PCB copper thickness is generally divided into 1OZ (35um), 2OZ (70um), 3OZ (105um), of course, there are thicker ones. The copper thickness depends on what kind of board you are making. For example, 2OZ is enough for switching power supplies with high current, and 1OZ is enough for general signals. Generally, double-sided boards are 1oz Multi-layer boards are generally 1/2oz 1/3oz for the inner layer and 1oz 1/2oz 1/3oz for the outer layer
0.5 oz copper thickness About 0.685 mm. 1 ounce is about 1.37 mm, so 1.37÷2=0.685, 0.5 oz copper thickness in mm About 0.685 mm
1 oz copper thickness: This is the most common and basic copper thickness standard, also known as standard copper thickness. 1 oz copper thickness refers to the weight of 1 ounce (about 35.3 grams) of copper foil per square foot of board area, and the corresponding copper foil thickness is about 1.4 mils (0.035mm). This copper thickness is suitable for most common circuit board designs and applications.
2 oz copper thickness: 2 oz copper thickness refers to the weight of 2 ounces (about 70.6 grams) of copper foil per square foot of board area, and the corresponding copper foil thickness is about 2.8 mils (0.071mm). This copper thickness is suitable for some applications that require higher current carrying capacity, such as power electronic devices and high-power LEDs.
3 oz copper thickness: 3 oz copper thickness refers to the weight of 3 ounces (about 105.9 grams) of copper foil per square foot of board area, and the corresponding copper foil thickness is about 4.2 mils (0.107mm). This copper thickness is suitable for some special applications that require higher current carrying capacity, such as high-power amplifiers and high-power power supplies.
PCB copper foil thickness standard
Common international PCB thicknesses are: 35um, 50um, and 70um.
The copper foil (copper cladding) thickness of general single-sided and double-sided PCBs is about 35um (1.4mil), and the other specifications are 50um and 70um.
The surface thickness of multilayer boards is generally 35um=1oz (1.4mil), and the inner layer is 17.5um (0.7mil).
The relationship between the line width, copper thickness and current passing through the PCB board
1 foot = 12 inches 1 inch = 1000 mil 1mil = 25.4um 1mil = 1000uin mil is sometimes called inch 1um = 40uin (some companies call microinches “microinches”, which are actually microinches) 1OZ = 28.35 grams per square foot = 35 microns
The copper content of PCB copper foil is generally 90% and 88%.
Copper foil is made of copper and a certain proportion of other metals. There are two common specifications of copper foil, namely 90% and 88% copper content. The size of these two specifications of copper foil is 16*16cm, which is widely used in various occasions where copper foil is needed, including PCB manufacturing. In PCB manufacturing, copper foil is the basic material of the circuit board, and its thickness and copper content have an important influence on the electrical performance and durability of the circuit board. The thickness of copper foil is usually expressed in OZ (ounces). The standard PCB copper thickness range is 1/4OZ-6OZ. The specific thickness includes 1OZ, 2OZ, 3OZ, 4OZ, 5OZ, 6OZ, which correspond to different copper thickness sizes, such as 35um, 70um, 105um, 140um, 175um, 210um. In practical applications, the commonly used copper thicknesses are 1OZ, 2OZ, 3OZ, 4OZ, etc. These copper thicknesses can meet the needs of most electronic products.
Why is the copper foil on the surface of PCB copper+plating?
The copper foil on the surface of the PCB adopts the copper+plating method, mainly because this treatment method can provide better conductivity and protection circuit. Copper foil is the conductor of PCB, and its basic material is copper, while plating (plating) is a layer of metal added on the basis of copper foil by electroplating or other methods, usually tin, gold or other alloys, to provide additional protection and enhance electrical performance. The reasons and advantages of this treatment method are as follows:
Conductivity: Copper has good conductivity and is an ideal medium for the flow of electrons. In PCB, copper foil is used as a conductive layer to connect various electronic components and ensure smooth transmission of current.
Protective circuit: By adding plating, such as tin or gold, to the copper foil, additional protection can be provided to prevent the copper foil from being oxidized or corroded, thereby protecting the long-term stability and reliability of the circuit board.
Enhanced electrical performance: Plating not only prevents copper foil from being oxidized, but also enhances electrical performance by selecting appropriate plating materials, such as using gold plating to improve the corrosion resistance and conductivity of the circuit board.
Cost considerations: Although gold is an expensive metal, the use of gold plating in certain key signal lines or high-density interconnection areas can significantly improve the performance and reliability of the circuit board, especially in reducing signal loss and interference in high-frequency signal transmission.
When it comes to PCB surface finishes, choosing the right one is essential for the longevity and performance of your circuit board. Among the many options available, two of the most popular are Hot Air Solder Leveling (HASL) and Electroless Nickel Immersion Gold (ENIG). These two methods offer distinct advantages depending on the application, and understanding their differences can help you select the best finish for your project.
What Does HASL Stand For?
HASL stands for Hot Air Solder Leveling. It is a surface finish process used in PCB manufacturing. The term describes the method where solder is applied to the copper pads on a PCB and then leveled using hot air to ensure even coating. HASL is widely used because of its simplicity and effectiveness in providing a reliable solderable surface.
What Is HASL in PCB?
In PCB manufacturing, HASL is a surface finish applied to the exposed copper pads to protect them from oxidation and to provide a good surface for soldering components. The HASL process involves dipping the PCB into molten solder, typically composed of a lead-free alloy, and then using hot air to remove excess solder, ensuring a smooth and even layer. This finish is particularly valued for its excellent solderability and cost-effectiveness.
Characteristics of Hot Air Solder Leveling
Hot Air Solder Leveling is a widely used surface finish in PCB manufacturing due to its unique set of characteristics that make it suitable for various applications. Below are the key attributes that define HASL:
1. HASL provides one of the most solderable surfaces available for PCB assembly. The molten solder applied during the HASL process creates a coating that is highly receptive to soldering, making it easy to attach components.
2. Compared to other surface finishes like ENIG or OSP, HASL is generally more affordable.
3. The solder coating provided by HASL serves as a protective layer for the copper pads on the PCB. This layer helps prevent oxidation and corrosion.
4. Variability in coating thickness. The hot air leveling process can result in uneven distribution of solder, leading to variations in thickness across the PCB. While this might be a drawback for designs requiring fine-pitch components or precise tolerances, it is often acceptable in less demanding applications where slight variations are not critical.
5. Thermal resistance. The solder layer provided by HASL can withstand multiple thermal cycles during the PCB assembly process, such as during solder reflow.
6. The HASL process creates a strong bond between the solder and the underlying copper pads.
What Is the HASL Method?
The HASL coating process is a critical step in PCB manufacturing, designed to protect the exposed copper pads and good solderability during the assembly of electronic components. The process is under several steps, each carefully controlled to achieve a uniform and reliable coating. Here’s a detailed look at how HASL is applied to a PCB:
1. Pre-Cleaning the PCB
The HASL process begins with thoroughly cleaning the PCB to remove any contaminants such as oxidation, oils, or residues from previous manufacturing steps. This is typically done using a combination of chemical cleaning agents and mechanical scrubbing.
2. Flux Application
After cleaning, a layer of flux is applied to the PCB. Flux is a chemical agent that serves multiple purposes: it removes any remaining oxidation from the copper pads, improves the wetting of the solder, and helps the solder adhere more effectively to the copper. The type of flux used can vary, but it must be compatible with the solder alloy to ensure a reliable coating.
3. Solder Bath Dipping
The PCB is then dipped into a bath of molten solder. For lead-free HASL, the solder typically consists of a tin-silver-copper (SAC) alloy, which is heated to a temperature between 240°C and 260°C (464°F to 500°F). The molten solder covers the entire surface of the PCB, including the copper pads and through-holes, forming a protective layer.
4. Hot Air Leveling
Once the PCB is removed from the solder bath, it immediately undergoes the leveling process. The board is passed through a pair of hot air knives positioned on either side. These knives blow high-pressure, heated air across the surface of the PCB, removing any excess solder and ensuring a uniform layer remains on the pads.
5. Cooling
After leveling, the PCB is cooled to solidify the solder coating. This cooling is typically done using an air or water-based cooling system, depending on the specific requirements of the manufacturing process. Rapid cooling can sometimes introduce stresses into the solder layer, so the cooling rate must be carefully controlled to avoid defects like cracking or warping.
6. Post-Process Cleaning
In some cases, the PCB may undergo a final cleaning step to remove any flux residues or other contaminants that might remain after the HASL process. And then testing and inspection.
What Is the Difference Between HASL and ENIG Finish?
While both HASL and ENIG are popular PCB surface finishes, they differ significantly in their composition, application, and performance:
Characteristic
HASL
ENIG
Cost
Lower cost, suitable for budget-sensitive projects
Higher cost, but justifiable for high-reliability needs
Solderability
Excellent, but may vary with coating thickness
Consistent, even for fine-pitch components
Durability
Reasonable, but less effective in harsh environments
Superior, with excellent corrosion resistance
Thermal Performance
Good, but uneven surface might cause issues
Excellent, with consistent performance in high-heat scenarios
Best Suited For
General-purpose electronics, consumer products
High-reliability applications, aerospace, medical, and high-density PCBs
Surface Flatness
May have uneven surface, less ideal for fine-pitch components
Extremely flat surface, ideal for precise component placement
Environmental Impact
Lead-free HASL is environmentally safer, but traditional HASL uses lead which is harmful
Environmentally friendly, as it doesn’t use lead or other harmful materials
Shelf Life
Shorter shelf life due to potential oxidation over time
Longer shelf life due to gold’s resistance to oxidation
Reworkability
Easier to rework due to the nature of solder
More challenging to rework due to hard nickel layer
HAL vs. HASL
HAL (Hot Air Leveling) and HASL (Hot Air Solder Leveling) are terms often used interchangeably, but they can refer to slightly different processes. HAL is a broader term that encompasses any method of leveling solder using hot air. In contrast, HASL specifically refers to using solder to coat the PCB’s surface. Essentially, all HASL processes are HAL, but not all HAL processes are HASL.
What Is the Composition of HASL?
At present, the solder of lead-free solder alloy hot air leveling is mainly Sn-Cu-Ni+Ge (germanium) or Sn-Cu-Ni+Co (cobalt). The components of Sn-Cu-Ni+Ge (Germanium) in the OPA2544T are Sn, 0.7% Cu, 0.05% Ni and Ge with a nominal content of 65×10-6. Germanium can not only prevent the growth of oxides, but also prevent the solder joints on the PCB pad coating surface from yellowing and tarnishing during the HASL process and subsequent reflow welding and wave soldering processes. In addition, germanium can also inhibit the formation of slag in lead-free wave soldering.
The biggest problem in the lead-free HASL process is the problem of sinking copper in the tin tank during the use of the equipment.
The typical operating temperature range of the HASL process is 265 to 275 ° C, and this temperature range can be used for almost all actual manufactured laminates. At this temperature, even CEM1, there is no problem of delamination and degradation. However, the actual process temperature increases with the increase of copper composition in the tin tank. When the copper composition is 0.3% higher than the optimal value of 1.2%, then the welding temperature must be increased to 285 ° C, which is not the laminate can withstand. Although a copper-free solder alloy can be added to reduce the copper content in the tin tank, it is difficult to control the proportion.
The so-called “freeze-drying” method can also be used. When the tin lead eutectic solder (63Sn-37Pb) temperature drops to about 190℃, the melting tin copper intermetallic compound (Cri6Sn5) will be “freeze-dried”. In high-density lead solders, Cu6Sn5 floats on the surface of the molten solder and can be skimmed out using a slotted spoon. However, in lead-free solder, Ct16SIl5 is denser than lead-free solder, and CLJ6Sn5 will settle to the bottom of the tin tank. There is a mechanism to reduce the temperature to about 235 ° C (about 8 ° C higher than the melting point temperature), the tin tank shut down for at least two hours, preferably all night, at this time, most of the alloy is still in a molten state, you can design special tools, from the bottom of the tin tank out of the precipitation of Cr16Sn5, but it is still very difficult.
What Is the Minimum Pitch for HASL?
The minimum pitch for HASL refers to the smallest distance between two adjacent pads that can be reliably soldered using the HASL process. Due to the nature of the hot air leveling process, which can create uneven surfaces, HASL is generally not recommended for very fine-pitch components. The minimum pitch is typically around 0.65mm, but it can vary depending on the specific requirements and the quality of the HASL process used.
Does HASL Oxidize?
One of the main concerns with any PCB finish is oxidation, which can affect solderability and reliability. While HASL provides a protective solder layer that helps prevent oxidation, it is not entirely immune. Over time, especially in harsh environments, the solder can oxidize, leading to potential issues during assembly. However, proper storage and handling can minimize this risk, making HASL a reliable choice for many applications.
How Thick Is the HASL Coating?
The thickness of the HASL coating can vary depending on the process parameters and the type of solder used. Typically, the thickness ranges from 1 to 25 microns. This variability can be a drawback for applications requiring precise and consistent thickness, especially for fine-pitch components. However, for many general-purpose applications, the thickness provided by HASL is more than sufficient.
What Is the Black Pad Syndrome?
Black pad syndrome is a phenomenon associated with the ENIG finish, not HASL. It occurs when there is an issue with the nickel layer during the ENIG process, leading to poor solder joints and potential failures. The term “black pad” refers to the appearance of the affected nickel layer, which turns black due to oxidation and contamination. While this issue is unrelated to HASL, it’s important to note that HASL does not suffer from black pad syndrome, making it a more straightforward and reliable finish in this regard.
When choosing between lead-free HASL and ENIG surface finishes for your PCB, it’s important to consider the specific needs of your project. For reliable and high-quality PCB manufacturer, consider working with EBest Circuit (Best Technology), a leader in the field. With our expertise and advanced technology, we ensure that your PCBs meet the highest standards of quality and performance. Whether you choose HASL or ENIG, we have the experience and capability to deliver the best results for your project.
Ceramic PCB is an innovation of traditional PCB circuit board. Ceramic PCB will use an organic compound called polyimide as solder paste, and ceramics (aluminum nitride, aluminum oxide, beryllium oxide) are often used as substrate materials. In the electronic power industry, ceramic PCB is a substitute for the traditional PCB technology based on FR-4 glass epoxy resin laminated with a thin copper layer.
The market of ceramic PCB is growing faster and faster because of its unique performance and cost-effectiveness. Compared with traditional FR4-PCB, they have many advantages, including thermal conductivity, chemical resistance, electrical insulation and high thermal shock resistance. So it is widely used in military, aerospace, consumer electronics industry and Internet of Things equipment.
What is a Ceramic PCB?
Ceramic PCB or ceramic circuit board is a kind of printed circuit board using ceramic material as substrate. Different from the traditional PCB which often uses FR4 and other materials, ceramic PCB has better heat dissipation and electrical insulation. These characteristics make ceramic PCB an ideal choice for high-power applications such as LED lighting, power electronics and automotive electronics.
Commonly used ceramic materials for ceramic PCB generally include alumina (Al2O3), aluminum nitride (AlN) and silicon carbide (SiC). These materials can provide the necessary thermal conductivity and mechanical strength for ceramic PCB applications, and ensure that the circuit board can withstand high temperature and harsh working conditions.
One of the main advantages of ceramic circuit boards is that they can handle higher power load without overheating risk, which significantly improves the service life of ceramic PCB. At the same time, the low coefficient of thermal expansion (CTE) in ceramic materials also reduces the risk of thermal stress and further improves the durability of ceramic PCB.
How to Make Ceramic PCB?
Due to the unique properties of ceramic materials, the process of manufacturing ceramic PCB is more complicated than traditional PCB. The manufacturing process usually involves several key steps:
Firstly, the first step is to select the appropriate ceramic materials according to the specific requirements of the circuit board.
The second step is to press and sinter the ceramic powder into the required shape and thickness after selecting the material. The sintering process involves heating the material to a high temperature to fuse the particles together, thus forming a dense and solid substrate.
The third step is to deposit a layer of metal (usually copper or gold) on the surface after the substrate is formed, then apply photoresist material to the metal layer, and use ultraviolet rays to expose the required circuit pattern, and then etch away the exposed area, leaving the circuit pattern.
Finally, after the circuit is formed, the circuit board should go through a finishing process to improve its performance and durability. Finally, the quality of the finished circuit board should be checked to ensure that it meets all the required specifications.
This process can make ceramic PCB highly reliable and can work normally under extreme conditions.
How Many Layers in Ceramic PCB?
Ceramic PCB can be made of multiple layers like traditional PCB, and its number of layers depends on the complexity of the circuit and the application requirements.
Single-layer ceramic PCB is composed of a single-layer ceramic material and a metal circuit at the top, which is usually used for heat dissipation applications.
Multilayer ceramic PCB is more complex, consisting of multilayer ceramic materials and metal circuits, which are stacked together and interconnected by vias. The extra layer allows more complex circuit design, enabling the circuit board to handle more signals and power for applications requiring higher functions.
The number of layers in ceramic PCB can range from one to several. Each additional layer will increase the complexity and cost of the circuit board, but it will also increase its function and performance, depending on its application scenario.
How Thick is Gold Conductor Printed on the Ceramic PCB?
The thickness of gold conductor on ceramic PCB is an important factor affecting the performance and durability of circuit board. The thickness of gold conductor depends on the application and required performance characteristics, and is usually in the range of 0.5 micron to 10 micron. Of course, a thicker gold layer can also be provided, which also brings better conductivity and more stable performance, especially in high-power applications, which also brings higher costs.
In high frequency applications, the thicker gold layer can reduce the signal loss, improve the overall performance of the circuit, and also better prevent wear and prolong the service life of PCB.
Considering the specific requirements of the application, the exact thickness of the gold conductor has been determined in the design stage. Our advanced manufacturing technology enables us to accurately control the thickness of the gold conductor and ensure that each circuit board meets the required specifications.
What is the Ceramic insulator on the Circuit Board Used For?
Ceramic insulators are generally used to electrically insulate different components and conductive paths on a circuit board, prevent short circuits and ensure that the circuit operates as expected. It plays a vital role in the performance and reliability of ceramic circuit boards.
Even a small amount of current leakage will cause serious problems. Ceramic materials of insulators provide excellent electrical insulation performance, which means that they can withstand high voltage without allowing current to pass through. In addition to electrical insulation, ceramic insulators also have thermal insulation properties, which can help control the heat generated by components on the circuit board.
Ceramic insulators are usually placed between metal conductors on the circuit board, which allows multiple conductive paths to be placed closely together without the risk of short circuit because they are electrically insulated from each other.
Generally speaking, ceramic insulator is a key component of ceramic PCB, which helps to improve its performance and reliability.
What equipment does BEST Technology have?
We use advanced machines at every step of the production process, from substrate molding to circuit molding and surface treatment, to ensure the highest quality ceramic PCB.
For substrate forming, we have high-precision press and sintering furnace, which can produce dense and uniform ceramic substrates.
Our metallization process is also supported by advanced sputtering and chemical vapor deposition equipment to ensure that a consistent high-quality metal layer can be formed on the substrate.
At the same time, we also have cutting-edge lithography equipment for circuit formation, which enables us to create complex and accurate circuit patterns on the circuit board.
In addition to our advanced equipment, our team of technicians and engineers have rich experience in the production of ceramic printed circuit boards. Combined with our most advanced equipment, we can provide high-quality products that meet the most demanding requirements.
Ceramic PCB has a series of advantages, from materials to technology, each of which provides corresponding advantages, including excellent thermal management, electrical insulation and durability, making them an ideal choice for high power and high temperature applications. BEST Technology has advanced manufacturing technology, first-class equipment and commitment to quality, which can ensure that our ceramic PCB achieves the highest performance and the best quality. Whether you need a single-layer board or a complex multi-layer design, we have the expertise and equipment to provide products that meet your needs.
rigid-flex printed circuit board ,Rigid flex pcb manufacturer. More than 5 years design team of 10 people. Quick proofing within 1 week. A 3,000-square-meter factory for small batch to mass production and assembly.
What is a rigid flex pcb?
Rigid flex pcb,rigid-flex printed circuit board，Rigid flex circuit are a hybrid construction flex circuit consisting of rigid and flexible substrates which are laminated together into a single structure. Each layer of rigid-flex circuit are electrically interconnected by plated through holes (PTH), which is different from a flexible circuit with FR4/PI stiffener on top or bottom of flex circuit only by the means of presensive or thermal senstive adhesive only, no PTH.
Rigid-flex PCBs can be divided into single-sided boards, double-sided boards and multi-layer boards according to the number of conductive circuit layers. Multi-layer boards usually contain multiple rigid layers and flexible layers, and the circuits are connected and interconnected through interlayer connections.
Is Rigid flex PCB reliable?
Design and manufacturing efficiency: Designers of rigid-flex boards can use a single component to replace a composite printed circuit board connected by multiple connectors, multiple cables and ribbon cables, which not only has stronger performance and higher stability, but also limits the scope of the design to one component, optimizing the available space by bending and folding the lines like a stacked paper swan.
Space and weight optimization: In PCB prototyping for consumer electronics, the use of rigid-flex boards not only maximizes space use and minimizes weight, but also greatly improves reliability, eliminating many needs for solder joints and fragile and fragile wiring that are prone to connection problems. The design of this circuit board allows the size and weight of equipment and systems to be reduced while maintaining functionality.
High stress environment adaptability: Rigid-flex boards also have high impact resistance and can survive in high stress environments, which makes it widely used in military, aviation and medical equipment.
Excellent electrical performance: Rigid-flex boards provide excellent electrical performance, and good thermal conductivity makes components easy to cool. The lower dielectric constant of the flexible part allows for fast transmission of electrical signals, and the PI substrate has a higher glass transition temperature or melting point, which allows the components to operate well at higher temperatures.
Assembly reliability: Rigid-flex boards reduce the hardware required for traditional rigid boards and flexible boards to be connected, such as traditional jumper sockets, etc., and can provide higher assembly reliability.
What is the difference between rigid flex and semi flex?
Definition and structure Rigid-flexible board: It is a combination of soft board and hard board, that is, a thin layer of flexible bottom layer and rigid bottom layer are combined and laminated into a single component to form a circuit board1. It changes the traditional flat design concept and expands it to a three-dimensional space concept. It has both rigid layer and flexible layer and is a multi-layer printed circuit board. Semi-flexible board: It is a PCB used in the field of static bending obtained by combining controlled deep milling or rigid-flexible board processing technology (such as milling cover or opening window, etc.) in the standard hard board processing process2. It often uses FR4 material, first processes the PCB according to the normal process, and then mills the middle part that needs to be bent to make it flexible.
Flexibility and application Rigid-flexible board: It has higher flexibility and can be bent, folded or rounded, and then integrated into various products, such as aerospace equipment, military aircraft, high-end medical equipment, digital cameras, portable cameras and high-quality MP3 players. Semi-flexible board: Although it can be bent or curved, its flexibility is not as good as that of rigid-flexible board. It is mainly used in situations where static bending is required, such as endoscopes in medical equipment, injection needle tip protection circuit boards, and medical equipment temperature control circuit boards.
Processing and cost Rigid-flexible board: Due to the mixed use of multiple materials and multiple production steps, its processing time is longer and the production cost is higher. Semi-flexible board: Although its processing process is also more complicated, its processing cost is lower than that of rigid-flexible board, and it is more suitable in some applications.
Features and advantages Rigid-flexible board: It has stronger performance and higher stability, can reduce space and weight, and improve the reliability of connection.
Semi-flexible board: It has the advantages of low cost, good dimensional stability, bendable three-dimensional installation to reduce space, and reduce the number of interfaces during assembly to improve reliability.
how do they add rigid layers to flex pcb?
Design layout: Before starting the manufacturing process, the PCB design layout is first carried out to determine the location and connection method of the components.
Substrate preparation: Clean the laminate containing the copper layer to prepare for the subsequent manufacturing process.
Pattern generation: The generation of circuit patterns is completed by screen printing or photo imaging.
Etching process: The laminate with the circuit pattern is soaked in an etching tank or sprayed with an etchant solution for etching.
Mechanical drilling: Circuit holes, pads and via patterns are drilled using a precision drilling system or technology, such as laser drilling technology.
Copper plating process: Deposit the required copper in the plated vias to establish electrical interconnections between layers.
Covering layer application and lamination: Apply the covering layer material (such as polyimide film) and adhesive, and laminate under specific temperature, pressure and vacuum limits to ensure proper adhesion of the covering layer.
Apply stiffeners: Apply local additional stiffeners before additional lamination processes as required by the board design.
Flexible board cutting: Cut flexible boards from production panels using hydraulic punching methods or specialized punching knives.
Electrical testing and verification: Conduct electrical testing in accordance with IPC-ET-652 guidelines to confirm that the insulation, connection, quality, and performance of the circuit board meet the requirements of the design specifications.
What are the disadvantages of rigid flex PCB?
Material damage or breakage: The flexible materials used in rigid-flex boards are susceptible to flexure and bending. Long-term use or improper handling may cause damage or breakage of the flexible part, resulting in an open circuit.
Poor welding: The manufacture of rigid-flex boards requires welding processes. If the welding is poor or the solder joints are of poor quality, it may cause loose connections or solder joints to fall off, resulting in an open circuit.
Excessive bending or stretching: Excessive bending or stretching during use may cause the connection wires or wires of the flexible part to be stretched excessively and break, causing an open circuit.
Design defects: If the design of the rigid-flex board is unreasonable or defective, such as insufficient design of the overbending area or too small bending radius, the material of the flexible part may be damaged by excessive stress, resulting in an open circuit.
Environmental factors: Under different environmental conditions, it may be affected by factors such as temperature, humidity, and chemicals. Long-term use in harsh environments may cause material aging or corrosion, resulting in an open circuit.
Damage during assembly: During the assembly process, improper operation or external force may cause damage to the connecting wires or wires of the flexible part, resulting in an open circuit.
Application fields of rigid flex PCB
Automotive electronics: Rigid-flex boards are widely used in automotive electronic systems such as dashboards, navigation systems, and in-car entertainment systems in the automotive industry. Their flexibility and high reliability enable them to adapt to the complex spatial layout and vibration environment inside the car.
Medical equipment: In the field of medical equipment, rigid-flex boards also have important applications, such as medical monitoring equipment, medical imaging equipment, etc. Its flexible part can adapt to different equipment shapes and size requirements, while having stable circuit connection performance.
Aerospace field: Rigid-flex boards are usually used in aircraft dashboards, navigation systems, communication equipment, etc. in the aerospace field. Due to their light, thin and flexible characteristics, rigid-flex boards have become an ideal choice for aerospace equipment.
Smart wearable devices: With the rapid development of smart wearable devices, rigid-flex boards are widely used in products such as smart watches and health monitoring equipment. They can be combined with curved display screens, sensors and other components to achieve a more humanized design.
Industrial control field: In the field of industrial automation control, rigid-flex boards are often used in PLC controllers, robot control systems, sensor interfaces, etc. Its flexibility and reliability ensure the stable operation of the equipment in harsh environments.
Rigid flex pcb manufacturer
rigid flex pcb.rigid-flex printed circuit board，Rigid flex circuit are a hybrid construction flex circuit consisting of rigid and flexible substrates which are laminated together into a single structure. Each layer of rigid-flex circuit are electrically interconnected by plated through holes (PTH), which is different from a flexible circuit with FR4/PI stiffener on top or bottom of flex circuit only by the means of presensive or thermal senstive adhesive only, no PTH.
Multilayer circuitry-from 3 to 14+ layers Min LW/LS: 4mil/4mil Adhesive-based and adhesiveless constructions, including thermoplastic and thermoset stiffener attachment. Polyimide substrates: 1/2mil – 4mil Copper: 1/3OZ – 2OZ, RA or ED type Stiffeners include Polyimide (0.075-0.20mm), FR4 (0.15-2.0mm), and punched or formed metal parts (0.075-1.0mm) Low-cost, conventional fabrication and lamination completed with PTH based plating Screened inks, photo-imageable soldermasks, or laminated coverlay dielectrics Surface finishes: ENIG, electroplated nickel/gold, immersion silver, tin, EMI Shielding
how to design flex rigid pcb?
Rigid-Flex Circuit Design Guidelines
To form a rigid-flex, follow these considerations to ensure the best results.
Considerations When Designing Rigid-Flex Circuits
To produce a rigid-flex PCB with unmatched quality and functionality, you must follow the correct manufacturing specifications. This is the set guidelines and standards that manufacturers must consider when designing and manufacturing flexible circuit boards.
Determine Manufacturing Process and Materials Beforehand
Depending on the flexibility you require, you need to decide beforehand what materials to use and the methods to use. Example; When the board you are designing only needs to be folded during manufacturing and thereafter be in a fixed position without bending, you can decide the following
Copper type and grade
Manufacturing method
Number of layers to be used.
On the other hand, if the board is for an application with frequent movement, vibration, and impact, you must be clear in choosing the following:
Copper Coils
Adhesives and
Number of Layers
Place Copper Traces at Right Angles to Rigid-Flex
Copperworks is a great fit when placed on the right edge of the board. Avoid bending copper traces at corners as it will pull stress and may not create the best bend. For PCB flex that requires bending, use sharp radius bends to avoid smudging copper traces.
Provide adequate pad support for exposed copper
Repetitive stress from frequent bending can cause copper on the circuit to break away from the polyimide substrate. Support exposed copper with pads to prevent separation.
Use hatched polygons
Hatched polygons instead of solidified copper help maintain the flexibility of flexible PCBs.
Leave at least 1/2mm gap between copper ring and adjacent vias
1/2mm helps avoid fatigue caused by frequent bending. Placing vias in fixed areas of the board helps avoid frequent movement and bending, resulting in the best rigid-flex.
The customs code for printed circuit boards is 8534-0000. 8534 is the classification code for this item, and 0000 represents the sub-classification code under this item. In the actual customs declaration process, it is necessary to select the corresponding sub-classification code according to the specific classification standard of printed circuit boards.
hs code printed circuit board：85340000 PCBs made of FR-4 material (i.e. silicon tetrachloride fiberglass board) are classified under HS code 8534.00.00 hs code printed circuits with more than six layers：85340010 hs code printed circuits with four layers or less:85340090 The HS code for PCB (printed circuit board) is 8534001000. HS code of PCBA is 8543709990
How do you classify printed circuit boards?
According to different classification standards, printed circuit boards can be divided into many types, such as single-sided boards, double-sided boards, multi-layer boards, rigid boards, flexible boards, etc.
The role of HS codes for printed circuit boards
HS codes are a way for customs to classify goods, and are also an important basis for import and export statistics. As an electronic component, printed circuit boards also need to be HS coded so that customs can accurately classify and manage them.
Types of HS codes for printed circuit boards
There are two main HS codes for printed circuit boards: 85340010 and 85340090. Among them, 85340010 is mainly used for printed circuits with more than six layers, while 85340090 is mainly used for printed circuits with four layers or less. The difference between the two codes lies in the number of layers of the printed circuit board, because printed circuits with more than six layers require higher technical requirements and more complex production processes.
How to choose the correct HS code
The specific HS code may vary depending on product specifications, materials and other factors. Therefore, in actual operation, it is recommended to consult relevant departments or professionals according to the specific situation to ensure accuracy. If you are not sure which HS code to choose, you can consult the printed circuit board manufacturer or relevant industry associations for more professional advice.
How do I do a customs declaration?
Declare the code accurately. Select the sub-classification number corresponding to the printed circuit board according to the actual situation to avoid penalties or detention caused by coding errors.
Provide a complete production process. The production process of the printed circuit board needs to be provided in the customs declaration, including the procurement, production, processing, testing and other links of the materials, so as to facilitate the customs inspection of the printed circuit board.
Declare accurate materials and technical parameters. The technical parameters such as the substrate, copper foil thickness, board thickness, drilling diameter, line width, line spacing, etc. used in the printed circuit board need to be accurately declared in the customs declaration.
Re-declaration is required if the dominant production process is changed. If the dominant production process is changed, it is necessary to re-declare to the customs and re-make the customs declaration.
Comply with relevant national quality standards. Printed circuit boards need to meet relevant national quality standards, such as ISO, UL, etc.
hs code electronic,How do I find an HS code?The HS code for PCB (printed circuit board) is 8534001000. PCBs made of FR-4 material (i.e. silicon tetrachloride fiberglass board) are classified under HS code 8534.00.00
TDA7294 is a class AB monolithic audio amplifier integrated circuit launched by SGS-THOMSON Microelectronics in the 1990s. It swept away the raw, cold and hard sound of previous linear integrated amplifiers and thick film integrated amplifiers, and is widely used in HiFi fields, such as home theaters, active speakers, high-performance TVs and other fields.
The chip adopts a 15-pin dual-row asymmetric plug-in package, the differential input stage is composed of bipolar transistors, and the driver stage and power output stage use DMOS field-effect transistor semiconductor technology. This hybrid semiconductor manufacturing process allows TDA7294 to take into account the advantages of bipolar signal processing circuits and MOS power tubes, and the playback sound is very friendly (it is praised by audiophiles as a “tube-flavored amplifier”); the built-in silent standby function, short-circuit current and overheating protection functions make its performance more perfect. It can be used in HiFi home audio, active audio, high-performance TVs and other fields.
Tda7294 amplifier board
tda7294 amplifier board PCBA
This circuit is an official standard circuit, stable and reliable.
The filter uses a large electrolytic capacitor with a withstand voltage of 50V and a capacity of 2200uf.
Power supply voltage: dual 12-36V ring transformer, dual 32V ring transformer is recommended
Output power: 85W*1 undistorted rated power, peak power 100W
Can easily drive speakers above 100W, speaker impedance: 4-8 ohms
PCB size: 50*50mm
Basic parameters: Power supply: dual 18-28V AC Power: 2X80W+160W subwoofer Circuit board size: 218x98MM Potentiometer function: low frequency frequency adjustment, subwoofer volume. Left and right channel volume, treble, bass.
Adopting the new laser dark word TDA7294 The power filter uses 6 63V3300UF capacitors, and the rectifier uses a 25A imported rectifier flat bridge. PCB uses 1.6mm thick double-sided board, 2.0 ounces copper thickness, and full tin spraying process to ensure good passing performance of large and small currents. Fever component assembly, the subwoofer part consists of two new TDA7294 BTL output, The low-pass filter is designed according to the frequency adjustable design of home theater style (50-150HZ), with strong power! The left and right channels are served by two TDA7294 respectively, and the input coupling capacitor uses the German imported WIMA 2.2UF coupling capacitor, which makes the sound sweeter! The signal-to-noise ratio of the board is also very high, and even if you put your ear close to the speaker, you can’t hear the AC noise! It is the best choice for upgrading 2.1 amplifiers!
TDA7294 datasheet
TDA7294 Main Features
Wide supply voltage range: ±10V ~±40V High output power: 70W (up to 100W) Standby and mute functions Noiseless ON/OFF switch Low noise and low distortion Short circuit protection and overheat protection
TDA7294
Pin function Pin 1 is the standby terminal; Pin 2 is the inverting input terminal; Pin 3 is the positive input terminal; Pin 4 is grounded; Pins 5, 11, and 12 are empty pins; Pin 6 is the bootstrap terminal; Pin 7 is +Vs (signal processing part); Pin 8 is -Vs (signal processing part); Pin 9 is the standby pin; Pin 10 is the mute pin; Pin 13 is +Vs (final stage); Pin 14 is the output terminal; Pin 15 is -Vs (final stage)
DIY Production
1) The first step is to get the PCB. Here you can make the PCB yourself by DIY ironing method. Since the PCB is easy to make, the PCB design is kept single layer only, or you can get ready-made quality PCB from best.or custom tda7294 amplifier board. 2) After the PCB is completed, carefully mount all small components like jumpers, resistors, diodes, etc. to the PCB and trim their terminals, then solder them to the PCB first, because there are many components on this board, so it is better to solder them one by one 3) After installing the small components, install the large components like capacitors, fuse holders, rectifiers to the PCB and solder them. (Don’t install the power filter capacitor, 22000uF capacitor for now. Completed in the following steps) 4) After that, it’s time to mount all 7 ICs to the PCB and solder them. 5) Now properly mount the heat sink on the IC using insulating MICA and insulating plastic shoulder washers. Remember to use good quality thermal paste between the heat sink and IC. 6) After mounting the IC on the heat sink. Check the continuity between the heat sink and the IC back plate using a multimeter. There should not be any continuity between them. Please note the heat sink isolation 7) Now mount the cooling fan to the PCB using cable ties or any other suitable method. The board assembly is now complete. Clean the track side of the board using IPA (Isopropyl Alcohol) or cleaning flux and then power the board using a 20-0-20 VAC transformer or a 24-0-24 VAC transformer.
Which one has better sound quality, TDA7294 or LM3886? Voltage AC 28v
LM3886 has better bass because its maximum current can reach 10A, which means it can drive a 2-ohm box without any problems. From the parameters alone, LM3886 is worse than 7294. And it is true in practice, especially for bass. If the transformer is OK, it feels very powerful. 7294 is not as good as 3886 in bass. The current is large when it comes to bass. 7294 itself has overcurrent protection. When the current reaches a certain level, it starts to limit the output current. However, 7294 is better in treble.
When communicate with clients, they always ask why the PCB board are so expensive? Is there any basis for that? Actually, the price of PCBs are made specifically according to its manufacturing process, layers, complexities and so on. Today, EBest Circuit (Best Technology) is deeply sharing the composition of PCB cost. Welcome to keep reading.
Why is PCB Board So Expensive?
The cost of a PCB can sometimes seem high due to several reasons. Firstly, the complexity of the design plays a significant role. High-density interconnect (HDI) PCBs, multi-layer PCBs, and those requiring advanced materials or special finishes can drive up the cost. Additionally, stringent quality control measures and the need for precise manufacturing processes add to the expense.
Another factor is the cost of raw materials. Copper, laminates, and specialty substrates can vary in price, affecting the overall cost of the PCB. Furthermore, labor costs in the region where the PCB is manufactured, along with overhead costs such as utilities and facility maintenance, contribute to the final price.
What Factors Affect the PCB Board Cost?
PCB board can cost from $10 to $500 to produce. Buyers are always amazing that why PCB cost so high? But they don’t know there are numerous factors a manufacturer considers in determining PCB costs. If you are in the market to design a PCB, this guide provides factors to consider that could increase or decrease the cost of circuit boards.
Manufacture technology
The specific technology used in the PCB can significantly impact the cost. Advanced technologies such as HDI (High-Density Interconnect), embedded busbar or flexible PCBs often require more complex manufacturing processes, which can increase the cost.
Material Type
The type of materials used for the PCB, such as standard FR4, high-frequency laminates, or other specialty substrates, can influence the cost. Higher quality or specialized materials typically cost more.
IPC Grade
The IPC standards and grades indicate the quality and reliability requirements of the PCB. In electronics manufacturing, printed circuit boards are divided into three levels: level 1, level 2 and level 3. These grades reflect the quality level of each board type, from the lowest (Level 1 standard) to the highest (Level 3 standard). This classification system was developed and defined by IPC and is specified in the IPC-6011 series.
Circuit Design
The complexity of the circuit design, including the number of layers, trace width, and spacing, affects the cost. More intricate designs require more precision and advanced techniques, leading to increased expenses.
PCB Size & Yield
The physical dimensions of the PCB and the yield rate during production play a role in the overall cost. Larger boards or designs with lower yield rates (more defects) will typically cost more to produce.
Material Thickness
The thickness of the materials used in the PCB construction, such as the substrate and copper layers, can impact the cost. Thicker materials may be more expensive and require more resources to process.
Copper Thickness
The thickness of the copper used in the PCB, measured in ounces per square foot, can affect the cost. Thicker copper layers provide better electrical performance but are more expensive.
Stack-up
The method of layering and stacking the materials in the PCB, known as the stack-up configuration, can influence the cost. Complex stack-ups with multiple layers and specific arrangements can be more costly to manufacture. Read our another post of How Can I Reduce and Optimize the Cost of My PCB in A Best Way?
Manufacturing Process of A Standard PCB
PCB Design and Layout
The manufacturing process begins with the design phase, where engineers use CAD (Computer-Aided Design) software to create the PCB layout. This includes defining the circuit paths, components, and layers, ensuring the design meets the electrical and mechanical requirements.
Once the design is finalized, a photomask is created, which is a transparent film with the PCB design printed on it. The PCB substrate, typically made of FR4, is then coated with a light-sensitive material called photoresist.
Drilling
Precise holes are drilled into the board for through-hole components and vias using computer-controlled drilling machines. The board is cleaned and deburred to remove any rough edges or debris from the drilling process.
Plating and Copper Deposition
A thin layer of copper is deposited on the surface of the board and inside the drilled holes through an electroless plating process, providing a conductive base. Additional copper is electroplated onto the board, building up the thickness of the copper traces and plated through-holes.
Pattern Transfer
The photomask is placed over the photoresist-coated substrate and exposed to ultraviolet (UV) light. The UV light hardens the photoresist where the design allows light to pass through, and the board is then developed to wash away the unhardened photoresist, leaving behind the desired circuit pattern.
Etching
The PCB undergoes an etching process using a chemical solution to remove unwanted copper, leaving only the copper traces that form the circuits. The remaining hardened photoresist is then stripped away to reveal the clean copper pattern.
Applying Solder Mask
A layer of solder mask is applied to the board to protect the copper traces from oxidation and prevent solder bridges during assembly. The solder mask is cured using UV light, hardening it and making it durable.
Surface Finish/Surface Treatment
A surface finish is applied to the exposed copper areas to protect them and facilitate soldering. Common finishes include HASL (Hot Air Solder Leveling), ENIG (Electroless Nickel Immersion Gold), and OSP (Organic Solderability Preservatives).
Outline Routing
One the surface treatment finish, it will be routed according to the manufacturing file by CNC machine. And then individual PCBs are cut from the larger panel using routing or V-scoring, depending on the board design and requirements.
Electrical Testing & FQC
The PCB undergoes electrical testing to check for short circuits, open circuits, and other defects. This is typically done using a flying probe tester or a bed-of-nails tester. Then the board is visually inspected for any cosmetic defects or anomalies, and further tests and inspections are performed to ensure the PCB meets all specified requirements and standards. Below you can see the full manufacturing process video of a PCB:
EBest Circuit (Best Technology) – A 18+ Years Experience PCB Manufacturer
When you are looking for a reliable PCB manufacturer, considering EBest Circuit (Best Technology). We have transparent price and 5years quality warranty. We 24/7 hours online and welcome all the technical questions and PCB inquiries. Contact us for more!
Common PCB failures are mainly concentrated on components such as capacitors, resistors, inductors, diodes, transistors, MOSFETs, integrated chips (IC), and crystals. Some obvious damages can be visually detected, while others require the use of tools. Today, let’s learn how to troubleshoot PCB faults using a multimeter.
How Will You Diagnose a Faulty PCB By Visually?
For some printed circuit boards, we can check by our naked eyes. Here are some common ways to follow:
1. Check the condition of components
When you get a faulty PCB, first observe if there are any obvious component damages, such as burnt or swollen electrolytic capacitors, burnt resistors, and damaged power devices.
2. Inspect the soldering of the PCB
Check if the printed circuit board (PCB) is deformed or warped; if there are any loose or poorly soldered joints; if the copper cladding on the PCB is lifted, burnt, or blackened.
3. Examine the component plug-ins
Ensure the correct orientation of integrated circuits, diodes, and the PCB power transformer.
How to Check PCB with a Multimeter?
Before you start testing your PCB, ensure you have the right tools and environment. Here’s a checklist to get you started:
1. Safety First: Wear anti-static gloves and ensure you are working on an anti-static mat to prevent damage to the PCB.
2. Multimeter Selection: Choose a multimeter with the ability to measure voltage, resistance, and continuity. A digital multimeter is preferred for accuracy.
3. Visual Inspection: Examine the PCB for visible signs of damage such as burnt components, broken traces, or solder bridges.
4. Power Off the Board: Always test the PCB with the power off to avoid any electrical hazards and damage to the multimeter.
How Do You Test Individual Components on a PCB?
Testing individual components like resistors, capacitors, and diodes can pinpoint the exact failure. Here’s a general approach:
Diode
Transistor
MOSFET
Electrolytic Capacitors
How to Test Diodes?
1. Set the MF47-type multimeter to measure resistance.
2. Place the red and black probes on the two ends of the diode and read the value.
3. Swap the probes and measure again.
4. Judge based on the two measurements: the forward resistance of small power germanium diodes is 300-500Ω, silicon diodes are about 1kΩ or larger. The reverse resistance of germanium diodes is tens of kilo-ohms, and silicon diodes are above 500kΩ (values are much smaller for high-power diodes). A good diode has low forward resistance and high reverse resistance, and the larger the difference, the better.
5. If both forward and reverse resistances are very low, the diode is short-circuited; if both are very high or infinite, the diode is open-circuited and needs to be discarded.
How to Test Transistors?
1. Set the digital multimeter to the diode mode.
2. Measure the PN junction with the probes. If it conducts forward, the displayed value is the forward voltage drop of the PN junction.
3. Determine the collector and emitter: measure the forward voltage drop of the two PN junctions, the larger drop is the emitter (e), and the smaller drop is the collector (c). If the red probe is connected to the common terminal, the transistor is NPN type, and the common terminal is the base (b); if the black probe is connected to the common terminal, the transistor is PNP type, and the common terminal is the base (b).
4. For in-circuit testing, measure the forward and reverse resistance of the PN junction to determine if the transistor is damaged. If the branch resistance is larger than the forward resistance of the PN junction, there should be a clear difference between the forward and reverse resistances, otherwise, the PN junction is damaged.
The Way to Test MOSFETs?
1. Connect the black probe to the drain (D) and the red probe to the source (S), the resistance should be 500-600.
2. Without moving the black probe, touch the gate (G) with the red probe, then measure the source (S) again; it should conduct.
3. Connect the red probe to the drain (D), touch the gate (G) with the black probe, then measure the source (S); the resistance should be the same as the first measurement, indicating the MOSFET is working normally.
How to Test Electrolytic Capacitors?
1. Select the appropriate range on the MF47-type multimeter based on the capacitor’s capacity. Use R×1K range for capacitors below 47μF, and R×100 range for those above 47μF.
2. Connect the red probe to the negative lead and the black probe to the positive lead of the capacitor.
3. On initial contact, the multimeter needle will deflect right and then gradually return to the left until it stops at a certain position (close to infinity). This value is the capacitor’s forward leakage resistance; the larger the value, the better the capacitor’s performance.
4. Swap the probes and repeat the process. The measured value will be the reverse leakage resistance, slightly smaller than the forward leakage resistance.
5. If no charging phenomenon occurs (the needle doesn’t move), the capacitor is either open or short-circuited internally. If the resistance is very small or zero, the capacitor is leaky or has broken down and cannot be used.
This is the end of this article, if you want to know more about it, welcome to contact us.
As electronic devices become increasingly miniaturized and high-performance, traditional circuit boards are no longer sufficient for certain high-demand applications. To address these challenges, the Thermal-Electric Separation Copper Substrate with Flexible PCB has emerged. This innovative composite circuit board combines the efficient heat dissipation characteristics of thermal-electric separation copper substrates with the flexibility of flexible PCBs (FPC). It is widely use for high-performance electronic products, which requires efficient heat dissipation and complex circuit.
What is Thermal-Electric Separation Copper Substrate with Flexible PCB?
The Thermal-Electric Separation Copper Substrate with Flexible PCB is a composite material that combines a rigid thermal-electric separation copper substrate with a flexible circuit board. It integrates the advantages of both, providing superior performance in high-power and high-density applications.
1. Thermal-Electric Separation Copper Substrate
The thermal-electric separation copper substrate is designed for high-power electronic devices, providing an efficient heat dissipation solution. It separates the paths of heat and electrical signals to avoid thermal interference with electrical performance. Its structure typically includes:
Single-sided design: Electronic components are placed on one side of the copper substrate, while the other side is used for heat dissipation.
High thermal conductivity materials: Such as copper or aluminum, which can quickly conduct heat, like copper is 400W/m.k, aluminum is 237W/m.k.
Thermal vias: Vertical heat conduction paths that rapidly transfer heat to the dissipation layer.
2. Flexible PCB (FPC)
Flexible PCBs (Flexible Printed Circuits, FPC) use flexible materials like polyimide (PI) or polyester (PET) that can bend and fold to adapt to complex three-dimensional structures and dynamic application scenarios. Their advantages include:
Lightweight: Reducing the overall weight of the device.
High-density wiring: Achieving complex circuit designs in limited space.
Flexibility: Meeting diverse design needs.
Structure and Characteristics
The structure of the Thermal-Electric Separation Copper Substrate with Flexible PCB includes rigid and flexible parts, connected together using conductive adhesives or other bonding materials to form a unified whole.
1. Rigid Part
The rigid part uses the thermal-electric separation copper substrate, responsible for efficient heat dissipation and mechanical support. This part usually carries high-power components to ensure rapid heat transfer and dissipation.
2. Flexible Part
The flexible part uses the flexible PCB, which can bend and fold to fit the complex internal structure of devices. This part is typically used to connect the rigid part with other modules that require flexible connections.
3. Bonding Method
The flexible and rigid parts are bonded together using conductive adhesives, welding, or mechanical connections. The design of the bonding area ensures stable electrical connections and reliability during bending and dynamic use.
Thermal-Electric Separation Copper Substrate with Flexible PCB Advantages
1. Efficient Heat Dissipation
The thermal-electric separation copper substrate provides excellent heat dissipation, effectively conducting away the heat generated by high-power components to maintain a reasonable operating temperature range. This is especially important for applications like high-power LEDs and power semiconductor devices.
2. Flexibility
The use of the flexible PCB offers great design freedom, allowing adaptation to the complex three-dimensional structures and dynamic application needs within devices. This enables designers to achieve more complex circuit designs in limited spaces, increasing device integration and functionality.
3. Reliability
The thermal-electric separation design and high thermal conductivity materials enhance the reliability of the circuit board, reducing the impact of heat on electrical performance. The flexible part reduces the number of connection points, lowering the risk of failure.
4. Space Saving
Combining the advantages of rigid and flexible circuit boards allows for efficient heat dissipation and complex circuit in limited space. This is crucial for modern miniaturized and high-density electronic product designs.
Where Thermal-Electric Separation Copper Substrate with Flexible PCB used?
1. High-Power LED Lighting
High-power LEDs generate a significant amount of heat during operation. The thermal-electric separation copper substrate provides an efficient heat dissipation solution, ensuring the stable operation and long lifespan of LEDs. The flexible part is used to connect different LED modules, accommodating diverse design requirements.
2. Automotive Electronics
In automotive electronics, such as in-vehicle cameras and sensor modules, efficient heat dissipation and compact design are required. The thermal-electric separation copper substrate with flexible PCB can meet these demands, enhancing device reliability and performance.
3. Consumer Electronics
Devices like smartphones and tablets require lightweight and miniaturized designs. The thermal-electric separation copper substrate with flexible PCB offers efficient heat dissipation and flexible circuit, optimizing device performance and user experience.
4. Medical Devices
In applications that require flexibility and reliability, such as portable diagnostic equipment and implantable medical devices, the thermal-electric separation copper substrate with flexible PCB can help to enhancing device performance and reliability.
How does Thermal-Electric Separation Copper Substrate with Flexible PCB manufactured?
The manufacturing process for the thermal-electric separation copper substrate with flexible PCB is complex, typically including the following steps:
Material Preparation: Selecting appropriate rigid and flexible materials and performing pre-treatment.
Circuit Printing: Printing circuit patterns on both rigid and flexible materials.
Lamination and Bonding: Combining the flexible circuit board with the thermal-electric separation copper substrate, usually using conductive adhesives or other bonding materials.
Drilling and Plating: Drilling holes and electroplating to form conductive paths on the combined board.
Surface Treatment: Performing surface treatments such as pad coating on the circuit board.
Testing and Inspection: Conducting electrical and mechanical performance tests to ensure the quality and reliability of the board.
The thermal-electric separation copper substrate with flexible PCB, as an innovative composite circuit board, combines the advantages of efficient heat dissipation and flexible wiring. It is widely used in high-performance and complex design electronic products. With continuous technological advancements and growing market demand, this composite circuit board will play an important role in more fields, driving the ongoing innovation of electronic manufacturing technology. Want know more about it, just feel your free to contact us.
Nowadays, PCBs became more and more important and you can see it in every electronic device. The PCB plays a critical role in our daily life. With circuit board, the device can power on and help to transmit signals, manage heat and perform electricity. A good PCB can help to improve the overall of your device. However, not all the PCBs are work good and within your expectable, you must know how to test it and ensure it enables a good performance. As an experienced PCB manufacturers in Asia, today we want to share with you how we test a PCB, and we try to use simple words to make you sense.
What is a printed circuit board?
Before knowing the methods of testing circuit board, let’s understand the definition of PCB. A PCB is a flat board made from insulating materials like fiber glasses with conductive pathways etched onto its surface. The pathways we called circuit or traces. These pathways connect different electronic components, so that they can communicate and function together. PCBs come in various materials, shapes and sizes, which always is customized to meet specific applications and performance requirements.
PCBs can be divided into different types according to substrate material used. They are – normal FR4 PCB, polyimide flexible PCB, metal core PCB, ceramic PCB, rogers PCB. Different has its own properties and advantages. The choice of materials and the design of the PCB significantly impact the performance and reliability of the final product. Understanding the materials used in PCBs is crucial for anyone involved in electronics, from hobbyists to professional engineers/designers.
Common PCB Circuit Board Issues
Though PCB has a strong construction, they are easy to be broken or failure since they always encounter a range of issues. These problems can stem from manufacturing defects, wear and tear, or improper handling. Identifying and diagnosing these issues promptly is crucial for maintaining the reliability and performance of electronic devices. Common issues we faced are including:
Open Circuits: These occur when a break in the circuits prevents current flow normally. Open circuits can result from physical damage or manufacturing errors.
Short Circuits: Due to improper soldering, unreasonable circuit design and other reasons, resulting in a short circuit between two or more points in the circuit that should not be connected. This can cause excessive current flow, potentially damaging components.
Grounding: The unreasonable design of ground area leads to interference signals on the grounding, which affects the normal operation of the circuit.
Signal: The signal circuit design is not reasonable, resulting in interference signals on the signal.
Component Failures: Individual components on a PCB can fail due to aging, overheating, or electrical stress breakdown. And incorrect orientation will lead to the failure of PCB.
Soldering Issues: Poor soldering can lead to weak connections, causing intermittent faults or complete circuit failure. This including the dents in the solder joints, this also can make the PCB failure.
Corrosion: PCB exposure to moisture and contaminants for a long time can cause corrosion, degrading the conductive pathways and component leads.
How to check a PCB?
In generally, there are four common ways to check whether if your PCB are good or failure.
1. Visual inspection
The easiest way is visual inspection. Through naked eye observation, check whether the solder joint on the PCB circuit board is firm, whether there is short circuit, open circuit and other phenomena. And look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.
2. Use a multimeter
Multimeter is a common tool used for measuring PCB. Multimeter is versatility and it has multiplied modes. Select the appropriate mode on the multimeter, such as continuity, voltage, or resistance mode, depending on what you are testing. Before testing, make sure probes are in good condition and properly connected to the multimeter, with the red probe typically being positive and the black probe negative or ground. Click here to read What is the PCB flying probe test?
3. E-tester
E-tester is a good way to test short or open circuit when it is a mass production. If you just want to test one piece PCB, multimeter is much better.
4. Use oscilloscope
An oscilloscope is a powerful diagnostic tool used to observe the waveform of electrical signals in a circuit. Connect the oscilloscope probes to the test points on the PCB, it can capture the waveform. By observing the waveform, determine whether the circuit is working normally.
5. Use a thermal imager
A thermal imager also is a effective way to check the condition of PCB. It can capture the temperature distribution on the PCB. It helps identify areas with excessive heat, which can indicate potential issues.
How to Test a Circuit Board with a Multimeter Effectively?
Testing a circuit board with a multimeter is essential for diagnosing and fixing electronic issues. A multimeter can measure voltage, current, and resistance, helping you identify problems with the PCB. The main way to test a PCB with a multimeter is to measure voltage, resistance, and ground.
Measuring voltage
By measuring the voltage on the circuit board, can quickly test whether the circuit is working properly. Use the voltage gear of the multimeter, select the appropriate range, then measure the input and output of the power supply on the circuit board respectively, to check whether the voltage is within the normal range. If the voltage is abnormal, may indicate that the circuit is open or short.
Measuring resistance value
By measuring the resistance value on the circuit board, can detect whether the circuit is smooth. Use the resistance level of the multimeter, select the appropriate range, then measure the key nodes on the circuit board, check whether the resistance value is within the normal range. If the resistance value is abnormal, may indicate that the circuit is open or short.
Check the grounding
Grounding is critical to the proper operation of the circuit board. Use the multimeter’s ground test function, to check that key points on the board are properly grounded, this helps to spot potential electrical connection problems.
In addition, for industrial-grade PCB measurement, the use of higher-precision multimeters and special pens can improve the accuracy and efficiency of the measurement. For example, the Fluke 17B Max multimeter is equipped with an extra-pointed stylus, enables more accurate measurement of patch components and pins, and improves measurement fineness and accuracy.
Generally speaking, using a multimeter to test the PCB board needs to master the correct measurement methods and skills. At the same time according to the complexity of the circuit board to choose the appropriate measurement tools, to ensure the accuracy and efficiency of the test.
How to Tell if a Circuit Board is Bad?
Identifying a bad circuit board requires a combination of visual inspection and multimeter testing. Here are some signs and methods to determine if a PCB is faulty:
Visual Signs
Look for burnt components, discolored areas, or broken traces, such as somewhere became black or be burned obviously. These are clear indicators of damage.
Component Testing
Use the multimeter to test individual components. A component that doesn’t show the expected resistance or voltage is likely faulty.
Continuity Testin
Check for open circuits. Lack of continuity in a path indicates a broken trace or solder joint.
Short Circuit Detection
Identify any unintended connections between different paths. This can be done by checking for continuity where there should be none.
Functionality Testing
Test the circuit board in its intended application. If the device does not function correctly, there may be an issue with the PCB.
Why Choose EBest Circuit (Best Technology)?
By reading this post, you may know how to test a PCB by multimeter already and other methods to identify them. EBest Circuit (Best Technology) has engaging in the PCB manufacturing for more than 18 years, we have served over 2000+ customers all around the world. We have strong R&D team and equipped with advanced equipment to improve the yield and product quality.
At EBest Circuit (Best Technology), we provide various PCB manufacturing, including metal core PCBs, ceramic PCBs, rigid-flex PCBs and some other special PCBs like HDI PCB, busbar PCB, heavy copper PCB. If you have similiar projects, you are welcome to contact us.
