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Differences Guide, ceramic antenna vs pcb antenna
Thursday, September 12th, 2024

Antenna plays a vital role in wireless devices, and ceramic antenna and PCB antenna have their own characteristics. Ceramic antenna is small, low cost, easy to use, and has good anti-interference, waterproof, dustproof, lightning protection and other properties. PCB antenna is an important RF component and is also indispensable in wireless communication equipment.

What is a ceramic antenna?

Ceramic antenna is a miniaturized antenna suitable for Bluetooth devices. It uses a ceramic shell and has anti-interference, lightning resistance, waterproof and dustproof capabilities.

Differences Guide, ceramic antenna vs pcb antenna

It mainly uses GPS satellites to achieve navigation and positioning. It is divided into block ceramic antenna and multilayer ceramic antenna. Block antenna uses high temperature to sinter the entire ceramic body once and then prints the metal part of the antenna on the surface of the ceramic block.

Multilayer antenna firing uses low temperature co-firing to stack and align multiple layers of ceramics and then sinter at high temperature. The metal conductor of the antenna can be printed on each layer of ceramic dielectric layer according to design requirements, which can effectively reduce the size of the antenna and achieve the purpose of hiding the antenna.

Since the dielectric constant of ceramic itself is higher than that of PCB circuit board, and the dielectric loss is also smaller than that of PCB circuit board, the use of ceramic antenna can effectively reduce the size of antenna while ensuring antenna performance, and is more suitable for use in low-power Bluetooth modules.

Ceramic antennas are widely used in Bluetooth devices, such as Bluetooth headsets, smart watches, Bluetooth e-cigarettes, smart small appliances, smart medical, smart home products, etc. Its gain is generally 2dbi, and the reading distance can reach 2 meters. It is an industrial-grade product for indoor use, with an external size of 78mm×78mm×5mm.

What is a PCB antenna?

PCB antenna refers to the part on the PCB used for wireless reception and transmission.

Differences Guide, ceramic antenna vs pcb antenna

When transmitting, it converts the high-frequency current of the transmitter into electromagnetic waves in space; when receiving, it converts the electromagnetic waves intercepted from space into high-frequency current and sends them to the receiver. Usually set on Bluetooth or wireless transmission modules. For example, PCB antennas play an important role in ZM602 series Wi-Fi modules, achieving performance indicators such as gain > 2.0dBi, working bandwidth > 150MHz, S11 within bandwidth < -10dB, input impedance 50Ω, and standing wave ratio < 2.0.

The most common structure of PCB antenna is the inverted F antenna. The length of the antenna needs to meet the quarter free space wavelength of the transmitted signal. In actual design, it is often designed as a serpentine trace to reduce the occupied space.

The advantages of PCB antennas are small space occupation, low cost, no need to assemble the antenna separately, not easy to touch and damage, and convenient assembly of the whole machine; the disadvantages are that it is difficult to make a single antenna field round, the insertion loss is high, the efficiency is relatively low, and it is easy to be interfered by the motherboard.

What are the differences between ceramic antennas and PCB antennas?

  • (I) Difference in dielectric constant:

In terms of dielectric constant, ceramic antennas have obvious advantages. The dielectric constant of ceramic antennas is higher than that of PCB antennas, which enables ceramic antennas to gather and transmit electromagnetic wave signals more effectively.

The higher dielectric constant allows ceramic antennas to be more compact in design, effectively reducing the size of the antenna. In some miniaturized Bluetooth devices, such as smart watches and Bluetooth headsets, the high dielectric constant characteristics of ceramic antennas can meet the strict space requirements of the device, leaving more design space for other electronic components.

  • (II) Difference in dielectric loss:

Ceramic dielectrics also perform well in dielectric loss. Compared with PCB circuit boards, ceramic dielectrics have lower dielectric losses, which means that in low-power Bluetooth modules, ceramic antennas can transmit signals more efficiently while reducing energy loss.

The use of ceramic antennas in low-power Bluetooth modules is significantly better than PCB antennas, which can effectively extend the battery life of Bluetooth devices. The low dielectric loss characteristics of ceramic antennas can ensure that the device still maintains stable signal transmission when running for a long time.

  • (III) Difference in size and effect:

The size of ceramic antennas is generally comparable to that of 1210 packages. In practical applications, antennas of this size can well meet the design requirements of various miniaturized electronic devices. At the same time, the effect of ceramic antennas is stronger than that of PCB antennas. This is because the special structure and material properties of ceramic antennas make them more efficient and stable in signal reception and transmission.

In some Bluetooth audio devices with high signal quality requirements, ceramic antennas can provide clearer and more stable audio transmission effects, reducing signal interference and distortion. However, due to the limitations of its design and manufacturing, PCB antennas are often not as good as ceramic antennas in signal transmission effects.

What are the benefits of ceramic antennas?

Advantages:

Ceramic antennas take up little space, which makes them very advantageous in miniaturized electronic devices. For example, in wearable devices such as smart watches and Bluetooth headsets, more space can be left for other electronic components, making the design of the device more compact.

Its performance is good, and it can effectively reduce power consumption while ensuring signal strength. For example, in some low-power Bluetooth devices, ceramic antennas can extend the battery life of the device.

Ceramic antennas can also effectively improve the integration of the motherboard, reduce the antenna’s restrictions on ID, and introduce the design in the early stage of product design, so that it can be better integrated with the motherboard and improve the overall performance of the product.

Disadvantages:

The bandwidth of ceramic antennas is narrow, and it is difficult to achieve multi-band. This means that in some application scenarios that need to support multiple frequency bands at the same time, ceramic antennas may not meet the needs.

In some multifunctional wireless communication devices, it is necessary to support multiple frequency bands such as Bluetooth, Wi-Fi, GPS, etc. at the same time. Ceramic antennas may need to be used in conjunction with other antennas, which increases the complexity and cost of the design.

What are the benefits of PCB antennas?

Advantages:

PCB antennas take up less space and are especially suitable for electronic devices that have strict space requirements. For example, in some ultra-thin smartphones and laptops, PCB antennas can be directly integrated on the circuit board without taking up additional space.

Low cost is also an important advantage of PCB antennas. Since it can be made directly on the PCB board, no additional assembly process is required, which reduces production costs.

PCB antennas do not need to be assembled separately, are not easily damaged by touch, and are easy to assemble as a whole, which improves production efficiency.

Disadvantages:

It is difficult to make a single antenna field of a PCB antenna round, which will affect the coverage and stability of the signal.

High insertion loss means that the signal is lost more during transmission, reducing the strength and quality of the signal.

PCB antennas are easily interfered by other electronic components on the motherboard, which requires careful consideration and optimization during design and layout to reduce the impact of interference on the signal.

Application scenarios and selection of ceramic antennas and PCB antennas

According to different needs, PCB onboard antennas can be selected in environments without metal coverage, IPEX external antennas can be selected with metal coverage, and ceramic antennas can be selected if the space is not large.

Differences Guide, ceramic antenna vs pcb antenna

In actual applications, different usage environments and needs determine the choice of antenna type. If it is in an environment without metal coverage, PCB onboard antennas are an economical and convenient choice. PCB onboard antennas have the advantages of low cost, no need to assemble antennas separately, not easy to touch and damage, and easy assembly.

When in an environment with metal coverage, IPEX external antennas are more suitable. IPEX external antennas have good directional directivity, high efficiency, strong anti-interference ability, and can stay away from interference on the motherboard. Although it is costly and difficult to assemble, it can ensure stable signal transmission in a metal environment.

If the PCB board space is not large, ceramic antennas are an ideal choice. Ceramic antennas can effectively reduce the size of the antenna to achieve the purpose of hiding the antenna. At the same time, since the dielectric constant of ceramic itself is higher than that of PCB circuit board, it can better adapt to the design requirements of small space while ensuring performance.

In summary, when choosing an antenna, we need to comprehensively consider the specific use environment and needs and choose the most suitable antenna type to ensure that the device can achieve stable and efficient wireless communication.

Conclusion:

Ceramic antennas and PCB antennas each have their own characteristics and advantages. Understanding their differences will help you make the most appropriate decision when choosing wireless devices.

BEST Technology has many years of experience in manufacturing ceramic circuit boards. Its products can provide stable and reliable signal transmission in the fields of GPS navigation, Bluetooth devices, wireless LAN, and the Internet of Things.

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Ceramic PCB Manufacturers: Development History and Future
Thursday, September 12th, 2024

In today’s era of rapid technological development, ceramic PCBs have emerged in many fields with their excellent performance and unique advantages. Behind ceramic PCBs are a group of professional ceramic PCB manufacturers who are promoting the progress and development of the electronics industry with their unremitting efforts and superb skills.

Ceramic PCB Manufacturers: Development History and Future

Reasons for the development of ceramic pcb manufacturer

  • (I) Expansion of market size

In recent years, the ceramic PCB market size has shown a growing trend. According to statistics, the global ceramic substrate market size reached US$1.13 billion in 2022 and is expected to reach US$4.15 billion in 2029, with a compound annual growth rate (CAGR) of 18.23%.

In the Chinese market, the market size of China’s ceramic circuit board industry is about 2.399 billion yuan by 2023, with a CAGR of 19.1% from 2015 to 2023.

In terms of output, China’s ceramic substrate output accounted for about 35.9% of the world’s total in 2022, and is expected to reach 54.9% in 2029. Europe is the second largest market region, with a share of 33% in 2022 and an estimated 21.99% in 2029. Japan, Southeast Asia, South Korea and Taiwan are also important production areas.

  • (II) Promotion of technological progress

Technological innovation plays a vital role in promoting ceramic PCB manufacturers. In terms of the application of new materials, the research and development of new ceramic materials provides more options for ceramic PCBs.

In terms of production process improvements, ceramic PCB manufacturing technology includes steps such as pressing, welding, metallization and printing. By optimizing process parameters and process control, higher quality ceramic PCBs can be obtained.

The application of laser cutting and punching technology in the production of ceramic circuit boards improves processing accuracy and speed, and meets the requirements of small size and high density of electronic devices and semiconductor components.

What are the well-known ceramic pcb manufacturers?

BEST Technology:

  • Product features: A domestic manufacturer that focuses on the R&D and production of large, medium and small batches of ceramic circuit boards and prototypes, serving high-tech enterprises and scientific research institutions at home and abroad. Mainly focused on MCPCB, FR4 PCB, Ceramic PCB, Special PCB such as Heavy Copper (up to 20 OZ), and PCB assembly service.
  • Market share: Ranked among the top domestic ceramic substrate manufacturers, with a monthly production capacity of 100,000 sheets.
Ceramic PCB Manufacturers: Development History and Future
  • Technical advantages: Over 18 years of experience in the PCB industry. Proficient in DPC, AMB, DBC, LTCC, HTCC production processes, fully passed TS16949, ISO9001, ISO14001 certification. With the aim of “zero quality defects”, we provide high-quality products and services, with short delivery time and stable quality for ceramic boards.

What are the production processes of ceramic PCBs?

(I) Laser processing technology

Lasers play a vital role in ceramic PCB processing. Laser drilling has the advantages of high precision and high efficiency, and can meet the requirements of electronic devices and semiconductor components for micropore diameters ranging from 0.05 to 0.2 mm.

Ceramic PCB Manufacturers: Development History and Future

Laser cutting also has many advantages. First, it has high precision, fast speed, narrow slits, small heat-affected zone, and smooth cut surfaces without burrs.

(II) Other molding processes

  • Tape casting: The advantage is that it can produce large-area, thin-thickness and uniform ceramic substrates, which are suitable for large-scale production. However, tape casting has high requirements for equipment, and the viscosity and fluidity of the slurry need to be controlled during the process.
  • Powder pressing: Simple operation and low cost. However, the pressed ceramic substrate may have problems of uneven density and high porosity, which affect its performance.
  • Extrusion molding: Suitable for the production of long strip or tubular ceramic substrates with high production efficiency. However, the shape of the extruded ceramic substrate is relatively simple and the dimensional accuracy is relatively low.

(III) LAM process advantages

The LAM process has significant advantages in ceramic PCB manufacturing.

First, the bonding strength between the metal layer and the ceramic is high, up to 45 MPa (the strength of the ceramic sheet is greater than 1mm thick), the conductivity is good, and the heat is small when the current passes through.

Secondly, the thermal conductivity is high. The thermal conductivity of alumina ceramics is 20-35 W/mk, and the thermal conductivity of aluminum nitride ceramics is 170-230 W/mk, which is much higher than the thermal conductivity of the traditional aluminum-based circuit board MCPCB of 1 to 2 W/mk.

In addition, the insulation is good, and the breakdown voltage is as high as 20KV/mm. The thickness of the conductive layer can be customized arbitrarily within the range of 1μm-1mm, and the current can be designed according to the circuit module. The thicker the copper layer, the greater the current passing through.

The high-frequency loss is small, and high-frequency circuits can be designed and assembled; the dielectric constant is very small, and the line/spacing (L/S) resolution can reach 20μm, thus achieving short and thin devices.

It does not contain organic components, is resistant to cosmic rays, and has high reliability and long service life in the aerospace field; the copper layer does not contain an oxide layer and can be used for a long time in a reducing atmosphere.

What are the characteristics of ceramic pcb manufacturer?

  • (I) Obvious technical advantages

Ceramic PCB manufacturers have significant technical advantages. First of all, high thermal conductivity is one of the outstanding features of ceramic PCB. This enables ceramic PCB to effectively dissipate heat in high-power electronic equipment and improve the reliability and stability of the equipment.

Low thermal expansion coefficient is also an important technical feature of ceramic PCB. Its thermal expansion coefficient is close to that of silicon chips, which can save labor and materials and reduce costs. At the same time, when the temperature changes, it can reduce the stress caused by thermal expansion and contraction, and ensure the stability of the circuit.

High surface hardness makes ceramic PCB more durable and longer service life. Compared with traditional PCBs, ceramic PCBs are not easily scratched and worn, and can maintain good performance in harsh environments.

  • (II) Adapt to a variety of fields

Ceramic PCB has a wide range of application advantages in many fields.

In the field of LED lighting, the excellent heat dissipation performance of ceramic PCB can effectively reduce the temperature of LED chips, improve luminous efficiency and life. At the same time, ceramic PCB has good insulation and high pressure resistance, which ensures personal safety and equipment protection.

Ceramic PCB Manufacturers: Development History and Future

In the semiconductor field, the high thermal conductivity of ceramic PCB can quickly conduct heat away from semiconductor chips and improve cooling efficiency. In addition, the low thermal expansion coefficient and high surface hardness of ceramic PCB can adapt to the working environment of semiconductor coolers at different temperatures and ensure its stable performance.

  • (III) Clear market structure

At present, the ceramic PCB market presents a clear competitive pattern. In the global market, a few internationally renowned companies occupy a large market share. These companies have advanced technology and rich experience, and have strong strength in material research and development, production technology and market expansion.

The development opportunities for domestic manufacturers lie in the huge demand and policy support of the domestic market. With the rapid development of strategic emerging industries such as 5G communications, new energy vehicles, and high-end manufacturing, the market demand for ceramic PCBs will continue to grow.

At the same time, domestic manufacturers are also facing some challenges. On the one hand, international competitors have strong technical strength and brand influence, and domestic manufacturers need to increase investment in technological innovation and brand building. On the other hand, the production cost of ceramic PCBs is high, and domestic manufacturers need to continuously optimize production processes, reduce costs, and improve the cost performance of products.

What is the market prospect of ceramic PCB manufacturers?

(I) Strong policy support

As the core material of passive electronic components, electronic ceramics are an important material basis for electronic information technology.

In order to promote the development of the electronic ceramics industry, the state has issued a series of policies, such as “Opinions on Deepening the Reform of the Management System of the Electronic and Electrical Industry”, “The 14th Five-Year Plan for the Development of the Digital Economy”, “The 14th Five-Year Plan for the Development of Intelligent Manufacturing”, and “The 14th Five-Year Plan for the Development of China’s Electronic Components Industry”.

At the same time, the state has also strengthened quality management supervision of the PCB board industry, formulated strict quality standards and testing requirements, and supported enterprises to carry out ISO quality management system certification to improve product quality and competitiveness.

In terms of environmental protection, the Chinese government has adopted strict environmental protection policies to regulate the production and processing processes of the PCB board industry, restrict the use of hazardous substances, promote the recycling of resources and promote clean production, laying a solid policy foundation for the development of ceramic PCB manufacturers.

(II) Market demand growth

With the rapid development of downstream application fields such as new energy vehicles and 5G communications, the market demand for ceramic PCBs has shown a strong growth trend.

In the field of new energy vehicles, a large number of high-voltage and high-power devices contained in new energy vehicles, such as IGBT and MOSFET, have high requirements for heat dissipation.

Ceramic substrates have a good heat dissipation effect, which can dissipate the high heat in the power system in time to ensure the normal operation of large power loads, further increasing the use of PCBs for new energy vehicles.

In the field of 5G communications, the advent of the 5G era has made signal base stations more dense, with the number reaching 100 times that of 4G, including a series of software and hardware upgrades brought about by the iterative upgrade of terminal receiving devices.

As hardware for high-frequency transmission, the core of it is the circuit board. At present, the circuit board with the smallest transmission loss is the ceramic circuit board, which has long been widely used in the communications industry.

In the future, entering 2020, 5G will be expected to be commercially available. With the development of the new era of 5G, it is expected that by 2030, the domestic direct economic output will reach 6.3 trillion, and 8 million jobs will be created.

(III) Future development trends

  • Technological innovation: Ceramic PCB manufacturers will continue to increase their technological innovation efforts, develop new ceramic materials and advanced production processes.
  • Product upgrade: With the continuous improvement of PCB performance requirements in downstream application fields, ceramic PCB manufacturers will launch higher-end and more personalized products.
  • Market expansion: Ceramic PCB manufacturers will actively expand domestic and foreign markets, strengthen cooperation with downstream customers, and increase the market share of products. In the international market, domestic manufacturers can enhance brand awareness and influence and expand overseas markets by participating in international exhibitions and cooperating with internationally renowned companies.

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What is ceramic material for PCB?
Monday, September 9th, 2024

The top ten commonly used ceramic materials:
Common ceramic circuit board materials mainly include 96 aluminum oxide (Al2O3), 99 aluminum oxide (Al2O3), zirconium oxide (ZrO2), aluminum nitride (AlN), silicon carbide (SiC), silicon nitride (Si3N4), piezoelectric ceramics, diamond, sapphire, toughened ceramics (ZTA).

Ceramic PCB Material

Ceramic PCB Material

Uncommon ceramic circuit board materials
Uncommon ceramic circuit board materials mainly include silicon dioxide (SiO2), titanium zirconium oxide (ZrTiO4), boron nitride (BN), boron carbide (B4C), magnesium oxide (MgO), iron oxide (Fe2O3), cerium oxide (CeO2), silicon nitride (Si3N4), yttrium zirconium oxide (Y2O3-ZrO2), yttrium aluminum oxide (Y3Al5O12), titanium oxide (TiO2), silicon zirconium oxide (ZrSiO4), tungsten carbide (WC), titanium carbide (TiC), titanium nitride (TiN), silicon nitride (SiOxNy).

Ceramic PCB
Ceramic PCB
Ceramic PCB
Ceramic PCB

Alumina ceramic materials

Alumina ceramic materials

1). 99 alumina
99 alumina refers to alumina materials with a purity of 99% or higher. It is usually made of chemically pure alumina or high-purity alumina as raw materials, and is made through multiple processes such as high-temperature calcination, crushing, molding, and sintering. Compared with 96 alumina, 99 alumina has higher chemical purity, density and hardness, as well as better high-temperature stability and corrosion resistance.


99 alumina is widely used in electronics, machinery, chemical industry, aerospace and other fields. In the electronics field, 99 alumina is usually used to manufacture high-frequency electronic components, integrated circuit packaging, dielectrics and other devices; in the mechanical field, 99 alumina is mainly used to manufacture high-hardness ceramic tools, bearing balls, etc.; in the chemical field, 99 alumina can be used to manufacture catalysts and adsorbents; in the aerospace field, 99 alumina is often used to manufacture high-temperature structural parts, aircraft engine parts, etc.

2). 96 alumina
96 alumina, also known as industrial alumina or α-alumina, is a high-purity ceramic material. Its chemical formula is Al2O3, which belongs to oxide ceramics. 96 alumina is usually made of alumina powder through pressing, molding, sintering and other processes. The “96” here means that its aluminum oxide purity reaches more than 96%. 96 alumina has the characteristics of high hardness, high strength, high wear resistance, and good high temperature stability. It is widely used in the manufacture of ceramic products, refractory materials, abrasives, electronic devices and other fields.

Advantages of 99 alumina substrate:

High purity, usually reaching a purity level of 99.99%, excellent electrical properties, high dielectric constant and low dielectric loss.
Good high temperature stability, can work stably in high temperature environment, and can usually withstand temperatures up to 1700℃.
High mechanical strength, high strength, high hardness, not easy to be damaged, and can withstand greater force and pressure.
It has excellent corrosion resistance, is not corroded by most chemical substances, and is suitable for chemical media such as acids and alkalis.
It can be prepared into a thinner substrate, which is conducive to the preparation of microelectronic devices.

Advantages of 96 alumina substrate:
Cheaper than 99 alumina substrate, the cost is relatively low.
It is easier to process than 99 alumina substrate, and can be processed by cutting, drilling and other processing, which is convenient for preparing substrates of various shapes.
In some low-temperature and low-electric field strength applications, the dielectric constant and dielectric loss are lower than those of 99 alumina substrate, and it has better signal transmission performance.

Disadvantages:
Compared with 99 alumina substrate, 96 alumina substrate has lower purity, higher dielectric constant and dielectric loss.
It is prone to brittle fracture in high temperature environment.

Alumina ceramic application industry
99 alumina substrate: suitable for high-power LED, high-voltage integrated circuit, high-temperature sensor, high-frequency electronic components and other fields.
96 alumina substrate: suitable for low-power electronic components, sensors, capacitors, micro relays, microwave components and other fields.

Aluminum nitride ceramic material (AlN)

Aluminum nitride ceramic material (AlN)

Aluminum nitride ceramic is a high-performance ceramic material made of aluminum nitride powder sintered at high temperature. Its main component is aluminum nitride (AlN), which has the characteristics of high melting point (about 2800℃), hardness (9.0 to 9.5Mohs), strength and thermal conductivity. At the same time, it also has good insulation performance, chemical stability and high temperature resistance. Due to these characteristics, Sliton aluminum nitride ceramic circuit boards are widely used in microelectronics, optoelectronics, power electronics, aerospace and other fields.

Advantages

  1. High hardness: The hardness of aluminum nitride is close to that of diamond, which is more than 3 times that of traditional alumina. It can be used to make high-strength mechanical parts.
  2. High strength: Aluminum nitride has high strength, good wear resistance and corrosion resistance, and can be used to make high-load, high-wear and corrosion-resistant parts.
  3. High thermal conductivity: The thermal conductivity of aluminum nitride is very high, reaching 170-230W/(m·K), which is more than 4 times that of traditional aluminum oxide. It can be used to make high-power, high-frequency RF components.
  4. High insulation: The dielectric constant of aluminum nitride is low, about 1/3 of that of traditional aluminum oxide, and can be used to make high-frequency, high-precision microwave components.
  5. Anti-oxidation: Aluminum nitride has good anti-oxidation properties at high temperatures and can be used to make parts in high-temperature environments.

Application of aluminum nitride ceramics
Widely used in semiconductors, aerospace, electronics, military and other fields. For example, it is used to make high-frequency RF devices, microwave components, electronic ceramics, thermistors, high-temperature sensors, etc.

Zirconia ceramic material (ZrO2)

Zirconium oxide ceramic material is a ceramic material with high strength, high hardness, high temperature tolerance, corrosion resistance and good insulation performance. Its chemical formula is ZrO2, and it is usually stabilized to improve the stability and wear resistance of its lattice. Zirconia ceramic material has the characteristics of low thermal conductivity and high melting point, so it is widely used in industrial fields with strict requirements such as high temperature, high pressure, high speed and high precision, such as aerospace, electronics, medical and energy.
Advantages

  1. High hardness: The hardness of zirconia ceramics is very high, usually reaching HRA90 or above, even up to HRA95, which is more than 10 times that of steel.
  2. High strength: Zirconia ceramics have extremely high strength, which can reach 900MPa at room temperature, and can still maintain high strength at high temperature.
  3. Good wear resistance: Zirconia ceramics have high surface flatness and high hardness, so they have good wear resistance.
  4. Good corrosion resistance: Zirconia ceramics are chemically inert and not easily corroded by chemicals such as acids and alkalis, and can operate stably for a long time in harsh environments.
  5. Excellent insulation performance: Zirconia ceramics have excellent insulation performance and can be used for high-voltage insulation materials.
  6. Good high-temperature stability: Zirconia ceramics have extremely high melting points and high-temperature stability, and can be used for a long time in high-temperature environments.

Application of Zirconia Ceramics
Widely used in high-end manufacturing, electronics, aerospace, medical equipment, chemical industry and other fields, such as abrasives, high-temperature structures, pneumatic components, medical equipment, sensors, capacitors, etc.

Silicon carbide ceramic material (SiC)

Silicon carbide is a compound with the chemical formula SiC, which is composed of two elements: silicon and carbon. It is a ceramic material that is resistant to high temperature, corrosion, and extremely hard. It is also an industrial material widely used in extreme environments such as high temperature, high frequency, and high pressure. Silicon carbide has excellent mechanical, electromagnetic, and thermal properties, and is therefore widely used in semiconductors, disks, aerospace, and other fields. In addition, silicon carbide has good semiconductor properties and is also widely used in power electronics, optoelectronics, and other fields.
Advantages

  1. High hardness: The hardness of silicon carbide material is 5 times higher than that of steel and 3 times higher than that of aluminum.
  2. High strength: The strength of silicon carbide material is high, and the tensile strength can reach more than 400MPa.
  3. High temperature resistance: Silicon carbide material has a high melting point and can withstand high temperature thermal shock. The general use temperature is 1200℃-1600℃.
  4. Good oxidation resistance: Silicon carbide material can resist high temperature oxidation corrosion and can be used in air.
  5. Good wear resistance: Silicon carbide material has high hardness, low friction coefficient and good wear resistance.
  6. Good thermal conductivity: Silicon carbide material has excellent thermal conductivity, which is 2-3 times that of metal and can effectively dissipate heat.
  7. Good chemical stability: Silicon carbide material has good chemical stability and will not be corroded by acid, alkali, etc.

Silicon carbide ceramic PCB application
Widely used in high temperature, high pressure, high speed, high load, corrosion resistance and other fields, such as power, electronics, machinery, aviation, metallurgy and other industries.

Silicon nitride ceramic material (Si3N4)

Silicon nitride ceramic material is a high-temperature ceramic material based on nitrogen and silicon elements. It has excellent properties such as high strength, high hardness, high wear resistance, high temperature resistance, oxidation resistance, and corrosion resistance. Its chemical stability is extremely high and is not easily corroded by acids, alkalis, solvents, etc. The hardness of silicon nitride ceramic materials is comparable to that of diamond, or even higher, reaching about 24GPa. It is harder and less prone to wear than ordinary ceramic materials. At the same time, it has good insulation properties and thermal stability, and can work stably for a long time in high temperature environments.

Advantages of silicon nitride ceramic PCB materials

  1. High hardness: The hardness of silicon nitride ceramic materials is close to that of diamond, which can reach more than 30GPa.
  2. High strength: The bending strength of silicon nitride ceramic materials is high, which can reach more than 1000MPa.
  3. High wear resistance: Silicon nitride ceramic materials have good wear resistance and can be used to manufacture high-speed bearings and cutting tools, etc.
  4. High temperature resistance: Silicon nitride ceramic materials have high high temperature resistance and can be used in high temperature environments above 1000°C.
  5. Corrosion resistance: Silicon nitride ceramic materials have excellent corrosion resistance and can be used in some acidic and alkaline working environments.
  6. Lightweight: Silicon nitride ceramic materials are lighter than steel and can be used in lightweight design.

Silicon nitride ceramic PCB applications
Widely used in aerospace, optoelectronics, electronics, semiconductors, machinery and other fields.

Piezoelectric ceramic materials

Piezoelectric ceramic materials are ceramic materials with piezoelectric effect, which can deform under external electric field or mechanical stress, and generate electric charge when deformed. They are usually made of materials such as barium lead oxide (Pb(Zr,Ti)O3) or niobium lead oxide (Pb(Mg1/3Nb2/3)O3-PbTiO3) as the main components and sintered.

Advantages

  1. Piezoelectric effect: It can convert mechanical stress into electrical signals, or convert electrical signals into mechanical motion. This effect makes piezoelectric ceramic materials widely used in sensors, actuators, acoustic wave devices and other fields.
  2. Dielectric properties: With high dielectric constant and low dielectric loss, piezoelectric ceramic materials are used as capacitors, filters, etc. in electronic components.
  3. Mechanical properties: With high hardness, strength and wear resistance, piezoelectric ceramic materials are used in mechanical engineering.
  4. Thermal stability: With good thermal stability and high temperature resistance, it can work stably in high temperature environment.
    Piezoelectric ceramic PCB applications
    Widely used in sensors, actuators, acoustic wave devices, electronic components, mechanical engineering and other fields.

Diamond ceramic material

Diamond ceramic material is a new type of material made by sintering diamond powder and ceramic as raw materials at high temperature and high pressure. Because diamond has extremely high hardness, reaching Mohs hardness level 10, and has excellent wear resistance, corrosion resistance and high temperature oxidation resistance, diamond ceramic material has extremely high physical and chemical properties.

Advantages of diamond ceramic PCB material

  1. Extremely high hardness and strength, more wear-resistant, scratch-resistant and impact-resistant than ordinary ceramic materials;
  2. Excellent corrosion resistance, able to resist corrosive media such as strong acids and alkalis;
  3. Excellent high-temperature oxidation resistance, can be used for a long time at high temperature without damage;
  4. Excellent thermal conductivity and insulation performance;
  5. Easy to process into ceramic products of various shapes and sizes.

Application of diamond ceramic PCB
Diamond ceramic materials are widely used in high-end machinery, electronics, optics, medical and chemical fields, such as bearings, nozzles, cutting tools, hydraulic cylinders, electrical insulation parts, laser parts, etc.

Sapphire ceramic material

Sapphire ceramic material, also known as synthetic sapphire (Synthetic Sapphire), is a man-made single crystal material with excellent properties such as high hardness, high wear resistance and high corrosion resistance. The main component of sapphire ceramic material is aluminum oxide (Al2O3), which is prepared by melting or heat treatment at high temperature.

Advantages of sapphire ceramic material:

  1. High hardness: The hardness of sapphire ceramic material is second only to diamond, and it has high wear resistance.
  2. High corrosion resistance: Sapphire ceramic material has excellent corrosion resistance and can be used stably for a long time in harsh environments such as strong acid and strong alkali.
  3. High light transmittance: Sapphire ceramic material has high light transmittance and can be used in optics, laser and other fields.

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What problems can occur in the ceramic PCB etching process?
Thursday, August 15th, 2024

Ceramic PCB etching is a process that removes copper from a ceramic PCB by chemical methods to leave only the required copper traces on the board. This allows the creation of conductive paths between the components on the ceramic PCB that make up the circuit. Etching is a key step in ceramic PCB manufacturing, which can make ceramic PCB manufacturing efficient and up to standard.

During the ceramic PCB etching process, the chemical etchant solution dissolves the unwanted copper on the ceramic PCB laminate, while the resist (usually a polymer film) protects the copper traces from being etched away. After the etching is completed, only the desired copper circuit pattern remains on the ceramic PCB.

What are the reasons for uneven etching?

The reasons for uneven etching mainly include insufficient etching solution concentration, ‌high or low temperature, ‌long or short time, ‌incomplete film stripping on the substrate surface, ‌residual film, ‌uneven thickness of copper plating on the board surface when copper is plated on the entire board, etc. ‌

Uneven etching is one of the problems often encountered in the ceramic PCB etching process, ‌and its reasons are diverse and complex. ‌First of all, the problem of etching solution is an important factor leading to uneven etching. ‌If the concentration of the etching solution is insufficient, or the temperature is too high or too low, or the etching time is too long or too short, uneven etching may occur. ‌These problems can be solved by adjusting the concentration of the etching solution, controlling the etching temperature within an appropriate range, and ensuring that the etching time is within a reasonable range.

In addition, improper surface treatment of the substrate is also one of the reasons for uneven etching. ‌If the film on the substrate surface is not completely removed, there is residual film, or the thickness of the copper plating layer on the board surface is uneven when the copper is plated on the entire board, the uniformity of etching will be affected. ‌Similarly, if the ink is stained on the transmission roller of the etching machine when the board surface is corrected or repaired with ink, uneven etching may also occur.

How to avoid uneven etching?

Optimize the design of the etching tank: ensure the uniform distribution of the etching solution in the etching tank, design a reasonable liquid flow path, and improve the fluidity and uniformity of the etching solution.

Control the etching time: Reasonably control the etching time, avoid too long or too short etching time, and ensure uniform etching.

Stabilize the concentration of etching solution: Regularly monitor and adjust the concentration of etching solution to ensure the chemical composition of etching solution is stable.

How does the residue problem affect the etching quality?

Impact on etching uniformity: The presence of residues and impurities may have a serious impact on the success of the etching process, especially at the micro-nano scale, these residues and impurities may affect the uniformity of etching, resulting in a decrease in etching quality. ‌

Affect the uniformity and stability of etching solution: Residues and impurities may affect the uniformity and stability of etching solution, thereby affecting the quality of etching process. Factors such as etching solution concentration, pressure strength, temperature, speed and environment are all key factors affecting etching quality, and the presence of residues may interfere with the normal function of these factors, resulting in a decrease in etching quality. ‌

Affect the etching performance and quality of metal materials: The type and microstructure of metal materials have a significant impact on the etching process and quality. Alloy materials containing different elements will form micro-corrosion cells during the corrosion process, affecting the dissolution rate and uniformity of the metal corrosion process. The presence of residues may aggravate this effect, resulting in a decrease in etching quality. ‌

Requires additional cleaning and processing steps: In order to remove the residue, additional cleaning and processing steps may be required, which may increase production costs and time. ‌In addition, if the residue is difficult to remove or detect, it may also affect the quality and performance of the final product.

How to avoid the problem of residue?

Use pure etching solution: Select high-purity etching solution to ensure the purity and chemical activity of the etching solution.

Increase cleaning steps: Use a multi-step cleaning process to completely remove the etching solution and etching products to ensure that the surface is clean and residue-free.

Optimize process control: Strictly control parameters such as temperature, time, and concentration during the etching process to ensure stable etching effects.

What problems will over-etching cause?

Over-etching of ceramic PCBs will cause a series of problems, including excessive circuit etching, local corrosion, galvanic corrosion, etc.

Excessive circuit etching: When the circuit design is too detailed and the copper foil used is thick, it may cause excessive circuit etching, resulting in abnormal copper foil peeling strength, thus affecting the normal function of the circuit.

Local corrosion: includes filiform corrosion, crevice corrosion, and pitting corrosion. These types of corrosion are usually caused by chemical reactions between oxygen, moisture in the air and copper, or by corrosion in these crevices due to residual materials, hardware, or areas under components on the PCB.

Galvanic corrosion: When two different metals are coupled in a corrosive electrolyte, galvanic corrosion, also known as bimetallic corrosion, occurs.

In summary, excessive etching of ceramic PCBs may not only cause abnormal circuit function, but also cause a variety of corrosion problems, thus affecting the overall performance and life of the circuit board.

How to avoid excessive etching?

Reasonably control the etching time: According to the specific process requirements, reasonably control the etching time to ensure that the etching depth is moderate.

Adjust the etching solution concentration: According to the etching requirements, adjust the etching solution concentration to control the etching rate.

Optimize process parameters: During the etching process, strictly control process parameters such as temperature and pressure to avoid excessive etching.

How does graphic distortion affect the etching effect?

The main causes of graphic distortion include poor photoresist graphics, uneven distribution of etching solution, and improper etching process control.

Poor photoresist pattern: During the photolithography process, the photoresist pattern is unclear and uneven, which will cause the circuit pattern to be distorted after etching.

Uneven distribution of etching liquid: The uneven distribution of etching liquid in the etching tank will lead to different etching rates in different areas, resulting in inconsistent line width and shape, and pattern distortion.

Improper control of etching process: Improper control of process parameters such as temperature, time, and concentration during etching will lead to unstable etching rate and pattern distortion.

How to avoid image distortion?

Improve the quality of photoresist patterns: Use high-quality photoresist to ensure clear and uniform photolithography patterns and improve pattern accuracy.

Optimize etching tank design: Design a reasonable etching tank to ensure uniform distribution of etching liquid in the tank and reduce pattern distortion.

Strictly control process parameters: During the etching process, strictly control process parameters such as temperature, time, and concentration to reduce pattern distortion.

There are many common problems in the etching process of ceramic PCBs. These problems can be effectively solved by reasonably controlling the etching time, adjusting the etching liquid concentration, and using high-precision equipment. As a professional ceramic circuit board manufacturer, BEST Technology has 18 years of experience in ceramic PCB production. It can provide high-quality products and comprehensive technical support to ensure the success of the project and the reliable operation of the equipment.

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A Comprehensive Introduction to Ceramic Circuit Board
Wednesday, August 14th, 2024

Ceramic circuit board has almost completely integrated into our daily life, and it is filled with all kinds of electronic products we use every day. However, the production of ceramic circuit board is not so simple. The ceramic material itself is brittle, and it is easy to break in the process of through-hole, which easily leads to the scrapping of the whole board. However, this problem can’t stop the development of ceramic circuit board, and its position in the electronic industry is becoming more and more important. So do you know how ceramic circuit board was born?

History of ceramic circuit board

The history of ceramic circuit boards can be traced back to the early 1950s. At that time, with the appearance of transistors, single-sided ceramic circuit boards were developed centering on the United States. The main manufacturing method in this period is the direct etching of copper foil as the mainstream. From 1953 to 1955, Japan made paper-based phenolic copper foil substrates from imported copper foil for the first time, and it was widely used in radios and other aspects. Subsequently, the emergence of professional circuit board manufacturers in Japan made the manufacturing technology of single panel progress rapidly, and ceramic circuit boards also entered the development stage. ‌

In the development process of ceramic circuit board, it has experienced the transformation from single panel to double panel. Compared with single panel, double panel has wiring on both sides, and leads on both sides are connected through guide holes, which is suitable for more complex circuits. There is more flexibility in the design of double-panel circuits, because the wiring can be carried out on both sides and staggered with each other, which increases the complexity of circuit design but also improves the performance and function of the circuit. ‌

What are the problems faced by traditional pcb circuit boards? ‌

With the increasing variety of electronic products, it is necessary to use the circuit board in assembly, but the first problem that has to be faced is the heat dissipation of the circuit board. With the continuous expansion of the application scope of VLSI and the development trend of SMT, the design of organic laminated PCB is facing the challenge of heat dissipation, which is because the thermal conductivity of most ordinary PCBs is low. However, the thermal conductivity of ceramics is 90 times that of epoxy glass fiber, and it has excellent conduction cooling effect. Moreover, components on ceramic PCB usually have a lower junction temperature than ordinary PCB.

Secondly, there is another problem that needs to be faced, which is the CTE compatibility challenge. SMT technology, which became popular in the first half of 1980s, is affecting the whole electronic assembly industry. Because SMT technology directly welds electronic components on both sides of PCB, compared with THT (through hole technology), SMT technology has lower cost, higher reliability and easier automation, which can reduce the circuit size by five-sixths. Some reliable packages, such as LCC (leadless chip carrier), are very compatible with SMT requirements, but they usually cannot withstand the challenges brought by thermal cycling. Therefore, LCC is questioned from package reliability to on-board interconnection, because the CTE (coefficient of thermal expansion) incompatibility between LCC and PCB materials leads to welding failure. Therefore, ceramic PCB came into being. Ceramic PCB can provide the best solution to overcome thermal cycle failure, because they share compatible CTE with leadless ceramic chip carriers, and have higher thermal conductivity, higher stability and inertness.

Characteristics of ceramic circuit board

Compared with the traditional pcb based on phenolic resin (FR-4), glass fiber cloth (GPP), polytetrafluoroethylene (PTFE), epoxy glass fiber and polyimide, ceramic circuit board has superior thermal conductivity, high mechanical strength and durability, excellent electrical insulation and high dielectric strength.

With the development of multi-function, miniaturization, speediness and large-scale electronic equipment, stricter requirements are put forward for the durability, thermal conductivity, dielectric constant and electrical insulation of ceramic PCB. It can be predicted that the demand for ceramic PCB with aluminum nitride, alumina and glass ceramics as substrate materials will be increasing, and the market for ceramic circuit boards will be wider and wider.

What are the types of ceramic circuit boards?

At present, the common types of ceramic circuit boards are HTCC, LTCC, DBC, DPC, AMB, TFC (thin film ceramic board) and TPC (thick film ceramic board).

1. HTCC is an early developed technology. However, due to the high sintering temperature (1300~1600℃), the selection of electrode materials is limited, and the manufacturing cost is relatively expensive, which makes the development of HTCC slow.

2. Although LTCC reduces the co-firing temperature to about 850℃, it has the disadvantage that dimensional accuracy and product strength are not easy to control.

3. DBC combines Al2O3 with Cu plate by high temperature heating. Its technical bottleneck is that it is not easy to solve the problem of micro-pores between Al2O3 and Cu plate, which makes the mass production energy and yield of this product greatly challenged.

4. DPC technology is to deposit Cu on Al2O3 substrate by direct copper plating technology. Its technology combines material and thin film technology, and its products are the most commonly used ceramic heat dissipation substrate in recent years. However, its ability of material control and process technology integration is high, which makes the technical threshold for entering DPC industry and stable production relatively high. DBC&DPC is a professional technology that has only been developed and matured in recent years in China and can be mass-produced.

5. AMB ceramic copper clad laminate adopts AMB active brazing process, and the bonding force of copper layer is higher than DPC, which is above 18n/mm and as high as 21 N/mm.. AMB ceramic copper clad laminate usually has high bonding force, and the copper is usually thick, ranging from 100 μ m to 800 μ m, and it is rarely used for wiring or punching. Even if there are wires, it is very simple and the spacing is relatively wide.

6. TFC thin-film ceramic substrate generally adopts sputtering process to directly deposit metal layer on the surface of ceramic substrate. If photolithography, development, etching and other processes are assisted, the metal layer can also be patterned and prepared into lines. Because the deposition speed of sputtering coating is low (generally less than 1um/h), the thickness of the metal layer on the surface of TFC substrate is small (generally less than 1um), and ceramic substrates with high graphic accuracy (line width/line spacing less than 10um) can be prepared. It is mainly used for packaging small current devices in the field of laser and optical communication.

7. TPC thick film ceramics is a method of forming conductive lines and electrodes by screen printing, directly depositing slurry on the substrate and sintering at high temperature. This method is suitable for most ceramic substrates. After high temperature sintering, the material will form a firmly adhered film on the ceramic circuit board, and after repeated for many times, it will form a circuit with multi-layer interconnection structure containing resistance or capacitance. The advantage of this technology is that the process is simple, but the disadvantages are obvious: the conductors are gold paste and silver paste, limited by the size of conductive paste and screen, the minimum wire width of the product is difficult to be less than 100μm, and it is impossible to make three-dimensional graphics, so it is not suitable for the production of fine circuit boards.

Where is the ceramic circuit board used?

1. LED lighting

2. Power electronics

3. Aerospace

4. Automotive Electronics

5. Medical equipment

6. high frequency communication

7. chemical equipment

8. industrial electronics

Ceramic circuit boards are widely used in all walks of life because of their unique properties, especially in the electronic circuit industry.

Since its birth, ceramic circuit boards have been widely used. With the development of electronic industry, in order to adapt to the application of special industries, the types of ceramic circuit boards have become more and more diverse. As a professional manufacturer of ceramic circuit boards, BEST Technology is committed to providing high-quality products and comprehensive technical support. For different types of ceramic circuit boards, BEST Technology also has professional equipment and personnel to produce them. Choose a powerful manufacturer of ceramic circuit boards, and you will have no worries.

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What Are the Benefits of Using Ceramic PCB?
Tuesday, August 13th, 2024

With the continuous improvement of the performance requirements of electronic equipment, such as high current, fast heat dissipation, high frequency, long life and a series of other requirements, the requirements for the circuit board carrying the functions of the equipment have become particularly harsh. The traditional FR4 pcb circuit board in the past has completely failed to meet the current use scenarios. It is found that the circuit board produced by adding the corresponding ceramic materials can meet the corresponding requirements when making the circuit board substrate. Since then, ceramic PCB came into being and quickly gained a decisive position in the market.

Why Use Ceramic PCB?

Ceramic PCB shows remarkable advantages in many application fields because of its unique physical and chemical properties. ‌

First of all, ceramic PCBs have excellent heat dissipation performance and low thermal expansion coefficient, which enables them to maintain stable performance in high temperature environment and effectively avoid equipment damage or performance degradation caused by temperature changes. Secondly, ceramic PCB has excellent insulation performance and high voltage resistance, which can guarantee personal safety and stable operation of equipment. In addition, the ceramic PCB has strong adhesion, and the bonding technology is adopted to ensure that the copper foil will not fall off, which improves the reliability of the product, especially in the application of high-frequency circuits. ‌

Ceramic PCB: What is it & Why should we use it?

The manufacturing process of ceramic PCB also has its own uniqueness. Usually, the bottom plate is formed by pressing ceramic powder, which ensures the flatness and surface smoothness of PCB, thus improving the quality of circuit board. Although the cost of ceramic PCB is usually higher than that of traditional materials such as FR-4, it is undoubtedly a better choice in applications requiring high performance and high reliability. ‌

To sum up, ceramic PCB is widely used in high-power power electronic modules, solar panel components, high-frequency switching power supplies, solid-state relays, automotive electronics, aerospace, military electronic products, high-power LED lighting products, communication antennas and other fields because of its excellent physical and chemical properties and high stability in high-frequency circuit applications.

What Are the Basic Components of Ceramic PCB?

The first is highly integrated circuit board, which has become an inevitable trend with the progress of electronic technology. Modern technology and electronic products integrate hundreds, thousands or even millions of transistors and resistors on a small silicon chip or integrated circuit (commonly known as IC) to form complex components.

These integrated circuits need a foundation for building tiny electronic materials and connections, usually called substrates. It also needs a structure to isolate the circuit from the external environment and turn it into a compact and solid unit, which is called packaging.

Integrated circuits need substrates and packages to maintain their reliability. Integrated circuits need insulating materials, and these two materials are born for this purpose. These packages will then be mounted on the printed circuit board.

Ceramics are famous for their insulating properties. The protective performance of this advanced ceramic material is an important factor for its use as substrate and packaging. This is why ceramic printed circuit boards or PCBs stand out from other similar products.

What are the Materials Used in Ceramic Circuit Board?

There are many kinds of materials for making ceramic PCB. When choosing ceramic materials, two basic characteristics that should be paid attention to are thermal conductivity and thermal expansion coefficient (CTE) of PCB.

Alumina (Al2O3), aluminum nitride (AlN), beryllium oxide (BeO), silicon carbide (SiC) and boron nitride (BN) are commonly used materials in ceramic PCB.

Alumina (Al2O3)

Alumina is an inorganic compound, also known as bauxite. It is an advanced material made of aluminum and oxygen. It is usually white, but it varies according to purity. The color can be pink to almost brown. This compound is tasteless and crystalline powder, but it is insoluble in water.

Among all oxide ceramics, alumina is the hardest and strongest. Because the content of alumina is higher than 95%, it is an excellent electrical insulator with a resistivity as high as about 1× 1014 Ω cm. Common purity ranges from 94% to 99%. The required color, hardness, size and shape should be easy to achieve. Because the composition can be changed, it is considered to be beneficial to engineering production.

This industrial oxide ceramic has excellent thermal stability and corrosion stability, excellent mechanical strength and dielectric strength, and can even form an airtight seal. The common 96% alumina has a thermal conductivity of 25.0 W/(m k) and a CTE of 4.5 to 10.9 x 10-6/k.. Besides being affordable and cost-effective, it has all these advantages.

It is the most commonly used substance in ceramics because it has many applications in the electronic field, including substrates and packaging. This is the preferred material when the application does not require the highest level of thermal performance. It is one of the most advanced ceramic materials with the most in-depth research and comprehensive characteristics.

Aluminum nitride (AIN)

Aluminum nitride (AIN) is a non-oxide semiconductor technology-grade ceramic material. The structure of this compound is hexagonal crystal, which is blue and white in pure state. Aluminum nitride is a synthetic ceramic compound, which is usually white or gray.

Ceramic PCB: What is it & Why should we use it?

One of the best ceramic substrate materials at present is aluminum nitride (AlN). Its resistivity ranges from 10 to 1210ω-m, and its thermal conductivity is 80 to 200W/(m k), even as high as 300W/(m k). Based on these characteristics, it is undoubtedly one of the most attractive PCB substrate materials and one of the best choices.

It has electrical insulation and a low coefficient of thermal expansion (CTE) of 4 to 6× 10-6k1 (between 20 and 1000°C), which is very close to the silicon wafer. The value of this compound is much higher than that of alumina, but the cost is also higher. It is most suitable for use in high current and high temperature environment.

Beryllium oxide (BeO)

Beryllium oxide (BeO) or Beryllium oxide is also called dextran or glucose oxide in history. As the name implies, it comes from beryl or mineral beryl. It is a solid crystalline inorganic compound with white color.

In addition to good electrical insulation, its thermal conductivity is higher than that of any other nonmetal [(209 to 330 W/(m k)], and even exceeds that of some metals except diamond. There are rigid bonds between the atoms of beryllium oxide, just like diamonds. It transfers heat in the form of vibration through these strong bonds, so the energy loss is minimal.

This refractory compound has a melting point of 2506.85 °C to 2575 °C, a boiling point of 3905 °C and a CTE of 7.4 to 8.9 x 10-6/k. Beryllium oxide has these excellent characteristics, so it is widely used in electronic industry and is a valuable resource. Because of its high melting point, excellent thermal conductivity and good resistance, other industries also benefit from it.

Beryllium oxide has shown excellent chemical and thermal stability in challenging conditions and harsh environments for more than 60 years. BeO can be used to provide air or liquid cooling in applications where PCB is exposed to high temperature or high-density PCB with limited space. ‌

What are the Advantages of Ceramic PCB over Traditional PCB?

The use of ceramic printed circuit boards has several advantages, which help to significantly reduce the size and weight of the final product while improving energy efficiency. High quality surface smoothness (due to its flatness), high temperature resistance and low dielectric constant are their other significant advantages. In addition, ceramic plates are durable and wear-resistant, which means that they can be used in areas with high mechanical stress.

Because ceramic substrates are cleaner than FR-4 boards, ceramic PCBs can accommodate high component density on a single circuit board, which means that they can accommodate smaller components while still maintaining the same mass and occupying space.

The high temperature resistance of ceramic board is several times higher than that of FR4, and the thermal deformation temperature of ceramic board is much higher than that of traditional FR4, which makes the circuit board have better performance under extreme temperature conditions, thus prolonging the service life of the circuit board.

Ceramic PCB is more resistant to moisture in the air than FR4 board.

Ceramic PCB is made of ceramics, which is more durable and stronger than traditional FR4.

Ceramic board has higher density than traditional PCB, which can ensure high signal integrity. In addition, these boards are faster and more reliable than traditional boards.

Ceramic boards have high thermal resistance due to low thermal conductivity, so ceramic PCB has another advantage of fire prevention, which can make them a good choice for products that need to meet certain flammability and heat resistance criteria. Because a thin layer of ceramic fiber on the surface of PCBA can prevent heat from flowing into the circuit board, and at the same time, it can protect the conductive traces from cracking when exposed to excessive heat.

What are the Application of Ceramic PCB?

1. High power device

2. On-board chip module

3. Proximity sensor

4. Solid State Relay (SSR)

5. Solar panel array

6. Transmission/reception module

7. Multilayer Interconnect Board

8. Solar cells

9. Light emitting diodes

10. Automobile lighting system

Ceramic PCB: What is it & Why should we use it?

As a high-performance electronic component, ceramic PCB‌ is playing a vital role in many fields because of its unique characteristics. This kind of printed circuit board is becoming more and more popular for various reasons. The most important factor to consider when choosing a PCB manufacturer is quality and experience. Through meticulous manufacturing technology and firm commitment to quality, BEST Technology strives to provide ceramic PCBs that can stand the test of time and meet the needs of the continuous development of modern technology. Contact us for more information!

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What is Ceramic PCB? Its Types and Manufacturing Process
Tuesday, August 13th, 2024

Ceramic PCB is an innovation of traditional PCB circuit board. Ceramic PCB will use an organic compound called polyimide as solder paste, and ceramics (aluminum nitride, aluminum oxide, beryllium oxide) are often used as substrate materials. In the electronic power industry, ceramic PCB is a substitute for the traditional PCB technology based on FR-4 glass epoxy resin laminated with a thin copper layer.

The market of ceramic PCB is growing faster and faster because of its unique performance and cost-effectiveness. Compared with traditional FR4-PCB, they have many advantages, including thermal conductivity, chemical resistance, electrical insulation and high thermal shock resistance. So it is widely used in military, aerospace, consumer electronics industry and Internet of Things equipment.

What is Ceramic PCB? Its Types and Manufacturing Process

What is a Ceramic PCB?

Ceramic PCB or ceramic circuit board is a kind of printed circuit board using ceramic material as substrate. Different from the traditional PCB which often uses FR4 and other materials, ceramic PCB has better heat dissipation and electrical insulation. These characteristics make ceramic PCB an ideal choice for high-power applications such as LED lighting, power electronics and automotive electronics.

Commonly used ceramic materials for ceramic PCB generally include alumina (Al2O3), aluminum nitride (AlN) and silicon carbide (SiC). These materials can provide the necessary thermal conductivity and mechanical strength for ceramic PCB applications, and ensure that the circuit board can withstand high temperature and harsh working conditions.

One of the main advantages of ceramic circuit boards is that they can handle higher power load without overheating risk, which significantly improves the service life of ceramic PCB. At the same time, the low coefficient of thermal expansion (CTE) in ceramic materials also reduces the risk of thermal stress and further improves the durability of ceramic PCB.

How to Make Ceramic PCB?

Due to the unique properties of ceramic materials, the process of manufacturing ceramic PCB is more complicated than traditional PCB. The manufacturing process usually involves several key steps:

Firstly, the first step is to select the appropriate ceramic materials according to the specific requirements of the circuit board.

The second step is to press and sinter the ceramic powder into the required shape and thickness after selecting the material. The sintering process involves heating the material to a high temperature to fuse the particles together, thus forming a dense and solid substrate.

The third step is to deposit a layer of metal (usually copper or gold) on the surface after the substrate is formed, then apply photoresist material to the metal layer, and use ultraviolet rays to expose the required circuit pattern, and then etch away the exposed area, leaving the circuit pattern.

Finally, after the circuit is formed, the circuit board should go through a finishing process to improve its performance and durability. Finally, the quality of the finished circuit board should be checked to ensure that it meets all the required specifications.

What is Ceramic PCB? Its Types and Manufacturing Process

This process can make ceramic PCB highly reliable and can work normally under extreme conditions.

How Many Layers in Ceramic PCB?

Ceramic PCB can be made of multiple layers like traditional PCB, and its number of layers depends on the complexity of the circuit and the application requirements.

Single-layer ceramic PCB is composed of a single-layer ceramic material and a metal circuit at the top, which is usually used for heat dissipation applications.

Multilayer ceramic PCB is more complex, consisting of multilayer ceramic materials and metal circuits, which are stacked together and interconnected by vias. The extra layer allows more complex circuit design, enabling the circuit board to handle more signals and power for applications requiring higher functions.

The number of layers in ceramic PCB can range from one to several. Each additional layer will increase the complexity and cost of the circuit board, but it will also increase its function and performance, depending on its application scenario.

How Thick is Gold Conductor Printed on the Ceramic PCB?

The thickness of gold conductor on ceramic PCB is an important factor affecting the performance and durability of circuit board. The thickness of gold conductor depends on the application and required performance characteristics, and is usually in the range of 0.5 micron to 10 micron. Of course, a thicker gold layer can also be provided, which also brings better conductivity and more stable performance, especially in high-power applications, which also brings higher costs.

In high frequency applications, the thicker gold layer can reduce the signal loss, improve the overall performance of the circuit, and also better prevent wear and prolong the service life of PCB.

Considering the specific requirements of the application, the exact thickness of the gold conductor has been determined in the design stage. Our advanced manufacturing technology enables us to accurately control the thickness of the gold conductor and ensure that each circuit board meets the required specifications.

What is the Ceramic insulator on the Circuit Board Used For?

Ceramic insulators are generally used to electrically insulate different components and conductive paths on a circuit board, prevent short circuits and ensure that the circuit operates as expected. It plays a vital role in the performance and reliability of ceramic circuit boards.

Even a small amount of current leakage will cause serious problems. Ceramic materials of insulators provide excellent electrical insulation performance, which means that they can withstand high voltage without allowing current to pass through. In addition to electrical insulation, ceramic insulators also have thermal insulation properties, which can help control the heat generated by components on the circuit board.

Ceramic insulators are usually placed between metal conductors on the circuit board, which allows multiple conductive paths to be placed closely together without the risk of short circuit because they are electrically insulated from each other.

Generally speaking, ceramic insulator is a key component of ceramic PCB, which helps to improve its performance and reliability.

What equipment does BEST Technology have?

We use advanced machines at every step of the production process, from substrate molding to circuit molding and surface treatment, to ensure the highest quality ceramic PCB.

For substrate forming, we have high-precision press and sintering furnace, which can produce dense and uniform ceramic substrates.

What is Ceramic PCB? Its Types and Manufacturing Process

Our metallization process is also supported by advanced sputtering and chemical vapor deposition equipment to ensure that a consistent high-quality metal layer can be formed on the substrate.

At the same time, we also have cutting-edge lithography equipment for circuit formation, which enables us to create complex and accurate circuit patterns on the circuit board.

In addition to our advanced equipment, our team of technicians and engineers have rich experience in the production of ceramic printed circuit boards. Combined with our most advanced equipment, we can provide high-quality products that meet the most demanding requirements.

Ceramic PCB has a series of advantages, from materials to technology, each of which provides corresponding advantages, including excellent thermal management, electrical insulation and durability, making them an ideal choice for high power and high temperature applications. BEST Technology has advanced manufacturing technology, first-class equipment and commitment to quality, which can ensure that our ceramic PCB achieves the highest performance and the best quality. Whether you need a single-layer board or a complex multi-layer design, we have the expertise and equipment to provide products that meet your needs.

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How is the ceramic PCB made?
Friday, August 9th, 2024

Ceramic PCB is composed of ceramic substrate, connecting layer and circuit layer. With the development of electronic industry, the types of ceramic PCB have become various. Since ceramic materials were used as PCB substrate, many methods for manufacturing circuit layer on ceramic substrate have been developed, among which several common ceramic circuit boards are HTCC (high temperature co-firing), LTCC (low temperature co-firing), DBC (direct copper cladding) and DPC (direct copper plating). Each type of ceramic circuit board has different usage scenarios, and also corresponds to different manufacturing processes.

How is the ceramic pcb made by HTCC process? ‌

First of all, the starting material of HTCC (high temperature co-fired ceramics) process is ceramic powder (such as Al2O3 or AlN), and these materials need to be mixed with organic binder to form paste ceramic slurry. Then, the ceramic slurry is scraped into a sheet by using a scraper, and a green embryo is formed through a drying process. After the green embryo is formed, through holes are drilled according to the circuit layer design, and then the wiring and hole filling are carried out by screen printing metal paste. Finally, the germ layers are stacked and sintered in a high temperature furnace (about 1600 C). ‌

How is the ceramic PCB made?

Specifically, the ‌HTCC process flow includes the following key steps:

Casting molding method: the ceramic slurry is scraped into a thin strip with uniform thickness, and dried by blowing filtered hot air opposite to the moving direction of the conveyor belt to form a green sheet.

Punching: Through mechanical drilling, mechanical punching or laser drilling, through holes are punched in the green blank. The size, position and accuracy of these holes directly affect the on-off and wiring density in the substrate.

Through-hole filling: the filling slurry is extruded into the through-hole of the green porcelain by mask printing method to complete the metallization process of the green porcelain.

Lamination, slicing and co-firing: the printed germ layers are laminated, then sliced and finally co-fired at high temperature. ‌

After the completion of this series of steps, a high-temperature co-fired ceramic (HTCC) substrate is obtained, which has excellent electrical and mechanical properties and is widely used in the manufacture of electronic products requiring high performance. ‌

How is the ceramic pcb made by LTCC process?

The first step is to prepare raw materials. The raw materials of ‌LTCC are mainly composed of ceramic powder and organic additives. Ceramic powders, such as alumina and zirconia, are used to improve the insulation and mechanical strength of ceramic materials. Organic additives are used to increase viscosity and improve plasticity, which is convenient for the subsequent molding process. ‌

Then there is circuit printing, the purpose of which is to print circuit patterns on ceramic substrates, usually using shielding printing technology. Firstly, the ceramic substrate is cleaned and coated with conductive metal ink. Then, the circuit pattern is transferred to the substrate by stamping with a printing die. Then, through the baking process, the conductive ink is solidified on the substrate to form a conductive circuit. ‌

How is the ceramic PCB made?

The third step is a sintering process, in which ceramic materials are chemically reacted at high temperature to combine their particles to form a compact ceramic body. In the process of sintering, the control of temperature gradient and atmosphere is very important to reduce the stress of materials and prevent them from oxidation.

In the final step of finished product inspection and subsequent treatment, the sintered ceramic substrate needs to be inspected first, including appearance quality inspection, size measurement, electrical performance test and other items. Qualified products can be subjected to subsequent electronic component packaging processes, such as welding, film covering, gas packaging, etc., to realize the protection and connection of electronic components. ‌

To sum up, the manufacturing process of ceramic PCB by ‌LTCC process involves many steps, such as precise material selection, processing, circuit printing, sintering, finished product inspection and subsequent treatment, to ensure the quality and performance of the final product.

How is the ceramic pcb made by DBC process?

The first step is the preparation of raw materials. First, it is necessary to select suitable ceramic substrate materials. Common materials include alumina (Al2O3) and aluminum nitride (AlN), which have high insulation, high thermal conductivity and good mechanical strength. The surface of the substrate should be cleaned and treated first to ensure the bonding with the subsequent copper foil. ‌‌

How is the ceramic PCB made?

Then the bonding between copper foil and ceramic substrate is the core step of DBC manufacturing process. At a certain temperature and pressure, the copper foil is closely attached to the ceramic substrate to form a firm bonding interface. It is necessary to control the parameters such as temperature, pressure and time in the bonding process to ensure the bonding quality and performance. ‌

Secondly, after the bonding is completed, the copper foil needs to be etched to form the required circuit pattern. Chemical etching or laser etching can be used in the etching process. By precisely controlling the etching depth and width, high-precision and high-resolution circuit patterns can be obtained. ‌

Finally, the DBC structure is cleaned, dried and tested. The purpose of this is to remove residues and improve the reliability and stability of products. ‌

Through the above steps, high-performance DBC ceramic substrates can be prepared, which are widely used in the packaging of intelligent power modules and electric vehicle power modules. ‌

How is the ceramic pcb made by DPC process?

Firstly, the ceramic substrate is pretreated and cleaned to ensure the cleanliness of the substrate surface and prepare for the subsequent deposition and copper plating process. ‌

Then the key step is to deposit a Ti/Cu layer on the surface of the substrate as a seed layer by vacuum sputtering technology. This step is the most important in DPC process.

Followed by photolithography, development and etching processes, the circuit is completed.

Finally, the thickness of the circuit is increased by electroplating or electroless plating to enhance the conductivity and durability of the circuit. After the metallized circuit is manufactured, the photoresist is removed, and finally the substrate is manufactured. ‌

How is the ceramic PCB made?

The manufacturing process of ceramic PCB by DPC process involves vacuum sputtering, photolithography, development, etching and electroplating, which makes the ceramic PCB by DPC process have good conductivity and durability, and is suitable for various electronic application scenarios. ‌

With the increasing use of ceramic PCB, in order to adapt to some application fields, many different process technologies have emerged, and each process technology has its own unique technology. For example, HTCC process needs to be sintered at high temperature to achieve its goal. According to the different environment used and the production cost, the appropriate ceramic PCB production technology is selected. BEST Technology has rich experience in manufacturing ceramic circuit boards. For different kinds of ceramic PCBs, there are different production lines and professionals. If you choose the right manufacturer, you will get the best quality ceramic circuit boards.

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How to Test a PCB Board? – Best Technology
Friday, August 2nd, 2024

Nowadays, PCBs became more and more important and you can see it in every electronic device. The PCB plays a critical role in our daily life. With circuit board, the device can power on and help to transmit signals, manage heat and perform electricity. A good PCB can help to improve the overall of your device. However, not all the PCBs are work good and within your expectable, you must know how to test it and ensure it enables a good performance. As an experienced PCB manufacturers in Asia, today we want to share with you how we test a PCB, and we try to use simple words to make you sense.

How to Test a PCB? - Best Technology

What is a printed circuit board?

Before knowing the methods of testing circuit board, let’s understand the definition of PCB. A PCB is a flat board made from insulating materials like fiber glasses with conductive pathways etched onto its surface. The pathways we called circuit or traces. These pathways connect different electronic components, so that they can communicate and function together. PCBs come in various materials, shapes and sizes, which always is customized to meet specific applications and performance requirements.

PCBs can be divided into different types according to substrate material used. They are – normal FR4 PCB, polyimide flexible PCB, metal core PCB, ceramic PCB, rogers PCB. Different has its own properties and advantages. The choice of materials and the design of the PCB significantly impact the performance and reliability of the final product. Understanding the materials used in PCBs is crucial for anyone involved in electronics, from hobbyists to professional engineers/designers.

How to Test a PCB? - Best Technology

Common PCB Circuit Board Issues

Though PCB has a strong construction, they are easy to be broken or failure since they always encounter a range of issues. These problems can stem from manufacturing defects, wear and tear, or improper handling. Identifying and diagnosing these issues promptly is crucial for maintaining the reliability and performance of electronic devices. Common issues we faced are including:

  • Open Circuits: These occur when a break in the circuits prevents current flow normally. Open circuits can result from physical damage or manufacturing errors.
  • Short Circuits: Due to improper soldering, unreasonable circuit design and other reasons, resulting in a short circuit between two or more points in the circuit that should not be connected. This can cause excessive current flow, potentially damaging components.
  • Grounding: The unreasonable design of ground area leads to interference signals on the grounding, which affects the normal operation of the circuit.
  • Signal: The signal circuit design is not reasonable, resulting in interference signals on the signal.
  • Component Failures: Individual components on a PCB can fail due to aging, overheating, or electrical stress breakdown. And incorrect orientation will lead to the failure of PCB.
  • Soldering Issues: Poor soldering can lead to weak connections, causing intermittent faults or complete circuit failure. This including the dents in the solder joints, this also can make the PCB failure.
  • Corrosion: PCB exposure to moisture and contaminants for a long time can cause corrosion, degrading the conductive pathways and component leads.

How to check a PCB?

In generally, there are four common ways to check whether if your PCB are good or failure.

1. Visual inspection

The easiest way is visual inspection. Through naked eye observation, check whether the solder joint on the PCB circuit board is firm, whether there is short circuit, open circuit and other phenomena. And look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.

2. Use a multimeter

Multimeter is a common tool used for measuring PCB. Multimeter is versatility and it has multiplied modes. Select the appropriate mode on the multimeter, such as continuity, voltage, or resistance mode, depending on what you are testing. Before testing, make sure probes are in good condition and properly connected to the multimeter, with the red probe typically being positive and the black probe negative or ground. Click here to read What is the PCB flying probe test?

3. E-tester

E-tester is a good way to test short or open circuit when it is a mass production. If you just want to test one piece PCB, multimeter is much better.

How to Test a PCB? - Best Technology

4. Use oscilloscope

An oscilloscope is a powerful diagnostic tool used to observe the waveform of electrical signals in a circuit. Connect the oscilloscope probes to the test points on the PCB, it can capture the waveform. By observing the waveform, determine whether the circuit is working normally.

5. Use a thermal imager

A thermal imager also is a effective way to check the condition of PCB. It can capture the temperature distribution on the PCB. It helps identify areas with excessive heat, which can indicate potential issues.

How to Test a Circuit Board with a Multimeter Effectively?

Testing a circuit board with a multimeter is essential for diagnosing and fixing electronic issues. A multimeter can measure voltage, current, and resistance, helping you identify problems with the PCB. The main way to test a PCB with a multimeter is to measure voltage, ‌ resistance, and ground. ‌

  • Measuring voltage

By measuring the voltage on the circuit board, ‌ can quickly test whether the circuit is working properly. Use the voltage gear of the multimeter, ‌ select the appropriate range, ‌ then measure the input and output of the power supply on the circuit board respectively, ‌ to check whether the voltage is within the normal range. If the voltage is abnormal, ‌ may indicate that the circuit is open or short. ‌

  • Measuring resistance value

By measuring the resistance value on the circuit board, can detect whether the circuit is smooth. Use the resistance level of the multimeter, select the appropriate range, then measure the key nodes on the circuit board, check whether the resistance value is within the normal range. If the resistance value is abnormal, may indicate that the circuit is open or short. ‌

How to Test a PCB? - Best Technology
  • Check the grounding

Grounding is critical to the proper operation of the circuit board. Use the multimeter’s ground test function, to check that key points on the board are properly grounded, ‌ this helps to spot potential electrical connection problems. ‌

In addition, for industrial-grade PCB measurement, the use of higher-precision multimeters and special pens can improve the accuracy and efficiency of the measurement. ‌ For example, the ‌ Fluke 17B Max multimeter is equipped with an extra-pointed stylus, enables more accurate measurement of patch components and pins, and ‌ improves measurement fineness and accuracy.

Generally speaking, using a multimeter to test the PCB board needs to master the correct measurement methods and skills. At the same time according to the complexity of the circuit board to choose the appropriate measurement tools, to ensure the accuracy and efficiency of the test.

How to Tell if a Circuit Board is Bad?

Identifying a bad circuit board requires a combination of visual inspection and multimeter testing. Here are some signs and methods to determine if a PCB is faulty:

  • Visual Signs

Look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.

  • Component Testing

Use the multimeter to test individual components. A component that doesn’t show the expected resistance or voltage is likely faulty.

  • Continuity Testin

Check for open circuits. Lack of continuity in a path indicates a broken trace or solder joint.

  • Short Circuit Detection

Identify any unintended connections between different paths. This can be done by checking for continuity where there should be none.

  • Functionality Testing

Test the circuit board in its intended application. If the device does not function correctly, there may be an issue with the PCB.

Why Choose Best Technology?

By reading this post, you may know how to test a PCB by multimeter already and other methods to identify them. Best Technology has engaging in the PCB manufacturing for more than 18 years, we have served over 2000+ customers all around the world. We have strong R&D team and equipped with advanced equipment to improve the yield and product quality.

At Best Technology, we provide various PCB manufacturing, including metal core PCBs, ceramic PCBs, rigid-flex PCBs and some other special PCBs like HDI PCB, busbar PCB, heavy copper PCB. If you have similiar projects, you are welcome to contact us.

Posted in best pcb, bestpcb, Ceramic PCB, FAQ, FR4 PCB, HDI PCB, mcpcb, Metal Core PCB, PCB News, PCB Technology | No Comments »

What are thick and thin film ceramic circuit boards used for?
Thursday, August 1st, 2024

Thick film and thin film technologies for ceramic circuit boards each have their specific uses. The application of thick film technology is mainly concentrated in areas that require high reliability and high performance, such as the automotive field, consumer electronics, communications engineering, medical equipment, aerospace, etc.

The application of thin film technology focuses on products that require specific optical, electrical, chemical and thermal properties, such as reflective coatings, optical recording media, insulating films, anti-oxidation, sensors, optoelectronic device heat sinks, etc. The following will introduce the uses and differences of thick film and thin film one by one.

What is a thick film ceramic circuit board used for?

Thick film ceramic circuit board is a kind of circuit board made by thick film technology, which is widely used, mainly for electrical connection, component mounting and surface modification.

What are thick and thin film ceramic circuit boards used for?
  • Electrical connection

Thick film circuit board can effectively connect all parts of the circuit to ensure the smooth transmission of current.

  • Component mounting

It can bear and fix electronic components, and ensure the correct position and stable operation of components in the circuit.

  • Surface modification

Through thick film technology, the surface of the circuit board can be modified to improve its electrical performance and durability. ‌

In addition, the thick film ceramic circuit board has some specific advantages, such as its manufacturing method allows it to be manufactured independently without using a substrate, and its thickness is usually between 10 and 25 μ m. This technology can be manufactured independently without using a substrate, which provides greater design flexibility. However, there may be some limitations in the accuracy of thick-film ceramic circuit boards. For example, in the process of using screen printing technology, the line width and accuracy may be insufficient due to the problems of screen printing, which may gradually lose the accuracy advantage for heat sinks with smaller and smaller size requirements in the future.

What is a thin film ceramic circuit board used for?

Thin film ceramic circuit boards are mainly used in module components of microwave circuits, including thin film load, thin film equalizer, thin film power divider, thin film attenuator, thin film coupler and thin film bridge. ‌

What are thick and thin film ceramic circuit boards used for?

1. Thin film load is often used to match the terminals of module components of microwave circuits to absorb redundant incident power. It is designed with alumina ceramic substrate, which has the advantage of high precision machining.

2. Thin-film equalizer is used to adjust the broadband power flatness of microwave circuits. By changing the square resistance of the integrated tantalum nitride film and designing different resistance values, the output waveform of the device is adjusted to achieve the balance of power signals.

3. Thin film power divider is used in multi-channel communication network system, which distributes power according to a certain proportion, and one input can be multi-output, thus avoiding the problem of unstable patch resistance welding of microstrip power divider.

4. Thin film attenuator is used for large signal attenuation or multi-gear adjustment attenuation value in microwave RF module, which realizes high attenuation value flatness of ultra-wideband and stable performance.

5. Thin-film couplers are used for power detection or signal separation, and can be designed as couplers with any weak coupling degree. tantalum nitride design is used to integrate isolated loads, which is suitable for broadband applications.

6. As a part of microwave module, thin film bridge is used for specific circuit connection and signal processing. ‌

According to these applications, we can better understand the wide application and advantages of thin-film ceramic circuit boards in the fields of high frequency, high power and high integration.

What are the advantages of thick film over thin film ceramic PCB?

Thick film ceramic circuit boards have higher mechanical strength and thermal conductivity than thin film ceramic circuit boards, and are more suitable for power electronics, automotive electronics and other occasions that require higher thermal management and mechanical strength. ‌

The main difference between thick-film ceramic circuit board and thin-film ceramic circuit board lies in their film thickness and manufacturing process. The thickness of thick film circuit board is generally greater than 10μm, while that of thin film circuit board is mostly less than 1μ m.. Thick film circuit board usually adopts screen printing process, while thin film circuit board adopts vacuum evaporation, magnetron sputtering and other process methods.

This difference in technology leads to their differences in performance and application fields. Specifically, the advantages of thick film ceramic circuit boards are mainly reflected in the following aspects:

Reliable performance

Thick film circuits are flexible in design, low in investment and cost, and are mostly used in high voltage, high current and high power occasions.

High mechanical strength

Due to the use of thick film materials, thick film ceramic circuit boards have high mechanical strength and can withstand greater physical pressure and impact.

Good thermal conductivity

Thick-film ceramic circuit boards have good thermal conductivity, which is conducive to rapid heat dissipation, and is particularly important for electronic equipment that needs good thermal management. ‌

Therefore, thick film ceramic circuit boards are more suitable for applications that require high mechanical strength and good thermal conductivity, such as power electronics, automotive electronics and other fields.

What is the difference between thick film and ceramic resistors?

There are some differences between film resistance and ceramic resistance in materials, manufacturing technology, size and shape, electrical properties and application scenarios. ‌

1. Materials and manufacturing process: Thick film resistors are usually made by screen printing process and spraying or sputtering on the circuit substrate. The commonly used substrate materials are ceramics, glass and so on. The ceramic resistor is a resistance device made of ceramic material, which is fired in a ceramic kiln. ‌

What are thick and thin film ceramic circuit boards used for?

2. Size and shape: Thick film resistors are usually flat, can be made into various sizes and shapes, and are suitable for assembly on circuit boards. Ceramic resistors are usually cylindrical and have a fixed size and shape. ‌

3. Electrical performance: Thick film resistor has high resistance accuracy and stability, and small temperature coefficient. Ceramic resistors have larger power carrying capacity and higher withstand voltage. ‌

4. Application scenario: Thick film resistor is suitable for high-precision circuits because of its large resistance range and good temperature stability. Ceramic resistors are suitable for general circuits and small electronic devices because of their small size and general electrical properties. ‌

From this, we can know that thick film resistors and ceramic resistors are different in materials, manufacturing processes, sizes and shapes, electrical properties and application scenarios, which make them suitable for different electronic equipment and circuit design requirements.

‌‌Thick film technology and thin film technology have certain substitutability in some fields, but thick film technology has irreplaceable role in the manufacturing and related processes of many products due to its advantages in cost, reliability, high temperature performance, etc., especially in multi-layer co-sintering processes such as LTCC and HTCC, where thin film technology cannot be applied. As a professional ceramic substrate manufacturer, Best Technology is committed to providing customers with high-quality thick film and thin film ceramic substrates to meet the needs of different applications.‌‌

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