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What is ICT Tester? In Circuit Test vs Flying Probe Testing
Monday, August 18th, 2025

Have you ever wondered why some electronic devices fail even when the PCB looks flawless? Or why high-volume production sometimes delivers inconsistent boards? These issues often trace back to undetected component defects, poor soldering, or faulty connections. Without proper testing, even a single defective part can lead to product failure, costly recalls, or customer dissatisfaction.

This is where an ICT tester equipment comes in. By performing in-circuit testing (ICT), manufacturers can quickly detect missing components, shorts, opens, and incorrect placements before the boards leave the production line. With the right ICT test electronics and in-circuit test fixtures, you gain fast, accurate, and reliable validation of each PCB, saving both time and money.

In this article, we’ll answer key questions such as:

  • What exactly is an ICT tester, and how does it work?
  • Why is ICT testing so critical for electronics manufacturing?
  • How does ICT differ from functional testing or flying probe testing?
  • When should you use ICT versus functional testing for your boards?

By understanding these points, you’ll see how ICT testing can prevent defects, improve production efficiency, and ensure reliable end products—turning potential headaches into controlled, predictable outcomes.

What is an ICT Tester?

An ICT tester is a system designed to perform in-circuit testing (ICT) on printed circuit boards after assembly. It is often recognized by its “bed-of-nails” fixture, which has hundreds or even thousands of pins arranged to contact specific points on the PCB. Each pin corresponds to a pad, via, or test point, allowing the tester to measure voltages, resistances, and currents at component level.

ICT testers can:

  • Detect missing, incorrect, or faulty components.
  • Identify open circuits, short circuits, and soldering defects.
  • Measure parameters such as resistance, capacitance, and diode orientation.
  • Verify integrated circuit placement and connectivity.

Because ICT is thorough and fast, it has become an industry-standard approach, especially in high-volume production lines.

Why is the ICT Test Important?

The ICT test is important for several reasons. In large-scale manufacturing, even a single defect can ripple into thousands of defective units. Detecting issues early reduces costs, avoids recalls, and protects brand reputation.

For example, in automotive electronics, where safety systems depend on flawless PCBs, ICT is crucial. An undetected fault in an airbag control system could have serious consequences. In consumer electronics, ICT prevents faulty smartphones, laptops, or home appliances from reaching the market.

The ICT test is also important for process improvement. It provides engineers with statistical data that highlights recurring problems, such as solder bridging or component misplacement. Manufacturers can use this data to refine processes, reduce defect rates, and improve yields.

What is the Purpose of the ICT Test?

The main purpose of ICT testing is to validate the quality and functionality of each component on the PCB. Unlike functional testing, which looks at the board’s overall behavior, ICT digs into details at component level.

ICT ensures that:

  • Every resistor has the correct value.
  • Capacitors and inductors are present and within tolerance.
  • Diodes and transistors are oriented properly.
  • Integrated circuits are placed in the right sockets and connected.

By catching defects at the source, ICT reduces the risk of failures at the product’s final stage. This is especially valuable in industries where long-term reliability is critical, such as aerospace, defense, and medical devices.

How Does an ICT Tester Work?

An ICT tester works by pressing the in-circuit test fixture against the PCB, making contact with the test pads or vias. Once contact is established, the system injects signals into the board and records the response.

Here’s a breakdown of the process:

  • Fixture Setup – The board is placed into a bed-of-nails fixture designed for its exact layout.
  • Signal Injection – Test probes inject electrical signals into various nodes of the circuit.
  • Measurement – The tester measures voltage, current, resistance, and capacitance at each point.
  • Analysis – Software compares the measured values with predefined thresholds.
  • Reporting – The system highlights any failures or deviations for quick troubleshooting.

ICT is highly automated, with a cycle time ranging from a few seconds to less than a minute. This makes it efficient for high-volume production, where time savings directly translate to lower manufacturing costs.

Advantages of ICT Testing

  • High Accuracy – Detects even subtle component defects.
  • Fast Cycle Time – Ideal for mass production.
  • Detailed Data – Provides insight into manufacturing trends.
  • Early Detection – Reduces rework and repair costs.
  • Reliability – Improves long-term performance of products.

What is the Difference Between Functional Testing and ICT Testing?

Both functional testing and ICT testing play important roles in quality assurance, but they target different aspects of the PCB.

  • ICT Testing – Focuses on component-level verification. It checks each resistor, capacitor, diode, transistor, and IC independently. ICT identifies defects like shorts, opens, wrong components, or poor solder joints.
  • Functional Testing – Evaluates the overall system behavior. It simulates real-world operating conditions, ensuring the PCB performs its intended function. Functional testing may involve powering up the device, running software, or checking communication protocols.

To put it simply: ICT looks at how the board is built, while functional testing checks how the board behaves. Both tests are complementary, and many manufacturers use them together.

Functional Testing vs ICT Testing

When to Use ICT and Functional Testing?

Choosing between ICT and functional testing depends on project goals and production stage.

Use ICT testing when:

  • Boards are still in the manufacturing phase.
  • Component-level accuracy needs to be validated.
  • High-volume production demands fast, repeatable results.

Use functional testing when:

  • The assembly is nearly complete.
  • The product’s performance under real operating conditions needs to be verified.
  • System-level testing is required, such as communication between multiple boards.

For best results, many manufacturers use a combination of ICT and functional testing. ICT catches early-stage defects, while functional testing provides final validation before shipment.

In-Circuit Test vs Flying Probe: What are Differences?

When comparing in-circuit testing (ICT) with flying probe testing, the differences come down to cost, speed, and flexibility.

In-Circuit Test (ICT):

  • Uses a custom in-circuit test fixture.
  • Offers fast cycle times (seconds).
  • Best for high-volume production.
  • High upfront cost for the fixture, but lower cost per test afterward.

Flying Probe Test:

  • Uses moving probes instead of a fixture.
  • Slower than ICT, since probes move sequentially.
  • Excellent for prototypes and low-volume runs.
  • No fixture cost, making it more flexible and cost-effective for small batches.

In practice, many manufacturers start with flying probe testing during prototyping. Once the design is finalized and volumes increase, they shift to ICT testing for efficiency.

In-Circuit Test vs Flying Probe

Applications of ICT Testing

ICT testing is used in a wide range of industries:

  • Automotive – For safety-critical systems like airbags, ABS, and engine control units.
  • Medical Devices – For life-support systems, imaging equipment, and diagnostic tools.
  • Aerospace and Defense – Where reliability under extreme conditions is non-negotiable.
  • Consumer Electronics – From smartphones to laptops, ensuring consistent quality.
  • Industrial Equipment – For automation controllers and power management systems.

In each of these cases, ICT contributes to higher reliability, lower failure rates, and better compliance with international standards.

Why Choose Best Technology for ICT and PCB Testing?

Best Technology is a reliable PCB manufacturer in China, trusted by more than 1,000 customers across industries worldwide. We specialize in small to medium-volume PCB manufacturing, PCB assembly, and complete electronic manufacturing services.

As one of the most experienced circuit board suppliers, our capabilities cover a wide range of PCB types, including rigid PCBs, flex PCBs, rigid-flex PCBs, aluminum PCBs, RF/microwave PCBs, high-speed and high-frequency PCBs, and HDI PCBs. Beyond manufacturing, we also provide turnkey assembly, component sourcing, box build assembly, PCBA testing, and full electronic testing services.

With over 19 years of experience, our engineering, production, and quality teams fully understand the unique needs of industries such as medical, automotive, and aerospace. We strictly follow international standards, working under IPC-A-600 for PCB manufacturing and IPC-A-610 for PCB assembly. All of our products meet IPC Class 2 standards, and for projects requiring higher reliability, we also deliver Class 3 or Class 3A compliance. Combined with strong engineering support and competitive pricing, we help customers achieve both reliability and cost-effectiveness.

FAQs

1. What does ICT stand for in electronics testing?

ICT stands for in-circuit testing, which validates the quality of individual PCB components.

2. Can ICT testing replace functional testing?

No. ICT and functional testing serve different purposes. ICT checks construction, while functional testing checks performance.

3. How long does an ICT test take?

Most ICT tests take only a few seconds, depending on the number of test points.

4. Is an in-circuit test fixture reusable?

Yes, but each fixture is custom-designed for a specific PCB layout.

5. Which is better: in-circuit test or flying probe?

ICT is best for high-volume runs due to speed. Flying probe is better for prototypes or small batches.

Printed Circuit Boards: PCB Design, Fabrication, Assembly and Testing
Friday, June 6th, 2025

When creating modern electronic devices, every step matters – from the first sketch to the final product. If you’re exploring the process of printed circuit boards, or PCBs, this guide is your one-stop resource. We’ll walk through PCB design, fabrication, assembly, and testing, covering what engineers and buyers need to know. Whether you’re designing your first board or sourcing from a manufacturer, getting each step right ensures performance, reliability, and cost-efficiency.

Printed Circuit Boards: PCB Design, Fabrication, Assembly and Testing

What Is a Printed Circuit Board?

A printed circuit board (PCB) is the backbone of nearly all electronic systems. It’s a flat board that holds and connects electronic components using conductive tracks, pads, and vias etched from copper sheets laminated onto a non-conductive substrate. Common materials include FR4, ceramic, aluminum, and polyimide.

PCBs come in many forms: single-sided, double-sided, and multilayer PCB, supporting everything from simple gadgets to complex military electronics. Their role is simple yet critical: provide physical support and reliable electrical connections.

How to Design a PCB Board?

The PCB design phase sets the tone for the entire lifecycle. It begins with defining the schematic, which maps out the electronic connections between components. Once that’s ready, designers move to layout – placing components and routing traces.

Key steps include:

  1. Creating schematics using software like Altium Designer, KiCAD, or Eagle.
  2. Assigning footprints to components for proper placement.
  3. Defining board dimensions, layer stack-up, and signal flow.
  4. Routing signals with attention to trace width, impedance, and clearance.
  5. Adding vias, copper pours, and power planes for optimal performance.
  6. Design Rule Check (DRC) to verify spacing, trace width, and other constraints.
  7. Generating Gerber files, which are the manufacturing blueprints.
Printed Circuit Boards: PCB Design, Fabrication, Assembly and Testing

Each design must balance space, power, heat, cost, and manufacturability. One overlooked detail could delay your entire project.

Considerations During PCB Design Phase

Designers must juggle multiple variables beyond schematic accuracy. Here are essential considerations to optimize performance and reduce failure risks:

1. Component Placement: Keep analog, digital, and power circuits separate to reduce interference. Group related components logically to minimize trace lengths.

2. Signal Integrity: For high-speed designs, impedance matching, differential pair routing, and minimizing crosstalk are vital.

3. Thermal Management: Use thermal vias, copper pours, and heat sinks to handle heat dissipation—especially in power electronics.

4. Design for Manufacturability (DFM): Ensure trace width, drill sizes, and clearances match manufacturer capabilities.

5. EMC and EMI Compliance: Ground planes, shielding, and filtering components help meet regulatory standards.

6. Mechanical Constraints: Don’t overlook mounting holes, connector alignment, or enclosure fit. These small details can turn into costly errors later.

Good design minimizes rework, improves lifespan, and lowers costs across production.

Full PCB Fabrication Process – Step by Step

Once the design is complete, the PCB fabrication process turns digital files into a tangible board. Here’s how it happens:

1. Material Selection

The manufacturer selects base materials like FR4, aluminum, or ceramic depending on thermal, mechanical, and electrical requirements.

2. Inner Layer Imaging (for Multilayer PCBs)

Each inner copper layer is patterned with the circuit using photoresist, UV exposure, and etching techniques.

3. Lamination

The etched inner layers are stacked and laminated under heat and pressure, forming a solid multilayer structure.

4. Drilling

Holes are drilled to create vias for electrical connections between layers. Laser drilling is used for microvias.

5. Plating and Copper Deposition

Holes are plated with copper using electroplating to ensure conductivity across layers.

6. Outer Layer Imaging

Outer copper layers are patterned similar to the inner layers using photoresist and etching.

7. Solder Mask Application

A solder mask is applied to insulate the board and protect traces, leaving pads and holes exposed for soldering.

8. Silkscreen Printing

Component labels, logos, and reference indicators are printed on the board.

9. Surface Finish

A surface finish like HASL, ENIG, OSP, or Immersion Silver is applied to exposed copper pads to protect them and improve solderability.

10. Electrical Testing

Flying probe or bed-of-nails tests check for open circuits and shorts.

Common PCB Assembly Issues During Manufacturing

During PCB assembly, components are mounted and soldered onto the board. This phase can be manual or automated using SMT (surface-mount technology) and THT (through-hole technology).

But several issues can disrupt this process:

1. Tombstoning: A component lifts on one side during reflow, causing connectivity failure.

2. Solder Bridges: Excess solder connects two pins unintentionally, leading to short circuits.

3. Cold Joints: Poor soldering results in weak mechanical bonds and unreliable connections.

4. Misaligned Components: Incorrect placement, often caused by poor paste application or pick-and-place calibration.

5. PCB Warping: Thin or large boards may bend during reflow, affecting soldering and mechanical integrity.

6. Component Damage: Excessive heat or mishandling can destroy delicate ICs or capacitors.

Quality control, professional assembly lines, and well-prepared Gerber + BOM files help avoid these issues.

How to Test Printed Circuit Boards?

After assembly, PCB testing ensures the product works before final integration. There are several testing levels depending on the application and budget:

Printed Circuit Boards: PCB Design, Fabrication, Assembly and Testing

1. Visual Inspection

The simplest method. Engineers check for physical defects like solder bridges, missing components, or alignment issues.

2. Automated Optical Inspection (AOI)

AOI uses cameras to scan boards for soldering quality, polarity, and presence of components.

3. In-Circuit Testing (ICT)

Tests each component’s electrical characteristics by probing specific test points. It’s fast and accurate for large-volume production.

4. Flying Probe Testing

Uses robotic probes to test low-to-medium volume PCBs without the need for custom fixtures.

5. Functional Testing (FCT)

Verifies the complete assembled PCB in real-world operating conditions. Essential for high-reliability applications.

Testing isn’t optional—it’s critical. Faulty boards cost time, money, and customer trust.

Why Consider Best Technology’s Turnkey Service?

If you’re tired of juggling multiple vendors for PCB design, fabrication, assembly, and testing, Best Technology offers a full turnkey PCB service that simplifies the process.

Here’s why clients worldwide trust us:

◎ Technical Support Before & After Sales

◎ Prototype & Small Volume Welcome

◎ Quick Turn-out, On-time Delivery

◎ High Quality, Special Request Available

◎ Strong R&D Team, Know How-To

◎ Rich Experience (>13 Years)

◎ Prompt Feedback (within 12H)

◎ One-stop Service (PCBA/Assembly)

Conclusion

Printed circuit boards are at the heart of modern electronics, and getting the design, fabrication, assembly, and testing right is non-negotiable. Each step has its role—and skipping or rushing any part can lead to costly failures.

Whether you’re building a simple sensor or a complex industrial controller, choosing a partner like Best Technology can make the journey smoother. We understand what engineers, startups, and procurement teams need: fast delivery, quality control, and transparent communication.

FAQs

1. What software is used to design PCBs?

Tools like Altium Designer, Eagle, KiCAD, and OrCAD are commonly used for schematic and PCB layout.

2. How long does PCB fabrication take?

Standard fabrication takes 3–7 days. Express services can deliver in 24–48 hours depending on complexity.

3. What is the difference between PCB and PCBA?

PCB is the bare board. PCBA is the board after components are assembled and soldered.

4. How much does PCB assembly cost?

Costs vary based on quantity, complexity, part types, and whether parts are sourced by the manufacturer or supplied by the customer.

5. Does Best Technology support low-volume PCB manufacturing?

Yes. We support both low and high-volume production and offer prototyping services for new designs.

What is ate in pcba testing?
Thursday, September 26th, 2024

Automatic test equipment (ATE) plays a vital role in the field of electronic manufacturing, especially in the testing of printed circuit board assemblies (PCBA). In order to ensure the quality of PCBA, automatic test equipment (ATE) has become an indispensable force in the PCBA testing process with its high efficiency, accuracy and reliability.

What are the 7 types of PCB testing methods?

The common detection methods of PCB (Printed Circuit Board) boards are mainly used to detect the quality and accuracy of PCB boards, which is an indispensable part of the PCB production process. The following are 7 commonly used PCB board detection methods:

  • 1. Visual inspection: Visual inspection is the simplest detection method. It observes the surface of the PCB board with human eyes to find possible defects, such as welding problems, component position offset, etc.
What is ate in pcba testing?
  • 2. X-ray detection: X-ray detection is mainly used to detect problems hidden inside the PCB board, such as welding quality, BGA ball welding quality, inner layer line routing problems, etc.
  • 3. Non-destructive testing: Non-destructive testing is a non-destructive detection method. Commonly used technologies include infrared testing, ultrasonic testing and electromagnetic wave testing.
  • 4. AOl (Automated Optical Inspection): AOl is a method of automated inspection using optical equipment, which detects problems on the surface of PCB boards through high-resolution camera systems and pattern recognition software.
  • 5. ATE (Automatic Test Equipment): ATE is an automatic test equipment used to test the electrical performance and functions of PCB boards.
  • 6. Vibration test: Vibration test is used to detect the reliability and durability of PCB boards in vibration environments. By applying vibrations of different frequencies and amplitudes, the problems that may occur in actual use of PCB boards can be evaluated.
  • 7. Thermal shock test: Thermal shock test is used to detect the performance of PCB boards in temperature change environments. By rapidly changing the temperature, the thermal expansion, thermal stability and welding quality of PCB boards can be evaluated.

These methods can comprehensively evaluate the quality and performance of PCB boards and detect potential problems in a timely manner to ensure the reliability and stability of PCB boards.

What is ate testing in semiconductor?

ATE testing is an important link in the semiconductor industry for testing the functional integrity and reliability of integrated circuits (ICs). It is the abbreviation of Automatic Test Equipment, which is a device that tests devices, circuit boards, and subsystems through computer control.

ATE testing plays a vital role in the semiconductor manufacturing process. It is a key step to ensure the quality of IC products. The test content includes DC parameter testing, AC parameter testing, functional testing, etc. These tests are designed to evaluate the performance, function, and reliability of the chip.

The basic principle of the test is to apply stimulus to the chip through the test vector, measure the response output of the chip, and compare it with the expected result to determine whether the chip meets the specification requirements.

ATE testing not only involves testing various parameters of the chip, but also includes structural testing of the chip, that is, detecting manufacturing defects to ensure the quality and reliability of the chip.

In addition, ATE testing also includes testing of voltage, current, frequency, pulse, temperature and other aspects of the chip to achieve comprehensive testing of the static parameters and dynamic performance of semiconductor chips.

In general, ATE testing is an important means of quality control of integrated circuits in the semiconductor industry. It improves the efficiency and accuracy of testing through automation, ensures the quality and reliability of semiconductor chips, and is an indispensable and important link in the semiconductor manufacturing process.

What is an ATE PSU?

ATE PSU refers to the power supply unit (Power Supply Unit) of Automatic Test Equipment. In the field of electronic testing, ATE (automatic test equipment) is mainly used for integrated systems of power supply electrical performance testing. The system consists of test equipment hardware and test system software, and is designed to provide efficient and accurate automatic testing functions.

What is ate in pcba testing?

The key to ATE test system integration is to combine test software, test hardware (such as oscilloscopes, digital multimeters, vector networks, etc.) with communication technology to meet the testing needs of products. With the increasing complexity of electronic products, the role of ATE test system integration has become indispensable.

As part of the ATE system, the power supply unit (PSU) is responsible for providing a stable power supply for the entire test system to ensure the accuracy and reliability of the test.

Therefore, ATE PSU is one of the very important components in the ATE system, and its performance directly affects the overall efficiency and accuracy of the ATE test system.

What are the advantages of ATE?

ATE test system has the following significant advantages:

  • ‌High efficiency and time saving‌: ATE test system can automatically complete the test without manual intervention, which greatly saves test time and improves production efficiency‌.
  • ‌Easy to operate‌: The operation is simple and easy to understand, easy to get started, which reduces the skill requirements for operators and reduces training costs‌.
  • ‌Safe and reliable‌: The danger of manual operation can be avoided during the test process to ensure the life safety of employees‌.
  • ‌Improve test efficiency‌: Automatically execute the test program, greatly shorten the test cycle, reduce manual intervention, and thus significantly improve test efficiency‌.
  • ‌Flexibility and scalability‌: It can be flexibly configured and adjusted according to different test requirements, and supports customized configuration of various test modules and sensors‌.
  • Reduced labor costs‌: Reduced dependence on labor, reduced labor costs, and improved labor efficiency‌.
  • ‌Strong anti-interference ability‌: The internal mechanical properties are good, and various external interferences can be eliminated to ensure the stability and accuracy of the test results‌.

In summary, the ATE test system is of great significance in improving production efficiency, reducing costs, ensuring employee safety, and optimizing quality management. It is widely used in product testing in semiconductors, electronics, automobiles and other fields‌.

What is ate in PCB?

ATE in PCB refers to automatic test equipment (Automatic Test Equipment). ATE is a computer-controlled device used to test devices, circuit boards, and subsystems.

It replaces manual labor through computer programming and automatically completes the test sequence. In the semiconductor industry, ATE specifically refers to an automatic tester for integrated circuits (ICs), whose functions include detecting the integrity of integrated circuit functions and ensuring the quality of integrated circuit manufacturing.

In a broader context, ATE equipment can perform chip parameter testing, functional testing, performance testing, fault detection, reliability testing, etc., and plays a vital role in the semiconductor manufacturing process.

What is the difference between automatic and manual testing?

In PCB testing, there are the following differences between automatic testing and manual testing:

  • 1. Automatic testing relies on equipment and software, and is programmed; manual testing is manually operated and more flexible.
  • 2. Automatic testing is high-speed and efficient, and can run continuously; manual testing is slow, easy to fatigue and low efficiency.
  • 3. Automatic testing has high accuracy and good consistency; manual testing is easily affected by human factors and has poor consistency.
  • 4. Automatic testing equipment has high investment but low operating cost; manual testing equipment has low cost but high labor cost.
  • 5. Automated testing is suitable for large-scale production and complex circuit boards; manual testing is suitable for small-batch production and fault diagnosis.

What is the purpose of automated testing?

The purpose of automated testing in PCB is to ensure that each circuit board can meet the high performance required in complex electrical applications, and to improve product quality and performance by detecting and repairing defects. ‌

Automated testing, especially in the PCB (printed circuit board) production process, plays a vital role. This test uses machine scanners with light imaging to visually inspect the finished circuit board and evaluate the process quality by using technologies such as automated optical inspection (AOI).

What is ate in pcba testing?

The importance of automated testing lies in its ability to detect and repair defects at multiple stages of production, including bare board inspection, solder paste inspection, pre-reflow and post-reflow. Improve production speed and productivity to ensure that tasks are completed on time.

Conclusion:

Automated test equipment (ATE) plays a key role in PCBA testing. It can improve test efficiency, accuracy and product quality, reduce test costs, and provide strong support for electronic manufacturing companies. With the continuous development of electronic technology, ATE will also continue to upgrade and improve to adapt to the increasingly complex PCBA testing needs.

What is a E-Tester & how E-tester test PCB?
Saturday, December 2nd, 2023

We often receive this question from customer” what is a E-Tester?” and” how to do E-Test for FR4 PCB?” Hereby I would like to share with you how to use E-Tester to test PCB.

Best Technology in FR4 PCB circuit manufacturing filed since year 2006, we have more than 17 years experiences in PCB fabrication process. We can provide from the design to turn key service for our customer.

Let us come to today’s topic, now what is a E-Tester?

What is a E-tester?

E-Tester is tooling for test PCB during volume production. E-Tester was used to detect the electrical performance of PCB. It is the essential process to test the PCB by this tester before shipment.

As you may know that during PCB process flow, it might be caused some defects by external factors and this is unavoidable.

So, in order to reduce the loss before PCB goes to the next stage when it is assembled with components, Therefore, the E-Test plays important role in PCB quality control to segregate PCBs with defects from shipment to customers and that’s why most of customers require their PCB manufactures to do 100% E test before shipment.

(E_testers)

The E tester mainly checks the open/short circuit for FR4 PCB.

How to do E-test?

Firstly, set up the E-tester on the testing machine and up test datasheet on the computer. Put the board to the E-tester to test the open/short circuit for board and dielectric strength.

Shorts Test: Check to make sure that NO current flows between separate nets by measuring the amount resistance between them.

Opens Test: Check to make sure there is current flow from one “node” to the next for every net on the board.

(Tester_testing)

During the testing, test whether there is short circuit between different network routes of PCB; test whether the PCB network is open to each PAD, and whether the hole is open; Finally, Insulation strength test and the Impedance test.

If the trace open is found on the bare board, the failure location could be repaired or the bare board has to be scrapped. On the other hand, the cost will be increased when PCB goes to the next stage when it is assembled with components, mainly are the sorting cost, component cost and the assembly cost. The compensation ratio is 10 times or even more than the PCB cost and this damages PCB manufacturer’s profit. The worse case is when PCBA is installed onto the end product, the loss caused by defected PCB could be very painful, say up to thousand times of PCB cost. Therefore, the E-Test plays important role in PCB industry to segregate PCBs with defects from shipment to customers and that’s why most of customers require their PCB suppliers to do 100% E test before shipment.

If you want to know more about testing for FR4 PCB board, welcome to visited www.bestpcbs.com or email us, we are very happy to answer your question.