Archive for the ‘best pcb’ Category

LED Wall Washer Aluminum PCB Manufacturer

Thursday, August 21st, 2025

Why choose LED wall washer aluminum PCB? Let’s explore its benefits, technical parameter, thermal solution, design guide, selection guide through this blog.

Are you troubled with these problems?

Poor heat dissipation leads to rapid light decay and short product lifespan?‌
Outdoor environments cause PCB corrosion and oxidation?‌
Heavy wall washer fixtures warp during installation?‌

Best Technology can provide services and solutions:

Custom Thermal Design‌ – Optimize aluminum PCB thickness and copper layer layout for precise temperature control.
Environmental Testing‌ – Provide third-party certification for waterproofing, shock resistance, and outdoor durability.
Fast Prototyping‌ – 24-hour turnaround for aluminum PCB samples, accelerating R&D cycles.

Welcome to contact us if you have any inquiry for LED wall washer aluminum PCB: sales@bestpcbs.com.

Why Choose LED Wall Washer Aluminum PCB?

Reasons why choose LED wall washer aluminum PCB:

Efficient heat dissipation and stable operation: The aluminum base plate quickly dissipates heat, preventing LED damage from high temperatures, ensuring long-term stable operation at high power levels and significantly delaying lumen degradation.
Lower cost and high cost-effectiveness: Aluminum’s low cost and inherent heat dissipation eliminate the need for external heat sinks, significantly reducing material and assembly costs.
Lightweight and compact, saving space: High heat dissipation efficiency allows for a thinner and lighter luminaire, eliminating the need for additional heat sink components and enabling flexible installation in confined locations.
Increased lifespan and reduced maintenance: Temperature control extends LED lifespan to over 30,000 hours, reducing maintenance requirements for outdoor applications at high altitudes.
Weather-resistant and resistant to harsh environments: The aluminum base plate is impact- and vibration-resistant, and the die-cast housing achieves IP67 waterproofing, making it suitable for outdoor use in the sun and rain.
Environmentally friendly and recyclable, in line with current trends: Aluminum is non-toxic and 100% recyclable, with low energy consumption in production, meeting green manufacturing requirements.
Supporting high power density: Carrying high current density, it drives densely packed, high-brightness LEDs for uniform, powerful wall-washing lighting.

LED Wall Washer Aluminum PCB Technical Parameter

Parameter Category‌	‌Technical Specifications	Description‌
Base Material‌	Aluminum alloy (5052/6061)	Thickness: 1.0-3.2mm, with anodized surface treatment
Thermal Conductivity	Conductivity: 1.0-8.0 W/(m·K)	Standard type (1.0-2.0) for medium-low power, high-conductivity (3.0-8.0) for high-power applications
Insulation Layer‌	Thickness: 50-200μm	Epoxy resin with ceramic filler, slightly higher loss than FR-4
	Dielectric Constant: 4.5-5.0 (1GHz)
	Dielectric Strength: ≥3 kV/mm
‌Thermal Resistance	Total thermal resistance: 0.8-3.0°C/W	Depends on copper foil area and insulation layer thickness
	Interface resistance: <0.5K/W (eutectic soldering)
‌Electrical Parameters	Operating voltage: AC220V/DC24V	Suitable for outdoor environments
	IP65 protection Operating temp: -40°C to +60°C
‌Mechanical Properties	Dimensional tolerance: ±0.1mm (custom modules)	Minimal impact from anodizing
	Surface roughness: Ra 0.2-0.8μm
‌Process Standards	Copper foil thickness: 35-70μm	Compatible with SMT and reflow soldering
	Peel strength: 1.0-1.5 kgf/cm UL94 V0 flame retardancy

How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

1. Superior Thermal Management for Optimal LED Operation

Heat Dissipation Efficiency: Aluminum PCBs (thermal conductivity 1-10 W/m·K) outperform FR4 (0.3 W/m·K) by 10x+, rapidly conducting 70% of LED-generated heat away from chips.
Temperature Control: Low thermal resistance (0.05–0.2 K/W) enables safe operation at >10W/chip, reducing junction temperature by 10–15°C and minimizing light decay.

2. Electrical Performance Optimization

Conductivity Advantage: Aluminum’s low impedance cuts power loss, improving system efficiency.
Light Output Boost: White-coated PCBs enhance reflection efficiency by 30%+, indirectly reducing energy consumption per lumen.

3. High-Density Design Support

Compact Integration: Aluminum substrates allow higher LED density (e.g., 500+ LEDs/m²) with uniform light distribution, ideal for large-scale illumination.
Mechanical Reliability: High bending strength prevents solder joint failures under vibration or thermal stress.

4. Cost & Lifespan Benefits

Extended Lifetime: Thermal efficiency extends LED lifespan to 50,000+ hours (2–3x longer than standard solutions).
Simplified Design: Eliminates 40% of external heat sinks, reducing material costs and assembly complexity. Aluminum recycling aligns with sustainability goals.

5. Real-World Application Advantages

High-Power Models: 48W wall washers leverage aluminum PCBs for compact IP66-rated designs, avoiding thermal failure.
Optical Optimization: Multi-layer structures (LED → phosphor → resin → reflective layer) maximize light extraction while efficiently managing internal heat.

How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

Wall Wash Light Aluminum PCB Thermal Solution

Copper Layer Thermal Design Optimization

Prioritize solid plane copper layers for maximum thermal conductivity (highest cost).
For cost-sensitive designs, grid patterns offer 80-90% thermal efficiency with ~10% cost reduction.
Avoid star/custom patterns unless required for EMC compliance (70-80% efficiency, unstable cost-benefit).

Thermal Via Design Refinement

Thermal vias are critical for heat transfer from component pads to aluminum substrate. Optimize parameters (diameter, pitch, copper thickness) to minimize thermal resistance.
Parallel thermal resistance network modeling simplifies design and improves efficiency by 20-30%. Reducing via pitch and increasing quantity is effective but requires cost-balance with drilling.

System Thermal Resistance Reduction

High-thermal-conductivity substrates: Use aluminum oxide (Al₂O₃) substrates (22-24 W/mK), outperforming FR-4/ceramic alternatives.
Thin dielectric layers: Minimize thickness while meeting electrical insulation requirements (key to low thermal resistance).
Reduce non-thermal vias: Excessive standard vias increase thermal path length and resistance.

Component Layout & Routing Strategies

Placement: Avoid hotspots by dispersing high-power components (LEDs, drivers). Position major heat sources near substrate edges or directly over thermal vias. Aim for uniform distribution.
Routing: Minimize long/thin copper traces to reduce resistive heating. Widen copper traces or increase thermal via contact area in critical paths (15-20% local thermal improvement).

Integrated Thermal Enhancement Measures

Heat sinks: Most common passive solution, handling ~70% of total heat load. Cost-effective and easy to integrate into housing.
Forced air cooling: Adds ~85% efficiency in enclosed/high-power units but increases cost, noise, and complexity.
Thermal interface materials (TIMs): Thermal grease/pads fill micro-gaps, improving interfacial conductivity by ~30% at low cost.
Liquid cooling: ~95% efficiency but highly complex and costly. Reserved for extreme power densities or specialized applications.

Convection Optimization

Component orientation: Align temperature-sensitive/heat-generating components with their long axis perpendicular to airflow in natural/forced convection.
Expose aluminum substrate: Directly expose large PCB aluminum areas to airflow where structurally feasible.
Airflow management: Arrange tall components parallel to airflow to reduce turbulence and avoid downstream thermal dead zones.

Substrate Material Selection

Aluminum-based PCBs (MCPCBs): Preferred for wall washers due to excellent thermal performance, mechanical robustness, CTE matching (reduces solder joint fatigue), and recyclability. Thickness range: 0.4-6.0mm.
Alumina ceramic substrates: Suitable for high-temperature/high-reliability applications (350-1500°C resistance) with good thermal conductivity.

Thermal Simulation Utilization

Use finite element analysis (FEA) in design phase to predict temperature distribution and identify hotspots.
Simulation-driven optimization reduces post-development thermal issues by 20-30%, lowering risk and cost, especially for mass production.

LED Wall Washer Aluminum PCB Color Consistency Design Guide

1. LED Selection & Color Parameters

Color Tolerance (SDCM): Use SDCM ≤5 LEDs to ensure batch consistency.
Color Rendering Index (CRI): Prioritize Ra ≥80 LEDs (e.g., Lumileds LUXEON) for accurate color reproduction.
Dimmable Options: Support 1900K-5700K CCT ranges with SDCM ≤5 across all settings.

2. Aluminum PCB & Thermal Design

Material: High-thermal-conductivity 6063 aluminum (≥200W/m·K) with anodized coating.
Layout: LED spacing ≥20mm (adjust per power) to prevent localized overheating.
Wiring: 45° traces (width ≥0.5mm, spacing ≥0.3mm) to minimize current interference.

3. Optical System Optimization

Mixing Distance: Short-distance lenses (≤15mm) for RGBWY uniform blending.
Lens: Optical-grade PC/PMMA (transmittance ≥92%) with recessed design (depth ≥5mm).

4. Environmental Adaptability

Protection: IP65/IP66 with silicone sealing (e.g., Dow Corning 7091).
Temperature: Operate from -20°C to +60°C without deformation.

5. Production & Quality Control

Supplier Collaboration: Verify PCB color process (UV-resistant ink, reflection ≥85%).
Inspection: Tighten tolerances (PCB size ±0.1mm, pad alignment ±0.05mm).
Soldering: Through-hole preferred; SMT requires epoxy reinforcement.

6. Control System Compatibility

Dimming: DMX512 0-100% smooth control with Δu’v’ ≤0.005.
Driver: PF >0.9, ripple ≤5% (e.g., PFC circuit design).

7. Long-Term Reliability

Testing: 50,000-hour LM-80 validation, Δu’v’ ≤0.003 post-aging.
Coating: Acrylic varnish (50-80μm) for UV/chemical resistance.

LED Wall Washer Aluminum PCB Color Consistency Design Guide

LED Wall Washer Aluminum PCB Selection Guide

1. Thermal Performance Priority

Thermal Conductivity: 1.0-2.0 W/(m·K) for low-power (<50W) ≥3.0 W/(m·K) for high-power (>50W).
Substrate Thickness: 1.0mm (lightweight) or 2.0-3.0mm (heavy-duty cooling).
Construction: 6061 aluminum base + ceramic-filled insulation for low thermal resistance.

2. Electrical Safety Standards

Protection: IP65 dust/water resistance mandatory for outdoors.
Insulation: Dielectric strength ≥3 kV/mm, copper foil adhesion ≥1.0 kgf/cm.
Voltage: Match input (AC220V/DC24V) with driver compatibility.

3. Optical Compatibility

Beam Angle: 120° standard lens requires PCB layout alignment.
Color Quality: High CRI (Ra>90) needs low-decay LEDs.
Efficacy: ≥10 lm/W for white light; RGB requires independent control zones.

4. Mechanical & Environmental Durability

Coating: Anodized + conformal coating (humidity/mold resistance ≤Class 1).
Impact Resistance: Die-cast aluminum housing (IK10 certified).
Temperature Range: -40°C to +60°C operational certification.

5. Cost & Supply Chain

Material Efficiency: Smart panel layout reduces waste by 23%.
Packaging: SMT-compatible reel packaging recommended.
Certifications: UL94 V0 flammability rating + RoHS compliance.

LED Wall Washer Aluminum PCB Selection Guide

Why Choose Best Technology as Aluminum PCB Manufacturer?

Reasons why choose us as LED wall washer aluminum PCB manufacturer:

1. Premium Quality Assurance

Material Selection: Use 6063/6061 aluminum with thermal conductivity ≥150W/m·K (3x higher than industry average).
Certifications: UL, RoHS, and IP65 compliance guaranteed for harsh outdoor environments.

2. 19 Years of Industry Expertise

Specialized Experience: Dedicated focus on LED lighting PCBs since 2005, with 500+ wall washer projects completed.

3. Cost-Effective Solutions

Price Advantage: 15-20% lower than competitors via optimized production lines and bulk material procurement.
Design Optimization: Free DFM reduces material waste by up to 25% without compromising performance.

4. Fast Delivery

Lead Time: 24 hour rapid prototyping, 5-7 days for mass production (50% faster than industry standard).

5. Free DFM Support

Pre-Production Analysis: Identify thermal bottlenecks, electrical risks, and assembly issues pre-manufacturing.
Design Adjustments: Optimize LED layouts for 30% higher lumen density while maintaining thermal safety.

6. Stringent Quality Control

Thermal cycling (-40°C~+125°C, 1000 cycles).
48-hour burn-in test for all batches.
AOI/X-ray inspection for solder joint integrity.

7. Customization Capability

Flexible Design: Support ultra-thin (0.8mm) to heavy-duty (3.2mm) substrates.
Special Coatings: White solder mask for 95% reflectivity, anti-sulfur treatment for coastal areas.

Welcome to contact us if you have any request for LED wall washer aluminum PCB: sales@bestpcbs.com.

Tags:aluminum pcb, LED Wall Washer
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

Copper Deposition PCB for HDI Board

Thursday, August 21st, 2025

Why choose copper deposition PCB for HDI board? Let’s explore technical parameter, benefits, production process, optimization solutions for copper deposition PCB.

Are you troubled with these problems?

How to ensure even copper deposition for HDI boards?
How to prevent signal loss from excessive copper thickness?
How does incomplete microvia filling affect PCB reliability?

Best Technology can provide service and solution:

Precision Thickness Control – Pulse plating ensures ±5% copper thickness tolerance.
Microvia Fill Technology – High-ductility copper eliminates voids, boosting yield by 15%.
Eco-Friendly Additives – Cyanide-free plating reduces wastewater treatment costs, RoHS compliant.

Welcome to contact us if you have any request for copper deposition PCB: sales@bestpcbs.com.

What is Copper Deposition PCB?

Copper deposition PCB is a circuit board manufacturing technology that deposits a copper layer on the substrate surface through electrolytic or chemical methods. This technology is categorized into two main types: electroplated copper (which requires a conductive layer and is used for through-hole plating and surface thickening) and electroless copper (which does not require a conductive layer and is suitable for metallizing non-metallic substrates such as plastics).

This process directly impacts the PCB’s conductivity, signal transmission speed, and structural reliability. It is a core technology for achieving high-density interconnect (HDI), flexible circuits, and electromagnetic shielding. It is widely used in 5G communications, automotive electronics, and consumer electronics.

Copper Deposition PCB Technical Parameter

Parameter Category	Technical Specifications
Copper Layer Thickness	Electroless: 0.3–1μm (0.01–0.03oz)
	Electrolytic: 5–70μm (1–3oz)
	Thick Copper: Max 30oz (≈1050μm)
Plating Uniformity	Hole wall copper thickness variation ≤15%
Plating Uniformity	Surface copper tolerance ±10%
Current Carrying Capacity	1oz (35μm): 1.8A/mm²
	2oz (70μm): 3.6A/mm²
	3oz (105μm): 5.4A/mm²
Surface Roughness	Electrolytic Foil: Ra 0.8–1.2μm
Surface Roughness	Rolled Foil: Rz ≤3μm
Tensile Strength	Electrolytic Foil: 150–300MPa
Tensile Strength	Rolled Foil: Elongation 20–40%
Min Line Width/Spacing	Inner Layers: 0.05mm
Min Line Width/Spacing	Outer Layers: 0.065mm
Hole Metallization	Mechanical Drill: ≥0.15mm
	Laser Drill: ≥0.05mm
	Aspect Ratio ≤8:1

Why Choose Copper Deposition PCB for HDI Board?

Electrical Conductivity & Signal Integrity

High Copper Conductivity: Minimal resistive losses (I²R) reduce line heating.
Microvia Direct Connections: Shorten signal path lengths by >30%, eliminating high-speed signal bottlenecks.

Thermal Management & Longevity

Thermal Conductivity: Exceeds aluminum (380-400 W/m·K), ensuring efficient heat dissipation for high-power components.
Thermal Stability: Low CTE (Coefficient of Thermal Expansion) minimizes solder joint fatigue under thermal cycling (-40°C~+125°C).

Space Efficiency & Component Density

Laser-Drilled Microvias: Filled with copper, enabling board thickness reduction to 0.4mm (vs. standard 0.6mm).
Copper-Pillar Interconnects: Replace traditional through-holes, achieving 30% higher component density.

Cost & Manufacturing Efficiency

Layer Reduction: 6-layer HDI design achieves equivalent performance of 8-layer conventional boards.
High Yield Rates: Mature electroless/electrolytic copper processes reduce rework (defect rate <0.2%).

Durability & Environmental Resistance

Mechanical Robustness: Withstands 1.5m drop tests and 50G vibration loads (industrial/automotive grade).
Humidity/Temperature Resistance: Maintains functionality in 95% RH and 85°C environments (IEC 60068-2-30).

Design Flexibility

Hybrid Architecture: Combines HDI zones (for 5G antennas/chip packaging) with conventional FR4 regions.
Thick Copper Integration: Supports 10oz+ copper layers for high-current power modules (≥200A).

How is Copper Deposited on HDI Board?

Copper Deposition Process for HDI Boards

1. Drilling

Laser (CO₂/UV) or mechanical drilling creates microvias (blind/buried holes) for interlayer connections. UV lasers achieve finer apertures (e.g., <25μm) with minimal thermal damage.

2. Desmear & Cleaning

Alkaline potassium permanganate treatment removes drilling residues, followed by cleaning to ensure contamination-free surfaces for metallization.

3. Chemical Roughening

Micro-etching (sulfuric acid/hydrogen peroxide) roughens copper surfaces (2-3μm depth) to enhance adhesion between the electroless copper layer and substrate.

4. Activation

Colloidal palladium activation deposits catalytic particles on non-conductive via walls, replacing outdated sensitization methods for reliable adhesion and avoiding copper displacement issues.

5. Electroless Copper Plating

A thin conductive layer (0.5-1μm) is deposited via autocatalytic reduction (copper ions + formaldehyde reductant) to initiate conductivity on via walls.

6. Electroplating Copper Thickening

Pulse electroplating adds 20-30μm copper to fill vias and reinforce conductivity. Parameters: current density 2-3A/dm², copper concentration 28-32g/L, temperature controlled.

7. Pattern Transfer & Etching

Photoresist coating, exposure, and development create circuit patterns. Wet/dry film etching removes excess copper, retaining designed traces.

8. Lamination & Stacking

Prepreg layers and core boards are vacuum-laminated under high temperature (180-190°C) and pressure (90-min curing) to form multilayer structures.

9. Surface Finish(Optional)

OSP: Organic solderability preservative (cost-effective, oxidation-resistant).
ENIG: Electroless nickel immersion gold (superior conductivity for high-frequency signals).
Immersion Ag/Au: Enhanced solderability (Ag requires anti-tarnish measures).
HASL: Hot air solder leveling (traditional, lower cost but less flatness).

10. Quality Inspection

AOI, X-Ray (via filling check), electrical tests (continuity, impedance), and reliability trials (thermal stress, salt spray) ensure compliance.

Copper Deposition Optimization for HDI Inner Layer Circuits

1. Plating Solution Formulation Optimization

Adjust copper salt concentration and additive ratios (e.g., levelers, suppressors) to balance deposition rate and uniformity.
Introduce chloride-based carriers to enhance throwing power and reduce void defects in via filling.

2. Substrate Surface Preparation

Use plasma or chemical roughening to improve copper-substrate adhesion.
Ensure strict cleaning (oxide/organic residue removal) to prevent discontinuous deposition or delamination.

3. Process Parameter Control

Apply dynamic current density (pulsed plating) to optimize copper thickness distribution across hole walls and surfaces.
Maintain temperature at 20–25°C to avoid crystal structure defects from precipitate formation.

4. Equipment & Flow Design

Upgrade plating tank agitation (jet + vibration systems) to minimize edge effects and thickness variation.
Use high-purity titanium anode baskets with soluble anode membranes for ion balance maintenance.

5. Inline Monitoring & Feedback

Deploy real-time resistivity sensors for automated additive replenishment based on solution composition.
Integrate laser thickness gauges for closed-loop control, reducing post-plating grinding loss.

6. Sustainability & Cost Efficiency

Develop low/cyanide-free plating systems to cut wastewater treatment costs.
Optimize plating tank load (≥80%) to minimize copper ball consumption and downtime.

7. Failure Mode Analysis

Build defect databases (nodules, pinholes) using DOE to identify critical process windows.
Regularly test ductility (≥15%) and resistivity (≤2.0μΩ·cm) for reliability assurance.

Long-Term Reliability of HDI Boards via Copper Deposition

1. Grain Structure Optimization

Control copper grain size (<5μm) and directional alignment to reduce grain boundary sliding under thermal stress.
Use pulsed plating for denser grains, lowering fatigue crack initiation risk.

2. Additive Residue Management

Monitor decomposition byproducts of organic additives (e.g., suppressors, brighteners) to prevent electrochemical migration.
Apply activated carbon filtration for ≥99.9% purity.

3. Thermal Stress Mitigation

Add graded metal layers (e.g., Ni/Au) between copper and substrate to address CTE mismatch.
Validate solder joint reliability via thermal cycling (-55°C to 125°C), targeting ΔTg ≤5°C.

4. Environmental Resistance

Limit porosity (<2 defects/cm²) to block moisture-induced corrosion.
Post-plate baking (150°C/2h) removes residual moisture for humidity resistance.

5. Electromigration Prevention

Optimize copper thickness uniformity (±3μm) to avoid high current density zones.
Use Co/Pd alloy barriers to extend MTBF >20 years.

6. Dynamic Load Monitoring

Embed fiber optic sensors for strain distribution tracking (resolution ≤1με).
Predict remaining lifespan via ML with <10% error margin.

7. Standards Compliance

Meet IPC-6012DS: peel strength ≥1.4N/mm, solderability at 260°C/10s.
Third-party testing (UL/CSA) confirms ≤5% electrical degradation after 125°C/1000h aging.

Our Copper Deposition HDI Board Case Studies

With ‌19 years‌ of specialized experience in copper deposition for HDI boards, we have successfully delivered ‌thousands of projects‌ across industries. Our expertise spans from ‌precision electroplating‌ and ‌microvia filling‌ to ‌full-turnkey solutions‌, from design, prototyping, mass production, and assembly. Whether it’s ‌5G base stations, automotive radar, or ultra-thin consumer electronics‌, we ensure ‌high-reliability interconnects‌ with consistent yield rates. Partner with us for ‌scalable, cost-optimized‌ HDI manufacturing. Here is a photo of copper deposition HDI board we made before:

Why Choose Best Technology as Copper Deposition PCB Manufacturer?

Reasons why choose us as copper deposition PCB manufacturer:

19-Year PCB Manufacturing Expertise: Proven track record in handling complex designs (e.g., HDI, RF, automotive) with 98.5% on-time delivery.
Global Certifications: ISO 9001, ISO 13485, UL and RoHS compliance guarantee product safety and regulatory adherence.
Cost Predictability: Transparent pricing model + bulk production optimization reduce hidden costs, achieving 15-20% cost savings under equivalent quality standards.
Fast Turnaround: 72-hour delivery for standard orders, 24-hour rapid prototyping, cutting R&D cycles by over 30% to accelerate market entry.
Strict Quality Inspection: Full-process AI visual inspection + 100% batch inspection ensure defect rates below 0.03%, minimizing post-sales repair costs.
Design Optimization Empowerment: Free DFM (Design for Manufacturability) analysis identifies design risks upfront, reducing average re-spin iterations by 2 and saving 1 week of development time.
Multi-Surface Finish Compatibility: Supports 8 surface treatment processes (HASL/ENIG/OSP/etc.), catering to automotive, medical, consumer electronics, and other high-reliability sectors.
Supply Chain Synergy: One-stop service from raw material sourcing to final packaging, eliminating communication costs associated with managing 5+ suppliers.
Eco-Compliant Manufacturing: Lead-free copper deposition process meets RoHS/REACH standards, simplifying global certification for clients.
Expert Technical Support: 10+ years of industry experience with 24/7 engineer assistance, resolving technical challenges and enhancing product reliability.

Welcome to contact us if you have any request for copper deposition HDI board: sales@bestpcbs.com.

Tags:Copper Deposition PCB, HDI Board
Posted in best pcb, bestpcb, HDI PCB, PCB Technology | No Comments »

What is Copper Inlay PCB?

Thursday, August 21st, 2025

Copper inlay PCB is a special circuit design method that significantly improves heat dissipation capability and current loading performance by inlaying copper in a PCB. This technology is widely used in power electronics, automobile electronics, and GaN devices, helping to tackle the difficult heat management problem of traditional PCBs in high-power and high-density environments.

Do you suffer from these headaches?

Poor heat dissipation problem in traditional PCBs?
High manufacturing difficulty and cost issues, such as easy to have alignment issues and material waste?
The compatibility problem between design and manufacturing? For example, in design, there may be a compatibility problem between the inlay copper structure and the other parts of the PCBs, such as the layer alignment, hole diameter, and the edge treatment, which finally leads to the manufacturing difficulty increasing.
Problems with the material selection and cost?

Here are some real solutions Best Technology uses in customers’ projects.

Optimizing design and manufacturing process: Best Technology adopts high-precision manufacturing processes, such as laser etching or photolithography.
Optimizing material selection: We use high-purity copper material to improve conductivity and mechanical performance. Besides, select a copper substrate or an aluminum substrate to improve thermal dissipation performance and reliability.
Controlling costs and boosting manufacturing: Best Technology optimizes design to reduce material waste and manufacturing complexity.
Optimizing heat dissipation and thermal management: We employ a multilayer copper inlay structure to boost the thermal dissipation capability

Best Technology provides copper inlay PCB design optimization, prototype, mass production, and assembly service. We have productive experience to tackle the thermal dissipation problem, manufacturing difficulty, and material selection issues. If you have any technical questions or doubts, a warm welcome to get in touch with us at sales@bestpcbs.com.

What is copper inlay PCB?

Copper inlay PCB integrates solid copper pieces into specific areas of a PCB. It benefits to improve conductivity capability and quick heat dissipation performance. In high current or high power applications, this design is more reliable than the design that purely make the thicker copper layer.

What is the relation: PCB inner layer copper thickness, copper inlay PCB?

The PCB inner layer copper thickness directly affects the board’s electrical and thermal behavior. It is good to know that if purely depending on copper thickness can’t meet demands in high power applications, then copper inlay PCB has a key role here. It boosts the copper thickness and quality in the part area, so as to improve the performance of the current load and heat dissipation.

Aspect	PCB Inner Layer Copper Thickness	Copper Inlay PCB
Definition	Standard copper thickness used across PCB inner layers	Embedded solid copper blocks in selective PCB areas
Main Role	Supports current flow and basic thermal paths	Handles high current and localized heat dissipation
Application	General PCB design, balanced power distribution	High-power, high-density, or thermally stressed zones
Performance Impact	Limited by overall copper thickness	Significantly boosts current and thermal capability

What is difference: copper inlay PCB, copper pour in PCB?

Copper inlay and copper pour are different strategies. Copper pour in PCB generally is for large area grounding or power distribution; however, copper inlay PCB is for the part area strengthening. The former one is limited to copper thickness, and its heat dissipation capability is limited. However, the latter one conducts heat directly via a solid copper block, and its effect is more significant.

Aspect	Copper Inlay PCB	Copper Pour in PCB
Material	Solid copper blocks inserted into PCB cavities	Large copper area formed by plating during PCB process
Purpose	Localized thermal control and high-current pathways	Power planes, ground planes, signal return paths
Precision	Highly targeted in selected PCB zones	Spread across wide board sections
Thermal Efficiency	Superior, due to direct copper mass and conduction	Limited by copper thickness and plane size

Why do PCBs use copper inlay?

PCB using copper inlay to mainly tackle the problem of the heat dissipation bottleneck and the current overloading. As the device is getting smaller and smaller while the power is getting larger and larger, the traditional PCB copper layer is easy to overheat, leading to failure. Copper inlay technology provides a stable thermal path and the current route, which reduces the failure rate and extends the product lifespan radically.

How to inlay copper into PCB?

The fabrication process includes copper block cutting → inlaying it into the PCB cavity → lamination bonding → common drilling, plating, and the etching process.

In this way, it not only ensures the bonding between the copper block and circuit boards but also ensures the surface smoothness and the overall heat conductivity effect. In actual production, it may need to adjust the process according to the specific parameters, such as copper block thickness and substrate types.

What is the Copper inlay PCB price?

Copper inlay PCB price depends on the board’s size, design complexity, and copper block quantity. Although the cost is higher than a common PCB, in high-power applications, it will reduce the repair and maintenance costs significantly due to the good heat dissipation. Hence, from the whole lifespan cost, it will be more cost-effective.

What are the advantages of GaN device thermal with copper inlay PCB in high-power applications?

A GaN device thermal with copper inlay PCB gives engineers a way to manage extreme heat and high currents. And it takes center stage in the high-power applications.

The high efficiency of heat conductivity in the PCB minimizes the risk of GaN devices overheating, supporting consistent performance even under demanding conditions.

Enhanced heat management ensures more stable high-frequency operation and improves switching performance, making the device suitable for rigorous tasks.

The copper inlay PCB enables the device to handle higher current densities without performance loss or overheating.

Keeping reliable operation in the compact design.

Extending the lifespan of the device and reducing the heat stress.

How does PCB copper inlay improve heat dissipation?

PCB copper inlay offers a direct heat dissipation path for the key heating components. The specific performance is as follows:

Rapidly conduct heat into the copper layer or heat sinks.

Reduce the operation temperature of the key components.

Reduce hotspots and protect the sensitive devices.

Improve the integrated power efficiency and stability.

Extend the operation lifespan of circuit boards.

In summary, copper inlay PCB is a workable solution to tackle the problem in the heat dissipation of the high-power and high heat density applications, and in the electrical performance. Best Technology wins customers’ trust and repeat orders since our team not only ensures customers get reliable and high-performance circuit boards via our rigorous quality control and rapid lead time, but also provides high-quality solutions. If you have any new projects, just feel free to contact us for a free DFM analysis, quick prototype, full turnkey fabrication, assembly, and box build service at sales@bestpcbs.com.

Tags:copper inlay pcb
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COB immersion gold aluminum substrate, Gold immersion plating

Thursday, August 21st, 2025

COB immersion gold aluminum substrate is a high-power packaging solution that directly bonds the LED chip (Chip On Board) to an aluminum substrate treated with immersion gold.

The aluminum substrate quickly dissipates heat, while the immersion gold layer ensures long-term oxidation resistance of the chip pads, ensuring reliable soldering. This eliminates the need for brackets and reflow soldering, resulting in higher luminous efficacy and longer lifespan. It has become a core substrate for high-power LED modules.

COB immersion gold aluminum substrate, Gold immersion plating

Do you have any questions about COB aluminum PCBs?

Does the immersion gold coating and thermal conductivity meet COB heat dissipation requirements?

Do the dimensions and specifications match COB packaging and lighting fixture installation?

Can the immersion gold process and materials withstand long-term high-temperature use?

Do the performance and cost meet expected price/performance ratios?

BEST Technology’s COB aluminum substrates can answer your questions.

The immersion gold layer reduces contact thermal resistance, while the aluminum base and highly thermally conductive insulation layer quickly dissipate concentrated heat from the COB, ensuring efficient heat dissipation.

The COB package area size and overall shape can be customized to accommodate different power COBs and lamp mounting structures.

The immersion gold layer offers strong oxidation resistance, and the substrate has undergone high-temperature cycling testing without delamination, ensuring it can withstand the long-term high-temperature operating environment of the COB.

High heat dissipation ensures COB lifespan, while customized processing optimizes costs, resulting in a reasonable balance of performance and price.

What is COB aluminum substrate?

COB aluminum substrate is a type of PCB that directly mounts LED chips on an aluminum base. Unlike traditional PCBs that use fiberglass, aluminum substrates use metal for better heat dissipation. This structure ensures LEDs operate efficiently and last longer.

The core of a COB aluminum substrate consists of three layers:

A copper circuit layer for electrical connections.

A dielectric layer for insulation and heat transfer.

An aluminum base layer for mechanical support and thermal conduction.

This design keeps LEDs cool and improves performance. It’s the reason COB substrates are widely used in LED lighting, automotive lights, and high-power applications.

Is immersion gold the same as ENIG?

Yes and no. Immersion gold is a key step in the ENIG (Electroless Nickel Immersion Gold) process. ENIG has two layers: a nickel layer and a thin gold layer. Nickel acts as a barrier to protect the copper, and gold prevents oxidation and ensures good solderability.

Therefore, immersion gold usually refers to the gold layer applied in the ENIG process. This finish is popular because it provides excellent corrosion resistance and long shelf life.

Can you plate aluminum substrate with gold?

Yes, you can. In fact, plating aluminum substrates with gold is common in high-end electronic applications. However, the process is not as simple as plating copper. Aluminum forms an oxide layer quickly, which must be removed before plating.

To apply immersion gold on an aluminum substrate, BEST Technology first coat the aluminum with a conductive layer, usually copper. Then, they apply the ENIG finish on top. This method ensures strong adhesion and reliable performance.

What are the benefits of immersion gold on aluminum substrates?

The benefits are impressive. Here are the main reasons why immersion gold is chosen for COB aluminum substrates:

Superior Corrosion Resistance: Gold does not tarnish or oxidize, so it protects the surface even in harsh environments.

Excellent Solderability: The gold layer makes soldering easier and more reliable, especially for fine-pitch components.

Improved Electrical Performance: Gold has low contact resistance, which enhances signal integrity.

Long Shelf Life: Boards with immersion gold can be stored longer without losing quality.

High Reliability for LED Applications: COB LEDs generate heat, and gold plating helps maintain stable performance under thermal stress.

These benefits make immersion gold plating a preferred choice for high-end LED lighting, automotive electronics, and industrial controls.

How thick is gold in ENIG finish?

The gold layer in an ENIG finish is very thin, but it’s enough to provide excellent protection. Typically, the thickness ranges from 0.05 to 0.1 microns. This thin layer ensures good solderability without adding significant cost.

The nickel layer beneath the gold is thicker, usually around 3 to 6 microns. Together, these layers create a strong barrier that protects the copper from oxidation and maintains good electrical conductivity.

Is ENIG better than HASL?

For high-end applications like COB aluminum substrates, ENIG is better than HASL (Hot Air Solder Leveling). Here’s why:

Flat Surface: ENIG provides a smooth, flat surface, which is essential for small components and fine-pitch designs.

Better Corrosion Protection: Gold offers superior resistance to oxidation compared to HASL.

Higher Reliability: ENIG is more stable for thermal cycling and high-power devices.

HASL is cheaper and works well for simple boards, but for COB LEDs, ENIG is the clear winner.

What are the problems with ENIG solderability?

ENIG is reliable, but there are some challenges:

Black Pad Issue: If the plating process is not controlled, it can lead to corrosion of the nickel layer, causing poor solder joints.

Higher Cost: ENIG is more expensive than HASL or OSP finishes.

However, these issues rarely occur when working with BEST Technology, a trusted PCB manufacturer that follows strict quality controls.

What are the uses of COB aluminum substrate?

COB aluminum substrates are used in a wide range of applications:

LED Lighting: High-brightness LEDs for residential, commercial, and industrial lighting.

Automotive Lights: Headlights, tail lights, and daytime running lights.

Display Backlighting: LCD and signage displays that need uniform light.

Medical Equipment: Devices that require precise lighting and heat management.

Industrial Control Systems: Where stable performance and long life are critical.

These uses show how important COB immersion gold aluminum substrates are in modern technology.

Conclusion:

COB aluminum substrates provide excellent heat dissipation and mechanical strength for LED applications. When paired with immersion gold plating, they offer even greater reliability, corrosion resistance, and solderability. ENIG is better than HASL for high-end boards, and the gold layer, though thin, ensures long-lasting performance.

If you need high-quality COB immersion gold aluminum substrates, contact us today at sales@bestpcbs.com

Tags:COB immersion gold aluminum substrate, gold immersion plating, immersion copper plating, immersion gold on copper, silver immersion plating
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB, PCB Technology | No Comments »

High Frequency PCB Materials, High Frequency Circuit Design

Thursday, August 21st, 2025

Have you ever faced such problems when design a PCB that used in high speed application?

Is your high-speed design bleeding signal strength?
How to solve poor thermal management in high-frequency systems to ensure stability and reliability?
How to effectively suppress severeEMI and meet EMC standards in high-frequency circuits?

At Best Technology, we fabricate high frequency PCB that can solve these problems. We use:

High quality materials with low loss and better shielding performance.
Utilize ground via array, densely arranging ground vias around radiation sources such as microstrip lines to form a “wall”.
Design multi-layer boards and adopt dedicated ground layers through reasonable stack-up design, provide a complete reference ground plane for high-frequency signals.

High frequency PCBs are essential in applications such as automotive radar, aerospace communication, medical imaging, 5G and satellite systems. These boards must handle signals above 100 MHz and, in many cases, well into the GHz range. At such speeds, signal losses, impedance mismatches, and electromagnetic interference (EMI) can cause severe degradation. Best Technology, a leading expertise in high frequency pcb manufacturing, can help to optimize your design and manufacture such board for you!

What is a High Frequency PCB?

A high frequency PCB is a printed circuit board designed to transmit signals above 500 MHz, often extending into 10 GHz, 30 GHz, or even higher depending on the application. Some applications, like automotive radar, require PCBs that perform stably at 77 GHz or more.

These boards are not limited to one sector. They are used in:

Wireless base stations and antennas
Radar for defense and vehicles
Satellite communication modules
High-speed computing and servers
Precision medical imaging devices

The key challenge is that as frequency rises, signals become more vulnerable to losses, reflections, and interference. A standard FR4 PCB cannot handle these issues beyond a certain point, which is why high frequency laminates and designs are essential.

High Frequency PCB Material

The choice of material determines how well a PCB will perform in high frequency environments. Engineers usually evaluate three main parameters:

Dielectric Constant (Dk): This defines how signals propagate through the material. A stable, low Dk improves signal speed and reduces delay.
Dissipation Factor (Df): Also called the loss tangent, this defines how much energy is lost as heat. Lower values are better for long-distance signal transmission.
Thermal Performance: Materials must handle fluctuating temperatures without expansion or deformation, especially in aerospace and automotive environments.

Common Materials Used in High Frequency PCB

PTFE (Teflon-based laminates): Offers extremely low loss and stable dielectric properties. Perfect for microwave and RF circuits, though harder to process during manufacturing.
Rogers laminates: Popular choices like RO4350B and RO3003 are widely used in communication devices due to their balance between cost and performance.
Arlon and Taconic: Trusted for aerospace and military-grade systems.
Ceramic-filled PTFE: Combines the benefits of PTFE with improved thermal stability, suitable for radar and satellite applications.
FR4: Economical, but only practical for low GHz applications, as losses rise sharply at higher frequencies.

When comparing FR4 to Rogers or PTFE, the difference is like comparing regular tires to high-performance racing tires. Both work, but only one is built for extreme conditions.

What is the Best PCB Material for High Frequency?

The “best” material depends on the actual use case. For example:

Up to 3 GHz: Rogers RO4350B provides stable performance at a manageable cost, widely used in RF applications.
Microwave range (10–30 GHz): PTFE laminates such as Taconic TLY or Rogers RO3003 give superior low-loss performance.
5G antennas: Low Dk and Df materials like Rogers RO4835 are chosen for consistent performance in outdoor environments.
Automotive radar (77 GHz): Ceramic-filled PTFE materials are the only reliable solution due to their high thermal and frequency stability.

Cost also matters. PTFE offers the lowest insertion loss but requires advanced processing, increasing manufacturing cost. Rogers materials are easier to fabricate and balance cost and performance, which is why they are widely used.

High Frequency PCB Characteristics

High frequency PCBs stand out due to specific characteristics:

Stable dielectric constant across wide frequencies
Low signal loss
Thermal durability
Controlled impedance
Dimensional stability

These boards are engineered not just to survive but to deliver reliable, repeatable performance in demanding environments.

High Frequency PCB Design Guidelines

Designing a high frequency PCB is a delicate balance of precision, material choice, and layout strategy. Even small mistakes in design can cause significant signal loss, reflection, or interference at gigahertz frequencies. Below are the key guidelines that engineers follow to ensure high performance.

1. Controlled Impedance Design

At high frequencies, the impedance of each trace must be carefully calculated and maintained. Variations in trace width, thickness, or dielectric spacing can cause reflections and signal degradation. Designers usually rely on simulation software to calculate controlled impedance for microstrip, stripline, or coplanar waveguide structures. The target impedance is often 50Ω for single-ended signals or 100Ω for differential pairs.

2. Minimize Trace Lengths

Signal paths should be as short as possible. Long traces increase insertion loss, cause delay, and may introduce unwanted reflections. In applications like RF communication or 5G antennas, even small increases in trace length can degrade signal integrity significantly.

3. Reduce the Number of Vias

Each via acts as a small inductance and capacitance, which can reflect high-frequency signals. Limiting via usage and optimizing via placement is essential. When vias are unavoidable, designers often use via stitching or back-drilling techniques to reduce parasitic effects.

4. Ground Planes and Reference Layers

A continuous, solid ground plane beneath signal traces improves return paths and minimizes electromagnetic interference (EMI). Multiple ground planes can be used in multilayer boards to enhance shielding and reduce noise coupling. Proper stacking ensures that signal layers are adjacent to reference planes, which stabilizes impedance and improves signal quality.

5. Differential Pair Routing

Differential pairs are widely used in high-speed digital and RF circuits. These pairs carry complementary signals, which improves noise immunity and reduces crosstalk. Designers maintain strict control over trace spacing, length matching, and symmetry to preserve signal integrity.

6. Stack-Up Optimization

The stack-up, or layer arrangement, determines how signal layers, power planes, and ground planes interact. Proper stack-up design can reduce cross-talk, improve thermal management, and control impedance. High frequency PCBs often use hybrid stack-ups with PTFE or ceramic layers to balance performance and manufacturability.

Every decision—from material choice to trace width, via placement to ground plane configuration—directly impacts signal integrity. A high frequency PCB is not just about connecting components; it is about managing signals, controlling impedance, and reducing loss to ensure reliable, precise performance in the gigahertz range.

High Frequency PCB Manufacturer – Best Technology

Not all manufacturers are capable of producing high frequency PCBs. Handling PTFE and ceramic materials requires different lamination temperatures, drilling techniques, and plating processes compared with FR4.

At Best Technology, we bring specialized expertise in:

Fabricating Rogers, Taconic, PTFE, and hybrid PCB stack-ups.
Maintaining strict dimensional tolerances for impedance control.
Advanced inspection to measure dielectric thickness, copper roughness, and loss factors.
End-to-end MES traceability to ensure every board can be tracked back to its source materials and processes.

This combination of material knowledge, certified systems, and engineering support makes Best Technology a trusted partner for customers who need more than just a standard PCB.

Insertion Loss Comparisons of Common High Frequency PCB Constructions

Material	Frequency (10GHz)	Insertion Loss (dB/inch)	Notes
FR4	~10GHz	0.7 – 1.0 dB	High loss, not recommended
Rogers RO4350B	~10GHz	0.2 – 0.3 dB	Cost-effective, reliable
Rogers RO3003	~10GHz	0.1 – 0.15 dB	Excellent for microwave use
PTFE Ceramic	~10GHz	0.05 – 0.1 dB	Premium choice for radar/5G

This table clearly shows why FR4 is avoided for RF designs. At high GHz levels, FR4 can lose more than three times the signal strength compared with PTFE laminates.

High Speed vs High Frequency PCB – What is the Difference?

The terms “high speed” and “high frequency” are often confused, but they describe different challenges:

High Speed PCB: Concerned with digital signals, rise times, and data rates. Examples: DDR memory boards, data centers, and Ethernet.
High Frequency PCB: Concerned with analog and RF signals in the GHz range. Examples: radar, antennas, and satellite communication.

In practice, many designs overlap. For instance, a 5G base station board must support high-speed data processing and high-frequency RF transmission simultaneously. This is why engineers often require both high-speed and high-frequency design expertise.

High Speed vs High Frequency PCB – What is the Difference?

Why Do We Need High Frequency?

High frequency PCBs enable many of the technologies that define modern life:

5G base stations and smartphones: Delivering ultra-fast, low-latency communication.
Automotive radar: Assisting advanced driver-assistance systems and autonomous driving.
Satellite communication: Providing global coverage for navigation and broadcasting.
Defense and aerospace: Supporting secure, high-performance radar and communication systems.
Medical devices: Enabling accurate imaging through MRI, CT, and ultrasound.

Without these boards, the next generation of communication and smart systems would not be possible.

Who Should Not Get High Frequency?

Not every project needs high frequency PCBs. For example:

A consumer product with simple sensors may not justify the extra cost.
Low-speed devices below 500 MHz can rely on FR4.
Cost-sensitive projects without high bandwidth needs should avoid high frequency laminates.

Choosing the right PCB type should always balance performance needs vs. budget.

FAQs

1. What frequency is considered high frequency in PCBs?

Any PCB designed to work above 500 MHz is typically considered high frequency, with advanced boards operating up to 60 GHz or more.

2. How does dielectric constant affect PCB performance?

A stable dielectric constant ensures signals propagate at predictable speeds and maintain impedance control, crucial for RF circuits.

3. Can FR4 be used for high frequency PCB?

FR4 works only up to around 1 GHz. Beyond that, losses become too high for reliable performance.

4. What are the challenges in manufacturing high frequency PCB?

Processing PTFE materials, achieving impedance accuracy, reducing insertion loss, and handling copper roughness are common challenges.

5. How to reduce signal loss in high frequency PCB design?

Use low-loss laminates, design shorter traces, avoid unnecessary vias, and apply smooth copper surfaces to reduce resistance.

Tags:high frequency pcb, high frequency pcb materials, high frequency vs high speed pcb
Posted in best pcb, bestpcb, Design Guide, FAQ, RF Board | No Comments »

Copper Multilayer PCB Manufacturer in China| Best Technology

Wednesday, August 20th, 2025

What is copper multilayer PCB? Let’s discover its material, benefits, applications, design guide for wearable device, production process through this blog.

Are you troubled with these problems?

High-frequency signal degradation killing your design?‌
Heat dissipation always a bottleneck?‌
Yield rates dropping with layer stacking?‌

Best Technology can provide service and solutions‌:

Rapid Response‌ – 24/7 engineering support, samples delivered in 48 hours.
Cost Efficiency‌ – Intelligent panelization + material reuse cuts costs by 15%.
‌Transparency‌ – Real-time production tracking with photo verification at key stages.

Welcome to contact us if you have any inquiry for copper multilayer PCB: sales@bestpcbs.com.

What is Copper Multilayer PCB?

Copper Multilayer PCB consist of alternating copper conductive layers and insulating materials (such as FR-4 or polyimide) bonded together through a lamination process. Copper’s high thermal conductivity (386W/m·K) and electrical conductivity support complex circuit designs, enabling high-density interconnection between layers through through-holes, blind vias, or buried vias.

This type of PCB is suitable for high-power applications (such as automotive electronics and 5G base stations), offering superior heat dissipation and signal stability compared to single- or double-layer PCBs. Its symmetrical structure (e.g., copper-prepreg-core-prepreg-copper) enhances mechanical strength and controls impedance. Some models also utilize thermal isolation technology to directly conduct heat.

What is Material of Multilayer Copper PCB?

1. Conductive Layer

Composition: Electrolytic copper foil (ED) or rolled copper foil (RA)
Features: Thickness 0.5–6 oz/ft² (17–210 μm), conductivity ≥58 MS/m (20°C), surface finish available: brown oxide (OSP) or nickel-gold (ENIG).

2. Insulation

FR-4: Epoxy resin + fiberglass, dielectric constant 4.2–4.8 (1 GHz), heat resistance 130°C (standard) / 170°C (high Tg).
Polyimide (PI): Dielectric constant 3.4–3.6 (1 GHz), heat resistance >250°C, short-term temperature resistance ≥300°C.

3. Prepreg (PP)

Composition: 7628/2116/1080 glass cloth impregnated with epoxy resin
Features: Thickness 0.05–0.2mm (0.1–0.4mm after lamination), resin content 52%–65%, curing conditions 180°C/60min.

4. Metal Substrate (Optional)

Aluminum Substrate: 1050/6061 alloy, thermal conductivity 180–220 W/m·K, thickness 1.0–3.2mm.
Copper Substrate: Electrolytic copper, thermal conductivity 386 W/m·K, thickness 0.5–2.0mm.

5. High-Frequency Material (Optional)

PTFE: Polytetrafluoroethylene, dielectric constant 2.2–2.5 (10 GHz), dissipation factor <0.001 (10 GHz).
Rogers RO4003C: dielectric constant 3.38 (10 GHz), dissipation factor 0.0027 (10 GHz).

6. Solder Mask

Composition: Liquid Photosensitive Solder Mask Ink (LPI)
Characteristics: Thickness 10–25μm, Temperature Resistance ≥ 150°C (short-term), Insulation Resistance ≥ 1×10⁸Ω.

What Are Advantages of Copper Multilayer PCBs?

Benefits of copper multilayer PCB:

High-density integration capabilities: By stacking multiple conductive layers (up to 32 layers), complex circuits can be integrated within a limited space, meeting the demands of miniaturized devices such as smartphone motherboards.
Excellent heat dissipation performance: Copper foil has a thermal conductivity of 400. W/m·K (nearly twice that of aluminum substrates), combined with a thick copper design (3–10 oz), allows for rapid heat conduction and reduces the junction temperature of high-power devices.
High-frequency signal integrity: Specialized high-frequency materials (such as PTFE) have a dielectric constant as low as 2.2–3.5, reducing signal loss and making them suitable for 5G base stations and radar systems.
Optimized electromagnetic compatibility: Multi-layer ground and power planes effectively shield electromagnetic interference (EMI) and reduce crosstalk risks.
Improved mechanical strength: Copper substrates offer superior deformation resistance to traditional FR-4, making them suitable for vibration environments such as automotive electronics.
Current carrying capacity: Thick copper layers (6 oz+) support high current transmission and reduce voltage drop in power modules.
Design flexibility: Supports advanced processes such as blind and buried vias and mixed dielectric layers to meet the needs of high-frequency, high-speed, and high-power hybrid designs.
Long-term reliability: Copper’s oxidation resistance and multi-layer laminate structure (using prepreg PP) extend product life, making them suitable for industrial control equipment.

What Are Advantages of Copper Multilayer PCBs?

What Are Applications of Copper Multilayer PCB?

Communications Equipment: 5G base stations, routers, mobile phone signal repeaters, fiber optic receivers
Computers and Data Centers: Server motherboards, hard drive controllers, graphics cards, storage devices
Medical Equipment: Heart monitors, CT scanners, X-ray equipment
Industrial Control and Automotive Electronics: Motor controllers, industrial automation systems, power converters, in-vehicle electronics
Aerospace: Satellite systems, space exploration equipment, radar
Consumer Electronics: Smartphones, wearable devices, game consoles
Energy and Power Systems: Power amplifiers, battery chargers, rectifiers, high-power conversion devices

How to Design a Copper Multilayer PCB for Wearable Device?

1. Material Selection & Substrate Optimization

Substrate: Prioritize polyimide (PI) or liquid crystal polymer (LCP), thickness 0.05–0.1mm, for flexibility (bending radius <5mm) and high-temperature resistance (Tg >250℃).
Conductive Layer: Use ultra-thin rolled annealed copper foil (RA, 0.5oz/17μm) to balance flexibility and conductivity (conductivity ≥58 MS/m).
Adhesive Layer: Apply low-modulus prepreg (PP) to reduce interlayer stress and prevent cracking during bending.

2. Stackup Design & Flexibility

Layer Count: Prioritize for 4-layer boards (Signal-Ground-Power-Signal) with total thickness 0.4–0.6mm to minimize weight.
Symmetry: Distribute copper layers symmetrically (e.g., Cu-PI-Cu) to avoid warping during bending; place ground and power planes adjacent to reduce EMI.
Flexible Zones: Use coreless structures (copper foil + PI only) in bending areas (e.g., wristband connections) for unrestricted flexibility.

3. Signal Integrity Assurance

High-Speed Signals: Design Bluetooth/Wi-Fi antennas as microstrip lines with 50Ω impedance control (trace width 0.15mm, spacing 0.1mm) and avoid 90° bends.
Differential Pair Routing: Route high-speed interfaces (USB, MIPI) with equal length (tolerance ±5mil) and spacing ≥3x trace width to minimize crosstalk.
Shielding: Add copper shielding layers (width ≥2mm) around antennas, grounded via stitching to reduce external EMI.

4. Power Distribution & Low-Power Design

Layered Power: Implement split power planes (e.g., 1.8V/3.3V) with power-ground spacing 0.1mm and decoupling capacitors (10μF + 100nF).
Low-Power Components: Select ultra-low-power MCUs (e.g., STM32L series) and PMICs, paired with hardware watchdogs to prevent lockups.
Layout Optimization: Place batteries, PMICs, and MCUs close to minimize trace length and reduce static power consumption.

5. Thermal Management Strategies

Heat Dissipation: Place copper foils (1oz thickness) under heat-generating components (MCUs, power chips) and connect via thermal vias (diameter 0.2mm, pitch 0.5mm) to external thermal areas.
Thermal-Electric Separation: Isolate high-power LEDs or battery chargers with dedicated copper layers to prevent heat transfer to sensitive components.
Material Enhancement: Embed graphene thermal films (0.01mm thickness) in critical zones to improve lateral heat conduction.

6. Mechanical Reliability & Bend Resistance

Solder Mask: Use high-flexibility solder mask (e.g., Taiyo PSR-9000), thickness 10μm, rated for >100,000 bend cycles.
Surface Finish: Apply ENIG (Electroless Nickel Immersion Gold) or OSP (Organic Solderability Preservative) to prevent copper oxidation and ensure solder reliability.
Validation: Pass dynamic bend tests (radius 3mm, 1Hz frequency, 10,000 cycles) and accelerated aging (85℃/85%RH, 168 hours).

7. Electromagnetic Compatibility (EMC) & Compliance

Grounding: Connect metal enclosures (e.g., wristband, buttons) to PCB ground via spring contacts or conductive adhesives, forming a Faraday cage to mitigate ESD.
Certification: Achieve CE (EU) or FCC (US) EMC compliance, testing across 80MHz–6GHz to ensure stable operation in complex electromagnetic environments.
Wireless Charging: Position Qi-standard coils at PCB edges, away from antennas and sensors to avoid interference.

How to Design a Copper Multilayer PCB for Wearable Device?

How was Copper Multilayer PCB Made?

1. Substrate Preparation

Select FR4 glass fiber epoxy resin laminate as substrate, with copper foil cladding (thickness 1oz/2oz).

2. Inner Layer Pattern Transfer:

Apply photosensitive dry film, transfer circuit pattern via UV exposure, and dissolve unexposed areas.
AOI (Automatic Optical Inspection) verifies line precision and marks defects.

3. Inner Layer Etching & Oxidation

Chemically etch copper not protected by dry film to form inner layer circuits.
Black oxide/brown oxide treatment on copper surfaces to enhance interlayer adhesion.

4. Lamination & Pre-Press

Stack inner layer core boards, prepreg sheets, and outer layer copper foils alternately, aligning via positioning holes.
High-temperature/high-pressure lamination (180-200℃) melts resin to fill gaps, forming a unified board.

5. Mechanical Drilling

CNC drilling machine processes through-holes/blind holes with diameter accuracy ±0.05mm.
Clean hole-wall resin residues (desmear).

6. Electroless Copper Plating

Deposit electroless copper (0.3-0.8μm) on hole walls to establish conductive base.
Electroplate to thicken copper layer (20-25μm) for reliable hole-wall conductivity.

7. Outer Layer Pattern Transfer

Repeat inner layer pattern transfer process, addressing hole alignment.
Use high-precision exposure equipment to compensate for interlayer deviation.

8. Outer Layer Etching & Stripping

Secondary etching defines outer layer circuits, with tin layer protecting desired copper areas.
Alkaline solution strips dry film, retaining circuit patterns.

9. Solder Mask & Silkscreen

Apply liquid photosensitive solder mask (green/black), expose and develop to expose pads.
Silkscreen component identifiers (white/yellow text).

10. Surface Finish

Treat pad areas with ENIG (Electroless Nickel Immersion Gold)/immersion tin/OSP to prevent oxidation and enhance solderability.
Plate gold finger areas with hard gold for wear resistance (e.g., board-edge connectors).

11. Electrical Testing

Flying probe test or bed-of-nails test verifies continuity and insulation.
AOI re-inspects for micro-shorts/opens.

12. Profiling & Packaging

CNC milling cuts board outlines; V-score or punching for separation.
Final cleaning, drying, and vacuum moisture-proof packaging.

Why Choose Best Technology as Copper Multilayer PCB Manufacturer?

Reasons why choose us as copper multilayer PCB manufacturer:

19 years of experience in copper substrate R&D: Precisely addressing interlayer heat dissipation and current carrying challenges in high-power multi-layer copper substrates, ensuring long-term stable operation of high-power devices (such as projectors/lasers).
Triple international quality certification (ISO9001/IATF16949/ISO13485): Medical and automotive-grade copper substrate production standards ensure ±1μm copper thickness uniformity in multi-layer board holes and zero deviation in electrical performance.
Customized thermal management solutions for copper substrates: Embedded copper pillars/thermoelectric separation structures reduce the thermal resistance of multi-layer boards to 0.5°C/W, extending the life of LEDs/power modules by over 30%.
Cost-optimized copper substrate design: Utilizing a gradient copper foil thickness (1oz outer layer + 2oz inner layer) to balance conductivity and heat dissipation requirements, saving 15% in material costs compared to traditional designs.
24-hour copper substrate rapid prototyping service: Laser drilling and electroless copper plating processes deliver high-complexity (20+ layers) copper substrate prototypes within 48 hours, accelerating the validation cycle for high-power products.
Free Copper Substrate Design for Material (DFM) Analysis: Preemptively identify design risks such as copper layer distribution and blind via alignment, preventing interlayer cracking caused by thermal expansion coefficient mismatch and reducing secondary re-board rework costs.
100% Automated Optical Inspection (AOI): Detects hole wall voids and copper nodules, a common feature of copper substrates, with a 0.01mm² level of defect detection, ensuring zero defective batch orders.
Full-Process Copper Substrate Solution: From thermal simulation (Flotherm) to copper layer etching and surface treatment (ENIG/HASL), we provide a one-stop service, reducing the cost of coordinating multiple suppliers.
Ultra-Thin Copper Substrate Process (0.2mm total thickness): Combining flexible PI substrate and copper foil calendering technology, we achieve a bend radius of less than 1mm for multi-layer copper substrates for wearable devices while maintaining a current density of 10A/cm².

Our Copper PCB Capabilities

Items	Technical Parameters
Product model	Copper PCB
Copper trace thickness	1OZ, 2OZ, 3OZ, 4OZ, up to 10OZ
Thermal Conductivity	1.0, 1.5, 2.0, 3.0W/m.K
Surface finishing	HAL(LF)/ Gold Immersion/ Gold plating/ OSP/ Immersion Tin/ Silver Immersion
Soldermask Color	White/Black/Green/Blue/Red/Yellow
Layers	1L, 2L, 4L, 6L, 8L, double sided, COB
Maximum dimension	1,100mm*480mm; 1,500x300mm
Minimum dimension	5mm*5mm
Minimum Line width/space	0.1mm/0.1mm
Warp and twist rate	≤0.75%(thickness:1.6mm, measurement:300mm×300mm)
Board Thickness	0.3－4.5mm
Die-Punching dimension tolerance	±0.15mm
V-cut positioning tolerance	±0.1mm
Manufacturing capability	6000m²
Wall Cu thickness	15-25um
Alignment tolerance	±0.076mm
Minimum diameter of die-punching hole	Thickness <=1.0mm: 1.0mm
	Thickness 1.2-3.0mm: 1.5mm
	Thickness 4.0mm: 2.0mm
Minimum size the square groove/slot/cutout	Thickness <=1.0mm: 0.8mm×0.8mm
	Thickness 1.2-3.0mm: 1.0×1.0mm
	Thickness 4.0mm: 1.5×1.5mm
Outline Tolerance	CNC routing：±0.1mm; Die-punching：±0.15mm
Minimum diameter of hole	0.3mm; not limit for maximum diameter of hole
Surface Finishing Thickness	gold plating：Ni 2.5-5um, Au: 0.025－0.075um
	immersion gold: Ni 3-6um, Au: 0.025-0.1um
	HAL(LF): 3-30um
V－cut Angle tolerance	±5°
V-cut Range	0.3mm-4.5mm
Smallest silkscreen height	0.15mm
Smallest PAD	0.1mm

How to Get a Quote for Copper Multilayer PCB Project?

Essential Documentation for Copper Multilayer PCB Quotation

Lamination Stackup Drawing: Specify layer materials (e.g., FR-4/Rogers 4350), copper thickness (1–6OZ), dielectric thickness (mm), and impedance control targets.
Gerber Files: Include circuit layers, drilling layers, and solder mask layers. Annotate trace width/spacing (e.g., 4/4mil), blind/buried via positions, and hole tolerance (±0.05mm).
PCB Technical Parameter Sheet: Board dimensions (L×W×T), layer count (e.g., 8L), surface finish (ENIG/OSP), and special processes (via plating/half-hole).
Impedance Control Requirements: Define differential pair impedance (e.g., 100Ω±10%), reference layers, and testing methods.
Acceptance Criteria: Specify IPC class (e.g., IPC-6012 Class 3) and testing items (flying probe/AOI/X-ray).
Quantity & Lead Time: Prototype/batch quantity (e.g., 5pcs/1k) and desired delivery timeline (e.g., 7-day expedited).
Special Requirements: High-frequency/thermal needs (e.g., PTFE hybrid), environmental certifications (RoHS/UL).

Why Partner with Best Technology?

Expertise: Handles 16+ layer thick copper (6OZ) and hybrid high-frequency boards.
Speed: Offers 48-hour quick quotes and complimentary impedance calculation.
Quality: Free DFM review to eliminate design flaws upfront.
Result: Avoid cost overruns, accelerate time-to-market, and ensure compliance for demanding applications.

Welcome to contact us if you have any request for copper multilayer PCB: sales@bestpcbs.com.

Tags:Copper Multilayer PCB, Multilayer Copper PCB
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

High Frequency PCB Design Guidelines – RF PCB Basic Acknowledge

Wednesday, August 20th, 2025

Are you often curious about these questions about high frequency PCB?

Have you ever wondered why some electronic systems lose performance at higher frequencies?
Why a well-designed PCB for low-speed circuits often fails when pushed into GHz ranges?
How can designers minimize losses above 1 GHz?

The answer lies in the design of high frequency PCBs. High frequency PCBs also known as RF PCB or radio frequency pcb. They are more important in applications such as 5G, automotive radar, aerospace communication, medical imaging, and satellite systems. These boards must handle signals above 100 MHz and, in many cases, well into the GHz range. At such speeds, signal losses, impedance mismatches, and electromagnetic interference (EMI) can cause severe degradation.

This blog provides detailed guidelines for designing high frequency PCBs. From material selection to signal routing, impedance control, thermal management, and testing, we will walk through the critical factors engineers must consider.

What Frequency Range is Considered High Frequency in PCB Design?

In PCB engineering, high frequency generally refers to signal frequencies above 500 MHz. For RF and microwave circuits, the range extends from 1 GHz up to 100 GHz. Typical applications include:

Wi-Fi (2.4 GHz / 5 GHz)
Bluetooth (2.4 GHz)
5G NR bands (3.5 GHz / 28 GHz / 39 GHz)
Automotive radar (24 GHz / 77 GHz)
Satellite communication (Ku-band 12–18 GHz, Ka-band 26–40 GHz)

The higher the frequency, the more sensitive the PCB becomes to signal loss, dielectric constant stability, and copper surface roughness. For instance, at 28 GHz (5G mmWave), even 0.1 dB/cm of insertion loss can cause serious degradation in system performance.

High Frequency PCB Design Guidelines - RF PCB Basic Acknowledge

What PCB Materials are used for High Frequency Applications?

The dielectric substrate is the foundation of high frequency PCB design. Key material properties include:

Dielectric Constant (Dk): Should remain stable across frequency and temperature.
Dissipation Factor (Df): Lower values mean lower signal loss.
Thermal Conductivity: Crucial for high-power RF designs.

Common Materials for High Frequency PCBs

Material Type	Dielectric Constant (Dk)	Dissipation Factor (Df) @10GHz	Thermal Conductivity (W/m·K)	Typical Use Case
FR4 (High Tg)	4.2–4.7	0.020–0.025	0.3	<1 GHz, low-cost boards
Rogers RO4350B	3.48 ±0.05	0.0037	0.69	2–20 GHz, antennas
Rogers RO3003	3.00 ±0.04	0.0013	0.50	mmWave 5G (28 GHz, 39 GHz)
Taconic RF-35	3.50	0.0018	0.62	Microwave circuits
PTFE (Teflon)	2.1–2.6	0.0009–0.0015	0.25–0.30	Aerospace, radar
Ceramic-filled PTFE	3.0–10	0.001–0.005	0.7–1.2	High-power RF

Data comparison shows that Rogers RO3003 has one of the lowest Df values, making it widely used in 5G mmWave base stations. PTFE-based laminates dominate satellite and radar applications where extreme performance is required.

How Does Dielectric Constant Affect Signal Speed?

The dielectric constant (Dk) directly influences the propagation velocity of signals on PCB traces. The relation is:

Where c = 3 × 10^8 m/s (speed of light in vacuum).

For FR4 (Dk ≈ 4.5) → v ≈ 1.41 × 10^8 m/s
For Rogers RO4350B (Dk ≈ 3.48) → v ≈ 1.61 × 10^8 m/s
For PTFE (Dk ≈ 2.2) → v ≈ 2.02 × 10^8 m/s

This means PTFE substrates allow signals to travel ~43% faster than FR4. In high-speed digital systems (like SerDes 56G PAM4 links), such differences greatly influence timing margins.

What are the Key Design Rules for High Frequency PCB Layout?

Designing high frequency boards requires stricter rules compared to conventional PCBs:

1. Controlled Impedance Traces

Single-ended 50 Ω, differential 90–100 Ω are typical.
Impedance tolerance must be within ±5% for frequencies above 10 GHz.

2. Insertion Loss Minimization

Use smooth copper foils (Ra < 2 μm).
Keep transmission lines short.
Avoid unnecessary vias, which can introduce 0.1–0.2 dB loss per via at 10 GHz.

3. Ground Plane Integrity

Solid reference planes reduce return path discontinuities.
Use via fences to confine RF energy.

4. Crosstalk Reduction

Maintain spacing ≥3× trace width between high frequency lines.
Place sensitive analog circuits far from digital noise sources.

5. Thermal Management

For power amplifiers, substrates with >0.8 W/m·K thermal conductivity are recommended.
Use thermal vias under RF components for efficient heat dissipation.

What are the Key Design Rules for High Frequency PCB Layout?

How Thick should a High Frequency PCB be?

The thickness of the PCB substrate directly impacts impedance and signal integrity. Typical stack-up configurations:

PCB Thickness	Layer Count	Dielectric Thickness	Frequency Application
0.2–0.4 mm	2–4L	0.1 mm core	High-speed connectors, 10–20 GHz
0.6–0.8 mm	4–6L	0.2 mm core	2.4/5 GHz Wi-Fi, Bluetooth
1.0–1.6 mm	6–10L	0.3–0.5 mm core	Automotive radar, 24 GHz
2.0+ mm	8–12L	>0.5 mm core	28 GHz 5G, satellite boards

For example, in 77 GHz automotive radar PCBs, manufacturers often use 0.254 mm or thinner substrates to reduce dielectric loss and keep microstrip lines narrow enough for impedance control.

How to Reduce Signal Loss in High Frequency PCB Design?

Signal loss (attenuation) is one of the biggest concerns in high frequency circuits. It is affected by:

Dielectric Loss: Higher Df increases insertion loss.
Conductor Loss: Surface roughness increases resistance at high frequencies due to skin effect.
Radiation Loss: Poor layout or sharp bends radiate energy.

Example of Insertion Loss Data

Material	Frequency	Line Length	Insertion Loss
FR4 (Df 0.020)	10 GHz	10 cm	-1.2 dB
Rogers RO4350B	10 GHz	10 cm	-0.25 dB
PTFE (Df 0.001)	10 GHz	10 cm	-0.05 dB

This demonstrates why high frequency applications almost never rely on standard FR4.

In Conclusion

Designing a high frequency PCB requires more than standard PCB know-how. From material selection to impedance control, routing, thermal management, and advanced testing, every step must be carefully engineered.

Best Technology is a trusted PCB manufacturer in China with expertise in high frequency PCB fabrication. We offer advanced laminates like Rogers, Taconic, and Isola, alongside ISO9001, ISO13485, IATF16949, and AS9100D certifications. Our team applies rigorous quality control, competitive pricing, professional engineering support, and MES-based traceability to deliver reliable high frequency PCBs for industries such as 5G, automotive radar, medical devices, and aerospace.

If your project requires precise high frequency PCB solutions, Best Technology is ready to provide professional guidance and manufacturing excellence.

FAQs

1. Can FR4 be used for high frequency PCBs?

Yes, but only for frequencies below ~1 GHz. For anything higher, specialized laminates are required.

2. What is the most commonly used material for 5G PCBs?

Rogers RO4350B and RO3003 are widely adopted due to their low loss at mmWave bands.

3. How do vias affect high frequency performance?

Each via can add 0.1–0.2 dB loss at 10 GHz, so designers minimize via count in RF paths.

4. Why is surface roughness important?

At high frequencies, the skin effect confines current to the outer conductor surface. Rough copper increases resistance and loss.

Tags:high frequency pcb, high frequency pcb design guide, radio frequency pcb, RF PCB
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Copper Pour PCB, Copper Pour in PCB

Wednesday, August 20th, 2025

What is copper pour PCB? Let’s discover its function, application, clearance design rules, grounding and connection problems and solutions, dead zones and sharp problems and solutions.

Are you worried about these problems?

Why does my high-speed PCB always have signal integrity issues?
How can I reduce thermal hotspots in dense component layouts?
What’s the most cost-effective way to improve EMI performance?

Best Technology can provide service and solutions:

Optimized copper pour design: Reduces impedance discontinuities and crosstalk by providing uniform current paths.)
Thermal-balanced copper pour: Dissipates heat evenly through enhanced thermal conductivity.)
EMI-shielded copper pour: Acts as a natural Faraday cage to minimize radiated emissions.)

Welcome to contact us if you have any request for copper pour PCB: sales@bestpcbs.com.

What is Copper Pour PCB?

Copper pour PCB (also called as copper pour in PCB) design refers to the technique of filling unused areas on a circuit board with conductive copper, typically connected to ground or power networks. It involves filling blank areas of a circuit board (not layout traces) with a continuous layer of copper foil using polygonal fills automatically generated by the design software. These copper foil areas are typically connected to the board’s ground plane (GND) or power plane (VCC), forming a complete conductive layer.

What is the Purpose of the Copper Pour on a PCB?

Signal Integrity: Provides low-impedance return paths for high-frequency signals, reducing electromagnetic loss.
EMI/RFI Shielding: Acts as conductive shielding to suppress external/internal electromagnetic interference.
Thermal Dissipation: Enhances heat transfer from high-power components via copper’s thermal conductivity.
Power Stability: Stabilizes voltage delivery through low-inductance copper planes for high-current circuits.
Structural Integrity: Balances copper distribution to prevent board warpage during fabrication.
Cost Efficiency: Reduces production costs by minimizing copper etching waste and simplifying processes.
Impedance Matching: Enables precise impedance control for high-speed signals via ground plane integration.

What Are Applications of Copper Pour PCB?

Lighting Systems: LED streetlights, automotive lights, surgical lighting.
Automotive Electronics: Electric vehicle battery management, motor controllers, charging systems, and headlight drivers.
Communications Equipment: 5G/6G base stations, RF amplifiers, antenna modules, and filtering devices.
Industrial Equipment: Welding machines, solar inverters, UPS power supplies, and robotic control systems.
Medical Equipment: MRI systems, X-ray machines, and surgical laser equipment.
Computers and Consumer Electronics: CPU motherboards, game consoles, and smartphones.
Aerospace: Satellite communications, radar, and avionics equipment.

What is the Difference between Copper Pour and Trace?

Characteristic	Trace	Copper Pour
Definition	Conductive path for signal/current	Filled copper area for functional/thermal purposes
Function	Signal/current transmission	Heat dissipation, EMI shielding, high-current carrying
Smart Avoidance	None (manual adjustment required)	Auto-isolates from other networks
Design Method	Manual routing line by line	Auto-fills irregular regions
Short Circuit Risk	Low (independent path)	High for standard pour, low for filled pour
High-Frequency Adaptability	Susceptible to interference (requires width/spacing optimization)	Reduces crosstalk (avoids via resonance)
Typical Thickness	0.7 mil (½ oz) or 1.4 mil (1 oz)	4 mil (standard)

PCB Copper Pour Clearance Design Rules

1. Core Spacing Values

General Baseline: Copper pad to pad/via distance ≥0.2mm (1oz copper foil) or ≥0.33mm (2.5oz copper foil). Any distance below this will result in a short circuit.
High-voltage scenarios: Calculate clearance based on voltage (e.g., 220V requires ≥2.5mm), using the maximum of clearance and creepage distances.
Board Edge Treatment: Copper pad to cutting line ≥0.8mm; otherwise, the copper sheet may tear during milling.

2. Specific Scenarios

Under capacitors: Copper pads are strictly prohibited, with a spacing of 0.1mm (to prevent parasitic capacitance from interfering with signals).
Antenna Area: Clearance below wireless modules ≥12.5mm (to prevent signal coupling, measured values).
Gold-plated board edges: Copper pad setback ≥0.5mm (to prevent corrosion caused by plating solution infiltration).

3. Software Practice (AD/KiCad)

Rule Settings:

Global Spacing: Start at 0.5mm (20mil), with separate rules for high-voltage areas.
Copper Pad Specific: Set to 0.8mm when no solder mask is present (to facilitate repair and soldering).
Priority Suppression: Board-Level Rules > Net-Level Rules > Single-Object Rules. In case of conflict, the strictest value is used.

4. Manufacturing Minefields

Peelable Structures: Isolated copper islands in the copper pad with a width less than 0.2mm will be deleted (etching will cause breakage).
Copper Layer Text: Text must be ≥0.15mm away from the copper pad (otherwise, the silkscreen will be blurred).
Sharp Angle Prohibition: Copper pad corners must be ≥45° (sharp corners can cause excessive corrosion during acid etching).

5. Signal Terms

High-Speed Lines: Copper pads must be ≥3 times the line width away from clock lines (e.g., a 0.2mm line width requires a 0.6mm setback).
Grounding copper: The spacing between copper layers in different voltage domains should be ≥1mm (to prevent leakage current).

Dead Zones and Sharp Angles Problems in Copper Pour PCB Design

Dead Zone Problems:

1. Electrical Isolation Failure: Isolated copper areas not connected to the network (dead copper) create an antenna effect, increasing electromagnetic interference (EMI), causing high-frequency signal distortion or noise interference.

2. Thermal Stress Concentration: Dead copper cannot effectively dissipate heat, causing local overheating that accelerates component aging and shortens PCB life.

3. Manufacturing Defect Risk: Dead copper can easily peel during etching, causing shorts or opens.

Dead Zone Solutions:

1. Ground Via Connection Design: Add ground vias (vias) in large dead copper areas, connecting them directly to the ground network (recommended density ≥ 1 per square centimeter) to eliminate the antenna effect.

2. Copper Layer Optimization Strategy: Avoid copper pouring in unrouted areas (such as mid-layer routing openings); use a grid-like window design (heat dissipation vias) to improve heat dissipation.

3. Automated Design for Factoring (DFM) Checking: Use EDA tools to run DFM rule checks (e.g., Gerber files with board outlines) to automatically identify and remove dead copper areas.

Sharp Angle Problems:

1. Enhanced EMI Radiation: Sharp angles (≤90°) form high-frequency transmitting antennas, interfering with sensitive circuits such as clock signals and increasing signal noise.

2. Etchant Traps: Etching solution accumulates at sharp angles, unevenly corroding the copper layer and causing wire breaks or shorts (the risk is doubled for trace widths ≤5 mils).

3. Mechanical Fragility: Sharp angles are susceptible to fracture under thermal stress, leading to open circuit failures, which is particularly serious in industrial-grade PCBs.

Sharp Angle Solution:

1. Replacement of Curved Corners: Use 45° bevels or arcs (arc radius ≥ 2 times the trace width) for all trace turns, completely avoiding 90° angles.

2. Line Optimization: Widen high-voltage/high-frequency lines (e.g., power lines ≥ 20 mils), ensuring smooth, chamfer-free lines; prioritize large-area copper pours for ground lines.

3. Embed Design for Functional Measurement (DFM) rules: Set minimum bend radius (≥ 0.2 mm) and line-to-space ratio (≥ 1:1), and use EDA tools to automatically correct sharp angles.

Grounding and Connection Problems in Copper Pour PCB Design

1. Grounding Failure Causing Noise/EMI Problems:

Ungrounded copper areas act as EMI antennas.
Long/impedance-mismatched ground paths disrupt high-frequency signal return.

Grounding Failure Causing Noise/EMI Solution:

Auto-connect copper to GND in Altium, use via stitching to link top/bottom copper to inner ground planes.
Limit high-frequency signal return paths to ≤ λ/20.
Use 4-layer stackup (Sig/Gnd/Pow/Sig) for direct top/bottom-to-ground connections.

2. Copper-Via/Pad Disconnection Problems:

Thermal stress or manufacturing errors break copper-via/pad links.
Flex PCBs develop cracks in bent areas.

Copper-Via/Pad Disconnection Solution:

Add teardrop transitions at vias to increase contact area.
Use edge-plating for flex PCBs with prepreg reinforcement.
Confirm min. copper thickness (≥1oz) and via spacing (≥0.3mm) with fabricators.

3. High-Frequency Loop Interference Problems:

Copper loops cause magnetic coupling, inducing crosstalk/oscillation.
Asymmetric differential pair returns disrupt impedance matching.

High-Frequency Loop Interference Solution:

Isolate analog/digital grounds with beads/0Ω resistors; connect copper to single GND.
Add guard ground traces (≥3× line width) around differential pairs.
Optimize copper shapes via SIwave EM simulation.

4. Thermal Expansion Failure Problems:

CTE mismatch under power devices causes pad/copper cracking.

Thermal Expansion Failure Solution:

Use mesh copper under power components with via arrays to inner ground.
Select FR-4 TG170 for CTE compatibility.

5. Fine-Pitch Component Shorting Problems:

Copper near BGA/QFN pads causes solder bridging.

Solution:

Set copper clearance ≥0.2mm (8mil) in Altium DRC.
Remove local copper under BGAs while preserving critical signal paths.

Why Choose Best Technology as Copper Pour PCB Supplier?

19-Year PCB Manufacturing Expertise: Proven track record in handling complex designs (e.g., HDI, RF, automotive) with 98.5% on-time delivery.
Global Certifications: ISO 9001, ISO 13485, UL and RoHS compliance guarantee product safety and regulatory adherence.
Fast Turnaround: 24-hour rapid prototyping and 5-day standard delivery for copper pour PCBs (3oz-10oz), accelerating time-to-market.
Cost Efficiency: Optimized production processes and bulk material procurement reduce costs by 15-20% compared to industry averages.
Strict Quality Inspection: 100% AOI inspection for bulk orders + 3D X-Ray scanning ensures <0.05% defect rate, minimizing rework costs.
Free DFM Analysis: Pre-production design checks identify copper pour issues (e.g., dead zones, sharp angles), saving $5,000+ in potential redesign costs.
Free Engineering Support: Dedicated team provides copper pour optimization, impedance control, and thermal management solutions at no extra charge.

Welcome to contact us if you have any inquiry for copper pour PCB: sales@bestpcbs.com.

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Embedded Copper Coin PCB Supplier| Best Technology

Tuesday, August 19th, 2025

What is embedded copper coin PCB? Let’s explore its structure, benefits, applications, connector methods, design guide, production processes together.

Are you troubled with these problems?

Is your product throttled by poor heat dissipation?
Are traditional cooling solutions squeezing your design space?
Is your PCB frequently experiencing thermal failures under complex operating conditions?

Best Technology can offer services and solutions:

Customized thermal design: ANSYS simulation and field verification.
Flexible manufacturing services: 0.2-2.0mm copper coin options.
Full-process quality control: 16 critical process checks for reliability.

Welcome to contact us if you have any inquiry for embedded copper coin PCB: sales@bestpcbs.com.

What is Embedded Copper Coin PCB?

Embedded Copper Coin PCB (Embedded Copper Coin) is an innovative technology that improves heat dissipation by embedding copper sheets (called “copper coins”) within printed circuit boards (PCBs). These copper coins, typically in a circular or rectangular stepped design, efficiently absorb and dissipate heat generated by electronic components, making them particularly suitable for high-power devices or miniaturized products (such as 5G communications equipment and space electronics).

This technology leverages copper’s high thermal conductivity to mount heat-generating components directly on the copper coins, significantly overcoming the limitations of traditional PCB heat dissipation vias or metal substrates, achieving more compact and efficient heat dissipation.

Structure of Embedded Copper Coin PCB

1. Copper Coin Body

Material: ≥99.9% pure copper, 0.5–3mm thick, 5–20mm diameter, nickel-plated.
Design: Stepped profile expands heat contact; fits round/rectangular chips.

2. Embedding Process

Process: Laser/mechanical insertion into PCB layers, FR-4 bonded, resin-filled for flatness.
Tolerance: Adhesive residue ≤0.1mm to prevent via cracks.

3. Conductive Interconnects

Vias: Metallized, copper-plated ≥25µm for low impedance.
Clearance: ≥0.2mm between layers (3kV AC safe).

4. Insulation & Protection

Solder Mask: ≥15µm edge coverage.
Vias: Resin-filled to reduce thermal stress.

5. Thermal Management

Path: Thermal adhesive/aluminum substrate beneath coin for vertical cooling.
Stacked Design: Simulation-optimized heat flow.

Advantages of Copper Coin-Embedded PCB

Highly Efficient Heat Dissipation: Copper exhibits excellent thermal conductivity and is embedded directly beneath heat-generating components to quickly dissipate heat and prevent overheating damage (such as power ICs or automotive-grade chips).
Saves PCB Space: No additional heat sink or complex air cooling systems are required, making it suitable for compact designs (such as drones and portable devices).
Improves Long-Term Reliability: Copper and PCB materials have similar coefficients of thermal expansion, reducing the risk of solder joint cracking and extending product life.
Lowers Overall Cost: The process is simpler than embedded copper coins, reducing production steps and material waste.
Supports Custom Design: Round and rectangular copper coins can flexibly adapt to different component shapes (such as special-shaped chips) to optimize heat conduction paths.

Applications of Embedded Copper Coin PCB

High-Power LED Lighting Cooling
RF/Microwave Power Amplifiers
New Energy Vehicle Power Systems
Industrial Power Equipment
Aerospace Electronics Systems
Server Power Modules
Power Electronics Converters
High-density packaged device cooling
Automated test equipment (ATE)
Audio power amplifiers

How is the Copper Coin Connected to the PCB?

Metallized Via Direct Connection

Copper coins connect to PCB inner layers via laser-drilled microvias (aperture ≥0.3mm), with copper plating thickness ≥25µm on via walls, ensuring low-impedance conduction (<10mΩ).
Suitable for high-current applications (e.g., EV traction systems carrying ≥200A).

Stepped Laminated Structure

Adopts OKI’s stepped copper coin design, where copper coins are laminated with PCBs using resin-filled gaps. Contact diameter 7mm, heat dissipation expanded to 10mm.
Requires controlled lamination temperature (170–200℃) and pressure (200–400psi) to avoid resin voids and elevated thermal resistance.

Conductive Adhesive Bonding

Uses thermal conductive adhesive (e.g., 3M 8810, thermal conductivity ≥1.5W/mK) to fix copper coins in non-conductive areas.
Ideal for high-frequency signal modules (e.g., mmWave radar) to prevent electromagnetic interference from metal vias.

How to Design A Embedded Copper Coin PCB?

Below are embedded copper coin PCB design guide:

1. Material & Copper Coin Parameter Design

Material selection: Select ≥99.9% purity electrolytic copper (thermal conductivity: 401W/(m·K)), with thickness matched to chip power (e.g., 1.5mm for 10W chips, 2.5mm for 20W chips).
Surface treatment: Nickel-plated (≥5µm); gold plating (≥1µm) for extreme environments.
Shape optimization: Stepped design expands contact area by 30–50%; rectangular coins for linear-package devices.

2. Embedding Position Planning

Single-layer boards: Align copper coin center with high-power component (e.g., CPU/GPU) heat core (error ≤0.2mm).
Multi-layer boards: Vertically stagger coins (e.g., Layer 2 coins offset 5mm from Layer 1).
Safety clearance: Maintain ≥0.5mm gap between coin edges and high-speed signal lines; ≥2mm from PCB edges.

3. 3D Thermal Interface Design

Vertical Cooling:

Apply thermal adhesive (e.g., Arctik 8800, 3.0W/(m·K)) to fill micro-gaps between chip and coin.
Embed aluminum substrate (1.0mm thickness) beneath coins; connect to backside heatsinks via thermal vias.

Horizontal Cooling:

Array small coins (3mm diameter, 5mm pitch) under uniformly heated devices (e.g., FPGAs).
Deploy thermal via arrays (0.3mm diameter, 0.8mm pitch) around coins; fill with conductive epoxy (e.g., Ausbond 9105, 1.5W/(m·K)).

4. Thermal Via Optimization

Via parameters: Diameter ≥0.3mm, copper plating ≥25µm, depth ≤2/3 of PCB thickness.
Process enhancement: Electroless Nickel Immersion Gold (ENIG) finish for via walls; array vias in ring or matrix patterns (pitch ≤1mm).

5. Manufacturing Process Control

Embedding methods:

Small coins (≤5mm): Laser drilling (±0.05mm accuracy), vacuum-adhesive fixation.
Large coins (≥10mm): Mechanical pressing (50–80psi), alignment pins for hole matching.

Resin filling: Use low-CTE (≤40ppm/℃) epoxy to fill gaps; cure via baking (150℃, 2 hours).

6. Thermal Simulation & Validation

Simulation phase: Model steady/transient thermal distribution using Ansys Icepak (input material parameters, via layout, and chip power data).

Physical testing:

Thermal imaging: Ensure junction-to-coin ΔT ≤5℃ (e.g., coin ≤115℃ at chip 120℃).
Temperature cycling (-40℃~125℃, 1,000 cycles): Inspect for cracks/delamination at coin-PCB junctions.

7. Standards Compliance Testing

Compliance: CPCA 6042 (embedded copper PCBs), IPC-6012C (rigid PCBs).
Dielectric testing: Apply 3kV AC between adjacent coins/ground; no breakdown for 60 seconds.

How to Design A Embedded Copper Coin PCB?

What is the Process of Embedded Copper Coin PCB?

1. Substrate Preprocessing & Copper Coin Fabrication

Substrate Cutting: FR-4 substrate cut to working dimensions (tolerance ±0.1mm), with simultaneous milling of copper coin positioning slots (depth = coin thickness +0.05mm).
Copper Coin Machining: CNC-shaped electrolytic copper (C11000), surface nickel-plated (2–5μm) + chemical roughening (Ra 0.8–1.2μm).

2. Inner Layer Production & Coin Embedding

Inner Layer Imaging: After circuit etching, black oxidation treatment applied to copper coin zones (surface area increased ≥30%).
Coin Assembly: Vacuum nozzle with visual positioning system (accuracy ±25μm) presses coins into slots; edges coated with conductive epoxy (thermal conductivity ≥5W/mK).
Pre-Lamination Inspection: X-ray detection of coin positional deviation (standard ≤0.1mm).

3. Multi-Layer Lamination Control

Stack-Up Structure: 2 high-TG prepreg sheets (e.g., IT-180A) placed above/below copper coin layer; copper foil pre-laminated with thermal adhesive film.

Vacuum Hot Pressing Parameters:

Stage 1: 120℃ / 3MPa / vacuum ≤10Pa
Stage 2: 180℃ / 8MPa / dwell 60min
Stage 3: Cooling to <50℃ before pressure release

Post-Pressing Treatment: Laser trimming of resin overflow; plasma cleaning of coin zones.

4. Drilling & Metallization

Step Drilling:

φ0.3mm pilot holes (through coin center)
Enlarged to φ0.5mm (aspect ratio ≤12:1)
Back-drilling residue ≤0.15mm

High-Thermal Via Metallization:

Pulse copper plating (average thickness ≥30μm)
Via filling with silver paste (thermal conductivity >200W/mK) or nano-aluminum resin.

5. Outer Layer Circuitry & Thermal Enhancement

Laser LDI Imaging: Circuit width compensation +0.1mm at coin connection zones (to offset lamination deformation).
Selective Thick Copper Plating: 3oz (105μm) plating around coin zones; 1oz (35μm) retention at non-thermal zones.
Thermal Via Arrays: φ0.25mm vias (pitch 1.0mm) within 1mm of coin edges, filled with thermal paste.

6. Surface Finish & Testing

Coin-Specific Surface Treatment:

Electroless nickel-palladium-gold (ENIG: Ni 5μm/Pd 0.2μm/Au 0.05μm) .
Or OSP + localized silver plating for oxidation resistance.

Thermal Validation:

Infrared thermography (ΔT ≤12℃ under 10W input)
Thermal cycling (-55℃~125℃, 1,000 cycles; impedance change ≤3%)

7. Final Inspection & Packaging

Coin-Specific Testing: Ultrasonic scanning (detect delamination); Shear strength test (≥50N/mm²)
Packaging: Antistatic vacuum packaging (internal humidity ≤10%RH); silicone pads added to coin zones.

Why Choose Best Technology as Embedded Copper Coin PCB Supplier?

Reasons why choose us as embedded copper coin PCB supplier:

Certification Compliance‌: ISO 9001, IATF 16949, ISO 13485 and RoHS, UL certified, and ensures global market compliance and reliability.
Superior Material Quality: Use ≥99.9% electrolytic copper (C11000) with nickel/gold plating. Ensures superior thermal conductivity (≥401W/m·K) and long-term reliability.
Reliable Quality Control‌: Strict process control with AOI/SPI/X-Ray inspection ensures 99.5% assembly yield and minimal defects.
24 Hours Rapid Prototyping: Accelerates product launches and time-to-market.
Free DFM Optimization: Reduces design errors by 40% and avoids costly rework.
One-Stop Solution: Simplifies vendor management, cutting admin work by 60%.
Advanced Thermal Solution: Guarantees stability for high-power applications (e.g., automotive/5G).
24/7 Technical Support: Minimizes downtime and ensures smooth mass production.

Welcome to contact us if you have any request for embedded copper coin PCB: sales@bestpcbs.com.

Tags:Embedded Copper Coin PCB
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Splitter PCB Design & Assembly, PCBA Service Supplier

Tuesday, August 19th, 2025

What is splitter PCB? Let’s explore its function, types, applications, technical parameter, design guide, assembly processes through this blog.

Customer Pain Points and Difficulties:

Severe signal attenuation and short transmission distance? (Splitter PCB uses high-precision impedance matching to ensure lossless signal distribution and extend transmission distance.)
Multi-path signal interference and poor stability? (Splitter PCB’s optimized isolation design effectively suppresses EMI/EMC and ensures signal purity.)
Complex assembly process and low yield? (Splitter PCB’s standardized production process and automated SMT placement improve consistency.)

Best Technology can provide services and solutions:

Customized Design Support: Provide impedance simulation and stack up optimization to ensure Splitter PCB meets your signal distribution needs.
Efficient Production and Delivery: 7-day proofing and 15-day mass production, quickly responding to your project schedule.
Full-Process Quality Assurance
ISO 9001 control throughout the entire process, from PCB manufacturing to assembly and testing, ensures reliability.

Let Best Technology be your splitter PCB expert and solve your signal distribution challenges! Contact us now if you have any request for splitter PCB design and assembly: sales@bestpcbs.com.

What is Splitter PCB?

A splitter PCB is a printed circuit board (PCB) specifically designed for signal or power distribution. It distributes input signals/currents to multiple output ports in equal or unequal proportions, enabling system signal synchronization or power isolation.

What is the Purpose of Splitter PCB?

RF Signal Distribution: Used in communications equipment (such as base stations and routers), it splits RF signals into multiple channels.
Mixed Signal Isolation: Isolates noise interference from analog and digital circuits.
Power Management: Distributes different voltage rails in multi-voltage systems (such as automotive BMS).
High-Speed Interface Optimization: Improves the transmission stability of high-speed signals such as PCIe/USB4.
Test Support: Facilitates device debugging and performance monitoring.
Flexible Electronics Integration: Adapts to the compact space requirements of wearable devices and foldable displays.

What Are Types of Splitter PCB?

POE Splitter PCB: Separates Power over Ethernet (PoE) into data and power, adapting to non-PoE devices.
Audio Splitter PCB: Distributes audio signals to multiple output channels (such as 3.5mm/RCA jacks), supporting parallel connection of speakers or headphones.
Fan Splitter PCB: Connects multiple fans (12/24V) in parallel, simplifying wiring for cooling systems (such as 3D printers or chassis fans).
HDMI Splitter PCB: Duplicates a single HDMI signal to multiple displays, supporting 4K/8K video transmission (such as conference presentations or advertising screens).
USB Splitter PCB: Expands a single USB port into multiple ports, supporting peripheral connection or charging (such as keyboards, mice, and mobile phones).

What Are Applications of PCB Splitter?

Communications and RF Systems – Signal distribution (such as 1-to-2 splitters), frequency band division (broadband equal power division), and RF test equipment (connecting signal sources and measuring instruments).
Audio Equipment – Speaker crossover (high/mid/low frequency band distribution), electronic crossovers (weak signal division before amplifiers).
Automotive Electronics – Power control (motor controllers, battery management systems), intelligent driving (millimeter-wave radar high-frequency PCBs), new energy battery data acquisition cables (FPC flexible monitoring).
Consumer Electronics – Smartphones/tablets (HDI boards, flexible PCBs), wearable devices (lightweight and heat-resistant designs).
Industrial and Aerospace – Extreme environments (high temperature/high pressure/strong electromagnetic interference), high-precision control (multilayer boards, ceramic substrates).
Data Centers and Cloud Computing – High-speed signal transmission (servers, data center multilayer boards), low-latency data processing.
Smart Home and IoT: Wireless device integration (sensors, communication modules), low-power flexible PCB design.

HDMI Splitter PCB Design Technical Parameter

Parameter Category	Technical Specifications
Input/Output Interface	1×HDMI input, 2×/4×/8×HDMI outputs (configurable)
HDMI Version Support	HDMI 2.0b/2.1 (supports 4K@60Hz, HDR, HDCP 2.2/2.3)
Resolution Support	Maximum 4K@60Hz (4:4:4), compatible with 1080P/720P and below
Signal Bandwidth	18Gbps (HDMI 2.0) / 48Gbps (HDMI 2.1)
Operating Voltage	DC 5V (typical)
Power Consumption	≤5W (static), ≤10W (dynamic)
PCB Layers	4-6 layer board (impedance-controlled layers)
PCB Material	FR-4 (Tg≥170℃), optional high-frequency material (e.g., Rogers 4350B)
Differential Impedance	100Ω±10% (HDMI differential signal lines)
Signal Integrity	Insertion loss ≤-3dB@6GHz, return loss ≤-10dB@6GHz
EDID Support	Dynamic/Static EDID storage (EEPROM capacity ≥256Byte)
HDCP Support	HDCP 1.4/2.2/2.3 compliant
Connector Type	HDMI Type A female socket (gold-plated contacts, thickness ≥15μm)
ESD Protection	Human Body Model ±8kV, Machine Model ±200V (IEC 61000-4-2)
Operating Temperature	0℃~70℃ (commercial grade), optional -40℃~85℃ (industrial grade)
Certification Standards	CE, FCC, RoHS, HDMI Adopter Certification

How to Design a HDMI Splitter PCB?

HDMI splitter PCB design guide:

1. Basic Layout and Stackup Design

Shortening the signal path:

Minimize the distance between the HDMI connector and the processing chip (such as the TMDS341A) to reduce signal attenuation and EMI.

Stackup Structure:

Use at least a 4-layer PCB (6 layers recommended), including a complete power and ground layer.
High-speed signal layers should be placed adjacent to the ground layer to enhance magnetic field coupling and suppress EMI.

2. Differential Signal Impedance Control (100Ω)

Trace Rules:

A 1:1 differential pair width/space ratio is recommended, with intra-pair error ≤ 5 mil and inter-pair error ≤ 10 mil.
Trace spacing (s) must meet the following requirements: s < h (dielectric thickness), s < W (line width), and d > 2s (distance from other traces).
Use a 2D field solver to accurately calculate impedance, avoiding reliance on empirical values.

Via Design:

Use small vias (8 mil/16 mil recommended) to reduce capacitance effects and impedance drop.
Avoid switching high-speed signals across different layers; otherwise, additional return vias will be required.

3. Power Supply and Decoupling Capacitor Design

Power Inlet: Place a 10μF tantalum capacitor for voltage regulation.
Chip Power Supply: Place a 0.1μF or 0.01μF ceramic capacitor next to each high-speed chip, and connect the capacitor pins with double vias to reduce inductance.
Decoupling Capacitors: Configure at least one 4.7μF capacitor and five 0.1μF capacitors, connecting them directly to the power plane (minimizing the path).
Power Plane: Avoid signal lines crossing split planes to ensure a continuous return path.

4. EDID Management Strategy

EDID Compose Mode: Automatically analyzes the resolutions of all displays and selects the lowest compatible value (e.g., 1080P) to ensure compatibility.
Fixed Mode: Forces the output to a specific resolution (e.g., 4K@60Hz) to accommodate high-end devices.
Priority Setting: Supports port priority (for example, when Output 1 is disconnected, Output 2 defaults to 1080P)

5. Design for Manufacturability (DFM)

Trace Equal Length:

Length deviation within a differential pair should be ≤ 5 mil to prevent EMI caused by phase shift.
Use curved or serpentine traces to correct for length differences.

Pad and Spacing:

HDMI pads should be minimized to prevent impedance mismatch.
The copper pad to board margin distance should be ≥ 75 mil to meet production process requirements.

6. Expandable Functionality and Compatibility

Output Port Planning:

Select the number of ports based on requirements (e.g., 1×2/1×4), and reserve one or two spare ports for upgrades.

Supported Protocols:

Ensure support for HDCP 1.4+/HDMI 2.0, 4K@60Hz, and 3D formats.
Integrate CEC commands (e.g., one-button standby and remote control passthrough) to enhance the user experience.

External Power Supply:

Multiple ports (≥4 outputs) require a separate 12V/5A power supply to avoid power shortages.

7. Design Considerations

Avoid Cross-Splits: A complete reference plane is required beneath the differential lines, otherwise impedance jumps and noise will occur.
Capacitor Selection: Use low-ESL ceramic capacitors for high-frequency ranges (>100MHz) and tantalum capacitors for voltage stabilization in low-frequency ranges.
Connector Quality: Use connectors that meet HDMI impedance standards to avoid signal reflections.

How to Assemble a Splitter PCB?

Below are splitter PCB assembly processes:

1. Prepare Materials & Tools

Gather Splitter PCB (pre-etched), component kit (resistors, capacitors, transmission lines), solder wire, flux, soldering iron, tweezers, multimeter.
Inspect PCB for cleanliness and shorts; verify components match BOM (e.g., resistor values).

2. Component Placement

Align components with PCB silkscreen:

Insert resistors/capacitors into pads; press gently.
Embed transmission lines (e.g., quarter-wavelength microstrip) into slots, ensuring contact with pads.
High-frequency parts (e.g., Wilkinson resistors) must follow polarity marks.

3. Soldering

Set iron to 280–320°C (use lower temp for PTFE to avoid warping).
Steps:
a. Apply flux to pad/lead.
b. Feed solder until melted; remove iron for smooth joints.
c. Use “drag soldering” for SMD parts.
Focus: Transmission line joints and isolation resistors (avoid cold joints/bridges).

4. Quality Inspection

Visual check: Conical, shiny solder joints with no cracks.
Electrical test: Measure resistance (e.g., isolation resistors) with multimeter (≤5% deviation).
Continuity test: Short input to one output; others should show no connection.

5. Functional Verification

Connect signal generator and spectrum analyzer:
a. Input signal to PCB; measure output power (e.g., 1-to-2 divider: ≤0.5dB difference).
b. Test port isolation (e.g., ≤-20dB).
Debug: Re-solder components if power imbalance or poor isolation persists.

6. Cleaning & Protection

Wipe flux residue with alcohol to prevent corrosion.
Apply conductive adhesive on edges for RF applications to reduce EMI.
Package in anti-static bags with specs/test results labeled.

7. Notes:

Use automated soldering for high-frequency PCBs (e.g., 77GHz automotive radar) to avoid parameter shifts.
Prioritize network analyzers for testing; multimeters suit low-frequency checks only.

Why Choose Best Technology as PCBA Service Supplier?

Reasons why choose us as splitter PCB assembly service supplier:

19 Years of Industry Experience: Proven expertise in RF/high-speed splitter PCB assembly for 5G, automotive, and IoT applications.
Full Certification Compliance: ISO 9001, IATF 16949, ISO 13485 and RoHS, UL certified, and ensures global market compliance and reliability.
Cost-Effective Solutions: Competitive pricing and optimized material sourcing help reduce your production costs by 15-30%.
Free DFM & Design Support: Expert impedance matching (e.g., 50Ω RF traces) and signal integrity analysis ensure optimal splitter PCB performance.
Reliable Quality Control: Strict process control with AOI/SPI/X-Ray inspection ensures 99.5% assembly yield and minimal defects.
Fast Turnkey Assembly: 7-day prototype delivery and 15-day mass production for splitter PCB orders (100pcs–10Kpcs).
Advanced SMT Capabilities: Supports 01005-size components and 0.3mm BGA assembly for high-density splitter PCB designs.
Effective Signal Isolation: Dedicated EMI/EMC control measures prevent crosstalk in mixed-signal splitter boards.
Flexible Scalability: Seamless transition from prototypes to large-scale production (1M+ units) with consistent quality.
24/7 Technical Support: Dedicated engineers provide real-time DFM feedback and troubleshooting support.

Welcome to contact us if you have any request for PCBA service: sales@bestpcbs.com.

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