Multi-Layer SinkPAD Board

March 31st, 2026

What Is a Multi-Layer SinkPAD Board?

A multi-layer SinkPAD board is a metal core PCB with more than two copper trace layers and a direct thermal path structure. The metal core is usually copper, and the thermal pad of the LED or power device is placed directly on the copper pedestal or copper core area. This allows heat to transfer quickly away from the component while the electrical circuits remain isolated through the dielectric layer.

Compared with a 1 layer SinkPAD board or a 2 layer SinkPAD board, the multi-layer version offers more routing space for complex circuits. The additional trace layers can be built on a single side or distributed on both sides of the board, depending on the product design.

Because of this structure, multi-layer SinkPAD boards combine two important functions in one compact platform: high-density circuit routing and efficient heat dissipation.

Multi-Layer SinkPAD Board

How Does a Multi-Layer SinkPAD Board Work?

The working principle of a multi-layer SinkPAD board is based on thermoelectric separation. The electrical current travels through the copper circuit layers, while the heat generated by the LED or semiconductor is transferred directly into the copper base through the thermal pad.

Since copper has very high thermal conductivity, around 400 W/m.K, heat can spread rapidly from the source to the metal base, and then into a heatsink, mounting surface, or surrounding air. This direct thermal path reduces thermal resistance and helps maintain lower operating temperatures.

At the same time, the extra routing layers allow engineers to build more sophisticated circuits in the same board area. This is useful when a product requires denser interconnections, control circuits, or more compact mechanical dimensions.

What Is the Difference Between Standard MCPCB and Multi-Layer SinkPAD Board?

A standard metal core PCB usually includes a dielectric layer between the heat source and the metal base. This provides insulation, but it also adds thermal resistance. In contrast, a multi-layer SinkPAD board uses a direct thermal path design, where the thermal pad of the LED or power device touches the copper core directly.

This difference offers several performance advantages:

Lower thermal resistance
Faster heat transfer
Better thermal stability for high-power devices
Higher routing density than basic SinkPAD boards
More flexibility for compact and complex circuit design

For designs that require both thermal efficiency and advanced routing capability, a multi-layer SinkPAD board is often a stronger choice than a conventional MCPCB.

Common Structures of Multi-Layer SinkPAD Board

4 Layer SinkPAD Board on the Same Side

One common structure is the 4 layer SinkPAD board with four trace layers built on the same side of the copper base. This design allows engineers to place more traces in the same board size and create more complex layouts than with a 1 layer or 2 layer SinkPAD board.

This structure is useful when the design needs strong thermal performance but also requires increased circuit density on one side.

Common Structures of Multi-Layer SinkPAD Board

Double-Sided 4 Layer SinkPAD Board

Another option is the double-sided 4 layer SinkPAD board, where two trace layers are placed on the top side and two trace layers are placed on the bottom side. This structure increases usable routing area and supports more advanced product architectures.

However, this type of board is more difficult to design and manufacture. Since components may be mounted on both sides, engineers must carefully consider how heat will be transferred to the heatsink.

Design Considerations for Double-Sided Multi-Layer SinkPAD Board

A double-sided multi-layer SinkPAD board does not use plated through holes in the same way as traditional multi-layer metal core PCBs. This is due to process limitations in SinkPAD manufacturing. That also means the routing strategy, layer transition plan, and thermal structure need to be considered very carefully during design.

When engineers choose this structure, they usually need to evaluate:

Where the heatsink will be located
How heat will leave the copper base efficiently
Whether components on both sides will affect thermal transfer
How to maintain electrical routing without plated through holes
Whether the added layout complexity is justified by the application

Because of these design challenges, multi-layer SinkPAD boards are generally used only when simpler SinkPAD structures cannot meet the routing needs of the product.

Multi-Layer SinkPAD Board Applications

Multi-layer SinkPAD boards are mainly used in products that combine high heat generation with more complex circuit requirements.

Typical applications include:

High power LED modules up to 200W
High-power semiconductor devices
Power transistor circuits
Thyristor and diode modules
High-power resistor applications
Compact thermal management systems
Advanced lighting products with dense layout design

These boards are especially useful when product designers need to control heat effectively without giving up routing flexibility.

Multi-Layer SinkPAD Board Capability

Item	Capability
Base Material	Copper
Copper Base Thickness	1.2mm, 1.4mm, 1.5mm, 1.6mm
Thermal Conductivity	400 W/m.K
Board Thickness	1.6mm to 2.0mm
Copper Thickness	0.5 oz, 1 oz, 2 oz, 3 oz
Outline Processing	Routing, Punching, V-Cut
Solder Mask Color	White, Black, Blue, Green, Red
Silkscreen Color	Black, White, Yellow
Surface Finish	Immersion Gold, ENEPIG, Immersion Tin, OSP
Max Panel Size	600 x 500mm
Packing	Vacuum packing, plastic bag
Sample Lead Time	3 to 4 weeks
Mass Production Lead Time	4 to 6 weeks

Why Choose a Multi-Layer SinkPAD Board?

A multi-layer SinkPAD board is a strong option when your product needs more than basic thermal management. It gives engineers more routing freedom while still preserving the direct thermal path needed for high-power components.

Compared with simpler SinkPAD structures, it supports more advanced circuit layouts. Compared with ordinary metal core PCB designs, it provides a more efficient thermal path. This makes it a practical solution for applications where both electrical complexity and thermal performance are important.

If your design requires compact size, high heat dissipation, and more circuit layers in the same board area, a multi-layer SinkPAD board can deliver clear advantages.

Tags: copper base sinkpad board, direct thermal path pcb, multi-layer copper base pcb, Multi-Layer SinkPAD Board, multilayer sinkpad pcb, sinkpad board for high power led
Posted in Metal Core PCB | No Comments »

2 Layer SinkPAD Board

March 24th, 2026

A 2 Layer SinkPAD board is a copper-based PCB structure designed for applications that need both strong thermal performance and more routing space on a compact layout. It features two circuit layers built on the same side of the board, combined with a dielectric insulation layer and a copper core or raised copper pedestal.

Unlike conventional metal core PCBs, the thermal pad of the LED in a 2 Layer SinkPAD board is placed directly on the copper core. This creates a direct thermal path, allowing heat to move away from the LED much faster. Because of this structure, the board is widely used in thermoelectric separation designs where electrical routing and thermal transfer need to be handled independently.

What Is a 2 Layer SinkPAD Board?

A 2 Layer SinkPAD board is a single-sided direct thermal path PCB with two copper trace layers arranged on the same side. Although it contains two routing layers, it is still considered a single-sided SinkPAD PCB because both circuit layers are located on the top side of the board.

The main advantage of this construction is that it combines electrical isolation with direct heat conduction. The circuit traces remain electrically insulated through the dielectric layer, while the LED thermal pad contacts the copper base directly.

Compared with a 1 Layer SinkPAD board, the 2-layer version supports more complex circuit routing on the same board size. That makes it a practical choice for compact, high-power lighting designs where both thermal control and circuit density matter.

2 Layer SinkPAD Board

How Does a 2 Layer SinkPAD Board Work?

The board works by separating the electrical path from the thermal path. Electrical signals move through the copper trace layers, while heat generated by the LED or power device is transferred directly into the copper core.

Since copper has very high thermal conductivity, around 400 W/m.K, heat can spread quickly from the hot spot to the base metal. From there, it can be transferred to a heatsink, mounting surface, or surrounding air. The direct contact design improves thermal efficiency far beyond what is possible with standard MCPCB structures. As a result, the LED junction temperature can be controlled more effectively.

Why Choose a 2 Layer SinkPAD Board Instead of a Standard MCPCB?

A standard metal core PCB usually includes a dielectric layer between the heat source and the metal base. That structure provides insulation, but it also adds thermal resistance. In a 2 Layer SinkPAD board, the thermal pad touches the copper pedestal directly, so heat does not need to pass through the dielectric in the same way.

This creates several practical benefits:

Lower thermal resistance
Better heat dissipation for high-power LEDs
More stable light output
Longer service life of the lamp
Higher routing density on the same board area
Better support for compact and advanced circuit design

For engineers working on high-power lighting modules, automotive lighting, or dense LED arrays, this structure offers a more efficient thermal solution without sacrificing design flexibility.

Advantages of Using 2 layers SinkPAD Board

The metal core is Copper with high density, strong thermal carrying capacity and higher thermal conductivity. So the volume can be smaller under the same power.
It adopts the thermoelectric separation structure, the Lumens depreciation of the LED is minimized, and the life of the lamp is prolonged.
Suitable for matching single high-power lamp, such as Cree XPL, XML, XHP; Osram LED, etc., also COB package LED
High power semiconductors (transistors, thyristors, diodes) as well as resistors.
A variety of Surface Finishing are available according to different demands. (ENIG, OSP, Immersion Tin, ENEPIG, HAL) with excellent reliability of the surface treatment layer.
Different structures can be made according to different design needs of LED. (Such as copper bump, copper concave block)
Put more circuits on the same side, design more complicated circuit board.

Typical Applications of 2 Layer SinkPAD Board

A 2 Layer SinkPAD board is commonly used in products that require both strong thermal conductivity and compact circuit design.

Typical applications include:

High power LED modules up to 200W
COB LED lighting
Single high-power LEDs such as Cree XPL, XML, XHP, and Osram LEDs
Automotive lighting systems
Industrial lighting equipment
Power semiconductor modules
High-power resistor circuits
Thermoelectric separation applications

Because of its copper direct thermal path structure, this board is especially useful in lighting products where heat buildup directly affects brightness consistency and service life.

2 Layer SinkPAD Board Stack-Up

The typical stack-up of a 2 Layer SinkPAD board includes:

Two copper circuit trace layers on the same side
Dielectric insulation layer
Copper core or copper pedestal
Direct thermal contact area under the LED thermal pad

This stack-up is designed to achieve both electrical isolation and rapid heat transfer. It is one of the main reasons this board performs much better than ordinary aluminum PCB or traditional MCPCB in high thermal load applications.

Our 2 Layer SinkPAD Board Capability

Item	Capability
Base Material	Copper
Copper Base Thickness	0.8mm, 1.0mm, 1.2mm, 1.4mm, 1.5mm
Thermal Conductivity	400 W/m.K
Board Thickness	1.0mm to 2.0mm
Copper Thickness	0.5 oz, 1 oz, 2 oz, special 3 to 10 oz
Outline Processing	Routing, Punching, V-Cut
Solder Mask Color	White, Black, Blue, Green, Red
Silkscreen Color	Black, White, Yellow
Surface Finish	Immersion Gold, ENEPIG, Immersion Tin, OSP
Max Panel Size	600 x 500mm
Packing	Vacuum packing, plastic bag
Sample Lead Time	1.5 to 2 weeks
Mass Production Lead Time	2 to 3 weeks

Why Is 2 Layer SinkPAD Board a Good Choice for High-Power LED Design?

In high-power LED products, heat is often the main factor that limits performance. Excessive temperature can reduce brightness, accelerate lumen depreciation, and shorten product lifespan. A 2 Layer SinkPAD board helps solve this issue by allowing heat to move directly into the copper base without unnecessary thermal barriers.

At the same time, the two-layer trace design gives more room for routing, which is useful when the LED module includes more complex circuitry. It is especially suitable for high-power LED modules, COB lighting, and power semiconductor applications where thermal performance directly affects reliability and lifespan. For projects that need both strong heat dissipation and more circuit freedom, a 2 Layer SinkPAD board is a highly effective choice.

FAQs about 2 Layer SinkPad MCPCB

1. What is a 2 Layer SinkPAD Board?

A 2 Layer SinkPAD Board is a high-power Metal Core PCB (MCPCB) that features two copper circuit layers on one side of a metal base. Unlike standard 2-layer MCPCBs where a dielectric layer separates all components from the metal core, the SinkPAD design “sinks” the thermal pad of a component through the dielectric, creating a Direct Thermal Path (DTP) to the copper or aluminum base.

2. How does a 2 Layer SinkPAD differ from a Single Layer SinkPAD?

While a single-layer SinkPAD only allows for simple circuit routing, a 2 Layer SinkPAD provides an additional copper layer for complex circuit design. This allows for more sophisticated power management, signal routing, or the placement of control components on the same board as high-power LEDs or transistors, all while maintaining the ultra-low thermal resistance of a direct-to-metal connection.

3. What are the thermal conductivity benefits of a 2 Layer SinkPAD?

Because the thermal pad of the component bypasses the 1–8 W/m·K dielectric layer and sits directly on the metal core, the effective thermal conductivity can reach 400 W/m·K (using a copper base). This is significantly higher than a standard 2-layer MCPCB, which is limited by the thermal resistance of the thin prepreg or dielectric layer required for circuit isolation.

4. Can I use Plated Through Vias (PTH) on a 2 Layer SinkPAD Board?

Yes, 2 Layer SinkPAD boards support inter-layer vias to connect the two copper circuit layers. However, these vias are typically used for electrical signals or low-power traces. The primary heat dissipation is still handled by the pedestal (the “SinkPAD”) that connects the high-power component’s thermal pad directly to the metal substrate, rather than relying on thermal vias.

5. When should I choose a 2 Layer SinkPAD over a standard FR4 with thermal vias?

You should choose a 2 Layer SinkPAD when your components generate heat that exceeds the capacity of FR4 (typically >3W per LED). While FR4 with thermal vias is cheaper, it cannot match the thermoelectric separation efficiency of a SinkPAD. If your application involves high-density power electronics where space is limited and active cooling is not an option, the 2-layer SinkPAD is the superior choice for reliability.

6. How does a 2 Layer SinkPAD differ from a Double-Sided SinkPAD PCB?

The primary difference lies in the circuit density versus mounting capability.

2 Layer SinkPAD: Features two copper circuit layers (Top & Bottom) on one side of the metal base. It is designed for complex circuitry that requires more routing space or inter-layer connections (vias) while still maintaining a Direct Thermal Path (DTP) for high-power components on the top side.
Double-Sided SinkPAD: Features circuit layers and component mounting pads on both sides of the metal core (Top and Bottom). This allows you to mount high-power components, like LEDs or transistors, on both surfaces of the board, with each side utilizing the central metal core for heat dissipation.

Tags: 2 layer copper base pcb, 2 layer sinkpad pcb, copper base sinkpad board, direct thermal path pcb, sinkpad board for high power led, sinkpad pcb manufacturer
Posted in Metal Core PCB | No Comments »

Double Sided SinkPAD Board

March 24th, 2026

What Double Sided SinkPAD Board is?

The Double sided SinkPAD board consists of at least two layers of trace circuit, and there’re at least one circuit layer on both top and bottom side of board, a dielectric (non-conducting) layer, a metal core/pedestal which normally is copper.

As there’re circuit layer on both sides, so engineer can put more (about 2 times, ideally) components on the same size circuit to realize more function, more complicated design, comparing to 1 Layer SinkPAD board or 2 layers SinkPAD board.

Double Sided SinkPAD Board

There’s no PTH (plated through hole) on double sided SinkPAD board, because the limitation of manufacturing process, which different from double sided Metal Core PCB which has a lot of PTH, and thermal PAD of LED will be put directly on copper core, also belonging to Direct Thermal Path (DTP) board too, but engineer needs to consider where the heat sink will be if he want more fast heat transferring, as there’re always components on both sides, and that make double sides SinkPAD board designing becoming more difficult & complex comparing to 1L SinkPAD board, or 2L SinkPAD board.

Stack up of Double Sided SinkPAD Board

Advantages of Utilizing Double Sided SinkPAD Board:

Put more components on the both top and bottom, design more complicated circuit board.
It adopts the thermoelectric separation structure, the Lumens depreciation of the LED is minimized, and the life of the lamp is prolonged.
Suitable for matching single high-power lamp, such as Cree XPL, XML, XHP; Osram LED, etc., also COB package LED
High power semiconductors (transistors, thyristors, diodes) as well as resistors.
A variety of Surface Finishing are available according to different demands. (ENIG, OSP, Immersion Tin, ENEPIG, HAL) with excellent reliability of the surface treatment layer.

Application of Double Sided SinkPAD Board

High Power LED (up to 200W).
High semiconductors (transistors, thyristors, diodes) as well as resistors.

2 Layer SinkaPAD Board Capability

Base material: Copper: 0.8mm, 1.0mm, 1.2mm, 1.4mm, 1.5mm
Thermal Conductivity: 400 W/m.K.
Board Thickness: 1.0mm~2.0 mm (0.04″~0.08″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ (specially 3-10 OZ)
Outline: Routing, punching, V-Cut
Soldermask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White/Yellow
Surface finishing: Immersion Gold, ENEPIG, Immersion Tin, OSP
Max Panel size: 600*500mm(23.62″*19.68″)
Packing: Vacuum/Plastic bag
Samples L/T: 1.5~2 weeks
MP L/T: 2-3 weeks

Click here to see the manufacturing process of double sided SinkPAD Board and other options.

If you want to customize double sided SinkPAD board, please contact EBest Circuit (Best Technology) today send your request for double sides SinkPAD PCB.

FAQs about Double-Sided SinkPAD Boards

1. What is a Double-Sided SinkPAD Board and how does it work?

A Double-Sided SinkPAD Board is a specialized Metal Core PCB (MCPCB) that provides a Direct Thermal Path (DTP) on both sides of the board. Unlike standard MCPCBs that use a dielectric layer to separate the circuit from the metal base, SinkPAD technology removes the dielectric under the component’s thermal pad. This allows the component (like a high-power LED) to sit directly on the copper or aluminum core, drastically reducing thermal resistance.

2. How does a Double-Sided SinkPAD differ from a standard Double-Sided MCPCB?

The primary difference is the thermal conductivity. In a standard double-sided MCPCB, heat must travel through a thermally conductive dielectric layer (typically 1–8 W/m·K) to reach the metal core. In a SinkPAD board, the dielectric is bypassed entirely for the thermal pad, allowing for conductivity ratings as high as 400 W/m·K (if using a copper core). Additionally, double-sided SinkPADs allow for higher component density by utilizing both the top and bottom layers for active circuitry.

3. Why would I choose a double-sided design over a single-layer SinkPAD?

Engineers choose double-sided SinkPADs when they need to maximize functional density in compact spaces. It allows for roughly twice the component population or more complex circuit routing compared to a 1-layer board. This is ideal for high-power applications where you need to mount LEDs or transistors on one side while placing control circuitry, connectors, or additional power components on the other.

4. Are there limitations to the Plated Through Holes (PTH) in double-sided SinkPADs?

Yes. Due to the unique manufacturing process where the metal core is “sunk” or embossed to meet the trace layer, standard Plated Through Holes (PTH) are often limited or more complex to implement than in traditional FR4 boards. Connections between sides are typically handled through specialized routing or assembly techniques, so it is crucial to consult with your manufacturer during the design phase to ensure the layout is compatible with the “thermoelectric separation” structure.

5. Which base material is better for SinkPAD boards: Aluminum or Copper?

Copper: Best for ultra-high-power applications. It offers superior thermal conductivity (approx. 400 W/m·K) and is the most common choice for SinkPAD convexity because it is easier to etch and process for this specific technology.
Aluminum: More cost-effective and lighter. While it has good thermal properties, the chemical process for creating the SinkPAD convexity is more complex, often making it more expensive or difficult to produce than copper-based SinkPADs.

6. Can SinkPAD technology be used for components other than LEDs?

Absolutely. While most commonly used for high-power LEDs (Cree, Osram, etc.) to prevent lumen depreciation, SinkPAD boards are excellent for any high-power semiconductor that features an electrically neutral thermal pad. This includes power transistors, thyristors, diodes, and high-wattage resistors used in automotive, aerospace, or industrial power monitoring.

Tags: double sided sinkpad pcb, ims pcb, sinkpad mcpcb, sinkpad metal core pcb, sinkpad pcb
Posted in Metal Core PCB | No Comments »

Multi Layer Metal Core PCB

March 24th, 2026

Just like FR4 PCB, we can also make boards with more than 2 layers of traces and we named it “Multi Layers MCPCB“. The structure is similar with FR4 Multi Layers, but it much more complex to make.

You can populated more components on the boards, put signal and ground layer into seperated layers, to achieve better performance in electrical performance.

Compared with normal FR4, this sturcture need more technology and experience on laminating of more than two layers together with metal core and the cost is much higher than 2 layers MCPCB or double sided MCPCB.

Structure of Multi Layers MCPCB

Capability of Multi Layers MCPCB

Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectrial layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.8mm~3.0mm(0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
Outline: Routing, punching, V-Cut
Soldermask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 600*500mm(23.62″*19.68″)
Packing: Vacuum/Plastic bag
Samples L/T: 15~18 Days
MP L/T: 15~20 Days

FAQs

1. What is a multi-layer MCPCB and how does it differ from standard FR4?

A multi-layer MCPCB consists of multiple copper conductive layers separated by high-thermal-conductivity dielectric layers, all bonded to a metal base (usually Aluminum or Copper). Unlike standard FR4, which relies on the epoxy glass substrate for structure, an MCPCB uses the metal base as a heat sink. While FR4 is an insulator with poor thermal management, the metal core in an MCPCB allows for heat dissipation rates that are significantly higher, making it essential for high-power electronics.

2. What are the typical thermal conductivity levels for multi-layer MCPCBs?

The thermal performance of a multi-layer MCPCB is primarily determined by the dielectric layer rather than the metal base itself. Standard dielectric materials offer conductivity between 1.0 W/mK and 3.0 W/mK. However, high-performance multi-layer stacks used in automotive or aerospace applications can reach 4.0 W/mK to 8.0 W/mK. Choosing the right dielectric is a balance between thermal efficiency and the breakdown voltage required for the circuit.

3. How many layers can be integrated into a Metal Core PCB?

Technically, “multi-layer” in the context of MCPCBs typically refers to 2-layer or 4-layer configurations. While it is possible to go higher, the complexity increases significantly because all heat must eventually pass through the dielectric layers to reach the metal base. In a 4-layer stack, the inner layers are further from the heat sink, which can lead to thermal bottlenecks if the design does not utilize thermal vias effectively.

4. Can you use plated through-holes (PTH) in a multi-layer MCPCB?

Yes, but the process is more complex than with standard PCBs. To prevent short-circuiting the signals to the metal core, the metal base must be pre-drilled and filled with an epoxy resin before the copper layers are laminated. Then, a smaller hole is drilled through the resin plug and plated. This creates an “insulated via” that allows signals to pass through the metal core safely.

5. What are the main applications for multi-layer MCPCB designs?

Multi-layer MCPCBs are the go-to solution when space is limited but power density is high. Common applications include:

Automotive: LED headlight systems and power converters (EV/HEV).
Power Supplies: High-voltage regulators and heavy-duty industrial rectifiers.
Aerospace: Power distribution units where weight and heat must be managed simultaneously.
Medical: High-intensity surgical lighting and imaging equipment.

6. What are the manufacturing challenges of multi-layer MCPCBs?

The primary challenge is coefficient of thermal expansion (CTE) mismatch. Metal bases (Aluminum/Copper) expand at different rates than the copper traces and dielectric during the lamination process. This can lead to delamination or bowing of the board. Precise control over the pressing cycle and the use of specialized “no-flow” or “low-flow” prepregs are required to ensure the structural integrity of the multi-layer stack.

Tags: multi layer mcpcb, multi layer metal core pcb, multi-layer mcpcb
Posted in Metal Core PCB | No Comments »

Double Sided Metal Core PCB

March 20th, 2026

A double sided metal core PCB also has same two layers of copper conductor like Double layers MCPCB, but the metal core is in the middle of two conductor, so there’re conductors (trace) on both sides of metal core, and were connected to each other by Vias. So we named it “Double sided MCPCB”, and you can populated SMD on both top and bottom.

Different with Single layer MCPCB, double sided MCPCB also requires an additional pressing step to laminate the imaged thermal conductive laminate and metal core (also known as metal base) together. But sometimes, some raw Metal Clad material vendor will supply board material which already laminated.

Compared with normal FR4, this structure need more technology and experience on laminating of two layers together with metal core.

Structure of Double Sided MCPCB

Capability of Double Sided MCPCB

Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectric layer): 0.8, 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.5mm~3.0mm (0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, 4.0 OZ, 5.0 OZ
Outline: Routing, punching, V-Cut
Solder mask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 600*500mm (23.62″*19.68″)
Packing: Vacuum/Plastic bag
Samples L/T: 10~15 Days
MP L/T: 12~15 Days

FAQs about Double sided Metal Core PCB

1. What is a double-sided metal core PCB?

A double-sided MCPCB consists of two circuit layers (top and bottom) with a metal core—typically aluminum or copper—sandwiched in the middle. Unlike standard FR4 boards, the metal core acts as a high-efficiency heat sink. The layers are connected using insulated through-holes or thermal vias to ensure electrical signals pass through without shorting against the metal base.

2. How does a double-sided MCPCB differ from a single-sided one?

The primary difference lies in component density and routing complexity.

Single-Sided: Components are on one side; the metal base is on the back. It is simpler and cheaper but limited in space.
Double-Sided: Allows for components and traces on both sides of the metal core. This is necessary for complex designs where high power density requires cooling for components on both surfaces of the board.

3. What materials are used for the core in double-sided PCBs?

The three most common materials are:

Aluminum (6061 or 5052): The most cost-effective and popular choice, offering good thermal conductivity and mechanical stability.
Copper: Offers superior thermal conductivity (nearly double that of aluminum) but is significantly heavier and more expensive.
Stainless Steel: Used primarily for its mechanical strength and corrosion resistance, though its thermal performance is lower than aluminum.

4. Why are double-sided MCPCBs used instead of standard FR4?

Standard FR4 is a poor thermal conductor. In high-power applications, heat builds up and can cause component failure. Double-sided MCPCBs are used because the metal core can dissipate heat at rates of 1.0 W/mK to 9.0 W/mK (or higher), whereas FR4 typically manages only 0.25 W/mK. This allows for smaller form factors without overheating.

5. What are the main applications for double-sided metal core PCBs?

These boards are a staple in industries where heat management is critical:

Automotive: LED headlights, power converters, and motor control modules.
Lighting: High-output street lights and industrial floodlights.
Power Electronics: Solid-state relays, rectifiers, and high-capacity power supplies.
Telecommunications: Signal amplifiers and high-frequency filtering equipment.

6. What are the manufacturing challenges of double-sided MCPCBs?

The most significant challenge is the drilling and insulation process. Because the core is conductive metal, every through-hole must be pre-drilled, filled with a specialized dielectric resin, and then re-drilled to prevent the copper pins from touching the metal core. This requires high precision and specialized lamination techniques to ensure the board does not delaminate under thermal stress.

Tags: doubld sided metal core pcb, Double Sided MCPCB, MCPCB Manufacturer
Posted in Metal Core PCB, PCB Manufacturer | No Comments »

COB MCPCB

March 20th, 2026

What is Chip On Board COB MCPCB?

COB MCPCB, known as “Chip-On-Board” Metal Core PCB, is a type of MCPCB used in thermoelectric separation application. By using COB MCPCB, the micro-chip (also known as “die”) directly touch the metal core where the heat dissipate, and electrically interconnect the trace of circuit board (wire-bonding) so that power supply can be provided.

In normal MCPCB, there’s a dielectric layer between trace copper and metal core, and the thermal conductivity is limited by that dielectric layers, so value can only be 1~3 W/m.K. But using COB MCPCB, there’s no such dielectric layer because chip (die) direct touch the metal core, so thermal conductivity value of COB MCPCB will be almost the same one of metal core material itself. The normal material of metal core is aluminum, so thermal conduviity of COB MCPCB is more than 200W/m.K.

COB MCPCB (Chip on Board)

What are the COB Wire Bonding Processes?

COB process consists of three main categories to perform when manufacturing the Chip-on-Board:

1st: die mount or die attach;

2nd: wire bonding;

3rd: the encapsulation of die wires.

By using wire bonding & epoxy packaging then directly embedded on MCPCB, this practice can extend the lifespan of LED and unified light emission.

According to process and material, COB MCPCB applications can be categorized into two types: Mirror Aluminum and silver or gold platting aluminum, or silver plating mirror aluminum PCB.

Structure of COB MCPCB

Advantage of utilizing COB MCPCB

Excellent heat dissipation
High thermal conductivity: 137W/m.K
Higher reliability with better heat dispatch and small number of solder joint.
Provide enhanced reliability and lifespan of LED
Easy assembly for high powers LEDs
High quality material and production process allows easy assembly and substantial reduce the error percentage in assembly process
Substantially reduced space and cost
With better security protection (difficult to hack using reverse engineering)
Shorter time to the market

Application of COB MCPCB

High Power LED (up to 200W)
LED Backlight for LED TV
LED Front Light for E-Book
Agriculture & Horticulture Lighting
Street & Parking Lot Lighting
Automotive
Power Supply
ustomer Electronics Lighting
Other products that require thermal solutions

FAQs about COB MCPCBs

1. What is the difference between a standard MCPCB and a COB MCPCB?

A standard MCPCB (Metal Core PCB) usually has SMT (Surface Mount Technology) components soldered onto a dielectric layer. In contrast, a COB (Chip-on-Board) MCPCB allows the LED semiconductor chip to be mounted directly onto the metal core or into a recessed “well.” This removes the thermal resistance of the LED package itself, allowing for much higher power density.

2. Why is thermal conductivity so important for COB MCPCBs?

Since COB LEDs pack many light-emitting diodes into a very small area, they generate intense localized heat. If this heat isn’t dissipated, the LED’s lifespan and brightness (luminous flux) drop rapidly. COB MCPCBs use materials like Aluminum or Copper to pull heat away from the chips at rates significantly higher than standard FR4 boards.

3. What are the common base materials used in COB MCPCBs?

Aluminum: The most common and cost-effective choice for general lighting.
Copper: Offers superior thermal conductivity but is heavier and more expensive; used for extreme high-power applications.
Stainless Steel: Occasionally used for high-strength requirements, though it has poorer thermal properties than Aluminum.

4. What is a “Mirror Aluminum” COB MCPCB?

A Mirror Aluminum COB MCPCB features a highly reflective, polished surface. This design ensures that light emitted from the sides of the LED chips is reflected forward, increasing the overall light output efficiency (Lumen/Watt) by reducing light absorption by the board itself.

5. Can COB MCPCBs be used with high-voltage applications?

Yes, but they require a specialized dielectric layer. This layer must be thin enough to allow heat to pass through to the metal core, but thick enough to provide electrical insulation (dielectric breakdown voltage) to prevent short circuits, especially in AC-driven LED modules.

6. What are the main applications for COB MCPCB technology?

Because they offer high brightness in a compact footprint, they are the industry standard for:

Automotive lighting (Headlights).
Industrial high-bay lighting.
Street lights and architectural floodlights.
Commercial downlights and track lighting.

Tags: chip on baord, Chip On Board, chip on board led, cob mcpcb, what is chip on board
Posted in Metal Core PCB, PCB Manufacturer | No Comments »

Single Layer MCPCB

March 20th, 2026

A simple layer single sided MCPCB consists of a metal base (usually aluminum, or copper alloy), Dielectric (non-conducting) Layer, Copper Circuit Layer, IC components and solder mask.

The prepreg dielectric provides excellent heat transfer from the foil and components to the base plate, while maintaining excellent electrical isolation. The base aluminum/copper plate gives the single-sided substrate mechanical integrity, and distributes and transfers the heat to a heat sink, mounting surface or directly to the ambient air.

The Single-Layer MCPCB can be used with surface mount and chip & wire components, and provides much lower thermal resistance than FR4 PWB. The metal core provides lower cost than ceramic substrates, and allows much larger areas than ceramic substrates.

Single Layer MCPCB Capability

Base material: Aluminum/Copper/Iron Alloy
Thermal Conductivity (dielectrial layer): 0.8, 1.0, 1.5, 2.0, 3.0 W/m.K.
Board Thickness: 0.5mm~3.0mm(0.02″~0.12″)
Copper thickness: 0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ, up to 10 OZ
Outline: Routing, punching, V-Cut
Soldermask: White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color: Black/White
Surface finishing: Immersion Gold, HASL, OSP
Max Panel size: 600*500mm(23.62″*19.68″)
Packing: Vacuum/Plastic bag
Samples L/T: 4~6 Days
MP L/T: 5~7 Days

Single Layer MCPCB FAQs

1. What is a single layer MCPCB?

A single layer MCPCB consists of a metal base (typically aluminum or copper), a non-conductive dielectric layer, and a copper circuit layer. Unlike standard PCBs, the metal core acts as a primary heat sink, moving thermal energy away from high-power components to the environment or an external cooling system.

2. How does a single layer MCPCB differ from a standard FR4 PCB?

The primary difference is the substrate material. While FR4 uses fiberglass and epoxy, an MCPCB uses a metal base. This allows MCPCBs to have significantly higher thermal conductivity. While a standard FR4 board typically has a conductivity of around 0.25 W/mK, a single layer MCPCB can range from 1.0 W/mK to 9.0 W/mK depending on the dielectric material used.

3. What are the typical applications for single layer MCPCBs?

Single layer MCPCBs are most commonly used in the LED lighting industry (street lights, automotive headlamps, and backlight units) because LEDs generate significant heat that can degrade performance if not dissipated. They are also widely used in power conversion, solid-state relays, and the automotive sector for motor control modules.

4. Can you have plated through-holes (PTH) on a single layer MCPCB?

Generally, no. In a standard single layer MCPCB, the metal base is conductive, so through-holes would cause a short circuit between the signal layer and the base. Components are typically Surface Mount Devices (SMD). If through-hole components are required, specialized “COB” (Chip on Board) or complex insulated hole processes are needed, which significantly increases cost.

5. What are the layers of a single layer MCPCB?

A standard stack-up includes four main layers:

Solder Mask: Protects the copper circuit.
Circuit Layer: The copper foil used for traces.
Dielectric Layer: The most critical part; it provides electrical insulation while facilitating heat transfer.
Metal Substrate: Usually 1.0mm to 3.2mm of Aluminum (5052 or 6061) or Copper.

6. Is aluminum or copper better for the metal core?

Aluminum is the most popular choice because it is cost-effective and provides excellent thermal dissipation for most applications. Copper offers even higher thermal conductivity but is much heavier and more expensive. Copper is usually reserved for extremely high-power density applications where aluminum’s performance is insufficient.

Tags: MCPCB, Single Layer MCPCB, single sided mcpcb
Posted in Metal Core PCB, PCB Manufacturer | No Comments »