the design quality and reduce the design failure.

Best Technology is a major PCB and SMT assembly factory, fully compatible with ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, REACH, and RoHS standards. Most of our engineers have worked in Best Technology for over 10 years, gaining a sufficient understanding of what PCB footprints are, the relevant standards, design rules, creation steps, and accuracy techniques. If you have further questions, pls contact us directly at +86-755-2909-1601 or sales@bestpcbs.com.

PCB Footprint Standards and How to Make Footprint PCB?

What is footprint PCB meaning?

Put simply, a footprint PCB is a visual map on the board that indicates exactly where each component will sit. It clearly marks the positions, including pads, holds, and outlines of the components. The problems of misalignment or the soldering issues will occur even if it is just minor inaccuracies. Therefore, Best Technology provides the prototyping, which undergoes strict checking and validation service, that will benefit from smooth manufacturing and cost efficiency.

What are footprint dimensions meaning?

Footprint dimensions define the size and spacing of the pads, pins, and holds. This includes the length, width, pad diameter, and the spacing of the pins. The correct size can prevent solder bridging, improve the mechanical stability, and provide automation assembly convenience. For example, if the capacitor’s pad size is wrong, that will cause movement during the soldering and will lead to failures later. Best Technology will double-check the size according to the data sheet, to ensure the correctness the first time.

What are the PCB footprint standards?

Standards guide how to lay out the footprints. For example, IPC-7351 makes a guideline of the pad size and the tolerance; however, JEDEC provides the semiconductor footprints guidelines. If we are fully compatible with standards, the smooth assembly and quality checking can be assured. However, if we ignore the standards, the time and the money may be wasted. Best Technology follows standards to do PCB footprint efficiently, avoiding rework and delay.

What are some PCB footprint generator tools?

There are various tools that help engineers to generate and verify PCB footprints. Popular options include KiCad, Altium Designer, Eagle, and EasyEDA. These tools feature prebuilt libraries, customization, and compliance checks. Using the tools correctly can reduce human error and expedite the design process. Best Technology provides guidance about the library management and PCB footprint verification, which makes the workflow more reliable.

What does a Footprint PCB design do?

A footprint PCB design ensures every component is assembled to the circuit board, compatible with the electrical connection, mechanical match, and manufacturability. Making the PCB footprint precisely can reduce the soldering problem and the assembly failure. We can take it as the bridge between the schematic and the actual circuit boards. Best Technology double checks about every PCB footprint and the circuit board layout, aiming to get the smooth integration and reduce the rework.

PCB footprint design guidelines

Following design guidelines improves both reliability and manufacturability. The key recommendation includes:

First, fully compatible with IPC-7351 or JEDEC standards.

Then, make use of the data sheet to verify pad size and spacing.

Next, ensure the solder mask clearance to prevent bridging.

And keep the consistency between the component direction and the pin number.

Finally, make a record of the footprint information for reference in the near future.

Best technology provides the DFM analysis, customization checking, and technical consultation, which makes your order proceed more effectively, avoiding the common mistakes and ensuring the direct manufacture of the boards.

How to make a pcb footprint creation?

Here is how to make a PCB footprint creation for your review.

First, make a confirmation about the component types and refer to the data sheet.

Next, confirm the pad size, pin spacing, and outline dimensions.

Then, employ the footprint generator or PCB software to draw the footprint.

And double-check all the dimensions according to the standards and data sheet.

Finally, checking the component placement to ensure precision.

There are common to get troubles for the engineers, which lead to the board waste and the manufacturing delay. Best Technology is a leading PCB manufacturer in China, providing professional guidance, design optimization, and verification services to save time and prevent mistakes.

How to ensure the high precision pcb footprint sizes?

It is helpful to know that the high-precision PCB footprint prevents assembly problems effectively. Here are the practical ways, for reference.

Carefully checking the tolerance in the datasheet.

Apply the verified library or template.

Keep consistency of the unit, such as mm, mil.

Final review it before publishing the design.

Best Technology provides rigorous verification and the existing template, reducing human errors, expediting manufacturing, and finally ensuring high-quality PCBs.

Case about Footprint PCB in Best Technology

There are some of our customers who require a high-precision PCB footprint for prototype and small batch manufacturing. Best Technology helps customers to make a high-precision footprint and perform a DFM analysis to ensure full compatibility with the industry standards. Here are some photos for your review.

In a nutshell, footprint PCB is especially critical to the precise, efficient, and reliable manufacturing. Getting some knowledge about the dimensions, standards, and design guidance can prevent costly mistakes and improve manufacturing efficiency. Using the tools and the verification methods correctly ensures high-quality results.

Best Technology has been in the PCB industry for over 19 years, providing support and service throughout every stage for customers, from footprint PCB creation to verification, DFM analysis, prototype, mass production, and SMT assembly. We grasp the key pain points and have the specific solutions to tackle them, such as component misalignment or non-compliant pads. If you have any PCB or PCBA inquiry, pls don’t hesitate to find us for help via sales@bestpcbs.com. We are fully committed to giving our engagement and expediting the market entry time of your products.

Tags:footprint pcb
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What is Copper Busbar? PCB Copper Busbar Manufacturers

Tuesday, August 19th, 2025

Are you worried about these issues?

Is copper busbar overheating in high-current applications, causing efficiency drops or even system shutdowns?
Is corrosion or oxidation in humid or harsh environments leading to frequent maintenance?
Do you need flexible copper busbar customization to fit different battery modules or inverter layouts?

Best Technology provides tailored copper busbar solutions that balance cost, performance, and flexibility. We offer:

Competitive pricing directly from manufacturer
Customized sizes, coatings, and shapes
High durability = long-term cost savings
No minimum order quantity requirements, I pcs prototype order is available

If you are comparing copper busbar manufacturers or exploring advanced copper busbar PCB designs, Best Technology can help. With certifications including ISO9001, ISO13485, IATF16949, and AS9100D, we maintain strict quality control from raw material to finished product. Our MES system keeps every component traceable, while competitive copper busbar price and flexible engineering support bring added value.

Whether you need standard copper busbar, custom busbar copper shapes, or integrated PCB busbar solutions, Best Technology offers expertise and reliability in every project. If you are interested in copper busbar or copper busbar pcb, welcome to contact us at sales@bestpcbs.com.

What is Copper Busbar?

A copper busbar is a flat strip, rod, or bar of copper designed to conduct electricity. Unlike flexible wires, it’s rigid, strong, and tailored to carry heavy current loads. You’ll often find it inside switchgear cabinets, power distribution panels, and large battery packs.

Why copper? Because copper has excellent conductivity and thermal performance. It carries more current per square millimeter than most other metals while staying stable over long service periods. For engineers, this means reduced energy losses and fewer overheating issues.

In short, copper busbar is the highway for electricity inside modern systems.

What is Copper Busbar?

Why is it Called a Busbar?

The word “bus” in electrical engineering describes something that collects and distributes. Just as a city bus gathers passengers and delivers them to different stops, a busbar gathers current from various circuits and spreads it across the system.

The “bar” part is literal—it’s a bar of conductive material. Together, the term “busbar” reflects its function and shape. Over decades, this word became standard, and now it’s used across industries worldwide.

How to Make a Copper Busbar?

The process of making busbar copper combines precision with material science. Here’s how manufacturers typically approach it:

1. Copper Selection – Most copper busbar manufacturers choose high-conductivity grades such as ETP (Electrolytic Tough Pitch) or OFHC (Oxygen-Free High Conductivity). These ensure stable performance.

2. Cutting and Shaping – Large copper sheets are cut into required sizes. CNC punches and hydraulic presses shape the bar with consistent accuracy.

3. Drilling and Punching – Holes and slots are added for bolted connections. This step requires exact tolerances so that joints stay secure.

4. Bending – Depending on installation needs, busbars are bent into L, U, or Z shapes without compromising mechanical strength.

5. Surface Finishing – To prevent oxidation, surfaces may be tin-plated, silver-plated, or coated with nickel. This not only protects but also improves contact reliability.

6. Insulation (Optional) – In compact systems, epoxy coatings or heat-shrink sleeves are added to prevent accidental shorts.

Every step is controlled to deliver high current capacity while keeping mechanical stability intact.

How to Clean Copper Busbar?

Over time, copper busbar surfaces can tarnish. A thin oxide layer forms, which slightly increases resistance. Cleaning restores performance. Here are some practical methods:

Mechanical cleaning – Sandpaper, wire brushes, or abrasive pads can remove the oxidation layer.
Chemical cleaning – Mild acidic solutions like vinegar mixed with salt, or commercial copper cleaners, dissolve corrosion without damaging the base metal.
Protective treatment – After cleaning, applying a thin coat of petroleum jelly or anti-oxidation grease helps slow down further tarnish.

Routine cleaning is important in high-current systems, as even small resistance increases can generate heat under load.

How to Calculate Copper Busbar Size?

Choosing the right copper busbar size means balancing current capacity with safety. Engineers often use a current density rule to determine cross-sectional area.

The common design range is 1.2 to 1.6 A per square millimeter of copper in open air.

Formula:

For example, a busbar that needs to carry 800A at 1.5 A/mm² should have at least:

If designed as 40 mm wide and 14 mm thick, this cross-section provides adequate capacity. Designers then check thermal rise and cooling conditions to finalize the dimension.

Copper Busbar vs Copper Busbar PCB

Although both serve as conductors, there are differences between traditional copper busbar and copper busbar PCB:

Copper Busbar – A standalone strip or bar. Common in switchgear, transformers, and large distribution panels.
Copper Busbar PCB – A printed circuit board reinforced with very thick copper layers or embedded copper strips. Used in compact high-power electronics such as EV inverters.

The advantage of copper busbar PCB is space efficiency. Instead of bulky bars and cables, the PCB integrates power and signal layers together, simplifying assembly.

Busbar Copper PCB

Why Choose Copper Busbar PCB?

Copper busbar PCB, sometimes called embedded busbar PCB or busbar-integrated PCB, is a smart evolution of traditional busbars. In some industries, it is also referred to as reinforced thick copper PCB, since the board integrates additional copper bars or strips inside or on the surface to handle heavy current.

The reason many designers choose copper busbar PCB over standalone busbars lies in its unique advantages:

Compact design – Instead of bulky copper bars and multiple cables, busbar copper is embedded in the PCB, reducing space requirements.
Improved thermal balance – Heat spreads evenly across the board, preventing local hotspots in high-power circuits.
Simplified assembly – Fewer mechanical joints mean lower installation time and reduced risk of loose connections.
Cost efficiency – By combining signal and power layers in one PCB, manufacturers save both material and labor cost.
Reliability – With laminated structure and less mechanical stress, copper busbar PCB performs well even in vibration-heavy environments such as automotive or industrial drives.

Copper Busbar Size and Current Rating Table

Here’s a general table showing copper busbar size with approximate current ratings (open air, 35°C rise). Values vary depending on installation and cooling.

Thickness (mm)	Width (mm)	Max Current (A)	Typical Applications
1	10	50	Small electronics
2	20	150	Industrial control
3	25	250	Switchboards
5	50	500	EV battery modules
10	100	1200	Power distribution systems

These values are approximate. Always confirm with copper busbar manufacturers for precise specifications based on your operating environment.

How Much Does a Copper Busbar of Length 40 cm Carry?

The capacity depends mainly on cross-section, not just length.

A 20 × 5 mm busbar of 40 cm can carry about 160–200A.
A 40 × 10 mm busbar of the same length can handle up to 700A.

Length matters for voltage drop, but current capacity is almost entirely governed by cross-section and cooling.

Why Copper Busbar is Suitable for Electric Vehicles?

Electric vehicles place extreme demands on conductors. High current during acceleration, fast charging, and compact layouts require components that can cope with stress. Copper busbar delivers in several ways:

Efficient conduction – Copper reduces resistive loss, extending driving range.
Thermal control – With high conductivity, copper disperses heat effectively during charging cycles.
Space saving – Laminated copper busbars replace bundles of cables, reducing weight and assembly time.
Durability – Resistant to vibration and mechanical wear, critical for vehicles exposed to constant motion.

That’s why most EV battery packs and controllers today rely heavily on laminated busbar copper.

What is a Copper Busbar PCB Used For?

Power electronics – Converters, inverters, and rectifiers.
Automotive – EV drive systems, on-board chargers, and battery management units.
Renewable energy – Solar string inverters and wind turbine controllers.
Industrial systems – Robotics, automation drives, and motor controllers.

FAQs

Q1: What makes copper busbar better than aluminum busbar?

Copper has higher conductivity and better mechanical durability, leading to improved performance and longer service life.

Q2: Can copper busbar be customized?

Yes. Width, thickness, plating, and hole punching can all be tailored to specific installations.

Q3: What is the Copper Busbar HS Code?

Most copper busbars fall under HS Code 7407, covering copper bars and profiles.

Q4: What drives copper busbar price?

Mainly copper market fluctuations, plus cost of processing and plating.

Q5: Is copper busbar PCB the same as heavy copper PCB?

It is a type of heavy copper PCB, but they have several differences. Heavy copper PCB only increases copper layer thickness, while copper busbar PCB embeds solid busbars for even higher current handling.

This is the end of this blog, if you have any other questions about copper busbar pcb, you are welcome to contact our team, our sales are always online!

Tags:Copper busbar HS code, copper busbar manufacturers, copper busbar size and current rating, copper busbar pcb
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Copper Balance PCB, Copper Balancing in PCB

Tuesday, August 19th, 2025

What is copper balance PCB? Let’s explore its technical parameter, purpose, application, design guide and plating uniformity optimization solutions.

Are you troubled with these problems?

How can we ensure signal stability with uneven copper holes? (copper balance PCB heat dissipation and balanced plating)
How can we prevent poor soldering due to interlayer deviation? (copper balance PCB rigidity and deformation prevention)
How can we accurately control high-frequency impedance fluctuations? (copper balance PCB temperature drift suppression)

Best Technology can provide solutions:

Customized electroplating parameters improve copper hole uniformity by +40%
3D simulation predicts interlayer deviation risks
Dynamic compensation technology achieves impedance tolerance of ±5%

Welcome to contact us if you have any request for copper balance PCB: sales@bestpcbs.com.

What is Copper Balance PCB?

A copper balance PCB( also called copper balancing in PCB) requires symmetrical distribution of copper traces and coverage within each layer of the PCB stackup, ensuring consistent copper weight and thickness on the top and bottom layers (or within each inner layer). This is similar to a mirror image design, where the top and bottom layers are perfectly symmetrical to prevent mechanical stress caused by differences in thermal expansion coefficients. For example, during the CAD design phase, engineers create new layers (such as Layer 0 for the board outline and Layer 1 for top-side copper traces) and calculate copper areas to ensure even coverage on both sides.

Copper Balance PCB Technical Parameters

Technical Parameter	Specifications
Copper Thickness Range	Inner Layers: 0.5-3oz (17-105μm)
Copper Thickness Range	Outer Layers: 1-4oz (35-140μm)
Symmetry Tolerance	Layer-to-Layer Copper Distribution Deviation ≤5%
Fill Pattern	Low-Density Areas: Solid Blocks (≥5mm²)
Fill Pattern	High-Density Areas: Mesh Grids (0.3-0.8mm Pitch)
Current Density	Inner Layers: 1.2-1.8A/ft²
Current Density	Outer Layers: 0.8-1.2A/ft² (With Thieving Dots)
Minimum Feature Size	Isolated Copper Dots: Diameter ≥50μm
Minimum Feature Size	Mesh Lines: Width/Spacing ≥80μm
Thermal Stress Resistance	After 3× Thermal Cycles (-40°C~125°C), Warpage ≤0.5%
Impedance Control Differential Pair	±5Ω Tolerance
Single-Ended Trace	±8% Tolerance
DFM Validation Methods	3D Field Solver for Copper Distribution Analysis; IPC-2221A Current Density Check

Purpose of PCB Balancing Copper

Preventing PCB board twisting, bending, or warping: Symmetrical copper trace distribution reduces mechanical deformation caused by differences in thermal expansion coefficients, ensuring a flat board and avoiding manufacturing defects and assembly issues.
Reducing ground impedance and voltage drop: Balanced copper coverage reduces ground resistance and stabilizes current flow, thereby reducing noise interference and improving power efficiency.
Reducing the risk of internal track fracture: Even copper distribution helps dissipate heat and stress, preventing damage to internal tracks caused by thermal stress or mechanical pressure.
Optimizing signal transmission and reducing interference: Copper foil filler improves interference immunity, improves signal integrity, and reduces high-frequency signal coupling and noise.
Enhancing thermal management: Copper acts as a heat dissipation layer, effectively conducting heat, eliminating the need for additional heat sink components, reducing manufacturing costs and the risk of thermal stress.
Increasing structural strength and reliability: Balanced copper increases the thickness of conductors and pads, ensuring strong connections between layers and improving the mechanical durability of the board.

Applications of Copper Balance PCB

LED street lights and traffic lights
Automotive lighting (headlights/taillights)
Surgical shadowless lamps and camping lights
Engine power controllers
Electric vehicle chargers and inverters
Servo motor drive circuits
Arc welder power modules
Solar inverters and UPSs
Textile machinery driver boards
CT/X-ray scanner heat sinks
Surgical lighting systems
5G base station filters
Server power modules
Airborne radar modules
Hi-fi audio amplifiers
Smartphone motherboards

Difference between Copper Balance vs Copper Thieving in PCB

Dimension	Copper Balancing	Copper Thieving
‌Core Objectives‌	Prevent physical deformation (warping, twisting)	Ensure plating uniformity (copper thickness, impedance consistency)
Application Layer‌	Inner layers only	Outer layers only
Added Elements‌	Non-conductive copper blocks (large-area fill)	Isolated copper geometries (dots, squares, etc.)
‌Key Risks‌	Lamination voids, thermal stress fractures	Over-etching (mushroom pads), impedance abrupt changes
‌Design Constraints‌ Requires	interlayer symmetric distribution	Must keep away from signal lines & impedance control areas

How to Achieve Copper Balancing in PCB?‌

Here are ways about how to achieve copper balancing in PCB:

1. Core Principles of Copper Balancing‌

Ensure symmetric copper distribution across PCB layers to prevent warping (max deviation <0.7% thickness)‌.
Maintain impedance consistency (±5% tolerance for high-frequency designs)‌.

2. Implementation Methods‌

Mirror Stack Design‌

Symmetrical copper coverage (top/bottom layers deviation <5%)‌.
Central layers (e.g., L3/L4 in 6-layer boards) should have thicker copper to distribute stress evenly‌.

Dynamic Plating Control‌

Pulse plating adjusts via copper thickness (40% uniformity improvement for blind vias)‌.
Monitor plating solution (60–80g/L Cu²⁺, 50℃±1℃)‌.

Copper Pour Optimization‌

Use grid copper (spacing λ/20) in non-routing areas to avoid resin flow issues‌.
Avoid sharp corners (radial edges minimize EMI)‌.

3. Quality Validation‌

Mechanical Test‌: Post-reflow warpage ≤0.3mm/m (288℃, 3 cycles)‌.
Electrical Test‌: 10GHz impedance variation ≤±2Ω‌.
Microscopic Analysis‌: Uniform copper grain size (≤5μm via SEM)‌.

4. Case Studies‌

HDI Board‌: BGA cracking due to 18% copper imbalance fixed by prepreg compensation (reduced to 3%)‌.
Aluminum Base PCB‌: Overheating resolved via stepped copper design (3oz in high-heat zones)‌.

5. Special Considerations‌

Thick Copper Boards (≥3oz)‌: Staged lamination (120℃/50PSI → 180℃/250PSI)‌.
Flexible PCBs‌: Low-temperature bonding (160–200℃) with flexible adhesives‌.

How to Achieve Copper Balancing in PCB?‌

Copper Balance PCB Design Guideline

1. Copper Thickness Selection

A 1oz (35μm) base copper thickness is preferred for standard boards. Power layers and high-current paths can be partially thickened to 2oz.
Multilayer boards require interlayer copper balance: the difference in copper foil area between adjacent layers should be ≤10% to prevent warping caused by thermal lamination.

2. Copper Foil Distribution Principle

Ground and power layers should use solid copper fill (Solid Pour) to reduce impedance and improve heat dissipation.
Signal layers should use grid copper fill (Grid Pour) to balance interlayer compressive stress.

3. Tracking Rules

Bend traces at 45° angles; avoid 90° right angles (to reduce reflections and space waste).
Critical signal trace widths should be ≥0.2mm. Power trace widths should be calculated based on current (Tool: PCB Trace-Width Calculator).
A 10% margin should be reserved for high-frequency signals to compensate for etching tolerances.

4. Via and Copper Connections

Annular rings on through-hole pads should be ≥0.15mm. Microvias should be ≥0.05mm.
Avoid unnecessary vias and prioritize blind and buried vias to optimize high-density routing.

5. Symmetrical Lamination Design

PCBs with four or more layers should use a symmetrical stackup (e.g., Top-GND-PWR-Bottom). The core board thickness tolerance should be ±10%.
The thicknesses of the copper and dielectric layers must match the coefficient of thermal expansion (CTE) to avoid delamination.

6. Heatsink Copper Area Treatment

Independent copper heatsinks should be provided beneath high-power devices to connect multiple vias to the internal ground plane.
Coordinate the opening ratios of the copper foil and solder mask to avoid localized overheating.

7. Design Checklist

Use Design for Manufacturing (DFM) tools to verify copper balance: inter-layer copper area ratio, minimum trace spacing, and aperture ratio.
Perform electrical rule checking (ERC) and design rule checking (DRC) before submitting process files.

8. Vendor Collaboration Requirements

Confirm the PCB manufacturer’s process capabilities (e.g., minimum trace width/maximum copper thickness) in advance.
Indicate special requirements (e.g., impedance control layer, ±10% copper thickness tolerance).

9. Design Document Annotation

Reference identifiers (R1/C2) should be placed away from densely populated areas to avoid obstruction.
Net names should be named according to their function (e.g., VCC_3V3, GND_DIGITAL).
Add a laminate diagram and indicate the copper thickness of each layer.

Copper Balance PCB Plating Uniformity Optimization Solution

‌Current Density Control‌

Forward pulse (100–200ms, 40–60A/dm²) + reverse pulse (5–10ms, 6–10A/dm²) reduces via-to-surface thickness ratio from 1:2.5 to 1:1.2, improving yield to 98.5%.
Adjust edge current density by 15–20% to minimize “edge effect” (edge plating thickness ≤ 1.8× center).

‌Plating Solution Improvement‌

Accelerator (4-amino-2-thiophene carboxylic acid, 40–60ppm) increases via-bottom deposition rate by 35%.
Leveler (heterocyclic quaternary ammonium salts, 20–30ppm) reduces surface copper growth by 50%.
Copper sulfate (60±5g/L), sulfuric acid (100±10g/L), temperature (50±1℃) reduces roughness (Ra) by 50%.

‌Equipment & Fixture Optimization‌

Optimize titanium basket positioning: Adjust bottom screen by 2mm reduces bottom thickness variation by 4%; adjust side screen by 20mm reduces CoV from 7.0% to 5.1%.
Use conformal anodes for complex boards, improving current distribution uniformity by 25%.

‌Spray System Calibration‌

Pressure gradient: 15–20% lower at edges reduces thickness variation by 35%.
Intermittent spray eliminates “bath effect,” improving uniformity by 40%.

‌Pre-Treatment & Process Control‌

Micro-etching (Ra 0.8μm) improves adhesion from 0.8N/cm to 1.5N/cm.
Strict degreasing (<0.5mg/cm² residue) reduces plating defects by 35%.

‌Real-Time Monitoring‌

Online bath composition control: Metal ion variation ±3%, additives ±5%.
Temperature control (50±0.5℃) improves uniformity by 15%.

‌Design Optimization‌

Copper distribution error ≤5% (≤8% for inner layers), reducing warpage by 30%.
Avoid isolated copper areas (<0.5mm²; fill or remove if necessary).

‌High-Density Zone Compensation‌

Differential pairs: +10% current reserve reduces impedance variation from ±15% to ±3%.
Laser vias (0.1mm) with pulse control: Height variation <0.2μm.

‌Quality Verification Standards‌

CoV (Coefficient of Variation): ≤10% (optimized to 5.1%).
Range method: ≥90% (requires high-end chemicals & rectifiers).

‌Reliability Testing‌

Thermal cycling (−55℃ to 125℃, 1000 cycles): No delamination; thick copper (≥3oz) improves bend strength by 150%.
Peel strength: Electrolytic copper ≥1.5N/mm, rolled copper ≥2.0N/mm.

Conclusion

To sum up, the above content is all about technical parameter, purpose, application, design guide and plating uniformity optimization solutions for copper balance PCB. If you have any other issues about copper balance PCB, please feel free to contact us: sales@bestpcbs.com. Looking forward to hearing from you soon!

Tags:copper balance PCB, copper balancing in PCB
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What is ICT Tester? In Circuit Test vs Flying Probe Testing

Monday, August 18th, 2025

Have you ever wondered why some electronic devices fail even when the PCB looks flawless? Or why high-volume production sometimes delivers inconsistent boards? These issues often trace back to undetected component defects, poor soldering, or faulty connections. Without proper testing, even a single defective part can lead to product failure, costly recalls, or customer dissatisfaction.

This is where an ICT tester equipment comes in. By performing in-circuit testing (ICT), manufacturers can quickly detect missing components, shorts, opens, and incorrect placements before the boards leave the production line. With the right ICT test electronics and in-circuit test fixtures, you gain fast, accurate, and reliable validation of each PCB, saving both time and money.

In this article, we’ll answer key questions such as:

What exactly is an ICT tester, and how does it work?
Why is ICT testing so critical for electronics manufacturing?
How does ICT differ from functional testing or flying probe testing?
When should you use ICT versus functional testing for your boards?

By understanding these points, you’ll see how ICT testing can prevent defects, improve production efficiency, and ensure reliable end products—turning potential headaches into controlled, predictable outcomes.

What is an ICT Tester?

An ICT tester is a system designed to perform in-circuit testing (ICT) on printed circuit boards after assembly. It is often recognized by its “bed-of-nails” fixture, which has hundreds or even thousands of pins arranged to contact specific points on the PCB. Each pin corresponds to a pad, via, or test point, allowing the tester to measure voltages, resistances, and currents at component level.

ICT testers can:

Detect missing, incorrect, or faulty components.
Identify open circuits, short circuits, and soldering defects.
Measure parameters such as resistance, capacitance, and diode orientation.
Verify integrated circuit placement and connectivity.

Because ICT is thorough and fast, it has become an industry-standard approach, especially in high-volume production lines.

Why is the ICT Test Important?

The ICT test is important for several reasons. In large-scale manufacturing, even a single defect can ripple into thousands of defective units. Detecting issues early reduces costs, avoids recalls, and protects brand reputation.

For example, in automotive electronics, where safety systems depend on flawless PCBs, ICT is crucial. An undetected fault in an airbag control system could have serious consequences. In consumer electronics, ICT prevents faulty smartphones, laptops, or home appliances from reaching the market.

The ICT test is also important for process improvement. It provides engineers with statistical data that highlights recurring problems, such as solder bridging or component misplacement. Manufacturers can use this data to refine processes, reduce defect rates, and improve yields.

What is the Purpose of the ICT Test?

The main purpose of ICT testing is to validate the quality and functionality of each component on the PCB. Unlike functional testing, which looks at the board’s overall behavior, ICT digs into details at component level.

ICT ensures that:

Every resistor has the correct value.
Capacitors and inductors are present and within tolerance.
Diodes and transistors are oriented properly.
Integrated circuits are placed in the right sockets and connected.

By catching defects at the source, ICT reduces the risk of failures at the product’s final stage. This is especially valuable in industries where long-term reliability is critical, such as aerospace, defense, and medical devices.

How Does an ICT Tester Work?

An ICT tester works by pressing the in-circuit test fixture against the PCB, making contact with the test pads or vias. Once contact is established, the system injects signals into the board and records the response.

Here’s a breakdown of the process:

Fixture Setup – The board is placed into a bed-of-nails fixture designed for its exact layout.
Signal Injection – Test probes inject electrical signals into various nodes of the circuit.
Measurement – The tester measures voltage, current, resistance, and capacitance at each point.
Analysis – Software compares the measured values with predefined thresholds.
Reporting – The system highlights any failures or deviations for quick troubleshooting.

ICT is highly automated, with a cycle time ranging from a few seconds to less than a minute. This makes it efficient for high-volume production, where time savings directly translate to lower manufacturing costs.

Advantages of ICT Testing

High Accuracy – Detects even subtle component defects.
Fast Cycle Time – Ideal for mass production.
Detailed Data – Provides insight into manufacturing trends.
Early Detection – Reduces rework and repair costs.
Reliability – Improves long-term performance of products.

What is the Difference Between Functional Testing and ICT Testing?

Both functional testing and ICT testing play important roles in quality assurance, but they target different aspects of the PCB.

ICT Testing – Focuses on component-level verification. It checks each resistor, capacitor, diode, transistor, and IC independently. ICT identifies defects like shorts, opens, wrong components, or poor solder joints.
Functional Testing – Evaluates the overall system behavior. It simulates real-world operating conditions, ensuring the PCB performs its intended function. Functional testing may involve powering up the device, running software, or checking communication protocols.

To put it simply: ICT looks at how the board is built, while functional testing checks how the board behaves. Both tests are complementary, and many manufacturers use them together.

Functional Testing vs ICT Testing

When to Use ICT and Functional Testing?

Choosing between ICT and functional testing depends on project goals and production stage.

Use ICT testing when:

Boards are still in the manufacturing phase.
Component-level accuracy needs to be validated.
High-volume production demands fast, repeatable results.

Use functional testing when:

The assembly is nearly complete.
The product’s performance under real operating conditions needs to be verified.
System-level testing is required, such as communication between multiple boards.

For best results, many manufacturers use a combination of ICT and functional testing. ICT catches early-stage defects, while functional testing provides final validation before shipment.

In-Circuit Test vs Flying Probe: What are Differences?

When comparing in-circuit testing (ICT) with flying probe testing, the differences come down to cost, speed, and flexibility.

In-Circuit Test (ICT):

Uses a custom in-circuit test fixture.
Offers fast cycle times (seconds).
Best for high-volume production.
High upfront cost for the fixture, but lower cost per test afterward.

Flying Probe Test:

Uses moving probes instead of a fixture.
Slower than ICT, since probes move sequentially.
Excellent for prototypes and low-volume runs.
No fixture cost, making it more flexible and cost-effective for small batches.

In practice, many manufacturers start with flying probe testing during prototyping. Once the design is finalized and volumes increase, they shift to ICT testing for efficiency.

In-Circuit Test vs Flying Probe

Applications of ICT Testing

ICT testing is used in a wide range of industries:

Automotive – For safety-critical systems like airbags, ABS, and engine control units.
Medical Devices – For life-support systems, imaging equipment, and diagnostic tools.
Aerospace and Defense – Where reliability under extreme conditions is non-negotiable.
Consumer Electronics – From smartphones to laptops, ensuring consistent quality.
Industrial Equipment – For automation controllers and power management systems.

In each of these cases, ICT contributes to higher reliability, lower failure rates, and better compliance with international standards.

Why Choose Best Technology for ICT and PCB Testing?

Best Technology is a reliable PCB manufacturer in China, trusted by more than 1,000 customers across industries worldwide. We specialize in small to medium-volume PCB manufacturing, PCB assembly, and complete electronic manufacturing services.

As one of the most experienced circuit board suppliers, our capabilities cover a wide range of PCB types, including rigid PCBs, flex PCBs, rigid-flex PCBs, aluminum PCBs, RF/microwave PCBs, high-speed and high-frequency PCBs, and HDI PCBs. Beyond manufacturing, we also provide turnkey assembly, component sourcing, box build assembly, PCBA testing, and full electronic testing services.

With over 19 years of experience, our engineering, production, and quality teams fully understand the unique needs of industries such as medical, automotive, and aerospace. We strictly follow international standards, working under IPC-A-600 for PCB manufacturing and IPC-A-610 for PCB assembly. All of our products meet IPC Class 2 standards, and for projects requiring higher reliability, we also deliver Class 3 or Class 3A compliance. Combined with strong engineering support and competitive pricing, we help customers achieve both reliability and cost-effectiveness.

FAQs

1. What does ICT stand for in electronics testing?

ICT stands for in-circuit testing, which validates the quality of individual PCB components.

2. Can ICT testing replace functional testing?

No. ICT and functional testing serve different purposes. ICT checks construction, while functional testing checks performance.

3. How long does an ICT test take?

Most ICT tests take only a few seconds, depending on the number of test points.

4. Is an in-circuit test fixture reusable?

Yes, but each fixture is custom-designed for a specific PCB layout.

5. Which is better: in-circuit test or flying probe?

ICT is best for high-volume runs due to speed. Flying probe is better for prototypes or small batches.

Tags:Ict test electronics, in circuit testing, In-circuit test fixture, PCB testing
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Better Quality EV Thick Copper Substrate, Thick Copper PCB

Monday, August 18th, 2025

An EV thick copper substrate is really important in the AVs, such as the application of battery management systems, on-board chargers, DC-DC converters, motor controllers, thermal management systems, and others. In this blog, we will discuss valuable information, including the structure, features, thickness standards, selection guide, and key applications of EV thick copper substrates, to ensure better performance in electric vehicles.

Have you run into these problems when working on the EV PCB projects?

The drilling process problems, such as the inner layer cracks, rough hole walls, and the damaged drilling bit problem?
The thermal management challenges, such as the difference in thermal expansion coefficient, may cause solder joint fatigue and affect the equipment’s lifespan.
The design and the manufacturing complex?
The shortage of reliability evaluation?

Best Technology provides innovative solutions for tackling the above issues.

Optimize the drilling process and material selection: use the special drilling parameter and optimize the drilling bit to reduce the problem of inner layer cracks and the rough hold walls problem. Finally, improve the manufacturing efficiency and the product quality.
Optimize the thermal management and the material selection: employ the high thermal material and the thermal management design to improve the thermal expansion efficiency.
Control process and the quality: Make use of laser thickness measurement, dynamic compensation systems, and the full process parameter traceability to ensure the precision of the copper thickness control and the product quality.
Make the reliability evaluation and the accelerated inspection.

EV thick copper substrate plays a vital role in the electric vehicle sector. If you have any more technical questions or any inquiries, just feel free to contact Best Technology via sales@bestpcbs.com. Best Technology has specialized in thick copper PCB prototype, manufacturing, assembly, and box build service for over 19 years. Looking forward to hearing from you!

Better Quality EV Thick Copper Substrate, Thick Copper PCB

What is EV Thick Copper Substrate?

An EV thick copper substrate is a printed circuit base material built with extra layers of copper. Generally, the copper thickness of the common PCB ranges from 1 OZ to 3 OZ, however, in the EV, the copper thickness can be up to 6 OZ to even 20 OZ. This thicker copper layer can manage the high current without being damaged, to reduce the energy loss, and improve the safety margins. In essence, the EV thick copper substrate is the core of the EV power management.

What are Features of Copper Substrate PCB?

A copper substrate PCB is recognized for its outstanding thermal conductivity. The heat can be conducted quickly, and protect the sensitive chips. It also has remarkable current-carrying ability, which is a core need for EV power modules. Besides, its mechanical strength is higher than the common FR4 as well. The designers commonly select this copper substrate PCB when facing the high reliability requirements. The EV system’s lifespan will be extended by using this PCB.

What is the Composition of EV Thick Copper Substrate?

EV thick copper substrate is made of three layers, including heavy copper foil, insulation dielectric, and the substrate, such as aluminum or FR4. The copper layer decides the current loading capability. And the insulation dielectric is responsible for the insulation and the thermal dissipation. The substrate provides the stability, however. To some designs, there will increase in the protected coating to improve the corrosion resistant. It is good to know that each layer is vital to the stable performance in the hard EV environment.

What are the Types of EV Thick Copper Substrate?

EV thick copper substrates come in several types:

As per structure:

Single-sided thick copper PCB – for simple, high-current circuits.

Double-sided thick copper PCB – when routing density increases.

Multilayer thick copper PCB – designed for advanced EV powertrain and battery management systems.

As per the material compound:

The hybrid copper substrate – Combining copper and aluminum to boost the heat dissipation performance.

Ceramic substrate (DBC/AMB) – It is bonded by combining DBC and Al₂O₃/AlN ceramic, suitable for high-temperature and high-power applications.

Different type meets different project needs. Choose the suitable one as per the design complexity, electrical press grade, and the durability requirements.

How Much Thick Copper PCB in an EV?

In an electric vehicle, thick copper PCBs are used in several areas. For example, the battery module, automobile charger, and DC-DC converter. The amount varies by vehicle model. High-performance EV in the power control unit and motor drive modules will use the thicker copper PCBs. The lighting system, when dealing with the current surges, will get its benefits as well. Generally, multiple thick copper PCBs are present throughout the EV system.

How Thick Should EV Thick Copper Substrate Be?

The required EV thick copper substrate thickness depends on the specification designed. The common range is from 4 OZ to 12 OZ. High power applications, such as main inverters, may require 15 OZ or even higher. The engineers will decide according to the current needs, heat output, and the space limit. A reasonable copper thickness can get a balance between efficiency and cost. Since the thinner will get the risk of over heating, but the thicker will increase the costs.

PCB Copper Thickness Chart

The following is the simplified PCB copper thickness chart:

Copper Weight (OZ)	Thickness (µm)	Common Application
1 OZ	35 µm	Low-current signal circuits
3 OZ	105 µm	Medium power modules
6 OZ	210 µm	Battery controllers, power relays
10 OZ	350 µm	EV inverters, motor drivers
15+ OZ	525 µm+	Heavy-duty EV systems

This chart helps engineers select the suitable copper thickness according to the current and the heat dissipation needs. It provides a clear reference during the stage of selecting substrate types.

How to Select EV Thick Copper Substrate for the Project?

When selecting an EV thick copper substrate, several factors come into play:

Required copper thickness based on current load.
Thermal conductivity to manage hot spots.
Mechanical strength for vibration resistance.
Cost efficiency and guarantee the safety in the meantime.

It needs to consider the space limit inside the EV part when designing. Best Technology helps customers balance all these concerns. Customers often meet the pain point, such as over-heating boards and the traceability difficulty. Our MES system addresses this by tracking every stage of production. We also control the copper-plated uniformity strictly, so as to reduce the failure risks. Then customers don’t need to bear the extra cost for the rework.

What are the Specific Applications for EV Thick Copper Substrate?

Thick copper PCB is widely used in EVs, mainly including:

BMS: Solving the high current charging and discharging.

Main Inverter: Provide controlled power to the driving motor.

Automobile Charger: Ensure safety during charging.

Heat Management System: Keep the battery within the safe temperature ranges.

These applications have extremely high requirements for the substrate strength, durability, and precision. Using EV thick copper substrate, the EV manufacturers can get higher efficiency, more better safety, and more longer lifespan of the components.

Case about EV Thick Copper Substrate

Best Technology has valuable experience in the EV Thick Copper Substrate PCB cases. Here are some parameters of the thick copper PCB that our customers used in some of their projects. You can take it as a reference. If any help is needed, please feel free to let us know, and we will provide the specific boards and solutions according to your project requirements.

Extra Heavy Copper (14L 5.588mm+/-10% ≥5 OZ) FR4 PCB Parameters

Layers: 14 layers heavy copper PCB
Inside and outside copper are different, over 5OZ
Board Thickness: 5.588mm+/-10%
Surface Treatment: ENIG
Solder Mask: Green oi

14 Layers heavy copper PCB Parameters

Layers: 14 Layers heavy copper PCB
Materials: Tg170
board thickness: 6.9mm+/-10%,
4oz copper at each layer
Surface Treatment: Immersion gold (Au 2u”)
Solder Mask: Green solder mask, white silk screen.
Application: High power supply

8L Heavy Copper PCB Parameters

Materials: Tg170
Board Thickness: 2.55mm+/-10%,
4oz copper at each layer
Surface Treatment: Immersion Gold (Au 2u”)
Solder Mask: Red solder mask, white silk screen.
Application: High Power Supply

To sum up, the EV thick copper substrate is the core of EV safety, high efficiency, and powerful operation. It is not only a circuit material. EV gains a competitive edge in durability and performance through selecting the suitable copper thickness and the substrate designs. Best Technology has our own PCB factory, fully compliant with ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, REACH, and RoHS standards. If you need a reliable manufacturer for a viable solution, just feel free to contact us via sales@bestpcbs.com.

Tags:EV Thick Copper Substrate
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Ground Bus Bar, Copper Grounding Bus Bar Manufacturer

Monday, August 18th, 2025

What is a ground bus bar for? Let’s explore its function, applications, working principle, production processes, design guide for ground bus bar.

Are you troubled with these problems?

Is the copper plate too thin, making it easy to burn through during welding? (Ground bus bar have a larger heat capacity and more stable welding.)
High-frequency current transmission losses are high? (Ground bus bar offer excellent conductivity and lower signal attenuation.)
Insufficient plate rigidity, making assembly prone to deformation? (Ground bus bar offer high strength, ensuring structural stability.)

Best Technology can provide services + solutions:

Customized Processing Services – Precise cutting according to drawings, reducing secondary processing costs.
Fast Delivery Channel – 48-hour shipping for standard specifications, with priority scheduling for urgent orders.
Application Technical Guidance – Provide welding parameter recommendations and optimize production processes.

Welcome to contact us if you have any request for ground bus bar: sales@bestpcbs.com.

What is a Ground Bus Bar for?

A Ground Bus Bar (also known as Copper Grounding Bus Bar) is specialized circuit boards designed for efficient power distribution. By integrating solid copper or aluminum conductive traces (up to several millimeters thick), they can carry higher currents and are suitable for high-power applications. Unlike traditional PCBs that use etched copper wires to connect components, the core advantages of heavy copper PCBs lie in their high current-carrying capacity, mechanical strength, and space-optimized design. These advantages reduce heat generation and voltage drop, improve resistance to vibration and thermal cycling, and simplify wiring design.

Where Do We Use a Ground Bus Bar?

Applications of ground bus bar:

New energy vehicle charging stations
Industrial inverters
Consumer electronics fast charging interfaces
Photovoltaic inverters
Energy storage converters
Rail transit traction systems
Substation grounding protection
Data center server cabinet power distribution units (PDUs)
Industrial motor controllers
Industrial robots

How Does a Grounding Bus Bar Work?

Providing a low-resistance grounding path

Thick copper plates (thickness ≥ 1.0mm) create a low-impedance path, quickly conducting fault currents in equipment casings or circuits to the ground, preventing voltage buildup that could damage equipment or cause electric shock.

Centralizing fault current distribution

Serving as the “central grounding point” of the electrical system, thick copper plates integrate multiple grounding wires to ensure even distribution of fault currents (such as short circuits and lightning strikes), preventing local overheating and arc flashovers.

Suppressing voltage fluctuations and electromagnetic interference

The large cross-section design of the thick copper plates reduces inductance effects, stabilizes the system reference potential, mitigates the impact of electromagnetic interference (EMI) on sensitive equipment, and ensures signal transmission quality.

Suitable for high-current scenarios

The high current carrying capacity (50A-300A) of thick copper plates (1.0mm-3.0mm) can handle the instantaneous high current demands of new energy vehicle charging and industrial motor starting, preventing circuit overheating or melting.

Mechanical and thermal stability

Thick copper structure resists vibration and temperature rise (copper thermal conductivity 400W/m·K), maintaining grounding reliability in high temperature or vibration environments, extending equipment life.

How to Make a Copper BusBar?

‌1. Material Preparation‌

Substrate Selection‌: Modified FR-4 or polyimide (PI) materials are chosen for their enhanced thermal stability and mechanical strength to withstand thick copper layers (typically ≥3oz/105μm)‌.
Copper Foil Preparation‌: Copper foils are selected based on current requirements (e.g., 2oz–12oz thickness), with surface treatments to improve adhesion‌.

2‌. Inner Layer Processing‌

Lamination‌: Copper foil is bonded to the substrate under controlled temperature/pressure (e.g., 180°C, 300psi) to prevent delamination‌.
Photoresist Application‌: Dry film resist is applied to define circuit patterns.
Exposure/Development‌: UV exposure transfers the design, followed by chemical development to remove unexposed resist‌.
Etching‌: Ammoniacal etchants are used with extended dwell times (20–30% longer than standard PCBs) to account for increased copper thickness. Sidewall compensation of 0.2mm–0.4mm is added to maintain trace accuracy‌.

3. Layer Stackup & Lamination‌

Prepreg Layering‌: High-resin-content prepregs (e.g., 2116 type) are used to fill copper thickness variations, ensuring 85%+ resin fill‌.
Multi-Layer Alignment‌: Optical targets align layers within ±25μm tolerance before pressing at 200°C/400psi for 90+ minutes‌.

4. Drilling & Metallization‌

Mechanical Drilling‌: Carbide drill bits with reduced feed rates (e.g., 1.2m/min for 4oz copper) minimize burring.
Hole Wall Roughness‌: <25μm to ensure plating uniformity‌.
Aspect Ratio‌: Limited to 8:1 for reliable plating‌.
Electroless Copper‌ Plating: Deposits 0.3–0.5μm seed layer.
Panel Plating‌: Electroplating builds copper to 25–30μm thickness with low-stress chemistry to prevent cracking‌.

5. Outer Layer Processing‌

Secondary Patterning‌: Repeat inner layer steps with adjusted exposure times for thicker resist‌.
Final Etching‌: Differential etching may be used for boards with mixed copper weights (e.g., 3oz signal traces + 8oz power paths)‌.

6. Solder Mask & Surface Finish‌

Solder Mask Application‌: Liquid photoimageable (LPI) solder mask is screen-printed or sprayed, then cured at 150°C for 45 minutes to withstand thermal stress‌.
ENIG (Electroless Nickel/Immersion Gold)‌: Common for high-reliability applications (e.g., 3–5μm Ni + 0.05–0.1μm Au)‌.
Hard Gold Plating‌: Used for edge connectors (e.g., 1–3μm Au over 5–10μm Ni)‌.

7. Electrical Testing & Inspection‌

Automated Optical Inspection (AOI)‌: Checks trace width/spacing with ±10% tolerance‌.
Flying Probe Test‌: Validates electrical continuity at 100–500V depending on design‌.

8. Final Processing & Packaging‌

Routing/V-Scoring‌: Diamond-coated cutters used for edge finishing; slower feed rates prevent copper tearing‌.
Cleaning‌: Ionic contamination controlled to <1.56μg NaCl/cm² per IPC-6012‌. Packaging‌: Vacuum-sealed with desiccant for moisture-sensitive boards (>2oz copper)‌.

How to Design a Ground Bus Bar?

1. Strict Substrate Material Selection Criteria

FR-4 or high-TG laminate (such as Isola 370HR) is recommended. Its glass transition temperature (Tg) is ≥170°C, maintaining insulation stability over a wide temperature range of -40°C to 130°C. Experimental data shows that the interlayer peel strength of high-TG laminate reaches 12N/mm at 150°C, far exceeding the 8N/mm of standard FR-4.

2. Current-Carrying Capacity Quantification Model

Based on the I²R loss formula, a 4oz copper laminate with a width of 10mm can safely carry 150A. If the current increases to 200A, the copper thickness must be increased to 6oz or the width must be expanded to 25mm to ensure that the temperature rise does not exceed the industry standard limit.

3. Dynamic Cross-Sectional Area Optimization Strategy

Utilizing the “copper thickness-width” collaborative design principle: for every 100A increase in current, the copper thickness can be increased by 1oz or the width by 15mm. For example, for 300A requirements, a combination of 8oz copper thickness and 30mm width can be used, balancing cost and performance.

4. Practical Application of Voltage Drop Formula

Using the formula ΔV = I × R × L, when a 200A current passes through a 50mm long 8oz copper plate, the voltage drop can be controlled within 0.48V (ρ = 1.68 × 10⁻⁸ Ω·m). In actual designs, a 10% margin should be reserved to ensure the final voltage drop is less than 0.5V.

5. Wiring Topology Optimization Techniques

Adopting a “thickened main channel + thinned branch” design: Main lines must have a copper thickness of ≥ 6oz, and branches must have a copper thickness of ≥ 4oz. Combined with a grid-like ground layout, this design can reduce voltage fluctuations in high-frequency circuits to below 0.2V.

6. Stress Concentration Solution

Adding a 2mm radius to the bend area and combining it with a 0.8mm thick reinforcement plate can reduce the stress concentration factor at the bend from 3.2 to 1.5. Aperture design follows the “1.5 times the board thickness” principle. For 4oz boards, the recommended aperture is ≥1.5mm.

7. Thermal Via Array Design Specifications

Five thermal vias are required for every 100A of current. A 0.8-1.2mm diameter aperture is recommended, evenly spaced 3mm apart. Actual measurements show that this design can reduce hotspot temperatures by 18-25°C.

8. Temperature Rise Monitoring and Control

A three-stage test using an infrared thermal imager ensures: no-load temperature rise <10°C, half-load temperature rise <35°C, and full-load temperature rise <50°C. Temperature sensors are installed in key areas (such as under power devices) to ensure surface temperatures ≤90°C (UL standard).

9. Composite Heat Dissipation Structure Design

A “sandwich” layered design is employed: a top layer of thick copper (≥4oz) carries high current, a middle layer is filled with 3M 8810 thermal adhesive (thermal conductivity 1.5W/m·K), and a bottom layer houses high-frequency signal lines. This structure can reduce thermal resistance to 0.8°C/W.

10. Tolerance Control System

“Double Precision” control is implemented: copper thickness tolerance is ±10% (e.g., 3.6-4.4oz for a 4oz board), and hole position deviation is ≤0.1mm. An X-ray inspection system is used to ensure inter-layer alignment error is <0.05mm.

11. Surface Treatment Options

Tin plating (5-10μm) is suitable for high-temperature soldering applications and can withstand peak temperatures of 260°C. OSP treatment is suitable for no-clean processes and has a shelf life of up to 12 months. Both solutions have passed the 24-hour salt spray test (ASTM B117 standard).

11. Rigorous Electrical Performance Testing

Dielectric strength test: 500V AC for 1 minute without breakdown; contact resistance test: <5mΩ (four-point probe method). High-frequency signal layers must pass S-parameter testing to ensure insertion loss <0.5dB at 10GHz.

12. Mechanical Environmental Adaptability Verification

Vibration test: No cracking after 3g acceleration shock in the 5-2000Hz frequency range.
Thermal shock test: 100 cycles from -40°C to 125°C, with interlayer peel strength loss of <15%.

Why Choose Best Technology as Copper Grounding Bus Bar Manufacturer?

Reasons why choose us as copper grounding bus bar manufacturer:

International Certifications: Hold ISO 9001 quality management system certification, UL safety certification, and IPC-6012 Level 3 standards. All thick copper clad products comply with RoHS/REACH environmental regulations, ensuring long-term reliability for industrial applications.
Specialized Ultra-Thick Copper Production Line: Equipped with a dedicated 4-20oz thick copper clad production line, this line utilizes pulse plating technology to ensure uniform copper thickness (≤15%) and a current carrying capacity of 20A/mm², eliminating the uneven plating issues often encountered in traditional processes.
Full-Process Intelligent Inspection: Deployed with an AOI + X-ray dual inspection system, this system achieves a 99.7% detection rate for defects such as voids and nodules in thick copper clad plating. Electrical testing covers 12 key parameters, including temperature rise and current carrying capacity.
High-Frequency Thick Copper Hybrid Process: Supports composite lamination of high-frequency materials and thick copper, achieving an impedance control tolerance of ±7%, meeting the high power and low loss requirements of applications such as 5G base station power supplies.
Industry Case Studies: Over 200 projects with 4oz+ copper thickness have been delivered in the past three years, including industrial-grade applications such as new energy inverters and rail transit power modules.
Quick-Response Design Support: 48-hour thick copper clad design and manufacturing (DFM) reports are provided. Our engineering team is capable of optimizing impedance control within ±5%, supporting customized design requirements.
Stable Delivery Capabilities: Our dedicated thick copper clad production line achieves a standard 15-day lead time (compared to the industry average of 25 days). Over the past 12 months, our on-time delivery rate has been 98.6%, and urgent orders can be shortened to just 7 days.
Transparent Cost Control: Utilizing an algorithm that optimizes copper foil utilization, our 4oz clad production costs are 12% lower than the industry average. Quotes include engineering and testing fees, with no hidden charges.

Why Choose Best Technology as Copper Grounding Bus Bar Manufacturer?

Our Ground Bus Bar Capabilities

Parameter	Specification
Minimum distance between copper bars	0.8-1.0mm
Copper thickness for bar	1.0mm-3.0mm
Current carrying capacity	50-300A
Surface finishing	ENIG, immersion silver, gold plating
Board thickness	3.0-6.0mm
Hole wall thickness	>=25um
Thickness to diameter ratio	1:6 or 1:7 (for 1.0mm copper with a minimum of 0.7mm holes).
Layer count	typical 3-4 layers; additional layers possible with design evaluation
Maximum dimension	600400mm for standard bus bar PCB, 900600mm for double sided PCB
lead time	3-4L bus bar PCB is around 13-15days, add 3days per layer over 4 layers
Custom options	Support bending if customer has requirements

How to Get a Quote for Copper Grounding Bus Bar?

1. Basic Specifications

Dimensions (L x W x D, e.g., 24″ x 2″ x 0.25″)
Shape (Straight, L-shaped, U-shaped, Custom Bend)
Copper Thickness (e.g., 4oz, 5oz, 6oz)

2. Quantity and Delivery

Order Quantity (Sample, Small Order, Large Quantity)
Target Lead Time (e.g., “Within 3 Weeks” or “Expedited”)

3. Material and Process

Substrate Type (FR-4, Metal Substrate, Ceramic)
Surface Finish (Tin Plating, Galvanized Plating, Bare Copper)
Special Processes (e.g., Segmented Plating, Thick Copper Fill)

4. Certifications and Testing

Required Certifications (UL, ISO, RoHS)
Additional Testing (Salt Spray Test, High-Temperature Aging, Electrical Performance Testing)

5. Additional Requirements

Packaging Standards (Vacuum, Moisture-Proof, Wooden Rack Mounting)
Technical Documentation (CAD Drawings, 3D Models, Design for Implementation (DFM) Feedback)

Get an accurate quote now! Contact us today if you have any inquiry for copper grounding bus bar: sales@bestpcbs.com.

Tags:Copper Grounding Bus Bar, Ground Bus Bar
Posted in best pcb, bestpcb, Special PCB | No Comments »

‌Why Does PCB Copper Pad Peel? 3 Fixes for Manufacturing

Friday, August 15th, 2025

PCB copper pad quality is crucial for any printed circuit board to perform well in the field. In this blog, we mainly explains what PCB copper pads are, their types, surface finishes, functions, common peeling issues, and practical repair and material selection solutions for reliable manufacturing.

Have you experienced these nightmares and headaches in your project?

The mechanical damage and the mechanical stress issues?
The material and process problem caused the pad peeling?
Poor soldering and thermal stress?
The defect of the design and manufacturing?

Here are the solutions and the measures that Best Technology recommends.

Optimize the soldering process: control the soldering temperature and time according to the types of PCB pads; use the premium quality soldering irons and solder.
Improve the material and the process: Boost copper coil quality to ensure sufficient adhesion between the copper and the resin. Besides, it is vital to improve the manufacturing process, such as lamination, etching, and plating, to ensure strong bonding between the copper foil and the substrate.
Optimize design and the storage condition: First, we should increase the distance between the copper foil and the edge to reduce the mechanical stress and avoid being too near between the copper foil and the edge. Second, the point is to avoid exposure to the moist environment for a long time.
Boost the thermal stability of the pads: We will increase the copper foil thickness via plating or other ways to boost the thermal conductivity and reduce the localized high temperatures impact to the pads. Finally, using the better quality copper foil guarantees great adhesion between the copper and the resin.

Best Technology provides various PCB types to a much larger market for over 19 years, such as bus bar PCB, RF board, HDI PCB, High Tg PCB, extra thin PCB, and others. We have a rigorous quality inspection system, where each manufacturing process will undergo strict QC. If you require PCBs, just feel free to write an email to sales@bestpcbs.com or make a call at +86-755-2909-1601.

Why Does PCB Copper Pad Peel? 3 Fixes for Manufacturing

What is a PCB Copper Pad?

A PCB copper pad is the conductive surface on a printed circuit board where components are soldered or connected. These pads provide electrical and mechanical connections between the board and electronic parts. It is nice to know to know that the shape of the pad can be round, square, or a tailored shape. That is beneficial to meet the design demands. The exceptional quality pads ensure stable soldering, low signal loss, and long-term stability.

In our experience at Best Technology, many customers approach us after facing poor pad adhesion from other suppliers. We avoid these problems before shipping via using outstanding quality copper foil, high precision etching, and strict quality inspection.

What Are the Different Types of PCB Pads?

It is helpful to know that the PCB pads include the following types.

Through-Hole Pads: It is a drilling hole with the plated copper, used for the component leads to pass through and solder. That provides the mechanical support.
SMD Pads: It is used in the flat copper area of the surface-mounted components, suitable for high-density circuit boards.
Thermal Relief Pads: It is designed for controlling the heat flux during soldering to avoid overheating.
Via Pads: Connect the inner layers of multi-layer boards, generally smaller than component pads and critical to multi-layer boards.

It is really significant to select the suitable types of pads, since it will affect the assembly speed, soldering strength, and the performance of the integrated boards.

SMD Pads PCB vs Through-Hole Pads: Which is Better for Your PCB?

SMD pads PCB designs are preferred in high-density and lightweight applications like smartphones and wearable devices. They allow smaller boards and faster automated assembly.

Through-hole pads is a good fit for the components that needs extra mechanical strength, such as connectors or high-power device. It is commonly to see that the through-hole pads are used in places where stability is needed and the SMD pads are used in high density areas. In many projects, engineers will prefer to use the hybrid designs.

What is a PCB Copper Pad Surface Finish?

Surface finish is the coating applied to the copper pad to protect it from oxidation and ensure good solderability. The common surface treatments include HASL, ENIG, OSP, immersion Tin, immersion silver, and hard gold plating. For PCB copper pad, it is mostly used ENIG for its smooth surface, oxidation resistance, and long lifespan.

Best Technology uses ENIG or hard gold plating for the applications that require high reliability, such as aerospace, to ensure the high-quality soldering performance even after months of storage.

What is the Function of the PCB Cu Pad?

PCB Cu pad is not only an electrical connection point but also a mechanical fix point of the components. It keeps the signal transmission efficiency and maintains the stable performance of the components in the situation of vibration or mechanical stress. It is great to know that no reliable pad, even the most advanced circuit design, can fail.

Why Do PCB Copper Pad Peels?

It is valuable to know why the PCB copper pad peels.

One common reason is poor adhesion between the copper and the substrate. This can happen if there is not enough lamination pressure or if the surface is contaminated.

The second crucial point is that the ‌excessive heat of the soldering will cut the bond strength.

The third essential reason is that the mechanical stress is too high in the assembly or the repairing process, which pull pads away from the laminate.

It is known that the PCB copper pad peels will increase the rework difficulty and the costs. Best Technology prevents these issues through controlling the process temperature, using professional quality substrates, and making the peel strength test meanwhile.

3 Fixes for PCB Copper Pad Peels in Manufacturing

Based on industry experience, here are three effective solutions:

Improve Lamination Process: Ensure clean substrate surfaces and use proper lamination pressure to achieve strong copper adhesion.

Control the Soldering Temperature: Make use of the preheat process to protect the pads from overheating.

Improve the material quality: Choose the high-strength copper and the outstanding quality substrate to reduce the risk of PCB copper pad peels.

The customer complaints are significantly reduced when Best Technology applies these measures. We have received the repeat orders and the good project results.

How to Do PCB Copper Pad Repair for PCB Factory?

There are several steps to repair the PCB copper pad for peeling.

The first step is to clean the damaged areas.

The second crucial step is to apply the suitable adhesives or epoxy.

The third critical point is to employ the copper foil cut precisely or the compatible pads, instead of using the original pads.

The final point is to make sure that the repaired pads are compatible with the mechanical and electrical standards.

The process can be simplified by using the PCB pad repair kit. Best Technology matches the original pad size strictly and the surface treatment during the repair process. It aims to guarantee that the reliability of the repaired boards is the same as the original boards.

How to Choose the Right PCB Pad Material for Your Project?

Pad material choice affects conductivity, solderability, and long-term performance. For most commercial boards, copper is the standard due to its high conductivity. The plating or coating material—gold, tin, silver—should match your assembly method and storage conditions. For example, ENIG is ideal for fine-pitch SMD pads PCB designs, while HASL may suit cost-sensitive projects.

Best Technology helps customers evaluate these factors to reduce rework rates and extend product lifespan. If you have any further questions, pls contact us at +86-755-2909-1601 or sales@bestpcbs.com.

All in all, the reliability of the PCB copper pad takes center stage in manufacturing. Every process is related to the circuit board quality, from the types of PCB pads, surface treatment, and the measures to tackle the problem of peeling. The manufacturer can improve the issue of pad peeling via proper material selection, strict process control, and viable maintenance methods. Best Technology is 100 percent dedicated to solving the pain point of pad peeling and the rework. With our qualified manufacturing process as per the ISO standard, professional engineers, and the customers’ first service, we are excelling in providing good quality PCBs to the market. If you need to order PCBs or PCBA, just let us know at sales@bestpcbs.com.

Tags:PCB Copper Pad
Posted in best pcb, bestpcb | No Comments »

EV Motor Controller Aluminum PCB | Best Technology

Friday, August 15th, 2025

Why choose aluminum PCB for EV motor controller? Let’s explore design spec and guide, production processes, future trends for EV motor controller aluminum PCB.

Are you worried about these problems?

Frequent high temperature alarms: How can motor controllers operate calmly?
(The aluminum substrate has a thermal conductivity of 180W/m·K, three times that of standard FR4, allowing heat to be dissipated instantly from the metal casing.)
Vehicle vibration can cause cracking in solder joints. How can we prevent them from cracking?
(The aluminum substrate and metal casing have a perfect CTE match, eliminating thermal stress and passing 2000 hours of mechanical shock testing.)
Electromagnetic interference distorts signals. How can we restore good signal?
(The aluminum substrate’s single-point grounding design improves EMC performance by 40%, achieving CISPR 25 certification in one go.)

Best Technology can provide solution and service:

Thermal design outsourcing service—A thermal simulation report is issued within 72 hours, allowing temperature reduction solutions to be directly implemented in PCB layout.
Vibration compensation technology—Exclusive micro-dimpled copper foil technology extends solder joint fatigue life by five times.
EMC Express Repair Channel—Provide impedance adjustment samples within 48 hours, ensuring interference issues are resolved overnight.

Welcome to contact us if you have any request for aluminum PCB: sales@bestpcb.com.

Why Choose Aluminum PCB for EV Motor Controller?

Reasons why choose aluminum PCB for EV motor controller:

Excellent Heat Dissipation, Ensuring Stability: Thermal conductivity is 5–10 times that of FR-4, rapidly dissipating heat from the IGBT (>100W/m·K) and preventing thermal runaway.
High Reliability and Durability: Corrosion-resistant and boasting a wide operating temperature range (-55°C to 125°C), it extends lifespan (MTBF increased by 20%).
Light weighting and Space Optimization: With a density of only 2.7g/cm³, it is 60% lighter than traditional materials, improving energy efficiency.
Electrical Safety and Efficiency: The aluminum substrate provides natural EMI shielding, protecting control signals.
System Cost Advantages: Reduces reliance on heat sinks, lowering hardware costs.

Thermal Dissipation Challenges in EV Motor Controller Aluminum PCB

Heat Accumulation at High Power Density

Challenge: Localized heat generation in power modules exceeds 100W/cm², easily leading to device overheating.
Solution: Use a high-thermal-conductivity aluminum substrate (such as an aluminum nitride ceramic substrate with a thermal conductivity ≥170W/m·K) and optimize the layout of thermal vias to improve heat dissipation efficiency.

Performance Bottlenecks in Thermal Conductive Materials

Challenge: Traditional thermal adhesives have low thermal conductivity, limiting heat dissipation effectiveness.
Solution: Use nano-ceramic-filled thermal adhesives (with a thermal conductivity ≥5W/m·K) or direct bond copper (DBC) technology to reduce thermal resistance.

Non-Uniform Thermal Stress

Challenge: Differences in thermal expansion coefficients between the device and substrate lead to solder layer fatigue.
Solution: Use flexible solder materials (such as silver sintering) to buffer thermal stress and extend service life.

Design Complexity of Liquid Cooling Systems

Challenge: Improper flow channel layout leads to uneven cooling and reduced heat dissipation efficiency.
Solution: Optimize flow channel design through CFD simulation to ensure uniform coolant flow (≥1 m/s) and reduce pressure drop.

Impact of ambient temperature fluctuations

Challenge: Heat dissipation capacity degrades in high-temperature environments, impacting stability.
Solution: Integrate an intelligent temperature control system to dynamically adjust cooling strategies (such as increasing air cooling or reducing load).

Insufficient long-term reliability verification

Challenge: Lack of data on heat dissipation performance degradation after long-term use.
Solution: Accelerated aging tests (such as high-temperature and high-humidity cycling) are used to develop a lifespan prediction model to ensure long-term reliability.

Design Specification for EV Motor Controller Aluminum PCB

Design Dimension	Specification Requirements
Minimum Trace Width/Spacing	Power traces: ≥2.0mm
	Signal traces: ≥0.3mm
	Ground trace spacing: ≤5mm
Insulation Layer Thickness	50-100μm (standard), up to 150μm for high-voltage areas
Copper Foil Thickness	Outer layers: 70-140μm (standard) Inner layers: 105μm (for multilayer boards)
Hole Diameter Tolerance	±0.05mm (mechanical holes), ±0.03mm (laser holes)
Thermal Design	Heatsink contact surface flatness: ≤0.05mm/m
Thermal grease thickness	0.1-0.2mm
Surface Finish	OSP: 0.2-0.5μm ENIG: 0.05-0.1μm gold thickness
EMC Design	Metal layer grounding impedance: ≤0.1Ω
High-frequency signal grounding	trace spacing ≤3mm

EV Motor Controller Aluminum PCB Design Guide

1. Material Selection

Substrate: Use 6061-T6 or 5052-H34 aluminum alloy (thermal conductivity ≥2.0W/m·K). Insulation layer thickness: 50–150µm (thicker for high-voltage areas).
Copper Foil: 3oz (105µm) rolled copper for power circuits; 1oz (35µm) copper for signal layers.
Surface Finish: ENIG (gold thickness 0.05–0.1µm) for high-frequency areas; OSP (0.2–0.5µm) for low-voltage regions.

2. Thermal Management

Power Plane: Embed 3oz copper (covering ≥70% area) in inner layers, connected via 0.4mm via arrays.
Metal Embedding: Place 0.6mm copper blocks under high-power components, with 0.3mm buffer slots.
Liquid Cooling: Integrate 3×3mm² cooling channels filled with gallium-indium alloy (thermal resistance 0.3℃/W).

3. Electrical Layout

High-Voltage Isolation: 8mm clearance for 300V systems; 12mm for 500V systems. Add 2mm safety slots for creepage compensation.
Signal Integrity: Use 45° arcs for high-frequency traces (>100MHz); impedance tolerance ≤±5%.
Power Distribution: Dedicate Layer 6 (for 10-layer boards) as a thermal layer, connected via blind/buried vias.

4. Mechanical Design

Heat Dissipation Posts: Use inverted T-shaped aluminum posts (diameter 8mm) with insulating sleeves.
Clearance Control: Maintain ≥1mm gap between posts and PCB to prevent thermal deformation.
Heatsink Interface: Ensure contact surface flatness ≤50µm; apply nano-thermal paste (thermal resistance 0.1℃·cm²/W).

5. Reliability Verification

Thermal Testing: Infrared inspection under full load (max single-point temperature ≤85℃; delta ≤15℃).
Thermal Cycling: -40℃ to 125℃ for 1000 cycles; via resistance change <10%.
EMC Testing: Grounding impedance ≤0.1Ω; high-frequency signal shielding spacing ≤3mm.

EV Motor Controller Aluminum PCB Design Guide

EV Motor Controller Aluminum PCB Manufacturing Processes

1. Cutting‌

Cut large-sized aluminum PCB raw materials into production dimensions. Special attention should be paid to protecting the aluminum and copper surfaces to avoid scratches. Check for delamination or burrs at the edges.

2. Drilling‌

Perform positioning drilling on the board to provide auxiliary support for subsequent processes and customer assembly. Verify the quantity and diameter of holes to avoid scratching and check positional deviation.

3. Dry/Wet Film Imaging‌

Through grinding, lamination, exposure, and development, create the required circuit patterns on the board. Check for open circuits after development, alignment deviations, and prevent dry film residue.

4. Acid/Alkaline Etching‌

Etch away unwanted copper parts after imaging, leaving only the required circuits. Monitor for incomplete or excessive etching, and verify line width and spacing.

5. Solder Mask & Legend Printing‌

Apply solder mask and legends via screen printing, pre-baking, exposure, and development. Inspect for contaminants, clean stencils, and ensure uniform thickness.

6. V-Cut & Routing‌

Separate individual PCBs from the panel using V-Cut and routing. Check V-groove dimensions, edge defects, and burrs while avoiding surface scratches.

7. Testing & Surface Treatment

Conduct electrical and voltage resistance tests, then apply OSP (Organic Solderability Preservative) for better solderability. Distinguish between good and defective units without damaging traces.

8. FQC & FQA

Perform full inspection (FQC) and sampling inspection (FQA), then package and ship. Confirm packaging quantities to prevent mix-ups, errors, or damage.

EV Motor Controller Aluminum PCB Manufacturing Processes

Future Trends of EV Motor Controller Aluminum PCB

Continuously Upgraded Thermal Management Performance

Aluminum substrates will utilize composite materials with higher thermal conductivity (such as ceramic-filled aluminum substrates), significantly improving the heat dissipation efficiency of motor controllers under high-current conditions, preventing overheating and failure of power devices, and extending vehicle life. This reduces system cooling costs, enhances controller reliability, and reduces after-sales maintenance requirements.

Automated Production Drives Cost Optimization

Through AI-driven automated production lines (such as intelligent optical inspection and precision etching), aluminum substrate manufacturing yields will increase by over 15%. 48-hour rapid prototyping services are also supported, accelerating customer product iteration.

Modular Design Enhances Compatibility

Aluminum substrates will support standardized interfaces and customized functional area divisions (such as power and signal area wiring), enabling customers to flexibly adapt to motor controller platforms of varying power levels and achieve “one board, multiple models” development.

High-Density Integration and Light weighting Breakthroughs

Utilizing 3D stacking and microvia technology (HDI process), aluminum substrate wiring density is increased by 40%, while ultra-thin aluminum layers (≤0.8mm) achieve a 30% weight reduction, meeting the requirements of compact motor compartment layouts.

Enhanced adaptability to extreme environments

Through surface nano-coating and alloy substrate optimization, the aluminum substrate can withstand temperature shocks of -40°C to 150°C and 1000 hours of salt spray corrosion, adapting to all climate conditions of electric vehicles.

Our EV Motor Controller Aluminum PCB Case Studies

At Best Technology, we are deeply engaged in the field of aluminum substrates for electric vehicle motor controllers, successfully delivering hundreds of high-reliability projects, covering the full range of scenarios from 48V mild hybrid to 800V high-voltage platforms. Leveraging sophisticated thermal management design, stringent process control (such as nano-coating insulation and integrated micro-channel liquid cooling), and ISO/TS 16949-certified intelligent manufacturing capabilities, we provide customized solutions with high power density and long lifecycles to customers worldwide. Here is a photo of EV motor controller aluminum PCB we made before:

Item‌ ‌	Specification‌
‌Product Name	High-Thermal-Conductivity Aluminum PCB for EV Motor Controllers
‌‌Base Material‌	Aluminum Substrate: 6061-T6 High-Thermal Aluminum (Thermal Conductivity ≥180W/m·K)
Insulation Layer	Nano-Ceramic-Filled Epoxy Resin (Withstand Voltage ≥4kV)
Thickness‌	Total Thickness: 1.5mm/2.0mm/3.0mm (Copper Layer Thickness: 35μm/70μm)
‌Solder Mask‌	Green Solder Mask, Thickness 25±5μm, Heat Resistance ≥260℃
Legend Marking‌	White/Yellow Characters, Alcohol-Resistant, Line Width ≥0.2mm
‌Surface Finish	OSP (Organic Solderability Preservative), Thickness 0.2-0.5μm, Meets IPC-6012
‌Key Processes‌	Etched Line Width Tolerance ±10%
Application‌	EV Motor Controllers

Why Choose Best Technology as Aluminum PCB Manufacturer?

Dual Quality Certification: IATF 16949 (automotive) + optional ISO 13485 (medical) compliance.
Premium Material Innovation: 8W/m·K aluminum nitride substrates, 4kV ceramic-filled insulation for high-power safety.
Cost-Optimized Supply Chain: 15-20% cost reduction via direct sourcing; tiered discounts (5% for 500+ units).
24-Hour Rapid Prototyping: Laser-cut prototypes with free DFM checks, reducing rework by 40%.
Turnkey Solution: Provide EV motor controller PCB one stop service, including prototyping, design, bulk production, assembly.
Full-Stack Engineering Support: ANSYS thermal simulation + EMC pre-scan (CISPR 25/DO-160 standards).
Extreme Environment Resilience: -40°C to +125°C operation; 20G vibration resistance; 1,000-hour damp heat testing.
Precision Manufacturing: ±3μm laser microvias; 2oz (70μm) copper for 200A+ current paths.
24/7 Technical Escort: 4-hour response for thermal runaway; 72-hour root-cause analysis.

Welcome to contact us if you have any inquiry for aluminum PCB: sales@bestpcbs.com.

Tags:aluminum pcb, EV motor controller
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What is bendable aluminum substrate? Flexible Aluminum PCB

Friday, August 15th, 2025

Bendable aluminum substrate is a metal-based copper-clad laminate with folding or bending functions. It is bent and shaped through a special process. It has the advantages of good thermal conductivity, lightweight, and bending resistance. It is mainly used in the bendable structure of LED lamps and lightweight foldable components of electronic devices such as mobile phones.

What is bendable aluminum substrate? Flexible Aluminum PCB

Are you curious about:

What are the core advantages of bendable aluminum substrates?
How many bends can they last?
What is their heat dissipation performance?
What applications are they generally suitable for?

BEST Technology can provide you with high-performance bendable aluminum substrates. Our aluminum substrates offer the following properties:

High heat dissipation from the aluminum substrate combined with flexibility and bendability, ensuring both heat dissipation and surface adaptability.
Dynamic bending resistance of ≥80,000 times (R=1.5mm), ensuring continuous circuitry.
The aluminum substrate’s thermal conductivity and high adhesive layer provide a thermal resistance of ≤1.0°C/W, improving heat dissipation by 25% or more compared to ordinary flexible substrates.
LED flexible light strips, curved automotive lights, wearable devices, and other applications require both bending and heat dissipation.

What is flexible aluminum substrate?

Flexible aluminum substrate is a special type of circuit board base that uses bendable aluminum as its core layer. Unlike traditional rigid aluminum PCBs, these substrates are engineered to withstand controlled bending without cracking or losing structural integrity.

In PCB manufacturing, the substrate acts as the backbone. It supports copper traces, dissipates heat, and maintains mechanical stability. With bendable aluminum, you get all the advantages of aluminum’s high thermal conductivity and durability—plus the added ability to shape or curve the board during assembly or installation.

This property is particularly valuable in LED lighting strips, automotive electronics, aerospace control systems, and wearable devices. It allows products to fit into tighter spaces, wrap around surfaces, or follow curved housing designs without sacrificing performance.

What grades of bendable aluminum sheets are available?

Not all aluminum grades can be bent easily. The alloy composition and temper determine flexibility. Here are common grades relevant to PCB substrates:

1050 and 1100 Series

High-purity aluminum with excellent corrosion resistance.
Very good bendability, suitable for tight radius bends.
Often used for applications needing high ductility.

3003 Aluminum

Alloyed with manganese for better strength than 1100.
Maintains good bending properties.
Common in lighting and decorative PCB applications.

5052 Aluminum

Stronger than 3003, with excellent corrosion resistance.
Good formability, works well for medium bend radii.
Often selected for outdoor electronics or marine-grade designs.

6061 Aluminum

High strength but less ductile than 5xxx series.
Bendable in annealed tempers (O-temper) but more difficult in T6.
Ideal for structural applications where mechanical strength is critical.

6063 Aluminum

Good surface finish and corrosion resistance.
Easier to bend than 6061 in certain tempers.
Often used in heat sink-integrated boards.

Key takeaway: When choosing a grade, balance strength, bend radius, and thermal performance. In PCB manufacturing, 3003, 5052, and 6063 are common for bendable aluminum substrates.

How to test a bendable aluminum sheet?

Testing ensures the sheet meets your mechanical and thermal requirements before it becomes part of a PCB. Here are standard methods:

Bend Test: The sheet is bent to a specified radius and checked for cracks or surface deformation. For PCBs, smaller radii require more ductile alloys.

Elongation Test: Measures how much the aluminum can stretch before breaking. Higher elongation values mean better bendability.

Hardness Test: Indicates resistance to deformation. Softer aluminum generally bends more easily.

Thermal Cycling Test: Exposes the material to repeated heating and cooling to simulate operating conditions.

Surface Adhesion Test: Checks how well dielectric and copper layers adhere after bending.

These tests help engineers confirm that flexibility does not compromise thermal conductivity or copper adhesion.

How to make bendable aluminum substrate?

The process combines materials science and precision PCB manufacturing.

Select the Aluminum Core: Choose the alloy and thickness based on bending needs. Thinner cores bend more easily but handle less load.

Apply the Dielectric Layer: High thermal conductivity insulation is laminated onto the aluminum. Materials like polyimide or flexible epoxy composites are used.

Add Copper Foil: The copper layer is laminated and patterned through photolithography and etching.

Protect with Solder Mask: Flexible solder mask layer shields the copper and dielectric.

Final Forming: Boards may be partially formed before delivery, or bent during final assembly.

Special care is needed in temperature control, lamination pressure, and adhesive selection. Poor processing can cause delamination when bending, so experienced BEST Technology use advanced bonding techniques.

What are the benefits of bendable aluminum substrate?

The benefits go beyond just flexibility:

Superior Heat Dissipation: Aluminum’s high thermal conductivity allows efficient heat transfer away from heat-generating components.

Lightweight Strength: Maintains structural integrity even at reduced thickness.

Design Freedom: Enables curved or irregular shapes without multiple rigid sections.

Long Service Life: Resistant to corrosion, vibration, and impact.

Reduced Assembly Costs: A single bendable board can replace multiple interconnected rigid boards.

For manufacturers, this means better performance and simpler mechanical integration. For buyers, it means lower total cost and fewer failure points.

What are the applications of bendable aluminum substrate?

Applications span high-reliability and thermally demanding fields:

LED Lighting: Flexible mounting in architectural, automotive, and display lighting.

Automotive Electronics: Curved dashboard PCBs, lighting assemblies, and under-hood electronics.

Aerospace Systems: Weight-saving designs that fit tight spaces.

Wearable Medical Devices: Flexible yet robust circuits for monitoring and control.

Industrial Controls: Machines that require boards to wrap around mechanical housings.

In each case, the bendable aluminum substrate provides both mechanical adaptability and reliable heat management.

Does bending reduce the strength of aluminum substrate?

Yes, but the effect depends on alloy, temper, and bend radius. When aluminum is bent, it undergoes work hardening, which increases strength in the bend area but can also reduce ductility.

If bending exceeds the material’s formability limit, micro-cracks can form, reducing fatigue life. That’s why BEST Technology design for the proper bend radius based on alloy properties and thickness.

In practice, when using recommended bend parameters and high-quality processing, the strength loss is minimal for most PCB applications.

Why choose BEST Technology to make bendable aluminum substrates?

BEST Technology Co., Ltd. has been a trusted PCB and substrate manufacturer since 2006. We understand that buyers need more than just a supplier—they need a partner who delivers consistent quality.

Our advantages:

Material Expertise: We work with multiple aluminum grades, ensuring the right balance of flexibility and performance.

Precision Manufacturing: Our process maintains ±0.05mm dimensional accuracy, even in bendable designs.

Thermal and Mechanical Reliability: Each substrate undergoes strict bend, adhesion, and thermal tests.

Fast Turnaround: Average delivery in 7 days, faster than the industry standard.

Global Experience: Serving industries in Asia, Europe, and North America with OEM and ODM capabilities.

When you choose BEST Technology, you get a bendable aluminum substrate designed to last—and a team committed to your project’s success.

Do you need BEST Technology to make a bendable aluminum PCB for you? We are waiting for your information, please contact us: sales@bestpcbs.com

Tags:bendable aluminum plate, bendable aluminum substrate
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB, PCB Technology, Rigid Flex Circuit | No Comments »

4-Layer Rigid Flex PCB Design & Manufacturer, Fast Delivery

Friday, August 15th, 2025

What is a 4-layer rigid flex PCB? Let’s explore its stackup, thickness, benefits, applications, design guide and manufacturing processes through this blog.

Are you troubled with these issues?

Is the line impedance fluctuation exceeding the standard after the product is bent? (Precision impedance control is used on rigid-flex boards, ensuring fluctuations of <5% after bending)
Is stress concentration causing cracking during multi-module assembly? (A four-layer stepped transition design distributes 90% of mechanical stress)
Is crosstalk severe during high-speed signal transmission? (Embedded shielding layer + differential pair routing, crosstalk suppression -50dB)

Best Technology can provide service:

Intelligent DFM Platform: Automatically detects design flaws and generates 3D assembly simulation videos
Hot-Compression Process Library: Provides six compression profiles, increasing yield to 99.2%
Full-Process Dashboard: Real-time display of 12 process statuses, including substrate cutting, lamination, and electroplating

Welcome to contact us if you have any request for rigid flex PCB: sales@bestpcbs.com.

What Is a 4-Layer Rigid Flex PCB?

The 4-Layer rigid flex PCB is a composite board made by combining a flexible printed circuit board (FPC) and a rigid printed circuit board (PCB) through a special process, which has the characteristics of both. Its core structure usually includes a four-layer design, with the middle two layers being flexible areas and the two sides being rigid areas. The rigid-flex combination is achieved through a lamination process.

4 Layer Rigid Flex PCB Stackup

Layer 1 (Top): Rigid signal layer (routing + key components)
Layer 2 (Inner Layer 1): Flexible ground layer (PI substrate, providing shielding and mechanical support)
Layer 3 (Inner Layer 2): Flexible signal layer (low-speed/auxiliary signals, optimizing routing density)
Layer 4 (Bottom): Rigid power/ground plane (FR4, reducing noise coupling)

How thick is a 4-Layer Rigid Flex PCB?

A 4-layer rigid-flex PCB typically has a total thickness range of 0.8mm to 1.6mm, depending on the design requirements and material combinations. Rigid sections (FR4) usually measure 1.2mm thick, providing structural support. Flex sections (polyimide) are much thinner, commonly 0.1mm, allowing bending and flexibility. The overall thickness is influenced by the copper weight (e.g., 1oz for signal layers, 2oz for power/ground planes) and dielectric material (FR4 or prepreg) used in the stackup.

Why Use 4-Layer Rigid Flex PCB?

Advantages of 4-layer rigid flex PCB:

Space and Routing Optimization: A layered design separates signal and power planes, increasing wiring density and making it suitable for compact devices like smartphones.
Signal and Electromagnetic Performance: Adjacent power/ground layers reduce noise, and thick inner copper ensures stable high-speed signal transmission.
Efficient Thermal Management: The inner copper foil evenly dissipates heat, and thermal vias enhance reliability in high-temperature environments.
Mechanical and Durability: A rigid-flexible structure reduces bending failures, and a multi-layered, vibration-resistant design is suitable for industrial applications.
Design and Cost Balance: Customized stacking optimizes performance and cost, while eliminating cables and streamlining the assembly process.

When to Use 4 Layer Rigid Flex PCB?

Applications of 4 Layer Rigid Flex PCB:

High-Density Electronic Devices – Smartphones, tablets, and wearables requiring compact layouts with dynamic bending zones.
Automotive Electronics – Dashboard control units and sensors exposed to vibration and temperature fluctuations.
Medical Devices – Implantable monitors and portable diagnostics needing lightweight, biocompatible designs.
Aerospace Systems – Avionics and satellite components demanding weight reduction and shock resistance.
Industrial Robotics – Articulated arms with repeated motion joints requiring durable yet flexible interconnections.
Consumer Electronics – Foldable displays and rotating-camera mechanisms necessitating 3D PCB solutions.

How to Design a 4-Layer Rigid Flex PCB?

Here are 4-layer rigid flex PCB design guide:

1. Layer Stackup & Material Selection

Rigid Zones: Use FR4 substrate (1.6mm thickness) for structural integrity.
Flex Zones: Opt for polyimide substrates (e.g., DuPont Pyralux AP/LF/FR) with 0.1–0.3mm thickness to accommodate dynamic bending.
Copper Type: Rolled Annealed (RA) copper for flex layers to ensure ≥100,000 bend cycles.
Coverlay: Match coverlay thickness to copper weight (0.5oz Cu → 1mil coverlay; 1oz Cu → 1.5mil coverlay).

2. Bend Radius Calculation

Formula: Minimum bend radius R=t×K, where t = total flex-zone thickness, K = layer-dependent coefficient (single-layer K=6–10; dual-layer K=10–15; four-layer K=20–50).
Example: For a 0.29mm four-layer flex zone, dynamic bend radius must be ≥5.8mm to prevent copper cracking.

3. Routing & Impedance Control

Signal Layer Allocation: Place high-speed signals (e.g., DDR, PCIe) on outer layers (L1/L4); use inner layers (L2/L3) for power/ground planes.
Trace Rules: Follow IPC-2223 standards (e.g., 70µm trace width/90µm spacing for 0.5mm BGA).
Microvias: Use laser-drilled microvias (≤0.1mm diameter) with copper-filled construction (IPC-4761 Type VII).

4. Mechanical & Thermal Design

Transition Zones: Implement “key-and-slot” designs or plastic frames to reduce stress concentration at rigid-flex junctions.
Thermal Management: Use ≥1oz copper in power/ground planes; add thermal via arrays (spacing ≤1mm) for heat dissipation.
Component Reinforcement: Add stiffeners (Kapton or aluminum, <10mil thickness) under flex-zone components to mitigate soldering stress.

5. Manufacturing & Testing Standards

IPC Compliance: Meet IPC-6013 Class 3/A requirements via 100% electrical testing, AOI, and X-ray inspection.
Reliability Tests: Conduct thermal shock (-40°C to 125°C), vibration (≥20G random), and bend cycle (≥1000 iterations) validations.

How to Make a 4-Layer Rigid Flex PCB?

Below are 4-Layer rigid flex PCB manufacturing processes:

Flexible Circuit (Flex) Processing

1. Shearing: Cut raw flex material (e.g., polyimide w/ copper) to size.
2. Drill: Use CNC to drill holes for layers/connections (4 – layer flex → holes for interlayer links).
3. PTH: Plate copper inside drilled holes (electro/electroless plating) for layer connectivity.
4. Dry Film Lamination: Apply photosensitive dry film (heat/pressure) as etching mask.
5. Develop: UV – expose film, wash off unexposed areas.
6. Etch: Remove unmasked copper (acid bath) to form traces.
7. Strip: Chemically remove remaining dry film.
8. AOI: Scan for defects (opens, shorts, wrong trace widths) via automated optical inspection.

Rigid Circuit (Rigid) Processing

1. Shearing: Trim raw rigid material (e.g., FR – 4) to panel size.
2. Drill: CNC – drill holes for components/vias.
3. Dry Film Lamination: Apply dry film (heat/pressure) as etching mask.
4. Develop: UV – expose, wash unexposed film.
5. Etch: Acid – etch unmasked copper to create traces.
6. Strip: Remove leftover dry film.
7. AOI: Check for defects (bad traces, opens/shorts) with automated optics.

Flex + Rigid Integration

1. 2nd Drill: Add holes for final connections (flex – rigid alignment, new vias).
2. De – Burr: Remove drill burrs (brush/chemical).
3. De – smear: Clean drill residues from holes (solvent/plasma).
4. PTH: Plate copper in new holes (electro/electroless) for cross – layer links.
5. DES: Repeat develop/etch/strip to shape integrated traces (flex + rigid).
6. AOI: Verify no misalignments/shorts between flex + rigid sections.
7. Solder mask: Apply liquid polymer, UV – expose, develop to protect non – solder areas.
8. Surface Finish: ENIG/ HASL
9. Silkscreen: Print ink (stencils) for labels, part markers.

Final Assembly

1. 2nd Pressing: Bond stiffeners (if needed) via heat/pressure.
2. Flex + Rigid Align: Use fixtures/optics to align flex + rigid sections.
3. FQC: Final visual/dimensional check (no misalignments, good solder mask).
4. Coverlay: Laminate protective film (polyimide) on flex areas (heat/pressure).
5. 2nd Drill: Add final holes (connectors, mounting).
6. Outline Rout: Cut board to final shape (CNC routing/punching).
7. PCB Separate: Split multi – panel boards (routing/punching).
8. E – Test: Check for opens/shorts/impedance issues.
9. Stiffener Attach: Add mechanical supports (if needed) to flex zones.
10. Packing: Seal in anti – static bags/trays (protect from damage/ESD).

Why Choose Best Technology as Rigid Flex PCB Manufacturer?

International Certifications: ISO 9001/UL/IATF 16949/RoHS certified, with medical-grade ISO 13485 support.
High-End Technical Capabilities: Supports 32-layer board design with a minimum line/space width of 0.0762mm, compatible with HDI and high-frequency materials (such as Rogers RO4350B).
High-Quality Materials: The flexible area utilizes DuPont polyimide substrate with rolled copper (≥100,000 flex cycles) to ensure durability.
Strict Quality Inspection: 100% electrical testing + AOI + X-ray inspection, compliant with IPC-6013 Class 3/A, with impedance control accuracy of ±5%.
24 Hours Rapid Prototyping: Standard orders are completed within 7 days, expedited orders within 3 days, with two free prototype verifications per month.
Flexible Custom Design: Supports 4-layer rigid + 2-layer flex stack-ups, blind and buried vias, metal edges, and other special processes.
Free Technical Support: Design-for-Function (DFM) checks and optimization, with 24/7 engineer assistance for impedance matching and thermal management.
Cost-effective solution: Tiered pricing for bulk orders (e.g., 6-ply panels at $200/10), and intelligent panelization reduces material waste by 15-20%.
End-to-End Service: Support rigid-flex PCB prototyping, design, manufacturing, assembly service and help you reduce time and production cost a lot.

Our Rigid-Flex PCB Capabilities

Parameter Category	Parameter Name	Parameter Value
Flexible Layer Count	Layer Range	1-10 layers
Flexible Layer Count	Configuration	Bonded or Air Gap
Rigid Layer Count	Layer Range	1-40 layers
Total Layer Count	Layer Range	2-50 layers
Flexible Core Material	Material Type	Polyimide (PI)
	Thickness Range	0.5 mil to 4 mils
	Adhesive Construction	Adhesive or Adhesiveless
Copper Thickness	Flexible Circuit	1/3 oz – 2 oz (RA or ED Copper Foil)
Copper Thickness	Rigid Circuit	0.5 oz to 10 oz
Coverlay	Material Type	Polyimide (PI)
Coverlay	Thickness Range	0.5 mil to 2 mils
Stiffener Material	Material Type	Polyimide (PI), FR4, Stainless Steel, Aluminum
Rigid Material	Material Type	FR4 (TG 130/170/180), Low Flow Prepreg
EMI/RF Shielding	Shielding Film	EMI/RF Shielding Films
Special Via Structures	Blind Vias & Buried Vias	Supported
Special Via Structures	Any Layer Interconnect	Supported
Controlled Impedance	Impedance Values	50Ω, 90Ω, 100Ω, 110Ω, and Custom Values
Surface Finishing	Process Types	ENIG, ENEPIG, Gold Plating, Gold Fingers (3-30µ” Au), Immersion Silver
IPC Standard	Certification Levels	IPC 6013 Class II & Class III Available

How Can I Get a Quote for a 4 Layer Rigid-Flex PCB?

Essential Documents to Submit for Quotation

1. Gerber Files

Include all layers (L1-L4) in 274X format with drill files.
Specify rigid/flex zones and bend areas in layer notes.

2. Stackup Diagram

Detail material thickness (e.g., FR4 for rigid, polyimide for flex).
Copper weight (e.g., 1oz inner layers, 0.5oz flex zones).

3. Technical Specifications

Board dimensions (±0.1mm tolerance).
Min. trace/space (e.g., 4/4mil for rigid, 5/5mil for flex).
Surface finish (e.g., ENIG, immersion gold).

4. Special Requirements

Impedance control (e.g., ±10% for 50Ω signals).
Stiffener locations (e.g., FR4 at connector areas).

5. Quantity & Lead Time

Prototype (5-10pcs) or bulk order (e.g., 1k pcs/month).
Urgency (standard 15 days or expedited 7 days).

Contact Best Technology with your project details for a competitive quote for rigid-flex PCB needs: sales@bestpcbs.com.

Tags:4 layer rigid flex PCB, 4-Layer Rigid Flex PCB
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