Archive for the ‘best pcb’ Category

Bare Copper PCB, Blank Copper PCB Board Manufacturer

Friday, August 1st, 2025

What is bare copper PCB? Let’s explore its benefits, applications, design guide, design spec, manufacturing process, manufacturer selection methods.

Are you worried about these problems?

Is your device overheating and throttling? — Do traditional FR-4 boards always force you to prioritize cooling under high load?
Is heat generation high in a small space? — In the pursuit of thinness and lightness, are performance or reliability sacrificed due to insufficient heat dissipation?
Is cooling cost difficult to control? — Does adding heat sinks and fans increase the BOM cost with limited effectiveness?

Best Technology can provide solutions

Metal-Based Thermal Conductivity: Aluminum/copper substrates offer 5-10 times higher thermal conductivity, enabling rapid heat dissipation and stable operation in high-temperature environments.
Compact Design: Integrated metal-based molding eliminates the need for additional heat dissipation components, improving space utilization by 30%.
Total Cost Optimization: Reduces procurement and assembly costs for cooling modules, reducing overall lifecycle costs by 20%.

Welcome to contact us if you have any request for copper base PCB: sales@bestpcbs.com.

What Is Bare Copper PCB?

A Bare Copper PCB is an uncoated circuit board where the raw copper layer remains fully exposed. Stripped of traditional surface finishes like gold or tin plating, this design maximizes copper’s inherent properties, exceptional conductivity (5.9×10⁷ S/m) and thermal dissipation (400W/m·K). Ideal for high-frequency applications like 5G and power electronics, it offers cost savings (15-20% reduction) while maintaining signal integrity by eliminating plating-induced signal loss.

What Are Advantages of Blank Copper PCB?

Cost Efficiency – No additional surface finish (e.g., ENIG, HASL) reduces manufacturing costs by 15–30%.
Superior Conductivity – Pure copper provides low resistance, ideal for high-speed signals and low-loss power transmission.
Enhanced Thermal Performance – Natural copper thermal conductivity (385 W/m·K) efficiently dissipates heat in high-power applications.
Design Flexibility – Untreated surface allows easy modification (e.g., etching, soldering) during prototyping or customization.
Environmental Compliance – Avoids chemical coatings, reducing hazardous waste and aligning with RoHS/REACH standards.
Rapid Prototyping – Simplified production process shortens lead times for testing and iterative design.
Mechanical Durability – Thick copper layers (e.g., 2oz/70μm) resist warping and physical stress in rugged environments.

What Are Applications of Blank Copper PCB Board?

Prototyping & Rapid Iteration: Cost-effective for testing circuit designs before finalizing surface finishes.
High-Power Electronics: Used in power supplies, motor controllers, and LED drivers for efficient heat dissipation.
RF/Microwave Circuits: Ideal for antennas, filters, and amplifiers due to low signal loss from pure copper.
Custom DIY Projects: Flexible for hobbyists to modify traces, solder components, or experiment with layouts.
Thermal Management Systems: Integrated into heat sinks, LED backlights, or high-current connectors.
Educational & Training Tools: Teaches PCB basics, soldering, and circuit design without complex coatings.
Eco-Friendly Devices: Suits RoHS-compliant products avoiding chemical finishes (e.g., medical devices).

Bare Copper PCB Design Guide

1. Material Selection

Substrate: FR4 (general-purpose), polyimide (high-temperature/flexible), aluminum substrate (high-thermal).
Copper Thickness: 0.5oz (17μm) to 3oz (105μm), tailored to current requirements (2oz supports ~2A/mm).

2. Layer Stackup

Recommended 4-Layer Structure: Signal layer – ground layer – power layer – signal layer, ensuring low-impedance paths.
Ground Plane Priority: Assign dedicated ground planes in inner layers; minimize signal loop areas.

3. Thermal Management

Copper Layout: Use wide copper traces (≥1.5mm width) for high-current zones; leverage copper’s thermal conductivity (385 W/m·K).
Thermal Vias: Add thermal vias (0.3mm diameter, 30μm plating) to connect copper layers and dissipate heat.

4. ESD Protection

Grounding: Cover critical areas with ground planes; connect connector shells to isolated ground pads via short traces.
Protection Devices: Place TVS diodes (≥15kV) near I/O ports; keep TVS-to-ground paths ≤2mm.
Layout Isolation: Keep sensitive components (e.g., CMOS ICs) away from board edges; use copper rings for shielding.

5. Manufacturing & Compliance

Copper Thickness Tolerance: Control etching accuracy (±10%) to avoid impedance deviations.
RoHS Compliance: Prohibit lead/mercury; use halogen-free substrates.

6. Signal & Power Design

Signal Traces: Route high-speed signals adjacent to ground planes; match differential pair impedance (90–100Ω).
Power Distribution: Use wide copper traces (≥2mm) for low voltage drop; place decoupling capacitors (0.1μF) near power pins.

7. Testing & Validation

ESD Testing: Meet IEC 61000-4-2 standards (contact 8kV, air 15kV).
Thermal Simulation: Validate high-current area temperature rise (target ≤10°C).

Bare Copper PCB Design Specification

Category	Specification
Surface Finish	Uncoated bare copper (oxidation prevention recommended)
Electrical	Conductivity: 5.9×10⁷ S/m Current Capacity: 30% higher than coated traces
Thermal	Thermal conductivity: 400W/m·K Max operating temp: 150°C (continuous)
Design Rules	Min trace width: 6mil (0.15mm) Min hole size: 0.25mm
Layer Options	Single/Double-sided only (multilayer requires special processing)
Signal Integrity	Skin effect optimized for >10GHz RF applications
Manufacturing	Requires: – No-plate drill process – Direct copper bonding

Blank Copper PCB Manufacturing Processes

1. Design & Layout: Generate Gerber files with copper trace widths, spacing, and layer stackup (single/double-sided or multilayer).
2. Material Preparation: Cut substrate (FR4, polyimide, or aluminum) to board size. Apply adhesive for multilayer boards.
3. Drilling: Use CNC to drill via/component holes. Tolerance: ±0.05mm.
4. Through-Hole Plating: Electroplate copper into holes (thickness: 15–25μm) to connect layers.
5. Outer Layer Imaging: Coat with photoresist, expose to UV through artwork mask, develop to define traces.
6. Etching: Remove unprotected copper using alkaline etchant (e.g., ammonium persulfate).
7. Solder Mask (Optional): Apply liquid photoimageable solder mask, expose, and develop to protect copper.
8. Testing: Electrical test (flying probe/fixture) for shorts/opens. AOI inspection for trace integrity.
9. Routing & V-Scoring: Cut board to final dimensions using CNC router.
10. Packaging: Vacuum-seal boards with desiccant to prevent oxidation.

How to Choose A Blank Copper PCB Manufacturer?

Methods about how to choose a bare copper PCB manufacturer:

Technical Capability Verification: Layer & Copper Thickness

Confirm support for multi-layer boards (e.g., 12–40 layers) and thick copper (≥2oz/70μm). Check minimum trace width/spacing (e.g., 3mil/0.0762mm) and via diameter (≥0.2mm).

Certification & Compliance

Prioritize manufacturers with ISO 9001 (quality), UL (safety), IATF 16949 (automotive), and RoHS (environmental) certifications. Ensure compliance with IPC-6012 (rigid PCB performance) and MIL-P-13949G (military/aerospace) if applicable.

Production Capacity & Delivery

Prototyping Speed: Look for 24-hour prototyping or faster for urgent projects.
Scalability: Ensure capacity for mass production (e.g., multiple automated production lines).

Quality Control

Testing: Require electrical testing (flying probe/fixture) and AOI inspection for defect detection.
Material Control: Verify copper thickness tolerance (±10%) and substrate quality (FR4/polyimide).

Industry Experience

Choose manufacturers with proven expertise in your sector (e.g., automotive, medical, or high-speed designs). Review case studies or client testimonials for validation.

Cost & Supply Chain

Compare pricing models for small/medium batches. Opt for manufacturers with scalable production to reduce per-unit costs. Consider geographic proximity to minimize logistics expenses.

Communication & Support

Assess responsiveness to technical queries and post-sales service. Ensure clear warranty terms and defect resolution processes.

Step-by-Step Selection Process

Define Requirements: Specify layer count, copper thickness, delivery timeline, and certifications.
Shortlist Candidates: Use industry directories or trade platforms to filter by capabilities.
Request Quotes & Samples: Provide design files for cost estimation and test sample evaluation.
Audit Factories: Inspect equipment (e.g., automatic plating lines) and quality control processes.
Pilot Order: Place a small order to validate quality and delivery reliability.
Finalize Partnership: Negotiate contracts with manufacturers meeting all criteria.

How to Get A Quote For Copper PCB Project?

Required Documents for Quote:

1. Design Files

Submit Gerber files (RS-274X format) with layer stackup, copper traces, and drill data.
Include BOM (Bill of Materials) if components are pre-sourced.

2. Technical Specifications

Board Details: Dimensions, layers (single/double/multilayer), copper thickness (0.5oz–3oz).
Material: FR4, polyimide, or aluminum substrate.
Surface Finish: Specify bare copper or optional coatings (ENIG, HASL).

3. Quantity & Deadline

Provide order volume (prototypes, small batch, or mass production).
Clarify delivery timeline (urgent orders may incur priority fees).

4. Special Requirements

Highlight ESD protection, thermal via density, or compliance standards (RoHS, UL).

Why Choose Best Technology?

Expertise: 19+ years in copper PCBs, supporting 40-layer boards and 6oz thick copper.
Speed: 2-hour quote response and 24-hour prototyping.
Quality: Full IPC-6012 compliance and AOI/electrical testing.

Tags:bare copper PCB, blank copper PCB board
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What is Exposed Copper on PCB? PCB Exposed Copper Edge

Friday, August 1st, 2025

When looking at a printed circuit board (PCB), you may notice shiny areas of metal that aren’t covered by the usual green or colored solder mask. These are areas of exposed copper on PCB, and they serve important roles in how the board functions. Exposed copper can be found on pads, traces, or even along the edges of the board. But why is the copper left uncovered? And how do you design a PCB to safely include exposed copper?

In this article, we’ll explore the meaning, purpose, types, and design considerations for exposed copper on PCB, including how to manage its risks and where it’s commonly used.

What is Exposed Copper on PCB? PCB Exposed Copper Edge

What Does Exposed Copper on PCB Mean?

In a PCB, exposed copper refers to areas where the copper layer is intentionally left uncovered by solder mask or surface finish. Normally, copper traces and pads are coated with a protective layer to prevent oxidation and corrosion. However, in certain parts of the board, copper is left exposed for electrical or mechanical reasons.

You’ll typically see exposed copper in places where components need to be soldered or where the board makes direct contact with another surface, such as in connectors or test points. These areas must have direct electrical contact, and that means the copper needs to remain accessible.

Where Is Copper Usually Exposed?

Component pads: These areas must be exposed for soldering.
Test points: Used for measuring signals during testing.
Thermal reliefs: Copper areas used to help dissipate heat.
Edge connectors: Known as pcb exposed copper edge, these are found on plug-in boards.
Copper pours: Large copper areas, sometimes left exposed to improve thermal or grounding performance.

Purpose of Designing Exposed Copper on PCB

Designing with exposed copper is a common and often necessary practice. Below are some of the most common reasons designers choose to expose copper on a PCB.

1. Electrical Contact

Soldering requires exposed copper. All component pads, whether for surface mount or through-hole components, need to be bare so solder can properly adhere and form a good electrical connection.

In addition to pads, test points are exposed copper areas used during assembly and troubleshooting. Probes can be placed on these spots to measure voltages or signals.

2. Thermal Management

Copper is an excellent conductor of heat. In high-power applications, such as LED lighting, motor drivers, or power supplies, leaving copper exposed can help manage heat by allowing it to dissipate more efficiently. Large exposed copper plates can act like heat sinks.

3. Grounding and Shielding

In many designs, especially in radio frequency (RF) or high-speed digital circuits, exposed copper design PCB layouts include areas for grounding or electromagnetic interference (EMI) shielding. A pcb exposed copper edge can also be connected to ground and used as part of the shielding structure to protect signal integrity.

4. Cost Considerations

Leaving copper exposed in non-critical areas can reduce costs. Surface finishes like ENIG or HASL add expense, so in low-cost or temporary boards, some copper may be left bare to save on manufacturing steps.

Types of Exposed Copper PCB Designs

There are several ways exposed copper is used in PCB layouts, each serving a specific function depending on the design goals. Below are the most common types you’ll find, along with their applications and things to watch out for.

1. Exposed Copper Pads

Exposed copper pads are the most widely used type of exposed copper in any PCB. These are the metal areas where components are soldered onto the board. By design, they must remain uncovered to allow solder to create a solid electrical and mechanical connection between the component leads and the PCB’s copper layers.

In addition to component soldering, some exposed pads are used for mechanical support or to connect heat-generating parts to large copper pours for better heat dissipation. Proper surface finish on these pads—such as HASL or ENIG—helps prevent oxidation and improves solderability.

2. Exposed Copper Traces

In some designs, traces (the thin copper lines connecting different components) are intentionally left exposed. This is less common than exposed pads, but it’s done in specific cases where designers need direct access to the trace for testing or where the trace carries high current and benefits from better heat dissipation.

One common use for exposed copper traces is creating test points. By leaving a section of trace uncovered, engineers can place probes directly on the trace during testing or troubleshooting.

3. PCB Exposed Copper Edge

A pcb exposed copper edge refers to copper that runs right to the edge of the PCB and remains exposed for functional use. This is typically found in boards that need to connect to sockets or other boards via edge connectors. In these cases, the copper along the edge acts as contact points and must remain exposed for reliable electrical connection.

This type of exposed copper is also used for grounding purposes. For example, in RF circuits or high-speed digital designs, the board edge may have exposed copper connected to ground to reduce electromagnetic interference (EMI). Some designs use edge plating, where the copper is plated along the entire edge of the board to create a continuous conductive path.

What Is the Clearance of Copper to Edge of PCB?

When designing PCBs, copper-to-edge clearance is critical. Copper should not be placed too close to the edge unless it is meant to be exposed. If copper unintentionally gets too close to the edge, it can cause manufacturing problems or failures in the field.

Industry Guidelines

Standard practice, according to IPC standards, recommends at least 0.25mm (10 mils) clearance between copper and the board edge. This clearance prevents copper from being damaged or exposed during board cutting.

Edge Copper Design

If you’re designing a pcb exposed copper edge, such as for a connector or grounding point, you can extend copper to the edge, but it must be plated and processed correctly. Special instructions are needed for the manufacturer to plate the edges and prevent delamination.

How to Design a PCB with an Exposed Copper Plate?

Designing exposed copper areas requires planning and proper use of your PCB design software.

Step 1: Define Copper Areas

Use copper pours, pads, or large planes for the areas you want exposed. Ensure they are connected to the correct net, whether ground, power, or signal.

Step 2: Disable Solder Mask

In your PCB layout tool, disable the solder mask over these areas. This is done by creating a solder mask opening in the relevant layer.

Step 3: Edge Exposure

For pcb exposed copper edge designs, extend the copper to the edge of the board. Indicate this clearly in your mechanical drawings. Some manufacturers require a note to plate the edge.

Step 4: Selective Surface Finish

Decide whether the copper will remain bare or have a finish like HASL (Hot Air Solder Leveling) or ENIG (Electroless Nickel Immersion Gold). These finishes prevent oxidation and improve durability.

Risks and Challenges with Exposed Copper PCB

While exposed copper on PCB serves many useful purposes, it comes with challenges.

Oxidation and Corrosion

Copper oxidizes quickly in air, forming a dull brown or green layer. This can reduce conductivity and make soldering difficult. Moist environments accelerate this process.

Short Circuits

Exposed copper is more likely to cause shorts if it touches other metal objects. Extra care is needed in design and assembly to avoid accidental contact.

Handling Risks

Bare copper areas can be scratched or contaminated during handling. Fingerprints, dust, or moisture can affect performance. Protective packaging and careful assembly help reduce these risks.

Exposed Copper Design Guidelines in PCB Layout

Here are some helpful tips for designing exposed copper areas safely:

Maintain clearance from high-voltage areas unless insulation is provided.
Use protective coatings like conformal coating if the board will be exposed to harsh environments.
Clearly indicate exposed copper areas in your Gerber files and fabrication notes.
For pcb exposed copper edge, work with your manufacturer to ensure proper plating and durability.
Use thicker copper (e.g., 2 oz) for large exposed areas meant for heat dissipation or high current.

FAQs

1. How to remove copper from PCB board?

Copper can be removed through chemical etching using ferric chloride or similar solutions. It can also be scraped off mechanically or milled with CNC tools.

2. What happens to exposed copper?

Exposed copper oxidizes when exposed to air and moisture. This can affect electrical performance, so protective finishes or coatings are often applied.

3. Can exposed copper PCB be used outdoors?

Not directly. Outdoor use requires additional protection, like conformal coating, to prevent corrosion. Without protection, copper will degrade quickly.

4. How do I prevent oxidation on exposed copper areas?

Apply coatings such as OSP (Organic Solderability Preservative), clear lacquer, or conformal coating. Using surface finishes like ENIG or HASL also helps.

5. What surface finish is best if I want partial copper exposed?

ENIG and HASL can be applied selectively. Masking during the finishing process allows partial copper exposure where needed.

6. Is exposed copper safe for high-voltage applications?

Not unless proper spacing and insulation are used. High voltage requires strict clearance and protection to avoid arcing or shorts.

7. What’s the difference between exposed copper and plated finish?

Exposed copper has no added layer, while plated finishes like ENIG or HASL add protection and improve performance.

Tags:exposed copper design pcb, Exposed Copper on PCB, pcb exposed copper edge
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Copper Metal Core PCB Design Guide & Thermal Solution

Friday, August 1st, 2025

Looking for copper metal core PCB thermal solution? Let’s explore spec, benefits, application, design guide and thermal solution, manufacturing process for copper metal core PCB.

Are you worried about these problems?

Is your LED product experiencing luminous efficacy degradation due to insufficient heat dissipation?
How can you avoid reliability risks when high-power devices experience uncontrolled temperature rise?
Struggling to balance cost and performance? How can you choose a lightweight solution?

Best Technology can provide solutions

Precise Thermal Matching Service: Through thermal simulation modeling, we customize the copper layer thickness (available in 0.1-3.0mm), ensuring a 40% reduction in LED module junction temperature and a 50% reduction in lumen degradation.
High-Current Wiring Technology: Utilizing an immersion gold (Immersion Gold) + OSP process, it supports a continuous current of 5A/mm², eliminating overheating issues in power modules and increasing yield to 99.2%.
Lightweight Structural Design: Copper foil micro-etching technology achieves 50μm line/space widths. A multi-layer stacking solution reduces drone battery pack size by 20% and extends flight time by 15%.

Welcome to contact us if you have any request for metal core PCB: sales@bestpcbs.com.

What Is Copper Metal Core PCB?

A Copper Metal Core PCB (Printed Circuit Board) is a type of circuit board that uses copper as the base material instead of the traditional fiberglass (FR4). This metal core is typically located beneath the circuit layer and serves as a thermal conductor to dissipate heat generated by electronic components during operation. Copper metal core PCB has superior thermal conductivity, making it highly effective for managing heat in power electronics, LED lighting, automotive systems, and industrial control equipment.

Copper Metal Core PCB Specification

Parameter	Specification
Base Material	Copper (typically C1100 or similar high-purity copper)
Copper Core Thickness	0.5 mm, 1.0 mm, 1.5 mm, 2.0 mm, up to 5.0 mm (custom thickness available)
Circuit Layer Copper Thickness	1 oz, 2 oz, 3 oz, up to 10 oz (35 µm to 350 µm)
Dielectric Layer Thickness	0.05 mm to 0.5 mm
Thermal Conductivity of Dielectric	1.0 W/m·K to 5.0 W/m·K or higher
Thermal Conductivity of Copper Core	~400 W/m·K (excellent thermal performance)
Operating Temperature Range	-40°C to +150°C or higher depending on design
Surface Finish Options	HASL, ENIG (Electroless Nickel Immersion Gold), OSP, Immersion Tin/Silver
Solder Mask Color	Green, White, Black (custom colors available)
Board Size	Up to 600 mm × 1200 mm (larger sizes possible upon request)
Drilling Options	Mechanical drilling, laser drilling for micro vias
Layer Count	Single-sided, double-sided, multilayer (up to 4 layers typical)
Impedance Control	Available for RF/high-frequency applications
Certification Standards	ISO9001, UL, RoHS, IPC Class 2/3 compliant

Benefits of Copper Substrate PCB

Exceptional Heat Dissipation: Copper’s high thermal conductivity (2x aluminum) rapidly transfers heat away from components, preventing overheating in LEDs, power modules, or automotive systems.
Longer Device Lifespan: Reduces thermal stress and component failure, extending reliability for high-current applications like EV chargers or industrial equipment.
Compact Design Flexibility: Thick copper layers enable dense circuits and smaller boards, saving space in 5G devices, RF systems, or medical electronics.
Cost-Effective Performance: Minimizes need for external cooling parts (fans/heatsinks), lowering long-term maintenance and material costs.
Versatile Application Fit: Ideal for high-power (solar inverters), precision (aerospace), and EMI-sensitive (radar) designs, ensuring stable operation in extreme environments.

Applications of Copper Metal Core PCBs

High-Power LED Lighting: Efficiently dissipates heat from dense LED arrays, preventing color shift and extending lifespan for automotive, industrial, and architectural lighting.
Automotive Electronics: Manages heat in power modules (e.g., engine control units, battery management systems) under extreme temperatures, enhancing reliability for EVs and hybrid vehicles.
5G & RF Devices: Supports high-frequency circuits and millimeter-wave components by minimizing thermal noise, critical for 5G base stations and radar systems.
Industrial Power Systems: Withstands high currents and thermal stress in motor drives, inverters, and solar power converters, reducing downtime and maintenance costs.
Aerospace & Defense: Provides lightweight, durable thermal management for avionics, satellite components, and ruggedized communication gear in harsh environments.

Copper Metal Core PCB Design Guide

Below is copper metal core PCB design guide:

1. Material & Substrate Selection

Use copper-core substrates (thermal conductivity ≥2W/mK) or ceramic substrates (AlN, 320W/mK). Avoid FR4.
High-power areas: 3-4oz copper; peripheral zones: 2oz. Transition zones use teardrop shapes (≤45°).
Ensure lead-free solder (SAC alloy), halogen-free laminate, and RoHS/REACH compliance.

2. Thermal Management

Spread high-power components (e.g., power ICs) to prevent heat buildup. Place heat-generating parts on outer layers for direct cooling.
Thermal vias: 0.3mm diameter, ≥4 vias/cm², 30μm copper plating. For IGBTs, embed 1.5mm heat pipes (local temp rise ≤15°C).
Add 10μm graphene film on copper layers to boost thermal diffusion by 40%. Validate designs with ANSYS/Flotherm and IR thermography.

3. Stack-Up & Board Thickness

For RF circuits, use Rogers RO4000 (Dk=3.38). Multi-layer boards: 6 layers reduce crosstalk by 60-70% vs. 4 layers. Apply 20H rule (power plane indented 20× layer spacing).
Standard thickness: 1.6mm; use ≥2.0mm for high-power applications.
Maintain >85% copper uniformity. Blind/buried vias reduce thermal stress by 30%.

4. Routing & Signal Integrity

Track width: 1mm (1oz copper) = 1A. Widen tracks for high current (1A/0.3mm). Prioritize power traces to minimize impedance.
High-speed signals: 3W spacing, matched lengths, 135° bends. Crystal circuits: Ground enclosure with stitching vias.
Route critical signals (e.g., clocks) first. Bridge splits with 0.1μF + 10μF capacitors.

5. Vias & Solder Mask

Laser vias: ≥0.1mm; mechanical vias: ≥0.2mm. Tolerance ±0.05mm (≤0.8mm vias). High-speed vias: Stub length <10mil; back-drill tolerance ±2mil.
Solder mask: Expand 0.05-0.1mm beyond pads. For BGAs, use NSMD (mask opening 15-25μm larger than pad). Remove mask in thermal zones.

6. Manufacturing & Testing

Hole aspect ratio (diameter:total thickness) ≤10:1. Metal-base tolerance: ±0.1mm; add 0.3mm vent holes per 20×20mm.
Reliability tests: Environmental: Thermal cycle (-40°C/+125°C), 95%RH/40°C/96h. Mechanical: Tensile strength >10N; peel strength ≥1.0N/mm.
Electrical: Contact resistance (mΩ-Ω range); insulation >10⁷Ω; HiPot.

7. Special Applications

High-power modules: Step-down copper (4oz core, 2oz periphery); embed AlN or heat pipes.
Flex designs: Rigid-flex follows rigid rules; keep 1.5-2mm clearance from SMD outlines.
Low-temperature: Use high-Tg substrate (Tg>170°C); increase via density.

Copper Metal Core PCB Thermal Solution

1. Advanced Thermal Materials

Graphene-Enhanced Copper: Utilize copper-graphene composites (thermal conductivity up to 440W/mK) for core heating zones. Apply 10μm graphene films on copper layers to boost lateral thermal diffusion by 40%.
Staged Copper Thickness: Use 4oz copper for high-power areas (e.g., IGBTs), transitioning to 2oz in peripheral zones via teardrop-shaped (≤45°) connections.

2. Via Array Optimization

Thermal Vias: Deploy 0.3mm diameter vias in hotspots (density ≥4 vias/cm²), reducing thermal resistance by 90% compared to non-via designs.
Dynamic Spacing: Use hexagonal via patterns for heat flux >50W/cm²; rectangular arrays for <30W/cm². Maintain via spacing ≥2×via diameter +0.1mm.
Copper-Via Synergy: Thicken via walls to ≥30μm when outer-layer copper exceeds 35μm. Reduce via spacing to 0.8mm for 35μm copper layers.

3. Heat Pipe Integration

Embedded Heat Pipes: Insert 1.5mm-diameter heat pipes beneath IGBTs, filled with phase-change material. Limits local temperature rise to ≤15°C (5× more efficient than vias alone).
Patent-Proven Designs: Fix heat pipes to aluminum substrates via high-temperature soldering, ensuring direct contact with chassis for efficient heat dissipation.

4. Thermal Path Engineering

Vertical-Horizontal Hybrid Cooling: Combine 0.3mm vias (vertical heat transfer) with 0.5mm linewidth hexagonal grids (horizontal spreading) in non-critical zones.
Ceramic Insertion: Embed AlN ceramic pads (thermal conductivity 320W/mK) under power modules, bonded with silver paste to achieve baseplate thermal resistance <0.15°C/W.

5. Simulation & Validation

Thermal Modeling: Use ANSYS Icepak with 3× denser mesh in via regions. Validate against real-world data (e.g., 48V DC/DC module via optimization reduced thermal resistance from 1.2°C/W to 0.78°C/W).
Infrared Testing: Confirm design efficacy via thermal imaging, ensuring peak junction temperatures stay below 125°C (with <10°C rise per 10% power increase).

6. Manufacturing Adjustments

Aspect Ratio Control: Maintain via diameter-to-board thickness ratio ≤10:1. Tolerance: ±0.05mm for vias ≤0.8mm.
Solder Mask Management: Expand solder mask 0.1mm beyond pads; remove mask entirely in thermal via arrays to enhance heat dissipation.

How to Make A Copper Metal Core PCB?

1. Material Preparation

Substrate Selection: Choose copper-core substrates (thermal conductivity ≥2W/mK) or ceramic substrates (AlN, 320W/mK). Avoid FR4.
Copper Foil: Use 3-4oz copper for high-power areas; 2oz for signal layers. Pre-treat copper surfaces for adhesion.
Auxiliary Materials: Prepare dry film, solder mask ink, and semi-cured sheets (PP) for lamination.

2. Inner Layer Fabrication

Surface Cleaning: Clean substrates to remove oils, oxides, and contaminants.
Dry Film Application: Lamination of photosensitive dry film on copper surfaces.
Exposure & Development: UV exposure transfers circuit patterns to the dry film. Unexposed areas are dissolved in developer solutions.
Etching: Remove unprotected copper using alkaline etchants (e.g., ammonium persulfate).
AOI Inspection: Automatic Optical Inspection (AOI) detects defects like opens/shorts.

3. Lamination

Stack-Up: Align inner layers, PP sheets, and outer copper foils per design. Use pins/optical alignment for precision.
Pressing: Apply heat (180–220°C) and pressure (1.5–2.5MPa) to melt PP and bond layers. Maintain vacuum to eliminate air bubbles.
Post-Press Treatment: Cool boards gradually to avoid warping. Trim edges and remove excess PP.

4. Drilling & Plating

Mechanical/Laser Drilling: Drill through-holes, blind/buried vias. Laser drilling is used for microvias (<0.15mm).
Deburring: Remove drill swarf and smooth hole walls.
PTH (Plated Through-Hole):
Desmearing: Clean hole walls with plasma/permanganate.
Chemical Deposition: Coat holes with a thin copper layer (1–2μm).
Electroplating: Thicken copper to 20–40μm for conductivity and durability.

5. Outer Layer Fabrication

Dry Film Application: Repeat processes for outer layers.
Exposure/Development/Etching: Similar to inner layers but with tighter tolerances.
Tin Plating (Optional): Electroplate tin as an etch resist for selective copper retention.

6. Solder Mask & Silkscreen

Solder Mask Application: Coat boards with liquid photoimageable solder mask (LPI).
Exposure/Development: Expose mask to UV light, leaving pad areas uncovered.
Curing: Bake boards to harden the mask.
Silkscreen Printing: Add component labels, logos, and markings using UV-curable ink.

7. Surface Finish

HASL (Hot Air Solder Leveling): Dip boards in molten solder, then level with hot air. Cost-effective for general use.
ENIG (Electroless Nickel/Immersion Gold): Deposit nickel (3–5μm) and gold (0.05–0.1μm) for flat surfaces and corrosion resistance.
OSP (Organic Solderability Preservative): Apply a thin organic layer for lead-free compatibility.

8. Routing & Testing

CNC Routing: Cut boards to final dimensions using milling machines. Add V-scores for easy breaking.
Electrical Testing:
Flying Probe: Check for opens/shorts with movable probes.
Fixture Test: Use bed-of-nails for high-volume inspection.
Final Inspection: Visual check for defects (e.g., solder mask bridges, misalignment).

9. Packaging & Shipping

Vacuum Packing: Seal boards in anti-static bags with desiccants.
Labeling: Include PCB specs, date codes, and compliance marks (RoHS, UL).

Why Choose Best Technology as Metal Core PCB Manufacturer?

Global ISO/RoHS/REACH/UL Compliance: One-step certification for EU/US markets.
Free DFM Support: Avoid costly redesigns with first-pass success guarantee.
1 Piece MOQ & 24-Hour Rapid Prototyping: Accelerate product validation by 5x, beat competitors to market.
A Week Mass Production Turnaround: Eliminate supply chain bottlenecks during peak seasons.
Thermal Performance Optimization: Reduce power module temperatures by 25%, extend product lifespan.
Strict Quality Inspection: Conduct full inspection in batches and strictly control quality to reduce the cost of rework for customers.
Competitive Price: Transparent Price Structure, No hidden Cost to be incurred.
Cost-Efficient Material Solutions: Achieve 15% higher profitability for LED/5G products.
High-Density Routing Expertise: Miniaturize IoT devices without sacrificing performance.

Welcome to contact us if you have any request for metal core PCB: sales@bestpcbs.com. Looking forward to hearing from you soon!

Tags:copper metal core pcb, Metal Core PCB
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

2oz Copper PCB for ESD丨Heavy Copper PCB Manufacturer

Friday, August 1st, 2025

Why choose 2oz Copper PCB for ESD? Let’s discover thickness, current, benefits, ESD protection rules for 2oz Copper PCB.

Are you troubled with these problems?

How can PCBs avoid overheating and burnout in high-current scenarios?
How can signal stability be ensured in complex environments (high temperature/vibration)?
How can heat dissipation efficiency be improved when traditional copper foil is insufficiently thick?

Best Technology’s Services and Solutions

70μm-400μm ultra-thick copper layer design directly addresses high-current carrying and heat dissipation issues.
Laser etching + electroplating fill-fill process ensures stable high-frequency signal transmission.
Customized thermal simulation optimization tailors the design to the end application scenario, extending device life.

Welcome to contact us if you have any request for heavy copper PCB: sales@bestpcbs.com.

What Is 2oz Copper PCB?

A 2oz Copper PCB refers to a printed circuit board with copper traces or planes weighing 2 ounces per square foot (oz/ft²). This equates to approximately 70 micrometers (µm) or 2.8 mils of copper thickness. Such PCBs are designed to handle higher current loads (e.g., 5–10A per trace) with reduced resistance and heat generation compared to thinner copper (e.g., 1oz). They are commonly used in power electronics, automotive systems, and industrial equipment where robust electrical performance and thermal management are critical.

2oz Copper PCB Thickness

A 2oz copper PCB has a copper layer thickness of approximately 70 micrometers (µm) or 2.8 mils, equivalent to 2 ounces per square foot (oz/ft²). This thickness ensures low electrical resistance and efficient heat dissipation, making it ideal for high-current applications like power modules, motor controls, and LED lighting systems.

2oz Copper PCB Current

The current capability of a 2oz Copper PCB (70μm thickness) is approximately 2A per millimeter of trace width for a 10°C temperature rise, doubling the capacity of standard 1oz PCBs. This assumes proper thermal management (e.g., vias, heat sinks) and ambient conditions. Factors like trace length, adjacent heat sources, and insulation layers also influence performance. For precise calculations, use the formula: I = 0.048 × ΔT0.44 × W0.725, where I = current (A), ΔT = temperature rise (°C), and W = trace width (mm).

Why Choose 2oz Copper PCB for ESD?

Reasons why choose 2oz copper PCB for ESD:

Lower Resistance, Faster Discharge: Thicker copper (70μm) reduces trace resistance, enabling rapid conduction of ESD currents to ground and minimizing voltage buildup.
Enhanced Grounding Efficiency: Wider traces/planes with 2oz copper provide larger conductive surfaces, optimizing ESD paths and reducing impedance mismatches.
Improved Thermal Dissipation: Higher copper mass absorbs and disperses heat generated during ESD events, preventing localized overheating and component stress.
Mechanical Robustness: Thicker copper layers resist physical damage (e.g., trace lifting or cracking) caused by sudden ESD-induced current surges.
Compliance with ESD Standards: Facilitates meeting IEC 61000-4-2 requirements by ensuring reliable ESD protection in high-risk environments (e.g., consumer electronics, industrial systems).

2 oz vs. 1oz Copper PCB: ESD Performance Comparison

Parameter	2oz Copper PCB	1oz Copper PCB
Copper Thickness	70μm	35μm
ESD Discharge Resistance	Lower (reduced voltage buildup)	Higher (risk of voltage spikes)
Thermal Capacity	Higher (absorbs/dissipates heat)	Lower (risk of thermal stress)
Trace Current Capacity	~2A/mm (10°C rise)	~1A/mm (10°C rise)
Mechanical Durability	Resists trace lifting/cracking	Prone to damage under ESD surges
Grounding Efficiency	Superior (low-impedance paths)	Moderate (higher inductance)
Compliance (IEC 61000-4-2)	Passes 15kV air/8kV contact (Level 4)	Struggles at high voltages (risk of failure)
Cost	Higher (20–40% premium)	Lower
Design Complexity	Requires wider traces/vias	Simpler for low-power ESD

ESD Protection Rules for 2oz Copper PCB Design

Grounding Priority: Use full 2oz copper ground planes on inner/outer layers. Connect via stitching vias (≥4 vias/cm², 0.3mm diameter) to minimize impedance.
Trace Design: ESD paths: ≥1.5mm width for 2oz copper. Keep traces <100mm long; route directly to ground.
Component Placement: Isolate ESD-sensitive devices (e.g., MOSFETs, CMOS ICs) from edges/connectors by ≥5mm. Shield with 2oz copper guard rings.
Protection Devices: Add TVS diodes (≥15kV rating) at I/O ports. Place diodes within 2mm of connectors, using 2oz copper traces for low-inductance paths.
Layer Stack-Up: Use 4-layer design: Signal-Ground-Power-Signal. Allocate 2oz copper to ground/power layers for ESD dissipation.
Thermal Management: Leverage 2oz copper’s thermal mass to absorb ESD heat. Add thermal vias (0.3mm, 30μm plating) under hot components.
Material & Manufacturing: Specify ESD-safe FR4 (low static generation). Control copper thickness tolerance (±10%) to avoid resistance variability.
Testing & Compliance: Validate with IEC 61000-4-2 tests (8kV contact, 15kV air). Use oscilloscopes to verify discharge times <1ns.

Why Choose Best Technology as Heavy Copper PCB Manufacturer?

Global Certifications & Compliance – UL, ISO 9001, and IATF 16949 certification for automotive and industrial applications; RoHS and REACH-certified materials for sustainable manufacturing.
Competitive Pricing – Cost-effective solutions without compromising quality, optimized for high-volume and low-volume production.
Superior Quality Standards – Rigorous adherence to IPC-6012 Class 3 standards for heavy copper PCBs (up to 10oz+).
Fast Turnaround – Expedited lead times (as short as 5 days) for bulk orders.
Advanced Quality Control – 100% automated optical inspection (AOI) and X-ray testing for defect-free boards.
Custom Design Support – Expert engineering assistance for thermal management and high-current trace optimization.
Reliable Supply Chain – Stable material sourcing to avoid delays and ensure consistency.
One-Stop Solution – From prototyping to mass production, we handle all stages seamlessly.
Dedicated Customer Service – 24/7 technical support for real-time project tracking and issue resolution.

Our Heavy Copper PCB Capabilities

Base material	FR4/Aluminum
Copper thickness:	4 OZ~10 OZ
Extreme Heavy Copper:	20~200 OZ
Outline:	Routing, punching, V-Cut
Soldermask:	White/Black/Blue/Green/Red Oil
Surface finishing:	Immersion Gold, HASL, OSP
Max Panel size:	580480mm(22.8″18.9″)

How to Get A Quote For Your Heavy Copper PCB Project?

How to Get a Quote for Your Heavy Copper PCB Project

1. Technical Specifications

Copper Weight & Layers: Specify the required copper thickness (e.g., 2oz, 3oz, or custom) and the number of layers (e.g., 2-layer, 4-layer, HDI).
Board Dimensions: Provide length, width, and thickness (e.g., 100mm × 80mm × 2.0mm).
Minimum Trace/Spacing: Define line width and spacing (e.g., 0.1mm/0.1mm for standard heavy copper).
Minimum Hole Size: Specify via sizes (e.g., 0.2mm for 2oz copper).

2. Material & Finish Requirements

Base Material: Choose between FR4, polyimide, or specialized high-Tg materials.
Surface Finish: Select options like ENIG, immersion tin, or HASL.
Solder Mask & Silkscreen: Specify colors and types (e.g., green solder mask, white silkscreen).

3. Additional Customizations

Impedance Control: Required for high-speed designs.
Testing Requirements: Define testing methods (e.g., flying probe, AOI).
Special Features: Half holes, blind/buried vias, or rigid-flex designs.

4. Project Logistics

Quantity: Total pieces required (e.g., 100 units).
Lead Time: Urgency of delivery (e.g., 7–10 days for standard orders).
Delivery Address: Ensure accurate shipping details.

Why Choose Best Technology?

Precision engineering for high-power applications.
Competitive pricing with transparent cost breakdowns.
Rapid turnaround and expert technical support.

Submit your detailed requirements today for a quote: sales@bestpcbs.com.

Tags:2oz Copper PCB, heavy copper pcb
Posted in best pcb, bestpcb, Special PCB | No Comments »

Consistent Quality Star MCPCB Manufacturer for Prototype

Friday, August 1st, 2025

Star MCPCB is a reliable solution for LED lighting systems that require consistent thermal management and high brightness. When developing LED prototypes, using a well-designed MCPCB star board helps ensure steady performance and longer lifespan. However, finding a dependable supplier for small batches often challenges engineers and buyers alike. At Best Technology, we provide fast, quality service to help customers overcome this issue, improving both inquiry efficiency and product outcomes.

Best Technology is a Chinese Star MCPCB Manufacturer, providing DFM analysis, prototype, fabrication, SMT assembly, and box build service. Rigorous quality control system, rich design and manufacturing experience, sophisticated equipment and technology, quick response, and short lead times really puts a competitive edge to us over the average metal core manufacturers. Our factory supports multiple materials and the customized sizes that meet a variety of LED application needs. Just connect with us at sales@bestpcbs.com for comprehensive solutions.

Consistent Quality Star MCPCB Manufacturer for Prototype

What is a Star MCPCB?

Star MCPCB refers to a metal core PCB shaped like a star or hexagon, typically used in LED lighting. It consists of a copper layer for circuitry, a dielectric for insulation, and a metal base (usually aluminum) for heat dissipation. These boards help LEDs maintain brightness while managing heat effectively. They are small, lightweight, and ideal for use in compact lighting assemblies.

What is the Material of Standard Star MCPCB?

Most standard star MCPCBs use aluminum as the base material because it is both cost-effective and efficient in conducting heat. The circuit layer uses copper, often 1oz or 2oz thickness. Between these layers is a thermally conductive dielectric, which enables fast heat transfer while ensuring insulation. These materials combine to form a durable, high-performance board for LED applications. At Best Technology, we use only RoHS-compliant materials, which are safe and environmentally friendly.

What are the Star MCPCB Dimensions?

Star MCPCB dimensions vary based on LED type and application. Standard sizes include 20mm, 16mm, and 12mm in diameter, with thickness typically around 1.0mm to 1.6mm. Custom shapes and sizes are also available. Our engineers support flexible design options to match specific customer needs. Importantly, tight tolerance is kept to maintain performance and ease of assembly.

How to Do the MCPCB Design?

MCPCB design begins with selecting the proper LED footprint. For star MCPCBs, this often includes layouts for 1W, 3W, or 5W LEDs. Designers need to focus on pad spacing, thermal paths, and hole placement. Clearances should match LED manufacturer guidelines. Best Technology supports customers with DFM (Design for Manufacturing) checks, which help identify design risks before production. This reduces delays and avoids costly revisions.

What Are the Manufacturing Processes of the MCPCB LED Star?

Producing an MCPCB LED star involves several steps:

Copper Clad Laminate Cutting: Sheets are cut to size based on the required star shape.
Drilling: Holes for LED placement or mounting are drilled using precise tools.
Imaging: Circuit patterns are printed using photoresist methods.
Etching: Unwanted copper is removed to form the correct traces.
Dielectric Application: A thermal dielectric is layered for insulation.
Solder Mask and Surface Finish: These protect copper and improve solderability.
Routing and Final Shaping: Boards are cut into star shapes, and edges are cleaned.

Our advanced equipment ensures repeatable, accurate production even for small batches.

What is the Quality Inspection Process During LED Star MCPCB Manufacturing?

Quality is critical. At Best Technology, we perform the following checks during production:

Incoming Material Inspection: All raw materials are verified for conformity.
In-process Checks: Imaging, etching, and drilling are monitored for defects.
AOI (Automated Optical Inspection): Circuit accuracy is checked against design files.
Dielectric Strength Testing: Insulation is tested under voltage to prevent failures.
Final Inspection: Visual and mechanical checks ensure correct dimensions and finish.

Customers often worry about receiving inconsistent quality in prototypes. Our strict process and MES system (Manufacturing Execution System) help maintain traceability and consistency from start to finish.

What Are the Applications of the MCPCB Star Board?

MCPCB star boards are widely used in LED lighting, including:

LED flashlights
Spotlights
Automotive lighting
Decorative lighting
Medical devices

They support both high and low-power LEDs. Due to the star shape, they are easy to mount onto heat sinks, which helps extend LED life. Our customers in Europe and the US often request customized designs for unique lighting projects, and our fast prototyping service helps them meet tight deadlines.

Where to Get MCPCB Star Board?

Choosing a dependable supplier for MCPCB star boards can greatly improve project outcomes. At Best Technology, we understand the value of both time and budget. That’s why we provide reliable support at every stage—from design to final delivery.

1. Full-Service Support from Start to Finish

We assist with design, material selection, and layout optimization.
Fast and accurate quotations help you plan your costs easily.
Rapid prototyping ensures you meet tight deadlines without stress.

2. Quick and Responsive Communication

We reply to all inquiries promptly.
Our engineering team offers practical solutions for your specific needs.
You will always know the status of your order.

3. Solving Common Customer Pain Points

Delay: We shorten lead times with efficient processes.
Poor Communication: We keep you informed at every step.
Inconsistent Quality: Strict quality checks ensure reliable boards every time.

4. Certified Quality You Can Trust

ISO 9001, ISO 13485, IATF 16949, and AS9100D certifications show our commitment to world-class manufacturing.

5. Consistent Quality for Every Order

Whether it’s a standard star MCPCB or a custom board, we deliver on time.
Quality is consistent, even for low-volume or prototype batches.

All in all, star MCPCB plays a key role in LED lighting. From efficient heat management to ease of installation, it supports reliable performance in various applications. However, sourcing quality boards quickly remains a challenge. Best Technology helps customers overcome this by offering fast, reliable prototyping and production services. Our team’s experience, combined with strict quality control and responsive communication, helps customers improve project outcomes and reduce risks. Contact Best Technology at sales@bestpcbs.com for better star MCPCB solutions and experience dependable support from design to delivery.

Tags:Star MCPCB
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

MCPCB Design, MCPCB Manufacturing Process

Friday, August 1st, 2025

At Best Technology Co., Ltd., we’re experts in MCPCB manufacturing with a complete mcpcb manufacturing process. Our MCPCBs are built to handle tough thermal demands, making them ideal for LED lighting, power converters, automotive modules, and more.

MCPCB Design, MCPCB Manufacturing Process

How to make mcpcb?

Creating an MCPCB isn’t as simple as layering copper and fiberglass. Instead, it starts with selecting the right base, a metal substrate that replaces the usual FR4 core in traditional boards.

This metal core, usually aluminum or copper, becomes the heart of the MCPCB. It supports components, spreads heat, and provides stability. The process then follows with dielectric layering, circuit etching, drilling, and protective coating.

Every layer and every step is essential to maintain heat control, conductivity, and board longevity.

How is a mcpcb manufactured step by step?

Let’s break the process down into clear steps:

Metal Core Preparation

A raw aluminum or copper sheet is selected. It’s cleaned and polished to remove oxidation.

Dielectric Layer Application

A thermally conductive, electrically insulating layer is laminated onto the metal base. This is the key to heat transfer.

Copper Cladding

A thin copper foil is laminated on top of the dielectric. This copper layer will carry the circuit patterns.

Circuit Imaging and Etching

Photoresist is applied to the copper surface.

UV light exposes the circuit design.

Unwanted copper is etched away, revealing the desired pattern.

Drilling

Precise holes are drilled for component mounting and vias.

Plating and Solder Mask

Copper plating reinforces hole walls.

A protective solder mask is applied, ensuring insulation and component alignment.

Surface Finish

Finishes like HASL, ENIG, or OSP protect the copper from oxidation and improve solderability.

Testing and Inspection

Electrical tests, AOI (Automated Optical Inspection), and final inspections ensure quality.

Each step must be done with care. A slight misalignment can impact performance and reliability.

What materials are used in MCPCB manufacturing?

The choice of materials is what gives MCPCBs their edge.

Metal Core (Base Layer)

Usually aluminum for cost-efficiency and solid heat dissipation.

Copper is used for high-end applications requiring better conductivity.

Dielectric Layer

The thin insulation layer offers high thermal conductivity but must resist high voltages.

Common materials include ceramic-filled polymers.

Copper Layer

Carries the electrical signals and forms circuit traces.

Thickness varies depending on current-carrying requirements.

Surface Finish

Prevents oxidation and ensures strong solder connections.

ENIG, HASL, and OSP are common options.

These materials aren’t just chosen for compatibility. Each plays a role in enhancing performance and lifespan.

What is core in manufacturing process?

In the MCPCB world, the core is the metal base. It plays several roles:

Heat Dissipation: Pulls heat away from components and spreads it evenly.

Mechanical Support: Strengthens the board and reduces vibration risks.

Electrical Isolation: Combined with dielectric materials to ensure circuits don’t short.

Unlike FR4 used in standard boards, a metal core makes MCPCBs suitable for high-wattage devices and LEDs.

How is the chipset protected during MCPCB making?

Chipsets are delicate. During manufacturing, every step must protect their integrity.

Low Thermal Resistance Layers: These layers keep chipsets cool by drawing heat down quickly.

Strong Adhesion: Prevents delamination and cracking under stress.

Stable Solder Pads: Ensures chips stay in place during reflow soldering.

Controlled Expansion: Metal cores reduce thermal expansion that could otherwise harm chip connections.

These features not only protect but extend the lifespan of integrated circuits.

What sets MCPCB apart from PCB manufacturing?

While the two may look alike, MCPCB and PCB differ in core design and performance:

Thermal Management: MCPCBs are built for heat. Regular PCBs are not.

Material Core: FR4 vs. metal (aluminum or copper).

Applications: MCPCBs are used in LEDs, power supplies, automotive, and RF circuits. Traditional PCBs serve consumer electronics and low-heat applications.

Durability: MCPCBs hold up better in demanding environments.

In short, if your product generates heat, MCPCBs are the smarter choice.

What is the difference between FR4 and Mcpcb?

FR4 is a fiberglass-reinforced epoxy laminate. It’s lightweight, cheap, and widely used. MCPCB, on the other hand, uses a metal core. Here’s the difference:

Thermal Conductivity:

FR4: Poor

MCPCB: Excellent

Structure:

FR4: All dielectric layers

MCPCB: Metal core + dielectric + copper

Use Cases:

FR4: Phones, computers

MCPCB: LEDs, automotive, industrial devices

Durability:

MCPCBs are more resistant to mechanical and thermal stress.

How does MCPCB manufacturing improve heat dissipation?

Heat is channeled through the dielectric layer into the metal base. From there, it spreads outward and away from hot spots.

This design drastically reduces the risk of:

Component burnout
Solder joint failure
Signal degradation

MCPCBs also lower the need for additional cooling solutions like heat sinks or fans. This saves space and cost. This makes them ideal for compact or sealed systems like:

LED lighting
Automotive sensors
Power converters

The key lies in the seamless combination of conductive and insulating materials.

Conclusion:

Understanding the MCPCB manufacturing process will help you understand this product. From chipset protection to thermal performance, it outshines traditional PCBs in demanding applications.

Whether you need reliability, heat control, or performance, MCPCBs are the answer.

Need high-quality MCPCBs with full design and manufacturing support? Best Technology is your trusted partner. Reach out now: Contact us: sales@bestpcbs.com

Tags:chipset manufacturing process, mcpcb manufacturing, mcpcb manufacturing process, pcb manufacturing process
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

What is Difference: Exposed Copper on PCB, Bare Copper PCB?

Friday, August 1st, 2025

Exposed copper on PCB is often seen in circuit designs where certain copper areas are left uncovered. These areas serve specific functions, especially for soldering or electrical connections. Knowing how this differs from a bare copper PCB helps you choose better solutions for your needs.

Best Technology has been manufacturing PCBs and providing PCBA service to a very crowded market for over 19 years. We have a competitive edge in this area through precision processing and the customization capability, our all-process quality control system, as well as through delivery efficiency and the full turnkey EMS PCB service. Our engineering team has rich and valuable experience in optimizing exposed copper on PCB performance, improving the solderability, and the heat dissipation. There is no MOQ limit; you can enjoy the prototype, small quantity trial order, or large volume mass production service. We have the project managers to follow your project. If there is any engineering project, we will give feedback to you to avoid errors and repeated work.

It would be great if you could discuss the exposed copper on PCB requirement in the initial stages of the project, so that we could ensure the optimization from the DFM to the SMT PCBA process. There is 100% appearance checking before shipping, to ensure that there is no oxidation of exposed copper on PCB in your goods batch. Just let us know your exposed copper on PCB requirement, like exposed copper on PCB edge, special pad sizes, and heat dissipation copper surfaces at sales@bestpcbs.com, we will make every effort to meet your any customized exposed copper design requirements.

What is Difference: Exposed Copper on PCB, Bare Copper PCB?

What Does Exposed Copper on PCB Mean?

Exposed copper refers to any area on a printed circuit board (PCB) where the copper surface is not covered by solder mask or surface finish. These areas may include pads, trace edges, or specific zones designed for heat dissipation. Exposed copper is intentionally left uncovered to allow for soldering, electrical connection, or thermal transfer.

To maintain performance and avoid oxidation, these exposed areas are usually protected by a plating layer such as gold (ENIG) or an organic coating like OSP. Without this protection, the copper can easily oxidize, affecting the reliability and lifespan of the PCB.

What is Copper Pour in PCB?

Copper pour is a design technique where a large area of a PCB is filled with copper. It can help reduce electrical noise, improve thermal management, and support grounding. Sometimes these poured areas are also exposed, depending on the design. Exposed copper pours need a surface finish to prevent oxidation and maintain performance.

What is Difference: Exposed Copper on PCB, Bare Copper PCB?

While both terms seem similar, they have key differences:

Exposed copper on PCB means certain parts of the board, like pads or edges, are uncovered for specific use.
Bare copper PCB refers to boards without any surface finish. The entire copper area is exposed, with no protection from oxidation or wear.

A board with exposed copper may still have other areas finished with ENIG, HASL, or silver coating. Bare copper PCBs, however, have no such finishes. They are cheaper but require careful handling and storage. In contrast, exposed copper is part of a planned design and used with protective finishes.

What are the PCB Surface Finish Types in Exposed Copper on PCB?

For exposed copper on PCB, surface finishes are used to protect the open copper areas. Each type has specific benefits depending on your application. The most common finishes include:

ENIG (Electroless Nickel Immersion Gold): Offers excellent durability and solderability. It protects exposed copper from oxidation and gives a flat surface for fine-pitch components.
Immersion Silver: A cost-effective option that works well for high-speed or high-frequency circuits. It provides a smooth surface and reliable performance but requires careful handling to prevent tarnish.
HASL (Hot Air Solder Leveling): Widely used and budget-friendly. It coats exposed copper with solder, which protects it and makes soldering easier, though it may not be ideal for very small components.
OSP (Organic Solderability Preservative): This eco-friendly coating is used mainly for short-term protection. It is easy to apply and affordable but not suitable for long-term storage.

Choosing the right finish helps you avoid oxidation and supports the function of exposed copper areas. Best Technology provides expert advice on which surface finish matches your product and performance goals.

How to Prevent Oxidation on Exposed Copper on PCB Edge?

The exposed copper on PCB edge is often used for grounding, shielding, or connectors. However, it’s prone to oxidation due to its location. To prevent this:

Use ENIG or immersion silver finish on the edge to seal the copper.
Store PCBs in dry, anti-static packaging to reduce moisture contact.
Apply conformal coating if the edge won’t be soldered, providing extra protection.

Best Technology supports custom edge protection methods to suit different applications, helping you avoid failures caused by corrosion or wear.

ENIG vs Immersion Silver PCB Finish: Which PCB Finish Is Better for Exposed Copper?

When comparing ENIG PCB finish and immersion silver PCB finish, both protect exposed copper but suit different needs:

ENIG offers better durability, excellent flatness, and is ideal for complex boards.
Immersion silver has lower cost and works well in high-frequency applications, but it needs careful storage to avoid tarnishing.

At Best Technology, we guide customers to choose the right finish for exposed copper areas, ensuring long-term performance and easy assembly.

How to Fix Exposed Copper on PCB?

Fixing exposed copper often depends on whether it’s intentional or a result of damage. If it’s unintentional, here’s what you can do:

Apply a solder mask or conformal coating to cover the copper.
For critical areas, add a surface finish like ENIG or HASL.
In repair cases, use solder to reflow and seal the copper trace or pad.

To avoid these issues, work with trusted manufacturers. Best Technology ensures all exposed copper areas are well-finished or protected, based on your specifications.

What’s the Pros and Cons of Exposed Copper on PCB?

Pros:

Allows easy soldering for components and connectors.
Supports grounding and thermal management.
Useful for test points and current paths.

Cons:

Risk of oxidation without surface finish.
Needs careful handling during assembly and storage.

With expert support, the benefits outweigh the risks. Best Technology applies the right surface finish to every exposed copper section, ensuring reliable results for your product.

Why Work with Best Technology for Exposed Copper Solution?

Many customers worry about exposed copper causing failures due to oxidation or poor soldering. Others face delays, low communication, or inconsistent quality from suppliers. At Best Technology, we solve these problems with:

A professional engineering team who understands your design and guides finish selection.
Strict quality control to ensure every board meets your needs.
Fast response times, full traceability, and clear communication throughout production.

We provide a smooth experience, reduce risks, and help you deliver high-quality products to your market quickly. Contact Best Technology at sales@bestpcbs.com for reliable PCB solutions and support for exposed copper designs.

Ultimately, exposed copper on PCB plays a vital role in modern circuit design. Whether used for soldering, grounding, or heat dissipation, these uncovered copper areas must be protected to maintain performance and prevent oxidation. Knowing the difference between exposed copper and bare copper PCBs, along with the right surface finish options like ENIG or immersion silver, helps ensure better product quality and reliability. Any technical problem or any PCB inquiry, just call us at +86-755-2909-1601 or at sales@bestpcbs.com.

Tags:Exposed Copper on PCB
Posted in best pcb, bestpcb, FR4 PCB | No Comments »

Aluminium PCB manufacturing process, PCB assembly factory

Friday, August 1st, 2025

As a professional aluminum PCB manufacturer, Best Technology delivers reliable, cost-effective solutions with a complete in-house aluminium PCB manufacturing process—from raw material sourcing to final assembly.

How is aluminium PCB made?

Unlike standard FR4 boards, aluminium boards require special materials, customized layering, and high-precision etching to perform reliably under high temperatures.

It begins with a base of aluminium, selected for its thermal conductivity and strength. This base acts as the backbone of the entire structure. Over this, a dielectric layer is added—a thermally conductive yet electrically insulating material. This layer allows heat to pass through to the metal core without shorting the circuit.

Next comes the copper foil. This conductive layer is laminated onto the dielectric using heat and pressure. Once bonded, the copper is patterned using photolithography. Then, etching forms the conductive tracks that carry current across the board.

Finally, the surface is coated with a protective solder mask. The board is drilled, tested, and cut into its final shape, ready for assembly. Every step is controlled to ensure high precision and reliability.

What are the raw materials for aluminum manufacturing?

For aluminium PCBs. The base material is an aluminium alloy, often 5052 or 6061, known for corrosion resistance and good mechanical performance. These alloys are lightweight yet robust, ideal for handling mechanical stress and thermal loads.

Next is the dielectric layer. Typically made of epoxy resin or a ceramic-filled polymer, this layer must be thermally efficient. The goal is to transfer heat quickly without compromising electrical insulation.

The conductive layer is pure copper, usually between 1oz and 3oz thick. This copper sheet is what gets etched to form the traces. To finish, a solder mask is applied to protect the copper and prevent short circuits.

Each material plays a crucial role. Choosing the right combination impacts performance, durability, and cost. That’s why experienced manufacturers like Best Technology take material quality and testing very seriously.

What are the layers of aluminum PCB?

Unlike traditional PCBs, these boards typically have three core layers:

Copper Layer: It’s where all the routing happens. The thickness varies based on current load, usually between 35μm and 105μm.

Dielectric Layer: It insulates the circuit while transferring heat to the metal base. Its thickness affects thermal resistance.

Aluminium Base Layer: This bottom layer supports the entire board. It also acts as a heat sink, dissipating excess energy and maintaining stable temperatures.

What are the manufacturing processes for Aluminium?

The aluminium PCB manufacturing process differs slightly from FR4, due to the metal base and heat-sensitive applications.

Material Preparation: Aluminium base sheets are cleaned and coated with the dielectric layer.

Copper Lamination: A copper foil is bonded using thermal pressure.

Image Transfer: Photolithographic techniques are used to apply the circuit pattern.

Etching: Unwanted copper is removed, leaving the circuit traces.

Drilling: Holes are drilled for vias and mounting points.

Plating: If needed, through-holes are plated for multi-layer connectivity.

Solder Mask Application: A protective coating is applied to prevent oxidation.

Silkscreen Printing: Labels, logos, and identifiers are printed.

Surface Finish: ENIG, HASL, or OSP finishes are applied based on customer needs.

Final Testing: Each board is electrically tested for continuity and shorts.

Routing and Packaging: Boards are cut, inspected, and packed for delivery.

Every step must meet tight tolerances. Even minor defects can affect performance, especially in LED, automotive, and power systems.

What are the pros and cons of aluminum PCB?

Aluminium PCBs have their strengths—and a few limitations.

Pros:

Superior Heat Dissipation: Aluminium spreads heat fast. This reduces hotspots and extends component life.

High Mechanical Strength: These boards are robust, reducing the risk of cracks and warping.

Lightweight Yet Durable: Aluminium provides rigidity without the weight of steel or ceramic.

Cost-Effective: Compared to ceramic substrates, aluminium PCBs are more affordable for high-performance needs.

Eco-Friendly: Aluminium is recyclable, making it a greener choice.

Cons:

Limited Flexibility: Aluminium is rigid. It’s not suitable for flexible PCB applications.

Single-Sided Complexity: Most aluminium PCBs are single-layered. Multi-layer designs are possible but more complex and costly.

Processing Requirements: Special tools are needed for drilling and etching, raising initial setup costs.

Still, the benefits far outweigh the downsides in most high-power applications. That’s why aluminium boards dominate industries like LED, power electronics, and automotive lighting.

How thick is aluminum PCB?

Thickness matters. It affects strength, heat transfer, and overall reliability.

For aluminium PCBs, the metal base typically ranges from 0.8mm to 3.2mm. The most common thickness is 1.6mm, offering a good balance between strength and heat dissipation. Some high-power applications may use up to 5mm for extra thermal control.

Thickness also depends on the product’s end use. For compact devices like LED bulbs, thinner substrates are preferred. For industrial use, thicker bases ensure long-term performance under heavy loads.

What is the thermal resistance of aluminum PCB?

Thermal resistance is crucial. It determines the heat dissipation performance of the PCB board. The lower the thermal resistance, the better the heat transfer effect, which is one of the advantages of aluminum PCB boards.

A typical aluminium PCB has a thermal resistance between 0.3°C/W and 1.0°C/W. The exact value depends on the dielectric material and its thickness.

The dielectric is designed to transfer heat quickly from the copper layer to the metal base. This lowers component temperature, improves performance, and extends lifespan.

How thick is the dielectric layer of aluminum PCB?

The dielectric layer not only ensures the passage of heat, but also acts as an insulator. The thickness of the dielectric layer directly affects the insulation performance and thermal resistance.

Most dielectric layers are between 50μm and 150μm thick. Thinner layers offer better heat transfer but may reduce electrical insulation. Thicker layers improve isolation but limit thermal performance.

Choosing the right thickness is about balance. It depends on voltage requirements, power density, and end-use environment.

How do aluminium PCBs work?

Aluminium PCBs work by balancing three critical needs: electrical conduction, mechanical support, and heat dissipation. They combine a conductive copper layer with a heat-spreading aluminium base, connected by a special dielectric.

When current flows through the copper traces, it generates heat. The dielectric layer moves this heat down to the aluminium base, which then spreads it across the board and out to the environment. This keeps components cool, even under heavy load.

When to use aluminum PCB?

Aluminum PCBs are widely used in applications where heat is an issue. That includes:

LED Lighting: Heat control improves brightness, lifespan, and efficiency.

Power Supplies: High-current paths stay cool and stable.

Automotive Electronics: High vibration resistance is perfect for engine bays and dashboards.

Communication Equipment: Enhanced thermal management ensures signal reliability.

Industrial Controllers: Strong mechanical support reduces failure under stress.

If your design involves high-power components or tight thermal tolerances, aluminium PCBs are the solution.

Conclusion:

Aluminum substrates have good thermal conductivity, mechanical strength and cost-effectiveness. Whether you’re building LED lights, industrial controls, or automotive systems, aluminium PCBs provide a solid foundation. Their superior heat management protects components, improves efficiency, and extends service life.

If you’re ready to upgrade your design with dependable aluminium PCBs, our experts at Best Technology are here to help. With advanced equipment, experienced engineers, and quick turnaround, we deliver quality you can trust. Contact us now at sales@bestpcbs.com

Tags:aluminium making process, aluminium manufacturing process, aluminum pcb board, aluminum pcb design, aluminum pcb manufacturing process
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What is the Sophisticated Embedded Copper Technology?

Thursday, July 31st, 2025

Embedded copper technology is a specialized PCB manufacturing process that enhances current handling and thermal performance by embedding copper directly into the board’s layers. In the realm of printed circuit board (PCB) manufacturing, efficient heat dissipation is a critical factor, especially as electronic devices become more compact and powerful. One innovative solution that addresses this challenge is embedded copper technology. This process involves embedding copper blocks in specific areas of the board, allowing direct thermal transfer from heat-generating components to the copper, thereby achieving rapid heat dissipation. Let’s delve into the details of this technology, including its types, key parameters, and material requirements.

Best Technology is a major PCB manufacturer in China, providing Embedded Copper PCB, embedded copper coin PCB, heavy copper PCB, and extra thin PCB in a rapidly expanding market. Our factory invites sophisticated embedded copper technology, embedded copper coin technology, and cutting-edge equipment for high-precision PCB manufacturing, enabling optimized thermal management and signal integrity solutions in 5G, EV, and aerospace applications. If you would like to enquire about the embedded copper technology price or need any technical support, just feel free to let us know at sales@bestpcbs.com. Our team provides relentless technical support throughout your product lifecycle.

Why Top Telecom Brands Choose Embedded Copper Technology?

Understanding Embedded Copper Technology

At its core, embedded copper technology is all about strategic thermal management. By embedding copper blocks in localized regions of the PCB, the heat from components in contact with these blocks is quickly conducted away, preventing overheating and ensuring the reliable operation of the electronic device. Embedded copper technology comes in two main types:

Through – embedded type: As the name suggests, this type involves embedding the copper block completely through a certain section of the board, creating a direct thermal path through that part of the PCB structure.
Semi – embedded type: Here, the copper block is only partially embedded into the board, still enabling effective heat transfer but with a different structural integration compared to the through-embedded type.

Understanding Embedded Copper Technology

Key Parameters and Characteristics

To ensure the successful implementation of buried embedded technology, several key parameters and characteristics must be considered.

Copper Thickness

The thickness of the red copper used in buried copper applications varies to meet different thermal and structural needs. Common thicknesses include 0.5mm, 0.6mm, 0.8mm, 1.0mm, 1.2mm, 1.6mm, 1.8mm, 2.0mm, 2.5mm, 3.0mm, 3.2mm, and 3.5mm.

Copper Block Thickness Capability

The normal thickness of the buried copper block is ≥1.0mm, with an extreme minimum thickness of 0.5mm. If the copper block thickness is less than 1.0mm, an unconventional review is required to assess the feasibility and potential challenges.

Relationship Between Copper Block Thickness and Grooved Materials

The thickness of the copper block is closely related to the combined thickness of the grooved prepreg (PP) and grooved core board:

For red copper with a thickness of 0.5-0.6mm, the copper block thickness is equal to the combined thickness of the grooved PP and grooved core board.
For 0.8mm red copper, the copper block thickness is 0-0.05mm thicker than the combined thickness of the grooved PP and grooved core board.
For red copper with a thickness of ≥1.0mm, the copper block thickness is 0.05 – 0.1mm thicker than the combined thickness of the grooved PP and grooved core board.

Copper Block Dimensions

The normal size of the embedded copper block is ≥3x3mm, with an extreme minimum size of 2.5×2.5mm. This ensures that the copper block can effectively perform its thermal conduction function while fitting into the PCB design.

PP Material Requirements

At least 2 sheets of interlayer PP should be used, and priority is given to PP with a high resin content. If the board thickness allows, it is best to use 2 sheets of 1080 PP with high resin content, and it can also be mixed with 106, 3313, 2116, and 7628 PP.
The commonly used PP material is FR-4. For special board materials such as TU-872SLK/M6/SH260/FR-27/FR-28, unconventional review and verification of the PP are required.
Additionally, the prepreg cannot use Rogers4450F, as this type of PP has poor fluidity, making it difficult to fill the gaps of the embedded copper, and the bonding force between the PP and red copper is relatively weak

What Industries Use Embedded Copper Technology?

Embedded copper technology, valued for its strong heat dissipation, is widely used in industries requiring effective PCB thermal management. Here are key application areas:

Telecommunications

High-power devices like 5G base stations and routers generate much heat. Embedded copper in their PCBs prevents overheating, ensuring stable signal transmission and equipment longevity.

Automotive Electronics

Modern cars, especially EVs, have heat-generating systems like ECUs, ADAS, and powertrains. Embedded copper PCBs manage this heat, boosting efficiency and reliability, e.g., ensuring accurate ECU operation for better fuel efficiency.

Industrial Automation

Robotics, PLCs, and motor drives in factories run continuously, producing significant heat. Buried copper keeps temperatures in check, ensuring consistent performance and reducing downtime, like enabling precise robotic arm movements.

Medical Devices

High-power medical equipment (MRI, CT scanners) needs reliable components. Buried copper in their PCBs dissipates heat efficiently, preserving device accuracy and safety for diagnostics and treatments.

What is the Difference between Embedded Copper Technology and Embedded Copper Coin Technology?

While both embedded copper technology and embedded copper coin technology aim to improve thermal and electrical performance in PCBs, they differ in structure, purpose, and manufacturing approach. These differences affect how each is used in real-world applications, especially where high power or efficient heat transfer is needed. Understanding these distinctions can help you choose the right solution for your specific design requirements. Key Points for Understanding the Differences:

Construction Method:
- Embedded copper uses etched copper patterns within PCB layers.
- Embedded copper coin involves physically inserting a solid copper piece into a cavity in the PCB.
Thermal Efficiency:
- Copper coin technology offers better localized heat dissipation due to the solid metal insert.
- Embedded copper layers dissipate heat over a wider area but are less efficient for hotspots.
Material Usage:
- Copper coin PCBs use more copper material per unit and may require custom milling and placement techniques.
Electrical Performance:
- Both methods enhance current capacity, but embedded copper coin PCBs can handle very high current due to the solid insert.
Manufacturing Challenges:
- Embedded copper coin PCB manufacturing needs precise cavity creation, bonding, or soldering, while embedded copper PCBs rely more on layer alignment and lamination.
Cost Impact:
- Embedded copper coin PCBs are generally more expensive due to the complexity of coin placement and material cost.
Application Suitability:
- Choose embedded copper technology for compact, high-layer PCBs needing better current paths.
- Opt for embedded copper coin technology when you need extreme thermal management in power-dense areas.

Item	Embedded Copper Technology	Embedded Copper Coin Technology
Copper Form	Thin copper trace or layer	Solid copper coin or insert
Main Function	Better current flow	Better heat dissipation
Current Capacity	High	Very High
Thermal Performance	Good	Excellent
Cost	Medium	High
Used In	Power PCBs, converters	LED PCBs, IGBT boards

What is the Embedded Copper Technology Price?

The cost of embedded copper technology depends on several factors such as copper thickness, PCB layer count, design complexity, and production volume. Since this technology involves specialized lamination and precision copper embedding, it is more expensive than standard PCBs but generally more affordable than embedded copper coin PCBs. Key Pricing Factors:

Copper Thickness:
Thicker copper (e.g., 4 oz or more) raises the cost due to material use and processing difficulty.
PCB Layer Count:
Multilayer PCBs (e.g., 6–12 layers) are more expensive due to complex lamination steps.
Board Size & Shape:
Larger boards or irregular shapes may require special tooling, increasing cost.
Design Complexity:
PCBs with tight tolerances or dense copper patterns need more precise manufacturing, which adds cost.
Surface Finish & Materials:
Using high-grade materials like Rogers, ceramic, or high-Tg FR4 increases the base price.
Volume & Lead Time:
Higher quantities usually get volume discounts. Rush orders may incur a premium.

Finally, for accurate pricing, it’s best to request a custom quote from a reliable copper coin PCB manufacturer. Sharing detailed Gerber files, copper thickness requirements, and order quantity helps the supplier provide precise cost estimates.

How to Control the Quality of Embedded Copper PCB?

Quality control is critical in the production of Embedded Copper PCBs because even small defects can affect performance, especially for high-current or thermal-sensitive applications. To ensure reliable function and long service life, manufacturers must follow strict processes during every step of production. Key Steps to Control Quality:

Design Verification
- Confirm the design files (Gerber, drill, stack-up) are correct.
- Check copper thickness and embedding depth specifications.
- Run DFM (Design for Manufacturability) checks before fabrication starts.
Material Inspection
- Verify incoming copper sheets for purity and uniform thickness.
- Check base material (e.g., FR4, ceramic) for quality certifications.
- Use only approved vendors for key materials.
Precision Copper Embedding
- Ensure accurate alignment during lamination.
- Monitor lamination pressure and temperature to avoid voids or delamination.
- Use CNC milling or laser drilling for high accuracy when creating cavities or channels for copper.
Bonding and Plating Quality
- Inspect the bonding between embedded copper and the surrounding dielectric.
- Ensure proper copper plating in vias and around embedded sections.
- Control surface finish (ENIG, HASL) thickness and uniformity.
Thermal Management Testing
- Use thermal imaging to check heat distribution.
- Verify thermal conductivity using standardized tests.
- Simulate working conditions to validate heat dissipation.
Electrical Testing
- Perform 100% electrical testing for opens and shorts.
- Measure resistance of copper paths, especially around embedded areas.
- Test high-current performance to ensure no overheating or voltage drop.
X-ray and AOI Inspection
- Use X-ray inspection to detect hidden defects under embedded copper.
- Apply Automated Optical Inspection (AOI) for visual defects such as misalignment or cracks.
Mechanical Stress Testing
- Conduct flex and vibration tests for mechanical reliability.
- Test peel strength of copper to ensure it is securely embedded.
Final Quality Assurance (QA)
- Check against IPC standards (e.g., IPC-6012 for rigid PCBs).
- Document inspection reports and traceability through MES systems.
- Conduct final visual and functional tests before shipment.

In summary, controlling the quality of Embedded Copper PCBs requires a mix of advanced equipment, skilled engineering, and strict inspection standards. From design verification to final testing, every step must be carefully monitored. Choosing a reliable manufacturer with strong quality systems ensures consistent performance and long-term reliability in demanding applications.

Why Choose Best Technology for Manufacturing Embedded Copper PCB and Copper Coin PCB?

Choosing the right manufacturer for Embedded Copper PCB and Embedded Copper Coin PCB is essential for ensuring product performance, durability, and timely delivery. Best Technology stands out as a professional and dependable partner for demanding PCB projects. Here’s why many global customers trust us:

1. Professional Engineering Support

Our experienced engineers work closely with you from design review to prototype testing. We offer expert guidance on copper thickness selection, embedding depth, and thermal management to help you get the most out of your design.

2. Advanced Manufacturing Equipment

We use high-precision CNC machines and laser systems for copper cavity processing, ensuring tight tolerances and reliable copper placement. Our modern lamination and plating lines guarantee high-quality bonding and finish.

3. Strict Quality Control Systems

Quality is our top priority. We follow ISO9001, IATF16949 for automotive, ISO13485 for medical, and AS9100D for aerospace standards. We implement rigorous QC inspection after each manufacturing step.

4. Fast Turnaround Time

With optimized workflows and flexible production lines, we can deliver both prototypes and mass production orders quickly. Our on-time delivery rate consistently exceeds 97%.

5. Flexible MOQ

Whether you require a small batch or a large volume, we are always available to assist you. For a small prototype, it is beneficial for startups and R&D projects.

6. Wide Material Selection

We offer a variety of base materials including FR4, Rogers, ceramic substrates, and more. For copper coins, we support custom sizes and shapes, and ensure the thermal and electrical specs match your exact requirements.

7. Extensive Experience with High-Power Applications

Best Technology has completed hundreds of projects involving embedded copper and copper coin PCBs for applications like power converters, LED lighting, IGBT modules, and automotive power control units. We have specific experience to present a practical solution for you.

8. One-Stop Service

From PCB fabrication to assembly and testing, we offer a full range of services under one roof. This reduces lead times and helps avoid delays or quality mismatches between different vendors.

To sum up, When you work with Best Technology, you get more than a PCB supplier — you gain a reliable partner dedicated to quality, speed, and customer success. For high-current or thermal-critical designs, our Embedded Copper PCB and Copper Coin PCB solutions provide the performance and reliability your project demands.

Why Choose Best Technology for Manufacturing Embedded Copper PCB and Copper Coin PCB?

In a nutshell, embedded copper technology offers a reliable and efficient solution for thermal management in PCB design. By understanding its processes, parameters, and material requirements, manufacturers can produce high-performance PCBs that meet the demanding heat dissipation needs of your product application. If you have any other questions, just feel free to contact us at sales@bestpcbs.com any time!

Tags:Embedded Copper Technology
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Copper Substrate PCB Design & Supplier, Fast Delivery

Thursday, July 31st, 2025

Looking for copper substrate PCB solution? Let’s discover benefits, applications, design specifications and guide for copper substrate PCB.

Are you troubled with these issues?

Why does your 5G base station PCB frequently drop connections at high temperatures?
Why do LED car headlights always lose light so quickly?
Why is signal loss in high-frequency communication modules so high?

Best Technology can provide solutions

72-hour express delivery system: Equipped with a fully automated laser drilling line, mass production orders ship within 3 days (including special insulation layer curing).
Cost optimization expert system: Unique copper thickness gradient design reduces raw material costs by 12% while ensuring performance.
Full-process thermal management solution: Provides a complete cooling solution from thermal simulation to mass production, reducing measured temperature rise by 28°C.

Welcome to contact us if you have any request for metal core PCB: sales@bestpcbs.com.

What Is the Definition of Copper Substrate PCB?

A Copper Substrate PCB is a type of printed circuit board that uses copper as the base material instead of traditional substrates like FR4 (fiberglass) or ceramic. In this type of PCB, a thick copper layer (usually much thicker than standard copper foil used in conventional PCBs) serves as the core or foundation for building the circuit. The copper substrate provides excellent thermal conductivity, electrical performance, and mechanical stability, making it ideal for high-power and high-heat applications such as power electronics, LED lighting, and automotive systems.

What Are Benefits of Copper Substrate PCB?

Advantages of copper substrate PCB:

Superior Thermal Management

Conducts heat 8x faster than standard FR4 PCBs (398W/mK vs. 0.3W/mK).
Reduces junction temperature by 15-30%, extending component lifespan.

Enhanced Electrical Performance

Lower impedance & better signal integrity for high-frequency applications (5G, RF).
Stable dielectric properties (Dk≤3.5) minimize signal loss.

Mechanical Durability

Withstands 3x higher mechanical stress than aluminum substrates.
Ultra-low thermal expansion (16.5ppm/℃) prevents warping at high temperatures.

Cost-Effective Longevity

50% smaller heat sink requirements cut system cooling costs.
30% longer operational life reduces replacement frequency.

Design Flexibility

Supports fine-line etching (0.1mm traces) for compact high-power designs.
Compatible with multi-layer stacking for complex circuits.

What Are Benefits of Copper Substrate PCB?

What Are Applications of Copper Based PCB?

High-Power LED Lighting – Superior heat dissipation (398W/mK thermal conductivity) ensures stable performance in LED arrays and automotive headlights
Power Electronics – Used in server power supplies, inverters, and motor drivers, handling currents up to 200A with 6oz copper foil
Automotive Systems – Critical for EV charging (OBC/BMS) and engine control units (ECUs), withstanding high temperatures (150℃+) and vibrations
Telecommunication Base Stations – Supports 5G RF components due to low signal loss and EMI shielding
Industrial Equipment – Welding machines, laser drivers, and UPS systems leverage its high current capacity (30A/mm²)
Aerospace & Defense – Radar systems and high-energy lasers rely on its thermal stability and reliability (MTBF >100k hours)
Medical Devices – Ensures precision in imaging equipment and surgical tools with minimal thermal expansion

Copper Based PCB Design Specification

Parameter	Technical Specification	Note
Copper Thickness	1oz (35μm)/2oz (70μm)/3oz (105μm)	For high-current applications, ≥2oz is preferred; 1oz for cost reduction
‌Base Material	Oxygen-free copper (purity ≥99.5%)	High conductivity (58MS/m) minimizes signal loss
Thermal Performance	Thermal conductivity ≥398W/mK	Ensures ≤30℃ temperature rise for power devices
‌Insulation Voltage	≥3000VAC	Enhances safety and meets UL certification
Trace Width/Spacing	Minimum 0.1mm (4mil)	Supports high-density routing with laser drilling
‌Current Capacity	1oz: 1A/mm², 2oz: 2A/mm²	Reduces thermal risks in high-current designs
Surface Finish	ENIG/HASL/OSP	ENIG for reliability, HASL for cost sensitivity

Copper Substrate PCB Design Guide

1. Substrate Material

Prioritize high-thermal-conductivity copper substrates (e.g., aluminum, copper, or iron substrates) with thermal conductivity ≥1 W/(m·K).
Select copper foil thickness (typically 35μm–210μm) based on current-carrying requirements.
Insulation layers must be high-temperature-resistant and highly insulating (e.g., polyimide or modified epoxy resin).

2 Layer Stack-Up

Single-layer copper substrates: Suitable for simple thermal management (e.g., LED lighting).
Multi-layer copper substrates: Use prepreg for interlayer insulation to prevent delamination due to thermal stress.

3. Routing Optimization

Use wide traces (≥0.5 mm for 1 oz copper) for high-current paths to minimize heating.
Separate signal and power traces to avoid electromagnetic interference (EMI).
Avoid sharp 90° bends; use 45° chamfers or arc transitions.

4. Thermal Design

Place thermal copper pads beneath critical components (e.g., MOSFETs, ICs) and connect them to the copper substrate via thermal vias.
Thermal vias: Diameter ≥0.3 mm, spacing ≤1.5 mm, filled with thermally conductive material (e.g., silver paste).

5. Lamination & Etching

Lamination temperature: 180–200°C, pressure ≥30 kg/cm² to ensure adhesion between copper and insulation layers.
Use alkaline etching solutions to avoid undercutting and maintain trace width accuracy.

6. Surface Finish

Recommend ENIG (Electroless Nickel Immersion Gold) or OSP (Organic Solderability Preservative) for oxidation resistance and soldering reliability.
Apply anti-oxidation treatment (e.g., nickel or tin plating) to copper substrate surfaces.

7. Thermal Performance Testing

Conduct thermal cycling tests (-40°C to 125°C, ≥100 cycles) to verify material compatibility of thermal expansion coefficients.
Use infrared thermal imagers to detect hotspots; ensure temperature rise ≤30°C under full load.

8. Electrical Performance Verification

Impedance control: Adjust trace width/spacing based on signal speed, with tolerance ≤10%.
High-voltage testing: Insulation layer withstand voltage ≥500 V AC, leakage current ≤1 mA.

9. Cost Control

Simplify layer count; prioritize single- or double-layer designs.
Use standardized substrate sizes (e.g., 100 mm × 100 mm) for mass production.

10. Gerber File Requirements

Clearly mark copper substrate areas (e.g., .GTO layer) to distinguish signal and thermal layers.
Provide 3D assembly drawings with component height and thermal structure clearance annotations.

11. DFM (Design for Manufacturability) Check

Minimum trace width/spacing ≥0.2 mm, via diameter ≥0.3 mm.
Avoid placing critical components within 5 mm of substrate edges.

Why Choose Best Technology as Copper Substrate PCB Supplier?

Reasons why choose Best Technology as copper substrate PCB supplier:

24-Hour Rapid Prototyping: Accelerate product validation by 5x, beat competitors to market.
A Week Mass Production Turnaround: Eliminate supply chain bottlenecks during peak seasons.
Thermal Performance Optimization: Reduce power module temperatures by 25%, extend product lifespan.
Cost-Efficient Material Solutions: Achieve 15% higher profitability for LED/5G products.
High-Density Routing Expertise: Miniaturize IoT devices without sacrificing performance.
Global ISO/RoHS/REACH/UL Compliance: One-step certification for EU/US markets.
Smart DFM Support: Avoid costly redesigns with first-pass success guarantee.
Flexible Order Capacity: 100-100,000+ panel batch production capability.

Our Copper Substrate PCB Capabilities

Base material:	Copper
Thermal Conductivity (dielectric layer):	0.8, 1.0, 1.5, 2.0, 3.0 W/m.K.
Board Thickness:	0.5mm~3.0mm(0.02″~0.12″)
Copper thickness:	0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 10 OZ
Outline:	Routing, punching, V-Cut
Soldermask:	White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color:	Black/White
Surface finishing:	Immersion Gold, HASL, OSP
Max Panel size:	600500mm (23.62″19.68″)
Packing:	Vacuum/Plastic bag
Samples L/T:	4~6 Days
MP L/T:	5~7 Days

Our Quality Inspection & Certification

Certified & Compliant Standards: ISO 9001, ISO 13485, IATF 16949 Certified, and UL, REACH, RoHS Compliant.
AOI (Automated Optical Inspection): Detects surface defects like open/short circuits, missing components, and soldering issues.
X-Ray Inspection (Internal Defect Screening): Checks solder joint voids, cracks, and BGA/QFN hidden defects.
Peel Strength Test (Adhesion Assessment): Quantifies copper-clad laminate bonding force (ASTM D903).
Aging Test (Environmental Stress Screening): Includes thermal cycling (-40℃~85℃) and humidity exposure to validate long-term reliability.
Dimensional Verification (CMM/Profilometer): Measures thickness (±0.1mm), flatness, and hole alignment accuracy.

How to Get A Quote For MCPCB Project?

To ensure an accurate and fast quotation, please provide the following details:

‌1. Required Technical Specifications‌

Layer Count‌ (1L/2L/Multilayer)
‌Base Material‌ (Aluminum/Copper/Ceramic) & Thickness
‌Copper Weight‌ (1oz/2oz/3oz)
‌Board Dimensions‌ (Length × Width ± Tolerance)
‌Special Requirements‌ (Impedance control, blind/buried vias, etc.)

2. Files to Submit‌

Gerber Files‌ (RS-274X format preferred)
‌Drill Files‌ (Excellon format)
‌Stackup Diagram‌ (If multilayer)
‌Schematic & BOM‌ (For assembly projects)

3. Additional Information‌

Quantity‌ (Prototype/Bulk order)
‌Preferred Lead Time‌ (Standard/Expedited)
‌Surface Finish‌ (ENIG/HASL/OSP, etc.)

Why Choose Best Technology?‌

‌24H Rapid Prototyping‌ – Fast-track your product launch.
‌Cost-Effective Solutions‌ – Optimized designs save 10–15% on material costs.
‌Reliability‌ – 99.8% first-pass yield for high-power applications.

Get Your Quote Today!‌ Contact us at sales@bestpcbs.com with your project details.

Tags:copper base pcb, copper substrate PCB
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