Archive for the ‘FAQ’ Category

PWB Vs. PCB: What Are the Manufacturing Process Differences?

Thursday, July 4th, 2024

In our daily life, electronic devices are existing everywhere. And there are many people know the “PCB” nowadays, while very less people know the “PWB”. Unless you’ve been in the PCB business for more than 20 years.

Actually, PWB is another term of circuit board, and it was used commonly before the year 1999. But with the development of electronics, it was replaced by PCB gradually. You want to know more about it? In this article, we will answer it for you. Deeply explain their definitions, manufacturing process, applications and the key differences between PCB and PWB.

PWB Vs. PCB: What Are the Manufacturing Process Differences?

What is A Printed Circuit Board (PCB)?

A Printed Circuit Board is a fundamental component in modern electronics, providing the physical and electrical connections for various electronic components. It consists of multiple compositions, including a non-conductive substrate, conductive pathways, and insulating layers, which facilitate the complex circuitry required in contemporary devices. A PCB can be made into single sided PCB, double sided PCB and multilayer PCB.

PCBs are integral to the functionality of a wide range of electronic products, from consumer gadgets like smartphones and computers to industrial machinery, medical devices, and aerospace systems. The advanced design and manufacturing processes involved in PCB production ensure high reliability and performance, making them essential in virtually all electronic applications.

Basic manufacturing process of PCB

Design and Layout

PCBs are designed using sophisticated computer-aided design (CAD) software. Designers create detailed layouts, specifying the placement of components, conductive pathways, and vias (interlayer connections). The design is converted into Gerber files, a standard format for PCB fabrication that contains all the necessary information for manufacturing. These files are essential for ensuring precision and accuracy during the manufacturing process.

Material Preparation

The substrate, typically FR4 (fiberglass epoxy laminate), is prepared. FR4 is known for its excellent mechanical strength and thermal stability, making it an ideal base material for PCBs. Copper sheets are laminated onto the substrate, which will form the conductive pathways after the etching process. This preparation stage is crucial for creating a reliable foundation for the PCB.

Printing the Circuit Pattern

A photoresist, a light-sensitive material, is applied to the copper-clad substrate. The board is exposed to ultraviolet (UV) light through a mask that defines the circuit pattern. The UV light hardens the photoresist in the exposed areas. The board is then developed in a chemical solution that removes the unexposed photoresist, revealing the copper to be etched away. This step accurately transfers the circuit design onto the board.

Etching

The board is immersed in an etching solution, commonly ferric chloride or ammonium persulfate, which removes the unprotected copper, leaving only the desired circuit pattern. This etching process is crucial for defining the conductive pathways on the PCB, ensuring that the correct connections are made according to the design specifications.

Drilling

Precision drilling machines are used to create holes for through-hole components and vias. These holes are then cleaned to remove any debris that could affect electrical connectivity. Drilling is a critical step in the PCB manufacturing process as it ensures proper placement and connection of components across different layers of the board.

Plating

The drilled holes are plated with copper to create electrical connections between the layers, which is especially important for multilayer PCBs. Additional layers of plating, such as nickel or gold, may be applied to improve conductivity and protect against oxidation. This plating process enhances the durability and performance of the PCB.

Solder Mask Applying

A solder mask is applied to protect the copper traces from oxidation and prevent solder bridges between closely spaced solder pads. The solder mask is exposed to UV light and then developed to reveal the solder pads. This layer not only protects the PCB but also improves its appearance and reliability.

Silkscreen Printing

A silkscreen layer is printed on the board to add text, component labels, and other identifiers. This layer helps in the identification and assembly of components, making it easier for technicians to work with the PCB during the manufacturing and repair processes.

Surface Finishing

Generally, a layer of surface finishing is coated on the PCB to protect its surface, it also called surface treatment. The common surface treatments are HASL-LF, ENIG, ENEPIG, OSP, Immersion Silver/Tin. Of course, different treatment offers different function, like OSP is to protect surface from oxidation, HASL-LF provides a good solderability, ENEPIG make sure the chemistry corrosion. Choose a suitable one according to your specific demands.

Assembly and Testing

Components are placed on the board using automated pick-and-place machines, and soldered using techniques like reflow soldering for surface-mount devices (SMD) and wave soldering for through-hole components. The finished PCB undergoes various tests, such as automated optical inspection (AOI), electrical testing, and functional testing, to ensure quality and performance. Want see the whole manufacturing process of a multilayer PCB, click here: Manufacturing Process of Multi-layer PCB.

What is the definition of Printed Wiring Board (PWB)?

A Printed Wiring Board is a term historically used to describe a type of circuit board that focuses primarily on the layout and wiring of electronic connections rather than the overall circuit functionality. PWBs emphasize the physical arrangement of conductive paths to connect various components but do not necessarily include all the integrated features found in modern PCBs.

This term was more prevalent during the earlier stages of electronic development, where the primary concern was establishing reliable electrical connections. As technology advanced, the term PCB became more common, reflecting the expanded capabilities and comprehensive role of these boards in forming complete electronic circuits. Despite being less common today, understanding the term PWB is crucial for historical context and certain niche applications.

How to Manufacture A Printed Wiring Board (PWB)?

Design and Layout

PWBs typically have simpler designs focused on wiring patterns rather than complex circuitry. In some cases, the layout may be done manually or using basic design software.

Material Preparation

Simpler substrates such as phenolic or epoxy resins may be used for PWBs. Copper sheets are laminated onto the substrate to form the conductive pathways. These materials are cost-effective and suitable for applications where advanced performance characteristics are not required.

Printing the Wiring Pattern

Similar to PCBs, a photoresist is applied to the copper-clad substrate. The board is then exposed to UV light through a mask and developed to reveal the copper to be etched away. This process creates the wiring pattern necessary for connecting electronic components.

Etching

The board is immersed in an etching solution to create the wiring pattern. This step is straightforward compared to the more intricate etching processes used in PCB manufacturing, reflecting the simpler requirements of PWBs.

Drilling

Holes for through-hole components are drilled, but the process may not require the precision needed for complex PCBs. This basic drilling process is adequate for the less demanding applications of PWBs.

Plating (if necessary)

Plating is done to ensure electrical connectivity but may not involve advanced techniques like those used for multilayer PCBs. It suffices for the simpler construction of PWBs.

Solder Mask Application

A basic solder mask may be applied to protect the wiring pattern. This layer provides sufficient protection for the relatively simple designs of PWBs, preventing short circuits and oxidation.

Silkscreen Printing

A simple silkscreen layer may be added for component identification. This helps in the assembly process but does not require the detailed labeling often necessary for PCBs.

Assembly and Testing

Components are manually or semi-automatically placed on PWBs and soldered using standard techniques. Basic electrical testing is conducted to ensure functionality. This simpler assembly and testing process aligns with the less complex nature of PWBs.

Which Kind of Materials used in PCB and PWB?

Substrate Materials

FR4 (fiberglass epoxy laminate) is the most common substrate material for PCBs due to its excellent mechanical strength and thermal stability. Phenolic resin, used in PWBs for simpler applications, is less durable and has lower thermal stability compared to FR4, but it is cost-effective and suitable for basic electronic devices. Polyimide is used for flexible PCBs due to its high flexibility and thermal resistance, making it ideal for applications requiring bending and flexing, such as wearable electronics and flexible displays.

Conductive Materials

Copper is the primary conductive material for both PCBs and PWBs. It is used to create the conductive pathways and pads, providing excellent electrical conductivity and reliability. Gold, nickel, and silver are used for plating to enhance conductivity and protect against oxidation, primarily in PCBs. These materials improve the durability and performance of the PCB by providing a reliable contact surface for soldering and component connections.

Insulating Materials

Prepreg, a fiberglass cloth impregnated with resin, is used in multilayer PCBs to bond the layers together. Prepreg provides mechanical strength and electrical insulation between the layers. Dielectric materials are used between layers in multilayer PCBs to provide electrical insulation, maintaining signal integrity and preventing short circuits.

Solder Mask Materials

Liquid Photo Imageable (LPI) solder mask is the most common type used in PCBs, providing excellent protection and durability. LPI solder masks are applied using a photolithographic process, ensuring precise coverage and protection. Dry film solder mask is used for simpler applications and PWBs. This type of solder mask is less expensive and easier to apply but may not offer the same level of protection as LPI solder masks.

Key differences between PCB and PWB

Feature	PCB (Printed Circuit Board)	PWB (Printed Wiring Board)
Design and Layout	Designed using sophisticated CAD tools for complex circuitry, including detailed simulation and optimization.	Simpler designs focused on wiring patterns, often done manually or with basic software.
Layer Count	Can have multiple layers (e.g., double-sided, multilayer) to support intricate circuit designs.	Generally single or double-sided, less commonly multilayer.
Component Types	Supports surface-mount technology (SMT) and through-hole technology (THT) components.	Primarily supports through-hole technology (THT) components.
Signal Integrity	Designed to maintain high signal integrity, minimizing electrical noise and interference.	Basic signal integrity management, sufficient for simple applications.
Flexibility and Rigidity	Includes both rigid and flexible PCBs, allowing for a wide range of applications.	Typically rigid, not commonly used in flexible applications.
Terminology and Usage	Universally used in the industry to refer to boards that integrate all necessary components to form complete circuits. Also called “bare board”.	Universally used in the industry to refer to boards that integrate all necessary components to form complete circuits.
Industry Standards	Recognized by standards organizations like IPC, IEC, and ANSI with specific performance and quality criteria.	Covered under broader standards but with fewer specific guidelines due to limited modern use.
Cost and Efficiency	Higher cost due to advanced materials and processes, offering superior performance and reliability.	More cost-effective for simple applications, but with limited performance and reliability.
Applications	Used in consumer electronics, industrial equipment, medical devices, aerospace, and defense.	Historically used in simpler electronic devices and early computers, still relevant in niche applications.

(Summary Differences: PCB VS PWB)

Other Terms Related to PWB and PCB

Based on the PCB and PWB, you may still hear about CCA, PCA, PWA during the PCB working. These terms are also related to printed circuit board. Here is a detailed explanation of each:

Printed Wiring Assembly (PWA)

PWA is the abbreviation for printed wiring assembly. This is an archaic term that was once used to describe what we now refer to as PCB assembly or PCBA. Although it is less common today, understanding this term is useful for historical context and when dealing with older documentation.

Circuit Card Assembly (CCA)

CCA stands for circuit card assembly. It is essentially the same thing as PCBA, where the PCB is assembled with all necessary components to create a functional unit. CCA is a less frequently used term compared to PCBA but is still recognized in certain industries and contexts.

Printed Circuit Board Assembly (PCBA)

PCBA is the abbreviation for printed circuit board assembly. When the PCB is assembled with all its electronic components by SMT technology, it is called PCBA or PCB assembly. Since a change in terminology in 1999, PCBA has become the standard term used for all assembled circuit boards. From users to technical committees, PCBA is the preferred term for referring to assembled boards. The assembly process involves placing and soldering components onto the PCB, making it a functional electronic circuit.

Printed Circuit Assembly (PCA)

PCA stands for printed circuit assembly, which is another term for PCBA. Like CCA, PCA is not commonly used in modern terminology but refers to the same concept of an assembled printed circuit board.

In a word, whatever for PWB, PCB, or circuit cards, they are refer to bare printed circuit boards (bare boards). While PCA, CCA, PWA, and PCBA refer to assembled circuit boards. Among these terms, PCB and PCBA are the most widely used in both industry and technical documentation.

This is the end of this introduction of PWB and PCB, welcome to contact us if you want more about PCB knowledge.

Tags:PCB, pcb manufacturing, printed circuit board, printed wiring board, pwb, PWB assembly
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High Speed PCB: How to Design It?

Wednesday, July 3rd, 2024

In today’s tech-driven world, creating efficient high speed PCB (Printed Circuit Board) is critical for ensuring devices can handle rapid data transfer without issues. These high speed PCBs are popular in the wireless devices which needs high signal transfer. Crafting high-speed circuits requires careful planning and precise execution to maintain signal quality and overall performance. In this blog, we introduced the basics of high-speed PCB design, offering practical tips and insights into the best materials and techniques for high-frequency applications.

What is a High Speed Circuit PCB?

High-speed PCB is a circuit board that can support signal transmission. High-speed signals usually refer to signals with frequencies higher than 50MHz, such as high-speed digital signals, high-speed analog signals, etc. These fast transitions can introduce challenges like signal reflections, electromagnetic interference (EMI), and crosstalk, which can disrupt performance if not properly managed.

Additionally, these signals will be affected by board materials, layout, wiring and other factors during transmission. Therefore, a specially designed circuit board is required to ensure the integrity and reliability of the signal. Here is a 4 layers high speed PCB for Iradar device with 50ohm single-ended impedance control.

Features of High-Speed PCB

High frequency

Low permittivity and low loss factor

Multilayer design

Strict impedance control

High-precision manufacturing

Low noise characteristic

High density circuit layout (micro-vias)

High performance

What is Considered High-Speed PCB Design?

High-speed PCB design focuses on managing the complexities that come with high-frequency signals and fast switching. Key considerations include:

– Signal Integrity: Ensuring signals travel without distortion or loss.

– Power Management: Distributing power effectively to minimize noise and voltage drops.

– Heat Handling: Managing heat from high-speed components to prevent overheating.

– Impedance Matching: Keeping impedance consistent to reduce signal reflections and loss.

– Differential Pair Routing: Reducing EMI and crosstalk by routing complementary signal pairs together.

This type of high speed pcb design requires a solid understanding of electromagnetic principles, advanced simulation tools, and precise manufacturing techniques. For those new to high-speed PCB design, Best Technology offers expert guidance and solutions.

What’s the Best Material for High-Speed PCB Design?

Choosing the right material for high speed pcb is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

– FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.

– Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.

– Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

Where is the High-Speed PCB Commonly Used in?

High-speed circuit boards are widely used in signal transmission applications, the typical fields are including:

1. Communication equipment – such as 5G base stations, optical fiber communication equipment, etc.

2. Data center – like high-performance computing, storage servers, etc.

3. Consumer electronics in our daily life – high-end smartphones, tablets, gaming devices, etc.

4. Aerospace and military – high speed are always used in high-end devices. For example, radar, navigation systems and other equipment with high reliability requirements.

What is the 3H Rule in High Speed PCB Design?

The 3H rule is a guideline suggesting that signal traces should be spaced at least three times the height of the dielectric (3H) between the signal layer and the adjacent ground or reference layer. This helps minimize crosstalk and maintain signal integrity, particularly for high-speed digital signals with rise times of 1 ns or less. Key aspects include:

– Trace Spacing: Keeping traces apart by at least 3H reduces electromagnetic coupling and interference.

– Signal Integrity: Adequate spacing helps maintain clear signals in high-speed circuits.

– Effectiveness: This rule is especially beneficial for fast digital signals, reducing the risk of crosstalk and interference.

For instance, if the dielectric height between the signal layer and the reference layer is 0.2 mm, traces should be at least 0.6 mm apart to follow the 3H rule.

How to Design a High-Speed Board?

Designing a high-speed PCB involves several strategies to ensure effective signal transmission, power distribution, and minimal EMI. Here’s a step-by-step approach:

Component Placement and Layer Stack-Up

Place high-speed components to minimize signal paths and interference. Group related components to simplify routing. In addition, create a layer stack-up that supports controlled impedance and reduces signal loss. Use ground planes between layers for a return path for high-frequency currents.

Trace Routing and Impedance Control

Keep high-speed traces short and direct, avoiding right-angle bends. Use microstrip or stripline configurations for controlled impedance and minimal noise. For impedance control, calculate and ensure consistent impedance for traces. Use differential pair routing for high-speed signals to reduce EMI and crosstalk.

Power Distribution and EMI Mitigation

Use decoupling capacitors near high-speed components to filter noise and stabilize the power supply. Design a robust power distribution network to minimize impedance and ensure stable voltage. And employ proper grounding and shielding techniques. Route high-speed signals on inner layers between ground planes to reduce EMI and provide a consistent return path.

Simulation and Testing

Use signal integrity analysis tools like SI or PI to simulate the PCB layout, predicting signal behavior and identifying potential issues. Analyze aspects like eye diagrams to assess signal quality.

High-speed PCB design is a complex but rewarding endeavor that ensures your electronics perform efficiently in high-frequency environments. By understanding the fundamentals and applying the right techniques and materials, you can create robust, high-speed boards. Best Technology is here to assist you with expert advice and solutions for your high-speed PCB needs.

Tags:3H rules, high speed circuit design, high speed pcb, high speed pcb design guidelines, high-speed pcb, high-speed pcb design, pcb design
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What Are the Differences Between Active and Passive Components?

Wednesday, July 3rd, 2024

In PCB electronics, components are classified into two main categories: active and passive components. Understanding these differences is crucial for anyone working with electronic circuits. Active components control electricity flow and require an external power source. Passive components do not control electricity and do not need an external power source.

What are active and passive components meaning?

Active and passive components, simply say, the device that needs an energy (electrical) source is called an active device, and the device that does not need an energy source is a passive device. Active components, such as transistors and diodes, require external power to function. They can control the flow of electricity. Passive components, like resistors and capacitors, do not need external power. They cannot control electrical flow but can store, resist, or filter energy. Both passive and active components are common useful in PCB assembly and SMT technology.

Active components play a dynamic role in circuits. They can amplify signals, switch currents, and perform various complex functions. These components rely on an external power source to operate and influence the behavior of the circuit. For instance, a transistor can amplify a weak signal, making it stronger and more useful for further processing.

What Are the Differences Between Active and Passive Components?

Passive components, on the other hand, are more static in nature. They cannot amplify signals or control current flow but are essential for other functions like energy storage and signal filtering. Resistors, capacitors, inductors, and transformers are common examples. Each of these components has a specific role in maintaining the stability and functionality of an electronic circuit.

What are the key differences between active and passive components?

The main difference between active and passive components is their ability to control electricity. Active components can amplify signals and perform complex tasks. Passive components can only store, resist, or filter energy. They cannot amplify signals or control current.

Active components are energy-dependent. They require an external source of power to function and can influence the flow of electricity within the circuit. For example, an integrated circuit (IC) can perform multiple functions like amplification, switching, and signal modulation, all of which require external power.

Passive components, in contrast, do not require an external power source. They can only perform their functions passively. For instance, a resistor can limit the current flowing through a circuit without needing additional power. Similarly, a capacitor can store electrical energy and release it when needed, all without external energy input.

Common active components in electronics

Active devices are the main components of electronic circuits. From the physical structure, circuit function and engineering parameters, active devices can be divided into discrete devices and integrated circuits.

1. Discrete devices

Bipolar transistor, generally referred to as transistor or BJT
Field effective transistor
Thyristor
Semiconductor resistors and capacitors – resistors and capacitors manufactured by integrated technology are used in integrated circuits.

2. Integrated circuit

Integrated circuit can be divided into analog IC and digital IC. Analog integrated circuits mainly deal with continuous analog signals, such as sound, light, temperature, etc., and retain the continuity and accuracy of the signal through amplification, filtering, mixing and other operations. In contrast, digital integrated circuits are used to process discrete time digital signals, convert the signal into binary digital form, and then perform logical operations and processing.

Basic analog integrated circuit devices generally include:

Integrated operational amplifier (operation amplifier)
Comparator
Logarithmic and exponential amplifiers
Multiplier/divider
Analog switching circuit (analog switch)
Phase lock loop
Integrated voltage regulator
Reference source
Wave-form generator
Power amplifier

Digital integrated circuit including:

Logic gate circuit
Flip-flop
Register
Decoder
Data comparator
Driver
Counter
Shaping circuit
Programmable Logic Device (PLD)
Microprocessor (MPU)
Microcontroller (MCU)
Digital signal processor (DSP)

Common passive components in electronics

Passive devices in electronic systems can be divided into circuit components and connection components according to the circuit functions they play. These components are essential for functions like energy storage, filtering, and impedance matching in electronic circuits. The common passive components are including:

Circuit components

Diode
Resistor
Resistor network
Capacitor
Inductor
Transformer
Relay
Key
Speaker
Switch

Connection components

Connector
Socket
Cable
PCB (printed circuit board)

Why are active components crucial in modern electronics?

The ability of active components to control and manipulate electrical signals makes them indispensable in a wide range of applications.

In computers, for example, active components such as processors and memory chips perform complex calculations and store large amounts of data. In communication systems, active components amplify weak signals, making long-distance transmission possible. Without these amplifiers, the signal would decay with distance, leading to a decline in communication quality. Power electronics, another key area of modern development, relies heavily on active components. Devices like power converters, inverters, and motor controllers use transistors and integrated circuits to efficiently convert and control electrical energy. This efficiency is crucial for applications ranging from renewable energy systems to electric vehicles.

It’s fair to say that without active components, devices like computers, smartphones, and TVS wouldn’t function the way they do today, and our era of big data wouldn’t be moving as fast as it is today.

How do passive components complement active components?

Both active and passive components are indispensable in a circuit. They depend on each other and complement each other. Without active components, the circuit cannot be activated or perform a specific work. Without passive components, the circuit cannot be controlled and adjusted, nor can it achieve a stable operating state. Such a relationship between the two is like the relationship between the “dynamic” and the “static” of a circuit.

For example, in an audio amplifier circuit, the power supply and amplifier are the active components, and the load and resistance are the passive components. The power supply provides energy, the amplifier amplifies the signal, and controls and limits it through load and resistance, and finally realizes the amplification and regulation of the audio signal. In signal processing, inductors filter out high-frequency noise and protect sensitive active components from interference. Transformers, on the other hand, enable efficient power transfer between different parts of the circuit, allowing active components to operate within their optimal voltage range.

Comparing the Energy Requirements of Active and Passive Elements

Active components need an external power source to function. They consume energy during operation. Passive components do not need external power and generally do not consume energy, except for minor resistive losses. This difference impacts the design and efficiency of electronic circuits.

Active components, such as transistors and integrated circuits, rely on external power to operate. This power requirement means that active components consume energy during their operation. The amount of energy consumed depends on the specific component and its application. For instance, a power amplifier consumes more energy than a simple transistor switch.

Passive components, in contrast, do not need external power to function. They operate solely based on the electrical energy present in the circuit. Resistors, capacitors, and inductors do not consume significant energy, except for minor resistive losses in resistors. This low energy requirement makes passive components more efficient in certain applications.

The difference in energy requirements between active and passive components impacts the overall efficiency of electronic circuits. Designers must carefully balance the use of active and passive components to achieve optimal performance and energy efficiency. For example, using passive filters instead of active ones can save energy in low-power applications.

Active and Passive Component Images and Symbols

Recognizing symbols are essential for reading and designing circuit diagrams. They provide a visual representation of the components and their functions, helping designers understand the overall structure and operation of the circuit. Recognizing these symbols is a fundamental skill for anyone involved in electronics. Here is a detailed images and symbols listing of common active and passive components.

Above all is the introduction to passive and active components, hope it is useful for every engineers. Best Technology is a professional PCB and PCBA manufacturer in Asia. We have our own factory in China and Vetnam. Welcome to contact us if you have any questions about components and PCB assembly.

Tags:Active and Passive Component Images and Symbols, active components, active components and passive components, active elements, passive component meaning, passive components, PCB, PCBA, SMT
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PCB Design for PICE Card, Industrial PCB Design Cases

Tuesday, June 25th, 2024

Best Technology has been a leader in PCB manufacturing and design for over 17 years. Our R&D team allows us to offer customers quick and valuable PCB design solutions. Here, we share one of our industrial motherboard design for PICE card for your reference.

PICE card

[1]: Main chip: XCKU11P

[2]: 30A maximum current

[3]: Single pair differential line, 10G optical network

[4]: 14 layers PCB

If you need a custom industrial PCB design, please feel free to contact us.

Tags:industrial PCB design, pcb design
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Video Decoder Hardware PCB Design Case Example

Tuesday, June 25th, 2024

A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:

Video decoder

[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI

[2]: Single pair differential line, 10G optical network, memory of DDR4

[3]: 12 layers PCB

Why choose us?

We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:

Professional engineer evaluation

DFM analysis

One-time successully on prototyping

SI analysis of signal integrity

Electromagnetic compatibility (EMC) analysis

Tags:hardware pcb design, pcb design, video decoder hardware
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High Speed PCB Design Guidelines, PCB Camera Design Case

Tuesday, June 25th, 2024

When designing high-speed PCBs, several critical factors must be considered to ensure optimal performance. These include signal integrity, impedance control, and minimizing electromagnetic interference (EMI). Below is an ultra high speed camera PCB solution made by Best Technology:

An ultra-high-speed camera rigid-flex circuit board

[1]: XCKU060 chip

[2]: 20A maximum current

[3]: Four DDR4 channels

[4]: 20 layers PCB

High Speed PCB Design Guidelines, PCB Camera Design Case

Camera PCB design considerations:

1. When the Camera adopts a connector: when the MIPI differential signal passes through the connector, the adjacent differential signal pairs must be isolated using GND pins; If it is not convenient to punch holes, the spacing between the difference pairs is at least 15mil.

2. If there is a reserved test point for the Camera connection seat, it should be close to the connection seat, and the Stub on the cable should be as short as possible.

3. Decoupling capacitors of AVDD/DOVDD/DVDD power supply need to be placed as close as possible to the Camera connection base.

4. The Camera layout needs to be far away from high-power radiation devices, such as GSM antennas.

5. CIF/MIPI and other signals, if there is a board to board connection through the connector, it is recommended that all signals be connected with a certain resistance value (between 2.2ohm and 10ohm, depending on the SI test), and reserve TVS devices.

Best Technology offers one-stop solutions for our values customers. And we provide free technical support for our customers. If you have similiar requirements, welcome to contact us at any time!

Tags:design guideline, high speed pcb design, pcb design
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Differential Signal PCB Design, Fiber Optical SFP Module

Tuesday, June 25th, 2024

PCB design is one of an important process before the PCB manufacturing, it determines the overall performance of the whole product. We are an experienced PCB design and manufacturing vendor, with our professional technical team and advanced evaluated tools, we can make sure the PCB design one-time success. Today, we shared a example of fiber optical SFP modules design:

32X100G(QSFP28) large capacity convergence shunt

[1]: Marvell: 98CX8522

[2]: Single pair differential line, 25G optical network

[3]: 16 layers PCB

Differential Signal PCB Design, Fiber Optical SFP Module

How to design a SFP optical module PCB?

SFP optical module interface PCB design depends on many aspects, including interface signal processing, timing control, power management and so on.

1. Determine the interface standard: SFP optical module interface standards, such as SFP, SFP+, QSFP and so on, you need to choose the appropriate interface standard according to the specific needs.

2. Choose the chip solution: According to the interface standard, choose the appropriate chip solution, usually including constant voltage source, amplifier, comparator, clock generator, EEPROM, etc.

3. Signal processing: For receiving and sending signals, filtering, amplification and comparison are required to ensure signal quality and stability.

4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.

5. Power management: SFP optical module interface requires multiple power supplies, including Vcc, VCC-TX, VCC-RX, etc. Reasonable power management is required to ensure the stability and reliability of the power supply.

6. PCB design: According to the above requirements, PCB design is carried out, considering signal isolation, layering layout, status separation, signal integrity and other factors.

Feel freely to send message us if you are interested in PCB design.

Tags:pcb design
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High Speed PCB Design, Industrial PCB Case Sharing

Tuesday, June 25th, 2024

A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. Best Technology is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.

32 x 400GE industrial switch

[1]: Marvell-400G chip

[2]: 200A maximum current

[3]: Single pair differential line 56G optical network

[4]: 24 layers high power PCB

High Speed PCB Design, Industrial PCB Case Sharing

What’s the Best Material for High-Speed PCB Design?

Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:

FR4: Widely used but not ideal for very high frequencies due to higher loss tangent.

Rogers (RO4000 series): Preferred for high-speed designs thanks to its low dielectric constant and loss tangent.

Teflon: Excellent for high-frequency applications but more expensive and harder to process.

Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.

For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.

Tags:high speed pcb, industrial pcb, pcb design
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Network Motherboard Design for Network Switching Cases

Tuesday, June 25th, 2024

Best technology offers numerous PCB design solutions for our customer, from HDI design, high speed device PCB design, AI optical module design and network motherboard design for network switching. Below is one of our network motherboard design solutions:

An ATCA network switching motherboard

[1]：BCM88XXX, BCM55XXX chips

[2]：60A maximum current

[3]：8口10Ｇ optical network

[4]: 8 x DDR3 chips

Network Motherboard Design for Network Switching Cases

Network Switching Differential Pair Design Guide

Each TrxP/TrxN signal group (where xcx0-3) shall be routed as a differential pair. This includes the entire length of wiring processing.
The individual differential correspondences are packed together as tightly as possible. Impedance calculations are usually started by selecting the smallest line blank (4-5mil). The tracking width is then adjusted to achieve the necessary impedance.
Differential line group resistance of Ethernet is calculated at 100 ohms.
In general, when routing the four differential pairs of the Gigabit Ethernet to the r45 connector, at least one pair will pass through to the opposite outer layer.
Priority should be given to differential pair wiring. Terminals should be added after the routing is determined
The values of all resistance terminals in the Ethernet front end should be 1.0% tolerance
All capacitor termination Ethernet front ends in the module should have strict tolerances and high quality product media (npo)

You are welcome to contact us if you want to get your DIY network switching PCB designs.

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PCB design: how to optimize component placement ?

Friday, June 21st, 2024

PCB design not only including the routing layout, component placement also is a key parameter. It involves understanding electrical parameters, signal integrity, and thermal management. This article will introduce several golden rules of how to optimize your component placement, whether you are a novice or a seasoned professional, it is helpful for you to manage your circuit board design greatly.

Determine the power supply and grounding plane

In the early stage of PCB design, reasonable power supply and grounding layout is the key. The power supply and ground plane not only provide a stable power supply for the components, but also play a role in reducing electromagnetic interference (EMI). To begin the layout, the first thing is confirming the location of the power supply and ground area. Usually, the power is placed in a complete layer of the PCB, and the ground is in another layer, which can effectively reduce the power supply noise.

Make sure the power plane is close to the area where high power is needed, which can reduce the voltage drops along the supply path. The ground area should be as large and continuous as possible, this helps to provide a good return path and reduce interference from high-frequency signals.

Differentiate layouts by function

When laying out components, dividing the circuit board into different functional areas can improve the efficiency and performance of the design. For example, you can separate power supply into signal processing area, power management area, and interface. This method helps to reduce the mutual interference between different circuits and improve the overall stability of the circuit.

Please noted that, high-frequency components should be close to connectors or key interfaces to shorten the signal path and reduce interference. Low-frequency components can be placed away from critical signal paths to optimize overall signal integrity.

Keep short and direct trace

Shortening the length of signal lines is another important thing to optimize component layout. Make sure keep them short and direct as possible. Long distance signal routing may lead to signal attenuation and delay, which will affect the overall performance of the circuit. Placing the relevant components as close as possible. This not only reduces the length of the circuits, but also reduces the coupling and interference between the signals.

How to optimize component placement during the PCB design?

In addition, in the routing process, try to avoid right-angle (90 degrees) turns. Because the right angle will cause signal reflection, affecting the integrity of the signal. Try to use 45 degree turns or arc turns to reduce signal loss.

Consider heat dissipation requirements

Heat management is an important consideration when placing high-power components. Place power components in the edge area of the PCB, such as power transistors and high-frequency converters. This facilitates the use of natural air flow for heat dissipation and convenient for the installation of external cooling devices.

In high-density designs, through-holes, vias and cooling copper blocks can be designed on the PCB, which can transfer heat to the inner layer or bottom of the PCB to help dissipate heat. In addition, maintain a reasonable distance between each component to promote air flow and heat dissipation.

Optimize test points position

Consider placing test points in a convenient location for testing and debugging. Placing test points close to relevant components simplifies the debugging process and reduces test complexity. In particular, the placement of test points on the key signal path can facilitate the detection and verification of signal integrity and stability in the design stage.

For example, the discrete components required for OpAmp operational amplifiers can be placed close to the device, so that the bypass capacitors and resistors can work with them. This helps to optimize the wiring length mentioned as above, while also making testing and fault detection easier.

Consider DFM & DFA factors

Optimizing component layout takes into account not only electrical performance, but also the actual requirements of manufacturing and assembly. For example, try to avoid placing components on both sides of the PCB to simplify the PCBA assembly process. The components are arranged neatly and spaced consistently, which helps the automated assembly equipment to operate efficiently and reduce assembly errors.

Properly using DFM (Design for Manufacturability) principles make production easier and more cost-effective. Ensure that your design can be fabricated with standard processes.

Perform DRC as often as possible

Although it only takes a short time to run DRC (Design Rule Check) functionality on PCB software. But in some complex design environments, perform checks during the design process can save a lot of time, which is a good habit to keep. Every layout routing decision is critical, and running DRC can remind you of the most important layout at any time.

Check production files before sending to manufacturer

While most of PCB manufacturers are happy to download it directly and verify it for you, it is best to export the Gerber file yourself and use the free software such as Gerberv to check that it is as expected to avoid misunderstandings. By verifying it yourself, you may even find some inadvertent errors and thus avoid the cost of completing the production according to the wrong parameters.

Successful PCB design cases – Best Technology

A: A mITX architecture industrial control main board

[1] Intel Xeon E3, Core™ i7/i5, Celeron G3900E processors

　[2]：2x DDR4 SODIMM 2133 MHz (up to 32 GByte)

　[3]：4x SATA Gen 3.0

　[4]：1x PCIe x16 (Gen 3)

　[5]：2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +

2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)

Anyway, communicating with your manufacturer to understand their equipment and processes can optimize the design, reduce manufacturing problems, improve production efficiency and product quality.

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