Posts Tagged ‘PCB’

PCB trace width and spacing Design Guide

星期五, 18 10 月, 2024

Trace width refers to the width of the conductive line on the PCB. If the line width is too narrow, the current passing through the unit area is too large, which will cause the wire temperature to rise and may damage the circuit board. Spacing refers to the distance between adjacent conductive lines on the PCB. Sufficient spacing can ensure the electrical insulation performance between adjacent lines and prevent short circuits between lines.

What is PCB trace/line spacing?

PCB trace/line spacing refers to the minimum distance between two lines on the PCB board. This distance is usually used to avoid electrical interference and ensure the reliability of the circuit. The size of the line spacing will affect the crosstalk, electromagnetic compatibility and heat dissipation performance of the circuit.

PCB trace width and spacing Design Guide

The basic concept and importance of line spacing is that it directly affects the performance and reliability of the circuit. The size of the line spacing needs to ensure that the electrical coupling and interference between the circuits are minimized to ensure the normal operation of the circuit.

What are the rules for PCB trace spacing?

The basic rule for PCB trace spacing is that the distance from the center of the line to the center of the line should be greater than or equal to 3 times the line width (3W rule) to ensure that crosstalk between lines is reduced.

‌3W rule‌: In order to minimize the interference between lines, the distance from the center of the line to the center of the line should be greater than or equal to 3 times the line width (3W rule), which can reduce 70% of the electric field interference. If you need to achieve a higher interference reduction effect, you can use 10 times the line width (10W rule), which can reduce 95% of the interference.

‌Electrical safety spacing‌: According to the production capacity of the PCB manufacturer, the spacing between the wires and between the wires and the pads shall not be less than 4mil. Usually, the conventional spacing is set to about 10mil to ensure production quality and electrical safety.

‌Special signal lines‌: For signal lines that need to control impedance, such as RF signals, important single-ended signals, and differential signals, the line width and line spacing should be determined according to the stacking calculation to ensure stable signal transmission.

‌Other considerations‌: In PCB design, it is also necessary to pay attention to the signal lines to avoid using right angles and sharp angles. Using arcs or 135° obtuse angles can reduce reflections and standing waves.

What is the minimum line spacing in PCB?

The minimum line spacing in PCB is usually 4mil. ‌ This spacing is to avoid electrical interference and ensure the reliability of the circuit. The specific line spacing requirements depend on factors such as design specifications, application environment, and manufacturing process. ‌

In some high-precision applications, a smaller spacing may be required, but in general, the spacing should not be less than 4mil. The common spacing in conventional design is 10mil, which can ensure better production efficiency and circuit stability. ‌

What is the minimum line width for a PCB?

The minimum line width of a PCB is usually 6mil (about 0.153mm). This is because in high-density and high-precision PCB design, the line width needs to reach this value to ensure production quality and reliability. ‌

The minimum line width may vary under different design requirements. The minimum line width that can be supported may reach 3.5mil (about 0.09mm) or less, but in most common designs, the line width will be greater than this value to ensure production yield and reliability. ‌ In high-density and high-precision PCB design, the line width may be thinner. ‌

When designing a PCB, the choice of line width needs to consider the needs of signal transmission. Generally speaking, the larger the line width, the better the factory production and the higher the yield. The line width in conventional design is usually 10mil (about 0.254mm), which can meet most application scenarios. In high-speed signal transmission, the line width needs to be greater than 10mil to reduce signal loss and synchronization problems.

What is the minimum hole spacing for PCB?

The minimum hole spacing of PCB is generally 0.1mm to 0.15mm. This range is applicable to standard 6-layer PCB circuit boards, but the specific value may vary depending on the manufacturing process and design requirements.

Under different manufacturing processes, the specific value of the minimum hole spacing is different. The minimum aperture of mechanical drilling is 0.15mm, while the minimum aperture of laser drilling can reach 0.075mm. In addition, the spacing from the pad to the outline is generally 0.2mm, and the single side of the pad cannot be less than 4mil (about 0.1mm), preferably greater than 6mil (about 0.15mm). For non-metallic holes and slots, the minimum spacing is not less than 1.6mm, and the slot hole is not less than 2.0mm from the edge of the board of the outline.

Factors that affect the minimum hole spacing of PCB include manufacturing process, design requirements and drilling detection. The advancement of manufacturing process has continuously improved the accuracy of PCB boards, and the minimum hole diameter and spacing have been continuously reduced. For example, the accuracy of modern PCB boards has developed to a minimum hole diameter of 0.08 mm and a minimum hole spacing of 0.1 mm or even higher. In addition, drilling detection is also an important link to ensure the quality of PCBs, including through holes, part holes, slot holes and special-shaped holes, which all need to be strictly inspected.

Why is PCB trace spacing design so important?

PCB trace spacing design is very important because it is directly related to the reliability, performance and safety of the circuit board. By reasonably designing the trace spacing, electrical interference can be avoided, signal transmission quality can be guaranteed, and the thermal stability and reliability of the circuit board can be improved, thereby ensuring the normal operation and long-term stable operation of the circuit board.

First, the design of trace spacing can prevent electrical interference. When two traces are parallel and close to each other, parasitic capacitance and inductance will be generated between them, resulting in signal interference and attenuation. Increasing the trace spacing can reduce this coupling effect, thereby ensuring stable signal transmission.

Second, appropriate trace spacing helps to improve the thermal stability of the circuit board. Components and traces with large working current will generate heat when working. If the traces are too dense, heat is easy to accumulate, resulting in local temperature rise, which may cause failure.

In addition, the design of trace spacing also needs to consider the requirements of production process. Smaller line width and line spacing have higher requirements for production process, which may increase production difficulty and cost.

What will happen if the PCB trace spacing is insufficient?

Insufficient PCB trace spacing will lead to problems such as signal attenuation, signal delay, crosstalk interference and layout difficulties. These problems will affect the performance and stability of the circuit and may even cause circuit function failure.

First, signal attenuation is a major problem of insufficient spacing. Signals will be attenuated during transmission. Too small spacing will increase the possibility of signal attenuation, resulting in signal distortion and increased noise, especially in high-frequency signals and fast signal transmission.

Second, signal delay is also a problem caused by insufficient spacing. It takes time for signals to propagate in the circuit. Too small spacing will extend the path of signal propagation, thereby increasing signal delay and affecting the real-time performance of the system.

In addition, crosstalk interference is another important issue. Insufficient spacing will increase the electromagnetic interaction between signal lines, leading to crosstalk interference, thereby introducing errors or interference and affecting the stability of the circuit.

Finally, layout difficulties are also a practical problem caused by insufficient spacing. When laying out the PCB, too small spacing will increase the complexity of the layout, making it difficult for designers to reasonably arrange the signal path, the distribution of power and ground lines, and the layout of components.

Does trace spacing affect PCB production cost?

The setting of trace spacing is directly related to the difficulty and cost of PCB production process. Although smaller line width and spacing can improve the performance of the circuit, it will increase the difficulty and cost of production.

The setting principles of trace spacing include:

The default values of line width and spacing are usually 6mil, but they can be adjusted according to design requirements. The minimum line width recommended value is 10mil, and the maximum line width can be set to 200mil.

The setting of trace spacing needs to take into account electrical safety and signal integrity. It is usually required that the line center spacing is not less than 3 times the line width to ensure that the electric field does not interfere with each other.

In the design of high-speed signal lines, using larger spacing can further reduce crosstalk and improve the stability of the circuit, but it will also increase costs.

Factors that affect the cost of PCB production also include:

‌Number of wiring layers‌: The more layers, the higher the price.

‌Via size‌: Vias smaller than 0.25mm usually require additional fees, and back drilling will increase the cost by about 10%~20%.

‌Plate selection‌: Unconventional materials such as high-frequency plates and halogen-free plates will increase procurement cycles and production costs.

In summary, the setting of trace spacing has a significant impact on the cost of PCB production. Reasonable settings can control costs while ensuring performance.

In short, PCB line width and spacing are very important parameters in electronic circuit design. They directly affect the performance, reliability and manufacturing feasibility of the circuit board. When designing a circuit board, it is necessary to reasonably select line width and spacing according to the requirements of the circuit and the actual situation.

Tags:PCB, pcb design, trace width and spacing
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What is aluminum pcb depaneling?

星期五, 11 10 月, 2024

In the electronic manufacturing process, it is usually necessary to divide a large area of aluminum-based PCB into multiple small pieces so that they can be installed in different electronic devices. Different electronic devices have different requirements for the size of PCBs. Through depaneling, large-area aluminum-based PCBs can be cut into sizes suitable for specific electronic devices.

What is the meaning of depaneling?

Aluminum PCB depaneling refers to cutting multiple circuit boards arranged in a row from a large board into separate small boards. This process is to divide a large aluminum printed circuit board (PCB) into multiple independent and fully functional circuit boards for subsequent assembly and use.

Aluminum PCB depaneling is an important link in the production process of electronic devices, which can improve production efficiency and circuit board flexibility.

What are the methods of PCB depaneling?

There are many ways to depanel aluminum PCBs. Common depaneling methods include:

1. ‌V-cut depaneling‌: Use a V-shaped blade to cut a V-shaped groove on the PCB board, and then separate the aluminum PCB along the groove by external force. This method is suitable for smaller aluminum PCB boards and fine dividing lines.

2. ‌Sawtooth depaneling‌: Cut the aluminum PCB board with a sawtooth cutting tool to form multiple small panels, and then separate the panels by pressure or vibration. This method is suitable for aluminum PCB boards with larger areas.

3. ‌Laser depaneling‌: Use a high-energy-density laser beam to accurately cut the aluminum PCB, which is suitable for production environments with high precision requirements and high efficiency.

4. ‌Chemical corrosion depaneling‌: Corrode the aluminum PCB with a chemical corrosive agent to form a dividing line, and then separate the panels by physical methods.

What is the process of depaneling PCB?

The aluminum PCB depaneling process varies depending on the depaneling method. The common aluminum PCB depaneling methods and processes are as follows:

Manual depaneling

Preparation: Check whether the aluminum PCB board meets the conditions for manual depaneling, such as confirming that there are no stress-sensitive components such as SMD (Surface Mounted Devices) on the board, and prepare suitable fixtures and operating space.

Positioning and fixing: Place the aluminum PCB concatenated or assembled boards that need to be separated on a stable workbench and fix them with fixtures to ensure that the boards do not move during the separation process. For aluminum PCB boards with V-grooves, align the V-grooves with the direction that is convenient for force application, and ensure that the board is placed in the correct direction and position to facilitate the separation operation.

Separation operation: The operator uses both hands or simple tools (such as tweezers, etc., and small cutting tools may be used in some special cases, but they must be operated with caution to avoid damaging the board) along the V-groove to break or separate the aluminum PCB board into individual small boards with appropriate force. During the operation, pay attention to controlling the force and direction to avoid damage to the board due to uneven force or wrong direction.

V-cut board separation machine separation

Equipment debugging: Turn on the power of the V-cut board separation machine, and adjust the upper guide knife position and lower knife height of the board separation machine according to the thickness of the aluminum PCB board, the depth and width of the V-groove and other parameters to ensure that the spacing between the upper and lower knives is appropriate and the aluminum PCB board can be accurately cut.

Upper board positioning: carefully place the aluminum PCB board with V groove on the workbench of the V-cut board splitter, ensure that the V groove of the aluminum PCB board fits tightly with the lower knife of the board splitter, and the position of the board is accurate to avoid deviation during the cutting process.

Board splitting operation: start the V-cut board splitter manually, electrically or pneumatically, so that the blade cuts along the V groove of the aluminum PCB board. During the cutting process, pay attention to the cutting situation to ensure that the cutting depth is moderate and will not cause over-cutting or incomplete cutting of the aluminum PCB board.

What is the manufacturing process of aluminum PCB?

The manufacturing process of aluminum substrate PCB mainly includes the following steps: cutting, drilling, dry and wet film imaging, etching, surface treatment and final inspection. ‌

1. Cutting: Cut the large-sized incoming materials into the size required for production, pay attention to the protection of the aluminum and copper surfaces, and avoid scratches and board edge delamination.

2. Drilling: Position the holes in the board to ensure the correct number and size, and avoid scratches on the board and deviation of the hole position.

3. Wet and dry film imaging: Present the parts required for making the circuit on the board, and pay attention to whether the circuit is open and whether the alignment is deviated after development.

4. Etching: Remove the uncovered parts to form the circuit pattern, and pay attention to the quality and stability of the circuit after etching.

5. Surface treatment: Perform necessary surface treatment on the circuit board, such as tin spraying, to improve the performance and appearance of the circuit board.

6. Final inspection: Perform a final inspection on the completed circuit board to ensure that the quality meets the requirements.

What are the advantages of aluminum PCB?

The main advantages of aluminum substrate PCB include:

Excellent heat dissipation performance: The aluminum substrate uses high thermal conductivity aluminum alloy as the core material, which can quickly conduct and dissipate heat, thereby effectively reducing the operating temperature of components.

‌Lightweight design‌: Compared with traditional FR4 substrates, aluminum substrates have lighter weight, which is particularly important in weight-sensitive fields such as aerospace and automobiles, helping to reduce the weight of the overall equipment and improve energy efficiency and operating performance‌.

‌Good mechanical properties‌: Aluminum substrates have high strength and hardness, providing good support and protection for electronic components. At the same time, its excellent impact resistance and vibration resistance enable it to adapt to various complex working environments and ensure the stable operation of the equipment‌.

‌Excellent electrical performance‌: Aluminum substrates have excellent insulation and voltage resistance, which can meet the electrical requirements of electronic equipment in various working environments and provide stable electrical support for the equipment‌.

‌Environmental protection‌: Aluminum substrates are made of environmentally friendly materials, there is no pollution in the production process, and waste is easy to recycle and dispose, which is fully in line with the current trend of green environmental protection‌.

‌Diverse application forms‌: There are many types of aluminum substrates, including flexible aluminum substrates, hybrid aluminum substrates, multi-layer aluminum substrates, etc., suitable for different application needs.

What are the disadvantages of aluminum PCB?

The main disadvantages of aluminum PCB include high cost, difficult process, electrical strength and withstand voltage problems, mismatched thermal conductivity test, inconsistent material specifications, and more defective products. ‌

First, the price of aluminum PCB is relatively high, usually accounting for more than 30% of the product price. This is because the production of aluminum PCB requires the use of high-purity aluminum materials and special processing technology, all of which push up the cost. ‌

Second, the process of aluminum PCB is difficult, especially when it is made into a double-sided board, the process complexity is higher, and it is easy to have problems in electrical strength and withstand voltage. In addition, the mismatch of thermal conductivity test methods and results of aluminum PCB is also a problem. ‌

In addition, the material specifications of aluminum PCB have not yet been unified, and there are multiple standards such as CPCA industry standards, national standards, and international standards, which brings certain uncertainties to production and application. ‌

Why is aluminum no longer used in integrated circuits?

The main reason why aluminum is no longer used in integrated circuits is that copper has replaced aluminum as an interconnect metal material. Copper has lower resistivity and better anti-electromigration performance than aluminum, which makes copper more reliable and effective in high-speed integrated circuits. ‌

Specifically, aluminum may experience electromigration under long-term current, that is, aluminum atoms migrate inside the wire, causing the wire to break or form voids, which in turn causes the integrated circuit to fail. In addition, as the interconnection spacing decreases, the resistance of the aluminum wire increases and the capacitance between the wires increases, resulting in increased RC delay, which is not conducive to high-speed integrated circuits.

Copper has a lower resistivity than aluminum, can transmit current more efficiently, and can carry more current in thinner metal wires. Copper also has higher electromigration resistance than aluminum, making copper interconnects more reliable under high current conditions. These advantages make copper a preferred material for advanced integrated circuit technology.

Aluminum-based PCB depaneling is an important link in the electronic manufacturing process, which directly affects the quality and performance of electronic equipment. By selecting the appropriate depaneling method, controlling the depaneling accuracy, and avoiding damage to the PCB, the quality and efficiency of aluminum-based PCB depaneling can be effectively improved.

Tags:aluminum pcb, MCPCB, PCB, printed circuit board
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Compare pcb single vs double sided

星期四, 10 10 月, 2024

There are many differences between single sided and double sided PCB in terms of structure, performance, application scenarios, etc. Single-sided PCB has conductive lines on only one side, while double-sided PCB has conductive lines on both sides, which makes them perform differently in terms of the complexity of circuit layout, signal transmission capability, and the types of electronic devices they are suitable for.

What is the difference between single and double sided PCB?

The main difference between single-sided PCB and double-sided PCB lies in their structure and use. Single-sided PCB has only one layer of lines, which is suitable for simple circuits; while double-sided PCB has two layers of lines, which is suitable for complex circuits.

The characteristics and application scope of single-sided PCB are as follows:

1. Structure: Single-sided PCB has only one layer of lines, and all components are on the same layer and connected by copper foil lines.

2. Application scope: Usually used for simple circuits, such as LED lights, alarm clocks, etc.

3. Advantages: Low manufacturing cost and simple manufacturing process.

4. Disadvantages: Only simple circuit layout can be realized, and the crossing of lines will increase the size of the board, which is not suitable for complex circuit layout.

The characteristics and application scope of double-sided PCB are as follows:

1. Structure: Double-sided PCB has two layers of lines, and components can be arranged and connected on two levels, and connected to each other through jacks and pads.

2. Application scope: Usually used for complex circuits, such as computers, mobile phones, etc.

3. Advantages: Complex circuit layout can be realized, and the crossing of lines will reduce the size of the board.

4. Disadvantages: The manufacturing cost is high, and the manufacturing process is more complicated than that of single-sided PCB, which is not suitable for ultra-large circuit layout.

The differences in materials and processes between single-sided PCB and double-sided PCB are as follows:

1. Material: Single-sided board has copper foil on only one side, while double-sided board has copper foil on both sides.

2. Process: The solder joints of single-sided board are basically on one side, and components are inserted on the other side; both sides of double-sided board can be soldered, with plug-in components and SMD components.

Why use single sided PCB?

Single-sided PCB is mainly used for simple circuit design and cost-sensitive applications. Since there is only one side of the single-sided board with wiring, the wiring is difficult, so it is mainly suitable for simple circuit design.

The advantages of single-sided PCB include low cost and relatively simple manufacturing process. Since the manufacturing process of single-sided board is relatively simple and does not require complex multi-layer wiring and connection, the cost is low and suitable for mass production.

What is the advantage of single layer PCB?

The main advantages of single-layer PCB include:

1. Low cost: The manufacturing cost of single-layer PCB board is relatively low, because only one layer of copper foil and one layer of substrate are required, the manufacturing process is relatively simple, and the material cost is low.

2. Easy to make: Compared with other structural types of PCB boards, the manufacturing method of single-layer PCB board is relatively simple, only single-sided wiring and single-layer corrosion are required, the manufacturing difficulty is low, the drilling, welding and installation of components are relatively simple, and it is unlikely to cause production problems.

3. High reliability: Single-layer PCB board does not have multi-layer wiring and connection, so it is not easy to have problems such as short circuit and interference, and has high reliability.

4. Suitable for simple circuits: Single-layer PCBs are suitable for simple circuit designs, such as LED lights, household appliances, etc., and can meet most low-complexity circuit requirements.

What are the disadvantages of single sided PCB?

First, the difficulty of wiring a single-sided PCB is a significant disadvantage. Since there is only one layer of copper foil, wiring is difficult, and the layout of the circuit and the location of components need to be carefully planned to avoid short circuits or circuit failures caused by improper wiring.

Second, the electromagnetic interference suppression capability of single-sided PCBs is relatively poor. In high-frequency circuits, the electromagnetic interference problem of single-sided PCBs will be more prominent and become an important factor to be considered during design.

Finally, single-sided PCBs limit the complexity of the circuit. Since it has only one layer of copper, it is not suitable for the design of complex circuits. For circuits that require high complexity, double-sided or multi-layer PCBs would be a better choice.

What are the advantages of double sided PCB?

The main advantages of double-sided PCBs include:

1. Enhanced circuit density: The available surface area of double-sided PCBs is doubled, and more components can be attached.

2. Higher signal transmission rate: Double-sided PCB design makes the circuit more complex and flexible, thereby improving the signal transmission rate and circuit performance.

3. More reliable circuit connection: By passing the circuit through holes between the two sides, the circuit can be connected on both sides, greatly improving the density and reliability of the circuit board.

4. Convenient wiring and debugging: The design of double-sided PCB makes wiring more flexible, convenient for complex circuit design, and also convenient for subsequent debugging and maintenance.

5. Environmental protection and high efficiency: Double-sided PCBs are made of non-toxic and pollution-free materials, which meet environmental protection requirements, and can carry more electronic components and improve the working efficiency of equipment.

Where are double sided PCBs used?

The characteristic of double-sided PCBs is that both sides can be wired and assembled with electronic components, and the lines on both sides are connected through holes (vias), so as to achieve more complex circuit design.

This design makes double-sided PCBs perform well in application scenarios that require high-density assembly and complex circuit layout. Due to the presence of vias, double-sided PCBs can achieve more complex circuit designs without significantly increasing the size of the circuit board.

Specific application areas include:

1. Computer and industrial control: Double-sided PCBs are widely used in computer motherboards and industrial control systems, providing complex circuit designs and high-density component layouts.

2. Communication equipment: In communication equipment, double-sided PCBs are used to achieve high-density signal processing and transmission, supporting various communication protocols.

3. Consumer electronics: In devices such as smartphones, tablets, routers, etc., double-sided PCBs are used to achieve complex circuit functions and efficient space utilization.

4. Aerospace: In the high-tech field, double-sided PCBs are used for applications with high performance requirements and strict space constraints.

What are the two sides of a PCB called?

The two sides of a PCB are called the top layer and the bottom layer. ‌

The top layer is usually used to place and layout electronic components such as chips, resistors, capacitors, etc. The pins, wires, identifiers, and markings of the components can be seen on this layer. The top layer is also called the component side.

The bottom layer is mainly used to connect the pins of electronic components and connect to the top layer through appropriate wires. In this layer, you can see the pads, vias, connections, and possible ground and power planes. The bottom layer is also called the solder side.

In addition to the top and bottom layers, PCBs may also contain other layers, such as signal layers, power/ground layers, mechanical layers, solder mask layers, solder paste protection layers, and no-routing layers. These layers play different roles in PCB design, such as providing circuit routing, mechanical support, and preventing short circuits.

Can you put components on both sides of a PCB?

Components can be placed on both sides of a PCB. The design of double-sided PCBs allows components and wiring to be placed on both sides of the circuit board, thereby increasing the complexity and functionality of the circuit.

Design features of double-sided PCBs include:

Dual use of wiring and components: Both sides of a double-sided PCB can be used for wiring and component placement, which greatly increases the complexity and functionality of the circuit.

Via connection: In order to achieve interconnection between components and wiring on a double-sided PCB, connections need to be made through vias. A via is a small hole filled or coated with metal that connects wires on both sides.

The use scenarios of double-sided PCBs include:

Increasing circuit density and functionality: Double-sided PCBs increase the layout space for components, allowing designers to achieve more functions without increasing the size of the circuit board, which is particularly suitable for occasions that require high-density integration and complex circuit design.

In short, single-sided and double-sided PCBs differ significantly in many aspects. Both single-sided and double-sided PCBs contribute to the vigorous development of the electronics industry and continue to help electronic technology move forward. BEST Technology has abundant upstream and downstream resources for circuit boards, and can quickly and efficiently meet customers’ various needs for circuit boards.

Tags:double sided, PCB, single sided
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Aluminum led pcb board manufacturers&Fast Delivery, Customization

星期四, 10 10 月, 2024

Aluminum LED PCB board are almost everywhere in our lives. LED lights have become more popular than other lights in the field of lighting. LED PCBs usually use aluminum or metal core as substrates. Aluminum can dissipate heat effectively and there is no need to use a heat sink, so the PCB can effectively dissipate a lot of heat without problems.

What is aluminum led pcb board?

Aluminum LED PCB board is a special printed circuit board that is mainly used for LED lighting and other equipment that requires efficient heat dissipation. Unlike traditional FR-4 fiberglass boards, aluminum LED PCB boards use aluminum alloy as the substrate and have better thermal conductivity. This type of board usually consists of a three-layer structure: circuit layer (copper foil layer), insulation layer, and metal base layer.

Aluminum led pcb board manufacturers&Fast Delivery, Customization

The characteristic of aluminum LED PCB board is that it uses aluminum alloy material, which has excellent thermal conductivity and can quickly dissipate the heat generated when the LED is working. Compared with traditional FR-4 fiberglass boards, aluminum substrates have higher thermal conductivity and can carry higher currents, which are suitable for applications that require high power output.

In addition, aluminum substrates also have good electrical insulation and machining properties, which makes them also have a place in high-end applications.

In terms of application, aluminum LED PCB boards are mainly used in products such as LED lighting equipment and solar street lights that require efficient heat dissipation. Due to its excellent thermal conductivity and cost-effectiveness, aluminum substrates have quickly become the preferred material in these fields.

Why choose aluminum led pcb board?

The main reason for choosing aluminum-based PCB boards is that they are due to their excellent thermal conductivity and light and high-strength characteristics, which can effectively reduce the operating temperature of LED lights and improve their stability and reliability.

The advantages of aluminum-based PCB boards include:

Excellent thermal conductivity ‌: The aluminum substrate uses metal aluminum as the substrate, which has excellent thermal conductivity, can effectively conduct the heat generated by the LED when it is working, reduce the module operating temperature, extend the service life, and improve the power density and reliability. ‌

Lightweight and high strength ‌: The aluminum substrate material is light and has high strength, which is suitable for various complex environments and high-strength application scenarios ‌.

‌Electromagnetic shielding performance‌: Aluminum substrate has good electromagnetic shielding performance, which can effectively reduce electromagnetic interference and improve the signal transmission quality of electronic equipment‌.

‌High degree of customization‌: Aluminum substrate can be customized according to customer needs to meet the specific needs of different application scenarios‌.

Disadvantages of aluminum led pcb board

The main disadvantages of aluminum LED PCB board include high cost, difficult process, electrical strength and voltage resistance problems. ‌

First, the cost of aluminum LED PCB board is high. Compared with other materials, the price of aluminum substrate accounts for more than 30% of the product price, which increases the cost of the product to a certain extent‌.

Secondly, aluminum LED PCB board has certain difficulties in process. The current mainstream products are mainly single-sided boards, and the process of making double-sided boards is more difficult‌.

In addition, aluminum LED PCB boards are prone to problems in electrical strength and voltage resistance. Due to the characteristics of the material itself, the manufactured products may not meet the standards in terms of electrical strength and voltage resistance‌.

What are the types of LED PCB boards?

LED PCB boards are printed circuit boards for mounting LEDs. Their substrate materials mainly determine the thermal conductivity of LED PCBs. According to the different heat dissipation performance, LED PCB boards can be divided into 6 types.

Aluminum LED PCB: Aluminum LED PCB is the most common and cost-effective printed circuit board for LED lights, such as LED plant growth lights.

Copper-based LED PCB: Copper-based LED PCB is used for high-power LED lights, such as car headlights. The structure of ordinary copper-based LED PCB is the same as that of aluminum LED PCB, but the thermal conductivity is several times higher than that of aluminum LED PCB.

FR-4 LED PCB: If the LED light is used as daily household lighting and does not require much printed circuit board heat dissipation, FR-4 LED PCB can be a cost-effective printed circuit board choice. The price of FR-4 LED PCB is lower than other types of circuit boards.

Ceramic LED PCB: High-power LED lights, especially photography and pool lights, use ceramic LED PCB. Ceramic LED PCBs include aluminum nitride (AlN) PCBs, aluminum oxide (alumina) PCBs, boron oxide (BeO) PCBs, and silicon nitride (Si₃N₄) PCBs. The most common ceramic LED PCBs are AlN PCBs and alumina PCBs.

Hybrid substrate LED PCBs: The substrate materials of high-power LED PCBs can be mixed. Hybrid LED PCBs can have two or three substrate materials. And the different substrate materials are connected by phase change, that is, they are combined into a whole.

Flexible LED PCBs: Flexible PCBs with polyimide or polyester substrates are used for flexible LED light strips. Flexible LED PCBs can be used for mask lights, miner headlamps, and indoor/outdoor decorative light strips.

What is a SMD LED PCB board?

SMD LED PCBs are printed circuit boards for surface mounted LEDs (Surface Mounted Devices). ‌ SMD LED PCBs are LED chips packaged into lamp beads, which are then soldered on PCBs to make LED modules with different spacings. In this packaging method, each lamp bead is an independent point light source, which has the advantages of small size, large scattering angle, good luminous uniformity and high reliability.

The characteristics of SMD LED PCB board include:

1. Principle of luminescence: When the current passes through the compound semiconductor, the electrons and holes combine to release energy and emit light, which belongs to cold luminescence, and the life span is about 50~100 times longer than that of tungsten filament bulbs, up to 100,000 hours.

2. Fast response speed: The lighting response speed is faster than that of ordinary electric lights, about 3~400 nanoseconds.

3. Energy saving and high efficiency: The electro-optical conversion efficiency is high, the power consumption is small, and it saves about 1/3~1/20 of the energy compared with the light bulb.

4. Wide application: It is mainly used in lighting systems, decorations, electronic equipment indicators, backlights, displays and instruments.

How to make aluminum led pcb board?

LED circuit boards usually have good thermal conductivity, electrical insulation, and mechanical processing performance, and are mainly composed of metal-clad copper plates, conductive layers, and insulating layers.

The main manufacturing processes of LED PCB include:

1. Raw material cutting
2. Drilling
3. Image transmission
4. Etching
5. Screen printing
6. Solder mask
7. Surface treatment
8. V-shaped cutting
9. Testing
10. FQC and packaging

What do G, R, B and + mean on the LED PCB?

On the LED PCB, G, R, B and + represent the following meanings:

G stands for ground: It is the zero potential reference point in the circuit, and the potential of all other circuits is measured relative to the ground. The ground plays the role of providing reference potential and preventing mutual interference between circuits in the circuit.

R stands for red: In LED display screens, R usually refers to red light-emitting diodes, which are used to produce red light. Red light is part of the visible spectrum and is often used in color displays or lighting systems.

B stands for blue: Also in LED display screens, B stands for blue light-emitting diodes, which are used to produce blue light. Blue light, together with red and green light, can synthesize various colors and is widely used in color display technology.

+ represents positive supply voltage: In the circuit, the + symbol usually represents the positive supply, that is, the power supply end that provides positive voltage. This is an important part of the power supply in the circuit to ensure the normal operation of electronic components.

In short, aluminum-based LED PCB boards occupy an important position in the electronics field with their excellent heat dissipation performance, reliable electrical performance and high mechanical strength. With the continuous advancement of technology, it will continue to bring more efficient solutions to many industries such as lighting, display screens, and automotive electronics.

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What is laser direct imaging technology?

星期三, 9 10 月, 2024

Laser direct imaging (LDI) technology is a process that uses lasers to expose images directly on photoresists, mainly used in the exposure process of PCB manufacturing processes. LDI is a widely used technology that can create a variety of images and is used in various industries, including electronics, automotive and medical industries.

What is laser direct imaging?

Laser direct imaging (LDI) is an advanced photolithography technology. It directly uses a laser beam to expose images on photoresists, eliminating the intermediate step of making photolithography masks in traditional photolithography technology.

In this process, the laser beam is precisely controlled according to the pre-set circuit pattern data. The laser emitted by the laser light source is processed by a series of optical components, such as beam expansion and focusing, and then the laser beam is guided by the scanning system to scan and expose the surface of the printed circuit board (PCB) coated with photoresist.

The photoresist responds to the laser energy, and according to the type of photoresist (positive or negative), the corresponding chemical changes occur in the laser irradiation area. This change will lay the foundation for subsequent development and other processes, thereby forming an accurate circuit pattern.

What is the principle of laser direct imaging?

The principle of laser direct imaging (LDI) is to expose the pattern directly on the substrate coated with photosensitive material through a computer-controlled laser beam.

Specifically, the workflow of LDI includes the following steps: First, the designed circuit pattern is converted into the image generation program of the spatial light modulator through computer-aided manufacturing (CAM) software. Then, the laser beam passes through the spatial light modulator, and the generated image is projected onto the substrate coated with photosensitive material through the optical imaging system to complete the pattern exposure. Compared with the traditional mask exposure process, LDI saves the film process in the exposure process and greatly improves the production efficiency.

The main advantages of LDI technology are its efficiency and precision. It directly uses a highly focused laser beam controlled by a computer to define the circuit pattern on the PCB copper layer covered with laser photoresist without the need for photographic tools, thus avoiding the film and printing defects in the traditional process.

In addition, LDI also optimizes the production environment, eliminates the influence of temperature and humidity on the product, and further improves the production quality and efficiency.

How does laser direct imaging (LDI) work?

Laser direct imaging (LDI) technology is a process that uses laser to directly expose and image on photoresist, and is mainly used in the exposure process in the PCB manufacturing process. Its working principle is as follows:

1. Design graphics: Design the circuit graphics to be produced through computer-aided design (CAD) software.

2. Generate images: Convert the designed circuit graphics into digital images and transmit them to the control system of the LDI equipment.

3. Laser scanning: The laser beam in the LDI equipment scans and exposes the photoresist according to the information of the digital image under the precise control of the control system.

4. Photochemical reaction: The photoresist undergoes a photochemical reaction under the irradiation of the laser, changing its solubility.

5. Development: The exposed photoresist is developed in the developer to remove the unexposed part of the photoresist, thereby forming a circuit pattern on the photoresist that is consistent with the design graphics.

6. Etching or electroplating: According to needs, the developed circuit board is etched or electroplated and other subsequent processes are performed to produce the actual circuit.

Compared with traditional exposure technology, LDI technology has higher resolution and precision, can produce finer circuit wiring and smaller line spacing, and also has higher production efficiency and flexibility.

What are the advantages of using laser direct imaging?

The main advantages of LDI (Laser Direct Image) technology include: eliminating the film process in the exposure process, saving time and cost for loading and unloading films, and reducing deviations caused by film expansion and contraction; directly imaging CAM data on PCB, eliminating CAM production process; high image resolution, fine wires can reach about 20um, suitable for fine wire production; improve PCB production yield.

The main problems of LDI technology include: high-precision lasers and optical systems are required, which increases the cost and complexity of the equipment; high environmental requirements, temperature and humidity need to be controlled to ensure imaging quality; high technical requirements for operators, and professional training is required to operate the equipment proficiently.

The advantages of LDI technology in the flexible board industry include: improving production efficiency, no need to make and replace physical masks, shortening production cycles and waiting time; high-precision imaging, capable of processing finer and more complex graphics, improving product yield and reliability; efficient use of materials, reducing material waste; environmental advantages, reducing the use of chemicals, and reducing environmental pollution.

What are the disadvantages of laser direct imaging?

The disadvantages of laser direct imaging (LDI) technology mainly include:

1. High equipment cost: LDI equipment is usually expensive and requires a large initial investment, which may be a burden for some small enterprises or projects.

2. High environmental requirements: LDI equipment needs to work in a specific environment, such as a dark room or a low-illuminance red light environment, which increases the requirements for the working environment.

3. Technical complexity: LDI technology involves multiple steps and complex process flows, with high technical requirements for operators, and long training costs and time.

4. High material cost: LDI requires the use of specific photoresists and laser diodes, which are expensive and increase production costs.

5. Speckle problem: After the laser beam is reflected or transmitted through a rough surface, it will form countless independent scattered sub-waves. These sub-waves are coherently superimposed during the spatial propagation process, forming random and irregularly distributed bright and dark spots in space, that is, speckle phenomenon, which may affect the imaging quality.

In summary, although LDI technology has the advantages of high precision and high efficiency, its disadvantages such as high equipment cost, complex technical requirements and speckle problem also need to be considered when using it.

When is laser direct imaging used?

Laser direct imaging LDI is mainly used in the exposure process in PCB manufacturing, especially when high precision and efficient production are required. This technology is particularly suitable for the production of fine-line and ultra-fine-line circuit boards, and can achieve the best imaging effect.

In addition, LDI technology is also widely used in the field of FPC soft boards, which can improve production efficiency and product quality, and support complex circuit structures and high-density layouts.

The advantages of laser direct imaging LDI technology include:

1. High precision: It can achieve high-resolution pattern exposure and improve product performance and reliability.

2. Efficient production: shorten the exposure process, speed up production and reduce costs.

3. Complex circuit structure: support the exposure of multi-layer FPC and meet the needs of high-density layout.

Laser direct imaging technology is a highly promising technology in the field of PCB manufacturing. It has many advantages in terms of precision, flexibility, production efficiency and cost-effectiveness, and plays an important role in PCB manufacturing in many fields such as high-end electronic products, automotive electronics, industrial control and communication equipment.

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What is the thermal conductivity of ceramic?

星期二, 8 10 月, 2024

Ceramics have emerged in many fields with their unique properties, and the thermal conductivity of ceramics has become one of the focuses of attention. Ceramic PCBs have the advantages of high thermal conductivity, good insulation performance, high mechanical strength and high precision, and have been widely used in high-power LED lighting, automotive electronics, and aerospace.

Is ceramic a good thermal conductor?

Ceramic PCB is a good thermal conductor. ‌

What is the thermal conductivity of ceramic?

The thermal conductivity of ceramic PCBs is due to the materials used, such as aluminum oxide (Al2O3) and aluminum nitride (AlN). These materials have high thermal conductivity and can effectively dissipate heat, prevent overheating, and ensure that electronic components can still work stably in high temperature environments.

The thermal conductivity of aluminum nitride reaches 170W/(mK)~220W/(mK). Such high thermal conductivity enables ceramic PCBs to effectively dissipate heat when the chip is working, ensuring that the sensor signal will not be distorted, especially in high temperature, high vibration, and corrosion environments. The signal of ceramic PCBs is still efficient, sensitive, and accurate. ‌

In addition, the manufacturing process of ceramic PCB adopts LAM technology, which is a laser rapid activation metallization technology, making ceramic PCB highly versatile and can replace the entire traditional printed circuit board with a simpler structure and enhanced performance.

In summary, ceramic PCB not only has good thermal conductivity, but also can maintain stability and reliability in harsh environments such as high temperature, high vibration, corrosion, etc., which is an ideal choice for high-performance electronic components.

What are the thermal properties of ceramics?

The thermal performance of ceramic PCB is significantly better than that of traditional printed circuit boards (PCBs).

The thermal performance of ceramic PCB is mainly reflected in the following aspects:

High thermal conductivity: The thermal conductivity of ceramic PCB is usually above 18W/mK, which is much higher than that of traditional ceramic materials and organic substrates. It can effectively transfer heat from the heating element to the heat sink and improve the heat dissipation efficiency.

Good insulation performance: The ceramic substrate has good insulation performance and can withstand high voltage and high current, ensuring the safety and stability of the circuit.

High mechanical strength: The ceramic substrate has high mechanical strength, can withstand large pressure and impact, and is not easy to break and deform.

‌Good chemical stability‌: Ceramic substrates have good chemical stability and can withstand corrosion from chemicals such as acids, alkalis, and salts, and are not prone to aging and deterioration‌.

‌Thin and lightweight‌: High thermal conductivity ceramic substrates can be made into thin and lightweight products to meet the needs of miniaturization and lightweight electronic devices‌.

These characteristics make ceramic PCBs the first choice for applications that generate a lot of heat and require efficient thermal management, especially in radio frequency (RF) and microwave applications, which can maintain signal integrity and minimize signal loss, making them indispensable in industries such as telecommunications, aerospace, and satellite communications‌.

In addition, ceramic PCBs’ chemical resistance and ability to withstand harsh environments make them ideal for applications that require contact with corrosive substances‌.

What material has the highest thermal conductivity?

Aluminum nitride (AlN) has the highest thermal conductivity. ‌

Aluminum nitride (AlN) is an excellent ceramic material with extremely high thermal conductivity and low expansion coefficient. Its thermal conductivity is as high as 170-230 W/mK, making it one of the ceramic substrate materials with the best thermal conductivity.

The effective heat dissipation performance of aluminum nitride makes it particularly suitable for the heat dissipation needs of high-power density electronic devices and high-frequency electronic devices. In addition, aluminum nitride also has the characteristics of high hardness, high mechanical strength, strong corrosion resistance, high biocompatibility, and a thermal expansion coefficient close to silicon, so it performs well in applications such as high-power LEDs, power modules, and laser fields.

In contrast, other common ceramic PCB materials such as aluminum oxide (Al2O3) have low thermal conductivity, generally between 18-35 W/mK. Although they have good insulation properties and mechanical strength, their thermal conductivity is not as good as aluminum nitride and cannot meet the heat dissipation needs of high-power devices. Therefore, aluminum nitride is the preferred material in applications that require efficient heat dissipation.

What is the thermal conductivity of ceramic in W mK?

Ceramic PCB, as a high thermal conductivity material, its thermal conductivity depends on the type of ceramic substrate used. The thermal conductivity of ‌alumina ceramic‌ is between 18-35 W/mK, while the thermal conductivity of ‌aluminum nitride ceramic‌ is as high as 170-230 W/mK, which shows that aluminum nitride ceramic has higher thermal conductivity than alumina ceramic.

In addition, the thermal conductivity of ceramic PCB is better than that of traditional ‌FR4 PCB‌ or ‌metal substrate‌, the latter of which usually has a thermal conductivity of less than 3W/mK. Especially in the field of products that require high heat dissipation performance, ceramic PCB is favored for its excellent thermal conductivity.

Do ceramics have good conductivity?

The conductivity of ceramic PCB (printed circuit board) is due to the ceramic substrate it uses. This substrate material has good thermal and electrical conductivity and can withstand high power density.

Ceramic substrates are usually made of materials such as alumina, aluminum oxide and silicon nitride, which give ceramic substrates excellent electrical properties and mechanical strength, making them widely used in high-frequency communications.

The thermal conductivity of ceramic PCB is between 25~230w, with very good insulation and thermal conductivity. At the same time, its dielectric constant is low, dielectric loss is small, and it has excellent high-frequency performance. These characteristics make ceramic PCB perform well in applications that require efficient thermal management and maintain signal integrity.

How good of an insulator is ceramic?

Ceramic PCB has excellent insulation performance. ‌

The insulation performance of ceramic PCB is due to its material characteristics. It is based on ceramic materials and has extremely high hardness and wear resistance. It also has good insulation performance and thermal stability. Ceramic materials themselves have excellent electrical insulation properties and can effectively prevent short circuits and current leakage.

Does ceramic have electrical resistance?

‌Ceramic PCB has resistance. ‌

Ceramic PCB, as a high-performance electronic substrate material, has excellent physical and electrical properties. In ceramic PCB, resistors are part of electronic components, used to limit current and reduce voltage, and are an indispensable component in the circuit. The resistors of ceramic PCBs are usually installed on the circuit board together with other electronic components to complete the function of the circuit together.

The thermal conductivity of ceramic is one of its important properties. Different types of ceramic materials have different thermal conductivities. In the future, with the continuous development and progress of electronic devices, the performance requirements for PCBs will become higher and higher, and ceramic PCBs will continue to develop and innovate to meet market demand.

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What is an apex regulator pcb?

星期二, 8 10 月, 2024

Apex regulator PCB, as a key electronic component, plays an indispensable role in ensuring power supply stability. In today’s era of high digitalization and electronic equipment dependence, a stable power supply is essential for the normal operation of various devices.

What is a regulator PCB?

Regulator PCB (Printed Circuit Board) is a printed circuit board that integrates regulator-related circuit components. It is centered on regulator components (such as voltage, current or power regulators), supplemented by other circuit components such as capacitors, resistors, and inductors to work together.

Through specific working principles, such as linear regulators adjust the degree of conduction, switching regulators use high-frequency switching actions and related modulation methods to achieve voltage regulation, current detection and control to achieve current regulation, and power regulation based on voltage and current regulation.

At the same time, it has output stability, can maintain output stability when the input voltage fluctuates and the load changes, and has multiple protection functions such as overvoltage, overcurrent, and overheating. It has the characteristics of flexible design of circuit structure and parameters according to needs, high integration to reduce volume, and easy installation and use.

What are the three types of regulators?

There are three main types of regulators: contact regulators, transistor regulators, and integrated circuit regulators. ‌

Contact regulators are an earlier type of regulator, which are characterized by slow contact vibration frequency, mechanical inertia and electromagnetic inertia, resulting in low voltage regulation accuracy, easy sparking of contacts, large radio interference, poor reliability, and short life. They have now been eliminated.

Transistor regulators emerged with the development of semiconductor technology. Their advantages include high switching frequency of transistors, no sparking, high regulation accuracy, light weight, small size, long life, high reliability, and low radio wave interference. This type of regulator is now widely used in a variety of mid- and low-end models.

In addition to the advantages of transistor regulators, integrated circuit regulators also have the characteristics of ultra-small size. They are usually installed inside the generator (built-in regulators), reducing external wiring and improving cooling effects. This type of regulator is widely used in a variety of car models.

What is an apex regulator pcb?

Apex regulator is an electronic device that regulates the voltage, current or power of a power supply to meet the needs of a specific electronic device or system. And the Apex regulator PCB is the product of combining the Apex regulator with the printed circuit board (PCB) technology.

PCB is a substrate that carries electronic components and provides electrical connections. It is made of insulating material, usually glass fiber reinforced epoxy, covered with a conductive copper foil pattern. Electronic components are mounted on the PCB by soldering or other connection methods to form a complete electronic circuit.

Apex regulator PCB integrates the Apex regulator onto the PCB, achieving a more compact and efficient power regulation solution. This integrated design not only reduces the space occupied, but also improves the reliability and stability of the circuit.

What is the function of the apex regulator pcb?

Receive input voltage: The PCB receives the input voltage from the power supply, which may vary due to a variety of factors. This input voltage is usually higher or lower than the level required by the system components.

Regulate voltage: The voltage regulator on the PCB adjusts the input voltage to match the required output level. If the input voltage is too low, the regulator increases it to the appropriate level.

Stabilizes output voltage: Once the voltage is regulated, the PCB distributes it to the various components of the electronic system. A feedback control system continuously monitors the output voltage to ensure it remains stable, and makes real-time adjustments as needed to offset any fluctuations in the input voltage.

Ensures lifespan: By maintaining a stable voltage supply, the apex regulator PCB helps protect sensitive components from damage caused by voltage surges or voltage drops.

How does a apex regulator circuit work?

The working principle of an APEX regulator PCB is to convert analog signals into digital signals through an ADC conversion circuit so that electronic devices and computers can understand and process them. ‌ This process involves converting analog signals from our real world into digital signals, allowing electronic devices to recognize and process these signals‌.

Specifically, the ADC conversion circuit in the APEX regulator PCB is responsible for converting the input analog signal into a digital signal. The ADC (Analog-to-Digital Converter) circuit is responsible for converting continuously changing analog voltage or current signals into discrete digital signals that can be processed and analyzed by electronic devices.

ADC circuits usually consist of three main parts: sampling, quantization, and encoding. These steps convert analog signals into binary codes that computers can process.

What are the applications for apex regulator pcb?

Apex regulator PCB is mainly used in automation industry, industrial robots, medical inspection, precision testing instruments and other fields. ‌ These application fields have high requirements for accuracy, efficiency and stability, making Apex regulator PCB an ideal choice.

In the automation industry, Apex regulator PCB is widely used in various automation equipment, such as servo system-controlled CNC trademark printing machines, CNC pipe bending machines, etc. These equipment require high-precision speed control and stable output. Apex regulator PCB can provide precise control and reliable performance to meet the needs of automated production.

In the field of industrial robots, Apex regulator PCB is used to control various actions of the robot to ensure its precise operation in complex environments. Its high torque output and stable accuracy enable the robot to perform well in various industrial applications, improving production efficiency and product quality.

Medical inspection and precision testing instruments also require regulators with high accuracy and stability. The application of Apex regulator PCB in these fields can provide precise control signals to ensure the accuracy and reliability of test results.

Conclusion:

As an indispensable part of electronic equipment, Apex regulator PCB plays an irreplaceable role in ensuring stable operation of equipment and improving equipment performance. With the continuous development of technology, it will continue to develop in the direction of miniaturization, integration, high efficiency, intelligence, etc., and continue to play an important role.

Tags:PCB, pcb design, PCBA, regulator PCB
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What is beveler in pcb?

星期一, 7 10 月, 2024

PCB beveler is a less well-known but very important tool, but it plays a vital role in the manufacturing and assembly process of PCB (printed circuit board). It is a tool specifically used to create bevels or chamfers around the edges or holes of PCB.

What is a PCB Beveler?

PCB beveler is a device used to bevel (chamfer) the edges of printed circuit boards (PCBs). Its functions include improving the electrical performance of PCBs, dispersing the electric field through beveling, reducing the risk of electrical breakdown; enhancing the mechanical properties of PCBs, preventing stress concentration and cracking at the edges; facilitating subsequent processing and assembly work, avoiding scratching other electronic components or damaging component pins during the plug-in process.

It has the advantages of high precision, high efficiency, low noise, and low energy consumption. It is widely used in the electronics industry, especially in the production process of consumer electronic products such as smartphones and tablets, which can improve production efficiency and product quality.

What is Edge Bevel in PCB?

Edge bevel is the process of making a transition edge between two sides of a PCB, usually on the outer edge of the PCB. Bevel is often used for edge connectors to allow for smoother insertion into another circuit board socket. Edge connector pins are often called gold fingers because they are plated with gold and have multiple parallel groups together.

Why do PCB edges need to be beveled?

The main reason why PCB edges need to be beveled is to increase the contact area, reduce contact resistance, and improve the stability of electrical connections.

The bevel process increases the contact area between the gold finger and other connectors by processing the PCB edge into a bevel, thereby reducing the contact resistance and improving the stability and reliability of signal transmission.

Specifically, the bevel process has the following advantages in application:

‌Increase contact area‌: Beveled edges can increase the contact area between the gold finger and the socket, thereby increasing friction and connection stability.

‌Reduce contact resistance‌: The bevel design reduces the pressure concentration at the contact point, thereby reducing the contact resistance and reducing the loss in signal transmission.

‌Adapt to different application scenarios‌: According to the specific application scenarios and equipment requirements, the bevel angle can be adjusted between 15° and 45° to meet different spatial layouts and electrical connection requirements‌.

The use of PCB beveling machines further improves the accuracy and efficiency of the beveling process. This mechanical equipment can accurately control the bevel angle through a high-precision mechanical transmission system and an efficient grinding process to ensure processing quality and production efficiency.

What are the Benefits of PCB Edge Beveling?

The main benefits of PCB edge beveling include enhanced aesthetics, easy installation, improved electrical performance, and reduced mechanical stress. ‌

First, the beveling process can enhance the aesthetics of the circuit board. By cutting the PCB edge at a specific angle, the beveling process makes the appearance of the circuit board more refined and beautiful, which can significantly improve the overall visual effect of the product‌.

Secondly, the beveling process is easy to install. The beveling design can better adapt to the structural design of various electronic devices, making the assembly of PCB boards and other components more convenient and precise, and the design of the beveling angle can better achieve the coordination of PCB boards with other components‌.

In addition, the beveling process can also improve electrical performance. Bevel design can increase the contact area and reduce the contact resistance, thereby improving the stability and reliability of signal transmission.

Finally, bevel design can reduce mechanical stress. The design of the beveled rectangle allows the socket to slowly and gradually enter or exit the jack when plugging and unplugging, thereby reducing the mechanical stress during plugging and unplugging and extending the service life of the socket and jack.

What are the limitations of PCB edge beveling?

The main limitations of PCB edge beveling include the design of the bevel angle, the spacing requirements between the components and the board edge, and the requirements for cutting accuracy and speed. ‌

First, the design of the bevel angle needs to be determined according to the specific application scenario and equipment requirements. The common bevel angle range is between 15° and 45°.

In some devices with high requirements for plugging and unplugging force and contact stability, a smaller bevel angle may be selected to increase the contact area and friction between the gold finger and the socket to ensure the stability of signal transmission; while in some occasions with strict restrictions on spatial layout, a larger bevel angle may be used to better realize the assembly of PCB boards and other components. ‌

Finally, cutting accuracy and speed are also important limiting factors. PCB beveling machines need to have high-precision cutting capabilities and be able to accurately cut within the specified size range. The cutting accuracy directly affects the quality and reliability of the circuit board.

How Does PCB Beveling Work?

PCB beveling machines are usually composed of a frame, a transmission system, a grinding system, a positioning fixture, and a protective device.

The transmission system uses high-precision gears or screw drives to ensure processing accuracy. The grinding system consists of a grinding head and a coolant system, etc., which are used to grind PCB boards. The positioning fixture is used to fix the PCB board to ensure the accuracy and stability of the processing, while the protective device is to protect the safety of the operator.

During the operation, first check whether the beveling machine is operating normally. If there is a problem, it needs to be repaired. Then, set the beveling angle according to customer needs or the default 45° angle.

Next, adjust the angle of the gong section and the table, adjust the distance of the steel plate according to the thickness of the board, and use a copper plate of the same thickness to test the knife to ensure that the angle of the bevel of the beveled board meets the requirements.

Finally, the grinding process is carried out through the grinding system. The grinding head rotates at a high speed and applies a certain amount of pressure on the PCB board, thereby processing its edge into a bevel.

What are the Applications of PCB Beveling?

The core application of the PCB beveling process is to increase the contact area and reduce the contact resistance, thereby improving the stability and efficiency of the connection. This process is common in the beveling of gold fingers, especially on devices such as computer memory bars and graphics cards. The bevel design of gold fingers can significantly improve the data transmission speed and reliability.

‌Specific application scenarios‌ include:

‌Computer memory bars and graphics cards‌: On these components, the bevel design of gold fingers can not only increase the contact area and reduce the contact resistance, but also prevent oxidation to a certain extent and extend the service life.

‌Other communication equipment‌: In addition to computer memory bars and graphics cards, the beveling process of gold fingers is also used in various devices that communicate through digital signals, such as consumer electronics, smartphones, and smart watches.

In short, the beveler in PCB is a tool specifically used to create bevels or chamfers around the edges or holes of PCBs. It has the functions of improving the reliability of PCB, facilitating assembly and improving appearance. When using the bevel, pay attention to the correct operation method and maintenance to ensure its normal operation and service life.

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What is the melting point of PCB solder?

星期一, 7 10 月, 2024

PCB solder plays a vital role in the assembly and function of PCBs. Reliable solder joints must remain intact to prevent components from loosening or falling off the PCB. Solder is the material used to connect the various electronic components on the PCB. Its importance is reflected in several key aspects. Solder ensures that electronic components can be firmly attached to the PCB.

What type of solder for PCB?

The commonly used types of solder for PCB include solder paste, tin bar and tin wire. ‌

1. ‌Solder paste‌: Mainly used in reflow soldering process. Solder paste consists of tin powder, flux and other additives. Tin powder is usually an alloy of tin and other metals. According to different melting points, solder paste can be divided into three types: low temperature, medium temperature and high temperature; according to different lead content, it can be divided into lead solder paste and lead-free solder paste. Lead-free solder paste gradually replaces lead solder paste to reduce environmental pollution‌.

What is the melting point of PCB solder?

2. ‌Solder bar‌: Mainly used in wave soldering process. Tin bar (solder bar) has excellent antioxidant ability, good fluidity after melting, suitable for wave soldering process, and is widely used in PCBA processing due to its good fluidity and strong solderability.

3. Tin wire: Mainly used in post-soldering process. Similar to tin bar, tin wire is also a kind of welding material, mainly used for manual welding or other occasions where filament solder is required.

In addition, the selection of welding materials also involves the selection of solder alloys. Eutectic alloys are one of the preferred solder alloys because of their low melting point, low welding temperature, small crystal grains, and dense structure, which are conducive to improving the strength of solder joints.

What temperature should solder be for PCB?

The solder temperature of PCB should vary according to different types of components and welding processes. ‌‌

For lead-containing PCB boards, the temperature in the preheating stage is usually controlled at 80~120℃ for 1~3 minutes; the temperature in the insulation stage is 150~180℃ for 30~60 seconds; the temperature in the reflow stage is 210~240℃ for 20~40 seconds; the cooling stage speed should be controlled within the range of 4~6℃ per second. ‌

For lead-free PCB boards, the temperature in the preheating stage is usually controlled at 100~150℃, the insulation stage is 180~220℃, the reflow stage is 240~260℃, and the cooling speed should be controlled within the range of 3~5℃ per second. ‌

What is the best soldering temperature for PCB? ‌

The best soldering temperature range for PCB is usually between 240 and 280 degrees Celsius. This temperature range is suitable for manual soldering and can ensure the best soldering effect and component reliability. ‌

For different types of welding situations, the temperature requirements are different:

1. Wave soldering: The optimal temperature is 280 degrees Celsius, ensuring that the solder joint temperature is 50 degrees Celsius higher than the melting point of the solder to achieve reliable welding results.

2. Small components (such as resistors and capacitors below 1206, and components with an area of less than 5 mm²): The recommended temperature is 250 degrees Celsius to prevent damage to the circuit board.

3. Large components: The soldering iron temperature should be set between 350 and 370 degrees Celsius, and the maximum should not exceed 390 degrees Celsius. The welding time should be kept within a few seconds to prevent damage to the pads on the PCB.

4. SMT processing: The recommended manual soldering temperature range is 240 to 280 degrees Celsius. Try to minimize the gap between the set temperature and the actual working temperature to achieve the best welding effect and component reliability.

In addition, the precise management of temperature during the welding process is also required to ensure the quality of the solder joints and circuit performance of the PCB board.

The preheating stage is very important to reduce the thermal shock during welding. The preheating temperature is usually controlled between 80 and 120 degrees Celsius for 1 to 3 minutes.

The insulation stage is to fully melt the components and solder paste on the PCB board. The temperature is usually controlled between 150 and 180 degrees Celsius for 30 to 60 seconds.

The cooling stage is to avoid thermal stress caused by rapid cooling. The cooling rate should be controlled to drop between 4 and 6 degrees Celsius per second.

What temperature does PCB solder melt?

The melting temperature of PCB solder depends on the type of solder. The melting temperature of lead solder ranges from 183°C to 217°C, while the melting temperature of lead-free solder is usually between 217°C and 257°C.

Lead solder has a lower melting point, usually between 183°C and 217°C. During the reflow process, the preheating temperature of lead solder is controlled at 80°C to 120°C, the holding temperature is 150°C to 180°C, the reflow temperature is 210°C to 240°C, and the cooling rate decreases by 4°C to 6°C per second.

The melting point of lead-free solder is higher, usually between 217°C and 257°C. During the reflow process, the preheating temperature of lead-free solder is controlled at 100°C to 150°C, the holding temperature is 180°C to 220°C, the reflow temperature is 240°C to 260°C, and the cooling rate decreases by 3°C to 5°C per second.

What is the melting point of PCB material?

The melting point of PCB material depends on its specific composition and type, usually between 1064℃ and 900℃. For PCB substrate materials, such as FR-4, its temperature resistance is measured by the Tg value (glass transition temperature). Ordinary FR-4 sheets have lower heat resistance, while high TG FR-4 sheets have better heat resistance and can withstand higher temperatures.

Different types of PCB materials have different melting points and heat resistance. The long-term working temperature of ordinary FR-4 sheets is generally between 130℃ and 140℃, and the instantaneous temperature resistance can reach 150℃ to 260℃. In contrast, PCBs made of special materials such as polyimide can withstand higher temperatures, even up to 280℃.

In addition, the surface treatment layer material of the PCB will also affect its heat resistance. For example, the melting point of the gold plating layer depends on the composition of the metal material used.

Which solder is best for PCB?

Choosing a solder suitable for PCB requires comprehensive consideration of multiple factors. The following solders have their own advantages and disadvantages:

Tin-silver-copper (SAC) alloy: good mechanical and electrical properties, high reliability, suitable for a variety of welding processes, and environmentally friendly. But the cost is high and the welding process requirements are high.

Tin-copper (Sn-Cu) alloy: low cost, good solderability, and environmentally friendly. The disadvantage is that the mechanical properties are slightly worse in high-demand scenarios.

What type of solder should not be used with electronics?

Electronic products should not use strong alkali, rosin grease, coconut oil, and neutral flux as flux. ‌

In the soldering process of electronic products, it is very important to choose a suitable flux. The main function of the flux is to remove the oxide film, prevent oxidation, and improve the quality of soldering.

However, some substances are not suitable for use as flux. Strong alkali and rosin grease will corrode the soldering joint and affect the quality of soldering. In addition, the use of acidic flux will also corrode the soldering joint, so acidic flux should be avoided.

In order to ensure the smooth progress of the soldering process and ensure the quality of soldering, some measures can be taken.

First, choose lead-free solder materials that meet ROHS standards to reduce environmental pollution. Second, use high-brightness soldering iron tips, reduce the use of soldering oil and rosin, and reduce smoke generation. Finally, select appropriate welding materials and processes according to specific needs, such as solder wire, solder paste, solder sheet, etc., to ensure the mechanical and electrical performance of welding.

In short, solder is a key element in the PCB assembly process. Its quality is directly related to whether the electronic equipment can operate normally, and the characteristic of solder melting point plays a decisive role in the welding process. I must deeply study and understand the characteristics of solder to ensure that every solder joint can meet the highest standards.

Tags:PCB, PCBA, Solder, solder melting point
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Can you use AC in PCB?

星期一, 7 10 月, 2024

Can you use AC in PCB?AC can be used in PCB boards. PCB boards are designed to support the use of AC, and the functions of AC can be realized through proper circuit design and component selection.

Can you use AC in PCB?

The use of AC in PCB boards requires consideration of the characteristics of AC. The current magnitude and direction of AC change continuously over time, which requires the components and layout on the PCB to adapt to such changes. For example, components such as inductors and capacitors play an important role in AC circuits, and their parameters and layout need to be carefully designed to achieve the desired circuit performance.

Specifically, AC circuit design on PCB boards includes selecting appropriate components, layout, and routing. For example, using test instruments such as LCR digital bridges can measure the parameters of components in AC circuits to ensure that the performance of the circuit meets the design requirements. In addition, reasonable ground routing and layout can reduce signal interference and ensure the stable transmission of AC.

Is the circuit board DC or AC?

Circuit boards can transmit both direct current and alternating current. In modern electronic products, we use alternating current for power supply, so most circuit boards are also designed to transmit alternating current. Of course, in some special application scenarios, some circuit boards also need to transmit direct current. Whether transmitting direct current or alternating current, the circuit board needs to meet the requirements of the transmitted current.

What is the PCB in AC?

The alternating current in PCB refers to the current whose direction changes periodically, that is, alternating current (AC). The application of alternating current in PCB is mainly reflected in power conversion and power transmission. PCB power supply usually converts AC into stable direct current (DC) output to meet the demand of electronic equipment for stable power supply. PCB power supply converts AC into the required DC through components such as transformers, rectifiers, filters and voltage regulators, and provides stable power output.

How to calculate the bandwidth of AC in PCB traces

The calculation of AC PCB trace width can be performed by the following formula: W = (I / J) * K, where W represents the trace width, I represents the current, J represents the current density, and K represents a coefficient related to materials and processes. ‌This formula shows that the trace width is related to the current, current density, and material properties‌.

AC in PCB Design Guide

Current Carrying Capacity: The width of a trace directly affects its ability to handle current without exceeding temperature limits or causing excessive voltage drop.
‌Impedance Control: In high-frequency applications, maintaining controlled impedance is critical for signal integrity. Trace width, trace spacing, and dielectric properties affect the characteristic impedance of the transmission line.
‌Heat Dissipation: Adequate trace width helps to effectively dissipate heat, preventing thermal issues such as trace delamination or solder joint failure.
‌Voltage Drop: Narrower traces exhibit higher resistance, resulting in increased voltage drop along the length of the trace. By adjusting the trace width, the voltage drop can be minimized.
‌Manufacturability: The PCB manufacturing process imposes restrictions on the minimum trace width, and designers must balance performance requirements with manufacturability constraints. ‌2.
‌Minimum Trace Width: Most manufacturers have a minimum trace width of 6mil or 0.152mm, and typically use traces of 0.254-0.3mm.
‌Material and Process Deviations: Due to the possibility of material and process deviations in the actual PCB manufacturing process, a certain margin needs to be left when calculating the line width.
‌Signal Integrity Simulation‌: Perform signal integrity simulations to ensure impedance is controlled and signal degradation due to reflections, crosstalk, or transmission line effects is minimized‌

AC in PCB wiring

The current trend is that the power supply voltage is getting lower and lower (especially for highly integrated digital devices), the space occupied is getting smaller and smaller, the weight is getting lighter and lighter, and the efficiency is getting higher and higher, which requires the precise design of the power supply circuit starting from the PCB.

Safety distance includes electrical clearance (spatial distance), creepage distance (surface distance) and insulation penetration distance…

Electrical clearance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the air.
Creepage distance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the insulation surface.

Determination of electrical clearance:

The distance can be determined according to the measured working voltage and insulation level

The electrical clearance size requirements of the primary side line are shown in Table 3 and Table 4

The electrical clearance size requirements of the secondary side line are shown in Table 5

But usually: Primary side AC part: L-N ≥ 2.5mm before the fuse, L.N PE (earth) ≥ 2.5mm, no requirements are made after the fuse is installed, but a certain distance should be maintained as much as possible to avoid short circuit damage to the power supply.

Primary side AC to DC part ≥2.0mm

Primary side DC ground to earth ≥2.5mm (primary side floating ground to earth)

Primary side to secondary side ≥4.0mm, components connected between primary and secondary sides

Secondary side gap ≥0.5mm

Secondary side ground to earth ≥1.0mm

Note: Before determining whether it meets the requirements, the internal parts should be applied with a force of 10N and the outer shell with a force of 30N to reduce the distance so that the space distance still meets the requirements under the worst case.

Determination of creepage distance:

Based on the working voltage and insulation level, the creepage distance can be determined by looking up Table 6

But usually: (1), primary side AC part: L-N ≥2.5mm before the fuse, L.N earth ≥2.5mm, no requirement is required after the fuse, but try to keep a certain distance to avoid short circuit damage to the power supply.

(2) Primary side AC to DC part ≥2.0mm

(3) Primary side DC ground to ground ≥4.0mm such as primary side ground to earth

(4) Primary side to secondary side ≥6.4mm, such as optocoupler, Y capacitor and other components, the foot spacing ≤6.4mm needs to be slotted.

(5) Secondary side parts ≥0.5mm

(6) Secondary side ground to earth ≥2.0mm or more

(7) Transformer two-stage ≥8.0mm or more

Insulation penetration distance:

It should meet the following requirements according to the working voltage and insulation application:

For working voltage not exceeding 50V (71V AC peak or DC value), there is no thickness requirement;
The minimum thickness of additional insulation should be 0.4mm;
When the reinforced insulation is not subjected to any mechanical stress that may cause deformation or performance degradation of the insulating material at normal temperature, the minimum thickness of the reinforced insulation should be 0.4mm. If the insulation provided is used in the protective casing of the equipment and will not be bumped or scratched during maintenance by the operator, and any of the following conditions apply, the above requirements do not apply to thin insulating materials regardless of their thickness;
For additional insulation, at least two layers of material are used, each of which can pass the dielectric strength test for additional insulation; or:
For additional insulation composed of three layers of material, any combination of two layers of material can pass the dielectric strength test for additional insulation; or:
For reinforced insulation, at least two layers of material are used, each of which can pass the dielectric strength test for reinforced insulation; or:
For reinforced insulation composed of three layers of insulating material, any combination of two layers of material can pass the dielectric strength test for reinforced insulation.

Points to note about wiring process:

Flat components such as capacitors must be flat without glue.

If the distance between two conductors can be shortened by applying a force of 10N, which is less than the safety distance requirement, glue can be used to fix the part to ensure its electrical clearance.

When laying PVC film inside some shell equipment, attention should be paid to ensuring the safety distance (pay attention to the processing technology).

When fixing the parts with glue, be careful not to leave foreign matter such as glue wire on the PCB board.

When processing parts, insulation damage should not be caused.

Requirements for flame-proof materials:

Heat shrink tubing V-1 or VTM-2 or above; PVC tubing V-1 or VTM-2 or above

Teflon tubing V-1 or VTM-2 or above; plastic materials such as silicone sheets, insulating tape V-1 or VTM-2 or above

PCB board 94V-1 or above

Regarding insulation level

(1) Working insulation: insulation required for normal operation of equipment

(2) Basic insulation: insulation that provides basic protection against electric shock

(3) Supplementary insulation: independent insulation applied in addition to basic insulation to protect against electric shock in case of basic insulation failure

(4) Double insulation: insulation consisting of basic insulation plus supplementary insulation

(5) Reinforced insulation: a single insulation structure that provides the same level of protection against electric shock as double insulation under the conditions specified in this standard

The applicable situations of various insulation are as follows:

A. Operational insulation

a. Between parts with different voltages

b. Between ELV circuits (or SELV circuits) and grounded conductive parts.

B. Basic insulation

a. Between parts with dangerous voltages and grounded conductive parts;

b. Between SELV circuits with dangerous voltages and grounding-dependent;

c. Between the primary power conductor and the grounded shield or the core of the main power transformer;

d. As part of double insulation.

C. Supplementary insulation.

a. Generally speaking, between accessible conductive parts and parts that may carry dangerous voltages after basic insulation is damaged, such as:

Ⅰ. Between the surface of handles, knobs, handles or similar objects and their ungrounded axis.

Ⅱ. Between the metal casing of the second category equipment and the outer skin of the power cord passing through this casing.

Ⅲ. Between the ELV circuit and the ungrounded metal casing.

b. As part of double insulation

D. Double insulation

Double insulation Reinforced insulation

Generally speaking, between the primary circuit and

a. between accessible ungrounded conductive parts, or

b. between floating SELV circuits, or

c. between TNV circuits

Double insulation = basic insulation + supplementary insulation

Note: ELV circuit: extra low voltage circuit

Under normal working conditions, the AC peak value between conductors or between any conductors does not exceed 42.4V or the DC value does not exceed 60V.

SELV circuit: safety extra low voltage circuit.

A properly designed and protected secondary circuit so that under normal conditions or single fault conditions, the voltage between any two accessible parts, and between any accessible parts and the protective grounding terminal of the equipment (only for Class I equipment) will not exceed the safety value.

TNV: communication network voltage circuit

Under normal working conditions, the circuit carrying communication signals

Difference between direct current and alternating current

‌The main differences between DC and AC include direction and polarity, voltage change, current loss, transformer use, and application scenarios.

‌Direction and polarity:

DC: The direction of the current remains unchanged, and the electrons flow from the positive electrode to the negative electrode.

AC: The direction of the current changes periodically, and the electrons flow back and forth between the positive and negative electrodes. ‌
‌Voltage change:

DC: The voltage remains constant and does not change over time.

AC: The voltage magnitude and direction change periodically over time. For example, the mains is an AC with a sine waveform.

‌Current loss:

DC: Fault losses are relatively small.

AC: There is capacitive current, and there is capacitive current in the transmission line. ‌
‌Transformer use:

DC: The voltage cannot be changed using a transformer.

AC: The voltage can be changed using a transformer, which is suitable for boosting voltage to reduce losses during long-distance transportation.

‌Application scenarios:

DC: Suitable for low-voltage electrical appliances and occasions that require stable current.
‌Alternating current‌: Suitable for household and industrial use, using transformers to change voltage to suit different needs.‌

FAQ About AC in PCB

FAQ About AC in PCB

Q: The relationship between PCB current and line width. Is the current divided into AC or DC?
A: The relationship between PCB current and line width is not divided into AC or DC. In terms of the nature of the lines on the PCB, the lines are all made of copper materials, and both AC and DC can pass. However, how much current can pass depends on the cross-sectional area of the line on your PCB. That is, line width x thickness of the copper foil of the line. If the cross-sectional area of the line is small, only small current signals can pass, and if the cross-sectional area is large, large current signals can pass. This signal can be AC or DC.
Not just 1mm, any line width can pass DC or AC signals.

Q: There is a packaged device, and there are 2 pins in the device that need to be connected to the live wire and neutral wire of 220V AC respectively. So how to deal with this power line when drawing the PCB? Are there any size requirements for pads, wires, etc.? Are there any protective measures required? Is it not possible to directly add pads to connect to the pin pads of the device?
A: It is best to mill a groove between the neutral wire and the live wire, and choose the thickness of the wire according to the current. When the current is large, you can put a tin layer on the wire, and the pad should be slightly larger.

Q: The grounding of the PCB circuit board design is also the negative pole. What is the difference between the grounding here and the AC grounding?

A: The concept of the circuit board ground is somewhat different from that of the power supply system. The power supply system refers to the earth, that is, the terminal with the same potential as the earth.

The ground in the circuit board is just a common terminal of a potential, which can be positive or negative, depending on the needs of the designer. It’s just that everyone is used to and assumes that the negative pole is the common terminal, that is, the ground. The circuit board ground is not necessarily connected to the earth.

But it must be connected to the earth when EMI filtering is required.

Q: Should all GNDs on the PCB board be connected? There is a terminal (screw type) with two terminals marked as V1+ and V1- on the PCB schematic. Should V1- be connected to the power supply ground? But I used a multimeter to measure why V3- is not connected to other GNDs on the board?

So how do you connect the ground and 10V of the power supply to the V1+ and V1- ends of the terminal?

A: Not all ground wires on the board are connected together. The ground wires are divided into analog ground and digital ground, just like the ground wire in DC and the ground wire in AC cannot be connected together. That is to say, there is a ground wire that is specifically used for power supply, and there is a ground wire that is specifically used for signals (shielding signal interference). These two ground wires cannot be connected together.
In addition, you mentioned V1+ and V1-, and V1- should not be considered a ground wire. Generally, the signal represented by this method is a differential signal, that is, the V1 signal is differentially divided into V1+ and V1-, which can reduce external interference and transmit farther. Finally, V1+ and V1- are integrated into the V1 signal.
You need to figure out whether the V1+ and V1- of the terminal are used for power supply. If they are used for power supply, then V1+ is the positive pole. V1- is the negative pole. Since you didn’t show us the picture, you can’t just connect it randomly. The circuit board needs to connect not only power but also signals, depending on how your board is made.

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