Best Technology has been a leader in PCB manufacturing and design for over 17 years. Our R&D team allows us to offer customers quick and valuable PCB design solutions. Here, we share one of our industrial motherboard design for PICE card for your reference.
[1]: Main chip: XCKU11P
[2]: 30A maximum current
[3]: Single pair differential line, 10G optical network
[4]: 14 layers PCB
If you need a custom industrial PCB design, please feel free to contact us.
A video decoder PCB design comprises several critical components that ensure efficient video signal processing. It includes the video decoder IC, memory modules (such as DDR RAM), power management units, and connectors for video input and output. You can see a video decoder pcb design example as following:
[1]: Xlinx: XC7K325T, Hisilicon: HI3521DV100_VI
[2]: Single pair differential line, 10G optical network, memory of DDR4
[3]: 12 layers PCB
We are a China based fabricator with over 17 years experience, what we provide not only including PCB design service, but also PCB fabricating, PCB duplicating and component sourcing and so on. Choose Best Technology you can enjoy:
Contact us if you have any questions.
PCB design is one of an important process before the PCB manufacturing, it determines the overall performance of the whole product. We are an experienced PCB design and manufacturing vendor, with our professional technical team and advanced evaluated tools, we can make sure the PCB design one-time success. Today, we shared a example of fiber optical SFP modules design:
[1]: Marvell: 98CX8522
[2]: Single pair differential line, 25G optical network
[3]: 16 layers PCB
SFP optical module interface PCB design depends on many aspects, including interface signal processing, timing control, power management and so on.
1. Determine the interface standard: SFP optical module interface standards, such as SFP, SFP+, QSFP and so on, you need to choose the appropriate interface standard according to the specific needs.
2. Choose the chip solution: According to the interface standard, choose the appropriate chip solution, usually including constant voltage source, amplifier, comparator, clock generator, EEPROM, etc.
3. Signal processing: For receiving and sending signals, filtering, amplification and comparison are required to ensure signal quality and stability.
4. Timing control: The timing and frequency of the clock signal need to be accurately controlled to ensure the correctness and stability of data transmission.
5. Power management: SFP optical module interface requires multiple power supplies, including Vcc, VCC-TX, VCC-RX, etc. Reasonable power management is required to ensure the stability and reliability of the power supply.
6. PCB design: According to the above requirements, PCB design is carried out, considering signal isolation, layering layout, status separation, signal integrity and other factors.
Feel freely to send message us if you are interested in PCB design.
A motherboard network adapter PCB comprises several key components, each playing a vital role in ensuring effective network connectivity. And between them, the PCB is the most important. Now, best technology is sharing an example about motherboard network PCB design.
[1]: Marvell: 98DX8548
[2]: 21A maximum current
[3]: Single pair differential line, 10G and 25G optical networks
[4]: 10 layers PCB
PCB design involves several steps and some considerations need to be noticed. If you are a designer, think about these points before starting the design.
Best Technology has more than 17 years in this industry, we have served for over 1200 customer all around the world. Our goal is to provide customer with best solutions and top notch quality products, and it is luckily that we did a good job. If you want to work with us or need a PCB manufacturer in Asia, contact us right now!
A high-speed circuit handles signals that switch quickly or operate at high frequencies, typically above 50 MHz, though some advanced systems may go into the GHz range. Best Technology is a one-stop PCB manufacturer that covers pcb design, pcb layout, pcb diagram, DFM, SI, PI analysis, PCB manufacturing and so on. In the following, you can see a high speed pcb design solution for industrial switch that we cooperated with our customer.
[1]: Marvell-400G chip
[2]: 200A maximum current
[3]: Single pair differential line 56G optical network
[4]: 24 layers high power PCB
Choosing the right material is vital for maintaining signal integrity and achieving optimal performance. The material impacts the board’s dielectric constant (Dk), loss tangent, and overall signal quality. Common materials include:
Selecting the appropriate material ensures the PCB can handle high-speed signals without compromising performance.
For the PCB design service, we can make sure the one-time success to save much time and money for customers. Our goal is to work with customers together and win more market with our clients. Just feel free to contact our technical team if you have similiar designs.
Best technology engaging in the PCB manufacturing and PCB design for more than 17 years. With a strong R&D team, we can provide customers with fast and valued PCB design solutions. Here is one of our industrial motherboard design & industrial PCB case sharing for your reference. If you want to get your own industrial PCB design, welcome to contact us.
A mITX architecture industrial control motherboard
[1] Intel Xeon E3, Core™ i7/i5, Celeron G3900E processors
[2]：2x DDR4 SODIMM 2133 MHz (up to 32 GByte)
[3]：4x SATA Gen 3.0
[4]：1x PCIe x16 (Gen 3)
[5]：2x USB 3.0 (Internal) + 1x USB 3.0 (Client) + 2x USB 3.0 (Rear I/O) + 2x USB 2.0 (Rear I/O) +
2x USB 2.0 (Front Header) + 1x USB 2.0 (mPCIe)
Contact us if you have any questions and inquiry about industrial PCB design projects.
In the design of electronic devices and systems, power distribution and heat dissipation management are key factors. Bus bar PCB, as an efficient solution, is particularly outstanding in these aspects. In this article, we would like to introduce the advantages of Bus bar PCB and its applications in different industries.
At the beginning, we should know what a bus bar PCB is. The Bus bar PCB is a special and newest design that integrates the FR4 material and metal alloy into a whole product, which allows the current transfer path into the circuit board. Due to the current carry capacity and special shape, it also called busbar PCB, embedded bus bar PCB, extruded copper PCB, copper inlay PCB, copper extrusion PCB.
Bus bar circuit board provide a more compact and efficient means of current distribution than traditional wires and cables. This design improves the overall performance of the electronic system by reducing inductance, increasing current carrying capacity, and optimizing heat dissipation.
Bus bar PCB offers numerous benefits when be using the power supply applications, its main functions are:
Bus bar PCBs reduce inductance by allowing current to flow between tightly spaced conductors. This layout reduces the loop area and thus the inductance value. This is particularly important for high-frequency and highspeed applications, as it reduces voltage spikes and noise, improving system stability and performance.
Due to its large cross-sectional area and high-quality conductive materials, Bus bar PCB can efficiently carry large currents. This is particularly useful in applications that require a large amount of power distribution, such as power supplies, electric vehicles, and renewable energy systems. Bus bar PCBs support higher current density compared to conventional PCB wiring, which improves thermal management and reliability.
The Bus bar PCB effectively dissipates heat generated by key components. In high power applications, the buildup of heat can affect performance and life. The Bus bar PCB helps maintain optimal operating temperatures through efficient heat distribution, reducing the need for additional cooling mechanisms.
The compact design of the Bus bar PCB reduces the overall size and weight of the electronic components. Its simple construction and elimination of multiple wire connectors contribute to space savings. This is particularly beneficial for applications where size and weight are critical, such as the aerospace and automotive industries.
Bus bar PCBS have superior mechanical strength and durability compared to traditional wiring systems. Its robust construction and secure connections reduce the risk of loose connections, failure due to vibration, and mechanical wear. This improves system reliability and service life for harsh environments and demanding applications.
Using a Bus bar PCB simplifies the assembly process because it reduces the number of individual wires and connectors. This not only speeds up installation, but also reduces assembly errors. In addition, the Bus bar PCB provides a more orderly and accessible layout for easy troubleshooting and repair.
Although there may be a high initial cost, Bus bar PCBs can provide cost savings in the long term. Its advantages in reduced inductance, improved thermal management and enhanced reliability reduce operating and maintenance costs. In addition, Bus bar PCB reduces the need for addons, such as heat sinks or complex wiring bundles, thereby increasing overall cost effectiveness.
Due the high current carry capacity of the bus bar PCB, makes it very suitable for power supply or power management devices. Bus bar PCB can perform well in such fields. Here are some common application examples that bus bar PCB can be used for. If you are seeking for a PCB to integrate into your power supply project, then bus bar PCB is the go-to-choice.
1. Power Electronics
In power converters, inverters and high-current power supplies, Bus bar PCBS are widely used because of their ability to efficiently handle high currents and excellent thermal performance.
2. The Automobile industry
Another popular field that bus bar PCB used in is automotives, especially in electric vehicles (EVs) and hybrid electric vehicles (HEVs). In the electric cars, it can be used for battery connectivity and power distribution, contributing to weight reduction and performance improvements.
3. Renewable energy
Bus bar PCB is an environment friendly material, it is often used in solar systems, wind turbines and energy storage solutions to manage high currents and enhance reliability.
4. Industrial equipment
In industrial machinery and equipment, Busbar PCB provides powerful and efficient power distribution for motors, drives and control systems.
5. Aerospace
Bus bar PCBS are used in aerospace applications, such as avionics and power distribution systems, where size, weight and reliability are key factors.
All in all, bus bar PCB offers significant advantages in handling high currents, improving thermal management, and providing reliable power distribution across various applications. By integrating bus bar PCBs, industries can achieve better power management, reduced system size and weight, and improved overall reliability.
Best Technology is a one-stop PCB solution provider in Asia, we offer various kinds of PCBs not only include bus bar PCB, but also Extra thin PCB, RF PCB, HDI PCB, Heavy copper PCB, Ceramic PCB, Metal Core PCB, Flex PCB and rigid flex PCB, PCBA and so more. We have more than 17 years-experience in PCB design and manufacturing, and served more than 1200 customers. Choosing Best Technology as your supplier ensures you get high quality PCBs, helping to improve the performance and competitiveness of your products. Contact us right now to customize your own PCB!
High-Density Interconnect (HDI) PCBs are revolutionizing the electronics industry with their advanced capabilities and compact designs. As technology continues to evolve, the demand for smaller, faster, and more efficient electronic devices has led to the widespread adoption of HDI PCBs.
HDI board refers to High Density Interconnect, that is, high density interconnect board, which is a relatively new technology developed by the PCB industry at the end of the 20th century.
The drilling of the traditional PCB board is affected by the drilling tool, and when the drilling aperture reaches 0.15mm, the cost is already very high, and it is difficult to improve again. The drilling of HDI board no longer relies on traditional mechanical drilling, but uses laser drilling technology. (This is why it is sometimes called a laser plate.) The hole diameter of the HDI board is generally 3-5mil (0.076-0.127mm), the line width is generally 3-4mil(0.076-0.10mm), the size of the pad can be greatly reduced, so more line distribution can be obtained within the unit area, and the high-density interconnection comes from this.
Smaller device spacing, more I/O pins and embedded passive devices Larger ASiCs and FPGAs with increasingly shorter rise times and higher frequencies all require smaller PCB feature sizes, which is driving a strong demand for HDI/ micro through-holes. The typical high density interconnector designs are including:
HDI is a compact circuit board designed for small volume users. Compared with ordinary FR4 PCB, the most significant feature of HDI is the high wiring density, and the difference between the two is mainly reflected in the following three aspects.
1. HDI is smaller and lighter
HDI board is a traditional dual panel as the core board, through continuous stacking layer by layer. This kind of circuit board made by continuous layering is also called Build-up Multilayer (BUM). Compared with traditional circuit boards, HDI circuit boards have the advantages of “light, thin, short and small”.
The electrical interconnection between the HDI board is realized through the conductive through hole, buried hole and blind hole connection, its structure is different from the common multi-layer circuit board, and a large number of micro-buried blind holes are used in HDI board. HDI uses direct laser drilling, while standard PCBS usually use mechanical drilling, so the number of layers and aspect ratio tend to be reduced.
The high density of HDI board is mainly reflected in the hole, line, pad density, and layer thickness.
● Micro-via hole
The HDI board contains the design of micro-pilot holes such as blind holes, which is mainly reflected in the micro-hole formation technology with a diameter less than 150um, and the high requirements of cost, production efficiency and hole position precision control. In the traditional multilayer circuit board, there are only through holes and no tiny buried blind holes.
● Fine line width and line distance
Its main performance in the wire defects and wire surface roughness requirements are more and more stringent. Generally, the line width and line distance do not exceed 76.2um.
● High pad density
The density of welded contacts is greater than 50 per square centimeter.
● Thinning of medium thickness
It is mainly manifested in the trend of the thickness of the interlayer medium to 80um and below, and the thickness uniformity requirements are becoming more and more stringent, especially for high-density plates and packaging substrates with characteristic impedance control.
2. Better electrical performance
HDI not only enables end-product designs to be miniaturized, but also to meet higher standards of electronic performance and efficiency at the same time.
The increased interconnect density of HDI allows for increased signal strength and improved reliability. In addition, the HDI board has better improvement for RF interference, electromagnetic wave interference, electrostatic discharge, heat conduction and so on. HDI also uses full digital signal process control (DSP) technology and a number of patented technologies, with a full range of load adaptability and strong short-term overload capability.
3. The HDI board has very high requirements for buried holes
It can be seen from the above that whether it is the volume of the board, or the electrical performance, HDI is better than ordinary PCB. Where the coin has two sides, the other side of HDI is as a high-end PCB manufacturing, its manufacturing threshold and process difficulty are much higher than ordinary PCB, and there are more problems to pay attention to when producing – especially the buried hole jack.
HDI PCB has greater different with normal FR4 PCB, from the stack up, material selection, manufacturing and cost. So, it is vital to understanding the basic parameters of a high-density interconnect board before start your designing trip. The standard parameters of HDI board mainly include the following aspects:
Generally, the number of layers of HDI board is 4-20 layers, and the high-end HDI board can reach to 40-50 layers.
Due to the HDI PCB are always used in high-end applications, their line width and spacing are usually very strict, and the common requirement is that the line width/spacing is 4/4mil (0.1mm), or even smaller.
These are one of the characteristics of the HDI board, blind hole and buried hole can reduce the area of the circuit board, make your design more density, and the bus enable to improve the signal transmission rate of the PCB.
The board thickness of HDI board is usually range from 0.8 to 3.2mm, of which 1.6mm is the most common thickness.
The pad on the HDI board is generally very small, and the common pad size is 0.2mm to 0.5mm. Different factory has different capabilities, it is best to ask your supplier or manufacturer to get a manufacturing capability document.
For high-speed signal transmission circuits, the impedance control of the HDI board is very important, and the requirements are very strict. It is needed to tell your vendor if your HDI board will be used in high-speed devices.
The main materials of HDI board are FR4, BT, PI, PET, etc. Different materials can meet different requirements.
This is the end of this sharing, contact us today to learn more about our HDI PCB solutions and how we can help you achieve your technological goals. In our next chapter, we will introduce the manufacturing process and methods of HDI boards, let me know if you are interested in it.
In PCB design, engineers often use via holes to connect the same electrical network located in different layers, vias and through holes PAD is very similar, the difference is that through holes pad is generally used to insert plug-in components, while via holes are generally small. Vias are very popular in some complex and multi-layer design, because it can serve as a pathway between the different layers.
Vias in printed circuit boards (PCBs) are essentially small holes that are drilled or etched into the board’s surface. These small, cylindrical holes are plated with conductive material, typically copper, to ensure electrical continuity between the layers. They serve as conduits for electrical connections between different layers of the PCB or between components mounted on the surface of the board and the internal circuitry.
They are important for creating multilayer PCBs, where multiple layers of copper traces are separated by insulating layers. Without vias, it would be impossible to establish connections between these layers, limiting the complexity and functionality of electronic devices.
A via hole in PCB is mainly composed of three parts, hole, pads around the holes, and power layer isolation area. The process of via hole is to plate a layer of copper foil on the cylindrical surface of the hole wall by chemical deposition to connect the copper foil that needs to be connected in the middle of each layer. In this way, the upper and lower sides of the hole are made into ordinary pad shape, which can be directly connected with the traces of the upper and lower sides. The wall thickness of the plating is 1mil or 2mil, and completed hole diameter may be 2mil-4mil smaller than the drilled hole.
Vias in PCBs primarily facilitate electrical connections across different board layers, enabling designers to craft intricate and compact circuit layouts by permitting signal and power traversal through layers. This capability is paramount in multi-layer PCBs, where space is constrained, and high-density component placement is requisite.
Vias permit the stacking of multiple circuit layers, optimizing PCB real estate, resulting in more compact devices.
Providing direct electrical signal pathways, reducing interference and loss, thereby enhancing overall circuit performance.
Thermal vias, specifically engineered for heat dissipation, aid in managing PCB temperatures, ensuring component reliability and longevity.
Vias afford greater flexibility in routing traces and component placement, fostering more innovative and efficient PCB designs.
There are several types of vias, each serving different purposes based on their placement and function. Understanding the different types and their applications is crucial for designing efficient and reliable PCBs. The most common types include through-hole vias, blind vias, and buried vias. Each offers unique advantages depending on the design requirements and constraints of the PCB.
1. Through-Hole Vias: These are the most common type of vias, extending through the PCB’s entire thickness, linking all layers. They are straightforward to manufacture and cost-effective.
2. Blind Vias: These vias connect an outer layer of the PCB to one or more inner layers but do not go through the entire board. They conserve space and simplify board layout complexity.
3. Buried Vias: Located entirely within the inner layers of the PCB, buried vias connect two or more internal layers without reaching the outer surfaces. They are useful for high-density and multi-layer PCBs where space is limited.
4. Micro Vias: Smaller than standard vias, micro vias are typically utilized in high-density interconnect (HDI) PCBs. They can connect adjacent layers or span multiple layers using stacked or staggered configurations.
The terms “PCB hole” and “via” are often used interchangeably, yet they denote distinct features within a PCB:
PCB hole generally refers to any drilled PCB hole, serving various purposes such as mounting components (e.g., plug-in components), positioning holes or mechanical mounting points. PCB holes are not necessarily conductive. While vias specifically denotes a conductive hole connecting different PCB layers. They are plated with conductive materials, usually copper, to ensure electrical continuity between layers.
In essence, while all vias are PCB holes, not all PCB holes are vias. Vias are a subset of PCB holes with the specific function of establishing electrical connections between layers, whereas PCB holes can serve a broader range of purposes, including mechanical and non-electrical functions.
In a PCB design, seemingly simple via holes often bring great negative effects to the design of the circuit. In order to reduce the adverse impact of the parasitic effect of the hole, PCB engineers can try their best to consider below points:
This is the end of this informational sharing, welcome to contact us if you want to know more about PCBs.
In the design of electronic products, electromagnetic compatibility (EMC) is a crucial consideration. Particularly in the design of printed circuit boards (PCBs), the rationality of EMC design directly impacts the performance and stability of the product. Among the many factors affecting EMC, one factor is especially critical, and that is the design of the ground plane. Today, let’s talk about the impact of grounding on EMC.
In an electronic product, grounding is a very important element, it is directly related to EMC compliance. Especially in large equipment, the grounding of multiple systems and subsystems is involved. It can be said, a good grounding system means the half successfully of a product.
The ground plane, as the reference potential in a circuit, not only carries the return path of current but also plays a role in electromagnetic shielding and noise suppression. In high-frequency circuits, the impedance and layout of the ground plane have a significant impact on signal integrity. Unreasonable ground plane design may result in signal interference, increased radiation, and decreased system stability.
EMC stands for Electromagnetic Compatibility. It refers to the ability of electronic devices and systems to operate properly in their intended electromagnetic environment without causing or experiencing interference. EMC ensures that devices can function without adversely affecting other devices nearby or being affected by electromagnetic interference from external sources. Generally, the ground planes will showing three shapes, please see as following:
Grounding can be understood as an equipotential point or plane serving as the reference potential for a circuit or system, which can be a specific ground layer in a PCB or the metal chassis of a product. While many perceive the purpose of designing a ground plane primarily to prevent external electromagnetic interference (EMI), but in printed circuit board design, it serves multiple purposes beyond this.
Generally, a well-designed ground provides a common reference zero potential for all circuit units within a system, ensuring no potential difference between circuits and thus stable operation. It also protects circuits from damage, ensuring the safe functioning of electronic products. For instance, ground can provide discharge paths for transient disturbances and dissipate accumulated charges on product metal enclosures induced by static electricity, to prevent potential sparks that may cause interference internally. Additionally, choosing appropriate grounding for shielding structures can yield effective electromagnetic shielding.
Grounding design is very necessary especially for medical industry. As we know, there are many medical devices are directly connected to patients’ bodies, such as monitors. In cases where the chassis carries voltage due to poor grounding, fatal risks may arise. Furthermore, grounding reduces common-mode interference currents flowing through PCBs and prevents high-frequency EMI signals within products from reaching equivalent radiating antennas. Thus, grounding is typically a primary method for noise suppression and interference prevention.
A well-designed grounding system should not only consider the radiation and conduction of individual PCBs but also prevent from a systemic perspective. In the design phase, failure to carefully consider the grounding system may indicate a high likelihood of EMC failure for the system. So, knowing the design principles is extremely important to make sure the successful of EMC.
To reduce the impedance of circuits, especially in high-frequency circuits, the ground plane should be made as short and wide as possible. This helps to minimize the return path of the current, thereby reducing EMI.
For complex PCB designs like multilayer PCBs, it is recommended to use a partition layout to separate the ground planes of different functional modules. This helps to isolate noise interference between different modules.
Depending on the circuit’s operating frequency and signal characteristics, choose between single-point grounding or multipoint grounding. Single-point grounding is suitable for low-frequency circuits, while multipoint grounding is more suitable for high-frequency circuits.
Where possible, use a ground plane as the ground. The ground plane can provide a low-impedance return path and aid in electromagnetic shielding.
As for PCB that has already design the circuit layout, how to optimize the ground to get the maximum EMI? Here are some tips that may helpful for you.
In PCB EMC design, ground plane design is an essential step that cannot be ignored. By following the principles and optimization methods of ground plane design, the EMC and signal integrity of electronic products can be significantly improved. Therefore, in PCB design, sufficient attention and consideration must be given to ground plane design. Welcome to contact Best Technology if you want to know more about ground and EMC design.