Heavy copper PCB design refers to creating printed circuit boards with much thicker copper layers than standard boards. While a typical PCB uses 1 oz copper (about 35µm), heavy copper PCBs range from 2 oz to 20 oz per square foot, sometimes even higher for extreme power needs.
Thick copper layers improve current handling, enhance mechanical strength, and allow for compact, high-power layouts without compromising reliability.
What is heavy copper PCB?
Heavy copper PCB uses copper conductors that are much thicker than standard PCBs. While standard boards use 1 oz copper (about 35µm), heavy copper boards range from 2 oz to 20 oz per square foot. Some extreme designs even go beyond that, which we call extreme copper PCB.
So, why so thick? Because thicker copper carries more current without overheating. It also improves mechanical strength, making the board more robust for harsh environments.
In short, heavy copper PCBs are not ordinary. They are designed for power electronics, automotive, defense, and industrial equipment that demand strength and stability.
Why use thick copper PCB?
Power systems produce heat. A lot of it. If your PCB cannot handle high current, failure is just a matter of time. That’s why thick copper PCBs are vital.
Here’s why industries love them:
Superior current capacity: Thick copper allows higher amperage without damaging traces.
Better heat dissipation: No more overheating issues in power circuits.
Strong mechanical bonding: Ideal for connectors, heavy components, and thermal sinks.
Design flexibility: Perfect for high-density interconnects and power distribution layers.
Thickness matters. A standard PCB has 1 oz copper (35µm). For heavy copper PCBs, the thickness ranges from:
2 oz (70µm): Entry-level heavy copper
3 oz to 6 oz (105µm to 210µm): Common for power electronics
8 oz to 20 oz (280µm to 700µm): Extreme copper PCB for very high power
The choice depends on current requirements, thermal performance, and mechanical strength. If your design demands high current flow, you need more copper.
What are the common problems in heavy copper PCB design?
Designing a heavy copper PCB is not as simple as adding more copper. It brings challenges:
Uneven Trace Widths: Incorrect design may lead to imbalance.
Plating Difficulties: High copper density affects via plating and reliability.
High Cost: More copper equals higher material and manufacturing cost.
With a professional heavy copper PCB manufacturer like BEST Technology, these challenges are easily solved. Our team uses controlled etching and advanced plating to ensure accuracy and quality.
How much does heavy copper price affect cost?
The price of heavy copper PCBs depends on:
Copper weight (2 oz, 4 oz, 6 oz, etc.)
Board size and layer count
Design complexity
Quantity
Copper is not cheap. A 6 oz PCB will cost more than a 2 oz PCB due to more copper and processing time. If you want exact pricing, contact us at sales@bestpcbs.com. Our experts will provide a detailed quotation and free consultation.
What are the benefits of thick copper PCB?
The benefits are undeniable:
High current carrying capacity: Perfect for power supplies and converters.
Excellent heat dissipation: Reduces thermal stress on components.
Stronger mechanical strength: Holds heavy connectors and components.
Compact design: Combine power and control circuits on one board.
Reliable in harsh environments: Ideal for automotive and military.
Simply put, heavy copper PCBs improve performance and extend the lifespan of your devices.
Why choose BEST Technology for heavy copper PCBs?
Because we deliver:
Copper thickness from 2 oz to 20 oz with precision.
Advanced etching technology for accurate trace widths.
Superior plating process for reliable via connections.
ISO9001:2015 certified manufacturing.
Short lead time: Fast delivery for your projects.
Our heavy copper boards are used in power converters, inverters, automotive systems, and defense equipment worldwide.
BEST Technology Heavy Copper PCB Capabilities
Specification Category
Details
Base material
FR4/Aluminum
Copper thickness
4OZ ~ 10OZ
Extreme Heavy Copper
20OZ ~ 200OZ
Outline
Routing, Punching, V-Cut
Soldermask
White/Black/Blue/Green/Red Oil
Surface finishing
Immersion Gold, HASL, OSP
Max Panel size
580 × 480 mm (22.8″ × 18.9″)
What are the applications of heavy copper PCBs?
These boards are everywhere in high-power industries:
Power Supply Modules
Automotive Electronics
Military and Defense Systems
Renewable Energy Systems (Solar, Wind)
Industrial Control Equipment
Telecom Base Stations
If your design needs high current handling and thermal stability, heavy copper is the only way.
Heavy copper PCB manufacturers – BEST Technology
Not all manufacturers can handle thick copper PCBs. It requires specialized equipment, strict process control, and experience. That’s where BEST Technology stands out.
We’ve been manufacturing heavy copper PCBs since 2006. Our factory is equipped for multi-layer heavy copper boards, extreme copper designs, and custom prototypes. We handle everything from design support to mass production.
When you choose us, you get:
Expert engineering support
Competitive pricing
On-time delivery
High-quality boards for critical applications
Conclusion:
Heavy copper PCB design is a requirement for high-power electronics. They offer superior current capacity, heat dissipation, and mechanical strength.
If you’re looking for professional heavy copper PCB manufacturers, BEST Technology is your trusted partner. Contact us at sales@bestpcbs.com for a quote, technical support, or free consultation.
How to use copper tape for PCB repair? Let’s explore benefits, applications, usage process, tools and material list, copper tape types, testing methods, and maintenance tips for copper tape PCB repair.
As a professional PCB manufacturer, Best Technology can provide you PCB repair service:
Free Technical Support: Provide evaluation of repair alternatives.
Repair multilayer boards:Supports blind and buried hole conductivity.
24 Hours Rapid Prototyping: Quickly replace the broken PCB board.
Welcome to contact us if you have any request for PCB repair or PCB prototyping: sales@bestpcbs.com.
Visually locate the broken trace. Use a magnifier to confirm the damage range.
Clean the area with an alcohol-soaked cotton swab to remove residue, oxidation, or solder mask. If the solder mask covers the break, scrape it off with a blade or sandpaper to expose the copper base.
2. Cut the Copper Tape
Trim the tape to match the broken trace’s shape, ensuring it’s slightly larger than the damaged zone (covering intact copper on both ends).
The tape width should match the original trace. Length must span the break and overlap adjacent copper (at least 1-2mm).
3. Apply the Copper Tape
Press the tape flat onto the break, ensuring full contact with exposed copper and no air bubbles.
The tape must fully cover the break and extend to nearby pads or vias for reliability.
4. Solder to Secure
Quickly solder the tape’s ends to the PCB copper. Avoid overheating (back adhesive may melt).
Use low-temperature solder. Keep the iron’s contact time under 2 seconds to prevent tape detachment.
If repairing a pad, solder the component lead to the tape simultaneously.
5. Trim Excess Tape
Carefully cut or scrape the tape edges to match the original trace width.
Warning: The repair is fragile—avoid excessive force to prevent lifting.
6. Reinforce and Insulate
(Optional) Cover the tape with insulating tape (e.g., Kapton) or apply solder mask to prevent shorts or damage.
For high-stress areas (e.g., PCB edges), reinforce with epoxy (e.g., Araldite).
7. Test Functionality
Use a multimeter to check continuity (resistance should be near 0Ω).
Power on the device and monitor for poor contact or overheating.
Application: Where adhesive must not create electrical contact to prevent shorts.
Testing and Verifying Repaired PCB Functionality
1. Visual Check
Look for visible flaws on the repaired PCB, like solder bridges, cold joints, or damaged parts.
Confirm components are placed and oriented correctly as per the design.
2. Continuity Test
Use a multimeter to check electrical continuity between key points, e.g., power/ground traces and component connections.
Ensure no open or short circuits exist.
3. Power-Up Test
Connect PCB to power supply and slowly raise voltage to operating level.
Watch power consumption; check for abnormal current or voltage issues.
4. Function Test
Create and run a full test plan covering all PCB functions.
Use tools like logic analyzers or oscilloscopes to verify digital and analog circuit operation.
Test under different conditions (voltages, frequencies, loads) for stability.
5. Signal Test
For high-speed or sensitive signals, check for crosstalk, reflections, and jitter.
Use TDR or similar methods to analyze signal quality.
6. Thermal Test
Monitor PCB and component temperatures during operation; ensure they’re within limits.
Use thermal cameras or sensors to find hot spots or excessive heat.
7. Environment Test
Put PCB through stress tests like temperature cycling, humidity, and vibration.
Confirm it still works after each test with no degradation.
Long-Term Maintenance Tips for Copper Tape Repairs
1. Keep It Clean
Wipe the repair area with a dry cloth to remove dust.
Use isopropyl alcohol (90%+) and a cotton swab for spills, avoid scrubbing.
2. Block Moisture
Coat the copper tape with non-conductive epoxy or conformal coating.
Store/operate PCBs in a dry place (<60% humidity).
3. Avoid Bending/Pressure
Don’t flex or twist flexible PCBs near the repair.
Keep heavy objects off the repaired area.
4. Check for Corrosion
Inspect every 3–6 months for discoloration or lifting edges.
Test with a multimeter for unexpected resistance.
5. Strengthen High-Use Joints
Add solder to frequent connections for durability.
Secure tape edges with non-conductive glue/epoxy.
6. Avoid Extreme Temps
Keep repairs away from heat sources (e.g., motors).
Prevent rapid cold exposure to avoid condensation.
7. Track Repairs
Label the repair site (e.g., “R12 – Copper Fix”).
Log dates/issues in a maintenance notebook.
8. Replace if Needed
If the tape cracks, corrodes, or peels, remove and reapply a new piece.
FAQs of Copper Tape for PCB Repair
Q1: Why does copper tape for PCB repair peel off? A1: Clean the PCB with alcohol and a cloth. Use strong-adhesive copper tape and press firmly with a flat tool.
Q2: Why do copper tape connections cut in and out? A2: Press out air bubbles with a smooth tool. Add solder to key spots after sticking the tape for better contact.
Q3: Why does copper tape cause shorts or breaks? A3: Line up the tape carefully using a magnifier. Hold it in place with masking tape before pressing down.
Q4: Why does copper tape corrode or dull? A4: Coat the repair with epoxy or conformal coating to block moisture. Store extra tape in a dry, sealed spot.
Q5: Why are solder joints on copper tape weak? A5: Use low heat when soldering and avoid overheating. Clean off flux residue with alcohol after soldering.
Are you always curious these questions about insulated metal substrate PCB:
What is insulated metal substrate? Does it the same as metal core PCB (MCPCB)?
What are the key differences between insulated metal substrate and standard PCB?
Can I use insulated metal substrate in my project? What’s its performance?
As a experienced PCB manufacturer, we can confident to say the insulated metal substrate (IMS) PCB is the same as mcpcb, there is no differences between them. But it is big differ from standard PCB. Actually, IMS PCB offer numerous benefits in high power or heat sensitive projects. In this blog we will introduce what is it, its performance and the differeces with FR4 PCB.
What is an Insulated Metal Substrate (IMS)?
An insulated metal substrate (IMS) is a type of metal core PCB designed for heat-intensive applications. Unlike traditional FR4 boards, IMS uses a metal base layer—usually aluminum or copper—covered with a thin dielectric insulation and a copper circuit layer on top.
The purpose of this design is simple: dissipate heat quickly while keeping the circuit stable. Aluminum IMS boards are most common, offering a balance of cost, strength, and thermal conductivity. Copper IMS is used where performance is critical, especially in high-current applications.
Key characteristics of IMS PCBs include:
High thermal conductivity to transfer heat away from components.
Strong mechanical stability compared to FR4.
Reliable performance in harsh environments.
For industries like LED lighting, automotive electronics, and power supplies, IMS PCBs have become a preferred choice.
What is IMS material for PCB?
The performance and cost of an insulated metal substrate PCB depend heavily on the choice of the base material. Different metals give different levels of thermal conductivity, mechanical strength, and pricing.
1. Copper IMS PCB
Copper has the best thermal conductivity among IMS options. It spreads heat rapidly and is highly stable under load. However, copper is expensive, so it is often reserved for high-power applications such as industrial converters or advanced automotive modules.
2. Aluminum IMS PCB
Aluminum is the most common choice for IMS PCBs. It strikes a balance between cost, weight, and thermal performance. With good heat dissipation and lower price than copper, it has become the preferred material in LED lighting and consumer automotive systems.
3. Iron IMS PCB
Iron-based substrates are rarely used. While they are strong, their lower thermal performance and processing challenges make them less attractive. In most cases, aluminum and copper dominate the IMS market.
What is a Traditional PCB?
A traditional PCB typically refers to a board made with FR4 substrate. FR-4 is a code for a fire-resistant material grade. It represents a material specification where the resin material must be able to extinguish itself when exposed to a burning condition. It is not a material name but a material grade. Most consumer electronics use FR4 PCBs because they are affordable and easy to manufacture.
The construction includes:
Fiberglass base (FR4) for insulation and strength.
Copper foil laminated on one or both sides.
Solder mask and silkscreen for protection and labeling.
FR4 PCBs work well in devices that do not generate extreme heat. They are versatile and suitable for phones, laptops, IoT devices, wearables, and household appliances.
What is the Difference Between Insulated Metal Substrate and PCB?
The key differences between ims pcb and traditional PCB is the base material, IMS pcb uses metal core as the base substrate while traditional PCB uses fiberglass epoxy. Due to the differences base materials used, their performance, price and applications are different accordingly. Here we listing a detailed table for your reference:
Feature
Traditional PCB (FR4)
Insulated Metal Substrate (IMS)
Base Material
Fiberglass epoxy (FR4)
Metal base (aluminum or copper)
Thermal Conductivity
Low (~0.3 W/mK)
High (2–10 W/mK dielectric + metal base can reach up to 400 W/mk)
Heat Management
Needs extra cooling (heat sinks, fans)
Built-in heat spreading through metal layer
Mechanical Strength
Rigid but less durable under vibration
Strong, resists shock and vibration
Flexibility
Can be rigid, flex, or rigid-flex
Mostly rigid only
Applications
Consumer electronics, IoT, computers
LED lighting, automotive, power modules
Cost
Low, highly economical for mass production
Higher, due to materials and processing
Why is IMS Better for Heat Dissipation Compared to PCB?
As we all know, heat is the biggest enemy of electronic components. If heat builds up, components degrade, solder joints crack, and lifespan shortens. Standard FR4 struggles to move heat away, leading to performance issues in high-power systems.
An IMS PCB solves this by using a metal base that acts like a built-in heat sink. The dielectric layer transfers heat from components directly to the metal, which spreads it out quickly. This keeps the board and devices cooler and improves the overall reliability.
This is why IMS PCBs are widely used in LED lighting, where heat directly impacts brightness and lifespan. Similarly, automotive systems like motor controllers and power converters use IMS to handle constant high currents.
Which Applications Do We Use IMS vs Standard PCB?
Each type of board has its own application areas.
IMS PCB applications
LED lighting systems
Automotive electronics (engine control units, sensors, chargers)
Power modules and converters
Industrial motor drives
Telecom base stations
FR4 PCB applications
Consumer electronics (phones, tablets, laptops)
IoT devices and smart wearables
Household appliances
Audio and multimedia systems
Office electronics
The decision depends on the heat level, power density, and cost balance.
Cost Differences Between IMS and PCB
IMS PCBs are more expensive than standard FR-4 boards due to their raw materials and processing steps. Aluminum-based IMS typically costs $0.12–$0.25 per cm², while FR-4 falls around $0.05–$0.10 per cm². Extra copper thickness, dielectric layers, and specialized drilling add further expense.
Yet, the higher upfront cost can translate into system savings. In LED lighting, automotive, and power modules, IMS often reduces the need for heat sinks or cooling parts. Studies show a 15–20% drop in overall system cost when FR-4 is replaced with IMS, thanks to better thermal control and longer product life.
Design Consideration of Insulated Metal Substrate PCB
Designing an Insulated Metal Substrate (IMS) PCB is more than just replacing FR4 with a metal base. The entire design strategy changes because thermal performance becomes the top priority. Several aspects need careful thought:
1. Dielectric Layer Thickness and Thermal Conductivity
The dielectric is the heart of an IMS PCB. Its job is to provide electrical insulation while transferring heat from the copper layer to the metal base.
Typical FR4 dielectric has thermal conductivity of 0.3–0.5 W/mK.
IMS dielectrics range from 2 to 10 W/mK, depending on material choice.
Thickness is usually 50–150 μm. Thinner layers transfer heat better but risk breakdown if not well controlled.
For normal LED boards, a 75 μm dielectric with 1-2 W/mK conductivity is often a balance between cost and reliability.
2. Copper Thickness and Trace Design
Current capacity is vital. Wider traces reduce resistance and heat buildup.
Standard FR4 PCBs often use 1 oz (35 μm) copper.
IMS boards commonly use 2–3 oz (70–105 μm) copper to carry higher currents.
IPC-2221 guidelines suggest that a 2 oz copper trace at 10 mm width can handle around 20–25 A continuously, which fits the demands of power devices.
3. Component Placement and Thermal Management
Hot components, such as MOSFETs, LEDs, or regulators, should be placed directly over areas where heat can spread into the metal base efficiently. Grouping high-power parts together without proper spacing often leads to localized hot spots.
Simulation tools (like ANSYS or thermal CAD software) are often used to map temperature rise. Data shows that placing components 5 mm apart can reduce local heat rise by 8–12°C compared to tightly packed layouts.
4. Board Thickness and Mechanical Strength
IMS boards are stiffer than FR4 due to the metal layer.
Common thickness: 0.8–3.2 mm.
For automotive PCBs exposed to vibration, a 1.6 mm aluminum base is typical for balancing rigidity and weight.
Designers should consider mounting holes and mechanical supports early to avoid stress cracking during assembly.
5. Surface Finishes and Soldering
Surface finishes like ENIG, ENEPIG, OSP or HASL are commonly applied. However, IMS boards undergo more thermal cycling during soldering, so ENIG is often preferred for reliability.
Factors Affect the Failure of Insulated Metal Substrate PCB
Even with proper design, IMS PCBs can fail if certain risks are not controlled. Failures usually stem from thermal, mechanical, or environmental stresses. Let’s examine the main causes, with supporting data:
1. Thermal Stress and Cycling
IMS PCBs are exposed to wide temperature swings, especially in LED lighting (-40°C to +120°C) or automotive control units (-55°C to +150°C). In additional, a thinner dielectric layer (<75 μm) is more likely to fail under repeated expansion and contraction. So, using high Tg dielectrics (Tg ≥ 170°C) and flexible solder materials reduces the chance of cracks.
2. Dielectric Breakdown
The dielectric layer separates copper circuitry from the conductive metal base. If the insulation fails, short circuits occur.
Standard IMS dielectric breakdown voltage: 2–6 kV/mm.
If the dielectric is too thin or contaminated during manufacturing, breakdown may occur earlier, especially in high-voltage power supplies.
3. Corrosion and Moisture Ingress
If the protective coating or solder mask is not properly applied, moisture, chemicals, or salts can corrode the copper traces or the aluminum base. There is no doubt that unprotected copper can corrode in under 72 hours in a salt spray environment (5% NaCl). Therefore, applying ENIG or OSP surface finishes greatly reduces corrosion risk.
4. Mechanical Stress and Vibration
IMS boards are less flexible than FR4, which means they can crack under excessive bending or vibration.
In automotive vibration testing (10–2,000 Hz sweep, 20 g), poor mounting caused delamination in 5–10% of samples after 50 hours.
Poor drilling, lamination errors, or uneven dielectric spreading can lead to early failures. For example:
Misaligned lamination can create voids, which increase heat resistance and raise local temperatures by 10–15°C.
Improper drilling of vias in IMS can leave burrs or microcracks, leading to premature electrical failure.
Best Technology has more than 19 years in IMS PCB manufacturing. It cannot be denied that we had ever faced such problems and solved them finally, then we have much experiences to solve them and mature skills to avoid such defectives.
Insulated Metal Substrates Market
The insulated metal substrates market has grown rapidly with the demand for efficient heat management in electronics. Several sectors drive this expansion:
LED Lighting: As LEDs move into general lighting, street lamps, and automotive headlights, IMS boards remain essential for heat control.
Electric Vehicles (EVs): Motor controllers, inverters, and battery systems require durable IMS boards to handle high currents.
Industrial Power Systems: Power converters, motor drives, and renewable energy inverters are major adopters.
Telecom: Base stations and 5G equipment rely on IMS to stabilize performance under heavy workloads.
Market reports suggest steady growth in IMS adoption worldwide, especially in Asia-Pacific regions like China and South Korea, where LED and EV industries are booming. Aluminum IMS PCBs dominate due to cost efficiency, but copper IMS is growing in high-performance niches.
How to Choose Between IMS PCB and FR4 PCB?
The choice between IMS PCB and FR-4 PCB depends on performance demands, cost expectations, and application environment. If your design handles high power density or generates significant heat—such as in LED lighting, power converters, or automotive control units—IMS PCB is usually the better option. Its aluminum or copper base provides strong thermal conductivity, keeping component temperatures 20–30% lower than FR-4 under the same load.
FR-4 PCB, on the other hand, is more suitable for general-purpose electronics where heat generation is moderate. Devices like consumer gadgets, IoT sensors, and low-power communication modules often prioritize affordability and flexibility in design over extreme thermal performance. FR-4 also supports higher multilayer counts more easily than IMS, which is beneficial for complex circuits with dense routing.
So, in a word:
Choose FR4 PCB if your device is low-power, cost-sensitive, and not heat-intensive.
Choose IMS PCB if your design generates high heat, requires high reliability, or operates in harsh environments.
In practice, many manufacturers use both types in their product lines. Consumer electronics stay with FR4, while lighting and automotive turn to IMS.
FAQs
1. What materials are used in insulated metal substrates?
IMS PCBs usually use aluminum or copper as the base, with a dielectric insulation layer and copper foil.
2. Is IMS PCB more reliable than FR4 PCB?
Yes, especially in high-power or high-heat applications, IMS offers better thermal management and durability.
3. Can IMS replace all standard PCBs?
No, IMS is designed for specific heat-demanding uses. FR4 remains more cost-effective for everyday electronics.
4. Why are IMS PCBs used in LED lighting?
They transfer heat away quickly, improving brightness, efficiency, and lifespan of LEDs.
5. How expensive are IMS PCBs compared to normal PCBs?
IMS PCBs cost more due to metal materials and manufacturing, but they often save costs by reducing cooling needs.
About Best Technology – Your Trust Insulated Metal Substrate PCB Supplier
Best Technology is a turnkey PCB & PCBA manufacturer in China, we specialize in the design and manufacturing of high-quality PCBs, and we are confident that we can provide a tailored solution for your project. With our expertise and a broad range of materials, including SY, Rogers, Isola, KB, ceramic, metal core pcb, flex circuit and busbar copper pcb, etc, we offer flexibility and reliability for all your PCB designs.
We’ve made many PCBs for our customers, whether you need high-speed, high-frequency, or multi-layer PCBs, our experienced engineering team ensures reliable, cost-effective designs with excellent manufacturability. We’ve worked in this industry over 19 years, so we deeply know what our customers want, and make them into reality.
Our services include:
Customized PCB design based on your schematic and specifications
Free Design for manufacturability (DFM) to reduce production issues
Optimization for signal integrity, thermal management, and reliability
PCB layout and PCB design full turnkey service
Industry certifications we have:
ISO9001 (quality management system)
IATF16949 (for automotive device)
ISO13485 (for medical instrument)
AS9100D (aerospace applications)
In addition to our advanced PCB manufacturing capabilities, we also have a fully equipped SMT factory both in China & Vietnam. This facility is dedicated to providing our customers with professional PCB assembly services, including SMD soldering, component placement, and testing. This allows us to offer a complete solution, from PCB fabrication to final assembly, all under one roof. If you have PCB or IMS PCB manufacturing demands, welcome to contact us at sales@bestpcbs.com
How to choose base copper weight for RF board? Let’s explore base copper weight options, selection guide, cost optimize solution, recommended supplier for RF board.
Are you troubled with these problems?
Severe signal attenuation?
Uncontrolled temperature rise?
Impedance fluctuations?
Best Technology can provide solutions:
Dynamic copper thickness algorithm reduces skin loss by 40%.
Gradient copper structure reduces hotspot temperature by over 15°C.
Intelligent impedance compensation with a ±0.5μm tolerance ensures 5G+ accuracy.
Base Copper Weight refers to the thickness of the initial copper foil on the PCB substrate (usually measured in ounces per square foot or microns). It directly affects the circuit’s current carrying capacity, signal transmission stability, and thermal management performance. It is a core parameter in PCB design that balances conductivity, heat dissipation requirements, and manufacturing feasibility.
Why Base Copper Weight is Important for RF Boards?
Limitation: high process complexity, increased lamination cost.
How to Choose the Base Copper Weight for RF Boards?
1. Define High-Frequency Requirements & Loss Budget
Evaluate RF circuit loss budget (dB): Based on signal frequency, transmission distance, and acceptable loss, determine the maximum per-unit-length loss.
Copper thickness impact on conductor loss: At high frequencies, the skin effect concentrates current near the surface; thicker copper reduces conductive loss. RF signal layers typically use 0.5-2 oz base copper.
2. Prioritize Impedance Control
Strictly match impedance targets (e.g., 50Ω transmission lines): Base copper weight is critical for impedance calculations and must align with dielectric thickness, trace width, and spacing.
Example: 50Ω Grounded Coplanar Waveguide (GCPW)
Base copper: 0.5 oz (≈17.5 μm)
Trace width: 6 mil, ground gap: 10 mil
Dielectric thickness: 3.8 mil (Dk=4.1)
3. Consider Copper Foil Roughness for High-Frequency Loss
Surface roughness impact: Rough copper significantly increases loss at microwave frequencies.
Use 0.5 oz or 1 oz to balance loss and etching precision. Thicker copper (≥2 oz) complicates etching and limits minimum trace/space.
Power/ground planes
Prioritize 2 oz to 6+ oz to minimize resistance and thermal stress.
Internal layers:
Signal layers: 0.5 oz for trace width <0.127 mm to enhance etching accuracy.
Plane layers: 1 oz for cost efficiency; 2 oz requires ≥10 mil spacing and adds ~20% cost.
5. Account for Manufacturing Constraints
Minimum trace/space rules:
1 oz boards: Outer layers ≥5 mil (2-layer) or ≥3.5 mil (4/6-layer).
2 oz boards: All layers ≥8 mil.
Lamination structure:
4-layer PCBs: Internal copper options—0.5 oz, 1 oz, or 2 oz (≥1.6 mm thickness required for 2 oz).
Plating impact: Final copper thickness (e.g., after ENIG) must include design margins.
6. Cost-Material Optimization
Standard weights (0.5/1/2 oz) are cost-effective; custom thicknesses require special processes and increase costs.
High-frequency laminates: e.g., Rogers RO4003C often pairs with 0.5 oz (≈17 μm) base copper for stable dielectric properties.
Cost-sensitive designs: Use FR-4 with 1 oz copper; for >5 GHz, combine optimized copper with RF laminates.
How Does Base Copper Weight Impact RF Board Production Cost?
1. Material Cost & Copper Thickness
Impact: Each 1 oz (≈35μm) copper increase raises raw material cost by 30-50%; >3 oz requires special rolling, costing exponentially more.
Solution: Prioritize standard weights (0.5/1/2 oz) for scalability; use “localized thick copper” (e.g., 2 oz only for power planes) to avoid full-board waste.
Example: 5G base stations reduce cost 15-20% by pairing 1 oz signal layers with 2 oz power planes.
2. Etching Complexity Control
Impact: Thick copper (≥2 oz) causes undercut, extending etching time 20-40% and increasing depreciation costs.
Solution: Adopt Semi-Additive Process (SAP) or optimized etchants (e.g., acidic cupric chloride); design with 10% width compensation for 2 oz traces to minimize rework.
3. Trace/Space Design Optimization
Impact: 2 oz copper requires ≥8 mil trace/space, limiting density and potentially increasing layer count or expensive processes.
Solution: Use 0.5 oz for signal layers (supports 3.5-5 mil) with HDI microvias; balance with 1 oz for non-critical layers.
Solution: Deploy AOI for real-time etching monitoring; reinforce thin copper with support layers; optimize stack-up to reduce interlayer stress, targeting >95% yield.
7. Supply Chain & Economies of Scale
Impact: Custom weights require premium pricing and longer lead times, increasing inventory/logistics costs.
Solution: Partner with fabricators for pooled standard weight inventory; use panelization for custom orders to share fixed costs; explore cost-effective alternatives like Cu-Al composite foil.
Why Choose Best Technology as RF Board Manufacturer?
19-Year PCB Manufacturing Expertise & Global Certifications:
ISO 9001, ISO 13485, UL and RoHS compliance guarantee product safety and regulatory adherence.
24 Hours Rapid Prototyping
Quick-turn prototypes (24-72 hours) with DFM feedback to optimize copper weight, stack-up, and impedance before volume production.
Multi-Thickness Copper Base Selection
Offer flexible base copper weights (0.5 oz to 6+ oz) to match diverse RF requirements, from ultra-low-loss 0.2 oz for millimeter-wave designs to robust 6 oz for high-power applications.
Advanced Impedance Control Expertise
Precision engineering for 50Ω/75Ω transmission lines with sub-1% impedance tolerance, supported by co-simulation of copper weight, trace geometry, and dielectric parameters.
Low-Loss Material Integration
Compatibility with high-frequency laminates (e.g., Rogers RO4000/RT/duroid, Panasonic Megtron 6) and optimized copper foil roughness (VLP/RTF) to minimize insertion loss.
High-Density Interconnect (HDI) Capability
Enable ≥20μm line/space resolution via SAP/mSAP processes, supporting complex RF module integration with minimal signal degradation.
Thermal Management Solutions
Design-integrated thick copper planes (≥2 oz) with thermal vias and heat sinks to enhance heat dissipation in GaN/HEMT power amplifiers.
Cost-Performance Optimization
Balanced material selection (e.g., FR-4 for cost-sensitive layers, RF laminates for critical signal paths) to minimize overall BOM cost while meeting performance targets.
Our RF Board Capabilities
Base material:
Rogers/Telfon
Board Thickness:
0.5mm~3.0mm(0.02″~0.12″)
Copper thickness:
0.5 OZ, 1.0 OZ, 2.0 OZ, 3.0 OZ
Outline:
Routing, punching, V-Cut
Soldermask:
White/Black/Blue/Green/Red Oil
Legend/Silkscreen Color:
Black/White
Surface finishing:
Immersion Gold, HASL, OSP
Max Panel size:
600*500mm(23.62″*19.68″)
Packing:
Vacuum/Plastic bag
Samples L/T:
7~9 Days
MP L/T:
8~10 Days
How to Get a Quote for RF Board Project?
List of items to submit for quotation:
1. Technical Specifications
Layer count (e.g., 4-layer rigid-flex).
Base material (e.g., Rogers 4350B, FR4).
Copper weight (e.g., 1oz outer/2oz inner).
Impedance control requirements (±5% tolerance).
Surface finish (e.g., ENIG, Immersion Silver).
2. Design Files
Gerber files (RS-274X format).
Drill files (Excellon format).
IPC-356 netlist (for testing).
3. Special RF Requirements
Frequency range (e.g., 5-40GHz).
Insertion loss limits (e.g., <0.5dB/inch @10GHz).
RF-specific stackup (e.g., hybrid PTFE/FR4).
4. Production Details
Quantity (prototype/bulk order).
Delivery timeline (e.g., 4-week lead time).
Testing standards (e.g., IPC-6012 Class 3).
5. Additional Notes
Special tolerances (e.g., ±2mil line width).
Certifications (e.g., UL, ITAR).
Packaging requirements (vacuum-sealed).
Welcome to contact us if you have any request for RF boards:sales@bestpcbs.com.
What isCAM PCB? Let’s discover its function, types, application, design software selection guide, design process and common design issues and solutions.
Are you worried about these issues?
Perfect design, but constant production issues?
Low-volume trial production costs too high?
High-frequency board signal quality consistently substandard?
Best Technology can provide service:
Free Design for Function (DFM) analysis reduces rework costs by 10%.
24-hour rapid prototyping service saves 15% in production costs.
Material Dk optimization solutions reduce losses by 25%.
CAM PCB refers to the specialized process of using Computer-Aided Manufacturing software to convert PCB design files (such as Gerber, drill data) into machine-executable production instructions. It optimizes manufacturability by validating designs, compensating for fabrication tolerances (such as etch compensation, impedance control), and generating precision tooling files (photolithography masks, drilling paths) to ensure yield and reliability.
AI-Driven DFM: Valor Process Preparation leverages ML for predictive quality control.
Cloud Collaboration: Altium 365 enables real-time CAM data management across teams.
What Is the CAM PCB Design Process?
1. Design File Import
Load PCB design data (Gerber, ODB++, Excellon, etc.) into CAM software. Verify file integrity and format compatibility for seamless processing.
2. Design Rule Check (DRC)
Validate critical parameters like trace width, spacing, pad size, and hole dimensions against manufacturing standards. Identify violations to prevent production defects.
3. DFM (Design for Manufacturing) Analysis
Conduct deep optimization: detect electrical/mechanical issues (e.g., solder mask alignment, minimum hole size), simulate process impacts (e.g., etch compensation, thermal stress), and refine designs for yield enhancement.
4. Panelization & Layout Optimization
Arrange multiple PCBs into panels for efficient production. Apply algorithms for material utilization, nesting precision, and toolpath optimization to minimize waste and machining time.
5. Manufacturing File Generation
Output production-ready files: photoplotter data (Gerber), drilling programs (NC/Excellon), milling paths, assembly drawings, and process-specific documentation (e.g., solder paste stencils).
6. Cross-Verification & Simulation
Validate outputs through 3D visualization, signal integrity checks, and thermal simulations. Ensure files meet device-specific requirements (e.g., light painting machine resolution, pick-and-place compatibility).
7. Final Validation & Archiving
Perform end-to-end verification of manufacturing files. Store processed data with version control and audit trails for traceability. Archive for future revisions or quality audits.
FAQs of CAM PCB Design
Q1: How to handle design file import anomalies in CAM PCB? A1: Use CAM software supporting multi-format import(e.g., CAM350) to validate file integrity and compatibility. Standardize data sources with conversion tools (e.g., CAMCAD) to prevent manual errors.
Q2: What are solutions for DRC violations in CAM processing? A2: Implement strict IPC-standard rule libraries in CAM tools (e.g., CAM350) to auto-flag violations. Leverage 3D visualization for precise fault localization and prioritize critical adjustments like impedance matching for high-speed lines.
Q3: How to address DFM defects like solder mask misalignment? A3: Enable DFM modules for deep simulation (e.g., etch compensation, thermal stress analysis). Optimize material parameters (e.g., PTFE Dk compensation) and adopt iterative validation for process refinement.
Q4: How to improve panelization efficiency? A4: Apply intelligent nesting algorithms (e.g., Genesis 2000) with optimized spacing rules (e.g., ≥1mm margins) and toolpath planning to achieve >85% material utilization.
Q5: What causes signal/thermal failures and how to mitigate? A5: Use SI/PI tools (e.g., HyperLynx) for signal integrity validation and thermal simulators (e.g., ANSYS) for heat distribution prediction. Implement thermal via arrays (≥10% copper coverage) in high-power zones.
Quick Turn PCB Fabrication is a highly efficient printed circuit board (PCB) production service. Through optimized processes, automated design checks, and synchronized production management, it completes the entire process from design to delivery within 24 hours to 5 days, significantly shortening product development cycles.
This service is designed to rapidly respond to the electronics industry’s needs for prototype verification and urgent production, allowing for flexible design adjustments. While the unit price is higher, it improves overall efficiency by saving time and costs. This service is widely used in consumer electronics prototypes (such as IoT devices), emergency medical and automotive parts, and rapid verification for startups.
Technical Specifications for Quick Turn PCB Fabrication
How to Design Fast Turn PCBs to Reduce Production Cost?
1. Modular Pre-layout
Decompose complex circuits into independent functional modules (e.g., power modules, signal processing modules), develop standardized libraries for cross-project reuse. Universal power module packaging reduced layout time by 30%.
2. Structured Constraint Management
Import mechanical structure data (STEP format), define keep-out zones and height restrictions. Use 25mil sub-grid for critical components (BGA) and 50mil main grid for general layout to align with automated SMT machine precision.
3. Layer Count Dynamic Balancing
Determine minimum viable layer count through signal integrity simulation. Replace traditional through-holes with buried/blind via hybrid structures for high-speed signals. Reduced an 8-layer industrial control board to 6 layers, cutting costs by 18%.
4. Material Standardization Strategy
Prioritize FR-4 substrate, use localized PTFE hybrid construction for >5GHz signals. Develop enterprise material libraries with ≥70% standard component packages. Achieved 40% cost reduction compared to full Rogers 4350B solutions.
5. DFM Rules Embedded Design
Implement real-time DRC rules: minimum trace width/spacing 6mil, pad diameter via+12mil, solder mask opening trace+4mil. Reduced production defect rates from 2.3% to 0.7%.
6. Panelization Economic Design
Use V-cut + stamp hole hybrid panelization with 3mm process margin. Optimal panel count: 5pcs/panel, reducing unit costs by 35% versus single boards.
7. Concurrent Design Process
Execute parallel tasks during schematic phase: BOM standardization review, ECAD-MCAD mechanical interference checks, and FloTHERM thermal simulations. Shortened design cycles from 15 days to 9 days.
Double Sided PCB Quick Turn Fabrication Processes
1. Material Cutting
Substrate Preparation: Use automatic shearing machines to cut copper-clad laminates (FR-4/CEM-1) into standard sizes (e.g., 18″×24″) with edge tolerance ≤0.1mm.
Pre-Baking Treatment: Bake cut substrates at 120℃ for 2 hours to eliminate material stress and prevent warpage during subsequent processes.
2. Drilling
CNC Drilling: Employ 6-axis CNC drills with 0.2mm–3.2mm diameter bits, operating at 10,000–15,000rpm. Drilling time per panel ≤5 minutes.
Hole Cleaning: Immediately blow debris from holes using high-pressure air to avoid plating defects.
3. Electroless Copper Plating
Desmearing: Immerse drilled panels in potassium permanganate solution to remove resin residues from holes.
Copper Deposition: Deposit 0.3–0.5μm copper layer in alkaline solution for hole wall conductivity, taking ~45 minutes.
4. Circuit Imaging
Dry Film Lamination: Attach photosensitive dry film to substrates via thermal rollers at 110℃±5℃ and 1.5m/min speed.
Laser Exposure: Use LDI (Laser Direct Imaging) to project patterns onto dry film with ≤4mil resolution, eliminating film usage and saving 30% time.
5. Etching
Alkaline Etching: Immerse exposed panels in ammonium chloride-copper solution to remove non-conductive copper, maintaining line width tolerance ±0.05mm.
Quick Stripping: Rinse residual dry film with high-pressure water jet at 50℃±5℃ for ≤2 minutes.
6. Solder Mask Application
Screen Printing: Apply UV-curable solder mask using 36T mesh, achieving 20–30μm thickness with automatic alignment accuracy ±0.1mm.
Pre-Curing: Bake panels at 80℃ for 10 minutes in infrared tunnel oven to stabilize ink flow.
Ultra-Fast Delivery (24-72 Hours): Accelerates product development cycles by 50%+ compared to standard lead times, enabling rapid prototyping and market validation.
Advanced Technical Capabilities: Supports 1-16 layer boards with 0.1mm mechanical drilling and 0.1mm laser microvias. Minimum 3.5mil/4mil trace/space (1mil/1mil for HDI). Enables complex designs for IoT, wearables, and high-speed applications.
Automated DFM Checks: Reduces design errors by 30%+ through pre-production validation, minimizing rework costs.
Transparent Pricing Model: Eliminates hidden costs, with small-batch discounts for prototypes <50pcs.
24/7 Engineering Support: Real-time technical assistance during design phase prevents costly production delays.
ISO-Certified Quality Control: Ensures reliability for medical/automotive applications with zero-defect tolerance.
Would you like to know what types ofPCB directoryare? Let’s explore FR4, Flexible, ceramic and metal core PCB directories through this blog together.
At Best Technology, we can provide you service:
Competitive Price & Premium Quality– Maximize your budget with cost-effective PCBs that meet stringent quality standards.
24 Hours Rapid Prototyping– Accelerates product development cycles.
Free DFM (Design for Manufacturability) Support -Prevents manufacturing errors before production.
Full Turnkey Solution-handle PCB fabrication to assembly, saving vendor coordination time cost and production cost.
Feel free to contact us if you have any inquiry for FR4 PCB, FPC PCB, ceramic PCB and MCPCB: sales@bestpcbs.com.
What Is PCB Directory?
PCB Directory is a professional online service platform dedicated to the global printed circuit board (PCB) industry. It aggregates resources from manufacturers, assembly providers, and design service firms, facilitating efficient supplier matching through parameter-based categorization (e.g., material type, layer count, thickness) and geographic filters. The platform supports specialized requirements such as flexible PCB and ceramic PCB, streamlining supply chain collaboration in electronics manufacturing and serving as a critical industry information hub.
Copper busbar plating is especially important for building a safe and durable electrical system. This blog is created to discuss the fundamentals of copper busbar plating, compares plating materials and processes, explores costs and applications, and shares ways to improve adhesion for long-term reliability.
Do these worries plague you constantly?
The lack of bonding of the plating?
Bad corrosion resistance of the plated layer?
Complicated plated layer process, high cost?
The problems can be solved with the following feasible solutions.
Adjust parameters of the plating solution and process.
Enhance surface pretreatment, for example, clear the copper busbar completely before plating, remove impurities, such as oil, oxides, etc, to improve the bonding strength of the plated layer and substrate.
Elevate the plated layer selection and the plated layer combination. And monitor the process parameter and ensure the plated layer performance via the microscope, hardness test, adhesion, and other testing methods.
Copper busbar plating is essential for stable power systems. By the way, copper busbar has been increasingly used in PCBs, and the copper busbar PCBs are mainly extensively used for high power, great reliability applications. The point is to improve conductivity, corrosion resistance, and soldering performance. At Best Technology, we help customers solve the headaches of PCB projects that customers face, with advanced plating methods and strict quality control. Best Technology is a quick-turn PCB manufacturer in China. If you would like to inquire about any PCB or PCBA price, just feel free to stay in contact with us by email sales@bestpcbs.com.
What is Copper Busbar Plating?
Copper busbar plating is the process of adding a protective metal layer onto copper bars. The main goals are corrosion protection, solderability, and durability. Tin, nickel, and silver are widely used depending on project needs. This layer also helps in harsh environments, where bare copper would quickly oxidize and lose efficiency.
What Material is Generally Used for Bus Bars?
Most busbars are made from copper because of its excellent conductivity and mechanical strength. Aluminum is also used for lightweight designs, but copper remains the choice for heavy-duty projects. When combined with plating, copper busbars achieve both high electrical performance and surface protection. This is why they are standard in substations, switchgear, and renewable energy projects.
What is the Difference Between a Nickel Plated Copper Busbar and a Tinplated Busbar?
A nickel plated copper busbar is strong against wear, temperature, and chemical exposure. It is widely used in automotive and aerospace fields. A tinplated busbar, on the other hand, is more common in general power distribution systems. It provides good conductivity at a lower cost. While nickel is chosen for endurance, tin balances performance with economy. Both finishes depend on solid adhesion to ensure long-term stability.
What is the Copper Busbar Tinning Process?
The copper busbar tinning process includes cleaning, activation, plating, and inspection. Electroplating gives thin and uniform coating, while hot dipping produces a thicker protective layer. Surface cleaning is vital. Without it, adhesion problems can appear. The plating must also be controlled under proper current and bath conditions. These steps make sure the tin layer bonds tightly with the copper surface.
Why Do Industries Prefer a Tin Plated Copper Bus Bar Over a Bare Copper Bus Bar?
Industries prefer a tin plated copper bus bar because it resists corrosion and extends service life. Bare copper forms oxide films that raise contact resistance. This can lead to heating, power loss, and poor reliability. A plated busbar reduces these risks. In humid or coastal regions, plating is almost always required. The extra protection saves cost by lowering maintenance and downtime.
How Does a Copper Busbar Plating Kit Help in Small-Scale or Custom Applications?
A copper busbar plating kit provides flexibility for small projects or custom orders. It allows engineers to plate parts without sending them to a factory. Kits often include cleaning tools, plating solution, and a power source. While not suitable for high-volume production, they help with prototypes and urgent repairs. For larger runs, industrial copper busbar tin plating machines are used for precision and consistency.
Why is Copper Busbar Plating Important in Electrical Systems?
Plating plays a key role in reliable power distribution. It prevents performance loss caused by corrosion or oxidation. In switchboards, renewable energy plants, and electric vehicles, copper bar plating ensures stable current flow. Strong adhesion makes this protection last longer. Without plating, systems face higher risks of failure, which can be costly to fix. For industries, plated busbars mean safer and more efficient operations.
How Much Does Copper Busbar Plating Cost for Industrial Projects?
Copper busbar plating cost varies with the coating type, thickness, and volume. Tin plating is the most economical choice. Nickel plating costs more but delivers longer durability. Silver is the premium option for high-frequency or low-resistance needs. The tinned copper busbar price remains attractive compared to the long-term savings. Investing in quality plating avoids higher expenses from frequent replacements or failures.
Why Should Engineers Consider the Copper Tin Plating Process for Long-Term Reliability?
The copper tin plating process provides reliable adhesion and balanced performance. It improves solderability, protects from corrosion, and ensures stable conductivity. Engineers choose tin plating when designing for outdoor or industrial settings. It gives strong resistance at an affordable cost. For many sectors, it is the preferred solution for balancing reliability with budget.
How to Improve Copper Busbar Plating Adhesion?
Improving adhesion requires attention to detail. First, clean and prepare the copper surface to remove oxides and grease. Second, control the plating bath with the right temperature and current. Third, apply post-treatment to seal and protect the surface. Using high-quality materials and equipment reduces the chance of peeling or weak bonding. At Best Technology, we invest in advanced plating lines and strict inspections. This approach helps customers overcome adhesion failures and secures stable, long-lasting busbars.
To sum up, copper busbar plating is more than a surface finish. It protect the PCBs from corrosion, oxidation, and maximizes efficiency. From tin-plated copper bar to a nickel-plated copper busbar, each option offers unique benefits. This blog has discussed copper busbar plating details, such as its meaning, significance, costs, and talk about how to perfect copper busbar plating adhesion as well. If you would like to explore more details about copper busbar plating, pls make contact with us at sales@bestpcbs.com or +86-755-2909-1601.
How to choose copper busbar material? Let’s discover its material datasheet, material grades and properties, material selection guide, difference between T1 and T2 busbar material through this blog.
Are you worried about these problems?
How to balance insufficient current-carrying capacity with cost?
How to ensure lifespan under high-current conditions?
Can non-standard designs be delivered quickly?
Best Technology can provide solutions:
High-Conductivity Copper: +15% conductivity with thinner design for cost reduction.
Welcome to contact us if you have any request for copper busbar: sales@bestpcbs.com.
What is Copper Busbar?
Copper Busbar is a rectangular, circular, or tubular copper conductor used in power systems for high-current transmission. As a core component in busbar trunks and grounding systems, it directly carries large currents. Its advantages include high conductivity (superior to aluminum), thermal conductivity, corrosion resistance, and mechanical strength, supporting complex installation needs. Surfaces are often tin/silver-plated for enhanced durability.
Copper Busbar Material Datasheet
Parameter Category
T1/TU1 (Oxygen-Free Copper)
T2 (Grade 2 Copper)
T3 (Grade 3 Copper)
TMY (Hard-State Copper)
Tin-Plated Copper (T2 Base)
Silver-Plated Copper (T2 Base)
Conductivity (%IACS)
≥101
≥100
≥98
≥97
≥98
≥99
Tensile Strength (MPa)
200–250
220–280
240–300
350–450
220–280
220–280
Elongation (%)
≥40
≥35
≥30
6–15
≥35
≥35
Hardness (HV)
40–60
45–65
50–70
100–120
45–65
45–65
Density (g/cm³)
8.94
8.89
8.85
8.89
8.89
8.89
Softening Temperature (°C)
200
190
180
150
190
190
Typical Standard
ASTM B152
GB/T 5585
GB/T 5231
IEC 60439
ASTM B33
ASTM B298
Common Copper Busbar Material Grade & Properties
T1 (Grade 1 Copper) / TU1 (Oxygen-Free Copper)
Properties: Ultra-high purity (≥99.95%), optimal conductivity/thermal conductivity, excellent plasticity (easy to bend/stretch), but low strength/hardness.
Properties: High purity (≥99.90%), good conductivity/thermal conductivity, excellent processability; contains trace oxygen (lower cost than T1).
Applications: Most common copper busbar material. Used in power distribution systems (switchgear, transformers), high-current conductors, and busbar connections.
T3 (Grade 3 Copper)
Properties: Purity ≥99.70%, slightly lower conductivity/thermal conductivity than T2, higher strength/hardness, good plasticity, lower cost.
Applications: Cost-sensitive or moderate strength needs (e.g., general-purpose electrical connections).
TMY (Hard-State Copper Busbar)
Properties: Typically T2 in hard (R) state. Cold-worked (rolled/drawn) for high strength/hardness, but reduced plasticity/conductivity.
Applications: Structural supports, rigid connections, vibration-resistant components (common in distribution cabinets).
Soft Copper (O-State Copper)
Properties: Annealed T2/TU1 in fully soft (O) state. Extremely pliable, highest conductivity (near-theoretical), but lowest strength.
Properties: Copper with trace alloying elements (Cd, Zr, Cr). Slight conductivity loss for high strength/hardness, wear resistance, and elevated-temperature stability.
Electrolytic Tough Pitch (ETP) copper (purity ≥99.9%) is the industry standard, offering ≥98% IACS conductivity for minimal energy loss.
Oxygen-Free Electronic (OFE) copper (purity ≥99.99%) is ideal for high-frequency applications (e.g., RF systems) due to its ultra-low oxygen content (<0.0005%), preventing oxide formation at joints.
Alloy avoidance:
Unless mechanical strength is critical (e.g., seismic zones), skip brass or copper alloys, as even 0.5% alloy addition can reduce conductivity by 5–10%.
2. Surface Treatment and Corrosion Resistance
Plating strategies:
Silver plating (2–5µm): Best for low-resistance contacts in high-current switches (e.g., circuit breakers), but requires laminating films to prevent scratching during installation.
Tin plating (5–10µm): Cost-effective for general-purpose use, offering sacrificial protection against oxidation. Avoid in acidic environments (pH <6).
Nickel plating (3–15µm): Resists sulfur-rich atmospheres (e.g., chemical plants) but increases contact resistance by 10–15%.
Edge finishing:
Deburr all edges with a 1.5mm radius minimum; use CNC machining for precision. Chamfer angles >45° reduce electric field concentration.
3. Sizing and Current-Carrying Capacity
Cross-sectional design:
Calculate using the formula: A = I × √(t) / (K × ΔT) (Where A = area (mm²), I = current (A), t = time (s), K = material constant (0.049 for copper), ΔT = temp rise (°C)).
Example: For 1000A over 1s with ΔT=30°C, A ≈ 1000 × 1 / (0.049 × 30) ≈ 680mm² (use 700mm² for safety).
Shape optimization:
Flat bars: Best for natural convection cooling (e.g., busbar trunks).
Hollow tubes: Reduce weight by 40% while maintaining 85% conductivity (ideal for aerospace).
4. Fabrication and Installation
Precision processing:
Use laser cutting for holes <3mm to avoid deformation. For bending, maintain a bend radius ≥2× thickness to prevent cracking.
Clean surfaces with isopropyl alcohol after machining to remove oil residues.
Connection best practices:
Copper-to-copper: Use friction welding for permanent joints (shear strength >200MPa).
Copper-to-aluminum: Apply zinc-based dielectric coating (e.g., Dow 17) before bolting to mitigate galvanic corrosion.
Insulation requirements:
Use silicone rubber (Class H, 180°C) for high-temp zones. For outdoor use, add UV-resistant coating.
5. System Compatibility and Standards
Standard alignment:
IEC 60439-1: Mandates busbar temperature rise ≤70°C under full load.
UL 758: Requires flammability rating V-0 for insulation materials.
Future-proofing:
Pre-drill M6/M8 holes with 10mm spacing for future branch connections.
Use modular busbar systems (e.g., plug-in units) for easy capacity upgrades.
6. Quality Assurance & Brand Trust
Inspection checklist:
Visual: No discoloration (blue/green patches indicate oxidation).
Dimensional: Use calipers to verify tolerance (±0.1mm for critical dimensions).
Bare copper busbar has increasingly been used in high-power applications such as energy storage systems, electric vehicle battery packs, renewable energy power distribution, and PCB interconnects for high-current circuits. In this blog, we will show you the definition, features, types, price, and application of the bare copper busbar.
Have you faced below complicated technical problems?
Difficult connection and bonding issues?
Complexity about processing and manufacturing?
Limitations about size and specification?
Potential problem with material and performance?
The particular solutions for the above problems are as follows.
Enhance connection process: Using innovative connection technique and employing superior quality connection material.
Boost manufacturing process: Adopting automation equipment and making tailored manufacturing solutions.
Upgrade material and design: Selecting the proper material and perfecting the design.
Providing technical support and service.
Bare copper busbar plays a vital role in modern electrical systems. It has diverse applications, including energy storage systems, electric vehicle (EV) battery packs, renewable energy power distribution, high current PCBs, and other uses. We are the source factory of bus bar PCBs. If you need any bus bar PCB for a specific application, just make contact with us at any moment via sales@bestpcbs.com.
What is Bare Copper Busbar?
A bare copper busbar is a solid strip of copper designed for electrical distribution. It conducts high current with minimal resistance. Due to its natural conductivity and durability, it is often the first choice in both industrial and electronic projects.
What are the Features of Electrical Copper Bus Bar?
The electrical copper bus bar offers high conductivity, strong mechanical strength, and excellent thermal stability. It supports high current loads without overheating. Its surface is smooth and easy to shape, which simplifies installation. Moreover, it can be customized into different thicknesses and sizes based on project requirements.
What are the Types of Bare Copper Busbar?
There are several types of bare copper busbars:
Flat Copper Busbar: Used for compact electrical assemblies.
Round Copper Busbar: Suitable for grounding and flexible routing.
Solid Copper Busbar: Designed for high mechanical stability and long service life.
Bare copper busbars are installed in switchgear, panel boards, power converters, and PCBs. They are also common in automotive, aerospace, and renewable energy systems. Thanks to their reliability, they serve as the backbone of both heavy power distribution and delicate circuit layouts.
How is the Copper Busbar Price?
The price of copper busbars depends on factors like copper market trends, busbar size, and customization level. Bare copper busbar price is usually higher than aluminum, but it offers better conductivity and durability. Many customers struggle with unclear quotations. Best Technology provides transparent pricing with detailed cost breakdowns to avoid hidden charges and build trust.
What are Copper Busbar Uses?
Copper busbar uses are wide-ranging. They conduct power in substations, distribute current in industrial plants, and provide grounding in sensitive electronics. In renewable energy, they connect solar inverters and wind turbines. In automotive and aerospace fields, they handle compact yet high-power systems. Their adaptability makes them a must-have in almost every electrical sector.
What Kind of PCBs will use Bare Copper Busbar?
High-current PCBs often require copper busbar integration. These include inverter boards, automotive control modules, and power supply units. By embedding busbars, engineers improve thermal management and reduce voltage drop. Best Technology specializes in producing PCB assemblies with embedded copper busbars, solving heat dissipation and current load challenges.
What are the Pros and Cons of Solid Copper Busbar?
Pros: Solid copper busbars offer high conductivity, excellent thermal stability, and long service life. They also resist corrosion and maintain performance under high loads.
Cons: The main drawback is higher cost compared to aluminum busbars. However, for long-term reliability and reduced maintenance, copper remains the preferred choice.
All in all, knowing the practical information about bare copper busbars will benefit engineers and manufacturers in optimizing high-current electrical projects and improving efficiency in power distribution applications. If you need any bus bar PCB pricing, pls get in contact with us directly at sales@bestpcbs.com.
