NRE, or Non-Recurring Engineering, refers to the upfront cost associated with developing and preparing the tools, processes, and engineering resources required for manufacturing a specific product. When it comes to PCB projects, NRE fees are vital because they cover the initial setup expenses that are incurred only once during the product development phase. These charges include design, tooling, programming, and testing requirements tailored to a particular PCB design, ensuring that the production is efficient and meets the required specifications.
Why Is It Necessary to Charge NRE Cost?
Charging an NRE cost is necessary because every PCB project is unique. The manufacturer must allocate resources to tailor the production to your specific design. The NRE fee ensures that all the necessary engineering work is done upfront to avoid delays or errors during mass production. If this fee weren’t charged, manufacturers would have to spread these costs across the entire production, making each unit more expensive, especially for small runs. This way, you can keep per-unit costs lower once production begins.
What Is the NRE Charge For?
The NRE charge is a crucial investment in ensuring that your PCB project gets off to the right start. It covers the engineering resources, setup, and processes that are required to customize the production environment specifically for your PCB design. Here are the main aspects that NRE fees typically cover:
Design Validation
Before manufacturing begins, the manufacturer must confirm that your PCB design is feasible and ready for production. This involves scrutinizing the layout for errors, verifying that it meets performance specifications, and ensuring compatibility with the chosen materials. This step can prevent expensive issues later in the process, such as defective boards or production delays.
Custom Tooling Setup
Every PCB design requires specific tools and fixtures to manufacture efficiently. NRE fees cover the creation or modification of tools that will allow your design to be assembled accurately. This might involve creating custom molds, dies, or specialized equipment that aligns with your PCB’s dimensions and complexity.
Programming and Firmware
For PCBs that require microcontrollers or other programmable components, the NRE charge often includes developing the necessary firmware or software to test and initialize these components. Manufacturers need to upload specific programs to ensure each unit functions correctly in real-world applications.
Prototype Creation
In some cases, the NRE fee also covers the cost of creating prototypes for testing. These prototypes are essential for verifying that the design works as intended before moving into full-scale production. The prototype phase allows for any last-minute adjustments and ensures that the final product will perform optimally.
How to Pay NRE Cost?
Paying the NRE cost is straightforward, but it’s important to clarify this with your manufacturer. Typically, the NRE fee is charged as a separate, one-time payment when you place your order. Depending on your arrangement with the manufacturer, it might be paid upfront or included in the first invoice along with the cost of your first production run. Payment terms can vary, but many manufacturers will expect it before starting the engineering and tooling processes. By paying this fee early, you ensure that your project can begin on time.
How to Reduce NRE Fee?
Reducing NRE costs may not always be possible, but there are ways to minimize them:
1. Reusing designs: If you’ve produced a similar PCB before, you can avoid some NRE costs by reusing or adapting the same designs.
2. Standardization: Using standard components and layouts rather than custom or unusual specifications can cut down on the design and tooling time.
3. Ordering in bulk: A larger production run can sometimes allow manufacturers to absorb some NRE costs, spreading the expense over a larger quantity of units.
4. Simplify design: A less complex design reduces the need for custom tools or special processes, leading to a lower NRE fee.
5. Choose experienced manufacturers: Partnering with a manufacturer like Best Technology who has experience in your industry can reduce the amount of custom setup needed, as they may already have processes and equipment suited to your project.
Considerations During the NRE Process
It’s important to approach the NRE process with a clear understanding of your project’s needs and goals. Communicate clearly with your manufacturer to avoid misunderstandings about what the NRE fee covers. For example, make sure you know if the fee includes changes or revisions to the design after the initial setup. You should also ask about the lead time for the engineering work. Knowing how long it will take to complete the NRE tasks helps you plan your project schedule more effectively.
Another consideration is the long-term benefits. While NRE fees may seem costly upfront, they are an investment that pays off as your project moves into full production. By ensuring that the initial design and setup are correct, you minimize the risk of costly production errors later.
When to Use Non-Recurring Engineering?
Non-Recurring Engineering is most beneficial when your PCB project involves custom designs or complex requirements. This is especially true when you need prototypes, new product development, or designs that require unique tools or processes. If you are producing a PCB that will have ongoing updates or revisions, it might also be necessary to pay an NRE fee each time the design changes. In general, the NRE fee is used whenever a manufacturer has to set up specialized processes or equipment that won’t be reused for other products.
How to Calculate NRE Cost?
NRE costs are calculated based on several factors. Manufacturers will consider the complexity of the design, the number of custom tools needed, and the extent of testing and programming required. The more custom features your PCB has, the higher the NRE cost is likely to be. Additionally, the cost of manpower to design and set up the project is included. Some manufacturers also calculate NRE based on the projected production run—larger runs may benefit from lower NRE fees as costs are spread over more units.
While it may seem daunting, NRE costs are ultimately a necessary investment for ensuring the success of your project. They allow manufacturers to deliver the best quality and avoid production errors, which can lead to greater savings in the long run.
An aluminum PCB, also known as an aluminum circuit board, is a type of metal core printed circuit board that uses aluminum as its base material. Unlike traditional PCBs, which are typically made with fiberglass, aluminum PCBs offer superior heat dissipation. This makes them ideal for high-power applications where excess heat can damage sensitive components. Aluminum PCBs are widely used in industries such as LED lighting, automotive, and power equipment because they provide better thermal management.
Aluminum PCBs are made from a combination of the following materials:
Aluminum Substrate: The base layer, responsible for mechanical support and heat dissipation.
Dielectric Layer: This layer provides insulation between the conductive layer and the aluminum base, while also helping with thermal transfer.
Conductive Layer: Made of copper, this layer is etched to form the circuit pattern and provides electrical connectivity.
Solder Mask Layer: This is a protective layer to protect the traces.
Types of Aluminum PCB
Aluminum circuit board is a kind of metal base copper clad plate with good heat dissipation function, the main types include single-sided aluminum PCB, double-sided aluminum PCB and multi-layer aluminum PCB.
Single sided aluminum PCB
The single-sided aluminum substrate is composed of a conductive graphic layer and an insulating material plus aluminum plate, which is relatively simple in structure and suitable for the installation and connection of some basic electronic components.
Double sided aluminum PCB
The double-sided circuit aluminum substrate has two layers of conductive graphics layer and the insulating material plus aluminum plate superimposed together, providing a larger circuit layout space and better heat dissipation effect, which is often used in electronic devices requiring higher integration and better heat dissipation performance.
Multilayer aluminum PCB
Multi-layer printed aluminum-based circuit board consists of three or more layers of conductive graphic layer and insulating material and aluminum plate alternately laminated together, with complex circuit design and excellent heat dissipation performance, suitable for high-end applications such as LED lighting, automotive electronics .
In addition, there are other special types of aluminum-based circuit boards, such as flexible aluminum substrates, mixed aluminum substrates, etc. Flexible aluminum substrate has excellent electrical insulation, flexibility and thermal conductivity, and is suitable for product design in various shapes and angles. The hybrid aluminum substrate is a multilayer component made of conventional FR-4 bonded to an aluminum substrate with a thermoelectric medium, designed to improve heat dissipation and rigidity, and used as a shield .
Aluminum PCB Features
The aluminum substrate, a metal-based cooling plate (including aluminum, copper, and iron substrates), is made from a low-alloyed Al-Mg-Si series high-plastic alloy plate. This material offers excellent thermal conductivity, electrical insulation, and mechanical processing capabilities. When compared to traditional FR-4 materials, aluminum substrates of the same thickness and line width can carry higher currents. Additionally, they can withstand voltages up to 4500V and have a thermal conductivity greater than 2.0, making aluminum substrates the preferred choice in the industry.
● Surface mount technology (SMT);
● Very effective treatment of thermal diffusion in circuit design;
● Reduce product operating temperature, improve product power density and reliability, extend product service life;
● Reduce product volume, reduce hardware and assembly costs;
● Replace fragile ceramic substrate for better mechanical durability.
Aluminum PCB vs. Copper PCB
Both aluminum and copper PCBs have their own advantages, but they cater to different applications:
1. Thermal Conductivity
In general, the higher the thermal conductivity, the more efficient the heat transfer, resulting in better heat dissipation and a longer lifespan. Among metal substrates, copper substrates offer the best thermal conductivity, outperforming aluminum substrates.
2. Electrical Conductivity
Both aluminum and copper are metals and conduct electricity, though their exact levels of conductivity differ. In terms of electrical conductivity, copper is significantly superior to aluminum. In applications that require high electrical conductivity, copper is the ideal choice.
3. Resistance
Resistance is crucial in PCB design as it affects the overall functionality and stability of the components. Given that copper has a higher density than aluminum, its resistance is generally lower. Therefore, in applications requiring thinner circuits and faster power transmission, copper is the better option.
4. Weight
Due to copper’s higher density per unit area, copper PCBs are much heavier than aluminum PCBs with the same design.
In applications where lightweight structures are critical, aluminum is the preferred material. On the other hand, applications where weight is not a major concern often favor the use of copper.
5. Applications
Aluminum substrates are somewhat specialized. They are mainly used in energy-saving lighting products such as indoor lighting, energy-efficient lighting, and street lights. Copper substrates are suitable for high-power lighting equipment like car headlights, tail lights, and some high-tech electronics.
6. Manufacturing Process
The manufacturing process for aluminum-based PCBs is simpler than that for copper-based PCBs, which also impacts their production time and delivery schedules. Below is aluminum PCB and copper core PCB that made by Best Technology:
Aluminum PCB Manufacturing Process
The manufacturing process for aluminum PCBs involves several steps to ensure high quality and performance. Here is a basic manufacturing process of aluminum PCB:
1. Substrate Selection and Preprocessing
Aluminum alloys with high thermal conductivity, such as the 5052 and 6061 series, are selected as the base material. The aluminum sheet is first cut and cleaned to remove surface grease and impurities, ensuring proper adhesion for subsequent processes.
2. Chemical Etching of Patterns
Photosensitive ink is used to form the desired circuit patterns on the aluminum surface. After exposure and development, the ink-covered areas protect the underlying aluminum from being etched by chemicals, while the unprotected areas are etched away, forming the circuit pattern.
3. Insulation Layer Deposition
To achieve electrical isolation, an insulating material, usually thermosetting resin or ceramic-filled epoxy resin, is deposited on the aluminum substrate. This step is typically completed using screen printing or inkjet printing technology to ensure a uniform and appropriately thick insulation layer.
4. Metallization
Creating conductive paths on the insulation layer is a key step. Copper foil is deposited onto the insulation layer using methods such as electroplating, sputtering, or chemical copper deposition. This copper foil serves as the conductive layer for connecting LED chips and other components.
5. Drilling and Metallization
Holes are drilled in the board according to the design to achieve electrical connections between different layers. The hole walls are then metallized to ensure good conductivity inside the holes.
6. Surface Treatment
To improve solderability and corrosion resistance, the aluminum substrate undergoes additional surface treatments, such as tin spraying, gold plating, or silver plating.
7. Assembly and Testing
LED chips, resistors, capacitors, and other components are soldered onto the circuit board to complete the assembly. Here you can see the whole manufacturing process of aluminum metal core PCB.
What Affects Aluminum PCB Circuit Board Price?
First of all, raw material cost is one of the important factors affecting the price of aluminum based circuit board. The raw materials of aluminum substrate include aluminum substrate and other auxiliary materials, such as insulating layer materials. The price fluctuation of aluminum substrate will directly affect the production cost of aluminum substrate, and then affect its market price. In addition, the cost of electricity is also a part of the production process cannot be ignored, the fluctuation of electricity price will further affect the production cost .
Secondly, market supply and demand is also a key factor in determining the price of aluminum-based circuit boards. If demand increases and supply is insufficient, prices will naturally go up. On the other hand, if there is an oversupply, the price will fall. Changes in demand in the construction, automotive and other industries, as well as changes on the supply side such as the construction of new plants or the closure of old plants, will have a direct impact on the price of aluminum-based circuit boards .
The macroeconomic environment also has an important impact on the price of aluminum-based circuit boards. When economic growth is expected to be good, the demand for aluminum substrate in related industries increases, driving up prices; The expectation of economic recession will lead to a decline in demand and pressure on aluminum substrate prices .
Policies and regulations is also one of the factors affecting the price of aluminum-based circuit boards. The government’s environmental protection policies, trade policies and industry subsidies will have an impact on the aluminum substrate market. For example, environmental policies that limit production may reduce supply and push up prices; The establishment of trade barriers may affect the import and export of aluminum substrate, and then affect the domestic market price.
Aluminum PCB Production Capability – Best Technology
Best Technology is known for its strong production capability when it comes to aluminum PCBs. Our manufacturing facilities are equipped with the latest technology to produce high-quality aluminum PCBs that meet industry standards. We have the ability to produce single-sided, double-sided, and multi-layer aluminum PCBs, below you can see our capability of aluminum PCBs:
Applications of Aluminum PCB
Aluminum PCBs are used in a variety of applications, particularly where heat management is crucial:
LED Lighting
Automotive Electronics
Power Supplies
Consumer Electronics
Medical
Household appliance
FAQs about Aluminum PCB Circuit Board
1. What is the main advantage of aluminum PCBs?
Aluminum PCBs excel in thermal management, making them perfect for heat-sensitive applications.
2. Are aluminum PCBs expensive?
No, aluminum PCBs are generally affordable, making them a cost-effective option for many industries.
3. Can aluminum PCBs be used in consumer electronics?
Yes, aluminum PCBs are commonly used in consumer electronics, especially in devices that generate significant heat.
4. What industries commonly use aluminum PCBs?
Industries such as automotive, LED lighting, and power supplies frequently use aluminum PCBs due to their thermal properties.
5. Is aluminum PCB better than copper PCB?
It depends on the application. Aluminum is better for heat dissipation, while copper excels in electrical conductivity.
A blank PCB is commonly referred to as a bare board. This term is used because the board has no components soldered onto it yet. It’s simply the foundation of a printed circuit board (PCB), typically made from a material like fiberglass and copper. The copper traces on the board outline where the electrical connections will eventually be made, but before any components are attached, the board remains “blank.”
A bare board is key point in the manufacturing process of electronic devices. Once components like resistors, capacitors, and integrated circuits are added, the blank PCB transforms into a fully functional circuit board. This is the stage where the blank board evolves, moving from raw material to the heart of a functioning device.
How to Use a Blank PCB Board?
Using a blank PCB starts with designing a circuit schematic. Specialized software is used to create a layout that specifies where each component will be placed and how they’ll be connected through copper traces. Once the design is finalized, the blank board serves as a canvas where components are either soldered by hand or using automated machines in mass production.
If you are working on a DIY project or prototyping, the blank PCB allows for customization and flexibility. You can use a soldering iron to manually attach your components. For large-scale production, automated machines place and solder components onto the blank board with precision. Using blank PCBs for custom designs or modifications is a cost-effective way to experiment with electronics.
Why Is PCB So Cheap?
PCBs are considered affordable due to mass production techniques. Modern manufacturing processes, such as automated assembly lines and the use of standard materials, have significantly reduced costs. The global nature of the electronics industry also plays a role, as many manufacturers source materials and labor from countries with lower production costs.
The materials used, primarily fiberglass and copper, are relatively inexpensive. Furthermore, technological advancements have optimized the process of making PCBs, allowing manufacturers to produce them quickly and in large quantities. The result is that even highly specialized PCBs can be produced at a low cost, making them accessible to hobbyists, startups, and large corporations alike. If you want to know the details about factors affect the price of PCB board, welcome to check our another blog:
How Are Blank PCBs Made?
The process of making blank PCBs is a sophisticated, multi-stage operation that ensures the boards meet high precision standards before any components are added. Here’s a detailed breakdown of the steps involved in manufacturing a blank PCB:
Material Selection and Lamination
Blank PCBs start with a substrate, typically made from fiberglass-reinforced epoxy laminate (FR4), which serves as the board’s structural foundation. This substrate is non-conductive, providing insulation for the circuit. A copper layer is then bonded to one or both sides of the substrate using heat and pressure, forming what is known as a copper-clad laminate. The thickness of this copper layer varies based on the board’s intended application, with typical copper thickness ranging from 1 oz (35 µm) to 2 oz (70 µm) per square foot. Thicker copper layers may be used for boards handling higher currents.
Photoresist Application
After lamination, the copper layer is coated with a light-sensitive material called photoresist. This step prepares the board for the next process, which is exposing the circuit pattern. The photoresist layer can be either liquid or dry film and plays a critical role in protecting certain parts of the copper during etching.
Imaging the Circuit Pattern
The desired circuit pattern, generated from PCB design software, is transferred onto the board. This is done by aligning the photoresist-coated board with a photomask (a stencil-like film) that contains the circuit layout. The board is then exposed to ultraviolet (UV) light. The areas of the photoresist not covered by the photomask are hardened, while the areas shielded by the mask remain soft and will later be removed.
Etching Process
The next step is to remove the unneeded copper from the board, a process called etching. Chemical etchants, like ferric chloride or ammonium persulfate, are used to dissolve the unprotected copper, leaving behind only the circuit traces. The areas of the copper protected by the hardened photoresist remain intact, forming the conductive pathways for the future components.
Drilling Holes for Components
After the etching process, holes need to be drilled into the board. These holes, called vias, allow for the placement of components such as resistors, capacitors, and integrated circuits, and are also used to connect different layers in multi-layer PCBs. Advanced PCB manufacturing often uses computer numerical control (CNC) drilling machines to ensure precision, especially for boards with many layers or small trace designs. Some manufacturers employ laser drilling for microvias.
Plating and Hole Metallization
Once the holes are drilled, they need to be plated to create electrical connections between the different layers of the PCB. This is done through a process called electroless copper plating, which deposits a thin layer of copper inside the drilled holes. The plating process ensures that when components are later inserted, electrical signals can flow between layers through the plated holes.
Solder Mask
After drilling and plating, the board is cleaned and coated with a layer of solder mask. This mask protects the copper traces and prevents solder from accidentally bridging across traces during assembly. The solder mask is typically green, though other colors like blue, red, black, or white can also be used. The solder mask is applied through a screen-printing process or as a dry film, and it is cured using UV light or heat.
Silkscreen Printing
Silkscreen printing is applied to the board to mark component locations, symbols, logos, or other identifiers needed during the assembly process. This layer is typically applied using a silk-screening process, similar to how images are printed onto clothing. White is the most common color used for silkscreen, as it provides high contrast against the green solder mask, but other colors can be used depending on the design.
Surface Finishing
The copper pads, where components will be soldered later, are treated with a surface finish to protect them from oxidation and ensure good solderability. Common finishes include HASL (Hot Air Solder Leveling), where the board is dipped in molten solder and excess solder is blown off with hot air, leaving a smooth surface. Another popular finish is ENIG (Electroless Nickel Immersion Gold), where a thin layer of nickel followed by gold is applied to the copper pads.
Electrical Testing and Quality Control
The final step in producing a blank PCB is electrical testing and quality control. Every trace and connection is tested to ensure there are no shorts or opens, which could render the board useless. Automated Optical Inspection (AOI) systems are used to visually inspect the board for defects, while flying probe tests and bed-of-nails tests check for electrical continuity. Any defects found at this stage are flagged for repair or, in severe cases, the board is scrapped.
What Is the Difference Between Bare PCB and PCB?
The term bare PCB refers to the unpopulated circuit board, which means it lacks any electronic components. In contrast, a PCB refers to a fully assembled board that includes all the necessary components to function.
In the bare stage, the PCB is simply the foundation for the circuit but isn’t functional. Once components are soldered onto the bare PCB, it becomes an operational printed circuit board, ready to be integrated into electronic devices.
How Do You Cut Blank PCB?
Cutting a blank PCB requires precision. Tools such as PCB shears, laser cutters, or CNC machines are commonly used to achieve clean, straight cuts without damaging the copper traces. For smaller DIY projects, a hand saw or scoring tool can be used, but these methods require a steady hand and careful planning to avoid mistakes.
Before cutting, it’s important to mark the board clearly to ensure the cuts are accurate. If the board is part of a larger project, cutting should be done after confirming that all components will fit within the intended space.
Why Are PCBs Green?
The green color on most PCBs comes from the solder mask that coats the board. While green is the most common color, the solder mask can be found in other colors such as red, blue, or black. The preference for green is largely historical, as it provided the best contrast for technicians to inspect the board visually.
Green solder masks also tend to offer better performance under different lighting conditions, which can be helpful during manufacturing and quality control processes.
Do PCBs Use AC or DC?
PCBs can handle both AC (alternating current) and DC (direct current), depending on the design and the type of components used. Some boards are designed specifically for DC circuits, while others are built to handle AC power.
For example, a power supply PCB may convert AC from a wall outlet into DC, which is used by many electronic devices. The flexibility to work with either type of current makes PCBs essential for a wide range of applications.
Blank PCB Board Supplier – Best Technology
With over 18 years as an industry leader, Best Technology is one of the most experienced PCB and PCB assembly manufacturer in Asia. We are highly specialized not only in quick-turn PCB prototype and PCB assembly, but also medium and small volume PCB fabrication. In Best Technology, you can enjoy a full-comprehensive one-stop service from PCB design, layout, PCB fabricate, PCB assembly, function testing and delivery. We always try our best to fabricate your PCB with copper clad laminate with the highest quality to meet your demands.
If you have any questions, please feel free to contact us with sales@bestpcbs.com, we will be happy to help you.
Can you use AC in PCB?AC can be used in PCB boards. PCB boards are designed to support the use of AC, and the functions of AC can be realized through proper circuit design and component selection.
Can you use AC in PCB?
The use of AC in PCB boards requires consideration of the characteristics of AC. The current magnitude and direction of AC change continuously over time, which requires the components and layout on the PCB to adapt to such changes. For example, components such as inductors and capacitors play an important role in AC circuits, and their parameters and layout need to be carefully designed to achieve the desired circuit performance.
Specifically, AC circuit design on PCB boards includes selecting appropriate components, layout, and routing. For example, using test instruments such as LCR digital bridges can measure the parameters of components in AC circuits to ensure that the performance of the circuit meets the design requirements. In addition, reasonable ground routing and layout can reduce signal interference and ensure the stable transmission of AC.
Is the circuit board DC or AC?
Circuit boards can transmit both direct current and alternating current. In modern electronic products, we use alternating current for power supply, so most circuit boards are also designed to transmit alternating current. Of course, in some special application scenarios, some circuit boards also need to transmit direct current. Whether transmitting direct current or alternating current, the circuit board needs to meet the requirements of the transmitted current.
What is the PCB in AC?
The alternating current in PCB refers to the current whose direction changes periodically, that is, alternating current (AC). The application of alternating current in PCB is mainly reflected in power conversion and power transmission. PCB power supply usually converts AC into stable direct current (DC) output to meet the demand of electronic equipment for stable power supply. PCB power supply converts AC into the required DC through components such as transformers, rectifiers, filters and voltage regulators, and provides stable power output.
How to calculate the bandwidth of AC in PCB traces
The calculation of AC PCB trace width can be performed by the following formula: W = (I / J) * K, where W represents the trace width, I represents the current, J represents the current density, and K represents a coefficient related to materials and processes. This formula shows that the trace width is related to the current, current density, and material properties.
AC in PCB Design Guide
Current Carrying Capacity: The width of a trace directly affects its ability to handle current without exceeding temperature limits or causing excessive voltage drop. Impedance Control: In high-frequency applications, maintaining controlled impedance is critical for signal integrity. Trace width, trace spacing, and dielectric properties affect the characteristic impedance of the transmission line. Heat Dissipation: Adequate trace width helps to effectively dissipate heat, preventing thermal issues such as trace delamination or solder joint failure. Voltage Drop: Narrower traces exhibit higher resistance, resulting in increased voltage drop along the length of the trace. By adjusting the trace width, the voltage drop can be minimized. Manufacturability: The PCB manufacturing process imposes restrictions on the minimum trace width, and designers must balance performance requirements with manufacturability constraints. 2. Minimum Trace Width: Most manufacturers have a minimum trace width of 6mil or 0.152mm, and typically use traces of 0.254-0.3mm. Material and Process Deviations: Due to the possibility of material and process deviations in the actual PCB manufacturing process, a certain margin needs to be left when calculating the line width. Signal Integrity Simulation: Perform signal integrity simulations to ensure impedance is controlled and signal degradation due to reflections, crosstalk, or transmission line effects is minimized
AC in PCB wiring
The current trend is that the power supply voltage is getting lower and lower (especially for highly integrated digital devices), the space occupied is getting smaller and smaller, the weight is getting lighter and lighter, and the efficiency is getting higher and higher, which requires the precise design of the power supply circuit starting from the PCB.
Safety distance includes electrical clearance (spatial distance), creepage distance (surface distance) and insulation penetration distance…
Electrical clearance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the air.
Creepage distance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the insulation surface.
Determination of electrical clearance:
The distance can be determined according to the measured working voltage and insulation level
The electrical clearance size requirements of the primary side line are shown in Table 3 and Table 4
The electrical clearance size requirements of the secondary side line are shown in Table 5
But usually: Primary side AC part: L-N ≥ 2.5mm before the fuse, L.N PE (earth) ≥ 2.5mm, no requirements are made after the fuse is installed, but a certain distance should be maintained as much as possible to avoid short circuit damage to the power supply.
Primary side AC to DC part ≥2.0mm
Primary side DC ground to earth ≥2.5mm (primary side floating ground to earth)
Primary side to secondary side ≥4.0mm, components connected between primary and secondary sides
Secondary side gap ≥0.5mm
Secondary side ground to earth ≥1.0mm
Note: Before determining whether it meets the requirements, the internal parts should be applied with a force of 10N and the outer shell with a force of 30N to reduce the distance so that the space distance still meets the requirements under the worst case.
Determination of creepage distance:
Based on the working voltage and insulation level, the creepage distance can be determined by looking up Table 6
But usually: (1), primary side AC part: L-N ≥2.5mm before the fuse, L.N earth ≥2.5mm, no requirement is required after the fuse, but try to keep a certain distance to avoid short circuit damage to the power supply.
(2) Primary side AC to DC part ≥2.0mm
(3) Primary side DC ground to ground ≥4.0mm such as primary side ground to earth
(4) Primary side to secondary side ≥6.4mm, such as optocoupler, Y capacitor and other components, the foot spacing ≤6.4mm needs to be slotted.
(5) Secondary side parts ≥0.5mm
(6) Secondary side ground to earth ≥2.0mm or more
(7) Transformer two-stage ≥8.0mm or more
Insulation penetration distance:
It should meet the following requirements according to the working voltage and insulation application:
For working voltage not exceeding 50V (71V AC peak or DC value), there is no thickness requirement;
The minimum thickness of additional insulation should be 0.4mm;
When the reinforced insulation is not subjected to any mechanical stress that may cause deformation or performance degradation of the insulating material at normal temperature, the minimum thickness of the reinforced insulation should be 0.4mm. If the insulation provided is used in the protective casing of the equipment and will not be bumped or scratched during maintenance by the operator, and any of the following conditions apply, the above requirements do not apply to thin insulating materials regardless of their thickness;
For additional insulation, at least two layers of material are used, each of which can pass the dielectric strength test for additional insulation; or:
For additional insulation composed of three layers of material, any combination of two layers of material can pass the dielectric strength test for additional insulation; or:
For reinforced insulation, at least two layers of material are used, each of which can pass the dielectric strength test for reinforced insulation; or:
For reinforced insulation composed of three layers of insulating material, any combination of two layers of material can pass the dielectric strength test for reinforced insulation.
Points to note about wiring process:
Flat components such as capacitors must be flat without glue.
If the distance between two conductors can be shortened by applying a force of 10N, which is less than the safety distance requirement, glue can be used to fix the part to ensure its electrical clearance.
When laying PVC film inside some shell equipment, attention should be paid to ensuring the safety distance (pay attention to the processing technology).
When fixing the parts with glue, be careful not to leave foreign matter such as glue wire on the PCB board.
When processing parts, insulation damage should not be caused.
Requirements for flame-proof materials:
Heat shrink tubing V-1 or VTM-2 or above; PVC tubing V-1 or VTM-2 or above
Teflon tubing V-1 or VTM-2 or above; plastic materials such as silicone sheets, insulating tape V-1 or VTM-2 or above
PCB board 94V-1 or above
Regarding insulation level
(1) Working insulation: insulation required for normal operation of equipment
(2) Basic insulation: insulation that provides basic protection against electric shock
(3) Supplementary insulation: independent insulation applied in addition to basic insulation to protect against electric shock in case of basic insulation failure
(4) Double insulation: insulation consisting of basic insulation plus supplementary insulation
(5) Reinforced insulation: a single insulation structure that provides the same level of protection against electric shock as double insulation under the conditions specified in this standard
The applicable situations of various insulation are as follows:
A. Operational insulation
a. Between parts with different voltages
b. Between ELV circuits (or SELV circuits) and grounded conductive parts.
B. Basic insulation
a. Between parts with dangerous voltages and grounded conductive parts;
b. Between SELV circuits with dangerous voltages and grounding-dependent;
c. Between the primary power conductor and the grounded shield or the core of the main power transformer;
d. As part of double insulation.
C. Supplementary insulation.
a. Generally speaking, between accessible conductive parts and parts that may carry dangerous voltages after basic insulation is damaged, such as:
Ⅰ. Between the surface of handles, knobs, handles or similar objects and their ungrounded axis.
Ⅱ. Between the metal casing of the second category equipment and the outer skin of the power cord passing through this casing.
Ⅲ. Between the ELV circuit and the ungrounded metal casing.
b. As part of double insulation
D. Double insulation
Double insulation Reinforced insulation
Generally speaking, between the primary circuit and
a. between accessible ungrounded conductive parts, or
Under normal working conditions, the AC peak value between conductors or between any conductors does not exceed 42.4V or the DC value does not exceed 60V.
SELV circuit: safety extra low voltage circuit.
A properly designed and protected secondary circuit so that under normal conditions or single fault conditions, the voltage between any two accessible parts, and between any accessible parts and the protective grounding terminal of the equipment (only for Class I equipment) will not exceed the safety value.
TNV: communication network voltage circuit
Under normal working conditions, the circuit carrying communication signals
Difference between direct current and alternating current
The main differences between DC and AC include direction and polarity, voltage change, current loss, transformer use, and application scenarios.
Direction and polarity:
DC: The direction of the current remains unchanged, and the electrons flow from the positive electrode to the negative electrode.
AC: The direction of the current changes periodically, and the electrons flow back and forth between the positive and negative electrodes. Voltage change:
DC: The voltage remains constant and does not change over time.
AC: The voltage magnitude and direction change periodically over time. For example, the mains is an AC with a sine waveform.
Current loss:
DC: Fault losses are relatively small.
AC: There is capacitive current, and there is capacitive current in the transmission line. Transformer use:
DC: The voltage cannot be changed using a transformer.
AC: The voltage can be changed using a transformer, which is suitable for boosting voltage to reduce losses during long-distance transportation.
Application scenarios:
DC: Suitable for low-voltage electrical appliances and occasions that require stable current. Alternating current: Suitable for household and industrial use, using transformers to change voltage to suit different needs.
FAQ About AC in PCB
FAQ About AC in PCB
Q: The relationship between PCB current and line width. Is the current divided into AC or DC? A: The relationship between PCB current and line width is not divided into AC or DC. In terms of the nature of the lines on the PCB, the lines are all made of copper materials, and both AC and DC can pass. However, how much current can pass depends on the cross-sectional area of the line on your PCB. That is, line width x thickness of the copper foil of the line. If the cross-sectional area of the line is small, only small current signals can pass, and if the cross-sectional area is large, large current signals can pass. This signal can be AC or DC. Not just 1mm, any line width can pass DC or AC signals.
Q: There is a packaged device, and there are 2 pins in the device that need to be connected to the live wire and neutral wire of 220V AC respectively. So how to deal with this power line when drawing the PCB? Are there any size requirements for pads, wires, etc.? Are there any protective measures required? Is it not possible to directly add pads to connect to the pin pads of the device? A: It is best to mill a groove between the neutral wire and the live wire, and choose the thickness of the wire according to the current. When the current is large, you can put a tin layer on the wire, and the pad should be slightly larger.
Q: The grounding of the PCB circuit board design is also the negative pole. What is the difference between the grounding here and the AC grounding?
A: The concept of the circuit board ground is somewhat different from that of the power supply system. The power supply system refers to the earth, that is, the terminal with the same potential as the earth.
The ground in the circuit board is just a common terminal of a potential, which can be positive or negative, depending on the needs of the designer. It’s just that everyone is used to and assumes that the negative pole is the common terminal, that is, the ground. The circuit board ground is not necessarily connected to the earth.
But it must be connected to the earth when EMI filtering is required.
Q: Should all GNDs on the PCB board be connected? There is a terminal (screw type) with two terminals marked as V1+ and V1- on the PCB schematic. Should V1- be connected to the power supply ground? But I used a multimeter to measure why V3- is not connected to other GNDs on the board?
So how do you connect the ground and 10V of the power supply to the V1+ and V1- ends of the terminal?
A: Not all ground wires on the board are connected together. The ground wires are divided into analog ground and digital ground, just like the ground wire in DC and the ground wire in AC cannot be connected together. That is to say, there is a ground wire that is specifically used for power supply, and there is a ground wire that is specifically used for signals (shielding signal interference). These two ground wires cannot be connected together. In addition, you mentioned V1+ and V1-, and V1- should not be considered a ground wire. Generally, the signal represented by this method is a differential signal, that is, the V1 signal is differentially divided into V1+ and V1-, which can reduce external interference and transmit farther. Finally, V1+ and V1- are integrated into the V1 signal. You need to figure out whether the V1+ and V1- of the terminal are used for power supply. If they are used for power supply, then V1+ is the positive pole. V1- is the negative pole. Since you didn’t show us the picture, you can’t just connect it randomly. The circuit board needs to connect not only power but also signals, depending on how your board is made.
How to convert .brd to .hyp file?You can try to use HyperLynx’s built-in conversion function to directly convert Allegro’s .brd file, but this method may encounter some problems and cause the conversion to fail.
If the built-in conversion function fails, you can try to convert the .brd file to ODB++ format and then import it into HyperLynx. The specific steps are as follows:
Open the PCB file in Allegro, select “File” -> “Export”, and then select ODB++ format for export.
After the export is successful, open HyperLynx, select “File” -> “Open ODB++”, select the exported ODB file, and wait for the import to complete before performing PCB board-level simulation. 1. If the above method still cannot solve the problem, you can try to add the system variable CDSROOT to solve the conversion failure problem. The specific steps are as follows:
Add the system variable CDSROOT, and the value is the installation path of Cadence Allegro, such as D:\Cadence\Cadence_SPB_17.2-2016\tools\bin.
After confirming, restart the computer and try the conversion operation again
How to convert Cadence17.2’s .brd file to HyperLynx9.4.1’s .hyp file
How to convert Cadence17.2’s .brd file to HyperLynx9.4.1’s .hyp file?Recently, I used Hyperlynx to simulate the signal integrity of PCBs, and I needed to convert various PCB formats into .hyp formats. In the process, I found that the PCB drawn by AD can be directly exported in .hyp format, which is very convenient, but the PCB drawn by Cadence cannot be directly exported. I need to use the built-in PCB converter of Hyperlynx to convert the .brd file of Cadence, as shown below:
But the conversion has always failed. I checked the .ERR file and found a line like this: ERROR: Cadance Allegro utility:extracta, so it is a problem with extracta.exe.
The specific solution is to add the system variable CDSROOT, and the value is D:\Cadence\Cadence_SPB_17.2-2016\tools\bin (the location of your extracta.exe). After confirming, restart the computer and the problem is solved.
Tutorial on converting Cadence17.2’s .brd file to HyperLynx9.4.1’s .hyp file
HyperLynx’s built-in conversion function can directly convert Allegro’s .brd file for use, but for some reason the following error always occurs. I didn’t find a solution online, so I had to find another way.
Another way to import PCB into HyperLynx is to convert the file to ODB++inside format. This method requires the installation of the ODB++inside plug-in in advance.
After installing the plug-in, you can convert the .brd file.
First open the PCB file in Allegro, select ODB++inside in file–>export, the following figure appears, select Export as ODBV6, click 1, and then click Accept.
Wait for the conversion to succeed.
This file is the converted file
Open HyperLynx9.4.1, select open ODB++ in file, select the odbjob_v6 folder, and click select folder.
Wait to open.
Click ok. .
What is a .hyp file?
.hyp file is a file used to record key information such as boundary conditions, material properties, solver settings, etc. of the analysis. This file is usually associated with HyperWorks analysis software and is the basis for numerical calculation and analysis.
The specific uses of .hyp files include:
Geometry model file: represents the geometry of the product or structure. Mesh file: shows the process of dividing the model into finite elements. Simulation setting file: records the key setting information of the analysis. Result file: contains the calculated engineering quantities such as strain, stress, displacement, etc. Post-processing file: used to visualize and analyze results in tools such as HyperView. Report document: usually in PDF or Word format, recording detailed results and conclusions of the analysis1. In terms of use, for example, in PCB tool software, .hyp files can be created and edited through the BroadSim function, including setting line characteristics, editing stacking information, etc., to simulate and analyze circuit boards2. In addition, the Hype software also supports exporting to .hyp format files for further analysis and processing.
Board electronics with holes The types of vias in PCB include through holes, blind holes and buried holes, which have different characteristics and requirements in design and manufacturing. The selection of the appropriate via type should consider the number of PCB layers, wiring density, signal frequency, cost budget and production process. The via design should pay attention to avoid affecting the welding quality, preventing electrical short circuits, and saving costs in high-density packaging.
What are the holes in a PCB called?
What are the holes on PCB called? What are the holes in the circuit? The holes on PCB can be roughly divided into 3 types, screw holes (mounting holes), conductive holes (vias), and plug-in holes.
Screw holes: Screw holes are used for fixing.
Conductive holes: Conductive holes (also called vias) are used for conducting electricity just like circuits.
Plug-in holes: Plug-in holes are of course used to plug in various parts, such as diodes, transistors, capacitors, inductors, etc.
What is a through hole
What is a through hole? Through holes, also known as perforations, are holes in a PCB that go all the way through the board. Their main purpose is to provide electrical connections for component pins while allowing soldering on both sides of the board.
1.A via is a special through hole whose wall is metallized to achieve electrical connection between different layers on a circuit board. This type of hole is usually used to connect component pins to internal circuits, or to achieve electrical connection between different layers in a multi-layer PCB. Vias need to be metallized during the PCB manufacturing process, which usually includes drilling, desmearing, chemical copper plating, and electroplating.
2.Non-conducting holes are the opposite of through holes. Their hole walls are not metallized, so they do not have electrical connection functions. These holes are mainly used for mechanical fixation, heat dissipation or identification purposes. Non-conducting holes are relatively simple in the PCB manufacturing process, and only drilling operations are required.
What is a blind via?
A blind via is a hole that extends from one side of a PCB to a certain internal layer without penetrating the entire board. The emergence of blind vias is mainly due to the development of HDI technology, which provides circuit designers with greater flexibility and more compact layout. Blind vias are usually used to connect surface mount components (SMD) to internal circuit layers, or to connect circuits between different internal layers.
What are buried vias?
Buried vias are holes located inside the PCB that do not penetrate any side of the board. They are completely hidden inside the board and are used to connect circuits between different internal layers. Buried vias are especially useful in HDI boards because they can reduce the overall thickness of the board while maintaining electrical connections between internal circuits.
What is a microvia?
Microvia refers to a hole with a smaller diameter, usually at the micron level. The emergence of microvia technology enables PCB designers to achieve more complex circuit layouts in a smaller space. Microvias are often used in high-density, high-reliability electronic devices such as mobile phones and tablets. The manufacture of microvias requires high-precision drilling equipment and technology to ensure the accuracy and reliability of the holes.
What are Mounting holes？
What are Mounting holes?Locking holes are auxiliary holes used in the PCB manufacturing and assembly process to accurately locate and fix the circuit board. They are usually located at the edge or specific position of the PCB to ensure that the circuit board can be accurately aligned and fixed during manufacturing, testing and assembly. The locating holes do not participate in the connection of the circuit, but are essential to ensure the quality and performance of the circuit board.
What are Mounting holes？
What are thermal vias?
Thermal vias are holes designed specifically for heat dissipation, usually large and can run through the entire PCB or multiple layers. Their role is to reduce heat buildup on the circuit board by increasing surface area and air flow, thereby improving the stability and reliability of the device. Thermal vias are particularly important in high-performance, high-power electronic devices.
FAQ About board electronics with holes
How to solve the contradiction between manual routing and automatic routing of high-speed signals?
Most of the current powerful routing software’s automatic routing tools have set constraints to control the routing method and the number of vias. The routing engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the capabilities of the routing engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing pair copper. Therefore, choosing a routing tool with strong routing engine capabilities is the solution.
Will adding test points affect the quality of high-speed signals?
As for whether it will affect the signal quality, it depends on the method of adding test points and how fast the signal is. Basically, the additional test points (not using the existing vias (via or DIP pins) as test points) may be added to the line or a small section of wire may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, while the latter is an additional branch. Both of these situations will have some impact on high-speed signals, and the extent of the impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be learned through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.
Can you introduce some foreign technical books and data on high-speed PCB design?
Now the application of high-speed digital circuits includes communication networks and calculators and other related fields. In the communication network, the operating frequency of PCB boards has reached around GHz, and the number of layers is as many as 40 layers as far as I know. Due to the advancement of chips, the operating frequency of calculator-related applications, whether it is a general PC or server, has reached 400MHz (such as Rambus) or above. In response to the demand for high-speed and high-density routing, the demand for blind/buried vias, mircrovias and build-up process technology is gradually increasing. These design requirements can be mass-produced by manufacturers.
Does the design of rigid-flexible boards require special design software and specifications? Where can I undertake the processing of such circuit boards in China?
Can I use general PCB design software to design flexible printed circuits (Flexible Printed Circuit). The Gerber format is also used for FPC manufacturers to produce. Since the manufacturing process is different from that of general PCBs, each manufacturer will have its own restrictions on line width, line spacing, and aperture (via) based on their manufacturing capabilities. In addition, some copper foil can be laid at the turning point of the flexible circuit board for reinforcement. As for the manufacturer, you can search for “FPC” as a keyword on the Internet and you should be able to find it.
If the size of the circuit board is fixed, if the design needs to accommodate more functions, it is often necessary to increase the routing density of the PCB, but this may lead to increased mutual interference between the routings, and at the same time, the impedance cannot be reduced if the routing is too thin. Please introduce the techniques in the design of high-speed (>100MHz) high-density PCBs?
When designing high-speed and high-density PCBs, crosstalk interference does need to be paid special attention to because it has a great impact on timing and signal integrity. Here are a few things to note:
Control the continuity and matching of the characteristic impedance of the trace.
The size of the trace spacing. The spacing commonly seen is twice the line width. Through simulation, you can know the impact of trace spacing on timing and signal integrity and find the tolerable spacing. The results of different chip signals may be different.
Choose an appropriate termination method.
Avoid the same routing direction of the upper and lower adjacent layers, or even have traces overlapped up and down, because this kind of crosstalk is greater than the case of adjacent traces on the same layer.
Use blind/buried vias to increase the trace area. However, the production cost of the PCB board will increase. It is indeed difficult to achieve complete parallelism and equal length in actual implementation, but it should be done as much as possible.
In addition, differential termination and common mode termination can be reserved to mitigate the impact on timing and signal integrity.
The RF part, IF part, and even the low-frequency circuit part of the outdoor unit are often deployed on the same PCB. What are the material requirements for such PCB? How to prevent interference between RF, IF, and even low-frequency circuits?
Hybrid circuit design is a big problem. It is difficult to have a perfect solution.
Generally, RF circuits are laid out and wired as an independent single board in the system, and there will even be a special shielding cavity. Moreover, RF circuits are generally single-sided or double-sided boards, and the circuits are relatively simple. All of these are to reduce the impact on the distributed parameters of RF circuits and improve the consistency of RF systems. Compared with general FR4 materials, RF circuit boards tend to use high-Q substrates. The dielectric constant of this material is relatively small, the distributed capacitance of the transmission line is small, the impedance is high, and the signal transmission delay is small. In hybrid circuit design, although RF and digital circuits are made on the same PCB, they are generally divided into RF circuit area and digital circuit area, and laid out and wired separately. Shielding is used between ground vias and shielding boxes.
What is pcba and its components?Refers to fixing electronic components on a printed circuit board by welding or other means to form a complete circuit system with specific functions. PCBA is one of the most important components in electronic devices, providing functions such as circuit connection, protection components and heat dissipation.
Best offers consignment, full turnkey, and partial turnkey assembly services. All parts are sourced directly from manufacturers or authorized distributors such as Digikey, Mouser, Future, TTI, Avnet, and Arrow to avoid counterfeit parts.
What is PCBA?
PCBA is the abbreviation of Printed Circuit Board Assembly, which refers to the process and product of installing and soldering all necessary electronic components on a PCB (printed circuit board) to form a complete functional circuit. PCBA is a key step in the production of electronic equipment. It provides a platform for electronic components to work in a coordinated manner, enabling the device to perform its intended tasks.
What is a PCBA component?
What is a PCBA component?
PCBA components refer to electronic components soldered on PCBs, including various components packaged in SMD patches and DIP plug-ins, such as integrated circuits IC, crystal oscillators, diodes, triodes, resistors, capacitors, transformers, digital tubes, connectors, inductors, etc. These components are the basis for realizing the hardware connection and program functions of PCBA boards. PCB designers will draw the corresponding circuit schematics according to the functions of the products and select appropriate components to realize the circuit functions.
PCBA process steps
PCBA process steps
The PCBA (Printed Circuit Board Assembly) assembly process mainly includes two processes: SMT (surface mount technology) and DIP (through-hole insertion technology). According to the size and type of electronic components, the assembly process can be divided into several common component assembly methods such as single-sided mounting, double-sided mounting, single-sided mixed mounting and double-sided mixed mounting.
Empty board loading: Arrange the PCB boards neatly, put them into the material rack, and send the PCB boards to the SMT production line through the automatic board loading machine.
2. Printing solder paste: Print solder paste on the pads on the PCB board where components need to be soldered to prepare for subsequent soldering.
3.Solder paste inspection: Check the quality of solder paste printing through optical instruments to ensure that there is no problem such as too much tin, too little tin or thick solder paste.
4.SMT: Use high-speed SMT machines and general-purpose SMT machines to attach electronic components to the PCB board. Small components use high-speed SMT machines, and large components use general-purpose SMT machines.
5.Reflow soldering: Melt the solder paste to solder the electronic components to the PCB board. Temperature control during the reflow soldering process is very important.
6. Cleaning and testing: Clean after soldering to remove excess solder and impurities, and then test to ensure that all components are correctly soldered.
PCB board inspection and acceptance standards
Appearance inspection: Check the dimensional accuracy, position accuracy, surface treatment and electrical safety of the PCBA board. The dimensional accuracy should meet the design requirements, such as aperture, line width, line spacing, etc. The position accuracy should be accurate and without deviation, such as component spacing, pad position, etc. The surface treatment should meet the requirements, such as whether there are scratches, oxidation, oil stains, cracks, depressions, discoloration, corrosion, etc. The electrical connection should be reliable, without short circuit or open circuit.
Acceptance conditions: The parts are damaged, but the body remains good, the internal metal components are not exposed, and the specifications are marked with text, and the polarity is identifiable. Although the IC is damaged, there is no cracking. There is no cracking between the IC foot and the body package. The part foot is not damaged. The part surface is tinned with a tin filling amount of more than 75% of the PCB board thickness. The pinhole size on the solder joint is less than 1/4 of the cross-sectional area of the part foot, and the pinhole at any point does not penetrate the PCB.
The difference between PCB and PCBA
PCB is the carrier and basic framework of electronic components, while PCBA is a circuit board assembly with specific functions, which directly determines the performance and function of electronic products.
Definition and Function
1.PCB (printed circuit board): It does not contain any active or passive components itself, but is just a basic framework. Definition: PCB is a substrate used for electrical connection of electronic components, which forms a conductive circuit pattern on an insulating substrate through etching, drilling, copper plating and other processes. Function: PCB mainly plays the role of supporting and electrically connecting electronic components, and is the carrier of electronic components.
2.PCBA (printed circuit board assembly) PCBA is the core part of electronic products and directly determines the performance and function of the product. Definition: PCBA is a circuit board assembly with specific functions formed by soldering electronic components to PCB through processes such as SMT (surface mount technology) or THT (through-hole mounting technology). Function: PCBA contains PCB and all necessary electronic components, which work together to realize the preset functions of the circuit board.
Manufacturing process
1.PCB manufacturing process Design: Design the PCB layout according to the circuit schematic. Making the substrate: Use materials such as copper foil, insulating materials and prepreg to make the substrate of the PCB. Etching: Remove the unnecessary copper foil part on the substrate by chemical or physical methods to form a conductive circuit pattern. Drilling: Drill holes on the PCB for connecting different layers or installing components. Copper plating: Plate a layer of copper in the hole and on the surface of the circuit to improve conductivity and solderability. Subsequent processing: Including steps such as cleaning, inspection, and cutting, and finally get the finished PCB.
2.PCBA manufacturing process Preparation: Prepare the required PCB and electronic components. Welding: Solder the electronic components to the PCB through SMT or THT technology. Detection: Use automated testing equipment to perform functional testing and quality inspection on PCBA. Packaging: Package qualified PCBA for transportation and storage.
Features and applications
1.PCB features Customization: PCB can be customized according to specific needs to meet the layout requirements of different circuits and components. Standardization: PCB manufacturing follows certain standards and specifications to ensure product quality and reliability. Flexibility: PCB can adapt to various complex circuit designs and component layout requirements. Widely used: PCB is widely used in various electronic products, such as mobile phones, computers, home appliances, etc.
PCBA features Functionality: PCBA has specific functions and can be directly used for the assembly and testing of electronic products. Integrity: PCBA contains all the necessary electronic components and PCBs, and is a complete circuit board assembly. Reliability: After rigorous testing and inspection, PCBA has high reliability and stability. Specific application: PCBA is usually used on the production line of electronic products and directly participates in the assembly and testing process of the product.
The difference between PCBA and SMT
PCBA VS SMT
There are significant differences between PCBA processing and SMT processing in terms of definition and scope, component types and assembly methods, process flow and equipment, application fields and product features.
Definition and scope PCBA processing is a broader concept that covers the entire process of assembling electronic components onto printed circuit boards, including circuit board design, component selection, welding, testing and other links. PCBA processing can use both through-hole technology (THT) and surface mount technology (SMT). SMT processing is an important link in PCBA processing, specifically referring to the process of mounting surface mount components (such as chip resistors, chip capacitors, etc.) on the surface of printed circuit boards using surface mount technology. SMT processing usually includes steps such as printing solder paste, mounting components, and reflow soldering.
Component types and assembly methods PCBA processing can handle various types of components, including through-hole components (such as integrated circuits in DIP packages) and surface mount components. Through-hole components need to be soldered to the other side of the circuit board through the jack, while surface mount components are directly mounted on the surface of the circuit board. SMT processing focuses on processing surface mount components. These components have the characteristics of small size, light weight, no pins or short pins, which can achieve high-density assembly, thereby improving the integration and performance of circuit boards.
Process flow and equipment The application field of PCBA processing is very wide, covering almost all industries that require electronic circuit boards, such as communications, medical, aviation, home appliances, etc. Since PCBA processing can handle various types of components and complex assembly requirements, it is suitable for the production of electronic products of various sizes and complexities. SMT processing is more suitable for the production of miniaturized, lightweight, and highly integrated electronic products. Since surface mount components are small and light, SMT processing can achieve high-density assembly, thereby reducing product volume and weight. In addition, SMT processing also has the advantages of high production efficiency and stable product quality.
PCBA Common Terms
Surface mount assembly (SMA): a printed circuit board assembly completed using surface mount technology.
Reflow soldering: the connection between surface mount components and PCB pads is achieved by melting the solder paste pre-allocated to the PCB pads.
Wave soldering: the molten solder is sprayed into a solder wave crest as required by the design through the equipment, so that the PCB with electronic components passes through the solder wave crest to achieve the connection between the components and the PCB pads.
Solder paste printing: the solder paste is placed on the steel mesh, and the solder paste is leaked through the holes on the steel mesh by a scraper and accurately printed on the PCB pads.
Automated optical inspection (AOI): the soldering effect of the PCB board can be detected by scanning and comparing. Defective PCB boards can be detected.
Rework: the act of reworking defective boards detected by AOI or manual inspection.
Fine pitch: refers to the lead center spacing of surface mounted package components ≤ 0.50mm.
Gerber file: A collection of document formats that describe circuit board images and drilling and milling data, used for PCBA quotation and processing.
BOM file: A bill of materials that lists all materials and quantities required for PCBA processing.
Solder paste deviation, solder paste tip, solder paste hole, etc.: These are common defects in PCBA processing.
FAQ About PCBA
FAQ Abaout PCBA
Why can PCBA processing improve the reliability and stability of circuit boards? PCBA processing can greatly reduce the failure rate of products, speed up the launch of products, and improve production efficiency through strict quality management system, strict control and quality inspection from component procurement to production process.
How to ensure the quality of PCBA? The key to ensuring the quality of PCBA lies in a strict quality management system, including strict control and quality inspection from component procurement to production process.
How to control the cost of PCBA processing? Methods to control the cost of PCBA processing include optimizing design, reducing component costs, and improving production efficiency.
How to choose a suitable PCBA processing plant? Selecting a PCBA processing plant requires considering factors such as the factory’s equipment, quality management system, production capacity, and experience.
What are the problems and causes of cold soldering in PCBA? Due to insufficient solder paste, insufficient soldering temperature, or too short soldering time, no effective soldering is formed between the component pins and the pads, which may cause circuit blockage or poor contact.
What are the problems and causes of cold welding? Due to the low welding temperature, the welding material is not completely melted, which is manifested as the surface of the welding point is rough, gray, and has no gloss. The welding strength is insufficient, which can easily cause the welding point to break.
What are the problems and causes of continuous welding? Due to excessive application of solder paste or the pins of adjacent components are too close, a connection is formed between welding points that should not be connected, which may cause a short circuit.
What are the problems and causes of component damage? Due to static electricity, overheating, mechanical stress and other reasons, the performance of components is reduced or completely fails, affecting the overall circuit function.
What are the problems and causes of component misalignment? Due to equipment failure, operating errors and other reasons during the patch process, the components are not aligned with the pads on the PCB, which may cause poor welding or abnormal circuit function.
What are the problems and causes of PCB contamination? During the production and storage process, it is polluted by oil stains, dust and other pollutants, which affects the welding effect and may cause problems such as poor welding or short circuit.
What are the problems and causes of PCB deformation? Due to environmental factors such as high temperature and humidity, PCB deformation affects the mounting and welding of components, which may cause abnormal circuit function.
What are the problems and causes of missed inspection of PCBA? Due to failure of detection equipment, operating errors, etc., defective products may flow into the next process or market, affecting product quality and customer satisfaction.
What are the problems and causes of PCBA mixing? During the production process, components or PCBs are mixed, resulting in product performance not meeting requirements, which may cause customer returns or claims.
Best is mainly engaged in the production of High frequency pcb communication circuits, high-speed, microwave and radio frequency printed circuit boards, mainly in sample making and small and medium batches. The main products are: microwave radio frequency high-frequency boards, Rogers high-frequency boards, Rogers multi-layer high-frequency mixed-pressure boards, Rogers radio frequency boards, Taconic microwave boards, Taconic multi-layer circuit boards, Arlon microstrip antenna boards, ARLON high-frequency boards, F4BM antenna boards, F4BM multi-layer mixed-pressure boards, radio frequency amplifier PCB boards, HDI precision multi-layer boards, serving domestic and foreign high-tech enterprises and scientific research institutions.
What is a high frequency pcb communication circuits
High frequency pcb communication circuits to a circuit board with an operating frequency in the high frequency band (usually greater than 300MHz or a wavelength less than 1 meter), which is mainly used to transmit high-frequency signals and data. This type of circuit board is widely used in radio frequency (RF) and microwave fields, such as communication equipment, radar systems, satellite communications, and high-speed data transmission systems.
What is a high frequency pcb communication circuits
The characteristics of high-frequency circuits include challenges such as transmission line effects, signal integrity issues, and electromagnetic interference (EMI). Due to the short wavelength of high-frequency signals, traditional low-frequency circuit design methods are no longer applicable, and special design and processing methods are required to ensure the performance and stability of the circuit.
High-frequency circuit boards are produced on microwave substrate copper-clad boards using ordinary rigid circuit board manufacturing methods or special processing methods. They need to have high-quality electrical properties and chemical stability to meet the requirements of high-frequency signal transmission.
Definition of high frequency pcb communication circuits
High-frequency circuit board, as a special circuit board, is mainly suitable for occasions with high electromagnetic frequency, especially in the fields of high frequency (frequency greater than 300MHz or wavelength less than 1 meter) and microwave (frequency greater than 3GHz or wavelength less than 0.1 meter).
It is a circuit board made on a microwave substrate copper-clad board by adopting some manufacturing processes or special processing methods of ordinary rigid circuit boards. Generally speaking, when the frequency of the circuit board reaches above 1GHz, it can be defined as a high-frequency board.
With the rapid development of science and technology, more and more equipment designs have begun to involve microwave frequency bands (>1GHz) and even expanded to the millimeter wave field (such as 77GHz), especially in popular applications such as 77GHz millimeter wave antennas on vehicles.
This trend not only promotes the continuous increase in frequency, but also puts higher requirements on the substrate of the circuit board.
For example, the substrate material needs to have excellent electrical properties, stable chemical properties, and as the frequency of the power signal increases, the loss on the substrate must be extremely small. Therefore, the importance of high-frequency boards is becoming more and more prominent.
Advantages of high frequency pcb communication circuits
The main advantages of high frequency pcb communication circuits include efficient data transmission, strong anti-interference ability, high-frequency bandwidth and high reliability.
high frequency pcb communication circuits can achieve efficient data transmission. High-frequency signals have a short cycle and can transmit more information per unit time, so they have the advantage of large-capacity transmission. In addition, high-frequency signals can achieve fast signal processing and are suitable for application scenarios that require high-speed data transmission and high real-time requirements.
high frequency pcb communication circuits have strong anti-interference capabilities. Due to the short wavelength of high-frequency signals, they can better avoid external interference and attenuation and have strong anti-interference capabilities. This makes high-frequency signals have advantages in fields such as wireless communications and radar systems, and can achieve stable signal transmission and reception.
high frequency pcb communication circuits also have the advantage of high-frequency bandwidth. High-frequency signals correspond to a larger frequency range and can provide higher bandwidth than low-frequency signals. This means that more data can be transmitted, thereby supporting higher data rates and richer media content.
High reliability of high frequency pcb communication circuits is also one of its advantages. The use of high-quality materials and manufacturing processes can effectively resist external interference and oxidation corrosion, ensure stable performance in high temperature environments, and thus extend the service life of the circuit board.
Classification of high frequency pcb communication circuits
Classification by material:
Organic materials: including phenolic resin, glass fiber/epoxy resin, Polyimide, BT/Epoxy (bismaleimide triazine/epoxy resin), etc.
Inorganic materials: mainly including aluminum, copper-invar-copper, ceramic, etc. These materials are mainly selected for their excellent heat dissipation function.
Classification by the hardness of the finished product:
Rigid PCB: has a solid structure and stable performance.
Flexible PCB: has flexibility and bendability, suitable for occasions requiring flexible wiring.
Rigid-Flex PCB: It combines the characteristics of rigid and flexible boards, and has higher design flexibility and wide application.
Classification by structure:
Single-sided board: A circuit board with a conductive layer on only one side.
Double-sided board: Both sides are coated with conductive layers, separated by insulating materials in the middle.
Multilayer board: It is composed of multiple conductive layers and insulating layers, and has higher circuit integration and reliability.
Classification by use:
Communication board: It is used in various communication equipment and systems.
Consumable electronic board: It is commonly found in consumer electronic products.
Military board: A circuit board that meets special requirements in the military field.
Computer board: A circuit board used in computer hardware.
Semiconductor board: A circuit board used in the manufacturing and testing process of semiconductors.
Electrical test board: A circuit board used in electronic testing and measurement equipment.
How to choose high-frequency circuit board high-speed board
When choosing PCB board, you must find a balance between meeting design requirements, mass production and cost. In short, the design requirements cover two aspects: electrical performance and structural reliability. Especially when designing ultra-high-speed PCB (frequency greater than GHz), the choice of board is particularly important. For example, the commonly used FR-4 material will have a significantly increased dielectric loss (Df, i.e., Dielectric Loss) at a frequency of several GHz, and may no longer be applicable.
Taking the 10Gb/S high-speed digital signal as an example, this signal can be regarded as the superposition of multiple sinusoidal wave signals of different frequencies. Therefore, the 10Gb/S signal contains multiple components of different frequencies: such as a 5GHz fundamental signal, a 3rd-order 15GHz signal, a 5th-order 25GHz signal, and a 7th-order 35GHz signal. In order to ensure the integrity of digital signals, maintain the steepness of the upper and lower edges of the signals, and be compatible with the low-loss, low-distortion transmission of RF microwaves (the high-frequency harmonic part of the digital signal reaches the microwave frequency band), the selection of materials for high-speed digital circuit PCBs has many similarities with the needs of RF microwave circuits.
In actual engineering operations, the selection of high-frequency boards seems simple, but the factors that need to be considered are quite complex. Through the introduction of this article, PCB design engineers or high-speed project leaders can have a deeper understanding of the characteristics and selection of boards. Understand the electrical properties, thermal properties, reliability and other characteristics of the board, and use the stacking design reasonably to create products with high reliability and excellent processability, and achieve the best balance of various factors.
Composition and key components of high frequency pcb communication circuits
High frequency pcb communication circuits are basically composed of passive components, active devices and passive networks. Passive components include resistors, capacitors and inductors, which mainly exhibit resistance characteristics at low frequencies, but also exhibit reactance characteristics at high frequencies. Active devices such as high-frequency triodes have the characteristics of high gain, high frequency response and low noise, and are widely used in television, radio communication, radar and other fields.
Application of high frequency pcb communication circuits
High frequency pcb communication circuits are widely used in long-distance communication systems, with a communication distance of up to thousands of kilometers, and are often used to maintain communication between aircraft and bases. It occupies a high-frequency band of 2~30MHz, uses skywave propagation, and can propagate over long distances. Modern airborne high-frequency communication systems usually use single-sideband communication systems, which can greatly compress the occupied frequency band and save transmission power. However, high-frequency communication is also susceptible to electrical interference such as ionospheric disturbances and lightning, generating radio background noise, and there is fading, and the signal is sometimes strong and sometimes weak.
Design Guidelines for High Frequency PCB Communication Circuits
Design Guidelines
High Frequency PCB Communication Circuits
How to avoid high-frequency interference?
The basic idea of avoiding high-frequency interference is to minimize the interference of the electromagnetic field of high-frequency signals, which is the so-called crosstalk. You can increase the distance between high-speed signals and analog signals, or add ground guard/shunt traces next to analog signals. Also pay attention to the noise interference of digital ground to analog ground.
How to solve the signal integrity problem in high-frequency communication PCB design?
Signal integrity is basically an impedance matching problem. The factors that affect impedance matching include the architecture and output impedance of the signal source, the characteristic impedance of the trace, the characteristics of the load end, and the topology of the trace. The solution is to rely on termination and adjust the topology of the trace.
How is the differential wiring method implemented?
There are two points to note when wiring differential pairs. One is that the length of the two lines should be as equal as possible, and the other is that the spacing between the two lines (this spacing is determined by the differential impedance) should remain unchanged, that is, they should be kept parallel. There are two parallel methods, one is that two lines run on the same routing layer (side-by-side), and the other is that two lines run on two adjacent layers (over-under). Generally, the former side-by-side (side by side, shoulder to shoulder) is more commonly used.
How to implement differential routing for clock signal lines with only one output end?
To use differential routing, it must be meaningful if both the signal source and the receiving end are differential signals. Therefore, differential routing cannot be used for clock signals with only one output end.
Can a matching resistor be added between the differential line pairs at the receiving end?
The matching resistor between the differential line pairs at the receiving end is usually added, and its value should be equal to the value of the differential impedance. This will improve the signal quality.
Why should the routing of differential pairs be close and parallel?
The routing method of differential pairs should be appropriately close and parallel. The so-called appropriate proximity is because this spacing will affect the value of differential impedance, which is an important parameter for designing differential pairs. Parallelism is also required because the consistency of differential impedance must be maintained. If the two lines are sometimes far away and sometimes close, the differential impedance will be inconsistent, which will affect the signal integrity and timing delay.
How to deal with some theoretical conflicts in actual wiring?
Basically, it is right to separate the analog/digital ground. It should be noted that the signal routing should try not to cross the split place (moat), and the return current path of the power supply and signal should not be too large.
The crystal oscillator is an analog positive feedback oscillation circuit. To have a stable oscillation signal, the loop gain and phase specifications must be met. The oscillation specification of this analog signal is easily interfered. Even if ground guard traces are added, it may not be possible to completely isolate the interference. Moreover, if it is too far away, the noise on the ground plane will also affect the positive feedback oscillation circuit. Therefore, the distance between the crystal oscillator and the chip must be as close as possible.
It is true that there are many conflicts between high-speed wiring and EMI requirements. But the basic principle is that the resistors, capacitors or ferrite beads added due to EMI cannot cause some electrical characteristics of the signal to not meet the specifications. Therefore, first use the techniques of arranging routing and PCB stacking to solve or reduce EMI problems, such as routing high-speed signals on the inner layer. Only then use resistors, capacitors or ferrite beads to reduce damage to the signal.
How to solve the contradiction between manual routing and automatic routing of high-speed signals?
Most of the current powerful routing software’s automatic routing tools have set constraints to control the winding method and the number of vias. The winding engine capabilities and constraint setting items of various EDA companies are sometimes very different. For example, whether there are enough constraints to control the winding method of the serpentine, whether the routing spacing of the differential pair can be controlled, etc. This will affect whether the routing method generated by automatic routing can meet the designer’s ideas. In addition, the difficulty of manually adjusting the routing is also related to the ability of the winding engine. For example, the pushing ability of the routing, the pushing ability of the via, and even the pushing ability of the routing to the copper plating, etc. Therefore, choosing a routing tool with a strong winding engine capability is the solution.
About test coupon.
The test coupon is used to measure the characteristic impedance of the produced PCB board with TDR (Time Domain Reflectometer) to see if it meets the design requirements. Generally, the impedance to be controlled is single line and differential pair. Therefore, the trace width and line spacing (when there is a differential pair) on the test coupon should be the same as the line to be controlled. The location of the ground point during measurement is important. In order to reduce the inductance of the ground lead, the grounding point of the TDR probe is usually very close to the probe tip, so the distance and method between the point where the signal is measured on the test coupon and the ground point should be consistent with the probe used.
In high-speed PCB design, the blank area of the signal layer can be copper-plated, and how should the copper of multiple signal layers be distributed in grounding and power supply?
Generally, the copper plating in the blank area is mostly grounded. However, when plating copper next to high-speed signal lines, pay attention to the distance between the copper plating and the signal line, because the copper plating will reduce the characteristic impedance of the trace a little. Also be careful not to affect the characteristic impedance of other layers, such as in the dual strip line structure.
Can the signal line on the power plane be calculated using the microstrip line model? Can the signal between the power and ground planes be calculated using the stripline model?
Yes, both the power plane and the ground plane must be considered as reference planes when calculating the characteristic impedance. For example, a four-layer board: top layer-power layer-ground layer-bottom layer. At this time, the model of the characteristic impedance of the top layer routing is a microstrip line model with the power plane as the reference plane.
Can the automatic generation of test points on high-density printed circuit boards by software generally meet the test requirements of mass production?
Whether the test points automatically generated by general software meet the test requirements depends on whether the specifications for adding test points meet the requirements of the test equipment. In addition, if the routing is too dense and the specifications for adding test points are strict, it may not be possible to automatically add test points to each line. Of course, the places to be tested need to be filled manually.
Will adding test points affect the quality of high-speed signals?
As for whether it will affect the signal quality, it depends on the way of adding test points and how fast the signal is. Basically, the additional test point (without using the existing via or DIP pin as the test point) may be added to the line or a short line may be pulled out from the line. The former is equivalent to adding a very small capacitor to the line, and the latter is an additional branch. Both situations will have some impact on the high-speed signal, and the degree of impact is related to the frequency speed of the signal and the edge rate of the signal. The magnitude of the impact can be known through simulation. In principle, the smaller the test point, the better (of course, it must meet the requirements of the test equipment) and the shorter the branch, the better.
How should the ground wires between the boards of a system be connected when several PCBs are connected to each other?
When the signals or power supplies between the PCB boards are in operation, for example, when the power supply or signal from board A is sent to board B, there will be an equal amount of current flowing back from the ground layer to board A (this is Kirchoff current law). The current on the ground layer will flow back to the impedance. Therefore, at each interface where the power supply or signal is connected to each other, the number of pins allocated to the ground layer should not be too small to reduce the impedance, so as to reduce the noise on the ground layer. In addition, the entire current loop can be analyzed, especially the part with larger current, and the connection method of the ground layer or ground wire can be adjusted to control the flow of current (for example, create low impedance at a certain place to let most of the current flow through this place) to reduce the impact on other more sensitive signals.
The Ego Battery Circuit Board is a kind of circuit board that assembled with Ego branded batteries. Ego batteries are commonly found in devices such as e-cigarettes (also known as vape pens) and portable power tools. The circuit board is responsible for controlling the current between the battery and the device, ensuring optimal performance while protecting the battery from potential hazards.
Essentially, the Ego battery circuit board acts as the “brain” of the battery. It monitors important factors such as voltage, current and temperature and makes real-time adjustments to keep everything running smoothly. If the battery voltage drops too low or rises too high, the circuit board steps in to regulate the current. This prevents the battery from being damaged by overcharge, over-discharge, or short circuit.
The Ego battery circuit board is designed with safety in mind. Overcharging or over-discharging can cause the battery to overheat and even catch fire in extreme cases, but built-in protection prevents these problems. Therefore, Ego batteries are safer to use in everyday devices, especially in e-cigarettes, where users rely on them for frequent daily charging and discharging.
How Does the Lithium Battery Protection Circuit Board Work?
The working principle of the lithium battery protection circuit board mainly involves real-time monitoring of the voltage and current of the battery, and taking protective measures when necessary to ensure the safe use of the battery. The lithium battery protection circuit board is usually composed of electronic circuits, including control ICs, MOS switches, resistors, capacitors and auxiliary devices such as NTC, ID memory, etc. These components work together to achieve complete protection of the battery.
Overshoot protection
When the battery is charged to the voltage exceeds the set value (generally 4.25-4.35V), the protection circuit board will respond immediately and turn off the MOS switch within tens of milliseconds through the control IC to stop charging and prevent the battery from being damaged due to overcharge. When the overcharge protection is restored, charging will start again when the battery voltage falls back to a certain value (e.g. 3.8-4.1V).
Over-discharge protection
When the voltage of the battery is reduced to the set value (generally 2.3-2.5V) due to discharge, the protection circuit will also turn off the MOS switch through the control IC in a short time to stop discharge, in order to prevent the battery from being damaged by excessive discharge.
Overcurrent and short circuit protection
If the discharge current in the circuit exceeds the set value or the output is short-circuited, the overcurrent and short circuit detection circuit will act to shut off the MOS tube, thus cutting off the current and protecting the battery from damage.
In addition, the protection board also includes bypass or decoupling capacitors, the location and value of these capacitors are critical for both digital and analog design, and their location should be placed as close as possible to the device to effectively bypass the high-frequency signal on the power supply, avoiding the introduction of noise or vibration.
What Is the Battery-Looking Thing on a Circuit Board?
The “battery-looking” component on a circuit board can sometimes confuse users who think it might be a battery, but in many cases, it’s actually a different electronic component known as a capacitor. A capacitor is a device used to store and release electrical energy. While it might resemble a small battery in shape and size, its function is quite different.
Capacitors play a critical role in regulating voltage and smoothing out fluctuations in electrical circuits. In many electronic devices, including Ego batteries, capacitors are used to stabilize the power output, ensuring a steady flow of electricity. Without capacitors, the voltage supplied to a device could spike or drop suddenly, leading to erratic performance or damage to sensitive components.
Capacitors can be mistaken for batteries because they store energy, but they don’t have the same long-term storage capabilities as a true battery. While a battery provides a continuous flow of energy over an extended period, a capacitor is designed to store energy temporarily and release it quickly when needed.
In some cases, especially in complex electronic systems, there is a small backup battery on the circuit board. This is commonly found in devices like computers or other electronics that need to maintain settings or real-time clocks even when the main device is turned off. These backup batteries ensure that critical information, like the time or system settings, remains intact. However, in Ego battery circuit boards, you will typically only find components like capacitors, resistors, and protection circuit boards that manage power regulation and performance, rather than actual backup batteries.
What Does Rechargeable Battery with PCB Mean?
A rechargeable battery with a PCB means that the battery is equipped with a printed circuit board (PCB), which is usually to increase the functionality and safety of the battery. The PCB board in the rechargeable battery plays an important role, which not only increases the functionality of the battery, but also improves the safety of the battery. Specifically, the role of the PCB board on the battery is reflected in the following aspects:
1. Battery management
The battery in the charging bank needs to be properly managed through the PCB board to ensure its safe and stable work. The PCB board integrates the battery management chip and related circuits, which can charge, discharge and measure the battery, and has the protection functions of overcharge, over-discharge and over-current, so as to extend the service life of the battery.
2. Energy conversion
The power bank needs to convert the electrical energy of the battery into the voltage and current suitable for mobile devices. The circuit and electronic components on the PCB board realize this energy conversion process, converting the battery’s electrical energy into a stable output voltage and current to meet the needs of different devices.
3. Efficiency improvement
Excellent PCB board design can reduce the resistance and loss in the circuit, improve the charging efficiency. At the same time, the intelligent charging chip can also be integrated on the PCB board to adjust the charging power according to the status of the battery and the needs of the equipment, and further improve the charging efficiency.
4. Safety guarantee
The circuit and electronic components on the PCB board need to have a high degree of safety and stability to ensure that there will be no short circuit, overheating, explosion and other safety accidents during use. At the same time, PCB boards also need to have electromagnetic compatibility to reduce interference with other equipment.
How Many Years Do Ego Batteries Last?
10 Years. Due to their high capacity, all EGO batteries can be stored unattended for a minimum of 10 years without damaging capacity and cycle performance.
Frequently Asked Questions about Ego Battery Circuit Board
What devices use Ego batteries?
Ego batteries are popular in vaping devices but can also be found in power tools, flashlights, and other portable electronic devices.
Can I replace the circuit board in an Ego battery?
Replacing the circuit board requires technical knowledge and is not recommended unless you are experienced with battery repairs. It’s safer to replace the entire battery.
Are Ego batteries safe?
Yes, Ego batteries are equipped with protection circuit boards that ensure safety by preventing overcharging, overheating, and other potential issues.
How often should I charge my Ego battery?
It’s recommended to charge the battery before it gets too low to avoid over-discharging. Regular charging, without letting the battery fully drain, helps extend its lifespan.
What is the warranty on Ego batteries?
Most Ego batteries come with a warranty of 1 to 3 years, depending on the manufacturer and the specific product.
The DB Technology Hoot Circuit Board is an advanced control board used in hot tubs to manage and automate various functions, making your spa experience efficient and enjoyable. This circuit board is central to the hot tub’s operation, overseeing everything from heating the water to powering the jets. It communicates with the control panel, relays commands, and adjusts settings based on user inputs. Essentially, the Hoot Circuit Board is the brain of the hot tub, coordinating multiple components to maintain a smooth, safe, and personalized experience for the user. It is known for its durability and reliability, this board can, however, develop faults over time due to age, moisture, or electrical issues, necessitating a replacement.
Components and Functions of the Hoot Circuit Board
The DB Technology Hoot Circuit Board consists of several key components, each serving an essential role in the functioning of your hot tub:
Microcontroller Unit (MCU): The MCU is the core of the circuit board, processing commands from the control panel. It manages tasks like temperature adjustments, pump speed, and safety protocols.
Relay Switches: These switches control the power flow to various parts of the hot tub, such as heaters and pumps. They act as the gatekeepers, opening and closing circuits based on commands from the MCU.
Sensors and Thermistors: These components monitor temperature and water flow. They ensure the hot tub operates within safe limits, preventing overheating and other potential hazards.
Power Supply Components: The power components, including capacitors and resistors, regulate voltage and current, ensuring stable power delivery to the entire system.
Communication Ports: These ports allow the circuit board to communicate with the control panel and other connected devices, facilitating real-time adjustments and error reporting.
Each part of the Hoot Circuit Board works together to provide a safe and enjoyable hot tub experience. However, when one component fails, it can affect the entire system.
How Much Does It Cost to Replace a Circuit Board on a Hot Tub?
Replacing a circuit board on a hot tub can vary in cost, depending on the model and brand. For a DB Technology Hoot Circuit Board, replacement prices typically range between $200 and $600. Factors influencing the cost include the availability of the board, whether it’s purchased directly from the manufacturer or a third-party supplier, and any additional installation fees.
If you opt to replace the board yourself, you may only need to pay for the board and any tools required. However, this approach demands basic knowledge of electronics and safety precautions.
Or you can hirea professional can add to the cost, with service fees ranging from $100 to $200. Though more expensive, a professional installation ensures the board is installed correctly, minimizing risks of further issues.
While the initial cost may seem high, replacing a faulty circuit board can extend the life of your hot tub and improve its performance, making it a worthwhile investment.
How Long Do Hot Tub Circuit Boards Last?
The life of the circuit board of the hot tub is affected by many factors, and a fixed number of years cannot be given.
The life of hot tub circuit board is affected by many factors such as raw material quality, production process, environmental factors and so on. High-quality substrates and copper foils effectively reduce the risk of aging and failure, while high-precision production processes and strict quality control reduce defects and improve long-term stability. In addition, environmental factors such as humidity, temperature, and the presence of contaminants can also cause the board to age. Therefore, maintaining appropriate environmental conditions, such as controlling humidity and temperature, is an effective measure to extend the shelf life of the circuit board.
For electric water heaters, their service life is between 5-15 years, which indicates that the life of the circuit board will also be affected by the overall use of the electric water heater. Therefore, the life of the hot tub circuit board not only depends on the quality and maintenance of the circuit board itself, but also is affected by the frequency of use of the water heater, maintenance and other factors. In order to ensure the safety and effectiveness of use, it is recommended to regularly inspect and maintain the hot tub and its circuit board, follow the manufacturer’s recommendations for maintenance and replacement to ensure the best performance and safety.
How Do I Know If My Circuit Board Is Bad?
Recognizing the signs of a failing circuit board early can help prevent further damage and costly repairs. Here are common indicators to be done if your DB Technology Hoot Circuit Board might be malfunctioning:
1. Visual inspection
Carefully observe whether the surface of the circuit board has obvious physical damage, such as burning, cracking, corrosion, etc. If an anomaly is found, it is likely a sign of damage to the circuit board.
2. Test voltage
Use a digital multimeter or multifunction tester to measure the voltage between each key point on the circuit board. If there is an abnormal voltage value (such as short circuit, open circuit, or abnormal high and low), it indicates that there may be a problem with the board.
3. Tracking signals
When some functions on the circuit board do not work properly, devices such as oscilloscopes or logic analyzers can be used to track the signal path and determine whether there is interruption or interference.
4. Component testing
If there are removable components on the circuit board, such as integrated circuit chips, electrolytic capacitors or diodes, you can use test instruments to test these components to confirm whether their performance is normal.
5. Thermal imaging
Use an infrared thermal imaging camera to scan the surface of the circuit board to detect whether there are hot spots or abnormal temperature areas. This can help detect possible faults or overload conditions in the board.
Please note that if you do not have the relevant expertise and skills, it may be risky to determine whether the board is damaged. It is recommended to consult a professional or seek the help of professional repair services like Best Technology when it is necessary to judge or repair the circuit board.
Alternatives to the Hoot Circuit Board
If a replacement Hoot Circuit Board is not readily available or doesn’t fit your budget, consider alternative options that offer comparable performance:
Generic Replacement Boards
Some manufacturers produce universal circuit boards compatible with multiple hot tub brands. These boards can serve as a suitable alternative but may require additional wiring adjustments.
Upgraded Boards
You can upgrade your circuit boards with enhanced features, like advanced control settings or energy efficiency improvements, are available. Though slightly more expensive, these boards can enhance your hot tub experience.
Used or Refurbished Boards
Pre-owned or refurbished circuit boards can be a cost-effective solution. Ensure that these boards are tested and come with a warranty to avoid future issues.
Choosing the right alternative depends on your hot tub’s compatibility and your specific needs. Always verify compatibility before purchasing a replacement.
Step-by-Step Guide to Replacing Your Hoot Circuit Board
Replacing your DB Technology Hoot Circuit Board can be a manageable task with the right tools and guidance. Here’s a simple step-by-step guide:
1. Before starting, turn off the power supply to your hot tub at the breaker box to avoid electrical shock.
2. Locate the control box that houses the circuit board. Remove the cover using a screwdriver.
3. Before disconnecting anything, take detailed photos of the circuit board and wiring connections. This will help you reconnect everything correctly.
4. Carefully remove the connectors and wiring attached to the circuit board. Unscrew any mounting screws holding the board in place.
5. Position the new Hoot Circuit Board in place and secure it with screws. Reconnect all wires and connectors as per your reference photos.
6. Turn the power back on and test all functions of the hot tub to ensure the new board is working correctly. Check for any error messages or irregular operation.
7. Once everything is functioning as expected, replace the control box cover securely.
Replacing a circuit board can be a straightforward process, but if you’re unsure, consulting Best Technology is always a good idea to ensure safety and proper installation.
Why Choose Best Technology for Hoot Circuit Board?
Selecting the right supplier for your DB Technology Hoot Circuit Board replacement or upgrade can greatly impact the performance and longevity of your hot tub. Choosing Best Technology as your go-to provider for Hoot Circuit Boards because:
No stencil, setup fee
Free capacitors and resistors for prototype customers
Rapid prototyping: 24-hour delivery, 8-hour rush service
Dust-free workshop for PCB and PCBA assembly
Over 2000+ customers all around the world
Dedicated one-on-one service with WIP production updates
ISO9001, ISO13485, IATF16949 certificated
Factory in Vietnam, US, China
You are welcome to contact us any time for PCB projects!!
