Archive for the ‘FAQ’ Category

What is the thermal conductivity of copper practical?

Wednesday, September 25th, 2024

In the vast field of materials science, copper occupies an important position with its excellent performance. Among them, the thermal conductivity of copper is particularly eye-catching, becoming the preferred material for heat conduction in many fields. Copper plays an important role in electronic equipment, heat exchangers, construction and other fields.

What is the thermal conductivity value for copper?

The thermal conductivity of copper is about 401W/m·K. ‌

The thermal conductivity refers to the heat transferred through 1 square meter of area in 1 second under stable heat transfer conditions, with a temperature difference of 1 degree (K, ℃) on both sides of a 1 meter thick material. The unit is watt/meter·degree (W/(m·K)).

The thermal conductivity is a parameter to measure the thermal conductivity of a material. The larger the value, the better the thermal conductivity. Due to its high thermal conductivity, copper is often used to make radiators, heat conductors and other applications that require efficient heat transfer.

What is the thermal conductivity of copper at 25 C?

The thermal conductivity of copper is affected by many factors. On the one hand, temperature is an important influencing factor. Generally speaking, the thermal conductivity of copper decreases with increasing temperature.

At 25℃, the thermal conductivity of copper is about 401W/m.K, and at 100℃, the thermal conductivity of copper is 377W/m・K.

How do you measure thermal conductivity of copper?

The thermal conductivity of copper is usually measured by the steady-state method. ‌

The steady-state method is a classic method for measuring the thermal conductivity of thermal insulation materials. It uses the equilibrium state in which the heat transfer rate is equal to the heat dissipation rate during stable heat transfer.

This method has a simple and clear principle and high accuracy. Although the measurement time is long and the environmental conditions are high, it is suitable for measuring thermal conductivity materials at medium temperatures, especially for low thermal conductivity materials such as rock, plastic, rubber, glass, and thermal insulation materials.

In the steady-state method, commonly used methods include heat flow method, protected heat flow method, and protected hot plate method. The basic principles of these methods are similar, but some standards are formulated for different thermal insulation materials, and the test results are similar.

What metal has the highest thermal conductivity?

Silver has the highest thermal conductivity.

Among metals, silver has a thermal conductivity of 411W/(m·K), which is the highest value among all metals. This property of silver makes it the metal with the best thermal conductivity.

In contrast, copper has a thermal conductivity of 401W/(m·K), which is also very high, but still slightly lower than silver. Other metals such as gold and aluminum have thermal conductivities of 315W/(m·K) and 237W/(m·K), respectively, which are lower than silver and copper. Therefore, from the perspective of thermal conductivity, silver is undoubtedly the metal with the best thermal conductivity.

In addition, although the thermal conductivity of copper is also very high, reaching 401W/(m·K), second only to silver, among pure metals, the thermal conductivity of silver is still the highest. However, in practical applications, copper is widely used because of its good conductivity and relatively low cost.

Which metal is the poorest conductor of heat?

The metal with the worst thermal conductivity is iron. ‌

Among metal materials, the thermal conductivity of iron is 0.163, while that of copper and silver is, and that of aluminum is 0.5. These data indicate that the thermal conductivity of iron is significantly lower than that of other common metals. Therefore, it can be concluded that iron is the metal with the worst thermal conductivity‌.

Why copper has highest thermal conductivity?

Copper has the highest thermal conductivity‌, mainly because of its unique physical and chemical properties. The superior thermal conductivity of copper is mainly attributed to its crystal structure and electronic properties.

Copper is a metal with good electrical and thermal conductivity, which is due to the presence of a large number of free electrons in the crystals of copper. These free electrons can effectively transfer heat when colliding with metal cations in the crystal, making copper extremely thermally conductive.

The thermal conductivity of copper is about 400 W/m·K, which means that copper transfers much more heat per unit time than most other materials. The high thermal conductivity allows copper to quickly transfer heat away, with efficient heat dissipation.

What happens to copper when it is heated?

When copper is heated, its volume increases, its mass remains unchanged, and its density decreases. ‌

When copper is heated, its volume increases due to the property of thermal expansion and contraction. This is because when the copper block is heated, the distance between atoms increases, resulting in an increase in volume. At the same time, the mass of copper is a property of matter, which is only related to the amount of matter contained, and has nothing to do with the position, state, shape, and temperature of the object. Therefore, the mass of copper remains unchanged after heating.

In addition, when copper is heated in the air, if it reacts with oxygen, black copper oxide (CuO) will be generated on the surface. This chemical change will cause the color of copper to change from red to black.

In summary, when copper is heated, not only will its volume increase, its mass remain unchanged, and its density decrease, but it will also react with oxygen to generate copper oxide when heated in the air, resulting in a change in surface color.

Why does copper turn green?

Copper turns green because it is oxidized in the air to form copper rust. The main component of this copper rust is basic copper carbonate, which is green in color. ‌

Copper will be oxidized in the air to form copper rust. This rusting process is the result of a combination of factors, including the reaction of copper with oxygen, water vapor and carbon dioxide in the air.

Specifically, when copper is exposed to oxygen, water and carbon dioxide in humid air for a long time, a chemical reaction will occur to generate basic copper carbonate (Cu2(OH)2CO3), a green inorganic compound, so a green rust layer will form on the copper surface.

This process not only occurs on the surface of copper, but also because the main component of copper rust is basic copper carbonate, the color of copper rust is green, which makes the appearance of copper products appear green.

Copper has become the preferred material for heat conduction in many fields due to its high thermal conductivity, good processing performance and stable thermal conductivity. With the continuous advancement of science and technology, it is believed that copper will continue to play an important role in future development.

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IC substrate design& prototyping IC substrate manufacturers

Wednesday, September 25th, 2024

IC substrates are usually made of multiple layers of insulating materials, conductors, and semiconductor materials. These materials are precisely processed to form a complex circuit network. The material selection of the substrate has a crucial impact on its performance, such as thermal conductivity, electrical properties, mechanical strength, etc.

IC substrates play an important role in electronic devices, providing stable support and efficient connections for integrated circuits. With the continuous development of electronic technology, the importance of IC substrates will continue to increase.

What is an ic substrate

IC substrate, also known as ic package substrate, is a substrate used to package bare IC (integrated circuit) chips. It is the core material of chip packaging and has the characteristics of high density, high precision, high performance, miniaturization and thinness.

As an intermediate product, IC substrate connects the chip and the circuit board, plays a role in physical mechanical support, heat dissipation and protection, and provides electronic connection between the chip and the PCB to achieve signal transmission.

It is a key carrier in the packaging and testing process and is widely used in mainstream packaging technologies such as BGA (ball grid array packaging) and CSP (chip size packaging). The main functions of the packaging method include isolating the exposed chip from the air, preventing corrosion of the circuit on the chip, and providing an intermediate bridge for information transmission between highly refined chips and less refined printed circuit boards.

IC substrate definition

IC substrate is the support of semiconductor integrated circuits. Its main function is to connect various electronic components to form a complete circuit system. As a platform, it provides a solid foundation for various components within the IC to ensure the normal operation of the circuit.

IC substrate manufacturing process

How are ic substrates made? IC (Integrated Circuit) substrate manufacturing refers to packaging electronic components onto a circuit board to form a complete circuit system. The IC substrate manufacturing process mainly includes the following steps: design, proofing, printing, drilling, gold plating, welding, testing and packaging.

Design, schematic design and layout design are carried out according to the circuit design requirements, the size and number of layers of the circuit board are determined, and process analysis is carried out to determine the substrate manufacturing process.
Proofing, the designed circuit board sample is generated into a file, and the graphics on the file are transferred to the circuit board through a photolithography machine to form a copper pole, etc.
Printing, the area on the circuit board on the graphics transferred by the photolithography machine is etched to remove unnecessary copper and expose the glass fiber surface.
Drilling, use a drilling machine to make the required holes on the circuit board for welding components.
Gold plating, a layer of metal is covered on the surface of the circuit board through the electroplating process, which can improve the conductivity of the product on the one hand and prevent oxidation on the other hand.
Soldering: solder IC chips and other components to the corresponding positions of the circuit board, using hot plates and brackets for soldering.
Testing: test the soldered circuit board to verify whether the electrical performance, signal path and stability of the circuit board meet the design requirements.
Packaging: label, clean and package the qualified circuit boards to make them suitable for transportation and storage.

how ic substrate differentiate? The IC substrate manufacturing process is a complex and delicate process that requires a series of steps such as design, proofing, printing, drilling, gold plating, welding, testing and packaging. Only by strictly following the process can the quality and performance of the final product be guaranteed.

IC substrate manufacturers

As a leader of IC substrate manufacturer, Best Technology has over 18 years experience, we are so confident that we can provide the highest quality and high specifition IC substrate for you! Backing up with a group of professional engineers, and well established quality system. Best Technology has grown to become a major PCB manufacturer in Asia to serve in diverse customers base. At Best Technology, you can enjoy a full turn-key service from IC substrate design, prototyping, mass production and IC substrate assembly.

IC substrate manufacturers

How ic substrate differentiate

How to distinguish IC substrates? The distinction of IC substrates can be made in many ways, mainly including classification by package type, material properties, and bonding technology.

‌1. Classification by package type‌:

‌BGA IC substrate‌: It performs well in heat dissipation and electrical performance, can significantly increase chip pins, and is suitable for IC packages with more than 300 pins.

‌CSP IC substrate‌: It is a single-chip package with light weight, small size, and similar size to IC. It is mainly used in memory products, telecommunications products, and electronic products with a small number of pins.

‌FC IC substrate‌: By flipping the chip package, it has low signal interference, low circuit loss, good performance, and effective heat dissipation.

‌MCM IC substrate‌: It absorbs chips with different functions into one package, which is light, thin, short, and miniaturized, but because multiple chips are packaged in one package, this type of substrate does not perform well in signal interference, heat dissipation, fine wiring, etc.

‌2. Classification by material properties‌:

‌Rigid IC substrate‌: Mainly made of epoxy resin, BT resin or ABF resin, with a CTE (coefficient of thermal expansion) of about 13 to 17ppm/°C.

‌Flex IC substrate‌: Mainly made of PI or PE resin, with a CTE of 13 to 27ppm/°C.

‌Ceramic IC substrate‌: Mainly made of ceramic materials such as alumina, aluminum nitride or silicon carbide, with a relatively low CTE of about 6 to 8ppm/°C.

3.‌Classification by bonding technology‌:

‌Wire bonding‌

‌TAB (Keyboard Automated Bonding)‌

‌FC bonding

IC substrate vs PCB

The differences between IC substrate and PCB are mainly reflected in the definition, materials, structure, manufacturing process and application scenarios. In this article, Jieduobang will introduce the differences between IC substrate and PCB in detail.

Definition

PCB is the support of electronic components and the carrier for the electrical connection of electronic components; IC substrate is an integrated circuit chip carrier used to install integrated circuit chips and provide electrical connections with extremely high density and reliability.

Materials

PCB uses conductive and insulating materials such as copper clad laminate, glass fiber material and PTFE material; IC substrate mainly uses polymer materials (such as FR-4) and brittle ceramic materials.

Structure

PCB is composed of circuit boards by stacking multiple board layers, which can be connected through holes; the structure of IC substrate mainly includes circuit layer and assembly layer.

Manufacturing process

PCB manufacturing includes steps such as design, graphic layout, patch, welding and testing; IC substrate needs to undergo tedious processes such as preheating, pitting and buttoning.

Application of IC substrates

PCBs are widely used in the field of electronic product manufacturing, such as computer motherboards, mobile phone circuit boards, etc.; IC substrates are small, high-density, and highly reliable, and are widely used in high-end electronic fields, such as aerospace, national defense, and automotive electronics.

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What is Better than Bennic Bypassing Capacitor?

Tuesday, September 24th, 2024

What is Bennic Bypassing Capacitor?

Bennic is a well-known brand in the audio and electronics industry, particularly for its capacitors, which are often used in bypassing applications. A bypass capacitor is placed across a power supply to reduce noise and improve the stability of a circuit. It essentially filters out unwanted signals, ensuring that only the clean, desired frequencies pass through. Bennic capacitors have earned a reputation for reliability and quality in both audio and electronic applications.

However, when you ask, “What is better than a Bennic bypassing capacitor?” the answer depends largely on the specific application. Some other brands or types of capacitors may offer better performance depending on factors like capacitance values, temperature stability, or frequency response.

What is Better than Bennic Bypassing Capacitor?

What Type of Capacitor is Best for Bypass?

The type of capacitor most suitable for bypass is the multilayer ceramic capacitor (MLCC). ‌

Multilayer ceramic capacitors (MLCCs) are the first choice for bypass capacitors due to their small size, low equivalent series resistance (ESR), low equivalent series inductance (ESL) and wide operating temperature range. These characteristics enable MLCC to effectively suppress high-frequency noise signals and interference signals to ensure circuit stability and signal quality. Although MLCC has some drawbacks, such as capacitance values that may vary dynamically with temperature, DC bias, and AC signal voltage, and the piezoelectric properties of dielectric materials that may convert vibration or mechanical shock into AC noise voltage, the impact of these drawbacks is acceptable in most applications. Due to its small footprint and low cost, MLCC is used in almost every electronic device, although more careful evaluation may be required in noise-sensitive applications.

What Type of Capacitor is Best for Bypass?

Compared to MLCC, solid tantalum electrolytic capacitors are less sensitive to the effects of temperature, bias, and vibration, which makes them potentially a better choice in specific situations. However, the wide application of MLCC and its excellent bypass performance make it the first choice for bypass capacitors.

What is Better Than Bennic Bypassing Capacitor?

While Bennic capacitors are highly regarded, other high-quality brands and capacitor types might perform better depending on the context of use. For high-end audio applications, Mundorf capacitors are often praised for their superior sound clarity. Nichicon capacitors are another top-tier choice, known for their exceptional performance in both audio and power applications.

If you’re looking for capacitors with higher temperature stability, capacitors from Wima or Vishay could be a better choice. They are known for their high precision and reliability in high-temperature environments. Additionally, some film capacitors, like those from the Mundorf EVO series, might surpass Bennic capacitors when it comes to audio fidelity.

What Size Bypass Connection Do I Need?

The size of the bypass capacitor you need depends on the circuit’s power requirements and frequency range. For power supplies in typical electronic circuits, bypass capacitors range from 0.01 µF to 100 µF, depending on the specific requirements. For audio applications, where Bennic capacitors are frequently used, you may see values from 1 µF to 10 µF.

In power circuits, you might want to use larger capacitors, like 10 µF or higher, to smooth out lower-frequency noise. For higher-frequency noise, smaller capacitors, like 0.1 µF, tend to work better. It’s also important to choose a capacitor with a voltage rating that exceeds the operating voltage of the circuit to ensure reliability.

What Type of Bypass Capacitor Works Best at High Frequency?

At higher frequencies, ceramic capacitors are often the best choice for bypassing. Their low equivalent series resistance (ESR) and inductance make them ideal for filtering out high-frequency noise. Multilayer ceramic capacitors (MLCCs) are particularly effective in such cases because they can provide excellent high-frequency performance while maintaining small physical sizes.

Electrolytic capacitors, on the other hand, may not perform as well at higher frequencies due to their higher ESR and inductance. For ultra-high-frequency applications, you might also consider using tantalum capacitors or specialized film capacitors.

How to Choose the Value of a Bypass Capacitor?

Choosing the right value for a bypass capacitor is crucial to the performance of any electronic circuit, particularly those dealing with noise-sensitive components like op amps, microcontrollers, and RF circuits. The value of the capacitor determines its effectiveness at filtering out unwanted noise across different frequencies. Here are the key factors to consider:

Target Frequency

The first step is to determine the frequency range of the noise you want to filter out. For lower-frequency noise, you’ll need a larger capacitance value. Capacitors in the range of 10 µF to 100 µF are typically used to filter low-frequency noise, such as power supply hum. For higher-frequency noise, a smaller capacitor, such as 0.01 µF to 0.1 µF, is often more effective. In many cases, circuits will use multiple capacitors to address different frequency ranges (a practice known as multi-capacitor bypassing).

Capacitor Type

Different types of capacitors have different characteristics that can affect the bypassing performance. Ceramic capacitors are often preferred for high-frequency noise filtering because of their low equivalent series resistance (ESR) and inductance. Electrolytic capacitors, while having higher capacitance, tend to have higher ESR.

Operating Voltage

It’s crucial to select a capacitor with a voltage rating that is at least 20-50% higher than the circuit’s operating voltage. For instance, in a 5V circuit, a capacitor rated for 10V or higher would provide a safe margin of operation.

Temperature and Environmental Considerations

If your circuit operates in environments with extreme temperatures, make sure to choose capacitors that are rated for those conditions. Ceramic capacitors with a C0G (or NP0) dielectric offer excellent temperature stability. On the other hand, capacitors with X7R or Y5V dielectrics are more susceptible to capacitance changes over temperature, so they may not be the best choice for precise applications.

Application-Specific Requirements

In audio circuits, where noise can severely affect sound quality, precision and high-quality capacitors are often used. Meanwhile, in power circuits, a combination of electrolytic and ceramic capacitors might offer the best balance between high and low-frequency filtering.

What is the Difference Between a Decoupling Capacitor and a Bypass Capacitor?

Though decoupling and bypass capacitors serve similar functions, they are used slightly differently. A bypass capacitor is specifically designed to filter out noise from the power supply, allowing only the desired signals to pass through.

A decoupling capacitor, on the other hand, helps to isolate different parts of a circuit, ensuring that changes in current from one part don’t affect other parts. It works as a buffer, absorbing noise and voltage fluctuations that could otherwise cause instability in the circuit.

In many cases, the terms are used interchangeably because bypass and decoupling capacitors often serve both purposes in a circuit.

Does Bypass Capacitor Increase Gain?

A bypass capacitor does not directly increase gain, but it does help improve the overall performance of an amplifier. In some amplifier circuits, bypass capacitors help reduce noise and stabilize the power supply, which can indirectly contribute to better signal quality and perhaps an apparent increase in gain.

For instance, in common-emitter amplifier circuits, a bypass capacitor across the emitter resistor can increase the gain by reducing the feedback signal. By filtering out unwanted signals, the circuit can focus on amplifying the desired signal more effectively.

Why Use Multiple Bypass Capacitors?

Using multiple bypass capacitors of different values is a common practice to cover a wide range of frequencies. Different capacitors excel at filtering different frequencies. A larger capacitor (e.g., 10 µF) is typically used to filter out low-frequency noise, such as power supply ripple, but its effectiveness diminishes at higher frequencies due to parasitic inductance. On the other hand, smaller capacitors (e.g., 0.1 µF or 0.01 µF) are more effective at higher frequencies but may not be able to handle lower-frequency noise. In addition to this, here are some other benefits we can get when using multiple bypass capacitors:

Broad frequency coverage

Low ESR and inductance

Improved power supply stability

Closer placement to noise sources

Redundancy for reliability

What Happens to the Output Voltage if Bypass Capacitor is Removed?

If a bypass capacitor is removed from a circuit, you may notice increased noise and instability in the output voltage. The capacitor helps to filter out high-frequency noise and smooth out fluctuations in the power supply. Without it, the circuit becomes more susceptible to unwanted interference, which could result in a noisy or distorted signal.

In some cases, removing a bypass capacitor can also affect the circuit’s gain, particularly in amplifiers, where the capacitor helps to control signal feedback.

Do Op Amps Need Bypass Capacitors?

Yes, operational amplifiers (op amps) typically require bypass capacitors to ensure stable operation. Op amps are highly sensitive to power supply fluctuations. Without proper bypassing, noise from the power supply can couple into the op amp’s signal path, causing distortion, oscillation, or instability. Op amps with high gain are particularly prone to oscillation if there’s noise in the power supply. A bypass capacitor across the op amp’s power pins can prevent oscillations by stabilizing the voltage supply.

Best Technology provides one-stop service for our customers, not only for PCB and PCBA assembly, but also components sourcing. If you have PCBA projects, but don’t want to buy components by yourself, welcome to contact sales@bestpcbs.com, we are happy to help you!

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Flip-Chip Packages and Chipped Acceptance Criteria

Tuesday, September 24th, 2024

What is Flip-Chip Packaging?

Flip chip is a leadless structure that generally contains circuit units. The term “flip chip” comes from the process of flipping the die upside down during mounting. Solder balls made of tin-lead are deposited on the I/O pads, and then the chip is flipped and heated so that the molten tin-lead balls bond with the ceramic substrate. This technique replaces conventional wire bonding and is gradually becoming the mainstream in packaging technology, currently primarily used in high-clock-rate products such as CPUs, GPUs (Graphic Processor Units), and chipsets. Compared to COB (Chip on Board), the structure of flip-chip packages has the chip and I/O ends (solder balls) facing downward. Since the I/O terminals are distributed across the entire surface of the chip, flip-chip packaging has reached its peak in terms of packaging density and processing speed. In particular, it can be processed using methods similar to SMT (Surface Mount Technology), making it the ultimate direction for chip packaging and high-density assembly.

Flip-Chip Packages and Chipped Acceptance Criteria

Flip-chip technology originated in the 1950s with thermocouple welding techniques, but it was not widely applied until the 1990s. In traditional packaging methods, the chip is packaged at the bottom and connected to the package substrate via gold wires. In contrast, flip-chip technology connects the active side of the integrated circuit chip (the side with the circuit pattern) face-down directly to the substrate through solder bumps, thereby achieving circuit connections.

What is the Main Advantage of a Flip-Chip Packages?

Compared to traditional wire bonding processes, flip-chip packaging technology offers many distinct advantages, including superior electrical and thermal performance, higher I/O pin count, and reduced package size.

The thermal performance of flip-chip packaging is significantly better than that of conventional wire bonding processes. Today, many electronic devices such as ASICs, microprocessors, and SoCs dissipate power between 10-25W, or even more. In contrast, enhanced heat-dissipation BGA devices using wire bonding can only dissipate between 5-10W. Based on operating conditions, thermal requirements (maximum junction temperature), ambient temperature, and airflow, along with packaging parameters (such as external heatsinks, package size, substrate layers, and the number of solder balls), flip-chip packaging typically supports power dissipation of up to 25W.

The exceptional thermal performance of flip-chip packaging is determined by its low thermal resistance and structure. Heat generated by the chip is dissipated through thermal solder balls and internal and external heatsinks. The close contact between the thermal pad and the chip surface results in low junction temperatures (θjc). To reduce thermal resistance between the thermal pad and the chip, a high thermal conductivity adhesive is applied between them, making it easier for heat to dissipate within the package. For further improvement in thermal performance, an external heatsink can be directly mounted on the thermal pad to achieve even lower junction temperatures (θjc).

Another key advantage of flip-chip packaging is its electrical performance. Wire bonding processes have become bottlenecks for high-frequency and certain applications, while flip-chip technology improves electrical performance. Many electronic devices today operate at high frequencies, making signal integrity a crucial factor. In the past, the frequency limit for IC packaging was around 2-3GHz. With flip-chip packaging, depending on the substrate technology used, it can reach frequencies as high as 10-40GHz.

Flip-Chip Package Acceptance Criteria

Flip-chip packages, like any electronic component, must meet specific acceptance criteria to ensure they function as intended and maintain long-term reliability. These criteria primarily focus on the physical integrity of the die and bumps, as well as electrical performance.

Bump Integrity: The solder bumps must be intact and free from cracks, voids, or excessive deformation. Even small imperfections can lead to electrical failures over time due to mechanical stress or thermal cycling.

Chipped Die Edges: While some minor chipping at the die edges may be acceptable, chips that extend too close to the active area of the die can compromise the electrical performance and reliability. Typically, acceptance criteria specify the maximum allowable chip size and proximity to critical areas.

Solder Joint Strength: The strength of the solder joints between the bumps and the substrate must be sufficient to withstand thermal and mechanical stresses during normal operation. Weak or poorly formed joints can result in electrical discontinuities or complete failure of the device.

Electrical Performance: The electrical connections between the die and substrate must meet specific resistance and capacitance requirements. Any deviation from these parameters could lead to performance issues or signal integrity problems.

Thermal Performance: Flip-chip packages must be capable of dissipating heat effectively. If the package does not meet thermal performance criteria, it may overheat, leading to reduced performance or even damage to the device.

Flip-Chip Packaging Process

1. Inspection and Sorting: The chips are inspected and classified to ensure quality.

2. Adhesion: Conductive glue or solder balls are applied to the IC contact points of the chip.

3. Flip: The chip is flipped onto the PCB substrate using flipping equipment, aligning the chip’s contact points with the substrate.

4. Soldering: The chip contact points are soldered to the metal wiring on the substrate through methods such as thermocompression or thermal cooling.

5. Encapsulation: The entire chip is encapsulated using resin or other packaging materials to protect it from external environmental factors.

6. Testing: Functional testing is conducted on the encapsulated chip to ensure it operates correctly.

It is worth mentioning that flip-chip packaging technology faces some challenges during its development. First, since the chip is flipped onto the substrate, the active surface of the chip is exposed, which requires higher protection standards. Second, as the size and spacing of the solder bumps decrease, the alignment precision between the chip and the substrate becomes increasingly critical. Lastly, as packaging density increases, heat dissipation issues become more prominent.

What Are the Different Types of Flip Chips?

Flip chips can be categorized into different types based on their different packages:

1. Flip Chip Ball Grid Array (FCBGA)

Flip Chip Ball Grid Array (FCBGA) is a type of packaging where the die is flipped and connected to a substrate using an array of solder balls. The solder balls are arranged in a grid on the bottom of the package, providing both electrical and mechanical connections. FCBGA is commonly used in high-performance processors like CPUs and GPUs due to its ability to handle high pin counts, excellent electrical performance, and efficient heat dissipation.

2. Flip Chip Chip Scale Package (FCCSP)

Flip Chip Chip Scale Package (FCCSP) refers to a packaging method where the package size is only slightly larger than the die itself. In this type, the die is flipped and mounted directly onto a substrate or carrier using solder bumps. FCCSP is typically used in small form factor devices like mobile phones, tablets, and other compact electronics where space-saving is crucial. It offers better electrical performance and higher packaging density compared to traditional wire-bonded CSP.

3. Flip Chip System in Package (SiP)

SiP integrates multiple components, such as chips, passive components, and sensors, into a single package. The flip chip method allows for denser interconnections within the package, improving overall performance and reducing the footprint. SiP technology is used in applications like mobile devices, wearable technology, and IoT devices where multi-functionality in a compact form is essential.

How Does a Flip Chip Work?

A flip chip works by directly connecting the active side of the semiconductor die to the substrate through solder bumps. These bumps form the electrical pathways between the die and the external circuitry. Once the bumps are reflowed, they solidify into robust electrical connections. The underfill material provides additional mechanical support and helps manage thermal expansion differences between the die and substrate.

The absence of long wire bonds significantly reduces signal latency and noise, making flip-chip packages ideal for high-frequency and high-speed applications. The direct contact also allows for better heat dissipation.

What is the Difference Between Wire Bond and Flip Chip Packaging?

Wire bond packaging and flip-chip packaging are two distinct methods of connecting a semiconductor die to a substrate. They differ in different connection methods, electrical path lengths, applicable scenarios, and multi-chip stacking capabilities.

Connection Method

In wire bonding packaging, the chip is placed face up, and its connections to the circuit board are made through wires (usually gold wires). In contrast, flip-chip packaging uses bumps on the chip to directly interconnect components by flipping them face down onto the substrate, carrier, or circuit board. The electrical side is facing down, essentially flipping the traditional wire bonding method, which is why it’s called “flip chip.”

Electrical Path Length

Wire bonding has a longer electrical path, making it unsuitable for newer devices that require high-speed operation. In comparison, the electrical path in flip-chip packaging is only a fraction of that in wire bonding, making it highly suitable for high-speed operations.

Applicable

Wire bonding is widely used in mobile devices that don’t require fast operations, such as mobile DRAM and NAND chips, due to its cost-effectiveness and reliability. On the other hand, flip-chip packaging, with its shorter electrical path and higher I/O capabilities, is used for packaging high-speed components like CPUs, GPUs, and high-speed DRAM chips.

Multi-Chip Stacking Capability

Wire bonding faces challenges with multi-chip stacking due to the presence of wires, making it less ideal for high-density storage products. Flip-chip packaging, however, allows for denser interconnections in a smaller space, supporting multi-chip stacking and enabling faster data processing.

What is the Difference Between Flip Chip and WLCSP?

Flip-chip packaging and Wafer-Level Chip-Scale Packaging (WLCSP) are both methods of connecting semiconductor dies to external circuitry, but they have important differences:

In flip-chip packaging, the die is mounted onto a separate substrate or PCB. The bumps or solder balls are on the active side of the die, and the assembly is completed after the die is cut from the wafer.

However, in WLCSP, the packaging process occurs directly at the wafer level before the individual dies are cut. The solder bumps are applied while the die is still part of the wafer, and the final package is essentially the same size as the die itself. WLCSP is ideal for applications where size is critical, such as mobile devices, while flip-chip packaging is used for high-performance applications requiring greater thermal and electrical capabilities.

What is a Flip Chip Used For?

Flip-chip packaging is used in a wide variety of applications, particularly those that require high performance, small size, and efficient thermal management. Some common uses include:

Mobile devices
Networking equipment
Automotive electronics
Cell phones
Handheld electronics
GPS
PC peripherals
Voltage regulators
High-speed memory
Camcorders
DVD
Digital cameras
Game console
Graphics and chipsets for pcs
Servers
Microprocessor for pc and servers
Memory

This is the end of this sharing, welcome to contact us if you have any questions.

Tags:flip chip acceptance criteria, flip-chip packages acceptance criteria
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What are printed circuit board thickness standards?

Monday, September 23rd, 2024

What is the Standard Thickness of a PCB?

The standard thickness of a PCB is often 1.6 mm. This has become the go-to thickness in the industry because it balances flexibility, cost, and performance for most applications. However, depending on the requirements of the design, PCB thickness can vary widely.

What are printed circuit board thickness standards?

Manufacturers offer various thicknesses to accommodate specific designs, from 0.4 mm (0.016 inches) for ultra-thin, flexible boards, up to 3.2 mm or even thicker for high-current, rugged applications. The choice of thickness largely depends on the type of application and the mechanical strength needed.

How is PCB Thickness Measured?

Measuring PCB thickness accurately is crucial for ensuring the board meets design specifications and performs optimally in its application. The thickness of a PCB refers to the total height of the board, including all its layers—copper, dielectric, and solder mask. This thickness plays a role in many factors, from electrical performance to mechanical stability, and must be precisely controlled. The tools and methods used to measure PCB thickness include:

1. Micrometers

A micrometer is the most common tool for measuring PCB thickness. It allows precise measurements down to fractions of a millimeter, making it ideal for multilayer PCBs where small deviations can affect performance. The micrometer is placed at various points across the board to ensure uniform thickness.

2. Calipers

Digital or analog calipers are also used to measure the thickness of PCBs. They are particularly useful for quickly gauging thickness across different sections of the board.

3. Cross-Sectioning

In cases where even more precision is required, manufacturers may opt to cross-section the board. This involves cutting a sample of the PCB and measuring it under a microscope to analyze each layer’s contribution to the overall thickness.

PCB thickness is typically measured in mils (1 mil = 0.001 inches) or millimeters, depending on the region and industry. Standard PCB thicknesses usually fall between 0.4 mm (0.016 inches) and 3.2 mm (0.125 inches), but custom designs may require other dimensions.

In mass production, quality control procedures are in place to ensure that the boards maintain a consistent thickness across large batches. Thickness tolerances range from ±10% to ±20%, depending on the manufacturer and materials used.

How Thick is a 2-Layer PCB Board?

A standard 2-layer PCB is typically 1.6 mm thick, but this can vary based on specific requirements. The board consists of two copper layers, one on each side of the insulating core.

Core Thickness: The thickness of the insulating material between the two copper layers is generally around 1.4 mm.

Copper Thickness: Standard copper thickness is 35 μm (1 oz copper), though this can be adjusted for higher current-carrying capacity.

For lighter applications, such as compact consumer electronics, a thinner board of 0.8 mm may be used, providing more flexibility and space-saving. Meanwhile, more robust applications may demand thicknesses exceeding 2.4 mm.

How Thick is a Standard 8-Layer PCB?

When it comes to multilayer PCBs like the 8-layer variant, thicknesses usually range from 1.4 mm to 2.4 mm, depending on the design requirements. With multiple layers of copper and insulating material stacked together, manufacturers must optimize thickness while considering electrical performance and mechanical rigidity.

Each additional layer introduces more copper and insulation, increasing the overall thickness. For high-frequency applications or boards that must handle significant current, thicker boards may be necessary to ensure signal integrity and thermal management.

How Does PCB Thickness Affect Thermal Performance?

The influence of PCB thickness on thermal performance is mainly reflected in heat dissipation efficiency and heat capacity.

The thickness of the PCB directly affects its heat dissipation efficiency. Thicker PCBs have greater heat capacity and better heat conductivity, and are able to conduct the heat generated by electronic components more effectively. This is because copper has good thermal conductivity, and the thicker copper foil layer can more quickly transfer heat from the heating element to the cooling area or external radiator, helping to improve the overall thermal management efficiency and protect sensitive components from thermal damage.

In addition, the thickness of the PCB is also closely related to its mechanical strength and stiffness. Thicker PCB boards have higher flexural stiffness and impact toughness, can withstand greater mechanical stress and vibration, and ensure the stability and reliability of electronic equipment in harsh environments. This is equally important in thermal management, as it helps to maintain the stable operation of electronic equipment in high temperature environments and prevent performance degradation or damage due to overheating.

However, it is important to note that while thicker PCBs are good for heat dissipation, in high-frequency applications, excessively thick PCBs may increase the impedance and coupling of the signal, thus affecting electrical performance.

What Factors Influence PCB Thickness?

PCB board thickness is one of the key parameters to be considered in the design process, which has a great impact on the performance and reliability of the circuit board. When choosing plate thickness, the following factors need to be considered:

1. Signal speed

The thinner the plate, the faster the signal speed, and vice versa. However, when the board thickness is less than 0.8mm, the signal will have a great loss, will produce serious signal interference, affecting the normal work of the circuit board.

2. Heat conduction

The thinner the board thickness, the worse the heat dissipation ability, easy to produce hot spots and thermal runaway phenomenon, affecting the performance and reliability of the circuit board.

3. Mechanical strength

The greater the thickness of the plate, the higher the mechanical strength, the smoother the surface of the plate, and the greater the bending strength. However, too thick a board will affect the assembly and size of the board design.

4. Number of layers

More layers mean a thicker board. A single-layer PCB may be as thin as 0.4 mm, while multilayer boards like an 8-layer PCB may reach over 2 mm.

Taking the above factors into consideration, it is usually appropriate to choose the plate thickness between 1.6mm-2.0mm.

How to Decide PCB Thickness?

According to different applications and needs, PCB board can be divided into a variety of thicknesses, commonly used board thickness is 0.8mm, 1.0mm, 1.2mm, 1.6mm, 2.0mm and so on. When selecting PCB board thickness, it is necessary to make comprehensive consideration according to specific application scenarios and design requirements. Here are a few ways to choose plate thickness:

1. Determine according to the circuit complexity and working environment

When the circuit complexity is high, multiple components need to be connected at the same time, or the circuit board needs to work in a high temperature environment, you are advised to select a thicker board thickness to effectively improve the performance and reliability of the circuit board.

2. Determine the device size and type

If the device size is small and requires precision assembly, a thinner plate thickness is recommended. For large devices, such as power switches and high-power LED lights, it is recommended to choose a thicker board thickness.

3. Determined according to design requirements and cost control

In terms of cost control, the thinner the plate thickness, the higher the corresponding plate cost will be. Therefore, the cost and performance should be considered comprehensively in the design, and the most appropriate plate thickness should be selected.

In addition, as an 18+ years experienced PCB manufacturer, we summarized a small tip for choosing PCB thickness, hope this is help for you.

The board thickness below 1.0mm is generally used for small electronic devices and mobile devices, such as smart watches, Bluetooth headsets and so on.

1.0mm-1.6mm PCB thickness is suitable for most common electronic devices, such as smart phones, tablets, digital cameras, etc.

Thickness >1.6mm is generally used for industrial control equipment, power switches and other large electronic equipment.

Advanced PCB Manufacturer – Best Technology

At Best Technology, we specialize in manufacturing high-quality PCBs tailored to meet your exact design specifications. We offer custom thickness options for single-layer, double-layer, and multilayer boards.

We understand that PCB thickness is critical to performance, whether you’re working on high-current applications or compact designs. Our team of experts can guide you through the selection process, ensuring that your boards are not only optimized for electrical performance but also for thermal and mechanical stability.

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What Do Letter and Numbers on A Schematic Mean?

Monday, September 23rd, 2024

On a schematic diagram, letters and numbers serve as an organized and systematic way to represent the various components, their relationships, and the specifics of the PCB circuit design. Here’s an extended explanation of the key elements represented by these symbols.

Component designators

Component designators are typically a letter or combination of letters that denote the type of electrical or electronic component. These letters are standardized, so engineers and technicians across the world can easily understand the schematic.

R: Resistor (e.g., R1, R2) – Indicates a resistor, with numbers differentiating multiple resistors in the circuit.

C: Capacitor (e.g., C1, C2) – Refers to capacitors, either for storing charge or filtering signals.

L: Inductor (e.g., L1, L2) – Shows inductors, which store energy in a magnetic field.

D: Diode (e.g., D1, D2) – Marks diodes, which allow current to flow in one direction.

Q: Transistor (e.g., Q1, Q2) – Represents a transistor, which can be used for switching or amplification.

U: Integrated Circuit (IC) (e.g., U1, U2) – Denotes an IC, a collection of components like transistors, diodes, and resistors in one package.

J: Connector (e.g., J1, J2) – Represents a connector or jack where an external connection can be made.

SW: Switch (e.g., SW1, SW2) – Indicates a switch that can open or close the circuit.

TP: Test Point (e.g., TP1, TP2) – Refers to a point in the circuit where voltage or signal measurements can be taken.

LED: Light Emitting Diode (e.g., LED1, LED2) – Represents an LED, a special type of diode that emits light.

F: Fuse (e.g., F1, F2) – Denotes a fuse, a protective device to prevent overcurrent.

VR or P: Variable Resistor/Potentiometer – A resistor whose resistance can be adjusted, often used for tuning circuits.

M: Motor (e.g., M1, M2) – Marks a motor, converting electrical energy into mechanical motion.

Above just few common letters used in PCB schematics, here we summarized a chart for your better reading.

Letter	Represents Components
D	Diode/Inverter (sometimes inverter use it)
Q	Transistor (also used instead of V and VT)
C	Capacitor
L	Inductor
R	Resistor
K	Relay
T	Transformer
X、Y	Crystal Oscillator
U、IC	Integrated Circuit
M	Motor
CX	High Voltage Ceramic Capacitor
CY	High Voltage Thin Film Capacitor
CE	Electrolytic Capacitor
VR	Variable Resistor
RT	Thermal Resistor
RP	Potentiometer
RG	GND
J	Joggle
JP	Jumper
FU	Fuse
N	Optocoupler
B、BZ	Buzzer
SCR	Unidirectional Thyristor
TRIAC	Bidirectional Thyristor
FB	Ferrite Bead
ZD	Zener Diode
LED	Light-Emitting Diode
SPK	Speaker
S、SW	Switch
DB	Bridge Diode
TP	Test Point

Reference Numbers

Reference numbers provide a clear and organized way to distinguish between multiple instances of the same type of component within a schematic. Without these numbers, it would be difficult to identify and refer to specific components during assembly, troubleshooting, or modifications.

For example:

R1, R2, R3: These are three different resistors in the same circuit.

C1, C2, C3: Refers to different capacitors.

The numbers ensure there’s no confusion when discussing the schematic, ordering parts, or identifying where a fault might lie in the circuit.

Sometimes, designer use [Component Designator] + [Number] structure: the component designator is a letter or combination of letters (e.g., R for resistor, C for capacitor, U for IC).

Or the number is a sequential identifier, starting from 1 and incrementing for each new component of that type (e.g., R1, R2, R3 for three resistors).

Values and Ratings

Numbers are often placed near components to indicate their electrical values. These values help in understanding the component specifications and performance:

Resistors: The value of resistance is given in ohms (Ω). For example, “R1 100Ω” indicates that resistor R1 has a resistance of 100 ohms.

Capacitors: The capacitance is usually specified in farads (often microfarads or picofarads). For example, “C1 10μF” refers to a capacitor with a capacitance of 10 microfarads.

Inductors: The inductance is given in henries (H). For example, “L1 100mH” means the inductor has a value of 100 millihenries.

Voltage Ratings: Components may have voltage ratings marked on them, indicating the maximum voltage they can handle safely. For example, a capacitor might have “50V” written next to it, meaning it can withstand up to 50 volts.

Tolerance and Power Ratings: Some components may include additional ratings like tolerance (e.g., ±5%) for resistors or power ratings in watts (e.g., 0.25W for resistors).

Pin Numbers and Labels

Components like ICs, connectors, and transistors may have multiple terminals or pins. On the schematic, pin numbers are often labeled to indicate where each connection needs to be made. For example, an IC might have pin numbers 1, 2, 3, etc., and the schematic helps you see how these pins connect to other parts of the circuit.

For connectors and ICs, pin labels like VCC, GND, Output, or specific functions (e.g., Reset, Clock) may be used to denote what each pin does. In a slide potentiometer, for instance, the pinout might be labeled as Output, VCC, and GND to clarify the connection points.

Nodes and Signal Labels

Nodes: In a schematic, a “node” refers to a junction where different components are connected. Nodes might be labeled with numbers or names to represent different parts of the circuit.

For instance, all components connected to ground might have the label GND.

Similarly, all components connected to a 5V supply might have the label VCC or +5V.

If a schematic involves multiple pages or complex designs, signals may be labeled with text to show where a wire is going or what function it performs (e.g., CLK for clock signal, DATA for data line).

Wire and Trace Identifications

Wires and traces in schematics are shown as lines connecting the components. These lines show the paths through which electrical signals and currents flow. Sometimes, wires are labeled with names or numbers, especially if the schematic is very complex or spans multiple sheets. For example: wires may be labeled with names like SCL, SDA (for I2C communications), or simply A1, A2 to denote different connections.

Voltage and Current Values

Some schematics include voltage or current values directly on the diagram to show how much voltage should be present at specific points or how much current is flowing through a component. For instance: 5V or 12V might be written near a power supply line, indicating the expected voltage at that point in the circuit.

Current values may be given in milliamps (e.g., 20mA), showing the expected current flowing through a component like an LED.

Special Symbols

Schematics may also include symbols to indicate specific characteristics or features of the circuit, such as:

Ground (GND): The symbol for ground shows where components are connected to a common reference point (usually zero volts).

Power Rails: Symbols like +5V or +12V indicate where power is supplied in the circuit.

Oscillators or Clock Signals: These can be shown with special symbols or labels, such as a waveform or the abbreviation CLK.

There is needed to be noted that, the meaning of the letters/numbers on the PCB board did not form a strict standard, is not always consistent with the above table or above mentioned, they are just for easy to communicate and manufacture. If special labels existing your customer’s schematic, please communicate with your client.

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What is IPC in Cars? – Best Technology

Monday, September 23rd, 2024

What is IPC in a Car?

Instrument Panel Cluster (IPC) in cars refers to the array of instruments and displays located on the vehicle’s dashboard. It plays a vital role in conveying essential information to the driver, including speed, fuel levels, engine performance, and other indicators that ensure safe and efficient driving. The IPC also manages warnings and alerts, helping the driver respond to potential issues promptly. With technological advances, the IPC has evolved from simple mechanical dials to more sophisticated digital displays.

In every car, the Instrument Panel Cluster is designed to centralize important information. The IPC houses meters like the speedometer, fuel gauge, and odometer, which were once mechanical but have now become digital. Modern IPCs also integrate with car computer systems to provide real-time data, making it easier for drivers to monitor vehicle performance. The shift towards digital clusters offers more dynamic displays, customizing what drivers see based on current driving conditions.

Types of Instrument Clusters

There are several types of IPCs that have been used in cars over the years, each offering a different level of functionality.

Analog IPC: These traditional clusters use mechanical dials for speed, fuel, and other key indicators. Though reliable, they are less flexible than newer systems.

Digital IPC: The digital IPC provides real-time data through a screen, displaying information like navigation, temperature, and even diagnostics.

Hybrid IPC: Combining the best of both worlds, hybrid IPCs feature analog gauges alongside digital displays. This setup allows for traditional dials but adds dynamic elements like alerts and animations.

Fully Digital Clusters: High-end modern vehicles often come with fully digital IPCs. These systems provide a wide range of customization options and enhanced visualization.

Components of IPC in Cars

Each Instrument Panel Cluster is made up of multiple components designed to convey key data to the driver.

1. Speedometer: Shows the current speed of the vehicle.

2. Tachometer: Displays engine RPM to help with gear management.

3. Fuel Gauge: Indicates the remaining fuel in the tank.

4. Odometer: Tracks total distance covered by the vehicle.

5. Temperature Gauge: Monitors engine temperature to prevent overheating.

6. Warning Lights: Signals for issues such as engine problems, low oil, or tire pressure.

Each of these components plays a crucial role in ensuring a smooth driving experience, allowing the driver to make informed decisions on the road.

How Does IPC in Cars Work?

The IPC is not just a passive display; it is an active part of the vehicle’s computer system. Through a series of sensors and control modules, the IPC collects data from different parts of the car. These sensors track everything from vehicle speed to fuel consumption and engine health. The data is then processed and displayed on the IPC for the driver to see.

For instance, when a car accelerates, the speedometer gauge increases accordingly. If the fuel level drops below a certain threshold, the fuel gauge reflects this, and a warning light might come on. The interaction between the car’s systems and the IPC is instant, ensuring drivers have access to critical information in real-time.

Functionality of IPC

The primary function of the IPC is to keep the driver informed about the car’s operational status. Whether it’s monitoring speed or alerting the driver to an engine issue, the IPC is the driver’s first line of information. Modern IPCs go beyond basic data, often integrating GPS, vehicle diagnostics, and even entertainment features.

Many IPCs can now be customized based on the driver’s preferences. For example, a driver might choose to display navigation data instead of the tachometer if they are more focused on reaching their destination efficiently.

How IPC Displays Critical Information to the Driver?

The IPC uses various visual cues to display information. Some of the most common include:

Gauges: These are the traditional dials like the speedometer and fuel gauge. They are easy to read and provide constant updates.

Warning Lights: These small icons light up to signal specific issues, such as low oil levels or a problem with the brakes.

Digital Displays: In digital IPCs, critical information is often shown on a screen, making it easier to change between different types of data as needed.

By presenting this data in a straightforward manner, the IPC ensures drivers can quickly interpret the information without taking their eyes off the road for too long.

Why Is IPC Important in a Car?

The IPC is a critical safety feature in any vehicle. Without it, drivers would have little to no information about the current condition of their car. The IPC helps drivers maintain speed limits, monitor fuel levels, and detect potential engine issues before they become serious problems. In modern vehicles, the IPC also aids in navigation, parking assistance, and fuel efficiency, offering a more comprehensive driving experience.

An efficient IPC helps reduce stress for drivers by streamlining the information they need in one centralized location. This enhances not only the safety but also the overall driving comfort, allowing the driver to focus on the road.

Interaction Between the Vehicle’s Sensors and the IPC

The seamless interaction between the vehicle’s sensors and the IPC ensures real-time data transfer. Sensors installed throughout the car continuously send data to the IPC’s control module. These sensors monitor vital statistics, such as engine health, fuel consumption, and tire pressure.

For instance, if there is an issue with the engine, the relevant sensor will detect it and immediately communicate the information to the IPC. This triggers a warning light, prompting the driver to check the engine or visit a mechanic. This interaction helps prevent damage to the vehicle and ensures the driver is aware of any issues as soon as they arise.

Common Issues and Maintenance of IPC

Despite being a reliable part of the vehicle, the IPC can occasionally face issues. Common problems include:

1. Faulty Displays: Over time, digital IPCs might experience glitches or screen failures. This can make it difficult for drivers to access critical information.

2. Sensor Malfunctions: If a sensor fails, it may send incorrect data to the IPC. This can result in inaccurate readings, such as incorrect fuel levels or engine temperature.

3. Warning Light Malfunctions: Sometimes, warning lights may stay on even when there is no issue, confusing drivers.

To keep the IPC functioning smoothly, regular maintenance is essential. Drivers should ensure that the sensors and control modules are inspected periodically. If there are any signs of malfunction, such as inaccurate readings or unresponsive displays, they should be addressed promptly to avoid bigger issues down the line.

IPC in Cars vs. IPC in PCBs

Though they are same in the context, but they have different meanings when used in different areas. In cars, IPC refers to the Instrument Panel Cluster, a crucial part of the vehicle’s dashboard. In the world of electronics, IPC stands for the Institute for Printed Circuits, now known simply IPC. Which governs standards and protocols for PCB (Printed Circuit Board) manufacturing.

This global association creates standards for the design, manufacture, and assembly of PCBs and electronics. IPC standards are widely adopted to ensure product reliability, quality, and compatibility across different manufacturing processes. By following IPC guidelines, companies can produce consistent, high-quality PCB products, whether for consumer electronics, automotive systems, or industrial machinery.

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BGA Chipping Per IPC-610: Everything You Need to Know

Friday, September 20th, 2024

What is a BGA chip?

The Ball Grid Array (BGA) is actually a kind of package mode, not the chip itself. BGA is a surface adhesion technology that used in the packaging of integrated circuits, which is interconnected with the printed circuit board (PCB) by making an array solder ball at the bottom of the chip as the I/O end of the circuit. This packaging technology allows the bottom surface of the entire device to be used as a pin, with a shorter average wire length than the surrounding defined package type, resulting in better high-speed performance. BGA package technology is improved from pin grid arrays to provide more pins than other package types such as dual in-line or four-side pin flat packages. Soldering BGA-packaged devices requires precise control and is usually done by automated plant equipment. The BGA package device is not suitable for slot fixing, but is fixed to the PCB by surface mount. BGA packaging technology comes in many forms, including plastic BGA (PBGA), ceramic BGA (CBGA), and others, each of which varies in size, amount of I/O, physical structure, and packaging materials.

BGA Chipping Per IPC-610

BGA chips are popular because of their compact size and ability to provide higher density connections. This allows manufacturers to pack more functionality into smaller devices. It is widely used in electronics to mount microprocessors, memory chips and other components onto printed circuit boards (PCBS), which are then installed into our electronic devices. Such as our smartphones, laptops and advanced electronic devices.

Why is BGA used?

BGA packaging is used primarily due to its ability to offer higher connection density and better electrical performance compared to traditional packages like QFP (Quad Flat Package). The design of BGAs minimizes issues like short circuits and signal interference, which are more common with older pin-based methods. Another reason BGAs are preferred is their superior thermal dissipation capabilities. The solder balls act as conductors, helping to transfer heat away from the chip. Below you can see some other benefits of using BGA chips.

1. High-density package: BGA package can provide a large number of I/O (input/output) connection points in a relatively small space.

2. Miniaturization: The BGA package allows the chip to be mounted directly on the PCB (printed circuit board), reducing the thickness and volume of the package.

3. Good heat dissipation performance: BGA package can better heat dissipation due to its large underside contact area.

4. Reliable electrical performance: BGA package adopts spherical solder joints, which can reduce signal transmission delay.

5. Easy assembly: While the number of I/O pins in the BGA package increases, the pin spacing remains unchanged or even increases, which helps to improve the yield of assembly. 6. Cost effectiveness: Although the initial investment of BGA packaging is high, it can reduce costs in the long run due to its high efficiency and miniaturization capability.

7. Wide range of applications: BGA packages are suitable for various types of integrated circuits from simple microcontrollers to complex graphics processors.

8. Easy maintenance: In some cases, BGA-packaged chips can be replaced or repaired, but this usually requires professional equipment and technology.

9. Mature technology: BGA packaging technology has been very mature, there are many types to choose from, such as PBGA (plastic ball grid array), CBGA (ceramic ball grid array), etc., to meet the needs of different applications.

What does a BGA do?

A BGA plays a crucial role in establishing electrical connections between an IC and the PCB. The tiny solder balls act as both conductors and connectors, allowing signals to flow between the chip and the board. This is critical in enabling the functionality of various devices, from computers to consumer electronics.

Additionally, BGAs enhance the durability and performance of circuits by providing a stable connection that can withstand environmental stress, such as temperature fluctuations or mechanical vibrations. This makes them a preferred choice in mission-critical applications, including aerospace, automotive, and medical electronics.

What is the difference between BGA and flip chip?

The primary difference between a BGA and a flip chip lies in how the chip is mounted onto the PCB. In a BGA, the chip is placed on top of the solder balls, which serve as the connection points between the IC and the PCB. The solder balls are positioned in a grid pattern under the chip. The chip remains on the top surface, with the balls acting as connectors below.

In contrast, a flip chip is mounted upside down, or “flipped.” The connections are made directly between the IC and the PCB, eliminating the need for solder balls. This method makes the active component of the chip face the substrate and can be directly in contact with the substrate, thus improving the thermal and electrical performance. The main advantages of flip chips include high density, which can reduce the size of the package so that more chips can be installed in a limited space. In addition, flip chip technology also has excellent electrical and thermal performance, which can provide better signal transmission and heat dissipation effects. However, it can be more expensive and complex to manufacture, making BGAs a more cost-effective solution in many cases.

BGA chipping per IPC-610

IPC-610, a globally recognized standard for PCB assembly and acceptance, provides guidelines on acceptable levels of chipping in BGAs. According to IPC-610, minor chipping on non-critical areas of a BGA is allowed as long as it does not affect the functionality or reliability of the component.

Section 10.6 of the IPC-610 standard is specific to BGA chips and defines what are acceptable and unacceptable defects. Under this standard, buyers ensure that BGA used in electronic products meets high quality standards and does not compromise the integrity of the finished product. Manufacturers must adhere to these standards to maintain the reliability and safety of their products, especially in industries such as aerospace and medical devices, where component failures can have serious consequences.

The description of BGA in IPC-A-610 standard mainly focuses on the acceptance standards of BGA components, which involve the appearance, structure, and welding quality of BGA components. Specifically, IPC-A-610 standard acceptance of BGA components includes but is not limited to the following points:

Appearance inspection

The appearance of BGA components should meet the requirements of the standard, no obvious defects such as cracks, deformation, etc.

Welding quality

The welding of BGA components should be uniform and complete, without bad phenomena such as virtual welding and cold welding. The solder joint should be firm and able to withstand certain mechanical stress.

Pin/ball grid array inspection

The pin or ball grid array of the BGA component should be well docked with the PCB pad, without dislocation, offset and other phenomena. The pin or ball should be intact and free of defects.

Size and position accuracy

The BGA component should be accurately installed on the PCB, and its position and height should meet the design requirements to ensure the normal connection of the circuit and the functional realization of the component.

In addition, as technology evolves, the IPC-A-610 standard is constantly updated to accommodate new technologies and component types. For example, the IPC-A-610G version includes new SMT terminal types and updated plating hole filling requirements, as well as BGA void requirements.

How long does IPC-610 last?

IPC-610 is regularly updated to reflect changes in technology and industry practices. However, the certification itself typically lasts for two years. After this period, manufacturers and technicians may need to undergo recertification to ensure they are up to date with the latest standards and guidelines. The two-year validity helps maintain a high level of competence and ensures that those involved in the production and inspection of PCBs follow the most current best practices.

Recertification is crucial, as it ensures that professionals stay informed about any changes in the IPC-610 standard, particularly regarding evolving technologies like BGAs and their use in modern electronics. This ongoing education helps manufacturers produce high-quality, reliable products that meet the demands of today’s fast-paced tech industry.

What is Section 10.6 of the IPC-A-610?

Section 10.6 of the IPC-A-610 standard provides specific criteria for the inspection and acceptance of BGA chipping. It outlines the types of chipping that are considered acceptable and those that are not. Minor cosmetic chips on the non-functional areas of a BGA are usually acceptable as long as they do not interfere with the operation or reliability of the chip. However, chipping on functional areas, such as those that could affect the solder ball connections, is not allowed.

What is the difference between IPC-600 and IPC-610?

IPC inspection standards refer to the inspection of electronic components according to IPC-A-600 and IPC-A-610 standards. IPC-A-600 is an inspection standard for printed circuit boards (PCBs), while IPC-A-610 is an inspection standard for electronic assembly. These two standards are the most commonly used inspection standards in the electronic manufacturing industry, which specify the appearance, size, welding quality and other requirements of electronic components.

First, the IPC-A-600 standard specifies the appearance and size requirements of the printed circuit board. According to the standard, the printed circuit board should be free of any surface defects, such as bubbles, cracks, scratches, etc. In addition, the size of the printed circuit board should meet the design requirements, the aperture, line width, line distance and other parameters must also meet the standard provisions. Only printed circuit boards that meet these requirements can be considered qualified.

Second, the IPC-A-610 standard specifies the inspection requirements for electronic assembly. According to this standard, welding quality is one of the most important inspection contents in electronic assembly. The welding should be uniform and firm, and the welding point should have no defects such as virtual welding, dislocation, short circuit and so on. In addition to the welding quality, the installation position, direction and spacing of the components also need to meet the standards. Only electronic assemblies that meet these requirements can be considered qualified.

When carrying out IPC inspection, it is necessary to carry out inspection and evaluation in strict accordance with the requirements of the standard. First of all, it is necessary to accurately understand and master the content of IPC-A-600 and IPC-A-610 standards, and understand the requirements and testing methods therein. Secondly, appropriate inspection equipment and tools should be used, such as microscopes, calipers, welding quality detectors, etc., to ensure the accuracy and reliability of the inspection. Finally, it is necessary to accurately record and evaluate the inspection results, timely discover and correct unqualified products, and ensure quality control in the production process.

With over 18 years as an industry leader, Best Technology is one of the most experienced PCB and PCB assembly manufacturer in Asia. We are highly specialized not only in quick-turn PCB prototype and PCB assembly, but also medium and small volume PCB fabrication. In Best Technology, you can enjoy a full-comprehensive one-stop service from PCB design, layout, PCB fabricate, PCB assembly, function testing and delivery. We always try our best to fabricate your PCB with copper clad laminate with the highest quality to meet your demands.
If you have any questions, please feel free to contact us with sales@bestpcbs.com, we will be happy to help you.

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High Frequency PCB & High Frequency PCB Prototype

Friday, September 20th, 2024

What is High-Frequency PCBs?

What is High-Frequency PCBs? High frequency PCBs are specifically designed to operate at frequencies typically above 1GHz. These circuit boards play a crucial role in modern communication systems like satellite communications, radar, and wireless networks. The materials used in high-frequency PCBs are different from those in standard PCBs. While standard PCBs use FR4 material, high-frequency PCBs often require specialized materials like PTFE (Teflon) or Rogers material to reduce signal loss and improve overall performance.

The growing need for faster and more reliable communication across industries makes high-frequency PCBs essential for creating cutting-edge devices.

High Frequency PCB Materials

Click here to download Raw Materials of RF PCB.

Advantages of High Frequency PCB

Faster signal transmission

Better signal integrity

Enhanced thermal management

Low electromagnetic interference (EMI)

Application in emerging technologies

Improved precision in high-speed applications

What is the Frequency Limit for FR4 PCB?

FR4 is the most widely used material in standard PCBs due to its affordability and adequate performance for general applications. However, when it comes to high-frequency operations, FR4 has its limitations. The material can handle frequencies up to about 1GHz, but beyond this range, its performance starts to degrade significantly. High-frequency signals experience increased signal loss, dielectric losses, and electromagnetic interference (EMI) due to FR4’s higher dielectric constant (around 4.5) and poor thermal properties.

The limitations make FR4 unsuitable for more advanced applications like high-speed telecommunications, radar systems, and modern wireless technologies where signals operate in the gigahertz range. When designing PCBs that require frequencies beyond 1GHz, alternative materials like PTFE (Teflon) or Rogers laminates are recommended to maintain signal integrity and reduce losses.

How Do You Make High-Frequency PCB?

Creating a high-frequency PCB involves a few additional considerations compared to standard PCB designs. First, the choice of materials is critical. PTFE, Rogers, and other high-performance laminates are commonly used to ensure the PCB can handle high-frequency signals. Next, the board’s thickness, trace width, and layout need to be carefully calculated to avoid impedance issues. The key process including:

1. Material Selection

The first step is choosing materials that can handle high-frequency signals. Materials like PTFE, Rogers, or ceramic substrates are commonly used because they have lower dielectric constants, low dissipation factors, and better thermal stability. These materials ensure minimal signal degradation.

2. Controlled Impedance

High-frequency signals are sensitive to variations in impedance. Controlled impedance design ensures that the trace impedance matches the signal’s requirements, preventing reflection and signal distortion. This involves calculating the width and spacing of the traces and ensuring consistent dielectric properties across layers.

3. Multi-layer PCB

Multi-layer boards are often necessary for high-frequency applications to separate signals and reduce cross-talk. Ground planes are typically added to lower electromagnetic interference (EMI) and provide better signal grounding.

4. Short and Direct Signal Paths

Keeping signal paths as short as possible helps minimize signal loss and prevents unwanted interference. Traces that are too long or involve sharp bends can introduce delay and noise.

5. Shielding

In some cases, shielding techniques can be employed to prevent interference from other electronic components. This can include grounded planes, copper shields, or even encapsulating certain areas of the PCB.

High-frequency PCB design often requires sophisticated simulation tools. Software such as Ansys or Altium Designer helps predict how signals will behave on the board, allowing for adjustments to be made before fabrication.

What is the Highest RF Frequency?

In communication circuits, radio frequency (RF) bands cover a wide range of frequencies, typically starting from 20kHz up to 300GHz. The highest RF frequency currently used in commercial applications ranges from 100GHz to 300GHz, categorized as millimeter waves. These frequencies are essential for high-speed data transmission in technologies like 5G, radar systems, and advanced satellite communication. While developing PCBs that can efficiently handle such frequencies can be challenging, material innovations have made it possible.

What Are Some Important Considerations When Designing a PCB Layout for High-Frequency Circuits?

Designing a PCB for high-frequency circuits demands a careful approach to ensure signal integrity. The first thing to consider is the dielectric material. As previously mentioned, materials like Rogers or PTFE are preferred because they offer lower dielectric loss, which is crucial at higher frequencies. Trace layout is another critical factor. The length and width of the traces must be calculated to maintain impedance control, ensuring that signals don’t get distorted as they travel through the board.

1. Signal Integrity and Trace Layout

The layout of traces is a critical consideration in high-frequency PCB design. To maintain signal integrity, traces should be kept as short and straight as possible. Long traces can introduce delay, noise, and signal degradation. Additionally, sharp corners in trace routing should be avoided because they can lead to signal reflection and impedance discontinuities. Rounded or 45-degree bends are preferable to right-angle corners, which can cause unwanted signal interference.

2. Ground Planes and Layer Stack-Up

A solid, continuous ground plane is one of the most effective ways to reduce noise and EMI in high-frequency PCBs. Ground planes provide a low-impedance path for return currents and act as shields to prevent electromagnetic radiation from affecting other components. For multi-layer PCBs, having dedicated power and ground planes in the stack-up helps reduce noise and improves overall signal integrity.

3. Via Management

Vias introduce small inductances into the signal path, which can become problematic in high-frequency circuits. High-frequency signals are particularly sensitive to these inductances, and excessive use of vias can degrade signal quality. Designers should minimize the number of vias in high-frequency signal paths and use smaller, controlled-depth vias like microvias or buried vias to reduce parasitic effects.

4. Signal Isolation

High-frequency circuits often involve both analog and digital signals, and proper isolation between these signals is critical to prevent interference. Digital signals tend to generate high levels of noise, which can interfere with sensitive analog signals. To avoid this, analog and digital components should be physically separated on the PCB, with separate ground planes if possible.

5. Power Distribution and Decoupling

Stable power distribution is necessary to ensure that high-frequency components operate without interruptions. A decoupling capacitor should be placed near the power supply pins of each active component to filter out high-frequency noise and maintain a steady voltage. Multiple capacitors of different values (e.g., 0.1µF and 10µF) can be used in parallel to filter noise over a wide frequency range.

How Do You Avoid High-Frequency Interference in PCB?

Interference is a common issue in high-frequency PCBs, but it can be managed with the right design techniques. The most effective way to avoid high-frequency interference is by using a dedicated ground plane. This plane acts as a shield, helping to reduce EMI and cross-talk between different parts of the circuit. Shielding can also be applied to individual traces or components that are more susceptible to interference.

Ground Planes

A continuous ground plane is one of the most effective ways to reduce high-frequency interference. It acts as a shield and prevents unwanted noise from penetrating the circuit. The use of multiple ground planes in multi-layer PCBs can also provide better signal grounding.

Signal Layer Segregation

Isolating analog and digital signals helps to reduce interference between them. Analog signals are more susceptible to noise, so they should be kept separate from high-frequency digital signals.

Shorter Traces

Keeping traces short and direct minimizes the potential for signal loss or delay, and helps maintain signal integrity. The longer the trace, the more likely it is to pick up unwanted noise.

Minimize Via Usage

Excessive use of vias can create points of discontinuity in the signal path, leading to reflections and noise. If vias are necessary, they should be placed strategically and sparingly.

EMI Shielding

In some cases, it may be necessary to use EMI shields around particularly sensitive areas of the PCB.

Decoupling Capacitors

Adding decoupling capacitors between the power supply and ground helps to filter out high-frequency noise and maintain a clean signal.

What is the Difference Between High-Speed and High-Frequency PCB?

Though they may seem similar, high-speed and high-frequency PCBs serve different purposes. High-speed PCBs are designed to handle fast data transmission speeds, often used in applications like computing and networking. These PCBs focus on minimizing delay and ensuring signals reach their destination without distortion.

On the other hand, high-frequency PCBs are specifically optimized for circuits operating at high frequencies, often in communication systems. The emphasis here is on maintaining signal integrity across a wide frequency range. While both high-speed and high-frequency PCBs share common design principles, such as controlled impedance and signal integrity, the challenges they face differ. High-speed PCBs focus more on data transmission, while high-frequency PCBs deal with RF signals and the challenges of maintaining signal strength at higher frequencies.

How Do You Fix Frequency Interference?

If your PCB is experiencing frequency interference, there are several methods to fix the problem. One common approach is to improve grounding by using a continuous ground plane. This helps shield signals from external noise and interference. You can also add shielding to specific components or traces that are particularly susceptible to interference.

Adding filters at key points in your circuit can help block unwanted frequencies. For instance, a low-pass filter allows only low-frequency signals to pass through, blocking higher-frequency interference. You can also reduce trace lengths and maintain clean, direct paths for high-frequency signals. Finally, proper isolation of analog and digital circuits is crucial to prevent noise from leaking into sensitive areas.

Tags:high frequency pcb, RF PCB, rogers pcb
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What is a high frequency pcb communication circuits?

Thursday, September 19th, 2024

In today’s highly digitalized and interconnected world, high frequency PCB communication circuits play a vital role. Whether in the fields of high-speed data transmission, wireless communications, satellite communications or radar systems, high frequency PCB communication circuits have demonstrated their unique advantages and importance.

What is high frequency PCB?

high frequency PCB communication circuits refer to printed circuit board circuits that operate in a higher frequency range, usually between hundreds of MHz and tens of GHz. Compared with traditional low-frequency PCB circuits, high frequency PCB communication circuits have the following significant characteristics:

What is a high frequency pcb communication circuits?

1. High-speed signal transmission: high frequency PCB communication circuits can support high-speed data transmission and meet the needs of modern communication systems for large data volumes and high bandwidth.

2. Low signal loss: At high frequencies, signal transmission loss will increase significantly. Therefore, high frequency PCB communication circuits require special materials and design techniques to reduce signal loss and improve signal transmission quality.

3. Good electromagnetic compatibility: high frequency signals are prone to electromagnetic interference and affect surrounding electronic equipment. high frequency PCB communication circuits need to have good electromagnetic compatibility to ensure their stable operation in complex electromagnetic environments.

4. Miniaturization and lightweight: As electronic equipment continues to be miniaturized and lightweight, high frequency PCB communication circuits also need to develop in the direction of miniaturization and lightweight. This requires the use of high-density integration technology and advanced manufacturing processes to reduce the size and weight of circuit boards.

How do you make high frequency PCB?

Making a high frequency PCB (printed circuit board) involves several key steps to ensure the stability and reliability of signal transmission, taking into account the characteristics of high frequency signals.

1. ‌Material selection and preparation‌:

Choose a substrate material with low dielectric constant and low dielectric loss to ensure the stability and reliability of signal transmission.

The substrate material requires a conductive layer with good electrical conductivity and corrosion resistance.

Auxiliary materials such as membrane materials, filling materials, etc. also need to be carefully selected and prepared.

2. ‌Design, drawing production, etching, and laminating‌:

Carry out circuit design and layout planning based on design requirements and signal transmission characteristics.

Make PCB drawings and convert circuit layout and connection lines into circuit diagrams on the drawings.

The circuit diagram on the drawing is transferred to the substrate through photolithography technology and etched to form a conductive layer.

The film sticking process attaches the protective layer and copper clad layer to the conductive layer to protect the circuit and improve the mechanical strength.

3. ‌Welding and assembly process‌:

Surface mount technology is widely used in high frequency PCB welding, and SMT components are accurately welded to PCBs through methods such as hot air or reflow soldering.

Manual soldering technology also plays an important role in the assembly of high frequency PCBs. Plug-in components and connecting lines are connected by manual soldering.

4. ‌Special considerations for high frequency PCBs‌:

high frequency circuit design requires the adoption of special design principles and strategies, such as transmission line theory and matching, short and straight wiring strategies, impedance control and matching, decoupling and bypass, etc., to ensure signal quality and system reliability.

Adopt strategies such as multi-layer board design, straight wiring, shortening signal leads, reducing inter-layer alternation, being wary of crosstalk, increasing decoupling capacitors, isolating digital and analog ground wires, avoiding loops, ensuring impedance matching, and preventing ground bounce to improve Performance and reliability of high frequency circuits.

Through the above steps, a high-quality PCB that meets high frequency signal transmission requirements can be produced to ensure stable signal transmission and reliable operation of the system.

What are some important considerations when designing a PCB layout for high frequency circuits?

Designing high frequency PCB communication circuits faces many challenges and requires comprehensive consideration of circuit performance, electromagnetic compatibility, reliability and other aspects. Here are some of the major design challenges:

1. Signal integrity: At high frequencies, signal transmission will be affected by reflection, crosstalk, attenuation and other factors, leading to signal integrity problems.

2. Electromagnetic compatibility: As mentioned before, high frequency signals are prone to electromagnetic interference, so high frequency PCB communication circuits need to have good electromagnetic compatibility.

3. Thermal management: high frequency PCB communication circuits will generate a large amount of heat when working. If the heat cannot be dissipated in a timely and effective manner, the performance of the circuit will be reduced or even damaged.

4. Reliability: high frequency PCB communication circuits usually work in harsh environments, such as high temperature, high humidity, vibration, etc.

What is the highest frequency used for communication?

The highest frequency used for communication is 450GHz. ‌

This frequency range was finally approved at the 2019 World Radiocommunication Conference (WRC-19) and involves the 275 GHz-296 GHz, 306 GHz-313 GHz, 318 GHz-333 GHz and 356 GHz-450 GHz frequency bands, for a total of 137 GHz Bandwidth resources.

These frequency bands are used without restrictions for fixed and land mobile service applications. This is the first time that ITU has clarified the spectrum resources available for terrestrial active radio service applications in the terahertz frequency band above 275 GHz, and raised the upper limit of available spectrum resources for active services to 450 GHz, providing basic resource guarantee for the development and application of the global terahertz communication industry. .

Which frequency is best for communication?

For WiFi communication, choosing which frequency band is best depends on the user’s specific needs and network environment.

The 2.4GHz frequency band is suitable for use in home and office environments because of its strong signal penetration and low interference, especially when wide coverage and signal stability are required.

Because of its high-speed transmission capabilities, the 5GHz band is suitable for scenarios that require large traffic transmission, such as high-definition videos and online games, because it provides faster network speeds and more stable transmission rates.

In satellite communications, different frequency bands have their own advantages and applicable scenarios.

Although the C-band has low frequency and low gain, its rain attenuation is much smaller than that of the Ku-band and even smaller than the Ka-band. It is suitable for businesses that have strict requirements on communication quality, such as television and radio.

The Ku band has high frequency, high gain, small antenna size, and is easy to install. It is especially suitable for mobile emergency communication services such as communication in motion and communication in silence, and satellite news collection SNG and DTH services.

When selecting the wireless communication frequency band bandwidth.

The 20MHz frequency band bandwidth is suitable for small to medium-sized wireless networks due to its stable signal and wide coverage.

Although the data transmission rate of the 40MHz band bandwidth is relatively high, the signal penetration capability is weak and is suitable for dense environments or application scenarios that require higher transmission rates.

What are examples of high frequency equipment?

high frequency PCB communication circuits are widely used in various fields. The following are some of the main application fields:

1. Wireless communication: high frequency PCB communication circuits are the core components of wireless communication systems, such as mobile phones, base stations, satellite communications, etc.

2. Radar system: high frequency PCB communication circuits are also widely used in radar systems, such as radar antennas, signal processing, transmitters and receivers, etc.

3. Satellite communications: Satellite communications require the use of high frequency PCB communication circuits to transmit and receive signals.

4. High-speed data transmission: In the field of high-speed data transmission, high frequency PCB communication circuits can achieve data transmission rates of tens of Gbps per second to meet the needs of large data volume and high bandwidth.

In short, high frequency PCB communication circuits are an important part of modern communication technology and have broad application prospects and development potential. With the continuous advancement of technology.

Tags:PCB, PCBA, SMT
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