In the world of printed circuit board (PCB), ceramic PCB stands out as a reliable choice for applications requiring superior thermal conductivity, high-frequency performance, and robust electrical insulation. Ceramic multilayer PCB, in particular, offers an added advantage by combining multiple layers of ceramic material to enhance the performance and reliability of electronic devices. In this article, we’ll explore what ceramic PCBs is, its different types, and its specific advantages compared to other materials like FR4.
What is a Ceramic PCB?
A ceramic PCB is a type of printed circuit board made using ceramic materials instead of traditional fiberglass-based boards. Ceramic substrates are known for their excellent thermal conductivity, high dielectric strength, and resistance to high temperatures. These properties make ceramic PCBs ideal for use in high-performance electronic devices that need to withstand extreme conditions. Ceramic PCB is widely used in applications like power electronics, automotive electronics, and telecommunications, where heat dissipation and stability are critical. Unlike FR4, which is a common base material for most PCBs, ceramic materials can handle much higher operating temperatures, which is essential in many industrial applications.
What Are the Different Types of Ceramic PCB?
There are several types of ceramic PCBs, each with unique properties that cater to specific needs. Here are the most commonly used: 1. Alumina (Al2O3) PCBs: Alumina ceramic PCBs are the most common type. They are highly versatile and used in various applications, from consumer electronics to medical devices. 2. Aluminum Nitride (AlN) PCBs: Known for their outstanding thermal conductivity, AlN ceramic PCBs are often used in high-power applications like LED lighting, automotive systems, and power supplies. 3. Beryllium Oxide (BeO) PCBs: These PCBs are excellent in terms of thermal conductivity and electrical insulation. They are commonly used in high-frequency applications such as microwave systems. 4. Silicon Nitride (Si3N4) PCBs: These are known for their strength and thermal stability. Silicon Nitride PCBs are often used in devices that require a combination of electrical insulation and heat resistance. Each type of ceramic material has its own set of advantages, and selecting the right one depends on factors like the operating temperature, power requirements, and the environment in which the PCB will be used.
What is the Difference Between Ceramic Substrate and FR4?
Ceramic substrates and FR4 serve similar functions in PCBs, but they differ in their material properties. FR4 is a glass-reinforced epoxy laminate, typically used in most PCBs due to its cost-effectiveness and ease of fabrication. However, it doesn’t perform well in high-temperature or high-frequency applications. On the other hand, ceramic substrates, like alumina, have a much higher thermal conductivity and can withstand much higher temperatures, making them ideal for applications that require robust heat management. Additionally, ceramic substrates have superior electrical insulation properties compared to FR4, which is a key factor in high-power and high-voltage circuits. In short, while FR4 is affordable and effective for everyday applications, ceramic substrates are preferred for demanding environments where thermal management and high-frequency performance are essential.
How Thick is Ceramic PCB?
The thickness of ceramic PCBs can vary depending on the application and the type of ceramic material used. Typically, ceramic PCBs range in thickness from 0.25mm to 3.0mm, but thicker versions are possible for applications requiring more robust structural support or additional layers for signal routing. The thickness also impacts the overall thermal conductivity of the board. Thicker ceramic PCBs provide better heat dissipation but may also reduce the flexibility for complex circuit designs. Choosing the right thickness is critical to ensure optimal performance and efficiency in the final product.
What is the Thermal Conductivity of Ceramic PCB?
One of the standout features of ceramic PCBs is their thermal conductivity. Ceramic materials like aluminum nitride, beryllium oxide, and alumina have significantly higher thermal conductivity compared to traditional PCB materials like FR4. For example, aluminum nitride has a thermal conductivity of around 170 W/m·K, while alumina is typically around 30 W/m·K. This high thermal conductivity allows ceramic PCBs to efficiently dissipate heat, preventing overheating and damage to sensitive components in high-power applications. In contrast, FR4 has relatively low thermal conductivity, which limits its use in environments where heat management is crucial.
How Are Ceramic PCBs Made?
The manufacturing process of ceramic PCBs is quite different from traditional FR4-based PCBs. Here’s a simplified overview of the process: 1. Substrate Preparation: The ceramic material is first prepared, typically in the form of thin ceramic sheets. The material is chosen based on its thermal and electrical properties. 2. Layering: For multilayer ceramic PCBs, multiple layers of ceramic material are stacked together. These layers are often coated with a conductive metal layer, such as copper, to create the circuitry. 3. Etching: The copper layers are then etched to form the desired circuit pattern. This process is similar to traditional PCB manufacturing but requires special equipment due to the hardness of the ceramic materials. 4. Firing: The entire assembly is fired in a kiln to ensure that the layers bond together and the copper traces are firmly attached to the ceramic substrate. 5. Testing: Finally, the ceramic PCB is tested for electrical performance, thermal conductivity, and structural integrity. This ensures the board meets the required standards for its intended application.
What is a Ceramic Substrate Used For?
Ceramic substrates are used in a wide range of applications due to their excellent thermal management, electrical insulation, and mechanical strength. Some common uses include: Power Electronics: Ceramic substrates are used in power semiconductors, where heat management is critical for performance. LED Lighting: The high thermal conductivity of ceramic substrates makes them perfect for LED assemblies, where efficient heat dissipation is essential for long-term reliability. Telecommunications: Ceramic PCBs are used in high-frequency circuits, such as microwave and RF applications, where their low signal loss and thermal stability are advantageous. Automotive Electronics: The demanding environment in automotive electronics calls for ceramic substrates that can withstand high temperatures and vibrations while ensuring reliable electrical performance. The versatility of ceramic substrates makes them an essential component in industries that demand high-performance, reliable electronics.
Ceramic multilayer PCBs offer a range of advantages, from superior thermal conductivity to electrical insulation and high-frequency performance. They are well-suited for applications where reliability and durability are paramount, such as in power electronics, telecommunications, and automotive systems. While ceramic PCBs may be more expensive than traditional FR4 boards, their performance benefits often outweigh the cost in high-performance applications. Whether you’re designing a high-power LED system, a complex RF circuit, or any other advanced electronic device, ceramic PCBs provide the stability, heat dissipation, and electrical insulation needed for long-lasting and efficient operation. If you’re in need of ceramic PCBs, Best Technology can provide high-quality, customized solutions tailored to your specific requirements. Reach out to us at sales@bestpcbs.com to learn more about how we can support your project with advanced ceramic PCB technology.
Aluminum base PCB (Printed Circuit Board) is an essential part of modern electronics, particularly for applications where heat dissipation is critical. These PCBs are designed to provide effective heat management, which is why they are widely used in high-power LED systems, automotive electronics, and other devices that generate significant heat. In this article, we’ll explore the key features of aluminum base PCBs, including their thermal properties, construction, and benefits compared to other PCB materials.
What is Aluminum PCB?
An aluminum PCB is a type of metal-based PCB that uses an aluminum substrate to provide better thermal conductivity. The aluminum material acts as both a conductor for electrical signals and a heat sink to dissipate heat away from sensitive components. Aluminum PCBs are typically used in high-power applications where managing heat is a crucial concern, such as in LED lighting, power supplies, and automotive electronics.
The design of aluminum base PCBs consists of three layers: the copper layer, the dielectric layer, and the aluminum base. The copper layer carries the electrical signals, while the dielectric layer insulates and binds the copper to the aluminum base. This combination ensures both electrical efficiency and heat management.
What is the Thermal Resistance of Aluminum PCB?
The thermal resistance of an aluminum PCB refers to how well the PCB can resist heat transfer. In most cases, aluminum PCBs have a low thermal resistance, meaning they efficiently transfer heat away from the components. The thermal resistance of aluminum substrates is usually between 1.0 and 3.2℃/W. Most aluminum substrates have a thermal resistance greater than 1℃/W, while high thermal conductivity aluminum substrates have a thermal resistance less than 0.5℃/W or lower. For example, the thermal resistance of a tin-sprayed aluminum substrate can reach 1.7℃/W or 3.2℃/W. The specific thermal resistance can depend on the thickness of the copper and dielectric layers, but generally, aluminum PCBs are known for their superior heat dissipation properties.
In comparison to traditional FR4 PCBs, aluminum-based PCBs offer much better thermal management, making them a popular choice for power-hungry devices like high-power LEDs. This efficient heat dissipation helps to maintain the stability and performance of the device, preventing overheating and reducing the risk of failure.
What is the Maximum Temperature for Aluminum PCB?
The maximum temperature an aluminum PCB can withstand depends on the design and the materials used. However, most aluminum base PCBs can operate effectively at temperatures ranging from -40°C to 150°C(Even higher, but may be limited in long-term use). Some specialized designs can even handle more higher temperatures.
Aluminum PCBs are often chosen for their ability to operate in high-temperature environments without compromising performance. This makes them an excellent choice for industries like automotive, telecommunications, and lighting, where high temperatures are common.
How Thick is Aluminum PCB?
The thickness of an aluminum PCB can vary depending on its application and the heat dissipation requirements. Typically, the aluminum base layer ranges from 0.8mm to 3.0mm, with thicker layers providing better heat dissipation. The thickness of the copper layer also plays a role, as thicker copper helps to better handle high-power applications.
For instance, a 12w LED aluminum base PCB would typically use a copper thickness of about 1 oz/ft² to 2 oz/ft², whereas a 25w LED aluminum base PCB would require a thicker copper layer to handle the increased power. Thicker aluminum layers are used in devices that generate significant heat, such as LED drivers and power supplies.
What is the Difference Between FR4 and Aluminum PCB?
The primary difference between FR4 PCBs and aluminum PCBs lies in their substrate material. FR4 is a composite material made of woven fiberglass and epoxy resin, while aluminum PCB uses aluminum as the base layer.
FR4 is widely used for general applications because it is cost-effective and offers good electrical insulation. However, it doesn’t provide the same level of heat dissipation as aluminum PCBs. Aluminum-based PCBs, on the other hand, are specifically designed to manage heat more effectively, which is why they are preferred for high-power applications like aluminum base LED PCBs and metal-based aluminum PCBs.
Another key difference is that aluminum PCBs are generally thicker and more rigid than FR4 boards, offering better mechanical strength. While FR4 is a great choice for lower-power devices, aluminum PCBs are the go-to solution for heat-intensive applications. Best Technology stands out by providing customized, high-quality products with quick turnaround times, all backed by our top-tier customer service.
What is the Best PCB Material for Heat Dissipation?
Aluminum is the best material for heat dissipation when it comes to PCBs. Aluminum base PCBs excel in transferring heat away from sensitive components, ensuring that devices do not overheat during operation. Other materials like copper and ceramic also have good thermal properties, but aluminum provides a balanced combination of cost, performance, and manufacturability.
For high-power devices like LED aluminum base PCBs or metal-based aluminum PCB boards, aluminum is the material of choice due to its excellent thermal conductivity, which helps maintain the optimal performance and longevity of the device.
How Do Aluminum PCBs Work?
Aluminum PCBs work by using the aluminum base to conduct heat away from the components mounted on the board. When an electronic component, such as an LED, operates, it generates heat. In a traditional PCB made from materials like FR4, this heat can build up, causing the components to overheat and potentially fail.
With aluminum PCBs, the heat generated by the components is quickly transferred through the copper and dielectric layers to the aluminum base. From there, the heat is dissipated into the surrounding environment, preventing overheating. This process ensures that the components remain within their safe operating temperature range, thus improving the reliability and lifespan of the device.
For example, aluminum-based LED PCBs are specifically designed to handle the high heat generated by LEDs, keeping them cool and allowing them to operate efficiently without degradation.
Aluminum base PCBs offer superior thermal management, making them ideal for high-power applications that require efficient heat dissipation. From aluminum base LED PCBs to metal-based aluminum PCB boards, these PCBs help prevent overheating, increase reliability, and improve the overall performance of electronic devices. Whether you are designing a 25w PCB LED aluminum star base or a single layer LED aluminum base PCB, aluminum offers excellent heat resistance and thermal conductivity.
When selecting the right PCB material, aluminum base PCBs should be at the top of your list for any application where heat management is a priority. With their ability to handle high temperatures and provide better mechanical strength than traditional materials like FR4, aluminum-based PCBs are the best choice for applications such as LED lighting, power supplies, and other high-power electronics.
Choose aluminum base PCBs for your next project and experience improved performance, longer lifespan, and efficient heat management. Best Technology offers a wide range of aluminum base pcb products with high quality, tailored to meet the specific needs of each customer. Pls feel free to reach out to us at sales@bestpcbs.com for more details.
How to make two sided pcb Altium? Be familiar with the interface and basic operations of Altium Designer, accurately design the circuit schematic diagram, reasonably plan the PCB layout, make full use of the double-sided space, conduct fine wiring, ensure signal integrity, and correctly set the rules and parameters to meet production requirements.
What is a double-sided PCB?
Double-Sided PCB refers to a printed circuit board with conductive copper layers on both sides, and the circuit between the two sides is connected through through holes (small holes). This design enables double-sided PCBs to implement more complex circuit layouts in limited space without significantly increasing the board size.
Double-sided PCBs are widely used in various application scenarios that require complex circuit layouts and high-density assembly, such as computers, communication equipment, industrial control, and consumer electronics.
Because it can achieve more complex circuit designs in a limited space, double-sided PCB is particularly suitable for applications that require higher-function electronic equipment, such as smart home equipment, computer hardware, medical equipment, etc.
Create a project: In Altium Designer, select “File” > “New” > “Project” to create a new PCB project.
Draw a schematic: Select “File” > “New” > “Schematic” to create a new schematic file. Add the required components to the schematic and connect them using wires.
Add package library: If you need to use a custom package library, you need to add it to the project. Select Design > Add/Remove Library and select the desired footprint library.
Generate PCB: After the schematic is drawn, select “Design” > “Update PCB Document” to import the components and connection information in the schematic into the PCB.
Layout components: In PCB, components are laid out according to design requirements. You can use Altium’s automatic layout tools or manual layout.
Routing: Use Altium’s routing tools to route the connections between components. You can choose automatic routing or manual routing.
Add silkscreens and logos: Add silkscreens and logos to the PCB to easily identify components and connections.
Check and Validate: Use Altium’s Design Rule Checker tool to check that your PCB design meets requirements. Electrical rule checks, wiring rule checks, etc. can be performed.
Generate manufacturing files: After the PCB design is completed, select “File” > “Fabrication Outputs” to generate manufacturing files, such as Gerber files, drilling files, etc.
How to make two-sided PCB?
After designing the layout of the double-sided PCB in the PCB design software according to the circuit schematic diagram, the production process begins.
The complete process of making double-sided PCB:
Preparation materials: Choose a copper-clad laminate covered with copper foil of a specific thickness (such as 18μm, 35μm, etc.) on both sides, and determine the copper foil specifications according to circuit requirements.
Drilling: According to the drilling documents, use a CNC drilling machine to drill high-precision holes to ensure the connection paths for the circuits on each layer.
Copper immersion: Place the drilled PCB board in a copper immersion liquid to deposit a thin copper layer on the hole wall, laying the foundation for subsequent copper electroplating and ensuring the reliability of electrical connections.
Copper electroplating: Use the PCB board as the cathode to energize the copper ion plating solution, thicken the copper layer to the design standard, and enhance the electrical conductivity and mechanical properties.
Exposure and development: The Gerber file is made into a film. After applying photoresist to the copper-clad board, the film pattern is printed on the board through exposure equipment, and then the unexposed photoresist is dissolved with a developer to initially present the circuit pattern.
Etching: Use ferric chloride or acidic etching solution to dissolve the copper foil that is not protected by the photoresist, and form precise lines on both sides of the copper-clad board. Then use a film stripping solution to remove the remaining photoresist.
Make the solder mask layer: Use screen printing to apply solder mask ink of the selected color on the circuits on both sides of the board, and use screen printing to print white character ink on the corresponding positions of the cured solder mask layer to mark component information to facilitate assembly and debugging.
Drying treatment: Drying fixes the character ink to avoid fading and blurring.
Surface treatment: Dip tin or spray to coat the pad with tin layer to improve solderability, suitable for products with regular soldering requirements.
Can you put components on both sides of a PCB?
Components can be placed on both sides of the PCB. Both sides of the PCB double-sided panel can be wired and components placed, which can reduce the difficulty of wiring and is suitable for the design of complex circuits.
In a double-board design, larger and denser components such as QFP and BGA are usually placed on the top layer of the board, while plug-in components can only be placed on the top layer. Smaller components and components are placed on the other side (bottom layer) of the plug-in components. Chip components with a small number of pins and loose arrangement.
How do you flip a PCB in Altium?
Use the shortcut key: Press the “V” key and then the “B” key to quickly flip the PCB view to the bottom layer. This method is like turning the PCB board over visually, making it easier to view the underlying component layout, wiring, etc.
Operation through the menu: Select the “View” menu, find the “Flip Board” option in the drop-down menu, and click it to flip the PCB view between the top and bottom layers. This method is relatively intuitive and suitable for users who are not familiar with shortcut keys.
How do you flip a component to the bottom in Altium?
Menu operation: Hold down the “Ctrl” key and use the left mouse button to click the components that need to be flipped one by one to select them all. Then follow the menu operation steps for flipping a single component, that is, select “Edit” – “Move” – ”Flip Selection”, so that multiple selected components can be flipped to the bottom together.
Shortcut key operation: First select multiple components, the selection method is the same as above, also hold down the “Ctrl” key and click the components. Then press the “L” key to flip these selected components to the bottom layer at the same time.
How do I mirror graphics in Altium?
In the schematic editing environment, select the component that needs to be mirrored. You can select it by left-clicking the component with the mouse. Then select the “Edit” menu and click on the “Mirror” option. Or use the shortcut key “Ctrl + M” to mirror the component in the horizontal direction. Properties such as the pin connections of the component will not change, only the graphic appearance will be mirrored.
In the PCB editing environment, select the component to be mirrored by clicking it directly with the left mouse button. Select the “Move” submenu under the “Edit” menu and click on the “Mirror Selection” option. The component will be mirrored with the axis perpendicular to the PCB board plane as the axis of symmetry. This is useful when adjusting component layout, especially when you need to flip the component from top to bottom and mirror it at the same time, etc.
In addition, for some regularly shaped components (such as rectangular components), you can also select the component and hold down the “L” key to achieve the effect of flipping and mirroring the component between layers.
How do I rotate a whole PCB in Altium?
Use keyboard shortcuts to rotate in the PCB Editor:
Select the entire PCB (you can select the entire PCB through the “Edit” menu – “Select” – “All”). Press “Space” to rotate the PCB counterclockwise in 90° increments. This is a faster way to rotate, making it easier to adjust the direction of the PCB during the layout and routing process to better fit the workspace or meet specific layout ideas.
Rotate via menu options:
Also select the entire PCB first. Select the “Edit” menu – “Move” – ”Rotate Selection”. In the pop-up dialog box, you can set the rotation angle. The PCB can be rotated accurately according to the design requirements, such as inputting any angle such as 45°, 60°, etc., and then clicking the “OK” button to complete the rotation operation. This method is relatively more flexible and can meet the rotation needs of non-integer multiples of 90°.
During the design process, pay attention to key points, be familiar with the operation of the software, accurately design the circuit schematic, reasonably plan the PCB layout, conduct fine wiring, set correct rules and parameters, and conduct strict inspection and optimization. Only in this way can the quality and reliability of PCB design be ensured and meet the needs of practical applications.
How to create a new PCB in Altium? To creating a new pcb in altium from schematic, finalize the schematic with all components and connections, then create a new PCB layout document. Arrange components in the workspace, define the board shape and layer stackup, and set design rules. Route the traces and verify the design using Altium’s Design Rule Check (DRC) to ensure it meets manufacturing and design standards.
To create a new file: Open the Altium software, select the “File” menu, and then click the “New” option. In the pop-up submenu, select “PCB”, so that a new blank PCB file is created. You can also use the shortcut key “Ctrl + N”, and then select “PCB Document” in the pop-up “New Document” dialog box to create it.
2. Set PCB parameters
Unit setting: Select “Document Option” in the “Design” menu. In the pop-up dialog box, you can select the unit of the PCB. Generally, there are two units to choose from: imperial (mil) and metric (mm).
Grid setting: Also in the “Document Options” dialog box, switch to the “Grids” tab. You can set the Visible Grid and Snap Grid. The visible grid is used as a visual reference during the design process to help users align components and wiring.
Define the board frame: You can use the “Line” tool or the “Keep – Out” tool in the “Place” menu to draw the border of the PCB. If you use the “Line” tool, you need to manually draw a closed polygon to represent the shape of the PCB; the area drawn with the “Keep – Out” tool indicates the range where wiring is prohibited, and can also be used as the boundary of the PCB.
Precisely set the size: Select “Board Shape” in the “Design” menu, and then select “Redefine Board Shape”. At this time, the mouse cursor will become a cross shape. Use the mouse to click on the previously drawn board frame lines, and the software will automatically redefine the shape and size of the PCB based on these lines.
3. Add component library
Open the component library panel: In the “Libraries” panel on the right, if it is not displayed, you can open it through the “Workspace Panels” option in the “View” menu, and then select “Libraries”.
Add library files: In the component library panel, click the “Libraries” button, and in the pop-up “Available Libraries” dialog box, select the “Install” option. Then find the required component library file in the file browser (usually *.IntLib or *.SchLib and *.PcbLib files), select and click “Open” to add the component library to the software.
4. Place components
Find components: After the component library is added, you can find the components that need to be placed on the PCB in the component library panel. You can quickly locate the component by entering the component name, model or package type in the search box.
Place components: After finding the required component, double-click the component name or click the component name and select the “Place” option. The mouse cursor will change to the shape of the component. Move the mouse to the appropriate position in the PCB editing area and click the left mouse button to place the component. During the placement process, you can rotate the component by pressing the space bar to adjust the direction of the component.
5. Component layout
Manual layout: After placing the component, you need to layout the component. When manually laying out, you can adjust the position of the component based on factors such as the electrical connection relationship between components, signal flow, and the mechanical structure of the PCB.
Automatic layout (optional): Altium also provides an automatic layout function. Select the “Component Placement” option in the “Tools” menu, and then select “Auto Place”. However, the result of automatic layout may not be ideal, and manual adjustments are usually required based on the automatic layout to achieve the best layout effect.
6. Wiring
Set wiring rules: Before wiring, you need to set wiring rules. Select the “Rules” option in the “Design” menu. In the pop-up “PCB Rules and Constraints Editor” dialog box, you can set various routing rules such as line width, routing spacing, and via size.
Start routing: Select the “Interactive Routing” option in the “Route” menu, or use the shortcut key “Ctrl + W”, and the mouse cursor will become a cross shape. Click a component pin as the starting point for routing, and then move the mouse to the target pin. The software will automatically generate routing according to the set routing rules. During the routing process, you can switch the routing mode by pressing the “Shift + Space” key combination, such as 45° routing, 90° routing, etc.
7. Design Verification
Electrical Rule Check (ERC): Select the “Design Rule Check” option in the “Tools” menu. In the pop-up “Design Rule Check” dialog box, set the items and parameters to be checked, and then click the “Run DRC” button. The software will check whether the PCB design complies with the previously set routing rules, such as whether there are short circuits, open circuits, insufficient spacing, etc., and generate a check report.
3D view check (optional): Altium also provides a 3D view function, which can help users check the PCB design more intuitively. Select the “Switch to 3D” option in the “View” menu, and the software will display the PCB design in 3D.
Through the above steps, you can create a new PCB in Altium. In the actual design process, you may need to repeatedly adjust and optimize each step according to the specific design requirements and complexity to obtain a high-quality PCB design.
What is the difference between a schematic and a PCB?
The main differences between a schematic and a PCB are in terms of definition, purpose, content, and form of expression.
1. Definition and purpose
Schematic: A schematic is also called a circuit diagram or electrical schematic. It uses graphic symbols to represent circuit components and their connections. The schematic mainly describes the working principle of an electronic device and does not involve a specific physical layout.
PCB: A PCB diagram is a printed circuit board diagram, which is a mapping drawing of a circuit board, detailing the routing, component location, size, and connection method of the circuit board. PCB diagram is the direct basis for the actual production of circuit boards. It is mainly used to guide the manufacturing and assembly process of PCB boards to ensure that components are placed correctly and lines are connected accurately.
2. Content and form of expression
Schematic diagram: The schematic diagram represents components and connection lines in a symbolic form, clearly showing the working principle and logical relationship of the circuit. It does not involve specific physical layout and size, so it is relatively flexible and easy to modify and optimize.
PCB diagram: The PCB diagram shows the actual layout and electrical connection of components, including copper foil lines, pads and vias. PCB diagram is the basis of circuit board manufacturing, involving specific physical layout and connection methods. Once determined, the modification is more complicated.
How to make a PCB from schematic?
Making a PCB from a schematic can be divided into the following steps:
Drawing a schematic diagram: Use circuit design software (such as Altium Designer, Eagle, etc.) to draw a circuit schematic diagram, including the connection relationship of each electronic component.
Design PCB: According to the component layout and connection relationship in the schematic diagram, PCB layout design is performed in the PCB design software, including component placement, wiring, etc.
Generate Gerber files: Export the designed PCB files as Gerber files, which is a standard PCB manufacturing file format that contains information about each layer of the PCB, such as copper foil layer, silk screen layer, solder mask layer, etc.
Make PCB: Send the generated Gerber files to the PCB manufacturer or use PCB manufacturing equipment for production. The PCB manufacturer will make the actual PCB circuit board according to the Gerber file.
Solder components: Solder the electronic components to the manufactured PCB circuit board to complete the circuit assembly.
Test and debug: Test and debug the assembled circuit board to ensure that the circuit functions normally.
Can Altium open Gerber files?
Altium Designer can open Gerber files. The specific steps are as follows:
Open Altium Designer software, select “File” in the menu bar, then select “New”, and then click “Cam document” in its drop-down submenu to create a new CAM file.
In the newly created CAM file, select the “Import” sub-item of the “File” menu item, and then select “Gerber” to start importing Gerber files.
Select the Gerber file to be opened in the pop-up window, click “Open”, and then click the “OK” button in the pop-up “Import Gerber” window, and the Gerber file can be successfully opened.
How do I convert PCB to schematic in Altium?
To convert PCB to schematic in Altium, first open the PCB file and export the network table through the “Design” menu (select the appropriate format such as Protel format). Then create a new schematic file and import the previously exported network table through the “Design” menu. Then manually adjust the component layout to make it more reasonable, and finally check whether the connection relationship is correct and improve the schematic, add annotations and logos, etc.
How do you place components from schematic in Altium?
In Altium Designer, first make sure that the required component library has been added. If not, you can add it by opening it in the “Workspace Panels” under the “Libraries” panel menu. Click the “Libraries” button, select “Install) in the “Available Libraries” dialog box that pops up, and find the component library file (such as *.SchLib) and add it.
In the “Libraries” panel, enter keywords such as component name, model or package type in the search box to find the components to be placed. You can also expand the corresponding library folder in the library list and browse to find the components.
After finding the component, there are two ways to place it. One is to double-click the component name directly, and the mouse cursor will change to the shape of the component; the other is to click the component name and select the “Place” option.
Move the mouse to the schematic editing area and click the left mouse button to place the component in the appropriate position. During the placement process, you can press the space bar to rotate the component and adjust its direction. Repeat this operation and place all the required components one by one into the schematic according to the schematic design.
How to make a PCB board step by step?
PCB manufacturing: After receiving the file, the PCB manufacturer manufactures it according to the file information. The manufacturing process includes multiple process steps such as inner layer pattern production, lamination, outer layer pattern production, drilling, electroplating, solder mask coating and silk screen characters.
Component assembly: After the PCB is manufactured, the components are assembled by manual welding or automated equipment, and the electronic components are installed on the PCB board according to the requirements of the BOM and schematic diagram to complete the production of the PCB board.
Functional test: Use test equipment to perform functional tests on the assembled PCB board to check whether the circuit can work normally and whether it meets the design requirements.
Performance debugging: For some complex circuits, performance debugging may be required, such as adjusting component parameters, optimizing signal processing, etc., to improve the performance and stability of the circuit.
In short, throughout the design process, continuous adjustments and optimizations are required to ensure the performance, reliability and manufacturability of the PCB. At the same time, Altium Designer also provides many other functions and tools to help you better complete PCB design tasks.
If you’re working with electronics, you’ve probably heard of Printed Circuit Boards (PCBs). They’re at the heart of almost every electronic device we use today. But have you ever wondered what are PCB designs called? Are they just called PCB designs, or is there more to it? Well, it turns out there are quite a few terms for PCB designs, and each one refers to a specific aspect of the design process. Let’s take a closer look at these terms, how they’re used, and what makes each one unique.
What Are PCB Designs Called?
PCB designs are often referred to by different names depending on the context or the stage of the design process. Let’s explore the most common terms:
1. PCB Layout
This is probably the most frequently used term. When someone mentions a PCB layout, they’re talking about the physical arrangement of components and the routing of electrical connections (also called traces) on the board.
Think of it like designing the floor plan of a house. The layout ensures that everything fits within the available space and that all the rooms (or in this case, components) are connected in the right way.
2. Circuit Board Design
Sometimes, you’ll hear people refer to the process as circuit board design. This term emphasizes the broader design aspect, from planning the circuit to placing components and routing connections. It’s a more general term that covers everything from the initial schematic to the final layout.
3. PCB Schematic
While the schematic is technically just one part of the design process, some people refer to the entire design as the schematic. This is more common among those who focus on the circuit’s logic rather than its physical structure.
4. Gerber Files
Once the design is complete, it’s converted into a set of files called Gerber files. These files contain all the information needed to manufacture the PCB. Sometimes, people use the term Gerber files to refer to the finished design, even though it’s technically just the output.
5. EDA (Electronic Design Automation) File
In professional environments, PCB designs are often called EDA files. These are the files created by design software like Altium Designer, KiCad, or Eagle. They contain all the details of the design, including the schematic, layout, and design rules.
What Is the Difference Between a PCB Design and a Schematic Design?
Many people use the terms PCB design and schematic design interchangeably, but they serve different purposes in the design process.
Schematic Design
Represents the electrical connections between components.
Focuses on the logic and functionality of the circuit.
Uses symbols to represent components like resistors, capacitors, and transistors.
Helps engineers understand how the circuit works.
PCB Design
Translates the schematic into a physical layout.
Focuses on the placement of components and routing of traces.
Considers factors like board size, layer count, and thermal performance.
Ensures the circuit can be manufactured and assembled.
In summary, the schematic shows what the circuit does, while the PCB design shows how it does it physically.
PCB Schematics Elements
A schematic is the starting point for any PCB design. It provides a clear visual representation of the circuit’s functionality. Here are the key elements of a schematic:
1. Component Symbols
Each component in the circuit is represented by a symbol. For example, a resistor is usually shown as a zigzag line, while a capacitor is two parallel lines.
2. Nets (Connections)
Lines connecting the symbols represent electrical connections, known as nets. These nets define how components interact with each other.
3. Reference Designators
Lines connecting the symbols represent electrical connections, known as nets. These nets define how components interact with each other.
4. Values and Ratings
The schematic also shows the values and ratings of components, such as the resistance of a resistor or the capacitance of a capacitor.
5. Power and Ground Symbols
Every circuit needs power and ground connections. These are represented by standard symbols, ensuring the circuit has a common reference point for voltage.
Common Terms in PCB Design
1. Silkscreen Layer
The silkscreen layer contains text, logos, and symbols printed on the surface of the PCB to help identify components and guide assembly. It can also include part numbers, component values, and polarity markings.
2. Via
A via is a hole in the PCB that allows electrical connections between different layers. Vias are often used in multi-layer PCBs to route signals between the top and bottom layers or inner layers.
3. Copper Pour
A copper pour is a large, solid region of copper that is poured over areas like ground or power planes. It helps reduce noise, increase current-carrying capacity, and improve thermal dissipation.
4. Trace Width
Trace width refers to the thickness of the copper traces used to connect components. The width of a trace must be designed to carry the required amount of current without overheating.
5. Drill Hole
A drill hole is a hole that is made in the PCB to accommodate components with leads or for vias. The size and placement of drill holes are critical to the assembly process.
6. Solder Mask
The solder mask is a protective layer applied over the PCB to prevent solder from bridging between pads. It also helps prevent oxidation of the copper traces and improves the board’s overall durability.
7. Pad
Pads are small copper areas on the PCB where components are mounted or soldered. Pads can be through-hole or surface-mount, depending on the type of component.
8. Bill of Materials (BOM)
The BOM is a comprehensive list of all the components required for the assembly of a PCB. It includes details like part numbers, quantities, and specifications for each component.
9. Impedance Control
Impedance control is the process of ensuring that the impedance of the PCB traces matches the requirements of the signals that will travel through them. This is important for high-speed and RF circuits.
10. Stack-up
Stack-up refers to the arrangement of layers in a multi-layer PCB. It defines how the copper, dielectric, and other materials are stacked to create the board.
11. Daisy-Chaining
Daisy-chaining is a method of connecting multiple components or pins in a series, often used in signal or power distribution systems within the PCB design.
12. Overcurrent Protection
Overcurrent protection refers to circuits designed to prevent excessive current from flowing through the PCB traces, often by using fuses or resistors that limit the current flow.
13. Design for Manufacturability (DFM)
DFM refers to designing the PCB in a way that makes it easier and more cost-effective to manufacture. This includes factors like trace width, pad size, and component placement.
14. Routing
Routing is the process of designing the electrical paths that connect the components on a PCB. Proper routing ensures that signals are carried efficiently with minimal interference.
15. Thermal Via
Thermal vias are specially designed vias used to transfer heat away from high-heat components to other parts of the PCB or a heat sink.
16. Electromagnetic Interference (EMI) Shielding
EMI shielding involves using design techniques, such as grounding and the use of shielding components, to protect sensitive parts of the PCB from electromagnetic interference.
17. Differential Pair
A differential pair is a set of two traces that carry complementary signals, often used in high-speed designs like USB or Ethernet to minimize noise and improve signal integrity.
18. Power Distribution Network (PDN)
The PDN refers to the system of traces and planes that deliver power to various components on the PCB. Proper PDN design is crucial to ensure reliable power delivery and minimize voltage drops.
19. Electrical Rule Check (ERC)
ERC is a process that checks the schematic design for electrical issues like unconnected nets, incorrect component connections, or incorrect power supply connections.
20. Multi-layer PCB
A multi-layer PCB contains more than two layers of conductive material and is used for more complex designs that require high-density circuits, especially in smaller devices.
21. Surface-Mount Technology (SMT)
SMT is a method for mounting components directly onto the surface of the PCB, rather than inserting them through holes. This allows for smaller, more compact designs.
22. Through-Hole Technology
Through-hole technology involves inserting component leads through holes in the PCB and soldering them on the opposite side. It’s commonly used for components that require strong mechanical bonds.
23. Hot Air Soldering
A method of soldering components onto the PCB using hot air, often used in reflow soldering processes for surface-mount components.
24. Trace Routing
Trace routing is the process of laying out the paths that the electrical signals will take through the PCB. Good trace routing ensures efficient and reliable signal transmission.
25. Tenting
Tenting refers to the process of covering the vias with a layer of solder mask, leaving the pad open. It helps prevent solder from flowing into vias during soldering.
PCB Design vs. PCB Layout
Although often used interchangeably, PCB design and PCB layout have different meanings:
PCB Design: Refers to the entire process, from schematic creation to generating manufacturing files.
PCB Layout: Specifically focuses on the physical arrangement of components and routing of traces on the board.
In simple terms, PCB layout is a part of the overall PCB design process.
PCB Design Process
Designing a PCB is a multi-step process that requires careful planning and attention to detail.
1. Schematic Capture
The process starts with creating a schematic diagram that defines the circuit’s functionality and connections.
2. Component Selection
Next, components are selected based on the circuit requirements. Factors like size, power rating, and cost are considered.
3. PCB Layout
Components are placed on the board, and traces are routed to connect them. This step requires balancing electrical performance with physical constraints.
4. Design Rules Check (DRC)
The layout is checked for errors or violations of design rules to ensure it meets manufacturing standards.
5. Gerber File Generation
Once the design is complete, Gerber files are generated. These files are used by manufacturers to produce the PCB.
6. Fabrication and Assembly
The PCB is fabricated, and components are assembled to create the final product.
FAQs
Q: What software is used for PCB design?
A: Popular software includes Altium Designer, Eagle, KiCad, and OrCAD.
Q: How many layers can a PCB have?
A: PCBs can have anywhere from one to 16 or more layers, depending on complexity.
Q: Why is trace width important?
A: Trace width affects the current-carrying capacity and signal integrity of the circuit.
Q: What is a multilayer PCB?
A: A multilayer PCB has multiple layers of copper separated by insulating material, allowing for more complex designs.
Q: How long does it take to design a PCB?
A: The time varies based on complexity. Simple designs may take a few days, while complex designs can take weeks.
Trace width refers to the width of the conductive line on the PCB. If the line width is too narrow, the current passing through the unit area is too large, which will cause the wire temperature to rise and may damage the circuit board. Spacing refers to the distance between adjacent conductive lines on the PCB. Sufficient spacing can ensure the electrical insulation performance between adjacent lines and prevent short circuits between lines.
What is PCB trace/line spacing?
PCB trace/line spacing refers to the minimum distance between two lines on the PCB board. This distance is usually used to avoid electrical interference and ensure the reliability of the circuit. The size of the line spacing will affect the crosstalk, electromagnetic compatibility and heat dissipation performance of the circuit.
The basic concept and importance of line spacing is that it directly affects the performance and reliability of the circuit. The size of the line spacing needs to ensure that the electrical coupling and interference between the circuits are minimized to ensure the normal operation of the circuit.
What are the rules for PCB trace spacing?
The basic rule for PCB trace spacing is that the distance from the center of the line to the center of the line should be greater than or equal to 3 times the line width (3W rule) to ensure that crosstalk between lines is reduced.
3W rule: In order to minimize the interference between lines, the distance from the center of the line to the center of the line should be greater than or equal to 3 times the line width (3W rule), which can reduce 70% of the electric field interference. If you need to achieve a higher interference reduction effect, you can use 10 times the line width (10W rule), which can reduce 95% of the interference.
Electrical safety spacing: According to the production capacity of the PCB manufacturer, the spacing between the wires and between the wires and the pads shall not be less than 4mil. Usually, the conventional spacing is set to about 10mil to ensure production quality and electrical safety.
Special signal lines: For signal lines that need to control impedance, such as RF signals, important single-ended signals, and differential signals, the line width and line spacing should be determined according to the stacking calculation to ensure stable signal transmission.
Other considerations: In PCB design, it is also necessary to pay attention to the signal lines to avoid using right angles and sharp angles. Using arcs or 135° obtuse angles can reduce reflections and standing waves.
What is the minimum line spacing in PCB?
The minimum line spacing in PCB is usually 4mil. This spacing is to avoid electrical interference and ensure the reliability of the circuit. The specific line spacing requirements depend on factors such as design specifications, application environment, and manufacturing process.
In some high-precision applications, a smaller spacing may be required, but in general, the spacing should not be less than 4mil. The common spacing in conventional design is 10mil, which can ensure better production efficiency and circuit stability.
What is the minimum line width for a PCB?
The minimum line width of a PCB is usually 6mil (about 0.153mm). This is because in high-density and high-precision PCB design, the line width needs to reach this value to ensure production quality and reliability.
The minimum line width may vary under different design requirements. The minimum line width that can be supported may reach 3.5mil (about 0.09mm) or less, but in most common designs, the line width will be greater than this value to ensure production yield and reliability. In high-density and high-precision PCB design, the line width may be thinner.
When designing a PCB, the choice of line width needs to consider the needs of signal transmission. Generally speaking, the larger the line width, the better the factory production and the higher the yield. The line width in conventional design is usually 10mil (about 0.254mm), which can meet most application scenarios. In high-speed signal transmission, the line width needs to be greater than 10mil to reduce signal loss and synchronization problems.
What is the minimum hole spacing for PCB?
The minimum hole spacing of PCB is generally 0.1mm to 0.15mm. This range is applicable to standard 6-layer PCB circuit boards, but the specific value may vary depending on the manufacturing process and design requirements.
Under different manufacturing processes, the specific value of the minimum hole spacing is different. The minimum aperture of mechanical drilling is 0.15mm, while the minimum aperture of laser drilling can reach 0.075mm. In addition, the spacing from the pad to the outline is generally 0.2mm, and the single side of the pad cannot be less than 4mil (about 0.1mm), preferably greater than 6mil (about 0.15mm). For non-metallic holes and slots, the minimum spacing is not less than 1.6mm, and the slot hole is not less than 2.0mm from the edge of the board of the outline.
Factors that affect the minimum hole spacing of PCB include manufacturing process, design requirements and drilling detection. The advancement of manufacturing process has continuously improved the accuracy of PCB boards, and the minimum hole diameter and spacing have been continuously reduced. For example, the accuracy of modern PCB boards has developed to a minimum hole diameter of 0.08 mm and a minimum hole spacing of 0.1 mm or even higher. In addition, drilling detection is also an important link to ensure the quality of PCBs, including through holes, part holes, slot holes and special-shaped holes, which all need to be strictly inspected.
Why is PCB trace spacing design so important?
PCB trace spacing design is very important because it is directly related to the reliability, performance and safety of the circuit board. By reasonably designing the trace spacing, electrical interference can be avoided, signal transmission quality can be guaranteed, and the thermal stability and reliability of the circuit board can be improved, thereby ensuring the normal operation and long-term stable operation of the circuit board.
First, the design of trace spacing can prevent electrical interference. When two traces are parallel and close to each other, parasitic capacitance and inductance will be generated between them, resulting in signal interference and attenuation. Increasing the trace spacing can reduce this coupling effect, thereby ensuring stable signal transmission.
Second, appropriate trace spacing helps to improve the thermal stability of the circuit board. Components and traces with large working current will generate heat when working. If the traces are too dense, heat is easy to accumulate, resulting in local temperature rise, which may cause failure.
In addition, the design of trace spacing also needs to consider the requirements of production process. Smaller line width and line spacing have higher requirements for production process, which may increase production difficulty and cost.
What will happen if the PCB trace spacing is insufficient?
Insufficient PCB trace spacing will lead to problems such as signal attenuation, signal delay, crosstalk interference and layout difficulties. These problems will affect the performance and stability of the circuit and may even cause circuit function failure.
First, signal attenuation is a major problem of insufficient spacing. Signals will be attenuated during transmission. Too small spacing will increase the possibility of signal attenuation, resulting in signal distortion and increased noise, especially in high-frequency signals and fast signal transmission.
Second, signal delay is also a problem caused by insufficient spacing. It takes time for signals to propagate in the circuit. Too small spacing will extend the path of signal propagation, thereby increasing signal delay and affecting the real-time performance of the system.
In addition, crosstalk interference is another important issue. Insufficient spacing will increase the electromagnetic interaction between signal lines, leading to crosstalk interference, thereby introducing errors or interference and affecting the stability of the circuit.
Finally, layout difficulties are also a practical problem caused by insufficient spacing. When laying out the PCB, too small spacing will increase the complexity of the layout, making it difficult for designers to reasonably arrange the signal path, the distribution of power and ground lines, and the layout of components.
Does trace spacing affect PCB production cost?
The setting of trace spacing is directly related to the difficulty and cost of PCB production process. Although smaller line width and spacing can improve the performance of the circuit, it will increase the difficulty and cost of production.
The setting principles of trace spacing include:
The default values of line width and spacing are usually 6mil, but they can be adjusted according to design requirements. The minimum line width recommended value is 10mil, and the maximum line width can be set to 200mil.
The setting of trace spacing needs to take into account electrical safety and signal integrity. It is usually required that the line center spacing is not less than 3 times the line width to ensure that the electric field does not interfere with each other.
In the design of high-speed signal lines, using larger spacing can further reduce crosstalk and improve the stability of the circuit, but it will also increase costs.
Factors that affect the cost of PCB production also include:
Number of wiring layers: The more layers, the higher the price.
Via size: Vias smaller than 0.25mm usually require additional fees, and back drilling will increase the cost by about 10%~20%.
Plate selection: Unconventional materials such as high-frequency plates and halogen-free plates will increase procurement cycles and production costs.
In summary, the setting of trace spacing has a significant impact on the cost of PCB production. Reasonable settings can control costs while ensuring performance.
In short, PCB line width and spacing are very important parameters in electronic circuit design. They directly affect the performance, reliability and manufacturing feasibility of the circuit board. When designing a circuit board, it is necessary to reasonably select line width and spacing according to the requirements of the circuit and the actual situation.
Apex regulator PCB, as a key electronic component, plays an indispensable role in ensuring power supply stability. In today’s era of high digitalization and electronic equipment dependence, a stable power supply is essential for the normal operation of various devices.
What is a regulator PCB?
Regulator PCB (Printed Circuit Board) is a printed circuit board that integrates regulator-related circuit components. It is centered on regulator components (such as voltage, current or power regulators), supplemented by other circuit components such as capacitors, resistors, and inductors to work together.
Through specific working principles, such as linear regulators adjust the degree of conduction, switching regulators use high-frequency switching actions and related modulation methods to achieve voltage regulation, current detection and control to achieve current regulation, and power regulation based on voltage and current regulation.
At the same time, it has output stability, can maintain output stability when the input voltage fluctuates and the load changes, and has multiple protection functions such as overvoltage, overcurrent, and overheating. It has the characteristics of flexible design of circuit structure and parameters according to needs, high integration to reduce volume, and easy installation and use.
What are the three types of regulators?
There are three main types of regulators: contact regulators, transistor regulators, and integrated circuit regulators.
Contact regulators are an earlier type of regulator, which are characterized by slow contact vibration frequency, mechanical inertia and electromagnetic inertia, resulting in low voltage regulation accuracy, easy sparking of contacts, large radio interference, poor reliability, and short life. They have now been eliminated.
Transistor regulators emerged with the development of semiconductor technology. Their advantages include high switching frequency of transistors, no sparking, high regulation accuracy, light weight, small size, long life, high reliability, and low radio wave interference. This type of regulator is now widely used in a variety of mid- and low-end models.
In addition to the advantages of transistor regulators, integrated circuit regulators also have the characteristics of ultra-small size. They are usually installed inside the generator (built-in regulators), reducing external wiring and improving cooling effects. This type of regulator is widely used in a variety of car models.
What is an apex regulator pcb?
Apex regulator is an electronic device that regulates the voltage, current or power of a power supply to meet the needs of a specific electronic device or system. And the Apex regulator PCB is the product of combining the Apex regulator with the printed circuit board (PCB) technology.
PCB is a substrate that carries electronic components and provides electrical connections. It is made of insulating material, usually glass fiber reinforced epoxy, covered with a conductive copper foil pattern. Electronic components are mounted on the PCB by soldering or other connection methods to form a complete electronic circuit.
Apex regulator PCB integrates the Apex regulator onto the PCB, achieving a more compact and efficient power regulation solution. This integrated design not only reduces the space occupied, but also improves the reliability and stability of the circuit.
What is the function of the apex regulator pcb?
Receive input voltage: The PCB receives the input voltage from the power supply, which may vary due to a variety of factors. This input voltage is usually higher or lower than the level required by the system components.
Regulate voltage: The voltage regulator on the PCB adjusts the input voltage to match the required output level. If the input voltage is too low, the regulator increases it to the appropriate level.
Stabilizes output voltage: Once the voltage is regulated, the PCB distributes it to the various components of the electronic system. A feedback control system continuously monitors the output voltage to ensure it remains stable, and makes real-time adjustments as needed to offset any fluctuations in the input voltage.
Ensures lifespan: By maintaining a stable voltage supply, the apex regulator PCB helps protect sensitive components from damage caused by voltage surges or voltage drops.
How does a apex regulator circuit work?
The working principle of an APEX regulator PCB is to convert analog signals into digital signals through an ADC conversion circuit so that electronic devices and computers can understand and process them. This process involves converting analog signals from our real world into digital signals, allowing electronic devices to recognize and process these signals.
Specifically, the ADC conversion circuit in the APEX regulator PCB is responsible for converting the input analog signal into a digital signal. The ADC (Analog-to-Digital Converter) circuit is responsible for converting continuously changing analog voltage or current signals into discrete digital signals that can be processed and analyzed by electronic devices.
ADC circuits usually consist of three main parts: sampling, quantization, and encoding. These steps convert analog signals into binary codes that computers can process.
What are the applications for apex regulator pcb?
Apex regulator PCB is mainly used in automation industry, industrial robots, medical inspection, precision testing instruments and other fields. These application fields have high requirements for accuracy, efficiency and stability, making Apex regulator PCB an ideal choice.
In the automation industry, Apex regulator PCB is widely used in various automation equipment, such as servo system-controlled CNC trademark printing machines, CNC pipe bending machines, etc. These equipment require high-precision speed control and stable output. Apex regulator PCB can provide precise control and reliable performance to meet the needs of automated production.
In the field of industrial robots, Apex regulator PCB is used to control various actions of the robot to ensure its precise operation in complex environments. Its high torque output and stable accuracy enable the robot to perform well in various industrial applications, improving production efficiency and product quality.
Medical inspection and precision testing instruments also require regulators with high accuracy and stability. The application of Apex regulator PCB in these fields can provide precise control signals to ensure the accuracy and reliability of test results.
Conclusion:
As an indispensable part of electronic equipment, Apex regulator PCB plays an irreplaceable role in ensuring stable operation of equipment and improving equipment performance. With the continuous development of technology, it will continue to develop in the direction of miniaturization, integration, high efficiency, intelligence, etc., and continue to play an important role.
Can you use AC in PCB?AC can be used in PCB boards. PCB boards are designed to support the use of AC, and the functions of AC can be realized through proper circuit design and component selection.
Can you use AC in PCB?
The use of AC in PCB boards requires consideration of the characteristics of AC. The current magnitude and direction of AC change continuously over time, which requires the components and layout on the PCB to adapt to such changes. For example, components such as inductors and capacitors play an important role in AC circuits, and their parameters and layout need to be carefully designed to achieve the desired circuit performance.
Specifically, AC circuit design on PCB boards includes selecting appropriate components, layout, and routing. For example, using test instruments such as LCR digital bridges can measure the parameters of components in AC circuits to ensure that the performance of the circuit meets the design requirements. In addition, reasonable ground routing and layout can reduce signal interference and ensure the stable transmission of AC.
Is the circuit board DC or AC?
Circuit boards can transmit both direct current and alternating current. In modern electronic products, we use alternating current for power supply, so most circuit boards are also designed to transmit alternating current. Of course, in some special application scenarios, some circuit boards also need to transmit direct current. Whether transmitting direct current or alternating current, the circuit board needs to meet the requirements of the transmitted current.
What is the PCB in AC?
The alternating current in PCB refers to the current whose direction changes periodically, that is, alternating current (AC). The application of alternating current in PCB is mainly reflected in power conversion and power transmission. PCB power supply usually converts AC into stable direct current (DC) output to meet the demand of electronic equipment for stable power supply. PCB power supply converts AC into the required DC through components such as transformers, rectifiers, filters and voltage regulators, and provides stable power output.
How to calculate the bandwidth of AC in PCB traces
The calculation of AC PCB trace width can be performed by the following formula: W = (I / J) * K, where W represents the trace width, I represents the current, J represents the current density, and K represents a coefficient related to materials and processes. This formula shows that the trace width is related to the current, current density, and material properties.
AC in PCB Design Guide
Current Carrying Capacity: The width of a trace directly affects its ability to handle current without exceeding temperature limits or causing excessive voltage drop. Impedance Control: In high-frequency applications, maintaining controlled impedance is critical for signal integrity. Trace width, trace spacing, and dielectric properties affect the characteristic impedance of the transmission line. Heat Dissipation: Adequate trace width helps to effectively dissipate heat, preventing thermal issues such as trace delamination or solder joint failure. Voltage Drop: Narrower traces exhibit higher resistance, resulting in increased voltage drop along the length of the trace. By adjusting the trace width, the voltage drop can be minimized. Manufacturability: The PCB manufacturing process imposes restrictions on the minimum trace width, and designers must balance performance requirements with manufacturability constraints. 2. Minimum Trace Width: Most manufacturers have a minimum trace width of 6mil or 0.152mm, and typically use traces of 0.254-0.3mm. Material and Process Deviations: Due to the possibility of material and process deviations in the actual PCB manufacturing process, a certain margin needs to be left when calculating the line width. Signal Integrity Simulation: Perform signal integrity simulations to ensure impedance is controlled and signal degradation due to reflections, crosstalk, or transmission line effects is minimized
AC in PCB wiring
The current trend is that the power supply voltage is getting lower and lower (especially for highly integrated digital devices), the space occupied is getting smaller and smaller, the weight is getting lighter and lighter, and the efficiency is getting higher and higher, which requires the precise design of the power supply circuit starting from the PCB.
Safety distance includes electrical clearance (spatial distance), creepage distance (surface distance) and insulation penetration distance…
Electrical clearance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the air.
Creepage distance: the shortest distance between two adjacent conductors or one conductor and the adjacent motor housing surface measured along the insulation surface.
Determination of electrical clearance:
The distance can be determined according to the measured working voltage and insulation level
The electrical clearance size requirements of the primary side line are shown in Table 3 and Table 4
The electrical clearance size requirements of the secondary side line are shown in Table 5
But usually: Primary side AC part: L-N ≥ 2.5mm before the fuse, L.N PE (earth) ≥ 2.5mm, no requirements are made after the fuse is installed, but a certain distance should be maintained as much as possible to avoid short circuit damage to the power supply.
Primary side AC to DC part ≥2.0mm
Primary side DC ground to earth ≥2.5mm (primary side floating ground to earth)
Primary side to secondary side ≥4.0mm, components connected between primary and secondary sides
Secondary side gap ≥0.5mm
Secondary side ground to earth ≥1.0mm
Note: Before determining whether it meets the requirements, the internal parts should be applied with a force of 10N and the outer shell with a force of 30N to reduce the distance so that the space distance still meets the requirements under the worst case.
Determination of creepage distance:
Based on the working voltage and insulation level, the creepage distance can be determined by looking up Table 6
But usually: (1), primary side AC part: L-N ≥2.5mm before the fuse, L.N earth ≥2.5mm, no requirement is required after the fuse, but try to keep a certain distance to avoid short circuit damage to the power supply.
(2) Primary side AC to DC part ≥2.0mm
(3) Primary side DC ground to ground ≥4.0mm such as primary side ground to earth
(4) Primary side to secondary side ≥6.4mm, such as optocoupler, Y capacitor and other components, the foot spacing ≤6.4mm needs to be slotted.
(5) Secondary side parts ≥0.5mm
(6) Secondary side ground to earth ≥2.0mm or more
(7) Transformer two-stage ≥8.0mm or more
Insulation penetration distance:
It should meet the following requirements according to the working voltage and insulation application:
For working voltage not exceeding 50V (71V AC peak or DC value), there is no thickness requirement;
The minimum thickness of additional insulation should be 0.4mm;
When the reinforced insulation is not subjected to any mechanical stress that may cause deformation or performance degradation of the insulating material at normal temperature, the minimum thickness of the reinforced insulation should be 0.4mm. If the insulation provided is used in the protective casing of the equipment and will not be bumped or scratched during maintenance by the operator, and any of the following conditions apply, the above requirements do not apply to thin insulating materials regardless of their thickness;
For additional insulation, at least two layers of material are used, each of which can pass the dielectric strength test for additional insulation; or:
For additional insulation composed of three layers of material, any combination of two layers of material can pass the dielectric strength test for additional insulation; or:
For reinforced insulation, at least two layers of material are used, each of which can pass the dielectric strength test for reinforced insulation; or:
For reinforced insulation composed of three layers of insulating material, any combination of two layers of material can pass the dielectric strength test for reinforced insulation.
Points to note about wiring process:
Flat components such as capacitors must be flat without glue.
If the distance between two conductors can be shortened by applying a force of 10N, which is less than the safety distance requirement, glue can be used to fix the part to ensure its electrical clearance.
When laying PVC film inside some shell equipment, attention should be paid to ensuring the safety distance (pay attention to the processing technology).
When fixing the parts with glue, be careful not to leave foreign matter such as glue wire on the PCB board.
When processing parts, insulation damage should not be caused.
Requirements for flame-proof materials:
Heat shrink tubing V-1 or VTM-2 or above; PVC tubing V-1 or VTM-2 or above
Teflon tubing V-1 or VTM-2 or above; plastic materials such as silicone sheets, insulating tape V-1 or VTM-2 or above
PCB board 94V-1 or above
Regarding insulation level
(1) Working insulation: insulation required for normal operation of equipment
(2) Basic insulation: insulation that provides basic protection against electric shock
(3) Supplementary insulation: independent insulation applied in addition to basic insulation to protect against electric shock in case of basic insulation failure
(4) Double insulation: insulation consisting of basic insulation plus supplementary insulation
(5) Reinforced insulation: a single insulation structure that provides the same level of protection against electric shock as double insulation under the conditions specified in this standard
The applicable situations of various insulation are as follows:
A. Operational insulation
a. Between parts with different voltages
b. Between ELV circuits (or SELV circuits) and grounded conductive parts.
B. Basic insulation
a. Between parts with dangerous voltages and grounded conductive parts;
b. Between SELV circuits with dangerous voltages and grounding-dependent;
c. Between the primary power conductor and the grounded shield or the core of the main power transformer;
d. As part of double insulation.
C. Supplementary insulation.
a. Generally speaking, between accessible conductive parts and parts that may carry dangerous voltages after basic insulation is damaged, such as:
Ⅰ. Between the surface of handles, knobs, handles or similar objects and their ungrounded axis.
Ⅱ. Between the metal casing of the second category equipment and the outer skin of the power cord passing through this casing.
Ⅲ. Between the ELV circuit and the ungrounded metal casing.
b. As part of double insulation
D. Double insulation
Double insulation Reinforced insulation
Generally speaking, between the primary circuit and
a. between accessible ungrounded conductive parts, or
Under normal working conditions, the AC peak value between conductors or between any conductors does not exceed 42.4V or the DC value does not exceed 60V.
SELV circuit: safety extra low voltage circuit.
A properly designed and protected secondary circuit so that under normal conditions or single fault conditions, the voltage between any two accessible parts, and between any accessible parts and the protective grounding terminal of the equipment (only for Class I equipment) will not exceed the safety value.
TNV: communication network voltage circuit
Under normal working conditions, the circuit carrying communication signals
Difference between direct current and alternating current
The main differences between DC and AC include direction and polarity, voltage change, current loss, transformer use, and application scenarios.
Direction and polarity:
DC: The direction of the current remains unchanged, and the electrons flow from the positive electrode to the negative electrode.
AC: The direction of the current changes periodically, and the electrons flow back and forth between the positive and negative electrodes. Voltage change:
DC: The voltage remains constant and does not change over time.
AC: The voltage magnitude and direction change periodically over time. For example, the mains is an AC with a sine waveform.
Current loss:
DC: Fault losses are relatively small.
AC: There is capacitive current, and there is capacitive current in the transmission line. Transformer use:
DC: The voltage cannot be changed using a transformer.
AC: The voltage can be changed using a transformer, which is suitable for boosting voltage to reduce losses during long-distance transportation.
Application scenarios:
DC: Suitable for low-voltage electrical appliances and occasions that require stable current. Alternating current: Suitable for household and industrial use, using transformers to change voltage to suit different needs.
FAQ About AC in PCB
FAQ About AC in PCB
Q: The relationship between PCB current and line width. Is the current divided into AC or DC? A: The relationship between PCB current and line width is not divided into AC or DC. In terms of the nature of the lines on the PCB, the lines are all made of copper materials, and both AC and DC can pass. However, how much current can pass depends on the cross-sectional area of the line on your PCB. That is, line width x thickness of the copper foil of the line. If the cross-sectional area of the line is small, only small current signals can pass, and if the cross-sectional area is large, large current signals can pass. This signal can be AC or DC. Not just 1mm, any line width can pass DC or AC signals.
Q: There is a packaged device, and there are 2 pins in the device that need to be connected to the live wire and neutral wire of 220V AC respectively. So how to deal with this power line when drawing the PCB? Are there any size requirements for pads, wires, etc.? Are there any protective measures required? Is it not possible to directly add pads to connect to the pin pads of the device? A: It is best to mill a groove between the neutral wire and the live wire, and choose the thickness of the wire according to the current. When the current is large, you can put a tin layer on the wire, and the pad should be slightly larger.
Q: The grounding of the PCB circuit board design is also the negative pole. What is the difference between the grounding here and the AC grounding?
A: The concept of the circuit board ground is somewhat different from that of the power supply system. The power supply system refers to the earth, that is, the terminal with the same potential as the earth.
The ground in the circuit board is just a common terminal of a potential, which can be positive or negative, depending on the needs of the designer. It’s just that everyone is used to and assumes that the negative pole is the common terminal, that is, the ground. The circuit board ground is not necessarily connected to the earth.
But it must be connected to the earth when EMI filtering is required.
Q: Should all GNDs on the PCB board be connected? There is a terminal (screw type) with two terminals marked as V1+ and V1- on the PCB schematic. Should V1- be connected to the power supply ground? But I used a multimeter to measure why V3- is not connected to other GNDs on the board?
So how do you connect the ground and 10V of the power supply to the V1+ and V1- ends of the terminal?
A: Not all ground wires on the board are connected together. The ground wires are divided into analog ground and digital ground, just like the ground wire in DC and the ground wire in AC cannot be connected together. That is to say, there is a ground wire that is specifically used for power supply, and there is a ground wire that is specifically used for signals (shielding signal interference). These two ground wires cannot be connected together. In addition, you mentioned V1+ and V1-, and V1- should not be considered a ground wire. Generally, the signal represented by this method is a differential signal, that is, the V1 signal is differentially divided into V1+ and V1-, which can reduce external interference and transmit farther. Finally, V1+ and V1- are integrated into the V1 signal. You need to figure out whether the V1+ and V1- of the terminal are used for power supply. If they are used for power supply, then V1+ is the positive pole. V1- is the negative pole. Since you didn’t show us the picture, you can’t just connect it randomly. The circuit board needs to connect not only power but also signals, depending on how your board is made.
Aluminum is ubiquitous in all kinds of materials in daily life. The thermal conductivity of aluminum plays a very critical role in the wide application of aluminum materials. Whether it is to help electronic devices dissipate heat or to play the advantages of thermal conduction in fields such as automobiles and buildings, the thermal conductivity of aluminum must be considered.
How good is aluminum at conducting heat?
Aluminum has relatively good thermal conductivity, but its thermal conductivity is not as good as copper. The thermal conductivity of aluminum is about 237 W/m·K, while the thermal conductivity of copper is about 385 W/m·K, which means that under the same conditions, copper can transfer heat more efficiently.
The reason why aluminum has good thermal conductivity is that its thermal conductivity is high, and aluminum has a high specific heat capacity. Specific heat capacity refers to the amount of heat that needs to be absorbed or released by a unit mass of a substance to increase or decrease the temperature by 1K. Aluminum’s high specific heat capacity makes it more efficient in absorbing and releasing heat, which is crucial for applications that need to dissipate heat quickly.
What is thermal conductivity?
Thermal conductivity is a physical quantity that represents the ability of a material to conduct heat. The higher the thermal conductivity, the less heat is lost within the material. Thermal conductivity is defined as the amount of heat directly conducted through a material per unit cross-section and length per unit temperature difference and per unit time, and is expressed in Watts per meter Kelvin (W/m-K).
What is the thermal heat conductivity of aluminium?
The thermal conductivity of aluminium is 237W/mK. Thermal conductivity (k) is a measure of the ability of heat to flow through a material.
Thermal conductivity (k) is a measure of the ability of a material to conduct heat, and represents the amount of heat flow through a unit area per unit temperature gradient per unit time. Aluminium, as a common metal material, has a high thermal conductivity and is suitable for applications that require good thermal conductivity.
What is the thermal conductivity of aluminium at high temperatures?
The thermal conductivity of aluminium changes as the temperature increases. Generally speaking, as a metal gets hotter, its thermal conductivity decreases slightly. For aluminium, the thermal conductivity decreases as the temperature increases, but it still retains significant thermal conductivity.
As temperatures approach 500°C, the thermal conductivity of aluminum drops to about 160 W/m·K. This drop occurs because increasing temperatures cause increased atomic vibrations within the metal, which interferes with the flow of heat. Despite this drop in thermal conductivity, aluminum still performs well in high-temperature applications, such as engines or high-performance electronics.
What is the weight constant of aluminum?
The weight constant of aluminum is 2.7 g/cm³. Aluminum is a metallic element with a silvery-white appearance and is a lightweight metal.
The density of aluminum can also be expressed as 2.7×10³ kg/m³, which means that there are 2.7×10³ kg per cubic meter of aluminum. 34 In addition, the density of aluminum can also be expressed as 2700 kg/m³, which is another common unit conversion method.
What is the K value of aluminum?
The “K” value is a shorthand term that is often used to refer to the thermal conductivity of a material. The thermal conductivity K value of aluminum is 237 W/mK. Aluminum is a common metal material with a thermal conductivity of 237W/mK in the solid state.
Thermal conductivity (thermal conductivity coefficient) is a physical property of a material that indicates the ability of heat to be conducted through a unit area and temperature gradient in a unit time. The greater the thermal conductivity, the better the thermal conductivity of the material. Aluminum, as an excellent thermal conductive material, is widely used in many applications.
What would a high value of K mean thermal conductivity?
A high K value means that the thermal conductivity of the material is high, that is, the material has a strong ability to conduct heat. Thermal conductivity (K value) is an important parameter to measure the rate and ability of a material to conduct heat. Materials with high K values can conduct heat more efficiently and have better thermal conductivity.
Specifically, thermal conductivity (K value) is defined as the amount of heat directly conducted by a material of unit cross-section and length under unit temperature difference and unit time. The metric unit is watt/meter Kelvin (W/m·K). If the K value of a material is 1, it means that when the temperature difference between the opposite surfaces is 1 degree, 1 cubic meter of the material will conduct heat at a rate of 1 watt.
Materials with high K values have significant advantages in thermal management. First, they can quickly transfer heat from the heat source to the heat sink, effectively reducing the operating temperature of electronic components, extending the life of the device, and improving system reliability. Second, materials with high K values can significantly reduce the thermal resistance between thermal interfaces and improve the efficiency of heat transfer, especially for high power density devices. Finally, in harsh working environments, materials with high K values can significantly enhance thermal management capabilities, prevent local overheating, and ensure stable system operation.
Is a higher or lower k value better?
Generally speaking, for applications that require effective conduction or heat dissipation, the higher the K value, the better. If the material has a higher K value, it can transfer heat away from hot spots faster, helping to prevent overheating.
In the electronics industry, components can get very hot, so people use materials with high thermal conductivity to make heat sinks. These materials can draw heat away from delicate parts, helping to prevent component damage or failure.
However, in some cases, the lower the thermal conductivity, the better. In insulating materials, you want a lower K value so that heat can’t pass through easily. In these cases, materials such as plastic or fiberglass, which have much lower thermal conductivity than aluminum, are preferred.
Conclusion:
With the continuous advancement of science and technology, the understanding and application of aluminum’s thermal conductivity will continue to expand and deepen. New processing technologies may further optimize aluminum’s thermal conductivity, allowing it to play a unique role in more emerging fields, such as new energy development and high-speed rail transportation.
How to convert .brd to .hyp file?You can try to use HyperLynx’s built-in conversion function to directly convert Allegro’s .brd file, but this method may encounter some problems and cause the conversion to fail.
If the built-in conversion function fails, you can try to convert the .brd file to ODB++ format and then import it into HyperLynx. The specific steps are as follows:
Open the PCB file in Allegro, select “File” -> “Export”, and then select ODB++ format for export.
After the export is successful, open HyperLynx, select “File” -> “Open ODB++”, select the exported ODB file, and wait for the import to complete before performing PCB board-level simulation. 1. If the above method still cannot solve the problem, you can try to add the system variable CDSROOT to solve the conversion failure problem. The specific steps are as follows:
Add the system variable CDSROOT, and the value is the installation path of Cadence Allegro, such as D:\Cadence\Cadence_SPB_17.2-2016\tools\bin.
After confirming, restart the computer and try the conversion operation again
How to convert Cadence17.2’s .brd file to HyperLynx9.4.1’s .hyp file
How to convert Cadence17.2’s .brd file to HyperLynx9.4.1’s .hyp file?Recently, I used Hyperlynx to simulate the signal integrity of PCBs, and I needed to convert various PCB formats into .hyp formats. In the process, I found that the PCB drawn by AD can be directly exported in .hyp format, which is very convenient, but the PCB drawn by Cadence cannot be directly exported. I need to use the built-in PCB converter of Hyperlynx to convert the .brd file of Cadence, as shown below:
But the conversion has always failed. I checked the .ERR file and found a line like this: ERROR: Cadance Allegro utility:extracta, so it is a problem with extracta.exe.
The specific solution is to add the system variable CDSROOT, and the value is D:\Cadence\Cadence_SPB_17.2-2016\tools\bin (the location of your extracta.exe). After confirming, restart the computer and the problem is solved.
Tutorial on converting Cadence17.2’s .brd file to HyperLynx9.4.1’s .hyp file
HyperLynx’s built-in conversion function can directly convert Allegro’s .brd file for use, but for some reason the following error always occurs. I didn’t find a solution online, so I had to find another way.
Another way to import PCB into HyperLynx is to convert the file to ODB++inside format. This method requires the installation of the ODB++inside plug-in in advance.
After installing the plug-in, you can convert the .brd file.
First open the PCB file in Allegro, select ODB++inside in file–>export, the following figure appears, select Export as ODBV6, click 1, and then click Accept.
Wait for the conversion to succeed.
This file is the converted file
Open HyperLynx9.4.1, select open ODB++ in file, select the odbjob_v6 folder, and click select folder.
Wait to open.
Click ok. .
What is a .hyp file?
.hyp file is a file used to record key information such as boundary conditions, material properties, solver settings, etc. of the analysis. This file is usually associated with HyperWorks analysis software and is the basis for numerical calculation and analysis.
The specific uses of .hyp files include:
Geometry model file: represents the geometry of the product or structure. Mesh file: shows the process of dividing the model into finite elements. Simulation setting file: records the key setting information of the analysis. Result file: contains the calculated engineering quantities such as strain, stress, displacement, etc. Post-processing file: used to visualize and analyze results in tools such as HyperView. Report document: usually in PDF or Word format, recording detailed results and conclusions of the analysis1. In terms of use, for example, in PCB tool software, .hyp files can be created and edited through the BroadSim function, including setting line characteristics, editing stacking information, etc., to simulate and analyze circuit boards2. In addition, the Hype software also supports exporting to .hyp format files for further analysis and processing.
