High Frequency PCB Design Guidelines – RF PCB Basic Acknowledge

August 20th, 2025

Are you often curious about these questions about high frequency PCB?

Have you ever wondered why some electronic systems lose performance at higher frequencies?
Why a well-designed PCB for low-speed circuits often fails when pushed into GHz ranges?
How can designers minimize losses above 1 GHz?

The answer lies in the design of high frequency PCBs. High frequency PCBs also known as RF PCB or radio frequency pcb. They are more important in applications such as 5G, automotive radar, aerospace communication, medical imaging, and satellite systems. These boards must handle signals above 100 MHz and, in many cases, well into the GHz range. At such speeds, signal losses, impedance mismatches, and electromagnetic interference (EMI) can cause severe degradation.

This blog provides detailed guidelines for designing high frequency PCBs. From material selection to signal routing, impedance control, thermal management, and testing, we will walk through the critical factors engineers must consider.

What Frequency Range is Considered High Frequency in PCB Design?

In PCB engineering, high frequency generally refers to signal frequencies above 500 MHz. For RF and microwave circuits, the range extends from 1 GHz up to 100 GHz. Typical applications include:

Wi-Fi (2.4 GHz / 5 GHz)
Bluetooth (2.4 GHz)
5G NR bands (3.5 GHz / 28 GHz / 39 GHz)
Automotive radar (24 GHz / 77 GHz)
Satellite communication (Ku-band 12–18 GHz, Ka-band 26–40 GHz)

The higher the frequency, the more sensitive the PCB becomes to signal loss, dielectric constant stability, and copper surface roughness. For instance, at 28 GHz (5G mmWave), even 0.1 dB/cm of insertion loss can cause serious degradation in system performance.

High Frequency PCB Design Guidelines - RF PCB Basic Acknowledge

What PCB Materials are used for High Frequency Applications?

The dielectric substrate is the foundation of high frequency PCB design. Key material properties include:

Dielectric Constant (Dk): Should remain stable across frequency and temperature.
Dissipation Factor (Df): Lower values mean lower signal loss.
Thermal Conductivity: Crucial for high-power RF designs.

Common Materials for High Frequency PCBs

Material Type	Dielectric Constant (Dk)	Dissipation Factor (Df) @10GHz	Thermal Conductivity (W/m·K)	Typical Use Case
FR4 (High Tg)	4.2–4.7	0.020–0.025	0.3	<1 GHz, low-cost boards
Rogers RO4350B	3.48 ±0.05	0.0037	0.69	2–20 GHz, antennas
Rogers RO3003	3.00 ±0.04	0.0013	0.50	mmWave 5G (28 GHz, 39 GHz)
Taconic RF-35	3.50	0.0018	0.62	Microwave circuits
PTFE (Teflon)	2.1–2.6	0.0009–0.0015	0.25–0.30	Aerospace, radar
Ceramic-filled PTFE	3.0–10	0.001–0.005	0.7–1.2	High-power RF

Data comparison shows that Rogers RO3003 has one of the lowest Df values, making it widely used in 5G mmWave base stations. PTFE-based laminates dominate satellite and radar applications where extreme performance is required.

How Does Dielectric Constant Affect Signal Speed?

The dielectric constant (Dk) directly influences the propagation velocity of signals on PCB traces. The relation is:

Where c = 3 × 10^8 m/s (speed of light in vacuum).

For FR4 (Dk ≈ 4.5) → v ≈ 1.41 × 10^8 m/s
For Rogers RO4350B (Dk ≈ 3.48) → v ≈ 1.61 × 10^8 m/s
For PTFE (Dk ≈ 2.2) → v ≈ 2.02 × 10^8 m/s

This means PTFE substrates allow signals to travel ~43% faster than FR4. In high-speed digital systems (like SerDes 56G PAM4 links), such differences greatly influence timing margins.

What are the Key Design Rules for High Frequency PCB Layout?

Designing high frequency boards requires stricter rules compared to conventional PCBs:

1. Controlled Impedance Traces

Single-ended 50 Ω, differential 90–100 Ω are typical.
Impedance tolerance must be within ±5% for frequencies above 10 GHz.

2. Insertion Loss Minimization

Use smooth copper foils (Ra < 2 μm).
Keep transmission lines short.
Avoid unnecessary vias, which can introduce 0.1–0.2 dB loss per via at 10 GHz.

3. Ground Plane Integrity

Solid reference planes reduce return path discontinuities.
Use via fences to confine RF energy.

4. Crosstalk Reduction

Maintain spacing ≥3× trace width between high frequency lines.
Place sensitive analog circuits far from digital noise sources.

5. Thermal Management

For power amplifiers, substrates with >0.8 W/m·K thermal conductivity are recommended.
Use thermal vias under RF components for efficient heat dissipation.

What are the Key Design Rules for High Frequency PCB Layout?

How Thick should a High Frequency PCB be?

The thickness of the PCB substrate directly impacts impedance and signal integrity. Typical stack-up configurations:

PCB Thickness	Layer Count	Dielectric Thickness	Frequency Application
0.2–0.4 mm	2–4L	0.1 mm core	High-speed connectors, 10–20 GHz
0.6–0.8 mm	4–6L	0.2 mm core	2.4/5 GHz Wi-Fi, Bluetooth
1.0–1.6 mm	6–10L	0.3–0.5 mm core	Automotive radar, 24 GHz
2.0+ mm	8–12L	>0.5 mm core	28 GHz 5G, satellite boards

For example, in 77 GHz automotive radar PCBs, manufacturers often use 0.254 mm or thinner substrates to reduce dielectric loss and keep microstrip lines narrow enough for impedance control.

How to Reduce Signal Loss in High Frequency PCB Design?

Signal loss (attenuation) is one of the biggest concerns in high frequency circuits. It is affected by:

Dielectric Loss: Higher Df increases insertion loss.
Conductor Loss: Surface roughness increases resistance at high frequencies due to skin effect.
Radiation Loss: Poor layout or sharp bends radiate energy.

Example of Insertion Loss Data

Material	Frequency	Line Length	Insertion Loss
FR4 (Df 0.020)	10 GHz	10 cm	-1.2 dB
Rogers RO4350B	10 GHz	10 cm	-0.25 dB
PTFE (Df 0.001)	10 GHz	10 cm	-0.05 dB

This demonstrates why high frequency applications almost never rely on standard FR4.

In Conclusion

Designing a high frequency PCB requires more than standard PCB know-how. From material selection to impedance control, routing, thermal management, and advanced testing, every step must be carefully engineered.

Best Technology is a trusted PCB manufacturer in China with expertise in high frequency PCB fabrication. We offer advanced laminates like Rogers, Taconic, and Isola, alongside ISO9001, ISO13485, IATF16949, and AS9100D certifications. Our team applies rigorous quality control, competitive pricing, professional engineering support, and MES-based traceability to deliver reliable high frequency PCBs for industries such as 5G, automotive radar, medical devices, and aerospace.

If your project requires precise high frequency PCB solutions, Best Technology is ready to provide professional guidance and manufacturing excellence.

FAQs

1. Can FR4 be used for high frequency PCBs?

Yes, but only for frequencies below ~1 GHz. For anything higher, specialized laminates are required.

2. What is the most commonly used material for 5G PCBs?

Rogers RO4350B and RO3003 are widely adopted due to their low loss at mmWave bands.

3. How do vias affect high frequency performance?

Each via can add 0.1–0.2 dB loss at 10 GHz, so designers minimize via count in RF paths.

4. Why is surface roughness important?

At high frequencies, the skin effect confines current to the outer conductor surface. Rough copper increases resistance and loss.

Tags: high frequency pcb, high frequency pcb design guide, radio frequency pcb, RF PCB
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What is an LED lighting aluminum substrate?

August 20th, 2025

LED lighting aluminum substrate is a circuit board with aluminum as the base, on which the LED chip is directly soldered, which is both conductive and acts as a heat sink. Aluminum’s high thermal conductivity instantly dissipates heat, preventing LED overheating and light decay, allowing high-power LEDs to maintain a long lifespan and continuous high brightness.

What is an LED lighting aluminum substrate?

Are you curious about BEST Technology’s aluminum substrates for LED lighting?

Does the thermal conductivity meet the cooling requirements?

Do the dimensions match the fixture’s installation requirements?

Can the material and craftsmanship withstand high temperatures?

Is the performance and cost-performance ratio reasonable?

Does BEST Technology offer customization and after-sales service?

BEST Technology’s aluminum substrates for LED lighting can answer these questions.

Compatible. The aluminum base and ceramic-filled insulation layer design offers far superior thermal conductivity compared to traditional substrates, rapidly dissipating heat from the LED and ensuring stable operation.

Compatible. Standard sizes and full customization (non-standard shapes and thicknesses) are available. Small batches and samples can be delivered quickly, and the product is compatible with diverse lamp structures.

Performance. The insulation layer has undergone high and low temperature cycling tests to ensure no delamination, and its long-term operating temperature reaches 150°C. The thermal expansion coefficient is optimized for the LED chip, providing strong resistance to thermal stress.

Reasonable. The zoned heat dissipation design saves costs, improves thermal conductivity by hundreds of times, and is priced lower than international brands, balancing longevity and affordability.

Support. Full customization is provided (design, materials, and craftsmanship). After-sales service includes a 48-hour response time, free repairs during the warranty period, and 24-hour delivery for expedited orders.

What is the substrate of LED lights?

In simple terms, the substrate is the base material that supports the LED chip. It provides structure, stability, and heat management. Think of it as the “backbone” of the LED light.

LED chips generate light when electricity passes through them. But they also produce heat at the same time. If the heat isn’t managed, it can shorten the life of the LED and lower its performance. That’s where the substrate plays a critical role.

Among many options, aluminum substrates stand out as the preferred choice for LED lighting. They are designed not only to hold the LED components but also to transfer heat away quickly, ensuring the light stays cool and lasts longer.

Why use aluminum substrates for LED lighting?

LEDs are sensitive to high temperatures. Excessive heat can cause them to fade, fail early, or lose brightness. Aluminum substrates prevent this problem.

Aluminum is an excellent conductor of heat. When used as a substrate, it helps channel heat away from the LED chip to the surroundings. This ensures consistent performance and protects the LEDs from damage.

Besides thermal benefits, aluminum substrates also offer strong mechanical support. They are lightweight yet durable, making them perfect for modern LED designs. Whether used in a slim LED panel or a high-power street light, aluminum substrates ensure efficiency and reliability.

What materials are LED lights made of?

LED lights are more than just chips and covers. Several layers and materials come together to create the final product:

LED chip: The tiny semiconductor that produces light.

Substrate: The base material, often aluminum, that supports and cools the chip.

Circuit layer: Usually made of copper, it carries the electrical signals.

Dielectric layer: Provides insulation while allowing heat to pass through.

Lens or cover: Shapes the light and protects the chip.

Among these, the LED lighting aluminum substrate is one of the most critical parts. It combines electrical insulation with thermal conduction, two qualities rarely found together.

Can LED lights go on metal?

Yes, LEDs can be mounted on metal, and aluminum is the most common choice. In fact, many LED assemblies are designed specifically for metal bases.

When LEDs are mounted on aluminum, they gain improved heat dissipation. This is essential for applications like automotive lighting, industrial lamps, and high-brightness panels where heat is a big concern.

Unlike bulky cooling systems, aluminum substrates provide natural thermal management.

How does LED aluminum improve heat dissipation?

Heat dissipation is the most important function of aluminum substrates. Without it, LEDs would overheat and fail quickly.

Aluminum has high thermal conductivity. It pulls heat away from the LED chip and spreads it across the substrate. From there, the heat is released into the air.

Compared to traditional substrates, aluminum is far superior in thermal management. For example, FR4 (a common PCB material) cannot handle high heat as well.

In short, LED aluminum substrates work as natural heat spreaders. They extend the lifespan of LEDs, maintain brightness, and allow lights to perform at their best even in challenging conditions.

Why are aluminum substrates better than FR4 for LEDs?

FR4 is a widely used PCB material made of glass fiber and epoxy resin. While it works for many electronic devices, it struggles when used in LED lighting.

Here’s why aluminum substrates are superior:

Better heat conduction: Aluminum conducts heat up to 10 times faster than FR4.

Higher durability: Aluminum substrates can handle higher temperatures without damage.

Stronger support: They provide a stable base for high-power LED chips.

Longer lifespan: LEDs last longer when mounted on aluminum compared to FR4.

Because of these advantages, aluminum substrates are the first choice for most LED lighting products. FR4 may still be used in low-power LED designs, but for serious performance, aluminum is the winner.

What makes LED aluminum durable and reliable?

Reliability is everything in lighting. Aluminum is naturally strong and resistant to cracking. It also handles environmental stress well, such as vibration, impact, and moisture. This makes it ideal for outdoor and industrial LED applications.

The dielectric layer used in aluminum substrates also ensures electrical insulation. It prevents short circuits while allowing heat transfer.

In addition, LED lighting aluminum substrates resist thermal aging. They maintain their properties over time, even under constant heat. This means consistent performance, longer lifespans, and fewer replacements.

Where are LED lighting aluminum substrates applied?

The use of aluminum substrates in LED lighting is nearly endless. From household lights to industrial equipment, they are everywhere. Some common applications include:

Street lights: High-power LEDs need aluminum substrates to stay cool.

Automotive lighting: Headlights, brake lights, and interior lights benefit from aluminum’s durability.

Consumer electronics: Backlighting in TVs, displays, and smartphones.

Industrial lamps: Used in warehouses and factories where reliability is key.

Medical devices: Precision lights where stable output is essential.

Architectural lighting: Decorative LEDs that need consistent brightness.

Wherever LEDs are used, aluminum substrates play a key role in making them efficient and reliable.

Why are LED lighting aluminum extrusions important?

In addition to substrates, LED lighting aluminum extrusions are often used for housing and thermal management. These extrusions are aluminum profiles designed to protect LEDs and spread heat.

When combined with aluminum substrates, extrusions create a complete thermal solution. They not only manage heat but also improve the appearance and durability of LED products.

Conclusion:

The LED lighting aluminum substrate is the foundation of reliable LED technology. It supports the chip, improves thermal management, and ensures durability. Compared to FR4, aluminum is far superior in heat conduction and reliability. That’s why it’s the top choice for everything from street lights to smartphones.

In short, aluminum substrates make LEDs brighter, cooler, and longer-lasting. If you are looking for high-quality LED lighting aluminum substrates, reach out to us at sales@bestpcbs.com

Tags: aluminum substrates, LED lighting aluminum substrate, led substrates
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Copper Pour PCB, Copper Pour in PCB

August 20th, 2025

What is copper pour PCB? Let’s discover its function, application, clearance design rules, grounding and connection problems and solutions, dead zones and sharp problems and solutions.

Are you worried about these problems?

Why does my high-speed PCB always have signal integrity issues?
How can I reduce thermal hotspots in dense component layouts?
What’s the most cost-effective way to improve EMI performance?

Best Technology can provide service and solutions:

Optimized copper pour design: Reduces impedance discontinuities and crosstalk by providing uniform current paths.)
Thermal-balanced copper pour: Dissipates heat evenly through enhanced thermal conductivity.)
EMI-shielded copper pour: Acts as a natural Faraday cage to minimize radiated emissions.)

Welcome to contact us if you have any request for copper pour PCB: sales@bestpcbs.com.

What is Copper Pour PCB?

Copper pour PCB (also called as copper pour in PCB) design refers to the technique of filling unused areas on a circuit board with conductive copper, typically connected to ground or power networks. It involves filling blank areas of a circuit board (not layout traces) with a continuous layer of copper foil using polygonal fills automatically generated by the design software. These copper foil areas are typically connected to the board’s ground plane (GND) or power plane (VCC), forming a complete conductive layer.

What is the Purpose of the Copper Pour on a PCB?

Signal Integrity: Provides low-impedance return paths for high-frequency signals, reducing electromagnetic loss.
EMI/RFI Shielding: Acts as conductive shielding to suppress external/internal electromagnetic interference.
Thermal Dissipation: Enhances heat transfer from high-power components via copper’s thermal conductivity.
Power Stability: Stabilizes voltage delivery through low-inductance copper planes for high-current circuits.
Structural Integrity: Balances copper distribution to prevent board warpage during fabrication.
Cost Efficiency: Reduces production costs by minimizing copper etching waste and simplifying processes.
Impedance Matching: Enables precise impedance control for high-speed signals via ground plane integration.

What Are Applications of Copper Pour PCB?

Lighting Systems: LED streetlights, automotive lights, surgical lighting.
Automotive Electronics: Electric vehicle battery management, motor controllers, charging systems, and headlight drivers.
Communications Equipment: 5G/6G base stations, RF amplifiers, antenna modules, and filtering devices.
Industrial Equipment: Welding machines, solar inverters, UPS power supplies, and robotic control systems.
Medical Equipment: MRI systems, X-ray machines, and surgical laser equipment.
Computers and Consumer Electronics: CPU motherboards, game consoles, and smartphones.
Aerospace: Satellite communications, radar, and avionics equipment.

What is the Difference between Copper Pour and Trace?

Characteristic	Trace	Copper Pour
Definition	Conductive path for signal/current	Filled copper area for functional/thermal purposes
Function	Signal/current transmission	Heat dissipation, EMI shielding, high-current carrying
Smart Avoidance	None (manual adjustment required)	Auto-isolates from other networks
Design Method	Manual routing line by line	Auto-fills irregular regions
Short Circuit Risk	Low (independent path)	High for standard pour, low for filled pour
High-Frequency Adaptability	Susceptible to interference (requires width/spacing optimization)	Reduces crosstalk (avoids via resonance)
Typical Thickness	0.7 mil (½ oz) or 1.4 mil (1 oz)	4 mil (standard)

PCB Copper Pour Clearance Design Rules

1. Core Spacing Values

General Baseline: Copper pad to pad/via distance ≥0.2mm (1oz copper foil) or ≥0.33mm (2.5oz copper foil). Any distance below this will result in a short circuit.
High-voltage scenarios: Calculate clearance based on voltage (e.g., 220V requires ≥2.5mm), using the maximum of clearance and creepage distances.
Board Edge Treatment: Copper pad to cutting line ≥0.8mm; otherwise, the copper sheet may tear during milling.

2. Specific Scenarios

Under capacitors: Copper pads are strictly prohibited, with a spacing of 0.1mm (to prevent parasitic capacitance from interfering with signals).
Antenna Area: Clearance below wireless modules ≥12.5mm (to prevent signal coupling, measured values).
Gold-plated board edges: Copper pad setback ≥0.5mm (to prevent corrosion caused by plating solution infiltration).

3. Software Practice (AD/KiCad)

Rule Settings:

Global Spacing: Start at 0.5mm (20mil), with separate rules for high-voltage areas.
Copper Pad Specific: Set to 0.8mm when no solder mask is present (to facilitate repair and soldering).
Priority Suppression: Board-Level Rules > Net-Level Rules > Single-Object Rules. In case of conflict, the strictest value is used.

4. Manufacturing Minefields

Peelable Structures: Isolated copper islands in the copper pad with a width less than 0.2mm will be deleted (etching will cause breakage).
Copper Layer Text: Text must be ≥0.15mm away from the copper pad (otherwise, the silkscreen will be blurred).
Sharp Angle Prohibition: Copper pad corners must be ≥45° (sharp corners can cause excessive corrosion during acid etching).

5. Signal Terms

High-Speed Lines: Copper pads must be ≥3 times the line width away from clock lines (e.g., a 0.2mm line width requires a 0.6mm setback).
Grounding copper: The spacing between copper layers in different voltage domains should be ≥1mm (to prevent leakage current).

Dead Zones and Sharp Angles Problems in Copper Pour PCB Design

Dead Zone Problems:

1. Electrical Isolation Failure: Isolated copper areas not connected to the network (dead copper) create an antenna effect, increasing electromagnetic interference (EMI), causing high-frequency signal distortion or noise interference.

2. Thermal Stress Concentration: Dead copper cannot effectively dissipate heat, causing local overheating that accelerates component aging and shortens PCB life.

3. Manufacturing Defect Risk: Dead copper can easily peel during etching, causing shorts or opens.

Dead Zone Solutions:

1. Ground Via Connection Design: Add ground vias (vias) in large dead copper areas, connecting them directly to the ground network (recommended density ≥ 1 per square centimeter) to eliminate the antenna effect.

2. Copper Layer Optimization Strategy: Avoid copper pouring in unrouted areas (such as mid-layer routing openings); use a grid-like window design (heat dissipation vias) to improve heat dissipation.

3. Automated Design for Factoring (DFM) Checking: Use EDA tools to run DFM rule checks (e.g., Gerber files with board outlines) to automatically identify and remove dead copper areas.

Sharp Angle Problems:

1. Enhanced EMI Radiation: Sharp angles (≤90°) form high-frequency transmitting antennas, interfering with sensitive circuits such as clock signals and increasing signal noise.

2. Etchant Traps: Etching solution accumulates at sharp angles, unevenly corroding the copper layer and causing wire breaks or shorts (the risk is doubled for trace widths ≤5 mils).

3. Mechanical Fragility: Sharp angles are susceptible to fracture under thermal stress, leading to open circuit failures, which is particularly serious in industrial-grade PCBs.

Sharp Angle Solution:

1. Replacement of Curved Corners: Use 45° bevels or arcs (arc radius ≥ 2 times the trace width) for all trace turns, completely avoiding 90° angles.

2. Line Optimization: Widen high-voltage/high-frequency lines (e.g., power lines ≥ 20 mils), ensuring smooth, chamfer-free lines; prioritize large-area copper pours for ground lines.

3. Embed Design for Functional Measurement (DFM) rules: Set minimum bend radius (≥ 0.2 mm) and line-to-space ratio (≥ 1:1), and use EDA tools to automatically correct sharp angles.

Grounding and Connection Problems in Copper Pour PCB Design

1. Grounding Failure Causing Noise/EMI Problems:

Ungrounded copper areas act as EMI antennas.
Long/impedance-mismatched ground paths disrupt high-frequency signal return.

Grounding Failure Causing Noise/EMI Solution:

Auto-connect copper to GND in Altium, use via stitching to link top/bottom copper to inner ground planes.
Limit high-frequency signal return paths to ≤ λ/20.
Use 4-layer stackup (Sig/Gnd/Pow/Sig) for direct top/bottom-to-ground connections.

2. Copper-Via/Pad Disconnection Problems:

Thermal stress or manufacturing errors break copper-via/pad links.
Flex PCBs develop cracks in bent areas.

Copper-Via/Pad Disconnection Solution:

Add teardrop transitions at vias to increase contact area.
Use edge-plating for flex PCBs with prepreg reinforcement.
Confirm min. copper thickness (≥1oz) and via spacing (≥0.3mm) with fabricators.

3. High-Frequency Loop Interference Problems:

Copper loops cause magnetic coupling, inducing crosstalk/oscillation.
Asymmetric differential pair returns disrupt impedance matching.

High-Frequency Loop Interference Solution:

Isolate analog/digital grounds with beads/0Ω resistors; connect copper to single GND.
Add guard ground traces (≥3× line width) around differential pairs.
Optimize copper shapes via SIwave EM simulation.

4. Thermal Expansion Failure Problems:

CTE mismatch under power devices causes pad/copper cracking.

Thermal Expansion Failure Solution:

Use mesh copper under power components with via arrays to inner ground.
Select FR-4 TG170 for CTE compatibility.

5. Fine-Pitch Component Shorting Problems:

Copper near BGA/QFN pads causes solder bridging.

Solution:

Set copper clearance ≥0.2mm (8mil) in Altium DRC.
Remove local copper under BGAs while preserving critical signal paths.

Why Choose Best Technology as Copper Pour PCB Supplier?

19-Year PCB Manufacturing Expertise: Proven track record in handling complex designs (e.g., HDI, RF, automotive) with 98.5% on-time delivery.
Global Certifications: ISO 9001, ISO 13485, UL and RoHS compliance guarantee product safety and regulatory adherence.
Fast Turnaround: 24-hour rapid prototyping and 5-day standard delivery for copper pour PCBs (3oz-10oz), accelerating time-to-market.
Cost Efficiency: Optimized production processes and bulk material procurement reduce costs by 15-20% compared to industry averages.
Strict Quality Inspection: 100% AOI inspection for bulk orders + 3D X-Ray scanning ensures <0.05% defect rate, minimizing rework costs.
Free DFM Analysis: Pre-production design checks identify copper pour issues (e.g., dead zones, sharp angles), saving $5,000+ in potential redesign costs.
Free Engineering Support: Dedicated team provides copper pour optimization, impedance control, and thermal management solutions at no extra charge.

Welcome to contact us if you have any inquiry for copper pour PCB: sales@bestpcbs.com.

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Embedded Copper Coin PCB Supplier| Best Technology

August 19th, 2025

What is embedded copper coin PCB? Let’s explore its structure, benefits, applications, connector methods, design guide, production processes together.

Are you troubled with these problems?

Is your product throttled by poor heat dissipation?
Are traditional cooling solutions squeezing your design space?
Is your PCB frequently experiencing thermal failures under complex operating conditions?

Best Technology can offer services and solutions:

Customized thermal design: ANSYS simulation and field verification.
Flexible manufacturing services: 0.2-2.0mm copper coin options.
Full-process quality control: 16 critical process checks for reliability.

Welcome to contact us if you have any inquiry for embedded copper coin PCB: sales@bestpcbs.com.

What is Embedded Copper Coin PCB?

Embedded Copper Coin PCB (Embedded Copper Coin) is an innovative technology that improves heat dissipation by embedding copper sheets (called “copper coins”) within printed circuit boards (PCBs). These copper coins, typically in a circular or rectangular stepped design, efficiently absorb and dissipate heat generated by electronic components, making them particularly suitable for high-power devices or miniaturized products (such as 5G communications equipment and space electronics).

This technology leverages copper’s high thermal conductivity to mount heat-generating components directly on the copper coins, significantly overcoming the limitations of traditional PCB heat dissipation vias or metal substrates, achieving more compact and efficient heat dissipation.

Structure of Embedded Copper Coin PCB

1. Copper Coin Body

Material: ≥99.9% pure copper, 0.5–3mm thick, 5–20mm diameter, nickel-plated.
Design: Stepped profile expands heat contact; fits round/rectangular chips.

2. Embedding Process

Process: Laser/mechanical insertion into PCB layers, FR-4 bonded, resin-filled for flatness.
Tolerance: Adhesive residue ≤0.1mm to prevent via cracks.

3. Conductive Interconnects

Vias: Metallized, copper-plated ≥25µm for low impedance.
Clearance: ≥0.2mm between layers (3kV AC safe).

4. Insulation & Protection

Solder Mask: ≥15µm edge coverage.
Vias: Resin-filled to reduce thermal stress.

5. Thermal Management

Path: Thermal adhesive/aluminum substrate beneath coin for vertical cooling.
Stacked Design: Simulation-optimized heat flow.

Advantages of Copper Coin-Embedded PCB

Highly Efficient Heat Dissipation: Copper exhibits excellent thermal conductivity and is embedded directly beneath heat-generating components to quickly dissipate heat and prevent overheating damage (such as power ICs or automotive-grade chips).
Saves PCB Space: No additional heat sink or complex air cooling systems are required, making it suitable for compact designs (such as drones and portable devices).
Improves Long-Term Reliability: Copper and PCB materials have similar coefficients of thermal expansion, reducing the risk of solder joint cracking and extending product life.
Lowers Overall Cost: The process is simpler than embedded copper coins, reducing production steps and material waste.
Supports Custom Design: Round and rectangular copper coins can flexibly adapt to different component shapes (such as special-shaped chips) to optimize heat conduction paths.

Applications of Embedded Copper Coin PCB

High-Power LED Lighting Cooling
RF/Microwave Power Amplifiers
New Energy Vehicle Power Systems
Industrial Power Equipment
Aerospace Electronics Systems
Server Power Modules
Power Electronics Converters
High-density packaged device cooling
Automated test equipment (ATE)
Audio power amplifiers

How is the Copper Coin Connected to the PCB?

Metallized Via Direct Connection

Copper coins connect to PCB inner layers via laser-drilled microvias (aperture ≥0.3mm), with copper plating thickness ≥25µm on via walls, ensuring low-impedance conduction (<10mΩ).
Suitable for high-current applications (e.g., EV traction systems carrying ≥200A).

Stepped Laminated Structure

Adopts OKI’s stepped copper coin design, where copper coins are laminated with PCBs using resin-filled gaps. Contact diameter 7mm, heat dissipation expanded to 10mm.
Requires controlled lamination temperature (170–200℃) and pressure (200–400psi) to avoid resin voids and elevated thermal resistance.

Conductive Adhesive Bonding

Uses thermal conductive adhesive (e.g., 3M 8810, thermal conductivity ≥1.5W/mK) to fix copper coins in non-conductive areas.
Ideal for high-frequency signal modules (e.g., mmWave radar) to prevent electromagnetic interference from metal vias.

How to Design A Embedded Copper Coin PCB?

Below are embedded copper coin PCB design guide:

1. Material & Copper Coin Parameter Design

Material selection: Select ≥99.9% purity electrolytic copper (thermal conductivity: 401W/(m·K)), with thickness matched to chip power (e.g., 1.5mm for 10W chips, 2.5mm for 20W chips).
Surface treatment: Nickel-plated (≥5µm); gold plating (≥1µm) for extreme environments.
Shape optimization: Stepped design expands contact area by 30–50%; rectangular coins for linear-package devices.

2. Embedding Position Planning

Single-layer boards: Align copper coin center with high-power component (e.g., CPU/GPU) heat core (error ≤0.2mm).
Multi-layer boards: Vertically stagger coins (e.g., Layer 2 coins offset 5mm from Layer 1).
Safety clearance: Maintain ≥0.5mm gap between coin edges and high-speed signal lines; ≥2mm from PCB edges.

3. 3D Thermal Interface Design

Vertical Cooling:

Apply thermal adhesive (e.g., Arctik 8800, 3.0W/(m·K)) to fill micro-gaps between chip and coin.
Embed aluminum substrate (1.0mm thickness) beneath coins; connect to backside heatsinks via thermal vias.

Horizontal Cooling:

Array small coins (3mm diameter, 5mm pitch) under uniformly heated devices (e.g., FPGAs).
Deploy thermal via arrays (0.3mm diameter, 0.8mm pitch) around coins; fill with conductive epoxy (e.g., Ausbond 9105, 1.5W/(m·K)).

4. Thermal Via Optimization

Via parameters: Diameter ≥0.3mm, copper plating ≥25µm, depth ≤2/3 of PCB thickness.
Process enhancement: Electroless Nickel Immersion Gold (ENIG) finish for via walls; array vias in ring or matrix patterns (pitch ≤1mm).

5. Manufacturing Process Control

Embedding methods:

Small coins (≤5mm): Laser drilling (±0.05mm accuracy), vacuum-adhesive fixation.
Large coins (≥10mm): Mechanical pressing (50–80psi), alignment pins for hole matching.

Resin filling: Use low-CTE (≤40ppm/℃) epoxy to fill gaps; cure via baking (150℃, 2 hours).

6. Thermal Simulation & Validation

Simulation phase: Model steady/transient thermal distribution using Ansys Icepak (input material parameters, via layout, and chip power data).

Physical testing:

Thermal imaging: Ensure junction-to-coin ΔT ≤5℃ (e.g., coin ≤115℃ at chip 120℃).
Temperature cycling (-40℃~125℃, 1,000 cycles): Inspect for cracks/delamination at coin-PCB junctions.

7. Standards Compliance Testing

Compliance: CPCA 6042 (embedded copper PCBs), IPC-6012C (rigid PCBs).
Dielectric testing: Apply 3kV AC between adjacent coins/ground; no breakdown for 60 seconds.

How to Design A Embedded Copper Coin PCB?

What is the Process of Embedded Copper Coin PCB?

1. Substrate Preprocessing & Copper Coin Fabrication

Substrate Cutting: FR-4 substrate cut to working dimensions (tolerance ±0.1mm), with simultaneous milling of copper coin positioning slots (depth = coin thickness +0.05mm).
Copper Coin Machining: CNC-shaped electrolytic copper (C11000), surface nickel-plated (2–5μm) + chemical roughening (Ra 0.8–1.2μm).

2. Inner Layer Production & Coin Embedding

Inner Layer Imaging: After circuit etching, black oxidation treatment applied to copper coin zones (surface area increased ≥30%).
Coin Assembly: Vacuum nozzle with visual positioning system (accuracy ±25μm) presses coins into slots; edges coated with conductive epoxy (thermal conductivity ≥5W/mK).
Pre-Lamination Inspection: X-ray detection of coin positional deviation (standard ≤0.1mm).

3. Multi-Layer Lamination Control

Stack-Up Structure: 2 high-TG prepreg sheets (e.g., IT-180A) placed above/below copper coin layer; copper foil pre-laminated with thermal adhesive film.

Vacuum Hot Pressing Parameters:

Stage 1: 120℃ / 3MPa / vacuum ≤10Pa
Stage 2: 180℃ / 8MPa / dwell 60min
Stage 3: Cooling to <50℃ before pressure release

Post-Pressing Treatment: Laser trimming of resin overflow; plasma cleaning of coin zones.

4. Drilling & Metallization

Step Drilling:

φ0.3mm pilot holes (through coin center)
Enlarged to φ0.5mm (aspect ratio ≤12:1)
Back-drilling residue ≤0.15mm

High-Thermal Via Metallization:

Pulse copper plating (average thickness ≥30μm)
Via filling with silver paste (thermal conductivity >200W/mK) or nano-aluminum resin.

5. Outer Layer Circuitry & Thermal Enhancement

Laser LDI Imaging: Circuit width compensation +0.1mm at coin connection zones (to offset lamination deformation).
Selective Thick Copper Plating: 3oz (105μm) plating around coin zones; 1oz (35μm) retention at non-thermal zones.
Thermal Via Arrays: φ0.25mm vias (pitch 1.0mm) within 1mm of coin edges, filled with thermal paste.

6. Surface Finish & Testing

Coin-Specific Surface Treatment:

Electroless nickel-palladium-gold (ENIG: Ni 5μm/Pd 0.2μm/Au 0.05μm) .
Or OSP + localized silver plating for oxidation resistance.

Thermal Validation:

Infrared thermography (ΔT ≤12℃ under 10W input)
Thermal cycling (-55℃~125℃, 1,000 cycles; impedance change ≤3%)

7. Final Inspection & Packaging

Coin-Specific Testing: Ultrasonic scanning (detect delamination); Shear strength test (≥50N/mm²)
Packaging: Antistatic vacuum packaging (internal humidity ≤10%RH); silicone pads added to coin zones.

Why Choose Best Technology as Embedded Copper Coin PCB Supplier?

Reasons why choose us as embedded copper coin PCB supplier:

Certification Compliance‌: ISO 9001, IATF 16949, ISO 13485 and RoHS, UL certified, and ensures global market compliance and reliability.
Superior Material Quality: Use ≥99.9% electrolytic copper (C11000) with nickel/gold plating. Ensures superior thermal conductivity (≥401W/m·K) and long-term reliability.
Reliable Quality Control‌: Strict process control with AOI/SPI/X-Ray inspection ensures 99.5% assembly yield and minimal defects.
24 Hours Rapid Prototyping: Accelerates product launches and time-to-market.
Free DFM Optimization: Reduces design errors by 40% and avoids costly rework.
One-Stop Solution: Simplifies vendor management, cutting admin work by 60%.
Advanced Thermal Solution: Guarantees stability for high-power applications (e.g., automotive/5G).
24/7 Technical Support: Minimizes downtime and ensures smooth mass production.

Welcome to contact us if you have any request for embedded copper coin PCB: sales@bestpcbs.com.

Tags: Embedded Copper Coin PCB
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Splitter PCB Design & Assembly, PCBA Service Supplier

August 19th, 2025

What is splitter PCB? Let’s explore its function, types, applications, technical parameter, design guide, assembly processes through this blog.

Customer Pain Points and Difficulties:

Severe signal attenuation and short transmission distance? (Splitter PCB uses high-precision impedance matching to ensure lossless signal distribution and extend transmission distance.)
Multi-path signal interference and poor stability? (Splitter PCB’s optimized isolation design effectively suppresses EMI/EMC and ensures signal purity.)
Complex assembly process and low yield? (Splitter PCB’s standardized production process and automated SMT placement improve consistency.)

Best Technology can provide services and solutions:

Customized Design Support: Provide impedance simulation and stack up optimization to ensure Splitter PCB meets your signal distribution needs.
Efficient Production and Delivery: 7-day proofing and 15-day mass production, quickly responding to your project schedule.
Full-Process Quality Assurance
ISO 9001 control throughout the entire process, from PCB manufacturing to assembly and testing, ensures reliability.

Let Best Technology be your splitter PCB expert and solve your signal distribution challenges! Contact us now if you have any request for splitter PCB design and assembly: sales@bestpcbs.com.

What is Splitter PCB?

A splitter PCB is a printed circuit board (PCB) specifically designed for signal or power distribution. It distributes input signals/currents to multiple output ports in equal or unequal proportions, enabling system signal synchronization or power isolation.

What is the Purpose of Splitter PCB?

RF Signal Distribution: Used in communications equipment (such as base stations and routers), it splits RF signals into multiple channels.
Mixed Signal Isolation: Isolates noise interference from analog and digital circuits.
Power Management: Distributes different voltage rails in multi-voltage systems (such as automotive BMS).
High-Speed Interface Optimization: Improves the transmission stability of high-speed signals such as PCIe/USB4.
Test Support: Facilitates device debugging and performance monitoring.
Flexible Electronics Integration: Adapts to the compact space requirements of wearable devices and foldable displays.

What Are Types of Splitter PCB?

POE Splitter PCB: Separates Power over Ethernet (PoE) into data and power, adapting to non-PoE devices.
Audio Splitter PCB: Distributes audio signals to multiple output channels (such as 3.5mm/RCA jacks), supporting parallel connection of speakers or headphones.
Fan Splitter PCB: Connects multiple fans (12/24V) in parallel, simplifying wiring for cooling systems (such as 3D printers or chassis fans).
HDMI Splitter PCB: Duplicates a single HDMI signal to multiple displays, supporting 4K/8K video transmission (such as conference presentations or advertising screens).
USB Splitter PCB: Expands a single USB port into multiple ports, supporting peripheral connection or charging (such as keyboards, mice, and mobile phones).

What Are Applications of PCB Splitter?

Communications and RF Systems – Signal distribution (such as 1-to-2 splitters), frequency band division (broadband equal power division), and RF test equipment (connecting signal sources and measuring instruments).
Audio Equipment – Speaker crossover (high/mid/low frequency band distribution), electronic crossovers (weak signal division before amplifiers).
Automotive Electronics – Power control (motor controllers, battery management systems), intelligent driving (millimeter-wave radar high-frequency PCBs), new energy battery data acquisition cables (FPC flexible monitoring).
Consumer Electronics – Smartphones/tablets (HDI boards, flexible PCBs), wearable devices (lightweight and heat-resistant designs).
Industrial and Aerospace – Extreme environments (high temperature/high pressure/strong electromagnetic interference), high-precision control (multilayer boards, ceramic substrates).
Data Centers and Cloud Computing – High-speed signal transmission (servers, data center multilayer boards), low-latency data processing.
Smart Home and IoT: Wireless device integration (sensors, communication modules), low-power flexible PCB design.

HDMI Splitter PCB Design Technical Parameter

Parameter Category	Technical Specifications
Input/Output Interface	1×HDMI input, 2×/4×/8×HDMI outputs (configurable)
HDMI Version Support	HDMI 2.0b/2.1 (supports 4K@60Hz, HDR, HDCP 2.2/2.3)
Resolution Support	Maximum 4K@60Hz (4:4:4), compatible with 1080P/720P and below
Signal Bandwidth	18Gbps (HDMI 2.0) / 48Gbps (HDMI 2.1)
Operating Voltage	DC 5V (typical)
Power Consumption	≤5W (static), ≤10W (dynamic)
PCB Layers	4-6 layer board (impedance-controlled layers)
PCB Material	FR-4 (Tg≥170℃), optional high-frequency material (e.g., Rogers 4350B)
Differential Impedance	100Ω±10% (HDMI differential signal lines)
Signal Integrity	Insertion loss ≤-3dB@6GHz, return loss ≤-10dB@6GHz
EDID Support	Dynamic/Static EDID storage (EEPROM capacity ≥256Byte)
HDCP Support	HDCP 1.4/2.2/2.3 compliant
Connector Type	HDMI Type A female socket (gold-plated contacts, thickness ≥15μm)
ESD Protection	Human Body Model ±8kV, Machine Model ±200V (IEC 61000-4-2)
Operating Temperature	0℃~70℃ (commercial grade), optional -40℃~85℃ (industrial grade)
Certification Standards	CE, FCC, RoHS, HDMI Adopter Certification

How to Design a HDMI Splitter PCB?

HDMI splitter PCB design guide:

1. Basic Layout and Stackup Design

Shortening the signal path:

Minimize the distance between the HDMI connector and the processing chip (such as the TMDS341A) to reduce signal attenuation and EMI.

Stackup Structure:

Use at least a 4-layer PCB (6 layers recommended), including a complete power and ground layer.
High-speed signal layers should be placed adjacent to the ground layer to enhance magnetic field coupling and suppress EMI.

2. Differential Signal Impedance Control (100Ω)

Trace Rules:

A 1:1 differential pair width/space ratio is recommended, with intra-pair error ≤ 5 mil and inter-pair error ≤ 10 mil.
Trace spacing (s) must meet the following requirements: s < h (dielectric thickness), s < W (line width), and d > 2s (distance from other traces).
Use a 2D field solver to accurately calculate impedance, avoiding reliance on empirical values.

Via Design:

Use small vias (8 mil/16 mil recommended) to reduce capacitance effects and impedance drop.
Avoid switching high-speed signals across different layers; otherwise, additional return vias will be required.

3. Power Supply and Decoupling Capacitor Design

Power Inlet: Place a 10μF tantalum capacitor for voltage regulation.
Chip Power Supply: Place a 0.1μF or 0.01μF ceramic capacitor next to each high-speed chip, and connect the capacitor pins with double vias to reduce inductance.
Decoupling Capacitors: Configure at least one 4.7μF capacitor and five 0.1μF capacitors, connecting them directly to the power plane (minimizing the path).
Power Plane: Avoid signal lines crossing split planes to ensure a continuous return path.

4. EDID Management Strategy

EDID Compose Mode: Automatically analyzes the resolutions of all displays and selects the lowest compatible value (e.g., 1080P) to ensure compatibility.
Fixed Mode: Forces the output to a specific resolution (e.g., 4K@60Hz) to accommodate high-end devices.
Priority Setting: Supports port priority (for example, when Output 1 is disconnected, Output 2 defaults to 1080P)

5. Design for Manufacturability (DFM)

Trace Equal Length:

Length deviation within a differential pair should be ≤ 5 mil to prevent EMI caused by phase shift.
Use curved or serpentine traces to correct for length differences.

Pad and Spacing:

HDMI pads should be minimized to prevent impedance mismatch.
The copper pad to board margin distance should be ≥ 75 mil to meet production process requirements.

6. Expandable Functionality and Compatibility

Output Port Planning:

Select the number of ports based on requirements (e.g., 1×2/1×4), and reserve one or two spare ports for upgrades.

Supported Protocols:

Ensure support for HDCP 1.4+/HDMI 2.0, 4K@60Hz, and 3D formats.
Integrate CEC commands (e.g., one-button standby and remote control passthrough) to enhance the user experience.

External Power Supply:

Multiple ports (≥4 outputs) require a separate 12V/5A power supply to avoid power shortages.

7. Design Considerations

Avoid Cross-Splits: A complete reference plane is required beneath the differential lines, otherwise impedance jumps and noise will occur.
Capacitor Selection: Use low-ESL ceramic capacitors for high-frequency ranges (>100MHz) and tantalum capacitors for voltage stabilization in low-frequency ranges.
Connector Quality: Use connectors that meet HDMI impedance standards to avoid signal reflections.

How to Assemble a Splitter PCB?

Below are splitter PCB assembly processes:

1. Prepare Materials & Tools

Gather Splitter PCB (pre-etched), component kit (resistors, capacitors, transmission lines), solder wire, flux, soldering iron, tweezers, multimeter.
Inspect PCB for cleanliness and shorts; verify components match BOM (e.g., resistor values).

2. Component Placement

Align components with PCB silkscreen:

Insert resistors/capacitors into pads; press gently.
Embed transmission lines (e.g., quarter-wavelength microstrip) into slots, ensuring contact with pads.
High-frequency parts (e.g., Wilkinson resistors) must follow polarity marks.

3. Soldering

Set iron to 280–320°C (use lower temp for PTFE to avoid warping).
Steps:
a. Apply flux to pad/lead.
b. Feed solder until melted; remove iron for smooth joints.
c. Use “drag soldering” for SMD parts.
Focus: Transmission line joints and isolation resistors (avoid cold joints/bridges).

4. Quality Inspection

Visual check: Conical, shiny solder joints with no cracks.
Electrical test: Measure resistance (e.g., isolation resistors) with multimeter (≤5% deviation).
Continuity test: Short input to one output; others should show no connection.

5. Functional Verification

Connect signal generator and spectrum analyzer:
a. Input signal to PCB; measure output power (e.g., 1-to-2 divider: ≤0.5dB difference).
b. Test port isolation (e.g., ≤-20dB).
Debug: Re-solder components if power imbalance or poor isolation persists.

6. Cleaning & Protection

Wipe flux residue with alcohol to prevent corrosion.
Apply conductive adhesive on edges for RF applications to reduce EMI.
Package in anti-static bags with specs/test results labeled.

7. Notes:

Use automated soldering for high-frequency PCBs (e.g., 77GHz automotive radar) to avoid parameter shifts.
Prioritize network analyzers for testing; multimeters suit low-frequency checks only.

Why Choose Best Technology as PCBA Service Supplier?

Reasons why choose us as splitter PCB assembly service supplier:

19 Years of Industry Experience: Proven expertise in RF/high-speed splitter PCB assembly for 5G, automotive, and IoT applications.
Full Certification Compliance: ISO 9001, IATF 16949, ISO 13485 and RoHS, UL certified, and ensures global market compliance and reliability.
Cost-Effective Solutions: Competitive pricing and optimized material sourcing help reduce your production costs by 15-30%.
Free DFM & Design Support: Expert impedance matching (e.g., 50Ω RF traces) and signal integrity analysis ensure optimal splitter PCB performance.
Reliable Quality Control: Strict process control with AOI/SPI/X-Ray inspection ensures 99.5% assembly yield and minimal defects.
Fast Turnkey Assembly: 7-day prototype delivery and 15-day mass production for splitter PCB orders (100pcs–10Kpcs).
Advanced SMT Capabilities: Supports 01005-size components and 0.3mm BGA assembly for high-density splitter PCB designs.
Effective Signal Isolation: Dedicated EMI/EMC control measures prevent crosstalk in mixed-signal splitter boards.
Flexible Scalability: Seamless transition from prototypes to large-scale production (1M+ units) with consistent quality.
24/7 Technical Support: Dedicated engineers provide real-time DFM feedback and troubleshooting support.

Welcome to contact us if you have any request for PCBA service: sales@bestpcbs.com.

Tags: PCB Splitter, Splitter PCB
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PCB Footprint Standards and How to Make Footprint PCB?

August 19th, 2025

A footprint PCB is especially significant in component placement accuracy, soldering reliability, electrical performance, thermal management, and inspection and testing. This blog explains the meaning, standards, design guidelines, creation process, and precision methods of footprint PCBs to help engineers achieve accurate, reliable, and manufacturable circuit board layouts.

Do you have these problems on PCB prototype or mass production projects?

Manufacturing and assembly problems due to the non-standardized design?
Lacking the knowledge about the standardized design rules?
Absence of understanding of the component footprints?
Deficiency applies to the PCB footprint library?

Below are the workable solutions provided by Best Technology.

Fully follow and apply the standardized design norms to improve the PCB yield.
Employ a PCB footprint library to improve the design efficiency and reduce the rate of design mistakes.
Boost the design verification and inspection to improve the design quality and reduce the design failure.

Best Technology is a major PCB and SMT assembly factory, fully compatible with ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, REACH, and RoHS standards. Most of our engineers have worked in Best Technology for over 10 years, gaining a sufficient understanding of what PCB footprints are, the relevant standards, design rules, creation steps, and accuracy techniques. If you have further questions, pls contact us directly at +86-755-2909-1601 or sales@bestpcbs.com.

PCB Footprint Standards and How to Make Footprint PCB?

What is footprint PCB meaning?

Put simply, a footprint PCB is a visual map on the board that indicates exactly where each component will sit. It clearly marks the positions, including pads, holds, and outlines of the components. The problems of misalignment or the soldering issues will occur even if it is just minor inaccuracies. Therefore, Best Technology provides the prototyping, which undergoes strict checking and validation service, that will benefit from smooth manufacturing and cost efficiency.

What are footprint dimensions meaning?

Footprint dimensions define the size and spacing of the pads, pins, and holds. This includes the length, width, pad diameter, and the spacing of the pins. The correct size can prevent solder bridging, improve the mechanical stability, and provide automation assembly convenience. For example, if the capacitor’s pad size is wrong, that will cause movement during the soldering and will lead to failures later. Best Technology will double-check the size according to the data sheet, to ensure the correctness the first time.

What are the PCB footprint standards?

Standards guide how to lay out the footprints. For example, IPC-7351 makes a guideline of the pad size and the tolerance; however, JEDEC provides the semiconductor footprints guidelines. If we are fully compatible with standards, the smooth assembly and quality checking can be assured. However, if we ignore the standards, the time and the money may be wasted. Best Technology follows standards to do PCB footprint efficiently, avoiding rework and delay.

What are some PCB footprint generator tools?

There are various tools that help engineers to generate and verify PCB footprints. Popular options include KiCad, Altium Designer, Eagle, and EasyEDA. These tools feature prebuilt libraries, customization, and compliance checks. Using the tools correctly can reduce human error and expedite the design process. Best Technology provides guidance about the library management and PCB footprint verification, which makes the workflow more reliable.

What does a Footprint PCB design do?

A footprint PCB design ensures every component is assembled to the circuit board, compatible with the electrical connection, mechanical match, and manufacturability. Making the PCB footprint precisely can reduce the soldering problem and the assembly failure. We can take it as the bridge between the schematic and the actual circuit boards. Best Technology double checks about every PCB footprint and the circuit board layout, aiming to get the smooth integration and reduce the rework.

PCB footprint design guidelines

Following design guidelines improves both reliability and manufacturability. The key recommendation includes:

First, fully compatible with IPC-7351 or JEDEC standards.

Then, make use of the data sheet to verify pad size and spacing.

Next, ensure the solder mask clearance to prevent bridging.

And keep the consistency between the component direction and the pin number.

Finally, make a record of the footprint information for reference in the near future.

Best technology provides the DFM analysis, customization checking, and technical consultation, which makes your order proceed more effectively, avoiding the common mistakes and ensuring the direct manufacture of the boards.

How to make a pcb footprint creation?

Here is how to make a PCB footprint creation for your review.

First, make a confirmation about the component types and refer to the data sheet.

Next, confirm the pad size, pin spacing, and outline dimensions.

Then, employ the footprint generator or PCB software to draw the footprint.

And double-check all the dimensions according to the standards and data sheet.

Finally, checking the component placement to ensure precision.

There are common to get troubles for the engineers, which lead to the board waste and the manufacturing delay. Best Technology is a leading PCB manufacturer in China, providing professional guidance, design optimization, and verification services to save time and prevent mistakes.

How to ensure the high precision pcb footprint sizes?

It is helpful to know that the high-precision PCB footprint prevents assembly problems effectively. Here are the practical ways, for reference.

Carefully checking the tolerance in the datasheet.

Apply the verified library or template.

Keep consistency of the unit, such as mm, mil.

Final review it before publishing the design.

Best Technology provides rigorous verification and the existing template, reducing human errors, expediting manufacturing, and finally ensuring high-quality PCBs.

Case about Footprint PCB in Best Technology

There are some of our customers who require a high-precision PCB footprint for prototype and small batch manufacturing. Best Technology helps customers to make a high-precision footprint and perform a DFM analysis to ensure full compatibility with the industry standards. Here are some photos for your review.

In a nutshell, footprint PCB is especially critical to the precise, efficient, and reliable manufacturing. Getting some knowledge about the dimensions, standards, and design guidance can prevent costly mistakes and improve manufacturing efficiency. Using the tools and the verification methods correctly ensures high-quality results.

Best Technology has been in the PCB industry for over 19 years, providing support and service throughout every stage for customers, from footprint PCB creation to verification, DFM analysis, prototype, mass production, and SMT assembly. We grasp the key pain points and have the specific solutions to tackle them, such as component misalignment or non-compliant pads. If you have any PCB or PCBA inquiry, pls don’t hesitate to find us for help via sales@bestpcbs.com. We are fully committed to giving our engagement and expediting the market entry time of your products.

Tags: footprint pcb
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What is Copper Busbar? PCB Copper Busbar Manufacturers

August 19th, 2025

Are you worried about these issues?

Is copper busbar overheating in high-current applications, causing efficiency drops or even system shutdowns?
Is corrosion or oxidation in humid or harsh environments leading to frequent maintenance?
Do you need flexible copper busbar customization to fit different battery modules or inverter layouts?

Best Technology provides tailored copper busbar solutions that balance cost, performance, and flexibility. We offer:

Competitive pricing directly from manufacturer
Customized sizes, coatings, and shapes
High durability = long-term cost savings
No minimum order quantity requirements, I pcs prototype order is available

If you are comparing copper busbar manufacturers or exploring advanced copper busbar PCB designs, Best Technology can help. With certifications including ISO9001, ISO13485, IATF16949, and AS9100D, we maintain strict quality control from raw material to finished product. Our MES system keeps every component traceable, while competitive copper busbar price and flexible engineering support bring added value.

Whether you need standard copper busbar, custom busbar copper shapes, or integrated PCB busbar solutions, Best Technology offers expertise and reliability in every project. If you are interested in copper busbar or copper busbar pcb, welcome to contact us at sales@bestpcbs.com.

What is Copper Busbar?

A copper busbar is a flat strip, rod, or bar of copper designed to conduct electricity. Unlike flexible wires, it’s rigid, strong, and tailored to carry heavy current loads. You’ll often find it inside switchgear cabinets, power distribution panels, and large battery packs.

Why copper? Because copper has excellent conductivity and thermal performance. It carries more current per square millimeter than most other metals while staying stable over long service periods. For engineers, this means reduced energy losses and fewer overheating issues.

In short, copper busbar is the highway for electricity inside modern systems.

What is Copper Busbar?

Why is it Called a Busbar?

The word “bus” in electrical engineering describes something that collects and distributes. Just as a city bus gathers passengers and delivers them to different stops, a busbar gathers current from various circuits and spreads it across the system.

The “bar” part is literal—it’s a bar of conductive material. Together, the term “busbar” reflects its function and shape. Over decades, this word became standard, and now it’s used across industries worldwide.

How to Make a Copper Busbar?

The process of making busbar copper combines precision with material science. Here’s how manufacturers typically approach it:

1. Copper Selection – Most copper busbar manufacturers choose high-conductivity grades such as ETP (Electrolytic Tough Pitch) or OFHC (Oxygen-Free High Conductivity). These ensure stable performance.

2. Cutting and Shaping – Large copper sheets are cut into required sizes. CNC punches and hydraulic presses shape the bar with consistent accuracy.

3. Drilling and Punching – Holes and slots are added for bolted connections. This step requires exact tolerances so that joints stay secure.

4. Bending – Depending on installation needs, busbars are bent into L, U, or Z shapes without compromising mechanical strength.

5. Surface Finishing – To prevent oxidation, surfaces may be tin-plated, silver-plated, or coated with nickel. This not only protects but also improves contact reliability.

6. Insulation (Optional) – In compact systems, epoxy coatings or heat-shrink sleeves are added to prevent accidental shorts.

Every step is controlled to deliver high current capacity while keeping mechanical stability intact.

How to Clean Copper Busbar?

Over time, copper busbar surfaces can tarnish. A thin oxide layer forms, which slightly increases resistance. Cleaning restores performance. Here are some practical methods:

Mechanical cleaning – Sandpaper, wire brushes, or abrasive pads can remove the oxidation layer.
Chemical cleaning – Mild acidic solutions like vinegar mixed with salt, or commercial copper cleaners, dissolve corrosion without damaging the base metal.
Protective treatment – After cleaning, applying a thin coat of petroleum jelly or anti-oxidation grease helps slow down further tarnish.

Routine cleaning is important in high-current systems, as even small resistance increases can generate heat under load.

How to Calculate Copper Busbar Size?

Choosing the right copper busbar size means balancing current capacity with safety. Engineers often use a current density rule to determine cross-sectional area.

The common design range is 1.2 to 1.6 A per square millimeter of copper in open air.

Formula:

For example, a busbar that needs to carry 800A at 1.5 A/mm² should have at least:

If designed as 40 mm wide and 14 mm thick, this cross-section provides adequate capacity. Designers then check thermal rise and cooling conditions to finalize the dimension.

Copper Busbar vs Copper Busbar PCB

Although both serve as conductors, there are differences between traditional copper busbar and copper busbar PCB:

Copper Busbar – A standalone strip or bar. Common in switchgear, transformers, and large distribution panels.
Copper Busbar PCB – A printed circuit board reinforced with very thick copper layers or embedded copper strips. Used in compact high-power electronics such as EV inverters.

The advantage of copper busbar PCB is space efficiency. Instead of bulky bars and cables, the PCB integrates power and signal layers together, simplifying assembly.

Busbar Copper PCB

Why Choose Copper Busbar PCB?

Copper busbar PCB, sometimes called embedded busbar PCB or busbar-integrated PCB, is a smart evolution of traditional busbars. In some industries, it is also referred to as reinforced thick copper PCB, since the board integrates additional copper bars or strips inside or on the surface to handle heavy current.

The reason many designers choose copper busbar PCB over standalone busbars lies in its unique advantages:

Compact design – Instead of bulky copper bars and multiple cables, busbar copper is embedded in the PCB, reducing space requirements.
Improved thermal balance – Heat spreads evenly across the board, preventing local hotspots in high-power circuits.
Simplified assembly – Fewer mechanical joints mean lower installation time and reduced risk of loose connections.
Cost efficiency – By combining signal and power layers in one PCB, manufacturers save both material and labor cost.
Reliability – With laminated structure and less mechanical stress, copper busbar PCB performs well even in vibration-heavy environments such as automotive or industrial drives.

Copper Busbar Size and Current Rating Table

Here’s a general table showing copper busbar size with approximate current ratings (open air, 35°C rise). Values vary depending on installation and cooling.

Thickness (mm)	Width (mm)	Max Current (A)	Typical Applications
1	10	50	Small electronics
2	20	150	Industrial control
3	25	250	Switchboards
5	50	500	EV battery modules
10	100	1200	Power distribution systems

These values are approximate. Always confirm with copper busbar manufacturers for precise specifications based on your operating environment.

How Much Does a Copper Busbar of Length 40 cm Carry?

The capacity depends mainly on cross-section, not just length.

A 20 × 5 mm busbar of 40 cm can carry about 160–200A.
A 40 × 10 mm busbar of the same length can handle up to 700A.

Length matters for voltage drop, but current capacity is almost entirely governed by cross-section and cooling.

Why Copper Busbar is Suitable for Electric Vehicles?

Electric vehicles place extreme demands on conductors. High current during acceleration, fast charging, and compact layouts require components that can cope with stress. Copper busbar delivers in several ways:

Efficient conduction – Copper reduces resistive loss, extending driving range.
Thermal control – With high conductivity, copper disperses heat effectively during charging cycles.
Space saving – Laminated copper busbars replace bundles of cables, reducing weight and assembly time.
Durability – Resistant to vibration and mechanical wear, critical for vehicles exposed to constant motion.

That’s why most EV battery packs and controllers today rely heavily on laminated busbar copper.

What is a Copper Busbar PCB Used For?

Power electronics – Converters, inverters, and rectifiers.
Automotive – EV drive systems, on-board chargers, and battery management units.
Renewable energy – Solar string inverters and wind turbine controllers.
Industrial systems – Robotics, automation drives, and motor controllers.

FAQs

Q1: What makes copper busbar better than aluminum busbar?

Copper has higher conductivity and better mechanical durability, leading to improved performance and longer service life.

Q2: Can copper busbar be customized?

Yes. Width, thickness, plating, and hole punching can all be tailored to specific installations.

Q3: What is the Copper Busbar HS Code?

Most copper busbars fall under HS Code 7407, covering copper bars and profiles.

Q4: What drives copper busbar price?

Mainly copper market fluctuations, plus cost of processing and plating.

Q5: Is copper busbar PCB the same as heavy copper PCB?

It is a type of heavy copper PCB, but they have several differences. Heavy copper PCB only increases copper layer thickness, while copper busbar PCB embeds solid busbars for even higher current handling.

This is the end of this blog, if you have any other questions about copper busbar pcb, you are welcome to contact our team, our sales are always online!

Tags: Copper busbar HS code, copper busbar manufacturers, copper busbar size and current rating, copper busbar pcb
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Copper Balance PCB, Copper Balancing in PCB

August 19th, 2025

What is copper balance PCB? Let’s explore its technical parameter, purpose, application, design guide and plating uniformity optimization solutions.

Are you troubled with these problems?

How can we ensure signal stability with uneven copper holes? (copper balance PCB heat dissipation and balanced plating)
How can we prevent poor soldering due to interlayer deviation? (copper balance PCB rigidity and deformation prevention)
How can we accurately control high-frequency impedance fluctuations? (copper balance PCB temperature drift suppression)

Best Technology can provide solutions:

Customized electroplating parameters improve copper hole uniformity by +40%
3D simulation predicts interlayer deviation risks
Dynamic compensation technology achieves impedance tolerance of ±5%

Welcome to contact us if you have any request for copper balance PCB: sales@bestpcbs.com.

What is Copper Balance PCB?

A copper balance PCB( also called copper balancing in PCB) requires symmetrical distribution of copper traces and coverage within each layer of the PCB stackup, ensuring consistent copper weight and thickness on the top and bottom layers (or within each inner layer). This is similar to a mirror image design, where the top and bottom layers are perfectly symmetrical to prevent mechanical stress caused by differences in thermal expansion coefficients. For example, during the CAD design phase, engineers create new layers (such as Layer 0 for the board outline and Layer 1 for top-side copper traces) and calculate copper areas to ensure even coverage on both sides.

Copper Balance PCB Technical Parameters

Technical Parameter	Specifications
Copper Thickness Range	Inner Layers: 0.5-3oz (17-105μm)
Copper Thickness Range	Outer Layers: 1-4oz (35-140μm)
Symmetry Tolerance	Layer-to-Layer Copper Distribution Deviation ≤5%
Fill Pattern	Low-Density Areas: Solid Blocks (≥5mm²)
Fill Pattern	High-Density Areas: Mesh Grids (0.3-0.8mm Pitch)
Current Density	Inner Layers: 1.2-1.8A/ft²
Current Density	Outer Layers: 0.8-1.2A/ft² (With Thieving Dots)
Minimum Feature Size	Isolated Copper Dots: Diameter ≥50μm
Minimum Feature Size	Mesh Lines: Width/Spacing ≥80μm
Thermal Stress Resistance	After 3× Thermal Cycles (-40°C~125°C), Warpage ≤0.5%
Impedance Control Differential Pair	±5Ω Tolerance
Single-Ended Trace	±8% Tolerance
DFM Validation Methods	3D Field Solver for Copper Distribution Analysis; IPC-2221A Current Density Check

Purpose of PCB Balancing Copper

Preventing PCB board twisting, bending, or warping: Symmetrical copper trace distribution reduces mechanical deformation caused by differences in thermal expansion coefficients, ensuring a flat board and avoiding manufacturing defects and assembly issues.
Reducing ground impedance and voltage drop: Balanced copper coverage reduces ground resistance and stabilizes current flow, thereby reducing noise interference and improving power efficiency.
Reducing the risk of internal track fracture: Even copper distribution helps dissipate heat and stress, preventing damage to internal tracks caused by thermal stress or mechanical pressure.
Optimizing signal transmission and reducing interference: Copper foil filler improves interference immunity, improves signal integrity, and reduces high-frequency signal coupling and noise.
Enhancing thermal management: Copper acts as a heat dissipation layer, effectively conducting heat, eliminating the need for additional heat sink components, reducing manufacturing costs and the risk of thermal stress.
Increasing structural strength and reliability: Balanced copper increases the thickness of conductors and pads, ensuring strong connections between layers and improving the mechanical durability of the board.

Applications of Copper Balance PCB

LED street lights and traffic lights
Automotive lighting (headlights/taillights)
Surgical shadowless lamps and camping lights
Engine power controllers
Electric vehicle chargers and inverters
Servo motor drive circuits
Arc welder power modules
Solar inverters and UPSs
Textile machinery driver boards
CT/X-ray scanner heat sinks
Surgical lighting systems
5G base station filters
Server power modules
Airborne radar modules
Hi-fi audio amplifiers
Smartphone motherboards

Difference between Copper Balance vs Copper Thieving in PCB

Dimension	Copper Balancing	Copper Thieving
‌Core Objectives‌	Prevent physical deformation (warping, twisting)	Ensure plating uniformity (copper thickness, impedance consistency)
Application Layer‌	Inner layers only	Outer layers only
Added Elements‌	Non-conductive copper blocks (large-area fill)	Isolated copper geometries (dots, squares, etc.)
‌Key Risks‌	Lamination voids, thermal stress fractures	Over-etching (mushroom pads), impedance abrupt changes
‌Design Constraints‌ Requires	interlayer symmetric distribution	Must keep away from signal lines & impedance control areas

How to Achieve Copper Balancing in PCB?‌

Here are ways about how to achieve copper balancing in PCB:

1. Core Principles of Copper Balancing‌

Ensure symmetric copper distribution across PCB layers to prevent warping (max deviation <0.7% thickness)‌.
Maintain impedance consistency (±5% tolerance for high-frequency designs)‌.

2. Implementation Methods‌

Mirror Stack Design‌

Symmetrical copper coverage (top/bottom layers deviation <5%)‌.
Central layers (e.g., L3/L4 in 6-layer boards) should have thicker copper to distribute stress evenly‌.

Dynamic Plating Control‌

Pulse plating adjusts via copper thickness (40% uniformity improvement for blind vias)‌.
Monitor plating solution (60–80g/L Cu²⁺, 50℃±1℃)‌.

Copper Pour Optimization‌

Use grid copper (spacing λ/20) in non-routing areas to avoid resin flow issues‌.
Avoid sharp corners (radial edges minimize EMI)‌.

3. Quality Validation‌

Mechanical Test‌: Post-reflow warpage ≤0.3mm/m (288℃, 3 cycles)‌.
Electrical Test‌: 10GHz impedance variation ≤±2Ω‌.
Microscopic Analysis‌: Uniform copper grain size (≤5μm via SEM)‌.

4. Case Studies‌

HDI Board‌: BGA cracking due to 18% copper imbalance fixed by prepreg compensation (reduced to 3%)‌.
Aluminum Base PCB‌: Overheating resolved via stepped copper design (3oz in high-heat zones)‌.

5. Special Considerations‌

Thick Copper Boards (≥3oz)‌: Staged lamination (120℃/50PSI → 180℃/250PSI)‌.
Flexible PCBs‌: Low-temperature bonding (160–200℃) with flexible adhesives‌.

How to Achieve Copper Balancing in PCB?‌

Copper Balance PCB Design Guideline

1. Copper Thickness Selection

A 1oz (35μm) base copper thickness is preferred for standard boards. Power layers and high-current paths can be partially thickened to 2oz.
Multilayer boards require interlayer copper balance: the difference in copper foil area between adjacent layers should be ≤10% to prevent warping caused by thermal lamination.

2. Copper Foil Distribution Principle

Ground and power layers should use solid copper fill (Solid Pour) to reduce impedance and improve heat dissipation.
Signal layers should use grid copper fill (Grid Pour) to balance interlayer compressive stress.

3. Tracking Rules

Bend traces at 45° angles; avoid 90° right angles (to reduce reflections and space waste).
Critical signal trace widths should be ≥0.2mm. Power trace widths should be calculated based on current (Tool: PCB Trace-Width Calculator).
A 10% margin should be reserved for high-frequency signals to compensate for etching tolerances.

4. Via and Copper Connections

Annular rings on through-hole pads should be ≥0.15mm. Microvias should be ≥0.05mm.
Avoid unnecessary vias and prioritize blind and buried vias to optimize high-density routing.

5. Symmetrical Lamination Design

PCBs with four or more layers should use a symmetrical stackup (e.g., Top-GND-PWR-Bottom). The core board thickness tolerance should be ±10%.
The thicknesses of the copper and dielectric layers must match the coefficient of thermal expansion (CTE) to avoid delamination.

6. Heatsink Copper Area Treatment

Independent copper heatsinks should be provided beneath high-power devices to connect multiple vias to the internal ground plane.
Coordinate the opening ratios of the copper foil and solder mask to avoid localized overheating.

7. Design Checklist

Use Design for Manufacturing (DFM) tools to verify copper balance: inter-layer copper area ratio, minimum trace spacing, and aperture ratio.
Perform electrical rule checking (ERC) and design rule checking (DRC) before submitting process files.

8. Vendor Collaboration Requirements

Confirm the PCB manufacturer’s process capabilities (e.g., minimum trace width/maximum copper thickness) in advance.
Indicate special requirements (e.g., impedance control layer, ±10% copper thickness tolerance).

9. Design Document Annotation

Reference identifiers (R1/C2) should be placed away from densely populated areas to avoid obstruction.
Net names should be named according to their function (e.g., VCC_3V3, GND_DIGITAL).
Add a laminate diagram and indicate the copper thickness of each layer.

Copper Balance PCB Plating Uniformity Optimization Solution

‌Current Density Control‌

Forward pulse (100–200ms, 40–60A/dm²) + reverse pulse (5–10ms, 6–10A/dm²) reduces via-to-surface thickness ratio from 1:2.5 to 1:1.2, improving yield to 98.5%.
Adjust edge current density by 15–20% to minimize “edge effect” (edge plating thickness ≤ 1.8× center).

‌Plating Solution Improvement‌

Accelerator (4-amino-2-thiophene carboxylic acid, 40–60ppm) increases via-bottom deposition rate by 35%.
Leveler (heterocyclic quaternary ammonium salts, 20–30ppm) reduces surface copper growth by 50%.
Copper sulfate (60±5g/L), sulfuric acid (100±10g/L), temperature (50±1℃) reduces roughness (Ra) by 50%.

‌Equipment & Fixture Optimization‌

Optimize titanium basket positioning: Adjust bottom screen by 2mm reduces bottom thickness variation by 4%; adjust side screen by 20mm reduces CoV from 7.0% to 5.1%.
Use conformal anodes for complex boards, improving current distribution uniformity by 25%.

‌Spray System Calibration‌

Pressure gradient: 15–20% lower at edges reduces thickness variation by 35%.
Intermittent spray eliminates “bath effect,” improving uniformity by 40%.

‌Pre-Treatment & Process Control‌

Micro-etching (Ra 0.8μm) improves adhesion from 0.8N/cm to 1.5N/cm.
Strict degreasing (<0.5mg/cm² residue) reduces plating defects by 35%.

‌Real-Time Monitoring‌

Online bath composition control: Metal ion variation ±3%, additives ±5%.
Temperature control (50±0.5℃) improves uniformity by 15%.

‌Design Optimization‌

Copper distribution error ≤5% (≤8% for inner layers), reducing warpage by 30%.
Avoid isolated copper areas (<0.5mm²; fill or remove if necessary).

‌High-Density Zone Compensation‌

Differential pairs: +10% current reserve reduces impedance variation from ±15% to ±3%.
Laser vias (0.1mm) with pulse control: Height variation <0.2μm.

‌Quality Verification Standards‌

CoV (Coefficient of Variation): ≤10% (optimized to 5.1%).
Range method: ≥90% (requires high-end chemicals & rectifiers).

‌Reliability Testing‌

Thermal cycling (−55℃ to 125℃, 1000 cycles): No delamination; thick copper (≥3oz) improves bend strength by 150%.
Peel strength: Electrolytic copper ≥1.5N/mm, rolled copper ≥2.0N/mm.

Conclusion

To sum up, the above content is all about technical parameter, purpose, application, design guide and plating uniformity optimization solutions for copper balance PCB. If you have any other issues about copper balance PCB, please feel free to contact us: sales@bestpcbs.com. Looking forward to hearing from you soon!

Tags: copper balance PCB, copper balancing in PCB
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What is ICT Tester? In Circuit Test vs Flying Probe Testing

August 18th, 2025

Have you ever wondered why some electronic devices fail even when the PCB looks flawless? Or why high-volume production sometimes delivers inconsistent boards? These issues often trace back to undetected component defects, poor soldering, or faulty connections. Without proper testing, even a single defective part can lead to product failure, costly recalls, or customer dissatisfaction.

This is where an ICT tester equipment comes in. By performing in-circuit testing (ICT), manufacturers can quickly detect missing components, shorts, opens, and incorrect placements before the boards leave the production line. With the right ICT test electronics and in-circuit test fixtures, you gain fast, accurate, and reliable validation of each PCB, saving both time and money.

In this article, we’ll answer key questions such as:

What exactly is an ICT tester, and how does it work?
Why is ICT testing so critical for electronics manufacturing?
How does ICT differ from functional testing or flying probe testing?
When should you use ICT versus functional testing for your boards?

By understanding these points, you’ll see how ICT testing can prevent defects, improve production efficiency, and ensure reliable end products—turning potential headaches into controlled, predictable outcomes.

What is an ICT Tester?

An ICT tester is a system designed to perform in-circuit testing (ICT) on printed circuit boards after assembly. It is often recognized by its “bed-of-nails” fixture, which has hundreds or even thousands of pins arranged to contact specific points on the PCB. Each pin corresponds to a pad, via, or test point, allowing the tester to measure voltages, resistances, and currents at component level.

ICT testers can:

Detect missing, incorrect, or faulty components.
Identify open circuits, short circuits, and soldering defects.
Measure parameters such as resistance, capacitance, and diode orientation.
Verify integrated circuit placement and connectivity.

Because ICT is thorough and fast, it has become an industry-standard approach, especially in high-volume production lines.

Why is the ICT Test Important?

The ICT test is important for several reasons. In large-scale manufacturing, even a single defect can ripple into thousands of defective units. Detecting issues early reduces costs, avoids recalls, and protects brand reputation.

For example, in automotive electronics, where safety systems depend on flawless PCBs, ICT is crucial. An undetected fault in an airbag control system could have serious consequences. In consumer electronics, ICT prevents faulty smartphones, laptops, or home appliances from reaching the market.

The ICT test is also important for process improvement. It provides engineers with statistical data that highlights recurring problems, such as solder bridging or component misplacement. Manufacturers can use this data to refine processes, reduce defect rates, and improve yields.

What is the Purpose of the ICT Test?

The main purpose of ICT testing is to validate the quality and functionality of each component on the PCB. Unlike functional testing, which looks at the board’s overall behavior, ICT digs into details at component level.

ICT ensures that:

Every resistor has the correct value.
Capacitors and inductors are present and within tolerance.
Diodes and transistors are oriented properly.
Integrated circuits are placed in the right sockets and connected.

By catching defects at the source, ICT reduces the risk of failures at the product’s final stage. This is especially valuable in industries where long-term reliability is critical, such as aerospace, defense, and medical devices.

How Does an ICT Tester Work?

An ICT tester works by pressing the in-circuit test fixture against the PCB, making contact with the test pads or vias. Once contact is established, the system injects signals into the board and records the response.

Here’s a breakdown of the process:

Fixture Setup – The board is placed into a bed-of-nails fixture designed for its exact layout.
Signal Injection – Test probes inject electrical signals into various nodes of the circuit.
Measurement – The tester measures voltage, current, resistance, and capacitance at each point.
Analysis – Software compares the measured values with predefined thresholds.
Reporting – The system highlights any failures or deviations for quick troubleshooting.

ICT is highly automated, with a cycle time ranging from a few seconds to less than a minute. This makes it efficient for high-volume production, where time savings directly translate to lower manufacturing costs.

Advantages of ICT Testing

High Accuracy – Detects even subtle component defects.
Fast Cycle Time – Ideal for mass production.
Detailed Data – Provides insight into manufacturing trends.
Early Detection – Reduces rework and repair costs.
Reliability – Improves long-term performance of products.

What is the Difference Between Functional Testing and ICT Testing?

Both functional testing and ICT testing play important roles in quality assurance, but they target different aspects of the PCB.

ICT Testing – Focuses on component-level verification. It checks each resistor, capacitor, diode, transistor, and IC independently. ICT identifies defects like shorts, opens, wrong components, or poor solder joints.
Functional Testing – Evaluates the overall system behavior. It simulates real-world operating conditions, ensuring the PCB performs its intended function. Functional testing may involve powering up the device, running software, or checking communication protocols.

To put it simply: ICT looks at how the board is built, while functional testing checks how the board behaves. Both tests are complementary, and many manufacturers use them together.

Functional Testing vs ICT Testing

When to Use ICT and Functional Testing?

Choosing between ICT and functional testing depends on project goals and production stage.

Use ICT testing when:

Boards are still in the manufacturing phase.
Component-level accuracy needs to be validated.
High-volume production demands fast, repeatable results.

Use functional testing when:

The assembly is nearly complete.
The product’s performance under real operating conditions needs to be verified.
System-level testing is required, such as communication between multiple boards.

For best results, many manufacturers use a combination of ICT and functional testing. ICT catches early-stage defects, while functional testing provides final validation before shipment.

In-Circuit Test vs Flying Probe: What are Differences?

When comparing in-circuit testing (ICT) with flying probe testing, the differences come down to cost, speed, and flexibility.

In-Circuit Test (ICT):

Uses a custom in-circuit test fixture.
Offers fast cycle times (seconds).
Best for high-volume production.
High upfront cost for the fixture, but lower cost per test afterward.

Flying Probe Test:

Uses moving probes instead of a fixture.
Slower than ICT, since probes move sequentially.
Excellent for prototypes and low-volume runs.
No fixture cost, making it more flexible and cost-effective for small batches.

In practice, many manufacturers start with flying probe testing during prototyping. Once the design is finalized and volumes increase, they shift to ICT testing for efficiency.

In-Circuit Test vs Flying Probe

Applications of ICT Testing

ICT testing is used in a wide range of industries:

Automotive – For safety-critical systems like airbags, ABS, and engine control units.
Medical Devices – For life-support systems, imaging equipment, and diagnostic tools.
Aerospace and Defense – Where reliability under extreme conditions is non-negotiable.
Consumer Electronics – From smartphones to laptops, ensuring consistent quality.
Industrial Equipment – For automation controllers and power management systems.

In each of these cases, ICT contributes to higher reliability, lower failure rates, and better compliance with international standards.

Why Choose Best Technology for ICT and PCB Testing?

Best Technology is a reliable PCB manufacturer in China, trusted by more than 1,000 customers across industries worldwide. We specialize in small to medium-volume PCB manufacturing, PCB assembly, and complete electronic manufacturing services.

As one of the most experienced circuit board suppliers, our capabilities cover a wide range of PCB types, including rigid PCBs, flex PCBs, rigid-flex PCBs, aluminum PCBs, RF/microwave PCBs, high-speed and high-frequency PCBs, and HDI PCBs. Beyond manufacturing, we also provide turnkey assembly, component sourcing, box build assembly, PCBA testing, and full electronic testing services.

With over 19 years of experience, our engineering, production, and quality teams fully understand the unique needs of industries such as medical, automotive, and aerospace. We strictly follow international standards, working under IPC-A-600 for PCB manufacturing and IPC-A-610 for PCB assembly. All of our products meet IPC Class 2 standards, and for projects requiring higher reliability, we also deliver Class 3 or Class 3A compliance. Combined with strong engineering support and competitive pricing, we help customers achieve both reliability and cost-effectiveness.

FAQs

1. What does ICT stand for in electronics testing?

ICT stands for in-circuit testing, which validates the quality of individual PCB components.

2. Can ICT testing replace functional testing?

No. ICT and functional testing serve different purposes. ICT checks construction, while functional testing checks performance.

3. How long does an ICT test take?

Most ICT tests take only a few seconds, depending on the number of test points.

4. Is an in-circuit test fixture reusable?

Yes, but each fixture is custom-designed for a specific PCB layout.

5. Which is better: in-circuit test or flying probe?

ICT is best for high-volume runs due to speed. Flying probe is better for prototypes or small batches.

Tags: Ict test electronics, in circuit testing, In-circuit test fixture, PCB testing
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Better Quality EV Thick Copper Substrate, Thick Copper PCB

August 18th, 2025

An EV thick copper substrate is really important in the AVs, such as the application of battery management systems, on-board chargers, DC-DC converters, motor controllers, thermal management systems, and others. In this blog, we will discuss valuable information, including the structure, features, thickness standards, selection guide, and key applications of EV thick copper substrates, to ensure better performance in electric vehicles.

Have you run into these problems when working on the EV PCB projects?

The drilling process problems, such as the inner layer cracks, rough hole walls, and the damaged drilling bit problem?
The thermal management challenges, such as the difference in thermal expansion coefficient, may cause solder joint fatigue and affect the equipment’s lifespan.
The design and the manufacturing complex?
The shortage of reliability evaluation?

Best Technology provides innovative solutions for tackling the above issues.

Optimize the drilling process and material selection: use the special drilling parameter and optimize the drilling bit to reduce the problem of inner layer cracks and the rough hold walls problem. Finally, improve the manufacturing efficiency and the product quality.
Optimize the thermal management and the material selection: employ the high thermal material and the thermal management design to improve the thermal expansion efficiency.
Control process and the quality: Make use of laser thickness measurement, dynamic compensation systems, and the full process parameter traceability to ensure the precision of the copper thickness control and the product quality.
Make the reliability evaluation and the accelerated inspection.

EV thick copper substrate plays a vital role in the electric vehicle sector. If you have any more technical questions or any inquiries, just feel free to contact Best Technology via sales@bestpcbs.com. Best Technology has specialized in thick copper PCB prototype, manufacturing, assembly, and box build service for over 19 years. Looking forward to hearing from you!

Better Quality EV Thick Copper Substrate, Thick Copper PCB

What is EV Thick Copper Substrate?

An EV thick copper substrate is a printed circuit base material built with extra layers of copper. Generally, the copper thickness of the common PCB ranges from 1 OZ to 3 OZ, however, in the EV, the copper thickness can be up to 6 OZ to even 20 OZ. This thicker copper layer can manage the high current without being damaged, to reduce the energy loss, and improve the safety margins. In essence, the EV thick copper substrate is the core of the EV power management.

What are Features of Copper Substrate PCB?

A copper substrate PCB is recognized for its outstanding thermal conductivity. The heat can be conducted quickly, and protect the sensitive chips. It also has remarkable current-carrying ability, which is a core need for EV power modules. Besides, its mechanical strength is higher than the common FR4 as well. The designers commonly select this copper substrate PCB when facing the high reliability requirements. The EV system’s lifespan will be extended by using this PCB.

What is the Composition of EV Thick Copper Substrate?

EV thick copper substrate is made of three layers, including heavy copper foil, insulation dielectric, and the substrate, such as aluminum or FR4. The copper layer decides the current loading capability. And the insulation dielectric is responsible for the insulation and the thermal dissipation. The substrate provides the stability, however. To some designs, there will increase in the protected coating to improve the corrosion resistant. It is good to know that each layer is vital to the stable performance in the hard EV environment.

What are the Types of EV Thick Copper Substrate?

EV thick copper substrates come in several types:

As per structure:

Single-sided thick copper PCB – for simple, high-current circuits.

Double-sided thick copper PCB – when routing density increases.

Multilayer thick copper PCB – designed for advanced EV powertrain and battery management systems.

As per the material compound:

The hybrid copper substrate – Combining copper and aluminum to boost the heat dissipation performance.

Ceramic substrate (DBC/AMB) – It is bonded by combining DBC and Al₂O₃/AlN ceramic, suitable for high-temperature and high-power applications.

Different type meets different project needs. Choose the suitable one as per the design complexity, electrical press grade, and the durability requirements.

How Much Thick Copper PCB in an EV?

In an electric vehicle, thick copper PCBs are used in several areas. For example, the battery module, automobile charger, and DC-DC converter. The amount varies by vehicle model. High-performance EV in the power control unit and motor drive modules will use the thicker copper PCBs. The lighting system, when dealing with the current surges, will get its benefits as well. Generally, multiple thick copper PCBs are present throughout the EV system.

How Thick Should EV Thick Copper Substrate Be?

The required EV thick copper substrate thickness depends on the specification designed. The common range is from 4 OZ to 12 OZ. High power applications, such as main inverters, may require 15 OZ or even higher. The engineers will decide according to the current needs, heat output, and the space limit. A reasonable copper thickness can get a balance between efficiency and cost. Since the thinner will get the risk of over heating, but the thicker will increase the costs.

PCB Copper Thickness Chart

The following is the simplified PCB copper thickness chart:

Copper Weight (OZ)	Thickness (µm)	Common Application
1 OZ	35 µm	Low-current signal circuits
3 OZ	105 µm	Medium power modules
6 OZ	210 µm	Battery controllers, power relays
10 OZ	350 µm	EV inverters, motor drivers
15+ OZ	525 µm+	Heavy-duty EV systems

This chart helps engineers select the suitable copper thickness according to the current and the heat dissipation needs. It provides a clear reference during the stage of selecting substrate types.

How to Select EV Thick Copper Substrate for the Project?

When selecting an EV thick copper substrate, several factors come into play:

Required copper thickness based on current load.
Thermal conductivity to manage hot spots.
Mechanical strength for vibration resistance.
Cost efficiency and guarantee the safety in the meantime.

It needs to consider the space limit inside the EV part when designing. Best Technology helps customers balance all these concerns. Customers often meet the pain point, such as over-heating boards and the traceability difficulty. Our MES system addresses this by tracking every stage of production. We also control the copper-plated uniformity strictly, so as to reduce the failure risks. Then customers don’t need to bear the extra cost for the rework.

What are the Specific Applications for EV Thick Copper Substrate?

Thick copper PCB is widely used in EVs, mainly including:

BMS: Solving the high current charging and discharging.

Main Inverter: Provide controlled power to the driving motor.

Automobile Charger: Ensure safety during charging.

Heat Management System: Keep the battery within the safe temperature ranges.

These applications have extremely high requirements for the substrate strength, durability, and precision. Using EV thick copper substrate, the EV manufacturers can get higher efficiency, more better safety, and more longer lifespan of the components.

Case about EV Thick Copper Substrate

Best Technology has valuable experience in the EV Thick Copper Substrate PCB cases. Here are some parameters of the thick copper PCB that our customers used in some of their projects. You can take it as a reference. If any help is needed, please feel free to let us know, and we will provide the specific boards and solutions according to your project requirements.

Extra Heavy Copper (14L 5.588mm+/-10% ≥5 OZ) FR4 PCB Parameters

Layers: 14 layers heavy copper PCB
Inside and outside copper are different, over 5OZ
Board Thickness: 5.588mm+/-10%
Surface Treatment: ENIG
Solder Mask: Green oi

14 Layers heavy copper PCB Parameters

Layers: 14 Layers heavy copper PCB
Materials: Tg170
board thickness: 6.9mm+/-10%,
4oz copper at each layer
Surface Treatment: Immersion gold (Au 2u”)
Solder Mask: Green solder mask, white silk screen.
Application: High power supply

8L Heavy Copper PCB Parameters

Materials: Tg170
Board Thickness: 2.55mm+/-10%,
4oz copper at each layer
Surface Treatment: Immersion Gold (Au 2u”)
Solder Mask: Red solder mask, white silk screen.
Application: High Power Supply

To sum up, the EV thick copper substrate is the core of EV safety, high efficiency, and powerful operation. It is not only a circuit material. EV gains a competitive edge in durability and performance through selecting the suitable copper thickness and the substrate designs. Best Technology has our own PCB factory, fully compliant with ISO 9001, ISO 13485, IATF 16949, AS9100D, UL, REACH, and RoHS standards. If you need a reliable manufacturer for a viable solution, just feel free to contact us via sales@bestpcbs.com.

Tags: EV Thick Copper Substrate
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