Aluminium PCB boards are metal-based printed circuit boards with an aluminum alloy substrate. Their thermal conductivity is dozens of times higher than that of traditional FR-4, allowing them to quickly dissipate heat from chips and prevent failures caused by hot spots. Combined with highly reflective white oil and a thin insulating layer, they serve as both a circuit and a heat sink, making them widely used in LED lamps, power modules, and automotive electronics.
How to make aluminium PCB board?
Making an aluminium PCB board involves precision and the right materials. It starts with choosing a quality aluminium substrate. It’s then coated with an insulating dielectric layer, which isolates the conductive copper from the metal.
Next comes copper lamination. A thin sheet of copper is pressed onto the dielectric surface. This copper layer will form the circuit paths. Once laminated, the board is cleaned and coated with a photoresist. Ultraviolet (UV) light exposure follows, using a circuit design mask to harden certain parts of the photoresist.
Unexposed areas are washed away, revealing the pattern. The exposed copper is then etched off, leaving behind the circuit layout. After this, any remaining photoresist is stripped. Now the board is cleaned and goes through a surface finish process, such as HASL or ENIG, depending on the end-use.
Finally, the board is cut into shape and tested for functionality. Every step is crucial for ensuring electrical performance and heat resistance.
How does the aluminium PCB manufacturing process work?
Material preparation: Choose an aluminium base, usually with a thickness of 0.8mm to 3.0mm. Apply a thermal insulation layer and copper foil.
Lamination: Bond the dielectric and copper layers tightly to the aluminium. Heat and pressure ensure this bond holds firm.
Imaging: Apply a photoresist film and expose the board under UV light. The light hardens the areas forming the copper traces.
Etching: Remove unwanted copper using chemical solutions. Only the protected areas from imaging remain.
Drilling and Plating: Drill precise holes for component leads or vias. Plate these holes if needed.
Solder Mask and Surface Finish: Apply a protective solder mask to non-conductive areas. Add a surface finish to enhance solderability and corrosion resistance.
Testing: Perform electrical tests to check for shorts, open circuits, and reliability.
Profiling: Cut the board to the desired size and shape.
These steps are controlled tightly. That’s why working with an experienced aluminium PCB manufacturer is critical.
How to design an efficient aluminum PCB?
Designing an effective aluminium PCB starts with understanding its strengths. Heat management is the top reason to use aluminium. Start by placing high-power components closer to the metal core. This reduces thermal buildup.
Keep trace lengths short and direct. This minimizes resistance and power loss. Use wider traces for higher current paths. Layer stack-up also matters. A single-layer design is often enough for LED and power circuits. For more complex boards, consider a multilayer design.
Thermal vias can help in spreading heat, especially in multilayer boards. Select the right thickness for your dielectric layer to ensure proper insulation and heat flow.
When choosing the surface finish, think about the end application. ENIG works well for fine-pitch components. HASL is good for general use.
Excellent aluminum PCB design balances electrical, mechanical, and thermal performance. Choose BEST Technology, you will get the best aluminum PCB design
What are the layers of aluminum PCB?
Aluminium PCB boards generally have three layers:
Aluminium Base Layer: This is the mechanical support and heat conductor. It’s usually made of alloy 5052 or 6061 for strength and heat resistance.
Dielectric Layer: Placed between the base and copper foil. This insulation layer resists heat and electrically isolates the copper traces. Thickness varies from 50µm to 200µm.
Copper Layer: This is the conductive layer where the circuit forms. Thickness can range from 1oz to 3oz depending on current requirements.
Some designs include additional layers:
Solder Mask: Applied over the copper to prevent oxidation and short circuits.
Silkscreen: For labeling component placements and orientation.
These layers combine to offer durability, high thermal conductivity, and efficient current flow in one compact board.
What is the highest temperature aluminum PCB can withstand?
Aluminium PCBs are built to handle high heat. Their metal base and insulating layer offer much better thermal management than standard FR4 boards. Depending on the material used, aluminium PCBs can endure temperatures between 120°C to 150°C continuously.
For short durations or pulse heating, they can handle spikes up to 250°C. Some high-grade aluminium PCBs, with advanced dielectric materials, may go even higher.
This heat resistance makes them ideal for LED lighting, automotive controls, and power converters. Proper design and material selection can ensure your board works reliably in high-heat environments.
Can aluminum PCB support high frequency signals?
Yes, aluminium PCB boards can support high frequency signals. But it depends on the quality of the dielectric layer. A low-loss dielectric material ensures signal stability.
In high-frequency applications, such as communication devices and radar systems, signal integrity is crucial. Aluminium PCBs with high-performance dielectric can deliver clear, uninterrupted signals.
Design also plays a role. Keep signal paths short and separate analog from digital traces. Ground planes and impedance control improve performance even more.
Though aluminium PCBs aren’t the first choice for all RF applications, they work well in many mid-frequency designs.
How strong is FR4 compared to aluminum?
FR4 is the standard fiberglass material used in many PCBs. It’s lightweight, low-cost, and electrically reliable. But when it comes to strength and heat resistance, aluminium is superior.
Aluminium offers better mechanical support. It doesn’t warp under heat like FR4. It also dissipates heat much faster, which is vital in LED or power circuits.
FR4 works well for multi-layer signal processing boards. But for durability, thermal control, and stability, aluminium PCBs outperform FR4 in harsh conditions.
So, if your project demands strength and heat resistance, aluminium PCB is the better choice.
How does aluminum PCB compare to rigid flex and HDI PCB?
Aluminium PCBs, rigid flex PCBs, and HDI PCBs each serve different needs.
Aluminium PCB: Best for heat-intensive applications. Offers strong thermal management and mechanical strength.
Rigid Flex PCB: Combines flexibility and rigidity. Perfect for compact devices with moving parts like cameras or foldable screens.
HDI PCB: Designed for high-density circuits with microvias. Used in smartphones, tablets, and miniaturized electronics.
If your design demands heat dissipation and durability, aluminium wins. If space-saving and flexibility are key, go with rigid flex. For high-speed, high-density circuits, HDI is the way to go.
Conclusion:
Aluminium PCB boards are powerful and reliable. In many cases, they outperform traditional solutions in terms of heat dissipation and mechanical strength. Whether you’re working on LED lighting, power electronics, or high-frequency devices, Aluminium PCB boards provide a solid foundation.
Choose a professional partner to get the best results. At Best Technology, we specialize in high-quality aluminium PCB boards with custom design support and fast delivery.
If you are working on high-power electronics, LED lighting, or power conversion modules, thermal management is probably one of your biggest challenges. That’s where the double sided IMS PCB comes into play.
As a reliable IMS PCB manufacturer, Best Technology has been helping engineers and purchasing teams solve complex design issues using double sided metal core solutions that offer excellent thermal performance and mechanical strength. Our products are widely used in various applications like LED lighting, automotive electronics, power modules, and more.
What Is a Double Sided IMS PCB?
A double sided IMS PCB (Insulated Metal Substrate Printed Circuit Board) is a type of PCB that uses a metal base—typically aluminum or copper—combined with two copper layers and insulating dielectric layers in between. This structure allows designers to place components on both sides or route critical signals more efficiently while managing heat effectively.
Unlike single-sided IMS PCBs that have components and traces only on one side, double-sided versions support components mounting and traces layout both on top and bottom side, it allowed complex designs, higher current flow, and better heat transfer through thermal vias.
In simple terms: if your board gets hot and needs more routing space, a double sided IMS PCB can help.
Double Sided IMS PCB Structure
A double sided IMS PCB is built with multiple carefully selected layers, designed to balance electrical performance, mechanical strength, and heat dissipation. The general structure looks like this:
Top copper layer: Carries the electrical traces and component pads.
Top dielectric layer: An electrically insulating but thermally conductive material.
Metal core: Usually aluminum or copper, it serves as a mechanical base and heat sink.
Bottom dielectric layer: Same material as the top layer, separating the metal core from the bottom copper.
Bottom copper layer: It is a trace layer, used for power, ground, or additional signal traces.
Plated through holes (vias) allow electrical connection between the top and bottom copper layers. These vias can also help conduct heat away from hot components into the metal core, improving thermal performance.
Types of IMS PCB Materials
In IMS PCB design, the metal base plays a critical role in heat dissipation and mechanical stability. The two most commonly used core materials are aluminum and copper, each with distinct advantages and application scenarios.
1. Aluminum-Based IMS PCB
Aluminum is by far the most widely used metal base material in IMS PCBs. It offers a great balance between cost, weight, and thermal performance. With a typical thermal conductivity of 1.0 to 3.0 W/m·K, aluminum is sufficient for most applications where moderate heat needs to be managed efficiently.
Advantages of aluminum base:
Cost-effective: More affordable than copper, suitable for mass production.
Lightweight: Ideal for weight-sensitive designs like automotive lighting and portable devices.
Corrosion-resistant: Naturally forms a protective oxide layer, extending board life.
Good thermal conductivity: Capable of dissipating heat from surface-mounted components quickly.
Typical applications:
LED lighting systems (e.g. street lights, home bulbs)
Power driver boards
Consumer electronics
Automotive LED modules
Aluminum IMS PCBs are perfect for designs that need reasonable thermal performance at a lower cost. They’re especially common in LED products, where keeping junction temperature low is essential to extending light source life.
2. Copper-Based IMS PCB
Copper-based IMS PCBs are chosen when thermal management becomes critical, or when mechanical robustness is equally important. Copper has a thermal conductivity of around 5.0 W/m·K—more than double that of aluminum—making it an ideal choice for high-power or high-density applications.
Advantages of copper base:
Superior heat dissipation: Excellent for fast heat transfer in high-power designs.
High mechanical strength: Less prone to flexing or warping under load or heat.
Stable performance at high temperatures: Supports continuous operation in demanding environments.
Better current carrying capacity: Enables narrower traces for the same current level.
Typical applications:
Power inverters and converters
Motor control units and industrial drives
RF amplifiers and telecom power modules
Aerospace and defense electronics
High-performance LED arrays
Due to its higher cost and weight, copper is generally used in specialized applications where reliability, thermal performance, or current handling are mission-critical. It’s especially favored in automotive power systems, high-end industrial equipment, and aerospace control circuits.
Single vs Double Sided IMS PCB
When choosing between single-sided and double-sided IMS PCBs, understanding their structural and functional differences is essential. Below is a detailed comparison covering performance, design flexibility, manufacturing complexity, and cost.
Comparison Aspect
Single Sided IMS PCB
Double Sided IMS PCB
Copper Layers
One layer on top
Two layers – top and bottom
Component Placement
Only on one side
Possible on both sides or top side with backside routing
Thermal Conductivity Path
Heat moves in one direction (top to base)
Heat can dissipate through both layers via thermal vias
Routing Flexibility
Limited routing options
More complex, denser routing possible
Via Usage
Usually no plated vias
Requires plated through vias for inter-layer connections
Design Complexity
Simpler, suitable for low-power applications
Supports more complex, high-current designs
Manufacturing Cost
Lower cost, fewer steps
Higher cost due to drilling, plating, and alignment
Board Thickness
Generally thinner
Slightly thicker due to multilayer structure
Current Carrying Capacity
Limited by single copper layer
Higher due to dual copper planes
Mechanical Strength
Moderate
Higher due to more balanced structure
Typical Applications
LED bulbs, indicator lights, basic power supplies
LED headlights, motor drivers, power inverters
Preferred Use Cases
Cost-sensitive and thermally moderate projects
Thermally demanding, high-power, or complex circuitry
At Best Technology, we provide both types with full engineering support, helping you select the right option based on your performance goals and budget.
IMS PCB Design Considerations
Designing an effective IMS PCB, especially a double sided IMS PCB, requires more than just basic layout knowledge. As a professional IMS PCB manufacturer, we often find that early-stage design decisions directly impact not only the cost but also manufacturability, reliability, and thermal performance.
Here are our top recommendations to help you design a high-quality IMS PCB that meets both technical and production requirements:
1. Understand the Thermal Path Early
IMS PCBs are often chosen for their excellent heat dissipation. To maximize this advantage:
Place heat-generating components (like LEDs, power ICs, MOSFETs) directly above the metal core or near thermal vias.
Use thermal reliefs for pads to balance solderability and heat transfer.
Avoid thick dielectric layers if fast heat conduction is critical—choose higher thermal conductivity materials instead.
2. Use Plated Vias Wisely
In double sided IMS PCBs, plated through holes (vias) are crucial to connect the top and bottom copper layers. However:
Vias increase cost due to drilling and plating steps.
Avoid placing too many vias near mechanical mounting holes to prevent cracking during assembly.
For high-current paths, increase via diameter and plating thickness, or use multiple thermal vias in parallel.
3. Optimize Trace Widths and Spacing
Due to higher currents in IMS boards:
Use wider traces wherever possible, especially for power lines.
Respect minimum clearance based on copper thickness and voltage—this prevents arcing and improves reliability.
Avoid sharp 90° corners on high-current or RF traces; use 45° or curved corners instead.
If you’re not sure how wide your traces should be, send us your current ratings—we’ll recommend widths based on IPC standards and real-world performance.
4. Select Suitable Copper Thickness
For IMS PCBs, copper thickness directly impacts both electrical and thermal performance:
Standard thickness is 1oz (35µm), suitable for low to medium current.
For high current or improved thermal conduction, 2oz or 3oz copper is recommended.
Very thick copper (up to 10oz) is possible, but it increases cost and etching complexity.
5. Component Layout Planning
Avoid clustering hot components together—spread them out to help heat dissipation.
Keep temperature-sensitive components (like ICs, sensors) away from heat sources.
Leave clearance around mounting holes to prevent shorting with metal base.
6. Surface Finish Compatibility
Tell us your assembly process (manual, reflow, wave soldering) and component pitch—we’ll advise the best finish.
ENIG is recommended for flat surfaces and fine-pitch components.
HASL is affordable but not ideal for tight layouts.
Immersion silver and OSP are good for high-frequency circuits.
7. Share Your Design Goals Early
Many designers only share Gerber files at the last step. But as a manufacturer, we can provide more value when we’re involved earlier.
Let us know if your priority is cost, thermal performance, space saving, or high current.
Share thermal simulation data if available—we can help validate materials and layout choices.
If you’re unsure between aluminum and copper base, we can guide based on your budget and operating temperature.
Contact us early often helps reduce revisions, avoid design traps, and improve yield—saving both time and money.
Double Sided IMS PCB Manufacturing Process
Manufacturing a double sided IMS PCB involves multiple controlled steps. Here’s we simply introduce the manufacturing processed involving in the insulated metal substrate fabrication:
1. Material Lamination
The copper foils and dielectric are laminated on both sides of the metal base with high pressure and temperature.
2. Drilling & Via Formation
Mechanical or laser drilling creates via holes through the board. These holes are then plated with copper to allow connectivity between top and bottom copper layers.
3. Imaging & Etching
Circuit patterns are created on both copper layers using photoresist and chemical etching.
4. Solder Mask Application
Solder mask is applied to protect copper from oxidation and to guide solder placement during assembly.
5. Surface Finishing
Finish is applied on copper pads to enhance solderability and prevent corrosion.
6. Testing
Electrical tests (shorts/opens) and inspection ensure product quality before packaging and shipment.
Here is a completed manufacturing process of IMS PCB.
Double Sided IMS PCB Surface Finish Options
HASL (Lead-free): Affordable, but not ideal for fine-pitch components.
ENEPIG: Very good solderability, corrosion resistance, durable.
OSP: Cost-effective and environmentally friendly, but short shelf life.
Immersion Silver: Good for high-frequency signals, flat and solderable.
Hard Gold: Very durable, typically used for connectors or edge contacts, but rarely used in IMS PCB, it is popular in FR4 PCB.
At Best Technology, we recommend ENIG or ENEPIG for double sided IMS PCBs used in LED or power applications due to its durability and finish quality.
Cost Factors of Double Sided IMS PCB
The cost of a double sided IMS PCB is influenced by multiple variables, ranging from material selection to design complexity. As a manufacturer, we often find that many cost increases come from early design decisions. Here are the main cost drivers you should be aware of:
1. Material Type
Aluminum is more affordable and widely used, while copper offers better thermal performance but at a significantly higher price. If your project doesn’t demand extreme thermal performance, aluminum is usually the better choice from a budget perspective. High Tg costs more.
2. Copper Weight
Thicker copper layers allow for higher current carrying capacity and better heat dissipation, but they also increase cost:
Standard: 1oz (35µm)
Mid-range: 2oz – 3oz
Heavy copper: 4oz – 10oz (used in power-intensive designs)
Heavier copper requires longer etching time and more material, which increases both processing time and price.
3. Board Size & Shape
Larger PCBs naturally use more material and occupy more space on the production panel. Irregular shapes also lead to more material waste and extra routing time.
Square or rectangular boards make better use of panel space.
Rounded or irregular outlines may require CNC routing or laser cutting, which adds cost.
4. Via Count and Type
Double sided IMS PCBs require plated through holes (PTH) to connect the two copper layers. The more vias you have, and the smaller their diameter, the more complex and expensive the drilling and plating process becomes. Via-in-pad, filled vias, and microvias are more expensive.
5. Dielectric Layer Thickness
Though not the focus here, it’s worth noting: if you select high-performance dielectric materials (e.g., with higher thermal conductivity or thinner thickness), the price will increase. These materials are more specialized and costlier to produce.
6. Special Features
Any additional processes will increase cost, such as:
Via-in-pad or filled vias
Selective plating or special coatings
Edge plating or beveling
Thermal simulations or FEA reports (optional support)
These are usually project-specific, so it’s best to clarify during the RFQ stage.
Best Technology – Your Reliable IMS PCB Manufacturer
When it comes to manufacturing double sided IMS PCBs, experience, precision, and consistency matter. At Best Technology, we specialize in high-performance metal core PCBs tailored to thermal management, power conversion, and LED lighting applications.
We offer:
Custom solutions using aluminum or copper base materials with various shapes
Precision-controlled dielectric thicknesses for consistent thermal resistance
Tight tolerance drilling and PTH plating for stable double-sided connections
Surface finishes like ENIG, ENEPIG, OSP, and lead-free HASL to match your assembly needs
Free DFM checks with technical support
24/7 before & after sales assist
Professional sales can provide best solution tailored to your specific requirement
Transparent price and data traceability
High quality control followed IATF 16949
No MOQ required, 1 pc available
Whether you need rapid prototypes or mass production, our engineering team supports you from design optimization to final testing. We believe that a good PCB starts with good communication—and we’re always ready to listen.
To get an accurate and cost-effective quote, always provide the following details upfront:
Q1: What is the thermal conductivity of a double sided IMS PCB?
It depends on the dielectric used. Standard ranges are 1.0 to 3.0 W/m·K, with higher options available for demanding designs.
Q2: Can I place components on both sides of a double sided IMS PCB?
Typically, one side is reserved for power routing or heat dissipation, but yes, it’s technically possible depending on the application.
Q3: What surface finish is best for LED applications?
ENIG is recommended for its flatness, solderability, and long shelf life.
Q4: Are double sided IMS PCBs expensive?
They cost more than single-sided IMS or standard FR4 PCBs, but offer much better thermal and electrical performance, especially for power-intensive designs.
Q5: How can I get a quote from Best Technology?
Just email your Gerber files and requirements to sales@bestpcbs.com, and we’ll respond within 24 hours.
Circuit board damage happens for many reasons—heat, moisture, aging parts, or physical stress. But with the right knowledge and tools, pcb repair is absolutely possible. Whether it’s a simple home device or an AC control board, identifying the issue early helps cut costs and prevent deeper damage.
If you’re dealing with an HVAC unit, industrial equipment, or a sensitive medical device, working with professionals makes sense. Best Technology supports customers around the world with reliable PCB production and testing. From standard single-layer boards to complex multilayer and ceramic solutions, we’re committed to high performance and long-lasting quality.
What Are Most Circuit Problems Due To?
Most circuit board problems are caused by heat, moisture, power surges, dust, and aging. These issues affect the board either slowly over time or all at once. Heat, in particular, is a silent killer. When components get too hot, they wear out faster. Solder joints also become weak. Over time, the board may stop working even if there’s no visible damage.
Moisture is another hidden threat. If water or humidity gets inside the board, it can cause corrosion. Corrosion eats away at the copper traces and makes connections weak. If you’re in a humid climate or near the ocean, your electronics may wear out faster unless sealed properly.
Another problem is physical stress. If the board is bent or shaken a lot, microcracks can appear. These cracks are hard to see but can break connections inside the board. Eventually, signals can’t travel properly, and the board may fail.
What Usually Goes Bad on a Circuit Board?
Some parts of a circuit board are more likely to fail than others. Capacitors are one of the most common troublemakers. They are often found in power supplies, and over time they dry out or leak. When that happens, your device might stop turning on, or it might behave oddly.
Resistors can also burn out, especially if there’s a short circuit. When a resistor fails, it often turns black or breaks apart.
Integrated circuits (ICs) are another weak point. These chips control important functions. They are small and sensitive. A small voltage spike can damage them instantly.
Solder joints are also a common problem. Over time, these joints can crack. This causes the component to lose contact with the board. Re-soldering usually solves the issue, but only if the board isn’t too damaged.
What Would Cause a Circuit Board to Burn?
A burned circuit board is a serious problem. It usually happens due to:
Short circuits
Power supply issues
Component failure (like a failed transistor or voltage regulator)
Poor PCB design or low-quality manufacturing
Dust buildup causing arcing or hot spots
Burn marks, melting, or a burnt smell are signs of severe board damage. In some cases, PCB repair is still possible. But if the internal layers are affected, replacement may be the only option.
How to Tell If a Circuit Board Is Blown?
It’s not always easy to tell if a board is blown just by looking. But there are a few signs to check:
1. Physical Clues
Burn marks or dark spots
Swollen or leaking capacitors
Cracked chips
Melted areas or broken traces
2. Electrical Behavior
The device won’t turn on
It powers on but acts erratically
Parts of the device stop working
3. Testing with Tools
Use a multimeter to check voltage and resistance
Check continuity to find broken paths
A lack of signal or power at test points means something’s wrong
If any of these signs appear, the board might be blown. Depending on the damage, PCB board repair cost may vary from low to high.
How Long Should a Circuit Board Last?
A well-made PCB can last 10 to 20 years. Some last even longer if kept in a clean, cool, dry place. But others fail within just a few years. It depends on:
Quality of components
How hot the board gets
How clean the environment is
How often the device is used
For example, a control board in an AC unit might last 10–15 years. But if it’s exposed to heat and dust, failure can happen sooner. Keeping regular cleaning and maintenance help extend life. And replace worn-out capacitors and clean off dust yearly to prevent common failures.
What Does PCB Repair Actually Mean?
The term PCB repair means fixing any part of a circuit board that’s no longer working. That might include:
Replacing broken components
Repairing damaged traces or pads
Fixing bad solder joints
Cleaning dirty or corroded parts
PCB repair doesn’t always need advanced skills. If you understand the circuit and can use a multimeter and soldering iron, small repairs are possible. For more complex repairs, it’s better to visit a service center.
Is It Possible to Repair a Circuit Board?
Yes, circuit boards can be repaired. But it depends on the type of damage. If a part is broken, it can usually be replaced. If a trace is cut, it can often be patched with a jumper wire. Here are some common PCB repair methods:
Component Replacement: If a resistor, capacitor, or chip fails, desolder it and install a new one.
Trace Repair: Use a jumper wire or conductive ink to reconnect broken traces.
Solder Joint Fixes: Reflow old solder or add fresh solder to cracked joints.
Cleaning Corrosion: Use alcohol and a brush to remove oxidation or rust.
Some repairs are easy. Others, like fixing broken inner layers, may not be possible without factory tools. For home users, many fixes are possible with basic PCB repair tools. At Best Technology, we offer free pcb board repair service if your board be bad during the operation or assembly, we can repair it for you and for free.
How Much Does It Cost to Replace the AC Control Board?
The AC PCB repair cost or replacement cost depends on the board model and brand.
1. Simple AC PCB Repair
If only one or two components are bad, a technician may charge $50–$100. If the board is easily accessible and parts are common, the cost stays low.
2. AC PCB Replacement
If the board is totally fried or has a rare fault, full replacement might be needed. That can cost:
$150–$250 for residential units
$300–$400 for high-end or commercial ACs
Labor may be extra if the unit is hard to open. In some cases, it’s cheaper to fix the board using local services with AC PCB repair experience.
PCB Repair Tools You Might Need
To repair a circuit board, you don’t need a full lab. A small kit with the right tools is enough for most jobs. Here are essential PCB repair tools:
1. Soldering Iron: A must-have for replacing components
2. Desoldering Pump or Braid: To remove old solder cleanly
3. Multimeter: To test voltages and check for open circuits
4. Tweezers and Magnifying Glass: Helpful for handling small parts
5. Hot Air Rework Station: Needed for surface-mount parts (SMD)
6. PCB Holder or Clamp: Keeps your board stable while working
7. Isopropyl Alcohol and Brush: For cleaning dust or corrosion
With practice, many home users can fix basic issues. Just make sure to work slowly and carefully.
Can You Do AC PCB Repair Yourself?
If you have some knowledge of electronics and the right tools, you might fix an AC control board yourself. You can:
Replace burnt capacitors
Re-solder loose joints
Clean the board to remove dirt or corrosion
But there are risks. AC boards often control high-voltage parts. A mistake could damage the system—or cause injury. You should not attempt AC PCB repair if:
You’re not familiar with electronics
The damage looks severe
You don’t have the proper tools
In those cases, it’s better to call your PCB manufacturer or seeking for a qualified repair shop at your local.
How to Prevent Circuit Board Damage?
Repairing is great, but prevention is better. You can reduce the chance of needing pcb repair by:
Keeping electronics clean and dry
Avoiding power surges with surge protectors
Ensuring proper ventilation to reduce overheating
Mounting boards securely to avoid mechanical stress
Scheduling regular inspection and cleaning, especially for industrial and HVAC systems
Preventive steps are usually cheaper than dealing with a blown board.
When to Replace Instead of Repair?
In some cases, fixing the board doesn’t make sense. You should replace it if:
Damage covers a large area
The board has many burned or broken parts
It’s cheaper to replace than repair
It’s hard to find parts for the repair
If your AC is old and parts are rare, it’s often smarter to upgrade both the board and the unit. You’ll avoid repeated repair costs.
About Best Technology
Best Technology is a reliable PCB manufacturer in China. We specialize in small to medium-volume PCB Manufacture, PCB Assembly, and Electronic Manufacturing Services. As one of the highly experienced circuit board suppliers, our products and services include a wide range of printed circuit boards such as rigid PCBs, flex PCBs, rigid-flex PCBs, aluminum PCBs, RF Microwave PCBs, high-speed PCBs, high-frequency PCBs, and HDI PCBs.
Apart from being an experienced printed circuit board manufacturer, Best Technology also provides turnkey assembly, component sourcing, box build assembly, PCBA testing, and complete electronics test and assembly. We are a one-stop PCB manufacturer dedicated to meeting all your PCB board manufacture demand.
FAQs
1. What does PCB repair mean in electronics?
It refers to fixing damaged components, traces, or solder joints on a circuit board to restore functionality.
2. Can a burnt PCB be fixed?
Yes, if the damage is limited to outer layers and doesn’t affect inner traces, it’s often repairable.
3. How much does PCB board repair cost?
It ranges from $50 to $150 depending on the extent of damage and labor involved.
4. What tools are used for PCB repair?
Common tools include soldering irons, multimeters, hot air guns, tweezers, and desoldering tools.
5. Is AC PCB repair worth it?
If the board is rare or expensive, yes. But sometimes, full replacement is more cost-effective.
Custom circuit board design is the process of creating a PCB layout tailored to meet specific project needs. Unlike off-the-shelf solutions, a custom PCB gives you complete control over size, shape, layer stack-up, routing, and component placement. Whether you’re building a compact wearable, a robust industrial device, or a specialized automotive controller, a custom layout helps improve performance and space efficiency.
Who Needs a Custom Circuit Board Design?
Custom circuit boards are essential for engineers, startups, hardware developers, and OEMs who can’t rely on generic PCBs. If you’re designing a unique product or working with unusual form factors or power requirements, a custom design is your only option. This includes industries like:
Medical devices needing miniaturized, high-reliability circuits.
Automotive and aerospace systems requiring rugged, multilayer PCBs.
Research and development teams creating prototypes.
In short, if your project demands specific functions, form factor, or performance that standard PCBs can’t deliver, it’s time for a custom solution.
Circuit Board Design Rules
Design rules form the foundation of a reliable custom circuit board design. They’re not just about meeting DRC checks but ensuring your board works correctly in the field. Here are the most important and professional-level design constraints to follow:
1. Minimum trace width and spacing:
For standard 1 oz copper (35μm), a minimum trace width of 6 mil (0.15mm) is commonly used for signal lines. Power traces may require 10–20 mil or more, depending on the current. Use IPC-2221 charts or online calculators to determine width based on current (e.g., a 1A trace over 1oz copper typically needs 15 mil for internal layers, 10 mil for outer layers).
2. Minimum spacing:
Standard fabrication allows 6 mil spacing, but for HDI designs or high voltage isolation, use wider spacing. IPC-2221 recommends 63 mil (1.6mm) spacing for 250V isolation.
3. Via size and annular ring:
A typical via uses a 0.3 mm drill with 0.6 mm pad size, leaving a 0.15 mm annular ring. For HDI, microvias can be as small as 0.1 mm.
4. GND plane design:
Always use a solid ground plane on an internal layer. For multi-layer boards, dedicate one layer (often the second layer) as a continuous GND plane to reduce EMI and support return current paths. For analog and digital mixed-signal boards, separate analog GND and digital GND, and connect them at a single point near ADC/DAC.
5. High-speed signal rules:
Use controlled impedance for differential pairs and high-speed single-ended lines. Keep length mismatches for differential pairs within ±5 mils, and spacing between the pair should be 2–3 times the trace width.
6. Creepage and clearance:
Follow IPC-2221 standards for high-voltage boards. For instance, for 240V AC, you need minimum 3.2mm clearance between conductors.
7. DRC and design checks:
Always define your DRC settings based on your manufacturer’s capabilities. Most manufacturers support 4/4 mil (trace/space) in standard processes, but 6/6 mil is more commonly used for robustness.
How to Layout Your DIY Circuit Board?
Laying out your custom PCB starts with strategy. A great schematic won’t save a poor layout, especially for fast signals or complex systems. Here’s a professional approach to DIY or low-volume layout:
1. Start with a block-level floorplan:
Divide your circuit into sections (power, MCU, analog, RF, connectors) and place them logically. Keep high-speed signals short and isolated from analog traces.
2. Place decoupling capacitors close:
Every IC power pin should have a 0.1μF ceramic capacitor placed within 1–2 mm of the pin, with a short path to the ground plane.
3. Use polygon pours for GND:
Instead of routing GND traces, pour solid copper polygons for GND connections. Ensure the polygon is tied to a proper ground net and has enough vias to connect to internal GND planes (1 via per 1–2 cm² area is a good rule).
4. Signal layer planning:
In a 4-layer board:
Top layer: Signals and components
2nd layer: Solid GND plane
3rd layer: Power plane
Bottom layer: Secondary signals
This gives you clean return paths and effective power distribution.
5. Controlled impedance routing:
For USB, HDMI, Ethernet, and RF signals, match the impedance (typically 50Ω single-ended or 100Ω differential). Use your PCB software’s impedance calculator or external tools like Saturn PCB Toolkit. Factors include trace width, dielectric height, and copper thickness. For instance, a 50Ω microstrip over 1.6mm FR-4 (εr=4.2) might require 12 mil trace width over 10 mil height.
Differential pair routing:
Keep equal length (match to within ±5 mils).
Maintain consistent spacing.
Avoid 90° bends—use two 45° bends or arcs.
6. Avoid stubs and isolated copper:
Any unused copper or hanging trace stubs can act as antennas. Remove them to reduce EMI.
7. Thermal relief and copper balance:
For through-hole pads connected to GND or power planes, use thermal reliefs to aid soldering. Also, ensure copper is balanced across layers to avoid warping.
PCB Design Software
You can’t design a custom board without the right software. Depending on your experience and budget, here are some options:
KiCad (Free, open-source): Ideal for beginners and hobbyists. Offers schematic capture, PCB layout, and 3D visualization.
EAGLE (Free for students and small projects): Good integration with Fusion 360 and supports complex designs.
Altium Designer (Paid): Industry standard for advanced features like high-speed routing, simulation, and collaboration tools.
EasyEDA (Cloud-based): Great for quick prototypes and integrates directly with fabrication services.
OrCAD/PADS: Often used in professional environments for complex multilayer boards.
Choosing the right tool depends on your project’s needs, from simple prototypes to multilayer, production-ready boards. Here are the top 10 PCB design software that engineer commonly used.
Considerations During Designing a Custom Circuit Board
Designing a custom PCB isn’t just about making connections—it’s a balancing act between performance, cost, and manufacturability. Here’s what to consider:
Board size and shape: Compact designs can save space but are harder to route.
Number of layers: Multilayer boards improve performance but increase cost.
Component availability: Choose parts that are easy to source and compatible with your assembler’s equipment.
Thermal management: Use heat sinks, thermal vias, or copper pours to manage heat.
Manufacturing capabilities: Make sure your design matches your fabricator’s limits for trace width, hole size, and stack-up.
Testing and debugging: Leave space for test pads, headers, or diagnostic LEDs.
Thoughtful planning during the design phase saves time and avoids problems during production.
Where Can I Get a Custom Circuit Board?
You can order a custom circuit board from online PCB manufacturers or local fabrication shops. Some popular platforms include:
JLCPCB
PCBWay
Sierra Circuits
However, if you’re looking for a highly reliable one-stop PCB solution with both fabrication and assembly services, it’s better to work with a professional company that understands the full production lifecycle.
Best Technology is your trusted partner for custom circuit board design, manufacturing, and assembly. With ISO9001, IATF16949, ISO13485, and AS9100D certifications, we follow strict quality systems to ensure that your project meets industry standards. Below are some advantages that customers why choose us:
Full customization for single-sided, multilayer, ceramic, metal-core, and HDI boards.
Advanced engineering support from schematic to layout optimization.
Fast prototyping with 24/7 customer service and on-time delivery.
Traceability with MES system, covering every process step for your peace of mind.
Competitive pricing without compromising on quality.
Whether you’re a startup building a prototype or a Fortune 500 company scaling production, we’re here to support every step of your journey.
Contact us now to get a quote or free design consultation.
FAQs
1. What file format is needed to get a custom PCB made?
You’ll typically need Gerber files, CAD, BOM (Bill of Materials), and a pick-and-place file for assembly.
2. How long does custom PCB manufacturing take?
Depending on complexity and quantity, fabrication may take 3–7 days, with assembly adding 2–5 more days. Expedited service is available.
3. Can I get a custom PCB in small quantities?
Yes. Many manufacturers, including Best Technology, support low-volume and prototype runs.
4. Is custom PCB design expensive?
The cost depends on board complexity, number of layers, and turnaround time. Simple designs are very affordable today.
5. Do you help with PCB design revisions?
At Best Technology, yes—we offer design assistance and layout reviews to ensure your files are ready for production.
In high-speed electronic systems, signal integrity is crucial. One of the key factors that ensures clear, distortion-free signal transmission is impedance control. In this blog, we’ll explore what impedance control is, why it’s important in PCB design, how it’s calculated, and what factors influence it. Whether you’re a PCB designer or sourcing boards from a manufacturer, understanding impedance control is essential to ensuring performance and reliability.
What Is Impedance in a PCB?
Impedance refers to the resistance a circuit offers to alternating current (AC), especially in the presence of inductors and capacitors. In simple terms, it’s how much the signal “fights back” as it moves through the traces on a PCB. The unit of impedance is Ohms (Ω).
In PCBs, impedance isn’t just about resistance—it includes the effects of capacitance and inductance created by the PCB’s structure and materials. That’s why it needs to be tightly controlled, especially in high-speed signal circuits.
Why Is Impedance Matching Needed?
Impedance matching is essential to ensure efficient signal transmission across different parts of an electrical system. When the impedance of a signal source, transmission path (such as a PCB trace), and load are not properly matched, it causes signal reflection, power loss, and distortion—especially in high-speed or RF designs.
Key reasons why impedance matching is necessary:
Prevents Signal Reflection: Any mismatch causes part of the signal to bounce back to the source, interfering with the original signal and creating noise.
Maintains Signal Integrity: For data to reach its destination accurately and consistently, impedance must be uniform along the transmission path.
Reduces EMI (Electromagnetic Interference): Mismatched impedance can result in radiated emissions, which may interfere with nearby circuits.
Improves Power Transfer: In RF applications, maximum power is transferred only when the source and load impedance are equal.
Enables High-Speed Communication: Interfaces like HDMI, USB, Ethernet, and LVDS require tight impedance control for proper function.
In short, impedance matching is critical to achieving predictable, reliable performance in complex circuits and high-speed digital or RF systems.
What Is Impedance Control?
Impedance control is the process of designing PCB traces so that their impedance remains within a specified tolerance, typically ±10%. This ensures signal transmission remains clean, reduces signal reflections, and avoids data loss or distortion—especially critical for USB, HDMI, high-speed memory, and RF circuits.
Why Is Impedance Control Important?
Controlled impedance becomes essential in high-frequency applications like:
Communication equipment
Medical devices
Aerospace and defense electronics
Consumer electronics
Automotive systems
Signals traveling through improperly matched impedances can reflect back toward the source, leading to noise, jitter, and signal loss.
Common Types of PCB Impedance
Impedance isn’t a one-size-fits-all metric. There are different types, depending on signal configuration:
1. Single-Ended Impedance (Single-Ended Trace)
This refers to the impedance of a single signal line with respect to a reference plane (usually GND). This type is common in basic digital or analog signals.
Example: 50Ω impedance, line width of 5 mil on L1 referencing L2.
2. Differential Impedance
Used in differential pair routing where two lines carry equal and opposite signals (like in USB, HDMI). The impedance is measured between the two lines.
Example: 90Ω impedance, line width/spacing = 5/6 mil, referencing L2.
3. Coplanar Impedance
Here, the signal line is flanked by ground or power planes on the same layer, adding shielding and tighter impedance control.
Single-Ended Coplanar Impedance: Signal line with ground on both sides.
Differential Coplanar Impedance: Differential pair surrounded by ground on the same layer.
Example: 90Ω impedance, line width/spacing = 7.5/8/8 mil.
How Is Impedance Calculated?
Impedance is calculated using simulation tools that factor in geometry and material properties. The most commonly used tools include:
Polar SI8000
Polar SI9000
These tools allow engineers to model various stack-ups and design constraints to meet impedance targets.
Common input parameters include:
Trace width
Trace spacing (for differential)
Distance to reference plane (dielectric thickness)
Dielectric constant (Dk)
Copper thickness
Factors That Affect Impedance in PCB Design
Controlling impedance means adjusting several design parameters. Here’s how they influence impedance:
Factor
Effect on Impedance
Line width
Wider lines reduce impedance (inverse)
Line spacing
Narrower spacing lowers differential impedance
Dielectric thickness
Thicker dielectric increases impedance
Distance to nearby copper
Greater distance increases impedance
Dielectric constant (Dk)
Higher Dk reduces impedance
Copper thickness
Typically fixed; indirectly affects trace width needs
In practice, designers will tweak line width, spacing, and dielectric thickness to reach target values, since Dk and copper thickness are often constrained by material availability or cost.
Impedance Control Verification
Impedance control verification is the process of measuring and confirming that the actual impedance on the manufactured PCB matches the design specifications. This verification ensures that the board will perform reliably in the intended high-speed application. Here are some verify impedance control methods:
1.Test Coupons:
Special trace structures are added to the edge of the production panel.
These are manufactured using the same stack-up and process as the main board.
2. TDR (Time Domain Reflectometry):
A signal pulse is sent through the test coupon trace.
The equipment measures how the signal reflects along the trace to determine actual impedance.
This method is non-destructive and very precise.
3. Report & Tolerance Check:
The measured values are compared against target impedance (e.g., 50Ω, 90Ω).
Typical tolerance is ±10%, depending on customer requirements.
A formal impedance test report is provided.
4. Process Adjustments (if needed):
If values fall outside tolerance, manufacturers may tweak line width or dielectric thickness and re-run tests before final production.
Verifying impedance isn’t just a formality—it’s a guarantee that the board will function correctly in its application. Skipping this step can result in field failures, EMI issues, or complete communication breakdowns.
Why Choose Best Technology for Impedance-Controlled PCBs?
At Best Technology, we specialize in high-speed, high-reliability PCBs with precise impedance control. We use industry-standard impedance calculation software and fabricate test coupons to verify every impedance-controlled design. Whether you need simple 2-layer PCBs or complex HDI PCB stackups with tight tolerances, we provide:
Competitive pricing
Rigorous quality control
Engineering support for stackup & impedance design
Fast lead times
FAQs About Impedance Control
1. What is the typical tolerance for controlled impedance?
Most designs require ±10% tolerance from the target impedance value.
2. Do all PCBs require impedance control?
No, only high-speed or RF boards need impedance-controlled traces.
3. How do manufacturers verify impedance control?
They use test coupons and tools like TDR (Time Domain Reflectometry).
4. Can I use FR4 for impedance-controlled designs?
Yes, but its dielectric constant must be accounted for in calculations.
5. What happens if impedance isn’t controlled?
It can lead to signal reflection, data loss, and poor system performance.
Copper base PCB delamination is one of the most frustrating and critical issues for engineers and buyers alike. When layers of the PCB separate, it compromises thermal performance, mechanical strengthen electrical safety. Whether it happens during soldering or while in use, understanding how to prevent and respond to delamination is vital for long-term reliability.
What Is Delamination in Copper Base PCBs?
Delamination refers to the separation of different material layers in the copper base PCB structure. This usually occurs between the copper foil and the insulating dielectric or between the dielectric and the metal base. It is often visible as bubbles, warping, or peeling, and can even lead to electrical failure.
Delamination is a sign of poor adhesion, excessive internal stress, or improper material pairing. While it may seem like a production flaw, in many cases, it is a result of both design and process-related decisions.
Common Causes of Delamination in Copper Base PCB
1. Mismatch in Thermal Expansion Coefficient (CTE)
The CTE mismatch between copper, dielectric resin, and metal base can generate internal stress during temperature cycling, leading to separation over time.
2. Poor Lamination Process
If the lamination pressure is too low, or the vacuum environment is inadequate, resin will not bond well with copper. This creates weak interfaces that can easily delaminate during reflow or wave soldering.
3. Excessive Heat or Thermal Shock
Copper base PCBs used in LED, power, or automotive sectors often undergo extreme temperatures. Rapid heating or cooling during soldering can exceed the material’s limit and cause bubbling or blistering.
4. Moisture Absorption
If the PCB absorbs moisture during storage or processing, it will vaporize during soldering, forming vapor pressure that forces the layers apart.
5. Mechanical Drilling Stress
For thick copper or multilayer copper base PCBs, improper drilling parameters may introduce mechanical stress that fractures the resin bond.
Signs That Your Copper Base PCB Is Delaminating
Bubbles or bulges under the copper foil
Peeling or flaking of surface copper
Warping or deformation after soldering
Burn marks or internal voids seen in X-ray or ultrasonic scans
Circuit opens or intermittent connections
How to Handle Delamination During Production?
If you detect delamination during prototype or volume production:
1. Stop and Identify the Root Cause:
Perform cross-sectional analysis of the delaminated area.
Check resin flow, press temperature, and bonding pressure during lamination.
Verify vacuum level and lamination time.
2. Adjust the Lamination Process:
Increase bonding pressure and resin flow time.
Use vacuum lamination with temperature ramping.
Switch to a resin system with better heat resistance and adhesion.
3. Dry the Material Before Lamination:
Bake prepregs and metal cores at 120–150°C for 2–4 hours to eliminate moisture.
4. Use Better Dielectric Materials:
Use thermally conductive epoxy with higher Tg and lower CTE.
Consider ceramic-filled resins for high-power applications.
1. Check if soldering parameters were too aggressive
Overheating or reflow profiles with steep ramps can cause internal separation.
2. Inspect PCB storage and packaging
Improper vacuum sealing or exposure to humidity can lead to moisture buildup.
3. Request reliability test reports from the supplier
Ensure your supplier provides thermal cycling, cross-section, and peel strength data for the batch.
How to Prevent Delamination in Copper Base PCB Designs?
Preventing delamination requires a combined effort in material selection, stack-up design, processing parameters, and storage control. Here’s how to prevent & reduce the risk of delamination from the ground up.
1. Use High-Quality Dielectric Materials
One of the most direct ways to prevent delamination is choosing a dielectric layer with excellent adhesion properties and low moisture absorption. In copper base PCB design, typical dielectrics include thermally conductive epoxy, ceramic-filled resin, or polyimide.
What to look for in dielectric material:
High Tg (Glass Transition Temperature) above 150°C
Low CTE (Coefficient of Thermal Expansion) for better mechanical stability
High peel strength to enhance bonding with copper
Thermal conductivity ≥ 1.0 W/m·K for effective heat transfer
2. Choose the Right Stack-up for Your Application
If your design needs high thermal conductivity, select a resin with high Tg and low CTE to reduce internal stress.
3. Design Even Copper Distribution
Avoid heavy copper areas on one side only, which can cause warping or asymmetrical expansion during soldering.
4. Pre-bake the PCB Before Reflow
Even if your supplier provides vacuum-packed boards, pre-baking before SMT helps prevent delamination from moisture.
5. Set Realistic Soldering Profiles
Avoid shock heating. Ramp temperature gradually and stay within resin limits.
6. Proper Drill Parameters and Hole Cleaning
For multilayer copper base PCBs, drilling through copper and resin layers generates mechanical stress. Improper drill speed, feed rate, or dull drill bits can cause micro-cracks, which may propagate and cause delamination.
7. Avoid Sharp Thermal Transitions in Reflow Soldering
Rapid heating or cooling causes materials to expand or contract at different rates. If the resin can’t keep up, it will delaminate.
Copper base PCB delamination is not just a fabrication problem — it’s also a design and process challenge. By carefully selecting materials, managing thermal profiles, and working with professional PCB manufacturers, you can significantly reduce the risk.
FAQs
Q1: What causes copper base PCB to delaminate after soldering?
Rapid heating, high peak temperature, or moisture buildup in the board are the most common causes.
Q2: How can I test whether my copper base PCB has internal delamination?
You can use ultrasonic scanning (C-SAM), X-ray imaging, or destructive cross-sectioning.
Q3: What’s the ideal copper thickness to reduce delamination risk?
While thicker copper helps heat dissipation, it also introduces stress. A balance between 2oz–4oz copper and suitable resin is ideal.
Q4: Can I rework a delaminated copper base PCB?
In most cases, no. Once delaminated, the structural and electrical integrity is compromised.
Q5: What files should I provide to the manufacturer to ensure better reliability?
Gerber files, stack-up drawing, copper weight details, thermal simulations (if any), and assembly temperature profiles.
Why Choose Best Technology?
Best Technology specializes in high-reliability copper base PCBs for LED, power, and automotive markets. We apply vacuum press lamination, use high-Tg resins, and perform 100% inspection on thermal integrity. Whether you need single-layer, double-layer, or heavy copper designs, we provide reliable solutions backed by engineering support.
Let us help you optimize your copper base PCB design to prevent delamination and maximize thermal and mechanical stability.
If you’ve ever tried to get a copper core PCB prototyped, you might have experienced sticker shock. Compared to standard FR4 or even aluminum PCBs, copper base PCB prototyping is significantly more expensive. But why is that? Is it just the material cost—or is there more behind the pricing?
This article explores why copper core PCB prototyping is expensive, highlighting the five core factors that affect the price. If you’re planning to prototype with copper, this guide will help you manage expectations and control costs without compromising quality.
1. High Raw Material Cost of Copper Base PCB
Copper is a premium metal. Compared to aluminum or traditional FR4 materials, copper base PCBs use significantly more raw copper, especially for heavy copper designs (2oz to 10oz). Thick copper requires more material, which increases raw material cost.
Besides the copper layer, these PCBs often use advanced insulation materials like ceramic or high-conductivity epoxy, which are not cheap. Together, they make copper base PCB a costlier substrate right from the start.
2. Copper Core Is Costlier and Harder to Process
Copper base PCBs are built on metal substrates where copper is used as the base material. Compared to aluminum PCBs, copper-based substrates have higher thermal conductivity and mechanical strength—but also come at a premium.
Challenges:
Copper is heavier and more difficult to machine than aluminum.
It demands higher-grade dielectrics to manage heat flow and electrical insulation.
Machining tolerance must be tight, which often requires CNC milling or laser cutting.
In prototyping, every material switch requires reprogramming and tool setup—this adds to unit cost, especially for small batches.
3. Full-Process Manufacturing for Low Volumes = High Unit Cost
Many customers expect prototyping to be a simplified process, but copper PCB prototypes go through the full manufacturing workflow, just like mass production.
Involved Steps:
Lamination of copper foil and dielectric layer onto the metal core
Photolithography and etching of thick copper traces
Drilling and metal plating through holes (if applicable)
Solder mask and silkscreen application
Surface finish such as HASL, ENIG, or OSP
Electrical and AOI testing
Unlike FR4 samples, these steps for copper PCBs are more labor-intensive and require custom setup, making short runs costly.
4. Board Size and Quantity: Small Orders Still Use Full Panels
You might think that fewer boards mean lower cost—but that’s not how copper PCB prototyping works. Manufacturers need to process entire panels, even if the customer only needs one or two pieces.
Key Considerations:
Panel utilization is poor for unique shapes or non-standard sizes.
Tooling, drilling, and routing costs remain fixed regardless of quantity.
Wasted copper material adds to the final quote.
5. Testing and Quality Control Requirements Raise the Bar
Copper base PCBs are commonly used in high-power LED lighting, automotive control units, power supplies, and military devices. These applications demand precise thermal performance, which must be verified in prototypes.
Extra Testing:
Dielectric strength and thermal conductivity evaluation
X-ray or AOI inspections to verify copper-to-core bonding
Flatness and planarity checks
Anti-oxidation packaging for copper exposure protection
While FR4 or aluminum PCBs may pass with visual inspection, copper PCB prototyping requires intensive quality checks to simulate performance under real-world stress.
In addition to this, only a small percentage of PCB manufacturers have the equipment, technology, and skilled workers to prototype copper base PCBs. These facilities often run specialized machinery and require higher operational overheads. That exclusivity creates a supply-demand gap, increasing pricing. Furthermore, setup for copper PCBs takes more time — involving tool calibration, stack-up configuration, and thermal modeling — all of which raise prototyping expenses.
How to Lower Your Copper PCB Prototyping Cost?
While you can’t eliminate the inherent cost of copper core PCB prototyping, you can definitely make smart choices to reduce waste and improve cost-efficiency. Here are strategic steps engineers and procurement teams can take:
1. Choose the Right Copper Thickness
Avoid overengineering. While 5oz or more copper might seem safer, most designs perform well with 2oz to 3oz copper thickness. This keeps etching time, material use, and plating costs within reason.
2. Standardize Your Board Shape and Size
Odd-shaped PCBs or extremely small panels lead to poor panel utilization. Try to stick to standard sizes like 100mm x 100mm or 150mm x 150mm, which optimize production yields and reduce cutting loss.
3. Simplify the Initial Design
Avoid complex features such as plated through-holes, cavities, or selective surface finishes in your prototype stage. These features add cost and are often not required for first-round validation.
4. Use Cost-Efficient Dielectrics
For less heat-sensitive applications, consider standard ceramic or polymer-based insulation layers rather than high-cost options like AlN unless required. Choosing the right dielectric saves material and processing time.
5. Avoid Over-Specifying Surface Finishes
Electroless Nickel Immersion Gold (ENIG) is often used, but it’s not always necessary. If you don’t need high wire bonding or long shelf life, consider OSP or HASL—these finishes are far more affordable.
6. Batch Your Orders to Improve Panel Utilization
If you plan to order multiple revisions or versions, ask your manufacturer if they can combine them in a single panel. This reduces setup time and improves manufacturing efficiency.
Why Choose Best Technology for Copper Core PCB Prototyping?
At Best Technology, we specialize in copper base PCB manufacturing and prototyping. We understand the thermal, electrical, and mechanical demands of your application—and we’re here to support you at every step.
Our Advantages:
In-house CNC machining for precise panel shaping
Extensive material inventory including standard and heavy copper
MES traceability and full-process quality inspection
Thermal simulation support before prototyping
Global shipping with vacuum-sealed packaging
One-on-one engineering consultation for design reviews
Free DFM & DFA checks
We’re certified under ISO9001, ISO13485, IATF16949, and AS9100D, making us a reliable partner for medical, automotive, and aerospace industries.
Conclusion
If you’re planning to develop high-power or heat-sensitive electronics, copper core PCB prototyping is a strategic investment. While the costs may seem high initially, understanding the five main cost factors gives you more control over your design and procurement decisions.
Looking to reduce the copper PCB sample price while maintaining performance? Contact Best Technology for a free quote and technical design review.
Frequently Asked Questions (FAQs)
1. Why is copper base PCB prototyping more expensive than aluminum PCB samples?
Copper is costlier and harder to machine. It also needs special insulation materials and more precise control during manufacturing, which adds to the overall expense.
2. Can I use thinner copper to reduce prototyping costs?
Yes, 2oz or 3oz copper works well for most thermal and current needs. Always confirm with your PCB supplier.
3. Is SMD-only design more cost-effective for copper PCBs?
Absolutely. Using SMD components eliminates through-holes and makes the manufacturing process simpler and cheaper.
4. How can I estimate copper PCB prototyping cost?
Submit your Gerber files, copper weight, board dimensions, and finish requirements to your supplier for an accurate quote.
5. What files should I provide to the manufacturer?
You should prepare and send your Gerber files (RS-274X), drill file, copper thickness, stack-up details, fabrication notes, and BOM (if assembly is needed). This ensures fast and accurate quotation and fabrication.
Struggling to source responsiveLED lighting PCB assembly services? Struggling to source responsive LED lighting PCB assembly service? Discover its benefits, application, supplier evaluation tips. reduction cost methods.
Best Technology deliversLED lighting PCB assembly solutions with a vertically integrated supply chain, ensuring uninterrupted access to premium components even during global shortages. Our automated SMT lines and dedicated engineering team enable rapid prototyping in 24 hours and full-scale production within 3-5 days, while emergency orders benefit from prioritized 24-hour turnaround – all backed by strict IPC-A-610 Class 3 quality control for <0.1% defect rates. By combining thermal-optimized DFM analysis (2-6oz copper core integration) with smart panelization algorithms, we reduce material waste by 18% and assembly costs by 15% without compromising luminous consistency (±3% flux variance). Whether you’re developing UV sterilization systems or smart horticultural lighting, our scalable capacity handles 1-piece prototypes to 50k+ batches with identical precision. Welcome to contact us for free design review if you have any request for LED lighting PCB assembly: sales@bestpcbs.com.
What Is LED Lighting PCB Assembly?
LED lighting PCB assemblyrefers to the specialized process of integrating light-emitting diodes (LEDs) onto printed circuit boards (PCBs) to create functional illumination systems. This involves precise placement of SMD or COB LEDs, resistors, drivers, and thermal management components onto substrates like aluminum-core or FR4 boards, ensuring stable electrical connections and heat dissipation. Advanced techniques such as automated pick-and-place machines, reflow soldering, and conformal coating are applied to achieve consistent brightness, color temperature accuracy (e.g., 3000K warm white), and resistance to environmental stressors like moisture or vibration. The assembly supports diverse applications, from automotive lighting to architectural accents, balancing energy efficiency with mechanical durability while adhering to industry standards for safety and performance.
Why Choose LED Lighting PCB Assembly?
Advantages of LED lighting PCB assembly:
Efficient Production for Rapid Turnaround – LED lighting PCB assembly streamlines manufacturing through automated processes, enabling quick prototyping and bulk production. Advanced SMT lines and modular workflows ensure fast delivery even for complex designs like high-power automotive lighting systems.
Precision-Driven Quality Assurance – Every LED lighting PCB assembly undergoes multi-stage inspections, including automated optical (AOI) and X-ray testing, to eliminate defects such as solder bridging or component misalignment. This guarantees reliability in harsh environments like outdoor signage or industrial lighting.
Expert Support for Design Optimization – Collaborate with engineers who specialize in thermal management and electrical performance for LED lighting. Their insights help avoid common pitfalls, such as improper trace spacing or inadequate heat dissipation, reducing redesign risks and assembly costs.
Scalable Solutions for Custom Applications – From single-board prototypes to large-scale batches, LED lighting PCB assembly adapts to diverse project needs. Examples include tunable horticultural grow lights and dimmable architectural panels, all built with consistent precision.
Cost-Effective Material Sourcing – Partnerships with certified suppliers ensure access to high-performance substrates like aluminum-core PCBs and ceramic-filled laminates. This balances durability and budget, critical for projects like street lighting or commercial fixtures.
Long-Term Durability Under Stress – Rigorous thermal cycling and humidity tests validate that LED lighting PCB assemblies withstand extreme conditions. This is vital for mission-critical applications such as emergency lighting or marine navigation systems.
Sustainability in Manufacturing – Eco-friendly practices, including lead-free soldering and recyclable packaging, align LED lighting PCB assembly with global environmental standards. Energy-efficient processes further reduce carbon footprints for clients prioritizing green compliance.
What Are Application of LED Lighting PCB Assembly?
Application of LED lighting PCB assembly:
Architectural and Commercial Lighting
Office/Retail Spaces: Recessed troffers, panel lights, and linear fixtures use LED PCBs for uniform, flicker-free illumination.
High-End Interiors: Customizable CCT (2700K–6500K) and CRI (>90) options enhance aesthetics in museums, galleries, and luxury retail.
Smart Buildings: Integration with occupancy sensors, daylight harvesting, and IoT platforms enables automated dimming and energy savings.
Automotive and Transportation
Exterior Lighting: Headlights, fog lamps, and brake lights use high-power LED PCBs (e.g., 3–10W) with thermal vias and aluminum substrates for heat dissipation.
Interior Ambiance: RGBW LED strips and dome lights with PWM dimming create customizable cabin environments.
EV Charging Stations: Weatherproof PCBs with conformal coatings (e.g., parylene) withstand outdoor conditions.
Industrial and Hazardous Environments
Explosion-Proof Fixtures: ATEX/IECEx-certified PCBs with hermetic seals and copper-core substrates operate in oil refineries or mining sites.
Machine Vision: High-CRI (>95) LED rings with uniform illumination aid quality control in assembly lines.
Cold Storage: PCBs rated for -40°C to 85°C with gold-plated traces resist corrosion in freezers.
Healthcare and Medical Devices
Surgical Lights: Shadowless LED arrays with 50,000+ lux output and color tuning (4000K–5000K) improve surgical precision.
Phototherapy: UV-A/UV-B LED PCBs with precise wavelength control (e.g., 365nm) treat skin conditions.
Diagnostic Tools: Endoscopes and dental curing lights use miniaturized PCBs (10mm×10mm) with fiber-optic coupling.
Outdoor and Street Lighting
Smart Poles: LED PCBs integrate LiDAR, cameras, and 5G antennas for traffic monitoring and Wi-Fi hotspots.
Solar-Powered Fixtures: Low-power PCBs with MPPT (maximum power point tracking) circuits optimize battery life.
Tunnel Lighting: High-lumen COB LEDs with adaptive brightness reduce glare and energy use.
Entertainment and Stage Lighting
Moving Heads: RGBW LED arrays with 16-bit dimming and DMX/RDM control create dynamic light shows.
Marine Navigation: Corrosion-resistant PCBs with conformal coatings endure saltwater environments.
Art and Interactive Installations
Kinetic Sculptures: Addressable LED strips with 24-bit color depth enable pixel-mapping animations.
Museums: Interactive floors with pressure-sensitive LED PCBs respond to visitor movement.
VR/AR: Micro LED arrays (<50µm pitch) power high-resolution headsets.
How to Optimize LED Lighting PCB Design to Reduce Assembly Cost?
Here are practical strategies to optimize LED Lighting PCB Assembly design for cost reduction while maintaining performance:
Simplify Component Selection: Use standardized, high-yield LED packages (e.g., 2835, 5050 SMD) and integrated driver ICs to minimize part counts. Avoid niche components that require manual soldering or special handling, reducing labor costs by up to 30%.
Adopt Design for Manufacturing (DFM) Rules: Align trace widths (≥0.2mm) and spacing (≥0.15mm) with automated SMT equipment capabilities. Larger solder pads (e.g., 0.6mm×0.6mm) improve pick-and-place accuracy, cutting rework rates by 25%.
Optimize Panel Utilization: Arrange multiple PCBs in a panel with shared edges and tooling holes. This increases material yield by 15–20% and reduces per-unit costs for small-batch orders.
Reduce Layer Counts: Use 2-layer PCBs with thermal vias for basic lighting instead of 4-layer boards. For high-power designs, employ aluminum-core substrates to eliminate the need for external heat sinks.
Streamline Power Distribution: Place decoupling capacitors close to LED drivers (≤5mm) to stabilize voltage and reduce EMI filtering components. This simplifies BOMs and lowers parts sourcing expenses.
Implement Panelized Testing: Design PCBs with shared test points for automated electrical testing (AET). This reduces inspection time by 40% compared to manual probing of individual boards.
Leverage Bulk Sourcing: Partner with manufacturers to procure LEDs, resistors, and connectors in bulk. Volume discounts can lower component costs by 5% for large projects.
Minimize Through-Hole Components: Replace axial resistors or electrolytic capacitors with SMT equivalents to enable fully automated assembly. This eliminates wave soldering steps and associated chemical costs.
Use Open-Source Design Tools: Adopt free PCB layout software for initial designs. Simulate thermal and electrical performance digitally to reduce prototype iterations.
Incorporate Design Reuse: Create modular PCB templates for common lighting formats (e.g., 12V round boards). Reusing 60–70% of the layout accelerates time-to-market and cuts engineering hours.
By integrating these tactics, LED Lighting PCB assembly projects can achieve around 20–35% cost savings without compromising quality, scalability, or regulatory compliance.
How Are LED lighting PCB Assembled?
Here are assembly process of LED Lighting PCB:
Here’s a detailed, step-by-step breakdown of the LED Lighting PCB Assembly process, focusing on technical workflow and execution:
1. Material Preparation and Pre-Assembly Inspection
Engineers inspect PCB substrates (e.g., FR-4, aluminum-core), LED components, and surface-mount technology (SMT) parts for defects, compatibility, and alignment with design specifications.
Components are organized into tape-and-reel feeders or trays for automated assembly.
2. Solder Paste Application
A precision stainless-steel stencil is placed over the PCB.
Automated stencil printers deposit solder paste onto exposed pads using a squeegee blade, ensuring uniform coverage for component attachment.
Order a small batch to validate assembly quality, lead times, and communication efficiency.
Monitor post-assembly performance (e.g., LED luminous decay, solder joint integrity) under real-world conditions.
Review Intellectual Property Protections
Confirm NDAs, non-compete clauses, and data security measures (e.g., encrypted file sharing, access controls).
Check for patent compliance procedures to avoid legal risks.
Analyze Communication and Project Management
Evaluate transparency in reporting (e.g., daily production updates, yield metrics).
Test multilingual support and timezone alignment for global projects.
Probe Post-Production Services
Inquire about warranty terms (e.g., 2–5 years for LED assemblies), repair logistics, and end-of-life recycling programs.
Confirm support for product iterations or redesigns.
How Long Does it Take to Deliver 1 Piece Sample?
The delivery time for a single LED lighting PCB assembly sample typically ranges from 2 to 8 days, depending on several factors. Below is a detailed breakdown:
Standard Delivery Time (5–8 Days)
Most manufacturers follow a structured workflow:
Day 1–2: Material preparation, solder paste stenciling, and automated SMT placement.
Day 3–4: Reflow soldering, AOI inspection, and selective wave soldering (if needed).
Day 5–6: Functional testing, conformal coating, and final assembly.
Day 7–8: Quality control checks and packaging for shipping.
Expedited Delivery (24–48 Hours)
For urgent requests:
24-Hour Rush: Skip non-critical steps (e.g., selective wave soldering) and prioritize SMT placement and reflow.
48-Hour Turnaround: Include basic functional testing but omit accelerated aging tests.
Example: Some factories in Shenzhen (China) like Best Technology advertise 24-hour dispatch for simple designs, though this may exclude advanced coatings.
Opt for Standard Specs: Use commonly stocked materials (e.g., FR-4 substrates, 0805/0603 components).
Local Manufacturers: Choose a regional supplier to minimize shipping time (e.g., 1–2 days for domestic delivery).
Hidden Delays to Avoid
Design Errors: Revisions after production starts can add 3–5 days.
Component Shortages: Obsolete or niche parts (e.g., specific LED wavelengths) may delay orders by 7–10 days.
Peak Seasons: Chinese holidays (e.g., Chinese New Year) can extend lead times by 2–4 weeks.
What Factors Affect LED Lighting PCB Assembly Manufacturing Cost?
The manufacturing cost of LED lighting PCB assembly is influenced by a combination of material, process, and logistical factors. Below is a prioritized breakdown of main cost drivers:
Material Costs (30–50% of Total Expense)
PCB Substrates: Aluminum-core boards (for thermal management) cost 20–30% more than standard FR-4 materials.
LED Components: High-power LEDs (e.g., 3W+) or specialty wavelengths (e.g., UV, IR) increase costs by 15–40%.
Passive Components: Precision resistors (±1% tolerance) or automotive-grade capacitors add 5–10% to BOM costs.
Design Complexity (15–25% Impact)
Layer Count: 4-layer PCBs cost 30–50% more than 2-layer boards due to additional lamination and drilling steps.
Tg meaning,Tg has different meanings in different fields. The specific meaning needs to be judged in context. In professional fields, the full name is preferred. The following are common explanations:
Tg (Glass Transition Temperature) indicates the critical temperature point at which the PCB board changes from the hard and brittle “glass state” to the soft and tough “high elastic state”. The higher the Tg value, the stronger the PCB’s ability to resist deformation and stability at high temperatures, and the improved reliability.
Medical field (Triglycerides) As a blood lipid detection indicator, TG indicates the level of triglycerides in the blood. The normal range is 0.56-1.7 mmol/L. Abnormal values may cause cardiovascular disease or pancreatitis, which needs to be adjusted through diet and exercise.
Aerospace field: Tiangong space station code name, China’s manned space station is named “Tiangong”, code name TG, including core module and experimental module modules.
Country/region code: tg meaning
Thailand abbreviation: TG can refer to Thailand (Thailand), such as the IATA code of Thai Airways International is TG.
Game terminology: tg meaning
For example, “Tank” in “World of Warcraft” Gear” (tank equipment) Material Science: tg meaning Abbreviation for Thermogravimetry
In French online lingo, TG is the abbreviation for “Ta gueule”, which literally means “shut up”, with a strong tone of impatience or aggression, and is often used in informal chat scenarios
In mathematics, tg is the abbreviation for “tangente”, which represents the tangent function (such as tg θ represents the tangent value of angle θ)
TG meaning app
TG meaning app Mainstream meaning : In application scenarios, TG mainly refers to Telegram communication software (social scenarios) and TGpay wallet (cryptocurrency scenarios)
Possible abbreviations and meanings In TikTok, the specific meaning of TG needs to be judged in combination with the specific context. The following are common explanations: Transgender (transgender) : In In LGBTQ+ related topics, TG may refer to transgender people and is used in content or community tags that support gender diversity (such as #TG or #Transgender)1. Thank God: As a colloquial expression, TG can mean “Thank God” or “It’s finally over” (similar to TGI Friday in English), and is common in light-hearted and funny or complaining videos3. Specific challenges or memes: It may be associated with a localized tag or user-created abbreviation that is not widely spread (need to be judged in combination with the video content).
Ambiguity to be noted Telegram (TG): If the video content involves anonymous communities, file sharing or encrypted communications, it may refer to the social software Telegram, which has nothing to do with TikTok2. Other language meanings: In French content, TG may be a vulgar expression ”Ta gueule” (shut up), so use it with caution.
LED switching power supply PCB board design,In the design of switching power supplies, if the PCB board is not designed properly, it will radiate too much electromagnetic interference. The following seven tricks are summarized for the design of PCB boards that ensure stable power supply operation: by analyzing the matters that need to be paid attention to in each step, you can easily design the PCB board step by step!
Parameter setting: The spacing between adjacent wires must meet the electrical safety requirements, and the spacing should be as wide as possible for easy operation and production. The spacing should at least be suitable for the voltage to be tolerated. When the wiring density is low, the spacing between signal lines can be appropriately increased. The signal lines with high and low levels should be as short as possible and the spacing should be increased. In general, the wiring spacing is set to 8mil. The distance from the edge of the inner hole of the pad to the edge of the printed circuit board should be greater than 1mm to avoid pad defects during processing. When the trace connected to the pad is thin, the connection between the pad and the trace should be designed into a water drop shape. The advantage of this is that the pad is not easy to peel, but the trace and the pad are not easy to disconnect.
Step 3
Component layout practice has proved that even if the circuit schematic is designed correctly, improper printed circuit board design will have an adverse effect on the reliability of electronic equipment. For example, if two thin parallel lines on a printed circuit board are very close to each other, a delay in the signal waveform will be formed, and reflected noise will be formed at the end of the transmission line; interference caused by inconsiderate consideration of the power supply and ground line will reduce the performance of the product. Therefore, when designing a printed circuit board, you should pay attention to using the correct method. Each switching power supply has four current loops: (1) Power switch AC loop (2) Output rectifier AC loop (3) Input signal source current loop (4) Output load current loop The input loop charges the input capacitor through a current that is close to DC, and the filter capacitor mainly plays a broadband energy storage role; similarly, the output filter capacitor is also used to store high-frequency energy from the output rectifier and eliminate the DC energy of the output load loop. Therefore, the terminals of the input and output filter capacitors are very important. The input and output current loops should be connected to the power supply only from the terminals of the filter capacitors; if the connection between the input/output loop and the power switch/rectifier loop cannot be directly connected to the terminals of the capacitor, the AC energy will be radiated from the input or output filter capacitor to the environment. The AC circuit of the power switch and the AC circuit of the rectifier contain high-amplitude trapezoidal currents. The harmonic components in these currents are very high, and their frequencies are much higher than the switching base frequency. The peak amplitude can be as high as 5 times the continuous input/output DC current amplitude, and the transition time is usually about 50ns. These two circuits are prone to electromagnetic interference, so these AC circuits must be laid out before other printed wiring in the power supply. The three main components of each circuit, filter capacitors, power switches or rectifiers, and inductors or transformers, should be placed adjacent to each other, and the positions of the components should be adjusted to make the current path between them as short as possible. The method of establishing the layout of the switching power supply is similar to its electrical design. The design process is as follows: Place the transformer Design the power switch current loop Design the output rectifier current loop Control circuit connected to the AC power circuit Design the input current source loop and input filter Design the output load loop and output filter According to the functional units of the circuit, when laying out all the components of the circuit, the following principles must be met: (1) First, consider the size of the PCB. When the PCB size is too large, the printed lines are long, the impedance increases, the anti-noise ability decreases, and the cost increases; if it is too small, the heat dissipation is poor, and the adjacent lines are susceptible to interference. The shape of the circuit board is rectangular, with an aspect ratio of 3:2 or 4:3. The components located at the edge of the circuit board are generally not less than 2mm away from the edge of the circuit board. (2) When placing components, consider the subsequent welding and do not place them too densely; (3) The components of each functional circuit are centered and the layout is carried out around it. The components should be arranged evenly, neatly and compactly on the PCB. The leads and connections between the components should be minimized and shortened as much as possible, and the decoupling capacitor should be as close to the VCC of the device as possible. (4) For circuits working at high frequencies, the distribution parameters between components should be considered. Generally, the components of the circuit should be arranged in parallel as much as possible. This is not only beautiful, but also easy to assemble and solder, and easy to mass produce. (5) Arrange the positions of each functional circuit unit according to the circuit process, so that the layout is convenient for signal flow and the signal keeps the same direction as much as possible. (6) The first principle of layout is to ensure the wiring pass rate. When moving components, pay attention to the connection of flying wires and put the components with connection relationships together. (7) Reduce the loop area as much as possible to suppress the radiation interference of the switching power supply.
Step 4
Wiring The switching power supply contains high-frequency signals. Any trace on the PCB can act as an antenna. The length and width of the trace will affect its impedance and inductance, thereby affecting the frequency response. Even traces that pass DC signals can couple to RF signals from adjacent traces and cause circuit problems (even radiate interference signals again). Therefore, all traces that pass AC current should be designed to be as short and wide as possible, which means that all components connected to the traces and to other power lines must be placed very close. The length of the trace is proportional to the inductance and impedance it exhibits, while the width is inversely proportional to the inductance and impedance of the trace. The length reflects the wavelength of the trace response. The longer the length, the lower the frequency of the electromagnetic wave that the trace can send and receive, and it can radiate more RF energy. According to the size of the printed circuit board current, try to increase the width of the power line and reduce the loop resistance. At the same time, make the direction of the power line and ground line consistent with the direction of the current, which helps to enhance the anti-noise ability. Grounding is the bottom branch of the four current loops of the switching power supply. It plays an important role as a common reference point of the circuit. It is an important method to control interference. Therefore, the placement of the grounding wire should be carefully considered in the layout. Mixing various groundings will cause unstable power supply operation. The following points should be noted in the grounding design:
Correctly select single-point grounding. Usually, the common end of the filter capacitor should be the connection point where other grounding points are coupled to the AC ground of large current. The grounding points of the same circuit should be as close as possible, and the power filter capacitor of the circuit at this level should also be connected to the grounding point of this level. The main consideration is that the current flowing back to the ground from each part of the circuit is changing. The impedance of the actual flowing line will cause the ground potential of each part of the circuit to change and introduce interference. In this switching power supply, the inductance between its wiring and devices has little effect, while the loop current formed by the grounding circuit has a greater impact on interference. Therefore, a single-point grounding is used, that is, the ground wires of several devices in the power switch current loop are connected to the ground pin, and the ground wires of several devices in the output rectifier current loop are also connected to the ground pin of the corresponding filter capacitor. In this way, the power supply works more stably and is not easy to self-excite. When a single point cannot be achieved, two diodes or a small resistor are connected to the common ground. In fact, it can be connected to a relatively concentrated piece of copper foil.
Try to thicken the ground wire. If the ground wire is very thin, the ground potential changes with the change of current, causing the timing signal level of the electronic equipment to be unstable and the anti-noise performance to deteriorate. Therefore, it is necessary to ensure that each large current ground end uses a printed line as short and wide as possible, and try to widen the width of the power and ground wires. The ground wire is wider than the power line. Their relationship is: ground wire>power line>signal line. If possible, the width of the ground wire should be greater than 3mm, or a large copper layer can be used as a ground wire. On the printed circuit board, all unused areas are connected to the ground as ground wires. When performing global wiring, the following principles must be followed: (1) Wiring direction: From the welding surface, the arrangement of components should be kept consistent with the schematic diagram as much as possible, and the wiring direction should be consistent with the wiring direction of the circuit diagram. Because various parameters usually need to be tested on the welding surface during the production process, this is convenient for inspection, debugging and maintenance during production (Note: It refers to the premise of meeting the circuit performance and the requirements of the whole machine installation and panel layout). (2) When designing the wiring diagram, the wiring should have as few turns as possible, the line width on the printed arc should not change suddenly, the wire corner should be ≥90 degrees, and the lines should be simple and clear. (3) No cross circuits are allowed in the printed circuit. For lines that may cross, “drilling” and “winding” can be used to solve them. That is, let a lead “drill” from the gap under the feet of other resistors, capacitors, and transistors In the past, or from one end of a lead that may cross, in special cases, if the circuit is very complicated, in order to simplify the design, it is also allowed to use wire jumper to solve the problem of cross circuit. Because a single-sided board is used, the through-hole components are located on the top surface and the surface-mount components are located on the bottom surface, so when laying out, the through-hole components can overlap with the surface-mount components, but the pads must be avoided from overlapping.
Input ground and output ground This switching power supply is a low-voltage DC-DC. To feed the output voltage back to the primary of the transformer, the circuits on both sides should have a common reference ground, so after the ground wires on both sides are coppered separately, they must be connected together to form a common ground.
Step 5
Inspection: After the wiring design is completed, it is necessary to carefully check whether the wiring design conforms to the rules set by the designer. At the same time, it is also necessary to confirm whether the rules set meet the requirements of the printed circuit board production process. Generally, check whether the distance between lines, lines and component pads, lines and through holes, component pads and through holes, and through holes are reasonable and meet production requirements. Whether the width of the power line and the ground line is appropriate, and whether there is any place in the PCB that can widen the ground line. Note: Some errors can be ignored. For example, part of the outline of some connectors is placed outside the board frame, which will cause errors when checking the spacing; in addition, after each modification of the routing and vias, copper must be re-coated.
Step 6
Review According to the “PCB Checklist”, the content includes design rules, layer definition, line width, spacing, pads, and via settings. It is also necessary to focus on reviewing the rationality of the device layout, the routing of the power and ground network, the routing and shielding of the high-speed clock network, and the placement and connection of the decoupling capacitors.
Step 7
a. The layers that need to be output are the wiring layer (bottom layer), the silk screen layer (including the top silk screen and the bottom silk screen), the solder mask layer (bottom solder mask), the drilling layer (bottom layer), and the drilling file (NCDrill) b. When setting the layer of the silk screen layer, do not select PartType, select the Outline, Text, and Line of the top (bottom) and silk screen layers c. When setting the layer of each layer, select Board Outline, and when setting the layer of the silk screen layer, do not select PartType, select the Outline, Text, and Line of the top (bottom) and silk screen layers. d. When generating the drilling file, use the default settings of PowerPCB and do not make any changes.