Archive for the ‘FAQ’ Category

PCB Assembly manufacturer High Quality & Fast Delivery

Monday, September 9th, 2024

What is pcba?

PCBA is the abbreviation of Printed Circuit Board Assembly, which means “circuit board assembly” or “circuit board assembly”. ‌It refers to installing electronic components on a printed circuit board and connecting the components to the circuit board through welding and other methods to form a complete circuit system.

This process involves multiple important links, including SMT (surface mount technology) mounting, DIP (dual in-line package) plug-in, etc., which eventually form a key component of electronic products. PCBA is not only the physical support of electronic equipment, but also provides a way to connect circuits, and also plays a role in protecting components and dissipating heat. In the manufacturing process of electronic products, the production process of PCBA includes steps such as PCB design, manufacturing, component placement, welding and testing to ensure the functionality and reliability of the product.

What does pcba stand for in electronics

PCBA stands for Printed Circuit Board Assembly in electronic products‌. PCBA is the process of assembling and soldering electronic components on a printed circuit board to form a complete circuit board. It is an important part of modern electronic products, including mobile phones, computers, cars, home appliances, etc.

. PCBA processing involves several important links, such as SMT (surface mount technology) and DIP (dual in-line package) plug-ins, which ensure the correct placement of electronic components and the reliability of the circuit. In addition, the use of PCBA processing equipment and the improvement of manufacturing processes, such as printers and dispensing machines, have improved the yield and efficiency of PCBA processing products‌

What is pcba manufacturing

The manufacturing process of PCB (printed circuit board) involves multiple process links, including design, plate making, drilling, filling, electroplating, etc. These steps together constitute the manufacturing process of PCB.

Design: First, according to the needs and layout design of the circuit, the circuit diagram is drawn using computer-aided design (CAD) software. This stage is very critical because it directly determines the function and performance of the PCB.
Plate making: After the design is completed, the designed circuit diagram needs to be converted into a practical PCB board that can be made. This usually involves the use of photosensitive materials and special chemical treatments so that the circuit pattern can be accurately transferred to the PCB substrate.
Drilling: After the plate making is completed, holes need to be drilled on the substrate according to the designed circuit pattern. These holes are used for subsequent wiring connections. The precision and accuracy of drilling are essential to ensure the normal operation of the circuit.
Filling: After drilling, some substances, such as resin, need to be filled in the hole to enhance the structural strength and electrical insulation performance of the PCB.
‌Electroplated‌: In order to ensure good electrical connection, the PCB needs to be electroplated, usually by electroplating a layer of copper or other conductive materials on the copper foil. This step is very important to ensure the conductivity and durability of the circuit.
‌Lamination and cutting‌: After the electroplating is completed, the multi-layer circuit boards are laminated together to form a multi-layer PCB. Subsequently, the PCB boards are cut into specific sizes as needed.
Inspection and testing‌: The manufactured PCB is inspected and tested to ensure that its functions and performance meet the design requirements. This may include visual inspection, functional testing and other methods.
‌Finished product assembly‌: The qualified PCBA board is assembled into the shell

‌What is the SMT process in PCBA?

‌1. Programming and adjusting the SMT machine‌: According to the information provided by the customer, program the coordinates of the location of the SMT components and perform the first piece check.

2. Printing solder paste‌: Use a screen printer to print the solder paste on the pads on the PCB board where the electronic components need to be soldered.

3. SPI inspection‌: Use a solder paste detector to detect the quality of solder paste printing to ensure that there are no defects.

4. SMT‌: Use a SMT machine to accurately install the electronic components SMD to the fixed position of the PCB.

‌5. High-temperature solder paste melting‌: The solder paste is melted at high temperature through a reflow oven to firmly solder the electronic components SMD and the PCB board together.

6. AOI inspection‌: Use an automatic optical inspection instrument to detect whether the PCBA components after welding have poor welding.

7. Visual inspection‌: Manual inspection checks the version of the PCBA, whether the direction of the components is correct, and the defects after welding.

8. Packaging‌: The qualified products are separated and packaged. The packaging materials used include anti-static bubble bags, static cotton, blister trays, etc.

PCB Assembly manufacturer High Quality & Fast Delivery

Best Technology is a PCB assembly manufacturer in Asia, who specializes in printed circuit board assembly (PCBA) and manufacturing. We have our own PCBA factory with 8 SMT lines, each line equipped with full-automated manufacturing and testing machine. In our PCBA factory, you can see dual-online AOI, SPI, X-RAY, nitrogen reflow oevn and so on. We are certified by ISO9001, ISO13485, and IATF16949, ensuring the highest quality standards in every PCB project.

Full turnkey service from pcb design, pcb manufacturing, component sourcing, pcb assembly, pcb duplicating in a very short time.

We source all the parts directly from the manufacturers or from authorized distributors such as Digikey, Mouser,Future,TTI,Avnet and Arrow to avoid counterfeit parts.

We also warehouse a significant inventory of common parts.If we cannot source a specific component, our engineers will make recommendations for fair-price alternatives.

What is pcba test

‌‌PCBA testing‌ is the process of testing the electrical conductivity and input-output values of the PCBA circuit board with mounted electronic components to ensure that all the installed circuit boards are completely consistent with the various specifications and parameters of the design. Through strict testing, the performance and reliability of the PCBA board can be improved, customer trust can be won, and cooperation between enterprises and customers can be promoted.

PCBA testing includes various test forms, such as ICT testing (internal circuit testing), FCT testing (functional testing), fatigue testing, extreme environment testing and aging testing.
ICT testing tests the characteristics of devices and circuit networks by applying test probes to the test points on the PCB.

FCT testing is mainly used to test the electronic and electrical functional aspects of the PCBA board, and is tested under the condition of simulating the actual operating state of the PCBA board. Fatigue testing performs high-frequency and long-term operations by sampling to observe whether failures occur.

Extreme environment testing places the PCBA board in harsh and extreme environments, such as high temperature, severe cold, and falling, to infer the reliability of the PCBA board. Aging testing is to power on the PCBA board and electronic products for a long time to observe whether any failures occur.

What is a pcba number

A combination of letters and numbers used to uniquely identify and track each electronic component on a circuit board. These numbers are often called component numbers, part numbers, or reference designators.

On PCBA boards, the format and meaning of these numbers may vary depending on the manufacturer and designer, but generally follow certain rules.

For example, common numbers are R107, C118, Q102, D202, etc., where:
The first letter usually identifies the type of device, such as: R for resistors, C for capacitors, D for diodes, Q for transistors, etc.
The subsequent digital part may indicate the circuit function number (such as “1” may indicate the motherboard circuit, “2” may indicate the power supply circuit, etc.) and the serial number of the device on the circuit board.

FAQ About PCBA

hat does poor welding include and what kind of faults will it cause?
Poor welding is manifested as incomplete solder joints, cold solder joints, etc., which lead to reduced conductivity of the circuit board or circuit failure. Solutions include optimizing soldering parameters, ensuring pad cleanliness, adjusting soldering energy, and increasing soldering temperature or extending soldering time.

What causes component misalignment?
It is caused by inaccurate positioning of components during the soldering process, affecting circuit connection and product function. Solutions include implementing precise visual inspection and automatic inspection to ensure that components are placed correctly and rework and repair.

What do short circuits and open circuits mean?
Short circuits and open circuits: caused by poor insulation or fracture between adjacent solder joints on the circuit board or between solder joints and lines, which may cause abnormal current flow or circuit interruption. Solutions include ensuring that solder paste is evenly applied, components are correctly placed, and adjusting soldering parameters to avoid excessive soldering temperature and pressure.

What causes solder cracking?
Solder cracking: cracking occurs during use or after a certain environmental stress, usually due to excessively high temperatures, long soldering time, or improper selection of soldering materials during the soldering process. Solutions include optimizing soldering parameters, ensuring proper soldering temperature and time, and selecting appropriate soldering materials.

Why electrostatic discharge?
‌Electrostatic discharge (ESD) damage: Sensitive electronic components can be damaged by ESD. Solutions include implementing ESD control measures in the production environment, such as using ESD gloves and anti-static workbenches.
Does voltage instability affect PCBA performance?
‌Power supply issues: Power supply stability issues can affect PCBA performance. Solutions include implementing power electronics technology and voltage regulators to ensure stable power supply.

what does pcba stand for

PCBA stands for Printed Circuit Board Assembly. Other synonyms of PCBA include “PCB Assembly”, “Populated PCB” and “Board Assembly”. These terms are widely used in the electronics industry to describe the finished or semi-finished state of a circuit board after component placement and soldering.‌

what is a pcba board

PCBA board, full name Printed Circuit Board Assembly, Chinese name is printed circuit board assembly, refers to the installation and welding of components on the completed printed circuit board to form a circuit board that can be used directly.

The production process of PCBA board mainly includes three steps: component mounting, welding and testing. First, the obtained components are accurately positioned and mounted on the PCB board according to the design requirements, and then the components are firmly fixed on the PCB board by welding, and the circuit is ensured to be unobstructed. Finally, the circuit is tested to verify whether it is working properly. The whole process requires a high degree of technology and precision to ensure the quality of PCBA board.

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What are inverters and converters? What do they do?

Monday, September 9th, 2024

Electricity is ubiquitous in our lives, and the use of all devices is closely related to electricity. The use of electricity depends on how to control and convert it. Among them, the indispensable tools are inverters and converters, which can convert electrical energy into different forms to meet various needs.

What are AC and DC?

1. Definition of alternating current and direct current:

Alternating current (AC) refers to the current whose direction changes periodically over time, and the average current in one cycle is zero.

The waveform of alternating current is usually a sine curve, but there can also be other waveforms, such as triangular waves and square waves. Alternating current is widely used in power transmission and industrial applications.

Inverters and converters? What effect do they have on current flow?

Direct current (DC) refers to the current whose direction is constant.

The magnitude and direction of direct current do not change with time. Common DC power sources include dry batteries and storage batteries. The direction of pulsating direct current does not change, but the magnitude changes with time. It usually needs to be filtered to become smooth direct current.

2. The difference between AC and DC:

The main difference between AC and DC is whether the direction of the current changes over time.

The direction of AC changes periodically, while the direction of DC remains unchanged. In addition, the average value of AC in a cycle is zero, while the current and voltage of DC remain constant.

3. Application scenarios of AC and DC:

AC is mainly used for power transmission and industrial applications because its waveform is a sinusoidal curve, which is suitable for long-distance transmission. DC is often used in situations where constant current is required, such as battery-powered electronic devices.

How do you convert from DC to AC?

DC can be converted into AC through an inverter. The inverter usually consists of an inverter bridge, control logic, and filter circuits.

Inversion is a current conversion process opposite to rectification, which converts DC into AC. When the inverter side, i.e., the AC side, is connected to the power grid, it is called active inversion, and when the inverter side, i.e., the AC side, is directly connected to the load, it is called passive inversion.

The inverter circuit can convert DC power into AC power of any frequency and voltage under the control of the control circuit, so it is widely used, for example, when DC power is needed to supply power to AC loads.

What is dc to ac inverter?

‌Inverter is a device that converts DC power into AC power. ‌‌

The inverter is mainly composed of an inverter bridge, control logic and filter circuit, which can convert DC power (such as batteries, storage batteries) into fixed frequency and voltage or frequency and voltage AC power, usually 220V, 50Hz sine wave.

Inverters are particularly widely used in automobiles. They can drive various electrical appliances and tools by connecting to batteries, making it possible to use household appliances when driving or traveling.

Inverters can be divided into sine wave inverters and square wave inverters according to the output waveform. Although the sine wave inverter is more expensive, it can be applied to various loads, and the output waveform is closer to the mains, which is friendly to electrical equipment.

The efficiency of the inverter is an important indicator of its performance, which indicates the ratio of output power to input power. With the development of technology, inverters are showing a trend of high frequency, high performance and miniaturization, and are widely used in various fields of power electronics technology.

What is dc to ac converter?

An AC to DC converter is a device whose main function is to convert alternating current (AC) into direct current (DC). Such converters are commonly used in household appliances, computers, mobile phone chargers and other devices to convert the AC power provided by the power grid into the DC power required by the device.

The working principle of the AC/DC converter involves converting the AC power into smooth DC power through a rectification and filtering process. This converter can be bidirectional in terms of power flow, that is, power can flow from the power source to the load (called rectification) or from the load back to the power source (called active inversion).

The working principle of the AC/DC converter involves several key steps:

‌Rectification‌: Converting AC power into unidirectional pulsating DC power is achieved by using a rectifier, which can be a half-wave rectifier or a full-wave rectifier, depending on the specific technology used.

‌Filtering‌: Filtering is performed by using capacitors to eliminate the pulsating components generated during the rectification process to obtain a smoother DC power.

‌Voltage stabilization‌: In some applications, voltage stabilization may also be required to ensure the stability of the output voltage.

The design and application of AC/DC converters are limited by many factors, including safety standards, electromagnetic compatibility (EMC) requirements, and power system optimization design.

In addition, the use of high-voltage, high-current switches increases the power consumption, which to a certain extent limits the modularization process of AC/DC converters.

What is the difference between an inverter and converter?

The main difference between an inverter and a converter is that they have different functions and conversion directions. ‌

Although inverters and converters sound similar, their functions and conversion directions are completely different. The main function of an inverter is to convert direct current (DC) into alternating current (AC), while a converter does the opposite, converting AC into DC. This difference makes them play their respective roles in different application scenarios.

1. ‌Inverter‌:

The main application of an inverter includes converting electricity generated by a DC power source (such as a battery) into AC to meet the needs of AC equipment. The advantages of the inverter include high conversion efficiency, fast startup, good safety performance, etc., but it may also generate noise due to its working principle, and corresponding countermeasures need to be taken to reduce the noise.

2. Converter:

Unlike the inverter, the main function of the converter is to convert AC to DC.

This is usually achieved through the process of half-wave rectification and full-wave rectification, which involves passing the positive half-cycle or positive and negative cycles of AC through the rectifier circuit, and then further processing through capacitor filtering and voltage stabilization circuit to finally obtain DC.

Converters are widely used in various electronic devices that need to convert AC power to DC power.

In general, although inverters and converters are similar in name, their functions and conversion directions are completely different. Inverters convert DC to AC and are suitable for using DC power for AC devices; while converters convert AC to DC to meet the needs of devices that require DC power.

Why would you use an inverter?

The main reason for using an inverter is to convert DC to AC to meet the power needs of various devices and systems. ‌

The main function of the inverter is to convert direct current (DC) into alternating current (AC), which is necessary in many fields and scenarios. Here are some of the main uses of the inverter:

1. Household electricity: The inverter can convert the DC power of the car battery or other DC power source into the AC power required by household appliances, so that the car or other DC power source can power household devices.

2. Emergency power supply: In the event of a power outage or power outage, the inverter can convert the DC power of the backup power source (such as gasoline generators, solar panels, etc.) into AC power to provide power support for key equipment.

3. Electronic devices: Many portable electronic devices (such as laptops, mobile phones, cameras, etc.) use DC batteries as power sources. The inverter can convert DC power into AC power to provide power for these devices.

4. Industrial applications: In industrial production, the inverter can convert high-voltage DC power into low-voltage AC power to meet the power needs of different equipment and systems.

5. Electric vehicle charging: With the popularity of electric vehicles, inverters are increasingly used in electric vehicle charging stations, which convert direct current from the power grid into alternating current required by electric vehicle batteries.

6. Radio communication: In radio communication, inverters are used to convert direct current into radio frequency power to transmit and receive radio signals.

Therefore, inverters play an indispensable role in modern society and are widely used in various fields to provide necessary power conversion and support for various devices and systems.

What are the disadvantages of an inverter?

1. Harm to batteries: Inverters increase the burden on batteries and shorten the life of batteries. Inverters generate electromagnetic interference and heat when working, which may interfere with batteries, causing unstable battery voltage or internal damage to batteries.

2. Energy loss: The conversion efficiency of inverters is relatively low, and there will be a certain amount of energy loss.

3. High cost: The cost of inverters is high, which may not be suitable for some low-cost applications.

4. May generate electromagnetic interference and heat: The inverter will generate high-frequency electromagnetic waves and a certain amount of heat when working, which may affect the working performance of other electronic equipment and may even cause safety problems.

In summary, although the inverter provides convenience in many applications, its disadvantages cannot be ignored, including energy loss, high cost, possible electromagnetic interference and heat, and potential safety hazards.

Conclusion:

Inverters and converters are indispensable in modern electrical systems to ensure that energy flows to where it is needed in the right form. Whether it is converting DC to AC for renewable energy systems, using batteries to power equipment, or ensuring uninterruptible power supply, these tools can achieve a smooth transition between different types of current.

Tags:circuit, converter, inverter, PCB
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What is a breadboard & What is it used for?

Monday, September 9th, 2024

In the vast world of electronics, there is a seemingly ordinary but extremely important tool, the breadboard. The breadboard is like a silently dedicated assistant to electronic engineers, building a bridge for electronic enthusiasts and professionals to realize their creativity. So, what exactly is a breadboard? What is its indispensable use?

What is a breadboard?

A breadboard is a board designed and manufactured for solderless experiments on electronic circuits. It has many small jacks, allowing various electronic components to be inserted or removed as needed, eliminating the soldering steps, saving circuit assembly time, and components can be reused, which is very suitable for electronic circuit assembly, debugging and training.

The original intention of the breadboard was to encourage innovation and simplify the learning process of electronic circuits. Its main features include:

No soldering design: users can directly insert electronic components into the jacks of the breadboard without soldering, which greatly reduces the difficulty and complexity of electronic circuit production.

‌Components are reusable‌: Due to the solderless design, users can replace or adjust components in the circuit at any time without re-soldering, which is very beneficial for experiments and learning.

‌Suitable for all kinds of electronic components‌: Whether it is resistors, capacitors, transistors or integrated circuits, they can be easily inserted into the sockets of the breadboard for experiments and tests.

‌Simple structure‌: Breadboards are usually made of plastic blocks and contain a matrix of electrical sockets inside. These sockets are connected within the board, usually in rows of five sockets, forming a complete circuit path.

Why is it called a breadboard?

The reason why the breadboard got its name can be traced back to the era of vacuum tube circuits. At that time, most of the circuit components were large in size, and people usually fixed them to a piece of bread-cutting wood for connection by screws and nails. As the size of circuit components decreased, the name of the breadboard remained.

The origin of this name reflects the historical evolution and technological progress in the field of electronic production, and also reflects the intimacy and recognition of electronic production enthusiasts for this tool.

The original intention of the design of breadboard is to facilitate the assembly, debugging and training of electronic circuits. By providing many small jacks, various electronic components can be inserted or unplugged at will, thus eliminating the trouble of welding, saving the assembly time of the circuit, and the components can be reused, which is very suitable for the non-welding experiment of electronic circuits.

What is a breadboard used for?

Breadboards are mainly used for the design and manufacture of non-welding experiments of electronic circuits. ‌

A breadboard is a board designed and manufactured for the non-welding experiment of electronic circuits. Its characteristics are that there are many small jacks on the board, allowing various electronic components to be inserted or unplugged at will as needed, thus eliminating the welding process and saving the assembly time of the circuit.

In addition, since the components can be reused, breadboards are very suitable for the assembly, debugging and training of electronic circuits. This tool is a must-have for electronic production enthusiasts, and is widely used in electronic engineering, communication engineering, automatic control and other fields.

In practical applications, breadboards can be used for simulation testing and verification in the circuit design stage, as well as for transferring circuits to PCB boards for mass production in the production and manufacturing stage.

In the fields of education and research, breadboards help students and researchers better understand electronic technology and circuit design principles. It can also be used for the development and production of DIY electronic products, robots and other fields, and has a wide range of application prospects.

What types of breadboards are there?

1. Solderless breadboard:

This is the most common type. It consists of many small jacks inside, and the circuit is connected by inserting the pins of electronic components. No soldering is required, which is convenient and fast, suitable for beginners and quick circuit construction and debugging.

There are different specifications and sizes, such as small breadboards are suitable for simple circuit experiments, and large breadboards can accommodate more components to build more complex circuits.

2. Solderless breadboard:

The function is similar to that of the solderless breadboard, and electronic components can be connected without soldering. Usually with colored marking lines or areas, it is easy to distinguish different circuit parts and plan component layout.

Some solderless breadboards also come with power bars and ground bars, which are convenient for providing power and ground connections for the circuit.

3. Multi-hole breadboard:

There are more jacks and a denser layout. More electronic components can be connected, which is suitable for building complex circuits.

Some multi-hole breadboards are also designed with special structures, such as grooves or slots, to facilitate the fixing of wires and components and make the circuit more stable.

4. Breadboard with power supply

The integrated power module can directly provide stable power to the circuit without the need to connect an additional power adapter or battery pack.

The power supply part usually has an adjustable voltage function to meet the power requirements of different electronic components.

5. Transparent breadboard

Made of transparent materials, it is convenient to observe the connection status and component layout inside the circuit, which is very helpful for teaching and circuit debugging.

The appearance of the transparent breadboard is beautiful, which can increase the fun and visualization of circuit construction.

What is a “solderless” breadboard?

A solderless breadboard (also called a solderless test board) is a method that provides convenient interconnection of electronic components without the need for soldering. ‌This breadboard consists of a series of U-shaped metal contacts that are located below the hole grid in the electrically insulating shell.

The component leads and the wire segments inserted through the holes are held under spring tension by the contacts below, thus achieving a solderless connection. Solderless breadboards are particularly suitable for electronic circuit experiments in hobby, education or development environments because they allow users to quickly and easily build and reconfigure circuits while saving the time and cost of soldering.

In addition, solderless breadboards also support the reuse of components, which is very beneficial for learning and training. However, it should be noted that although solderless breadboards provide great convenience, they do not provide a mechanically sturdy interconnection, have limited power handling capabilities, and are not suitable for high-speed circuit applications.

What are the advantages and disadvantages of a breadboard?

The advantages of breadboards are:

1. Convenient and fast operation:

No need to solder, electronic components can be directly inserted into the jacks of the breadboard for circuit connection, which greatly saves the time and workload of circuit construction.

If a connection error is found during the insertion of the component, the component can be easily pulled out and reinserted without damage, reducing the cost and risk of circuit construction.

2. High safety:

Compared with soldered circuits, breadboards do not have safety issues such as burns and electric shocks that may occur during soldering, and are particularly suitable for beginners and students.

There is no need to worry about components being damaged due to improper soldering, which reduces safety hazards in circuit experiments.

3. Suitable for beginners:

For beginners of electronic circuits, breadboard is an ideal learning tool. It can help beginners quickly understand the basic principles and connection methods of circuits, enhance the perceptual understanding of electronic circuits through practical operations, and improve the interest and efficiency of learning.

4. Easy to observe and debug:

The structure of the breadboard is relatively simple, and the circuit connection is clearly visible, which is convenient for users to observe the connection of the circuit and the layout of components.

The advantages of breadboard are:

1. Poor connection stability:

The contact between the jacks on the breadboard and the component pins may not be tight enough, and it is easy to have a virtual connection. Especially after transportation, movement or long-term use, the jacks may become loose, resulting in unstable circuit connection and affecting the normal operation of the circuit.

2. Not suitable for complex circuits:

The number and layout of the jacks of the breadboard are limited. When the number of components in the circuit is large or the circuit structure is complex, the breadboard may not provide enough jacks to connect all the components, limiting the scale and complexity of the circuit.

When there are many connecting wires on the breadboard, it is easy to have chaotic lines, which increases the difficulty of circuit debugging and troubleshooting.

3. Poor high-frequency performance:

The structure and material of the breadboard determine that its high-frequency performance is poor, and it is not suitable for the transmission and processing of high-frequency signals. In high-frequency circuits, the transmission of signals will be affected by the jacks and connecting wires on the breadboard, resulting in signal distortion, attenuation and other problems.

4. Limited current carrying capacity:

The current carrying capacity of the connecting wires and jacks on the breadboard is limited. For high-power electronic components, it may not provide enough current, causing the components to not work properly or damage the breadboard.

Conclusion:

Breadboards are an indispensable tool in the world of electronics. From experiments to troubleshooting, breadboards are an indispensable part of circuit design. They can easily handle modifications, are cost-effective, and are reusable, making them a mainstream product in the electronics field.

Tags:breadboard, PCB, pcb design, PCBA
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What is Soldering? What Temperature Does Solder Melt?

Friday, September 6th, 2024

Soldering is a crucial process in many industries, especially in electronics and metalworking. It involves bonding materials, primarily metals, using a filler material called solder. This process is essential for creating connections that are both electrically conductive and mechanically strong. But what exactly is soldering? At what temperature does solder melt? And what types of solder are most commonly used? This blog will answer these questions and explain why soldering is important.

What is Soldering?

Soldering is a PCB assembly process where two or more metal surfaces are joined by melting and flowing a filler metal (solder) into the joint. Unlike welding, soldering doesn’t melt the base metals. Instead, the filler metal, which has a lower melting point, is used to create a bond between the two surfaces. The process is common in electronics, plumbing, and metalwork, where a strong, conductive connection is needed.

Generally speaking, the commonly used solder materials are tin lead alloy solder, antimony solder, cadmium solder, silver solder, and copper solder. The linear solder used in standard welding operations is called rosin cored solder wire or solder wire. A flux was added to the solder. This flux is composed of rosin and a small amount of active agent. It is very important to set the temperature during welding operation. The most suitable temperature for welding operations is plus 50 degrees at the melting point of the welding used. The set temperature of the soldering iron head, due to the size of the welding part, the power and performance of the soldering iron, and the different types and lines of the solder, it is appropriate to increase 100 degrees on the basis of the above temperature.

The main products of solder are divided into three categories: solder wire, solder bar and solder paste. Applied to all kinds of electronic welding, suitable for manual welding, wave welding, reflow welding and other processes.

What is Soldering Primarily Used For?

Soldering is mainly used in the electronics industry to connect various components on PCBs. Without soldering, it would be nearly impossible to create the intricate electrical connections that power most electronic devices. From mobile phones to computers, soldered joints are everywhere.

Soldering is also widely used in plumbing for joining copper pipes. It creates leak-proof seals that withstand pressure, making it reliable for water supply systems. Additionally, jewelry makers and metalworkers use soldering to join fine pieces of metal. It allows them to create strong, invisible joints without damaging delicate components.

What Temperature Does Solder Melt?

The melting point of solder depends on the type of solder being used. Solder typically comes in two main varieties: leaded and lead-free.

Leaded Solder

The most common composition of leaded solder is a mixture of tin (Sn) and lead (Pb), typically in a 60/40 ratio. This type of solder melts at around 183°C (361°F). Leaded solder has been used for decades due to its reliable melting point and easy flow properties, making it ideal for electronics.

Lead-Free Solder

Lead-free solder is now more widely used due to health and environmental regulations. Lead-free solder typically contains a mix of tin, copper, and sometimes silver. Its melting point is slightly higher, around 217°C (423°F). Although it requires more heat, lead-free solder is considered safer and more environmentally friendly.

It’s important to note that different solders may have varying melting points depending on their specific composition. Always check the specifications of the solder you’re using to ensure you apply the correct temperature.

Does Solder Have Lead?

Not all solder contains lead. Leaded solder was once the standard for many years, especially in the electronics industry. However, due to the harmful effects of lead exposure, leaded solder is being phased out, particularly in consumer electronics.

Lead-free solder is now the preferred option, especially for products sold in regions that regulate the use of hazardous materials. The shift to lead-free solder has become more prevalent with the Restriction of Hazardous Substances (RoHS) directive, which bans the use of lead in many electrical and electronic products. Today, many manufacturers and companies use lead-free solder for health and environmental reasons.

While lead-free solder is generally considered safer, leaded solder is still used in some industries due to its lower melting point and reliability in certain applications.

What is the Melting Point of Solder?

The melting point of solder depends on its composition, but the most commonly used solders have predictable melting temperatures:

Leaded Solder: 183°C (361°F)

Lead-Free Solder: 217°C (423°F)

These are standard temperatures, but other specialized solders may melt at higher or lower temperatures. For instance, silver-bearing solders may melt at higher temperatures, while low-temperature solders for specific applications can melt as low as 138°C (280°F).

Knowing the exact melting point of your solder is important because using the wrong temperature can lead to poor joints or even damage to components. In electronics, overheating can affect sensitive components, while underheating can result in weak or unreliable connections.

What is Lead-Free Solder Made of?

Lead-free solder typically contains a mixture of metals designed to mimic the properties of traditional leaded solder. The most common lead-free solder composition is a mix of tin (Sn), copper (Cu), and sometimes silver (Ag). This combination ensures a solid joint while keeping the melting point manageable.

Tin (Sn): The main ingredient in most solders, providing strength and flexibility.

Copper (Cu): Helps to enhance the mechanical strength of the solder joint.

Silver (Ag): Sometimes added to improve conductivity and joint strength, though this increases cost.

Lead-free solder is used to create safer work environments, particularly in industries where workers are regularly exposed to soldering fumes. It is also more environmentally friendly as it reduces the risks associated with lead contamination.

Is Tenshan Lead-Free?

Yes, most manufacturers, including Tenshan, now offer lead-free solder options in compliance with environmental standards. Lead-free solders, like those provided by Tenshan, are designed for use in various industries, ensuring safe and effective soldering without the risks associated with lead exposure.

Lead-free products from companies like Tenshan are developed to meet both performance and safety standards. These solders deliver excellent bonding capabilities without compromising the health of the workers or the environment. With the growing emphasis on eco-friendly practices, lead-free options are becoming the preferred choice for many applications.

Tags:melting point of solder, solder melt, solder temperature
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Do LED lights need a circuit board?

Thursday, September 5th, 2024

LED lights have become an integral part of modern lighting solutions, featuring energy-saving, durability, and versatility. But a common question is, do you think LED lights need a circuit board to work?

What is a LED circuit board?

An LED circuit board is a platform used to power and control light-emitting diodes (LEDs). Essentially, it is the basis for connecting all the necessary electronic components (such as resistors, capacitors, and diodes) to ensure that the LED operates safely and efficiently.

Circuit boards used for LEDs are usually metal core printed circuit boards (MCPCBs) because they have excellent heat dissipation properties. This is important because although LEDs are highly efficient, they still generate heat. Without proper heat management, this can lead to poor performance or shortened life of the LED.

The design and manufacture of LED circuit boards involves many aspects, including the layout of the board, the soldering of components, and the design of the driver circuit. The driver circuit is the core part of the LED circuit board, which is responsible for converting the input AC power into DC power suitable for LED use, while providing stable current and voltage to ensure the normal operation and long life of the LED.

LED circuit boards are used in a wide range of applications, from small consumer electronics to industrial lighting and automotive headlights. They provide a simplified way to control and adjust LEDs while ensuring effective heat management.

How to make a LED light circuit board?

The process of making an LED light circuit board involves multiple steps, including soldering, self-testing, cleaning, grinding, and wiring.

1. Soldering:

Determine the direction of the light, the side with the black rectangle is the negative end. Determine the direction of the circuit board, the end with the inner and outer wiring ports is the upper left corner. Start from the upper left light and solder in sequence to ensure that each solder joint is full and clean, without cold solder joints or leaks.

2. Self-test:

After completing the soldering, check whether the solder joints have cold solder joints, leaks, etc. Use a multimeter to touch the positive and negative terminals of the circuit board to check whether the LED lights are on at the same time.

3. Cleaning:

Use 95% alcohol to scrub the circuit board to remove residues.

4. Rubbing:

Remove the LED light circuit board from the entire board, use fine sandpaper to grind off the burrs on the edges, and make the circuit board flat.

5. Wiring:

Use blue and black thin wires to connect the circuit board. The wiring point close to the inner circle is negative and connected to the black wire; the wiring point close to the outer circle is positive and connected to the red wire. Make sure the wire is connected from the back to the front.

6. Final self-check:

Check the wiring to ensure that each wire passes through the pad and the length of the wires on both sides of the pad left on the surface is as short as possible to ensure that the circuit board can work properly.

Each step is crucial, especially the welding and wiring parts, which need to be carefully operated to ensure the performance and safety of the circuit board.

How should an LED be connected in a circuit?

LEDs should be connected to the circuit through the correct wiring method to ensure their normal operation and extend their life. ‌

First of all, there are three main wiring methods for LEDs: two-end wiring, single-end wiring and staggered wiring.

Two-end wiring is a commonly used wiring method in the early days. It is characterized by convenient wiring and simple operation. It is suitable for the replacement of fluorescent tubes.

Single-ended wiring is a safer wiring method, in which one end of the LED tube is not wired, and the two pins on the other end are respectively wired to the constant current drive power supply. This wiring method ensures that if one end of the LED tube is connected to AC power, the other end will never be charged.

Staggered wiring is an innovative wiring method that is compatible with a variety of electronic ballasts and can work normally without a starter.

When connecting LEDs, you need to pay attention to the following points:

Correctly distinguish the positive and negative poles of the LED, which can usually be judged by observing the appearance, using a multimeter or battery. Connect the anode of the LED to the positive pole of the power supply and the cathode to the negative pole of the power supply to ensure that the LED works properly.

Use appropriate resistors to limit the current to protect the LED from damage by overcurrent. The resistance value should be calculated based on the power supply voltage, the rated voltage of the LED, and the required current.

Keep the LED dry, avoid moisture or static interference, and pay attention to the temperature to avoid excessively high temperatures that affect its life and performance.

For the power connection of LED light strings, two basic forms can be used: positive connection and negative connection. The positive and negative poles of each light string correspond to the positive and negative poles of the power supply. When a large number of LED lights are connected in series, it is more practical to adopt a series-parallel combination strategy, and the number of parallel groups is determined by calculating the rated current of the power supply. ‌

Do LED lights need special wiring?

LED lights do not require special wiring, but it is necessary to determine whether a grounding wire is required based on the specific situation of the lamp. ‌

LED lights are usually designed without special wiring because they can be directly connected to AC power, thanks to the built-in rectifier of LED lights.

When installing LED lights, it is important to understand the difference between the live wire and the neutral wire, because although LED lights themselves work under DC power, they usually have built-in rectifiers and can be directly connected to household AC power.

When replacing traditional fluorescent tubes, it is necessary to remove the original ballast and starter, and directly connect the live wire and the neutral wire to both ends of the LED tube.

Regarding the issue of grounding wires, most LED lights on the market are double-insulated designs, which means that their housing and structure have met safety requirements, so no grounding wire is required. However, for lamps with metal shells, grounding is necessary to prevent people from getting electric shock when touching the bare metal.

In addition, if the bulb has a grounding wire, it is better to connect it, which can better ensure safety. It should be noted that Class III lamps are not allowed to be grounded because they use safety extra low voltage (SELV) and should be isolated from high voltage using an isolation transformer, and should not be grounded.

In summary, although LED lamps do not require special wiring, you should pay attention to safe wiring methods during installation, and judge whether a grounding wire is required according to the specific situation of the lamp to ensure safety and prevent the risk of electric shock.

Where to put resistor in LED circuit board?

In the LED circuit, the resistor should be placed between the positive pole of the LED and the first LED, that is, in front of each string of lamp beads. ‌ This placement does not depend on the specific location of the resistor, because the resistor and the LED are in series, which means that whether the resistor is placed in front of, behind, in the middle of each string of lamp beads, or anywhere randomly, the effect is the same.

This is because the main function of the resistor is to control the current through the LED by consuming a certain voltage and current, ensuring that the LED operates at a normal operating current and avoiding damage to the LED due to excessive current.

It is worth noting that although the position of the resistor has little effect on the LED, in actual circuit design, considering the simplicity and safety of the circuit, the resistor is usually placed close to the positive pole of the power supply. This design can avoid too many connection points in the circuit, thereby simplifying the circuit structure.

Conclusion:

LED lights usually require circuit boards for optimal performance, especially in complex or high-power applications. LED circuit boards ensure proper heat dissipation and current regulation, which are key factors in ensuring the service life and efficiency of the lighting system. BEST Technology has accumulated rich manufacturing experience in the design of LED circuit boards, and various different LED light circuits can be designed to the top level.

Tags:LED, PCB, PCBA
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How to Calculate Current Carrying Capacity in PCB Vias?

Thursday, September 5th, 2024

What are vias in PCB design?

Via hole is one of the important components of multi-layer PCB, and the cost of drilling usually accounts for 30% to 40% of the PCB board cost. Simply put, every hole on the PCB can be called a pass hole. From the function point of view, the hole can be divided into two categories: one is used as an electrical connection between the layers. The second is used as the fixing or positioning of the device.

How to Calculate Current Carrying Capacity in PCB Vias?

From a manufacturing process perspective, vias can be divided into three types: blind vias, buried vias, and through vias:

Blind vias: These connect the surface layer to an internal layer, without going through the entire board. Their depth is typically related to the hole diameter.

Buried vias: Located inside the PCB, they don’t reach the surface.

Through vias: These pass through the entire board and are the most common due to their lower manufacturing cost and simpler process.

How to make PCB vias?

Typically, PCB vias are produced following the IPC-2 standard, where the copper thickness in the hole is around 0.8 mil to 1 mil. However, in practice, the copper plating might not be uniform, and the thinnest part could be as narrow as 0.7 mil, affecting the current-carrying capacity.

Generally, the conventional PCB board is produced according to IPC-2 standard, where the copper thickness in the hole is around 0.8 mil to 1 mil (you can check the specific content of the IPC-2 standard). The hole that we think is produced during production is this ideal situation (as shown below), the size of the hole is regular, and the thickness of the hole copper is very symmetrical:

However, in practice, the copper plating might not be uniform. As you can see, the copper plating thickness of the perforated wall of the PCB produced in general may be wide up and down, and narrow in the middle, so the narrowest limit may be 0.7mil. It can be imagined that if the current carrying situation is evaluated, it should be calculated according to the smallest and smallest cross-sectional area, but the smallest cross-sectional area is deviated from the actual design value. But actually, a good PCB manufacturer can help to save much time and money for you, you can see the via holes cross-sectional made by Best Technology and others.

What Is the Current Carrying Capacity of a Via?

The current-carrying capacity of a via refers to the maximum current it can safely handle. In PCB design, vias are essential components that connect traces between layers, and their size and shape directly impact how much current they can carry. Factors affecting current capacity include via diameter, number of vias, and placement.

The current carrying capacity of a via hole refers to the current that can be safely carried by the hole. In PCB design, the hole is a key component connecting the layers of printed wires. Their size and shape directly affect the ability of current to pass through. The current carrying capacity of the hole is not only related to the diameter of the hole, but also affected by the uneven current distribution. That is, when multiple holes are actually placed, the current distribution is not equal, which is related to the distribution, quantity and location of the hole. Therefore, evaluating the current carrying capacity of the holes requires consideration of a variety of factors, including the size and number of holes, and their layout on the board.

For instance, a 12 mil via can safely carry around 1.2A of current. However, increasing the via size (e.g., to 16 mil, 20 mil, or 24 mil) doesn’t necessarily yield a proportional increase in current capacity. A recommended via size for optimal current handling is 10-12 mil.

In some cases, the current carrying capacity of the through hole can be evaluated by DC simulation software, such as using tools such as Allegro’s IR Drop. These tools can help designers more accurately predict and optimize the performance of the board.

How to Calculate Current Carrying Capacity in PCB Via?

The current-carrying capacity of a via can be simplified by using a trace model calculation. The formula is:

I = 0.048 * T^0.44 * A^0.75

Where:

I is the maximum allowable current in amperes (A).

T is the maximum temperature rise in degrees Celsius.

A is the cross-sectional area of the via, measured in square mils.

For the cross-sectional area of the via: A = π * (D + Tk) * Tk

Where:

D is the via’s diameter.

Tk is the copper thickness, typically around 20 μm (0.8 mil) according to IPC-2 or IPC-3 standards.

In high-density interconnect (HDI) boards, due to manufacturing constraints, the copper thickness may be reduced to as low as 10 μm.

PCB Via Current Calculator Per IPC 2152

IPC-2152 replaces the 50-year-old IPC-2221B standard. IPC-2221B identifies in a series of diagrams the connection between the PCB’s temperature rise, the current in the track, and the cross-sectional area of the track without multilayer boards.

IPC-2152 outlines the relationship of thermal conductivity, through hole, board material, and thickness to current, trace cross section, copper weight, and temperature. It can also determine the exact values of external and internal traces. IPC-2152 is not only a real-time protection program, but it also helps PCB designers model safe and appropriate designs. The Best Technology Wire Width and current Capacity calculator is based on this standard. You can calculate the trace area and current capacity for a given temperature rise.

The figure below is the calculation chart of the cross-sectional area of the through-hole given by IPC 2152. The formula of the cross-sectional area of the through-hole wall in the above figure is transformed, where D is the empty outer diameter, D is the inner diameter of the hole, and (d-d)/2 is the thickness of the hole wall, also known as the through-hole copper thickness. Where D is the empty outer diameter, D is the inner diameter of the hole, and (d-d)/2 is the thickness of the hole wall, also known as the thickness of copper through the hole. The copper thickness through the hole is not determined, and the copper thickness of each PCB manufacturer may be different. If you want to pass a larger current through the hole, it may be better to punch several more through the hole.

Then you can get a new formula of calculating cross sectional area of hole wall:

A typical example is calculating the via size based on a 20°C temperature rise and a 1A current.

Given:

Copper thickness of 1 oz (1.38 mil)

Current carrying capacity of 1A

Maximum temperature rise of 20°C

From the IPC-2152 Conservative Chart, the cross-sectional area corresponding to these conditions is 28 mil². Using the equation for the via’s cross-sectional area, you can calculate the via’s diameter.

From the chart, the required cross-sectional area is 28 mil².

The copper thickness is 1.38 mil.

Solving for the via diameter, we get:

d = 7.28 mil (0.185 mm)

Thus, a via with an internal diameter of 0.185 mm will safely carry a 1A current with a 20°C temperature rise.

Best Technology’s Via Current Capacity Calculator

Best Technology offers a current capacity calculator for PCB vias to ensure that designs meet specific current-carrying needs. The tool allows designers to input their parameters, such as via diameter and copper thickness, and outputs the current-carrying capacity value. Clik below image to use or click here: via current capacity calculator

Tags:current carrying capacity, PCB via current calculator, PCB via current calculator per IPC 2152
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RoHS vs. Pb Free Temperature – An Ultimate Guide

Tuesday, September 3rd, 2024

Soldering is a critical process in electronics manufacturing. It involves joining components to a printed circuit board (PCB) using a metal alloy called solder. Over the years, the industry has seen a shift from traditional lead-based solder to more environmentally friendly options. This shift has introduced terms like RoHS and Pb-free into the vocabulary of professionals. Understanding these terms, especially in relation to soldering temperatures, is crucial for anyone involved in electronics production.

This guide will break down the differences between RoHS and Pb-free soldering, focusing on their temperature requirements. We’ll explore what these terms mean and how they impact the soldering process.

What Does RoHS Stand For?

RoHS stands for Restriction of Hazardous Substances. It’s a directive that originated in the European Union, aiming to limit the use of certain hazardous materials in electrical and electronic products. Specifically, RoHS restricts substances like lead (Pb), mercury, cadmium, hexavalent chromium, and some flame retardants in manufacturing processes.

The directive came into effect in 2006 and has since become a global standard for electronics manufacturers. Complying with RoHS means that a product does not contain any of the restricted substances above a certain threshold. This initiative was created to reduce the environmental and health impacts associated with these hazardous materials.

RoHS vs. Pb Free Temperature – An Ultimate Guide

What Does Pb-Free Mean?

Pb-free, as the name suggests, refers to the absence of lead (Pb) in a product or process. In the context of soldering, Pb-free means that the solder alloy used does not contain lead. Lead has traditionally been a key component in solder due to its low melting point, making it easier to work with. However, the toxic nature of lead and its environmental impact has led to a global shift towards Pb-free alternatives.

Pb-free solder usually consists of a combination of tin (Sn), silver (Ag), and copper (Cu). These alternatives have a higher melting point than lead-based solder, which requires adjustments in the soldering process, especially in terms of temperature.

Is RoHS the Same as Lead-Free?

While RoHS and Pb-free are related, they are not the same thing. RoHS is a regulatory standard that restricts the use of several hazardous substances, including lead. Pb-free, on the other hand, specifically refers to the absence of lead in a product or process.

In other words, Pb-free solder is a product that complies with the RoHS directive, but RoHS covers a broader range of materials beyond just lead. Therefore, a product can be RoHS compliant without being entirely Pb-free if it still contains lead within acceptable limits set by the directive.

What Is the Difference Between RoHS and Pb?

RoHS is a directive, a set of rules that manufacturers must follow to ensure their products are safe and environmentally friendly. Pb refers to lead, a specific element that RoHS seeks to limit or eliminate in electronic products.

The main difference lies in their scope. RoHS is about regulation, while Pb (lead) is one of the substances that these regulations seek to control. Pb-free solder is a direct result of the RoHS directive’s push to eliminate lead from electronics manufacturing. However, Pb-free soldering requires different handling and temperatures, which brings us to the next key points.

What Temperature Is Pb-Free Soldering?

Pb-free soldering requires higher temperatures compared to traditional lead-based soldering. The typical melting point of Pb-free solder is around 217°C to 220°C (423°F to 428°F). This is significantly higher than lead-based solder, which melts at around 183°C (361°F).

The higher temperature is due to the different alloy composition in Pb-free solder. Tin (Sn), silver (Ag), and copper (Cu) are the main components, and they require more heat to reach a liquid state. This means that when working with Pb-free solder, the soldering equipment must be capable of reaching and maintaining these higher temperatures.

Adjusting to this temperature is crucial because improper soldering temperatures can lead to weak joints, incomplete soldering, or damage to components. Therefore, manufacturers often need to recalibrate their soldering equipment when switching to Pb-free processes.

What Temperature Does RoHS Solder Melt At?

RoHS-compliant solder includes both lead-free and lead-based options, depending on the specific application and compliance level. For lead-free, which is common in RoHS-compliant products, the melting temperature is typically in the range of 217°C to 220°C (423°F to 428°F), similar to Pb-free solder.

However, if the RoHS-compliant product still uses lead-based solder within the allowable limits, the melting temperature would be around 183°C (361°F). This is less common today as more manufacturers move towards entirely lead-free processes to fully comply with RoHS and similar regulations.

The shift to RoHS-compliant soldering involves understanding these temperature differences and adjusting manufacturing processes accordingly. This ensures the reliability and durability of the solder joints in electronic products.

What Is the Best Temperature for Lead-Free Solder?

The best temperature for lead-free soldering typically ranges between 240°C to 250°C (464°F to 482°F). This range provides a buffer above the melting point to ensure proper flow and bonding of the solder.

Working within this temperature range helps achieve a strong, reliable solder joint while minimizing the risk of overheating and damaging sensitive components. It’s essential to monitor the soldering process closely because exceeding this range can cause problems, such as burnt components or damaged PCBs.

Manufacturers must carefully control the temperature during lead-free soldering to maintain the quality and integrity of the solder joints. Proper temperature control is a critical factor in producing durable, long-lasting electronic products.

Which is Best for PCB Soldering?

When it comes to PCB soldering, the choice between lead-based (Pb) solder and lead-free (Pb-free) solder depends on various factors, including environmental regulations, the application of the PCB, and the desired properties of the solder joints. Here’s a breakdown to help you decide which is best for your needs:

1. For environmental compliance, Pb-free solder is the best choice if you need to meet regulatory requirements like RoHS. It’s also better for the environment and human health.

2. Lead-based solder might be better if you’re working on non-compliant projects where ease of use and joint durability are top priorities, such as prototyping or repair work.

3. For modern electronics manufacturing, Pb-free solder is increasingly the standard, especially for products that need to be sold globally. It’s also the best choice for future-proofing your manufacturing processes against tightening environmental regulations.

In conclusion, Pb-free solder is generally the best choice for modern, environmentally conscious PCB manufacturing, particularly when compliance with regulations like RoHS is necessary. However, lead-based solder may still be preferred for specific applications where ease of use and durability are more important than regulatory compliance.

Tags:pb free temperature, rohs, rohs vs pb free
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What is SMT POP (Package on Package) Process?

Tuesday, September 3rd, 2024

What is smt pop process?Package on Package (PoP) means that a logical package with high integration at the bottom is superimposed on another matching large-capacity memory package to form a new package as a whole. Laminated packaging can be the same shape of the logic and memory chip package can be reintegrated, without the use of stacked logic-memory chip packaging method in the manufacturing and commercial problems. This new form of high-density packaging is mainly used in a variety of consumer electronic products such as smart phones, digital cameras, and portable wearable devices.

What is SMT POP (Package on Package) Process?

What Does POP Do in Assembly?

In an era where consumer electronics are becoming smaller and more powerful, saving PCB space is crucial. PoP allows for the vertical stacking of components, such as processors and memory, on top of each other. This is especially important in devices like smartphones, tablets, and wearable technology, where space is at a premium.

One of the significant advantages of PoP is the ability to individually test and replace the stacked components before final assembly. This step-by-step verification ensures higher yields during manufacturing, as defective components can be identified and replaced early in the process. Additionally, since each component is tested separately, the overall cost of assembly can be reduced, as fewer defective products reach the final stages of production.

Moreover, PoP provides manufacturers with the flexibility to mix and match different types of components. For example, different memory types can be combined with various processors, depending on the requirements of the final product.

SMT POP Structure

POP stacking assembly typically involves placing components on top of each other, usually combining logic and memory devices. The structure can range from 2 to 4 layers, with memory PoP going up to 8 layers. Although the overall height increases slightly, each component can be tested individually before assembly, ensuring higher yield rates and minimizing total assembly costs.

PCB Assembly Layers of PoP:

Amkor PoP Typical Structure:

Bottom PSvfBGA (Package Stackable very thin fine pitch BGA)

Top Stacked CSP (fine pitch BGA)

Bottom PSvfBGA Structure:

Dimensions: 10-15mm

Pad pitch: 0.65mm, with bottom ball pitch at 0.5mm (0.4mm)

Substrate: FR-5

Ball material: 63Sn37Pb/Pb-free

Top SCSP Structure:

Dimensions: 4-21mm

Bottom ball pitch: 0.4-0.8mm

Substrate: Polyimide

Ball material: 63Sn37Pb/Pb-free

Ball diameter: 0.25-0.46mm

SMT POP Manufacturing Process

The manufacturing process for Package on Package technology is a multi-step procedure that demands precision and careful attention to detail to ensure the successful assembly of high-performance electronic devices. Here’s an extended explanation of each stage in the PoP manufacturing process:

1. Non-PoP Side Component Assembly

The PoP process begins with the assembly of components on the non-PoP side of the PCB. This involves standard SMT assembly processes:

Stencil Printing: Solder paste is applied to the designated pads on the PCB using a stencil.

Component Placement: Using automated pick-and-place machines, surface-mount components are accurately positioned onto the solder-pasted pads.

Reflow Soldering: The PCB is then passed through a reflow oven, where the solder paste is heated to its melting point, securing the components to the board.

Inspection: The solder joints are inspected using Automated Optical Inspection (AOI) to ensure that they are correctly formed and that the components are properly placed.

2. Solder Paste Printing on the PoP Side

After completing the assembly on the non-PoP side, the PCB is flipped, and solder paste is printed on the pads where the bottom PoP component will be placed. This step is crucial, as the quality of the solder paste application directly affects the integrity of the solder joints between the PoP components.

3. Placement of Bottom Components and Other Devices

The bottom components, which typically include the logic processor, are placed onto the solder-pasted pads using high-precision pick-and-place equipment. This placement must be extremely accurate to ensure proper alignment with the top component in the subsequent steps.

4. Flux or Solder Paste Dipping for the Top Components

Before the top component is placed, it is dipped in flux or a thin layer of solder paste. This dipping ensures that the solder joints between the top and bottom components are robust and reliable. The flux helps to clean the surfaces and promote better solder flow during reflow, while the solder paste provides additional material for the solder joints.

5. Placement of Top Components

The top component, typically a memory chip, is then placed onto the bottom component. This step requires precise alignment to ensure that the solder balls on the top component correctly match the pads on the bottom component. Any misalignment can lead to defective connections and, consequently, a malfunctioning device.

6. Reflow Soldering and Inspection

Once the top component is placed, the entire assembly is subjected to reflow soldering. During this process, the PCB passes through a reflow oven where the solder paste re-melts, forming solid connections between the components. The temperature profile during reflow must be carefully controlled to prevent warping or damaging the delicate PoP structure.

After reflow, the assembly is inspected using AOI or X-ray inspection to verify the quality of the solder joints, particularly the hidden joints between the top and bottom components. X-ray inspection is often employed because it can penetrate the layers and provide a clear view of the solder joints, ensuring there are no voids, misalignments, or insufficient solder.

7. Final Testing and Quality Control

The assembled PoP structure undergoes a series of electrical tests to ensure functionality. This includes testing for continuity, shorts, and the performance of the integrated components. High-quality PoP assemblies should pass all functional tests without issue, confirming that the solder joints and component placements are reliable.

8. Packaging and Shipping

After passing the final tests, the PoP assemblies are cleaned to remove any residual flux or contaminants. They are then packaged according to the customer’s requirements and prepared for shipping. Proper packaging is essential to protect the sensitive PoP structures from damage during transit.

POP Design Considerations

Factors affecting the spatial relationship include substrate and component design, substrate manufacturing processes, component packaging processes, and SMT assembly processes. Key aspects to consider are:

Pad design
Solder mask opening
Ball size and height variation
Amount of flux or solder paste applied
Placement accuracy
Reflow environment and temperature
Warpage of components and substrate
Bottom component molding thickness

What are the advantages of POP smt process?

POP is mainly a system integration 3D package developed for mobile devices, and its structure mainly has the following characteristics.

Storage devices and logic devices can be freely combined, and can be tested or replaced separately to ensure the yield.
POP is stacked in the vertical direction, saving the board area and improving the system packaging density.
The vertical interconnection of stacked devices replaces the traditional two-dimensional package interconnection, which can realize faster data transmission between logic devices and storage devices.

With the development of technology, the following main types of POP structures have emerged.

Solder Ball Connected PoP

Logic chips have more I/0 ports, so they are often packaged with Flip Chip (FC) technology and used as the bottom component. The bottom chip adopts Capillary Under Fill (CUF) technology.

MLP Connected PoP

In order to develop a thinner PoP Package structure, MoldimgLaser Package (MLP) technology came into being, also known as Through Mold Via (TMV) technology on the market. The method is to first weld the tin ball around the bottom chip and directly plastic seal, and then use laser perforation to expose the tin ball for subsequent connection with the upper components.

Folded and BVA Connected PoP

In order to meet the requirements of thin size, strong function and large I/0 number of PoP products, flexible circuit boards are used to connect various package components and fold to form PoP structure, and BVA (Bond Via Array) is used to improve product performance and reduce pin spacing.

POP Applications

1. Smartphones: PoP is widely used in smartphones, like the Meizu 16S, for integrating application processors and memory.

2. Wearable Devices: PoP is commonly used in next-generation wearable devices.

3. Electronic Watches: PoP packaging is key for improving performance and reducing costs in electronic watches.

4. Earphones: The Meizu POP Pro noise-cancelling earphones utilize PoP technology.

5. Health Watches: Huami’s Amazfit Pop, one of the most affordable blood oxygen monitoring watches, uses PoP technology.

For more information about our POP Assembly capabilities, please contact us any time! We can be reached via email at sales@bestpcbs.com, or toll free at +86-755-2909-1601.

Tags:smt pop process, smt process
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How much does a custom pcb cost per unit? How to calculate?

Monday, September 2nd, 2024

In the field of electronic manufacturing, PCB (Printed Circuit Board) is an indispensable basic component. For electronic equipment manufacturers, it is very important to accurately calculate the cost of PCB circuit boards.

In the PCB processing plant, the cost estimation method of PCB is composed of many factors. Most of the cost comes from the number of layers, materials, drilling volume, and surface treatment process of the board. Generally speaking, the board cost is about half of the total cost.

What is the average cost of a PCB?

The average cost of PCB varies due to many factors, and there is no fixed value. ‌

The cost of PCB is mainly composed of the following parts:

1. Substrate cost: Substrate is the basic component of PCB. Common material types include FR4, CEM-1, aluminum substrate, etc. The price of different types of substrates varies greatly.

How much does a custom PCB cost per unit? How to calculate?

2. Process cost: The manufacturing process of PCB includes inner layer circuit production, lamination, drilling, electroplating, outer layer circuit production, solder mask treatment, text printing and surface treatment. Each step requires professional equipment and technicians to operate, so there will be corresponding costs.

3. Inspection cost: After the PCB is manufactured, a series of tests are required to ensure its quality, including electrical performance testing, reliability testing, and appearance inspection.

4. Other additional expenses: In addition to the above main costs, there are some additional expenses to consider, such as special design or modification services may require additional design fees. In addition, additional costs such as packaging, transportation, and taxes also need to be taken into consideration.

In summary, the cost of PCB is composed of multiple aspects, including substrate cost, process cost, inspection cost, and other additional expenses, which need to be comprehensively evaluated based on specific board type, number of layers, drilling amount, surface treatment process, and other factors.

How to calculate PCB design cost?

‌Material cost is an important part of design cost, including board, solder mask ink, chemical agents, etc. These costs are relatively easy to calculate, but the additional losses caused by material loss and risks during storage and use need to be considered.

‌Process cost covers equipment use time, worker wages, energy consumption, etc. When calculating the cost of equipment use, the frequency and duration of equipment use and the total investment cost should be taken into account.

‌Equipment depreciation and maintenance costs‌ are also a part that cannot be ignored, including the original price of the equipment, accumulated depreciation, and maintenance and repair costs.

‌Other related costs‌ such as administrative costs, quality control costs, and R&D costs, although more difficult to calculate, have a significant impact on the total cost of the project.

Material costs include substrate materials, circuit board materials, and copper foil, processing costs involve drilling, copper plating, graphic etching and other processes, and labor costs include direct and indirect labor costs. Through these calculations, plus a reasonable profit margin, the final PCB quotation is obtained.

What is the most expensive PCB?

The most expensive PCB may be an electroless nickel electroless palladium immersion gold (ENEPIG) PCB.

This electroplating material has a copper-nickel-palladium-gold layer structure that can be directly bonded to the electroplating layer through wires. The last layer of gold is very thin, just like electroless nickel immersion gold (ENIG).

The gold layer is soft, so excessive mechanical damage or deep scratches may expose the palladium layer. Although the gold layer is soft, ENEPIG’s PCB is often considered the first choice in high-end applications due to its high-quality electrical performance and durability, so its cost is relatively high.

In addition, the production of high-end precision PCB circuit boards is also expensive, including multi-layer boards, boards with BGA, HDI circuit boards, etc. These products usually require more complex production processes and higher material quality, so the cost is also relatively high.

How much does PCB assembly cost per component?

The PCB assembly cost of each component is composed of multiple factors, including board costs, processing costs, testing costs, and other additional costs. ‌

Board costs are an important part of PCB assembly costs. The types of boards, such as FR4, CEM-1, aluminum substrates, etc., have large price differences.

FR4 boards are widely used due to their excellent electrical and processing properties, but their prices are affected by fluctuations in the prices of raw materials such as international copper prices, epoxy resins, and glass fiber cloth.

Aluminum substrates are favored in certain specific applications due to their good heat dissipation performance, but their prices are usually much higher than FR4 boards.

‌Processing costs‌ cover multiple links in the PCB manufacturing process, such as inner layer circuit production, lamination, drilling, electroplating, outer layer circuit production, solder mask, text printing and surface treatment.

Each link requires professional equipment and technicians to operate, so there will be corresponding costs. In particular, the costs of steps such as drilling and electroplating will vary according to factors such as the number of holes, the area and thickness of the electroplating.

‌Testing costs‌ are an important link to ensure the quality of PCBs. After the production is completed, the PCB needs to undergo a series of tests, including electrical testing, reliability testing, and appearance inspection.

These tests require not only professional testing equipment, but also experienced testers to operate and analyze the results, so certain costs will also be incurred.

‌Other additional costs‌ include additional design fees that PCB manufacturers may charge if customers require special design or modification services. In addition, there are some additional costs such as packaging, transportation and taxes that need to be taken into account.

In summary, the PCB assembly cost of each component is determined by the board cost, processing cost, testing cost and other additional costs, and the specific cost will vary according to the specific needs of the project and the manufacturer’s quotation.

What is the cheapest PCB finish?

The cheapest PCB surface treatment process is hot air solder leveling (HASL). ‌

HASL is a commonly used PCB surface treatment process, which is divided into lead-containing tin and lead-free tin. It is one of the most commonly used and relatively inexpensive surface treatment processes.

This process is to immerse the circuit board in molten solder (tin/lead), and then the solder covers all exposed copper surfaces on the board to form a HASL surface finish.

HASL is not only one of the cheapest types of PCB surface treatment, but its process temperature is 250℃, the shelf life can reach 12 months, and the surface treatment thickness ranges from 1-40um, making it an economical and practical choice.

In addition, HASL is divided into leaded and lead-free. Although the leaded version is gradually replaced by the lead-free version for environmental reasons, the lead-free HASL still maintains a low cost, making it the preferred choice for projects with limited budgets‌.‌

Do vias make PCBs more expensive?

Vias may indeed increase the cost of PCBs. ‌

Vias are an important part of multi-layer PCB boards, and they play a key role in the design and manufacturing process of circuit boards. Vias can be divided into buried vias, blind vias and through holes. Among them, through holes pass through the entire circuit board and are used to achieve internal interconnection or component installation and positioning. They are the most commonly used types.

The number and type of vias directly affect the cost of the PCB, because each via needs to go through processes such as drilling and electroplating, which account for a considerable part of the cost of PCB board manufacturing.

Factors that affect the cost of PCBs also include the size of the vias. The smaller the via, the greater the manufacturing difficulty, and the corresponding increase in cost.

In addition, different types of vias require different processing technologies and materials, which also affects the cost. For example, the processing processes and difficulties of blind and buried vias are different, resulting in different prices.

The price difference between blind and buried vias is mainly caused by many factors such as material cost, complexity of processing process and difficulty of processing. Blind vias require double-sided or multi-layer composite boards, which have higher material costs, while buried vias can be processed using single-sided boards, which have relatively low costs.

In addition, the processing processes of blind vias are diverse, the process is complex, and higher technology and cost are required. The processing time is long and the manufacturing cost is relatively high.

In summary, the number, type, size and processing method of vias will affect the cost of PCB. When designing PCB, it is necessary to find a balance between function and cost to optimize the design and cost control.

Conclusion:

The unit cost of PCB is affected by many factors, including but not limited to the number of layers, material, drilling amount, and surface treatment process of the board. BEST Technology has many years of experience in PCB board design and has skilled experience in handling various factors that affect PCB cost. It can help you find the best way to solve all your concerns about PCB cost.

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What file types are used for PCB design?

Monday, September 2nd, 2024

What file type is used for pcb designs?Generally, PCB boards require Gerber files, drilling files, bill of materials (BOM), manufacturing drawings and assembly drawings. The Gerber file suffix is .gbr, the drilling file suffix is (.drl), and the PCB schematic file suffix is .schdoc. The drilling file is usually in Excellon format (.xin). The center coordinate file is also called the pick and place file, which is provided in CSV (comma separated value) format.

Ｗhether it is an individual or a company making PCB boards, PCB boards generally require Gerber files, drilling files, bill of materials (BOM), manufacturing drawings and assembly drawings. Among them, Gerber files are a set of files, which are the most important and contain information about each layer of the PCB to be used in production.

What files do I need to make a PCB?

Making PCBs (printed circuit boards) requires a series of files to ensure the smooth progress of the manufacturing process and the quality of the product.

‌Gerber file‌: This is the most common and crucial file in PCB manufacturing. It contains the geometric information of each layer of the PCB, such as copper lines, pads, solder mask layers and silk screen layers, and also includes separate files for each PCB layer, such as top copper, bottom copper, solder mask, silk screen layer, etc. ‌

What file types are used for PCB design?

‌Drill file‌: Provides drilling coordinates and size information for PCBs, and specifies the aperture size of components, vias and mounting holes. Drill files are usually generated in Excellon format or as separate ASCII files‌.

‌Bill of Materials (BOM): A BOM is a detailed list of all components used in a PCB design, including information such as part number, component value, description, and quantity, which helps ensure that all required components are correctly sourced and placed on the PCB.

‌Center Coordinate File: Also known as a pick and place file, it provides coordinate and orientation information for each component on the PCB and is essential for the automated assembly process. Center coordinate files are usually provided in CSV format.

‌Fabrication Drawing: This is an engineering drawing that includes key information about the PCB, such as board dimensions, drill hole dimensions, layer stackup, tolerances, surface finish, and other manufacturing-related details, which serves as a reference for PCB manufacturers during the production process.

‌Assembly Drawing: Provides additional information for the PCB assembly process, including component placement details, reference numbers, orientation, and any special instructions for assembly technicians.

In addition, depending on the specific design and production needs, other documents may also be required, such as circuit diagrams, special layer files, installation instructions and precautions, etc. ‌ The preparation and provision of these documents is a key step in ensuring a smooth PCB production process.

What are Gerber files? What information do they contain?

Gerber files are a series of ASCII vector format files that define PCB design specifications. They are generated using electronic design automation (EDA) or computer-aided design (CAD) tools and provide information such as board configuration parameters, aperture descriptions, XY coordinate locations, and drawing instructions.

Configuration details include the size and shape of the PCB to be manufactured. Each layer of the board information is recorded in a different file to define components such as copper traces, pads, vias, solder mask, silk screen, and logos. The Gerber file indicates the XY coordinate location of each geometric shape and uses instructions to draw these shapes on the physical board.

The basic components of the Gerber file include: board size, shape, top assembly, top silk screen, top solder mask, top paste, top copper, internal signals, inner layers, bottom copper, bottom paste, bottom solder mask, bottom silk screen, bottom assembly, and manufacturing information (providing stackup, drilling details, cutting, etc.).

Gerber files generated by computer-aided manufacturing (CAM) tools have user-selected extensions, usually using project naming such as “.TOP” for top layer, “.BOT” for bottom layer, and “.drl” for drill data.

How is a PCB designed?

PCB design is a complex process that involves multiple steps and considerations to ensure the functionality and reliability of the final product.

‌Schematic Design‌: First, you need to prepare a schematic and component library. The schematic is the blueprint of the circuit design, while the component library contains information about the various components used in the circuit.

‌Component Symbols and Packages‌: The symbol of the component is used to represent the component in the schematic, while the package defines the physical form of the component on the PCB. The component symbol is used in the schematic design stage, while the package is used in the PCB layout and routing stages.

How is a PCB designed?

‌PCB Layout‌: The layout stage involves placing electronic components on the PCB, and factors that need to be considered include the orientation, size, and relative position of the components.

‌Routing‌: After the layout is completed, the next step is the routing stage, which is to connect the various components according to the needs of the circuit.

‌DRC Check‌: Design rule checking (DRC) is performed during the design process to ensure that the design complies with predetermined electrical and physical rules. This includes checking for shorts, open circuits, and other possible design errors.

‌Solder mask and solder paste layer‌: The solder mask is used to prevent unnecessary soldering, while the solder paste layer is used to specify solder joints. The correct design of these layers is critical to ensuring the reliability and manufacturability of the circuit board.

‌Network and DRC Check‌: In the final stage of design, network checks are performed to ensure that all components are properly connected, while DRC checks are performed to verify that the design complies with all electrical and physical rules.

‌Through the above steps, designers are able to transform the circuit design in the schematic into an actual, manufacturable PCB. This process requires comprehensive consideration of multiple factors such as the functionality, reliability, and manufacturing cost of the circuit.

‌What is the schematic file for PCB?

‌PCB schematic files are the main files used for circuit design, analysis, and debugging. They mainly show the electrical connection relationship between electronic components, but do not reflect the actual physical location of these components on the PCB board. ‌

Schematic Diagram is the basis of circuit design. It uses symbols and lines to express the connection and working principle of the circuit in a concise and clear manner, and pays more attention to the functional expression of the circuit.

Schematic diagram does not involve the specific layout and wiring of electronic components on the PCB board, so it focuses on the logical representation of the circuit rather than the physical implementation. ‌

In contrast, PCB design files plan the precise location and wiring of electronic components on the PCB board in detail, taking into account the connectivity of the circuit, and also comprehensively considering factors such as signal integrity, power distribution, thermal design, and mechanical strength. ‌

These design files are the main files used to manufacture actual electronic devices, including PCB layout and PCB wiring. The layout determines the location of electronic components on the circuit board, while the wiring involves the electrical connection between components. ‌

In general, schematic files and PCB design files play different roles in the design and manufacturing process of electronic products. The former focuses on the expression of circuit logic and function, while the latter focuses on converting this logic into actual physical implementation, including the specific location and connection method of components. ‌

What is the difference between PCB design and schematic design?

The main difference between PCB design and schematic design lies in their purpose, content and application scenarios. ‌

‌Purpose and content‌:

Schematic design focuses on describing the logical relationship and electrical performance of the circuit, using graphic symbols to display power, components and connections, and can clearly show the logical relationship of the internal circuit of the electronic device. It is mainly used for circuit analysis and design, helping to understand the working principle of the equipment and perform fault diagnosis‌.

PCB design focuses on describing the actual physical size, position and wiring of components, and is the actual circuit board layout and wiring design based on the schematic diagram. It is mainly used to guide the manufacture and assembly of PCBs, reflecting the actual layout and wiring of electronic equipment‌.

‌Application scenarios‌:

Schematic design plays an important role in the process of R&D, debugging and maintenance, and is a key tool for understanding the working principle of the equipment and performing fault diagnosis‌.

PCB design files are an important basis for the actual PCB board manufacturing and subsequent assembly, debugging and other processes‌.

In short, schematic design is the basis of electronic product development. It provides information such as the logical relationship and electrical performance of the circuit, while PCB design is the key link to convert the schematic into an actual circuit board. It is necessary to design components layout and wiring according to the requirements of the schematic.

What is a PCB stencil file?

A PCB stencil file is a pre-designed file template used to quickly generate PCB design files containing specific information.

These template files usually contain basic information such as board size, board layer settings, grid settings, and title bar settings. Users can quickly generate new PCB design files based on these templates, thereby speeding up the design process.

By using these templates, designers can avoid designing these basic settings from scratch, saving time and energy, and focusing on more complex circuit design details.

Conclusion:

There are many types of PCB design files, among which Gerber files are the most important. The information they contain is the most and the most important. The final quality of the PCB circuit board depends on the first step of design. BEST Technology has very professional PCB designers who have many years of industry experience and can meet all your needs.

Tags:PCB, pcb design, PCBA, printed circuit board
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