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What Are the Benefits of Using Ceramic PCB?
Tuesday, August 13th, 2024

With the continuous improvement of the performance requirements of electronic equipment, such as high current, fast heat dissipation, high frequency, long life and a series of other requirements, the requirements for the circuit board carrying the functions of the equipment have become particularly harsh. The traditional FR4 pcb circuit board in the past has completely failed to meet the current use scenarios. It is found that the circuit board produced by adding the corresponding ceramic materials can meet the corresponding requirements when making the circuit board substrate. Since then, ceramic PCB came into being and quickly gained a decisive position in the market.

Why Use Ceramic PCB?

Ceramic PCB shows remarkable advantages in many application fields because of its unique physical and chemical properties. ‌

First of all, ceramic PCBs have excellent heat dissipation performance and low thermal expansion coefficient, which enables them to maintain stable performance in high temperature environment and effectively avoid equipment damage or performance degradation caused by temperature changes. Secondly, ceramic PCB has excellent insulation performance and high voltage resistance, which can guarantee personal safety and stable operation of equipment. In addition, the ceramic PCB has strong adhesion, and the bonding technology is adopted to ensure that the copper foil will not fall off, which improves the reliability of the product, especially in the application of high-frequency circuits. ‌

Ceramic PCB: What is it & Why should we use it?

The manufacturing process of ceramic PCB also has its own uniqueness. Usually, the bottom plate is formed by pressing ceramic powder, which ensures the flatness and surface smoothness of PCB, thus improving the quality of circuit board. Although the cost of ceramic PCB is usually higher than that of traditional materials such as FR-4, it is undoubtedly a better choice in applications requiring high performance and high reliability. ‌

To sum up, ceramic PCB is widely used in high-power power electronic modules, solar panel components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace, military electronic products, high-power LED lighting products, communication antennas and other fields because of its excellent physical and chemical properties and high stability in high-frequency circuit applications.

What Are the Basic Components of Ceramic PCB?

The first is highly integrated circuit board, which has become an inevitable trend with the progress of electronic technology. Modern technology and electronic products integrate hundreds, thousands or even millions of transistors and resistors on a small silicon chip or integrated circuit (commonly known as IC) to form complex components.

These integrated circuits need a foundation for building tiny electronic materials and connections, usually called substrates. It also needs a structure to isolate the circuit from the external environment and turn it into a compact and solid unit, which is called packaging.

Integrated circuits need substrates and packages to maintain their reliability. Integrated circuits need insulating materials, and these two materials are born for this purpose. These packages will then be mounted on the printed circuit board.

Ceramics are famous for their insulating properties. The protective performance of this advanced ceramic material is an important factor for its use as substrate and packaging. This is why ceramic printed circuit boards or PCBs stand out from other similar products.

What are the Materials Used in Ceramic Circuit Board?

There are many kinds of materials for making ceramic PCB. When choosing ceramic materials, two basic characteristics that should be paid attention to are thermal conductivity and thermal expansion coefficient (CTE) of PCB.

Alumina (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO), silicon carbide (SiC) and boron nitride (BN) are commonly used materials in ceramic PCB.

Alumina (Al2O3)

Alumina is an inorganic compound, also known as bauxite. It is an advanced material made of aluminum and oxygen. It is usually white, but it varies according to purity. The color can be pink to almost brown. This compound is tasteless and crystalline powder, but it is insoluble in water.

Among all oxide ceramics, alumina is the hardest and strongest. Because the content of alumina is higher than 95%, it is an excellent electrical insulator with a resistivity as high as about 1× 1014 Ω cm. Common purity ranges from 94% to 99%. The required color, hardness, size and shape should be easy to achieve. Because the composition can be changed, it is considered to be beneficial to engineering production.

This industrial oxide ceramic has excellent thermal stability and corrosion stability, excellent mechanical strength and dielectric strength, and can even form an airtight seal. The common 96% alumina has a thermal conductivity of 25.0 W/(m k) and a CTE of 4.5 to 10.9 x 10-6/k.. Besides being affordable and cost-effective, it has all these advantages.

It is the most commonly used substance in ceramics because it has many applications in the electronic field, including substrates and packaging. This is the preferred material when the application does not require the highest level of thermal performance. It is one of the most advanced ceramic materials with the most in-depth research and comprehensive characteristics.

Aluminum nitride (AIN)

Aluminum nitride (AIN) is a non-oxide semiconductor technology-grade ceramic material. The structure of this compound is hexagonal crystal, which is blue and white in pure state. Aluminum nitride is a synthetic ceramic compound, which is usually white or gray.

Ceramic PCB: What is it & Why should we use it?

One of the best ceramic substrate materials at present is aluminum nitride (AlN). Its resistivity ranges from 10 to 1210ω-m, and its thermal conductivity is 80 to 200W/(m k), even as high as 300W/(m k). Based on these characteristics, it is undoubtedly one of the most attractive PCB substrate materials and one of the best choices.

It has electrical insulation and a low coefficient of thermal expansion (CTE) of 4 to 6× 10-6k1 (between 20 and 1000°C), which is very close to the silicon wafer. The value of this compound is much higher than that of alumina, but the cost is also higher. It is most suitable for use in high current and high temperature environment.

Beryllium oxide (BeO)

Beryllium oxide (BeO) or Beryllium oxide is also called dextran or glucose oxide in history. As the name implies, it comes from beryl or mineral beryl. It is a solid crystalline inorganic compound with white color.

In addition to good electrical insulation, its thermal conductivity is higher than that of any other nonmetal [(209 to 330 W/(m k)], and even exceeds that of some metals except diamond. There are rigid bonds between the atoms of beryllium oxide, just like diamonds. It transfers heat in the form of vibration through these strong bonds, so the energy loss is minimal.

This refractory compound has a melting point of 2506.85 °C to 2575 °C, a boiling point of 3905 °C and a CTE of 7.4 to 8.9 x 10-6/k. Beryllium oxide has these excellent characteristics, so it is widely used in electronic industry and is a valuable resource. Because of its high melting point, excellent thermal conductivity and good resistance, other industries also benefit from it.

Beryllium oxide has shown excellent chemical and thermal stability in challenging conditions and harsh environments for more than 60 years. BeO can be used to provide air or liquid cooling in applications where PCB is exposed to high temperature or high-density PCB with limited space. ‌

What are the Advantages of Ceramic PCB over Traditional PCB?

The use of ceramic printed circuit boards has several advantages, which help to significantly reduce the size and weight of the final product while improving energy efficiency. High quality surface smoothness (due to its flatness), high temperature resistance and low dielectric constant are their other significant advantages. In addition, ceramic plates are durable and wear-resistant, which means that they can be used in areas with high mechanical stress.

Because ceramic substrates are cleaner than FR-4 boards, ceramic PCBs can accommodate high component density on a single circuit board, which means that they can accommodate smaller components while still maintaining the same mass and occupying space.

The high temperature resistance of ceramic board is several times higher than that of FR4, and the thermal deformation temperature of ceramic board is much higher than that of traditional FR4, which makes the circuit board have better performance under extreme temperature conditions, thus prolonging the service life of the circuit board.

Ceramic PCB is more resistant to moisture in the air than FR4 board.

Ceramic PCB is made of ceramics, which is more durable and stronger than traditional FR4.

Ceramic board has higher density than traditional PCB, which can ensure high signal integrity. In addition, these boards are faster and more reliable than traditional boards.

Ceramic boards have high thermal resistance due to low thermal conductivity, so ceramic PCB has another advantage of fire prevention, which can make them a good choice for products that need to meet certain flammability and heat resistance criteria. Because a thin layer of ceramic fiber on the surface of PCBA can prevent heat from flowing into the circuit board, and at the same time, it can protect the conductive traces from cracking when exposed to excessive heat.

What are the Application of Ceramic PCB?

1. High power device

2. On-board chip module

3. Proximity sensor

4. Solid State Relay (SSR)

5. Solar panel array

6. Transmission/reception module

7. Multilayer Interconnect Board

8. Solar cells

9. Light emitting diodes

10. Automobile lighting system

Ceramic PCB: What is it & Why should we use it?

As a high-performance electronic component, ceramic PCB‌ is playing a vital role in many fields because of its unique characteristics. This kind of printed circuit board is becoming more and more popular for various reasons. The most important factor to consider when choosing a PCB manufacturer is quality and experience. Through meticulous manufacturing technology and firm commitment to quality, BEST Technology strives to provide ceramic PCBs that can stand the test of time and meet the needs of the continuous development of modern technology. Contact us for more information!

What is Thermal-Electric Separation Copper Substrate with Flexible PCB?
Saturday, August 3rd, 2024

As electronic devices become increasingly miniaturized and high-performance, traditional circuit boards are no longer sufficient for certain high-demand applications. To address these challenges, the Thermal-Electric Separation Copper Substrate with Flexible PCB has emerged. This innovative composite circuit board combines the efficient heat dissipation characteristics of thermal-electric separation copper substrates with the flexibility of flexible PCBs (FPC). It is widely use for high-performance electronic products, which requires efficient heat dissipation and complex circuit.

What is Thermal-Electric Separation Copper Substrate with Flexible PCB?

The Thermal-Electric Separation Copper Substrate with Flexible PCB is a composite material that combines a rigid thermal-electric separation copper substrate with a flexible circuit board. It integrates the advantages of both, providing superior performance in high-power and high-density applications.

What is Thermal-Electric Separation Copper Substrate with Flexible PCB?

1. Thermal-Electric Separation Copper Substrate

The thermal-electric separation copper substrate is designed for high-power electronic devices, providing an efficient heat dissipation solution. It separates the paths of heat and electrical signals to avoid thermal interference with electrical performance. Its structure typically includes:

  • Single-sided design: Electronic components are placed on one side of the copper substrate, while the other side is used for heat dissipation.
  • High thermal conductivity materials: Such as copper or aluminum, which can quickly conduct heat, like copper is 400W/m.k, aluminum is 237W/m.k.
  • Thermal vias: Vertical heat conduction paths that rapidly transfer heat to the dissipation layer.

2. Flexible PCB (FPC)

Flexible PCBs (Flexible Printed Circuits, FPC) use flexible materials like polyimide (PI) or polyester (PET) that can bend and fold to adapt to complex three-dimensional structures and dynamic application scenarios. Their advantages include:

  • Lightweight: Reducing the overall weight of the device.
  • High-density wiring: Achieving complex circuit designs in limited space.
  • Flexibility: Meeting diverse design needs.

Structure and Characteristics

The structure of the Thermal-Electric Separation Copper Substrate with Flexible PCB includes rigid and flexible parts, connected together using conductive adhesives or other bonding materials to form a unified whole.

1. Rigid Part

The rigid part uses the thermal-electric separation copper substrate, responsible for efficient heat dissipation and mechanical support. This part usually carries high-power components to ensure rapid heat transfer and dissipation.

2. Flexible Part

The flexible part uses the flexible PCB, which can bend and fold to fit the complex internal structure of devices. This part is typically used to connect the rigid part with other modules that require flexible connections.

3. Bonding Method

The flexible and rigid parts are bonded together using conductive adhesives, welding, or mechanical connections. The design of the bonding area ensures stable electrical connections and reliability during bending and dynamic use.

Thermal-Electric Separation Copper Substrate with Flexible PCB Advantages

1. Efficient Heat Dissipation

The thermal-electric separation copper substrate provides excellent heat dissipation, effectively conducting away the heat generated by high-power components to maintain a reasonable operating temperature range. This is especially important for applications like high-power LEDs and power semiconductor devices.

2. Flexibility

The use of the flexible PCB offers great design freedom, allowing adaptation to the complex three-dimensional structures and dynamic application needs within devices. This enables designers to achieve more complex circuit designs in limited spaces, increasing device integration and functionality.

3. Reliability

The thermal-electric separation design and high thermal conductivity materials enhance the reliability of the circuit board, reducing the impact of heat on electrical performance. The flexible part reduces the number of connection points, lowering the risk of failure.

4. Space Saving

Combining the advantages of rigid and flexible circuit boards allows for efficient heat dissipation and complex circuit in limited space. This is crucial for modern miniaturized and high-density electronic product designs.

Where Thermal-Electric Separation Copper Substrate with Flexible PCB used?

1. High-Power LED Lighting

High-power LEDs generate a significant amount of heat during operation. The thermal-electric separation copper substrate provides an efficient heat dissipation solution, ensuring the stable operation and long lifespan of LEDs. The flexible part is used to connect different LED modules, accommodating diverse design requirements.

2. Automotive Electronics

In automotive electronics, such as in-vehicle cameras and sensor modules, efficient heat dissipation and compact design are required. The thermal-electric separation copper substrate with flexible PCB can meet these demands, enhancing device reliability and performance.

What is Thermal-Electric Separation Copper Substrate with Flexible PCB?

3. Consumer Electronics

Devices like smartphones and tablets require lightweight and miniaturized designs. The thermal-electric separation copper substrate with flexible PCB offers efficient heat dissipation and flexible circuit, optimizing device performance and user experience.

4. Medical Devices

In applications that require flexibility and reliability, such as portable diagnostic equipment and implantable medical devices, the thermal-electric separation copper substrate with flexible PCB can help to enhancing device performance and reliability.

How does Thermal-Electric Separation Copper Substrate with Flexible PCB manufactured?

The manufacturing process for the thermal-electric separation copper substrate with flexible PCB is complex, typically including the following steps:

  1. Material Preparation: Selecting appropriate rigid and flexible materials and performing pre-treatment.
  2. Circuit Printing: Printing circuit patterns on both rigid and flexible materials.
  3. Lamination and Bonding: Combining the flexible circuit board with the thermal-electric separation copper substrate, usually using conductive adhesives or other bonding materials.
  4. Drilling and Plating: Drilling holes and electroplating to form conductive paths on the combined board.
  5. Surface Treatment: Performing surface treatments such as pad coating on the circuit board.
  6. Testing and Inspection: Conducting electrical and mechanical performance tests to ensure the quality and reliability of the board.

The thermal-electric separation copper substrate with flexible PCB, as an innovative composite circuit board, combines the advantages of efficient heat dissipation and flexible wiring. It is widely used in high-performance and complex design electronic products. With continuous technological advancements and growing market demand, this composite circuit board will play an important role in more fields, driving the ongoing innovation of electronic manufacturing technology. Want know more about it, just feel your free to contact us.

What are thick and thin film ceramic circuit boards used for?
Thursday, August 1st, 2024

Thick film and thin film technologies for ceramic circuit boards each have their specific uses. The application of thick film technology is mainly concentrated in areas that require high reliability and high performance, such as the automotive field, consumer electronics, communications engineering, medical equipment, aerospace, etc.

The application of thin film technology focuses on products that require specific optical, electrical, chemical and thermal properties, such as reflective coatings, optical recording media, insulating films, anti-oxidation, sensors, optoelectronic device heat sinks, etc. The following will introduce the uses and differences of thick film and thin film one by one.

What is a thick film ceramic circuit board used for?

Thick film ceramic circuit board is a kind of circuit board made by thick film technology, which is widely used, mainly for electrical connection, component mounting and surface modification.

What are thick and thin film ceramic circuit boards used for?
  • Electrical connection

Thick film circuit board can effectively connect all parts of the circuit to ensure the smooth transmission of current.

  • Component mounting

It can bear and fix electronic components, and ensure the correct position and stable operation of components in the circuit.

  • Surface modification

Through thick film technology, the surface of the circuit board can be modified to improve its electrical performance and durability. ‌

In addition, the thick film ceramic circuit board has some specific advantages, such as its manufacturing method allows it to be manufactured independently without using a substrate, and its thickness is usually between 10 and 25 μ m. This technology can be manufactured independently without using a substrate, which provides greater design flexibility. However, there may be some limitations in the accuracy of thick-film ceramic circuit boards. For example, in the process of using screen printing technology, the line width and accuracy may be insufficient due to the problems of screen printing, which may gradually lose the accuracy advantage for heat sinks with smaller and smaller size requirements in the future.

What is a thin film ceramic circuit board used for?

Thin film ceramic circuit boards are mainly used in module components of microwave circuits, including thin film load, thin film equalizer, thin film power divider, thin film attenuator, thin film coupler and thin film bridge. ‌

What are thick and thin film ceramic circuit boards used for?

1. Thin film load is often used to match the terminals of module components of microwave circuits to absorb redundant incident power. It is designed with alumina ceramic substrate, which has the advantage of high precision machining.

2. Thin-film equalizer is used to adjust the broadband power flatness of microwave circuits. By changing the square resistance of the integrated tantalum nitride film and designing different resistance values, the output waveform of the device is adjusted to achieve the balance of power signals.

3. Thin film power divider is used in multi-channel communication network system, which distributes power according to a certain proportion, and one input can be multi-output, thus avoiding the problem of unstable patch resistance welding of microstrip power divider.

4. Thin film attenuator is used for large signal attenuation or multi-gear adjustment attenuation value in microwave RF module, which realizes high attenuation value flatness of ultra-wideband and stable performance.

5. Thin-film couplers are used for power detection or signal separation, and can be designed as couplers with any weak coupling degree. tantalum nitride design is used to integrate isolated loads, which is suitable for broadband applications.

6. As a part of microwave module, thin film bridge is used for specific circuit connection and signal processing. ‌

According to these applications, we can better understand the wide application and advantages of thin-film ceramic circuit boards in the fields of high frequency, high power and high integration.

What are the advantages of thick film over thin film ceramic PCB?

Thick film ceramic circuit boards have higher mechanical strength and thermal conductivity than thin film ceramic circuit boards, and are more suitable for power electronics, automotive electronics and other occasions that require higher thermal management and mechanical strength. ‌

The main difference between thick-film ceramic circuit board and thin-film ceramic circuit board lies in their film thickness and manufacturing process. The thickness of thick film circuit board is generally greater than 10μm, while that of thin film circuit board is mostly less than 1μ m.. Thick film circuit board usually adopts screen printing process, while thin film circuit board adopts vacuum evaporation, magnetron sputtering and other process methods.

This difference in technology leads to their differences in performance and application fields. Specifically, the advantages of thick film ceramic circuit boards are mainly reflected in the following aspects:

Reliable performance

Thick film circuits are flexible in design, low in investment and cost, and are mostly used in high voltage, high current and high power occasions.

High mechanical strength

Due to the use of thick film materials, thick film ceramic circuit boards have high mechanical strength and can withstand greater physical pressure and impact.

Good thermal conductivity

Thick-film ceramic circuit boards have good thermal conductivity, which is conducive to rapid heat dissipation, and is particularly important for electronic equipment that needs good thermal management. ‌

Therefore, thick film ceramic circuit boards are more suitable for applications that require high mechanical strength and good thermal conductivity, such as power electronics, automotive electronics and other fields.

What is the difference between thick film and ceramic resistors?

There are some differences between film resistance and ceramic resistance in materials, manufacturing technology, size and shape, electrical properties and application scenarios. ‌

1. Materials and manufacturing process: Thick film resistors are usually made by screen printing process and spraying or sputtering on the circuit substrate. The commonly used substrate materials are ceramics, glass and so on. The ceramic resistor is a resistance device made of ceramic material, which is fired in a ceramic kiln. ‌

What are thick and thin film ceramic circuit boards used for?

2. Size and shape: Thick film resistors are usually flat, can be made into various sizes and shapes, and are suitable for assembly on circuit boards. Ceramic resistors are usually cylindrical and have a fixed size and shape. ‌

3. Electrical performance: Thick film resistor has high resistance accuracy and stability, and small temperature coefficient. Ceramic resistors have larger power carrying capacity and higher withstand voltage. ‌

4. Application scenario: Thick film resistor is suitable for high-precision circuits because of its large resistance range and good temperature stability. Ceramic resistors are suitable for general circuits and small electronic devices because of their small size and general electrical properties. ‌

From this, we can know that thick film resistors and ceramic resistors are different in materials, manufacturing processes, sizes and shapes, electrical properties and application scenarios, which make them suitable for different electronic equipment and circuit design requirements.

‌‌Thick film technology and thin film technology have certain substitutability in some fields, but thick film technology has irreplaceable role in the manufacturing and related processes of many products due to its advantages in cost, reliability, high temperature performance, etc., especially in multi-layer co-sintering processes such as LTCC and HTCC, where thin film technology cannot be applied. As a professional ceramic substrate manufacturer, Best Technology is committed to providing customers with high-quality thick film and thin film ceramic substrates to meet the needs of different applications.‌‌

What is a PCB Board? – Best Technology
Saturday, July 13th, 2024

In our daily life, the electronics has been gradually infiltrated our lives. Between them, the PCB board plays an important role in it, and we must say, PCB is the foundational element of electronics. From the simplest gadgets to the most complex machinery, PCBs play a crucial role.

What is a PCB Board?

A printed circuit board (PCB) is an electronic that uses metal conductors to create electrical connections between components. Generally, a PCB is a flat, laminated composite made of non-conductive substrate materials with conductive pathways etched or printed onto it. These pathways, also known as traces, enable the electronic components mounted on the board to communicate with each other.

What is a PCB Board?

PCBs are designed to support and electrically connect various components such as resistors, capacitors, diodes, and integrated circuits. The intricate network of copper tracks forms circuits that dictate the device’s functionality. PCBs can range from simple single-sided boards used in basic electronics to complex multi-layered structures found in advanced applications.

Common PCB Structure

A PCB’s structure is composed of several key layers, each serving a distinct purpose. Here is a detailed breakdown of these layers:

Substrate (Base Material)

The substrate, usually made of fiberglass (FR4), provides the board with its rigidity and thickness. It is the foundational layer upon which all other materials are built.

Copper Layer

This conductive layer is typically made of copper foil. For single-sided PCBs, the copper layer is only on one side of the substrate, whereas double-sided and multi-layer PCBs have copper layers on both sides or between multiple layers of substrate.

Solder Mask

The solder mask is a protective layer applied over the copper traces to prevent oxidation and accidental short-circuiting. It insulates the copper traces and leaves the component pads exposed for soldering. The green color commonly associated with PCBs comes from this layer, though it can also be found in other colors like red, blue, black, and white.

Silkscreen

The silkscreen layer is used to add labels, symbols, logos, and other markings to the PCB. This layer helps in identifying component locations and orientations during assembly and troubleshooting.

Components and Connectors (PCBA)

Components such as resistors, capacitors, diodes, and integrated circuits are soldered onto the PCB. Connectors allow the PCB to interface with other boards, power supplies, and external devices.

What is a PCB Board?

How Many Types of PCB?

Single-Sided PCBs

These are the simplest types of PCBs, with copper on only one side of the board. You’ll find them in basic, low-cost electronics like calculators, radios, and power supplies. They’re easy to design and manufacture, which keeps costs down and makes them great for straightforward applications.

Double-Sided PCBs

These boards have copper layers on both sides, allowing for more complex circuits. They’re common in more sophisticated electronics like amplifiers, power monitoring systems, and HVAC systems. With increased circuit density and flexible design options, they can handle more complex tasks.

Multi-Layer PCBs

When you need to pack in a lot of circuits, multi-layer PCBs are the way to go. They consist of three or more layers of copper, separated by insulating layers. You’ll see these in high-tech devices like computers, servers, medical equipment, and aerospace electronics. They offer high circuit density, reduced size and weight, and better signal integrity.

Rigid PCBs

Made from solid, inflexible materials like fiberglass, rigid PCBs keep their shape and provide strong support for components. They’re durable and used in everything from simple toys to complex industrial equipment.

Flexible PCBs

These are made from flexible plastic materials like polyimide, allowing them to bend and flex. Perfect for wearable electronics, flexible displays, and compact devices where space is tight. They’re lightweight, can fit into small, irregular spaces, and can handle being bent repeatedly.

Rigid-Flex PCBs

Combining the best of both rigid and flexible PCBs, these are great for devices that need both stability and flexibility, like smartphones, cameras, and medical devices. They save space, reduce the need for connectors and interconnections, and improve reliability.

High-Frequency PCBs

Designed to operate at frequencies above 1 GHz, these are used in communication systems, microwave technology, and high-speed devices. They provide low signal loss and high performance, making them crucial for advanced communication technologies.

Ceramic PCBs

Using ceramic as the substrate material, these PCBs offer excellent thermal conductivity and stability. They’re perfect for high-power applications and environments with extreme temperatures, like LED lighting, power electronics, and aerospace systems. Ceramic PCBs ensure reliable performance in harsh conditions.

Metal Core PCBs

Featuring a metal core, usually aluminum or copper, these PCBs improve heat dissipation. They’re used in high-power applications where efficient thermal management is crucial, such as LED lighting, power supplies, and automotive electronics.

Special PCBs

Bus Bar PCBs

These integrate bus bars for high-current applications, ensuring efficient power distribution and minimal voltage drop. They’re used in heavy-duty power supplies, electric vehicles, and industrial machinery. Bus bar PCBs provide robust and reliable connections for high-power systems.

What is a PCB Board?

Heavy Copper PCBs

With thicker copper layers, typically 3 ounces per square foot or more, these PCBs can handle higher currents and enhance thermal management. They’re used in power distribution, automotive, and industrial applications where durability and performance are critical. Heavy copper PCBs ensure reliable operation under high-stress conditions.

What is a PCB Board?

HDI (High-Density Interconnect) PCBs

These feature finer lines and spaces, smaller vias, and higher connection pad density. They’re used in advanced electronics like smartphones, tablets, and medical devices where space and performance are paramount. HDI PCBs enable miniaturization and improved electrical performance.

Extra Thin PCBs

Designed with minimal thickness, these PCBs are perfect for fitting into compact and lightweight devices. You’ll find them in flexible displays, wearables, and miniaturized electronic gadgets. Extra thin PCBs allow for innovative design solutions and space-saving configurations.

What is a PCB Board?

RF (Radio Frequency) PCBs

Optimized for high-frequency signals, these are used in communication devices, antennas, and microwave applications. They’re designed to minimize signal loss and interference, ensuring optimal performance in wireless communication systems.

High Tg PCBs

These have a high glass transition temperature, making them suitable for high-temperature environments. Used in automotive, aerospace, and industrial applications, high Tg PCBs maintain structural integrity and performance at elevated temperatures.

Impedance Control PCBs

These are designed to maintain consistent impedance for high-speed signal transmission. They’re used in communication devices, high-speed digital circuits, and advanced computing systems. Impedance control PCBs ensure signal integrity and reduce signal loss and reflection.

What is a PCB Board?

Why Are PCB Boards So Expensive?

Material Quality

High-grade materials like FR4 (fiberglass), ceramics, and high-quality copper foil are used to ensure durability and performance. These materials are essential for withstanding environmental stress and ensuring reliable operation, but they are expensive. For example, ceramic substrates can cost up to 10 times more than standard FR4 materials due to their superior thermal conductivity and electrical properties.

Complexity of Design

Multi-layer PCBs and advanced designs such as HDI (High-Density Interconnect) boards require complex manufacturing processes. The process involves precise alignment of layers and sophisticated techniques like laser drilling for micro-vias. The added complexity increases the production costs significantly. For instance, a standard 4-layer PCB might cost $50 per square meter, while a 12-layer HDI PCB could cost over $200 per square meter.

Precision and Technology

Manufacturing high-precision PCBs involves advanced machinery for etching, drilling, and plating. This machinery requires significant investment, and the skilled labor needed to operate it adds to the cost. The precision required in the production process ensures that the PCBs meet exacting standards, crucial for high-performance applications. A single advanced PCB drilling machine can cost upwards of $500,000.

Volume of Production

Smaller production runs generally have higher costs per unit because the setup and tooling expenses are spread over fewer units. For example, a low-volume production run of 10 PCBs might cost $100 per board, whereas a high-volume run of 10,000 boards might reduce the cost to $10 per board due to economies of scale.

Testing and Quality Assurance

Rigorous testing, including electrical, thermal, and functional tests, ensures that the PCBs meet strict performance standards. This testing process is vital to ensure reliability, especially in critical applications like medical devices and aerospace. Quality assurance processes can add 20-30% to the overall production cost, but they are essential for maintaining high standards.

What is the Difference Between PCBA and PCB Board?

The terms PCB and PCBA are often used interchangeably, but they refer to different stages of the board’s life cycle. The PCB is the bare board itself, with no electronic components attached. It consists of a non-conductive substrate, copper traces, solder mask, and silkscreen. A PCB serves as the foundation for assembling electronic components.

On the other hand, a PCBA (Printed Circuit Board Assembly) is a PCB that has undergone the assembly process, where all necessary electronic components like resistors, capacitors, diodes, and integrated circuits are soldered onto the board. Essentially, a PCBA is a functional circuit board ready for use in electronic devices. The transition from a PCB to a PCBA involves component placement, soldering, and quality testing, transforming the bare board into an operational assembly. Below is a typical PCBA product for your reference.

What is a PCB Board?

What is PCB Board Common Use?

PCB boards are existing in everywhere what we live, for example, the global smartphone market, which relies heavily on PCBs, was valued at approximately $520 billion in 2020. Here are some common applications that PCB used in:

Automotive Industry

In the automotive sector, PCBs are used in engine control units, infotainment systems, and advanced driver-assistance systems (ADAS). These applications enhance vehicle performance, safety, and connectivity.

Medical Devices

PCBs are integral to medical devices such as diagnostic equipment, patient monitoring systems, and implantable devices. They ensure precise and reliable operation, which is critical for patient safety and effective treatment.

Industrial Applications

PCBs are used in control systems, machinery, and power distribution units in industrial settings. They provide robust and durable solutions capable of withstanding harsh conditions and continuous operation.

Telecommunications

In telecommunications, PCBs are essential in routers, switches, and communication devices, ensuring efficient and reliable data transmission. As the demand for faster and more reliable communication networks grows, so does the need for high-quality PCBs.

Why Are Circuit Boards Green?

The characteristic green color of most PCBs comes from the solder mask, a protective layer applied over the copper traces to prevent oxidation, short-circuiting, and to protect the board during soldering.

The green color is traditional, largely due to historical reasons and practical benefits. Green solder mask provides a good contrast against the white silkscreen and the shiny copper traces, making it easier for technicians to inspect and identify components during assembly and troubleshooting. Additionally, green solder mask was one of the first colors to be developed and standardized in the industry, leading to its widespread adoption. However, PCBs are not limited to green; they can also be found in other colors such as red, blue, black, and white, depending on the specific requirements and aesthetic preferences of the project. The choice of solder mask color does not affect the performance of the PCB, but green remains popular due to its well-established manufacturing process and visual advantages.

How to Get Started with Best Technology?

Here at Best Technology, we are experienced in designing all types of PCBs, including standard rigid PCBs, special PCBs, and irregular PCBs. We can design and develop PCBs according to customer specification and offer suggestions on the right materials for your project.

We provide the full series of PCB manufacturing, from the initial PCB design, PCB layout, to custom PCB fabricate, PCB assembly, box building and so forth. By the way, we have our own factory in Vietnam, that means we can ship out the PCBs directly from Vietnam.

Welcome to contact us when you want to get a quote!

What is Tg meaning in FR4 PCB? – Best Technology
Wednesday, July 10th, 2024

In the world of printed circuit boards (PCBs), understanding material properties is crucial. One such property is Tg, or glass transition temperature. For FR4 PCBs, knowing what Tg means can significantly impact design and performance. In this blog, we’ll explore what Tg is, how it’s measured, its importance, and other related questions.

What Does Tg Mean in PCB Manufacturing?

Tg stands for glass transition temperature. It refers to the temperature at which a polymer material, such as the resin in a PCB substrate, transitions from a hard, glassy state to a softer, rubbery state.

For the circuit board, the ‌Tg value reflects the highest temperature it can withstand. When the temperature exceeds Tg values, ‌ the molecular structure of the circuit board material will be changed, ‌ lead to changes in its physical properties. Such as mechanical strength, size stability, adhesive, water imbibition, thermal expansion, etc. ‌Therefore, the level of TG value of the PCB directly affects the stability and high temperature resistance of the circuit board.

What is Tg meaning in FR4 PCB? - Best Technology

In the high temperature environment, if the TG value of the circuit board is too low, it is easy to cause PCB deformation, fracture, cracking and other problems, affecting the reliability and life of the printed circuit board. If the TG value of the circuit board is too high, the PCB is easy to become hard and brittle, affecting the processability and flexibility of the circuit board.

How is Tg Measured in FR4 Materials?

Accurate measurement of Tg is crucial for ensuring the performance and reliability of FR4 PCBs. Knowing the exact Tg helps in selecting the appropriate material for specific applications, particularly those involving high temperatures and thermal cycling. Using materials with a Tg well above the operating temperature ensures the PCB will maintain its mechanical and electrical properties under expected conditions.

The primary method for measuring Tg in FR4 materials is by differential scanning calorimetry (DSC). It involves heating a small sample of the material at a controlled rate, typically between 10°C to 20°C/min. As the sample heats, the DSC measures the heat flow into the material and records it as a thermogram. The Tg is identified as the temperature where there is a noticeable change in heat capacity, appearing as a step or inflection point on the thermogram. DSC is widely used because it provides precise and reliable Tg measurements.

What is Tg meaning in FR4 PCB? - Best Technology

Additionally, Dynamic Mechanical Analysis (DMA) and Thermomechanical Analysis (TMA) also can be used to measure the Tg value.

Why is Glass Transition Temperature Critical in PCBs?

Glass transition temperature is critical because it affects the thermal and mechanical properties of the PCB. If a PCB operates near or above its Tg, it can experience issues like delamination, warping, and electrical failure. Here are some benefits of Tg.

  • Thermal stability

One of the main reasons is its role in determining thermal stability. During operation, PCBs are subjected to varying temperatures due to power dissipation from electronic components and environmental conditions. Make sure the Tg of the PCB material is well above the maximum operating temperature, it helps maintain mechanical stability and reliable performance under thermal stress.

  • Mechanical Strength

The Tg value also affects the mechanical strength and durability of the PCB. Below the Tg, the material is rigid and can withstand mechanical stress without significant deformation. This rigidity is essential for maintaining the structural integrity of the PCB, especially during assembly processes like soldering, where the board is subjected to mechanical and thermal stresses.

  • Thermal Management

Thermal management is very important to electronics, especially for those miniaturized electronic devices. If the PCB itself has good thermal management, then designers no need to install heatsink or coolers. Materials with higher Tg values exhibit lower coefficients of thermal expansion (CTE), meaning less expansion and contraction with temperature changes. 

  • Application-specific requirements

Different applications have varying thermal and mechanical requirements. High-performance computing, automotive, aerospace, and industrial electronics often operate in environments with high temperatures and thermal cycling. For these applications, using PCB materials with appropriate Tg values is crucial.

What is the Typical Tg Value for Standard FR4 PCBs?

Standard FR4 materials generally have Tg values in the range of 130°C to 140°C. For high-performance applications, materials with higher Tg values are necessary. The table below lists some common high Tg materials used in PCB manufacturing, along with their Tg values and characteristics.

MaterialTg Value (°C)CharacteristicsApplications
ISOLA IS410180Excellent thermal and mechanical propertiesHigh-reliability applications
Nanya NP-175175High thermal stability, good mechanical strengthAutomotive, industrial electronics
Shengyi S1000H170Cost-effective, widely usedConsumer electronics, industrial applications
Ventec VT-47170High Tg and low CTEHigh-density interconnect (HDI) PCBs
Rogers 4350B280Extremely high Tg, excellent thermal stabilityRF and microwave applications
(Common used high Tg materials)

Can You Explain the Difference Between Tg and Td in PCBs?

Tg and Td (decomposition temperature) are two different thermal properties. Unlike the reversible physical change associated with Tg, decomposition is an irreversible chemical process. At Td, the polymer chains in the material break down, leading to a loss of structural integrity and release of volatile compounds. Key points about Td include:

1. Chemical Stability

Td represents the upper thermal limit of a material’s chemical stability. Exceeding Td results in the breakdown of the polymer structure, rendering the material unsuitable for further use.

2. Material Selection

Knowing the Td helps in selecting materials for high-temperature applications. A material’s Td should be well above the maximum operating temperature to prevent degradation.

What is Tg meaning in FR4 PCB? - Best Technology

3. Safety and Reliability

Operating a PCB above its Td can result in catastrophic failure, including charring, delamination, and loss of electrical performance. The operating temperature remains below Td is critical for safety and reliability.

How Do You Choose the Right Tg Value for Your PCB Design?

Choosing the right Tg value depends on the operating environment and thermal demands of your application. Consider factors such as the maximum operating temperature, the thermal cycling the PCB will undergo, and the mechanical stresses it will face. Consulting with material suppliers and using simulation tools can help make an informed decision. According to our 18 years experience in PCB, we summarized a recommend Tg value for each application. Hope this is useful for you guys.

  • Consumer electronics

If your PCB will be used in standard consumer electronics, just like smartphones and tablets, a Tg value of around 130°C to 140°C is typically sufficient. These devices generally do not encounter extreme temperatures or thermal cycling.

  • Automotive applications

Automotive PCBs are always exposed to high temperatures and significant thermal cycling. A Tg value of 170°C or higher is recommended to ensure reliability and performance under the hood. So, Rogers material is good for this kind of PCB.

  • Aerospace and defense

Applications in aerospace and defense require materials that can withstand extreme temperatures and harsh environments. High Tg materials with values of 180°C or more are often used to meet these stringent requirements.

  • Industrial Electronics

Industrial environments can vary widely, but generally, high Tg materials are preferred due to the exposure to high temperatures and mechanical stress. A Tg value of at least 150°C to 170°C is advisable.

Best Technology is a well-known PCB and PCBA assembly provider in Asia and Vietnam. We have a large facility for handling low-medium to mass production PCBs, and supporting for various kinds of custom PCBs. Some special PCBs are available here, like bus bar PCB for new energy vehicles, heavy copper PCB for high power and high current PCBs, ceramic PCBs for harsh environments, extra thin PCB, RF PCB, microwaves PCB, IC substrate PCB and so on.

For more information, please do not hesitate to contact us.

What are the advantages of ceramic PCB?
Saturday, July 6th, 2024

Ceramic PCB is a type of emerging PCB in the recent years, they are known for their high thermal conductivity and low expansion coefficient. Except this, it has numerous advantages that normal FR4 PCB can not achieved. And even for metal core PCB (MCPCB). Today, we are going to introduce their characteristics in detail.

What are the advantages of ceramic PCB?

1.  High thermal conductivity

The core metal content of ceramic circuit boards is as high as 96-98%, which makes them have extremely high thermal conductivity. Compared with ordinary FR4 circuit boards, the thermal conductivity of ceramic circuit boards can reach 170-230 W/mK, while the thermal conductivity of FR4 boards is usually only 0.3-0.4 W/mK. Higher thermal conductivity allows for more efficient heat dissipation, avoiding the problem of damage to electronic components due to overheating. This is particularly important in high-power applications, such as LEDs and power semiconductors.

2.  Low thermal expansion coefficient

Ceramic materials have a very low coefficient of thermal expansion (CTE), usually between 6-8 ppm/°C. In contrast, FR4 material has around 14-16 ppm/°C CTE. This means that ceramic materials hardly expand or contract when temperature changes. The low thermal expansion coefficient improves the reliability of the circuit board, reduces the influence of the thermal cycle on the circuit board structure and the connection of electronic components. Especially suitable for use in the environment with frequent temperature changes.

What are the advantages of ceramic PCB?

3.  High surface hardness

The surface hardness of ceramic materials is up to 9 Mohs, which is harder than aluminum oxide and silicon. It means ceramic PCB has more wear-resistant, scratch resistant, and not easy to damage. It enables to run stably for a long time even in harsh physical environments, extending the service life of the board. That is why ceramic PCB is always recommended to use in military.

4.  High compressive strength

The compressive strength of the ceramic circuit board can reach 450-500 MPa, which can withstand large mechanical pressure without deformation or rupture. This characteristic makes them excellent in applications that require them to withstand mechanical stress, such as industrial automation and aerospace.

5.  High dielectric strength

Ceramic PCB has very high dielectric strength, usually between 15-25 kV/mm. And it can withstand higher electric fields without electrical breakdown.

6.  Ability to withstand higher temperatures

Ceramic circuit boards can operate at temperatures up to 1000°C without degradation or damage. While FR4 circuit boards typically operate at an upper limit of 140-170°C. Ceramic circuit boards are suitable for electronic devices in high temperature environments, such as electric vehicles and high-power lasers.

What are the advantages of ceramic PCB?

7. High breakdown voltage

The high breakdown voltage of the ceramic circuit board can reach 20-35 kV, ensuring reliable operation under high voltage conditions. It is well suitable for use in high-voltage power supplies and power electronic equipment, providing higher safety.

8.  Does not absorb water

The water absorption of ceramic materials is usually less than 0.1%, while the water absorption of FR4 materials is 0.1-0.2%. The non-water absorbing feature prevents performance degradation and damage caused by water absorption in a humid environment. It is ideal for Marine, medical, and other applications that require moisture resistance.

9. Low loss at high frequency

In high-frequency applications, the dielectric loss Angle tangent (Df) of ceramic circuit boards is usually between 0.0001-0.001, while the loss Angle tangent of FR4 materials is 0.02-0.03. Low loss ensures signal integrity and transmission efficiency, which is suitable for communication equipment and high-frequency electronic equipment.

10.  Resistance to cosmic rays

Ceramic materials can resist the impact of cosmic rays, will not be degraded or damaged by rays. They are suitable for satellite electronic equipment, ensuring the stability and reliability of the circuit board in a high radiation environment.

11.  No organic ingredients

Ceramic circuit boards do not contain organic components, so they have high chemical stability, are not susceptible to chemical corrosion and decomposition. They are good choice to use in harsh chemical environments.

12.  High-density assembly

Ceramic circuit boards support high-density assembly with line/pitch resolution of 20 microns. This allows them to be adapted to more complex and refined circuit designs, suitable for microelectronics and high-precision applications.

Best Technology provides professional one-stop ceramic PCB design and manufacturing service all around the world. We welcome all the friends and partners from domestic and abroad to visit our ceramic circuit board workshop.

What Are the Advantages of Using Bus Bar PCB?
Friday, June 14th, 2024

In the design of electronic devices and systems, power distribution and heat dissipation management are key factors. Bus bar PCB, as an efficient solution, is particularly outstanding in these aspects. In this article, we would like to introduce the advantages of Bus bar PCB and its applications in different industries.

What Is A Bus Bar PCB?

At the beginning, we should know what a bus bar PCB is. The Bus bar PCB is a special and newest design that integrates the FR4 material and metal alloy into a whole product, which allows the current transfer path into the circuit board. Due to the current carry capacity and special shape, it also called busbar PCB, embedded bus bar PCB, extruded copper PCB, copper inlay PCB, copper extrusion PCB.

bus bar pcb

Bus bar circuit board provide a more compact and efficient means of current distribution than traditional wires and cables. This design improves the overall performance of the electronic system by reducing inductance, increasing current carrying capacity, and optimizing heat dissipation.

What Are the Advantages of Bus Bar PCB?

Bus bar PCB offers numerous benefits when be using the power supply applications, its main functions are:

1. Reduce the inductance

Bus bar PCBs reduce inductance by allowing current to flow between tightly spaced conductors. This layout reduces the loop area and thus the inductance value. This is particularly important for high-frequency and highspeed applications, as it reduces voltage spikes and noise, improving system stability and performance.

2. Enhanced current carrying capacity

Due to its large cross-sectional area and high-quality conductive materials, Bus bar PCB can efficiently carry large currents. This is particularly useful in applications that require a large amount of power distribution, such as power supplies, electric vehicles, and renewable energy systems. Bus bar PCBs support higher current density compared to conventional PCB wiring, which improves thermal management and reliability.

3. Improve thermal management

The Bus bar PCB effectively dissipates heat generated by key components. In high power applications, the buildup of heat can affect performance and life. The Bus bar PCB helps maintain optimal operating temperatures through efficient heat distribution, reducing the need for additional cooling mechanisms.

4. Save space and weight

The compact design of the Bus bar PCB reduces the overall size and weight of the electronic components. Its simple construction and elimination of multiple wire connectors contribute to space savings. This is particularly beneficial for applications where size and weight are critical, such as the aerospace and automotive industries.

5. Improved reliability and durability

Bus bar PCBS have superior mechanical strength and durability compared to traditional wiring systems. Its robust construction and secure connections reduce the risk of loose connections, failure due to vibration, and mechanical wear. This improves system reliability and service life for harsh environments and demanding applications.

6. Simplify assembly and maintenance

Using a Bus bar PCB simplifies the assembly process because it reduces the number of individual wires and connectors. This not only speeds up installation, but also reduces assembly errors. In addition, the Bus bar PCB provides a more orderly and accessible layout for easy troubleshooting and repair.

embeded bus bar pcb

7. Cost effective

Although there may be a high initial cost, Bus bar PCBs can provide cost savings in the long term. Its advantages in reduced inductance, improved thermal management and enhanced reliability reduce operating and maintenance costs. In addition, Bus bar PCB reduces the need for addons, such as heat sinks or complex wiring bundles, thereby increasing overall cost effectiveness.

What Applications of Bus Bar PCB?

Due the high current carry capacity of the bus bar PCB, makes it very suitable for power supply or power management devices. Bus bar PCB can perform well in such fields. Here are some common application examples that bus bar PCB can be used for. If you are seeking for a PCB to integrate into your power supply project, then bus bar PCB is the go-to-choice.

1. Power Electronics

In power converters, inverters and high-current power supplies, Bus bar PCBS are widely used because of their ability to efficiently handle high currents and excellent thermal performance.

2. The Automobile industry

Another popular field that bus bar PCB used in is automotives, especially in electric vehicles (EVs) and hybrid electric vehicles (HEVs). In the electric cars, it can be used for battery connectivity and power distribution, contributing to weight reduction and performance improvements.

3. Renewable energy

Bus bar PCB is an environment friendly material, it is often used in solar systems, wind turbines and energy storage solutions to manage high currents and enhance reliability.

4. Industrial equipment

In industrial machinery and equipment, Busbar PCB provides powerful and efficient power distribution for motors, drives and control systems.

aluminum bus bar pcb

5. Aerospace

Bus bar PCBS are used in aerospace applications, such as avionics and power distribution systems, where size, weight and reliability are key factors.

Final Words

All in all, bus bar PCB offers significant advantages in handling high currents, improving thermal management, and providing reliable power distribution across various applications. By integrating bus bar PCBs, industries can achieve better power management, reduced system size and weight, and improved overall reliability.

Best Technology is a one-stop PCB solution provider in Asia, we offer various kinds of PCBs not only include bus bar PCB, but also Extra thin PCB, RF PCB, HDI PCB, Heavy copper PCB, Ceramic PCB, Metal Core PCB, Flex PCB and rigid flex PCB, PCBA and so more. We have more than 17 years-experience in PCB design and manufacturing, and served more than 1200 customers. Choosing Best Technology as your supplier ensures you get high quality PCBs, helping to improve the performance and competitiveness of your products. Contact us right now to customize your own PCB!

Bus Bar PCB: What are the Considerations During Designing?
Saturday, June 8th, 2024

In the electronics industry especially for new-energy vehicles, a Bus Bar PCB plays an important role to achieve specific function. It transmits large amounts of current through metal strips or conductive paths, making it ideal for high-power applications. The design of busbar PCBs is a key technical area for designers or engineers who engaged in power distribution or who require efficient current management. In this article, we would like to share some information about the considerations during a bus bar circuit board designing, hope this may help you to design a desired PCB successfully.

What is a Bus Bar PCB?

Bus bar PCB is one of a new type of heavy copper PCB and it was made by FR4 fiber glass material and laminated with metal alloys.  It transmits electrical energy from one point to multiple output points through integrated conductive paths, which are typically made of copper or aluminum. Busbar PCBs are designed to reduce resistance and inductance, thereby maximizing current transfer efficiency and minimizing energy loss.

bus bar pcb design

Generally, if it is used in a charging pile product, there are generally at least 2 busbar circuit boards, one is the main control board (a larger one), and the other is a smaller board, both of two need to use the bus bar process.

Bus bar PCB is widely used in power distribution systems, electric vehicles, industrial equipment and other occasions requiring high current. They are designed to simplify system wiring, reduce electromagnetic interference (EMI), and improve overall reliability and performance of the product.

Why is High Current Bus Bar PCB Important?

Bus bar PCB has irreplaceable advantages in current transmission and power distribution. They mainly feature three functions when used in electronics. First of all, they are able to efficiently handle large currents without generating excessive heat. This is what standard FR4 PCB cannot achieved. Secondly, bus bar PCB has ability to significantly reduce the complexity of the circuit layout design. By integrating the current transfer path, they can reduce the number and length of circuits required by the system, thereby simplifying system design and reducing potential failures.

In addition, bus bar PCB helps reduce electromagnetic interference. Due to the design optimization of the conductive path, the noise generated during current transmission can be effectively suppressed. This characteristic makes it perform well in high-noise environments, ensuring the stability and reliability of electronic devices.

What Should We Consider When Designing A Bus Bar PCB?

Due to it is a new innovation in the industry, it is a not a simple thing to design a bus bar circuit board successfully. It’s a complex task that requires consideration of several technical factors to ensure its effectiveness and reliability. The following are the main aspects to focus on when designing a bus bar PCB.

  • Copper Thickness

The first important thing is what’s the copper thickness of busbar you want to. You must know, thicker copper allows for higher current carrying capacity, but not thicker thickness is better, it should be calculated according to the voltage and current it will used in.

  • Current capacity and temperature management

The bus bar PCB should be designed to carry the maximum expected current while keeping the temperature within a safe range. This is usually achieved by selecting the appropriate conductor material and optimizing the cross-sectional area of the conductor. For example, for 100A current requirements, a typical design would use copper strips with a thickness of 5mm to ensure that the temperature rise does not exceed 20C.

bus bar pcb design
  • Resistance and inductance

Low resistance and low inductance are key to bus bar PCB design. The shape, thickness and layout of conductors should reduce resistance and inductance as much as possible to improve the efficiency of current transmission. For example, the use of trapezoidal or flat conductors can effectively reduce inductance, thereby improving current transmission performance.

  • Electromagnetic compatibility (EMC)

Bus bar PCB design also needs to consider electromagnetic compatibility issues to ensure that it does not produce too much electromagnetic interference (EMI), while being able to resist external electromagnetic interference. By optimizing the conductor layout and using shielding materials, the electromagnetic compatibility of the bus PCB can be significantly improved.

  • Thermal management

Because bus bar PCB aims to transmit high current, thermal management is an important part of the design. The thermal design should ensure that the PCB can effectively dissipate heat and prevent overheating damage. For high power applications, radiators or active cooling are often used to ensure temperature control within design specifications.

bus bar pcb design

Best Technology Manufacturing Capability of Bus Bar PCBs

As the one of leading PCB manufacturers in China, Best Technology has exceptional capabilities in the production of busbar PCBs. Our manufacturing capabilities include high-precision metal processing technology to produce busbar PCBs with complex geometry and tight tolerances. In addition, we also have the production capacity of multi-layer bus bar PCB to meet the needs of different applications.

Best Technology is committed to providing customers with high-quality, high-performance busbar PCBs to support their power management and distribution systems. Below is a basic parameter of our bus bar PCB manufacturing capability. For more details, welcome to e-mail us at sales@bestpcbs.com.

Best technology capability of bus bar pcb
(Best technology capability of bus bar pcb)

Nowadays, bus bar PCBs are widely used in power distribution systems, electric vehicles, industrial equipment and other occasions requiring high current. According to statistics, the global busbar market is expected to grow at a compound annual growth rate (CAGR) of 6.5% between 2023 and 2028, demonstrating the growing importance of this technology in multiple industries.

With the rapid development of the eras, the most important thing for designers or buyers is to find a reliable bus bar PCB manufacturer to meet the high demands of the market. As the expert of the bus bar PCB fabricating, Best Technology has the mature technology and advanced equipment to produce high quality bus bar PCBs. Contact us right now to get your own bus bar PCB solutions!

Why is FR4 Material the Most Commonly Used PCB Material?
Wednesday, June 5th, 2024

FR4 material is a highly popular and widely used substrate in the PCB industry due to its exceptional mechanical strength, electrical insulation, and flame retardant properties. It has become the standard for PCB fabrication.

What is FR4 Material and Why is it Used in PCBs?

FR4 is a type of fiberglass-reinforced epoxy laminate. The term “FR4” comes from its flame-retardant properties, meeting the UL94V-0 standard. It is made from woven fiberglass cloth and epoxy resin, which together provide great strength and durability.

Electrical engineers and designers prefer FR4 because of its many benefits, such as:

  • Low cost
  • High dielectric strength
  • Excellent strength-to-weight ratio
  • Moisture resistance
  • Temperature endurance
  • Good electric loss characteristics
  • Flame retardance and self-extinguishing capabilities
  • Mechanical robustness
  • Insulating properties

FR4 is also suitable for marine PCBs because it absorbs very little water. In a standard FR4 PCB, a layer of FR4 is placed between two thin layers of laminated copper.

FR4 material pcb

What are the Key Performances of FR4 Material?

FR4 material, also recognized as flame retardant 4, is a composite of glass fabric and epoxy resin, predominantly utilized as a foundational material for printed circuit boards. Familiarity with the specifications of FR4 is crucial for selecting the appropriate substrate for PCB manufacturing. Key specifications include:

1. The thickness of FR4 sheet is usually 0.2 mm to 3.2 mm, and other special thickness also available.

2. The specific gravity of FR4 material is about 1.85g/cm3, which means that it is heavier than water.

3. Coefficient of thermal expansion of FR4 is about 1.0×10^-5cm/cm/℃, which means that its length or width will expand slightly when the temperature changes.

4. The thermal decomposition temperature of FR4 materials is usually between 280C and 320C, which makes it able to withstand high temperature applications.

5. FR4 material has a dielectric constant around 4.0-4.8, which makes it an ideal material for circuit board manufacturing.

6. FR4 has good arc resistance, which means that in the case of high voltage, it can effectively prevent arc discharge.

7. FR4 material good hydrolysis resistance and can maintain good performance even in a humid environment.

RF FR4 PCB

What are the Types of PCB Materials in the Industry?

PCB materials can be broadly categorized based on their composition and intended application. Nowadays, the commonly used are including FR4, polyimide (PI), Metal material (copper or aluminum), ceramic substrate like Al2O3, AlN, Si3N4, and so on. Different materials have its unique functions and well-suited in specific environment. Here we introduce their properties and suited applications simply.

FR4 (Fiberglass Epoxy Laminate)

At present, almost of PCB you seen in the market or electronics used the FR4 material. It widely used because of its superb equilibrium of mechanical strength, electrical insulation, and cost-efficiency. Actually, according to the different reinforcement materials, the circuit board is mainly classified into the following types:

1) FR-4

2) FR-1, FR-2, etc.

3) CEM series: Composite substrate

FR-4 used frequently because of its high fire resistance rating.

High Tg FR4

Though normal FR4 material has good electrical insulation, it is not an ideal option for high frequency circuit board. And then, high Tg FR4 stands out by using an advanced technology. “Tg” refers to glass transition temperature, the juncture at which the material transitions from a rigid, glassy state to a pliable, rubbery state. High Tg FR4 boasts a Tg of 170°C or higher.

Polyimide (PI)

Polyimide materials are renowned for their excellent flexibility, superior thermal stability and chemical resistance. It is always used as raw material of flex circuits, rigid flex circuit boards or membrane switches. Due to the good chemistry properties, they can endure temperatures up to 260°C and are highly flexible, making them ideal for those small and limited PCB designs.

polyimide pcb

Metal base material

Metal materials always used in metal core PCBs (MCPCB), usually used aluminum core or copper core. The metal base has great thermal conductivity to enhance the thermal management of the device, buy using metal core, the device can dissipate heat away from the critical component such as LED chips, ICs, BGAs, to remain the reliability and performance of the PCB.

metal core pcb

Ceramic substrate

Ceramic PCB substrate offers excellent thermal conductivity and stability than that metal core PCBs, making them suitable for high-power and high-frequency applications. But due to the high cost and complex manufacturing, the ceramic PCB is much expensive than metal core PCB, therefore, they are always be used in high-end applications, such as the military, defense, aerospace and some special fields where requires excellent thermal management.

ceramic pcb

Understanding these materials enable to help engineers and designers in selecting the most appropriate substrate for their projects, ensuring optimal performance and cost-efficiency. Best Technology provides a comprehensive array of PCB materials, guaranteeing high-quality solutions for all your electronic needs.

What are the Applications of FR4 PCB Material in Various Industries?

FR4 material is versatile and finds applications in numerous industries, including:

  • Consumer Electronics like smartphones, laptops, and other personal electronic devices.
  • Applied in vehicle electronics for infotainment systems, engine control units, and more.
  • Industrial Equipment such as control systems, power supplies, and industrial automation.
  • Essential for telecommunications, network devices, routers, and communication infrastructure.
  • Medical instrumentation and diagnostic equipment.
  • Aerospace and defense in avionics, radar systems, and defense electronics.

This is all of this sharing, thanks for your reading. Welcome to contact us if you have other questions about FR4 or other raw materials of PCB. Best Technology engaging in the PCB manufacturing about 18 years, we are one of the leading PCB manufacturers in China. And we have such confidence to provide with you the best PCB and PCBA fast solution for your projects.

What are HDI PCBs and Their Basic Parameters?
Wednesday, June 5th, 2024

High-Density Interconnect (HDI) PCBs are revolutionizing the electronics industry with their advanced capabilities and compact designs. As technology continues to evolve, the demand for smaller, faster, and more efficient electronic devices has led to the widespread adoption of HDI PCBs.

What is Definition of HDI PCB?

HDI board refers to High Density Interconnect, that is, high density interconnect board, which is a relatively new technology developed by the PCB industry at the end of the 20th century.

The drilling of the traditional PCB board is affected by the drilling tool, and when the drilling aperture reaches 0.15mm, the cost is already very high, and it is difficult to improve again. The drilling of HDI board no longer relies on traditional mechanical drilling, but uses laser drilling technology. (This is why it is sometimes called a laser plate.) The hole diameter of the HDI board is generally 3-5mil (0.076-0.127mm), the line width is generally 3-4mil(0.076-0.10mm), the size of the pad can be greatly reduced, so more line distribution can be obtained within the unit area, and the high-density interconnection comes from this.

Smaller device spacing, more I/O pins and embedded passive devices Larger ASiCs and FPGAs with increasingly shorter rise times and higher frequencies all require smaller PCB feature sizes, which is driving a strong demand for HDI/ micro through-holes. The typical high density interconnector designs are including:

  • 1+N+1
  • 2+N+2
  • 3+N+3
  • 4+N+4
HDI PCB

What are the benefits of HDI PCB?

HDI is a compact circuit board designed for small volume users. Compared with ordinary FR4 PCB, the most significant feature of HDI is the high wiring density, and the difference between the two is mainly reflected in the following three aspects.

1. HDI is smaller and lighter

HDI board is a traditional dual panel as the core board, through continuous stacking layer by layer. This kind of circuit board made by continuous layering is also called Build-up Multilayer (BUM). Compared with traditional circuit boards, HDI circuit boards have the advantages of “light, thin, short and small”.

The electrical interconnection between the HDI board is realized through the conductive through hole, buried hole and blind hole connection, its structure is different from the common multi-layer circuit board, and a large number of micro-buried blind holes are used in HDI board. HDI uses direct laser drilling, while standard PCBS usually use mechanical drilling, so the number of layers and aspect ratio tend to be reduced.

The high density of HDI board is mainly reflected in the hole, line, pad density, and layer thickness.

● Micro-via hole

The HDI board contains the design of micro-pilot holes such as blind holes, which is mainly reflected in the micro-hole formation technology with a diameter less than 150um, and the high requirements of cost, production efficiency and hole position precision control. In the traditional multilayer circuit board, there are only through holes and no tiny buried blind holes.

● Fine line width and line distance

Its main performance in the wire defects and wire surface roughness requirements are more and more stringent. Generally, the line width and line distance do not exceed 76.2um.

● High pad density

The density of welded contacts is greater than 50 per square centimeter.

● Thinning of medium thickness

It is mainly manifested in the trend of the thickness of the interlayer medium to 80um and below, and the thickness uniformity requirements are becoming more and more stringent, especially for high-density plates and packaging substrates with characteristic impedance control.

2. Better electrical performance

    HDI not only enables end-product designs to be miniaturized, but also to meet higher standards of electronic performance and efficiency at the same time.

    The increased interconnect density of HDI allows for increased signal strength and improved reliability. In addition, the HDI board has better improvement for RF interference, electromagnetic wave interference, electrostatic discharge, heat conduction and so on. HDI also uses full digital signal process control (DSP) technology and a number of patented technologies, with a full range of load adaptability and strong short-term overload capability.

    3. The HDI board has very high requirements for buried holes

    It can be seen from the above that whether it is the volume of the board, or the electrical performance, HDI is better than ordinary PCB. Where the coin has two sides, the other side of HDI is as a high-end PCB manufacturing, its manufacturing threshold and process difficulty are much higher than ordinary PCB, and there are more problems to pay attention to when producing – especially the buried hole jack.

    What are the basic parameters of HDI PCB?

    HDI PCB has greater different with normal FR4 PCB, from the stack up, material selection, manufacturing and cost. So, it is vital to understanding the basic parameters of a high-density interconnect board before start your designing trip. The standard parameters of HDI board mainly include the following aspects:

    1. Numbers of layers

    Generally, the number of layers of HDI board is 4-20 layers, and the high-end HDI board can reach to 40-50 layers.

    • Line width/spacing

    Due to the HDI PCB are always used in high-end applications, their line width and spacing are usually very strict, and the common requirement is that the line width/spacing is 4/4mil (0.1mm), or even smaller.

    • Blind hole, buried hole, bus

    These are one of the characteristics of the HDI board, blind hole and buried hole can reduce the area of the circuit board, make your design more density, and the bus enable to improve the signal transmission rate of the PCB.

    • Board thickness

    The board thickness of HDI board is usually range from 0.8 to 3.2mm, of which 1.6mm is the most common thickness.

    • Pad

    The pad on the HDI board is generally very small, and the common pad size is 0.2mm to 0.5mm. Different factory has different capabilities, it is best to ask your supplier or manufacturer to get a manufacturing capability document.

    • Impedance control

    For high-speed signal transmission circuits, the impedance control of the HDI board is very important, and the requirements are very strict. It is needed to tell your vendor if your HDI board will be used in high-speed devices.

    • Material

    The main materials of HDI board are FR4, BT, PI, PET, etc. Different materials can meet different requirements.

    This is the end of this sharing, contact us today to learn more about our HDI PCB solutions and how we can help you achieve your technological goals. In our next chapter, we will introduce the manufacturing process and methods of HDI boards, let me know if you are interested in it.