Archive for the ‘bestpcb’ Category

LED double-sided aluminum substrate, LED substrates

Friday, August 22nd, 2025

LED double-sided aluminum substrate is a high thermal conductivity circuit board with copper wiring on both sides of the aluminum substrate. LEDs are soldered on one side and drive or control circuits are carried on the other side. The aluminum core in the middle dissipates heat quickly, allowing high-power lamp beads to operate stably in a smaller space. It has been widely used in automotive headlights, street lights and high-density backlight modules.

LED double-sided aluminum substrate, LED substrates

Are you curious about Best Technology’s LED double-sided aluminum substrate?

Will double-sided wiring lead to short circuits or signal distortion due to inaccurate interconnections?

Is heat dissipation balanced on both sides, preventing localized overheating that could affect the life of the lamp?

Will the copper foil easily peel off after repeated soldering?

Does the cost of double-sided processing justify the performance improvement?

Best Technology’s LED double-sided aluminum substrate can answer these questions.

Using high-precision drilling and alignment processes, interconnect holes are precisely positioned, providing reliable insulation and preventing short circuits or signal issues.

The double-sided aluminum base design, with its symmetrical heat dissipation path, ensures even heat conduction, reduces localized overheating, and extends the life of the lamp.

The copper foil and aluminum base are tightly bonded through a high-temperature pressing process, resistant to soldering heat shock and maintaining stable adhesion after repeated soldering.

The double-sided design increases circuit density and heat dissipation efficiency. Process costs are optimized through large-scale production, and the performance improvements far outweigh the cost increases.

What is double sided aluminum PCB?

Double-sided aluminum PCB is a printed circuit board with aluminum as its base material, featuring copper layers on both sides. It includes an insulating dielectric layer between the copper and aluminum base. This design enables routing on both sides, unlike single-sided boards that only allow traces on one side.

Because aluminum offers excellent heat dissipation, these boards are widely used in high-power LED lighting. They prevent overheating, which can damage LEDs or reduce their lifespan.

With two conductive layers, double-sided boards also allow more complex circuits, making them ideal for advanced LED assemblies.

Types of double-sided aluminum PCB

Double-sided aluminum PCBs come in different forms, depending on application needs. The most common types include:

Standard Double-Sided Aluminum PCB: These have two copper layers and a dielectric layer between the aluminum base. They are simple yet effective for medium-power applications.

Hybrid Double-Sided PCB: This type of substrate combines the benefits of two different materials, such as aluminum and ceramic, to provide improved thermal conductivity and electrical performance.

Flexible Double-Sided PCB: This type of substrate is made of a flexible material and has a layer of aluminum on both sides. It is commonly used in applications where flexibility is required, such as in wearable electronics.

High-frequency double-sided aluminum PCB: This type of substrate is designed for high-frequency applications and has a low dielectric constant, which helps to reduce signal loss.

Each type serves a specific purpose. Choosing the right one depends on thermal requirements, circuit complexity, and mechanical needs.

How does a double-sided aluminum PCB differ from a single-sided one?

Single-sided aluminum PCB has one copper layer for circuit routing, limiting its complexity. A double-sided board, on the other hand, has two copper layers, allowing for denser component placement and more advanced designs.

Another major difference is thermal management. Both provide excellent heat dissipation thanks to the aluminum base, but double-sided boards handle higher power loads better. This is crucial for high-brightness LED systems where heat can build up quickly.

Lastly, cost and assembly differ. Double-sided boards may cost slightly more.

What materials are used in LED double-sided aluminum substrates?

LED double-sided aluminum substrate typically consists of:

Aluminum Base Layer: Provides structural strength and excellent thermal conductivity.

Dielectric Layer: Acts as an insulator between the aluminum base and copper layer while offering high thermal performance.

Copper Foil: Present on both sides for circuit routing. Thickness varies depending on current requirements.

Solder Mask: Protects the copper from oxidation and prevents short circuits.

Silkscreen Layer: Used for labeling components and guiding assembly.

Some boards may also include surface finishes like ENIG (Electroless Nickel Immersion Gold) for better solderability and corrosion resistance.

What are the advantages of using double-sided LED substrates over FR4?

Compared to FR4 boards, double-sided aluminum substrates have multiple advantages:

Superior Heat Dissipation: Aluminum conducts heat away from LEDs quickly, reducing thermal stress.

Enhanced Durability: Aluminum-based boards are more resistant to mechanical stress than FR4.

Better Power Handling: Perfect for high-power LED applications where FR4 cannot manage heat efficiently.

Longer LED Lifespan: Lower operating temperatures mean LEDs last longer, reducing replacement costs.

Compact Design: Double-sided routing allows smaller, more efficient layouts.

While FR4 is common in electronics, it cannot match aluminum substrates for thermal and structural performance in LED systems.

What thickness options are available for double-sided LED aluminum boards?

Thickness plays a vital role in thermal performance and strength. Typical options include:

Aluminum Base Thickness: 1.0 mm, 1.2 mm, 1.5 mm, and 2.0 mm.

Copper Thickness: Usually 1 oz (35 μm), 2 oz (70 μm), or even higher for high-current applications.

Dielectric Layer: Often between 75 μm and 150 μm, depending on thermal needs.

Choosing the right thickness ensures proper heat dissipation without adding unnecessary weight.

Where is the double-sided aluminum substrate used?

Double-sided aluminum substrates are versatile. Common applications include:

LED Lighting Systems: Indoor, outdoor, and industrial lighting where thermal management is critical.

Automotive Lighting: Headlights, tail lamps, and dashboard lighting.

Consumer Electronics: Devices that require compact yet heat-resistant boards.

Medical Devices: Surgical lights and diagnostic equipment that must stay cool for safety.

Power Electronics: High-power converters and power supplies where heat is a major concern.

The ability to handle high power and maintain stability under heat makes these substrates essential for advanced applications.

How is a double-sided aluminum PCB manufactured?

The manufacturing process involves several precise steps:

Aluminum Base Preparation: The base is cleaned and treated to improve adhesion.

Dielectric Layer Application: A thermally conductive but electrically insulating layer is added.

Copper Foil Lamination: Copper is laminated on both sides under heat and pressure.

Circuit Patterning: Copper layers are etched to create circuit paths.

Drilling and Plating: Holes are drilled and plated to connect layers.

Surface Finish: ENIG, HASL, or other finishes are applied for better solderability.

Solder Mask and Silkscreen: Applied for protection and labeling.

Testing: Each board undergoes electrical and thermal testing to ensure quality.

Precision is key to achieving tight tolerances and long-lasting performance.

What are the applications of double-sided aluminum PCB?

These boards power a wide range of industries:

LED Lighting: Streetlights, floodlights, and smart lighting solutions.

Displays and Signage: High-brightness displays that run for long hours.

Telecommunication Equipment: Devices where heat control is essential for reliability.

Aerospace and Defense: Applications requiring extreme durability and stability.

Renewable Energy: Solar inverters and power control systems that demand high thermal performance.

Wherever heat and reliability matter, double-sided aluminum PCBs are the go-to solution.

Conclusion:

Double-sided aluminum substrates for LEDs are able to handle high power, dissipate heat efficiently, and support compact designs without compromising performance. Their advantages over FR4 make them the best choice for demanding applications.

If you need custom LED aluminum substrates for your projects, Best Technology is here to help. We provide premium-quality aluminum PCBs, strict quality control, and fast delivery. Contact us today at sales@bestpcbs.com

Tags:double sided led strip, LED double-sided aluminum PCB, led substrates
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

6oz Aluminum PCB for Electronic Control Board

Friday, August 22nd, 2025

Why choose 6oz aluminum PCB for electronic control board? Let’s explore benefits, applications, technical spec, thermal management, production processes for 6oz aluminum PCB.

Are you troubled with these problems?

Overheating causing frequent failures and high repair costs?
Poor PCB thermal performance limiting product upgrades?
Small-batch orders struggling with slow delivery and inventory risks?

Best Technology can provide services and solutions:

High-Efficiency Thermal Management: Significantly extending device lifespan.
Rapid Prototyping: 48 hours rapid prototyping and flexible support for small-batch orders.
Cost Optimization: Integrated thermal design reduces overall system costs by 25%.

Welcome to contact us if you have any inquiry for aluminum PCB: sales@bestpcbs.com.

Why Choose 6oz Aluminum PCB for Electronic Control Board?

Reasons why choose 6oz aluminum PCB for electronic control board:

Heat Dissipation Powerhouse: Thermal conductivity >2.0W/m·K. Reduces component temperatures by 40% vs. FR4.
High Current Performance: 6oz copper (0.17mm) handles high power loads. Minimizes voltage drop in motor drives/power modules.
Lightweight & Durable: Aluminum alloy (6063/5052) balances strength and weight. Withstands vibration/industrial environments.
EMI Shielding: Reduces high-frequency noise in RF/5G circuits. Improves signal integrity with grounding design.
Cost-Efficient Design: Eliminates heatsinks/fans. Enables compact layouts for space-constrained boards.
Rugged Reliability: Passes extreme thermal cycling (-40°C~125°C). Surface finishes (ENIG) resist corrosion.
Scalable Production: Consistent copper thickness for high yields. Customizable layers for diverse control board needs.

Applications of 6oz Aluminum PCB for EV Electronic Control Board

Motor Controller (MCU) Power Module‌
On-Board Charger (OBC) DC-DC Conversion Circuit‌
Battery Management System (BMS) Main Board‌
Inverter Power Unit‌
PDU (Power Distribution Unit) Busbar‌
VCU (Vehicle Control Unit) Power Module‌
Thermal-Sensitive Sensor Interface Board‌
Fast Charger Power Module‌

6oz Aluminum PCB for Electronic Control Board Design Specification

Parameter Category	Specifications/Details
Substrate Material	6063/5052 Aluminum Alloy (High Thermal Conductivity, Corrosion-Resistant)
Copper Thickness	6oz (≈0.17mm, ±10% Tolerance)
Thermal Conductivity	≥2.0W/m·K (Aluminum Substrate Layer)
Thermal Resistance	Soldering Temperature: 260°C/10s No Delamination; Thermal Cycling: 3 Cycles (-40°C~125°C) No Cracks
Mechanical Properties	Tensile Strength ≥200MPa; Bend Radius ≥1.5×Board Thickness (Non-Plated Side)
Surface Finish	ENIG (Au Thickness 0.05~0.1μm), OSP (Antioxidant)
Insulation Layer	Epoxy/Polyimide (Thickness 50~150μm, Dielectric Strength ≥500V)
Min Trace Width/Space	0.15mm/0.15mm (Requires Electroplating Process)

6oz Aluminum PCB for Electronic Control Board Thermal Management

1. Material Selection Criteria

Base Material: 6oz (170μm) copper-clad aluminum PCB with thermal conductivity ≥3W/m·K.
Dielectric Layer: Thermal resistance ≤1.2°C·cm²/W, withstand voltage ≥500V.
Surface Treatment: Anodized finish ≥5μm, surface roughness Ra0.8-1.6μm.

2. Thermal Source Layout

Maintain ≥30% copper coverage in high-power zones.
Keep ≥5mm spacing between MOSFET/IGBT components.
Position temperature-sensitive parts (capacitors) ≥10mm from heat sources.

3. Thermal Path Design

Thermal via arrays under critical components (0.5mm diameter, 1mm pitch).
Via filling with thermal conductive paste (≥5W/m·K).
Direct contact pressure ≥20N/cm² between PCB and housing.

4. Cooling System Configuration

Passive Cooling:

Fin thickness ≥1.5mm, height ≥20mm.
Thermal grease thickness 0.1-0.3mm at interface.

Active Cooling:

Add axial fan when power density >5W/cm²
Airflow ≥3CFM/W, noise <35dB(A)

5. Process Control

Soldering: Peak temperature 245±5°C, reflow time ≤90s.
Assembly: M3 stainless screws (1.2-1.5N·m torque), spring washers ≥0.8mm.

6. Performance Verification

Thermal resistance (junction-to-ambient) ≤5°C/W.
Temperature rise ≤45°C under full load.
Pass 1000 hours 85°C/85% RH aging test.

7. Achieved Results

40%+ improvement in heat dissipation efficiency.
25-35°C reduction in component operating temperatures.
System MTBF ≥50,000 hours.
Compliance with IEC 60068-2-78 damp heat standard.
30%+ space reduction compared to traditional designs.

6oz Aluminum PCB for Electronic Control Board Thermal Management

6oz Electronic Control Aluminum PCB Manufacturing Processes

1. Raw Material Preparation

Procure high-purity electrolytic copper foil (6oz, 210μm thickness).
Select 5052 or 6061 series aluminum alloy substrate.
Prepare high-thermal-conductivity insulating dielectric layer (≥8W/mK).

2. Aluminum Substrate Pretreatment

Mechanically polish substrate surface to surface roughness Ra ≤ 0.2μm.
Chemically clean to remove surface oxide layers and oil contamination.
Anodize to enhance surface insulation properties.

3. Insulating Layer Coating

Apply thermal conductive adhesive uniformly using high-precision coating equipment.
Curing conditions: 150 ±5℃ for 30 minutes.
Thickness tolerance controlled within ±10μm.

4. Copper Foil Lamination

Hot-press composite 6oz copper foil with insulating layer.
Process parameters: pressure 15–20kg/cm², temperature 180–200℃.
Ensure no bubbles or delamination defects.

5. Pattern Transfer

Use LDI (Laser Direct Imaging) technology.
Special etching compensation design required for 6oz thick copper.
Minimum line width/spacing: 0.2mm/0.2mm.

6. Etching Process

Adopt acidic copper chloride etching solution.
Strictly control side etching rate ≤15%.
Post-etching copper thickness deviation within ±10%.

7. Drilling

Use tungsten carbide drills or laser drilling.
Hole diameter tolerance ±0.05mm.
Hole wall roughness ≤25μm.

8. Surface Finish

Optional processes: immersion gold/OSP/HASL.
Immersion gold thickness: 0.05–0.1μm.
Nickel layer thickness: 3–5μm.

9. Solder Mask Printing

Apply high-thermal-conductivity solder mask ink.
Thickness: 20–30μm.
Post-curing temperature resistance up to 150℃.

10. Contour Machining

CNC milling with contour tolerance ±0.1mm.
V-cut depth controlled at 1/3 of board thickness.
Chamfering to eliminate burrs.

11. Electrical Testing

100% flying probe testing.
Insulation resistance ≥1000MΩ.
Withstand voltage test ≥3kV/60s.

12. Final Inspection

Visual inspection under 10x magnification.
Full dimensional inspection via CMM.
Thermal resistance test ≤0.5℃/W.

13. Packaging & Shipping

Vacuum moisture-proof packaging.
Anti-scratch spacing between each piece.
Storage conditions: temperature 15–30℃, humidity ≤60%.

How to Balance Cost and Quality of Electronic Control Aluminum PCB?

1. Material Tiering Optimization

Critical Zones: Use 6oz copper foil + 6061 aluminum alloy (thermal conductivity ≥200W/m·K) for high-heat components (e.g., IGBTs).
Non-Critical Zones: Deploy 4oz copper foil + 5052 aluminum alloy, reducing material costs by 15-20% while validating thermal distribution via simulation.

2. Design Standardization & Modularization

Build a library of universal circuit modules (e.g., power conversion units), cutting custom design time by 30%.
Use DFM system to auto-check thermal expansion coefficient matching, reducing rework by 67%.

3. Smart Manufacturing Upgrades

Deploy AI-powered visual inspection to monitor etching uniformity, boosting 6oz thick-copper board yield from 85% to 96%.
Adopt diamond-coated milling cutters for edge processing, reducing burr rate by 90% and improving soldering reliability.

4. Supply Chain Vertical Integration

Sign long-term agreements with raw material suppliers to lock copper foil prices; use JIT warehousing to cut inventory costs by 10-15%.
Prioritize domestic high-thermal-conductivity insulation (e.g., ceramic-filled epoxy), shortening lead times to ≤7 days.

5. Differentiated Surface Finishing

Apply low-cost OSP (Organic Solderability Preservative) for non-soldering areas and ENIG for critical pads, reducing surface treatment costs by 40% while passing 500hrs 85℃/85%RH tests.

6. Life Cycle Cost Accounting

Optimize for high-thermal-conductivity insulation (≥8W/m·K): Though 20% more expensive upfront, it reduces cooling components, cutting total life cycle costs by 8-12%.

7. Green Manufacturing & Recycling

Establish scrap recycling system (70% recycled aluminum utilization), meeting EU 2025 e-waste recycling targets (≥65%).
Replace traditional stamping with laser cutting, reducing waste rate from 22% to 8% while improving accuracy to ±0.05mm.

How to Balance Cost and Quality of Electronic Control Aluminum PCB?

Our Electronic Control Aluminum PCB Case Studies

At Best Technology, we specialize in electronic control aluminum PCB manufacturing for 19 years, providing a full service from design consultation to mass production. Our professional design team can customize designs based on your power device layout and heat dissipation requirements, ensuring your products meet stringent electrical performance and mechanical stability requirements. Here is a photo of electronic control board aluminum PCB we made before:

Why Choose Best Technology as Aluminum PCB Manufacturer?

Dual-Certification Quality Assurance

ISO 9001 (general quality) & IATF 16949 (automotive-grade) certified
Optional medical-grade ISO 13485 compliance

Thermal Management Gradient

Economy: 3W/m·K aluminum PCB for low-power devices (e.g., security sensors)
Premium: 8W/m·K aluminum nitride substrate for high-power applications (e.g., 5G base stations)

Supply Chain Efficiency

Direct sourcing reduces bulk procurement costs by 15%-20%
Flexible production scale from 50-unit prototypes to 10,000-unit mass production

24-Hour Rapid Prototyping

Aluminum substrate samples delivered within 24 hours
Free DFM (Design for Manufacturability) optimization to mitigate thermal via placement risks

Integrated One-Stop Service

PCB design, thermal simulation, and SMT assembly under one roof
Engineering support for thermal resistance calculation and temperature rise modeling

Eco-Friendly Manufacturing

RoHS/REACH compliance with 95% recycled aluminum content
Lead-free process reduces carbon emissions by 25%

High-Reliability Material System

Dielectric layer: ≥500V withstand voltage, ≤1.2°C·cm²/W thermal resistance
Anodized surface (5-8μm thickness), passes 1,000hrs 85℃/85%RH aging test

Precision Fabrication Capability

Minimum trace width/spacing: 0.1mm
Laser drilling accuracy: ±0.05mm
Layer alignment precision: ≤0.03mm

Welcome to contact us if you have any request for aluminum PCB: sales@bestpcbs.com.

Tags:Electronic Control Board
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

LED Wall Washer Aluminum PCB Manufacturer

Thursday, August 21st, 2025

Why choose LED wall washer aluminum PCB? Let’s explore its benefits, technical parameter, thermal solution, design guide, selection guide through this blog.

Are you troubled with these problems?

Poor heat dissipation leads to rapid light decay and short product lifespan?‌
Outdoor environments cause PCB corrosion and oxidation?‌
Heavy wall washer fixtures warp during installation?‌

Best Technology can provide services and solutions:

Custom Thermal Design‌ – Optimize aluminum PCB thickness and copper layer layout for precise temperature control.
Environmental Testing‌ – Provide third-party certification for waterproofing, shock resistance, and outdoor durability.
Fast Prototyping‌ – 24-hour turnaround for aluminum PCB samples, accelerating R&D cycles.

Welcome to contact us if you have any inquiry for LED wall washer aluminum PCB: sales@bestpcbs.com.

Why Choose LED Wall Washer Aluminum PCB?

Reasons why choose LED wall washer aluminum PCB:

Efficient heat dissipation and stable operation: The aluminum base plate quickly dissipates heat, preventing LED damage from high temperatures, ensuring long-term stable operation at high power levels and significantly delaying lumen degradation.
Lower cost and high cost-effectiveness: Aluminum’s low cost and inherent heat dissipation eliminate the need for external heat sinks, significantly reducing material and assembly costs.
Lightweight and compact, saving space: High heat dissipation efficiency allows for a thinner and lighter luminaire, eliminating the need for additional heat sink components and enabling flexible installation in confined locations.
Increased lifespan and reduced maintenance: Temperature control extends LED lifespan to over 30,000 hours, reducing maintenance requirements for outdoor applications at high altitudes.
Weather-resistant and resistant to harsh environments: The aluminum base plate is impact- and vibration-resistant, and the die-cast housing achieves IP67 waterproofing, making it suitable for outdoor use in the sun and rain.
Environmentally friendly and recyclable, in line with current trends: Aluminum is non-toxic and 100% recyclable, with low energy consumption in production, meeting green manufacturing requirements.
Supporting high power density: Carrying high current density, it drives densely packed, high-brightness LEDs for uniform, powerful wall-washing lighting.

LED Wall Washer Aluminum PCB Technical Parameter

Parameter Category‌	‌Technical Specifications	Description‌
Base Material‌	Aluminum alloy (5052/6061)	Thickness: 1.0-3.2mm, with anodized surface treatment
Thermal Conductivity	Conductivity: 1.0-8.0 W/(m·K)	Standard type (1.0-2.0) for medium-low power, high-conductivity (3.0-8.0) for high-power applications
Insulation Layer‌	Thickness: 50-200μm	Epoxy resin with ceramic filler, slightly higher loss than FR-4
	Dielectric Constant: 4.5-5.0 (1GHz)
	Dielectric Strength: ≥3 kV/mm
‌Thermal Resistance	Total thermal resistance: 0.8-3.0°C/W	Depends on copper foil area and insulation layer thickness
	Interface resistance: <0.5K/W (eutectic soldering)
‌Electrical Parameters	Operating voltage: AC220V/DC24V	Suitable for outdoor environments
	IP65 protection Operating temp: -40°C to +60°C
‌Mechanical Properties	Dimensional tolerance: ±0.1mm (custom modules)	Minimal impact from anodizing
	Surface roughness: Ra 0.2-0.8μm
‌Process Standards	Copper foil thickness: 35-70μm	Compatible with SMT and reflow soldering
	Peel strength: 1.0-1.5 kgf/cm UL94 V0 flame retardancy

How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

1. Superior Thermal Management for Optimal LED Operation

Heat Dissipation Efficiency: Aluminum PCBs (thermal conductivity 1-10 W/m·K) outperform FR4 (0.3 W/m·K) by 10x+, rapidly conducting 70% of LED-generated heat away from chips.
Temperature Control: Low thermal resistance (0.05–0.2 K/W) enables safe operation at >10W/chip, reducing junction temperature by 10–15°C and minimizing light decay.

2. Electrical Performance Optimization

Conductivity Advantage: Aluminum’s low impedance cuts power loss, improving system efficiency.
Light Output Boost: White-coated PCBs enhance reflection efficiency by 30%+, indirectly reducing energy consumption per lumen.

3. High-Density Design Support

Compact Integration: Aluminum substrates allow higher LED density (e.g., 500+ LEDs/m²) with uniform light distribution, ideal for large-scale illumination.
Mechanical Reliability: High bending strength prevents solder joint failures under vibration or thermal stress.

4. Cost & Lifespan Benefits

Extended Lifetime: Thermal efficiency extends LED lifespan to 50,000+ hours (2–3x longer than standard solutions).
Simplified Design: Eliminates 40% of external heat sinks, reducing material costs and assembly complexity. Aluminum recycling aligns with sustainability goals.

5. Real-World Application Advantages

High-Power Models: 48W wall washers leverage aluminum PCBs for compact IP66-rated designs, avoiding thermal failure.
Optical Optimization: Multi-layer structures (LED → phosphor → resin → reflective layer) maximize light extraction while efficiently managing internal heat.

How Aluminum PCB Enhances LED Wall Washer Light Efficiency?

Wall Wash Light Aluminum PCB Thermal Solution

Copper Layer Thermal Design Optimization

Prioritize solid plane copper layers for maximum thermal conductivity (highest cost).
For cost-sensitive designs, grid patterns offer 80-90% thermal efficiency with ~10% cost reduction.
Avoid star/custom patterns unless required for EMC compliance (70-80% efficiency, unstable cost-benefit).

Thermal Via Design Refinement

Thermal vias are critical for heat transfer from component pads to aluminum substrate. Optimize parameters (diameter, pitch, copper thickness) to minimize thermal resistance.
Parallel thermal resistance network modeling simplifies design and improves efficiency by 20-30%. Reducing via pitch and increasing quantity is effective but requires cost-balance with drilling.

System Thermal Resistance Reduction

High-thermal-conductivity substrates: Use aluminum oxide (Al₂O₃) substrates (22-24 W/mK), outperforming FR-4/ceramic alternatives.
Thin dielectric layers: Minimize thickness while meeting electrical insulation requirements (key to low thermal resistance).
Reduce non-thermal vias: Excessive standard vias increase thermal path length and resistance.

Component Layout & Routing Strategies

Placement: Avoid hotspots by dispersing high-power components (LEDs, drivers). Position major heat sources near substrate edges or directly over thermal vias. Aim for uniform distribution.
Routing: Minimize long/thin copper traces to reduce resistive heating. Widen copper traces or increase thermal via contact area in critical paths (15-20% local thermal improvement).

Integrated Thermal Enhancement Measures

Heat sinks: Most common passive solution, handling ~70% of total heat load. Cost-effective and easy to integrate into housing.
Forced air cooling: Adds ~85% efficiency in enclosed/high-power units but increases cost, noise, and complexity.
Thermal interface materials (TIMs): Thermal grease/pads fill micro-gaps, improving interfacial conductivity by ~30% at low cost.
Liquid cooling: ~95% efficiency but highly complex and costly. Reserved for extreme power densities or specialized applications.

Convection Optimization

Component orientation: Align temperature-sensitive/heat-generating components with their long axis perpendicular to airflow in natural/forced convection.
Expose aluminum substrate: Directly expose large PCB aluminum areas to airflow where structurally feasible.
Airflow management: Arrange tall components parallel to airflow to reduce turbulence and avoid downstream thermal dead zones.

Substrate Material Selection

Aluminum-based PCBs (MCPCBs): Preferred for wall washers due to excellent thermal performance, mechanical robustness, CTE matching (reduces solder joint fatigue), and recyclability. Thickness range: 0.4-6.0mm.
Alumina ceramic substrates: Suitable for high-temperature/high-reliability applications (350-1500°C resistance) with good thermal conductivity.

Thermal Simulation Utilization

Use finite element analysis (FEA) in design phase to predict temperature distribution and identify hotspots.
Simulation-driven optimization reduces post-development thermal issues by 20-30%, lowering risk and cost, especially for mass production.

LED Wall Washer Aluminum PCB Color Consistency Design Guide

1. LED Selection & Color Parameters

Color Tolerance (SDCM): Use SDCM ≤5 LEDs to ensure batch consistency.
Color Rendering Index (CRI): Prioritize Ra ≥80 LEDs (e.g., Lumileds LUXEON) for accurate color reproduction.
Dimmable Options: Support 1900K-5700K CCT ranges with SDCM ≤5 across all settings.

2. Aluminum PCB & Thermal Design

Material: High-thermal-conductivity 6063 aluminum (≥200W/m·K) with anodized coating.
Layout: LED spacing ≥20mm (adjust per power) to prevent localized overheating.
Wiring: 45° traces (width ≥0.5mm, spacing ≥0.3mm) to minimize current interference.

3. Optical System Optimization

Mixing Distance: Short-distance lenses (≤15mm) for RGBWY uniform blending.
Lens: Optical-grade PC/PMMA (transmittance ≥92%) with recessed design (depth ≥5mm).

4. Environmental Adaptability

Protection: IP65/IP66 with silicone sealing (e.g., Dow Corning 7091).
Temperature: Operate from -20°C to +60°C without deformation.

5. Production & Quality Control

Supplier Collaboration: Verify PCB color process (UV-resistant ink, reflection ≥85%).
Inspection: Tighten tolerances (PCB size ±0.1mm, pad alignment ±0.05mm).
Soldering: Through-hole preferred; SMT requires epoxy reinforcement.

6. Control System Compatibility

Dimming: DMX512 0-100% smooth control with Δu’v’ ≤0.005.
Driver: PF >0.9, ripple ≤5% (e.g., PFC circuit design).

7. Long-Term Reliability

Testing: 50,000-hour LM-80 validation, Δu’v’ ≤0.003 post-aging.
Coating: Acrylic varnish (50-80μm) for UV/chemical resistance.

LED Wall Washer Aluminum PCB Color Consistency Design Guide

LED Wall Washer Aluminum PCB Selection Guide

1. Thermal Performance Priority

Thermal Conductivity: 1.0-2.0 W/(m·K) for low-power (<50W) ≥3.0 W/(m·K) for high-power (>50W).
Substrate Thickness: 1.0mm (lightweight) or 2.0-3.0mm (heavy-duty cooling).
Construction: 6061 aluminum base + ceramic-filled insulation for low thermal resistance.

2. Electrical Safety Standards

Protection: IP65 dust/water resistance mandatory for outdoors.
Insulation: Dielectric strength ≥3 kV/mm, copper foil adhesion ≥1.0 kgf/cm.
Voltage: Match input (AC220V/DC24V) with driver compatibility.

3. Optical Compatibility

Beam Angle: 120° standard lens requires PCB layout alignment.
Color Quality: High CRI (Ra>90) needs low-decay LEDs.
Efficacy: ≥10 lm/W for white light; RGB requires independent control zones.

4. Mechanical & Environmental Durability

Coating: Anodized + conformal coating (humidity/mold resistance ≤Class 1).
Impact Resistance: Die-cast aluminum housing (IK10 certified).
Temperature Range: -40°C to +60°C operational certification.

5. Cost & Supply Chain

Material Efficiency: Smart panel layout reduces waste by 23%.
Packaging: SMT-compatible reel packaging recommended.
Certifications: UL94 V0 flammability rating + RoHS compliance.

LED Wall Washer Aluminum PCB Selection Guide

Why Choose Best Technology as Aluminum PCB Manufacturer?

Reasons why choose us as LED wall washer aluminum PCB manufacturer:

1. Premium Quality Assurance

Material Selection: Use 6063/6061 aluminum with thermal conductivity ≥150W/m·K (3x higher than industry average).
Certifications: UL, RoHS, and IP65 compliance guaranteed for harsh outdoor environments.

2. 19 Years of Industry Expertise

Specialized Experience: Dedicated focus on LED lighting PCBs since 2005, with 500+ wall washer projects completed.

3. Cost-Effective Solutions

Price Advantage: 15-20% lower than competitors via optimized production lines and bulk material procurement.
Design Optimization: Free DFM reduces material waste by up to 25% without compromising performance.

4. Fast Delivery

Lead Time: 24 hour rapid prototyping, 5-7 days for mass production (50% faster than industry standard).

5. Free DFM Support

Pre-Production Analysis: Identify thermal bottlenecks, electrical risks, and assembly issues pre-manufacturing.
Design Adjustments: Optimize LED layouts for 30% higher lumen density while maintaining thermal safety.

6. Stringent Quality Control

Thermal cycling (-40°C~+125°C, 1000 cycles).
48-hour burn-in test for all batches.
AOI/X-ray inspection for solder joint integrity.

7. Customization Capability

Flexible Design: Support ultra-thin (0.8mm) to heavy-duty (3.2mm) substrates.
Special Coatings: White solder mask for 95% reflectivity, anti-sulfur treatment for coastal areas.

Welcome to contact us if you have any request for LED wall washer aluminum PCB: sales@bestpcbs.com.

Tags:aluminum pcb, LED Wall Washer
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Copper Deposition PCB for HDI Board

Thursday, August 21st, 2025

Why choose copper deposition PCB for HDI board? Let’s explore technical parameter, benefits, production process, optimization solutions for copper deposition PCB.

Are you troubled with these problems?

How to ensure even copper deposition for HDI boards?
How to prevent signal loss from excessive copper thickness?
How does incomplete microvia filling affect PCB reliability?

Best Technology can provide service and solution:

Precision Thickness Control – Pulse plating ensures ±5% copper thickness tolerance.
Microvia Fill Technology – High-ductility copper eliminates voids, boosting yield by 15%.
Eco-Friendly Additives – Cyanide-free plating reduces wastewater treatment costs, RoHS compliant.

Welcome to contact us if you have any request for copper deposition PCB: sales@bestpcbs.com.

What is Copper Deposition PCB?

Copper deposition PCB is a circuit board manufacturing technology that deposits a copper layer on the substrate surface through electrolytic or chemical methods. This technology is categorized into two main types: electroplated copper (which requires a conductive layer and is used for through-hole plating and surface thickening) and electroless copper (which does not require a conductive layer and is suitable for metallizing non-metallic substrates such as plastics).

This process directly impacts the PCB’s conductivity, signal transmission speed, and structural reliability. It is a core technology for achieving high-density interconnect (HDI), flexible circuits, and electromagnetic shielding. It is widely used in 5G communications, automotive electronics, and consumer electronics.

Copper Deposition PCB Technical Parameter

Parameter Category	Technical Specifications
Copper Layer Thickness	Electroless: 0.3–1μm (0.01–0.03oz)
	Electrolytic: 5–70μm (1–3oz)
	Thick Copper: Max 30oz (≈1050μm)
Plating Uniformity	Hole wall copper thickness variation ≤15%
Plating Uniformity	Surface copper tolerance ±10%
Current Carrying Capacity	1oz (35μm): 1.8A/mm²
	2oz (70μm): 3.6A/mm²
	3oz (105μm): 5.4A/mm²
Surface Roughness	Electrolytic Foil: Ra 0.8–1.2μm
Surface Roughness	Rolled Foil: Rz ≤3μm
Tensile Strength	Electrolytic Foil: 150–300MPa
Tensile Strength	Rolled Foil: Elongation 20–40%
Min Line Width/Spacing	Inner Layers: 0.05mm
Min Line Width/Spacing	Outer Layers: 0.065mm
Hole Metallization	Mechanical Drill: ≥0.15mm
	Laser Drill: ≥0.05mm
	Aspect Ratio ≤8:1

Why Choose Copper Deposition PCB for HDI Board?

Electrical Conductivity & Signal Integrity

High Copper Conductivity: Minimal resistive losses (I²R) reduce line heating.
Microvia Direct Connections: Shorten signal path lengths by >30%, eliminating high-speed signal bottlenecks.

Thermal Management & Longevity

Thermal Conductivity: Exceeds aluminum (380-400 W/m·K), ensuring efficient heat dissipation for high-power components.
Thermal Stability: Low CTE (Coefficient of Thermal Expansion) minimizes solder joint fatigue under thermal cycling (-40°C~+125°C).

Space Efficiency & Component Density

Laser-Drilled Microvias: Filled with copper, enabling board thickness reduction to 0.4mm (vs. standard 0.6mm).
Copper-Pillar Interconnects: Replace traditional through-holes, achieving 30% higher component density.

Cost & Manufacturing Efficiency

Layer Reduction: 6-layer HDI design achieves equivalent performance of 8-layer conventional boards.
High Yield Rates: Mature electroless/electrolytic copper processes reduce rework (defect rate <0.2%).

Durability & Environmental Resistance

Mechanical Robustness: Withstands 1.5m drop tests and 50G vibration loads (industrial/automotive grade).
Humidity/Temperature Resistance: Maintains functionality in 95% RH and 85°C environments (IEC 60068-2-30).

Design Flexibility

Hybrid Architecture: Combines HDI zones (for 5G antennas/chip packaging) with conventional FR4 regions.
Thick Copper Integration: Supports 10oz+ copper layers for high-current power modules (≥200A).

How is Copper Deposited on HDI Board?

Copper Deposition Process for HDI Boards

1. Drilling

Laser (CO₂/UV) or mechanical drilling creates microvias (blind/buried holes) for interlayer connections. UV lasers achieve finer apertures (e.g., <25μm) with minimal thermal damage.

2. Desmear & Cleaning

Alkaline potassium permanganate treatment removes drilling residues, followed by cleaning to ensure contamination-free surfaces for metallization.

3. Chemical Roughening

Micro-etching (sulfuric acid/hydrogen peroxide) roughens copper surfaces (2-3μm depth) to enhance adhesion between the electroless copper layer and substrate.

4. Activation

Colloidal palladium activation deposits catalytic particles on non-conductive via walls, replacing outdated sensitization methods for reliable adhesion and avoiding copper displacement issues.

5. Electroless Copper Plating

A thin conductive layer (0.5-1μm) is deposited via autocatalytic reduction (copper ions + formaldehyde reductant) to initiate conductivity on via walls.

6. Electroplating Copper Thickening

Pulse electroplating adds 20-30μm copper to fill vias and reinforce conductivity. Parameters: current density 2-3A/dm², copper concentration 28-32g/L, temperature controlled.

7. Pattern Transfer & Etching

Photoresist coating, exposure, and development create circuit patterns. Wet/dry film etching removes excess copper, retaining designed traces.

8. Lamination & Stacking

Prepreg layers and core boards are vacuum-laminated under high temperature (180-190°C) and pressure (90-min curing) to form multilayer structures.

9. Surface Finish(Optional)

OSP: Organic solderability preservative (cost-effective, oxidation-resistant).
ENIG: Electroless nickel immersion gold (superior conductivity for high-frequency signals).
Immersion Ag/Au: Enhanced solderability (Ag requires anti-tarnish measures).
HASL: Hot air solder leveling (traditional, lower cost but less flatness).

10. Quality Inspection

AOI, X-Ray (via filling check), electrical tests (continuity, impedance), and reliability trials (thermal stress, salt spray) ensure compliance.

Copper Deposition Optimization for HDI Inner Layer Circuits

1. Plating Solution Formulation Optimization

Adjust copper salt concentration and additive ratios (e.g., levelers, suppressors) to balance deposition rate and uniformity.
Introduce chloride-based carriers to enhance throwing power and reduce void defects in via filling.

2. Substrate Surface Preparation

Use plasma or chemical roughening to improve copper-substrate adhesion.
Ensure strict cleaning (oxide/organic residue removal) to prevent discontinuous deposition or delamination.

3. Process Parameter Control

Apply dynamic current density (pulsed plating) to optimize copper thickness distribution across hole walls and surfaces.
Maintain temperature at 20–25°C to avoid crystal structure defects from precipitate formation.

4. Equipment & Flow Design

Upgrade plating tank agitation (jet + vibration systems) to minimize edge effects and thickness variation.
Use high-purity titanium anode baskets with soluble anode membranes for ion balance maintenance.

5. Inline Monitoring & Feedback

Deploy real-time resistivity sensors for automated additive replenishment based on solution composition.
Integrate laser thickness gauges for closed-loop control, reducing post-plating grinding loss.

6. Sustainability & Cost Efficiency

Develop low/cyanide-free plating systems to cut wastewater treatment costs.
Optimize plating tank load (≥80%) to minimize copper ball consumption and downtime.

7. Failure Mode Analysis

Build defect databases (nodules, pinholes) using DOE to identify critical process windows.
Regularly test ductility (≥15%) and resistivity (≤2.0μΩ·cm) for reliability assurance.

Long-Term Reliability of HDI Boards via Copper Deposition

1. Grain Structure Optimization

Control copper grain size (<5μm) and directional alignment to reduce grain boundary sliding under thermal stress.
Use pulsed plating for denser grains, lowering fatigue crack initiation risk.

2. Additive Residue Management

Monitor decomposition byproducts of organic additives (e.g., suppressors, brighteners) to prevent electrochemical migration.
Apply activated carbon filtration for ≥99.9% purity.

3. Thermal Stress Mitigation

Add graded metal layers (e.g., Ni/Au) between copper and substrate to address CTE mismatch.
Validate solder joint reliability via thermal cycling (-55°C to 125°C), targeting ΔTg ≤5°C.

4. Environmental Resistance

Limit porosity (<2 defects/cm²) to block moisture-induced corrosion.
Post-plate baking (150°C/2h) removes residual moisture for humidity resistance.

5. Electromigration Prevention

Optimize copper thickness uniformity (±3μm) to avoid high current density zones.
Use Co/Pd alloy barriers to extend MTBF >20 years.

6. Dynamic Load Monitoring

Embed fiber optic sensors for strain distribution tracking (resolution ≤1με).
Predict remaining lifespan via ML with <10% error margin.

7. Standards Compliance

Meet IPC-6012DS: peel strength ≥1.4N/mm, solderability at 260°C/10s.
Third-party testing (UL/CSA) confirms ≤5% electrical degradation after 125°C/1000h aging.

Our Copper Deposition HDI Board Case Studies

With ‌19 years‌ of specialized experience in copper deposition for HDI boards, we have successfully delivered ‌thousands of projects‌ across industries. Our expertise spans from ‌precision electroplating‌ and ‌microvia filling‌ to ‌full-turnkey solutions‌, from design, prototyping, mass production, and assembly. Whether it’s ‌5G base stations, automotive radar, or ultra-thin consumer electronics‌, we ensure ‌high-reliability interconnects‌ with consistent yield rates. Partner with us for ‌scalable, cost-optimized‌ HDI manufacturing. Here is a photo of copper deposition HDI board we made before:

Why Choose Best Technology as Copper Deposition PCB Manufacturer?

Reasons why choose us as copper deposition PCB manufacturer:

19-Year PCB Manufacturing Expertise: Proven track record in handling complex designs (e.g., HDI, RF, automotive) with 98.5% on-time delivery.
Global Certifications: ISO 9001, ISO 13485, UL and RoHS compliance guarantee product safety and regulatory adherence.
Cost Predictability: Transparent pricing model + bulk production optimization reduce hidden costs, achieving 15-20% cost savings under equivalent quality standards.
Fast Turnaround: 72-hour delivery for standard orders, 24-hour rapid prototyping, cutting R&D cycles by over 30% to accelerate market entry.
Strict Quality Inspection: Full-process AI visual inspection + 100% batch inspection ensure defect rates below 0.03%, minimizing post-sales repair costs.
Design Optimization Empowerment: Free DFM (Design for Manufacturability) analysis identifies design risks upfront, reducing average re-spin iterations by 2 and saving 1 week of development time.
Multi-Surface Finish Compatibility: Supports 8 surface treatment processes (HASL/ENIG/OSP/etc.), catering to automotive, medical, consumer electronics, and other high-reliability sectors.
Supply Chain Synergy: One-stop service from raw material sourcing to final packaging, eliminating communication costs associated with managing 5+ suppliers.
Eco-Compliant Manufacturing: Lead-free copper deposition process meets RoHS/REACH standards, simplifying global certification for clients.
Expert Technical Support: 10+ years of industry experience with 24/7 engineer assistance, resolving technical challenges and enhancing product reliability.

Welcome to contact us if you have any request for copper deposition HDI board: sales@bestpcbs.com.

Tags:Copper Deposition PCB, HDI Board
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What is Copper Inlay PCB?

Thursday, August 21st, 2025

Copper inlay PCB is a special circuit design method that significantly improves heat dissipation capability and current loading performance by inlaying copper in a PCB. This technology is widely used in power electronics, automobile electronics, and GaN devices, helping to tackle the difficult heat management problem of traditional PCBs in high-power and high-density environments.

Do you suffer from these headaches?

Poor heat dissipation problem in traditional PCBs?
High manufacturing difficulty and cost issues, such as easy to have alignment issues and material waste?
The compatibility problem between design and manufacturing? For example, in design, there may be a compatibility problem between the inlay copper structure and the other parts of the PCBs, such as the layer alignment, hole diameter, and the edge treatment, which finally leads to the manufacturing difficulty increasing.
Problems with the material selection and cost?

Here are some real solutions Best Technology uses in customers’ projects.

Optimizing design and manufacturing process: Best Technology adopts high-precision manufacturing processes, such as laser etching or photolithography.
Optimizing material selection: We use high-purity copper material to improve conductivity and mechanical performance. Besides, select a copper substrate or an aluminum substrate to improve thermal dissipation performance and reliability.
Controlling costs and boosting manufacturing: Best Technology optimizes design to reduce material waste and manufacturing complexity.
Optimizing heat dissipation and thermal management: We employ a multilayer copper inlay structure to boost the thermal dissipation capability

Best Technology provides copper inlay PCB design optimization, prototype, mass production, and assembly service. We have productive experience to tackle the thermal dissipation problem, manufacturing difficulty, and material selection issues. If you have any technical questions or doubts, a warm welcome to get in touch with us at sales@bestpcbs.com.

What is copper inlay PCB?

Copper inlay PCB integrates solid copper pieces into specific areas of a PCB. It benefits to improve conductivity capability and quick heat dissipation performance. In high current or high power applications, this design is more reliable than the design that purely make the thicker copper layer.

What is the relation: PCB inner layer copper thickness, copper inlay PCB?

The PCB inner layer copper thickness directly affects the board’s electrical and thermal behavior. It is good to know that if purely depending on copper thickness can’t meet demands in high power applications, then copper inlay PCB has a key role here. It boosts the copper thickness and quality in the part area, so as to improve the performance of the current load and heat dissipation.

Aspect	PCB Inner Layer Copper Thickness	Copper Inlay PCB
Definition	Standard copper thickness used across PCB inner layers	Embedded solid copper blocks in selective PCB areas
Main Role	Supports current flow and basic thermal paths	Handles high current and localized heat dissipation
Application	General PCB design, balanced power distribution	High-power, high-density, or thermally stressed zones
Performance Impact	Limited by overall copper thickness	Significantly boosts current and thermal capability

What is difference: copper inlay PCB, copper pour in PCB?

Copper inlay and copper pour are different strategies. Copper pour in PCB generally is for large area grounding or power distribution; however, copper inlay PCB is for the part area strengthening. The former one is limited to copper thickness, and its heat dissipation capability is limited. However, the latter one conducts heat directly via a solid copper block, and its effect is more significant.

Aspect	Copper Inlay PCB	Copper Pour in PCB
Material	Solid copper blocks inserted into PCB cavities	Large copper area formed by plating during PCB process
Purpose	Localized thermal control and high-current pathways	Power planes, ground planes, signal return paths
Precision	Highly targeted in selected PCB zones	Spread across wide board sections
Thermal Efficiency	Superior, due to direct copper mass and conduction	Limited by copper thickness and plane size

Why do PCBs use copper inlay?

PCB using copper inlay to mainly tackle the problem of the heat dissipation bottleneck and the current overloading. As the device is getting smaller and smaller while the power is getting larger and larger, the traditional PCB copper layer is easy to overheat, leading to failure. Copper inlay technology provides a stable thermal path and the current route, which reduces the failure rate and extends the product lifespan radically.

How to inlay copper into PCB?

The fabrication process includes copper block cutting → inlaying it into the PCB cavity → lamination bonding → common drilling, plating, and the etching process.

In this way, it not only ensures the bonding between the copper block and circuit boards but also ensures the surface smoothness and the overall heat conductivity effect. In actual production, it may need to adjust the process according to the specific parameters, such as copper block thickness and substrate types.

What is the Copper inlay PCB price?

Copper inlay PCB price depends on the board’s size, design complexity, and copper block quantity. Although the cost is higher than a common PCB, in high-power applications, it will reduce the repair and maintenance costs significantly due to the good heat dissipation. Hence, from the whole lifespan cost, it will be more cost-effective.

What are the advantages of GaN device thermal with copper inlay PCB in high-power applications?

A GaN device thermal with copper inlay PCB gives engineers a way to manage extreme heat and high currents. And it takes center stage in the high-power applications.

The high efficiency of heat conductivity in the PCB minimizes the risk of GaN devices overheating, supporting consistent performance even under demanding conditions.

Enhanced heat management ensures more stable high-frequency operation and improves switching performance, making the device suitable for rigorous tasks.

The copper inlay PCB enables the device to handle higher current densities without performance loss or overheating.

Keeping reliable operation in the compact design.

Extending the lifespan of the device and reducing the heat stress.

How does PCB copper inlay improve heat dissipation?

PCB copper inlay offers a direct heat dissipation path for the key heating components. The specific performance is as follows:

Rapidly conduct heat into the copper layer or heat sinks.

Reduce the operation temperature of the key components.

Reduce hotspots and protect the sensitive devices.

Improve the integrated power efficiency and stability.

Extend the operation lifespan of circuit boards.

In summary, copper inlay PCB is a workable solution to tackle the problem in the heat dissipation of the high-power and high heat density applications, and in the electrical performance. Best Technology wins customers’ trust and repeat orders since our team not only ensures customers get reliable and high-performance circuit boards via our rigorous quality control and rapid lead time, but also provides high-quality solutions. If you have any new projects, just feel free to contact us for a free DFM analysis, quick prototype, full turnkey fabrication, assembly, and box build service at sales@bestpcbs.com.

Tags:copper inlay pcb
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COB immersion gold aluminum substrate, Gold immersion plating

Thursday, August 21st, 2025

COB immersion gold aluminum substrate is a high-power packaging solution that directly bonds the LED chip (Chip On Board) to an aluminum substrate treated with immersion gold.

The aluminum substrate quickly dissipates heat, while the immersion gold layer ensures long-term oxidation resistance of the chip pads, ensuring reliable soldering. This eliminates the need for brackets and reflow soldering, resulting in higher luminous efficacy and longer lifespan. It has become a core substrate for high-power LED modules.

COB immersion gold aluminum substrate, Gold immersion plating

Do you have any questions about COB aluminum PCBs?

Does the immersion gold coating and thermal conductivity meet COB heat dissipation requirements?

Do the dimensions and specifications match COB packaging and lighting fixture installation?

Can the immersion gold process and materials withstand long-term high-temperature use?

Do the performance and cost meet expected price/performance ratios?

BEST Technology’s COB aluminum substrates can answer your questions.

The immersion gold layer reduces contact thermal resistance, while the aluminum base and highly thermally conductive insulation layer quickly dissipate concentrated heat from the COB, ensuring efficient heat dissipation.

The COB package area size and overall shape can be customized to accommodate different power COBs and lamp mounting structures.

The immersion gold layer offers strong oxidation resistance, and the substrate has undergone high-temperature cycling testing without delamination, ensuring it can withstand the long-term high-temperature operating environment of the COB.

High heat dissipation ensures COB lifespan, while customized processing optimizes costs, resulting in a reasonable balance of performance and price.

What is COB aluminum substrate?

COB aluminum substrate is a type of PCB that directly mounts LED chips on an aluminum base. Unlike traditional PCBs that use fiberglass, aluminum substrates use metal for better heat dissipation. This structure ensures LEDs operate efficiently and last longer.

The core of a COB aluminum substrate consists of three layers:

A copper circuit layer for electrical connections.

A dielectric layer for insulation and heat transfer.

An aluminum base layer for mechanical support and thermal conduction.

This design keeps LEDs cool and improves performance. It’s the reason COB substrates are widely used in LED lighting, automotive lights, and high-power applications.

Is immersion gold the same as ENIG?

Yes and no. Immersion gold is a key step in the ENIG (Electroless Nickel Immersion Gold) process. ENIG has two layers: a nickel layer and a thin gold layer. Nickel acts as a barrier to protect the copper, and gold prevents oxidation and ensures good solderability.

Therefore, immersion gold usually refers to the gold layer applied in the ENIG process. This finish is popular because it provides excellent corrosion resistance and long shelf life.

Can you plate aluminum substrate with gold?

Yes, you can. In fact, plating aluminum substrates with gold is common in high-end electronic applications. However, the process is not as simple as plating copper. Aluminum forms an oxide layer quickly, which must be removed before plating.

To apply immersion gold on an aluminum substrate, BEST Technology first coat the aluminum with a conductive layer, usually copper. Then, they apply the ENIG finish on top. This method ensures strong adhesion and reliable performance.

What are the benefits of immersion gold on aluminum substrates?

The benefits are impressive. Here are the main reasons why immersion gold is chosen for COB aluminum substrates:

Superior Corrosion Resistance: Gold does not tarnish or oxidize, so it protects the surface even in harsh environments.

Excellent Solderability: The gold layer makes soldering easier and more reliable, especially for fine-pitch components.

Improved Electrical Performance: Gold has low contact resistance, which enhances signal integrity.

Long Shelf Life: Boards with immersion gold can be stored longer without losing quality.

High Reliability for LED Applications: COB LEDs generate heat, and gold plating helps maintain stable performance under thermal stress.

These benefits make immersion gold plating a preferred choice for high-end LED lighting, automotive electronics, and industrial controls.

How thick is gold in ENIG finish?

The gold layer in an ENIG finish is very thin, but it’s enough to provide excellent protection. Typically, the thickness ranges from 0.05 to 0.1 microns. This thin layer ensures good solderability without adding significant cost.

The nickel layer beneath the gold is thicker, usually around 3 to 6 microns. Together, these layers create a strong barrier that protects the copper from oxidation and maintains good electrical conductivity.

Is ENIG better than HASL?

For high-end applications like COB aluminum substrates, ENIG is better than HASL (Hot Air Solder Leveling). Here’s why:

Flat Surface: ENIG provides a smooth, flat surface, which is essential for small components and fine-pitch designs.

Better Corrosion Protection: Gold offers superior resistance to oxidation compared to HASL.

Higher Reliability: ENIG is more stable for thermal cycling and high-power devices.

HASL is cheaper and works well for simple boards, but for COB LEDs, ENIG is the clear winner.

What are the problems with ENIG solderability?

ENIG is reliable, but there are some challenges:

Black Pad Issue: If the plating process is not controlled, it can lead to corrosion of the nickel layer, causing poor solder joints.

Higher Cost: ENIG is more expensive than HASL or OSP finishes.

However, these issues rarely occur when working with BEST Technology, a trusted PCB manufacturer that follows strict quality controls.

What are the uses of COB aluminum substrate?

COB aluminum substrates are used in a wide range of applications:

LED Lighting: High-brightness LEDs for residential, commercial, and industrial lighting.

Automotive Lights: Headlights, tail lights, and daytime running lights.

Display Backlighting: LCD and signage displays that need uniform light.

Medical Equipment: Devices that require precise lighting and heat management.

Industrial Control Systems: Where stable performance and long life are critical.

These uses show how important COB immersion gold aluminum substrates are in modern technology.

Conclusion:

COB aluminum substrates provide excellent heat dissipation and mechanical strength for LED applications. When paired with immersion gold plating, they offer even greater reliability, corrosion resistance, and solderability. ENIG is better than HASL for high-end boards, and the gold layer, though thin, ensures long-lasting performance.

If you need high-quality COB immersion gold aluminum substrates, contact us today at sales@bestpcbs.com

Tags:COB immersion gold aluminum substrate, gold immersion plating, immersion copper plating, immersion gold on copper, silver immersion plating
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High Frequency PCB Materials, High Frequency Circuit Design

Thursday, August 21st, 2025

Have you ever faced such problems when design a PCB that used in high speed application?

Is your high-speed design bleeding signal strength?
How to solve poor thermal management in high-frequency systems to ensure stability and reliability?
How to effectively suppress severeEMI and meet EMC standards in high-frequency circuits?

At Best Technology, we fabricate high frequency PCB that can solve these problems. We use:

High quality materials with low loss and better shielding performance.
Utilize ground via array, densely arranging ground vias around radiation sources such as microstrip lines to form a “wall”.
Design multi-layer boards and adopt dedicated ground layers through reasonable stack-up design, provide a complete reference ground plane for high-frequency signals.

High frequency PCBs are essential in applications such as automotive radar, aerospace communication, medical imaging, 5G and satellite systems. These boards must handle signals above 100 MHz and, in many cases, well into the GHz range. At such speeds, signal losses, impedance mismatches, and electromagnetic interference (EMI) can cause severe degradation. Best Technology, a leading expertise in high frequency pcb manufacturing, can help to optimize your design and manufacture such board for you!

What is a High Frequency PCB?

A high frequency PCB is a printed circuit board designed to transmit signals above 500 MHz, often extending into 10 GHz, 30 GHz, or even higher depending on the application. Some applications, like automotive radar, require PCBs that perform stably at 77 GHz or more.

These boards are not limited to one sector. They are used in:

Wireless base stations and antennas
Radar for defense and vehicles
Satellite communication modules
High-speed computing and servers
Precision medical imaging devices

The key challenge is that as frequency rises, signals become more vulnerable to losses, reflections, and interference. A standard FR4 PCB cannot handle these issues beyond a certain point, which is why high frequency laminates and designs are essential.

High Frequency PCB Material

The choice of material determines how well a PCB will perform in high frequency environments. Engineers usually evaluate three main parameters:

Dielectric Constant (Dk): This defines how signals propagate through the material. A stable, low Dk improves signal speed and reduces delay.
Dissipation Factor (Df): Also called the loss tangent, this defines how much energy is lost as heat. Lower values are better for long-distance signal transmission.
Thermal Performance: Materials must handle fluctuating temperatures without expansion or deformation, especially in aerospace and automotive environments.

Common Materials Used in High Frequency PCB

PTFE (Teflon-based laminates): Offers extremely low loss and stable dielectric properties. Perfect for microwave and RF circuits, though harder to process during manufacturing.
Rogers laminates: Popular choices like RO4350B and RO3003 are widely used in communication devices due to their balance between cost and performance.
Arlon and Taconic: Trusted for aerospace and military-grade systems.
Ceramic-filled PTFE: Combines the benefits of PTFE with improved thermal stability, suitable for radar and satellite applications.
FR4: Economical, but only practical for low GHz applications, as losses rise sharply at higher frequencies.

When comparing FR4 to Rogers or PTFE, the difference is like comparing regular tires to high-performance racing tires. Both work, but only one is built for extreme conditions.

What is the Best PCB Material for High Frequency?

The “best” material depends on the actual use case. For example:

Up to 3 GHz: Rogers RO4350B provides stable performance at a manageable cost, widely used in RF applications.
Microwave range (10–30 GHz): PTFE laminates such as Taconic TLY or Rogers RO3003 give superior low-loss performance.
5G antennas: Low Dk and Df materials like Rogers RO4835 are chosen for consistent performance in outdoor environments.
Automotive radar (77 GHz): Ceramic-filled PTFE materials are the only reliable solution due to their high thermal and frequency stability.

Cost also matters. PTFE offers the lowest insertion loss but requires advanced processing, increasing manufacturing cost. Rogers materials are easier to fabricate and balance cost and performance, which is why they are widely used.

High Frequency PCB Characteristics

High frequency PCBs stand out due to specific characteristics:

Stable dielectric constant across wide frequencies
Low signal loss
Thermal durability
Controlled impedance
Dimensional stability

These boards are engineered not just to survive but to deliver reliable, repeatable performance in demanding environments.

High Frequency PCB Design Guidelines

Designing a high frequency PCB is a delicate balance of precision, material choice, and layout strategy. Even small mistakes in design can cause significant signal loss, reflection, or interference at gigahertz frequencies. Below are the key guidelines that engineers follow to ensure high performance.

1. Controlled Impedance Design

At high frequencies, the impedance of each trace must be carefully calculated and maintained. Variations in trace width, thickness, or dielectric spacing can cause reflections and signal degradation. Designers usually rely on simulation software to calculate controlled impedance for microstrip, stripline, or coplanar waveguide structures. The target impedance is often 50Ω for single-ended signals or 100Ω for differential pairs.

2. Minimize Trace Lengths

Signal paths should be as short as possible. Long traces increase insertion loss, cause delay, and may introduce unwanted reflections. In applications like RF communication or 5G antennas, even small increases in trace length can degrade signal integrity significantly.

3. Reduce the Number of Vias

Each via acts as a small inductance and capacitance, which can reflect high-frequency signals. Limiting via usage and optimizing via placement is essential. When vias are unavoidable, designers often use via stitching or back-drilling techniques to reduce parasitic effects.

4. Ground Planes and Reference Layers

A continuous, solid ground plane beneath signal traces improves return paths and minimizes electromagnetic interference (EMI). Multiple ground planes can be used in multilayer boards to enhance shielding and reduce noise coupling. Proper stacking ensures that signal layers are adjacent to reference planes, which stabilizes impedance and improves signal quality.

5. Differential Pair Routing

Differential pairs are widely used in high-speed digital and RF circuits. These pairs carry complementary signals, which improves noise immunity and reduces crosstalk. Designers maintain strict control over trace spacing, length matching, and symmetry to preserve signal integrity.

6. Stack-Up Optimization

The stack-up, or layer arrangement, determines how signal layers, power planes, and ground planes interact. Proper stack-up design can reduce cross-talk, improve thermal management, and control impedance. High frequency PCBs often use hybrid stack-ups with PTFE or ceramic layers to balance performance and manufacturability.

Every decision—from material choice to trace width, via placement to ground plane configuration—directly impacts signal integrity. A high frequency PCB is not just about connecting components; it is about managing signals, controlling impedance, and reducing loss to ensure reliable, precise performance in the gigahertz range.

High Frequency PCB Manufacturer – Best Technology

Not all manufacturers are capable of producing high frequency PCBs. Handling PTFE and ceramic materials requires different lamination temperatures, drilling techniques, and plating processes compared with FR4.

At Best Technology, we bring specialized expertise in:

Fabricating Rogers, Taconic, PTFE, and hybrid PCB stack-ups.
Maintaining strict dimensional tolerances for impedance control.
Advanced inspection to measure dielectric thickness, copper roughness, and loss factors.
End-to-end MES traceability to ensure every board can be tracked back to its source materials and processes.

This combination of material knowledge, certified systems, and engineering support makes Best Technology a trusted partner for customers who need more than just a standard PCB.

Insertion Loss Comparisons of Common High Frequency PCB Constructions

Material	Frequency (10GHz)	Insertion Loss (dB/inch)	Notes
FR4	~10GHz	0.7 – 1.0 dB	High loss, not recommended
Rogers RO4350B	~10GHz	0.2 – 0.3 dB	Cost-effective, reliable
Rogers RO3003	~10GHz	0.1 – 0.15 dB	Excellent for microwave use
PTFE Ceramic	~10GHz	0.05 – 0.1 dB	Premium choice for radar/5G

This table clearly shows why FR4 is avoided for RF designs. At high GHz levels, FR4 can lose more than three times the signal strength compared with PTFE laminates.

High Speed vs High Frequency PCB – What is the Difference?

The terms “high speed” and “high frequency” are often confused, but they describe different challenges:

High Speed PCB: Concerned with digital signals, rise times, and data rates. Examples: DDR memory boards, data centers, and Ethernet.
High Frequency PCB: Concerned with analog and RF signals in the GHz range. Examples: radar, antennas, and satellite communication.

In practice, many designs overlap. For instance, a 5G base station board must support high-speed data processing and high-frequency RF transmission simultaneously. This is why engineers often require both high-speed and high-frequency design expertise.

High Speed vs High Frequency PCB – What is the Difference?

Why Do We Need High Frequency?

High frequency PCBs enable many of the technologies that define modern life:

5G base stations and smartphones: Delivering ultra-fast, low-latency communication.
Automotive radar: Assisting advanced driver-assistance systems and autonomous driving.
Satellite communication: Providing global coverage for navigation and broadcasting.
Defense and aerospace: Supporting secure, high-performance radar and communication systems.
Medical devices: Enabling accurate imaging through MRI, CT, and ultrasound.

Without these boards, the next generation of communication and smart systems would not be possible.

Who Should Not Get High Frequency?

Not every project needs high frequency PCBs. For example:

A consumer product with simple sensors may not justify the extra cost.
Low-speed devices below 500 MHz can rely on FR4.
Cost-sensitive projects without high bandwidth needs should avoid high frequency laminates.

Choosing the right PCB type should always balance performance needs vs. budget.

FAQs

1. What frequency is considered high frequency in PCBs?

Any PCB designed to work above 500 MHz is typically considered high frequency, with advanced boards operating up to 60 GHz or more.

2. How does dielectric constant affect PCB performance?

A stable dielectric constant ensures signals propagate at predictable speeds and maintain impedance control, crucial for RF circuits.

3. Can FR4 be used for high frequency PCB?

FR4 works only up to around 1 GHz. Beyond that, losses become too high for reliable performance.

4. What are the challenges in manufacturing high frequency PCB?

Processing PTFE materials, achieving impedance accuracy, reducing insertion loss, and handling copper roughness are common challenges.

5. How to reduce signal loss in high frequency PCB design?

Use low-loss laminates, design shorter traces, avoid unnecessary vias, and apply smooth copper surfaces to reduce resistance.

Tags:high frequency pcb, high frequency pcb materials, high frequency vs high speed pcb
Posted in best pcb, bestpcb, Design Guide, FAQ, RF Board | No Comments »

Copper Multilayer PCB Manufacturer in China| Best Technology

Wednesday, August 20th, 2025

What is copper multilayer PCB? Let’s discover its material, benefits, applications, design guide for wearable device, production process through this blog.

Are you troubled with these problems?

High-frequency signal degradation killing your design?‌
Heat dissipation always a bottleneck?‌
Yield rates dropping with layer stacking?‌

Best Technology can provide service and solutions‌:

Rapid Response‌ – 24/7 engineering support, samples delivered in 48 hours.
Cost Efficiency‌ – Intelligent panelization + material reuse cuts costs by 15%.
‌Transparency‌ – Real-time production tracking with photo verification at key stages.

Welcome to contact us if you have any inquiry for copper multilayer PCB: sales@bestpcbs.com.

What is Copper Multilayer PCB?

Copper Multilayer PCB consist of alternating copper conductive layers and insulating materials (such as FR-4 or polyimide) bonded together through a lamination process. Copper’s high thermal conductivity (386W/m·K) and electrical conductivity support complex circuit designs, enabling high-density interconnection between layers through through-holes, blind vias, or buried vias.

This type of PCB is suitable for high-power applications (such as automotive electronics and 5G base stations), offering superior heat dissipation and signal stability compared to single- or double-layer PCBs. Its symmetrical structure (e.g., copper-prepreg-core-prepreg-copper) enhances mechanical strength and controls impedance. Some models also utilize thermal isolation technology to directly conduct heat.

What is Material of Multilayer Copper PCB?

1. Conductive Layer

Composition: Electrolytic copper foil (ED) or rolled copper foil (RA)
Features: Thickness 0.5–6 oz/ft² (17–210 μm), conductivity ≥58 MS/m (20°C), surface finish available: brown oxide (OSP) or nickel-gold (ENIG).

2. Insulation

FR-4: Epoxy resin + fiberglass, dielectric constant 4.2–4.8 (1 GHz), heat resistance 130°C (standard) / 170°C (high Tg).
Polyimide (PI): Dielectric constant 3.4–3.6 (1 GHz), heat resistance >250°C, short-term temperature resistance ≥300°C.

3. Prepreg (PP)

Composition: 7628/2116/1080 glass cloth impregnated with epoxy resin
Features: Thickness 0.05–0.2mm (0.1–0.4mm after lamination), resin content 52%–65%, curing conditions 180°C/60min.

4. Metal Substrate (Optional)

Aluminum Substrate: 1050/6061 alloy, thermal conductivity 180–220 W/m·K, thickness 1.0–3.2mm.
Copper Substrate: Electrolytic copper, thermal conductivity 386 W/m·K, thickness 0.5–2.0mm.

5. High-Frequency Material (Optional)

PTFE: Polytetrafluoroethylene, dielectric constant 2.2–2.5 (10 GHz), dissipation factor <0.001 (10 GHz).
Rogers RO4003C: dielectric constant 3.38 (10 GHz), dissipation factor 0.0027 (10 GHz).

6. Solder Mask

Composition: Liquid Photosensitive Solder Mask Ink (LPI)
Characteristics: Thickness 10–25μm, Temperature Resistance ≥ 150°C (short-term), Insulation Resistance ≥ 1×10⁸Ω.

What Are Advantages of Copper Multilayer PCBs?

Benefits of copper multilayer PCB:

High-density integration capabilities: By stacking multiple conductive layers (up to 32 layers), complex circuits can be integrated within a limited space, meeting the demands of miniaturized devices such as smartphone motherboards.
Excellent heat dissipation performance: Copper foil has a thermal conductivity of 400. W/m·K (nearly twice that of aluminum substrates), combined with a thick copper design (3–10 oz), allows for rapid heat conduction and reduces the junction temperature of high-power devices.
High-frequency signal integrity: Specialized high-frequency materials (such as PTFE) have a dielectric constant as low as 2.2–3.5, reducing signal loss and making them suitable for 5G base stations and radar systems.
Optimized electromagnetic compatibility: Multi-layer ground and power planes effectively shield electromagnetic interference (EMI) and reduce crosstalk risks.
Improved mechanical strength: Copper substrates offer superior deformation resistance to traditional FR-4, making them suitable for vibration environments such as automotive electronics.
Current carrying capacity: Thick copper layers (6 oz+) support high current transmission and reduce voltage drop in power modules.
Design flexibility: Supports advanced processes such as blind and buried vias and mixed dielectric layers to meet the needs of high-frequency, high-speed, and high-power hybrid designs.
Long-term reliability: Copper’s oxidation resistance and multi-layer laminate structure (using prepreg PP) extend product life, making them suitable for industrial control equipment.

What Are Advantages of Copper Multilayer PCBs?

What Are Applications of Copper Multilayer PCB?

Communications Equipment: 5G base stations, routers, mobile phone signal repeaters, fiber optic receivers
Computers and Data Centers: Server motherboards, hard drive controllers, graphics cards, storage devices
Medical Equipment: Heart monitors, CT scanners, X-ray equipment
Industrial Control and Automotive Electronics: Motor controllers, industrial automation systems, power converters, in-vehicle electronics
Aerospace: Satellite systems, space exploration equipment, radar
Consumer Electronics: Smartphones, wearable devices, game consoles
Energy and Power Systems: Power amplifiers, battery chargers, rectifiers, high-power conversion devices

How to Design a Copper Multilayer PCB for Wearable Device?

1. Material Selection & Substrate Optimization

Substrate: Prioritize polyimide (PI) or liquid crystal polymer (LCP), thickness 0.05–0.1mm, for flexibility (bending radius <5mm) and high-temperature resistance (Tg >250℃).
Conductive Layer: Use ultra-thin rolled annealed copper foil (RA, 0.5oz/17μm) to balance flexibility and conductivity (conductivity ≥58 MS/m).
Adhesive Layer: Apply low-modulus prepreg (PP) to reduce interlayer stress and prevent cracking during bending.

2. Stackup Design & Flexibility

Layer Count: Prioritize for 4-layer boards (Signal-Ground-Power-Signal) with total thickness 0.4–0.6mm to minimize weight.
Symmetry: Distribute copper layers symmetrically (e.g., Cu-PI-Cu) to avoid warping during bending; place ground and power planes adjacent to reduce EMI.
Flexible Zones: Use coreless structures (copper foil + PI only) in bending areas (e.g., wristband connections) for unrestricted flexibility.

3. Signal Integrity Assurance

High-Speed Signals: Design Bluetooth/Wi-Fi antennas as microstrip lines with 50Ω impedance control (trace width 0.15mm, spacing 0.1mm) and avoid 90° bends.
Differential Pair Routing: Route high-speed interfaces (USB, MIPI) with equal length (tolerance ±5mil) and spacing ≥3x trace width to minimize crosstalk.
Shielding: Add copper shielding layers (width ≥2mm) around antennas, grounded via stitching to reduce external EMI.

4. Power Distribution & Low-Power Design

Layered Power: Implement split power planes (e.g., 1.8V/3.3V) with power-ground spacing 0.1mm and decoupling capacitors (10μF + 100nF).
Low-Power Components: Select ultra-low-power MCUs (e.g., STM32L series) and PMICs, paired with hardware watchdogs to prevent lockups.
Layout Optimization: Place batteries, PMICs, and MCUs close to minimize trace length and reduce static power consumption.

5. Thermal Management Strategies

Heat Dissipation: Place copper foils (1oz thickness) under heat-generating components (MCUs, power chips) and connect via thermal vias (diameter 0.2mm, pitch 0.5mm) to external thermal areas.
Thermal-Electric Separation: Isolate high-power LEDs or battery chargers with dedicated copper layers to prevent heat transfer to sensitive components.
Material Enhancement: Embed graphene thermal films (0.01mm thickness) in critical zones to improve lateral heat conduction.

6. Mechanical Reliability & Bend Resistance

Solder Mask: Use high-flexibility solder mask (e.g., Taiyo PSR-9000), thickness 10μm, rated for >100,000 bend cycles.
Surface Finish: Apply ENIG (Electroless Nickel Immersion Gold) or OSP (Organic Solderability Preservative) to prevent copper oxidation and ensure solder reliability.
Validation: Pass dynamic bend tests (radius 3mm, 1Hz frequency, 10,000 cycles) and accelerated aging (85℃/85%RH, 168 hours).

7. Electromagnetic Compatibility (EMC) & Compliance

Grounding: Connect metal enclosures (e.g., wristband, buttons) to PCB ground via spring contacts or conductive adhesives, forming a Faraday cage to mitigate ESD.
Certification: Achieve CE (EU) or FCC (US) EMC compliance, testing across 80MHz–6GHz to ensure stable operation in complex electromagnetic environments.
Wireless Charging: Position Qi-standard coils at PCB edges, away from antennas and sensors to avoid interference.

How to Design a Copper Multilayer PCB for Wearable Device?

How was Copper Multilayer PCB Made?

1. Substrate Preparation

Select FR4 glass fiber epoxy resin laminate as substrate, with copper foil cladding (thickness 1oz/2oz).

2. Inner Layer Pattern Transfer:

Apply photosensitive dry film, transfer circuit pattern via UV exposure, and dissolve unexposed areas.
AOI (Automatic Optical Inspection) verifies line precision and marks defects.

3. Inner Layer Etching & Oxidation

Chemically etch copper not protected by dry film to form inner layer circuits.
Black oxide/brown oxide treatment on copper surfaces to enhance interlayer adhesion.

4. Lamination & Pre-Press

Stack inner layer core boards, prepreg sheets, and outer layer copper foils alternately, aligning via positioning holes.
High-temperature/high-pressure lamination (180-200℃) melts resin to fill gaps, forming a unified board.

5. Mechanical Drilling

CNC drilling machine processes through-holes/blind holes with diameter accuracy ±0.05mm.
Clean hole-wall resin residues (desmear).

6. Electroless Copper Plating

Deposit electroless copper (0.3-0.8μm) on hole walls to establish conductive base.
Electroplate to thicken copper layer (20-25μm) for reliable hole-wall conductivity.

7. Outer Layer Pattern Transfer

Repeat inner layer pattern transfer process, addressing hole alignment.
Use high-precision exposure equipment to compensate for interlayer deviation.

8. Outer Layer Etching & Stripping

Secondary etching defines outer layer circuits, with tin layer protecting desired copper areas.
Alkaline solution strips dry film, retaining circuit patterns.

9. Solder Mask & Silkscreen

Apply liquid photosensitive solder mask (green/black), expose and develop to expose pads.
Silkscreen component identifiers (white/yellow text).

10. Surface Finish

Treat pad areas with ENIG (Electroless Nickel Immersion Gold)/immersion tin/OSP to prevent oxidation and enhance solderability.
Plate gold finger areas with hard gold for wear resistance (e.g., board-edge connectors).

11. Electrical Testing

Flying probe test or bed-of-nails test verifies continuity and insulation.
AOI re-inspects for micro-shorts/opens.

12. Profiling & Packaging

CNC milling cuts board outlines; V-score or punching for separation.
Final cleaning, drying, and vacuum moisture-proof packaging.

Why Choose Best Technology as Copper Multilayer PCB Manufacturer?

Reasons why choose us as copper multilayer PCB manufacturer:

19 years of experience in copper substrate R&D: Precisely addressing interlayer heat dissipation and current carrying challenges in high-power multi-layer copper substrates, ensuring long-term stable operation of high-power devices (such as projectors/lasers).
Triple international quality certification (ISO9001/IATF16949/ISO13485): Medical and automotive-grade copper substrate production standards ensure ±1μm copper thickness uniformity in multi-layer board holes and zero deviation in electrical performance.
Customized thermal management solutions for copper substrates: Embedded copper pillars/thermoelectric separation structures reduce the thermal resistance of multi-layer boards to 0.5°C/W, extending the life of LEDs/power modules by over 30%.
Cost-optimized copper substrate design: Utilizing a gradient copper foil thickness (1oz outer layer + 2oz inner layer) to balance conductivity and heat dissipation requirements, saving 15% in material costs compared to traditional designs.
24-hour copper substrate rapid prototyping service: Laser drilling and electroless copper plating processes deliver high-complexity (20+ layers) copper substrate prototypes within 48 hours, accelerating the validation cycle for high-power products.
Free Copper Substrate Design for Material (DFM) Analysis: Preemptively identify design risks such as copper layer distribution and blind via alignment, preventing interlayer cracking caused by thermal expansion coefficient mismatch and reducing secondary re-board rework costs.
100% Automated Optical Inspection (AOI): Detects hole wall voids and copper nodules, a common feature of copper substrates, with a 0.01mm² level of defect detection, ensuring zero defective batch orders.
Full-Process Copper Substrate Solution: From thermal simulation (Flotherm) to copper layer etching and surface treatment (ENIG/HASL), we provide a one-stop service, reducing the cost of coordinating multiple suppliers.
Ultra-Thin Copper Substrate Process (0.2mm total thickness): Combining flexible PI substrate and copper foil calendering technology, we achieve a bend radius of less than 1mm for multi-layer copper substrates for wearable devices while maintaining a current density of 10A/cm².

Our Copper PCB Capabilities

Items	Technical Parameters
Product model	Copper PCB
Copper trace thickness	1OZ, 2OZ, 3OZ, 4OZ, up to 10OZ
Thermal Conductivity	1.0, 1.5, 2.0, 3.0W/m.K
Surface finishing	HAL(LF)/ Gold Immersion/ Gold plating/ OSP/ Immersion Tin/ Silver Immersion
Soldermask Color	White/Black/Green/Blue/Red/Yellow
Layers	1L, 2L, 4L, 6L, 8L, double sided, COB
Maximum dimension	1,100mm*480mm; 1,500x300mm
Minimum dimension	5mm*5mm
Minimum Line width/space	0.1mm/0.1mm
Warp and twist rate	≤0.75%(thickness:1.6mm, measurement:300mm×300mm)
Board Thickness	0.3－4.5mm
Die-Punching dimension tolerance	±0.15mm
V-cut positioning tolerance	±0.1mm
Manufacturing capability	6000m²
Wall Cu thickness	15-25um
Alignment tolerance	±0.076mm
Minimum diameter of die-punching hole	Thickness <=1.0mm: 1.0mm
	Thickness 1.2-3.0mm: 1.5mm
	Thickness 4.0mm: 2.0mm
Minimum size the square groove/slot/cutout	Thickness <=1.0mm: 0.8mm×0.8mm
	Thickness 1.2-3.0mm: 1.0×1.0mm
	Thickness 4.0mm: 1.5×1.5mm
Outline Tolerance	CNC routing：±0.1mm; Die-punching：±0.15mm
Minimum diameter of hole	0.3mm; not limit for maximum diameter of hole
Surface Finishing Thickness	gold plating：Ni 2.5-5um, Au: 0.025－0.075um
	immersion gold: Ni 3-6um, Au: 0.025-0.1um
	HAL(LF): 3-30um
V－cut Angle tolerance	±5°
V-cut Range	0.3mm-4.5mm
Smallest silkscreen height	0.15mm
Smallest PAD	0.1mm

How to Get a Quote for Copper Multilayer PCB Project?

Essential Documentation for Copper Multilayer PCB Quotation

Lamination Stackup Drawing: Specify layer materials (e.g., FR-4/Rogers 4350), copper thickness (1–6OZ), dielectric thickness (mm), and impedance control targets.
Gerber Files: Include circuit layers, drilling layers, and solder mask layers. Annotate trace width/spacing (e.g., 4/4mil), blind/buried via positions, and hole tolerance (±0.05mm).
PCB Technical Parameter Sheet: Board dimensions (L×W×T), layer count (e.g., 8L), surface finish (ENIG/OSP), and special processes (via plating/half-hole).
Impedance Control Requirements: Define differential pair impedance (e.g., 100Ω±10%), reference layers, and testing methods.
Acceptance Criteria: Specify IPC class (e.g., IPC-6012 Class 3) and testing items (flying probe/AOI/X-ray).
Quantity & Lead Time: Prototype/batch quantity (e.g., 5pcs/1k) and desired delivery timeline (e.g., 7-day expedited).
Special Requirements: High-frequency/thermal needs (e.g., PTFE hybrid), environmental certifications (RoHS/UL).

Why Partner with Best Technology?

Expertise: Handles 16+ layer thick copper (6OZ) and hybrid high-frequency boards.
Speed: Offers 48-hour quick quotes and complimentary impedance calculation.
Quality: Free DFM review to eliminate design flaws upfront.
Result: Avoid cost overruns, accelerate time-to-market, and ensure compliance for demanding applications.

Welcome to contact us if you have any request for copper multilayer PCB: sales@bestpcbs.com.

Tags:Copper Multilayer PCB, Multilayer Copper PCB
Posted in best pcb, bestpcb, mcpcb, Metal Core PCB | No Comments »

High Frequency PCB Design Guidelines – RF PCB Basic Acknowledge

Wednesday, August 20th, 2025

Are you often curious about these questions about high frequency PCB?

Have you ever wondered why some electronic systems lose performance at higher frequencies?
Why a well-designed PCB for low-speed circuits often fails when pushed into GHz ranges?
How can designers minimize losses above 1 GHz?

The answer lies in the design of high frequency PCBs. High frequency PCBs also known as RF PCB or radio frequency pcb. They are more important in applications such as 5G, automotive radar, aerospace communication, medical imaging, and satellite systems. These boards must handle signals above 100 MHz and, in many cases, well into the GHz range. At such speeds, signal losses, impedance mismatches, and electromagnetic interference (EMI) can cause severe degradation.

This blog provides detailed guidelines for designing high frequency PCBs. From material selection to signal routing, impedance control, thermal management, and testing, we will walk through the critical factors engineers must consider.

What Frequency Range is Considered High Frequency in PCB Design?

In PCB engineering, high frequency generally refers to signal frequencies above 500 MHz. For RF and microwave circuits, the range extends from 1 GHz up to 100 GHz. Typical applications include:

Wi-Fi (2.4 GHz / 5 GHz)
Bluetooth (2.4 GHz)
5G NR bands (3.5 GHz / 28 GHz / 39 GHz)
Automotive radar (24 GHz / 77 GHz)
Satellite communication (Ku-band 12–18 GHz, Ka-band 26–40 GHz)

The higher the frequency, the more sensitive the PCB becomes to signal loss, dielectric constant stability, and copper surface roughness. For instance, at 28 GHz (5G mmWave), even 0.1 dB/cm of insertion loss can cause serious degradation in system performance.

High Frequency PCB Design Guidelines - RF PCB Basic Acknowledge

What PCB Materials are used for High Frequency Applications?

The dielectric substrate is the foundation of high frequency PCB design. Key material properties include:

Dielectric Constant (Dk): Should remain stable across frequency and temperature.
Dissipation Factor (Df): Lower values mean lower signal loss.
Thermal Conductivity: Crucial for high-power RF designs.

Common Materials for High Frequency PCBs

Material Type	Dielectric Constant (Dk)	Dissipation Factor (Df) @10GHz	Thermal Conductivity (W/m·K)	Typical Use Case
FR4 (High Tg)	4.2–4.7	0.020–0.025	0.3	<1 GHz, low-cost boards
Rogers RO4350B	3.48 ±0.05	0.0037	0.69	2–20 GHz, antennas
Rogers RO3003	3.00 ±0.04	0.0013	0.50	mmWave 5G (28 GHz, 39 GHz)
Taconic RF-35	3.50	0.0018	0.62	Microwave circuits
PTFE (Teflon)	2.1–2.6	0.0009–0.0015	0.25–0.30	Aerospace, radar
Ceramic-filled PTFE	3.0–10	0.001–0.005	0.7–1.2	High-power RF

Data comparison shows that Rogers RO3003 has one of the lowest Df values, making it widely used in 5G mmWave base stations. PTFE-based laminates dominate satellite and radar applications where extreme performance is required.

How Does Dielectric Constant Affect Signal Speed?

The dielectric constant (Dk) directly influences the propagation velocity of signals on PCB traces. The relation is:

Where c = 3 × 10^8 m/s (speed of light in vacuum).

For FR4 (Dk ≈ 4.5) → v ≈ 1.41 × 10^8 m/s
For Rogers RO4350B (Dk ≈ 3.48) → v ≈ 1.61 × 10^8 m/s
For PTFE (Dk ≈ 2.2) → v ≈ 2.02 × 10^8 m/s

This means PTFE substrates allow signals to travel ~43% faster than FR4. In high-speed digital systems (like SerDes 56G PAM4 links), such differences greatly influence timing margins.

What are the Key Design Rules for High Frequency PCB Layout?

Designing high frequency boards requires stricter rules compared to conventional PCBs:

1. Controlled Impedance Traces

Single-ended 50 Ω, differential 90–100 Ω are typical.
Impedance tolerance must be within ±5% for frequencies above 10 GHz.

2. Insertion Loss Minimization

Use smooth copper foils (Ra < 2 μm).
Keep transmission lines short.
Avoid unnecessary vias, which can introduce 0.1–0.2 dB loss per via at 10 GHz.

3. Ground Plane Integrity

Solid reference planes reduce return path discontinuities.
Use via fences to confine RF energy.

4. Crosstalk Reduction

Maintain spacing ≥3× trace width between high frequency lines.
Place sensitive analog circuits far from digital noise sources.

5. Thermal Management

For power amplifiers, substrates with >0.8 W/m·K thermal conductivity are recommended.
Use thermal vias under RF components for efficient heat dissipation.

What are the Key Design Rules for High Frequency PCB Layout?

How Thick should a High Frequency PCB be?

The thickness of the PCB substrate directly impacts impedance and signal integrity. Typical stack-up configurations:

PCB Thickness	Layer Count	Dielectric Thickness	Frequency Application
0.2–0.4 mm	2–4L	0.1 mm core	High-speed connectors, 10–20 GHz
0.6–0.8 mm	4–6L	0.2 mm core	2.4/5 GHz Wi-Fi, Bluetooth
1.0–1.6 mm	6–10L	0.3–0.5 mm core	Automotive radar, 24 GHz
2.0+ mm	8–12L	>0.5 mm core	28 GHz 5G, satellite boards

For example, in 77 GHz automotive radar PCBs, manufacturers often use 0.254 mm or thinner substrates to reduce dielectric loss and keep microstrip lines narrow enough for impedance control.

How to Reduce Signal Loss in High Frequency PCB Design?

Signal loss (attenuation) is one of the biggest concerns in high frequency circuits. It is affected by:

Dielectric Loss: Higher Df increases insertion loss.
Conductor Loss: Surface roughness increases resistance at high frequencies due to skin effect.
Radiation Loss: Poor layout or sharp bends radiate energy.

Example of Insertion Loss Data

Material	Frequency	Line Length	Insertion Loss
FR4 (Df 0.020)	10 GHz	10 cm	-1.2 dB
Rogers RO4350B	10 GHz	10 cm	-0.25 dB
PTFE (Df 0.001)	10 GHz	10 cm	-0.05 dB

This demonstrates why high frequency applications almost never rely on standard FR4.

In Conclusion

Designing a high frequency PCB requires more than standard PCB know-how. From material selection to impedance control, routing, thermal management, and advanced testing, every step must be carefully engineered.

Best Technology is a trusted PCB manufacturer in China with expertise in high frequency PCB fabrication. We offer advanced laminates like Rogers, Taconic, and Isola, alongside ISO9001, ISO13485, IATF16949, and AS9100D certifications. Our team applies rigorous quality control, competitive pricing, professional engineering support, and MES-based traceability to deliver reliable high frequency PCBs for industries such as 5G, automotive radar, medical devices, and aerospace.

If your project requires precise high frequency PCB solutions, Best Technology is ready to provide professional guidance and manufacturing excellence.

FAQs

1. Can FR4 be used for high frequency PCBs?

Yes, but only for frequencies below ~1 GHz. For anything higher, specialized laminates are required.

2. What is the most commonly used material for 5G PCBs?

Rogers RO4350B and RO3003 are widely adopted due to their low loss at mmWave bands.

3. How do vias affect high frequency performance?

Each via can add 0.1–0.2 dB loss at 10 GHz, so designers minimize via count in RF paths.

4. Why is surface roughness important?

At high frequencies, the skin effect confines current to the outer conductor surface. Rough copper increases resistance and loss.

Tags:high frequency pcb, high frequency pcb design guide, radio frequency pcb, RF PCB
Posted in best pcb, bestpcb, Design Guide, FAQ, RF Board, Special PCB | No Comments »

Copper Pour PCB, Copper Pour in PCB

Wednesday, August 20th, 2025

What is copper pour PCB? Let’s discover its function, application, clearance design rules, grounding and connection problems and solutions, dead zones and sharp problems and solutions.

Are you worried about these problems?

Why does my high-speed PCB always have signal integrity issues?
How can I reduce thermal hotspots in dense component layouts?
What’s the most cost-effective way to improve EMI performance?

Best Technology can provide service and solutions:

Optimized copper pour design: Reduces impedance discontinuities and crosstalk by providing uniform current paths.)
Thermal-balanced copper pour: Dissipates heat evenly through enhanced thermal conductivity.)
EMI-shielded copper pour: Acts as a natural Faraday cage to minimize radiated emissions.)

Welcome to contact us if you have any request for copper pour PCB: sales@bestpcbs.com.

What is Copper Pour PCB?

Copper pour PCB (also called as copper pour in PCB) design refers to the technique of filling unused areas on a circuit board with conductive copper, typically connected to ground or power networks. It involves filling blank areas of a circuit board (not layout traces) with a continuous layer of copper foil using polygonal fills automatically generated by the design software. These copper foil areas are typically connected to the board’s ground plane (GND) or power plane (VCC), forming a complete conductive layer.

What is the Purpose of the Copper Pour on a PCB?

Signal Integrity: Provides low-impedance return paths for high-frequency signals, reducing electromagnetic loss.
EMI/RFI Shielding: Acts as conductive shielding to suppress external/internal electromagnetic interference.
Thermal Dissipation: Enhances heat transfer from high-power components via copper’s thermal conductivity.
Power Stability: Stabilizes voltage delivery through low-inductance copper planes for high-current circuits.
Structural Integrity: Balances copper distribution to prevent board warpage during fabrication.
Cost Efficiency: Reduces production costs by minimizing copper etching waste and simplifying processes.
Impedance Matching: Enables precise impedance control for high-speed signals via ground plane integration.

What Are Applications of Copper Pour PCB?

Lighting Systems: LED streetlights, automotive lights, surgical lighting.
Automotive Electronics: Electric vehicle battery management, motor controllers, charging systems, and headlight drivers.
Communications Equipment: 5G/6G base stations, RF amplifiers, antenna modules, and filtering devices.
Industrial Equipment: Welding machines, solar inverters, UPS power supplies, and robotic control systems.
Medical Equipment: MRI systems, X-ray machines, and surgical laser equipment.
Computers and Consumer Electronics: CPU motherboards, game consoles, and smartphones.
Aerospace: Satellite communications, radar, and avionics equipment.

What is the Difference between Copper Pour and Trace?

Characteristic	Trace	Copper Pour
Definition	Conductive path for signal/current	Filled copper area for functional/thermal purposes
Function	Signal/current transmission	Heat dissipation, EMI shielding, high-current carrying
Smart Avoidance	None (manual adjustment required)	Auto-isolates from other networks
Design Method	Manual routing line by line	Auto-fills irregular regions
Short Circuit Risk	Low (independent path)	High for standard pour, low for filled pour
High-Frequency Adaptability	Susceptible to interference (requires width/spacing optimization)	Reduces crosstalk (avoids via resonance)
Typical Thickness	0.7 mil (½ oz) or 1.4 mil (1 oz)	4 mil (standard)

PCB Copper Pour Clearance Design Rules

1. Core Spacing Values

General Baseline: Copper pad to pad/via distance ≥0.2mm (1oz copper foil) or ≥0.33mm (2.5oz copper foil). Any distance below this will result in a short circuit.
High-voltage scenarios: Calculate clearance based on voltage (e.g., 220V requires ≥2.5mm), using the maximum of clearance and creepage distances.
Board Edge Treatment: Copper pad to cutting line ≥0.8mm; otherwise, the copper sheet may tear during milling.

2. Specific Scenarios

Under capacitors: Copper pads are strictly prohibited, with a spacing of 0.1mm (to prevent parasitic capacitance from interfering with signals).
Antenna Area: Clearance below wireless modules ≥12.5mm (to prevent signal coupling, measured values).
Gold-plated board edges: Copper pad setback ≥0.5mm (to prevent corrosion caused by plating solution infiltration).

3. Software Practice (AD/KiCad)

Rule Settings:

Global Spacing: Start at 0.5mm (20mil), with separate rules for high-voltage areas.
Copper Pad Specific: Set to 0.8mm when no solder mask is present (to facilitate repair and soldering).
Priority Suppression: Board-Level Rules > Net-Level Rules > Single-Object Rules. In case of conflict, the strictest value is used.

4. Manufacturing Minefields

Peelable Structures: Isolated copper islands in the copper pad with a width less than 0.2mm will be deleted (etching will cause breakage).
Copper Layer Text: Text must be ≥0.15mm away from the copper pad (otherwise, the silkscreen will be blurred).
Sharp Angle Prohibition: Copper pad corners must be ≥45° (sharp corners can cause excessive corrosion during acid etching).

5. Signal Terms

High-Speed Lines: Copper pads must be ≥3 times the line width away from clock lines (e.g., a 0.2mm line width requires a 0.6mm setback).
Grounding copper: The spacing between copper layers in different voltage domains should be ≥1mm (to prevent leakage current).

Dead Zones and Sharp Angles Problems in Copper Pour PCB Design

Dead Zone Problems:

1. Electrical Isolation Failure: Isolated copper areas not connected to the network (dead copper) create an antenna effect, increasing electromagnetic interference (EMI), causing high-frequency signal distortion or noise interference.

2. Thermal Stress Concentration: Dead copper cannot effectively dissipate heat, causing local overheating that accelerates component aging and shortens PCB life.

3. Manufacturing Defect Risk: Dead copper can easily peel during etching, causing shorts or opens.

Dead Zone Solutions:

1. Ground Via Connection Design: Add ground vias (vias) in large dead copper areas, connecting them directly to the ground network (recommended density ≥ 1 per square centimeter) to eliminate the antenna effect.

2. Copper Layer Optimization Strategy: Avoid copper pouring in unrouted areas (such as mid-layer routing openings); use a grid-like window design (heat dissipation vias) to improve heat dissipation.

3. Automated Design for Factoring (DFM) Checking: Use EDA tools to run DFM rule checks (e.g., Gerber files with board outlines) to automatically identify and remove dead copper areas.

Sharp Angle Problems:

1. Enhanced EMI Radiation: Sharp angles (≤90°) form high-frequency transmitting antennas, interfering with sensitive circuits such as clock signals and increasing signal noise.

2. Etchant Traps: Etching solution accumulates at sharp angles, unevenly corroding the copper layer and causing wire breaks or shorts (the risk is doubled for trace widths ≤5 mils).

3. Mechanical Fragility: Sharp angles are susceptible to fracture under thermal stress, leading to open circuit failures, which is particularly serious in industrial-grade PCBs.

Sharp Angle Solution:

1. Replacement of Curved Corners: Use 45° bevels or arcs (arc radius ≥ 2 times the trace width) for all trace turns, completely avoiding 90° angles.

2. Line Optimization: Widen high-voltage/high-frequency lines (e.g., power lines ≥ 20 mils), ensuring smooth, chamfer-free lines; prioritize large-area copper pours for ground lines.

3. Embed Design for Functional Measurement (DFM) rules: Set minimum bend radius (≥ 0.2 mm) and line-to-space ratio (≥ 1:1), and use EDA tools to automatically correct sharp angles.

Grounding and Connection Problems in Copper Pour PCB Design

1. Grounding Failure Causing Noise/EMI Problems:

Ungrounded copper areas act as EMI antennas.
Long/impedance-mismatched ground paths disrupt high-frequency signal return.

Grounding Failure Causing Noise/EMI Solution:

Auto-connect copper to GND in Altium, use via stitching to link top/bottom copper to inner ground planes.
Limit high-frequency signal return paths to ≤ λ/20.
Use 4-layer stackup (Sig/Gnd/Pow/Sig) for direct top/bottom-to-ground connections.

2. Copper-Via/Pad Disconnection Problems:

Thermal stress or manufacturing errors break copper-via/pad links.
Flex PCBs develop cracks in bent areas.

Copper-Via/Pad Disconnection Solution:

Add teardrop transitions at vias to increase contact area.
Use edge-plating for flex PCBs with prepreg reinforcement.
Confirm min. copper thickness (≥1oz) and via spacing (≥0.3mm) with fabricators.

3. High-Frequency Loop Interference Problems:

Copper loops cause magnetic coupling, inducing crosstalk/oscillation.
Asymmetric differential pair returns disrupt impedance matching.

High-Frequency Loop Interference Solution:

Isolate analog/digital grounds with beads/0Ω resistors; connect copper to single GND.
Add guard ground traces (≥3× line width) around differential pairs.
Optimize copper shapes via SIwave EM simulation.

4. Thermal Expansion Failure Problems:

CTE mismatch under power devices causes pad/copper cracking.

Thermal Expansion Failure Solution:

Use mesh copper under power components with via arrays to inner ground.
Select FR-4 TG170 for CTE compatibility.

5. Fine-Pitch Component Shorting Problems:

Copper near BGA/QFN pads causes solder bridging.

Solution:

Set copper clearance ≥0.2mm (8mil) in Altium DRC.
Remove local copper under BGAs while preserving critical signal paths.

Why Choose Best Technology as Copper Pour PCB Supplier?

19-Year PCB Manufacturing Expertise: Proven track record in handling complex designs (e.g., HDI, RF, automotive) with 98.5% on-time delivery.
Global Certifications: ISO 9001, ISO 13485, UL and RoHS compliance guarantee product safety and regulatory adherence.
Fast Turnaround: 24-hour rapid prototyping and 5-day standard delivery for copper pour PCBs (3oz-10oz), accelerating time-to-market.
Cost Efficiency: Optimized production processes and bulk material procurement reduce costs by 15-20% compared to industry averages.
Strict Quality Inspection: 100% AOI inspection for bulk orders + 3D X-Ray scanning ensures <0.05% defect rate, minimizing rework costs.
Free DFM Analysis: Pre-production design checks identify copper pour issues (e.g., dead zones, sharp angles), saving $5,000+ in potential redesign costs.
Free Engineering Support: Dedicated team provides copper pour optimization, impedance control, and thermal management solutions at no extra charge.

Welcome to contact us if you have any inquiry for copper pour PCB: sales@bestpcbs.com.

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