In today’s era of rapid technological development, electronic devices have become an indispensable part of our lives. Behind this, a new type of circuit board material, ceramic pcb, is gradually becoming the most favored object in the field of electronics.

What is a ceramic pcb?

Ceramic circuit board, as the name suggests, is a circuit board made of ceramic as the substrate. Compared with traditional organic circuit boards, ceramic pcb have many unique advantages. Ceramic materials have extremely high heat resistance, insulation and mechanical strength, and can work stably under extreme environmental conditions.

At the same time, ceramic pcb also have good thermal conductivity, which can effectively dissipate the heat generated by electronic components and improve the reliability and stability of electronic equipment.

Briefly describe the manufacturing process of ceramic pcb

The manufacturing process of ceramic pcbs is very complicated and requires multiple processes to complete.

First, it is necessary to select suitable ceramic materials, such as aluminum oxide, aluminum nitride, etc. These ceramic materials have different performance characteristics and can be selected according to specific application requirements.

Then, through precise processing technology, the ceramic material is made into the required shape and size. Next, advanced printing technology is used to print circuit graphics on the ceramic substrate.

Finally, through high-temperature sintering and other processes, the circuit pattern is fixed on the ceramic substrate to form a ceramic pcb.

What are the different types of ceramic PCB?

• Alumina ceramic PCB:

Alumina ceramic PCB is one of the most commonly used types of ceramic PCBs in the current market. It has the advantages of low price, good thermal conductivity, high resistance, high hardness, high electrical insulation, strong corrosion resistance, and high biocompatibility.

It is mainly used in white light, infrared, VCSEL LED lamps and other fields, usually used for 3W to 5W power LEDs. In the alumina PCB market, there are 75%, 96% and 99% alumina PCBs. The higher the purity, the better the performance, but the higher the cost.

• Aluminum nitride ceramic PCB:

The thermal conductivity of aluminum nitride ceramic PCB is 7 to 10 times higher than that of alumina PCB. It has the advantages of high thermal conductivity and resistance, high hardness, high mechanical strength, high electrical insulation, strong corrosion resistance, high biocompatibility, and thermal expansion coefficient close to Si.

It is considered to be the most promising ceramic PCB in the future and is widely used in high-power LEDs, power modules, laser fields, etc.

• Silicon nitride ceramic PCB:

Silicon nitride ceramic PCB has the advantages of high thermal conductivity, high strength, high fracture toughness, etc., and is mainly used in IGBT modules, vehicle modules, military industry, aerospace, aviation modules and other fields.

Unlike brittle traditional ceramic materials, at high temperatures, silicon nitride PCB has good mechanical strength and fracture toughness, and the thermal expansion coefficient matches that of Si. But the manufacture of silicon nitride PCB is not easy, the bonding of the circuit layer to the ceramic substrate is unstable, and the resistance and insulation are low.

• Silicon carbide ceramic PCB:

Silicon carbide ceramic PCB has the advantages of good strength even at 1400°C, extremely high thermal conductivity and resistance, good semiconductor conductivity, high hardness, etc.

Mainly used in the laser field, it is easy to work at 1000°C. At present, the manufacturing cost of silicon carbide PCB is extremely expensive, but with the advancement of manufacturing technology in the future, it is expected to be more widely used.

What are the advantages of ceramic pcb?

• 1. High thermal conductivity: Ceramic materials have good thermal conductivity and can effectively dissipate the heat generated by electronic components.

• 2. High insulation: Ceramic materials have extremely high insulation properties, which can effectively prevent short circuits and leakage between circuits.

• 3. High mechanical strength: Ceramic materials have high mechanical strength and can withstand large external forces and vibrations.

• 4. Good dimensional stability: The thermal expansion coefficient of ceramic materials is very small, and they can maintain dimensional stability under different temperature environments.

• 5. Good chemical stability: Ceramic materials have good chemical stability and can resist the erosion of various chemical substances.

What are the application areas of ceramic pcb?

• 1. LED lighting: Since LED lamps generate a lot of heat when working, circuit boards with good thermal conductivity are needed to dissipate heat.

• 2. Power electronics: Power electronic devices usually need to withstand high voltages and high currents, so circuit boards with good insulation and mechanical strength are needed.

• 3. Aerospace: The aerospace field has very high requirements for the reliability and stability of electronic equipment, so it is necessary to use circuit boards with good heat resistance, insulation and mechanical strength.

• 4. Medical equipment: Medical equipment has very high requirements for the safety and reliability of electronic equipment, so it is necessary to use circuit boards with good insulation and chemical stability.

• 5. Communication equipment: Communication equipment has very high requirements for the high-frequency performance and stability of electronic equipment, so it is necessary to use circuit boards with good high-frequency performance and dimensional stability.

How thick is ceramic PCB?

The thickness of ceramic PCB varies depending on different types and application scenarios. Generally speaking, the thickness of common ceramic PCBs ranges from 0.25mm to 1.5mm.

The thickness of alumina ceramic PCBs is usually 0.5mm – 1.5mm. Alumina ceramics are widely used because of their low cost, and the choice of board thickness usually depends on the specific application requirements.

In some occasions where space requirements are not high but a certain mechanical strength is required, thicker alumina ceramic PCBs may be selected, such as 1.2mm or 1.5mm thickness. In some small electronic devices with limited space, thinner alumina ceramic PCBs, such as 0.5mm or 0.8mm thickness, may be selected.

The thickness of aluminum nitride ceramic PCB is relatively thin, generally between 0.25mm – 1.0mm.

Aluminum nitride has better thermal performance, but it is also more expensive. Due to its high thermal conductivity, in some applications with extremely high heat dissipation requirements, such as heat dissipation substrates for high-power semiconductor chips, thinner aluminum nitride ceramic PCBs may be selected to achieve better heat dissipation and more compact design.

In some high-end electronic devices, aluminum nitride ceramic PCBs with a thickness of 0.5mm or 0.6mm may be used.

In short, the thickness of ceramic PCBs has a certain flexibility and can be selected according to specific application scenarios and performance requirements.

At what temperature does ceramic PCB melt?

Ceramic PCBs usually do not “melt” like metals.

Ceramic materials have very high melting points, such as the melting point of alumina ceramics is about 2050℃, and the melting point of aluminum nitride ceramics is about 2200℃. In the normal use environment of electronic equipment, ceramic PCBs will hardly reach such high temperatures.

It should be noted that although the ceramic PCB itself will not melt, the metal circuits, solder, etc. on it may change or be damaged at too high a temperature.

As an innovative treasure in the field of electronics, ceramic pcbs have many unique advantages and broad application prospects. It is believed that in the near future, ceramic pcbswill become the mainstream circuit board material in the electronics field and make greater contributions to the development of electronic technology.

In this ever-changing era, electronic devices are changing our lives at an unprecedented speed. From smartphones to cars to industrial automation equipment, these products all hide an important component – ceramic printed circuit boards (Ceramic PCBs).

What are the commonly used materials for ceramic PCB substrates?

Imagine that in a tiny space, there are countless electronic components, which are closely arranged and interconnected to form a complex and sophisticated network. This is the working environment of ceramic PCBs. In order to ensure that these components can work normally under harsh conditions such as high temperature and high pressure, it is crucial to choose a suitable substrate.

Commonly used ceramic PCB substrates are mainly the following:

1. Alumina (Al2O3):

• It is one of the preferred materials for its excellent insulation performance, good thermal conductivity and high mechanical strength.

• Alumina substrates are usually used to make single-layer ceramic PCBs, which are suitable for applications under medium temperature and pressure conditions.

• It has extremely high chemical stability and is not easy to react with other substances, thus ensuring the long-term reliability of the circuit.

2. Aluminum nitride (AlN):

• Compared with aluminum oxide, aluminum nitride has higher thermal conductivity and can dissipate heat more effectively, making it an ideal choice for manufacturing high-performance electronic products.

• Aluminum nitride substrates are often used to make double-layer or multi-layer ceramic PCBs, especially for high-frequency signal transmission and high power density applications.

• In fields such as semiconductor packaging and LED lighting, the outstanding performance of aluminum nitride makes it one of the indispensable materials.

3. Silicon nitride (Si3N4):

• It is known for its excellent heat resistance and chemical stability, and it still performs well in extreme environments.

• Silicon nitride substrates not only have extremely high mechanical strength, but also can withstand a higher temperature range. They are widely used in demanding scenarios such as aerospace, automotive electronics and military equipment.

What are the commonly used conductor materials for ceramic PCBs?

Conductor materials play an extremely important role in ceramic PCBs. They are responsible for transmitting signals and electricity and are the link between various functional modules.

Common conductor materials include precious metals such as copper, gold, and silver, as well as nickel plating. Among them, copper is widely used for its good conductivity and affordable price; gold shines in high-end applications for its excellent corrosion resistance; silver is between the two, combining cost-effectiveness and reliability.

• As the most commonly used conductor material, copper foil is soft enough to easily combine with ceramic substrates to form a durable circuit path.

• Gold foil is mainly used in occasions that require high reliability and long life, such as aerospace, medical equipment, etc. The oxidation resistance and corrosion resistance of gold enable it to maintain stable electrical performance in extreme environments, ensuring the normal operation of key components.

• Silver foil is widely used in mid- and low-end products due to its good conductivity and low cost. Silver’s conductivity is second only to gold, but it is more affordable in terms of cost and is suitable for large-scale production and application. In certain specific fields, such as high-frequency circuits and wireless communication equipment, silver foil can also play an important role.

What are the types of ceramic PCBs?

With the advancement of technology, ceramic PCBs have also developed into various types to adapt to various application scenarios:

1. Single-layer ceramic PCB:

• Simple structure, low cost, suitable for occasions with low performance requirements.

• This type of PCB usually has only one layer of ceramic substrate, on which a layer of conductor material is laid to form a basic circuit layout.

• Single-layer ceramic PCBs are mainly used for entry-level electronic products, such as ordinary household appliances and basic communication equipment.

2. Double-layer or multi-layer ceramic PCB:

• By stacking multiple layers of ceramic substrates and setting interconnection channels between them, more complex circuit designs can be achieved, which is suitable for high-end products that require high-density integration.

• This type of PCB can accommodate more electronic components and more complex circuit structures, and is widely used in high-performance computing, advanced medical equipment and high-end automotive electronic systems.

• Multilayer ceramic PCBs have high design flexibility and can be customized according to specific needs to achieve optimal performance.

3. Hybrid ceramic PCB:

• Combining ceramic substrates of different materials, giving full play to their respective advantages, suitable for use in special environments.

• This type of PCB usually uses two or more ceramic materials, such as a combination of alumina and aluminum nitride, which can ensure good thermal conductivity and provide sufficient mechanical strength.

• Hybrid ceramic PCBs are suitable for applications with extreme temperature changes and high pressure conditions, such as deep-sea exploration equipment and space exploration instruments.

Advantages and characteristics of ceramic PCB

The reason why ceramic PCBs stand out among many materials is inseparable from their unique advantages:

High temperature resistance:

• It can remain stable at temperatures up to 1000℃, making it an ideal choice for high-temperature working environments.

• Ceramic materials themselves have extremely high melting points and are not easy to deform or damage even under extremely high temperature conditions, which enables ceramic PCBs to operate reliably in extreme environments.

High reliability:

• It will not deform or damage even under long-term exposure to extreme conditions, ensuring the continuous and reliable operation of the system.

• Ceramic materials have high chemical stability and are not easy to react with other substances, so they can maintain stable electrical performance in harsh environments.

Excellent thermal management capabilities:

• Efficient heat dissipation helps to extend the life of components and improve overall efficiency.

• The high thermal conductivity of ceramic materials enables it to quickly conduct heat away, effectively reducing the temperature of the circuit board, thereby improving the reliability and service life of the system.

Environmentally friendly and pollution-free:

• The production process meets green environmental protection standards and is easy to recycle and reuse after disposal.

• The production process of ceramic PCBs produces less waste, and the discarded materials can be recycled, which is in line with the concept of sustainable development.

These characteristics make ceramic PCBs an important force in promoting scientific and technological progress, and continue to lead the industry to a higher level.

What are the applications of ceramic PCBs?

From aerospace to medical equipment, from automotive electronics to communication facilities, ceramic PCBs are everywhere.

In satellite navigation systems, ceramic PCBs ensure positioning accuracy with their reliable signal transmission capabilities; in medical devices such as pacemakers, they rely on their ability to accurately control current to protect patient safety. In addition, in the construction of 5G base stations, ceramic PCBs also play an irreplaceable role, supporting the demand for high-speed data transmission.

Specific application cases are as follows:

• 1. Aerospace: In satellite communication systems, the high reliability of ceramic PCBs ensures the accuracy of data transmission. During long-term flight, ceramic PCBs can resist extreme temperature changes, maintain stable electrical performance, and ensure unimpeded communication between satellites and ground stations.

• 2. Medical equipment: In implantable medical devices such as pacemakers, the miniaturization and high reliability of ceramic PCBs become key factors. Ceramic materials have good biocompatibility and will not have adverse effects on human tissues. At the same time, they can provide precise current control to ensure therapeutic effects.

• 3. Automotive electronics: In modern automobiles, ceramic PCBs are widely used in key components such as engine control systems, sensors, and navigation systems. The high temperature resistance of ceramic PCBs enables it to operate reliably in high-temperature environments in the engine compartment, ensuring the safety and comfort of the vehicle.

• 4. 5G communication: In the construction and maintenance of 5G base stations, the efficient heat dissipation capacity and high-density integration characteristics of ceramic PCBs make them an ideal choice. Ceramic PCBs can handle a large number of data transmission tasks and ensure the high-speed and stable operation of 5G networks.

What is the production process of ceramic PCB?

The production process of ceramic PCBs is very delicate, and every step needs to be strictly controlled to ensure the high quality of the final product.

• 1. Raw material preparation: First, the required ceramic powder and other raw materials need to be prepared to ensure their purity and uniformity.

• 2. Molding: The ceramic powder is made into a substrate by pressing or casting. The temperature and pressure need to be strictly controlled during the molding process to ensure the flatness and consistency of the substrate.

• 3. Sintering: The formed substrate is placed in a high-temperature furnace for sintering. The sintering process requires precise control of the temperature curve to ensure the density and stability of the ceramic substrate.

• 4. Metallization: A layer of conductor material such as copper, gold or silver is applied to the ceramic substrate by electroplating, spraying or other means. This process requires highly precise operation to ensure the uniform distribution and good adhesion of the conductor layer.

• 5. Circuit design and etching: According to the circuit design drawings, etching is performed on the conductor layer to form the required circuit pattern. The etching process requires the use of special chemicals, and the time and temperature need to be precisely controlled to ensure the accuracy and clarity of the circuit pattern.

• 6. Testing and inspection: Finally, the completed ceramic PCB is fully tested and inspected to ensure that its electrical and mechanical properties meet the design requirements. The test items include resistance, voltage, current and other indicators.

Through this series of fine process flows, ceramic PCBs have excellent performance and reliability and have become an indispensable part of the electronics industry.

What are the development trends and prospects of ceramic PCBs?

With the continuous advancement of science and technology and the growing social needs, ceramic PCBs are also constantly developing and improving. In the future, ceramic PCBs will show greater potential in the following aspects:

• 1. Miniaturization and integration: As electronic products develop towards smaller and higher integration, ceramic PCBs will continue to shrink in size while accommodating more electronic components. This means achieving more complex functions in a limited space and improving the performance of the overall system.

• 2. High performance and high reliability: In the future, ceramic PCBs will pay more attention to high performance and high reliability, especially in applications under extreme environments. The application of new materials and new technologies will further enhance the temperature resistance, mechanical strength and electrical stability of ceramic PCBs, enabling them to play a role in a wider range of fields.

• 3. Environmental protection and sustainable development: As the global awareness of environmental protection increases, the production process of ceramic PCBs will pay more attention to environmental protection and sustainable development. The research and development and application of new environmentally friendly materials will become an important direction to reduce the impact on the environment.

• 4. Intelligence and automation: Ceramic PCBs in the future will be more intelligent and automated. By introducing advanced manufacturing technology and intelligent control systems, production efficiency and product quality can be further improved, costs can be reduced, and market demand can be better met.

In short, as an advanced electronic material, ceramic PCBs have unique advantages and broad application prospects, making them an important force in promoting scientific and technological progress. With the continuous advancement of technology and changes in social needs, ceramic PCBs will continue to show greater potential and development space in various fields.

In this field full of innovation and challenges, ceramic base pcb have quietly emerged and quickly attracted the attention of the industry with their excellent performance and broad application prospects.

What is a ceramic base pcb?

Ceramic base pcb are made of ceramic as the matrix material through complex and sophisticated processes. This type of circuit board has many unique properties, which makes it widely used in many fields.

Ceramic substrates are easier to break than glass fiber boards, and the process is more difficult than ordinary PCB boards, and the process technology requirements are high. In the production process, there are important process links such as drilling, copper coating, and etching.

The copper coating process plays a key role in the ceramic substrate PCB process. The commonly used copper coating processes are DBC process and DPC process. In the DPC process, the electroplating process is adopted, and the adhesion layer and seed layer are formed on the ceramic surface through the sputtering process to increase the adhesion strength of the metal circuit and play a conductive role.

The etching of ceramic-based circuit boards is divided into inner layer etching and outer layer etching. Different etching methods have different processes and characteristics. At the same time, some problems may occur in the etching process, such as incomplete film removal, board surface oxidation, incomplete copper etching, excessive copper etching, etc., and corresponding improvement methods need to be adopted.

In short, ceramic base pcb occupy an important position in the electronics field due to their unique properties and complex manufacturing processes.

What are the different types of ceramic PCB?

(I) Classification by material

• Alumina ceramic substrates are the most commonly used substrate materials in the electronics industry. They have high strength and chemical stability, rich raw material sources, and are suitable for various technical manufacturing and different shapes.

• Beryllium oxide ceramic substrates have a higher thermal conductivity than metal aluminum and are used in situations where high thermal conductivity is required, but the temperature drops rapidly after exceeding 300°C, and their toxicity limits their own development.

• Aluminum nitride ceramic substrates have high thermal conductivity and expansion coefficients that match Si, and are ideal large-scale integrated circuit heat dissipation substrates and packaging materials.

• Silicon nitride ceramic substrates have higher mechanical strength than other ceramics and can achieve long life in harsh working environments and HEV/EV and other renewable energy application conditions.

(II) Classification by process

• Thick film ceramic PCBs use screen printing technology to coat metal slurry on the surface of ceramic substrates, which are dried and sintered at high temperature. Its advantage is that the process is relatively simple and the cost is low.

• Low-temperature co-fired ceramic (LTCC) PCB first mixes inorganic alumina powder with about 30% – 50% glass material and organic binder to make a slurry, scrapes it into sheets to form a green embryo, then drills through holes according to the design of each layer, uses screen printing technology to fill holes and print circuits, and finally sintered at 850 – 900℃.

• High-temperature co-fired ceramic (HTCC) PCB first adds ceramic powder to an organic binder to make a paste slurry, scrapes it into sheets to form a green embryo, then drills through holes, uses screen printing technology to fill holes and print circuits, and sintered at 1300 – 1600℃.

What are the characteristics of ceramic base pcb?

(I) Performance advantages

• First, it has strong mechanical stress, can maintain a stable shape in various complex use environments, and is not easily deformed by external forces.

• High thermal conductivity is one of its notable features. For example, the thermal conductivity of alumina ceramic substrates is between 28 and 35 W/(m・K), and the theoretical thermal conductivity of aluminum nitride ceramic substrates at room temperature is 319W/(m・K), which allows the heat generated by electronic components to be quickly dissipated, effectively avoiding circuit failures caused by local overheating.

• High insulation ensures the safe and stable operation of the circuit and prevents leakage. Good thermal cycle performance is also one of its advantages, with a cycle number of up to 50,000 times and high reliability.

• In an environment with extreme temperature changes, ceramic base pcb can still maintain stable performance, which is crucial for some electronic devices that need to work in harsh environments.

(II) Comparison with traditional PCBs

Compared with conventional PCBs, ceramic base pcb have obvious advantages.

• In terms of thermal conductivity, traditional PCBs usually require heat dissipation holes, inner metal planes, heat dissipation platforms, and active cooling devices such as fans to remove heat from hot components. However, ceramic base pcb, with their high thermal conductivity, do not require these additional components and can easily transfer heat to active cooling components, thermal landings, or device packaging.

• In terms of mechanical strength, ceramic base pcb have higher compressive strength and surface hardness, higher durability, and longer service life.

• In terms of corrosion resistance, ceramic materials are extremely resistant to most chemicals and are suitable for applications in harsh environments.

However, ceramic base pcb also have some disadvantages.

• The cost is higher than that of standard PCBs, which is due to the relatively complex materials and manufacturing processes.

• Reduced availability, because the current production scale of ceramic base pcb is relatively small and the manufacturing difficulty is relatively high.

• Fragility is one of the main disadvantages of ceramic base pcb, and currently only small-area circuit boards can be manufactured.

Manufacturing process of ceramic base pcb

(I) Drilling process

Ceramic substrates are generally drilled by laser. Laser drilling technology has many advantages over traditional drilling technology, such as high precision, high surface flatness, roughness of 0.1μm~0.3μm, laser drilling aperture of 0.15mm-0.5mm, and even below 0.06mm.

(II) Copper coating process

Commonly used copper coating processes include DBC process and DPC process.

In the DPC process, electroplating process is adopted. Copper coating refers to covering the area without wiring on the circuit board with copper foil, which is connected to the ground wire to increase the ground wire area, reduce the loop area, reduce the voltage drop, and improve the power supply efficiency and anti-interference ability.

In addition to reducing the ground wire impedance, copper coating also has the functions of reducing the loop cross-sectional area and enhancing the signal mirror loop.

Therefore, the copper coating process plays a very critical role in the ceramic substrate PCB process. Incomplete, truncated mirror loop or incorrectly positioned copper layer often leads to new interference, which has a negative impact on the use of the circuit board.

(III) Etching process

The etching of ceramic substrates is divided into inner layer etching and outer layer etching. The inner layer etching adopts acid etching, and wet film or dry film is used as resist; the outer layer etching adopts alkaline etching, and tin-lead is used as resist.

1. The alkaline etching process is as follows:

• Defilming: Use film stripping liquid to remove the film on the circuit board surface to expose the unprocessed copper surface.

• Etching: Use etching liquid to etch away the unnecessary bottom copper, leaving a thickened circuit.

• New washing liquid: Use monohydrated ammonia without copper ions, and use ammonium chloride solution to remove the residual liquid on the board surface.

• Hole filling: Mainly remove excess palladium ions in non-plated through holes to prevent gold ions from being deposited in the gold immersion process.

• Tin stripping: Use nitric acid solution to strip the tin-lead layer.

2. Acid copper chloride etching process:

• Development: Use sodium carbonate to dissolve the part of the dry film that has not been irradiated by ultraviolet light, and retain the part that has been irradiated.

• Etching: According to a certain proportion of solution, the copper surface exposed to the outside after the dry film or wet film is dissolved is dissolved with acidic copper chloride etching solution.

• Film stripping: According to a certain proportion of solution, the protective film on the circuit is dissolved under a specific temperature and speed environment.

Common problems and improvement methods of etching process:

• 1. Incomplete film stripping: It may be that the film stripping solution concentration is not enough or the operation time is insufficient. It is necessary to adjust the film stripping solution concentration or extend the operation time.

• 2. Board surface oxidation: It may be that the exposure time is too long or the ambient humidity is high during the etching process. The exposure time should be shortened as much as possible and the ambient humidity should be controlled.

• 3. Incomplete copper etching: It may be that the etching solution concentration is low or the etching time is short. The etching solution concentration needs to be increased or the etching time needs to be extended.

• 4. Excessive copper etching: It may be that the etching time is too long or the etching solution concentration is too high. The etching time should be reduced or the etching solution concentration should be reduced.

What is a ceramic PCB used for?

(I) High-frequency applications

Ceramic base pcb perform well in high-frequency applications. Due to its high dielectric constant and low dielectric loss tangent value, it can maintain good stability and reliability in high-frequency signal transmission.

In high-frequency electronic equipment such as mobile phones, microwave ovens, radars, communication equipment and other fields, ceramic base pcb can effectively reduce noise interference and improve signal transmission quality. In addition, ceramic base pcb can withstand higher output power to meet the power requirements of high-frequency equipment.

(II) Aerospace

ceramic base pcb have important application value in the aerospace field. Its thermal expansion coefficient is very close to silicon and much lower than most common metals, which enables it to work well with other electronic components in an environment with extreme temperature changes and will not damage the chip due to thermal expansion and contraction.

In key parts of aircraft electronic equipment, navigation systems, rocket engines, etc., ceramic base pcb can withstand harsh environments such as high temperature, high pressure, radiation, and corrosion to ensure the reliability of the equipment.

(III) Other fields

ceramic base pcb are also widely used in power devices, communication substrates, mobile phone application module substrates, automotive electronic substrates and other fields.

In the field of power devices, such as the power electronic system of electric vehicles, DPC ceramic circuit boards, as ideal electronic substrates, play an important role in battery management systems, motor drive systems and fast charging systems.

In terms of communication substrates, ceramic substrates, that is, high-frequency filters used in high-frequency ceramic substrates, are used in 5G network equipment. They have low high-frequency loss and low dielectric constant. The dielectric loss of signals propagating in them can reach the lowest among all current PCBs, which is particularly suitable for high-frequency communications such as 5G.

In the mobile phone application module substrate, ceramic base pcb can meet the requirements of mobile phones for miniaturization and high performance. In the field of automotive electronic substrates, new energy vehicles have high requirements for heat dissipation. Ceramic substrates have good heat dissipation effects and can dissipate high heat in the power system in time to ensure the normal operation of large power loads.

Development prospects of ceramic base pcb

(I) Market size growth

In recent years, the market size of ceramic base pcb has shown a trend of continuous growth.

First, with the development of miniaturization, high performance and multi-functionality of electronic equipment, the requirements for heat dissipation performance, insulation performance and high-frequency characteristics of circuit boards are getting higher and higher.

Secondly, technological progress has driven the cost reduction and production efficiency improvement of ceramic base pcb, which will further promote the expansion of its market size.

Finally, the continuous emergence of emerging application fields has also brought a broad market space for ceramic base pcb.

(II) Industry challenges and opportunities

Technical barriers: The ceramic base pcb industry is a technology-intensive industry. Its research and development and production require knowledge of multiple disciplines such as electronics, computers, materials, and chemicals, and there are many product types, long processes, and complex process technologies.

Fundamental barriers: The ceramic base pcb industry has complex process technologies, many links, and high customization requirements. In the early stage, a large amount of capital investment is required for the purchase of equipment, new plant buildings and supporting facilities, procurement of raw materials, and the employment of R&D and production personnel.

Talent barriers: The ceramic circuit board industry is highly professional. Technical and R&D personnel not only need to have professional knowledge in multiple fields, but also need to have a deep understanding and familiarity with product applications, process flows, equipment improvements, etc.

In summary, although the ceramic base pcb industry faces many challenges, it has also ushered in rare development opportunities. Driven by policy support, market demand growth, and technological innovation, the ceramic base pcb industry is expected to achieve sustained and rapid development.