Metal Core Printed Circuit Boards (MCPCBs) are widely used in high-power applications like LED lighting, automotive systems, and power electronics. They offer superior thermal management compared to standard FR4 PCBs, but several variables impact their final pricing. Whether youâre prototyping or placing a volume order, understanding these factors helps you make informed decisions and avoid unexpected costs.
At Best Technology, we manufacture a wide range of MCPCBs tailored to customer requirements. Below, weâve broken down the main elements that influence pricing so you can better evaluate your design options.
Key Technical Factors That Affect MCPCB Pricing
1. Board Dimensions
Size is the starting point for cost evaluation. For non-rectangular shapes like circles, pricing is based on the longest two sidesâtypically the diameter for round boards. Larger boards require more base material and longer processing time, which increases the unit price.
2. Copper Thickness
Copper thickness directly affects both thermal performance and cost. We offer standard and high-current options, including 0.5 OZ, 1 OZ, 2 OZ, 3 OZ, up to 8 OZ. Thicker copper enhances current-carrying capacity but also raises the complexity and expense of manufacturing.
3. Thermal Conductivity
A higher thermal conductivity helps to dissipate heat more efficiently. For example, 3W/m·K materials offer better heat transfer but are more expensive than standard options. The choice often depends on the power density of your application.
4. Surface Finishing
We support finishes such as HASL_LF (lead-free hot air leveling), OSP (Organic Solderability Preservative), and ENIG (Electroless Nickel Immersion Gold). ENIG is the premium choice due to its excellent solderability and oxidation resistance, though it comes at a higher cost.
5. Board Thickness
The most common MCPCB thickness is 1.6mm ±10%, which meets most design standards. Boards thinner than 1mm or thicker than 2mm will cost more due to non-standard processing. Our maximum capacity reaches 4.0mm ±10% for specific projects.
6. Solder mask Type and Color
Solder mask adds not only a protective layer but also an aesthetic touch. We offer white, black, blue, green, and red options. For high-end applications like LED boards, Taiyo solder mask is preferred for its excellent reflectivity, though it is priced higher than regular options.
7. Stack-Up and Construction
The complexity of the PCB stack-up has a big impact on both cost and manufacturing time. Single-layer boards are simpler and cheaper, while multi-layer, double-sided, or heat sink-integrated boards increase the number of processes, materials, and quality inspections required.
MCPCB Types We Offer
Our company specializes in producing a wide range of MCPCB types to suit various thermal and mechanical requirements:
Single Layer MCPCB
Two Layers MCPCB
Double-Sided MCPCB
Multi-Layer MCPCB
Chip-on-Board (COB) MCPCB
Heat Sink Integrated MCPCB
Each type is customizable to your exact application needsâwhether you’re building high-power LED lighting, automotive electronics, or power conversion devices.
How to Choose the Right Parameters Without Overspending?
When planning your MCPCB project, it’s essential to balance performance requirements with budget constraints. Here are a few suggestions:
Match copper thickness to your current needs â don’t over-specify if lower OZ will suffice.
Select surface finishing based on reliability needs â use ENIG for sensitive components, OSP for more budget-friendly builds.
Ask about solder mask options early â especially for LED projects requiring high reflectivity.
Consider standard thicknesses â unless your application has unique structural or thermal demands.
Let us help with stack-up decisions â especially for complex or multi-functional boards.
At Best Technology, we guide you through each stage of development, offering design support, material recommendations, and volume-based quotations that match your project goals.
Need help optimizing your MCPCB design for performance and cost?
Contact our team today for a fast, professional quote and expert guidance tailored to your application.
If you’ve ever held a green circuit board, chances are you were looking at an FR4 PCB. It’s one of the most common materials used in printed circuit board production today. But what makes FR4 so popular? And how exactly does the FR4 PCB manufacturing process work from start to finish?
In this guide, we’ll walk you through everything from the basics of FR4 material to the full production process, FR4 PCB stack-up design, material properties, and key manufacturing considerations. Whether you’re a designer, engineer, or purchasing specialist, this is your go-to reference for working with FR4 PCBs.
What Is FR4 Material?
FR4 stands for âFlame Retardant 4.â It is a type of fiberglass-reinforced epoxy laminate that meets specific flame resistance standards. The core of the material is made from woven fiberglass cloth soaked in epoxy resin. This combination gives it excellent mechanical strength and insulation.
It offers great mechanical strength and excellent insulation, even at high temperatures. Because of these qualities, FR4 PCB material is widely used in everything from mobile phones and automotive systems to medical devices and industrial controls.
FR4 PCB Material Properties
The performance of any PCB starts with the base material. Hereâs what makes FR4 PCB material properties suitable for a wide range of electronics:
Electrical Insulation: FR4 is an excellent electrical insulator, which protects your circuit.
Heat Resistance: It can withstand soldering and other high-temperature processes.
Mechanical Strength: Its fiberglass base provides structural durability.
Moisture Resistance: FR4 doesn’t absorb much water, so it remains stable in humid conditions.
Thermal Stability: Most FR4 materials can handle temperatures up to 130â140°C. Some high-Tg versions go higher.
FR4 PCB Stack-up
The stack-up refers to how the layers of copper and insulating materials are arranged in a PCB. In FR4 PCBs, the stack-up directly affects signal performance, EMI control, and even thermal management. A typical FR4 PCB stack-up can have one, two, or multiple copper layers separated by dielectric layers of FR4.
A basic FR4 PCB stack-up might include:
Top Copper Layer (signal)
Prepreg layer (dielectric made of FR4)
Inner Copper Layer (for power or signal routing)
Core (FR4 material with copper on both sides)
Bottom Copper Layer
For multilayer boards, additional layers are added between the top and bottom layers using alternating layers of copper and FR4-based dielectric.
Engineers design the stack-up based on signal integrity, board thickness, and power distribution requirements. Choosing the right arrangement improves reliability and helps prevent signal interference.
FR4 PCB Thickness
One important design decision is selecting the right FR4 PCB thickness. Standard boards are often 1.6 mm thick, but other options are available, ranging from 0.2 mm to over 3.2 mm.
FR4 boards typically come in standard thicknesses such as:
0.4 mm
0.8 mm
1.0 mm
1.2 mm
1.6 mm (most common)
2.0 mm
Custom thicknesses are also available depending on the application. Thicker boards are ideal for mechanical strength and high-current applications, while thinner boards are used in compact devices like smartphones.
When choosing FR4 PCB thickness, consider the following:
Mechanical strength: Thicker boards provide more durability.
Flexibility: Thinner boards can reduce weight and size.
Thermal load: More copper and greater thickness help dissipate heat.
Signal integrity: The distance between signal layers matters in high-speed designs.
Proper thickness planning improves performance and reduces warping during reflow or wave soldering.
What Is the Difference Between FR4 and FR5 PCB?
At first glance, FR4 and FR5 materials might seem very similarâtheyâre both fiberglass-based substrates. However, the key difference lies in their thermal performance.
Property
FR4
FR5
Max Temp. Resistance
~130â140°C
~170â180°C
Cost
Lower
Higher
Application
General electronics
High-temp environments
Dielectric Strength
High
Comparable to FR4
FR5 is a more heat-tolerant version of FR4 but also more expensive. Unless your project involves high temperatures, FR4 will typically be the better option. Most consumer and industrial electronics use FR4 unless extreme thermal demands require upgrading to FR5.
FR4 PCB Manufacturing Process â Step by Step
Now that we’ve covered the material, stack-up, and design considerations, let’s explain the whole FR4 PCB manufacturing process.
1. Material Preparation
Manufacturing starts with selecting the right FR4 board based on the desired thickness and copper weight. Sheets are cut into panels and cleaned for processing.
2. Inner Layer Imaging
For multilayer PCBs, inner copper layers are etched first. A photoresist is applied, and the circuit pattern is transferred using UV light. Unwanted copper is etched away using a chemical solution.
3. Layer Alignment & Lamination
Once inner layers are etched, layers are stacked with prepreg (uncured FR4 resin sheets) between them. This stack is laminated under heat and pressure to bond all layers together.
4. Drilling
Next, holes are drilled for vias and through-hole components. High-speed CNC machines or laser drills are used depending on the design.
5. Plating
Drilled holes are chemically treated and then electroplated with copper. This forms conductive paths between layers.
6. Outer Layer Imaging & Etching
Outer copper layers go through the same imaging and etching process as the inner layers. The circuit pattern is created using photoresist and chemical etching.
7. Solder Mask Application
A protective solder mask is applied to insulate copper traces and prevent solder bridges. This step also gives the board its green (or sometimes blue, red, or black) color.
8. Silkscreen Printing
Component labels and identifiers are printed on the board using white epoxy ink.
9. Surface Finish
Surface finishes like HASL, ENIG, or OSP are added to exposed copper pads. This step improves solderability and protects the copper.
10. Routing and V-Cutting
Boards are cut into their final shape using routers or V-cut machines.
11. Electrical Testing
Each board is tested for shorts, opens, and other faults using flying probe or fixture-based testers.
12. Final Inspection and Packing
Boards are visually inspected and packed in anti-static materials for delivery.
Considerations During FR4 PCB Manufacturing
There are several factors to keep in mind when manufacturing with FR4:
Thermal Expansion: Consider the coefficient of thermal expansion, especially for multilayer or BGA designs.
Glass Transition Temperature (Tg): Higher Tg FR4 is better for lead-free soldering and automotive applications.
Thickness Control: Even small deviations in FR4 PCB thickness can affect impedance and performance.
Copper Weight: Heavier copper requires more precise etching and lamination processes.
If you’re working with a reliable FR4 PCB manufacturer, these details are usually handled with strict quality controls.
Why Choose Best Technology for Your FR4 PCB Manufacturing?
At Best Technology, we specialize in high-quality PCB manufacturing using FR4 material. Whether you need simple prototypes or complex multilayer designs, our team delivers consistent quality with fast turnaround. We use advanced MES systems to track your PCBs through every step of production, ensuring traceability and precision.
Multilayer PCB design is at the heart of compact, high-speed electronics. As more devices require higher functionality in smaller packages, multilayer PCBs have become the go-to solution. In this blog, weâll explore how these boards are designed, what materials go into them, and how they are manufactured.
Best Technology is a trusted PCB manufacturer based in China, specializing in small to medium-volume PCB fabrication, PCB assembly, and comprehensive electronic manufacturing services (EMS). As a one-stop PCB solutions provider, we go beyond manufacturing. Our services cover turnkey assembly, component sourcing, box build assembly, PCBA testing, and full electronics assembly. Whether you’re developing a prototype or scaling up to full production, Best Technology is committed to delivering reliable quality, fast turnaround, and personalized support to meet all your PCB and electronics manufacturing needs.
What Is PCB Multilayer?
A multilayer PCB is a type of printed circuit board made by stacking multiple copper layers with insulating materials in between. While a single-sided PCB has only one conductive layer and a double-sided PCB has two, a multilayer PCB typically starts at four layers and can exceed thirty layers depending on the design complexity.
These copper layers are interconnected using vias (small plated holes). The main advantage is that multilayer PCBs allow more complex circuitry in a compact form. Theyâre used when simple routing becomes impossible due to high component density, high-speed signals, or design restrictions.
Multilayer boards usually contain signal layers, power planes, and ground planes that are symmetrically arranged to ensure electrical balance and mechanical stability.
Advantages of Multilayer PCB
There are many advantages of multilayer PCBs, especially for high-end, compact, and performance-driven applications:
High Circuit Density: Multilayer PCBs offer more real estate by using multiple layers. This helps route more connections without crowding.
Compact Size: By stacking layers, complex circuits can be condensed into smaller board sizes, which is important for modern gadgets.
Better Signal Integrity: Ground and power planes shield signal layers, helping reduce electromagnetic interference and signal loss.
Enhanced Reliability: Since many connections are internal and automated, multilayer PCBs tend to be more reliable than manually wired boards.
Improved Power Distribution: Dedicated power planes help distribute power evenly across the board.
Cost Efficiency in Mass Production: Although more expensive to design, they become cost-effective when produced at scale.
What Materials Are Used for Multilayer PCB?
Multilayer PCB construction involves several materials chosen based on the applicationâs electrical, thermal, and mechanical requirements. Common materials include:
Copper Foil: Used for all conductive layers. Thickness ranges from 0.5oz to 3oz, depending on current requirements.
Core Material (FR4): The most widely used substrate, made from fiberglass-reinforced epoxy. It provides mechanical strength and insulation.
Prepreg (Pre-impregnated resin): A resin-impregnated fiberglass that bonds layers together during lamination.
High-Frequency Materials: For applications like 5G or RF circuits, materials such as PTFE, Rogers, or ceramic substrates are used.
Solder Mask: This green or colored coating protects the board from oxidation and solder bridges.
Silkscreen: Printed on the board to mark component positions and labels.
For high-temperature or high-reliability applications, alternative materials like polyimide or metal cores may also be used.
Why Are There No 3 Layer PCBs?
Technically, you can make a 3-layer PCB, but they are very uncommon and often impractical. PCB manufacturing is designed to favor even-numbered layer configurations for several reasons:
1. Symmetry: Even-layered stack-ups offer better mechanical balance. Odd layers may lead to board warping due to uneven internal stress.
2. Manufacturing Simplicity: Most production lines are optimized for 4, 6, or 8 layers. A 3-layer board would require a custom process, which increases cost.
3. Signal Performance: High-speed signals benefit from a symmetrical structure. Odd-layer designs make it harder to maintain signal and power integrity.
Because of these reasons, designers usually move to 4-layer designs when they outgrow double-sided layouts.
How to Design a Multilayer PCB?
Designing a multilayer PCB starts with understanding the functional needs of your product. Hereâs a step-by-step process:
Define Layer Count: Decide how many layers are required based on circuit complexity, signal integrity, and available space. Common configurations include 4, 6, and 8 layers.
Create a Stack-Up: Plan how each layer will function â signal, ground, or power. Layer arrangement impacts EMI performance and routing efficiency.
Component Placement: Place high-speed, sensitive, and power components with care. Keep analog and digital sections separate.
Routing Strategy: Route critical signals on inner layers to shield them from external noise. Use short, direct routes for clock and high-speed lines.
Via Planning: Use through-hole vias, blind vias, and buried vias to connect different layers.
Impedance Control: For high-speed signals, calculate and control the trace impedance using PCB design software.
Thermal Management: Add thermal vias and consider copper pour for better heat distribution.
Design for Manufacturability (DFM): Ensure trace widths, spacing, hole sizes, and clearances follow manufacturer guidelines.
Design tools like Altium Designer, Eagle, or KiCad can help streamline multilayer PCB design while checking for errors along the way.
How to Build a Multilayer PCB Stack-Up?
A stack-up is the arrangement of copper and dielectric layers in a multilayer PCB. It affects signal quality, EMI, thermal behavior, and mechanical strength.
Common 4-Layer Stack-Up:
Top layer: Signal
Inner layer 1: Ground
Inner layer 2: Power
Bottom layer: Signal
6-Layer Stack-Up Example:
Top: Signal
Layer 2: Ground
Layer 3: Signal
Layer 4: Signal
Layer 5: Power
Bottom: Signal
Tips for Effective Stack-Up:
Keep ground and power layers close for decoupling.
Place critical signals between ground planes.
Symmetry reduces warping.
Maintain consistent dielectric thickness to control impedance.
At Best Technology, our engineering team assists clients with stack-up planning to match their performance, size, and cost targets.
Multilayer PCB Manufacturing Process
The multilayer PCB manufacturing process involves combining multiple copper and insulation layers through precise steps:
1. Inner Layer Imaging
Each internal copper layer is printed with the desired circuit pattern using photoresist and UV light.
2. Etching
Unwanted copper is chemically etched away, leaving only the circuit traces.
3. Lamination
All layers are stacked with prepreg between them and laminated under high heat and pressure to form a single board.
4. Drilling
Holes are drilled through the stack to connect layers. These include through-hole, blind, and buried vias.
5. Plating
Copper is plated into drilled holes and on the boardâs surface to create electrical paths.
6. Outer Layer Imaging and Etching
Outer layers undergo the same photoimaging and etching process as inner layers.
7. Solder Mask and Silkscreen Application
A solder mask is added to prevent oxidation and short circuits. Silkscreen is printed for component labeling.
8. Surface Finishing
Finishes like HASL, ENIG, or OSP are applied to pads for better solderability.
9. Testing and Inspection
Every board undergoes electrical tests and visual inspections to catch defects.
At Best Technology, we combine automated optical inspection (AOI), flying probe testing, and impedance measurement tools to ensure product quality at every stage.
Multilayer PCB Application
Multilayer PCBs are used in products where performance and miniaturization are critical. Here are some typical multilayer PCB applications:
Smartphones and Tablets: Compact devices need high-density PCBs to fit advanced features in tight spaces.
Medical Equipment: Imaging machines, heart monitors, and portable diagnostic tools depend on stable multilayer circuits.
Automotive Electronics: Modern vehicles use multilayer PCBs for infotainment systems, sensors, and control units.
Telecommunication Devices: Routers, switches, and 5G antennas rely on multilayer designs for signal integrity.
Industrial Controls: Multilayer PCBs support automation equipment and high-voltage circuits.
Military and Aerospace: Satellites, drones, and radar systems require rugged multilayer boards with excellent thermal and electrical performance.
How to Identify Multilayer PCB?
Identifying a multilayer PCB can be tricky just by looking at the surface. However, here are some tips:
Edge View: Under a magnifier, you can often see multiple stacked layers at the board edge.
X-ray Inspection: In factories, X-ray equipment can show internal connections and vias not visible from outside.
Blind/Buried Vias: If the board has vias that donât go through the entire thickness, itâs likely multilayer.
Complexity and Component Density: A compact board handling many components usually suggests a multilayer design.
FAQs
1. What is the typical number of layers in a multilayer PCB?
Most commonly, multilayer PCBs have 4, 6, or 8 layers. High-end designs may go up to 32 or more.
2. Can multilayer PCBs be flexible?
Yes. Flexible multilayer PCBs are used in wearables, cameras, and aerospace applications where bending is needed.
3. Are multilayer PCBs expensive?
They cost more than single or double-layer PCBs but offer more value in space savings and performance.
4. Whatâs the difference between blind and buried vias?
Blind vias connect outer and inner layers. Buried vias connect internal layers only, and are hidden from the surface.
5. How does Best Technology support multilayer PCB projects?
We offer complete support â design review, stack-up suggestions, high-speed materials, and full traceability via MES systems.
When a cold solder joint appears on a PCB, it might not fail immediately. But over time, it can cause real troubleâintermittent signals, unstable connections, or even complete circuit failure. These defects are often hidden, and if not caught early, they can waste time and money in rework.
In this blog, youâll learn:
What a cold solder joint looks like
What causes it
How to avoid and fix it
Why a trusted PCB assembly partner like Best Technology matters
What is a Cold Solder Joint?â
A cold solder joint or cold joint solder, is a defective connection between a component lead or terminal and a PCB pad during PCB assembly process. Unlike a properly formed solder joint, which provides a strong, reliable electrical and mechanical connection, a cold solder joint fails to fully bond the two elements together.â
When soldering is done correctly, the solder melts completely and wets both the component lead and the PCB pad, creating a smooth, shiny, and concave surface. In the case of a cold solder joint, however, the solder doesn’t reach its optimal melting point or doesn’t flow properly. This results in a rough, dull, and often uneven surface. The joint may look like it’s attached, but in reality, the connection is weak and prone to failure. It might conduct electricity intermittently or not at all, leading to erratic behavior in the electronic device, from occasional glitches to complete breakdowns.â
Cold Solder Joint Causesâ
Several factors can contribute to the formation of cold solder joints. Understanding these causes is the first step in preventing them.â
Inadequate Soldering Temperatureâ
One of the primary culprits is insufficient soldering temperature. Each type of solder has a specific melting range, and if the soldering iron or reflow oven doesn’t reach and maintain the appropriate temperature, the solder won’t melt fully. For example, if the temperature is too low, the solder may only partially liquefy, leaving solid particles that prevent a proper bond.
Incorrect Soldering Timeâ
If the soldering iron is applied for too short a time, the solder won’t have enough time to melt and flow properly. On the flip side, overheating the joint by leaving the soldering iron on for too long can also cause problems. It can damage the component leads, PCB pads, or even change the properties of the solder itself, potentially leading to a cold solder joint.â
Poor Surface Preparationâ
The cleanliness and condition of the surfaces to be soldered are vital. If the component leads or PCB pads are dirty, oxidized, or contaminated with oils, residues, or other substances, the solder won’t adhere properly. Oxidation, in particular, forms a thin layer on the metal surfaces that acts as a barrier to soldering.
Inappropriate Flux Usageâ
Flux is a key component in the soldering process. It helps clean the surfaces, remove oxidation, and promote the flow of solder. However, using the wrong type of flux, too little flux, or applying it incorrectly can lead to cold solder joints. Some fluxes may not be compatible with certain solders or components, while insufficient flux won’t provide enough cleaning and wetting action.
Component Movement During Solderingâ
When components move while the solder is still molten, it can disrupt the formation of a proper joint. This can happen due to vibrations during the soldering process, improper handling of the PCB, or insufficient securing of the components. Even a small movement can break the developing bond, resulting in a cold solder joint or a weak connection.â
Cold Solder Joint Picturesâ
Visual aids can be extremely helpful in identifying cold solder joints. Here are common visual signs:
Dull, Grainy Appearance: A good joint is shiny and smooth. Cold ones look frosty or matte.
Cracks or Gaps: Visible separations or voids between the component and pad.
Ball-Like Shape: If the solder beads up instead of flowing smoothly, it likely didnât bond.
Lifting Leads: Components that seem slightly off the pad may signal a cold joint underneath.
Identifying a good solder joint is just as important as recognizing a cold one. A high-quality solder joint has several distinct characteristics:â
1. Appearanceâ
A good solder joint should have a smooth, shiny, and concave surface. The solder should flow evenly around the component lead and onto the PCB pad, forming a natural fillet.
2. Wettingâ
Proper wetting is a key indicator of a good solder joint. The solder should spread and adhere evenly to both the component lead and the PCB pad, covering the surfaces completely. When the wetting is correct, there will be no gaps, voids, or bare spots where the metal surfaces are exposed.
3. Strengthâ
A well-soldered joint should be strong enough to hold the component in place firmly. Gently tugging on the component (with appropriate care not to damage it) should reveal a solid connection.
How to Avoid Cold Solder Jointsâ?
Prevention is better than repair. Hereâs how to keep cold solder joints from happening in the first place:
1. Use the Right Temperature
Always set your soldering iron between 350°C to 400°C for standard lead-based solder. Higher temperatures may be needed for lead-free types.
2. Pre-Clean Pads and Leads
Use isopropyl alcohol to clean surfaces before soldering. Dirt and oxidation are invisible enemies.
3. Donât Skip the Flux
Flux removes oxidation and improves solder flow. Many solder wires include it, but extra flux helps in difficult spots.
4. Keep Steady Hands
Hold the component and iron steady until the solder cools. Use clamps or tools if needed.
5. Pick Quality Tools
Poor-quality irons with unstable tips lead to inconsistent heat. Invest in a reliable soldering station with temperature control.
6. Work in a Clean, Static-Safe Area
Humidity, static, and poor lighting all raise the chances of making mistakes.
How to Fix Cold Solder Jointsâ?
Despite our best efforts, cold solder joints may still occur. Fortunately, there are ways to fix them:â
1. Solderingâ
The first step in fixing a cold solder joint is often desoldering. Use a desoldering pump or wick to remove the existing solder from the joint. Heat the joint with the soldering iron to remelt the solder, and then use the desoldering tool to suck up or absorb the molten solder. Make sure to remove all the old solder completely to start fresh.â
2. Cleaningâ
After desoldering, clean the surfaces again to remove any flux residues, oxidation, or other contaminants that may have accumulated. This step is crucial for ensuring a proper repair. Use a suitable cleaning solution and a clean brush or cloth to wipe the surfaces clean.â
3. Resolderingâ
Once the surfaces are clean, it’s time to resolder the joint. Apply a small amount of fresh flux to the cleaned surfaces, and then heat the joint with the soldering iron. When the flux starts to bubble and activate, feed a small amount of solder into the joint.
4. Inspection and Testingâ
After resoldering, inspect the joint visually to make sure it looks good and meets the criteria for a proper solder joint. Then, use testing equipment to verify the electrical connection. Check for continuity and make sure the joint is conducting electricity properly. If any issues are found, repeat the desoldering, cleaning, and resoldering process until the joint is fixed.â
Trust PCB Assembly Service Provider â Best Technologyâ
Avoiding cold solder joints isn’t just about skillsâit’s also about choosing the right PCB assembly partner. At Best Technology, we follow strict quality processes to ensure every joint is clean, strong, and reliable. Hereâs how we guarantee excellence:
A perf board, often referred to as a perforated board, is a type of printed circuit board (PCB) thatâs widely used in prototyping and DIY electronics. Unlike fully fabricated PCBs, a perf board offers a flexible way to mount and wire components before committing to a finalized design. If youâve ever wondered how electronics hobbyists or engineers test ideas quickly, perf board printed circuit boards (PCBs) are often the answer.
What is Perf Board Printed Circuit Boards PCBs?
Perf boards are thin boards made from an insulating material like fiberglass or phenolic resin, pre-drilled with evenly spaced holes. These holes are laid out in a grid pattern and are designed to hold through-hole electronic components. The term âperf board printed circuit boards PCBsâ refers to this category of PCBs that lack pre-designed traces but allow for custom circuit construction.
Unlike standard PCBs, perf boards donât come with etched copper paths. You can design your own connections using wires or solder bridges, offering full control of your circuit layout.
What is Another Name for a Perfboard?
Perfboards are also known as prototyping boards, dot boards, or project boards. In some circles, theyâre casually called âproto boards.â While names vary, their purpose remains the same: to provide a quick, hands-on way to build, test, and modify circuits during the design phase.
What is Perf Board Made Of?
Most perf boards are made from one of two materials:
FR4 (Fiberglass Reinforced Epoxy): Durable and commonly used in professional settings.
Phenolic Resin: More affordable but slightly brittle, usually found in budget DIY kits.
The board has a grid of holes, and in some cases, those holes are surrounded by copper pads, especially in copper-clad perf boards. These pads allow easy soldering of components and jumpers.
What Does a Perf Board Do?
A perf board allows engineers and hobbyists to construct electronic circuits manually. You mount components through the holes and connect them with wire or solder to form the circuit. Itâs especially useful for:
Rapid prototyping
Small-scale production
Educational projects
Repair or replacement circuits
Perf boards eliminate the wait time and cost associated with custom PCB fabrication during early design phases.
What is the Difference Between a Perf Board and a Breadboard?
This is a common question for beginners, and the differences are worth understanding:
Feature
Perf Board
Breadboard
Reusability
Single-use
Reusable
Soldering
Required
Not needed
Electrical Conductivity
Manual with wires/solder
Internal metal strips
Component Stability
Permanent
Temporary
Best for
Finalizing prototypes
Initial testing & concept design
If you’re experimenting with a new idea, start with a breadboard. When you’re ready to make it permanent, switch to a perf board.
Perf Board Dimensions
Perf boards come in various standard sizes, typically measured in holes (e.g., 60×40 holes) or in millimeters. Here are a few common options:
3cm x 7cm (30mm x 70mm): Great for small circuits or microcontroller projects
5cm x 7cm: A medium size, popular for Arduino-based designs
9cm x 15cm: Ideal for complex circuits with more components
The standard hole spacing is 2.54mm (0.1 inch), which aligns perfectly with most DIP (dual in-line package) components.
Perf Board Price
Prices vary based on size, material, and copper coverage. Hereâs a general range:
Small perf board (3×7 cm): $0.20â$1.00 each
Medium board (5×7 cm): $0.50â$2.00 each
Large board (9×15 cm): $1.50â$5.00 each
Buying in bulk usually reduces cost. For instance, a 10-pack of medium boards may cost under $10 on platforms like Amazon, AliExpress, or Digi-Key.
How to Use a Perf Board?
Using a perf board is an excellent way to build a permanent version of a prototype circuit. Here’s a step-by-step approach to help you get startedâeven if you’re new to soldering or circuit design:
1. Plan Your Layout
Before inserting components, sketch your circuit on paper or use software like Fritzing or KiCad. Try to place components in a way that minimizes the number of jumpers and crossing wires. Make sure power and ground rails are easy to access.
2. Insert the Components
Place the components into the holes of the perf board with the leads facing down. Start with the shortest components (like resistors), then work your way up to taller ones (like capacitors or IC sockets). This helps keep the board level while soldering.
3. Secure the Components
Bend the leads slightly on the bottom side of the board to hold components in place. This is especially helpful if youâre working with many parts at once or if the board is going to be moved before soldering.
4. Solder the Leads
Once your components are in place, flip the board over and solder each lead to its corresponding pad. Try to heat both the pad and the lead at the same time for a clean solder joint.
5. Trim Excess Leads
After soldering, use flush cutters to snip off the extra length of the component leads. This prevents shorts and makes the back of the board neat.
6. Make Electrical Connections
Now itâs time to connect the components electrically. You can use:
Hook-up wire: Strip and bend it to form paths between solder points.
Solder bridges: Add a small amount of solder to connect two nearby pads.
Insulated jumper wires: For long connections across the board.
Tip: Color-code your wires for easier troubleshooting later (e.g., red for VCC, black for GND, yellow for signal).
7. Test the Circuit
Before powering up, check all connections with a multimeter. Look for continuity and confirm there are no shorts between adjacent traces or leads.
This process may take a bit of time, but it helps you build a functional and clean circuit thatâs much more durable than a breadboard setup.
Perfboard Soldering Tips and Techniques
Soldering is a crucial step when working with perf boards. Good soldering makes your circuit reliable and long-lasting. Here are some essential tips and techniques to get better, cleaner, and more efficient solder joints:
1. Use the Right Soldering Iron
Choose a soldering iron with a fine tip and adjustable temperature, especially for delicate components. A temperature of around 350°C is good for most standard soldering jobs.
2. Select Quality Solder
Use 60/40 tin-lead rosin core solder or lead-free solder if safety or regulations require it. Thin solder (like 0.6mm) is easier to control for small connections.
3. Keep the Tip Clean
Clean the soldering iron tip with a damp sponge or brass wire before and after every few joints. This helps maintain heat transfer and reduces oxidation.
4. Pre-tin the Tip
Apply a small amount of solder to the tip before you start. This thin coating improves heat transfer to the pad and component lead.
5. Solder Quickly and Precisely
Touch the iron to the joint (pad and lead) for about 1â2 seconds, then feed in solder. Pull the iron away once enough solder has flowed. Avoid lingering too long, as overheating can damage the pad or component.
6. Avoid Cold Solder Joints
Cold joints happen when the solder doesnât melt fully. They appear dull or cracked and can lead to unreliable connections. Always ensure the joint is shiny and slightly concave.
7. Use Heat Shrink or Insulation
When making jumpers or exposed connections, cover them with heat shrink tubing or use insulated wire to prevent accidental shorts.
8. Work in a Well-Ventilated Area
Soldering fumes can be harmful. Work near a window or use a small fume extractor to keep the air clean.
9. Double-Check Your Work
After finishing the soldering, inspect every joint. Use a magnifying glass if needed. A continuity check with a multimeter is also recommended.
10. Practice Makes Perfect
If youâre new to soldering, consider practicing on a spare perf board with some scrap components. Developing steady hands and learning how solder flows will improve your technique quickly.
Why Choose Best Technology for Custom PCBs?
While perf boards are great for prototyping, finalized products need custom-made PCBs. Thatâs where Best Technology comes in. We specialize in designing and manufacturing high-quality PCBs for various industries, from consumer electronics to automotive and aerospace.
We use a MES traceability system, provide professional engineering support, and offer competitive pricing even for low-volume orders. Whether you’re upgrading from perf board to custom PCB or need help bringing a prototype to life, Best Technology has you covered.
FAQs
1. Can I use surface-mount components on a perf board?
Yes, but itâs trickier. Youâll need to manually create pads using wire or copper tape.
2. Are there perf boards with pre-connected tracks?
Yes, stripboards have rows of connected holes, which help speed up certain circuit designs.
3. Can perf boards handle high current?
Only to a certain extent. For higher currents, wider copper traces or bus bars are preferred.
4. Where can I buy perf boards?
Theyâre available online on Amazon, eBay, Digi-Key, Mouser, and local electronics stores.
5. Whatâs the best way to plan a circuit on a perf board?
Use grid paper or software like Fritzing to lay out components before building.
PCB panelization is a critical step in the manufacturing process that directly impacts production efficiency, material waste, and overall costs. Poor panel design can lead to lower yields, increased scrap, and delays in assembly. In this blog, weâll explore actionable strategies to optimize PCB panelization for higher yield and cost savings.
Why Panelization Matters in PCB Manufacturing?
Panelization refers to arranging multiple PCB designs onto a single manufacturing panel (or “array”) for batch processing. Key benefits include:
Reduced material waste: Maximizing panel space utilization.
Faster assembly: Enabling automated pick-and-place machines to process multiple boards simultaneously.
Lower handling costs: Fewer individual boards to manage during fabrication and assembly.
However, suboptimal panelization can lead to:
Warpage during soldering.
V-score or routing errors.
Increased breakage during depaneling.
6 Tips to Optimize PCB Panelization
Base on our 19+years experiences in the PCB manufacturing field, today I would like to share you 6 Strategies to Optimize PCB Panelization
1. Choose the Right Panel Size
Align your PCB dimensions with standard panel sizes (e.g., 18″x24″, 21″x24″) to minimize material trimming.
Example: If your board is 80mm x 60mm, arrange 4×6 units on a 324mm x 480mm panel to reduce unused space.
2. Optimize Board Arrangement
Rotation: Rotate boards to fit more units per panel.
Mirroring: Use symmetrical designs to avoid “wasted” gaps.
The choice of depaneling (separating individual boards) affects yield and edge quality:
V-Score: Low cost and fast, but requires straight edges and may weaken boards.
Tab Routing: Ideal for irregular shapes but adds milling time.
Laser Cutting: Precision for high-density designs, but higher cost.
Rule of thumb: Use V-score for rectangular boards and routing for complex shapes.
4. Add Breakaway Tabs and Mouse Bites
Breakaway tabs: Small connectors between boards to prevent movement during assembly.
Mouse bites: Perforated holes for easy manual separation.
Spacing: Maintain 1.5â2mm between boards to avoid solder mask bridging.
5. Incorporate Fiducials and Tooling Holes
Add global fiducials to the panel for accurate alignment during SMT assembly.
Include tooling holes (3.2mm diameter) to secure the panel during drilling and routing.
6. Balance Quantity vs. Risk
Overcrowding panels increases the risk of cross-board defects.
Underutilizing panels raises material costs.
Recommended: Aim for 4â20 boards per panel, depending on size and complexity.
Case Study: Cost Savings Through Smart Panelization
A consumer electronics manufacturer redesigned their 50mm x 50mm IoT module panel:
Initial design: 8 boards/panel with 15% wasted space.
Optimized design: 12 boards/panel using rotated layouts and shared tooling holes.
Results:
15% reduction in material costs.
10% faster SMT assembly.
Fewer depaneling errors due to improved tab routing.
Common Panelization Mistakes to Avoid
Ignoring manufacturer capabilities: Always consult your PCB fabâs panel size and tolerances.
Overcomplicating shapes: Complex panels increase milling time and scrap rates.
Skipping test coupons: Include test patterns for impedance control and quality checks.
Conclusion
Optimizing PCB panelization requires a balance of geometric efficiency, process knowledge, and collaboration with manufacturers. By implementing these strategies, you can reduce waste, improve yields, and lower production costs without compromising quality.
Pro Tip: Use panelization-specific design rules in tools like Altium or KiCad to automate compliance checks.
Also, if you want to know more about how to optimize PCB Panelization for Higher Yield and Lower Cost, please feel free to inquiry from us.
Best Technology, your trusted PCB & PCBA manufacturer with over 19 years of industry expertise, is excited to return to New-Tech Israel 2025! After a successful participation last year, weâre back with even more innovative products and solutions. Weâd love to see you at our booth!
Date & Time:
As someone whoâs had the chance to participate in this event before, I can honestly say itâs one of the best opportunities to explore cutting-edge technology and network with industry experts. If youâre in the PCB, electronics, or manufacturing industries, this is a must-visit event!
Transparent/PI/Rubber Silicone Flexible Heating Films
Semi-Flexible PCBs & Bendable Aluminum PCBs
Ceramic Packages
Our experts will be available to provide in-depth insights on PCB assembly, covering everything from prototypes to low and high-volume production. Whether you need FPC, PCB, MCPCB, or Ceramic PCBs, weâre here to support your entire project with end-to-end servicesâfrom components sourcing to board fabrication, and even final assembly with programming and testing.
Our International Certifications
ISO 9001 (Quality Management System)
ISO 13485 (For Medical Device)
IATF 16949 (For Automotives)
AS 9100D (For Aerospace Parts)
At Best Technology, we take quality seriously. Our commitment to excellent quality is demonstrated by those international certifications we got!!!
Exciting News: Our New SMT Factory in Vietnam
May some friends missed out our post, we would like to emphasis again that weâve recently expanded with a new SMT factory in Vietnam! This expansion will allow us to offer even faster turnaround times, greater scalability for our PCB assembly services.
Canât Make It to the Event?
If youâre unable to attend in person but are still interested in learning more about our innovative products, weâd love to hear from you! Feel free to contact us directly for more information, product details, or a personalized consultation.
About New-Tech
The New-Tech Exhibition is the largest and major exhibition of the HiâTech & Electronics in Israel. More than 150 companies, who lead these fields in Israel and around the world, will take part and exhibit in this trade show.
This exhibition show featuring a comprehensive array of electronic components, production processes, subcontracting services, clean room equipment, electro-optic devices, test equipment, printed circuit boards, industrial materials, computerization solutions, robotics, power systems, RF/microwave technologies, and more. Attendees can explore cutting-edge innovations in development, design, engineering, and procurement across various industries.
Donât miss outâregister now and visit us at Booth 78 to see how Best Technology can help you take your projects to the next level!
It is important to note:
1. Participation in the exhibition is conditional on prior registration, even for invited customers.
2. After registration and before the conference, a code will be sent to the mobile to confirm participation in the conference.
Have you ever wondered what powers your mobile phone behind the screen? Every tap, swipe, or call you make is possible because of one hidden hero: the mobile phone PCB. In simple terms, the mobile circuit board connects and controls all parts of your phone. It links the battery, screen, camera, processor, and even your wireless network. Without it, nothing would work.
At Best Technology, we design and manufacture custom mobile PCBs that support todayâs advanced smartphones. As a leading mobile PCB manufacturer both in China and Vietnam, we have decades years of experience in producing high-quality boards for mobile devices, wearables, and smart electronics. Certificated by ISO9001, IATF16949, ISO13485, AS9100D, it shows we have enough capability to produce highest quality mobile PCB board. Whether you need flexible, rigid, HDI, RF or multilayer PCBs, we deliver one-stop solutions with fast turnaround and competitive pricing.
What Is a Mobile Phone PCB?
A mobile phone PCB is the core of your smartphone, which drives your phone be intelligent. It looks like a green or black plate populated with many small electronic parts. These components are connected through thin copper lines etched onto the board. Together, they power your phone and make sure each part works smoothly.
In smartphones, the PCB board mobile phone is usually a multi-layer board, meaning it has several layers stacked together. This design helps save space and supports high-speed data processing. The PCB also holds all essential parts like the processor, memory, charging port, and wireless chips.
What Does a Mobile Phone PCB Actually Do?
A mobile phone PCB acts like the brain and nervous system, it mainly used to connect and manage every part of the phone, its working principle is:
Power distribution: It sends power from the battery to other parts.
Signal transmission: It lets the processor talk to the screen, camera, and sensors.
Component support: It holds everything in place and keeps them working together.
Without the mobile phone PCB, the battery wouldnât know how to charge, the screen wouldnât respond, and the speaker wouldnât play music. It handles all the behind-the-scenes activity while you use your apps and make calls.
Core Components on a Mobile Phone PCB
A mobile phone PCB always is a populated PCB. At the top of the PCB, youâll find the antenna point, where the antenna connects. Your phone connects to Wi-Fi, Bluetooth, and cellular networks through these antennas. Each component on the PCB plays its unique role:
Antenna Switch: A 16-leg switch that controls signal direction. Sometimes built together with the PFO.
PFO (Power Frequency Oscillator): Manages signal frequency. Found next to the antenna switch.
Network IC: Controls mobile network functions. In some phones, it’s built into the CPU.
Power IC: Found near brown capacitors. Regulates power across the PCB.
CPU (Processor): The largest IC. Handles all system commands and performance tasks. Some phones have two CPUs.
Flash IC: Stores system data and software. Located beside the CPU.
Logic IC: A 20-pin chip. Manages basic logic operations.
Charging IC: Found beside R22. Controls battery charging.
Audio IC: Controls sound functions. Placed close to the Power IC.
Capacitors: Store and release electrical energy. Help stabilize power supply.
Resistors: Control the flow of current. Protect other parts from too much power.
Diodes: Allow current to flow in one direction only. Prevent power damage and signal errors.
Below is a multi-layer PCB used in iphone. These parts make it possible for you to browse, take photos, and connect with the world.
Why Multi-layer PCBs Are Standard in Smartphones?
Todayâs smartphones are like mini computers. They handle everything from streaming video to running powerful apps. To keep up, mobile phone PCB design has evolved. One of the biggest upgrades? The switch to multi-layer PCBs. Here we listing main advantages of using multi-layer PCBs in mobile phone.
Firstly, multi-layer PCBs offer higher circuit density, allowing more components like processors and memory to fit in the limited space. For example, the iPhone 14 Pro uses a 10-layer PCB to deliver powerful functionality in a compact design.
Secondly, they improve high-speed signal transmission by reducing interference through ground and shielding layers, ensuring stable and fast data transferâa must for modern smartphones.
Additionally, multi-layer PCBs reduce the size and weight of smartphones. By accommodating more circuits in the same area, they help achieve smaller, lighter designs, like in the Apple Watch Series 8.
Finally, multi-layer PCBs enhance reliability and mechanical strength. Their complex construction improves durability and vibration resistance, ensuring a longer-lasting product.
How Inner and Outer Layers Interact in a Mobile PCB Stack?
In a mobile PCB board, the inner and outer layers work together like a team. The outer layers handle the connection of chips, antennas, and components you can see. Meanwhile, the inner layers manage signal traces, power distribution, and ground planes.
Signals often travel between these layers through viasâsmall holes filled with metal that link one layer to another. This allows for faster, cleaner communication between the mobile PCB components, such as the CPU, RAM, and radio circuits.
Materials Used in Mobile PCB Board
Choosing the right materials is crucial in mobile phone PCB manufacturing. Each layer and part of the board serves a different purpose, so engineers carefully select materials to match performance needs, durability, and size constraints. Hereâs a comparison of commonly used mobile PCB materials:
Material
Description
Pros
Common Use in Mobile PCB
FR4
Fiberglass-reinforced epoxy laminate
Cost-effective, stable electrical properties
Base material in most mobile PCB cores
Polyimide
Flexible and heat-resistant material
Great for flexible PCBs and foldable applications
Used in camera modules, folding phones
Rogers
High-frequency laminate
Low dielectric loss, excellent RF performance
Antenna sections, 5G, Wi-Fi, Bluetooth
Teflon (PTFE)
Non-stick, high-performance polymer
Ultra-low signal loss, ideal for high-speed signals
Used in high-speed communication layers
Ceramic
Advanced inorganic composite
Excellent heat dissipation, high frequency stability
Power modules, 5G RF front-end, shielding
PCB Layout Basics for Mobile Phones
A solid layout is the backbone of any mobile phone PCB. Designers start with the schematic, which maps every component and connection. Mobile PCB layout focuses on a few key goals:
Short signal paths to avoid delay.
Clear power and ground planes for stability.
Thermal zones to manage heat.
Shielded areas for RF sections like Wi-Fi and GSM modules.
Placing the processor, RAM, power management ICs, and antennas carefully prevents problems later.
Warm tips:
Keep power and ground layers as solid planes. Avoid breaks or thin sections, which create voltage drops. Also, decoupling capacitors should sit close to power pins of chips.
Tips for GSM, Wi-Fi, Bluetooth, and 5G Mobile PCB Antennas
Keep antennas away from metalâmetal blocks signals.
Use ground clearance around antenna traces to reduce noise.
Match impedance of the RF trace to avoid reflection.
Add shielding near high-speed digital lines to prevent signal loss.
For 5G, which uses millimeter-wave bands, the routing must be super precise. Even a few millimeters can affect signal strength. Tools like electromagnetic simulation software help refine these paths.
How AI and Automation Are Changing PCB Layout?
AI and automation have brought big changes to mobile PCB design in this two year. Instead of placing parts manually, designers can now rely on smart layout tools that optimize paths automatically. Machine learning predicts optimal routing paths. Automation assists in component placement, thermal analysis, and EMI reduction. They suggest better placements in secondsâsaving hours of work.
AI also speeds up mobile PCB testing. It spots defects on boards using image recognition. That means more accurate inspections, less rework, and faster production.
As AI tools improve, theyâll continue to reduce errors, cut costs, and deliver better mobile board designs. It’s a leap forward for the industry.
What Does Best Technology Serve You?
At Best Technology, we provide complete solutions for mobile PCB design and manufacturing. Whether you’re developing a new smartphone, tablet, or wearable device, we help you build it from the ground up. Our services including but not limited to:
Custom mobile phone PCB layout and design based on your needs
Single-layer to 32+ layer boards, including HDI, rigid-flex, and high-frequency options
Advanced material selection such as FR4, polyimide, Rogers, and BT epoxy
Rapid prototyping and small-volume production with quick delivery
Full testing services like AOI, flying probe, impedance, and X-ray inspection
With over 18 years in the PCB industry, weâve supported top-tier brands in building reliable, high-performance mobile electronics. Our team works closely with customers and give the best suggestions to optimize your mobile circuit board design. If you are interested in the mobile PCB develop, you are welcome to contact our team at sales@bestpcbs.com.
FAQs
1. What does a mobile phone PCB diagram show?
It shows where each component is placed on the board and how they are connected through copper traces.
2. How can I avoid power issues in PCB layout?
Use ground planes, short power paths, and place capacitors close to chips for voltage stability.
3. How do I identify damaged parts on a mobile PCB?
Use thermal cameras, multimeters, and reference schematics to locate shorted, burned, or faulty components.
4. What makes Best Technology a strong mobile PCB manufacturer?
They provide full-stack design-to-production all in one service, expert engineering support, DFM check, SI, PI analysis and a proven track record in mobile electronics.
Fiberglass circuit board is the backbone of todayâs electronics. These boards support and connect components in almost every electronic device, from consumer gadgets to industrial control systems. Unlike ordinary materials, fiberglass brings strength and stability. It holds up well under heat, resists moisture, and stays firm under mechanical stress.
What Are Fiberglass Circuit Boards?
A fiberglass circuit board is a type of printed circuit board (PCB) made using a base material reinforced with glass fibers and resinâtypically epoxy. This combination results in a strong, heat-resistant, and electrically stable platform used to mount and interconnect electronic components.
Also called printed circuit board fiberglass, these boards dominate the electronics industry thanks to their durability and consistent performance. From mass-produced gadgets to high-end machinery, fiberglass boards provide the structural and electrical backbone that keeps everything working smoothly.
What Are Fiberglass Boards Made Of?
Fiberglass boards are made from fine strands of glass spun into a fabric. This fabric, typically known as glass cloth, is then saturated with epoxy resin. Once hardened, the composite becomes the core insulating layer in a fiberglass circuit board.
The most common material is FR4. It includes:
Woven E-glass (Electrical-grade glass): Provides electrical insulation and dimensional stability.
Epoxy resin: Bonds the glass fibers and maintains structure under thermal stress.
Copper foil: Laminated onto one or both sides to create electrical pathways.
Together, these elements create an electrical fiberglass board that is tough, heat-resistant, and non-conductive at its core.
Types of Fiberglass Circuit Boards
Fiberglass circuit boards arenât one-size-fits-all. They come in multiple variations to meet different design and performance needs. Whether you’re designing a basic remote control or a complex radar module, there’s a fiberglass board fit for the job.
Single Layer Fiberglass Circuit Board
This is the most basic type. It has copper traces on only one side of the board. Itâs often used in low-cost consumer electronics, LED lights, and household appliances. Despite its simplicity, the fiberglass circuit board structure keeps it durable and stable.
Double Layer Fiberglass Circuit Board
With copper layers on both sides and vias connecting them, this board offers more routing space and better performance. Itâs a popular choice for audio equipment, industrial sensors, and power supplies. These boards balance cost with performance and are widely produced by fiberglass circuit board manufacturers worldwide.
Multilayer Fiberglass Circuit Board
These contain three or more layers of fiberglass and copper laminated together. They are essential for smartphones, routers, and advanced computing devices. With increased layer count comes better signal control and component density.
HDI Fiberglass Circuit Board
High-Density Interconnect (HDI) boards pack more functionality into smaller areas. They use microvias, blind vias, and fine lines to boost performance without increasing board size. HDI designs often use printed circuit board fiberglass materials for strength and tight tolerances.
High Frequency Fiberglass Circuit Board
For RF or microwave applications, standard fiberglass isnât always enough. Specialized fiberglass composites with low dielectric loss are used. These boards are perfect for radar systems, antennas, and satellite communication.
Rigid-Flexible Fiberglass Circuit Board
Combining rigid fiberglass sections with flexible polyimide layers, these hybrid boards offer both structural support and flexibility. Theyâre widely used in wearables, military electronics, and compact medical devices.
Features of Using Fiberglass Circuit Board
Fiberglass circuit boards offer several unmatched advantages. These features help explain why theyâre so common in nearly every electronic product.
Thermal Stability: Fiberglass holds up well under heat. It wonât warp or delaminate under typical operating conditions.
Dimensional Stability: Even in humid or fluctuating environments, the board keeps its shape.
Electrical Insulation: The glass fibers prevent current leakage and minimize signal loss.
Mechanical Strength: These boards donât crack easily. They can take a beating during assembly or usage.
Low Fiberglass Board Price: Compared to ceramics or PTFE substrates, fiberglass board price is much lowerâwithout major performance tradeoffs.
Why Is Fiberglass Used in Motherboards?
Motherboards are the nerve center of any computing device. They require a substrate thatâs flat, stable, and electrically inert. Fiberglass checks all those boxes. Its woven glass core resists bending and warping over time, ensuring that pins, sockets, and solder joints stay aligned. It also helps dissipate heat generated by processors and other high-power components.
Motherboards also demand multi-layered structures. Only multilayer fiberglass circuit boards can deliver the routing density needed for complex connections between CPU, RAM, GPU, and other modules. That’s why fiberglass remains the default material for virtually all desktop and laptop motherboards.
What Is Fiberglass Board Used For?
Beyond motherboards, electrical fiberglass boards are everywhere:
Consumer Electronics: Smartphones, TVs, game consoles.
Thanks to their adaptability and performance, fiberglass boards can be customized for nearly any electrical task. This is why fiberglass circuit board manufacturers remain in high demand globally.
Why Is Fiberglass Hazardous?
Though highly useful, fiberglass isnât without precautions. During manufacturing, cutting or sanding fiberglass can release microscopic glass particles. These can irritate the skin, eyes, and respiratory system. Thatâs why workers must wear protective gear in production settings.
However, once the board is sealed and installed, it poses minimal risk. Finished electrical fiberglass boards are stable, safe, and inert under normal use conditions. They do not emit toxins or degrade during product life.
Is Glass Fiber the Same as Fiberglass?
Technically, yesâglass fiber and fiberglass refer to the same material. âGlass fiberâ usually describes the raw filament or strands. âFiberglassâ refers to the composite made from glass fibers and resin.
In PCB manufacturing, the terms are often used interchangeably. Whether you say printed circuit board fiberglass or glass fiber PCB, the meaning remains consistent: a reliable, heat-resistant circuit platform. While the terms are related, in practice, fiberglass is the final product used in PCBs, not just the raw glass fiber.
FAQs
Q1: Is fiberglass better than FR2 in circuit boards?
Yes. Fiberglass (FR4) offers higher strength, better insulation, and improved heat tolerance compared to FR2 paper-based boards.
Q2: How much does a fiberglass board cost?
The fiberglass board price varies by layer count, size, and copper thickness. Single-layer boards may cost less than $1 per piece, while multilayer HDI boards are higher.
Q3: Can fiberglass circuit boards handle high power?
Yes. With proper copper thickness and thermal management, fiberglass PCBs handle moderate to high power loads reliably.
Q4: Are fiberglass boards environmentally friendly?
Most are ROHS-compliant. However, disposal must be handled properly due to the epoxy content.
Q5: Who are top fiberglass circuit board manufacturers?
Top producers include Best Technology, TTM Technologies, and PCBWay. Look for ISO-certified factories with full in-house fabrication.
Whether you’re building a simple LED board or a complex communication device, printed circuit board fiberglass options are there to support your design.
Looking for a trustworthy partner to supply high-quality fiberglass PCBs? Best Technology has more than 18 years of experience manufacturing standard and custom circuit boards, including single to multilayer designs, HDI, and high-frequency variants. Our in-house production facilities are ISO9001, IATF16949, AS9100D and UL certified, ensuring that every board meets global quality standards. We pride ourselves on delivering fast lead times, customized solutions, and exceptional technical support that help our clients stay ahead in an ever-evolving market.
A copper foil PCB is a type of printed circuit board where copper foil is laminated onto the base material to form the conductive layer. This copper layer is what carries electrical signals and power between different parts of the board. Without it, a PCB wouldnât function at all.
The copper is typically applied through lamination, where thin sheets of copper foil are bonded to a substrate, usually made of fiberglass-reinforced epoxy resin like FR4. This copper layer is then etched to create precise paths, known as traces, that connect components across the board.
There are also different thicknesses of copper foil used, which affect the boardâs ability to carry current and dissipate heat. The standard thickness is usually 1 oz/ftÂČ (about 35ÎŒm), but heavier copper options like 2 oz or 3 oz are often used in power electronics or high-temperature applications.
What is the Purpose of Copper Foil in PCB?
The main role of copper foil is to carry electric current across the circuit. It’s the path for data, signals, and energy. Without copper foil, there would be no communication between components.
Besides that, copper foil helps in thermal transfer. When current flows, heat is generated. Copper helps in spreading this heat evenly, reducing hot spots. Thatâs key in designs with dense parts or power-hungry chips. Also, copper layers add mechanical strength to the board, supporting solder joints and reducing flex.
What are the Different Types of Copper Foils?
Copper foil types vary based on how they’re made, how rough they are, and what kind of performance they offer in real PCB applications. Choosing the right type can make a big difference in signal clarity, layer adhesion, and long-term reliability. Letâs see the most common types used in the PCB industry:
1. Electrodeposited (ED) Copper Foil
Electrodeposited copper foil is the most widely used type in standard rigid PCBs. Itâs made through an electrochemical process where copper ions are deposited onto a rotating stainless steel drum. The side in contact with the drum becomes smooth, while the other side is naturally rough.
ED copper foil is great for multilayer rigid boards, consumer electronics, and automotive circuits. When treated with surface chemicals, it bonds well to laminates and resists layer separation.
2. Rolled Annealed (RA) Copper Foil
RA copper foil is made by mechanically rolling solid copper into very thin sheets and then annealing it (heating and cooling) to relieve stress. Youâll find RA copper in flex circuits, flex-rigid PCBs, wearable electronics, and mobile devices. When boards must flex without breaking, RA is the go-to.
3. Reverse Treated Foil (RTF)
RTF is a type of ED foil where the shiny side is treated instead of the rough side. This treatment adds micro-etching or chemical bonding to enhance adhesion between the copper and the laminate. RTF is popular in HDI (High-Density Interconnect) boards, high-speed digital circuits, and RF designs where signal loss must be controlled.
4. Very Low Profile (VLP) and Ultra-Low Profile (ULP) Copper Foils
These are smoother versions of standard ED foils, created to reduce conductor roughness. VLP and ULP foils are still electrodeposited, but they go through extra steps to minimize surface peaks and valleys. They are used in high-speed digital systems, data centers, 5G antennas, and any application where clean signal transmission matters.
5. High-Temperature Elongation (HTE) Copper Foil
HTE copper foil is a variant of ED copper, enhanced for high thermal and mechanical stress. It resists cracking under repeated heating and cooling cycles. HTE is preferred for automotive, power electronics, and multilayer PCBs that go through reflow soldering or see high current loads.
6. Resin-Coated Copper Foil (RCC)
RCC combines copper foil with a thin layer of resin. This resin bonds directly to the core without needing prepreg sheets, which simplifies the lamination process. Mainly in mobile phones, compact devices, or where thin layers and high accuracy are needed.
Here is a summary comparison table between them:
Copper Foil Type
Strength
Flexibility
Smoothness
Signal Performance
Application
ED
High
Low
Moderate
Standard
Rigid PCBs
RA
Medium
High
High
Good
Flex PCBs
RTF
High
Medium
Treated
Excellent
RF, HDI
VLP/ULP
Medium
Medium
Very High
Superior
5G, high-speed
HTE
Very High
Low
Moderate
Standard
Power boards
RCC
Low
Medium
High
Good
Thin mobile boards
What is the Roughness of Copper Foil in PCB?
âThe roughness of copper foil on PCB â refers to the unsmoothness of the copper foil surface, Copper foil roughness affects how well signals move through the board. In high-speed designs, surface texture matters a lot. Rough copper increases insertion loss. This weakens the signal and causes noise.
Roughness is usually measured in microns, which is usually quantified by Ra, Rz and Rq. Lower values are better for RF or high-speed data.
âRaâ: The arithmetic average of the absolute value of the contour deviation over the sampling length, applicable to copper foil surface.
âRzâ: Sum of the average of the 5 largest profile peak heights and the average of the 5 largest profile valley depths over the sampling length for copper foil rough surface.
âRqâ: Means RMS (Root means square) value, it also is a roughness index.â
PCB Copper Thickness Chart
Copper thickness is often given in ounces per square foot. But that doesnât mean much until you convert it. Here’s a helpful chart:
Copper Weight (oz/ftÂČ)
Thickness (”m)
Thickness (mil)
0.5 oz
~17 ”m
~0.67 mil
1 oz
~35 ”m
~1.37 mil
2 oz
~70 ”m
~2.74 mil
3 oz
~105 ”m
~4.11 mil
4 oz
~140 ”m
~5.48 mil
For single & double sided PCB, the copper foil thickness is about 35um, 50um, 70um;
For multi-layer PCB, its outer layer copper thickness is 35um, and inner layer copper thickness is 17.5um (1/2oz).
Designers choose copper weight based on current flow and thermal limits. Thicker copper is used in power PCBs. Thinner layers are more common in signal circuits or HDI boards.
HTE vs RTF copper foil
When it comes to choosing the right copper foil for high-performance PCBs, HTE (High-Temperature Elongation) and RTF (Reverse Treated Foil) are two of the most commonly used options.
HTE Copper Foil
HTE copper foil is a specially processed electrodeposited foil thatâs engineered to handle high thermal and mechanical stress. The term “high-temperature elongation” refers to the foilâs improved flexibility and stretch resistance when exposed to heat.
Itâs treated chemically to improve adhesion strength, making it more reliable during multiple soldering cycles. The surface has a consistent profile that bonds well with different dielectric materials.
Key Features of HTE Foil:
Strong peel strength
Durable under repeated heating
Excellent for plated-through-hole (PTH) reliability
Withstands lamination and solder reflow cycles
RTF Copper Foil
RTF, or Reverse Treated Foil, is also made through an electrodeposition process, but with one key difference: the shiny side gets treated instead of the rough side. This treatment applies a fine, uniform microstructure that enhances bonding without creating high surface roughness.
This smoother surface makes RTF a preferred option in high-speed signal and RF PCB applications where low signal loss is critical.
Key Features of RTF Foil:
Lower surface roughness
Better electrical performance at high frequencies
Improved signal integrity
Balanced peel strength and performance
PCB Copper Electrical Conductivity
Copper has one of the highest electrical conductivities of any metal. Thatâs why itâs the go-to choice for PCBs. The typical conductivity of copper used in PCBs is about 5.8 x 10â· S/m (Siemens per meter).
This high conductivity allows small traces to carry high current with low voltage drop. It also reduces signal distortion, which is key in high-speed or RF applications.
Still, conductivity depends on purity. Most PCB foils use 99.9% pure copper. If copper is oxidized or poorly handled, conductivity drops. That’s why clean processes and proper lamination are important.
How to Calculate Copper Thickness in PCB?
The thickness of copper in PCB can be calculated by the following methods:
1. Calculation of copper plating thickness by current density and plating time:
Plating thickness (um) = current density (ASF) x plating time (min) x plating efficiency Ă 0.0202â. This formula takes into account the amount of electricity, equivalent, molar mass, density and other factors. The specific calculation process involves the product of current density, plating time and plating efficiency, then multiplying by a factor 0.0202â.
â2. Thickness calculated by weight of copper foil:
In the common option “copper-covered FR4, single-sided,1 oz”,1 oz indicates the thickness of the copper foil. 1 oz = 28.35 g/ftÂČ, copper foil density of 8.93 g/cmÂł, 1 square foot = 929.03 cmÂČ. Thus, 1 oz copper foil thickness = 28.35/8.93/929.03 â 35um or 1.35mil â. Common PCB thicknesses include 1/2Oz = 17.5um, 1 oz = 35um, 2oz = 70um, and 3 oz = 105um.
1. Isola Group:Known for high-frequency and low-loss materials.
2. Kingboard: One of the worldâs biggest copper clad laminate suppliers.
3. Ventec International: Offers low-profile copper foils and thermal substrates.
4. Mitsui Mining & Smelting: A top name in RTF and ultra-smooth foils.
5. Best Technology: Based in Asia, with 18+ years in the industry. We supply high-quality copper foil PCBs, from 0.5 oz to over 6 oz.
At Best Technology, we bring over 18 years of hands-on experience. We support standard and custom copper weights, including heavy copper for high-current boards. Our RTF and HTE options fit both signal-sensitive and power-heavy needs.
With fast lead times, in-house testing, and global delivery, weâre more than just a PCB maker. Weâre your reliable partner for copper foil PCB solutions. Reach out today to explore your next project with confidence.
